Antenna for inductively coupled plasma excitation, antenna unit for inductively coupled plasma excitation, and plasma processing apparatus.
The antenna design with a conductive plate and impedance adjustment sections enhances magnetic field generation and uniformity, addressing inefficiencies in existing plasma excitation antennas for improved semiconductor processing.
JP2026110824APending Publication Date: 2026-07-02TOKYO ELECTRON LTD
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- TOKYO ELECTRON LTD
- Filing Date
- 2026-04-28
- Publication Date
- 2026-07-02
AI Technical Summary
Technical Problem
Existing inductively coupled plasma excitation antennas suffer from inefficiencies in magnetic field generation and non-uniformity of magnetic field strength due to inductive coupling and central openings, which affect plasma processing in semiconductor manufacturing.
Method used
The antenna design incorporates a conductive plate positioned above the coil assemblies, with impedance adjustment sections and a conductive cylinder, to minimize magnetic field leakage and balance current distribution, enhancing magnetic field generation and uniformity.
Benefits of technology
This design improves the efficiency and circumferential uniformity of the magnetic field strength, leading to more effective plasma processing in semiconductor treatments such as etching and film deposition.
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Smart Images
Figure 2026110824000001_ABST
Abstract
When exciting a plasma using an inductively coupled plasma excitation antenna, the efficiency of magnetic field generation by the antenna is improved while simultaneously improving the circumferential uniformity of the magnetic field strength. [Solution] An inductively coupled plasma excitation antenna comprising: a conductive plate; a plurality of coil assemblies, one end of which is connected to the conductive plate; an impedance adjustment unit provided between the other end of each of the plurality of coil assemblies and ground; and a conductor plate positioned above the conductive plate, wherein the distance between the conductive plate and the conductor plate is shorter than the distance between the conductive plate and the plurality of coil assemblies.
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