Liquid dispensing head and recording device

Abstract

This facilitates the attachment of a heat sink to the driver IC. [Solution] A liquid discharge head comprising: a discharge member having a plurality of nozzles for discharging liquid, a plurality of elements for discharging liquid from the plurality of nozzles, a plurality of terminals electrically connected to each of the plurality of elements, and a flexible substrate having a plurality of wiring corresponding to the plurality of terminals, wherein the flexible substrate has a first surface, a second surface opposite to the first surface, and a bent region where the first surface is folded back toward the second surface, and the plurality of wirings have a wider pitch in the bent region than in other regions.

Description

Technical Field

[0001] The disclosed embodiments relate to a liquid ejection head and a recording apparatus.

Background Art

[0002] As printing apparatuses, inkjet printers and inkjet plotters using an inkjet recording method are known. Such an inkjet printing apparatus is equipped with a liquid ejection head for ejecting a liquid.

[0003] Such a liquid ejection head has, for example, a flexible flexible substrate connected to a ejection member that ejects a liquid. A driving IC for driving an element provided in the ejection member is mounted on the flexible substrate. Since the driving IC generates heat, it is pressed against a heat sink.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] There is still room for further improvement in the above liquid ejection head in terms of facilitating the attachment of the heat sink to the driving IC.

[0006] One aspect of the present embodiment has been made in view of the above, and an object thereof is to provide a liquid ejection head and a recording apparatus that facilitate the attachment of a heat sink to a driving IC.

Means for Solving the Problems

[0007] A liquid discharge head according to one embodiment comprises a discharge member having a plurality of nozzles for discharging liquid, a plurality of elements for discharging liquid from the plurality of nozzles, and a plurality of terminals electrically connected to each of the plurality of elements, and a flexible substrate having a plurality of wiring corresponding to the plurality of terminals, wherein the flexible substrate has a first surface, a second surface opposite to the first surface, and a bent region where the first surface is folded back toward the second surface, and the plurality of wirings have a wider pitch in the bent region than in other regions. [Effects of the Invention]

[0008] According to one embodiment, a heat sink can be easily attached to a drive IC mounted on a flexible substrate. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a schematic front view showing a general front view of the printer according to this embodiment. [Figure 2] Figure 2 is a schematic plan view showing a general plan of the printer according to this embodiment. [Figure 3] Figure 3 is a schematic side view showing the internal configuration of the liquid discharge head according to the embodiment. [Figure 4] Figure 4 is a schematic diagram showing a side cross-section of the relay substrate according to the embodiment. [Figure 5] Figure 5 is a schematic plan view showing the plane of the relay substrate according to the embodiment. [Figure 6] Figure 6 is a schematic diagram showing a flexible substrate according to an embodiment. [Figure 7] Figure 7 is a schematic diagram showing a flexible substrate according to an embodiment. [Figure 8] Figure 8 is a schematic plan view showing a flexible substrate according to an embodiment. [Figure 9] Figure 9 is a schematic side view showing the support portion according to the embodiment. [Figure 10] Figure 10 is a schematic side view showing the support portion according to the embodiment. [Modes for carrying out the invention]

[0010] The embodiments of the liquid dispensing head and recording device disclosed herein will be described below with reference to the attached drawings. However, the embodiments described below do not limit this disclosure. Furthermore, it should be noted that the drawings are schematic, and the dimensional relationships and ratios of each element may differ from reality. Additionally, there may be differences in dimensional relationships and ratios between drawings.

[0011] Furthermore, in the embodiments described below, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" may be used, but these expressions do not require strict adherence to "constant," "orthogonal," "perpendicular," or "parallel" conditions. In other words, each of the above expressions allows for deviations such as manufacturing accuracy or installation accuracy.

[0012] Furthermore, each embodiment can be combined as appropriate, provided that the processing content is not inconsistent. Also, the same parts are denoted by the same reference numerals in each of the following embodiments, and redundant explanations are omitted.

[0013] Conventional liquid dispensing heads have room for further improvement in terms of facilitating the attachment of heat sinks to the drive ICs. For example, when a dispensing element that dispenses liquid and a flexible circuit board containing a drive IC are connected via an intermediate board, the drive IC may face inward (towards the dispensing element) when the dispensing element is housed in a casing, making it difficult to create a structure that presses the drive IC against a heat sink. For these reasons, there is a need for technology that can easily attach heat sinks to drive ICs mounted on flexible circuit boards.

[0014] <Printer Configuration> First, referring to FIGS. 1 and 2, an overview of a printer 1, which is an example of a recording apparatus according to an embodiment, will be described. FIG. 1 is a front view schematically showing a schematic front of the printer 1 according to the embodiment. FIG. 2 is a plan view schematically showing a schematic plan of the printer 1 according to the embodiment. The printer 1 according to the embodiment is, for example, a color inkjet printer.

[0015] As shown in FIG. 1, the printer 1 includes a paper feed roller 2, a guide roller 3, an applicator 4, a head case 5, a plurality of conveyance rollers 6, a plurality of frames 7, a plurality of liquid ejection heads 8, a conveyance roller 9, a dryer 10, a conveyance roller 11, a sensor unit 12, and a recovery roller 13. The conveyance roller 6 is an example of a conveyance unit.

[0016] Furthermore, the printer 1 has a control unit 14 that controls each part of the printer 1. The control unit 14 controls the operations of the paper feed roller 2, the guide roller 3, the applicator 4, the head case 5, the plurality of conveyance rollers 6, the plurality of frames 7, the plurality of liquid ejection heads 8, the conveyance roller 9, the dryer 10, the conveyance roller 11, the sensor unit 12, and the recovery roller 13.

[0017] The printer 1 records an image or characters on the printing paper P by landing droplets on the printing paper P. The printing paper P is an example of a recording medium. The printing paper P is in a state of being wound around the paper feed roller 2 before use. The printer 1 conveys the printing paper P from the paper feed roller 2 through the guide roller 3 and the applicator 4 into the head case 5.

[0018] The applicator 4 uniformly applies a coating agent to the printing paper P. Thereby, since the surface treatment can be performed on the printing paper P, the printing quality of the printer 1 can be improved.

[0019] The head case 5 houses a plurality of conveyance rollers 6, a plurality of frames 7, and a plurality of liquid ejection heads 8. Inside the head case 5, a space is formed that is isolated from the outside, except for a part such as a portion where the printing paper P enters and exits and is connected to the outside.

[0020] The internal space of the head case 5 is controlled by the control unit 14, as needed, by at least one of the control factors such as temperature, humidity, and atmospheric pressure. The transport rollers 6 transport the printing paper P within the head case 5 to the vicinity of the liquid ejection head 8.

[0021] The frame 7 is a rectangular flat plate positioned close above the printing paper P being transported by the transport rollers 6. Furthermore, as shown in Figure 2, the frame 7 is positioned so that its longitudinal direction is perpendicular to the transport direction of the printing paper P. Inside the head case 5, multiple (for example, four) frames 7 are positioned at predetermined intervals along the transport direction of the printing paper P.

[0022] The liquid ejection head 8 is supplied with a liquid, such as ink, from a liquid tank (not shown). The liquid ejection head 8 ejects the liquid supplied from the liquid tank.

[0023] The control unit 14 controls the liquid ejection head 8 based on data such as images and characters, and ejects liquid toward the printing paper P. The distance between the liquid ejection head 8 and the printing paper P is, for example, about 0.5 to 20 mm.

[0024] The liquid dispensing head 8 is fixed to the frame 7. The liquid dispensing head 8 is positioned so that its longitudinal direction is perpendicular to the direction in which the printing paper P is transported.

[0025] In other words, the printer 1 according to this embodiment is a so-called line printer in which a liquid ejection head 8 is fixed inside the printer 1. However, the printer 1 according to this embodiment is not limited to a line printer, and may be a so-called serial printer.

[0026] A serial printer is a type of printer that alternates between recording data while moving a liquid ejection head 8 in a direction intersecting the transport direction of the printing paper P, for example, in a nearly perpendicular direction, and transporting the printing paper P.

[0027] As shown in Figure 2, multiple (for example, five) liquid discharge heads 8 are fixed to a single frame 7. Figure 2 shows an example where three liquid discharge heads 8 are located in front of the printing paper P in the transport direction and two are located behind it, and the liquid discharge heads 8 are positioned so that the centers of each liquid discharge head 8 do not overlap in the transport direction of the printing paper P.

[0028] A head group 8A is formed by multiple liquid ejection heads 8 located on a single frame 7. The four head groups 8A are positioned along the transport direction of the printing paper P. Four colors of ink are supplied to the liquid ejection heads 8 belonging to the same head group 8A. As a result, the printer 1 can perform printing with four colors of ink using the four head groups 8A.

[0029] The ink colors ejected from each liquid ejection head 8 are, for example, magenta (M), yellow (Y), cyan (C), and black (K). The control unit 14 controls each liquid ejection head 8 to eject multiple colors of ink onto the printing paper P, thereby enabling the printing of a color image on the printing paper P.

[0030] Furthermore, in order to treat the surface of the printing paper P, a coating agent may be dispensed onto the printing paper P from the liquid ejection head 8.

[0031] Furthermore, the number of liquid ejection heads 8 included in one head group 8A, and the number of head groups 8A installed in printer 1, can be changed as appropriate depending on the object to be printed and the printing conditions. For example, if the printing is limited to the area that can be printed with one liquid ejection head 8, then printer 1 may only have one liquid ejection head 8 installed.

[0032] The printed paper P, which has been processed inside the head case 5, is transported to the outside of the head case 5 by the transport roller 9 and passes through the inside of the dryer 10. The dryer 10 dries the printed paper P. The dried printed paper P is transported by the transport roller 11 and collected by the recovery roller 13.

[0033] In printer 1, drying the printing paper P in the dryer 10 prevents the overlapping printing paper P from sticking together and prevents friction from undried liquid in the recovery roller 13.

[0034] The sensor unit 12 is composed of position sensors, speed sensors, temperature sensors, and the like. The control unit 14 can determine the state of each part of the printer 1 based on the information from the sensor unit 12 and control each part of the printer 1.

[0035] The printer 1 described so far has shown the case where printing paper P is used as the printing target (i.e., recording medium), but the printing target in printer 1 is not limited to printing paper P; a roll of cloth or other material may also be used as the printing target.

[0036] Alternatively, the printer 1 may transport the printing paper P on a conveyor belt instead of directly transporting it. By using a conveyor belt, the printer 1 can print on sheets of paper, cut cloth, wood, tiles, etc.

[0037] The printer 1 may also print wiring patterns for electronic devices by ejecting a liquid containing conductive particles from the liquid ejection head 8. Alternatively, the printer 1 may produce chemical products by ejecting a predetermined amount of liquid chemical agent or a liquid containing a chemical agent from the liquid ejection head 8 toward a reaction vessel or the like.

[0038] The printer 1 may also include a cleaning unit for cleaning the liquid ejection head 8. The cleaning unit cleans the liquid ejection head 8, for example, by wiping or capping.

[0039] Wiping is a process that removes liquid adhering to the liquid discharge head 8 by wiping the surface of the part where the liquid is discharged with a flexible wiper, for example.

[0040] Furthermore, the capping process is carried out, for example, as follows: First, a cap is placed over the part from which the liquid is dispensed (this is called capping). This creates a nearly sealed space between the part from which the liquid is dispensed and the cap.

[0041] Next, the liquid is repeatedly dispensed in this sealed space. This removes any liquids with a higher viscosity than standard, as well as foreign matter, that may have been clogging the dispensing nozzle.

[0042] <Configuration of the liquid dispensing head> Next, the configuration of the liquid dispensing head 8 according to the embodiment will be described with reference to Figure 3. Figure 3 is a schematic side view showing the internal configuration of the liquid dispensing head 8 according to the embodiment. In Figure 3, a side view perpendicular to the longitudinal direction of the liquid dispensing head 8 is shown.

[0043] The liquid discharge head 8 comprises a discharge member 20, a support substrate 30, a relay substrate 40, a flexible substrate 50, a drive IC 100, a manifold 31, a reservoir 32, a heat dissipation section 80, a support section 90, a drive substrate 110, and a housing 120.

[0044] In the following explanation, for convenience, the direction in which the discharge member 20 is provided in the liquid discharge head 8 may be referred to as "down," and the direction in which the support substrate 30 is provided relative to the discharge member 20 may be referred to as "up."

[0045] The reservoir 32 stores liquid. The manifold 31 has openings (not shown) at both ends in the main scanning direction, which is perpendicular to the sub-scanning direction, which is the transport direction of the printing paper P, and parallel to the printing paper P. The liquid supply member has a flow path inside, and liquid is supplied from the reservoir 32 through the opening.

[0046] The support substrate 30 is located on top of the discharge member 20. The support substrate 30 has a flow path inside and supplies the liquid supplied from the manifold 31 to the discharge member 20. In addition, the support substrate 30 has a predetermined thickness that is greater than the discharge member 20 and has the function of reinforcing the discharge member 20.

[0047] The discharge member 20 is substantially flat in shape and has a first surface adjacent to the support substrate 30 and a second surface located opposite the first surface. The first surface has an opening (not shown), and liquid is supplied from the support substrate 30 to the interior of the discharge member 20 through this opening. The second surface has a plurality of discharge holes for discharging liquid onto the printing paper P. The discharge member 20 has a flow path inside that allows liquid to flow from the first surface to the second surface.

[0048] The discharge member 20 has a plurality of displacement elements. The plurality of displacement elements are located on the first surface of the discharge member 20.

[0049] The relay board 40 is located at two positions on the first surface of the discharge member 20, flanking the support board 30. One end of the relay board 40 is electrically connected to the discharge member 20, and the other end is electrically connected to the flexible board 50. The relay board 40 has the function of relaying signals transmitted by the flexible board 50 to the discharge member 20. The relay board 40 can also be configured with a wider pitch between the terminals on the flexible board 50 and the terminals on the discharge member 20. This improves the reliability of the connection between the discharge member 20 and the flexible board 50. Furthermore, the relay board 40 is lower in height from the first surface of the discharge member 20 than the support board 30. This reduces the possibility of interference between the relay board 40 and the liquid supply member when the liquid supply member is installed on the support board 30, thereby improving the flexibility of the liquid supply member's layout.

[0050] The flexible circuit board 50 is a flexible wiring board and is placed at each relay circuit board 40. This flexible circuit board 50 transmits control signals from the discharge member 20 to the relay circuit board 40. One end of the flexible circuit board 50 is electrically connected to the relay circuit board 40, and the other end of the flexible circuit board 50 is extended above the support circuit board 30 and is electrically connected to the drive circuit board connector 111 of the drive circuit board 110. The flexible circuit board 50 has a first surface on which the drive IC 100, described later, is placed, and a second surface opposite to the first surface.

[0051] The drive IC 100 is mounted (placed) on the flexible substrate 50. Based on the drive signals sent from the control unit 14 (see Figure 1), the drive IC 100 drives each displacement element in the discharge member 20. In this way, the drive IC 100 can control the drive of the liquid discharge head 8.

[0052] As shown in the figure, the area of ​​the flexible substrate 50 on which the drive IC 100 is located is folded back to the second surface.

[0053] The heat dissipation section 80 is for dissipating heat from the drive IC 100. This heat dissipation section 80 is positioned adjacent to the drive IC 100 and dissipates heat from the drive IC 100. The heat dissipation section 80 in the figure is shown as an example of a plate-shaped configuration. One side of this plate-shaped heat dissipation section 80 is in contact with the drive IC 100, and the other side is in contact with the housing 120. The heat from the drive IC 100 is transferred to the housing 120 via the heat dissipation section 80 and dissipated.

[0054] The support portion 90 presses the drive IC 100 against the heat dissipation portion 80. This support portion 90 presses the drive IC 100 against the heat dissipation portion 80 via the flexible substrate 50. This reduces the thermal resistance between the drive IC 100 and the heat dissipation portion 80. The figure shows an example where the support portion 90 presses against the left and right drive ICs 100, respectively.

[0055] The drive board 110 drives the liquid discharge head 8. This drive board 110 includes a circuit that generates control signals for the drive IC 100. The control signals for the drive IC 100 are supplied to the flexible board 50 via the drive board connector 111.

[0056] As shown in the figure, a portion of the end of the flexible circuit board 50 is connected to the drive board connector 111, and another portion is connected to the relay board 40. The area of ​​the flexible circuit board 50 that is connected to the relay board 40 is referred to as the first area. The area of ​​the flexible circuit board 50 that is connected to the drive board connector 111 is referred to as the second area. This second area corresponds to the area of ​​the end where the wiring for transmitting signals from the drive IC 100 is located.

[0057] The housing 120 houses the discharge member 20, support board 30, relay board 40, flexible board 50, drive IC 100, manifold 31, reservoir 32, heat dissipation section 80, support section 90, and drive board 110. Furthermore, as described above, the housing 120 also dissipates heat from the drive IC 100.

[0058] Note that Figure 3 shows an example of the configuration of the liquid dispensing head 8, and may include other components besides those shown in Figure 3.

[0059] <Configuration of the relay board> Next, the configuration of the relay substrate 40 according to the embodiment will be described with reference to Figures 4 and 5. Figure 4 is a schematic diagram showing a side cross-section of the relay substrate 40 according to the embodiment. Figure 5 is a schematic plan view showing the top view of the relay substrate 40 according to the embodiment.

[0060] As shown in Figure 4, the discharge member 20 and the flexible substrate 50 are connected to the relay substrate 40. Multiple terminals 21 are arranged at the end of the discharge member 20. Multiple terminals 61 are also arranged at the end of the flexible substrate 50.

[0061] The relay board 40 comprises a plurality of pads 41 and a plurality of pads 42, and wiring 43. Pads 41 are pads that are joined to terminals 21 of the discharge member 20. Pads 42 are pads that are joined to terminals 61 of the flexible board 50. The wiring 43 is arranged for each of the pads 41 and 42 and connects the pads 41 and 42. The terminals 21 and pads 41, and the terminals 61 and pads 42 are joined by a conductive bonding material. For example, an anisotropic conductive film (ACF) can be used as this conductive bonding material.

[0062] Wiring 62 is connected to terminal 61 of the flexible substrate 50. As shown in the figure, the flexible substrate 50 is bent in the opposite direction to the liquid discharge direction of the discharge member 20.

[0063] As shown in Figure 5, multiple pads 41 are arranged on one end of the relay board 40, and multiple pads 42 are arranged on the other end. Multiple wirings 43 connect the pads 41 and pads 42 on a one-to-one basis. As mentioned above, the multiple pads 42 are arranged at a wider pitch than the pitch of the multiple pads 41.

[0064] <Configuration of Flexible Circuit Board> Next, the configuration of the flexible substrate 50 according to the embodiment will be described with reference to Figures 6 to 8. Figures 6 and 7 are schematic diagrams showing the flexible substrate 50 according to the embodiment. Figure 8 is a schematic plan view showing the flexible substrate 50 according to the embodiment.

[0065] As shown in Figure 6, the flexible substrate 50 includes a first region 51 connected to the relay substrate 40 and a second region 52 connected to the drive substrate connector 111. The first region 51 and the second region 52 are separated by a notch 53. The flexible substrate 50 in the same figure shows an example in which the second region 52a and the second region 52b are located on both sides of the first region 51. The first region 51 and the second region 52a are separated by a notch 53a. Also, the first region 51 and the second region 52b are separated by a notch 53b.

[0066] The diagram shows the configuration of the flexible substrate 50 as viewed from the first side. The drive IC 100 is located on this first side.

[0067] As shown in Figure 7, the first surface of the area on the flexible substrate 50 where the drive IC 100 is placed is folded back toward the second surface. As a result of the first surface being folded back toward the second surface, the first region 51 and the second regions 52a and 52b are positioned in different orientations. The first region 51 in the figure is shown as being further bent toward the relay substrate 40.

[0068] As shown in Figure 8, multiple terminals 66 are arranged in the first region 51 of the flexible substrate 50. Multiple terminals 61a are arranged in the second region 52a of the flexible substrate 50, and multiple terminals 61b are arranged in the second region 52b. Furthermore, as explained in Figure 6, the first region 51 and the second region 52a are separated by a notch 53a, and the first region 51 and the second region 52b are separated by a notch 53b.

[0069] Separation parts are positioned in the notches 53a and 53b shown in the figure. These separation parts are positioned near the opening of the notches to separate them. Separation part 54a is positioned in notch 53a, and separation part 54b is positioned in notch 53b. By positioning these separation parts 54a and 54b, the strength required when handling the flexible substrate 50 during the manufacturing process of the liquid discharge head 8 can be improved.

[0070] The dotted line area in the figure represents the area 55 where the drive IC 100 is located. Pads 63 and 64 of the drive IC 100 are located in this area 55. Pad 63 is a pad to which signals and power from the drive board 110 are input, and is connected to terminals 61a and 61b via wiring 62. Pad 64 is a pad to which signals from the ejection member 20 are output, and is connected to terminal 66 via wiring 65. Wirings 62 and 65 can be made of copper (Cu), for example.

[0071] The notches 53a and 53b in the figure represent an example in which the ends are formed by curves that are curved in the direction of extension, such as the notch 53a. This improves the strength when stress is applied to the ends of the notches 53a, etc.

[0072] Furthermore, reinforcing wiring 68 can be placed near the ends of the notches 53a and other sections. This wiring 68 is made of Cu or the like and has a relatively wide wiring pattern. By placing this wiring 68, the strength of the ends of the notches 53a and other sections can be further improved.

[0073] Furthermore, a wiring 67 for transmitting a reference potential can be placed near the end portion such as the notch 53a. This wiring 67 is configured to be relatively wide. By placing this wiring 67, the strength of the end portion such as the notch 53a can be further improved. Note that a power supply wiring can also be used for the wiring 67.

[0074] Furthermore, the dashed line in the figure represents the bending region 56 where the flexible substrate 50 is folded back. As shown in the figure, the pitch of the wiring 65 in this bending region 56 can be made wider than in other regions. This makes it possible to improve the strength of the flexible substrate 50 in the bending region 56.

[0075] <Structure of the support structure> Next, the configuration of the support portion 90 according to the embodiment will be described with reference to Figures 9 and 10. Figures 9 and 10 are schematic side views showing the support portion 90 according to the embodiment.

[0076] As shown in Figure 9, the support portion 90 can be configured to press the drive IC 100 against the heat dissipation portion 80 via a flexible substrate 50 that has been folded in half and overlapped. By adopting a configuration in which the bending region 56 does not overlap the support portion 90, the strength of the flexible substrate 50 can be improved. In addition, the heat from the drive IC 100 can be transferred by the flexible substrate 50.

[0077] As shown in Figure 10, an opening 91 can be formed near the bottom of the support portion 90, and a configuration can be adopted in which the first region 51 of the flexible substrate 50, which is folded back, passes through this opening 91. In this case, the flexible substrate 50 is folded back in a shape that sandwiches the region of the support portion 90 that presses against the drive IC 100. This makes it possible to alleviate the bending of the bending region 56 of the flexible substrate 50, thereby reducing the load on the flexible substrate 50 and improving its strength.

[0078] <Various variations> In Figure 3, a configuration can be adopted in which one of the two sets of relay boards 40, flexible board 50, and heat dissipation section 80 is omitted.

[0079] In Figures 6 to 8, a configuration can be adopted in which either the second region 52a or 52b is omitted.

[0080] As described above, the liquid discharge head according to the embodiment (for example, liquid discharge head 8) comprises a discharge member (for example, discharge member 20) and a flexible substrate (for example, flexible substrate 50). The discharge member has a plurality of nozzles for discharging liquid, a plurality of elements for discharging liquid from the plurality of nozzles, and a plurality of terminals electrically connected to each of the plurality of elements. The flexible substrate has a plurality of wiring corresponding to the plurality of terminals and a drive IC (for example, drive IC 100) connected to the plurality of wiring for driving the plurality of elements. The relay substrate electrically connects a heat dissipation section (for example, heat dissipation section 80) arranged adjacent to the drive IC, the discharge member and the flexible substrate. The flexible substrate has a first surface on which the drive IC is arranged and a second surface opposite to the first surface, and the first surface in the area on which the drive IC is arranged is folded back to the second surface side. As a result, the drive IC is arranged on the outside, making it easy to attach a heat sink to the drive IC.

[0081] The flexible substrate may include an intermediate substrate (e.g., intermediate substrate 40) that electrically connects the discharge member and the flexible substrate, and the flexible substrate may have a first region (first region 51) which is an end region connected to the intermediate substrate, a second region (e.g., second regions 52a and 52b) which is an end region where wiring for transmitting signals from the drive IC is arranged, and notches (e.g., notches 53a and 53b) that separate the first region and the second region. This makes it possible to form the region connected to the intermediate substrate and the end region where wiring for transmitting signals from the drive IC is arranged integrally.

[0082] Furthermore, the flexible substrate may have notches at its edges that are formed by curves. This can improve the strength of the flexible substrate.

[0083] Furthermore, the flexible substrate may have reinforcing wiring (e.g., wiring 68) placed near the edges of the notches. This can improve the strength of the flexible substrate.

[0084] Furthermore, the flexible substrate may have wiring (e.g., wiring 67) that transmits a reference potential near the end of the notch. This can improve the strength of the flexible substrate.

[0085] Furthermore, the flexible substrate may also have separation sections (for example, separation sections 54a and 54b) positioned near the opening of the notch to separate the notch. This improves the strength required when handling the flexible substrate.

[0086] Furthermore, the flexible substrate may have terminals (e.g., terminals 61a and 61b) for connecting to a drive board that supplies signals from the drive IC located at the end of the second region. This allows the flexible substrate to be used for signal transmission between the relay board and the drive board, and enables miniaturization of the liquid dispensing head.

[0087] Furthermore, the flexible substrate may have multiple wirings arranged in the folded bending region (e.g., bending region 56) with a wider pitch than in other regions. This can improve the strength of the flexible substrate.

[0088] Furthermore, the system may also include a support portion (for example, a support portion 90) that presses the drive IC against the heat dissipation portion via a flexible substrate. This reduces the thermal resistance between the drive IC and the heat dissipation portion.

[0089] Alternatively, the support portion may be pressed against the heat dissipation portion via a flexible substrate that is folded and overlapped. This allows heat from the drive IC to be transferred to the discharge member, further dissipating heat from the drive IC.

[0090] Alternatively, the support portion may be pressed against the heat dissipation portion via a flexible substrate that is folded back to enclose itself. This can improve the strength of the flexible substrate.

[0091] Furthermore, the flexible substrate may be bent in the opposite direction to the liquid discharge direction in the discharge member. This allows for miniaturization of the liquid discharge head.

[0092] Furthermore, in this first embodiment, a housing (for example, housing 120) on which the heat dissipation unit is located may be further provided. This allows the heat from the heat dissipation unit to be released into the housing, further dissipating heat from the drive IC.

[0093] Further effects and modifications can be readily derived by those skilled in the art. Therefore, broader aspects of the present invention are not limited to the specific details and representative embodiments expressed and described above. Accordingly, various modifications are possible without departing from the spirit or scope of the overall concept of the invention as defined by the appended claims and equivalents. [Explanation of symbols]

[0094] 8 liquid dispensing heads 20 Discharge member 40 Intermediate boards 50 Flexible circuit boards 51 The first area 52, 52a, 52b Second region 53, 53a, 53b Notches 54a, 54b Separation part 56 Bending region 80 Heat radiation part 90 Support part 100 drive IC 110 Drive board 111 Drive board connector 120 cabinets

Claims

1. A dispensing member having a plurality of nozzles for dispensing liquid, a plurality of elements for dispensing liquid from the plurality of nozzles, and a plurality of terminals electrically connected to each of the plurality of elements, A flexible circuit board having multiple wirings corresponding to the multiple terminals, Equipped with, The aforementioned flexible substrate is Page 1 and, The second surface opposite to the first surface, The first surface is a bent region that is folded back toward the second surface and It has, The aforementioned plurality of wirings have a wider pitch in the bending region than in other regions. Liquid dispensing head.

2. A drive IC is arranged on the first surface of the flexible substrate, The heat dissipation part that contacts the aforementioned drive IC To further enhance The liquid dispensing head according to claim 1.

3. The direction in which the liquid is discharged from the plurality of nozzles is defined as the first direction. The bending region is located on the side opposite to the first direction from the drive IC. The liquid dispensing head according to claim 2.

4. The system further includes a support portion located on the first direction side of the aforementioned bending region. The liquid dispensing head according to claim 3.

5. The flexible substrate is in contact with the second surfaces of the two substrates. The portion where the two surfaces come into contact is located between the support portion and the heat dissipation portion. The liquid dispensing head according to claim 4.

6. The flexible substrate is located between the support portion and the heat dissipation portion, and on the opposite side of the support portion from the drive IC. The liquid dispensing head according to claim 4.

7. The support portion has an opening, The flexible substrate is located within the opening. The liquid dispensing head according to claim 6.

8. The system further comprises a relay board that electrically connects the discharge member and the flexible substrate. The liquid dispensing head according to claim 1.

9. The aforementioned flexible substrate is A first region which is the end region connected to the relay substrate, A second region is an end region where wiring for transmitting signals of the drive IC arranged on the first surface is arranged, A notch separating the first region and the second region has The liquid dispensing head according to claim 8.

10. The flexible substrate has the cutout portion whose end is formed by a curve. The liquid dispensing head according to claim 9.

11. The flexible substrate has reinforcing wiring arranged near the end of the notch. The liquid dispensing head according to claim 9.

12. The flexible substrate has wiring for transmitting a reference potential arranged near the end of the notch. The liquid dispensing head according to claim 9.

13. The flexible substrate further includes a separation portion positioned near the opening of the notch and separating the notch. The liquid dispensing head according to claim 9.

14. The flexible substrate has terminals at the end of the second region for connecting to a drive board that supplies signals from the drive IC. The liquid dispensing head according to claim 9.

15. Further equipped with a chassis A liquid dispensing head according to any one of claims 1 to 14.

16. A recording device comprising a liquid dispensing head according to any one of claims 1 to 14.

Images