Holding device

Abstract

To provide a holding device that can suppress corrosion of the bonding layer. [Solution] The holding device 1 comprises a plate-shaped member 10 having a first surface S1 and a second surface S2 located on the opposite side of the first surface S1, a base member 20 having a third surface S3 positioned opposite the second surface S2, and a joining layer 30 positioned between the second surface S2 and the third surface S3 to join the second surface S2 and the third surface S3. The holding device 1 also comprises a bottom plate portion 51, a side wall portion 52 having a specific portion 53 that rises from the outer peripheral end of the bottom plate portion 51 toward the plate-shaped member 10 and is positioned close to the plate-shaped member 10, a housing member 50 that houses the joining layer 30 and the base member 20 on its inside, and an adjustment member 59 that can adjust the positional relationship between the specific portion 53 and the plate-shaped member 10.

Description

Technical Field

[0001] This disclosure relates to a holding device.

Background Art

[0002] As an example of a holding device for holding a wafer during semiconductor manufacturing, an electrostatic chuck described in Patent Document 1 is known. This electrostatic chuck mainly includes a ceramic plate, a metal cooling plate, and a metal plate support plate. Electrodes for generating an electrostatic force for fixing a wafer are embedded inside the ceramic plate. The metal cooling plate has cooling grooves through which cooling water flows inside. The ceramic plate and the metal cooling plate are brazed or soldered. The metal cooling plate is fixed by bolts in a cavity formed in the metal support plate. It is said that the plasma heat applied to the wafer passes through the ceramic plate, through the brazed layer or soldered layer, and then is transmitted to the metal cooling plate. Such an electrostatic chuck is installed inside a processing chamber of a semiconductor manufacturing apparatus and is used for performing various processes such as film formation and etching on the wafer using plasma.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In plasma processing, the inside of the processing chamber is set to a process gas atmosphere at a predetermined pressure. As the process gas, a highly reactive reactive gas may be used. When the bonding layer of the electrostatic chuck is exposed to the reactive gas and corrosion progresses, problems may occur such as the heat transfer performance between the base member and the holding substrate not being maintained, or the corroded bonding layer becoming powdered.

[0005] The purpose of this disclosure is to provide a holding device that can suppress corrosion of the bonding layer. [Means for solving the problem]

[0006] The holding device of this disclosure comprises a plate-shaped member having a first surface and a second surface located opposite to the first surface; a base member having a third surface disposed opposite to the second surface; a bonding layer disposed between the second surface and the third surface and joining the second surface and the third surface; a bottom plate portion; a side wall portion having a specific portion which rises from the outer peripheral end of the bottom plate portion toward the plate-shaped member and is disposed in close proximity to or in contact with the plate-shaped member; a housing member which houses the bonding layer and the base member on its inside; and an adjusting member which can adjust the positional relationship between the specific portion and the plate-shaped member. [Effects of the Invention]

[0007] According to this disclosure, a retaining device that can suppress corrosion of the joint layer can be provided. [Brief explanation of the drawing]

[0008] [Figure 1] Figure 1 is a schematic diagram illustrating the general configuration of the holding device according to the first embodiment. [Figure 2] Figure 2 is a cross-sectional view taken along line AA in Figure 1. [Figure 3] Figure 3 is a partial cross-sectional view of the holding device according to the second embodiment, and is a partial cross-sectional view of the portion corresponding to line AA in Figure 1 of the first embodiment. [Figure 4] Figure 4 is a partial cross-sectional view of the holding device according to the third embodiment, and is a partial cross-sectional view of the portion corresponding to line AA in Figure 1 of the first embodiment. [Figure 5] Figure 5 is a partial cross-sectional view of the holding device according to the fourth embodiment, and is a partial cross-sectional view of the portion corresponding to line AA in Figure 1 of the first embodiment. [Figure 6] Figure 6 is a partial cross-sectional view of the holding device according to the fifth embodiment, and is a partial cross-sectional view of the portion corresponding to line AA in Figure 1 of the first embodiment. [Figure 7] Figure 7 is a partial cross-sectional view of the holding device according to the sixth embodiment, and is a partial cross-sectional view of the portion corresponding to line AA in Figure 1 of the first embodiment. [Figure 8] Figure 8 is a partial cross-sectional view of the holding device according to the seventh embodiment, and is a partial cross-sectional view of the portion corresponding to line AA in Figure 1 of the first embodiment. [Figure 9] Figure 9 is a partial cross-sectional view of the holding device according to the eighth embodiment, and is a partial cross-sectional view of the portion corresponding to line AA in Figure 1 of the first embodiment. [Figure 10] Figure 10 is a partial cross-sectional view of the holding device according to the ninth embodiment, and is a partial cross-sectional view of the portion corresponding to line AA in Figure 1 of the first embodiment. [Figure 11] Figure 11 is a cross-sectional view of the holding device according to the 10th embodiment, and is a cross-sectional view of the portion corresponding to line AA in Figure 1 of the first embodiment. [Figure 12] Figure 12 is a cross-sectional view of the holding device according to the 11th embodiment, and is a cross-sectional view of the portion corresponding to line AA in Figure 1 of the first embodiment. [Modes for carrying out the invention]

[0009] First, embodiments of this disclosure will be listed and described. (1) The holding device of the present disclosure comprises a plate-shaped member having a first surface and a second surface located opposite to the first surface; a base member having a third surface disposed opposite to the second surface; a bonding layer disposed between the second surface and the third surface and joining the second surface and the third surface; a bottom plate portion; a side wall portion having a specific portion which rises from the outer peripheral end of the bottom plate portion toward the plate-shaped member and is disposed in close proximity to or in contact with the plate-shaped member, and a housing member which houses the bonding layer and the base member on its inside; and an adjustment member which can adjust the positional relationship between the specific portion and the plate-shaped member.

[0010] When the interior of the processing chamber is in a reactive gas atmosphere, the holding device according to the present disclosure includes a housing member. Thus, the bonding layer is housed inside the housing member, making it less likely to be exposed to the reactive gas. Further, the holding device according to the present disclosure can suppress the intrusion of the reactive gas into the interior of the housing member by adjusting the positional relationship between a specific portion of the housing member and the plate-like member with an adjustment member. Therefore, the holding device according to the present disclosure can suppress the corrosion of the bonding layer.

[0011] (2) In the holding device according to (1), the specific portion is a portion arranged at the upper end of the side wall portion and in contact with the second surface, and it is preferable that the surface roughness (Ra) of the specific portion is 0.5 μm or less.

[0012] The specific portion at the upper end of the side wall portion contacts the second surface of the plate-like member. By adjusting the positional relationship between the specific portion and the second surface of the plate-like member with an adjustment member, the intrusion of the reactive gas into the interior of the housing member is suppressed. Further, by setting the surface roughness of the specific portion as described above, the adhesion in the state where the two are in contact is improved. Therefore, the intrusion of the reactive gas into the interior of the housing member is further suppressed.

[0013] ((3)) In the holding device according to (2), the specific portion is a seal band portion formed to protrude toward the second surface at the upper end of the side wall portion and in contact with the second surface, and it is preferable that the surface roughness (Ra) of the portion of the seal band portion in contact with the second surface is 0.2 μm or less.

[0014] By setting the surface roughness of the portion of the seal band portion in contact with the second surface as described above, the adhesion between the seal band portion and the second surface is further improved. Further, when the seal band portion is formed of a metal material, by adjusting the seal band portion and the second surface of the plate-like member to contact with each other with an adjustment member, the seal band portion is slightly plastically deformed to conform to the second surface, and the adhesion between the seal band portion and the second surface is further improved.

[0015] <{ (4) In the holding device according to any one of (1) to (3), a layer of a material having plasma resistance may be formed on the specific portion.

[0016] In this case, since the specific portion can have plasma resistance, the intrusion of reactive gas into the interior of the housing member is further suppressed.

[0017] (5) In the holding device according to any one of (1) to (4), a sealing member for sealing the gap between the specific portion and the plate-like member may be provided between the specific portion and the plate-like member.

[0018] In this case, since the gap between the specific portion and the plate-like member is sealed by the sealing member, the intrusion of reactive gas into the interior of the housing member is further suppressed.

[0019] (6) In the holding device according to (5), a plurality of the sealing members may be provided.

[0020] By providing a plurality of sealing members, even if any one of the sealing members is deteriorated by reactive gas, the positional relationship between the specific portion and the plate-like member is adjusted by the adjusting member, so that the other sealing member seals the gap between the specific portion and the plate-like member. Therefore, the intrusion of reactive gas into the interior of the housing member is suppressed.

[0021] (7) In the holding device according to any one of (1) to (6), an opening for supplying or exhausting gas to the interior of the housing member may be formed in the housing member.

[0022] In this case, the retaining device can exhaust reactive gas that has entered the interior of the containment member through the opening. Furthermore, by exhausting the gas inside the containment member through the opening, the retaining device can lower the air pressure inside the containment member, thereby improving the adhesion between the specific part and the plate-shaped member, or between the sealing member and the plate-shaped member. In addition, by supplying an inert gas such as helium into the interior of the containment member through the opening, the retaining device can reduce the concentration of reactive gas that has entered the interior of the containment member, thereby suppressing corrosion of the bonding layer. Moreover, by supplying an inert gas into the interior of the containment member through the opening, the retaining device can exhaust reactive gas that has entered the interior of the containment member by pushing it out of the containment member through the small gap between the specific part and the plate-shaped member.

[0023] <Details of the first embodiment of this disclosure> A schematic configuration of the first embodiment of this disclosure will be described with reference to Figures 1 and 2. This disclosure is not limited to these examples, but is intended to include all modifications within the meaning and scope of the claims as indicated by the claims. In the following description, for multiple identical components, only some components may be reference-labeled, while the reference numerals for others may be omitted. In this specification, the configuration of the holding device 1 is described with the positive Z-axis direction as the upward direction, the negative Z-axis direction as the downward direction, and the XY plane direction as the horizontal direction, but the actual usage embodiment of the holding device 1 may have a different configuration. In this specification, "horizontal" and "parallel" also include configurations that are substantially perceived as horizontal and parallel.

[0024] The holding device 1 of the first embodiment is an electrostatic chuck capable of adsorbing and holding a workpiece (hereinafter referred to as "wafer W"). The workpiece is a semiconductor wafer, a glass substrate, etc. The electrostatic chuck is installed, for example, inside the processing chamber of a semiconductor manufacturing apparatus (not shown) and used to perform various processes on the wafer W, such as film deposition and etching, using plasma.

[0025] The holding device 1 of the first embodiment, as shown in Figure 1, comprises a plate-shaped member 10, a base member 20, and a housing member 50. The plate-shaped member 10 and the base member 20 are joined to each other by a bonding layer 30 disposed between the plate-shaped member 10 and the base member 20.

[0026] The plate-shaped member 10 is a plate-shaped member that is substantially circular when viewed in the Z-axis direction and has insulating properties. In the first embodiment, the plate-shaped member 10 has a shape having, for example, a diameter of about 320 mm and a thickness of about 3 mm. The plate-shaped member 10 is formed of ceramics mainly composed of, for example, alumina (Al2O3) or aluminum nitride (AlN). In this specification, "main component" means that the component present in the largest proportion.

[0027] The plate-shaped member 10 has a first surface S1 for holding the wafer W and a second surface S2, shown in Figure 2, located on the opposite side of the first surface S1. The first surface S1 and the second surface S2 are substantially circular surfaces extending in a direction perpendicular to the Z-axis direction (horizontal direction). The first surface S1 is located on the upper side of the plate-shaped member 10, and the second surface S2 is located on the lower side of the plate-shaped member 10.

[0028] A chuck electrode 40, made of a conductive material including tungsten and molybdenum, is arranged inside the plate-shaped member 10. The chuck electrode 40 is, for example, planar and substantially parallel to the first surface S1. The chuck electrode 40 is provided with a power supply terminal (not shown), and an electrostatic attraction force is generated when power is supplied to the chuck electrode 40 from an external power source via the power supply terminal. This electrostatic attraction force causes the wafer W to be attracted and held on the first surface S1.

[0029] The plate-shaped member 10 with the above configuration can be manufactured, for example, by creating multiple green sheets made of ceramics, processing a predetermined green sheet by forming via holes, filling it with metallizing paste, printing, etc., heat-pressing these green sheets together, cutting or other processing, and then firing them.

[0030] As shown in Figure 1, the base member 20 is a substantially disc-shaped member having a diameter equivalent to that of the plate-shaped member 10. In the first embodiment, the base member 20 is a disc-shaped member with a smaller diameter than the plate-shaped member 10, having a diameter of about 300 mm and a thickness of about 15 mm to 30 mm. The base member 20 is formed from a metal such as aluminum or an aluminum alloy, a ceramic mainly composed of silicon carbide (SiC), alumina, aluminum nitride, or a composite material of metal and ceramic. When the base member 20 is made of ceramic, it is preferable that its thermal conductivity is 70 W / m·K or higher. In this case, since the thermal conductivity of the base member 20 is relatively high, the heat exchange efficiency with the refrigerant flowing through the refrigerant flow path 21, which will be described later, is improved.

[0031] In the first embodiment, the base member 20 is made of a sintered ceramic body mainly composed of silicon carbide. If the sintered ceramic body mainly composed of silicon carbide is conductive, the base member 20 can be given the function of an electrode to which a high-frequency voltage for generating plasma is applied. If the base member 20 is made of a non-conductive material, a conductive film may be formed on the surface of the base member 20. This allows the base member 20 to function as an electrode during plasma processing. Similarly, if the base member 20 is made mainly of silicon carbide, a similar conductive film may be formed on the surface of the base member 20.

[0032] The base member 20 has a third surface S3 located on the side facing the plate-shaped member 10, and a fourth surface S4 located on the opposite side from the third surface S3. The third surface S3 and the fourth surface S4 are both substantially circular surfaces extending in a direction perpendicular to the Z-axis direction (horizontal direction). The third surface S3 is located on the upper side of the base member 20, and the fourth surface S4 is located on the lower side of the base member 20. The third surface S3 is bonded to the second surface S2 of the plate-shaped member 10 by a bonding layer 30. The surface roughness (Ra) of the third surface S3 and the fourth surface S4 is preferably about 0.8 μm to 2.0 μm.

[0033] A refrigerant channel 21 is formed inside the base member 20. The refrigerant channel 21 is a channel with a width of approximately 5 mm to 10 mm and a depth of approximately 10 mm, and is formed in a spiral shape when viewed from above inside the base member 20. The refrigerant channel 21 is connected to a refrigerant circulation device (not shown). The refrigerant circulation device is configured to circulate the refrigerant through the refrigerant channel 21. A fluorine-based inert liquid, water, etc., can be used as the refrigerant. When the refrigerant flows through the refrigerant channel 21, the base member 20 is cooled. The plate-shaped member 10 is cooled by heat transfer between the base member 20 and the plate-shaped member 10 via the bonding layer 30. As a result, the wafer W held on the first surface S1 of the plate-shaped member 10 is cooled. In this way, the temperature of the wafer W is controlled.

[0034] In recent years, the amount of heat generated by plasma processing has increased, and maintaining the heat transfer performance between the plate-shaped member 10 and the base member 20 is crucial in order to maintain the wafer W temperature at a predetermined temperature. In this embodiment, both the plate-shaped member 10 and the base member 20 are made of ceramic material. In such cases, the thermal conductivity of the plate-shaped member 10 and the base member 20 can be relatively similar, making it easier to maintain the heat transfer performance between the plate-shaped member 10 and the base member 20 via the bonding layer 30. As shown in Figure 2, the refrigerant flow path 21 is formed to be rectangular in the XZ plane cross-section view, but the refrigerant flow path 21 may be formed to have other shapes such as circular or elliptical.

[0035] The base member 20 of the above configuration can be made, for example, by molding ceramic raw material powder by CIP (cold isohydrostatic pressing), degreasing the resulting molded body by holding it at a predetermined temperature, heating the degreased molded body to a high temperature in a nitrogen gas atmosphere or the like, and appropriately molding the sintered body obtained by heating.

[0036] The bonding layer 30 is positioned between the second surface S2 of the plate-shaped member 10 and the third surface S3 of the base member 20. The thickness of the bonding layer 30 is, for example, about 0.1 mm to 1 mm. The bonding layer 30 is composed of an adhesive having a predetermined thermal conductivity and thermal expansion properties. As the adhesive constituting the bonding layer 30, an organic resin material or an inorganic adhesive material is used. Organic resin materials include, for example, silicone resin, fluororesin, acrylic resin, epoxy resin, and other organic resin materials. Inorganic adhesive materials include, for example, those mainly composed of ceramics and inorganic polymers.

[0037] As shown in Figure 1, the housing member 50 is a member comprising a substantially disc-shaped bottom plate portion 51 and a side wall portion 52 that rises from the outer peripheral end of the bottom plate portion 51 toward the plate-shaped member 10. The bottom plate portion 51 has a diameter equivalent to that of the plate-shaped member 10 and a thickness of approximately 3 mm to 15 mm. The length of the side wall portion 52 in the Z-axis direction is slightly longer than the thickness of the base member 20.

[0038] When the holding device 1 is placed inside the processing chamber and plasma processing is performed on the wafer W held by the holding device 1, the inside of the processing chamber may be subjected to a process gas atmosphere. The containment member 50 is provided to suppress corrosion of the bonding layer 30 by exposure to the reactive gas when a reactive gas is used as the process gas, by containing the bonding layer 30 and the base member 20 inside it. Examples of reactive gases used include NF3, Cl2, CF4, CCl4, HF, ClF3, HCl, etc. For this reason, the containment member 50 is preferably made of an aluminum alloy such as A5052 or A6061, which is easy to shape and has a certain degree of corrosion resistance. The containment member 50 may also be made of other corrosion-resistant metals, various ceramic materials, or composite materials of metal and ceramics.

[0039] The housing member 50 is attached to the base member 20 by an adjustment member 59. The bottom plate portion 51 of the housing member 50 has a through hole 55 that penetrates the bottom plate portion 51 in the thickness direction. In this embodiment, two adjustment members 59 are provided, and the through holes 55 are formed in two locations in the bottom plate portion 51. The number of adjustment members 59 and the number of through holes 55 formed in the bottom plate portion 51 may be changed as appropriate. In this embodiment, the adjustment member 59 is a screw. The adjustment member 59 comprises a screw head 59A and a threaded portion 59B. The through hole 55 is shaped to accommodate the head 59A and the portion of the threaded portion 59B that is close to the head 59A inside it.

[0040] As shown in Figure 2, a fastening hole 25 is formed on the fourth surface S4 of the base member 20 in an area that overlaps with the area where the through hole 55 is formed when the bottom plate portion 51 is viewed from above, and it is recessed from the fourth surface S4 toward the third surface S3. In this embodiment, the fastening hole 25 is a screw hole into which the threaded portion 59B of the adjustment member 59, which is a screw, is fastened. By fastening the threaded portion 59B of the adjustment member 59, which is inserted through the through hole 55, to the fastening hole 25, the bottom plate portion 51 of the housing member 50 and the fourth surface S4 of the base member 20 are positioned to face each other. In addition, the side wall portion 512 of the housing member 50 is positioned to surround the outer peripheral end surface S6 of the base member 20. In this way, the bonding layer 30 and the base member 20 are housed inside the housing member 50. At this time, the outer peripheral end surface S5 of the plate-shaped member 10 is positioned to be aligned with the outer surface of the side wall portion 52 of the housing member 50. The outer peripheral end face S5 may be positioned outside the outer surface of the side wall portion 52, or it may be positioned inside the outer surface of the side wall portion 52.

[0041] The end face located at the upper end of the side wall portion 52 of the housing member 50 contacts the second surface S2 of the plate-shaped member 10. This portion located at the upper end of the side wall portion 52 and in contact with or close to the second surface S2 of the plate-shaped member 10 is designated as the specific portion 53. In the first embodiment, the upper end face of the side wall portion 52 corresponds to the specific portion 53. By the entire specific portion 53 contacting the second surface S2 of the plate-shaped member 10, the bonding layer 30 and the base member 20 are isolated from the outside of the holding device 1 in a manner that they are located in a region formed between the housing member 50 and the second surface S2.

[0042] A user of the retaining device 1 can adjust the position of the specific portion 53 relative to the second surface S2 of the plate-shaped member 10 by adjusting the degree to which the adjustment member 59 is fastened to the fastening hole 25. For example, by fastening the adjustment member 59 more tightly to the fastening hole 25, the user can make the specific portion 53 more closely adhere to the second surface S2, thereby improving the airtightness of the inner region of the housing member 50 relative to the outside of the retaining device 1. This suppresses the intrusion of reactive gas into the interior of the housing member 50, and thus suppresses corrosion of the bonding layer 30 located in the inner region of the housing member 50.

[0043] The surface roughness (Ra) of the specific portion 53 is preferably 1.6 μm or less. In the first embodiment, the surface roughness (Ra) of the specific portion 53 is 0.5 μm or less. The portion of the second surface S2 that contacts the specific portion 53 is defined as the contact portion S2A. In the first embodiment, the contact portion S2A corresponds to the outer edge of the second surface S2. In the first embodiment, the surface roughness (Ra) of the contact portion S2A is also 0.5 μm or less. This improves the adhesion between the specific portion 53 and the contact portion S2A when they are in contact. Therefore, the airtightness of the inner region of the housing member 50 relative to the outside of the holding device 1 is further improved, and the intrusion of reactive gas into the interior of the housing member 50 is suitably suppressed. Therefore, corrosion of the bonding layer 30 arranged in the inner region of the housing member 50 is suitably suppressed.

[0044] As described above, the holding device 1 comprises a plate-shaped member 10 having a first surface S1 and a second surface S2 located on the opposite side of the first surface S1, a base member 20 having a third surface S3 positioned opposite the second surface S2, and a bonding layer 30 positioned between the second surface S2 and the third surface S3 to join the second surface S2 and the third surface S3. The holding device 1 also comprises a bottom plate portion 51, a side wall portion 52 having a specific portion 53 that rises from the outer peripheral end of the bottom plate portion 51 toward the plate-shaped member 10 and is positioned close to the plate-shaped member 10, a housing member 50 that houses the bonding layer 30 and the base member 20 on its inside, and an adjustment member 59 that can adjust the positional relationship between the specific portion 53 and the plate-shaped member 10.

[0045] Even when the inside of the processing chamber is subjected to a reactive gas atmosphere, the holding device 1 is equipped with a housing member 50, so the bonding layer 30 is housed inside the housing member 50 and is less likely to be exposed to the reactive gas. Furthermore, the holding device 1 can suppress the intrusion of reactive gas into the housing member 50 by adjusting the positional relationship between a specific part 53 of the housing member 50 and the plate-shaped member 10 using an adjustment member 59. Therefore, the holding device 1 can suppress corrosion of the bonding layer 30.

[0046] The specific portion 53 is located at the upper end of the side wall portion 52 and is in contact with the second surface S2, and the surface roughness (Ra) of the specific portion 53 is 0.5 μm or less.

[0047] The specific portion 53 at the upper end of the side wall portion 52 contacts the second surface S2 of the plate-shaped member 10. By adjusting the positional relationship between the specific portion 53 and the second surface S2 of the plate-shaped member 10 using the adjustment member 59, the intrusion of reactive gas into the interior of the containment member 50 is suppressed. Furthermore, the surface roughness of the specific portion 53 is set as described above, improving the adhesion when the two are in contact. Therefore, the intrusion of reactive gas into the interior of the containment member 50 is further suppressed.

[0048] <Details of the second embodiment of this disclosure> Next, a holding device 71 according to the second embodiment of this disclosure will be described with reference to Figure 3. In the second embodiment, the same reference numerals are used for the same parts as in the first embodiment, and redundant explanations of the structure, operation, and effect are omitted.

[0049] As shown in Figure 3, the holding device 71 comprises a plate-shaped member 10, a base member 20, a bonding layer 30, and a housing member 150. The housing member 150 has side wall portions 152 that rise from the outer peripheral end of a substantially disc-shaped bottom plate portion (not shown) toward the plate-shaped member 10.

[0050] A seal band portion 153 is formed on the upper end surface of the side wall portion 152, projecting from this upper end surface toward the second surface S2 of the plate-like member 10. In the second embodiment, the seal band portion 153 is each of the two protrusions shown projecting from the upper end surface of the side wall portion 152 toward the second surface S2 of the plate-like member 10 in Figure 3. As shown in Figure 3, one of the two seal band portions 153 is positioned on the upper end surface of the side wall portion 152, close to the outer surface of the side wall portion 152, while the other is positioned closer to the inner surface of the side wall portion 152 than the other seal band portion 153. Although not shown, in plan view, the seal band portion 153 forms a double annular protrusion on the upper end surface of the side wall portion 152. The seal band portion 153 is the part that is in contact with the second surface S2 of the plate-like member 10, and corresponds to the specific portion 53 in the first embodiment. Furthermore, the seal band portion 153 may form a double annular protrusion on the upper end surface of the side wall portion 152, as in the second embodiment, or it may form a single annular protrusion or three or more annular protrusions.

[0051] Although not shown in the illustration, the bottom plate portion of the housing member 150 has a through hole similar to the through hole 55 of the first embodiment. The adjustment member 59 is inserted through the through hole 55 and the threaded portion 59B is fastened to the fastening hole 25, thereby housing the joining layer 30 and the base member 20 inside the housing member 150. At this time, the end 153A of the seal band portion 153 opposite to the upper end surface of the side wall portion 152 contacts the second surface S2 of the plate-shaped member 10. The user of the holding device 71 can adjust the position of the seal band portion 153 relative to the second surface S2 of the plate-shaped member 10 by adjusting the degree to which the adjustment member 59 is fastened to the fastening hole. The portion of the second surface S2 of the plate-shaped member 10 that contacts the end 153A of the seal band portion 153 is called the contact portion S2A.

[0052] In the second embodiment, the surface roughness (Ra) of the end portion 153A of the seal band portion 153 is set to 0.2 μm or less. Generally, the smaller the area to be surface-treated, such as polishing, the smaller the surface roughness (Ra) can be. In the second embodiment, the area of ​​the end portion 153A of the seal band portion 153 is smaller than the area of ​​the entire upper end surface of the side wall portion 152. Therefore, the surface roughness (Ra) of the end portion 153A of the seal band portion 153 can be made smaller than when the entire upper end surface of the side wall portion 152 is surface-treated, such as polishing. In other words, by providing the seal band portion 153 on the upper end surface of the side wall portion 152, the retaining device 71 can further improve the adhesion between the end portion 153A of the seal band portion 153 and the contact portion S2A. As a result, the airtightness of the inner region of the housing member 150 relative to the outside of the retaining device 71 is further improved, and the intrusion of reactive gas into the interior of the housing member 150 is further suppressed. This suppresses corrosion of the bonding layer 30 located in the inner region of the housing member 150. In this case, it is preferable that the surface roughness (Ra) of the contact portion S2A is also 0.2 μm or less, as this further improves the adhesion between the contact portion S2A and the end portion 153A of the seal band portion 153.

[0053] The user of the retaining device 71 can improve the airtightness of the inner region of the housing member 150 from the outside of the retaining device 71 by tightening the adjustment member 59 more firmly against the fastening hole, thereby bringing the end 153A of the seal band portion 153 more tightly against the contact portion S2A. In this case, if the seal band portion 153 is made of metal, the adjustment member 59 may cause the seal band portion 153 to slightly plastically deform and conform more easily to the second surface by bringing the end 153A of the seal band portion 153 and the contact portion S2A into stronger contact. In this case, the adhesion between the end 153A of the seal band portion 153 and the contact portion S2A is further improved. This further suppresses the intrusion of reactive gas into the interior of the housing member 150. Therefore, corrosion of the bonding layer 30 disposed in the inner region of the housing member 150 is suppressed.

[0054] As described above, in the holding device 71, the specific part 53 is a seal band part 153 that is formed at the upper end of the side wall part 152, protruding toward the second surface S2 and in contact with the second surface S2. The surface roughness (Ra) of the part of the seal band part 153 that is in contact with the second surface S2 is 0.2 μm or less.

[0055] By making the surface roughness of the portion of the seal band portion 153 that contacts the second surface S2 as described above, the adhesion between the seal band portion 153 and the second surface S2 is further improved. Furthermore, if the seal band portion 153 is made of a metal material, the seal band portion 153 is slightly plastically deformed by the adjustment member 59 so that it comes into contact with the second surface S2 of the plate-like member 10, making it easier to conform to the second surface, and thus further improving the adhesion between the seal band portion 153 and the second surface S2.

[0056] <Details of the third embodiment of this disclosure> Next, a holding device 72 according to the third embodiment of this disclosure will be described with reference to Figure 4. In the third embodiment, the same reference numerals are used for the same parts as in the first embodiment, and redundant explanations of the structure, operation, and effect will be omitted.

[0057] As shown in Figure 4, the holding device 72 comprises a plate-shaped member 10, a base member 20, a bonding layer 30, and a housing member 250. The housing member 250 has a side wall portion 252 that rises from the outer peripheral end of a substantially disc-shaped bottom plate portion (not shown) toward the plate-shaped member 10. The upper end surface of the side wall portion 252 is a portion that is positioned close to the second surface S2 of the plate-shaped member 10. In the third embodiment, the upper end surface of the side wall portion 252 is designated as a specific portion 253.

[0058] In the third embodiment, as shown in Figure 4, a plasma-resistant layer 256, which is a layer of plasma-resistant material, is formed on the upper layer of the specific portion 253. In the third embodiment, yttria (Y2O3) is used as the plasma-resistant material for forming the plasma-resistant layer 256. The plasma-resistant layer 256, which is mainly composed of yttria, is formed by thermal spraying yttria onto the specific portion 253. In this case, the thickness of the plasma-resistant layer 256 is approximately 10 μm to 30 μm.

[0059] The specific portion 253 contacts the contact portion S2A of the second surface S2 of the plate-shaped member 10 via the plasma-resistant layer 256. The plasma resistance of the specific portion 253 is improved by the formation of the plasma-resistant layer 256 on the upper layer of the specific portion 253. Therefore, even when the holding device 72 is used in a reactive gas atmosphere, corrosion of the specific portion 253 by the reactive gas is suppressed. Consequently, the intrusion of reactive gas into the interior of the housing member 250 from between the specific portion 253 and the contact portion S2A is suppressed. Consequently, corrosion of the bonding layer 30 located in the inner region of the housing member 250 is suppressed.

[0060] Furthermore, materials other than yttria, such as YAG (Y3Al5O3) and YAG-dispersed alumina, may be used as the material for forming the plasma-resistant layer 256. Also, the plasma-resistant layer 256 may be formed on the upper layer of the seal band portion 153 in the second embodiment.

[0061] As described above, in the holding device 72, a plasma-resistant layer 256, which is a layer of plasma-resistant material, is formed on the specific part 253.

[0062] In this case, since the specific part 253 can have plasma resistance, the intrusion of reactive gas into the interior of the containment member 250 is further suppressed.

[0063] <Details of the fourth embodiment of this disclosure> Next, a holding device 73 according to the fourth embodiment of this disclosure will be described with reference to Figure 5. In the fourth embodiment, the same reference numerals are used for the same parts as in the first embodiment, and redundant explanations of the structure, operation, and effect are omitted.

[0064] As shown in Figure 5, the holding device 73 comprises a plate-shaped member 10, a base member 20, a bonding layer 30, and a housing member 350. The housing member 350 comprises a bottom plate portion 351 and a side wall portion 352 that rises from the outer peripheral end of the bottom plate portion 351 toward the plate-shaped member 10. A through hole 355 for inserting an adjustment member 59 is formed in the bottom plate portion 351. The through hole 355 is formed in the same shape as the through hole 55 in the first embodiment. The upper end of the side wall portion 352 is a portion that is positioned close to the second surface S2 of the plate-shaped member 10. In the fourth embodiment, the upper end surface of the side wall portion 352 is designated as a specific portion 353.

[0065] As shown in Figure 5, the specific portion 353 has a recess 353A formed therein that extends inward from the specific portion 353 toward the bottom plate portion 351. In plan view, the recess 353A is formed as a groove that is recessed in an annular shape on the specific portion 353. The recess 353A is formed to accommodate a sealing member 60 inside it. In this embodiment, the sealing member 60 is an O-ring made of a material such as a perfluoroelastomer that has plasma resistance, corrosion resistance, and elasticity. The sealing member 60 may be something other than an O-ring, such as a ring-shaped sealing member or a gasket cut into an annular shape. The sealing member 60 may also be made of another material that has corrosion resistance.

[0066] A user of the retaining device 73 can adjust the position of the specific portion 353 relative to the second surface S2 of the plate-shaped member 10 by adjusting the degree to which the adjustment member 59 is fastened to the fastening hole 25, with the sealing member 60 placed in the recess 353A. When the specific portion 353 is positioned close to the second surface S2, the sealing member 60 can fill and seal the gap between the specific portion 353 and the second surface S2.

[0067] The user can improve the airtightness of the inner region of the housing member 350 from the outside of the holding device 73 by tightening the adjustment member 59 more firmly against the fastening hole 25, thereby bringing the sealing member 60 more tightly to the contact portion S2A of the second surface S2 that contacts the sealing member 60. This suppresses the intrusion of reactive gas into the inside of the housing member 350, and thus suppresses corrosion of the bonding layer 30 disposed in the inner region of the housing member 350. In particular, when plasma treatment is performed at extremely low temperatures, the sealing member 60 may harden. In such cases, the user can bring the specific portion 353 closer to the contact portion S2A by tightening the adjustment member 59 even more firmly against the fastening hole 25. This allows the user to compress the hardened sealing member 60 and bring it tightly to the contact portion S2A, thereby restoring the airtightness of the inner region of the housing member 350 from the outside of the holding device 73.

[0068] As described above, in the holding device 73, a sealing member 60 is provided between the specific part 353 and the plate-shaped member 10 to seal the gap between the specific part 353 and the plate-shaped member 10.

[0069] In this case, the gap between the specific part 353 and the plate-shaped member 10 is sealed by the sealing member 60, further suppressing the intrusion of reactive gas into the interior of the containment member 350.

[0070] <Details of the fifth embodiment of this disclosure> Next, a holding device 74 according to the fifth embodiment of this disclosure will be described with reference to Figure 6. In the fifth embodiment, the same reference numerals are used for the same parts as in the first and fourth embodiments, and redundant explanations of the structure, operation, and effect are omitted.

[0071] As shown in Figure 6, the holding device 74 comprises a plate-shaped member 10, a base member 20, a bonding layer 30, and a housing member 450. The housing member 450 comprises a bottom plate portion (not shown) and a side wall portion 452 that rises from the outer peripheral end of the bottom plate portion toward the plate-shaped member 10. Although not shown, a through hole is formed in the bottom plate portion for inserting an adjustment member 59. This through hole is formed in the same shape as the through hole 55 in the first embodiment. The upper end of the side wall portion 452 is a portion that is positioned close to the second surface S2 of the plate-shaped member 10. In the fifth embodiment, the upper end surface of the side wall portion 452 is designated as a specific portion 453.

[0072] As shown in Figure 6, recesses 453A and 453B are formed in the specific portion 453, extending inward from the specific portion 453 toward the bottom plate portion. As shown in Figure 6, recess 453A is located in the specific portion 453, close to the outer surface of the side wall portion 452, while recess 453B is located closer to the inner surface of the side wall portion 452 than recess 453A. Although not shown in the figure, each of the recesses 453A and 453B is formed in a double groove shape that is recessed in an annular shape on the specific portion 453 in a plan view. Each of the recesses 453A and 453B is formed to accommodate the sealing member 60 inside.

[0073] A user of the retaining device 74 can adjust the position of the specific portion 453 relative to the second surface S2 of the plate-shaped member 10 by adjusting the degree to which the adjustment member 59 is fastened to the fastening hole 25, with the sealing member 60 positioned in each of the recesses 453A and 453B. When the specific portion 453 is positioned close to the second surface S2, the sealing member 60 is in close contact with the contact portion S2A of the second surface S2 that contacts the sealing member 60, so the sealing member 60 can fill and seal the gap between the specific portion 453 and the second surface S2. In this case, since the sealing member 60 is positioned twice in the specific portion 453, the airtightness of the inner region of the housing member 450 relative to the outside of the retaining device 74 is further improved. As a result, the intrusion of reactive gas into the inside of the housing member 450 is suppressed, and corrosion of the bonding layer 30 positioned in the inner region of the housing member 450 is suppressed.

[0074] In particular, if the plasma treatment is performed at an extremely low temperature, the sealing member 60 may harden. Because the sealing member 60 is arranged in a double layer in the specific section 453, even if one of the two sealing members 60 hardens, the degree of hardening of the other sealing member 60 may be less. In such cases, the user may adjust the degree to which the adjustment member 59 is fastened to the fastening hole 25 to firmly adhere the sealing member 60 with the less hardened degree to the contact portion S2A of the second surface S2. This restores the airtightness of the inner region of the housing member 450 to the outside of the holding device 74.

[0075] In the fifth embodiment, an example was shown in which the sealing member 60 is arranged in a double layer in the specific section 453, but there is no limit to the number of sealing members 60 arranged in the specific section 453. Therefore, three or more sealing members 60 may be arranged in the specific section 453.

[0076] As described above, the holding device 74 is provided with multiple sealing members 60.

[0077] In the holding device 74, multiple sealing members 60 are provided. Even if one of the sealing members 60 is altered by the reactive gas, the positional relationship between the specific part 453 and the plate-shaped member 10 is adjusted by the adjustment member 59, so that the other sealing members 60 seal the gap between the specific part 453 and the plate-shaped member 10. Therefore, the intrusion of reactive gas into the interior of the containment member 450 is suppressed.

[0078] <Details of the sixth embodiment of this disclosure> Next, a holding device 75 according to the sixth embodiment of this disclosure will be described with reference to Figure 7. In the sixth embodiment, the same reference numerals are used for the same parts as in the first and fourth embodiments, and redundant explanations of the structure, operation, and effect are omitted.

[0079] As shown in Figure 7, the holding device 75 comprises a plate-shaped member 510, a base member 20, a bonding layer 30, and a housing member 550. The plate-shaped member 510 is a disc-shaped member similar to the plate-shaped member 10 of the first embodiment, but its diameter is approximately the same as the diameter of the base member 20. Therefore, as shown in Figure 7, the outer peripheral end face S5 of the plate-shaped member 510 is positioned approximately the same as the outer peripheral end face S6 of the base member 20. The diameter of the plate-shaped member 510 may be slightly larger or slightly smaller than the diameter of the base member 20. The plate-shaped member 510 may be formed with a chuck electrode 540 or the like inside.

[0080] The housing member 550 comprises a bottom plate portion 551 and a side wall portion 552 that rises from the outer peripheral end of the bottom plate portion 551 toward the plate-shaped member 510. Although not shown in the figures, a through hole is formed in the bottom plate portion 551 for inserting the adjustment member 59. This through hole is formed in the same shape as the through hole 55 of the first embodiment. The length of the side wall portion 552 in the Z-axis direction is approximately the same as the combined length of the thickness of the base member 20, the thickness of the bonding layer 30, and the thickness of the plate-shaped member 510. When the adjustment member 59 is inserted through the through hole and the threaded portion 59B is fastened to the fastening hole 25, the bonding layer 30, the base member 20, and the plate-shaped member 510 are housed inside the housing member 550. At this time, the inner edge portion of the upper end of the side wall portion 552 is positioned close to the outer peripheral end face S5 of the plate-shaped member 510 and is arranged to surround the outer peripheral end face S5 of the plate-shaped member 510. This portion, which is positioned close to the outer peripheral end face S5 of the plate-shaped member 510 and surrounds the outer peripheral end face S5, is designated as the specific portion 553.

[0081] As shown in Figure 7, the specific portion 553 has a recess 553A formed in it that is recessed in the thickness direction of the side wall portion 552 from the specific portion 553. The recess 553A is formed in a groove shape over the entire specific portion 553, that is, over the entire inner edge portion of the upper end of the side wall portion 552. The recess 553A is formed to accommodate the sealing member 60 inside it.

[0082] A user of the retaining device 75 can adjust the position of the specific portion 553 relative to the outer peripheral end face S5 of the plate-shaped member 10 by adjusting the degree to which the adjustment member 59 is fastened to the fastening hole 25, with the sealing member 60 placed in the recess 553A. When the specific portion 553 is positioned close to the outer peripheral end face S5, the sealing member 60 can fill and seal the gap between the specific portion 553 and the outer peripheral end face S5. This improves the airtightness of the inner region of the housing member 550 relative to the outside of the retaining device 75. As a result, the intrusion of reactive gas into the interior of the housing member 550 is suppressed, and corrosion of the bonding layer 30 located in the inner region of the housing member 550 is suppressed.

[0083] <Details of the seventh embodiment of this disclosure> Next, a holding device 76 according to the seventh embodiment of this disclosure will be described with reference to Figure 8. In the seventh embodiment, the same reference numerals are used for the same parts as in the first, fourth, and sixth embodiments, and redundant explanations of the structure, operation, and effect will be omitted.

[0084] As shown in Figure 8, the holding device 76 comprises a plate-shaped member 510, a base member 20, a bonding layer 30, and a housing member 650. The plate-shaped member 510 is the same as the plate-shaped member 510 of the sixth embodiment. Therefore, as shown in Figure 8, the outer peripheral end face S5 of the plate-shaped member 510 is positioned approximately the same as the outer peripheral end face S6 of the base member 20.

[0085] The housing member 650 comprises a bottom plate portion 651 and a side wall portion 652 that rises from the outer peripheral end of the bottom plate portion 651 toward the plate-shaped member 510. Although not shown in the figures, a through hole is formed in the bottom plate portion 651 for inserting the adjustment member 59. This through hole is formed in the same shape as the through hole 55 of the first embodiment. The length of the side wall portion 652 in the Z-axis direction is slightly shorter than the combined length of the thickness of the base member 20, the thickness of the bonding layer 30, and the thickness of the plate-shaped member 510. The bonding layer 30, the base member 20, and the plate-shaped member 510 are housed inside the housing member 650 when the adjustment member 59 is inserted through the through hole and the threaded portion 59B is fastened to the fastening hole 25. At this time, the inner edge portion of the upper end of the side wall portion 552 is positioned to surround the end face of the joining layer 30 that is visible between the outer peripheral end face S5 of the plate-shaped member 510 and the outer peripheral end face S6 of the base member 20. This portion, which is positioned close to the end face of the joining layer 30 and surrounds the end face of the joining layer 30, is designated as the specific portion 653.

[0086] As shown in Figure 8, the specific portion 653 has a recess 653A formed in it that is recessed in the thickness direction of the side wall portion 652 from the specific portion 653. The recess 653A is formed in a groove shape over the entire specific portion 653, that is, over the entire inner edge portion of the end of the side wall portion 652. The recess 653A is formed to accommodate the sealing member 60 inside it.

[0087] A user of the retaining device 76 can adjust the position of the specific portion 653 relative to the plate-shaped member 10 by adjusting the degree to which the adjustment member 59 is fastened to the fastening hole 25, with the sealing member 60 placed in the recess 653A. When the specific portion 653 is positioned close to the lower part of the outer peripheral end face S5 of the plate-shaped member 510, the sealing member 60 can fill and seal the gap between the specific portion 553 and the lower part of the outer peripheral end face S5 and the end face of the bonding layer 30. This improves the airtightness of the inner region of the housing member 650 relative to the outside of the retaining device 76. In this way, the intrusion of reactive gas into the interior of the housing member 650 is suppressed, and corrosion of the bonding layer 30 located in the inner region of the housing member 650 is suppressed.

[0088] As shown in the seventh embodiment, the specific portion 653 only needs to be a portion positioned close to the outer peripheral end face S5 of the plate-shaped member 510, and the sealing member 60 positioned in the specific portion 653 does not need to be positioned in close contact with the outer peripheral end face S5. Even if the sealing member 60 positioned in the specific portion 653 is not in contact with the outer peripheral end face S5 of the plate-shaped member 510, corrosion of the bonding layer 30 is suppressed by direct contact with the end face of the bonding layer 30. Depending on the size of the sealing member 60, the sealing member 60 positioned in the specific portion 653 may be positioned to be in contact with the outer peripheral end face S5 of the plate-shaped member 510, the end face of the bonding layer 30, and the outer peripheral end face S6 of the base member 20.

[0089] <Details of the eighth embodiment of this disclosure> Next, a holding device 77 according to the eighth embodiment of this disclosure will be described with reference to Figure 9. In the eighth embodiment, the same reference numerals are used for the same parts as in the first and fourth embodiments, and redundant explanations of the structure, operation, and effect are omitted.

[0090] As shown in Figure 9, the holding device 77 comprises a plate-shaped member 10, a base member 20, a bonding layer 30, and a housing member 750. The housing member 750 comprises a bottom plate portion 751 and a side wall portion 752 that rises from the outer peripheral end of the bottom plate portion 751 toward the plate-shaped member 10. Although not shown, a through hole is formed in the bottom plate portion 751 for inserting an adjustment member 59. This through hole is formed in the same shape as the through hole 55 of the first embodiment. The length of the side wall portion 752 in the Z-axis direction is slightly longer than the thickness of the base member 20. When the adjustment member 59 is inserted through the through hole and the threaded portion 59B is fastened to the fastening hole 25, the bonding layer 30 and the base member 20 are housed inside the housing member 750. At this time, the upper end surface of the side wall portion 752 is positioned in contact with the second surface S2 of the plate-shaped member 10. In the eighth embodiment, the upper end surface of the side wall portion 752 is designated as the specific portion 753.

[0091] As shown in Figure 9, a recess 753A is formed in the specific portion 753. The recess 753A is formed by an inclined surface that slopes downward from the specific portion 753 toward the inner surface of the bottom plate portion 751 and the side wall portion 752, and a stepped surface that extends substantially horizontally from the lower end of the inclined surface toward the inner surface of the side wall portion 752, forming a step difference with the specific portion 753. The recess 753A is formed as a recess over the entire specific portion 753, that is, over the entire upper end surface of the side wall portion 752. With the specific portion 753 in contact with the outer edge of the second surface S2, the sealing member 60 is placed in the space surrounded by the recess 753A, the second surface S2, and the outer peripheral end surface S6 of the base member 20.

[0092] A user of the retaining device 77 can adjust the position of the specific portion 753 relative to the second surface S2 of the plate-shaped member 10 by adjusting the degree to which the adjustment member 59 is fastened to the fastening hole 25, while the sealing member 60 is positioned in the space surrounded by the recess 753A, the second surface S2, and the outer peripheral end face S6 of the base member 20. When the specific portion 753 is positioned in contact with the second surface S2, the sealing member 60 is positioned in contact with at least the surface of the recess 753A, the second surface S2, and the outer peripheral end face S6 of the base member 20. In this way, the sealing member 60 can fill and seal a portion of the space surrounded by the recess 753A, the second surface S2, and the outer peripheral end face S6 of the base member 20. As a result, the intrusion of reactive gas into the interior of the housing member 750 is suppressed, and corrosion of the bonding layer 30 positioned in the inner region of the housing member 750 is suppressed.

[0093] As shown in the sixth to eighth embodiments, the sealing member 60 is not limited to being provided in a manner that contacts the upper end surfaces of the side wall portions 352 and 452, as shown in the fourth and fifth embodiments. The sealing member 60 may also be provided in a manner that contacts the inner surfaces of the side wall portions 552, 652 and 752.

[0094] <Details of the ninth embodiment of this disclosure> Next, a holding device 78 according to the ninth embodiment of this disclosure will be described with reference to Figure 10. In the ninth embodiment, the same reference numerals are used for the same parts as in the first and fourth embodiments, and redundant explanations of the structure, operation, and effect are omitted.

[0095] As shown in Figure 10, the holding device 78 comprises a plate-shaped member 810, a base member 820, a bonding layer 830, and a housing member 850. The plate-shaped member 810 is a disc-shaped member of similar size to the plate-shaped member 510 of the sixth embodiment, and its diameter is approximately the same as the diameter of the base member 820. The plate-shaped member 810 may be formed to include a chuck electrode 840 or the like inside. The base member 820 is a disc-shaped member of similar size to the base member 20 of the first embodiment. A refrigerant flow path 821 similar to the refrigerant flow path 21 of the first embodiment is formed inside the base member 820. The bonding layer 830, similar to the bonding layer 30 of the first embodiment, is disposed between the second surface S2 of the plate-shaped member 10 and the third surface S3 of the base member 20, and bonds the second surface S2 and the third surface S3.

[0096] On the outer peripheral end face S5 of the plate-shaped member 810, in the portion adjacent to the bonding layer 830, an inclined surface 813 is formed that slopes inward from the outer peripheral end face S5 toward the inside of the plate-shaped member 810. On the end face of the bonding layer 830, an inclined surface 833 is formed that is continuous with the inclined surface 813. On the outer peripheral end face S6 of the base member 20, in the portion adjacent to the bonding layer 830, an inclined surface 823 is formed that slopes downward toward the outside of the base member 820 from the position where the inclined surface 833 and the third surface S3 are in contact. These inclined surfaces 813, 823, and 833 form a wedge-shaped recess so that the end face of the bonding layer 830 and its vicinity are open. The sealing member 60 is placed in this open region.

[0097] The housing member 850 comprises a bottom plate portion 851 and a side wall portion 852 that rises from the outer peripheral end of the bottom plate portion 851 toward the plate-shaped member 810. Although not shown in the figure, a through hole is formed in the bottom plate portion 851 for inserting the adjustment member 59. This through hole is formed in the same shape as the through hole 55 of the first embodiment. The length of the side wall portion 852 in the Z-axis direction is slightly shorter than the combined length of the thickness of the base member 20, the thickness of the bonding layer 30, and the thickness of the plate-shaped member 510. Alternatively, the length of the side wall portion 852 in the Z-axis direction may be equal to the combined length of the thickness of the bonding layer 30 and the thickness of the plate-shaped member 510. When the adjustment member 59 is inserted through the through hole and the threaded portion 59B is fastened to the fastening hole 25, the bonding layer 830, the base member 820, and a part of the plate-shaped member 810 are housed inside the housing member 850. At this time, the inner edge portion of the upper end of the side wall portion 852 is positioned close to the opening area formed by the inclined surfaces 813, 823, and 833, surrounding it. The inner edge portion of the upper end of the side wall portion 852, which is positioned to surround the opening area formed by the inclined surfaces 813, 823, and 833, is designated as the specific portion 853.

[0098] As shown in Figure 10, the sealing member 60 is positioned in the opening region formed by the inclined surfaces 813, 823, and 833. The portion of the sealing member 60 opposite to the opening region is positioned in contact with the specific portion 853. A user of the holding device 78 can adjust the position of the specific portion 853 relative to the opening region formed by the inclined surfaces 813, 823, and 833 by adjusting the degree to which the adjustment member 59 is fastened to the fastening hole 25. The sealing member 60 is positioned in contact with each of the inclined surfaces 813, 823, and 833 and with the specific portion 853. In this way, the sealing member 60 can fill and seal at least a portion of the opening region formed by the inclined surfaces 813, 823, and 833. This suppresses the intrusion of reactive gas into the interior of the housing member 850, thereby suppressing corrosion of the bonding layer 830 positioned in the inner region of the housing member 850.

[0099] Thus, the recess for arranging the sealing member 60 is not limited to being provided in the specific portion 853 of the side wall portion 852. The area for arranging the sealing member 60 may be secured by devising the shape of the end faces of the plate-like members 10, 510, 810, the base member 20, 820, and the bonding layer 30, 830.

[0100] <Details of the 10th Embodiment of this Disclosure> Next, a holding device 79 according to the tenth embodiment of this disclosure will be described with reference to Figure 11. In the tenth embodiment, the same reference numerals are used for the same parts as in the first and fourth embodiments, and redundant explanations of the structure, operation, and effect are omitted.

[0101] As shown in Figure 11, the holding device 79 comprises a plate-shaped member 10, a base member 20, a bonding layer 30, and a housing member 950. The housing member 950 comprises a bottom plate portion 951 and a side wall portion 952 that rises from the outer peripheral end of the bottom plate portion 951 toward the plate-shaped member 10. A through hole 955 for inserting the adjustment member 59 is formed in the bottom plate portion 951. This through hole 955 is formed in the same shape as the through hole 55 of the first embodiment. The side wall portion 952 is configured in the same way as the side wall portion 352 of the fourth embodiment. The upper end surface of the side wall portion 952 is designated as a specific portion 953. A recess 953A is formed in the specific portion 953, similar to the recess 353A formed in the specific portion 353 of the fourth embodiment. The recess 953A is formed to accommodate a sealing member 60 inside it.

[0102] A user of the retaining device 79 can adjust the position of the specific portion 953 relative to the second surface S2 of the plate-shaped member 10 by adjusting the degree to which the adjustment member 59 is fastened to the fastening hole 25, with the sealing member 60 positioned in the recess 953A. When the specific portion 953 is positioned close to the second surface S2, the sealing member 60 can fill and seal the gap between the specific portion 953 and the contact portion S2A on the second surface S2. This suppresses the intrusion of reactive gas into the interior of the housing member 950, thereby suppressing corrosion of the bonding layer 30 located in the inner region of the housing member 950.

[0103] As shown in Figure 11, the bottom plate portion 951 of the containment member 950 has an opening 958 that penetrates the bottom plate portion 951 in the thickness direction. The opening 958 is formed to allow gas to pass through. A fitting (not shown) is connected to the opening 958, and piping (not shown) is connected to the fitting. When the retaining device 79 is placed in a reactive gas atmosphere, depending on the pressure of the reactive gas, the sealing member 60 may not be able to completely seal the gap between the specific portion 953 and the contact portion S2A, and there is a slight possibility that the reactive gas may enter the inner region of the containment member 950.

[0104] An exhaust device (not shown) capable of exhausting gas can be connected to the aforementioned piping. In this case, the exhaust device can exhaust the gas inside the housing member 950 to the outside of the housing member 950 through the opening 958 via the joint and piping. That is, the opening 958 is formed in the housing member 950 to exhaust gas from the inside to the outside of the housing member 950. By exhausting reactive gas that has entered the inner region of the housing member 950 to the outside of the housing member 950 through the opening 958, corrosion of the bonding layer 30 arranged in the inner region of the housing member 950 is suppressed. In addition, by exhausting the gas inside the housing member 950 to the outside of the housing member 950 through the opening 958 using the exhaust device, the air pressure in the inner region of the housing member 950 can be lowered. In this case, the specific part 953 is positioned even closer to the second surface S2 of the plate-shaped member 10, and the adhesion between the sealing member 60 and the contact portion S2A on the second surface S2 is improved. This suppresses corrosion of the bonding layer 30.

[0105] Furthermore, an air supply device (not shown) capable of supplying gas can be connected to the aforementioned piping. In this case, the air supply device can supply an inert gas such as helium into the interior of the housing member 950 from the opening 958 via the piping and fittings. That is, the opening 958 is formed in the housing member 950 to supply gas from the outside to the inside of the housing member 950. This reduces the concentration of reactive gas that has entered the inner region of the housing member 950, thereby suppressing corrosion of the bonding layer 30 located in the inner region of the housing member 950. In addition, by supplying inert gas into the interior of the housing member 950 from the opening 958, the reactive gas that has entered the interior of the housing member 950 can be exhausted by pushing it out toward the outside of the housing member 950 through the small gap between the sealing member 60 and the contact portion S2A of the second surface S2. This suppresses corrosion of the bonding layer 30.

[0106] Furthermore, the opening 958 is not limited to being formed in the bottom plate portion 951 of the housing member 950, but may also be formed in, for example, the side wall portion 952. In addition, multiple openings 958 may be formed in the housing member 950.

[0107] As described above, in the holding device 79, the housing member 950 has an opening 958 formed therein for supplying or exhausting gas into the interior of the housing member 950.

[0108] In this case, the holding device 79 can exhaust the reactive gas that has entered the interior of the containment member 950 through the opening 958. Furthermore, by exhausting the gas inside the containment member 950 through the opening, the holding device 79 can lower the air pressure inside the containment member 950, thereby improving the adhesion between the specific part 953 and the plate-shaped member 10, or between the sealing member 60 and the plate-shaped member 10. In addition, the holding device 79 can reduce the concentration of the reactive gas that has entered the interior of the containment member 950 by supplying an inert gas, such as helium, to the interior of the containment member 950 through the opening 958, thereby suppressing corrosion of the bonding layer 30. Furthermore, by supplying an inert gas to the interior of the containment member 950 through the opening 958, the holding device 79 can exhaust the reactive gas that has entered the interior of the containment member 950 by pushing it out of the containment member 950 through the small gap between the sealing member 60 and the plate-shaped member 10 in the specific part 953.

[0109] <Details of the 11th Embodiment of this Disclosure> Next, a holding device 80 according to the 11th embodiment of this disclosure will be described with reference to Figure 12. In the 11th embodiment, the same reference numerals are used for the same parts as in the first and fourth embodiments, and redundant explanations of the structure, operation, and effect are omitted.

[0110] As shown in Figure 12, the holding device 80 comprises a plate-shaped member 10, a base member 20, a joining layer 30, and a housing member 1050. The housing member 1050 comprises a bottom plate portion 1051 and a side wall portion 1052 that rises from the outer peripheral end of the bottom plate portion 1051 toward the plate-shaped member 10. A through hole 1055 is formed in the bottom plate portion 1051 for inserting an adjustment member 59. This through hole 1055 is formed in the same shape as the through hole 55 of the first embodiment. In addition, an opening 1058 similar to the opening 958 of the tenth embodiment is formed in the bottom plate portion 1051. The opening 1058 is formed for supplying or exhausting gas to the inside of the housing member 1050. Similar to the tenth embodiment, a fitting (not shown) is connected to the opening 1058, and piping (not shown) is connected to the fitting. An exhaust device or an air supply device (not shown) can be connected to this piping.

[0111] The upper end surface of the side wall portion 1052, which is positioned close to the second surface S2 of the plate-shaped member 10, is designated as the specific portion 1053. The specific portion 1053 has a recess 1053A similar to the recess 353A formed in the specific portion 1053 in the fourth embodiment. The recess 1053A is formed to accommodate the sealing member 60 inside it.

[0112] A user of the retaining device 80 can adjust the position of the specific portion 1053 relative to the second surface S2 of the plate-shaped member 10 by adjusting the degree to which the adjustment member 59 is fastened to the fastening hole 25, with the sealing member 60 positioned in the recess 1053A. When the specific portion 1053 is positioned close to the second surface S2, the sealing member 60 can fill and seal the gap between the specific portion 1053 and the contact portion S2A on the second surface S2. This suppresses the intrusion of reactive gas into the interior of the housing member 1050, thereby suppressing corrosion of the bonding layer 30 located in the inner region of the housing member 1050.

[0113] The side wall portion 1052 further has openings 1059 formed therein. The openings 1059 are formed as holes that penetrate the side wall portion 1052 in the thickness direction. The openings 1059 are formed in an appropriate number in the side wall portion 1052.

[0114] When the holding device 80 is placed in a reactive gas atmosphere, depending on the pressure of the reactive gas, the sealing member 60 may not be able to completely seal the gap between the specific part 1053 and the contact part S2A, and there is a slight possibility that the reactive gas may enter the inner region of the containment member 950. In such cases, the user can supply an inert gas or the like through the opening 1058 to expel the reactive gas that has slightly entered the interior of the containment member 1050 by pushing it out through the opening 1059 without letting it accumulate near the bonding layer 30.

[0115] Alternatively, the user can exhaust the reactive gas that has entered the containment member 1050 from the opening 1058, thereby preventing it from accumulating near the bonding layer 30 and allowing it to be quickly discharged to the outside through the opening 1058. In this case, the formation of the opening 1059 creates a gas flow from the opening 1059 towards the opening 1058. This makes it easier to quickly discharge the reactive gas that has entered the containment member 1050 to the outside of the containment member 1050 through the opening 1058 without it accumulating near the bonding layer 30.

[0116] In order for the opening 1059 to perform such a function, it is preferable that the opening 1059 be formed in the side wall portion 1052 at a position between the specific portion 1053 and the bottom plate portion 1051, and at a position closer to the specific portion 1053 than to the bottom plate portion 1051. In this case, even if a small amount of reactive gas enters the interior of the housing member 1050, the reactive gas moving inside the housing member 105 will have less contact with the bonding layer 30, thereby suppressing corrosion of the bonding layer 30.

[0117] In the tenth and eleventh embodiments, examples were shown in which the housing members 950 and 1050 have openings 958 and 1058 formed therein for supplying or exhausting gas into or from the inside of the housing members 950 and 1050. Openings corresponding to openings 958 and 1058 may also be formed in the housing members 50, 150, 250, 350, 450, 550, 650, 750, and 850 of the first to ninth embodiments. In this case, the opening 1059 shown in the eleventh embodiment may also be formed in the housing members 50, 150, 250, 350, 450, 550, 650, 750, and 850 of the first to ninth embodiments.

[0118] <Other Embodiments> This disclosure is not limited to the embodiments described above and in the drawings. For example, the following embodiments are also included in the technical scope of this disclosure, and various modifications can be made without departing from the spirit of the disclosure.

[0119] (1) The second surface S2 of the plate-shaped members 10, 510, 810 and the third surface S3 of the base members 20, 620 are joined by brazing or soldering, and the joining layer 30, 830 may be composed of a layer of metal made of brazing material or solder.

[0120] (2) The second surface S2 of the plate-shaped members 10, 510, 810 and the third surface S3 of the base members 20, 820 may be joined by screw fastening. In this case, a portion of the threaded part of the screw is positioned between the second surface S2 of the plate-shaped members 10, 510, 810 and the third surface S3 of the base members 20, 820. The portion of the screw positioned between the second surface S2 and the third surface S3 corresponds to the joining layer 30, 830. When the second surface S2 of the plate-shaped members 10, 510, 810 and the third surface S3 of the base members 20, 820 are joined by screw fastening, it is preferable that a through hole is formed in either the plate-shaped member 10, 510, 810 or the base member 20, 820 in the thickness direction, and a screw hole for fastening a screw is formed in the other of the plate-shaped member 10, 510, 810 or the base member 20, 820, and a screw is fastened to that screw hole. In this case, a sealing member such as an O-ring may be provided around the through hole to suppress the intrusion of reactive gas into the through hole and screw hole.

[0121] (3) The adjusting member 59 may be a screw, bolt, clamp, or the like, as long as it can adjust the positional relationship between the specific parts 53, 253, 353, 453, 553, 653, 753, 853, 953, 1053 or the seal band part 153 and the plate-shaped members 10, 510, 810.

[0122] (4) The first surface S1 of the plate-shaped members 10, 510, 810 may be provided with a plurality of protrusions for supporting the wafer W.

[0123] (5) The outer peripheral end of the first surface S1 of the plate-shaped members 10, 510, 810 may be provided with annular protrusions for supporting the wafer W.

[0124] (6) The plate-shaped members 10, 510, and 810 may be provided with electrodes other than the chuck electrodes 40, 540, and 840, such as electrodes for heaters. Also, the plate-shaped members 10, 510, and 810 do not need to contain electrodes such as the chuck electrodes 40, 540, and 840 inside them. [Explanation of Symbols]

[0125] 1, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80: Holding device 10, 510, 810: Plate-shaped member 20, 820: Base member 25: Fastening hole 30, 830: Joining layer 50, 150, 250, 350, 450, 550, 650, 750, 850, 950, 1050: Housing member 51, 351, 551, 651, 751, 851, 951, 1051: Bottom plate section 52, 152, 252, 352, 452, 552, 652, 752, 852, 952, 1052: Side wall section 53,253,353,453,553,653,753,853,953,1053:Specific part 153:Seal band part 353A,453A,453B,553A,653A,753A,953A,1053A:Recess 55,355,955,1055:Through hole 59:Adjustment member 60:Sealing member 60 958,1058:Opening S1:First surface S2:Second surface S3:Third surface S4:Fourth surface W: wafer

Claims

1. A plate-shaped member having a first surface and a second surface located on the opposite side of the first surface, A base member having a third surface disposed opposite to the second surface, A bonding layer is disposed between the second surface and the third surface and joins the second surface and the third surface, A housing member comprising a bottom plate portion, a side wall portion having a specific portion that rises from the outer peripheral end of the bottom plate portion toward the plate-like member and is positioned close to or in contact with the plate-like member, and which houses the joining layer and the base member on its inside, An adjustment member that can adjust the positional relationship between the specified part and the plate-shaped member, A holding device equipped with the following features.

2. The specified portion is a part located at the upper end of the side wall portion that contacts the second surface, The holding device according to claim 1, wherein the surface roughness (Ra) of the specified part is 0.5 μm or less.

3. The specified portion is a seal band portion formed at the upper end of the side wall portion, protruding toward the second surface and in contact with the second surface. The holding device according to claim 2, wherein the surface roughness (Ra) of the portion of the seal band that contacts the second surface is 0.2 μm or less.

4. The holding device according to claim 1, wherein a layer of plasma-resistant material is formed on the specified portion.

5. The holding device according to claim 1, wherein a sealing member is provided between the specified portion and the plate-shaped member for sealing the gap between the specified portion and the plate-shaped member.

6. The holding device according to claim 5, wherein a plurality of the sealing members are provided.

7. The holding device according to claim 1, wherein the housing member has an opening formed therein for supplying or exhausting gas to the inside of the housing member.

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