solid phase bonding device
The solid-phase bonding apparatus uses fluid-adjustable mechanisms to ensure uniform pressure and miniaturization, addressing the size and force imbalance issues in existing technologies.
Patent Information
- Application Number
- JP2024226420
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2026-07-03
Smart Images

Figure 2026111194000001_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to a solid-phase bonding device.
Background Art
[0002] Japanese Patent No. 7242112 (Patent Document 1) discloses a solid-phase point bonding device including a pressurizing mechanism including a pressing portion and an energizing mechanism including a pair of electrodes. The solid-phase point bonding device disclosed in Japanese Patent No. 7242112 (Patent Document 1) is configured to energize two metal plates formed of a first workpiece and a second workpiece by a pair of electrodes to heat each metal plate, and press the two metal plates in a direction orthogonal to the metal plates by the pressing portion. A bonding method of bonding in a solid-phase state in a low-temperature range without melting the metal as disclosed in Japanese Patent No. 7242112 (Patent Document 1) is hereinafter also referred to as solid-phase bonding.
[0003] The pressing portion is composed of, for example, a pair of pressing members. In solid-phase bonding, after forming protrusions by pressing the first workpiece and the second workpiece with a pair of pressing members, while supplying power to the pair of electrodes, the pair of pressing members are further pressed to bond the first workpiece and the second workpiece in a solid-phase state. Further, Japanese Unexamined Patent Application Publication No. 2008-307595 (Patent Document 2) discloses a method for positioning a spot welding robot that moves an electrode using a servo motor.
Prior Art Documents
Patent Documents
[0004]
Patent Document 1
Patent Document 2
Summary of the Invention
Problems to be Solved by the Invention
[0005] Solid-phase joining requires a higher pressing force compared to resistance spot welding, as disclosed in Japanese Patent Publication No. 2008-307595 (Patent Document 2). Therefore, solid-phase joining equipment tends to be larger and heavier overall in order to increase the pressing force. Furthermore, in solid-phase joining equipment, if the positioning between the pair of pressing members and the first and second workpieces is misaligned, the pressing force on one workpiece may be significantly greater than the pressing force on the other workpiece during pressing.
[0006] The purpose of this disclosure is to miniaturize the solid-phase bonding apparatus while ensuring uniform pressure on each workpiece. [Means for solving the problem]
[0007] This disclosure relates to a solid-phase bonding apparatus for joining a first workpiece and a second workpiece that are conductive and overlap in the thickness direction in a solid-phase state. The solid-phase bonding apparatus comprises a pair of pressurizing members that press the first workpiece and the second workpiece from both sides in the thickness direction, a pair of electrodes arranged adjacent to the pair of pressurizing members, a pair of adjustment mechanisms that adjust the amount of pressure applied by the pair of pressurizing members by the inflow and outflow of fluid, a pressure device that inflows and outsweats fluid to the pair of adjustment mechanisms in common, a pressure gauge for measuring the pressure of the fluid, and a control device. The control device controls the pressure device based on the measurement value of the pressure gauge to cause fluid to inflow and out of the pair of adjustment mechanisms. [Effects of the Invention]
[0008] According to this disclosure, based on the measurement value of the pressure gauge, the pressure device is controlled and fluid is supplied to a pair of adjustment mechanisms that adjust the amount of indentation of a pair of pressurizing members by the inflow and outflow of fluid. By using a pair of adjustment mechanisms in this way, the solid-phase bonding device can be miniaturized and the pressurizing force on each workpiece can be made uniform. [Brief explanation of the drawing]
[0009] [Figure 1] This diagram schematically shows the solid-phase bonding system according to Embodiment 1. [Figure 2]This diagram schematically shows a solid-phase bonding apparatus according to Embodiment 1. [Figure 3] This diagram shows the structure of the second tool. [Figure 4] This is a diagram illustrating the joining process. [Figure 5] This diagram illustrates the operating state of various devices over time. [Figure 6] This is a diagram illustrating the operation of the first and second tools. [Figure 7] This figure schematically shows a solid-phase bonding apparatus according to Embodiment 2. [Modes for carrying out the invention]
[0010] The embodiments of this disclosure will be described in detail below with reference to the drawings. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and their descriptions will not be repeated.
[0011] [Embodiment 1] Figure 1 is a schematic diagram showing a solid-phase bonding system 100 according to Embodiment 1. The solid-phase bonding system 100 comprises a robot 200 and a solid-phase bonding apparatus 10. Note that the robot 200 is depicted smaller than its actual size relative to the solid-phase bonding apparatus 10.
[0012] The robot 200 includes a robot arm 210. The robot arm 210 is a multi-jointed arm, for example, a 6-axis multi-jointed arm. The robot arm 210 is controlled by the control device 30 to perform a set motion. However, the robot arm 210 may be controlled by another control device that controls the robot 200, rather than the control device 30.
[0013] The solid-phase bonding device 10 includes a pressure device 13, a C gun 14, a first adjustment mechanism 15, a first tool 16, a second adjustment mechanism 17, a second tool 18, a control device 30, and a power supply device 35. The solid-phase bonding device 10 is a device that forms a softened region at the interface of a plurality of workpieces W10, W20 by applying electricity to the plurality of workpieces W10, W20 that are overlapped with each other, and joins the plurality of workpieces W10, W20 in a solid state without melting them by plastically deforming the softened region. The solid-phase bonding device 10 is attached to the tip of a robot arm 210.
[0014] The plurality of workpieces W10, W20 include a first workpiece W10 and a second workpiece W20. Each workpiece W10, W20 is made of a metal such as iron or aluminum. Each workpiece W10, W20 is formed, for example, in a flat plate shape. Note that each workpiece W10, W20 may be made of something other than metal, as long as it has conductivity and is a material suitable for solid-phase bonding.
[0015] The pressure device 13 is disposed outside the robot arm 210 and includes a flow path (not shown) through which oil, which is a fluid for pressure adjustment, flows, and a pump (not shown) for allowing the oil to flow in and out. The driving of the pump is controlled by the control device 30. The pressure of the oil is detected by a pressure gauge 40.
[0016] The C gun 14 is movable to a position where it sandwiches the first workpiece W10 and the second workpiece W20 fixed to the jig 60 in the thickness direction. The first adjustment mechanism 15 is disposed at one end of the C gun 14. The second adjustment mechanism 17 is disposed at the other end of the C gun 14. The first tool 16 is fixed to the first adjustment mechanism 15. The second tool 18 is fixed to the second adjustment mechanism 17.
[0017] The control device 30 includes an arithmetic device 31, a memory 32, a storage device 33, and an input / output interface 34. These components are connected via a bus.
[0018] The arithmetic unit 31 is a computing entity (computer) that performs predetermined processing. The arithmetic unit 31 is composed of a processor such as a CPU (Central Processing Unit), MPU (Micro-Processing Unit), TPU (Tensor Processing Unit), or GPU (Graphics Processing Unit). While a processor, as an example of the arithmetic unit 31, has the function of performing predetermined processing by executing a predetermined program, some or all of these functions may be implemented using dedicated hardware circuits such as an ASIC (Application Specific Integrated Circuit) or FPGA (Field-Programmable Gate Array). The term "processor" is not limited to processors in the narrow sense that execute processing using a stored-program method, such as a CPU, MPU, TPU, or GPU, but may also include hardwired circuits such as ASICs or FPGAs. Furthermore, the arithmetic unit 31 is not limited to von Neumann type computers such as CPUs or GPUs, but may also consist of non-von Neumann type computers such as quantum computers or optical computers. The arithmetic unit 31 described above can also be read as a processing circuitry that performs predetermined processing. The arithmetic unit 31 may consist of one chip or multiple chips. Furthermore, the processor and associated processing circuits may consist of multiple computers interconnected by wired or wireless connections via a local area network or wireless network. The processor and associated processing circuits may also consist of a cloud computer that remotely performs calculations based on input data and outputs the calculation results to other devices located at a distance.
[0019] Memory 32 includes a storage area (e.g., a working area) for storing program codes or a work memory when the arithmetic unit 31 executes various programs. Examples of the memory 32 include volatile memories such as DRAM and SRAM, or non-volatile memories such as ROM and flash memory.
[0020] The storage device 33 stores various programs or various data executed by the arithmetic unit 31. For example, the storage device 33 stores a control program 330 for controlling various devices executed by the arithmetic unit 31. The storage device 33 may be one or more non-transitory computer readable media, or may be one or more computer readable storage media. Examples of the storage device 33 include HDD (Hard Disk Drive) and SSD (Solid State Drive).
[0021] Values acquired by an acquisition unit such as the pressure gauge 40 are input to the input / output interface 34. The power supply device 35 supplies voltage and current to the first tool 16 and the second tool 18. The control device 30 moves the robot arm 210 to the joining position of the first workpiece W10 and the second workpiece W20 by controlling a motor (not shown).
[0022] Next, the solid-phase bonding device 10 according to Embodiment 1 will be specifically described. FIG. 2 is a diagram schematically showing the solid-phase bonding device 10 according to Embodiment 1. In FIG. 2, the control device 30 and the power supply device 35 are not shown. When the X-axis, Y-axis, and Z-axis are defined as shown in FIG. 2, the X-axis direction is the front-rear direction of the solid-phase bonding device 10, the Y-axis direction is the up-down direction of the solid-phase bonding device 10, and the Z-axis direction is the left-right direction of the solid-phase bonding device 10.
[0023] As shown in Figure 2, the solid-state bonding apparatus 10 comprises a pressure device 13, a C-gun 14, a first adjustment mechanism 15, a first tool 16, a second adjustment mechanism 17, and a second tool 18. The pressure device 13 changes the pressure by supplying and circulating oil to and from a pair of adjustment mechanisms, the first adjustment mechanism 15 and the second adjustment mechanism 17. The flow paths for supplying and circulating oil from the pressure device 13 to the first adjustment mechanism 15 and the second adjustment mechanism 17 are referred to as the first flow path 131 and the second flow path 132.
[0024] The first adjustment mechanism 15 includes a hydraulic cylinder 151 that uses oil as the fluid, a piston 152 that divides the inside of the cylinder 151 into a first space 151a and a second space 151b, and a rod 153 that is connected to the piston 152 and reciprocates with a portion of it protruding from the cylinder 151. The first adjustment mechanism 15 is connected to the C gun 14 via an extension member 141 fixed to one end of the C gun 14.
[0025] The second adjustment mechanism 17 includes a hydraulic cylinder 171 that uses oil as the fluid, a piston 172 that divides the inside of the cylinder 171 into a first space 171a and a second space 171b, and a rod 173 that is connected to the piston 172 and reciprocates with a portion of it protruding from the cylinder 171. The second adjustment mechanism 17 is directly fixed to the other end of the C gun 14. The second adjustment mechanism 17 may also be connected to the C gun 14 via an extension member 141.
[0026] The first tool 16 includes a base portion 161, a first pressurizing member 162, a cover member 163, a first electrode 164, and a spring 165. The base portion 161, which is the end of the first pressurizing member 162, is fixed to the tip of the rod 153. The first pressurizing member 162 is integrally formed with the base portion 161 and presses the first workpiece W10 so that the first workpiece W10 undergoes plastic deformation. The cover member 163 is connected to the base portion 161 and is positioned to cover the first pressurizing member 162, the first electrode 164, and the spring 165. The "pressurizing member" may also be referred to as a "pressurizing shaft" or a "pressing member."
[0027] The first electrode 164 is positioned adjacent to the first pressurizing member 162 and is fixed to the base portion 161 via a spring 165. The biasing force of the spring 165 acts on the first workpiece W10 via the first electrode 164. The first flow path 131 for inflowing and outflowing oil from the pressure device 13 is divided midway and includes a first pressurizing flow path 131a for inflowing and outflowing oil into the first space 151a of the first adjustment mechanism 15, and a second pressurizing flow path 131b for inflowing and outflowing oil into the first space 171a of the second adjustment mechanism 17.
[0028] The second tool 18 includes a base portion 181, a second pressurizing member 182, a cover member 183, a second electrode 184, and a spring 185. The base portion 181, which is the end of the second pressurizing member 182, is fixed to the tip of the rod 173. The second pressurizing member 182 is integrally formed with the base portion 181 and presses the second workpiece W20 so that the second workpiece W20 undergoes plastic deformation. The cover member 183 is connected to the base portion 181 and is positioned to cover the second pressurizing member 182, the second electrode 184, and the spring 185.
[0029] The second electrode 184 is positioned adjacent to the second pressurizing member 182 and is fixed to the base portion 181 via a spring 185. The biasing force of the spring 185 acts on the second workpiece W20 via the second electrode 184. The second flow path 132 for inflowing and outflowing oil from the pressure device 13 is divided midway and includes a first depressurizing flow path 132a for inflowing and outflowing oil into the second space 151b of the first adjustment mechanism 15, and a second depressurizing flow path 132b for inflowing and outflowing oil into the second space 171b of the second adjustment mechanism 17.
[0030] The pair of pressurizing members, the first pressurizing member 162 and the second pressurizing member 182, are capable of applying pressure to the first workpiece W10 and the second workpiece W20 from both sides in the thickness direction when the plate-shaped workpieces are stacked. The first pressurizing member 162 and the second pressurizing member 182 are made of, for example, tungsten carbide. In this embodiment, the first pressurizing member 162 and the second pressurizing member 182 are formed in a cylindrical shape. The central axis of the first pressurizing member 162 is located on the extension of the central axis of the second pressurizing member 182, and the pressing surface of the first pressurizing member 162 is positioned to face the pressing surface of the second pressurizing member 182.
[0031] The pair of adjustment mechanisms, the first adjustment mechanism 15 and the second adjustment mechanism 17, adjust the amount of pressure exerted by the pair of pressurizing members, the first pressurizing member 162 and the second pressurizing member 182, by inflowing and outflowing oil, which is a fluid. The control device 30 controls the pressure device 13 based on the measurement value of the pressure gauge 40 to cause oil to flow in and out of the first adjustment mechanism 15 and the second adjustment mechanism 17. As a result, the first pressurizing member 162 and the second pressurizing member 182 move in a direction that presses the first workpiece W10 and the second workpiece W20 from both sides in the thickness direction, or in a direction that moves them away from each other.
[0032] Specifically, when the control device 30 increases the pressure applied to the first workpiece W10 and the second workpiece W20, it introduces oil from the pressure device 13, which is a common pressure source, through the first passage 131. The first pressurizing member 162 is pushed into the first workpiece W10 by the inflow of oil into the first space 151a of the first adjustment mechanism 15 via the first pressurizing passage 131a. The second pressurizing member 182 is pushed into the second workpiece W20 by the inflow of oil into the first space 171a of the second adjustment mechanism 17 via the second pressurizing passage 131b. On the other hand, when the first pressurizing member 162 is pushed into the first workpiece W10, the oil in the second space 151b flows out to the pressure device 13 via the first depressurizing passage 132a. Also, when the second pressurizing member 182 is pushed into the second workpiece W20, the oil in the second space 171b flows out to the pressure device 13 via the second depressurizing passage 132b.
[0033] Thus, the first adjustment mechanism 15 can adjust the hydraulic pressure by alternately flowing oil in and out of the first space 151a and the second space 151b, and the second adjustment mechanism 17 can adjust the hydraulic pressure by alternately flowing oil in and out of the first space 171a and the second space 171b. This type of hydraulic pressure control by the inflow and outflow of fluid into two spaces is called a double-acting type. By using a pair of double-acting adjustment mechanisms 15 and 17, the solid-state bonding device 10 can be made smaller compared to cases where a large motor is used, and the pressurizing force on each workpiece W10 and W20 can be made uniform above and below. Alternatively, a single-acting type can be used, in which fluid is inflowed and out using only one space. In this case, an elastic member such as a spring can be incorporated into the space opposite to the side through which the fluid is inflowed and out.
[0034] When the control device 30 reduces the pressure on the first workpiece W10 and the second workpiece W20, it introduces oil from the pressure device 13, which is a common pressure source, through the second flow path 132. The first pressurizing member 162 moves away from the first workpiece W10 as oil flows into the second space 151b of the first adjustment mechanism 15 via the first pressure reduction flow path 132a. The second pressurizing member 182 moves away from the second workpiece W20 as oil flows into the second space 171b of the second adjustment mechanism 17 via the second pressure reduction flow path 132b. On the other hand, as the first pressurizing member 162 moves away from the first workpiece W10, the oil in the first space 151a flows out to the pressure device 13 via the first pressurizing flow path 131a. Also, as the second pressurizing member 182 moves away from the second workpiece W20, the oil in the first space 171a flows out to the pressure device 13 via the second pressure reduction flow path 132b.
[0035] The pair of electrodes, the first electrode 164 and the second electrode 184, can energize the first workpiece W10 and the second workpiece W20 while in contact with them. When a voltage is applied to the first electrode 164 and the second electrode 184 while they are in contact with the first workpiece W10 and the second workpiece W20, power is supplied to the first electrode 164, the first workpiece W10, the second workpiece W20, and the second electrode 184.
[0036] The first electrode 164 is capable of contacting the portion of the first workpiece W10 that is pressurized by the first pressurizing member 162. In this embodiment, the first electrode 164 is formed in a cylindrical shape that surrounds the first pressurizing member 162. A gap is provided between the inner circumferential surface of the first electrode 164 and the outer circumferential surface of the first pressurizing member 162. The first electrode 164 is made of, for example, copper. The first electrode 164 has an annular contact surface that contacts the first workpiece W10. However, the shape of the contact surface is not limited to an annular shape.
[0037] The second electrode 184 has the same configuration as the first electrode 164. The second electrode 184 is capable of contacting the portion of the second workpiece W20 surrounding the portion that is pressurized by the second pressurizing member 182. The second electrode 184 is positioned such that its central axis lies on the extension of the central axis of the first electrode 164, and its contact surface faces the contact surface of the first electrode 164.
[0038] Here, we will specifically describe the structure of the pair of tools, the first tool 16 and the second tool 18. Figure 3 shows the structure of the second tool 18. Figure 3 describes the second tool 18 of the pair of tools. The second tool 18 is positioned vertically symmetrically with the first tool 16 and has the same structure as the first tool 16.
[0039] The second tool 18 is integrally formed with a base portion 181 and a second pressurizing member 182 extending upward from the base portion 181. The second electrode 184, positioned around the second pressurizing member 182, is supported by a plate 186. A spring 185 is positioned between the plate 186 and the base portion 181. The cover member 183 is connected to the base portion 181 and is positioned to cover the second pressurizing member 182, the second electrode 184, and the spring 185.
[0040] A gap d is provided between the upper end of the second pressurizing member 182 and the upper end of the second electrode 184. When the second tool 18 is brought close to the second workpiece W20, the upper end of the second electrode 184 contacts the second workpiece W20, and then slides along the inner circumference of the cover member 183. The second pressurizing member 182 moves the distance of the gap d so that the upper end of the second electrode 184 contacts the second workpiece W20, and then the upper end of the second pressurizing member 182 contacts the second workpiece W20.
[0041] Next, the joining process will be described. Figure 4 is a diagram illustrating the joining process. The control device 30 executes the joining process in the order shown in Figures 4(A) to (D). As shown in Figure 4(A), the control device 30 moves a pair of pressurizing members 162 and 182 toward each workpiece W10 and W20. At this time, each workpiece W10 and W20 is held between a pair of electrodes 164 and 184. A contact load of, for example, 1 kN is acting on each workpiece W10 and W20 as a biasing force from a pair of springs 165 and 185 (not shown).
[0042] The pair of electrodes 164 and 184 are biased to protrude approximately 1 mm (d) from the pair of pressurizing members 162 and 182 toward each workpiece W10 and W20. The pair of pressurizing members 162 and 182 and the pair of electrodes 164 and 184 are a mechanism driven as a whole by a pair of adjustment mechanisms 15 and 17 (a pressure device 13 that commonly supplies oil to and from the pair of adjustment mechanisms 15 and 17).
[0043] Next, as shown in Figure 4(B), the control device 30 moves the pair of pressurizing members 162 and 182 toward each workpiece W10 and W20, and applies a load to each workpiece W10 and W20 to form protrusions. Each workpiece W10 and W20 forms protrusions W11 and W21 as a result of the load applied to form the protrusions.
[0044] Next, as shown in Figure 4(C), the control device 30 applies current to each of the protrusions W11 and W21. The control device 30 applies current to each of the protrusions W11 and W21 formed on the contact portion of each workpiece W10 and W20 to soften the contact portion of each protrusion W11 and W21. Next, as shown in Figure 4(D), the control device 30 applies current to each of the protrusions W11 and W21 while pushing the pair of pressurizing members 162 and 182 to the joining position, thereby joining the workpieces W10 and W20 at the contact portion.
[0045] Next, the operating states of the various devices over time will be explained using Figures 5 and 6. Figure 5 is a diagram illustrating the operating states of the various devices over time. Figure 6 is a diagram illustrating the operation of the first tool 16 and the second tool 18. In Figure 6, only the first pressurizing member 162 and the first electrode 164 located at the tip of the first tool 16 are shown, and only the second pressurizing member 182 and the second electrode 184 located at the tip of the second tool 18 are shown. Note that in Figure 6, the projections W11 and W21 formed on each workpiece W10 and W20 shown in Figure 4 are omitted.
[0046] Figure 5(A) is a graph showing the relationship between the distance from the center position of each workpiece W10, W20 to the first tool 16 and the second tool 18 and time. Figure 5(B) is a graph showing the relationship between the applied pressure to each workpiece W10, W20 and time. Figure 5(C) is a graph showing the relationship between the forward rotation of the pump, the reverse rotation of the pump, and the energization of the pair of electrodes 164, 184 and time.
[0047] The first tool 16 and the second tool 18 operate in the order shown in Figures 6(A) to 6(G). Figure 6 illustrates the operation of the first tool 16 and the second tool 18 corresponding to each time point t1 to t7 shown in Figure 5. At time t1, the first tool 16 and the second tool 18 are located at a distance from the center position of each workpiece W10, W20. For example, suppose that a positional shift occurs due to some influence, and the second tool 18 is located further from the center position of workpieces W10, W20 than the first tool 16.
[0048] From time t1 to time t2, as shown in Figures 5 and 6(A), the first tool 16 and the second tool 18 move toward the center of each workpiece W10 and W20. From time t1 to time t2, the pressure device 13 is controlled by the control device 30 to rotate the pump in the forward direction. As a result, oil flows into the first space 151a of the first adjustment mechanism 15 and the first space 171a of the second adjustment mechanism 17.
[0049] Next, from time t2 to time t3, as shown in Figures 5 and 6(B), the first electrode 164 of the first tool 16 comes into contact with the first workpiece W10. Meanwhile, the second tool 18 continues to move toward the second workpiece W20. Next, as shown in Figures 5 and 6(C), from time t3 to time t4, the pair of pressurizing members 162 and 182 pressurize the workpieces W10 and W20. Based on the measurement value from the pressure gauge 40, the control device 30 controls the pressure device 13 and flows oil into the pair of adjustment mechanisms 15 and 17 to control the pressurizing force so that it becomes an appropriate value (pressurizing force F1) for joining.
[0050] From time t4 to time t5, as shown in Figures 5 and 6(D), a pair of pressurizing members 162 and 182 pressurize each workpiece W10 and W20 with a pressure F1. When a predetermined set time T has elapsed from time t4, a current X flows through the first electrode 164, the first workpiece W10, the second workpiece W20, and the second electrode 184. The current X flows through protrusions formed on the pressing portions of the pair of pressurizing members 162 and 182 (not shown), causing the pressing portions to soften. As the pressing portions soften, the pressurizing force F1 begins to decrease before time t5. Alternatively, the set time T may be omitted, and the current X may flow when the pressurizing force reaches F1.
[0051] From time t5 to time t6, as shown in Figures 5 and 6(E), the first tool 16 and the second tool 18 move away from the center positions of the respective workpieces W10 and W20. At time t5, the energization to the pair of electrodes 164 and 184 is stopped. Also at time t5, the pressure device 13 is controlled by the control device 30 to reverse the drive of the pump. As a result, oil flows into the second space 151b of the first adjustment mechanism 15 and the second space 171b of the second adjustment mechanism 17.
[0052] Next, from time t6 to time t7, as shown in Figures 5 and 6(F), the movement of the first tool 16 stops at time t6. Meanwhile, the second tool 18 continues to move away from the second workpiece W20. Then, as shown in Figures 5 and 6(G), at time t7, the second tool 18 also stops moving, and the control device 30 stops driving the pump of the pressure device 13. As a result, the first tool 16 and the second tool 18 return to their initial positions.
[0053] In the solid-phase bonding apparatus 10 of Embodiment 1, the control device 30 controls the pressure device 13 based on the measurement value of the pressure gauge 40, causing oil, which is a fluid, to flow in and out of a pair of adjustment mechanisms 15 and 17. This eliminates the need to use a large device when pressing the pair of pressurizing members 162 and 182 onto the workpieces W10 and W20, allowing the solid-phase bonding apparatus 10 to be miniaturized. Furthermore, since the amount of oil flowing into the pair of adjustment mechanisms 15 and 17 is automatically adjusted, the pressurizing force applied to each workpiece W10 and W20 can be made uniform.
[0054] [Embodiment 2] Figure 7 is a schematic diagram showing a solid-phase bonding apparatus 10A according to Embodiment 2. In Embodiment 2, compared to the solid-phase bonding apparatus 10 of Embodiment 1, a configuration comprising a servo motor 143 and an expandable / contractable member 142 that expands and contracts when driven by the servo motor 143 will be described. Note that in the solid-phase bonding apparatus 10A shown in Embodiment 2, the same reference numerals are used for the same components as in the solid-phase bonding apparatus 10 of Embodiment 1, and detailed explanations will not be repeated.
[0055] The servo motor 143 rotates the XZ plane shown in Figure 7 in the direction of the arrow, thereby moving the telescopic member 142 in the negative direction of the Y axis (direction of the downward arrow). Conversely, the servo motor 143 rotates the XZ plane in the opposite direction to the arrow, thereby moving the telescopic member 142 in the positive direction of the Y axis (opposite direction to the downward arrow). In this way, the telescopic member 142 is fixed to the adjustment mechanism 15 and extends and retracts when driven by the servo motor 143.
[0056] The case in which the telescopic member 142 is fixed to the adjustment mechanism 15 has been described. However, the telescopic member 142 may also be fixed to the adjustment mechanism 17, or to both the pair of adjustment mechanisms 15 and 17. When the telescopic member is fixed to the adjustment mechanism 17, a corresponding servo motor 143 should be installed. The control device 30 can increase the movement speed of the adjustment mechanism 15 by driving the servo motor 143.
[0057] <Summary> (1) This disclosure relates to a solid-state joining apparatus 10 for joining a first workpiece W10 and a second workpiece W20 that are conductive and overlap in the thickness direction in a solid state. The solid-state joining apparatus 10 comprises a pair of pressurizing members 162, 182 that press the first workpiece W10 and the second workpiece W20 from both sides in the thickness direction, a pair of electrodes 164, 184 respectively arranged adjacent to the pair of pressurizing members 162, 182, a pair of adjustment mechanisms 15, 17 that adjust the amount of pressure applied by the pair of pressurizing members 162, 182 by the inflow and outflow of fluid, a pressure device 13 that inflows and outsweats fluid to the pair of adjustment mechanisms 15, 17 in common, a pressure gauge 40 that measures the pressure of the fluid, and a control device 30. The control device 30 controls the pressure device 13 based on the measurement value of the pressure gauge 40 to cause fluid to inflow and out of the pair of adjustment mechanisms 15, 17.
[0058] According to the solid-phase bonding apparatus 10 of this disclosure, the pressure device 13 is controlled based on the measurement value of the pressure gauge 40, and fluid is injected into a pair of adjustment mechanisms 15 and 17 that adjust the amount of pressure applied to a pair of pressurizing members 162 and 182 by the inflow and outflow of fluid. By using this pair of adjustment mechanisms 15 and 17, the solid-phase bonding apparatus 10 can be miniaturized, and the pressurizing force applied to each workpiece W10 and W20 can be made uniform.
[0059] (2) In the solid-state bonding apparatus 10 of (1), each of the pair of adjustment mechanisms 15 and 17 includes a hydraulic cylinder 151, 171 that uses oil as the fluid, pistons 152, 172 that divide the inside of the cylinders 151, 171 into a first space 151a, 171a and a second space 151b, 171b, and rods 153, 173 that are connected to the pistons 152, 172 and reciprocate with a portion of them protruding from the cylinders 151, 171. The ends of each of the pair of pressurizing members 162, 182 are fixed to the tips of the rods 153, 173.
[0060] According to the solid-phase bonding apparatus 10 of this disclosure, by using a pair of adjustment mechanisms 15, 17 including hydraulic cylinders 151, 171, pistons 152, 172, and rods 153, 173, the solid-phase bonding apparatus 10 can be miniaturized and the pressing force applied to each workpiece W10, W20 can be made uniform.
[0061] (3) In the solid-phase bonding apparatus 10 of (1) or (2), the pair of adjustment mechanisms 15, 17 are of the double-acting type, which can adjust the hydraulic pressure by alternately flowing oil into and out of the first space 151a, 171a and the second space 151b, 171b.
[0062] According to the solid-phase bonding apparatus 10 of this disclosure, by using a pair of double-acting adjustment mechanisms 15, 17 that can adjust the hydraulic pressure by alternately flowing oil into and out of the first spaces 151a, 171a and the second spaces 151b, 171b, the solid-phase bonding apparatus 10 can be made smaller and the pressurizing force applied to each workpiece W10, W20 can be made uniform.
[0063] (4) In any of the solid-phase bonding apparatus 10 described in (1) to (3), the solid-phase bonding apparatus 10 is attached to the tip of the robot arm 210.
[0064] According to the solid-phase bonding apparatus 10 of this disclosure, the solid-phase bonding apparatus 10 can be miniaturized and therefore can be attached to the tip of a robot arm 210.
[0065] (5) A solid-state bonding apparatus 10A according to any of (1) to (3) further includes a servo motor 143 and an extendable member 142 that extends and retracts when driven by the servo motor 143. The extendable member 142 is fixed to at least one of a pair of adjustment mechanisms 15, 17. The control device 30 increases the movement speed of at least one of the pair of adjustment mechanisms 15, 17 by driving the servo motor 143.
[0066] According to the solid-phase bonding apparatus 10A of this disclosure, the movement speed of at least one of the pair of adjustment mechanisms 15 and 17 can be improved by driving the servo motor 143.
[0067] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The scope of this disclosure is indicated by the claims rather than by the description of the embodiments above, and all modifications within the meaning and scope equivalent to the claims are intended to be included. [Explanation of Symbols]
[0068] 10,10A Solid-phase bonding device, 13 Pressure device, 14 C gun, 15 First adjustment mechanism, 16 First tool, 17 Second adjustment mechanism, 18 Second tool, 30 Control device, 31 Calculation unit, 32 Memory, 33 Storage device, 34 Input / output interface, 35 Power supply, 40 Pressure gauge, 60 Fixture, 100 Solid-phase bonding system, 131 First flow path, 131a First pressurized flow path, 131b Second pressurized flow path, 132 Second flow path, 132a First depressurized flow path, 132b Second depressurized flow path, 141 Stretching member, 142 Expandable member, 143 Servo motor, 151,171 Cylinder, 151a,171a First space, 151b,171b Second space, 152,172 Piston, 153,173 Rod, 161,181 Base part, 162 First pressurizing member, 163, 183 Cover member, 164 First electrode, 165, 185 Spring, 182 Second pressurizing member, 184 Second electrode, 200 Robot, 210 Robot arm, 330 Control program, W10 First workpiece, W20 Second workpiece.
Claims
1. A solid-phase bonding apparatus for joining a first workpiece and a second workpiece that are conductive and overlap in the thickness direction in a solid-phase state, A pair of pressurizing members that press the first workpiece and the second workpiece from both sides in the thickness direction, A pair of electrodes are arranged adjacent to the pair of pressurizing members, A pair of adjustment mechanisms for adjusting the amount of pressure applied to the pair of pressurizing members by the inflow and outflow of fluid, A pressure device that commonly supplies the fluid inflow and out to the pair of adjustment mechanisms, A pressure gauge for measuring the pressure of the aforementioned fluid, Equipped with a control device, The control device controls the pressure device based on the measurement value of the pressure gauge, causing the fluid to flow in and out of the pair of adjustment mechanisms, and is a solid-phase bonding device.
2. Each of the pair of adjustment mechanisms is A hydraulic cylinder using oil as the fluid, A piston divides the inside of the cylinder into a first space and a second space, It includes a rod connected to the piston and which reciprocates with a portion of it protruding from the cylinder, The solid-phase bonding apparatus according to claim 1, wherein each end of the pair of pressurizing members is fixed to the tip of the rod.
3. The solid-phase bonding apparatus according to claim 2, wherein the pair of adjustment mechanisms are of a double-acting type capable of adjusting the hydraulic pressure by alternately flowing the oil into and out of the first space and the second space.
4. The solid-phase bonding apparatus according to claim 1 or claim 2, wherein the solid-phase bonding apparatus is attached to the tip of a robot arm.
5. The system further includes a servo motor and an extendable member that extends and retracts by the drive of the servo motor, The telescopic member is fixed to at least one of the pair of adjustment mechanisms, The solid-phase bonding apparatus according to claim 1 or 2, wherein the control device improves the movement speed of at least one of the pair of adjustment mechanisms by driving the servo motor.
Citation Information
Patent Citations
Method for positioning spot welding robot
JP2008307595A
Solid-state spot bonding method and solid-state spot bonding device
JP7242112B2
