Component mounting device

Abstract

The objective is to provide a component mounting device that can operate two transport lanes simultaneously, even when transporting large circuit boards. [Solution] The component loading device has two transport lanes 21, each consisting of a fixed conveyor 22 and a movable conveyor 23 whose distance from the fixed conveyor 22 can be changed. The component loading device has three lifting bodies 51 that are arranged in the Y direction in the area below the substrate transport section 12 and are able to move up and down, and a plurality of support members 36 provided on the fixed conveyor 22 and movable conveyor 23 of each of the two transport lanes 21, which are pushed up by the two lifting bodies 51 to lift and support both ends of the substrate KB positioned by the transport lane 21. The two support members 36 on the movable conveyor 23 of each of the two transport lanes 21 are pushed up by two different lifting bodies 51 to lift and support the ends of the substrate KB.

Description

Technical Field

[0001] The present disclosure relates to a component mounting device that mounts components on a substrate that is transported and positioned by a transport lane.

Background Art

[0002] Conventionally, a component mounting device has been configured to transport and position a substrate by a transport lane and then mount components on the substrate by a mounting head. The transport lane usually includes a fixed conveyor and a movable conveyor, and the lane width (the distance between the fixed conveyor and the movable conveyor) can be changed according to the size of the substrate by relatively moving the movable conveyor with respect to the fixed conveyor. A lift body that can move up and down is provided below the transport lane, and by pushing up the support members provided on each of the fixed conveyor and the movable conveyor with the lift body, both ends of the substrate positioned on the transport lane can be lifted and supported.

[0003] Also, as a component mounting device, there is known one in which two transport lanes are arranged side by side in the transport direction of the substrate, and component mounting operations can be performed on two substrates simultaneously and in parallel (see, for example, Patent Document 1 below). In such a configuration, since two lift bodies are also provided side by side in the arrangement direction of the transport lanes, by projecting the movable conveyor on one side of the two transport lanes above the lift body below the other transport lane (increasing the lane interval), it is also possible to handle a substrate having a large dimension in the width direction.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, as described above, when the movable conveyor of one transport lane is extended above the lifting body of the other transport lane, the lifting body of the other transport lane is used (raised) to lift and support the support member of the movable conveyor of the one transport lane. Therefore, the lifting body of the other transport lane cannot be used to push up the support member of the other transport lane, resulting in the problem that the two transport lanes cannot be operated simultaneously.

[0006] Therefore, the present disclosure aims to provide a component mounting device that can operate two transport lanes simultaneously, even when transporting large substrates. [Means for solving the problem]

[0007] The component mounting apparatus of the present disclosure comprises a substrate transport section having two transport lanes for transporting substrates in a horizontal first direction, arranged side by side in a second direction intersecting the first direction, and a mounting head for mounting components on the substrates transported and positioned by each of the two transport lanes, wherein each of the two transport lanes consists of a fixed conveyor located outward from each other and a movable conveyor located inward from each other and capable of changing the distance to the fixed conveyor, and has three or more lifting bodies arranged side by side in the second direction in a region below the substrate transport section, each independently capable of moving up and down, and a plurality of support members provided on the fixed conveyor and the movable conveyor of each of the two transport lanes, which are pushed up by the two lifting bodies to lift and support both ends of the substrate positioned by the transport lanes, and the two support members provided on the movable conveyor of each of the two transport lanes are pushed up by two different lifting bodies to lift and support the ends of the substrate. [Effects of the Invention]

[0008] According to this disclosure, even when transporting large substrates, two transport lanes can be operated simultaneously and in parallel. [Brief explanation of the drawing]

[0009] [Figure 1] This is a perspective view of a component mounting device in one embodiment of the present disclosure. [Figure 2] This is a side view of a component mounting device in one embodiment of the present disclosure. [Figure 3] This is a perspective view of a substrate transport section included in a component mounting device according to one embodiment of the present disclosure. [Figure 4] (a)(b) A perspective view of a part of the substrate transport section of a component mounting device according to one embodiment of the present disclosure. [Figure 5] This is an exploded perspective view of a part of the substrate transport section of a component mounting device according to one embodiment of the present disclosure. [Figure 6] (a)(b) A side cross-sectional view of a part of the substrate transport section of a component mounting device according to one embodiment of the present disclosure. [Figure 7] (a) A plan view and (b) A front view of a part of the substrate transport section of a component mounting device according to one embodiment of the present disclosure. [Figure 8] (a) A plan view and (b) A front view of a part of the substrate transport section of a component mounting device according to one embodiment of the present disclosure. [Figure 9] (a) A plan view and (b) A front view of a part of the substrate transport section of a component mounting device according to one embodiment of the present disclosure. [Figure 10] (a) A plan view and (b) A front view of a part of the substrate transport section of a component mounting device according to one embodiment of the present disclosure. [Figure 11] (a) A plan view and (b) A front view of a part of the substrate transport section of a component mounting device according to one embodiment of the present disclosure. [Figure 12] (a) A plan view and (b) A front view of a part of the substrate transport section of a component mounting device according to one embodiment of the present disclosure. [Figure 13] (a) A plan view and (b) A front view of a part of the substrate transport section of a component mounting device according to one embodiment of the present disclosure. [Modes for carrying out the invention]

[0010] Embodiments of this disclosure will be described below with reference to the drawings. Figures 1 and 2 show the component mounting device 10 in this embodiment. The component mounting device 10 is a device for mounting components BH on a substrate KB, and comprises a base 11, a substrate transport unit 12, a parts feeder 13, a head moving mechanism 14, and a mounting head 15. In this embodiment, for the sake of explanation, the transport direction of the substrate KB by the component mounting device 10 (left-right direction as seen from the operator OP) is defined as the X direction, the horizontal plane direction perpendicular to the X direction (front-back direction as seen from the operator OP) is defined as the Y direction, and the up-down direction is defined as the Z direction.

[0011] In Figures 1 and 2, the substrate transport unit 12 is equipped with two transport lanes 21 that extend in the X direction and are arranged side by side in the Y direction. The two transport lanes 21 consist of a first transport lane 21A located on the near side as seen from the operator OP, and a second transport lane 21B located on the far side as seen from the operator OP. In other words, in this embodiment, the substrate transport unit 12 is equipped with two transport lanes 21 that transport substrates KB in the horizontal X direction (first direction), and two transport lanes 21 that are arranged side by side in the Y direction (second direction) which intersects with the X direction, which is the transport direction of the substrates KB.

[0012] The substrate transport unit 12 receives the substrate KB from the upstream device (left side as viewed from the operator OP in Figure 1), transports (receives) it, and positions it at a predetermined work position. Once the substrate KB is positioned at the work position, component mounting is performed on it. After component mounting is completed on the substrate KB, the substrate transport unit 12 transports (receives) the substrate KB to the downstream device (right side as viewed from the operator OP).

[0013] In Figures 1 and 2, a trolley 11D is connected to each of the Y-directions of the base 11. The parts feeders 13 are mounted side by side in the X-direction on top of each of the two trolleys 11D.

[0014] Each parts feeder 13 functions as a component supply unit and supplies the component BH to a component take-out position 13T set at an end closer to the substrate conveyance unit 12. In the present embodiment, the parts feeder 13 is a tape feeder that supplies the component BH by pulling out and conveying a component supply tape BT in which the component BH is stored from a reel RL, but the parts feeder 13 only needs to supply the component BH and is not limited to a tape feeder.

[0015] In FIGS. 1 and 2, the head movement mechanism 14 includes a fixed table 14a provided on the base 11 and extending in the Y direction, and two movable tables 14b extending in the X direction and having one end attached to the fixed table 14a. The two mounting heads 15 are attached to the two movable tables 14b respectively.

[0016] The two movable tables 14b are each driven by a drive mechanism (not shown) provided on the fixed table 14a to move in the Y direction. The two mounting heads 15 are each driven by a drive mechanism (not shown) provided on the movable table 14b to which the mounting head 15 is attached to move in the X direction. Therefore, each mounting head 15 can move freely within the XY plane (horizontal plane) by the movement operation of the movable table 14b in the Y direction with respect to the fixed table 14a and the movement operation of the mounting head 15 itself in the X direction with respect to the movable table 14b.

[0017] In FIG. 2, the two mounting heads 15 each include a plurality of nozzles 15N extending downward. Each mounting head 15 can generate a vacuum adsorption force at the lower end of each nozzle 15N, and can pick up the component BH supplied by the parts feeder 13 by the vacuum adsorption force.

[0018] The operation of each part of the component mounting device 10 is controlled by a control unit 16 (Figure 2) located within the base 11. The control unit 16 is equipped with a CPU (Central Processing Unit) and operates the substrate transport unit 12 to transport and position the substrate KB, and operates each parts feeder 13 to supply parts BH to the parts pick-up position 13T. The control unit 16 also operates the head movement mechanism 14 to move the two mounting heads 15 and has each of the two mounting heads 15 pick up parts BH.

[0019] When the component mounting device 10 performs component mounting work to mount components BH onto a substrate KB, first, the substrate transport unit 12, controlled by the control unit 16, receives the substrate KB sent from the upstream device, transports it, and positions it at a predetermined work position. At this time, the substrate transport unit 12 operates both of the two transport lanes 21 (first transport lane 21A and second transport lane 21B), or only one of the two transport lanes 21 (first transport lane 21A) (details will be described later).

[0020] Once the board transport unit 12 positions the board KB, each parts feeder 13 operates and supplies parts BH to their respective parts pick-up positions 13T. The head movement mechanism 14 moves the two mounting heads 15 back and forth between the parts feeder 13 and the board KB, causing each mounting head 15 to perform a mounting turn.

[0021] The mounting turn performed by the mounting head 15 consists of moving above the parts feeder 13 and picking up the component BH supplied by the parts feeder 13 with the nozzle 15N, and moving above the substrate KB with the component BH picked up and mounting the component BH onto the substrate KB. Thus, in the component mounting device 10 of this embodiment, the mounting head 15 mounts the component BH onto the substrate KB which has been transported and positioned by the substrate transport unit 12.

[0022] Once the mounting head 15 has repeatedly performed mounting turns and all the components BH to be mounted on the circuit board KB have been mounted, the circuit board transport unit 12 operates to transport the circuit board KB to the downstream device. This completes the component mounting process for one circuit board KB.

[0023] In this component mounting device 10, the operation of the substrate transport unit 12 is a distinctive feature, which will be described below.

[0024] First, the configuration of the substrate transport unit 12 will be explained in detail. As shown in Figure 3, the two transport lanes 21 (first transport lane 21A and second transport lane 21B) of the substrate transport unit 12 each consist of a fixed conveyor 22 located outside each other and a movable conveyor 23 located inside each other. The fixed conveyor 22 is fixed to the base 11, and the movable conveyor 23 is movable in the Y direction relative to the base 11 (i.e., relative to the fixed conveyor 22). Hereinafter, the fixed conveyor 22 of the first transport lane 21A will be referred to as the first fixed conveyor 22A, and the movable conveyor 23 of the first transport lane 21A will be referred to as the first movable conveyor 23A. Also, the fixed conveyor 22 of the second transport lane 21B will be referred to as the second fixed conveyor 22B, and the movable conveyor 23 of the second transport lane 21B will be referred to as the second movable conveyor 23B.

[0025] In each of the two transport lanes 21, the configuration of the fixed conveyor 22 (first fixed conveyor 22A and second fixed conveyor 22B) and the configuration of the movable conveyor 23 (first movable conveyor 23A and second movable conveyor 23B) are almost identical. The fixed conveyor 22 and the movable conveyor 23 each include a base member 31, a plurality of pulleys 32, a conveyor belt 33, a drive motor 34, a pressed member 35, and a support member 36, as shown in Figures 4(a), (b) and 5, respectively.

[0026] In Figures 4(a), (b) and 5, the base member 31 consists of a plate-shaped member extending in the X direction along the XZ plane. Multiple (in this case, two) pulleys 32 are attached to the inner surfaces of both ends of the base member 31 (the surfaces facing the fixed conveyor 22 and the movable conveyor 23), and the conveyor belt 33 is stretched across these two pulleys 32. A drive motor 34 is provided on the base member 31 and rotates one of the two pulleys 32 to move the conveyor belt 33.

[0027] In Figures 5 and 6(a) and 6(b), the pressed member 35 is provided at the upper end of the base member 31, with one end in the Y direction protruding inward (towards the direction where the fixed conveyor 22 and the movable conveyor 23 face each other). The support member 36 consists of a plate-shaped member extending in the X direction within the XZ plane, and is provided on the inner surface side of the base member 31.

[0028] In Figures 4(a), (b), 5, and 6(a), (b), each support member 36 has a shape that extends upward to avoid the conveyor belt 33. As shown in Figures 4(a), (b) and 5, each support member 36 has an elongated hole 41 that extends vertically and penetrates in the plate thickness direction (Y direction) at both ends in the X direction.

[0029] In Figure 5, two screw members 31S, which are attached to the inner surface of the base member 31, are inserted through each of the two elongated holes 41 in each support member 36. As a result, the support member 36 is movable in the Z direction relative to the base member 31 (and therefore relative to the conveyor belt 33) using the two elongated holes 41 as guides. A post member 42 extending downward from the support member 36 is detachably provided on the lower surface of each of the left and right ends (X direction) of the support member 36.

[0030] The support members 36 are provided on both the fixed conveyor 22 and the movable conveyor 23 of each of the two transport lanes 21, and the substrate transport section 12 is equipped with a total of four support members 36. Hereinafter, as shown in Figures 7(a) and (b), the support member 36 provided on the first fixed conveyor 22A will be referred to as the "first support member 36A", the support member 36 provided on the first movable conveyor 23A will be referred to as the "second support member 36B", the support member 36 provided on the second fixed conveyor 22B will be referred to as the "third support member 36C", and the support member 36 provided on the second movable conveyor 23B will be referred to as the "fourth support member 36D".

[0031] In Figures 3 and 7(a) and 7(b), a plurality of lifting bodies 51 are arranged in the Y direction below the substrate transport section 12, that is, below the first transport lane 21A and the second transport lane 21B. In this embodiment, there are three lifting bodies 51, and the lifting body 51 closest to the operator OP is called the "first lifting body 51P", the lifting body 51 located behind the first lifting body 51P is called the "second lifting body 51Q", and the lifting body 51 located behind the second lifting body 51Q (the furthest back) is called the "third lifting body 51R". Each lifting body 51 is individually raised and lowered by a lifting cylinder 52 (Figures 3 and 4(a) and 4(b)) provided below it.

[0032] In this embodiment, the widthwise (Y-direction) dimensions of the first lifting body 51P, the second lifting body 51Q, and the third lifting body 51R are in a ratio of 2:1:1. For example, if the widthwise dimension of the first lifting body 51P is "2W", then the widthwise dimensions of the second lifting body 51Q and the third lifting body 51R are both "W" (Figure 7(b)).

[0033] In this embodiment, the Y-direction dimension (2W) of the lifting body 51 (first lifting body 51P) located at one end (the front end) in the Y-direction of the multiple (three) lifting bodies 51 provided by the component mounting device 10 is approximately equal to the sum of the Y-direction dimensions (W) of the other lifting bodies 51 (second lifting body 51Q and third lifting body 51R). The three lifting bodies 51 are arranged so that the spacing (gap) between adjacent bodies in the Y-direction is very small. In this embodiment, approximately half of the dimension (4W) from the front end (T1) of the first lifting body 51P to the back end (T2) of the third lifting body 51R is the width-direction dimension (2W) of the first lifting body 51P, and the remainder is the width-direction dimensions (W+W) of the second lifting body 51Q and the third lifting body 51R (Figure 7(b)).

[0034] In Figures 3 and 4(a) and 4(b), a plurality of upwardly extending support pins 53 are attached to the upper surface of each of the three lifting bodies 51. The support pins 53 support the lower surface of the circuit board KB located above them from below, and are attached to the lifting body 51 in an arrangement that corresponds to the circuit board KB to be supported (for example, an arrangement that avoids components BH mounted on the lower surface of the circuit board KB).

[0035] When the lifting cylinder 52 is not raising the lifting body 51, and the lifting body 51 is in its lowest position H0, the support member 36 hangs down under its own weight with the upper edge of the elongated hole 41 in contact with the screw member 31S from above (Figures 4(a) and 6(a)). When the lifting cylinder 52 is activated from this state and the lifting body 51 is raised, the lifting body 51 pushes up the post member 42 of the support member 36 located above it (Figure 4(a) → Figure 4(b), Figure 6(a) → Figure 6(b)), and the end of the substrate KB, which was supported by the conveyor belt 33, is lifted by the support member 36. When both ends of the substrate KB are lifted by the two support members 36 in this manner, both ends of the substrate KB are separated from the two conveyor belts 33 and pressed from below by the two pressing members 35 (Figures 4(b), 6(b)), and clamped between the pressing members 35 and the support members 36 (Figure 3).

[0036] As described above, when the lifting body 51 is raised and the upper ends of the two support members 36 come into contact with the lower surface of the substrate KB, the upper ends of the multiple support pins 53 provided on the lifting body 51 also come into contact with the lower surface of the substrate KB. Therefore, when both ends of the substrate KB are supported by the two support members 36 (including when it is pressed against the two members to be pressed 35), the entire central part of the lower surface of the substrate KB is supported by the multiple support pins 53. Although it is explained here that the support pins 53 and the post members 42 of the support members 36 are pushed up by the lifting body 51, the lifting means for pushing up the support pins 53 and the post members 42 of the support members 36 may be separate. With such a configuration, it becomes possible to support the lower surface of the substrate KB by the support pins 53 alone, without clamping both ends of the substrate KB between the members to be pressed 35 and the support members 36.

[0037] The first transport lane 21A and the second transport lane 21B can each change their lane width (the distance in the Y direction of the movable conveyor 23 relative to the fixed conveyor 22) according to the size (width dimension) of the substrate KB to be transported. The lane width is changed by operating the spacing change motors (not shown) provided on each of the first transport lane 21A and the second transport lane 21B, thereby moving the movable conveyor 23 in the Y direction relative to the fixed conveyor 22. When the lane width is changed, the distance between the support member 36 provided on the fixed conveyor 22 and the support member 36 provided on the movable conveyor 23 is also changed, as is the distance between the pressed member 35 provided on the fixed conveyor 22 and the pressed member 35 provided on the movable conveyor 23.

[0038] In this embodiment, the first fixed conveyor 22A is fixed in a position above the first lifting body 51P. The first movable conveyor 23A may be positioned above the first lifting body 51P, above the second lifting body 51Q, or above the third lifting body 51R, depending on the setting of the lane width of the first transport lane 21A.

[0039] The second fixed conveyor 22B is fixed in a position above the third lifting body 51R. The second movable conveyor 23B may be positioned above the third lifting body 51R or above the second lifting body 51Q, depending on the setting of the lane width of the second transport lane 21B.

[0040] In this embodiment, the component mounting device 10 offers two modes: "dual mode" and "single mode." "Dual mode" is a mode in which the first transport lane 21A and the second transport lane 21B are operated simultaneously to perform component mounting operations on two circuit boards KB at the same time. "Single mode," on the other hand, is a mode in which only one of the two transport lanes (in this case, the first transport lane 21A) is operated to perform component mounting operations on a single circuit board KB.

[0041] (Dual mode) First, let's explain the dual modes. There are three dual modes: the first dual mode, the second dual mode, and the third dual mode.

[0042] The first dual mode, as shown in Figures 8(a) and (b), is a mode in which the first transport lane 21A transports and clamps the substrate KB with the first movable conveyor 23A positioned above the first lifting body 51P, and the second transport lane 21B transports and clamps the substrate KB with the second movable conveyor 23B positioned above the second lifting body 51Q. This first dual mode is used when it is desired to perform component mounting work on a standard-sized substrate KB using both the first transport lane 21A and the second transport lane 21B.

[0043] In the first dual mode, the first lifting body 51P is raised from its normal height H0 to clamp the substrate KB positioned at the work position by the first transport lane 21A. As a result, the support member 36 (first support member 36A) of the first fixed conveyor 22A and the support member 36 (second support member 36B) of the first movable conveyor 23A are pushed up by the first lifting body 51P, and the substrate KB positioned at the work position by the first transport lane 21A is lifted and supported by the first support member 36A and the second support member 36B (Figure 8(b)).

[0044] In addition, in the first dual mode, the second lifting body 51Q and the third lifting body 51R are raised from their normal height H0 to clamp the substrate KB positioned at the work position by the second transport lane 21B. As a result, the support member 36 (third support member 36C) of the second fixed conveyor 22B is pushed up by the third lifting body 51R, and the support member 36 (fourth support member 36D) of the second movable conveyor 23B is pushed up by the second lifting body 51Q, so that the substrate KB positioned at the work position by the second transport lane 21B is lifted and supported by the third support member 36C and the fourth support member 36D (Figure 8(b)). Note that, although the first transport lane 21A is assumed to transport standard-sized substrate KB, the substrate KB transported by the first transport lane 21A may be a smaller-sized substrate KB with a smaller width dimension than the standard size.

[0045] The second dual mode, as shown in Figures 9(a) and (b), is a mode in which the first transport lane 21A transports and clamps the substrate KB with the first movable conveyor 23A positioned above the first lifting body 51P, and the second transport lane 21B transports and clamps the substrate KB with the second movable conveyor 23B positioned above the third lifting body 51R. This second dual mode is used when it is desired to perform component mounting on standard-sized substrate KBs using the first transport lane 21A and component mounting on small-sized substrate KBs using the second transport lane 21B.

[0046] In the second dual mode, the first lifting body 51P is raised from its normal height H0 to clamp the substrate KB positioned at the work position by the first transport lane 21A. As a result, the support member 36 (first support member 36A) of the first fixed conveyor 22A and the support member 36 (second support member 36B) of the first movable conveyor 23A are pushed up by the first lifting body 51P, and the substrate KB positioned at the work position by the first transport lane 21A is lifted and supported by the first support member 36A and the second support member 36B (Figure 9(b)).

[0047] In addition, in the second dual mode, the third lifting body 51R is raised from its normal height H0 to clamp the substrate KB positioned at the work position by the second transport lane 21B. As a result, the support member 36 (third support member 36C) of the second fixed conveyor 22B and the support member 36 (fourth support member 36D) of the second movable conveyor 23B are pushed up by the third lifting body 51R, and the substrate KB positioned at the work position by the second transport lane 21B is lifted and supported by the third support member 36C and the fourth support member 36D (Figure 9(b)). Note that, although the first transport lane 21A is assumed to transport standard-sized substrate KBs, the substrate KB transported by the first transport lane 21A may be a small-sized substrate KB.

[0048] The third dual mode, as shown in Figures 10(a) and (b), is a mode in which the first transport lane 21A transports and clamps the substrate KB with the first movable conveyor 23A positioned above the second lifting body 51Q, and the second transport lane 21B transports and clamps the substrate KB with the second movable conveyor 23B positioned above the third lifting body 51R. This third dual mode is used when it is desired to perform component mounting work on large substrate KBs, which have a width dimension larger than the standard size, using the first transport lane 21A, and component mounting work on small substrate KBs using the second transport lane 21B.

[0049] In the third dual mode, the first lifting body 51P and the second lifting body 51Q are raised from their normal height H0 to clamp the substrate KB positioned at the work position by the first transport lane 21A. As a result, the support member 36 (first support member 36A) of the first fixed conveyor 22A is pushed up by the first lifting body 51P, and the support member 36 (second support member 36B) of the first movable conveyor 23A is pushed up by the second lifting body 51Q, so that the substrate KB positioned at the work position by the first transport lane 21A is lifted and supported by the first support member 36A and the second support member 36B (Figure 10(b)).

[0050] In addition, in the third dual mode, the third lifting body 51R is raised from its normal height H0 to clamp the substrate KB positioned at the work position by the second transport lane 21B. As a result, the support member 36 of the second fixed conveyor 22B (third support member 36C) and the support member 36 of the second movable conveyor 23B (fourth support member 36D) are pushed up by the third lifting body 51R, and the substrate KB positioned at the work position by the second transport lane 21B is lifted and supported by the third support member 36C and the fourth support member 36D (Figure 10(b)).

[0051] As can be seen from the descriptions of these three dual modes, in this embodiment, the component mounting device 10 is configured such that the two support members 36 (second support member 36B and fourth support member 36D) on the movable conveyors 23 (first movable conveyor 23A and second movable conveyor 23B) of the two transport lanes 21 (first transport lane 21A and second transport lane 21B) are pushed up by two different lifting bodies 51 to lift and support the edges of the substrate KB. Specifically, in the first dual mode, the first lifting body 51P and the second lifting body 51Q push up the first support member 36A and the fourth support member 36D to support the substrate KB. In the second dual mode, the first lifting body 51P and the third lifting body 51R push up the first support member 36A and the fourth support member 36D to support the substrate KB.

[0052] As in the dual mode described above, when the first transport lane 21A and the second transport lane 21B are operated independently of each other, not only must the operation of transporting the substrate KB and positioning it in the work position be performed independently of each other, but the operation of clamping the positioned substrate KB must also be performed independently. Here, if the number of lifting bodies 51 is the same as the number of transport lanes 21 (2), then if the movable conveyor 23 of one transport lane 21 is extended to the other side and positioned on the lifting body 51 on the other side, then in order to clamp the substrate KB positioned by that transport lane 21, it is necessary to raise not only the lifting body 51 corresponding to that transport lane 21, but also the lifting body 51 corresponding to the other transport lane 21. In that case, as in the second dual mode described above, if a large substrate KB is transported by one transport lane 21 (the first transport lane 21A in the above example), the other transport lane 21 (the second transport lane 21B in the above example) cannot be operated.

[0053] In this respect, in the component mounting device 10 of this embodiment, since the number of lifting bodies 51 (3) is greater than the number of transport lanes 21 (2), even if one of the two transport lanes 21 (first transport lane 21A) extends outwards to the other side (second transport lane 21B), the two support members 36 provided on the movable conveyors 23 of each of the two transport lanes 21 can be pushed up by two different lifting bodies 51 (Figure 9(b)). For this reason, even when transporting large substrates KB, the two transport lanes 21 can be operated simultaneously in parallel, improving work efficiency.

[0054] Furthermore, in this embodiment, as described above, the Y-direction dimension of the first lifting body 51P, which is located at one end (the front end) in the Y-direction among the multiple (in this case, three) lifting bodies 51, is approximately equal to the sum of the second-direction dimensions of the other lifting bodies 51, namely the second lifting body 51Q and the third lifting body 51R. Therefore, when transporting circuit boards KB of all sizes, from standard to small, which are frequently subjected to component mounting work, by the circuit board transport unit 12 (in the first dual mode and second dual mode described above), the first lifting body 51P, which is the lifting body 51 with the largest width dimension, can push up the support member 36 (first support member 36A) provided on the first fixed conveyor 22A and the support member 36 (second support member 36B) provided on the first movable conveyor 23A with a single lifting body 51 (first lifting body 51P) (it is not necessary to raise two lifting bodies 51 to lift and support one circuit board KB), thus improving work efficiency.

[0055] (Single mode) Next, let's discuss single mode. There are three types of single mode: the first single mode, the second single mode, and the third single mode.

[0056] The first single mode, as shown in Figures 11(a) and (b), is a mode in which the first transport lane 21A transports and clamps the circuit board KB with the first movable conveyor 23A positioned above the first lifting body 51P. This first single mode is used when it is desired to perform component mounting work on a standard-sized circuit board KB using only the first transport lane 21A. In single mode, not limited to this first single mode, the second transport lane 21B is kept in a dormant (non-operational) state, but the second movable conveyor 23B is positioned above the third lifting body 51R and as close as possible to the second fixed conveyor 22B.

[0057] In the first single mode, the first lifting body 51P is raised from its normal height H0 to clamp the substrate KB positioned at the work position by the first transport lane 21A. As a result, the support member 36 (first support member 36A) of the first fixed conveyor 22A and the support member 36 (second support member 36B) of the first movable conveyor 23A are pushed up by the first lifting body 51P, and the substrate KB positioned at the work position by the first transport lane 21A is lifted and supported by the first support member 36A and the second support member 36B (Figure 11(b)).

[0058] The second single mode, as shown in Figures 12(a) and (b), is a mode in which the first transport lane 21A transports and clamps the substrate KB with the first movable conveyor 23A positioned above the second lifting body 51Q. This second single mode is used when it is desired to perform component mounting work on large-sized substrates KB using the first transport lane 21A.

[0059] In the second single mode, the first lifting body 51P and the second lifting body 51Q are raised from their normal height H0 to clamp the substrate KB positioned at the work position by the first transport lane 21A. As a result, the support member 36 (first support member 36A) of the first fixed conveyor 22A is pushed up by the first lifting body 51P, and the support member 36 (second support member 36B) of the first movable conveyor 23A is pushed up by the second lifting body 51Q, so that the substrate KB positioned at the work position by the first transport lane 21A is lifted and supported by the first support member 36A and the second support member 36B (Figure 12(b)).

[0060] The third single mode, as shown in Figures 13(a) and (b), is a mode in which the first transport lane 21A transports and clamps the substrate KB with the first movable conveyor 23A positioned above the third lifting body 51R. This third single mode is used when it is desired to perform component mounting work on extra-large substrate KB, which have even larger width dimensions than large-sized substrates, using the first transport lane 21A.

[0061] In the third single mode, the first lifting body 51P and the third lifting body 51R are raised from their normal height H0 to clamp the substrate KB positioned at the work position by the first transport lane 21A. As a result, the support member 36 (first support member 36A) of the first fixed conveyor 22A is pushed up by the first lifting body 51P, and the support member 36 (second support member 36B) of the first movable conveyor 23A is pushed up by the third lifting body 51R, so that the substrate KB positioned at the work position by the first transport lane 21A is lifted and supported by the first support member 36A and the second support member 36B (Figure 13(b)).

[0062] In this third single mode, the support member 36 of the second fixed conveyor 22B (third support member 36C) and the support member 36 of the second movable conveyor 23B (fourth support member 36D) are pushed up by the third lifting body 51R together with the support member 36 of the first movable conveyor 23A (second support member 36B). However, the second transport lane 21B is in a resting (non-operational) state and does not clamp the substrate KB, and therefore does not affect the clamping operation of the substrate KB in the first transport lane 21A, so there is no particular problem.

[0063] In this single mode, only one of the two transport lanes 21 (first transport lane 21A) is operated, while the other (second transport lane 21B) is kept idle. This makes it possible to transport extra-large sized circuit boards KB that could not be transported in dual mode (third single mode). Although it is not possible to perform simultaneous component mounting operations on two circuit boards KB using both transport lanes 21, this mode is useful because it allows for component mounting operations on special extra-large sized circuit boards KB.

[0064] The embodiments of this disclosure are described above, and include the following technologies (component mounting devices).

[0065] (Item 1) A component mounting device (component mounting device 10) comprises a substrate transport section (substrate transport section 12) having two transport lanes (transport lane 21) arranged side by side in a second direction (Y direction) that intersects with a horizontal first direction (X direction) for transporting substrates (substrate KB), and a mounting head (mounting head 15) for mounting components (components BH) onto the substrates that have been transported and positioned by each of the two transport lanes, wherein each of the two transport lanes consists of a fixed conveyor (fixed conveyor 22) located outward from each other and a movable conveyor (movable conveyor 23) located inward from each other and capable of changing the distance to the fixed conveyor, and the substrate transport A component mounting device comprising: three or more lifting bodies (lifting bodies 51) arranged in a line in the second direction in a region below the conveying section, each independently capable of moving up and down; and a plurality of support members (support members 36) provided on the fixed conveyor and the movable conveyor of each of the two transport lanes, which are pushed up by the two lifting bodies to lift and support both ends of the substrate positioned by the transport lane, wherein the two support members on the movable conveyor of each of the two transport lanes are pushed up by two different lifting bodies to lift and support the ends of the substrate.

[0066] In the component loading device described in item 1, since the number of lifting bodies is greater than the number of transport lanes, even if one of the two transport lanes extends to the other side, the two support members on the movable conveyors of each of the two transport lanes can be pushed up by two different lifting bodies to lift and support the substrate. Therefore, even when transporting large substrates, the two transport lanes can be operated simultaneously, improving work efficiency.

[0067] (Item 2) The component mounting device according to claim 1, wherein the dimension in the second direction of the lifting body located at one end of the plurality of lifting bodies in the second direction is approximately equal to the sum of the dimensions in the second direction of each of the other lifting bodies.

[0068] According to the technology in item 2, when transporting circuit boards of all sizes, from standard to small, which are frequently subjected to component mounting operations, by the circuit board transport unit, the lifting body with the largest width dimension can push up both the support members of the fixed conveyor and the movable conveyor on one transport lane with a single lifting body (there is no need to raise two lifting bodies to lift and support one circuit board), resulting in improved work efficiency.

[0069] This concludes the disclosure, but the technology described herein is not limited to what is described above, and various modifications are possible. For example, in the third single mode described in the above embodiment, when the third lifting body 51R is raised, the third support member 36C provided on the second fixed conveyor 22B) and the fourth support member 36D provided on the second movable conveyor 23B are lifted by the third lifting body 51R. However, by removing the post members 42 from the third support member 36C and the fourth support member 36D respectively, it is possible to prevent the third support member 36C and the fourth support member 36D from being pushed up by the raised third lifting body 51R.

[0070] Furthermore, in the above-described embodiment, there were three lifting bodies 51 arranged in the second direction (Y direction) in the area below the substrate transport section 12, but the number of lifting bodies 51 can be three or more, and may be four, five, or the like. The more lifting bodies 51 there are, the more combinations of substrate KB sizes that can be transported by the two transport lanes 21 can be increased. [Industrial applicability]

[0071] The present invention provides a component mounting device that can operate two transport lanes simultaneously, even when transporting large circuit boards. [Explanation of Symbols]

[0072] 10. Component mounting device 12. Substrate transport section 15 Mounted Heads 21 transport lanes 21A First transport lane 21B Second transport lane 22 Fixed conveyor 22A First Fixed Conveyor 22B Second Fixed Conveyor 23 Movable conveyor 23A First movable conveyor 23B Second movable conveyor 36 Support Member 36A First support member 36B Second support member 36C Third support member 36D Fourth support member 51 Lifting mechanism 51P First Elevator 51Q Second Elevator 51R Third Elevator BH parts KB board

Claims

1. A component mounting device comprising: a substrate transport unit having two transport lanes arranged side by side in a second direction intersecting the first direction, which transport substrates in a horizontal first direction; and a mounting head for mounting components onto the substrates that have been transported and positioned by each of the two transport lanes, Each of the two transport lanes consists of a fixed conveyor located outside of each other and a movable conveyor located inside of each other, the distance between each conveyor and the fixed conveyor being adjustable. In the area below the substrate transport section, there are three or more lifting bodies arranged in the second direction, each independently capable of moving up and down, Multiple support members are provided on the fixed conveyor and the movable conveyor of each of the two transport lanes, and are pushed up by the two lifting bodies to lift and support both ends of the substrate positioned by the transport lane, It has, A component mounting device in which the two support members provided on the movable conveyor of each of the two transport lanes are pushed up by two different lifting bodies to lift and support the edges of the substrate.

2. The component mounting device according to claim 1, wherein the dimension in the second direction of the lifting body located at one end of the plurality of lifting bodies in the second direction is approximately equal to the sum of the dimensions in the second direction of each of the other lifting bodies.

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