Self-assembling substrates and display devices including self-assembling wiring

Abstract

Reduces transfer defects in light-emitting elements. [Solution] The self-assembled substrate of the present disclosure includes first and second organized wirings spaced apart from each other in a first direction and extending in a second direction intersecting the first direction; an insulating layer provided above the first and second organized wirings and having organized holes between the first and second organized wirings; a first organized electrode between the first organized wirings and the organized holes; and a second organized electrode between the second organized wirings and the organized holes, wherein the first and second organized electrodes each include a first edge exposed by the organized holes and a second edge connected to the first and second organized wirings, the ends of which are located within the organized holes and spaced apart from the edges of the organized holes.

Description

Technical Field

[0001] The present invention relates to a display device, and particularly to a self-organizing substrate including self-organizing wiring and a display device.

Background Art

[0002] With the development of an information society, various requirements for display devices for displaying images have increased, and flat panel display devices such as liquid crystal display devices and light emitting diode display devices have been developed and adopted in various fields.

[0003] Among flat panel display devices, a light emitting diode display device includes a light emitting diode (LED) as a light emitting element. When the light emitting diode injects charges into a light emitting layer provided between a cathode which is an electron injection electrode and an anode which is a hole injection electrode, the light emitting diode is an element that emits light when electrons and holes combine to form excitons and then disappear.

[0004] Since the light emitting diode display device is a self-emitting element, it is superior in viewing angle and the like compared to a liquid crystal display device. Since it does not require a backlight, it can be lightweight and thin, and is also advantageous in terms of power consumption.

[0005] Such a light emitting diode display device can include a light emitting element made of an inorganic material or a light emitting element made of an organic material. However, the light emitting element made of an inorganic material is relatively superior in stability, has a fast response, and has characteristics such as a high contrast. Therefore, micro light emitting diodes (micro LED, μLED) for corresponding to high resolution are widely used as light emitting elements made of inorganic materials.

[0006] However, when inorganic light-emitting elements are formed on a separate growth substrate and transferred to the substrate of a display device, there was a problem with transfer defects occurring during the transfer process, such as the light-emitting elements becoming duplicated or being damaged. [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] This disclosure is presented to solve the aforementioned problems and aims to provide a self-assembled substrate and display device including self-assembled wiring that can reduce transfer defects of light-emitting elements. [Means for solving the problem]

[0008] To achieve the aforementioned objectives, the self-assembled substrate of the present disclosure includes first and second organized wirings spaced apart from each other in a first direction and extending in a second direction intersecting the first direction; an insulating layer provided above the first and second organized wirings and having organized holes between the first and second organized wirings; a first organized electrode between the first organized wirings and the organized holes; and a second organized electrode between the second organized wirings and the organized holes, wherein the first and second organized electrodes each include a first edge exposed by the organized holes and a second edge connected to the first and second organized wirings, the ends of which are located within the organized holes and spaced apart from the edges of the organized holes.

[0009] The length of the first side in the second direction is less than the length of the second side in the second direction.

[0010] Each of the first and second organizing electrodes includes an opening that superimposes on the organizing hole.

[0011] The portions of the first and second structuring electrodes exposed by the structuring holes are trapezoidal, L-shaped, or T-shaped.

[0012] In the second direction, the length of the first side exposed by the organized hole is greater than the length of the remaining portion of the first and second organized electrodes exposed by the organized hole in the second direction.

[0013] The self-assembled substrate of the present disclosure further includes a first sub-organized electrode below the first organized electrode and a second sub-organized electrode below the second organized electrode, wherein the resistivity of each of the first and second sub-organized electrodes is greater than the resistivity of each of the first and second organized electrodes.

[0014] The area of ​​the first lower organizing electrode and the second lower organizing electrode exposed by the organizing hole is greater than the area of ​​the first organizing electrode and the second organizing electrode exposed by the organizing hole.

[0015] The first suborganization electrode and the second suborganization electrode each include a third side corresponding to the first side, and the length of the first side in the second direction is less than the length of the third side in the second direction.

[0016] Multiple organizing holes are provided between the first organizing wiring and the second organizing wiring, and the multiple organizing holes have different sizes or shapes depending on the color of the light-emitting element that self-organizes within the corresponding organizing hole.

[0017] The self-assembled substrate is an active matrix substrate having a plurality of thin-film transistors arranged on its upper surface.

[0018] The display device of the present disclosure includes a substrate, first and second organized wirings on the substrate spaced apart from each other in a first direction and extending in a second direction intersecting the first direction, first and second organized electrodes positioned between the first and second organized wirings and spaced apart from each other in the first direction, and a light-emitting element above the first and second organized electrodes, wherein each of the first and second organized electrodes includes a first edge covered by the light-emitting element and a second edge connected to the first and second organized wirings, the first edge located within the boundary of the light-emitting element.

[0019] The display device of this disclosure further includes an insulating layer having organized holes that expose the first organized electrode and the second organized electrode, wherein the light-emitting element is located within the organized hole.

[0020] The length of the first side in the second direction is less than the length of the second side in the second direction.

[0021] Each of the first organized electrode and the second organized electrode includes an opening superimposed on the light-emitting element.

[0022] In the second direction, the length of the first side covered by the light-emitting element is greater than the length of the remaining portion of the first and second organized electrodes covered by the light-emitting element in the second direction.

[0023] The display device of the present disclosure further includes a first lower organizing electrode below the first organizing electrode and a second lower organizing electrode below the second organizing electrode, wherein the resistivity of each of the first and second lower organizing electrodes is greater than the resistivity of each of the first and second organizing electrodes.

[0024] The area of ​​the first and second suborganization electrodes covered by the light-emitting element is greater than the area of ​​the first and second organization electrodes covered by the light-emitting element.

[0025] The first lower structured electrode and the second lower structured electrode each include a third side corresponding to the first side, and the length of the first side in the second direction is smaller than the length of the third side in the second direction.

[0026] The light-emitting elements include red, green, and blue light-emitting elements arranged in the second direction, and the red, green, and blue light-emitting elements have different sizes or shapes from each other.

[0027] A part of each of the first structured electrode and the second structured electrode covered by the light-emitting elements is trapezoidal, L-shaped, or T-shaped.

Advantages of the Invention

[0028] The display device of the present disclosure can reduce the defect of double organization of the light-emitting elements by preventing adjacent sides of the structured electrodes that generate an electric field from being exposed to the outside of the self-organized light-emitting elements.

[0029] Also, by providing an opening and minimizing the contact area between the structured electrode and the light-emitting element, it is possible to reduce the defect that the light-emitting element is damaged during the transfer process.

[0030] In addition, by providing the structured electrode on the substrate of the display device and reducing the transfer stage of the light-emitting element, the manufacturing process can be reduced and the manufacturing cost can be saved. Furthermore, by using the structured electrode and the structured wiring as power supply wiring, the degree of freedom in design can be improved. As a result, the manufacturing process of the display device can be optimized and the production energy can be reduced.

[0031] Furthermore, by making the structured electrode have a double structure with different specific resistances and areas, the self-organization of the light-emitting elements can be facilitated and the defect of double organization of the light-emitting elements can be reduced.

Brief Description of the Drawings

[0032] [Figure 1]This is a schematic plan view showing a self-assembled substrate in a light-emitting element according to an embodiment of the present disclosure. [Figure 2] This is a cross-sectional view along line AA' in Figure 1. [Figure 3] This is a schematic plan view showing a self-assembled substrate in another example of a light-emitting element according to the embodiments of this disclosure. [Figure 4] This is a schematic plan view showing a self-assembled substrate in another example of a light-emitting element according to the embodiments of this disclosure. [Figure 5] This is a schematic plan view showing a display device according to an embodiment of the present disclosure. [Figure 6] This is a schematic cross-sectional view showing a display device according to an embodiment of the present disclosure along line II' in Figure 5. [Figure 7] This is a schematic plan view showing a display device according to another embodiment of the present disclosure. [Figure 8] This is a schematic cross-sectional view showing a display device according to another embodiment of the present disclosure along the line II-II' in Figure 7. [Figure 9] This is a schematic cross-sectional view showing a display device according to another embodiment of the present disclosure along the line III-III' in Figure 7. [Figure 10] Figure 7 is a schematic cross-sectional view showing a display device according to another embodiment of the present disclosure along the line IV-IV'. [Modes for carrying out the invention]

[0033] The advantages and features of this disclosure, and the methods for achieving them, will become clearer with reference to the embodiments described in detail with the drawings. However, the present invention is not limited to the embodiments disclosed below and can be embodied in a variety of different forms. These embodiments are provided so as to complete the disclosure and so as to allow a person ordinary skill in the art to fully understand the scope of the disclosure.

[0034] The shapes, sizes, proportions, angles, and quantities disclosed in the drawings illustrating embodiments of this disclosure are illustrative and the disclosure is not limited thereto. Throughout the specification, the same reference numerals represent the same components.

[0035] Furthermore, in explaining this disclosure, if it is determined that a specific explanation of the relevant prior art would obscure the gist of this disclosure, such detailed explanation will be omitted.

[0036] Wherever "equips," "includes," "has," "possesses," or "becomes" is used in this specification, other parts may be added unless "only / only" is also used.

[0037] Furthermore, if a component is written in the singular form, it may be interpreted as plural unless otherwise explicitly stated.

[0038] Furthermore, when interpreting the constituent elements, a margin of error shall be included even if not explicitly stated.

[0039] For example, when describing the positional relationship between two components using terms such as "above," "above," "below," or "beside," one or more other components may be located between the two components unless otherwise specified as "directly" or "directly."

[0040] Furthermore, while terms such as "first" and "second" are used to distinguish the components, the components are not limited to these terms. Therefore, the first component mentioned below may also be the second component within the technical concept of this disclosure.

[0041] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the drawings.

[0042] The display device according to the embodiment of this disclosure includes a plurality of subpixels, each subpixel including a light-emitting element. The light-emitting element is formed on a separate growth substrate, self-assembled on an organizing substrate, and then transferred from the organizing substrate to the substrate of the display device, i.e., the substrate on which the thin-film transistors are provided, using a donor.

[0043] The structure of the organized electrode of the light-emitting element according to the embodiment of this disclosure, which reduces transfer defects of the light-emitting element during such a transfer process, will be described with reference to Figure 1.

[0044] Figure 1 is a schematic plan view showing a self-assembled substrate in a light-emitting element according to an embodiment of the present disclosure, and Figure 2 is a schematic plan view showing a self-assembled substrate in a light-emitting element according to an embodiment of the present disclosure, showing a cross-section along line AA' in Figure 1.

[0045] As shown in Figures 1 and 2, the self-assembled substrate for a light-emitting element according to an embodiment of the present disclosure has a first organized wiring 134 and a second organized wiring 136, a first organized electrode 135 and a second organized electrode 137, and organized holes 117h provided on the upper part of the substrate 110.

[0046] When such a self-assembling substrate is placed on top of a chamber containing a fluid in which multiple light-emitting elements 140 are dispersed, and an alternating voltage is applied to the first organizing electrode 135 and the second organizing electrode 137, an electric field is generated between the first organizing electrode 135 and the second organizing electrode 137. Due to the dielectric phoretic force based on the generated electric field, the light-emitting elements 140 can self-assemble within the organizing holes 117h.

[0047] Specifically, the upper part of the substrate 110 is provided with a first organized wiring 134 and a second organized wiring 136, as well as a first organized electrode 135 and a second organized electrode 137.

[0048] The first organized wiring 134 and the second organized wiring 136 are spaced apart in the first direction X and extend in the second direction Y.

[0049] A first organizing electrode 135 and a second organizing electrode 137 are located between the first organizing wiring 134 and the second organizing wiring 136, and the first organizing electrode 135 and the second organizing electrode 137 are connected to the first organizing wiring 134 and the second organizing wiring 136, respectively. The first organizing electrode 135 and the second organizing electrode 137 are spaced apart in the first direction X.

[0050] The first organizing electrode 135 and the second organizing electrode 137 have substantially symmetrical shapes and may be symmetric with respect to the first direction X. This symmetry may be mirror symmetry or point symmetry with respect to the center of the organizing hole 117h. Each of the first organizing electrode 135 and the second organizing electrode 137 has a first side S1 and a second side S2 extending in the second direction Y and facing the first direction X.

[0051] The first side S1 overlaps the light-emitting element 140, and the second side S2 is spaced apart from the light-emitting element 140. The second side S2 is adjacent to the first organized wiring 134 and the second organized wiring 136, and may contact the first organized wiring 134 and the second organized wiring 136.

[0052] The first side S1 and the second side S2 may have different lengths, and the length of the first side S1 may be less than the length of the second side S2.

[0053] The length of the first side S1 may be smaller than the diameter of the light-emitting element 140 and the organized hole 117h. Such a first side S1 may be located inside the light-emitting element 140 and not exposed to the outside of the light-emitting element 140. In addition, both ends of the first side S1 of the first electrode portions 135a and 137a may overlap the light-emitting element 140 and be located inside the light-emitting element 140 and not exposed to the outside of the light-emitting element 140.

[0054] On the other hand, the length of the second side S2 may be greater than the diameter of the light-emitting element 140 and the organized hole 117h. However, the embodiments of this disclosure are not limited thereto, and the length of the second side S2 can be changed.

[0055] Each of the first organizing electrode 135 and the second organizing electrode 137 may include first electrode portions 135a, 137a and second electrode portions 135b, 137b.

[0056] The first electrode portions 135a and 137a may have a first side S1, and the second electrode portions 135b and 137b may have a second side S2. The first electrode portions 135a and 137a may have more detail as they move from the first side S1 to the second side S2, and the width may increase as they move from the first side S1 to the second electrode portions 135b and 137b. That is, the width of the first electrode portions 135a and 137a may increase as they move from the first side S1 to the second electrode portions 135b and 137b.

[0057] For example, the first electrode portions 135a and 137a may be trapezoidal in shape, and the second electrode portions 135b and 137b may be rectangular in shape. However, the embodiments of this disclosure are not limited thereto, and the shapes of the first electrode portions 135a and 137a and the second electrode portions 135b and 137b can be changed. Also, the second electrode portions 135b and 137b can be omitted.

[0058] On the other hand, the first electrode portions 135a and 137a may have openings 135c and 137c that overlap with the light-emitting element 140. As a result, the overlapping area between the first electrode portions 135a and 137a of the first organized electrode 135 and the second organized electrode 137 and the light-emitting element 140 can be minimized.

[0059] The shapes of the openings 135c and 137c may be the same as the shapes of the first electrode portions 135a and 137a. For example, the openings 135c and 137c may be trapezoidal in shape.

[0060] A first organized insulating layer 116 is provided on top of the first organized wiring 134 and the second organized wiring 136, as well as the first organized electrode 135 and the second organized electrode 137. The first organized insulating layer 116 can contact the substrate 110 through openings 135c and 137c. Such a first organized insulating layer 116 can be formed from an inorganic insulating material.

[0061] A second organized insulating layer 117 is provided on top of the first organized insulating layer 116, and the second organized insulating layer 117 has organized holes 117h. The organized holes 117h are provided superimposed on the first organized electrode 135 and the second organized electrode 137, and a light-emitting element 140 is provided within the organized holes 117h by a self-assembly process. At this time, the organized holes 117h are superimposed on the first electrode portions 135a and 137a of the first organized electrode 135 and the second organized electrode 137, and are spaced apart from the second electrode portions 135b and 137b.

[0062] Through these organized holes 117h, parts of the first electrode portions 135a and 137a of the first organized electrode 135 and the second organized electrode 137 are exposed, while the remainder of the first electrode portions 135a and 137a of the first organized electrodes 135 and 137, the second electrode portions 135b and 137b, and the first organized wiring 134 and 136 are covered by the second organized insulating layer 117.

[0063] Here, the light-emitting element 140 includes a first element electrode 141, a second element electrode 142, light-emitting structures 143, 144, 145, and a protective layer 146. The protective layer 146 covers the first element electrode 141 and the second element electrode 142, and may not be exposed.

[0064] The organized holes 117h may have the same shape as the light-emitting element 140. For example, the organized holes 117h and the light-emitting element 140 may be circular, elliptical, or polygonal. However, the embodiments of this disclosure are not limited thereto, and the shapes of the organized holes 117h and the light-emitting element 140 can be modified.

[0065] Considering the organization margin, the area of ​​the organization hole 117h may be larger than the area of ​​the light-emitting element 140. As a result, the first side S1 of the first electrode portions 135a and 137a is located within the organization hole 117h and spaced apart from the edge of the organization hole 117h. The distance between one end of the first side S1 and the edge of the organization hole 117h may be larger than the distance between the end of the light-emitting element 140 and the edge of the organization hole 117h. In addition, the first electrode portions 135a and 137a of the first organization electrode 135 and the second organization electrode 137 are exposed between the organization hole 117h and the light-emitting element 140.

[0066] The distance between the first electrode portions 135a and 137a of the first organizing electrode 135 and the second organizing electrode 137, which are exposed in this manner, may be greater than or equal to the distance between the first sides S1, which is the shortest distance between the first organizing electrode 135 and the second organizing electrode 137.

[0067] Here, the electric field strength is inversely proportional to the distance between the electrodes. However, before the self-assembly of the light-emitting element 140, the first edges S1 of the exposed first organizing electrode 135 and second organizing electrode 137 are substantially located in the center of the organizing hole 117h. Therefore, when the light-emitting element 140 self-assembles, the electric field strength between the first organizing electrode 135 and the second organizing electrode 137 is greatest in the center of the organizing hole 117h.

[0068] On the other hand, after the light-emitting element 140 self-assembles, the first edges S1 of the first organizing electrode 135 and the second organizing electrode 137 are superimposed on and covered by the light-emitting element 140, and the distance between the first organizing electrode 135 and the second organizing electrode 137 that are exposed and not covered by the light-emitting element 140 is greater than the distance between the first edges S1 of the first organizing electrode 135 and the second organizing electrode 137. Therefore, after the light-emitting element 140 self-assembles, the electric field intensity between the first organizing electrode 135 and the second organizing electrode 137 is less than the electric field intensity between the first organizing electrode 135 and the second organizing electrode 137 when the light-emitting element 140 self-assembles.

[0069] Thus, in the embodiments of this disclosure, the first organized electrode 135 and the second organized electrode 137 face each other, and the length of the first side S1 superimposed on the light-emitting element 140 is less than or equal to the diameter of the light-emitting element 140, and the first side S1 and the corners corresponding to both ends of the first side S1 are located inside the light-emitting element 140 and are not exposed to the outside of the light-emitting element 140.

[0070] In such a first organizing electrode 135 and second organizing electrode 137, the electric field intensity is greatest at the center of the organized hole 117h when the light-emitting element 140 self-assembles. Therefore, the light-emitting element 140 can self-assemble at the center of the organized hole 117h.

[0071] Furthermore, after the light-emitting element 140 self-assembles, the electric field strength between the first organizing electrode 135 and the second organizing electrode 137 is smaller than the electric field strength between the first organizing electrode 135 and the second organizing electrode 137 before the light-emitting element 140 self-assembles. Therefore, after the light-emitting element 140 self-assembles within the organizing hole 117h, the defect of another light-emitting element doubling up within the same organizing hole 117h can be reduced.

[0072] Furthermore, by providing openings 135c and 137c, the contact area between the first electrode portions 135a and 137a of the first organized electrode 135 and the second organized electrode 137 and the light-emitting element 140 can be minimized. As a result, defects in which the light-emitting element is damaged by van der Waals forces between the light-emitting element 140 and the organized substrate during the process of using a donor and picking it up can be reduced.

[0073] On the other hand, the first organized wiring 134 and the second organized wiring 136, as well as the first organized electrode 135 and the second organized electrode 137, can be used as power supply wiring.

[0074] The first organizing electrode 135 and the second organizing electrode 137 can have various shapes. This will be explained with reference to Figures 3 and 4.

[0075] Figure 3 is a schematic plan view showing a self-assembled substrate in another example of a light-emitting element according to the embodiments of this disclosure.

[0076] As shown in Figure 3, the first electrode portions 135a and 137a of the first organizing electrode 135 and the second organizing electrode 137 may be T-shaped.

[0077] The first electrode portions 135a and 137a may be arranged such that their T-shaped heads or upper ends face each other. Such T-shaped first electrode portions 135a and 137a may be symmetrical in the first direction X with respect to the center between the first electrode portions 135a and 137a.

[0078] In this case, the T-shaped head or upper end may overlap the light-emitting element 140 and have a first side S1. Such a T-shaped head or upper end may not be exposed to the outside of the light-emitting element 140 and may be located inside the light-emitting element 140. In the T-shaped first electrode portions 135a and 137a, the first side S1 may have its maximum length in the second direction Y.

[0079] Furthermore, the T-shaped legs or lower end can contact and electrically connect with the second electrode portions 135b and 137b. If the second electrode portions 135b and 137b are omitted, the T-shaped legs or lower end can contact and electrically connect with the first organized wiring 134 and the second organized wiring 136.

[0080] Figure 4 is a schematic plan view showing a self-assembled substrate in another example of a light-emitting element according to an embodiment of the present disclosure.

[0081] As shown in Figure 4, the first electrode portions 135a and 137a of the first organizing electrode 135 and the second organizing electrode 137 may be L-shaped.

[0082] The first electrode portions 135a and 137a can be arranged so that their L-shaped lower ends face each other. Such L-shaped first electrode portions 135a and 137a may be 180-degree rotationally symmetrical.

[0083] In this case, the L-shaped lower end overlaps the light-emitting element 140 and may have a first side S1. Such an L-shaped lower end is not exposed to the outside of the light-emitting element 140 and may be located inside the light-emitting element 140. In the L-shaped first electrode portions 135a and 137a, the first side S1 may have its maximum length in the second direction Y.

[0084] Furthermore, the L-shaped upper end can contact and electrically connect with the second electrode portions 135b and 137b. If the second electrode portions 135b and 137b are omitted, the L-shaped upper end can contact and electrically connect with the first organized wiring 134 and the second organized wiring 136.

[0085] On the other hand, the first organized electrode 135 and the second organized electrode 137 of this disclosure are provided on a substrate of a display device, and the light-emitting element can be directly transferred onto the substrate of the display device. The planar configuration of such an embodiment of this disclosure of the display device will be described with reference to Figure 5.

[0086] Figure 5 is a schematic plan view showing a display device according to an embodiment of the present disclosure, focusing on the configuration of the vertical wiring and the light-emitting section.

[0087] As shown in Figure 5, in the display device according to the embodiment of the present disclosure, a plurality of data wirings DL spaced apart in a first direction X and extending in a second direction Y, a first organizing wiring 134, and a second organizing wiring 136 are provided in sequence.

[0088] Furthermore, although not shown in Figure 5, gate wiring and light-emitting wiring extending in the first direction X and spaced apart in the second direction Y can be provided. The gate wiring and light-emitting wiring intersect with multiple data wirings DL, and the first organizing wiring 134 and the second organizing wiring 136, defining multiple subpixels.

[0089] Multiple data routes DL can include a first data route DL1, a second data route DL2, and a third data route DL3.

[0090] Multiple light-emitting elements 140 are arranged between the first organizing wiring 134 and the second organizing wiring 136. The multiple light-emitting elements 140 include red, green, and blue light-emitting elements 140R, 140G, and 140B, which may be spaced apart in the second direction Y.

[0091] The red, green, and blue light-emitting elements 140R, 140G, and 140B may have different shapes or areas from each other. For example, the red light-emitting element 140R may be circular, while the green light-emitting element 140G and the blue light-emitting element 140B may be elliptical with different major and minor axes. In this case, the major axis of the blue light-emitting element 140B may be larger than the major axis of the green light-emitting element 140G, and the minor axis of the blue light-emitting element 140B may be smaller than the minor axis of the green light-emitting element 140G. However, the embodiments of this disclosure are not limited thereto. The shapes of the red, green, and blue light-emitting elements 140R, 140G, and 140B can vary.

[0092] Organizational holes 117h are provided corresponding to the red, green, and blue light-emitting elements 140R, 140G, and 140B, respectively. The organizational holes 117h are substantially the same shape as the corresponding red, green, and blue light-emitting elements 140R, 140G, and 140B, and have a larger area than the corresponding red, green, and blue light-emitting elements 140R, 140G, and 140B.

[0093] Furthermore, a first organizing electrode 135 and a second organizing electrode 137 are provided, corresponding to the red, green, and blue light-emitting elements 140R, 140G, and 140B, respectively. The first organizing electrode 135 and the second organizing electrode 137 are connected to the first organizing wiring 134 and the second organizing wiring 136, respectively.

[0094] Each of the first organized electrode 135 and the second organized electrode 137 may include first electrode portions 135a, 137a and second electrode portions 135b, 137b, and may have openings 135c, 137c superimposed on the light-emitting element 140. However, embodiments of the present disclosure are not limited thereto. The second electrode portions 135b, 137b and / or openings 135c, 137c may be omitted.

[0095] The first organizing electrode 135 and the second organizing electrode 137 may have the same configuration as in Figure 1. Alternatively, in other embodiments of the present disclosure, the first organizing electrode 135 and the second organizing electrode 137 may have the same configuration as in Figure 3 or Figure 4.

[0096] On the other hand, a single first pixel electrode 152 is provided superimposed on the red, green, and blue light-emitting elements 140R, 140G, and 140B. In this case, the first pixel electrode 152 may have an opening that exposes a portion of each of the red, green, and blue light-emitting elements 140R, 140G, and 140B. The first pixel electrode 152 is also superimposed on the first and second organized wiring 134 and 136, as well as the first and second organized electrodes 135 and 137.

[0097] The first pixel electrode 152 is electrically connected to the light-emitting element 140, the first organizing wiring 134, and the second organizing wiring 136. The first organizing wiring 134 and the second organizing wiring 136 can function as power supply wiring that supplies a low potential voltage VSS to the light-emitting element 140.

[0098] Furthermore, multiple second pixel electrodes 162 are provided superimposed on each of the red, green, and blue light-emitting elements 140R, 140G, and 140B. Each of the multiple second pixel electrodes 162 contacts and electrically connects to an exposed portion of the red, green, and blue light-emitting elements 140R, 140G, and 140B, and is electrically connected to each of the multiple data wirings DL.

[0099] Specifically, the second pixel electrode 162a, which is superimposed on and electrically connected to the red light-emitting element 140R, is electrically connected to the first data wiring DL1; the second pixel electrode 162b, which is superimposed on and electrically connected to the green light-emitting element 140G, is electrically connected to the second data wiring DL2; and the second pixel electrode 162c, which is superimposed on and electrically connected to the blue light-emitting element 140B, is electrically connected to the third data wiring DL3.

[0100] In this case, the multiple second pixel electrodes 162 can be superimposed on and directly contact the multiple data lines DL. Alternatively, the multiple second pixel electrodes 162 can be electrically connected to the multiple data lines DL via separate electrodes or the like.

[0101] On the other hand, the second pixel electrode 162 can also be superimposed on the first organized wiring 134 and the second organized wiring 136, as well as the first organized electrode 135 and the second organized electrode 137.

[0102] The cross-sectional structure of the display device according to such embodiments of the present disclosure will be described in detail with reference to Figure 6.

[0103] Figure 6 is a schematic cross-sectional view showing a display device according to an embodiment of the present disclosure, and shows a cross-section along line II' in Figure 5.

[0104] As shown in Figure 6, the display device according to the embodiment of this disclosure can have a thin-film transistor TR and a light-emitting element 140 provided on the upper part of the substrate 110.

[0105] Specifically, a light-shielding layer 121 is provided on the upper part of the substrate 110. The substrate 100 may be a glass substrate or a plastic substrate. For example, the plastic substrate may be made of polyimide (PI), but is not limited to this.

[0106] The light-shielding layer 121 is formed from a conductive material such as a metal, and can be formed from at least one of the following: aluminum (Al), copper (Cu), molybdenum (Mo), titanium (Ti), chromium (Cr), nickel (Ni), tungsten (W), or alloys thereof. The light-shielding layer 121 may be a single layer or a multilayer structure.

[0107] A buffer layer 111 is provided above the light-shielding layer 121. The buffer layer 111 may be located substantially across the entire surface of the substrate 110. The buffer layer 111 may be a single layer or a multilayer made of an inorganic insulating material. For example, the inorganic insulating material may include silicon nitride (SiNx), silicon oxide (SiOx), or silicon oxide nitride (SiON).

[0108] An active layer 122 is provided above the buffer layer 111. The active layer 122 overlaps with the light-shielding layer 121, and the light-shielding layer 121 blocks the light incident on the active layer 122, reducing the degradation of the active layer 122 due to light.

[0109] The active layer 122 may include a central channel region and source and drain regions on either side of the channel region. Such an active layer 122 may be formed from an oxide semiconductor material. Alternatively, the active layer 122 may be formed from polycrystalline silicon. In this case, the side edges of the active layer 122 may be doped with impurities.

[0110] A gate insulating layer 112 is provided above the buffer layer 111 on which the active layer 122 is located. The gate insulating layer 112 may be located substantially across the entire surface of the substrate 110. The gate insulating layer 112 may be a single layer or a multilayer made of an inorganic insulating material. For example, the inorganic insulating material may include silicon nitride (SiNx), silicon oxide (SiOx), or silicon oxynitride (SiON).

[0111] A gate electrode 123 is provided on top of the gate insulating layer 112. The gate electrode 123 is superimposed on the active layer 122 and is located corresponding to the center of the active layer 122. Therefore, the gate electrode 123 is also superimposed on the light-shielding layer 121.

[0112] The gate electrode 123 is formed from a conductive material such as a metal, and can be formed from at least one of the following: aluminum (Al), copper (Cu), molybdenum (Mo), titanium (Ti), chromium (Cr), nickel (Ni), tungsten (W), or alloys thereof. The gate electrode 123 may have a single-layer structure or a multi-layer structure.

[0113] An interlayer insulating layer 113 is provided above the gate electrode 123. The interlayer insulating layer 113 may cover substantially the entire surface of the substrate 110. The interlayer insulating layer 113 may be a single layer or a multilayer made of an inorganic insulating material. For example, the inorganic insulating material may include silicon nitride (SiNx), silicon oxide (SiOx), or silicon oxynitride (SiON).

[0114] A source electrode 124 and a drain electrode 125 are provided on the upper part of the interlayer insulating layer 113. The source electrode 124 and the drain electrode 125 are spaced apart via the gate electrode 123 and contact the side edges of the active layer 122, respectively, through contact holes provided in the gate insulating layer 112 and the interlayer insulating layer 113.

[0115] The source electrode 124 and drain electrode 125, together with the active layer 122 and gate electrode 123, constitute a thin-film transistor TR. The thin-film transistor TR may also be a driving transistor and can be electrically connected to the data wiring DL in Figure 5.

[0116] Furthermore, one or more transistors having substantially the same configuration as the thin-film transistor TR can be provided on the substrate 110. However, the embodiments of this disclosure are not limited thereto.

[0117] The source electrode 124 and drain electrode 125 may be formed from a conductive material such as a metal. For example, they may be formed from at least one of aluminum (Al), copper (Cu), molybdenum (Mo), titanium (Ti), chromium (Cr), nickel (Ni), tungsten (W), or alloys thereof. The source electrode 124 and drain electrode 125 may have a single-layer structure or a multi-layer structure.

[0118] A passivation layer 114 is provided above the source electrode 124 and the drain electrode 125. The passivation layer 114 may cover substantially the entire surface of the substrate 110. The passivation layer 114 may be a single layer or a multilayer made of an inorganic insulating material. For example, the inorganic insulating material may include silicon nitride (SiNx), silicon oxide (SiOx), or silicon oxynitride (SiON).

[0119] Such passivation layer 114 can also be omitted.

[0120] An overcoat layer 115 is provided on top of the passivation layer 114. The overcoat layer 115 is positioned substantially over the entire surface of the substrate 110. The overcoat layer 115 eliminates any steps caused by the underlying film and has a substantially flat top surface. The overcoat layer 115 may be formed from an organic insulating material such as a photosensitive acrylic polymer (photoacrylic).

[0121] The upper part of the overcoat layer 115 is provided with a first connecting electrode 132, a first organized wiring 134 and a second organized wiring 136, and a first organized electrode 135 and a second organized electrode 137.

[0122] The first connecting electrode 132, the first organized wiring 134 and the second organized wiring 136, and the first organized electrode 135 and the second organized electrode 137 may be formed from a conductive material such as a metal. For example, they may be formed from at least one of aluminum (Al), copper (Cu), molybdenum (Mo), titanium (Ti), chromium (Cr), nickel (Ni), tungsten (W), or alloys thereof.

[0123] The first connecting electrode 132 is superimposed on the thin-film transistor TR and is electrically connected to the thin-film transistor TR. Specifically, the first connecting electrode 132 contacts and electrically connects with the drain electrode 125 through contact holes provided in the passivation layer 114 and the overcoat layer 115.

[0124] The first organized wiring 134 and the second organized wiring 136, as well as the first organized electrode 135 and the second organized electrode 137, are located spaced apart from the thin-film transistor TR.

[0125] The first organizing electrode 135 and the second organizing electrode 137 are connected to the first organizing wiring 134 and the second organizing wiring 136, respectively. Each of the first organizing electrode 135 and the second organizing electrode 137 includes first electrode portions 135a, 137a and second electrode portions 135b, 137b, the first electrode portions 135a, 137a having openings 135c, 137c.

[0126] A first organized insulating layer 116 is provided above the first connecting electrode 132, the first organized wiring 134 and the second organized wiring 136, and the first organized electrode 135 and the second organized electrode 137. The first organized insulating layer 116 may be located substantially over the entire surface of the substrate 110. The first organized insulating layer 116 may be in contact with the overcoat layer 115 through openings 135c and 137c.

[0127] The first organized insulating layer 116 may be a single layer or a multilayer made of an inorganic insulating material. For example, the inorganic insulating material may include, but is not limited to, silicon nitride (SiNx), silicon oxide (SiOx), or silicon oxynitride (SiON), and the first organized insulating layer 116 may be omitted.

[0128] A second organized insulating layer 117 is provided above the first organized insulating layer 116. The second organized insulating layer 117 may cover substantially the entire surface of the substrate 110.

[0129] The second organized insulating layer 117 covers the first organized wiring 134 and the second organized wiring 136, and has organized holes 117h corresponding to parts of the first organized electrode 135 and the second organized electrode 137. Specifically, the second organized insulating layer 117 covers the first organized wiring 134 and the second organized wiring 136, as well as the second electrode portions 135b and 137b of the first organized electrode 135 and the second organized electrode 137, and has organized holes 117h corresponding to the first electrode portions 135a and 137a of the first organized electrode 135 and the second organized electrode 137, with a portion of the first organized insulating layer 116 exposed through the organized holes 117h.

[0130] The light-emitting element 140 and the adhesive layer 118 are provided above the first organized insulating layer 116 within the organized hole 117h. The adhesive layer 118 and the second organized insulating layer 117 may be arranged to surround a portion of the side surface of the light-emitting element 140. The height of the adhesive layer 118 and the second organized insulating layer 117 is lower than the height of the light-emitting element 140, and the adhesive layer 118 and the second organized insulating layer 117 expose the first element electrode 141 and the second element electrode 142 of the light-emitting element 140.

[0131] The adhesive layer 118 can be formed after the light-emitting element 140 has self-assembled within the organized hole 117h, and fixes the self-assembled light-emitting element 140. The adhesive layer 118 can be formed from a photocurable adhesive material that hardens with light. For example, the adhesive layer 118 can be formed from a photosensitive acrylic polymer (photoacrylic), but is not limited to this. Alternatively, the adhesive layer 118 can be formed from any one of the following: polyimide (PI) resin, epoxy resin, urethane resin, or polydimethylsiloxane (PDMS) resin.

[0132] The light-emitting element 140 is superimposed on the first electrode portions 135a and 137a of the first organizing electrode 135 and the second organizing electrode 137, and is spaced apart from the first organizing wiring 134 and the second organizing wiring 136, as well as the second electrode portions 135b and 137b of the first organizing electrode 135 and the second organizing electrode 137.

[0133] The light-emitting element 140 may have the form of a light-emitting diode chip (microLED chip, μLED chip) including an n electrode, an n-type layer, an active layer, a p-type layer, and a p electrode. The n electrode and the p electrode may be provided on the same side (for example, the side opposite to the side facing the substrate 110), and it may have a horizontal (lateral) structure in which light is emitted from the side on which the n electrode and the p electrode are provided (for example, the side opposite to the side facing the substrate 110).

[0134] However, the embodiments of this disclosure are not limited thereto. In other embodiments, the light-emitting element 140 may have a flip-chip structure in which the n electrode and p electrode are provided on the same side (for example, the side facing the substrate 110) and light is emitted from the opposite side (for example, the side opposite to the side facing the substrate 110), or it may have a vertical structure in which the n electrode and p electrode are provided on opposite sides to each other.

[0135] The light-emitting element 140 includes a first element electrode 141, a second element electrode 142, light-emitting structures 143, 144, 145, and a protective layer 146.

[0136] The first element electrode 141 and the second element electrode 142 are spaced apart on the upper part of the light-emitting structures 143, 144, and 145, and the first element electrode 141 and the second element electrode 142 are located at different heights. For example, the second element electrode 142 may be positioned higher than the first element electrode 141.

[0137] Here, the first element electrode 141 may be an n electrode, and the second element electrode 142 may be a p electrode. In this case, the first element electrode 141 may be a cathode, and the second element electrode 142 may be an anode.

[0138] However, the embodiments of this disclosure are not limited thereto. In other embodiments, the first element electrode 141 may be a p electrode and the second element electrode 142 may be an n electrode.

[0139] The first element electrode 141 and the second element electrode 142 can be formed from a conductive material. For example, the first element electrode 141 and the second element electrode 142 can be formed from a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO). Alternatively, they can be formed from, but are not limited to, an opaque conductive material such as titanium (Ti), gold (Au), silver (Ag), copper (Cu), or alloys thereof.

[0140] The light-emitting structures 143, 144, and 145 include a first semiconductor layer 143, a light-emitting layer 144, and a second semiconductor layer 145, with the light-emitting layer 144 located between the first semiconductor layer 143 and the second semiconductor layer 145.

[0141] The light-emitting layer 144 and the second semiconductor layer 145 correspond to a part of the first semiconductor layer 143, are located above the first semiconductor layer 143, and are smaller in width and area than the first semiconductor layer 143, thus exposing a portion of the upper surface of the first semiconductor layer 143. The first element electrode 141 is located on the exposed upper surface of the first semiconductor layer 143, and the second element electrode 142 is located above the second semiconductor layer 145.

[0142] The first semiconductor layer 143 and the second semiconductor layer 145 can be formed by doping a semiconductor material with n-type or p-type impurities. For example, the first semiconductor layer 143 and the second semiconductor layer 145 can be formed by doping gallium nitride (GaN), indium aluminum phosphide (InAlP), or gallium arsenide (GaAs) with n-type or p-type impurities, respectively. For example, n-type impurities may be silicon (Si), germanium (Ge), or tin (Sn), and p-type impurities may be magnesium (Mg), zinc (Zn), or beryllium (Be), but are not limited to these.

[0143] The light-emitting layer 144 can emit light by receiving electrons and holes from the first semiconductor layer 143 and the second semiconductor layer 145, respectively. Such a light-emitting layer 144 may have a single quantum well (SQW) structure or a multi-quantum well (MQW) structure. For example, the light-emitting layer 144 may be formed from indium gallium nitride (InGaN) or gallium nitride (GaN), but is not limited to these materials.

[0144] A protective layer 146 is provided on the upper part of the light-emitting structures 143, 144, and 145 on which the first element electrode 141 and the second element electrode 142 are provided. The protective layer 146 covers and protects the first element electrode 141, the second element electrode, and the light-emitting structures 143, 144, and 145, while exposing a portion of the upper surface of the first element electrode 141 and the second element electrode 142.

[0145] The protective layer 146 may be a single layer or a multilayer made of an inorganic insulating material. For example, the inorganic insulating material may include silicon nitride (SiNx), silicon oxide (SiOx), or silicon oxide nitride (SiON).

[0146] Next, a first pixel electrode 152 and a second pixel electrode 154 are provided on top of the second organized insulating layer 117, in which the light-emitting element 140 and the adhesive layer 118 are provided within the organized holes 117h.

[0147] The first pixel electrode 152 is superimposed on the light-emitting element 140, contacts and electrically connects with the first element electrode 141 of the light-emitting element 140, and is spaced apart from the second element electrode 142. The first pixel electrode 152 corresponds to the second element electrode 142 and may have an opening that exposes the second element electrode 142.

[0148] Furthermore, the first pixel electrode 152 is superimposed on the first organized wiring 134 and the second organized wiring 136, and contacts and electrically connects with the first organized wiring 134 and the second organized wiring 136 through contact holes provided in the second organized insulating layer 117 and the first organized insulating layer 116.

[0149] As a result, the first element electrode 141 of the light-emitting element 140 is electrically connected to the first organizing wiring 134 and the second organizing wiring 136 via the first pixel electrode 152. At this time, the first organizing wiring 134 and the second organizing wiring 136 can supply a low potential voltage VSS to the first element electrode 141 of the light-emitting element 140.

[0150] The first pixel electrode 152 is superimposed on and in contact with the adhesive layer 118 and the second organized insulating layer 117.

[0151] The second connecting electrode 154 is superimposed on the first connecting electrode 132 and contacts the first connecting electrode 132 through contact holes provided in the second organized insulating layer 117 and the first organized insulating layer 116, thereby creating an electrical connection. Consequently, the second connecting electrode 154 is electrically connected to the drain electrode 125 of the thin-film transistor TR via the first connecting electrode 132.

[0152] The first pixel electrode 152 and the second connecting electrode 154 may be formed from a transparent conductive material such as ITO or IZO. Alternatively, the first pixel electrode 152 and the second connecting electrode 154 may be formed from a metallic material. For example, they may be formed from at least one of aluminum (Al), copper (Cu), molybdenum (Mo), titanium (Ti), chromium (Cr), nickel (Ni), tungsten (W), or alloys thereof.

[0153] A planarization layer 119 is provided above the first pixel electrode 152 and the second connecting electrode 154. The planarization layer 119 is distributed over substantially the entire surface of the substrate 110.

[0154] The planarizing layer 119 is positioned to surround a portion of the side surface of the light-emitting element 140, and together with the second organized insulating layer 117, it can flatten the upper surface of the substrate 110 on which the light-emitting element 140 is placed, and together with the adhesive layer 118 and the second organized insulating layer 117, it can fix and protect the light-emitting element 140.

[0155] The planarization layer 119 covers the light-emitting element 140 and the first pixel electrode 152, while exposing a portion of the light-emitting element 140. Specifically, the planarization layer 119 covers the first element electrode 141 and the first pixel electrode 152 of the light-emitting element 140, while exposing a portion of the second element electrode 142 of the light-emitting element 140.

[0156] Furthermore, the planarization layer 119 may not cover the second connecting electrode 154 and may be exposed. Alternatively, the planarization layer 119 may expose a portion of the second connecting electrode 154.

[0157] The planarization layer 119 can be formed from an organic insulating material such as a photosensitive acrylic polymer (photoacrylic).

[0158] Next, a second pixel electrode 162 is provided on the upper part of the planarization layer 119. The second pixel electrode 162 is superimposed on the light-emitting element 140, the first pixel electrode 152, and the second connecting electrode 154.

[0159] Specifically, the second pixel electrode 162 superimposes on the first element electrode 141 and the second element electrode 142 of the light-emitting element 140, and contacts a portion of the exposed second element electrode 142, thereby making an electrical connection. In addition, the second pixel electrode 162 superimposes on the first pixel electrode 152, and as a result, also superimposes on the first organized wiring 134 and the second organized wiring 136.

[0160] The second pixel electrode 162 extends, overlapping and covering the second connecting electrode 154, and contacts the second connecting electrode 154, thereby electrically connecting them. As a result, the second pixel electrode 162 is electrically connected to the first connecting electrode 132 via the second connecting electrode 154, and the second element electrode 142 of the light-emitting element 140 is electrically connected to the drain electrode 125 of the thin-film transistor TR via the second pixel electrode 162, the first connecting electrode 132, and the second connecting electrode 154, and can be electrically connected to the data wiring DL in Figure 5.

[0161] The second pixel electrode 162 may be formed from a transparent conductive material such as ITO or IZO. Alternatively, the second pixel electrode 162 may be formed from a metallic material. For example, it may be formed from at least one of aluminum (Al), copper (Cu), molybdenum (Mo), titanium (Ti), chromium (Cr), nickel (Ni), tungsten (W), or alloys thereof.

[0162] Thus, the display device according to the embodiment of the present disclosure reduces the number of transfer steps and manufacturing processes, thereby reducing manufacturing costs and minimizing or reducing transfer defects, by providing a first organizing electrode 135 and a second organizing electrode 137, as well as a first organizing wiring 134 and a second organizing wiring 136 for transferring the light-emitting element 140, on a substrate 110 on which a thin-film transistor TR is provided.

[0163] Since the first organized wiring 134 and the second organized wiring 136, as well as the first organized electrode 135 and the second organized electrode 137, can be used as power supply wiring, the degree of design flexibility can be improved.

[0164] On the other hand, the first organized electrode 135 and the second organized electrode 137 may have a two-layer structure. Other embodiments of the present disclosure of display devices will be described in detail with reference to Figures 7 to 10.

[0165] Figure 7 is a schematic plan view of a display device according to another embodiment of the present disclosure, and Figures 8 to 10 are schematic cross-sectional views of a display device according to another embodiment of the present disclosure. Figure 8 shows a cross-section along line II-II' in Figure 7, Figure 9 shows a cross-section along line III-III' in Figure 7, and Figure 10 shows a cross-section along line IV-IV' in Figure 7. The display devices according to other embodiments of the present disclosure have substantially the same configuration as the embodiments described above, except for the configuration of the connecting electrodes, organized wiring, and organized electrodes. The same or similar reference numerals are used for the same components, and their descriptions are simplified or omitted.

[0166] As shown in Figures 7 to 10, the first organized wiring 234 and the second organized wiring 236, as well as the first organized electrode 235 and the second organized electrode 237, have a two-layer structure consisting of a lower layer and an upper layer, and the lower layer may be formed from a conductive material having a higher resistivity than the upper layer.

[0167] The first connecting electrode 232 may also have a two-layer structure consisting of a lower layer and an upper layer. However, the embodiments of this disclosure are not limited thereto, and the first connecting electrode 232 in other embodiments may have a single-layer structure.

[0168] Specifically, the first organizing wiring 234 includes a first lower organizing wiring 2341 and a first upper organizing wiring 2342, and the second organizing wiring 236 includes a second lower organizing wiring 2361 and a second upper organizing wiring 2362. The first organizing electrode 235 includes a first lower organizing electrode 2351 and a first upper organizing electrode 2352, and the second organizing electrode 237 includes a second lower organizing electrode 2371 and a second upper organizing electrode 2372. In addition, the first connecting electrode 232 may include a first lower connecting electrode 2321 and a first upper connecting electrode 2322.

[0169] Here, the first lower-organized wiring 2341 and the second lower-organized wiring 2361, as well as the first lower-organized electrode 2351 and the second lower-organized electrode 2371, and the first lower connecting electrode 2321 may be formed from a material having a higher resistivity than the first upper-organized wiring 2342 and the second upper-organized wiring 2362, as well as the first upper-organized electrode 2352 and the second upper-organized electrode 2372, and the first upper connecting electrode 2322. As a result, the first lower-organized wiring 2341 and the second lower-organized wiring 2361, as well as the first lower-organized electrode 2351 and the second lower-organized electrode 2371, and the first lower connecting electrode 2321 may have a higher resistance than the first upper-organized wiring 2342 and the second upper-organized wiring 2362, as well as the first upper-organized electrode 2352 and the second upper-organized electrode 2372, and the first upper connecting electrode 2322.

[0170] For example, the first lower-organized wiring 2341 and the second lower-organized wiring 2361, as well as the first lower-organized electrode 2351 and the second lower-organized electrode 2371, and the first lower connecting electrode 2321 can be formed from a transparent conductive material such as ITO or IZO, while the first upper-organized wiring 2342 and the second upper-organized wiring 2362, as well as the first upper-organized electrode 2352 and the second upper-organized electrode 2372, and the first upper connecting electrode 2322 can be formed from a metallic material such as aluminum (Al), copper (Cu), molybdenum (Mo), titanium (Ti), chromium (Cr), nickel (Ni), tungsten (W), or alloys thereof.

[0171] On the other hand, the first lower organizing electrode 2351 and the second lower organizing electrode 2371 may have a larger area than the first upper organizing electrode 2352 and the second upper organizing electrode 2372. For example, the first lower organizing electrode 2351 and the second lower organizing electrode 2371 may be rectangular, and the first upper organizing electrode 2352 and the second upper organizing electrode 2372 may have the same configuration as the first organizing electrode 135 and the second organizing electrode 137 in Figure 3, i.e., a configuration including a T-shape. However, the embodiments of this disclosure are not limited thereto. In other embodiments, the first upper organizing electrode 2352 and the second upper organizing electrode 2372 may have the same configuration as the first organizing electrode 135 and the second organizing electrode 137 in Figure 1 or Figure 4. The first lower organizing electrode 2351 and the second lower organizing electrode 2371, as well as the first upper organizing electrode 2352 and the second upper organizing electrode 2372, are partially superimposed on the light-emitting element 140.

[0172] As described above, the length of the first side S1 of the first upper organizing electrode 2352 and the second upper organizing electrode 2372 superimposed on the light-emitting element 140 is smaller than the diameter of the light-emitting element 140 and the organizing hole 117h, while the length of the second side S2 of the first upper organizing electrode 2352 and the second upper organizing electrode 2372 spaced apart from the light-emitting element 140 may be larger than the diameter of the light-emitting element 140 and the organizing hole 117h. Such first side S1 is located within the light-emitting element 140 and is not exposed to the outside of the light-emitting element 140.

[0173] On the other hand, the length of the third side S3 of the first substructured electrode 2351 and the second substructured electrode 2371 superimposed on the light-emitting element 140 may be greater than the length of the first side S1 and the same as the length of the second side S2.

[0174] In this case, the length of the third side S3 of the first lower organizing electrode 2351 and the second lower organizing electrode 2371 is greater than the diameter of the light-emitting element 140 and the organizing hole 117h, and the third side S3 can be exposed to the outside of the light-emitting element 140 within the organizing hole 117h. On the other hand, the length of the first side S1 of the first upper organizing electrode 2352 and the second upper organizing electrode 2372 is less than the diameter of the light-emitting element 140 and the organizing hole 117h, and the first side S1 is not exposed to the outside of the light-emitting element 140 within the organizing hole 117h.

[0175] In other embodiments of the present disclosure, the first organizing electrode 235 and the second organizing electrode 237 are formed in a two-layer structure with different resistivity and area. This increases the electric field generation area within the organizing hole 117h, generating a relatively strong electric field and facilitating the self-assembly of the light-emitting element 140.

[0176] Furthermore, even if the first organized electrode 235 and the second organized electrode 237 are exposed within the organized hole 117h after the self-assembly of the light-emitting element 140, the first lower organized electrode 2351 and the second lower organized electrode 2371, which are made of a material with relatively low resistivity, are also exposed. Because the electric field strength is relatively weak, the defect of another light-emitting element being double-organized within the organized hole 117h where the light-emitting element 140 self-assembled can be reduced.

[0177] As described above with reference to preferred embodiments of the present disclosure, a person ordinary in the relevant art will understand that various modifications and changes can be made without departing from the technical concept and scope of the present disclosure as described in the claims. [Explanation of Symbols]

[0178] 110... Circuit board TR... Thin-film transistor 132...First connecting electrode 134...1st organized wiring 135...first organized electrode 136…Second organized wiring 137…Second organized electrode 140…Light-emitting element 152…First pixel electrode 154...Second connecting electrode 162...Second pixel electrode

Claims

1. A first organized wiring and a second organized wiring that are spaced apart from each other in a first direction and extend in a second direction intersecting the first direction, An insulating layer provided above the first organized wiring and the second organized wiring, having organized holes between the first organized wiring and the second organized wiring, The first organized electrode between the first organized wiring and the organized hole, Including the second organized wiring and the second organized electrode between the organized holes, The first organized electrode and the second organized electrode each include a first side exposed by the organized hole and a second side connected to the first organized wiring and the second organized wiring, The two ends of the first side are located within the organized holes and spaced apart from the edges of the organized holes in the self-organized substrate.

2. The self-assembled substrate according to claim 1, wherein the length of the first side in the second direction is smaller than the length of the second side in the second direction.

3. The self-assembled substrate according to claim 1, wherein each of the first and second organizing electrodes includes an opening superimposed on the organizing holes.

4. The self-assembled substrate according to claim 1, wherein a portion of each of the first and second organized electrodes exposed by the organized holes is trapezoidal, L-shaped, or T-shaped.

5. The self-assembled substrate according to claim 1, wherein in the second direction, the length of the first side exposed by the organized holes is greater than the length of the remaining portions of the first and second organized electrodes exposed by the organized holes in the second direction.

6. The first lower organizing electrode located below the first organizing electrode, Further including a second lower tissue electrode below the second tissue electrode, The self-assembled substrate according to claim 1, wherein the resistivity of each of the first and second suborganization electrodes is greater than the resistivity of each of the first and second assembly electrodes.

7. The self-assembled substrate according to claim 6, wherein the area of ​​each of the first lower organizing electrode and the second lower organizing electrode exposed by the organizing holes is greater than the area of ​​each of the first organizing electrode and the second organizing electrode exposed by the organizing holes.

8. The first suborganization electrode and the second suborganization electrode each include a third side corresponding to the first side, The self-assembled substrate according to claim 7, wherein the length of the first side in the second direction is smaller than the length of the third side in the second direction.

9. Multiple organizing holes are provided between the first organizing wiring and the second organizing wiring. The self-organizing substrate according to claim 1, wherein the plurality of organized holes have different sizes or shapes depending on the color of the light-emitting element that self-assembles within the corresponding organized hole.

10. The self-assembled substrate according to claim 1, wherein the self-assembled substrate is an active matrix substrate having a plurality of thin-film transistors disposed on its upper surface.

11. circuit board and On the substrate, spaced apart from each other in the first direction and intersecting the first direction A first organized wiring and a second organized wiring extending in a second direction, A first organizing electrode and a second organizing electrode are arranged between the first organizing wiring and the second organizing wiring, and are spaced apart from each other in the first direction, The first organized electrode and the second organized electrode include a light-emitting element on top of the second organized electrode, The first organized electrode and the second organized electrode each include a first side covered by the light-emitting element and a second side connected to the first organized wiring and the second organized wiring, The first side is a display device located within the boundary of the light-emitting element.

12. The present invention further includes an insulating layer having organized holes that expose the first organized electrode and the second organized electrode, The display device according to claim 11, wherein the light-emitting element is located within the organized hole.

13. The display device according to claim 11, wherein the length of the first side in the second direction is smaller than the length of the second side in the second direction.

14. The display device according to claim 11, wherein each of the first organized electrode and the second organized electrode includes an opening superimposed on the light-emitting element.

15. The display device according to claim 11, wherein in the second direction, the length of the first side covered by the light-emitting element is greater than the length of the remaining portion of the first and second organized electrodes covered by the light-emitting element in the second direction.

16. The first lower organizing electrode located below the first organizing electrode, Further including a second lower tissue electrode below the second tissue electrode, The display device according to claim 11, wherein the resistivity of each of the first and second suborganization electrodes is greater than the resistivity of each of the first and second organization electrodes.

17. The display device according to claim 16, wherein the area of ​​each of the first and second lower organizing electrodes covered by the light-emitting element is greater than the area of ​​each of the first and second organizing electrodes covered by the light-emitting element.

18. The first suborganization electrode and the second suborganization electrode each include a third side corresponding to the first side, The display device according to claim 17, wherein the length of the first side in the second direction is smaller than the length of the third side in the second direction.

19. The light-emitting element includes red, green, and blue light-emitting elements arranged in the second direction, The display device according to claim 11, wherein the red, green, and blue light-emitting elements have different sizes or shapes from each other.

20. The display device according to claim 11, wherein a portion of the first organized electrode and the second organized electrode, each covered by the light-emitting element, is trapezoidal, L-shaped, or T-shaped.

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