Apparatus and method for predicting wafer test data
By preprocessing WAT data into positional embedding vectors and using an AI model, the electrical characteristic distribution of a wafer is accurately predicted with limited test data, improving positional resolution and accuracy.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- DIGWISE TECH CORP LTD
- Filing Date
- 2024-12-16
- Publication Date
- 2026-07-10
AI Technical Summary
Existing methods struggle to accurately represent the electrical characteristic distribution of a wafer using limited test data.
A method involving preprocessing wafer acceptance test (WAT) data to convert positional information into embedding vectors and inputting chip probing (CP) data into an artificial intelligence model to generate predicted WAT data with a higher number of data points, using an electronic device with a processing circuit and memory to execute the AI model.
The method effectively predicts the electrical characteristic distribution across the entire wafer with a relatively small amount of test data, enhancing positional resolution and accuracy.
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