Photosensitive resin composition, method for manufacturing an electronic device, method for manufacturing an electronic device and a photosensitive resin composition

Abstract

To provide a photosensitive resin composition capable of forming a permanent film with good tensile elongation properties. [Solution] A thermosetting photosensitive resin composition for permanent film formation, comprising a resin and a photosensitive agent, wherein the number of particles with a diameter of 0.5 to 20 μm, counted in a 1 minute measurement at a flow rate of 3 g / min using a light scattering particle counter with a wavelength of 780 nm, is 100 or less.

Description

[Technical Field]

[0001] The present invention relates to a photosensitive resin composition, a method for manufacturing an electronic device, and a method for manufacturing an electronic device and a photosensitive resin composition. [Background technology]

[0002] In the manufacturing of electronic devices, photosensitive resin compositions are used to form permanent films (films that remain in the final product). Specifically, various photosensitive resin compositions for forming permanent films (typically cured films) such as interlayer films, surface protective films, and dam materials have been studied.

[0003] For example, Patent Document 1 describes a photosensitive resin composition comprising (A) 100 parts by mass of a polymer which is an alkali-soluble phenol resin, polyhydroxystyrene, or a derivative of polyhydroxystyrene, (B) 1 to 100 parts by mass of a photosensitive diazonaphthoquinone compound, (C) 100 to 1000 parts by mass of an organic solvent, and (D) 0.1 to 20 parts by mass of an adhesive aid which is an organic compound containing an alkoxysilyl group. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2012-063788 [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] Permanent films used in electronic devices require various properties. For example, they need to have good tensile elongation properties and be resistant to breakage by external forces. Having such properties in a permanent film leads to improved yield and reliability of electronic devices.

[0006] With the increasing sophistication, complexity, and miniaturization of electronic devices in recent years, the performance requirements for permanent films are constantly rising, and there is a need for further improvements in tensile elongation properties.

[0007] Therefore, with the objective of providing a photosensitive resin composition capable of forming a permanent film having good tensile elongation properties, the present inventors investigated new photosensitive resin compositions. [Means for solving the problem]

[0008] The inventors have completed the invention described below and solved the above problems.

[0009] According to the present invention, A thermosetting photosensitive resin composition for permanent film formation, It contains a resin and a photosensitive agent. A photosensitive resin composition in which the number of particles with a diameter of 0.5 to 20 μm, counted in a 1-minute measurement at a flow rate of 3 g / min using a light scattering particle counter with a wavelength of 780 nm, is 100 or less. It will be provided.

[0010] Furthermore, according to the present invention, A film-forming step of forming a photosensitive resin film using the above photosensitive resin composition, An exposure step of exposing the photosensitive resin film, A developing step for developing the exposed photosensitive resin film and Method of manufacturing electronic devices including It will be provided.

[0011] Furthermore, according to the present invention, Electronic device comprising a permanent film formed from the above photosensitive resin composition It will be provided.

[0012] Furthermore, according to the present invention, A method for producing the above-mentioned photosensitive resin composition, A method for producing a photosensitive resin composition, which includes a filtration step using a hollow fiber membrane filter with a pore diameter of 0.5 μm or less is provided.

Effect of the Invention

[0013] By using the photosensitive resin composition of the present invention, a permanent film having good tensile elongation characteristics can be formed.

Brief Description of the Drawings

[0014] [Figure 1] It is a diagram for explaining a method for manufacturing an electronic device.

Embodiments for Carrying Out the Invention

[0015] Hereinafter, embodiments of the present invention will be described in detail while referring to the drawings. In the drawings, similar components are denoted by similar reference numerals, and the description thereof will be omitted as appropriate. To avoid complexity, when there are a plurality of identical components within the same drawing, only one of them may be labeled with a reference numeral, and not all of them may be labeled. The drawings are for illustrative purposes only. The shapes and dimensional ratios of the members in the drawings do not necessarily correspond to actual articles.

[0016] In this specification, the notation "X to Y" in the description of a numerical range represents X or more and Y or less, unless otherwise specified. For example, "1 to 5 mass%" means "1 mass% or more and 5 mass% or less".

[0017] In the notation of a group (atomic group) in this specification, a notation that does not indicate whether it is substituted or unsubstituted includes both those having no substituent and those having a substituent. For example, the "alkyl group" includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group). In this specification, the term "(meth)acrylic" refers to a concept that encompasses both acrylic and methacrylic. The same applies to similar terms such as "(meth)acrylate." In this specification, unless otherwise specified, the term "organic group" refers to an atomic group obtained by removing one or more hydrogen atoms from an organic compound. For example, "monovalent organic group" refers to an atomic group obtained by removing one hydrogen atom from any organic compound. In this specification, the term "polyamide / polyimide resin" encompasses three types of resins unless otherwise specified: (i) resins containing polyamide structures but not polyimide structures, (ii) resins containing polyimide structures but not polyamide structures, and (iii) resins containing both polyamide and polyimide structures. Furthermore, in this specification, a polyamide resin may or may not contain polyimide structures in addition to polyamide structures, and a polyimide resin may or may not contain polyamide structures in addition to polyimide structures. In this specification, the term "electronic device" is used to encompass elements, devices, and final products to which electronic engineering technology is applied, such as semiconductor chips, semiconductor elements, printed circuit boards, electrical circuit display devices, information and communication terminals, light-emitting diodes, physical batteries, and chemical batteries.

[0018] <Photosensitive resin composition> The photosensitive resin composition of this embodiment is for permanent film formation. That is, the photosensitive resin composition of this embodiment is not a photoresist composition that is temporarily used as a mask during etching and then removed after use. The permanent film formed using the photosensitive resin composition of this embodiment is incorporated into a final product such as an electronic device. The photosensitive resin composition of this embodiment is thermosetting. Specifically, the photosensitive resin composition of this embodiment can be any of the following: (i) the resin itself has thermal polymerization and crosslinking properties; (ii) the composition as a whole becomes thermosetting by including a crosslinking agent / polymerizable monomer in addition to the resin (which may be thermosetting or thermoplastic); or (iii) insolubility increases due to chemical reactions such as ring closure reactions that occur when heated. The photosensitive resin composition of this embodiment comprises at least a resin and a photosensitive agent. When the photosensitive resin composition of this embodiment is passed through a light scattering particle counter using light with a wavelength of 780 nm, the number of particles with a diameter of 0.5 to 20 μm counted in a 1-minute measurement at a flow rate of 3 g / min is 100 or less. This number of particles is preferably 50 or less, more preferably 20 or less. There is no particular lower limit to the number of particles, and it may be 0. From a practical standpoint such as manufacturing cost, the number of particles is, for example, 0.1 or more, specifically 1 or more.

[0019] The reason why the permanent film formed from the "low particle" photosensitive resin composition of this embodiment has good tensile elongation properties is, although this is merely a hypothesis, explained as follows. If particles are present in the permanent film, the location of those particles is thought to act as a "trigger" for fracture. Therefore, by reducing the number of particles in the photosensitive resin composition used to form the permanent film, the "trigger" for fracture can be reduced, and as a result, good tensile elongation properties can be obtained.

[0020] As an additional effect, the reduced number of particles in the photosensitive resin composition tends to improve the adhesion of the permanent film (cured film) to the metal substrate. This is presumed to be because fewer particles reduce the "triggers for delamination."

[0021] Incidentally, several attempts have been made to reduce the number of particles in photoresist compositions used during etching (for example, International Publication No. 2017 / 163922). However, in photoresists that are used temporarily as a mask during etching and removed after use, "tensile elongation properties" are not usually required. The technical idea of ​​reducing the number of particles in the composition to "improve the tensile elongation properties of the permanent film" is based on the inventors' own research.

[0022] The "low particle" photosensitive resin composition of this embodiment can be manufactured by using appropriate materials and selecting appropriate manufacturing methods and conditions. Details will be explained in the examples, but for example, the photosensitive resin composition of this embodiment can be manufactured by performing filtration using a polypropylene hollow fiber membrane filter with a pore size of about 0.2 μm during the manufacturing of the photosensitive resin composition.

[0023] The following describes the components that the photosensitive resin composition of this embodiment may contain, as well as the properties and physical characteristics of the photosensitive resin composition of this embodiment.

[0024] (resin) Considering the estimated mechanism described above, that "the reduced number of particles leads to fewer triggers for fracture," it is believed that good tensile elongation properties can be obtained with any resin system in the photosensitive resin composition of this embodiment. Below, we will specifically describe epoxy resins and polyamide / polyimide resins, which are resins that are particularly preferred for use in the manufacture of electronic devices.

[0025] Epoxy resin As the epoxy resin, for example, an epoxy resin having two or more epoxy groups in one molecule can be used. The epoxy resin can be a monomer, oligomer, or polymer in general. The molecular weight and molecular structure of the epoxy resin are not particularly limited.

[0026] Examples of epoxy resins include phenol novolac type epoxy resins, cresol novolac type epoxy resins, cresol naphthol type epoxy resins, biphenyl type epoxy resins, biphenyl aralkyl type epoxy resins, naphthalene skeleton type epoxy resins, bisphenol A type epoxy resins, bisphenol A diglycidyl ether type epoxy resins, bisphenol F type epoxy resins, bisphenol F diglycidyl ether type epoxy resins, bisphenol S diglycidyl ether type epoxy resins, glycidyl ether type epoxy resins, aromatic polyfunctional epoxy resins, aliphatic epoxy resins, and aliphatic polyfunctional epoxy resins. Other examples include 3,4-epoxycyclohexylmethyl (3,4-epoxycyclohexane) carboxylate, 3,4-epoxy-6-methylcyclohexylmethyl (3,4-epoxy-6-methylcyclohexane) carboxylate, bis(3,4-epoxy-6-methylcyclohexylmethyl) adipate, dicyclopentanediene oxide, bis(2,3-epoxycyclopentyl) ether, and alicyclic epoxy resins such as Daicel's Celoxide 2021P, Celoxide 2081, Celoxide 2083, Celoxide 2085, Celoxide 8000, and Epolid GT401. Furthermore, other examples include aliphatic polyglycidyl ethers such as 2,2'-(((((1-(4-(2-(4-(oxiran-2-ylmethoxy)phenyl)propan-2-yl)phenyl)ethane-1,1-diyl)bis(4,1-phenylene))bis(oxy))bis(methylene))bis(oxiran)) (e.g., Techmore VG3101L from Printec), Epolite 100MF (Kyoeisha Chemical Industry Co., Ltd.), Epiol TMP (NOF Corporation), and 1,1,3,3,5,5-hexamethyl-1,5-bis(3-(oxiran-2-ylmethoxy)propyl)trisiloxane (e.g., DMS-E09 (Gerest)). Epoxy resins may be used alone or in combination with other resins.

[0027] The epoxy resin may include a solid epoxy resin having two or more epoxy groups in its molecule. As the solid epoxy resin, one having two or more epoxy groups and being solid at 25°C (room temperature) can be used. This improves the mechanical properties of the resin film in the photosensitive resin composition.

[0028] The epoxy resin preferably contains a polyfunctional epoxy resin with three or more functions in its molecule (i.e., a polyfunctional epoxy resin having three or more epoxy groups in one molecule). This allows the film to harden sufficiently, improving, for example, its heat resistance and durability as a permanent film. Furthermore, high heat resistance means that the properties of the permanent film are less likely to change even when heated, leading to further improvement in flatness.

[0029] As a polyfunctional epoxy resin with three or more functions, one or more epoxy resins selected from the group consisting of phenol novolac type epoxy resins, cresol novolac type epoxy resins, triphenylmethane type epoxy resins, dicyclopentadiene type epoxy resins, bisphenol A type epoxy resins, and tetramethylbisphenol F type epoxy resins are preferred. Among these, triphenylmethane type epoxy resins or novolac type epoxy resins are more preferred. This makes it possible to achieve an appropriate coefficient of thermal expansion while increasing the heat resistance of the resin film.

[0030] The epoxy resin may include a liquid epoxy resin having two or more epoxy groups in its molecule. The liquid epoxy resin functions as a film-forming agent and can improve the brittleness of the resin film of the photosensitive resin composition.

[0031] As the liquid epoxy resin, an epoxy compound having two or more epoxy groups and being liquid at room temperature (25°C) can be used. The viscosity of the liquid epoxy resin at 25°C is, for example, 1 to 8000 mPa·s, preferably 5 to 1500 mPa·s, and more preferably 10 to 1400 mPa·s.

[0032] The liquid epoxy resin may include, for example, one or more selected from the group consisting of bisphenol A diglycidyl ether, bisphenol F diglycidyl ether, alkyl diglycidyl ether, and alicyclic epoxy. These may be used individually or in combination of two or more. Among these, alkyl diglycidyl ether can be used from the viewpoint of reducing cracks after development.

[0033] The epoxy equivalent of the liquid epoxy resin is, for example, 100 to 200 g / eq, preferably 105 to 180 g / eq, and more preferably 110 to 170 g / eq. This improves the brittleness of the resin film.

[0034] The lower limit of the liquid epoxy resin content is, for example, 5% by mass or more, preferably 10% by mass or more, and more preferably 15% by mass or more, relative to the total nonvolatile components of the photosensitive resin composition. This improves the brittleness of the final cured film. The upper limit of the liquid epoxy resin content is, for example, 40% by mass or less, preferably 35% by mass or less, and more preferably 30% by mass or less, relative to the total nonvolatile components of the photosensitive resin composition. This allows for a balance in the film properties of the cured film.

[0035] The epoxy resin content is, for example, 40% by mass or more, preferably 45% by mass or more, and more preferably 50% by mass or more, relative to the total nonvolatile components of the photosensitive resin composition. This improves the heat resistance and mechanical strength of the final cured film. The epoxy resin content is, for example, 90% by mass or less, preferably 85% by mass or less, and more preferably 80% by mass or less, relative to the total nonvolatile components of the photosensitive resin composition. This improves patternability.

[0036] • Polyamide / polyimide resin The polyamide / polyimide resin preferably contains structural units represented by the following general formula (PA-1) and / or structural units represented by the following general formula (PI-1).

[0037] [ka]

[0038] [ka]

[0039] In general formulas (PA-1) and (PI-1), X is a divalent organic group, Y is a tetravalent organic group.

[0040] In general formulas (PA-1) and (PI-1), at least one of X and Y is preferably a fluorine atom-containing group. From the viewpoint of organic solvent solubility, it is preferable that both X and Y in general formulas (PA-1) and (PI-1) are fluorine atom-containing groups.

[0041] In general formulas (PA-1) and (PI-1), the divalent organic group of X and / or the tetravalent organic group of Y preferably contain an aromatic ring structure, and more preferably a benzene ring structure. This tends to further increase heat resistance. The benzene ring here may be substituted with a fluorine atom, a fluorinated alkyl group (preferably a trifluoromethyl group), or other fluorine-containing groups. In general formulas (PA-1) and (PI-1), the divalent organic group X and / or the tetravalent organic group Y preferably have a structure in which 2 to 6 benzene rings are linked via single bonds or divalent linking groups. Examples of divalent linking groups include alkylene groups, alkylene fluorides, and ether groups. The alkylene groups and alkylene fluorides may be linear or branched. In general formulas (PA-1) and (PI-1), the number of carbon atoms in the divalent organic group of X is, for example, 6 to 30. In general formulas (PA-1) and (PI-1), the number of carbon atoms in the tetravalent organic group of Y is, for example, 6 to 20. The two imide rings in the general formula (PI-1) are preferably five-membered rings.

[0042] Polyamide / polyimide resins more preferably contain structural units represented by the following general formula (PA-2) and / or the following general formula (PI-2).

[0043] [ka]

[0044] [ka]

[0045] In general formulas (PA-2) and (PI-2), X is synonymous with X in general formulas (PA-1) and (PI-1), Y' represents a single bond, a carbonyl group, or an alkylene group.

[0046] The specific form of X is the same as that described in general formulas (PA-1) and (PI-1). The alkylene group of Y' may be linear or branched. Preferably, some or all of the hydrogen atoms of the alkylene group of Y' are substituted with fluorine atoms. The number of carbon atoms in the alkylene group of Y' is, for example, 1 to 6, preferably 1 to 4, and more preferably 1 to 3.

[0047] From the viewpoint of reducing the amount of shrinkage during the formation of the cured film, the photosensitive resin composition of this embodiment preferably contains a polyimide resin, and more preferably contains a polyimide resin having an imide ring structure. When the number of moles of imide groups contained in the polyimide resin is denoted as IM and the number of moles of amide groups contained in the polyimide resin is denoted as AM, the imidization rate, expressed as {IM / (IM+AM)}×100(%), is preferably 90% or higher, more preferably 95% or higher, and even more preferably 98% or higher. In short, it is preferable that the polyimide resin is a resin with few or no ring-open amide structures and many ring-closed imide structures. By using such a polyimide resin, shrinkage due to heating (curing shrinkage) can be further suppressed (because dehydration due to ring-closing reaction does not occur). This can lead to further improvements in the reliability of electronic devices and further improvements in the flatness of the cured film. The imidation rate can be determined, for example, from the area of ​​the peak corresponding to the amide group or the peak corresponding to the imide group in the NMR spectrum. Alternatively, the imidation rate can be determined from the area of ​​the peak corresponding to the amide group or the peak corresponding to the imide group in the infrared absorption spectrum.

[0048] The polyamide / polyimide resin preferably contains fluorine atoms. Our findings indicate that polyamide / polyimide resins containing fluorine atoms tend to have better organic solvent solubility than those without fluorine atoms. Therefore, using a polyamide / polyimide resin containing fluorine atoms makes it easier to create a varnish-like property in the photosensitive resin composition. The amount (mass ratio) of fluorine atoms in a polyamide / polyimide resin containing fluorine atoms is, for example, 1 to 30% by mass, preferably 3 to 28% by mass, and more preferably 5 to 25% by mass. A sufficiently large amount of fluorine atoms in the resin makes it easier to obtain sufficient solubility in organic solvents. On the other hand, from the viewpoint of balancing with other properties, it is preferable that the amount of fluorine atoms is not too high.

[0049] By designing the ends of polyamide / polyimide resins in various ways, it is possible to further improve the mechanical properties of the cured product (such as tensile elongation).

[0050] As an example, polyamide / polyimide resins preferably have groups at their ends that can react with epoxy groups to form bonds. Examples of such groups include acid anhydride groups, hydroxyl groups, amino groups, and carboxyl groups.

[0051] Preferably, the polyamide / polyimide resin has acid anhydride groups at its ends. In the photosensitive resin composition of this embodiment, the acid anhydride groups and epoxy groups readily bond together. The acid anhydride group is preferably a group having a cyclic acid anhydride skeleton. Here, "cyclic structure" is preferably a 5-membered ring or a 6-membered ring, more preferably a 5-membered ring.

[0052] To add to the information regarding the terminal structure, it is preferable that the polyamide / polyimide resin does not have a maleimide structure at its terminals.

[0053] Polyamide resins can typically be obtained by reacting (condensation polymerization) a diamine with an acidic dianhydride. Polyimide resins can be obtained by imidizing (ring-closing reaction) a polyamide resin. Furthermore, desired functional groups may be introduced at the polymer ends as needed. Specific reaction conditions can be found in the examples provided later, as well as in the examples described in International Publication No. 2016 / 172092.

[0054] In the final polyamide / polyimide resin, the diamine is incorporated into the polymer as a divalent organic group X in general formula (PA-1) or (PI-1). The acidic dianhydride is incorporated into the polymer as a tetravalent organic group Y in general formula (PA-1) or (PI-1). In the synthesis of polyamide / polyimide resins, one or more diamines may be used, and one or more acidic dianhydrides may also be used.

[0055] Examples of diamines used as raw materials include 3,4'-diaminodiphenyl ether (3,4'-ODA), 4,4'-diamino-2,2'-bis(trifluoromethyl)biphenyl (TFMB), 3,3',5,5'-tetramethylbenzidine, 2,3,5,6-tetramethyl-1,4-phenylenediamine, 3,3'-diaminodiphenyl sulfone, 3,3'-dimethylbenzidine, 3,3'-bis(trifluoromethyl)benzidine, and 2,2'-bis(p-aminophenyl)hex Safluoropropane, bis(trifluoromethoxy)benzidine (TFMOB), 2,2'-bis(pentafluoroethoxy)benzidine (TFEOB), 2,2'-trifluoromethyl-4,4'-oxydianiline (OBABTF), 2-phenyl-2-trifluoromethyl-bis(p-aminophenyl)methane, 2-phenyl-2-trifluoromethyl-bis(m-aminophenyl)methane, 2,2'-bis(2-heptafluoroisopropoxy-tetrafluoroethoxy) (C)benzidine (DFPOB), 2,2-bis(m-aminophenyl)hexafluoropropane (6-FmDA), 2,2-bis(3-amino-4-methylphenyl)hexafluoropropane, 3,6-bis(trifluoromethyl)-1,4-diaminobenzene (2TFMPDA), 1-(3,5-diaminophenyl)-2,2-bis(trifluoromethyl)-3,3,4,4,5,5,5-heptafluoropentane, 3,5-diaminobenzotrifluoride (3,5-DAB TF), 3,5-diamino-5-(pentafluoroethyl)benzene, 3,5-diamino-5-(heptafluoropropyl)benzene, 2,2'-dimethylbenzidine (DMBZ), 2,2',6,6'-tetramethylbenzidine (TMBZ), 3,6-diamino-9,9-bis(trifluoromethyl)xanthene (6FCDAM), 3,6-diamino-9-trifluoromethyl-9-phenylxanthene (3FCDAM), 3,6-diamino-9,9-diphenylxanthene

[0056] Examples of acid dianhydrides used as raw materials include pyromellitic anhydride (PMDA), diphenyl ether-3,3',4,4'-tetracarboxylic acid dianhydride (ODPA), benzophenone-3,3',4,4'-tetracarboxylic acid dianhydride (BTDA), biphenyl-3,3',4,4'-tetracarboxylic acid dianhydride (BPDA), diphenyl sulfone-3,3',4,4'-tetracarboxylic acid dianhydride (DSDA), diphenylmethane-3,3',4,4'-tetracarboxylic acid dianhydride, 2,2-bis(3,4-phthalic anhydride)propane, and 2,2-bis(3,4-phthalic anhydride)-1,1,1,3,3,3-hexafluoropropane (6FDA). Of course, the usable acid dianhydrides are not limited to these. One or more acid dianhydrides can be used.

[0057] The ratio of diamine to acid dianhydride used is basically 1:1 in molar ratio. However, one may be used in excess to obtain the desired terminal structure. Specifically, by using an excess of diamine, the ends (both ends) of the polyamide / polyimide resin tend to become amino groups. On the other hand, by using an excess of acid dianhydride, the ends (both ends) of the polyamide / polyimide resin tend to become acid anhydride groups. As mentioned above, in this embodiment, it is preferable for the polyamide / polyimide resin to have acid anhydride groups at its ends. Therefore, in this embodiment, it is preferable to use an excess of acid dianhydride when synthesizing the polyamide / polyimide resin.

[0058] The amino groups and / or acid anhydride groups at the ends of the polyamide / polyimide resin obtained by condensation polymerization may be reacted with some reagent to make the resin ends have desired functional groups.

[0059] The weight-average molecular weight of the polyamide / polyimide resin is, for example, 5,000 to 100,000, preferably 7,000 to 75,000, and more preferably 10,000 to 50,000. A sufficiently large weight-average molecular weight of the polyamide / polyimide resin allows for sufficient heat resistance of the cured film, for example. Furthermore, a weight-average molecular weight that is not too large makes it easier to dissolve the polyamide / polyimide resin in organic solvents. The weight-average molecular weight can usually be determined by gel permeation chromatography (GPC) using polystyrene as a standard substance.

[0060] Incidentally, when using polyamide / polyimide resin, it is preferable to use it in combination with epoxy resin. Specific examples of epoxy resin are as described above. When using polyamide / polyimide resin and epoxy resin in combination, the amount is, for example, 0.5 to 30 parts by mass, preferably 1 to 20 parts by mass, and more preferably 3 to 15 parts by mass, per 100 parts by mass of polyamide resin and / or polyimide resin.

[0061] (Phenoxy resin) The photosensitive resin composition of this embodiment preferably contains a phenoxy resin. In particular, if the photosensitive resin composition of this embodiment contains an epoxy resin, it is preferable to use both the epoxy resin and the phenoxy resin in combination. It is believed that the use of phenoxy resin increases, for example, the flexibility of the formed film. In the narrow sense, "phenoxy resin" refers to a polyhydroxy polyether synthesized from bisphenols and epichlorohydrin. However, in this specification, polymers obtained by polyaddition reactions of polyfunctional epoxy resins and polyfunctional phenols (phenoxy resins in the broad sense) are also included as phenoxy resins.

[0062] Examples of phenoxy resins include bisphenol A type phenoxy resin, bisphenol F type phenoxy resin, copolymer phenoxy resin of bisphenol A type and bisphenol F type, biphenyl type phenoxy resin, bisphenol S type phenoxy resin, and copolymer phenoxy resin of biphenyl type phenoxy resin and bisphenol S type phenoxy resin. Among these, bisphenol A type phenoxy resin or copolymer phenoxy resin of bisphenol A type and bisphenol F type is preferred. Phenoxy resins may be used alone or in combination of two or more types.

[0063] The weight-average molecular weight (Mw) of the phenoxy resin is preferably 10,000 to 100,000, more preferably 20,000 to 80,000, and even more preferably 35,000 to 80,000. The relatively high Mw of the phenoxy resin further suppresses curing shrinkage and improves flatness. Although the detailed mechanism is unknown, it is presumed that a relatively high Mw suppresses the thermal motion of the molecular chains, resulting in improved flatness. On the other hand, in terms of solvent solubility and other factors, the Mw of the phenoxy resin is preferably 100,000 or less. The weight-average molecular weight is measured, for example, as a polystyrene-converted value using gel permeation chromatography (GPC).

[0064] The phenoxy resin may have reactive groups such as epoxy groups at both ends of the molecular chain or within the molecular chain. The reactive groups in the phenoxy resin are capable of crosslinking with the epoxy groups in the epoxy resin. By using such a phenoxy resin, the solvent resistance and heat resistance of the resin film can be improved.

[0065] Preferably, a phenoxy resin that is solid at 25°C is used. Specifically, a phenoxy resin with a non-volatile content of 90% by mass or more is preferred. By using such a phenoxy resin, the mechanical properties of the cured product can be improved.

[0066] The lower limit of the phenoxy resin content is preferably 20 parts by mass or more, more preferably 25 parts by mass or more, and even more preferably 30 parts by mass or more, per 100 parts by mass of epoxy resin or polyamide / polyimide resin. This allows for sufficient flexibility to be obtained. Furthermore, it is thought that the effects of suppressing excessive thermal curing and flattening the film surface due to flow, as described above, will be fully achieved as a presumed mechanism. The upper limit of the phenoxy resin content is preferably 60 parts by mass or less, more preferably 55 parts by mass or less, and even more preferably 50 parts by mass or less, per 100 parts by mass of epoxy resin or polyamide / polyimide resin. This allows the phenoxy resin to dissolve sufficiently in the solvent described later, making it possible to obtain a photosensitive resin composition with excellent coatability.

[0067] The photosensitive resin composition of this embodiment may contain thermoplastic resins other than phenoxy resin. Examples of such thermoplastic resins include polyvinyl acetal resin, (meth)acrylic resin, polyamide resin (e.g., nylon), thermoplastic urethane resin, polyolefin resin (e.g., polyethylene, polypropylene), polycarbonate, polyester resin (e.g., polyethylene terephthalate, polybutylene terephthalate), polyacetal, polyphenylene sulfide, polyether ether ketone, liquid crystal polymer, fluororesin (e.g., polytetrafluoroethylene, polyvinylidene fluoride), modified polyphenylene ether, polysulfone, polyethersulfone, polyarylate, polyamide-imide, polyether-imide, thermoplastic polyimide, and the like. If other thermoplastic resins are used, they may be used alone or in combination of two or more types.

[0068] (Photosensitive agent) The photosensitive resin composition of this embodiment contains a photosensitive agent. Any photosensitive agent can be used that, upon the action of light, alters the solubility of the photosensitive resin composition in a developer solution and / or cures the photosensitive composition.

[0069] As an example, the photosensitive agent preferably contains a photocationic polymerization initiator. In particular, the photocationic polymerization initiator is preferably used when the resin contains an epoxy resin. The active species generated from the photocationic polymerization initiator polymerize the epoxy groups in the epoxy resin in a chain reaction through a so-called chemical amplification mechanism. This then leads to a change in solubility in the developer / curing.

[0070] Specific examples of photocationic polymerization initiators include onium salt compounds. More specifically, these include iodonium salts such as diazonium salts and diaryliodonium salts, sulfonium salts such as triarylsulfonium salts, triarylpyryllium salts, benzylpyridinium thiocyanate, dialkylphenacylsulfonium salts, and dialkylhydroxyphenylphosphonium salts, which are photoacid generators or cationic photopolymerization initiators. In particular, from the viewpoint of patterning properties, it is preferable to use a triarylsulfonium salt.

[0071] Examples of counteranions for onium salt compounds include borate anions, sulfonate anions, gallate anions, phosphorus anions, and antimony anions. More specifically, examples include sulfonate anions, disulfonylimide anions, hexafluorophosphate anions, fluoroantimonate anions, tetrafluoroborate anions, and tetrakis(pentafluorophenyl)borate anions.

[0072] As another example, the photosensitive agent preferably contains a photoradical polymerization initiator. Photoradical generators are particularly effective in polymerizing photosensitive resin compositions that contain the polyfunctional (meth)acrylate compounds described later.

[0073] The photoradical generators that can be used are not particularly limited, and known ones can be used as appropriate. For example, 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-[4-(2-hydroxyethoxy)phenyl]-2-hydroxy-2-methyl-1-propan-1-one, 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropionyl)benzyl]phenyl}-2-methylpropan-1-one, 2-methyl-1-(4-methylthiophenyl Alkylphenone compounds such as (L)-2-morpholinopropane-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone; benzophenone compounds such as benzophenone, 4,4′-bis(dimethylamino)benzophenone, 2-carboxybenzophenone; benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl Benzoin compounds such as benzoin ether and benzoin isobutyl ether; thioxanthone compounds such as thioxanthone, 2-ethylthioxanthone, 2-isopropylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, and 2,4-diethylthioxanthone; 2-(4-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-ethoxynaphthyl)-4,6-bis( Halomethylated triazine compounds such as lichloromethyl)-s-triazine and 2-(4-ethoxycarbokynylnaphthyl)-4,6-bis(trichloromethyl)-s-triazine; halomethylated oxadiazole compounds such as 2-trichloromethyl-5-(2′-benzofuryl)-1,3,4-oxadiazole, 2-trichloromethyl-5-[β-(2′-benzofuryl)vinyl]-1,3,4-oxadiazole, 4-oxadiazole, and 2-trichloromethyl-5-furyl-1,3,4-oxadiazole;Biimidazole compounds such as 2,2′-bis(2-chlorophenyl)-4,4′,5,5′-tetraphenyl-1,2′-biimidazole, 2,2′-bis(2,4-dichlorophenyl)-4,4′,5,5′-tetraphenyl-1,2′-biimidazole, and 2,2′-bis(2,4,6-trichlorophenyl)-4,4′,5,5′-tetraphenyl-1,2′-biimidazole; 1,2-octanedione, 1-[4-(phenylthio)phenyl]-2-(O-benzoyloxime), ethanone, Examples include oxime ester compounds such as 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-,1-(O-acetyloxime); titanocene compounds such as bis(η5-2,4-cyclopentadiene-1-yl)-bis(2,6-difluoro-3-(1H-pyrrole-1-yl)-phenyl)titanium; benzoic acid ester compounds such as p-dimethylaminobenzoic acid and p-diethylaminobenzoic acid; and acridine compounds such as 9-phenylacridine. Among these, oxime ester compounds are particularly preferred.

[0074] If the photosensitive resin composition contains a photosensitive agent, it may contain only one type of photosensitive agent or two or more types. The photosensitive agent content is, for example, 0.3 to 5.0% by mass, preferably 0.5 to 4.5% by mass, and more preferably 1.0 to 4.0% by mass, relative to the total solid content of the photosensitive resin composition. A content of 0.3% by mass or more can improve patternability. Furthermore, a content of 5.0% by mass or less can reduce the ionic components in the film, thereby improving the insulation and reliability of the final film.

[0075] (Polyfunctional (meth)acrylate compounds) The photosensitive resin composition of this embodiment may contain a polyfunctional (meth)acrylate compound. Examples of polyfunctional (meth)acrylate compounds include those having two or more (meth)acryloyl groups in one molecule, without any particular limitations.

[0076] Based on our findings, polyfunctional (meth)acrylate compounds are preferably used in combination with polyamide / polyimide resins. Although the details are unclear, it is thought that when the polyfunctional (meth)acrylate compound cures (polymerizes), a structure is formed in which it is intricately "entangled" with the polyamide resin and / or polyimide resin. In particular, it is presumed that the polyfunctional (meth)acrylate compound, through polymerization, forms a network structure that "envelops" the cyclic skeleton of the polyimide resin having a cyclic skeleton such as an imide ring, or the cyclic skeleton of the polyamide resin, which may have a cyclic skeleton due to ring closure of at least a part of the polyamide structure by heat. It is presumed that the performance of the cured film is improved by the formation of such an intricately entangled structure.

[0077] From the perspective of achieving the intertwined structure described above and obtaining a highly durable and chemically resistant cured film, it is preferable that the polyfunctional (meth)acrylate compound has three or more functional groups. There is no particular upper limit to the number of functional groups in the polyfunctional (meth)acrylate compound, but considering the ease of obtaining raw materials, the upper limit is, for example, 11 functional groups. As a general trend, when polyfunctional (meth)acrylate compounds with a large number of functional groups ((meth)acryloyl groups) are used, the chemical resistance of the cured film tends to improve. On the other hand, when polyfunctional (meth)acrylate compounds with a small number of functional groups ((meth)acryloyl groups) are used, the mechanical properties of the cured film, such as tensile elongation, tend to be good.

[0078] For example, it is preferable that the polyfunctional (meth)acrylate compound contains seven or more functional (meth)acrylate compounds. For example, the polyfunctional (meth)acrylate compound preferably contains a 5-6 functional (meth)acrylate compound. For example, the polyfunctional (meth)acrylate compound preferably includes a 3- to 4-functional (meth)acrylate compound.

[0079] As an example, polyfunctional (meth)acrylate compounds may include compounds represented by the following general formula. In the following general formula, R' is a hydrogen atom or a methyl group, n is 0 to 3, and R is a hydrogen atom or a (meth)acryloyl group. Multiple R's may be the same or different.

[0080] [ka]

[0081] Specific examples of polyfunctional (meth)acrylate compounds include the following. Of course, polyfunctional (meth)acrylate compounds are not limited to these.

[0082] Polyol polyacrylates such as ethylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, and dipentaerythritol hexa(meth)acrylate; epoxy acrylates such as bisphenol A diglycidyl ether di(meth)acrylate and hexanediol diglycidyl ether di(meth)acrylate; and urethane(meth)acrylates obtained by the reaction of polyisocinate with hydroxyl group-containing(meth)acrylates such as hydroxyethyl(meth)acrylate.

[0083] Commercially available products such as Aronix M-400, Aronix M-460, Aronix M-402, Aronix M-510, Aronix M-520 (manufactured by Toagosei Co., Ltd.), KAYARAD T-1420, KAYARAD DPHA, KAYARAD DPCA20, KAYARAD DPCA30, KAYARAD DPCA60, KAYARAD DPCA120 (manufactured by Nippon Kayaku Co., Ltd.), Viscoat #230, Viscoat #300, Viscoat #802, Viscoat #2500, Viscoat #1000, Viscoat #1080 (manufactured by Osaka Organic Chemical Industry Co., Ltd.), NK Ester A-BPE-10, NK Ester A-GLY-9E, NK Ester A-9550, NK Ester A-DPH (manufactured by Shin Nakamura Chemical Industry Co., Ltd.).

[0084] When a photosensitive resin composition contains a polyfunctional (meth)acrylate compound, it may contain only one polyfunctional (meth)acrylate compound, or it may contain two or more polyfunctional (meth)acrylate compounds. In the latter case, it is preferable to use polyfunctional (meth)acrylate compounds with different numbers of functional groups in combination. By using polyfunctional (meth)acrylate compounds with different numbers of functional groups in combination, a more complex "entanglement structure" is created, which is thought to further improve the properties of the cured film. Incidentally, some commercially available polyfunctional (meth)acrylate compounds are mixtures of (meth)acrylates with different numbers of functional groups.

[0085] When using a polyfunctional (meth)acrylate compound, the amount of the polyfunctional (meth)acrylate compound per 100 parts by mass of epoxy resin and / or polyamide / polyimide resin is preferably 50 to 200 parts by mass, more preferably 60 to 150 parts by mass. The amount of polyfunctional (meth)acrylate compound used is not particularly limited, but as described above, by appropriately adjusting the amount used, one or more of the various performance characteristics can be improved. As mentioned above, in the photosensitive resin composition of this embodiment, it is thought that an "entangled structure" of polyamide / polyimide resin and polyfunctional (meth)acrylate is formed upon curing. By appropriately adjusting the amount of polyfunctional (meth)acrylate compound used relative to the polyamide / polyimide resin, it is thought that the polyamide / polyimide resin and the polyfunctional (meth)acrylate compound will entangle appropriately, and the amount of excess components that do not participate in the entanglement will be reduced. As a result, it is thought that the performance will be further improved.

[0086] (Thermal radical initiator) The photosensitive resin composition of this embodiment may contain a thermal radical initiator. It is believed that using a thermal radical initiator further promotes the polymerization reaction of the polyfunctional (meth)acrylate compound described above.

[0087] The thermal radical initiator preferably includes an organic peroxide. Examples of organic peroxides include octanoyl peroxide, lauroyl peroxide, stearoyl peroxide, 1,1,3,3-tetramethylbutyl peroxy 2-ethylhexanoate, oxalic acid peroxide, 2,5-dimethyl-2,5-di(2-ethylhexanoylperoxy)hexane, 1-cyclohexyl-1-methylethyl peroxy 2-ethylhexanoate, t-hexyl peroxy 2-ethylhexanoate, t-butyl peroxy 2-ethylhexanoate, m-toluyl peroxide, benzoyl peroxide, methyl ethyl ketone peroxide, acetyl peroxide, t-butyl hydroperoxide, di-t-butyl peroxide, cumene hydroperoxide, dicumyl peroxide, t-butyl perbenzoate, parachlorobenzoyl peroxide, and cyclohexanone peroxide.

[0088] When using a thermal radical initiator, you may use only one thermal radical initiator, or you may use two or more thermal radical initiators. When a thermal radical initiator is used, the amount is preferably 0.1 to 30 parts by mass, more preferably 1 to 20 parts by mass, per 100 parts by mass of the polyfunctional (meth)acrylate compound.

[0089] (curing catalyst) The photosensitive resin composition of this embodiment may also contain a curing catalyst. The curing catalyst has the function of promoting the reaction of the epoxy resin. By using a curing catalyst, the reaction involving the epoxy resin proceeds sufficiently, and for example, the tensile elongation of the cured film can be further improved.

[0090] Examples of curing catalysts include compounds known as curing catalysts (often also called curing accelerators) for epoxy resins. For example, diazabicycloalkenes such as 1,8-diazabicyclo[5,4,0]undecene-7 and their derivatives; amine compounds such as tributylamine and benzyldimethylamine; imidazole compounds such as 2-methylimidazole; organophosphines such as triphenylphosphine and methyldiphenylphosphine; tetrasubstituted phosphonium salts such as tetraphenylphosphonium·tetraphenylborate, tetraphenylphosphonium·tetrabenzoic acid borate, tetraphenylphosphonium·tetranaphthoyloxyborate, tetraphenylphosphonium·tetranaphthyloxyborate, and tetraphenylphosphonium·4,4'-sulfonyldiphenolate; and triphenylphosphine adducted with benzoquinone. Among these, organophosphines are particularly preferred.

[0091] When a curing catalyst is used, the amount is, for example, 1 to 80 parts by mass, preferably 5 to 50 parts by mass, per 100 parts by mass of epoxy resin. Incidentally, if the photosensitive resin composition of this embodiment is of the chemical amplification type, and curing proceeds by the active species generated by light irradiation triggering a chain reaction of chemical reactions, the photosensitive resin composition of this embodiment usually does not contain a curing catalyst.

[0092] (Adhesion enhancer) The photosensitive resin composition of this embodiment preferably contains an adhesion aid. This can, for example, further improve adhesion to the substrate.

[0093] The adhesion aid is not particularly limited. For example, silane coupling agents such as amino group-containing silane coupling agents, epoxy group-containing silane coupling agents, (meth)acryloyl group-containing silane coupling agents, mercapto group-containing silane coupling agents, vinyl group-containing silane coupling agents, ureido group-containing silane coupling agents, and sulfide group-containing silane coupling agents can be used. When using silane coupling agents, one type may be used alone, or two or more types may be used in combination.

[0094] Examples of amino group-containing silane coupling agents include bis(2-hydroxyethyl)-3-aminopropyltriethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, γ-aminopropylmethyldiethoxysilane, γ-aminopropylmethyldimethoxysilane, N-β(aminoethyl)γ-aminopropyltrimethoxysilane, N-β(aminoethyl)γ-aminopropyltriethoxysilane, N-β(aminoethyl)γ-aminopropylmethyldimethoxysilane, N-β(aminoethyl)γ-aminopropylmethyldiethoxysilane, and N-phenyl-γ-aminopropyltrimethoxysilane. Examples of epoxy group-containing silane coupling agents include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and γ-glycidylpropyltrimethoxysilane. Examples of silane coupling agents containing a (meth)acryloyl group include γ-((meth)acryloyloxypropyl)trimethoxysilane, γ-((meth)acryloyloxypropyl)methyldimethoxysilane, and γ-((meth)acryloyloxypropyl)methyldiethoxysilane. Examples of mercapto group-containing silane coupling agents include 3-mercaptopropyltrimethoxysilane. Examples of vinyl group-containing silane coupling agents include vinyltris(β-methoxyethoxy)silane, vinyltriethoxysilane, and vinyltrimethoxysilane. Examples of ureido group-containing silane coupling agents include 3-ureidopropyltriethoxysilane. Examples of sulfide group-containing silane coupling agents include bis(3-(triethoxysilyl)propyl) disulfide and bis(3-(triethoxysilyl)propyl) tetrasulfide. Examples of acid anhydride-containing silane coupling agents include 3-trimethoxysilylpropyl succinic anhydride, 3-triethoxysilylpropyl succinic anhydride, and 3-dimethylmethoxysilylpropyl succinic anhydride.

[0095] In addition to silane coupling agents, titanium coupling agents and zirconium coupling agents can also be used as adhesion enhancers.

[0096] When adhesion aids are used, they may be used alone or in combination of two or more adhesion aids. When an adhesion aid is used, the amount used is preferably 0.3 to 5% by mass, more preferably 0.4 to 4% by mass, and even more preferably 0.5 to 3% by mass, based on the total amount of non-volatile components of the photosensitive resin composition.

[0097] (Surfactants) The photosensitive resin composition of this embodiment preferably contains a surfactant. This can further improve the coatability of the photosensitive resin composition and the flatness of the film. Examples of surfactants include fluorine-based surfactants, silicone-based surfactants, alkyl-based surfactants, and acrylic-based surfactants.

[0098] The surfactant preferably contains at least one of a fluorine atom and a silicon atom. This contributes to obtaining a uniform resin film (improved coatability), improved developability, and improved adhesive strength. From another perspective, it is preferable that the surfactant is nonionic. The use of a nonionic surfactant is preferable, for example, in that it suppresses unintentional reactions with other components in the composition and improves the storage stability of the composition.

[0099] Commercially available products that can be preferably used as surfactants include, for example, the "Megafac" series from DIC Corporation: F-251, F-253, F-281, F-430, F-477, F-551, F-552, F-553, F-554, F-555, F-556, F-557, F-558, F-559, F-560, F-561, F-562, F-563, F-565, F- Examples include fluorine-containing oligomer surfactants such as 568, F-569, F-570, F-572, F-574, F-575, F-576, R-40, R-40-LM, R-41, and R-94; fluorine-containing nonionic surfactants such as Futergent 250 and Futergent 251 manufactured by Neos Co., Ltd.; and silicone-based surfactants such as the SILFOAM® series (e.g., SD 100 TS, SD 670, SD 850, SD 860, SD 882) manufactured by Wacker Chemie. Furthermore, FC4430 and FC4432 manufactured by 3M can also be cited as preferred surfactants.

[0100] When a surfactant is used, its amount is, for example, 0.001 to 1% by mass, preferably 0.005 to 0.5% by mass, based on the total amount of non-volatile components of the photosensitive resin composition.

[0101] (water) The photosensitive resin composition of this embodiment may contain water. The presence of water tends to facilitate the hydrolysis reaction of the silane coupling agent, for example, and improve the adhesion between the substrate and the cured film.

[0102] If the photosensitive resin composition of this embodiment contains water, the amount is preferably 0.1 to 5 parts by mass, more preferably 0.2 to 3 parts by mass, and even more preferably 0.5 to 2 parts by mass, based on 100 parts by mass of the total solid content (non-volatile components) of the photosensitive resin composition. The water content of the photosensitive resin composition can be quantified by the Karl Fischer method.

[0103] (Properties of the solvent / composition) The photosensitive resin composition of this embodiment preferably contains a solvent. This allows for easy formation of a photosensitive resin film on a substrate by coating. Solvents typically include organic solvents. The solvent is not particularly limited, as long as it can dissolve or disperse each of the above-mentioned components and does not substantially react chemically with each component.

[0104] Specific examples of solvents include, for example, N-methyl-2-pyrrolidone, γ-butyrolactone, N,N-dimethylacetamide, dimethyl sulfoxide, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dibutyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, methyl lactate, ethyl lactate, butyl lactate, methyl-1,3-butylene glycol acetate, 1,3-butylene glycol-3-monomethyl ether, methyl pyruvate, ethyl pyruvate, and methyl-3-methoxypropionate. Solvents may be used individually or in combination.

[0105] When the photosensitive resin composition of this embodiment contains a solvent, the photosensitive resin composition of this embodiment is usually varnish-like. More specifically, the photosensitive resin composition of this embodiment is preferably a varnish-like composition in which the resin and photosensitive agent are dissolved in a solvent. Because the photosensitive resin composition of this embodiment is varnish-like, a uniform film can be formed by coating. Furthermore, because the resin is "dissolved" in the solvent, a homogeneous cured film can be obtained.

[0106] When using a solvent, the concentration of total solids (non-volatile components) in the photosensitive resin composition is preferably 10 to 50% by mass, more preferably 20 to 45% by mass. This range allows for sufficient dissolution or dispersion of each component. Furthermore, it ensures good coatability, leading to improved flatness during spin coating. Additionally, the viscosity of the photosensitive resin composition can be appropriately controlled by adjusting the content of non-volatile components.

[0107] (Other ingredients) The photosensitive resin composition of this embodiment may contain other components in addition to the above components, as needed. Examples of such components include antioxidants, filler particles such as silica, sensitizers, and film-forming agents. However, due to tensile elongation performance considerations, it is preferable that the photosensitive resin composition of this embodiment does not contain filler particles.

[0108] (Additional information) The photosensitive resin composition of this embodiment is preferably a negative type, that is, one in which solubility in the developer decreases due to a curing (crosslinking) reaction caused by exposure. It is believed that reducing the number of particles in a negative type photosensitive resin composition reduces the inhibition of the curing (crosslinking) reaction by the presence of particles. In other words, the effect of "good tensile elongation characteristics" due to the reduction in the number of particles is considered to be particularly obtainable in a negative type photosensitive resin composition.

[0109] The photosensitive resin composition of this embodiment is preferably of the chemical amplification type, that is, a chain reaction occurs due to the activation species generated from the photosensitive agent, which changes the solubility in the developer (in the case of the negative type, the solubility in the developer decreases). It is thought that reducing the number of particles in the chemical amplification type photosensitive resin composition makes it less likely for the chain reaction to be inhibited. As a result, it is thought that the tensile elongation properties of the resulting permanent film will be further improved.

[0110] <Method for producing a photosensitive resin composition> The photosensitive resin composition of this embodiment can be manufactured by selecting an appropriate manufacturing method and manufacturing conditions. Specifically, the photosensitive resin composition of this embodiment can be manufactured by a filtration process using a hollow fiber membrane filter with a pore size of 0.5 μm or less. That is, by filtering the photosensitive resin composition obtained by mixing the above components (resin, photosensitive agent, solvent, etc.) with a hollow fiber membrane filter with a pore size of 0.5 μm or less, it is possible to manufacture a photosensitive resin composition in which the number of particles with a diameter of 0.5 to 20 μm, counted in a 1 minute measurement at a flow rate of 3 g / min, is 100 or less. Our findings indicate that hollow fiber membrane filters have a higher ability to capture particles generated in photosensitive resin compositions for permanent film formation compared to other filters such as membrane filters.

[0111] The pore size of the hollow fiber membrane filter is preferably 0.05 μm or more and 0.5 μm or less, more preferably 0.05 μm or more and 0.3 μm or less. The membrane surface area of ​​a hollow fiber membrane filter depends on the total amount and flow rate of the photosensitive resin composition being filtered, but from the viewpoint of reducing clogging, for example, 5000 cm² is considered appropriate. 2 Preferably 10,000 cm 2 More preferably 15,000 cm² 2 That concludes the explanation. There is no specific upper limit on the membrane area, but from a cost perspective, the upper limit could be, for example, 50,000 cm². 2 Specifically, 40,000 cm 2 More specifically, 30,000 cm 2 That is the case. The material of the hollow fiber membrane filter is preferably polyolefin, more preferably polypropylene. Various information regarding hollow fiber membrane filters is usually found in catalogs and specifications.

[0112] The filtration process may be performed only once or multiple times. In the case of performing the filtration process multiple times, the specific method may be recirculating filtration. Furthermore, the filtration process may be a multi-stage filtration process including a pre-filtration process using a filter with a relatively large pore size and a main filtration process using a filter with a relatively small pore size. In this case, a hollow fiber membrane filter with a pore size of 0.5 μm or less is used in at least the main filtration. The filter used in the pre-filtration is usually selected to have a larger pore size than the filter used in the main filtration. The filter used in the pre-filtration may be a hollow fiber membrane filter or a filter other than a hollow fiber membrane filter, such as a membrane filter.

[0113] The filtration flow rate is not particularly limited. For example, it can be set appropriately within a range of approximately 10 to 1000 g / min, taking into account the viscosity of the photosensitive resin composition, the concentration of nonvolatile components, the pore size and membrane area of ​​the filter, and the manufacturing efficiency. Incidentally, in the multi-stage filtration process described above, the flow rate may be changed between the pre-filtration and main filtration processes. In this case, the flow rate in the pre-filtration process is usually made greater than the flow rate in the main filtration process.

[0114] Hollow fiber membrane filters are available, for example, from KITZ Microfilter Corporation.

[0115] <Manufacturing methods for electronic devices, electronic devices> An electronic device (an electronic device comprising a film formed from the photosensitive resin composition) can be manufactured using the photosensitive resin composition of this embodiment. For example, an electronic device can be manufactured by a method for manufacturing an electronic device that includes: (i) a film-forming step of forming a photosensitive resin film on the surface of a substrate having steps on its surface using the photosensitive resin composition of this embodiment; (ii) an exposure step of exposing the photosensitive resin film to light; and (iii) a developing step of developing the exposed photosensitive resin film.

[0116] An example of an electronic device manufacturing method will be explained in more detail with reference to Figures 1A to 1D. Using the electronic device manufacturing method described here, a permanent film can be formed in contact with metal components such as copper wiring.

[0117] (Film formation process: Figure 1A) In the film formation process, a photosensitive resin film 3 is formed on the stepped surface of the substrate 1 having the step 10 using the photosensitive resin composition of this embodiment. The substrate 1 is not particularly limited. Examples of substrate 1 include silicon wafers, ceramic substrates, aluminum substrates, SiC wafers, GaN wafers, and the like. Step 10 is, for example, a Cu rewiring. Of course, step 10 may be a step other than a Cu rewiring. The height of step 10 is, for example, 1 to 10 μm, preferably 1 to 5 μm. The thickness of the photosensitive resin film 3 (the thickness of the portion without the step 10) is, for example, 1 to 15 μm, preferably 1 to 10 μm. This thickness only needs to be greater than the height of the step 10.

[0118] Methods for forming the photosensitive resin film 3 include applying a liquid photosensitive resin composition to a substrate by methods such as spin coating, spray coating, immersion, printing, roll coating, and inkjet. Typically, the method for forming the resin film is spin coating. The thickness of the photosensitive resin film 3 can be adjusted by changing the film formation conditions or by adjusting the viscosity of the photosensitive resin composition.

[0119] It is preferable to heat-dry the photosensitive resin film 3 after the film formation process and before the exposure process. This heat-drying process is sometimes called "pre-bake". The heating and drying temperature is typically 50 to 180°C, preferably 60 to 150°C. The heating and drying time is typically 30 to 600 seconds, preferably 30 to 300 seconds. This heating and drying process can sufficiently remove the solvent from the photosensitive resin composition. Heating is typically performed using a hot plate or oven.

[0120] (Exposure process: Figure 1B) In the exposure process, the photosensitive resin film 3 is exposed through the photomask 20. Examples of active light for exposure include X-rays, electron beams, ultraviolet light, and visible light. In terms of wavelength, active light with a wavelength of 200 to 500 nm is preferred. For reasons of pattern resolution and ease of handling the apparatus, the light source is preferably the g-line, h-line, or i-line of a mercury lamp. Alternatively, two or more light rays may be mixed and used. Preferred exposure devices include contact aligners, mirror projection systems, or steppers. The exposure dose in the exposure process is typically 40-1500 mJ / cm². 2 Preferably 80-1000 mJ / cm² 2 The sensitivity of the photosensitive resin composition, the thickness of the resin film, the shape of the pattern to be obtained, and other factors are appropriately adjusted within this range.

[0121] It is preferable to heat the resin film (post-exposure heating) between the exposure and development processes. This allows the reaction of substances (such as photosensitive agents) that have been cleaved or decomposed during exposure to proceed, which can lead to improvements in the pattern shape. The temperature and time for post-exposure heating are, for example, 50-200°C and 10-600 seconds.

[0122] (Developing process: Figure 1C) In the developing process, the photosensitive resin film exposed in the exposure process is developed using a developing solution. This removes a portion of the photosensitive resin film 3, yielding a resin film 3A with an opening 5. The photosensitive resin composition in this embodiment is typically negative type. Therefore, the opening 5 is provided in the portion of the photomask 20 corresponding to the light-shielding area. The development process can be carried out by methods such as immersion, paddle, or rotary spray.

[0123] In this embodiment, the developer preferably contains an organic solvent. More specifically, the developer is preferably a developer whose main component is an organic solvent (a developer in which 95% or more by mass of the components is an organic solvent). Developing with a developer containing an organic solvent makes it possible to suppress swelling of the pattern due to the developer compared to developing with an alkaline developer (water-based). In other words, it is easier to obtain a finer pattern.

[0124] Examples of organic solvents that can be used in developing solutions include ketone solvents such as cyclopentanone, ester solvents such as propylene glycol monomethyl ether acetate (PGMEA) and butyl acetate, and ether solvents such as propylene glycol monomethyl ether. As a developer, an organic solvent developer consisting solely of organic solvents and containing no impurities other than those inevitably present may be used. Note that metal elements are among the unavoidable impurities; however, from the perspective of preventing contamination of electronic devices, it is preferable to have as few unavoidable impurities as possible.

[0125] The development process time is typically within a range of 5 to 300 seconds, preferably 10 to 120 seconds, and is appropriately adjusted based on the thickness of the resin film, the shape of the pattern formed, and other factors.

[0126] Between the developing process and subsequent processes, there may be a curing process, for example, to cure the resin film 3A. Curing can be carried out, for example, by heat treatment at 150-250°C for 30-240 minutes.

[0127] (Additional rewiring process: Figure 1D) In the opening 5 created during the developing process, a Cu rewiring 11 different from the step 10 (for example, Cu rewiring) can be provided. By ensuring good flatness of the upper surface of the resin film 3A, fine Cu rewiring 11 can be provided with high precision.

[0128] The embodiments of the present invention have been described above, but these are merely examples, and various other configurations can be adopted. Furthermore, the present invention is not limited to the embodiments described above, and modifications, improvements, etc., within the scope that can achieve the objectives of the present invention are included in the present invention. [Examples]

[0129] Embodiments of the present invention will be described in detail based on examples and comparative examples. It should be noted that the present invention is not limited to these examples.

[0130] <Examples of epoxy resin use> (Manufacturing of photosensitive resin composition) First, a homogeneous mixture with the composition shown in Table 1 below was obtained.

[0131] [Table 1]

[0132] Epoxy resin EPPN-201 is a compound manufactured by Nippon Kayaku Co., Ltd., represented by the following chemical formula. Epoxy resin LX-01 is a compound manufactured by Osaka Soda Co., Ltd., represented by the following chemical formula. Phenoxy resin PKHA is a compound manufactured by Gabriel Phenoxies, represented by the following chemical formula. The photosensitive agent (photocationic polymerization initiator) CPI-310B is a photoacid generator manufactured by Sunapro, and its cation structure is triaryl(phenyl)sulfonium, and its anionic structure is B(C6F5)4. Surfactant FC4432 is a nonionic fluorine-based surfactant manufactured by 3M. The adhesion aid X-12-967C is 3-trimethoxysilylpropyl succinic anhydride, manufactured by Shin-Etsu Chemical Co., Ltd.

[0133] [ka]

[0134] The above mixture was filtered under the conditions of any of the following Examples 1-1 to 1-3 and Comparative Examples 1-1 to 1-2. Then, a photosensitive resin composition was produced.

[0135] · Example 1-1 The mixture was passed through a hollow fiber membrane filter (product number: F70SC12F-L8, pore size: 0.2 μm, material: polypropylene, membrane area: 20000 cm 2 ) of Kits Microfilter Co., Ltd. at a flow rate of 100 g / min for filtration. · Example 1-2 First, the mixture was passed through a membrane filter (product number: PIAA01P01, pore size: 1.0 μm, material: polyethylene, membrane area: 8000 cm 2 ) of Integra at a flow rate of 100 g / min for filtration, and then subsequently passed through a hollow fiber membrane filter (product number: F70SC12F-L8, pore size: 0.2 μm, material: polypropylene, membrane area: 20000 cm 2 ) of Kits Microfilter Co., Ltd. at a flow rate of 100 g / min for filtration. · Example 1-3 First, the mixture was subjected to three cycles of circulation filtration at a flow rate of 1000 g / min using a membrane filter (product number: PIAH01P01, pore size: (此处原文有误,推测为0.5μm), material: polyethylene, membrane area: 8000 cm 2 ) of Integra. The mixture after the circulation filtration was passed through a hollow fiber membrane filter (product number: F70SC12F-L8, pore size: 0.2 μm, material: polypropylene, membrane area: 20000 cm 2 ) of Kits Microfilter Co., Ltd. at a flow rate of 500 g / min for filtration.

[0136] · Comparative Example 1-1 The mixture was passed through a membrane filter (product number: PIAG01P01, pore size: 0.2 μm, material: ultra-high molecular weight polyethylene, membrane area: 8800 cm 2 ) of Integra at a flow rate of 100 g / min for filtration. · Comparative Example 1-2 注:原文中“ 混合物を、まず、インテグリス社のメンブレンフィルター(品番:PIAH01P01、孔径:0.5μm、材質:ポリエチレン、膜面積:8000cm ”中孔径部分原文疑似有误,已在翻译中按推测修正为“0.5μm”。First, the mixture is placed in an Integris membrane filter (product number: PIAA01P01, pore size: 1.0 μm, material: polyethylene, membrane area: 8000 cm²). 2 The material is filtered through a ) at a flow rate of 100g / min, and then subsequently filtered through an Integris membrane filter (product number: PIAG01P01, pore size: 0.2μm, material: ultra-high molecular weight polyethylene, membrane area: 8800cm²). 2 The material was filtered by passing it through a filter at a flow rate of 100g / min.

[0137] (Measurement of particle count) Each photosensitive resin composition was flowed at a flow rate of 3 g / min through a light scattering particle counter using light with a wavelength of 780 nm, and the number of particles with a diameter of 0.5 to 20 μm counted in a 1-minute measurement was counted. For the particle counter, we used the "KS-42 modified" from Rion Co., Ltd.

[0138] (Evaluation of tensile elongation properties) Each photosensitive resin composition was applied to a Si wafer, and the solvent was dried to form a resin film with a thickness of 10 μm. This resin film was cured at 170°C for 2 hours to obtain a cured film. After cooling to room temperature, the wafer was cut into 0.5 mm × 20 mm pieces, and the cured film was peeled off the wafer using an aqueous hydrofluoric acid solution. The peeled cured film was placed in a universal testing machine, and a tensile test was performed at room temperature at a speed of 5 mm / min. The elongation at the breaking point was then measured. Measurements were performed 10 times for each example and comparative example. The table below shows the average value of the elongation at the breaking point obtained from the 10 measurements.

[0139] (Evaluation of adhesion to metal) Evaluation samples were prepared using the following process. Each photosensitive resin composition was applied to a Cu wafer, and the solvent was dried to form a resin film with a thickness of 5 μm. Subsequently, via holes were formed in the photosensitive resin film by exposure and development, and a cured film was obtained by curing at 170°C for 2 hours. Next, residual scum on the resin film was removed using O2 plasma. Subsequently, a Ti layer (thickness 50 nm) and a Cu layer (300 nm) were formed on the substrate as adhesion layers by sputtering. After forming a resist (TMMR® P-W1000T PM, manufactured by Tokyo Ohka Co., Ltd.), electrolytic copper plating was performed to fill the via holes with copper plating, and the resist was removed with a resist stripping solution (ST-120, manufactured by Tokyo Ohka Co., Ltd.) to obtain an evaluation sample.

[0140] Next, the adhesion to the metal was evaluated using the following evaluation method. A simple reflow process was performed on the evaluation samples. After heating on a 260°C hot plate for 5 seconds, the samples were removed from the hot plate and cooled to room temperature. The heating and cooling operation was repeated 10 times. The adhesion state with the metal was confirmed using FIB-SEM. Via holes filled with copper plating were subjected to FIB processing, and the cross-section was observed with SEM to check for delamination at the interface between the resin film and Cu.

[0141] The table below summarizes the results of particle count measurement, tensile elongation performance evaluation, and adhesion evaluation with metal.

[0142] [Table 2]

[0143] As shown in the table above, the tensile elongation properties of the cured film (permanent film) formed from a photosensitive resin composition with a low particle count were better than those formed from a photosensitive resin composition with a low particle count. Furthermore, the cured film (permanent film) formed from a photosensitive resin composition with a low particle count showed good adhesion to metals.

[0144] (Evaluation of patternability) To be on the safe side, we confirmed that the above-mentioned photosensitive resin composition using epoxy resin possesses patterning properties as a "photosensitive resin composition" in the following manner.

[0145] The photosensitive resin composition of Example 1-1 was coated onto an 8-inch silicon wafer using a spin coater. After coating, it was pre-baked in air on a hot plate at 120°C for 3 minutes to obtain a resin film with a thickness of approximately 9 μm. This resin film was irradiated with i-lines through a Toppan Printing Co., Ltd. mask (which had a retained pattern and a cut-out pattern with a width of 1.0 to 100 μm). An i-line stepper (Nikon NSR-4425i) was used for the irradiation. After exposure, the wafer was placed on a hot plate and baked in air at 70°C for 5 minutes. Subsequently, the unexposed areas were dissolved and removed by spray development using propylene glycol monomethyl ether acetate as the developer for 30 seconds. As a result, we were able to obtain a pattern in which only the unexposed areas in the film were selectively removed. In other words, it was confirmed that a "pattern" can be formed by exposure using a photomask.

[0146] Furthermore, patterns could be similarly obtained by using the photosensitive resin compositions of Examples 1-2 and 1-3 instead of the photosensitive resin composition of Example 1-1.

[0147] <Examples using polyamide / polyimide resin> (Synthesis of polymer (A-1)) First, 64.1 g (0.20 mol) of 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl (hereinafter also referred to as TFMB) and 70.9 g (0.22 mol) of benzophenone-3,3',4,4'-tetracarboxylic dianhydride (hereinafter also referred to as BTDA) were placed in a reaction vessel of appropriate size equipped with a stirrer and a condenser. Then, 500 g of GBL was added to the reaction vessel. After aeration with nitrogen for 10 minutes, the temperature was raised to 60°C while stirring and the reaction was allowed to proceed for 1.5 hours. Subsequently, the reaction was further carried out at 180°C for 3 hours to polymerize the diamine and acidic dianhydride, thereby preparing a polyimide solution. The obtained polyimide solution was diluted with acetone to prepare a diluent, and then the diluent was added dropwise to a water / methanol mixture of 1 / 3 to precipitate a white solid. The obtained white solid was collected and vacuum-dried at 120°C. This process yielded polymer (A-1), a polyimide powder having acid anhydride at its ends. The weight-average molecular weight (Mw) of polymer (A-1), as determined by GPC measurement, was 25,000. Also, polymer (A-1) 1 ¹H-NMR measurements were performed, and the imidation rate (defined as above) was calculated from the quantitative values ​​of the amide peak relative to the aromatic ring peak of the polyimide. The imidation rate was 99% or higher.

[0148] The chemical formula for polymer (A-1) is shown below.

[0149] [ka]

[0150] (Manufacturing of photosensitive resin composition) First, the following materials were mixed uniformly to obtain a mixture. ·resin 100 parts by mass of (A-1) above • Polyfunctional (meth)acrylate compounds Viscoat #802 (manufactured by Osaka Organic Industry Co., Ltd., structure represented by the following chemical formula) 80 parts by mass

[0151] [ka]

[0152] • Photosensitive agent Irugacure OXE02 (BASF, oxime ester type photoradical generator) 10 parts by mass • Thermal radical generator Percadox BC (manufactured by Kayaku Nurion Co., Ltd., organic peroxide, cumyl peroxide) 10 parts by mass Epoxy resin TECHMORE VG3101L (manufactured by Printec Co., Ltd.) 7 parts by mass Celoxide 2021P (manufactured by Daicel Corporation) 3 parts by mass ·Curing catalyst 3 parts by mass of tetraphenylphosphonium·4,4'-sulfonyl diphenolate The synthesis method for the above-mentioned curing catalyst is as follows. In a separable flask equipped with a stirrer, 37.5 g (0.15 mol) of 4,4'-bisphenol S and 100 mL of methanol were charged and dissolved by stirring at room temperature. While continuing to stir, a solution of 4.0 g (0.1 mol) of sodium hydroxide dissolved in 50 mL of methanol was added. Next, a solution of 41.9 g (0.1 mol) of tetraphenylphosphonium bromide dissolved in 150 mL of methanol was added. Stirring was continued for a while, and after adding 300 mL of methanol, the solution in the flask was added dropwise to a large amount of water while stirring to obtain a white precipitate. The precipitate was filtered and dried. The target product, a white crystal, was obtained by the above procedure. • Adhesion enhancer (silane coupling agent) KBM-503 (manufactured by Shin-Etsu Chemical Co., Ltd., 3-methacryloxypropyltrimethoxysilane) 5 parts by mass X-12-967C (manufactured by Shin-Etsu Chemical Co., Ltd., structure as described above) 2 parts by mass • Surfactants FC4432 (manufactured by 3M, fluorine-based) 0.1 parts by mass ·Water 2 parts by mass • Solvents (organic solvents) Ethyl lactate (EL) 259 parts by mass γ-Butyrolactone (GBL) 259 parts by mass

[0153] The above mixture was filtered under the conditions of either Example 2-1 or Comparative Example 2-1 below. A photosensitive resin composition was then prepared. Example 2-1 The mixture was placed in a hollow fiber membrane filter (product number: F50C12T-L2, pore size: 0.2 μm, material: polypropylene, membrane area: 20,000 cm²) by Kitz Microfilter Co., Ltd. 2 The material was filtered by passing it through a filter at a flow rate of 50g / min. Comparison Example 2-1 The mixture was placed in an Integris membrane filter (product number: CWUG0S1S3, pore size: 0.2 μm, material: ultra-high molecular weight polyethylene, membrane area: 8800 cm²). 2 The material was filtered by passing it through a filter at a flow rate of 50g / min.

[0154] (Measurement of particle count) The measurements were taken in the same manner as in the examples using epoxy resin.

[0155] (Evaluation of tensile elongation properties) Each photosensitive resin composition was applied to a Si wafer, and the solvent was dried to form a resin film with a thickness of 7 μm. This resin film was cured at 200°C for 2 hours under a nitrogen atmosphere (oxygen concentration of 1000 ppm or less) to obtain a cured film. After cooling to room temperature, the wafer was cut into 0.5 mm × 20 mm pieces, and the cured film was peeled off the wafer with an aqueous hydrofluoric acid solution. The peeled cured film was set in a universal testing machine, and a tensile test was performed at room temperature at a speed of 5 mm / min. The elongation at the breaking point was then measured. Measurements were performed 10 times for each example and comparative example. The table below shows the average value of the elongation at the breaking point obtained from the 10 measurements.

[0156] The results of particle count measurement and tensile elongation performance evaluation are summarized in the table below.

[0157] [Table 3]

[0158] As shown in the table above, even in polyamide / polyimide resin systems, the tensile elongation properties of cured films (permanent films) formed with photosensitive resin compositions with a low particle count were better than those formed with photosensitive resin compositions with a low particle count. From these results and the results for epoxy resin systems mentioned above, it can be understood that, regardless of the type of resin, a lower particle count in the photosensitive resin composition improves the tensile elongation properties of the permanent film (cured film).

[0159] (Evaluation of patternability) To be on the safe side, we confirmed that the above-mentioned photosensitive resin composition using polyamide / polyimide resin possesses patterning properties as a "photosensitive resin composition" as follows.

[0160] The above-mentioned photosensitive resin composition using polyamide / polyimide resin was applied to an 8-inch silicon wafer using a spin coater to achieve a film thickness of 5 μm after drying. The film was then dried on a hot plate at 100°C for 3 minutes to obtain a photosensitive resin film. This photosensitive resin film was irradiated with i-lines using an i-line stepper (Nikon NSR-4425i) while varying the exposure amount, through a Toppan Printing Co., Ltd. mask (Test Chart No. 1: showing retained and cut-out patterns with widths of 0.5 to 50 μm). The film was then developed using cyclopentanone as the developer for 30 seconds, and dried by spinning it at 2500 RPM for 10 seconds. Through the above process, we were able to create 10 μmΦ via holes in the resin film. In other words, it was confirmed that a "pattern" can be formed by exposure using a photomask. [Explanation of symbols]

[0161] 1 circuit board 3 Photosensitive resin film 3A resin film 5 aperture 10 steps 11 Cu rewiring 20 Photomasks

Claims

1. A thermosetting photosensitive resin composition for permanent film formation, It contains a resin and a photosensitive agent. A photosensitive resin composition in which the number of particles with a diameter of 0.5 to 20 μm, counted in one minute at a flow rate of 3 g / min using a light scattering particle counter with a wavelength of 780 nm, is 100 or less.

2. A photosensitive resin composition according to claim 1, The resin is a photosensitive resin composition comprising one or more resins selected from the group consisting of epoxy resins, polyamide resins, and polyimide resins.

3. A photosensitive resin composition according to claim 1 or 2, The resin is a photosensitive resin composition comprising structural units represented by the following general formula (PA-1) and / or structural units represented by the following general formula (PI-1). 【Chemistry 1】 【Chemistry 2】 In the general formulas (PA-1) and (PI-1), X is a divalent organic group, Y is a tetravalent organic group.

4. A photosensitive resin composition according to claim 3, A photosensitive resin composition in which, in the general formulas (PA-1) and (PI-1), at least one of X and Y is a fluorine atom-containing group.

5. A photosensitive resin composition according to any one of claims 1 to 4, The photosensitive agent is a photosensitive resin composition comprising a photocationic polymerization initiator.

6. A photosensitive resin composition according to any one of claims 1 to 5, A photosensitive resin composition further containing a phenoxy resin.

7. A photosensitive resin composition according to any one of claims 1 to 6, A photosensitive resin composition further containing an adhesion enhancer.

8. A photosensitive resin composition according to any one of claims 1 to 7, A negative-type, photosensitive resin composition.

9. A photosensitive resin composition according to any one of claims 1 to 8, A photosensitive resin composition that is chemically amplified.

10. A photosensitive resin composition according to any one of claims 1 to 9, A photosensitive resin composition used to form a permanent film that is in contact with a metal component.

11. A film-forming step of forming a photosensitive resin film using the photosensitive resin composition according to any one of claims 1 to 9, An exposure step of exposing the photosensitive resin film, A developing step for developing the exposed photosensitive resin film and A method for manufacturing electronic devices including

12. An electronic device comprising a permanent film formed from a photosensitive resin composition according to any one of claims 1 to 9.

13. A method for producing a photosensitive resin composition according to any one of claims 1 to 9, A method for producing a photosensitive resin composition, comprising a filtration step using a hollow fiber membrane filter with a pore size of 0.5 μm or less.

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