Mounting head, component mounting device, and method for controlling the mounting head

Abstract

To provide a mounting head, a component mounting apparatus, and a control method for the mounting head that can perform fluxless mounting while reducing the amount of inert gas used. [Solution] The mounting head comprises a nozzle extending axially and having a suction surface for adsorbing components, a heating section for heating the nozzle, and a chamber surrounding the nozzle and the heating section. The chamber has a first wall that surrounds the nozzle and the heating section from the outside and defines an opening for the suction surface to access the components, and a second wall positioned opposite the opening and extending in a direction intersecting the first wall. The second wall is provided with a first supply port for supplying inert gas into the internal space of the chamber, and the first wall is provided with a projection that protrudes toward the internal space.

Description

Technical Field

[0001] The present disclosure relates to a mounting head, a component mounting apparatus, and a method for controlling the mounting head.

Background Art

[0002] Conventionally, a fluxless mounting technique for mounting chip components on a substrate without using flux has been proposed (for example, Patent Document 1).

[0003] In the mounting apparatus of Patent Document 1, while filling the working space with an inert gas such as nitrogen, plasma is irradiated onto the bonding surface of the chip component to perform a reduction process, and the chip component is mounted on the substrate.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, the mounting apparatus of Patent Document 1 has a problem that the amount of inert gas used increases.

[0006] Therefore, the present disclosure provides a mounting head, a component mounting apparatus, and a method for controlling the mounting head that can perform fluxless mounting while reducing the amount of inert gas used.

Means for Solving the Problems

[0007] A mounting head according to one aspect of the present disclosure is a mounting head for fluxless mounting, comprising: a nozzle extending axially and having a suction surface for adsorbing components; a heating section for heating the nozzle; and a chamber surrounding the nozzle and the heating section, wherein the chamber has a first wall portion that surrounds the nozzle and the heating section from the outside and defines an opening for the suction surface to access the components; and a second wall portion positioned opposite the opening and extending in a direction intersecting the first wall portion, the second wall portion being provided with a first supply port for supplying an inert gas to the internal space of the chamber, and the first wall portion being provided with a projection that protrudes toward the internal space.

[0008] A component mounting apparatus according to one aspect of the present disclosure comprises: a mounting head; a substrate holding stage for holding a substrate; a head moving unit for moving the mounting head laterally; an imaging device for imaging components held by the mounting head; and a reduction processing unit for performing a reduction process on components held by the mounting head using means other than flux.

[0009] A method for controlling a mounting head according to one aspect of the present disclosure comprises a nozzle extending axially and having an adsorption surface for adsorbing a component, a heating unit for heating the nozzle, and a chamber surrounding the nozzle and the heating unit, wherein the chamber has a first wall portion that surrounds the nozzle and the heating unit from the outside and defines an opening for the adsorption surface to access a component, and a second wall portion positioned opposite the opening and extending in a direction intersecting the first wall portion, the second wall portion is provided with a first supply port for supplying an inert gas to the internal space of the chamber, and the first wall portion is provided with a projection that protrudes toward the internal space, and a control unit controls the supply of inert gas from the first supply port. [Effects of the Invention]

[0010] According to the mounting head, component mounting apparatus, and method for controlling the mounting head of this disclosure, fluxless mounting can be performed while reducing the amount of inert gas used. [Brief explanation of the drawing]

[0011] [Figure 1] Schematic side view of a component mounting device having a mounting head of an embodiment. [Figure 2] Block diagram of a component mounting device [Figure 3A] A longitudinal cross-sectional view showing the peripheral configuration of the chamber (first position) of the mounting head. [Figure 3B] A longitudinal cross-sectional view showing the peripheral configuration of the chamber (second position) of the mounting head. [Figure 4] Bottom view of the mounting head [Figure 5] Block diagram of the mounting head [Figure 6A] Flowchart showing component mounting process by component mounting equipment [Figure 6B] Flowchart showing component mounting process by component mounting equipment [Figure 7A] Schematic diagrams illustrating the component mounting process using flowcharts in Figures 6A and 6B. [Figure 7B] Schematic diagrams illustrating the component mounting process using flowcharts in Figures 6A and 6B. [Figure 7C] Schematic diagrams illustrating the component mounting process using flowcharts in Figures 6A and 6B. [Figure 7D] Schematic diagrams illustrating the component mounting process using flowcharts in Figures 6A and 6B. [Figure 7E] Schematic diagrams illustrating the component mounting process using flowcharts in Figures 6A and 6B. [Figure 7F] Schematic diagrams illustrating the component mounting process using flowcharts in Figures 6A and 6B. [Figure 7G] Schematic diagrams illustrating the component mounting process using flowcharts in Figures 6A and 6B. [Figure 7H] Schematic diagrams illustrating the component mounting process using flowcharts in Figures 6A and 6B. [Figure 7I] Schematic diagrams illustrating the component mounting process using flowcharts in Figures 6A and 6B.

Best Mode for Carrying Out the Invention

[0012] According to a first aspect of the present disclosure, there is provided a mounting head for performing fluxless mounting, comprising: a nozzle having a suction surface for sucking a component and extending in an axial direction; a heating unit for heating the nozzle; and a chamber surrounding the nozzle and the heating unit, wherein the chamber surrounds the nozzle and the heating unit from the outside, and has a first wall portion defining an opening for the suction surface to access a component, and a second wall portion disposed at a position facing the opening and extending in a direction intersecting the first wall portion, and a first supply port for supplying an inert gas toward an internal space of the chamber is provided in the second wall portion, and a protruding portion protruding toward the internal space is provided in the first wall portion.

[0013] According to a second aspect of the present disclosure, there is provided the mounting head according to the first aspect, wherein a supply direction of the inert gas from the first supply port overlaps the protruding portion.

[0014] According to a third aspect of the present disclosure, there is provided the mounting head according to the first or second aspect, wherein a supply direction of the inert gas from the first supply port is parallel to the axial direction.

[0015] According to a fourth aspect of the present disclosure, there is provided the mounting head according to any one of the first to third aspects, wherein the protruding portion forms the opening. <0000​​​​​​​​​According to a seventh aspect of this disclosure, the mounting head according to the fifth or sixth aspect is provided, wherein the direction of supply of the inert gas from the second supply port is perpendicular to the axial direction.

[0019] According to the eighth aspect of this disclosure, the mounting head according to any one of the fifth to seventh aspects is provided, wherein the flow rate of the inert gas from the first supply port is set to be greater than the flow rate of the inert gas from the second supply port.

[0020] According to the ninth aspect of this disclosure, a mounting head according to any one of the fifth to eighth aspects is provided, wherein when a component adsorbed on the adsorption surface is mounted on a substrate, the supply of inert gas from the second supply port is stopped.

[0021] According to a tenth aspect of the present disclosure, a mounting head according to any one of the first to ninth aspects is provided, further comprising a chamber lifting unit for raising and lowering the chamber relative to the nozzle, wherein the chamber lifting unit raises and lowers the chamber between a first position in which the suction surface is located within the internal space and a second position in which the suction surface is located outside the internal space.

[0022] According to an eleventh aspect of this disclosure, a mounting head according to the tenth aspect is provided, wherein when mounting a component adsorbed on the adsorption surface onto a substrate, the chamber is positioned at the second position.

[0023] A twelfth aspect of this disclosure provides a component mounting apparatus comprising: a mounting head as described in any one of the first to eleventh aspects; a substrate holding stage for holding a substrate; a head moving unit for moving the mounting head laterally; an imaging device for imaging a component held by the mounting head; a reduction processing unit for performing a reduction process on the component held by the mounting head using means other than flux; and a control unit.

[0024] A thirteenth aspect of the present disclosure provides a method for controlling a mounting head, comprising: a nozzle extending axially and having an adsorption surface for adsorbing a component; a heating unit for heating the nozzle; and a chamber surrounding the nozzle and the heating unit, wherein the chamber has a first wall portion that surrounds the nozzle and the heating unit from the outside and defines an opening for the adsorption surface to access a component; and a second wall portion positioned opposite the opening and extending in a direction intersecting the first wall portion, the second wall portion being provided with a first supply port for supplying an inert gas to the internal space of the chamber, and the first wall portion being provided with a projection that protrudes toward the internal space, and a control unit controlling the supply of inert gas from the first supply port.

[0025] According to a fourteenth aspect of this disclosure, the protruding portion is provided with a second supply port for supplying an inert gas, and when a component adsorbed on the adsorption surface is mounted on a substrate, the control unit controls the supply of the inert gas from the second supply port to be stopped, thereby providing a control method for a mounting head as described in the thirteenth aspect.

[0026] According to a 15th aspect of the present disclosure, the mounting head further comprises a chamber lifting unit for raising and lowering the chamber relative to the nozzle, the chamber lifting unit raises and lowers the chamber between a first position in which the suction surface is located within the internal space and a second position in which the suction surface is located outside the internal space, and when mounting a component adsorbed on the suction surface onto a substrate, the control unit controls the chamber to be positioned at the second position, providing a control method for the mounting head according to the 13th or 14th aspect.

[0027] (Embodiment) The embodiments will be described below with reference to the drawings.

[0028] Figure 1 is a schematic side view showing an example of a component mounting apparatus 100 having a mounting head 6 according to an embodiment of the present disclosure. The X, Y, and Z directions in the figure represent the width, depth, and height directions of the component mounting apparatus 100.

[0029] The component mounting apparatus 100 shown in Figure 1 is a device that manufactures a mounted substrate by mounting component A onto substrate B. The component mounting apparatus 100 of this embodiment is a fluxless component mounting apparatus that does not use flux, and component A is a chip component with bumps. Before mounting component A onto substrate B, the fluxless component mounting apparatus 100 reduces the bonding surface of component A using a reduction treatment means such as atmospheric pressure plasma. The bonding surface is the surface of the bump of component A.

[0030] The component mounting apparatus 100 comprises a component supply unit 2, a pickup head 4, a mounting head 6, a substrate holding stage 8, an imaging device 10, a plasma irradiation device 12, and a control unit 13.

[0031] The component supply unit 2 is a component that supplies component A. In the example shown in Figure 1, multiple component A are placed on the upper surface of the component supply unit 2, and component A is picked up sequentially by the pickup head 4.

[0032] The pickup head 4 is a head that picks up component A supplied by the component supply unit 2. The pickup head 4, for example, attracts and holds component A. The pickup head 4 also has a function to invert upside down. After picking up component A, the pickup head 4 inverts upside down and transfers component A to the mounting head 6 in an upward-facing state.

[0033] The mounting head 6 is a head that mounts component A, received from the pickup head 4, onto the substrate B. For example, the mounting head 6 holds component A by suction. The mounting head 6 is supported by a head support 7 so as to be movable in the horizontal direction. The mounting head 6 is movable between a component receiving position where it receives component A from the pickup head 4 and a component mounting position above the substrate B.

[0034] The mounting head 6 of this embodiment has a chamber 16. The chamber 16 is a member that covers the area around the nozzle 26 for adsorbing the component A in the mounting head 6. The component mounting apparatus 100 of this embodiment can maintain a state in which oxidation of the bonding surface of the component A held by the mounting head 6 is suppressed by filling the internal space of the chamber 16 with an inert gas.

[0035] With this configuration, since it is only necessary to continuously supply inert gas to the internal space of the chamber 16, the amount of inert gas used can be reduced compared to when inert gas is supplied to the entire working space of the component mounting device 100.

[0036] Furthermore, the component mounting device 100 is equipped with a down-blow system, ensuring that clean air circulates throughout the entire workspace.

[0037] The substrate holding stage 8 is a stage that holds substrate B. The substrate holding stage 8 has functions such as heating substrate B and moving it in the XY direction.

[0038] The imaging device 10 is a device that images component A, held by the mounting head 6, from below. The imaging device 10 is, for example, a camera.

[0039] The plasma irradiation device 12 is a device that irradiates the component A held in the mounting head 6 with atmospheric pressure plasma. By irradiating the joint surface of component A with atmospheric pressure plasma, the oxide film on the joint surface of component A can be removed and reduced. The plasma irradiation device 12 is an example of a reduction treatment unit. Not limited to atmospheric pressure plasma, any reduction treatment unit that can reduce the joint surface of component A using means other than flux may be used (for example, a unit that reduces by supplying vaporized formic acid, or a unit that reduces by supplying hydrogen gas).

[0040] As shown in Figure 1, the imaging device 10 and the plasma irradiation device 12 are mounted on the base 14 and positioned adjacent to the substrate holding stage 8. In the example shown in Figure 1, the plasma irradiation device 12 is positioned closer to the substrate holding stage 8 than the imaging device 10. However, the positions of the imaging device 10 and the plasma irradiation device 12 may be swapped.

[0041] The plasma irradiation device 12 is not limited to being mounted on the base 14; it may be placed in any other location as long as it can irradiate the component A held by the mounting head 6 with atmospheric pressure plasma. For example, the plasma irradiation device may be suspended from a Y-axis head movement section that allows the mounting head 6 to move in the Y-axis direction.

[0042] The control unit 13 is a component that controls the operation of the component mounting device 100. The control unit 13 is electrically connected to each component of the component mounting device 100 and controls each component. The control unit 13 can be composed of, for example, a microcontroller, CPU, MPU, GPU, DSP, FPGA, or ASIC. The functions of the control unit 13 may be composed of hardware alone, or they may be realized by a combination of hardware and software. The control unit 13 realizes predetermined functions by reading data and programs stored in a storage unit such as memory and performing various arithmetic processing.

[0043] Figure 2 is a block diagram of the component mounting device 100.

[0044] As shown in Figure 2, the component mounting apparatus 100 further includes a pickup head moving unit 20, a mounting head moving unit 22, and a table moving unit 24.

[0045] The pickup head moving section 20 is a component for moving the pickup head 4. The pickup head moving section 20 has the function of moving the pickup head 4 linearly and the function of rotating it. The pickup head moving section 20 may have a motor or the like as a drive unit.

[0046] The mounting head moving unit 22 is a component for moving the mounting head 6. The mounting head moving unit 22 has the function of moving the mounting head 6 horizontally and the function of raising and lowering it in the Z direction. The mounting head moving unit 22 may have a motor or the like as a drive unit.

[0047] The table moving section 24 is a component for moving the substrate holding stage 8. The table moving section 24 has the function of moving the substrate holding stage 8 in the XY direction.

[0048] Next, the peripheral configuration of the chamber 16 of the mounting head 6 will be explained using Figures 3A, 3B, 4, and 5. Note that the bump of component A is omitted from the following figures.

[0049] Figures 3A and 3B are XZ cross-sectional views showing the peripheral configuration of the chamber 16 of the mounting head 6, respectively, and depict the chamber 16 at different heights. Figure 4 is a bottom view of the mounting head 6 as seen in the +Z direction.

[0050] Figures 3A and 3B illustrate the state in which part A is adsorbed onto the nozzle 26, while in Figure 4, the illustration of part A is omitted.

[0051] As shown in Figures 3A and 3B, the mounting head 6 has a nozzle 26, a heater 28, and a block 29 as components positioned inside the chamber 16.

[0052] The nozzle 26 is a component having a suction surface 27 for adsorbing part A. The suction surface 27 is provided with suction holes for adsorbing part A by negative pressure. The nozzle 26 is attached to the lower end of the heater 28.

[0053] The heater 28 is a component for heating the nozzle 26 and is an example of a heating element. By heating the nozzle 26 with the heater 28, the component A that is adsorbed onto the nozzle 26 is heated, and the bump, which is the bonding surface of component A, can be bonded to the electrode pad of the substrate B. The heater 28 is attached to the lower end of the block 29.

[0054] Block 29 is a block that supports the heater 28 and the nozzle 26. Block 29 is connected to the main body / block of the mounting head 6 (not shown).

[0055] The nozzle 26, heater 28, and block 29 all extend in the Z direction, which corresponds to the axial direction of the mounting head 6.

[0056] The chamber 16 is positioned to surround the nozzle 26, heater 28, and block 29 described above.

[0057] The chamber 16 has an internal space S inside it. An inert gas such as nitrogen is supplied to the internal space S, suppressing oxidation of the bonding surface of the component A adsorbed on the adsorption surface 27. The internal space S is a space capable of accommodating the adsorption surface 27 and the component A adsorbed on the adsorption surface 27.

[0058] As shown in Figures 3A, 3B, and 4, the chamber 16 has a first wall portion 30, a second wall portion 32, and a protruding portion 34.

[0059] The first wall portion 30, the second wall portion 32, and the protruding portion 34 are all wall portions that define the internal space S.

[0060] The first wall portion 30 is a wall portion that surrounds the nozzle 26, heater 28, and block 29 in the XY direction. The first wall portion 30 is positioned at a distance from the nozzle 26, heater 28, and block 29 in the XY direction and extends in the Z direction.

[0061] As shown in Figure 4, the first wall portion 30 is provided in an annular shape to surround the entire circumference of the nozzle 26, heater 28, and block 29, and in this embodiment, it is provided on four sides to form a rectangle.

[0062] The second wall portion 32 is connected to the upper end of the first wall portion 30.

[0063] The second wall portion 32 is a wall portion that extends in the XY direction at the upper end of the first wall portion 30. An opening is formed in the second wall portion 32 for the block 29 to pass through, and the block 29 and the second wall portion 32 are relatively able to move up and down. The gap between the block 29 and the second wall portion 32 is set to be small enough so that the inert gas does not escape.

[0064] The second wall portion 32 is provided with a first supply port 35 for supplying inert gas. The first supply port 35 is connected to an inert gas supply source via a first flow path 36 formed inside the chamber 16. In this embodiment, the supply direction B1 of the inert gas from the first supply port 35 is vertically downward (-Z direction).

[0065] As shown in Figure 4, the first supply ports 35 are arranged in a ring shape so as to surround the outer circumference of the second wall portion 32. Multiple first supply ports 35 are arranged in a row with spacing between them on each of the four outer circumferences of the second wall portion 32. In this embodiment, when viewed along the Z direction, the first supply ports 35 overlap the protruding portion 34.

[0066] The protruding portion 34 is a portion that protrudes inward from the lower end of the first wall portion 30. The protruding portion 34 extends in the XY direction, similar to the second wall portion 32. An opening 42 is formed on the inside of the protruding portion 34. The opening 42 is an opening for the nozzle 26 and the component A attracted to the nozzle 26 to access the substrate B.

[0067] The protruding portion 34 is provided with a second supply port 37 for supplying inert gas. The second supply port 37 is connected to an inert gas supply source via a second flow path 38 formed inside the chamber 16. In this embodiment, the second supply port 37 is formed on the end face 39 in the protruding direction of the protruding portion 34, and the supply direction B2 of the inert gas from the second supply port 37 is set to a lateral direction toward the opening 42 (the same as the protruding direction).

[0068] As shown in Figure 4, the protrusions 34, like the first wall portion 30, are provided in an annular shape to surround the entire circumference of the nozzle 26, heater 28, and block 29, and in this embodiment, they are provided on four sides to form a rectangle. On each of the four sides of the protrusions 34, a plurality of second supply ports 37 are arranged in a row at intervals from each other.

[0069] With the above configuration, an inert gas can be supplied from the first supply port 35 to fill the internal space S with inert gas, while an inert gas can be supplied from the second supply port 37 to form an inert gas air curtain at the opening 42. This prevents gases such as oxygen from entering the internal space S of the chamber 16 from the outside, and even when the nozzle 26 is heated to a high temperature (e.g., 200 degrees) by the heater 28, oxidation of the joint surface of the component A adsorbed on the nozzle 26 can be suppressed.

[0070] The chamber 16 in this embodiment further has the function of moving up and down relative to the nozzle 26, heater 28, and block 29. The chamber 16 moves up and down between a first position (arrow F1) shown in Figure 3A and a second position (arrow F2) shown in Figure 3B.

[0071] In the first position shown in Figure 3A, the adsorption surface 27 and the component A adsorbed onto the adsorption surface 27 are placed in the internal space S of the chamber 16.

[0072] In the second position shown in Figure 3B, the adsorption surface 27 and the component A adsorbed onto the adsorption surface 27 protrude below the internal space S of the chamber 16.

[0073] Chamber 16 is positioned in the first position shown in Figure 3A at times different from when component A is mounted on substrate B (for example, during horizontal movement, imaging, plasma irradiation, etc.). When chamber 16 is in the first position, the adsorption surface 27 and component A adsorbed on the adsorption surface 27 are contained within the internal space S, making it easier to suppress oxidation of component A. At this time, by supplying inert gas from both the first supply port 35 and the second supply port 37, it is possible to make it difficult for gases such as oxygen to enter the internal space S.

[0074] The chamber 16 is positioned in the second position shown in Figure 3B when mounting component A onto substrate B. When the chamber 16 is in the second position, the adsorption surface 27 and component A adsorbed onto the adsorption surface 27 protrude below the lower end of the chamber 16, allowing component A to be mounted onto substrate B without the chamber 16 interfering with substrate B. At this time, by supplying inert gas from the first supply port 35 while stopping the supply of inert gas from the second supply port 37, the entrainment of external air due to the reduced gap between the chamber 16 and substrate B can be suppressed.

[0075] The chamber 16 is mounted to the block 29 of the mounting head 6 or another block in a manner that allows it to slide in the Z direction, and is connected to the chamber lifting section 50, which will be described later.

[0076] Figure 5 is a block diagram of the mounting head 6.

[0077] As shown in Figure 5, the mounting head 6 further includes a chamber lifting section 50. The component mounting device 100 further includes a first valve 52, a first flow rate control member 53, a second valve 54, and a second flow rate control member 55 as components related to the first flow path 36 and the second flow path 38. Note that the valves 52, 54 and the flow rate control members 53, 55 may be provided on the mounting head 6.

[0078] The chamber lifting unit 50 is a component that moves the chamber 16 up and down relative to the nozzle 26, etc. The chamber lifting unit 50 raises and lowers the chamber 16 between the first position shown in Figure 3A and the second position shown in Figure 3B. In this embodiment, the chamber lifting unit 50 is an air cylinder. However, it is not limited to an air cylinder; any chamber lifting unit that raises and lowers the chamber 16 between the first position and the second position may be used.

[0079] The first valve 52 is a valve that opens and closes the first flow path 36, which is connected to the first supply port 35. When the first valve 52 opens the first flow path 36, inert gas is supplied from the first supply port 35, and when the first valve 52 closes the first flow path 36, the supply of inert gas from the first supply port 35 is stopped.

[0080] The second valve 54 is a valve that opens and closes the second flow path 38, which is connected to the second supply port 37. When the second valve 54 opens the second flow path 38, inert gas is supplied from the second supply port 37, and when the second valve 54 closes the second flow path 38, the supply of inert gas from the second supply port 37 is stopped.

[0081] The first flow rate control member 53 is a member for adjusting the flow rate of the inert gas flowing through the first flow path 36. The second flow rate control member 55 is a member for adjusting the flow rate of the inert gas flowing through the second flow path 38. In this embodiment, the first flow rate control member 53 and the second flow rate control member 55 are each regulators (pressure reducing valves). Not limited to regulators, any flow rate control member that can adjust the flow rate may be used.

[0082] In this embodiment, the first flow control member 53 and the second flow control member 55 are used to set the respective flow rates such that the flow rate of the first flow path 36 is greater than the flow rate of the second flow path 38. As a result, when inert gas is supplied from both the first supply port 35 and the second supply port 37, as shown in Figure 3A, more inert gas can be filled into the internal space S, thereby enhancing the effect of suppressing oxidation of the joint surface of component A.

[0083] Furthermore, not limited to cases where flow control members 53 and 55 such as regulators are used, the flow rate of the inert gas flowing through each flow path may be set by pre-adjusting the respective flow path cross-sectional areas of the first flow path 36 and the second flow path 38.

[0084] A method for mounting component A onto substrate B (fluxless mounting method) using the mounting head 6 and component mounting apparatus 100 having the above configuration will be explained with reference to Figures 6A, 6B, and 7A to 7I.

[0085] Figures 6A and 6B are flowcharts illustrating an example of the component mounting process of the component mounting device 100. Figures 7A to 7I are schematic side views illustrating each process in the flowcharts shown in Figures 6A and 6B.

[0086] Each of the processes shown in Figures 6A and 6B is executed under the control of the control unit 13.

[0087] The control unit 13 supplies inert gas into the chamber 16 from the first supply port 35 and the second supply port 37 (S1). Specifically, with the chamber 16 positioned in the first position as shown in Figure 3A, the two valves 52 and 54 shown in Figure 5 open two passages 36 and 38, supplying inert gas into the chamber 16 from the first supply port 35 and the second supply port 37. As a result, the internal space S of the chamber 16 is filled with inert gas.

[0088] The control unit 13 moves the mounting head 6 to the component receiving position (S2). Specifically, the control unit 13 drives the mounting head moving unit 22 shown in Figure 2 to move the mounting head 6 to a position where it can receive component A from the pickup head 4, as shown in Figure 7A. At this time, the chamber 16 is moved from the first position shown in Figure 3A to the second position shown in Figure 3B, so that the suction surface 27 of the nozzle 26 protrudes from the lower end surface of the chamber 16.

[0089] The control unit 13 transfers component A from the pickup head 4 to the mounting head 6 (S3). Specifically, the control unit 13 drives the mounting head moving unit 22 shown in Figure 2 to lower the mounting head 6, which is in the component receiving position, and causes component A held by the pickup head 4 to be attracted to the suction surface 27 of the nozzle 26 of the mounting head 6.

[0090] The control unit 13 moves the mounting head 6 to the imaging position (S4). Specifically, the control unit 13 drives the mounting head moving unit 22 shown in Figure 2 to move the mounting head 6 to the imaging position, which is directly above the imaging device 10, as shown in Figure 7B. After transferring the component A from the pickup head 4 to the mounting head 6, the chamber 16 is moved from the second position shown in Figure 3B to the first position shown in Figure 3A, thereby housing the component A in the internal space of the chamber 16.

[0091] The control unit 13 images component A (S5). Specifically, the control unit 13 drives the imaging device 10 shown in Figure 7B to image the area including component A located above. The control unit 13 acquires information regarding the imaging results and uses it for position correction when mounting component A onto the substrate B.

[0092] The control unit 13 moves the mounting head 6 to the plasma irradiation position (S6). Specifically, the control unit 13 drives the mounting head moving unit 22 shown in Figure 2 to move the mounting head 6 to the plasma irradiation position, which is directly above the plasma irradiation device 12, as shown in Figure 7C.

[0093] The control unit 13 irradiates component A with plasma (S7). Specifically, the control unit 13 drives the plasma irradiation device 12 shown in Figure 7C to irradiate component A, which is located above, with atmospheric pressure plasma. This removes the oxide film from the joint surface of component A and performs a reduction treatment.

[0094] The control unit 13 moves the mounting head 6 to the component mounting position (S8). Specifically, the control unit 13 drives the mounting head moving unit 22 shown in Figure 2 to move the mounting head 6 to the component mounting position directly above the substrate B, as shown in Figure 7D. The component mounting position is determined by correcting the pre-programmed mounting position for component A, which is the component to be mounted, using the imaging results acquired in step S5.

[0095] The control unit 13 lowers the mounting head 6 (S9). The control unit 13 drives the mounting head moving unit 22 shown in Figure 2 to lower the mounting head 6 towards the substrate B at high speed, as shown in Figure 7E.

[0096] The control unit 13 switches the speed of the mounting head 6 from high speed to low speed (S10). The control unit 13 controls the mounting head movement unit 22 shown in Figure 2 to change the speed of the mounting head 6, which is descending integrally as indicated by arrow F3 in Figure 7F, from high speed to low speed. The timing of the change from high speed to low speed is set so that the component A held by the mounting head 6 comes relatively close to the substrate B.

[0097] The control unit 13 raises the chamber 16 (S11). Specifically, the control unit 13 drives the chamber lifting unit 50 shown in Figure 5 to raise the chamber 16 from the first position shown in Figure 7F to the second position shown in Figure 7G (arrow F4). As a result, the component A that has been attracted to the nozzle 26 protrudes below the lower end of the chamber 16, making it ready to be mounted on the substrate B.

[0098] The control unit 13 stops the supply of inert gas from the second supply port 37 (S12). Specifically, the control unit 13 stops the supply of inert gas from the second supply port 37 by closing the second flow path 38 using the second valve 54 shown in Figure 5, as shown in Figure 7G. As a result, inert gas is supplied only from the first supply port 35.

[0099] By stopping the supply of inert gas from the second supply port 37, the entrainment of external air due to the reduced gap between the chamber 16 and the substrate B, as shown in Figure 7G, can be suppressed.

[0100] The timing of raising the chamber 16 in step S11 and the timing of stopping the supply of inert gas from the second supply port 37 in step S12 may be simultaneous, or one may come first. The timing may be determined based on information such as the distance D1 between component A and substrate B, or the distance D2 between the lower end of the chamber 16 and substrate B.

[0101] The control unit 13 mounts component A onto substrate B (S13). Specifically, the control unit 13 continues the low-speed descent of the mounting head 6 (arrow F3) to bring component A into contact with substrate B, as shown in Figure 7H. Contact between component A and substrate B may be determined based on the detection result of a contact sensor such as a pressure sensor. After determining that component A has contacted substrate B, the heater 28 is driven for a predetermined time to heat the nozzle 26 and component A to a high temperature, thereby joining the bonding surface of component A to the electrodes on substrate B.

[0102] In this embodiment, heating by the heater 28 is performed in two stages (preheating and main heating). Specifically, the heater 28 is driven from the start of the flowchart shown in Figure 6A to preheat the nozzle 26, and when component A is mounted on the substrate B in step S13, the output of the heater 28 is increased to heat it to a higher temperature (main heating). Preheating allows the nozzle to reach a high temperature in a short time during main heating, thereby reducing the cycle time.

[0103] The control unit 13 raises the mounting head 6 (S14). Specifically, the control unit 13 releases the suction of component A by the nozzle 26 and drives the mounting head moving unit 22 shown in Figure 2 to raise the mounting head 6 overall, as shown in Figure 7I (arrow F5).

[0104] The control unit 13 determines whether or not the next component A is present (S15). Specifically, the control unit 13 determines whether or not the next component A to be installed is present based on a predetermined installation program.

[0105] If the control unit 13 determines that the next component A is present (Yes in S15), it lowers the chamber 16 (S16) and returns it from the second position shown in Figure 7I to the first position shown in Figure 7F. The control unit 13 then resumes supplying inert gas from the second supply port 37 (S17), returning to a state where inert gas is supplied from both the first supply port 35 and the second supply port 37.

[0106] The control unit 13 then executes step S2 again and performs the component mounting process (S2-S14) for the next component A. As long as there are more components A, the control unit 13 repeatedly executes steps S2-S14, S16, and S17, thereby sequentially mounting multiple components A to predetermined component mounting positions on the substrate B.

[0107] If the control unit 13 determines that there is no next component A (No in S15), it terminates the component mounting process.

[0108] According to the above method, by maintaining a state in which inert gas is supplied into the chamber 16, oxidation of the bonding surface of component A adsorbed on the nozzle 26 can be suppressed. In particular, since it is only necessary to supply inert gas to the internal space S of the chamber 16, fluxless mounting can be performed while reducing the amount of inert gas used compared to supplying inert gas to the entire working space of the component mounting apparatus 100.

[0109] In this embodiment, the mounting head 6 is controlled to continuously supply inert gas while the component mounting process is being performed. Although this control results in slightly more inert gas usage compared to when the supply of inert gas is turned on and off, it enhances the effect of suppressing oxidation of the bonding surface of component A.

[0110] At least during the period from when the plasma irradiation device 12 irradiates component A with plasma until component A is mounted on substrate B, re-oxidation of the bonding surface of component A can be effectively suppressed. During other periods, the supply of inert gas may be controlled to be stopped as appropriate.

[0111] In this embodiment, the mounting head 6 preheats by driving the heater 28 even when components are not being mounted, so the nozzle 26 is kept at a high temperature, making the bumps of component A prone to oxidation. Therefore, by continuously supplying an inert gas, oxidation of the bonding surface of component A can be efficiently suppressed, thereby improving the accuracy of component mounting.

[0112] In this embodiment, the mounting head 6 is provided with a protrusion 34 in the chamber 16. By providing the protrusion 34, the downward velocity component of the inert gas supplied from the first supply port 35 can be reduced, directing the inert gas towards the center. This makes it easier to increase the concentration of the inert gas on the adsorption surface 27 of the nozzle 26, thereby improving the effect of suppressing oxidation of the joint surface of part A.

[0113] In this embodiment, the protrusion 34 overlaps the first supply port 35 when viewed from the Z direction. Furthermore, the supply direction B1 of the inert gas from the first supply port 35 is vertically downward and overlaps with the protrusion 34. This configuration makes it easier to control the direction of the inert gas supplied from the first supply port 35 using the protrusion 34.

[0114] Furthermore, in the mounting head 6 of this embodiment, a second supply port 37 is provided on the protruding portion 34. This makes it easier to maintain a state in which the internal space S is filled with inert gas. In addition, the supply direction B2 of the inert gas from the second supply port 37 in this embodiment is horizontal and toward the opening 42. This creates an air curtain at the opening 42, making it easier to maintain a state in which the internal space S is filled with inert gas.

[0115] Furthermore, in the mounting head 6 of this embodiment, the chamber 16 is able to move up and down relative to the nozzle 26, etc., and the position of the chamber 16 is changed depending on the situation. Specifically, at times other than when component A is mounted on the substrate B, the chamber 16 is positioned at the first position shown in Figure 7F, and at the time when component A is mounted on the substrate B, the chamber 16 is positioned at the second position shown in Figures 7G to 7I.

[0116] By positioning the chamber 16 at a first location where the area around component A can be easily filled with an inert gas when not mounting components, oxidation of the bonding surface of component A can be suppressed with greater precision, thereby improving the mounting accuracy of fluxless mounting.

[0117] In this embodiment, when in the first position, inert gas is supplied from both the first supply port 35 and the second supply port 37, and when in the second position, the supply of inert gas from the second supply port 37 is stopped and inert gas is supplied only from the first supply port 35. By stopping the supply of inert gas from the second supply port 37 in the second position, it is possible to suppress the entrainment of external air due to the reduced distance between the chamber 16 and the substrate B.

[0118] In this embodiment, the first flow rate control member 53 and the second flow rate control member 55 are used to set the flow rate of the first flow path 36 to be greater than the flow rate of the second flow path 38. As a result, as shown in Figure 7F, when inert gas is supplied from both the first supply port 35 and the second supply port 37, more inert gas can be filled into the internal space S, thereby enhancing the effect of suppressing oxidation of the joint surface of component A.

[0119] (Effects / Actions) As described above, the mounting head 6 of the embodiment is a mounting head for fluxless mounting, and comprises a nozzle 26 extending in the axial direction (Z direction) having a suction surface 27 for adsorbing a component A, a heater 28 (heating part) for heating the nozzle 26, and a chamber 16 surrounding the nozzle 26 and heater 28. The chamber 16 has a first wall portion 30 that surrounds the nozzle 26 and heater 28 from the outside and defines an opening 42 for the suction surface 27 to access the component A, and a second wall portion 32 positioned opposite the opening 42 and extending in a direction (XY direction) intersecting the first wall portion 30. The second wall portion 32 is provided with a first supply port 35 for supplying inert gas toward the internal space S of the chamber 16, and the first wall portion 30 is provided with a projection 34 that protrudes toward the internal space S.

[0120] With this configuration, by providing the protrusion 34 in the chamber 16, it becomes easier to maintain a state in which the internal space S of the chamber 16 is filled with inert gas, and fluxless mounting can be performed while reducing the amount of inert gas used.

[0121] Furthermore, in the mounting head 6 of this embodiment, the supply direction B1 of the inert gas from the first supply port 35 coincides with the protrusion 34. With this configuration, by restricting the progress of the inert gas with the protrusion 34, the inert gas is more likely to curve and proceed toward the adsorption surface 27 of the nozzle 26, thereby suppressing oxidation of the joint surface of component A.

[0122] Furthermore, in the implementation head 6 of this embodiment, the supply direction B1 of the inert gas from the first supply port 35 is parallel to the axial direction (Z direction). With this configuration, it becomes easier to control the direction of travel of the inert gas.

[0123] Furthermore, in the mounting head 6 of the embodiment, the protruding portion 34 forms an opening 42. With this configuration, the protruding portion 34 forming an opening 42 makes it easier to direct the inert gas bent inward by the protruding portion 34 towards the adsorption surface 27 of the nozzle 26, thereby suppressing oxidation of the joint surface of component A.

[0124] Furthermore, in the implementation head 6 of this embodiment, a second supply port 37 for supplying inert gas is provided in the protruding portion 34. With this configuration, it becomes easier to fill the internal space S of the chamber 16 with inert gas.

[0125] Furthermore, in the implementation head 6 of this embodiment, the second supply port 37 is provided on the end face 39 in the protruding direction of the protruding portion 34. With this configuration, an air curtain is created by the inert gas, making it easier to fill the internal space S of the chamber 16 with the inert gas.

[0126] Furthermore, in the implementation head 6 of this embodiment, the supply direction B2 of the inert gas from the second supply port 37 is perpendicular to the axial direction (Z direction). With this configuration, an air curtain is created by the inert gas, making it easier to fill the internal space S of the chamber 16 with the inert gas.

[0127] Furthermore, in the implementation head 6 of this embodiment, the flow rate of inert gas from the first supply port 35 is set to be greater than the flow rate of inert gas from the second supply port 37. With this configuration, by relatively increasing the flow rate of inert gas from the first supply port 35, it becomes easier to fill the internal space S of the chamber 16 with inert gas.

[0128] Furthermore, in the mounting head 6 of this embodiment, when mounting component A, which has been adsorbed onto the adsorption surface 27, onto substrate B, the supply of inert gas from the second supply port 37 is stopped. With this configuration, by stopping the supply of inert gas from the second supply port 37 when mounting components, it is possible to suppress the entrapment of external air around component A and substrate B.

[0129] Furthermore, the implementation head 6 of the embodiment is further equipped with a chamber lifting unit 50 that raises and lowers the chamber 16 relative to the nozzle 26. The chamber lifting unit 50 raises and lowers the chamber 16 between a first position in which the suction surface 27 is positioned within the internal space S and a second position in which the suction surface 27 is positioned outside the internal space S. With this configuration, the chamber 16 can be positioned in a more appropriate location depending on the situation.

[0130] Furthermore, in the mounting head 6 of this embodiment, when mounting component A, which has been adsorbed onto the suction surface 27, onto the substrate B, the chamber 16 is positioned in a second location. With this configuration, by positioning the chamber 16 in the second location during component mounting, component mounting can be performed while preventing the chamber 16 from interfering with the substrate B.

[0131] As described above, the control method for the mounting head 6 of the embodiment is a control method for the mounting head 6 comprising a nozzle 26 having a suction surface 27 for adsorbing a component A and extending in the axial direction (Z direction), a heater 28 (heating part) for heating the nozzle 26, and a chamber 16 surrounding the nozzle 26 and heater 28, wherein the chamber 16 has a first wall portion 30 that surrounds the nozzle 26 and heater 28 from the outside and defines an opening 42 for the suction surface 27 to access the component A, and a second wall portion 32 positioned opposite the opening 42 and extending in a direction (XY direction) intersecting the first wall portion 30, wherein the second wall portion 32 is provided with a first supply port 35 for supplying inert gas toward the internal space S of the chamber 16, and the first wall portion 30 is provided with a protrusion 34 that protrudes toward the internal space S, and the control unit 13 controls the supply of inert gas from the first supply port 35.

[0132] This method allows for fluxless assembly while reducing the amount of inert gas used.

[0133] Furthermore, in the control method for the mounting head 6 of this embodiment, a second supply port 37 for supplying inert gas is provided on the protruding portion 34, and when mounting component A, which has been adsorbed onto the adsorption surface 27, onto the substrate B, the supply of inert gas from the second supply port 37 is controlled to be stopped. With this method, by stopping the supply of inert gas from the second supply port 37 when mounting components, it is possible to suppress the entrapment of external air around component A and substrate B.

[0134] Furthermore, in the control method for the mounting head 6 of the embodiment, the mounting head 6 further includes a chamber lifting unit 50 that raises and lowers the chamber 16 relative to the nozzle 26. The chamber lifting unit 50 raises and lowers the chamber 16 between a first position in which the suction surface 27 is positioned in the internal space S and a second position in which the suction surface 27 is positioned outside the internal space S. When mounting a component A that has been adsorbed onto the suction surface 27 onto the substrate B, the control unit 13 positions the chamber 16 at the second position. With this method, by positioning the chamber 16 at the second position during component mounting, component mounting can be performed while preventing the chamber 16 from interfering with the substrate B.

[0135] As described above, the component mounting apparatus 100 of the embodiment includes a mounting head 6, a substrate holding stage 8 for holding a substrate B, a mounting head moving unit 22 for moving the mounting head 6 laterally, an imaging device 10 for imaging the component A held by the mounting head 6, a plasma irradiation device 12 (reduction processing unit) for performing a reduction process on the component A held by the mounting head 6 by means other than flux, and a control unit 13. With such a configuration, the mounting accuracy in fluxless mounting can be improved.

[0136] (others) Although the present invention has been described above with reference to the embodiments described above, the present invention is not limited to the embodiments described above. For example, in the above embodiment, a case in which a protrusion 34 is provided at the lower end of the first wall portion 30 of the chamber 16 was described, but the present invention is not limited to this case, and a protrusion may be provided in the middle portion of the first wall portion 30.

[0137] Furthermore, although the above embodiment described a case in which the second supply port 37 is provided on the end face 39 in the protruding direction of the protruding portion 34, the second supply port may be provided at other locations on the protruding portion 34, not limited to this case. For example, in addition to the second supply port 37 on the end face 39, a third supply port may be provided at the lower end of the first wall portion 30. In this case, a valve may be provided to switch between supplying inert gas from the second supply port 37 and supplying inert gas from the third supply port, so as to switch between supplying from the second supply port 37 and supplying from the third supply port depending on the situation.

[0138] While this disclosure is adequately described in relation to preferred embodiments with reference to the accompanying drawings, various variations and modifications will be obvious to those skilled in the art. Such variations and modifications should be understood as being included within the scope of this disclosure as defined by the attached claims. Furthermore, variations in combinations and sequences of elements in each embodiment can be realized without departing from the scope and spirit of this disclosure.

[0139] Furthermore, by appropriately combining any of the above embodiments and various modifications, the effects of each can be achieved. [Industrial applicability]

[0140] The present invention is applicable to mounting heads, component mounting devices, and methods for controlling mounting heads. [Explanation of Symbols]

[0141] 100 component mounting equipment 16 Chambers 26 nozzles 27 Adsorption surface 28 Heater (heating section) 30 1st wall section 32 Second wall section 34 Protrusion 42 Aperture Part A B substrate S interior space

Claims

1. A mounting head for fluxless mounting, A nozzle having a suction surface for adsorbing parts and extending in the axial direction, A heating unit for heating the nozzle, The system comprises the nozzle and the chamber surrounding the heating section, The aforementioned chamber is A first wall portion surrounds the nozzle and the heating portion from the outside, defining an opening for the suction surface to access the component, It has a second wall portion positioned opposite the opening and extending in a direction intersecting the first wall portion, The second wall portion is provided with a first supply port for supplying inert gas to the internal space of the chamber, and the first wall portion is provided with a projection that protrudes toward the internal space. Mounting head.

2. The mounting head according to claim 1, wherein the direction of supply of the inert gas from the first supply port overlaps with the protruding portion.

3. The mounting head according to claim 1, wherein the direction of supply of the inert gas from the first supply port is parallel to the axial direction.

4. The mounting head according to claim 1, wherein the protruding portion forms the opening.

5. The mounting head according to claim 1, wherein the protruding portion is provided with a second supply port for supplying an inert gas.

6. The mounting head according to claim 5, wherein the second supply port is provided on the end face in the protruding direction of the protruding portion.

7. The mounting head according to claim 5, wherein the direction of supply of the inert gas from the second supply port is perpendicular to the axial direction.

8. The mounting head according to claim 5, wherein the flow rate of the inert gas from the first supply port is set to be greater than the flow rate of the inert gas from the second supply port.

9. The mounting head according to claim 5, wherein when mounting a component adsorbed on the adsorption surface onto a substrate, the supply of inert gas from the second supply port is stopped.

10. The chamber further comprises a chamber lifting unit that raises and lowers the chamber relative to the nozzle, The mounting head according to claim 1, wherein the chamber lifting unit lifts the chamber between a first position in which the suction surface is positioned within the internal space and a second position in which the suction surface is positioned outside the internal space.

11. The mounting head according to claim 10, wherein when mounting a component adsorbed on the adsorption surface onto a substrate, the chamber is positioned at the second position.

12. The mounting head according to any one of claims 1 to 11, A substrate holding stage that holds the substrate, A head movement unit that moves the aforementioned mounting head in the lateral direction, An imaging device for imaging a component held in the mounting head, The system includes a reduction processing unit that performs a reduction process on the components held in the mounting head using a means other than flux. Component mounting equipment.

13. A control method for a mounting head comprising: a nozzle extending in the axial direction and having a suction surface for adsorbing parts; a heating unit for heating the nozzle; and a chamber surrounding the nozzle and the heating unit, The aforementioned chamber is A first wall portion surrounds the nozzle and the heating portion from the outside, defining an opening for the suction surface to access the component, It has a second wall portion positioned opposite the opening and extending in a direction intersecting the first wall portion, The second wall portion is provided with a first supply port for supplying inert gas to the internal space of the chamber, and the first wall portion is provided with a projection that protrudes toward the internal space. The control unit controls the supply of inert gas from the first supply port. Control method for the mounting head.

14. The aforementioned protrusion is provided with a second supply port for supplying inert gas. The mounting head control method according to claim 13, wherein when mounting a component adsorbed on the adsorption surface onto a substrate, the control unit controls the supply of inert gas from the second supply port to be stopped.

15. The mounting head further includes a chamber lifting unit that raises and lowers the chamber relative to the nozzle, The chamber lifting mechanism raises and lowers the chamber between a first position in which the suction surface is positioned within the internal space and a second position in which the suction surface is positioned outside the internal space. The mounting head control method according to claim 13, wherein when mounting a component adsorbed on the adsorption surface onto a substrate, the control unit controls the chamber to be positioned at the second position.

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