resin composition

Abstract

To provide a polyimide film with excellent retardation (Rth) and laser peelability, and a resin composition for forming the same. [Solution] A resin composition comprising a resin of a structural unit represented by general formula (9), wherein P4 comprises a structural unit derived from 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) and 9,9-bis(3,4-dicarboxyphenyl)fluorene dianhydride (BPAF), P3 represents a divalent organic group, and p represents a positive integer. TIFF2026123092000102.tif34151

Claims

1. The following general formulas (9) and (10): 【Chemistry 1】 {In the formula, P 3 This indicates a divalent organic group, P 4 The symbol indicates a tetravalent organic group, and p indicates a positive integer. 【Chemistry 2】 {In the formula, P 5 This indicates a divalent organic group, P 6 This indicates a tetravalent organic group, and q is a positive integer. A resin composition comprising a resin of structural units represented by, The aforementioned P 4 or P 6 The following general formulas (3) and (4): 【Transformation 3】 【Chemistry 4】 It contains constituent units derived from the compound represented by, The aforementioned P 4 or P 6 teeth, The following general formula (11): 【Transformation 5】 The following general formula (12): 【Transformation 6】 A resin composition comprising at least one constituent unit derived from a compound represented by [the formula shown].

2. The aforementioned resin is given by the following general formula (15): 【Transformation 7】 {In the formula, each of R 1 , and R 2 independently represents, when there are a plurality of them, a monovalent aliphatic hydrocarbon group having 1 to 5 carbon atoms or a monovalent aromatic group having 6 to 10 carbon atoms, and m represents an integer of 1 to 200.} The resin composition according to claim 1, comprising a structure represented by [the specified formula].

3. The aforementioned P 3 , P 4 , P 5 , P 6 The following general formula (16): 【Transformation 8】 {In the formula, R 3 Each of these is independently a single bond or a divalent organic group having 1 to 10 carbon atoms, R 4 and R 5 Each is independently a monovalent organic group having 1 to 10 carbon atoms, and at least one is a monovalent aliphatic hydrocarbon group having 1 to 5 carbon atoms, R 6 and R 7 Each is independently a monovalent organic group having 1 to 10 carbon atoms, and at least one is a monovalent aromatic group having 6 to 10 carbon atoms, R 8 and R 9 Each of these is independently a monovalent organic group having 1 to 10 carbon atoms, L 1 and L 2 These are, independently, an amino group and an acid anhydride group, i is an integer between 1 and 200, j and k are independently integers between 0 and 200, and 0 ≤ j / (i + j + k) ≤ 0.

50. The resin composition according to claim 1 or 2, comprising a constituent unit derived from a silicon-containing compound represented by .

4. A coating step of applying the resin composition described in claim 1 onto the surface of a support, A film formation step involves heating the resin composition to form a polyimide resin film, A peeling step of peeling the polyimide resin film from the support, A method for producing a polyimide resin film, comprising an irradiation step of irradiating the resin composition with a laser from the support side prior to the peeling step.

5. A coating step of applying the resin composition described in claim 1 onto the surface of a support, A film formation step involves heating the resin composition to form a polyimide resin film, A device formation step in which an element is formed on the polyimide resin film, A peeling step of peeling the polyimide resin film on which the element is formed from the support, A method for manufacturing a display, including the invention of a display.

6. A coating step of applying the resin composition described in claim 1 onto the surface of a support, A film formation step involves heating the resin composition to form a polyimide resin film, A device formation step in which an element is formed on the polyimide resin film, A method for manufacturing a laminate, including the following:

7. The method for manufacturing a laminate according to claim 6, further comprising the step of peeling the polyimide resin film on which the element is formed from the support.

8. A method for manufacturing a flexible device, comprising manufacturing a laminate by the method described in claim 6.

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