Package substrate and its manufacturing method
Patent Information
- Application Number
- JP2026019414
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-17
- Filing Date
- 2026-02-09
- Publication Date
- 2026-08-27
AI Technical Summary
【0020】 上記のように、本発明に係るパッケージ基板及びその製法において、主に該支持構造を該コア層中及び該配線構造中に形成し且つ該外周領域に対応して設置する構成により、各該誘電層の間、及び該誘電層とコア層との間の密着力を強化しているため、従来技術と比較して、各該誘電層の間(或いは該誘電層と該コア層との間)で工程中の高温下においてデラミネーションが発生した際、該支持構造(特に支持ブロック)はデラミネーションの発生を効果的に抑制し、湿気の浸入による電気的機能の損傷や信頼性の低下等の問題を回避することができる。
Smart Images
Figure 2026137657000001_ABST
Abstract
Claims
1. A core layer in which a wiring region and an outer peripheral region surrounding the wiring region are defined, A plurality of conductive pillars formed in the wiring region of the core layer and communicating with opposing sides of the core layer, A wiring layer formed on opposite sides of the core layer and electrically connected to the plurality of conductive pillars, A wiring structure formed on at least one side of the wiring region and the outer peripheral region of the core layer and electrically connected to the wiring layer, A support structure formed within the core layer and the wiring structure and installed corresponding to the outer peripheral region, comprising at least one support column formed within the core layer and at least one support block formed within the wiring structure, wherein the support column is not electrically connected to the wiring layer and the support block is not electrically connected to the wiring structure and the wiring layer, A package substrate characterized by comprising the following features.
2. The package substrate according to claim 1, characterized in that the support block is connected to the support column such that the support structure is stacked, or the support block is not connected to the support column.
3. The package substrate according to claim 1, wherein the support structure includes a plurality of support blocks, and the support structure further includes a connecting pad, the connecting pad is used to stack and connect vertically adjacent support blocks, and if the support structure is of a stacked type, the connecting pad connects the support blocks and the support columns.
4. The package substrate according to claim 1, characterized in that the support block is riveted, grid-like, or frame-like.
5. The package substrate according to claim 1, characterized in that the material of the core layer is an organic material, glass, ceramics, silicon carbide, AlO2, or a composite material having an elastic modulus of 50 to 100 GPa.
6. The steps include providing a core layer in which a wiring region and an outer peripheral region surrounding the wiring region are defined, The steps include forming a plurality of conductive pillars in the wiring region of the core layer and communicating with opposing sides of the core layer, and forming a wiring layer on opposing sides of the core layer and electrically connecting it to the plurality of conductive pillars, The steps include forming a wiring structure on at least one side of the wiring region and the outer peripheral region of the core layer, and electrically connecting the wiring structure to the wiring layer, A step of forming a support structure inside the core layer and inside the wiring structure and installing it in accordance with the outer peripheral region, the support structure comprising at least one support column formed inside the core layer and not electrically connected to the wiring layer, and at least one support block formed inside the wiring structure and not electrically connected to the wiring structure and the wiring layer, A method for manufacturing a package substrate, characterized by including [a specific element].
7. The method for manufacturing a package substrate according to claim 6, characterized in that the support block is connected to the support column such that the support structure is stacked, or the support block is not connected to the support column.
8. The method for manufacturing a package substrate according to claim 6, wherein the support structure includes a plurality of support blocks, and the support structure further includes connecting pads used to stack and connect vertically adjacent support blocks, and if the support structure is of a stacked type, the connecting pads connect the support blocks and the support columns.
9. The method for manufacturing a package substrate according to claim 6, characterized in that the support block is riveted, lattice-shaped, or frame-shaped.
10. The method for manufacturing a package substrate according to claim 6, characterized in that the material of the core layer is an organic material, glass, ceramics, silicon carbide, AlO2, or a composite material having an elastic modulus of 50 to 100 GPa.