Systems and methods for camera protection in hazardous environments

Abstract

The system may include a camera, the camera having at least a camera lens and a camera body, the camera lens and the camera body being oriented obliquely relative to the viewport and the radiation source. The system may include a first surface mirror or a second surface mirror operably positioned in front of the camera lens, the surface of the first surface mirror or the second surface mirror being coated with a reflective material. The system may include a shield, the shield protecting the camera from gamma rays.

Description

[Technical Field]

[0001] FIELD OF THE DISCLOSURE This disclosure relates generally to systems and methods for protecting cameras from hazardous environments, and more particularly to the use and protection of cameras used to monitor vitrification processes. [Background technology]

[0002] Vitrification processing systems can employ infrared (IR) cameras to monitor the process and melt surface inside the furnace hood. Typically, the IR camera is mounted near, next to, or adjacent to the outside of the furnace hood, with the imaging lens facing inward, toward the melt surface. The camera lens is typically isolated from the plenum atmosphere by a germanium or zinc selenide viewport that is transparent to the long-wave IR radiation measured by the camera.

[0003] Highly radioactive waste emits varying amounts of alpha, beta, and gamma radiation, depending on the type of waste treated in the vitrification process. Of these three types of radiation, gamma radiation has the unique ability to penetrate various materials and experience little attenuation from them. As a result, camera IR sensors, associated electronics, and the various non-metallic materials used in their construction will rapidly deteriorate and eventually fail if exposed to gamma radiation for a sufficient period of time, necessitating periodic replacement. For this very reason, the need to protect electronic imaging systems and other sensors from space radiation is well documented and is a particular priority in the design and construction of space-based systems.

[0004] Currently, mitigating the challenge in hazardous environments requires placing a dense material between the radiation source and the object being protected, commonly called a shield, which also effectively blocks the IR radiation needed for the IR camera's thin-film transistor (TFT) circuitry to resolve the image.

[0005] What is needed in the art is a system and method that allows a coated prism system to reflect long-wave IR signals with minimal attenuation to the IR camera lens of a positioned camera, but does not reflect or absorb gamma rays, allowing the camera to be safely positioned away from gamma rays while still being able to measure and image infrared transmission. Summary of the Invention

[0006] A right-angle first- or second-surface mirror coated with a thin reflective gold layer is installed in front of the camera lens, which would normally be pointed toward the waste surface. This front-mounted first- or second-surface mirror allows the camera body and lens to be oriented perpendicular to the melt hood's viewport, and thus the melt surface and radiation source. The function of the thin gold coating on the first- or second-surface mirror is to reflect long-wavelength infrared signals with minimal attenuation, but it is not expected to reflect or absorb gamma rays. Instead, gamma rays pass unimpeded through the low-density first- or second-surface mirror. Camera components exposed to gamma rays are shielded with lead or other high-density materials, reducing exposure to manageable levels.

[0007] The systems, methods, processes, and apparatus disclosed herein may be more fully understood by reference to the detailed description when considered in connection with the accompanying illustrative drawings, in which like reference numerals refer to like elements or acts throughout the drawings. [Brief explanation of the drawings]

[0008] [Figure 1A] FIG. 1 illustrates a cross-sectional side view of one embodiment of a camera protection system. [Figure 1B] FIG. 1B is a front view of the embodiment of FIG. 1A. [Figure 2] FIG. 1B is a vertical view of the embodiment of FIG. 1A. [Figure 3] 1 shows the protective housing for the camera. [Figure 4] FIG. 1 is an isometric view of an exemplary melting furnace coupled with a camera system. [Figure 5] FIG. 5 is a top view of the system of FIG. 4. [Figure 6] FIG. 5 is a front view of the system of FIG. 4. [Figure 7] FIG. 5 is a cross-sectional view of the system of FIG. 4. [Figure 8] 1 illustrates an embodiment of an electronic computing device. [Figure 9] 9 illustrates one embodiment of an apparatus that can be included as part of the electronic computing device of FIG. 8.

[0009] Elements and acts in the figures are illustrated for simplicity and are not necessarily depicted according to any particular order or embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Before describing any embodiments of the present disclosure in detail, it is to be understood that the systems and methods disclosed herein are not limited in their application to the details of construction and the arrangements of parts set forth in the following description or illustrated in the accompanying drawings. The systems and methods disclosed herein are capable of other embodiments and of being practiced or carried out in various ways. It should be noted that there are many different alternative configurations, devices, and techniques to which the disclosed embodiments may be applied. The full scope of embodiments is not limited to the examples described below.

[0011] In the following examples of illustrated embodiments, reference is made to the accompanying drawings, which form a part hereof, and which show, by way of illustration, various embodiments in which the systems, methods, processes, and / or apparatuses disclosed herein may be practiced. It is to be understood that other embodiments may be utilized and structural and functional changes may be made without departing from the scope of the present disclosure.

[0012] Figures 1-7 show various views of embodiments of systems and methods for protecting cameras in hazardous environments. In some embodiments, such as those illustrated in Figures 4-7, the systems and methods disclosed herein can be applied to vitrification processes for hazardous or radioactive waste.

[0013] 1A, 1B, and 2 illustrate one embodiment of a camera protection system. In the illustrated embodiment, the viewport 50 is angled θ° with respect to the top surface of an exemplary container 5 containing the object of interest. The angle θ can range from 0° to 60°. In some embodiments, the camera system can be utilized without the container 5. The container 5 is included to add perspective to the drawings but is not necessary for the functionality of the system.

[0014] Typically, the lens of camera 210 is aimed directly at the object of interest, which may be the waste surface in waste vitrification embodiments. In some embodiments, a right-angle first or second surface mirror 200 may be placed in front of the lens of camera 210, such that the camera body 210 and lens are oriented obliquely relative to the viewport 50 on the vessel 5, or the melt surface and radiation source in vitrification embodiments. In some embodiments, implementing a right-angle first or second surface mirror 200 may result in lower transmission losses and less attenuation of the IR signal over time in high gamma radiation fields.

[0015] In some embodiments, one or more surfaces of the right-angled first surface mirror or second surface mirror 200 may be coated with a reflective layer. In some embodiments where a right-angled first surface mirror 200 is implemented, the right-angled first surface mirror 200 may be coated externally. In some embodiments where a second surface mirror 200 is implemented, the second surface mirror 200 may be coated internally. In some embodiments, the reflective layer is a gold film. In some embodiments, the reflective layer may be made of aluminum or silver.

[0016] The effective function of the reflective layer on the first or second surface mirror 200 is to reflect 96-99% of long-wave IR signals (depicted by the thick solid arrows) with minimal attenuation (1-4%), but not reflect or absorb gamma radiation (depicted by the thick dashed arrows) due to its extremely short wavelength (high frequency). Instead, gamma rays are able to pass unimpeded through the low-density material and film layers of the first or second surface mirror 200. The camera 210 and components potentially exposed to gamma rays can be shielded with lead or other high-density material(s), thereby reducing exposure to manageable radiation levels.

[0017] FIG. 3 illustrates an embodiment of a camera 210 and a protective housing 215. In some embodiments, the housing 210 includes an outer layer of protective lead shielding. In some embodiments, the shielding is 60 mm to 65 mm thick. In some embodiments, the thickness of the shielding can vary depending on the work environment. In some embodiments, the shielding can reduce the cumulative dose to 100 Gy (1×10 rad). Many commercial off-the-shelf (COTS) imaging systems (e.g., the Mirion radiation-resistant camera) have a maximum total allowable dose of 100 Gy (1×10 rad). In some embodiments, the system has a design life of approximately 22,000 hours. In some embodiments, expected use can result in an average allowable dose rate of 0.0046 Gy / hr (0.46 rad / hr). FIGS. 4-7 illustrate various perspectives of the systems and methods disclosed herein being used in conjunction with a hazardous or radioactive waste vitrification process.

[0018] The above-described and illustrated embodiments are presented by way of example only and are not intended to limit the concepts and principles of the present disclosure. As such, those skilled in the art will recognize that various changes in the elements and their configuration and arrangement may be made without departing from the spirit and scope of the present disclosure as set forth in the appended claims.

[0019] Electronic Computers Electronic Computing Devices Figure 8 shows one embodiment of an electronic computing device 101 (also called an electronic controller, programmable logic controller, electronic control system, or electronic computing system) that may be part of the system. The electronic computing device 101 may be used to control the system in any of the ways described above. Figure 9 shows an embodiment of an apparatus that may be included as part of the electronic computing device 101.

[0020] The electronic computing device 101 includes one or more processors 103 (also called digital processing units or microprocessors) and memory 105 communicatively linked to each other by a system bus 107. In some embodiments, the electronic computing device 101 may also include one or more other interfaces and / or devices communicatively linked to the system bus 107.

[0021] For example, one or more storage devices 109 may be communicatively linked to the system bus 107 by one or more storage interfaces 111. One or more display devices 113 may be communicatively linked to the system bus 107 by one or more graphics interfaces 115. One or more input devices 117 may be communicatively linked to the system bus 107 by one or more input interfaces 119. One or more output devices 121 may be communicatively linked to the system bus 107 by one or more output interfaces 123. One or more communication devices 125 may be communicatively linked to the system bus 107 by one or more communication interfaces 127.

[0022] It should be understood that the electronic computing device 101 can have a variety of configurations. For example, in some embodiments, various components of the electronic computing device 101 can be located near each other, in a single housing, several housings, a single board, several boards communicatively linked to each other, etc. In other embodiments, various components of the electronic computing device 101 can be located remotely. For example, one or more input devices 117 and / or one or more output devices 121 can be located remotely or at a location separate from one or more processors 103 and / or memory 105.

[0023] Processor Each of the one or more processors 103 is an electrical circuit, such as an integrated circuit, that executes program instructions. Processor 103 may perform operations, such as arithmetic, logical, control, and input / output (I / O) operations, specified by the program instructions. In some embodiments, processor 103 includes a control unit (CU), an arithmetic logic unit (ALU), and / or a memory unit (alternatively referred to as cache memory).

[0024] The control unit may direct the operation of the processor 103 and / or instruct the memory 105, arithmetic logic unit, and output unit 121 on how to respond to instructions in a program. The control unit may also direct the flow of data or information between the processor 103 and other components of the electronic computing device 101. The control unit may also control the operation of the other components by providing timing and control signals.

[0025] The arithmetic logic unit is an electrical circuit within the processor 103 that performs integer arithmetic and bitwise logic operations. The arithmetic logic unit receives inputs in the form of data or information to be operated on and code that describes the operation to be performed. The arithmetic logic unit provides as output the results of the performed operations. In some configurations, the arithmetic logic unit may also include status inputs and / or outputs that communicate information about previous or current operations between the arithmetic logic unit and an external status register.

[0026] It should be understood that processor 103 can have any suitable configuration. For example, processor 103 can range from a simple processor specially built or configured to execute one or more programs for a particular application or device to a complex central processing unit configured to be used in a wide variety of ways and in an equally wide variety of applications. Examples of processor 103 include a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a central processing unit (CPU), a field-programmable gate array (FPGA) or other programmable logic device, and / or discrete gate or transistor logic. Processor 103 can also be implemented as any individual or combination of these devices.

[0027] memory Memory 105 (also called primary memory, main memory, or computer-readable medium) is a semiconductor device or system used to store information for immediate use by processor 103. Memory 105 is typically directly accessible by processor 103. Processor 103 can not only read and execute program instructions stored in memory 105, but can also store data and / or other information in memory 105 that is actively manipulated. Memory 105 is generally more expensive and operates faster than storage device 109. Memory 105 can be volatile, such as random access memory (RAM), or non-volatile, such as read-only memory (ROM).

[0028] System Bus System bus 107 broadly refers to a communication system through which information is transferred between processor 103, memory 105, and / or other components, such as peripherals, that may be considered part of electronic computing device 101. System bus 107 may include the physical system through which information travels, such as connectors, conductive paths, optical paths, wires, etc.

[0029] The system bus 107 can have a variety of physical configurations. In some embodiments, the system bus can be configured as a backbone connecting the processor 103, memory 105, and / or various devices and / or interfaces, as shown. In other embodiments, the system bus 107 can be configured as separate buses that communicatively couple one or more components. For example, the system bus 107 can include a bus that communicatively couples the processor 103, memory 105, and / or circuit boards (a bus may also be referred to as a front-side bus, memory bus, local bus, or host bus). The system bus 107 can include multiple additional I / O buses that communicatively link various other devices and / or interfaces to the processor 103.

[0030] It should be understood that information shared between components of the electronic computing device 101 includes program instructions, data, signals such as control signals, commands, bits, symbols, etc. Information can be represented using a variety of technologies and techniques. For example, in some embodiments, information can be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields, etc.

[0031] System bus 107 may be used for purposes other than sharing information. For example, system bus 107 may be used to provide power from power supply 129 to the various devices and / or interfaces connected to system bus 107. Similarly, system bus 107 may include address lines that match those of processor 103, allowing information to be sent to and from specific memory locations within memory 105. System bus 107 may also provide a system clock signal to synchronize the various devices and / or interfaces with the rest of the system.

[0032] The system bus 107 may use a variety of architectures, communications protocols, or protocol suites to communicatively link the processor 103, memory 105, and / or any of the other devices and / or interfaces. For example, suitable architectures include Industry Standard Architecture (ISA), Extended Industry Standard Architecture (EISA), MicroChannel Architecture (MCA), Video Electronics Standards Association (VESA), Peripheral Component Interconnect (PCI), PCI Express (PCI-X), Personal Computer Memory Card Industry Association (PCMCIA or PC Bus), Accelerated Graphics Port (AGP), Small Computer System Interface (SCSI), etc. Suitable communications protocols include TCP / IP, IPX / SPX, Modbus, DNP, BACnet, ControlNet, Ethernet / IP, etc.

[0033] Program Instructions The instructions stored on the electronic computing device 101 may include software algorithms and / or application programs. It is understood that the software algorithms may be expressed in the form of a method or process executed, in part or in whole, by the electronic computing device 101, or as instructions stored on a computer-readable medium, such as the memory 105 and / or the storage device 109. Similarly, the software algorithms may be illustrated in flowcharts and described in methods and / or processes.

[0034] It should be understood that the instructions can be entirely in software (including firmware, resident software, microcode, etc.), entirely in hardware, or a combination of software and hardware. If implemented in software executed by processor 103, information may be stored on or transmitted via a computer-readable medium, such as memory 105 and / or storage device 109. In some embodiments, the instructions may be included in any tangible medium of expression having program code embodied therein. In some embodiments, the instructions may be written in any combination of one or more programming languages.

[0035] It should also be understood that the flowcharts, block diagrams, methods, and / or processes describe algorithms and / or symbolic representations of information operations. These algorithmic descriptions and representations are commonly used by those skilled in the data processing arts to effectively convey the substance of their work to others skilled in the art. These operations, while described functionally or logically, are understood to be implemented by software and / or hardware that can be readily and easily produced from the functional or logical description of the algorithm.

[0036] In some embodiments, the instructions may include firmware such as a basic input / output system (BIOS) 131, an operating system 133, one or more application programs 135, and program data 137, which may be stored in memory 105 and / or storage device 109. Generally, the instructions are stored in memory 105 while electronic computing device 101 is on and running, or while the instructions are in use (e.g., while an application program is running). Similarly, the instructions are saved in storage device 109 when electronic computing device 101 is powered off.

[0037] Storage Devices Each of the one or more storage devices 109 (also called secondary memory or computer-readable media) is a device or system used to store information that does not need to be immediately used by the processor 103. The storage devices 109 may be communicatively linked to the system bus 107 by a storage interface 111. The storage devices 109 are typically not directly accessible to the processor 103. The storage devices 109 are generally less expensive and operate slower than the memory 105. The storage devices 109 are also typically non-volatile and are used to permanently store information.

[0038] Storage device 109 may take a variety of physical forms and use a variety of storage technologies. For example, in some embodiments, storage device 109 may be in the form of a hard disk storage device, a solid-state storage device, an optical storage device, etc. Also, in some embodiments, storage device 109 may store information using technologies such as magnetic disks (e.g., disk drives), laser beams (e.g., optical drives), semiconductors (e.g., solid-state drives), and / or magnetic tape.

[0039] display device Each of the one or more display devices 113 (also referred to as a human-machine interface (HMI) or screen) is a device that visually conveys text, graphics, video, and / or other information. In some embodiments, the information displayed on the display devices 113 exists electronically and is displayed temporarily. It should be understood that the display devices 113 can operate as output devices and / or input devices (e.g., touchscreen displays, etc.).

[0040] Display device 113 may be communicatively linked to system bus 107 by one or more graphics interfaces 115. In some embodiments, graphics interface 115 may be used to generate a feed of output images to display device 113. In some embodiments, graphics interface 115 may be a separate component, such as a dedicated graphics card or chip, or may be an integrated component that is part of or a subset of processor 103.

[0041] It should be understood that display device 113 can include a variety of physical structures and / or display technologies. For example, in some embodiments, display device 113 can be a screen integrated into a particular application or technology, a separate screen such as a monitor, etc. Display device 113 can also be a liquid crystal display, a light emitting diode display, a plasma display, a quantum dot display, etc.

[0042] Input Devices Each of the one or more input devices 117 is a physical component that provides information to the processor 103 and / or memory 105. The input devices 117 may be communicatively linked to the system bus 107 by one or more input interfaces 119. The input devices 117 may be of any suitable type and may provide any of a variety of information. For example, the input devices 117 may be digital and / or analog devices and may provide information in digital or analog form. Additionally, the input devices 117 may be used to provide user input for controlling the electronic computing device 101 or operational input for controlling aspects of a particular application.

[0043] The input device(s) 117 may include one or more sensors 139 and / or one or more other various input devices 141. It should be understood that the input device(s) 117 are not limited to only providing information. In some embodiments, the input device(s) 117 may also receive information. Such devices may be considered both an input device 117 and an output device 121.

[0044] The various input devices 141 can include a variety of devices and components. In some embodiments, the various input devices 141 can include switches, such as limit switches, level switches, vacuum switches, pressure switches, and buttons, including push buttons. In some embodiments, the various input devices 141 can include a pointing device, such as a mouse, a text input device, such as a keyboard, and a user interface component, such as a touch screen.

[0045] sensor Each of the one or more sensors 139 can be used to provide information about a wide variety of measured properties. Generally speaking, the sensors 139 are used to measure or detect information about their environment and transmit that information to the processor 103 and / or memory 105. In some embodiments, the sensors 139 can operate as transducers and generate electrical signals as a function of the measured property. The electrical signals are communicated to the processor 103 and / or memory 105, where they can be used for various purposes.

[0046] The sensors 139 can be digital and / or analog sensors. For example, in some embodiments, the sensors 139 provide digital information to the processor 103 and / or memory 105. In other embodiments, the sensors 139 provide analog information to the processor 103 and / or memory 105. Also, in some embodiments, the information can be converted from one type to another, for example, from digital to analog or from analog to digital.

[0047] It should be appreciated that the information provided by the sensor 139 can be used in a variety of ways by the processor 103. For example, in some embodiments, the processor 103 can compare the information to a setpoint. In some embodiments, the analog information is amplified before being compared to the setpoint.

[0048] In some embodiments, the sensor 139 can be used to measure one or more characteristics. For example, the sensor 139 can be used to measure position, radiation, temperature, sound, etc.

[0049] Image sensor In some embodiments, sensor 139 is an image sensor used to create images of aspects of the system and / or vitrification process. In general, an image sensor is a device that detects and transmits information used to create an image. An image sensor converts the attenuation of radiation waves (infrared, visible light, ultraviolet, or other frequencies) into a signal to transmit information.

[0050] The image sensor may be any of a variety of types of image sensors. For example, suitable image sensors include electronic image sensors such as charge-coupled devices (CCDs), active pixel sensors (CMOS sensors), etc. The image sensor may also be part of a camera or other imaging device.

[0051] temperature sensor In some embodiments, the sensor 139 is a temperature sensor used to measure the temperature of the vitrification process. Temperature is a physical quantity that represents the thermal energy present in a substance. In some embodiments, the temperature sensor acts as a transducer, generating an electrical signal as a function of the measured temperature.

[0052] Temperature sensors can be contact or non-contact. Contact temperature sensors are placed in physical contact with a material and rely primarily on conduction to detect temperature changes. Non-contact temperature sensors are not placed in physical contact with a material and rely primarily on convection or radiation to detect temperature changes.

[0053] The temperature sensor can be any of a variety of types of temperature sensors. For example, suitable temperature sensors include thermocouples (such as type K, type J, type T, type E, type N, type S, and type R), resistance temperature detectors (RTDs), thermistors, bimetallic strips, semiconductor temperature sensors, thermometers, vibrating wire temperature sensors, and infrared temperature sensors.

[0054] pressure sensor In some embodiments, sensor 139 is a pressure sensor used to measure the pressure of a fluid, such as air and / or hydraulic fluid. Pressure refers to the force required to stop the expansion of a fluid and is expressed as force per unit area. In some embodiments, the pressure sensor functions as a transducer, generating an electrical signal as a function of the measured pressure.

[0055] The pressure sensor can be configured to measure a variety of pressures. In some embodiments, the pressure sensor is an absolute pressure sensor configured to measure pressure relative to a vacuum. In some embodiments, the pressure sensor is a gauge pressure sensor configured to measure pressure relative to the surrounding atmospheric pressure. In some embodiments, the pressure sensor is a differential pressure sensor configured to measure the difference between two pressures. In some embodiments, the pressure sensor is a sealed pressure sensor configured to measure pressure relative to a fixed pressure other than atmospheric pressure.

[0056] Pressure sensors can use a variety of pressure sensing technologies. In some embodiments, the pressure sensor can use focused pressure sensing technology. This type of electronic pressure sensor uses a force-focusing body, such as a diaphragm, piston, Bourdon tube, or bellows, to measure strain or deflection due to a force applied to an area. Examples of suitable force collector pressure sensors include piezoresistive strain gauge pressure sensors, capacitive pressure sensors, electromagnetic pressure sensors, piezoelectric pressure sensors, strain gauge pressure sensors, optical pressure sensors, potentiometric pressure sensors, and force balance pressure sensors. In some embodiments, the pressure sensor can infer the pressure of the fluid using other properties, such as density.

[0057] Position Sensor In some embodiments, the sensor 139 is a position sensor configured to measure the position of an electrode, gripper, etc. The position sensor can be used to determine the absolute position or location of a component, or the relative position or displacement of a part in terms of linear movement, rotational angle, or three-dimensional space. In some embodiments, the position sensor functions as a transducer, generating an electrical signal as a function of the measured position.

[0058] There are two types of position sensors: contact position sensors and non-contact position sensors. Contact position sensors are placed in physical contact with a part and detect changes in its position. Non-contact position sensors can detect changes in the part's position without making physical contact with the part.

[0059] The position sensor may be any of a variety of types of position sensors and may be used to measure a variety of positions or movements, including linear, rotational, and / or angular positions or movements. For example, suitable position sensors include potentiometric position sensors, inductive position sensors such as linear variable differential transformers or rotary variable differential transformers, eddy current-based position sensors, capacitive position sensors, magnetostrictive position sensors, Hall effect-based magnetic position sensors, fiber optic position sensors, optical position sensors, ultrasonic position sensors, etc.

[0060] Optical sensor In some embodiments, sensor 139 is an optical sensor configured to measure various aspects of the system and / or vitrification process. Optical sensors can be used to determine the presence and / or intensity of light by measuring radiant energy present in certain frequency ranges, typically including the infrared, visible, and / or ultraviolet spectrums. In some embodiments, the optical sensor functions as a transducer, generating an electrical signal as a function of the measured radiant energy.

[0061] Optical sensors can include a variety of different light sensing technologies. In some embodiments, optical sensors generate electricity when illuminated. Examples of such optical sensors include photovoltaic optical sensors and photoemissive optical sensors. In some embodiments, optical sensors change electrical properties when illuminated. Examples of such optical sensors include photoresistor optical sensors and photoconductor optical sensors.

[0062] Output Device Each of the one or more output devices 121 is a physical component that receives information from the processor 103 and / or memory 105. The output devices 121 may be communicatively linked to the system bus 107 by one or more output interfaces 123. The output devices 121 may be of any suitable type and may receive any of a variety of information. For example, the output devices 121 may be digital and / or analog devices and may receive information in digital and / or analog form. The output devices 121 may also be used to provide information to a user or to perform various operations related to a particular application.

[0063] Output device(s) 121 may include one or more actuators 143 and / or one or more other various output devices 145. It should be understood that output device(s) 121 is not limited to only receiving information. In some embodiments, output device(s) 121 may also transmit information. Such devices may be considered both output device(s) 121 and input device(s) 117.

[0064] The various output devices 145 may include a variety of devices and components, and in some embodiments, the various output devices 145 may include audio output devices, such as speakers, or other output devices.

[0065] Actuator Each of the one or more actuators 143 can be used to actuate an action or operation. Generally, actuators 143 are used to actuate something in response to a command or control signal sent from processor 103. In some embodiments, actuators 143 can function as transducers by receiving an electrical signal and converting it into a desired movement or action.

[0066] The information received by actuator 143 can take a variety of forms and can use many technologies. For example, the information may be in the form of voltage or current, air or hydraulic fluid pressure, binary data, etc. Information can be provided in digital and analog forms. For example, in some embodiments, actuator 143 receives digital information from processor 103 or other component(s) within electronic computing device 101. In other embodiments, actuator 143 receives analog information from processor 103 or other component(s) within electronic computing device 101. Also, in some embodiments, the information received by actuator 143 can be converted from one type to another, for example, from digital to analog or from analog to digital.

[0067] The actuator 143 can be actuated using a variety of energy sources. For example, the actuator 143 can be actuated using electrical energy, hydraulic energy, pneumatic energy, thermal energy, magnetic energy, etc. Similarly, the actuator 143 can be an electric actuator, a hydraulic actuator, a pneumatic actuator, a thermal actuator, a magnetic actuator, etc. The actuator 143 can also be used to generate a variety of motions. For example, the actuator 143 can be used to generate linear and / or rotational motion.

[0068] motor In some embodiments, the actuator 143 can include an electric motor. Generally, an electric motor is a device that converts electrical energy into mechanical energy. In some embodiments, the mechanical energy generated by an electric motor takes the form of a rotating shaft. The mechanical energy can be used directly or converted into other mechanical motion using levers, gears, ratchets, cams, etc. The motor can be a DC motor or an AC motor.

[0069] relay In some embodiments, the actuator 143 can include a relay. Generally, a relay is an electrically operated switch. In some embodiments, the relay includes one or more input terminals for receiving information or control signals and one or more operating contact terminals electrically linked to another electrical device.

[0070] In some embodiments, the relay may include an electromechanical relay with contacts that are mechanically opened and closed. For example, the relay may include an electromagnet that opens and closes the contacts. In other embodiments, the relay may include a solid-state relay that uses semiconductor properties to control the on or off state of the relay without moving parts. Solid-state relays may include thyristors and transistors and can switch currents up to 100 amps or more.

[0071] communication equipment Each of the communication devices 125 is a physical component that enables the electronic computing device 101 to communicate with other devices, components, and / or networks. The communication devices may be communicatively linked to the system bus 107 by one or more communication interfaces 127. The communication devices 125 may include one or more wired communication devices 147 and / or one or more wireless communication devices 149.

[0072] It should be appreciated that the communication unit 125 can be any suitable physical unit. For example, in some embodiments, the communication unit 125 is a network interface controller used to connect the electronic computing device 101 to a local area network (LAN), a wide area network (WAN), or a larger network such as the Internet.

[0073] It should also be appreciated that communication device 125 can use a variety of communication protocols. For example, in some embodiments, wired communication device 147 can use a communication protocol such as Ethernet, RS-232, RS-485, USB, etc. Also, in some embodiments, wireless communication device 149 can use a communication protocol such as Wi-Fi, Bluetooth, Zigbee, LTE, 5G, etc.

[0074] power supply The power supply 129 may be used to provide power to the electronic computing device 101. The power supply 129 may provide any suitable type of power, such as an AC power source, a DC power source, etc. The power supply 129 may obtain power from any suitable power source, such as an AC power source (a standard wall outlet), a DC power source (a transformer plugged into a wall outlet), a battery, a generator, etc.

[0075] In some embodiments, the power supply 129 includes a power supply that converts current from the power source to a desired voltage, current, and / or frequency to power the electronic computing device 101. In some embodiments, the power supply can convert AC power between 110 and 240 VAC to DC power between 6 and 60 VDC.

[0076] circuit board The electronic computing device 101 may include one or more circuit boards (also called logic boards) to which one or more components may be coupled. For example, the processor 103, memory 105, storage device 109, display device 113, input device 117, output device 121, communication device 125, and / or power supply 129 may be coupled to one or more circuit boards. In some embodiments, the processor 103, memory 105, and / or storage device 109 may be coupled to a single circuit board.

[0077] In some embodiments, the circuit board may include a series of conductive tracks, pads, and / or other features etched from one or more sheets of copper laminate laminated onto and / or between sheets of a non-conductive substrate. The conductive features may be part of a system bus 107 that communicatively links various components of the electronic computing device 101. In some embodiments, the circuit board may be a printed circuit board. In some embodiments, the circuit board may be a motherboard.

[0078] Illustrative Embodiments P1. A camera protection system comprising: a camera comprising at least a camera lens and a camera body, the camera lens and the camera body being positioned at an angle relative to a viewport and a radiation source; a first surface mirror or a second surface mirror operably positioned in front of the camera lens, the first surface mirror or the second surface mirror having a surface coated with a reflective material; and a shielding body that protects the camera from gamma rays.

[0079] P2. The system of P1, wherein the reflective material is a gold coating.

[0080] P3. A system and method for reflecting gamma rays from a camera using a right-angle first surface mirror or second surface mirror.

[0081] P4. The system and method of P3, wherein the right-angled first surface mirror or the second surface mirror has a film coating on one or more surfaces.

[0082] P5. The system and method of P4, wherein the film coating comprises gold.

[0083] P6. The system and method of P3, wherein the camera is an infrared camera.

[0084] P7. A system and method for reflecting harmful light rays away from a camera using a right-angled first surface mirror or second surface mirror.

[0085] P8. The system and method of P7, wherein the right-angled first surface mirror or the second surface mirror has a film coating on one or more surfaces.

[0086] P9. The system and method of P8, wherein the film coating is composed of gold.

[0087] P10. The system and method of P7, wherein the camera is an infrared camera.

[0088] Common Terminology and Interpretation Conventions No method recited in the claims or specification should be construed as requiring that steps be performed in a particular order unless expressly stated otherwise, nor should the method be construed as providing support for performing the recited steps in any order unless expressly stated otherwise.

[0089] Certain features described in the context of separate embodiments herein can also be implemented in combination in a single embodiment. Conversely, various features described in the context of a single embodiment can also be implemented in multiple embodiments separately or in any suitable subcombination. Furthermore, while features may be described above in a particular combination, and even initially claimed as such, one or more features from the claimed combination can, in some cases, be deleted from that combination, and the claimed combination may be directed to a subcombination or a variation of the subcombination.

[0090] The illustrative configurations described herein are not intended to represent all possible implementations or all implementations that may be included within the scope of the claims. As used herein, the term "exemplary" means "serving as an example, instance, or illustration" and does not imply "preferred" or "advantageous over other embodiments."

[0091] Articles such as "the," "a," and "an" refer to singular or plural, and the word "or" is construed as inclusive (e.g., "x or y" means either x or y, or both) when used without preceding "or" with "either" (or other similar wording that clearly indicates that "or" is exclusive, e.g., only one of x or y).

[0092] The term "and / or" shall also be construed as inclusive (e.g., "x and / or y" means either x or y, or both). When "and / or" or "or" is used as a conjunction of a group of three or more items, the group shall be construed as including one item only, all items together, or any combination or number of items.

[0093] The phrase "based on" should be construed to refer to an open set of conditions unless expressly stated otherwise (e.g., based only on certain conditions). For example, a step described as being based on certain conditions may be based on the listed conditions and one or more unlisted conditions.

[0094] The terms "have," "having," "include," and "including" should be construed as synonyms for the terms "comprise" and "comprising," and the use of these terms should be understood as disclosing and providing support for narrower alternative embodiments in which these terms are replaced with "consisting of" or "consisting essentially of."

[0095] Unless otherwise indicated, numbers or expressions expressing dimensions, physical properties, and the like used in this specification (except in the claims) are understood to be modified in all instances by the term "about." At the very least, and not as an attempt to limit the application of the doctrine of equivalents to the scope of the claims, each numerical parameter recited in the specification or claims that is modified by "approximately" should be construed in light of at least the number of reported significant digits and by applying ordinary rounding techniques.

[0096] All disclosed ranges are understood to encompass and provide support for claims reciting any subranges or any and all individual values ​​subsumed within each range. For example, a recited range of 1 to 10 is considered to encompass and provide support for claims reciting any subranges or individual values ​​between and / or including the minimum value of 1 and the maximum value of 10, i.e., any subrange beginning with a minimum value of 1 or greater and ending with a maximum value of 10 or less (e.g., 5.5 to 10, 2.34 to 3.56, etc.), or any value between 1 and 10 (e.g., 3, 5.8, 9.9994, etc.), which values ​​can be expressed singly or as a minimum value (e.g., at least 5.8) or a maximum value (e.g., less than or equal to 9.9994), and these values ​​are considered to encompass and provide support for claims reciting such values.

[0097] All disclosed numerical values ​​are understood to be variable in either direction from 0 to 100%, and thus support claims reciting such values ​​(either singly or as minimum or maximum values—e.g., at least <value> or not more than <value>) or ranges or subranges that may be formed by such values. For example, a numerical value recited as 8 should be understood to vary from 0 to 16 (100% in either direction), and support claims recited as the range itself (e.g., 0 to 16), any subrange within the range (e.g., 2 to 12.5), or individual values ​​within the range expressed individually (e.g., 15.2), as a minimum value (e.g., at least 4.3), or as a maximum value (e.g., not more than 12.4).

[0098] Terms in the claims should be given their ordinary and accustomed meaning as determined by reference to relevant entries in widely used general and / or relevant specialty dictionaries, meanings commonly understood by those skilled in the art, etc. (e.g., when two or more relevant dictionary entries are combined, the broadest meaning of the combination of the entries should be accorded). Exceptions are made only in the following circumstances: (a) if a term is used in a broader sense than its ordinary meaning, the term shall be given its ordinary meaning plus its broader meaning; or (b) if a term is expressly defined to have a different meaning by reciting a phrase such as "herein means..." (e.g., "this term means...," "this term is defined as follows," "for purposes of this disclosure, this term shall mean..."). References to specific examples, use of "i.e.," use of the word "invention," etc., do not invoke exception (b) or otherwise limit the scope of the cited claim terms. Except where exception (b) applies, nothing contained herein should be deemed a disclaimer or negation of the scope of the claims.

[0099] Claimed subject matter is not, and should not be construed as, synonymous with any embodiment, feature, or combination of features described or illustrated herein, even if only a single embodiment of that feature or combination of features is illustrated and described.

Claims

1. A camera protection system a camera comprising at least a camera lens and a camera body, the camera lens and the camera body being disposed obliquely with respect to a viewport and a radiation source; a first or second surface mirror operably positioned in front of the camera lens, the first or second surface mirror having a surface coated with a reflective material; a shielding body, the shielding body protecting the camera from gamma rays; A camera protection system comprising:

2. The system of claim 1 , wherein the reflective material is a gold coating.

3. A system and method for reflecting gamma rays away from a camera using a right-angled first surface mirror or a second surface mirror.

4. The system and method of claim 3 , wherein the orthogonal first surface mirror or the second surface mirror has a film coating on one or more surfaces.

5. The system and method of claim 4 , wherein the film coating comprises gold.

6. The system and method of claim 3 , wherein the camera is an infrared camera.

7. A system and method for reflecting harmful light rays away from a camera using a right-angled first or second surface mirror.

8. The system and method of claim 7 , wherein the orthogonal first surface mirror or the second surface mirror has a film coating on one or more surfaces.

9. 10. The system and method of claim 8, wherein the film coating comprises gold.

10. The system and method of claim 7 , wherein the camera is an infrared camera.

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