Battery module, manufacturing method thereof, and curable resin composition contained in the battery module

Abstract

Provided is a method for manufacturing a battery module, the method comprising: preparing a case configured to house a plurality of battery cells therein; filling the case with a curable resin composition; and curing a portion of the curable resin composition to form a capping portion, wherein the curable resin composition comprises a silicone-based polymer, a curing catalyst, a crosslinking agent, and a hollow filler; the curable resin composition has a curing rate of 10 mPa·s (millipascal seconds) / min to 70 mPa·s / min at 23°C; and the curable resin composition has a curing rate of 400 mPa·s / min to 2000 mPa·s / min at 70°C.

Description

[Technical Field]

[0001] The present invention relates to a battery module, a method for producing the same, and a curable resin composition contained in the battery module. [Background technology]

[0002] Secondary batteries, which are easy to apply to various products and have electrical properties such as high energy density, are widely used not only in portable devices but also in electric vehicles (EVs) or hybrid electric vehicles (HEVs) driven by electric sources, etc. These secondary batteries have attracted attention as a new energy source due to their environmental friendliness, which does not produce any by-products from energy use, and their improved energy efficiency, as well as the primary advantage of dramatically reducing the use of fossil fuels.

[0003] Currently widely used types of secondary batteries include lithium-ion batteries, lithium polymer batteries, nickel-cadmium batteries, nickel-metal hydride batteries, nickel-zinc batteries, and the like. The operating voltage of a unit secondary battery cell is approximately 2.5 V to 4.5 V. Therefore, if a higher output voltage is required, multiple battery cells are connected in series to form a battery pack. Additionally, multiple battery cells may be connected in parallel to form a battery pack depending on the charge / discharge capacity required for the battery pack. Therefore, the number of battery cells included in a battery pack can vary depending on the required output voltage or charge / discharge capacity.

[0004] On the other hand, when constructing a battery pack by connecting multiple battery cells in series / parallel, it is common to first construct a battery module including at least one battery cell, and then add other components using the battery module.

[0005] Current battery modules including battery cells made up of cylindrical cells generally include a plurality of cylindrical cells stacked on top of each other, bus bar members that electrically connect the plurality of cylindrical cells to each other, and a module case that houses the bus bar members, the cylindrical cells, and various electronic components that make up the battery module.

[0006] However, in the case of current battery modules, the predetermined gaps between the cells are generated depending on the structural shape of the cylindrical cells, and when an external impact occurs, flow between the battery cells frequently occurs, resulting in a risk of damaging the battery cells.

[0007] Therefore, there is a demand for a method for providing a battery module that can more stably support battery cells and prevent damage to the battery cells due to external impact, as well as a method for providing a battery pack including the battery module and a vehicle equipped with the battery module. Summary of the Invention [Problem to be solved by the invention]

[0008] Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to provide a battery module that has an improved production rate and can effectively protect battery cells, as well as a method for manufacturing the battery module and a curable resin composition contained in the battery module. [Means for solving the problem]

[0009] According to one aspect of the present invention, the above and other objects can be achieved by providing a method for manufacturing a battery module, the method comprising: preparing a case configured to house a plurality of battery cells therein; filling the case with a curable resin composition; and curing a portion of the curable resin composition to form a capping portion, wherein the curable resin composition comprises a silicone-based polymer, a curing catalyst, a crosslinking agent, and a hollow filler; the curable resin composition has a curing rate of 10 mPa·s (milliPascal seconds) / min to 70 mPa·s / min at 23°C; and the curable resin composition has a curing rate of 400 mPa·s / min to 2000 mPa·s / min at 70°C.

[0010] According to an aspect of the present invention, the uncured portion of the curable resin composition in the case is disposed below the capping portion.

[0011] Another aspect of the present invention provides a battery module comprising: a plurality of battery cells; a case configured to house the battery cells; and a buffer portion configured to surround the battery cells and disposed in the case, wherein the buffer portion contains a curable resin composition that includes a silicone-based polymer, a curing catalyst, a crosslinking agent, and a hollow filler, the curable resin composition having a curing rate of 10 mPa·s / min to 70 mPa·s / min at 23°C and a curing rate of 400 mPa·s / min to 2000 mPa·s / min at 70°C.

[0012] According to yet another aspect of the present invention, there is provided a curable resin composition for producing a battery module, the curable resin composition comprising a silicone-based polymer, a curing catalyst, a crosslinking agent, and a hollow filler, wherein the curable resin composition has a curing rate of 10 mPa·s / min to 70 mPa·s / min at 23°C and a curing rate of 400 mPa·s / min to 2000 mPa·s / min at 70°C.

[0013] In one embodiment, the curable resin composition may have a viscosity of 500 mPa·s to 1200 mPa·s at 23°C.

[0014] In one embodiment, the curable resin composition may have a viscosity of 400 mPa·s to 1100 mPa·s at 70°C.

[0015] In one embodiment, the ratio of the second cure rate to the first cure rate may be from 10 to 60.

[0016] The curable resin composition according to an embodiment may further comprise a pigment or dye.

[0017] The curable resin composition according to one embodiment may further include a reaction inhibitor.

[0018] The curable resin composition according to one embodiment may be produced by mixing a first resin composition containing the curing catalyst and the reaction inhibitor with a second resin composition containing the crosslinker.

[0019] In one embodiment, the consistency of the curable resin composition may be 20 1 / 10 mm to 50 1 / 10 mm, as measured according to the following measurement method: [Measurement method] The curable resin composition is mixed and cured at 25°C for 3 hours to produce a silicone resin block with a diameter of 60 mm and a height of 70 mm, and the penetration depth of the silicone resin block is measured according to ISO2137 using a 9.38g hollow cone.

[0020] In one embodiment, the contact angle of the curable resin composition may be 10° to 30°, as measured according to the following measurement method: [Measurement method] The curable resin composition is added dropwise to a glass plate in a volume of 10 ml, and after 5 seconds, the contact angle between the glass plate and the curable resin composition is measured.

[0021] In one embodiment, the curable resin composition may have a contact angle reduction rate of 5° / sec to 15° / sec, measured according to the following measurement method: [Measurement method] The curable resin composition was added dropwise to the glass plate in the above volume, and after 0.25 seconds, the contact angle between the glass plate and the curable resin composition was measured. The contact angle reduction rate was a value obtained by dividing the difference between the contact angle at 0.25 seconds and the contact angle at 5 seconds by 4.75 seconds.

[0022] According to yet another aspect of the present invention, there is provided a curable resin composition for producing a battery module, the curable resin composition comprising: a first silicone resin composition comprising a first organopolysiloxane, a crosslinker, and a chain extender; and a second silicone resin composition comprising a second organopolysiloxane, a curing catalyst, and a reaction inhibitor, wherein at least one of the first silicone resin composition and the second silicone resin composition comprises hollow beads, and the first silicone resin composition and the second silicone resin composition are mixed and cured, wherein the curable resin composition has a first cure rate of 10 mPa·s / min to 70 mPa·s / min at 23°C and a second cure rate of 400 mPa·s / min to 2000 mPa·s / min at 70°C. [Effects of the Invention]

[0023] A method for manufacturing a battery module according to one embodiment includes the steps of injecting and filling a curable resin composition into a case, and curing a portion of the curable resin composition to form a capping portion.

[0024] Therefore, the method for manufacturing a battery module according to an embodiment may reduce the time required to cure the curable resin composition. That is, the method for manufacturing a battery module according to an embodiment may cure the remaining curable resin composition after the process of forming the capping portion.

[0025] In particular, the curable resin composition has a high curing rate at high temperatures, so that the curable resin composition in the open portion of the case can be rapidly cured under high temperature conditions, and therefore, the method for manufacturing a battery module according to the embodiment can firmly and quickly form the capping portion.

[0026] In addition, since the curable resin composition has an appropriate curing rate at room temperature, the curable resin composition can be filled into the case without leaving any gaps, i.e., the curable resin composition can be filled uniformly throughout the case without leaving any unfilled spaces.

[0027] Therefore, the method for manufacturing a battery module according to an embodiment can prevent the curable resin composition from flowing out even if the curable resin composition is not completely cured. In addition, the method for manufacturing a battery module according to an embodiment can prevent the curable resin composition from moving away from a desired position.

[0028] In addition, the curable resin composition has a low curing rate at room temperature. Therefore, the increase in viscosity of the curable resin composition can be minimized until the two-component composition is mixed and then injected. Therefore, the method for manufacturing a battery module according to one embodiment can shorten the injection time of the curable resin composition. In addition, the method for manufacturing a battery module according to one embodiment can inject the curable resin composition into the desired position in the case. [Brief explanation of the drawings]

[0029] [Figure 1] FIG. 1 is a perspective view showing a battery module according to an embodiment. [Figure 2] FIG. 1 is an exploded perspective view showing a battery module according to an embodiment. [Figure 3] FIG. 2 is a plan view showing an upper surface of a battery module according to an embodiment. [Figure 4] 1A to 1C are cross-sectional views illustrating a method for manufacturing a battery module according to an embodiment. [Figure 5] 1A to 1C are cross-sectional views illustrating a method for manufacturing a battery module according to an embodiment. [Figure 6] 1A to 1C are cross-sectional views illustrating a method for manufacturing a battery module according to an embodiment. [Figure 7] 1 is a schematic diagram showing a battery pack. [Figure 8] 1 is a schematic diagram showing a vehicle in which the battery pack is mounted. DETAILED DESCRIPTION OF THE INVENTION

[0030] In the description of the embodiments, when describing that each part, surface, layer, or substrate is formed "on" or "under" each part, surface, layer, or substrate, "on" and "under" include both being formed "directly" on or under another element and being formed "indirectly" on or under another element, such that intervening elements are also present. In addition, the reference to "on" and "under" each element will be provided based on the drawings. The size of each part in the drawings may be exaggerated for illustrative purposes and does not represent the actual size.

[0031] Fig. 1 is a perspective view showing a battery module according to an embodiment, Fig. 2 is an exploded perspective view showing a battery module according to an embodiment, and Fig. 3 is a plan view showing an upper surface of a battery module according to an embodiment.

[0032] 1 to 3, a battery module according to an embodiment may include a battery cell 100, a module case 200, a bus bar member 300, a circuit board assembly 400, a support plate 500, and a buffer portion 600.

[0033] The battery cell 100 is a secondary battery, and may be a pouch-type secondary battery, a prismatic secondary battery, or a cylindrical secondary battery. The battery cell 100 may be a cylindrical secondary battery, i.e., a cylindrical battery cell.

[0034] A plurality of battery cells 100 may be provided. The plurality of battery cells 100 may be housed in a module case 200, which will be described below. The plurality of battery cells 100 may be stacked in the module case 200, which will be described below, along the horizontal direction of the module case 200.

[0035] The module case 200 may house the battery cells 100 and various electronic components that make up the battery module 10. For this reason, the module case 200 may be provided with a predetermined housing space.

[0036] The module case 200 may include a case body 210 and a case cover 250 .

[0037] The case body 210 has a storage space therein and may house a plurality of battery cells 100, various electronic components that make up the battery module 10, and the like.

[0038] A plurality of cell insertion holes may be formed on the inner bottom surface of the case body 210. The plurality of cell insertion holes may be provided to match the number of the plurality of battery cells 100.

[0039] The lower portions of the plurality of battery cells 100 may be inserted into the plurality of cell insertion holes. Therefore, the plurality of battery cells 100 can be housed in the module case 210 more stably.

[0040] In addition, adhesive or the like may be applied to the inside of the plurality of cell insertion holes, in which case the plurality of battery cells 100 can be fixed more stably.

[0041] The case cover 250 forms the upper part of the module case 200 and may be combined with the case body 210 to package the battery cells 100 inside the module case 200.

[0042] Busbar members 300 may be provided on upper portions of the plurality of battery cells 100 and may electrically connect the plurality of battery cells 100 to one another. Multiple busbar members 300 may be provided and may be arranged to be spaced apart from one another by a predetermined distance.

[0043] The circuit board assembly 400 may be electrically connected to the plurality of bus bar members 300. The circuit board assembly 400 may sense the voltage, temperature, etc. of the battery cell 100. In addition, the circuit board assembly 400 may include terminals for connecting to an external power source, etc., and may include a control board for managing the battery cell 100.

[0044] The support plate 500 may be disposed between the plurality of battery cells 100 and the plurality of bus bar members 300 and may support the plurality of bus bar members 300 .

[0045] The buffer portion 600 serves to prevent the plurality of battery cells 100 from flowing, and may fill the spaces between the plurality of battery cells 100 in the lower portion of the support plate 500 .

[0046] The buffer portion 600 may include a composite material capable of filling a predetermined space. The buffer portion 600 may include a silicone-based curable resin composition. The buffer portion 600 may be provided together with the silicone-based curable resin composition, which may enable the contained battery cells 100 to be more stably housed within the module case 230.

[0047] When manufacturing the battery module 10, the buffer portion 600 may be filled into the inside of the module case 200 by a dispenser unit D that accommodates the buffer portion 600.

[0048] As such, in this embodiment, the battery cell 100 may be more stably supported by the buffer portion 600 and may more effectively prevent the battery cell 100 from moving due to an external impact. Therefore, in this embodiment, the risk of damage to the battery cell 100 due to an external impact or the like may be significantly reduced.

[0049] 3 to 6 are cross-sectional views showing a method for manufacturing a battery module according to an embodiment.

[0050] To produce the buffer portion, first, a silicone-based curable resin composition is prepared.

[0051] The silicone-based curable resin composition includes a first curable resin composition and a second curable resin composition.

[0052] The first curable resin composition includes a first organopolysiloxane. The first organopolysiloxane may be represented by the following average compositional formula (1): [ka]

[0053] In the above composition formula (1), R 1 is one or more groups selected from the group consisting of a hydrogen atom, a hydroxyl group, and a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms; a is from about 1.8 to about 2.2; and a+b can be from about 3.5 to about 8.

[0054] More specifically, a+b may be four.

[0055] In the composition formula (1), R 1The saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms represented by the formula (I) may be, for example, an alkyl group such as methyl, ethyl, propyl, hexyl, octyl, decyl, dodecyl, tetradecyl, hexadecyl, or octadecyl; a cycloalkyl group such as cyclopentyl or cyclohexyl; an alkenyl group such as vinyl or allyl; an aryl group such as phenyl or tolyl; an aralkyl group such as 2-phenylethyl or 2-methyl-2-phenylethyl; a halogenated hydrocarbon group such as 3,3,3-trifluoropropyl, 2-(perfluorobutyl)ethyl, 2-(perfluorooctyl)ethyl, or p-chlorophenyl; or the like.

[0056] The first organopolysiloxane may have a weight average molecular weight (Mw) of about 100 g / mol to about 10,000 g / mol. The first organopolysiloxane may have a weight average molecular weight of about 500 g / mol to about 7,000 g / mol. The first organopolysiloxane may have a weight average molecular weight of about 700 g / mol to about 5,000 g / mol. The first organopolysiloxane may have a weight average molecular weight of about 1,000 g / mol to about 3,000 g / mol. The weight average molecular weight may be measured using a polystyrene standard.

[0057] The first organopolysiloxane may have a kinematic viscosity of 10 mPa·s to 2000 mPa·s at 25° C. The first organopolysiloxane may have a kinematic viscosity of about 30 mPa·s to about 1500 mPa·s at 25° C. The kinematic viscosity of the first organopolysiloxane may be a value at 25° C. measured using an Ostwald viscometer.

[0058] The first organopolysiloxane has the above weight-average molecular weight and kinematic viscosity, which allows the buffer portion to have appropriate bonding strength, appropriate curing speed, and appropriate elasticity. Specifically, the first organopolysiloxane has the above weight-average molecular weight and kinematic viscosity, which allows the first organopolysiloxane to be easily injected between the secondary battery cells when forming the buffer portion.

[0059] The first organopolysiloxane contains an alkenyl group bonded to a silicon atom, and at least two alkenyl groups may be contained in one molecule of the first organopolysiloxane. Two to ten alkenyl groups may be contained in one molecule of the first organopolysiloxane. Two to five alkenyl groups may be contained in one molecule of the first organopolysiloxane. Two alkenyl groups may be contained in one molecule of the first organopolysiloxane.

[0060] The first organopolysiloxane may be represented by the following average compositional formula (2): [ka]

[0061] In the composition formula (2), R 1 may be a hydrogen atom, a hydroxyl group, or a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms; R 2 may be an alkenyl group. In composition formula (2), a+c may be about 1.8 to about 2.2, and a+b+c may be about 3.5 to about 8. In composition formula (2), a+b+c may be 4. In composition formula (2), a may be about 1.8 to about 2.2. Additionally, c may be 0.0001 to 0.1.

[0062] The first organopolysiloxane may be represented by the following chemical formula (3): [ka]

[0063] In the formula, R 1 may be a hydrogen atom, a hydroxyl group, or a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms; R 2 may be an alkenyl group. Additionally, in Chemical Formula 3, n may be 1 to 1500, and m may be 0 to 20. In Chemical Formula 3, n may be 10 to 1000, and m may be 0 to 20.

[0064] The first organopolysiloxane may be represented by the following chemical formula (4): [ka]

[0065] In the formula, n may be 1 to 1500. n may be 10 to 1000.

[0066] The first organopolysiloxane may have a weight average molecular weight (Mw) of about 100 g / mol to about 10,000 g / mol. The first organopolysiloxane may have a weight average molecular weight of about 500 g / mol to about 7,000 g / mol. The first organopolysiloxane may have a weight average molecular weight of about 700 g / mol to about 5,000 g / mol. The first organopolysiloxane may have a weight average molecular weight of about 1,000 g / mol to about 3,000 g / mol. The weight average molecular weight may be measured using a polystyrene standard.

[0067] The first organopolysiloxane may have a kinematic viscosity at 23°C of about 10 mPa·s to about 2000 mPa·s. The first organopolysiloxane may have a kinematic viscosity at 23°C of about 30 mPa·s to about 1500 mPa·s. The first organopolysiloxane may have a kinematic viscosity at 23°C of about 100 mPa·s to about 1000 mPa·s. The kinematic viscosity of the first organopolysiloxane may be a value at 23°C measured using an Ostwald viscometer.

[0068] The first organic polysiloxane may be contained in the first curable resin composition at a content of about 20 wt % to about 70 wt % relative to the total weight of the first curable resin composition. The first organic polysiloxane may be contained in the first curable resin composition at a content of about 25 wt % to about 65 wt % relative to the total weight of the first curable resin composition. The first organic polysiloxane may be contained in the first curable resin composition at a content of about 30 wt % to about 60 wt % relative to the total weight of the first curable resin composition.

[0069] The first curable resin composition may further include a high viscosity organopolysiloxane.

[0070] The high viscosity organopolysiloxane can be represented by formula (1), formula (2), formula 3, or formula 4.

[0071] The high-viscosity organopolysiloxane may have a viscosity of about 10,000 mPa·s to 100,000 mPa·s. The high-viscosity organopolysiloxane may have a viscosity of about 20,000 mPa·s to 70,000 mPa·s.

[0072] The high-viscosity organic polysiloxane may be contained in the first curable resin composition at a content of about 2 parts by weight to about 15 parts by weight per 100 parts by weight of the first organic polysiloxane. The high-viscosity organic polysiloxane may be contained in the first curable resin composition at a content of about 3 parts by weight to about 13 parts by weight per 100 parts by weight of the first organic polysiloxane. The high-viscosity organic polysiloxane may be contained in the first curable resin composition at a content of about 4 parts by weight to about 10 parts by weight per 100 parts by weight of the first organic polysiloxane.

[0073] The first curable resin composition may further include a chain extender.

[0074] The chain extender may include a hydrogen group bonded to a silicon atom. The number of hydrogen groups may be 1 to 10 per chain extender molecule. The number of hydrogen groups may be 2 to 10 per chain extender molecule. The number of hydrogen groups may be 2 to 5 per chain extender molecule. The number of hydrogen groups may be 2 per chain extender molecule.

[0075] The chain extender may be represented by the following formula 5: [ka]

[0076] In the formula, R 1 may be a hydrogen atom, a hydroxyl group, or a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms; R 3may be a hydrogen atom. Additionally, in Chemical Formula 5, n may be 1 to 1500, and m may be 0 to 20. In Chemical Formula 5, n may be 10 to 1000, and m may be 0 to 20. In Chemical Formula 5, n may be 1 to 1500, and m may be 0.

[0077] The chain extender may be represented by the following formula 6: [ka]

[0078] The chain extender may have a viscosity of about 20 mPa·s to about 500 mPa·s at about 23° C. The chain extender may have a viscosity of about 30 mPa·s to about 400 mPa·s at about 23° C. The chain extender may have a viscosity of about 40 mPa·s to about 350 mPa·s at about 23° C.

[0079] The chain extender may be contained in the first curable resin composition at a content of about 50 parts by weight to about 300 parts by weight per 100 parts by weight of the first organic polysiloxane. The chain extender may be contained in the first curable resin composition at a content of about 70 parts by weight to about 250 parts by weight per 100 parts by weight of the first organic polysiloxane. The chain extender may be contained in the first curable resin composition at a content of about 80 parts by weight to about 200 parts by weight per 100 parts by weight of the first organic polysiloxane.

[0080] The first curable resin composition may further include a crosslinker.

[0081] The crosslinker may be represented by the following formula 7: [ka]

[0082] In Formula 7, R 1 may be a hydrogen atom, a hydroxyl group, or a saturated or unsaturated monovalent hydrocarbon group having 1 to 18 carbon atoms; R 3may be a hydrogen atom. Additionally, in Chemical Formula 7, n may be 1 to 1500, and m may be 1 to 500. In Chemical Formula 7, n may be 10 to 1000, and m may be 1 to 100.

[0083] The crosslinker may be represented by the following formula 8: [ka]

[0084] In Chemical Formula 8, n may be 1 to 1500, and m may be 1 to 500. In Chemical Formula 8, n may be 10 to 1000, and m may be 1 to 100.

[0085] The crosslinking agent may have a viscosity of about 10 mPa·s to about 1000 mPa·s at about 23° C. The crosslinking agent may have a viscosity of about 50 mPa·s to about 700 mPa·s at about 23° C. The crosslinking agent may have a viscosity of about 60 mPa·s to about 500 mPa·s at about 23° C.

[0086] The crosslinking agent may be contained in the first curable resin composition at a content of about 2 parts by weight to about 10 parts by weight per 100 parts by weight of the first organopolysiloxane. The crosslinking agent may be contained in the first curable resin composition at a content of about 3 parts by weight to about 8 parts by weight per 100 parts by weight of the first organopolysiloxane. The crosslinking agent may be contained in the first curable resin composition at a content of about 4 parts by weight to about 7 parts by weight per 100 parts by weight of the first organopolysiloxane.

[0087] The first curable resin composition may further include a hollow filler.

[0088] The hollow filler may include a hollow inorganic filler. The hollow filler may include glass. The hollow filler may include borosilicate glass.

[0089] The hollow filler may have an average particle size (D50) of about 10 μm to about 100 μm. The hollow filler may have an average particle size (D50) of about 15 μm to about 100 μm. The hollow filler may have an average particle size (D50) of about 20 μm to about 90 μm.

[0090] The hollow filler is approximately 1.9m 2 / g ~ approx. 2.7m 2 / g specific surface area.

[0091] The hollow filler may have a collapse pressure at which 10% by volume collapses. The collapse pressure of the hollow filler may be from about 250 psi to about 27,000 psi.

[0092] The hollow filler may have a softening temperature of about 500°C to about 700°C.

[0093] The hollow filler may have a thermal conductivity of about 0.05 W / m·K to about 0.20 W / m·K.

[0094] Hollow filler is approximately 0.125 g / cm 3 ~Approx. 0.60g / cm 3 The true density may be

[0095] The term "true density" refers to the quotient obtained by dividing the mass of a hollow filler sample by the true volume of the mass of the hollow filler, as measured by a gas pycnometer. "True volume" refers to the total volume of the hollow filler, not the bulk volume.

[0096] The first curable resin composition may further include an additive.

[0097] The additive may be at least one selected from the group consisting of pigments, dyes, clays, surfactants, oils, wollastonite, and fumed silica.

[0098] "Dye" refers only to a colored or fluorescent organic substance that imparts color to a substrate by selective absorption of light. "Pigment" generally refers to a colored, white, or fluorescent particulate organic or inorganic solid that is insoluble in the medium or substrate in which it is incorporated and essentially unaffected by physical and chemical action. The appearance of a pigment is altered by selective absorption and / or scattering of light. Pigments generally retain their crystalline or particle structure throughout the coloring process. Pigments and dyes are well known in the art and need not be described in detail herein.

[0099] The clay may be a silicate containing a cation which may be selected from calcium, magnesium, aluminum, sodium, potassium and lithium cations, and mixtures thereof.

[0100] The surfactant may be a silicone polyether surfactant.

[0101] The oil may be castor oil. The oil may function as a rheology modifier.

[0102] Wollastonite, also known as calcium metasilicate, is a natural material that may be added as a fire retardant.

[0103] Fumed silica may be used as an additive to modify the rheology of these materials. Fumed silica may be obtained by high temperature pyrolysis of volatile silicon compounds in an oxyhydrogen flame to produce finely divided silica.

[0104] The additive may be contained in the first curable resin composition at a content of about 2 parts by weight to about 10 parts by weight per 100 parts by weight of the first organic polysiloxane. The additive may be contained in the first curable resin composition at a content of about 3 parts by weight to about 8 parts by weight per 100 parts by weight of the first organic polysiloxane.

[0105] The silicone-based resin composition includes a second curable resin composition.

[0106] The second curable resin composition includes a second organopolysiloxane.

[0107] The second organopolysiloxane can be represented by formula (1).

[0108] The second organopolysiloxane can be represented by formula (2).

[0109] The second organopolysiloxane may be represented by Formula 3:

[0110] The second organopolysiloxane may be represented by Formula 4:

[0111] The second organopolysiloxane can be substantially the same as the first organopolysiloxane.

[0112] The second organic polysiloxane may be contained in the second curable resin composition at a content of about 70 wt % to about 95 wt % relative to the total weight of the second curable resin composition. The second organic polysiloxane may be contained in the second curable resin composition at a content of about 75 wt % to about 95 wt % relative to the total weight of the second curable resin composition. The second organic polysiloxane may be contained in the second curable resin composition at a content of about 80 wt % to about 95 wt % relative to the total weight of the second curable resin composition.

[0113] The second curable resin composition contains a curing catalyst, which accelerates the curing of the silicone-based resin composition.

[0114] The curing catalyst may include a platinum-based catalyst.

[0115] Examples of curing catalysts include platinum-divinyltetramethyldisiloxane complex, organic titanate esters such as tetrabutyl titanate and tetraisopropyl titanate; organic titanium chelate compounds such as titanium diisopropyl bis(acetylacetate) and titanium diisopropyl bis(ethylacetonate); organic aluminum compounds such as aluminum tris(acetylacetonate) and aluminum tris(ethylacetonate); organic zirconium compounds such as zirconium tetra(acetylacetonate) and zirconium tetrabutylate; dibutyltin dioctoate, ... Examples include organic tin compounds such as tin dilaurate and dibutyltin-2-ethylhexoate; metal salts of organic carboxylic acids such as tin naphthenate, tin oleate, tin butyrate, cobalt naphthenate, and zinc stearate; amine compounds and their salts such as hexylamine and dodecylamine phosphate; quaternary ammonium salts such as benzyltriethylammonium acetate; lower fatty acid salts of alkali metals such as potassium acetate; dialkylhydroxylamines such as dimethylhydroxylamine and diethylhydroxylamine; and guanidyl group-containing organosilicon compounds.

[0116] The second curable resin composition may include a curing catalyst in an amount of about 0.01 to about 5 parts by weight per 100 parts by weight of the second organopolysiloxane. The second curable resin composition may include a curing catalyst in an amount of about 0.03 to about 3 parts by weight per 100 parts by weight of the second organopolysiloxane. The second curable resin composition may include a curing catalyst in an amount of about 0.1 to about 2 parts by weight per 100 parts by weight of the second organopolysiloxane.

[0117] The second curable resin composition may further contain a reaction inhibitor, which may include at least one selected from the group consisting of acetylene compounds such as 2-methyl-3-butyn-2-ol, 2-phenyl-3-butyn-2-ol, and 1-ethynyl-1-cyclohexanol; ene-yne ​​compounds such as 3-methyl-3-penten-1-yne and 3,5-dimethyl-3-hexen-1-yne; and curing reaction inhibitors such as hydrazine-based compounds, phosphine-based compounds, and mercaptan-based compounds.

[0118] The content of the reaction inhibitor may be about 0.0001 to about 10 parts by mass per 100 parts by mass of the second organopolysiloxane.

[0119] The second curable resin composition may further include a hollow filler.

[0120] That is, the hollow filler may be contained in the first curable resin composition, may be contained in the second curable resin composition, or may be contained in both the first curable resin composition and the second curable resin composition.

[0121] The second curable resin composition may contain about 3 parts by weight to about 20 parts by weight of the hollow filler per 100 parts by weight of the second organic polysiloxane. The second curable resin composition may contain about 5 parts by weight to about 15 parts by weight of the hollow filler per 100 parts by weight of the second organic polysiloxane. The second curable resin composition may contain about 6 parts by weight to about 14 parts by weight of the hollow filler per 100 parts by weight of the second organic polysiloxane.

[0122] The second curable resin composition may further contain an additive in a content of about 0.1 to about 5 parts by weight per 100 parts by weight of the second organopolysiloxane.

[0123] The silicone resin composition may be prepared by a conventional known method for preparing a silicone composition, and is not particularly limited.

[0124] The silicone-based resin composition may be prepared by mixing the first curable resin composition and the second curable resin composition.

[0125] In the silicone-based resin composition, the weight ratio of the first curable resin composition to the second curable resin composition may be about 0.5:1 to about 1:0.5. In the silicone-based resin composition, the weight ratio of the first curable resin composition to the second curable resin composition may be about 0.7:1 to about 1:0.7. In the silicone-based resin composition, the weight ratio of the first curable resin composition to the second curable resin composition may be about 0.8:1 to about 1:0.8.

[0126] For example, the silicone-based resin composition may be prepared by mixing the first curable resin composition and the second curable resin composition for 30 minutes to 4 hours using a mixer such as Trimix, Twin Mix, and Planetary Mixer (all registered trademarks manufactured by Inoue Seisakusho Co., Ltd.), Ultra Mixer (registered trademark manufactured by Mizuho Kogyo Co., Ltd.), or Hibis Disper Mix (registered trademark manufactured by Primix Co., Ltd.). The temperature during the mixing process may be room temperature.

[0127] The silicone resin composition may contain a hollow filler in an amount of about 5% by weight to about 20% by weight based on the total weight. The silicone resin composition may contain a hollow filler in an amount of about 6% by weight to about 15% by weight based on the total weight. The silicone resin composition may contain a hollow filler in an amount of about 7% by weight to about 13% by weight based on the total weight.

[0128] The silicone resin composition may comprise the first organopolysiloxane and the second organopolysiloxane in a content of about 50% to about 80% by weight based on the total weight. The silicone resin composition may comprise the first organopolysiloxane and the second organopolysiloxane in a content of about 55% to about 75% by weight based on the total weight. The silicone resin composition may comprise the first organopolysiloxane and the second organopolysiloxane in a content of about 60% to about 75% by weight based on the total weight.

[0129] The silicone resin composition may contain the high-viscosity organic polysiloxane at a content of about 0.3% to about 7% by weight. The silicone resin composition may contain the high-viscosity organic polysiloxane at a content of about 0.5% to about 5% by weight. The silicone resin composition may contain the high-viscosity organic polysiloxane at a content of about 0.6% to about 4% by weight.

[0130] The silicone resin composition may contain a crosslinking agent at a content of about 0.3% by weight to about 5% by weight. The silicone resin composition may contain a crosslinking agent at a content of about 0.5% by weight to about 3% by weight. The silicone resin composition may contain a crosslinking agent at a content of about 0.6% by weight to about 2% by weight.

[0131] The silicone resin composition may contain a chain extender at a content of about 10% by weight to about 40% by weight. The silicone resin composition may contain a chain extender at a content of about 15% by weight to about 35% by weight. The silicone resin composition may contain a chain extender at a content of about 20% by weight to about 30% by weight.

[0132] In the silicone resin composition, the ratio of the total weight of the first organopolysiloxane and the second organopolysiloxane to the weight of the chain extender may be from about 3:1 to about 1.5:1. In the silicone resin composition, the ratio of the total weight of the first organopolysiloxane and the second organopolysiloxane to the weight of the chain extender may be from about 2.5:1 to about 1.6:1.

[0133] The silicone resin composition may contain the additive at a content of about 0.3% by weight to about 5% by weight. The silicone resin composition may contain the additive at a content of about 0.5% by weight to about 3% by weight. The silicone resin composition may contain the additive at a content of about 0.6% by weight to about 2% by weight.

[0134] The silicone resin composition may contain the curing catalyst at a content of about 0.01% by weight to about 1% by weight. The silicone resin composition may contain the curing catalyst at a content of about 0.02% by weight to about 0.9% by weight. The silicone resin composition may contain the curing catalyst at a content of about 0.03% by weight to about 0.8% by weight.

[0135] The silicone resin composition may contain a reaction inhibitor at a content of about 0.01% by weight to about 1% by weight. The silicone resin composition may contain a reaction inhibitor at a content of about 0.02% by weight to about 0.9% by weight. The silicone resin composition may contain a reaction inhibitor at a content of about 0.03% by weight to about 0.8% by weight.

[0136] 4, the battery cell 100 is placed in the case body 210. The battery cell may be placed in the seating portion.

[0137] Referring to FIG. 5, silicone resin composition 601 is injected between battery cells 100 in case body 210.

[0138] 6, heat is applied to the injected silicone-based resin composition 601. Heat may be applied to an upper portion of the injected silicone-based resin composition, thus curing or semi-curing a portion of the injected silicone-based resin composition to form a capping portion 602. The capping portion 602 may be disposed on the uncured portion 601 of the injected silicone-based resin composition.

[0139] The curing temperature of the upper portion of the injected silicone resin composition may be about 60°C to about 150°C. The curing time of the upper portion of the injected silicone resin composition may be about 1 minute to about 10 minutes. Heat may be applied to the upper portion of the injected silicone resin composition by an infrared heater.

[0140] The capping portion may be formed on the upper portion of the case body. The capping portion may be formed on the upper portion of the silicone-based resin composition injected based on gravity.

[0141] The capping portion may be disposed at a height of about 0.5 to about 1 from the bottom relative to the total depth of the case body. The capping portion may be disposed at a height of about 0.8 to about 1 from the bottom relative to the total depth of the case body. The capping portion may be disposed at a height of about 0.9 to about 1 from the bottom relative to the total depth of the case body.

[0142] The capping portion may seal the inside of the case body. The capping portion may enclose the uncured portion of the injected silicone-based resin composition. Thus, the capping portion may prevent the uncured portion of the injected silicone-based resin composition from eluting.

[0143] Next, the bus bar member 300, the circuit board assembly 400, the support plate 500 and the case cover are assembled to the case body and the battery cell.

[0144] The uncured portion of the injected silicone resin composition may then be cured at room temperature, thus forming a buffer portion.

[0145] The silicone-based resin composition may have a first cure rate at about 23°C.

[0146] For silicone-based resin compositions, the first cure rate may be about 5 mPa·s / min to about 70 mPa·s / min. For silicone-based resin compositions, the first cure rate may be about 10 mPa·s / min to about 70 mPa·s / min. For silicone-based resin compositions, the first cure rate may be about 15 mPa·s / min to about 60 mPa·s / min.

[0147] The silicone-based resin composition may have a second cure rate at about 70°C.

[0148] For silicone-based resin compositions, the second cure rate may be from about 400 mPa·s / min to about 2000 mPa·s / min. For silicone-based resin compositions, the second cure rate may be from about 550 mPa·s / min to about 1900 mPa·s / min. For silicone-based resin compositions, the second cure rate may be from about 500 mPa·s / min to about 1800 mPa·s / min.

[0149] Additionally, the silicone-based resin composition may have a third cure rate at about 60°C.

[0150] For silicone-based resin compositions, the third cure rate may be from about 100 mPa·s / min to about 1500 mPa·s / min. For silicone-based resin compositions, the third cure rate may be from about 200 mPa·s / min to about 1200 mPa·s / min. For silicone-based resin compositions, the third cure rate may be from about 250 mPa·s / min to about 1000 mPa·s / min.

[0151] Additionally, the silicone-based resin composition may have a fourth cure rate at about 50°C.

[0152] For the silicone-based resin composition, the fourth cure rate may be about 70 mPa·s / min to about 1000 mPa·s / min. For the silicone-based resin composition, the fourth cure rate may be about 80 mPa·s / min to about 800 mPa·s / min. For the silicone-based resin composition, the fourth cure rate may be about 100 mPa·s / min to about 700 mPa·s / min.

[0153] At about 70° C., the silicone resin composition may have a viscosity of about 600 mPa·s to about 1100 mPa·s. At about 70° C., the silicone resin composition may have a viscosity of about 700 mPa·s to about 1000 mPa·s.

[0154] At about 60° C., the silicone resin composition may have a viscosity of about 650 mPa·s to about 1100 mPa·s. At about 60° C., the silicone resin composition may have a viscosity of about 750 mPa·s to about 1000 mPa·s.

[0155] At about 50° C., the silicone resin composition may have a viscosity of about 650 mPa·s to about 1100 mPa·s. At about 60° C., the silicone resin composition may have a viscosity of about 750 mPa·s to about 1000 mPa·s.

[0156] At about 23° C., the silicone resin composition may have a viscosity of about 750 mPa·s to about 1200 mPa·s. At about 60° C., the silicone resin composition may have a viscosity of about 850 mPa·s to about 1100 mPa·s.

[0157] The ratio of the first cure rate to the second cure rate may be from about 1:10 to about 1:400. The ratio of the first cure rate to the second cure rate may be from about 1:30 to about 1:200. The ratio of the first cure rate to the second cure rate may be from about 1:40 to about 1:200.

[0158] The ratio of the first cure rate to the third cure rate may be from about 1:9 to about 1:300. The ratio of the first cure rate to the third cure rate may be from about 1:25 to about 1:150. The ratio of the first cure rate to the third cure rate may be from about 1:20 to about 1:150.

[0159] The ratio of the first cure rate to the fourth cure rate may be from about 1:8 to about 1:200. The ratio of the first cure rate to the fourth cure rate may be from about 1:20 to about 1:100. The ratio of the first cure rate to the fourth cure rate may be from about 1:15 to about 1:100.

[0160] The first cure rate, the second cure rate, the third cure rate, and the fourth cure rate may be derived by measuring the viscosity of the silicone resin composition over time at about 23°C, about 70°C, about 60°C, and about 50°C, respectively.

[0161] The first cure rate, the second cure rate, the third cure rate, and the fourth cure rate may be derived by measuring the viscosity of the silicone resin composition over time at intervals of about 10 seconds, about 20 seconds, about 30 seconds, about 40 seconds, about 50 seconds, or about 60 seconds. Additionally, each of the first cure rate, the second cure rate, the third cure rate, and the fourth cure rate may be an average value obtained by dividing the change in viscosity measured in the time interval by the time interval.

[0162] The first cure rate, second cure rate, third cure rate, and fourth cure rate may be calculated according to Equation 1: [Formula 1] Cure rate = viscosity change / time interval

[0163] The first curing rate, the second curing rate, the third curing rate, and the fourth curing rate may be measured for about 1 minute to about 30 minutes. The first curing rate, the second curing rate, the third curing rate, and the fourth curing rate may be measured for about 1 minute to about 20 minutes. The first curing rate, the second curing rate, the third curing rate, and the fourth curing rate may be measured for about 1 minute, and may be measured while the viscosity of the silicone resin composition can be measured.

[0164] The first cure rate, the second cure rate, the third cure rate, and the fourth cure rate may be measured by a Brookfield viscometer (Model DV2T). In addition, when measuring the viscosity, the rotation speed may be about 10 rpm. In addition, when measuring the viscosity, the selectivity factor may be about 200.

[0165] The silicone-based resin composition may have a consistency.

[0166] The consistency of the silicone resin composition may be measured by the following method. [Measurement method] The silicone resin composition is fully cured to prepare a silicone resin block. The silicone resin composition is cured at about 70°C for 20 minutes to produce a silicone resin block having a height of about 70 mm, a diameter of about 60 mm, and a cylindrical shape. The consistency of the silicone resin block is measured according to ISO 2137. A 1 / 4 scale cone is used to measure the consistency.

[0167] The consistency of the silicone resin composition may be about 2 1 / 10 mm to about 50 1 / 10 mm. The consistency of the silicone resin composition may be about 3 1 / 10 mm to about 45 1 / 10 mm. The consistency of the silicone resin composition may be about 4 1 / 10 mm to about 30 1 / 10 mm. The consistency of the silicone resin composition may be about 20 1 / 10 mm to about 50 1 / 10 mm. The consistency of the silicone resin composition may be about 25 1 / 10 mm to about 45 1 / 10 mm. The consistency of the silicone resin composition may be about 20 1 / 10 mm to about 40 1 / 10 mm.

[0168] Since the silicone resin composition has a consistency within the above range, it can act as a buffer between battery cells, and the uncured silicone resin composition can be easily enclosed in the capping portion.

[0169] In addition, since the consistency of the silicone-based resin composition is within the above range, the battery cells can be properly fixed.

[0170] The silicone resin composition may have a contact angle.

[0171] The contact angle of the silicone resin composition may be measured according to the following measurement method: [Measurement method] The silicone resin composition is dropped onto a glass plate, and then the contact angle between the upper surface of the glass plate and the silicone resin composition drop is measured. The contact angle between the glass plate and the silicone resin composition may be measured at a time point of about 5 seconds.

[0172] The contact angle of the silicone resin composition may be about 10° to about 45°. The contact angle of the silicone resin composition may be about 10° to about 40°. The contact angle of the silicone resin composition may be about 10° to about 35°. The contact angle of the silicone resin composition may be about 10° to about 30°. The contact angle of the silicone resin composition may be about 15° to about 30°.

[0173] The silicone-based resin composition may have a contact angle reduction rate.

[0174] The rate of contact angle decrease can be calculated by the following equation 2: [Formula 2] Contact angle decrease rate = (contact angle at 0.25 seconds - contact angle at 5 seconds) / 4.75 seconds

[0175] The contact angle reduction rate of the silicone resin composition may be about 5° / sec to about 15° / sec. The contact angle reduction rate of the silicone resin composition may be about 6° / sec to about 14° / sec. The contact angle reduction rate of the silicone resin composition may be about 7° / sec to about 13° / sec.

[0176] Since the silicone-based resin composition has a contact angle and a contact angle reduction rate within the above ranges, the silicone-based resin composition can be easily injected between battery cells. That is, the battery cells may have an exterior material such as a polymer film, and the silicone-based resin composition can have high wettability with respect to the exterior material of the battery cells.

[0177] Therefore, the silicone resin composition can be quickly injected between the battery cells, and the formation of unfilled spaces can be prevented.

[0178] The silicone-based resin composition may have thermal conductivity.

[0179] In addition, the first curable resin composition may have a contact angle. The contact angle of the first curable resin composition may be measured by the above-mentioned measurement method.

[0180] The contact angle of the first curable resin composition may be about 10° to about 45°. The contact angle of the first curable resin composition may be about 10° to about 40°. The contact angle of the first curable resin composition may be about 10° to about 35°. The contact angle of the first curable resin composition may be about 15° to about 30°.

[0181] In addition, the second curable resin composition may have a contact angle. The contact angle of the second curable resin composition may be measured by the above-mentioned measurement method.

[0182] The contact angle of the second curable resin composition may be about 10° to about 45°. The contact angle of the second curable resin composition may be about 10° to about 40°. The contact angle of the second curable resin composition may be about 10° to about 35°. The contact angle of the second curable resin composition may be about 15° to about 30°.

[0183] The first curable resin composition may have a contact angle reduction rate.

[0184] The contact angle reduction rate of the first curable resin composition may be about 6° / sec to about 14° / sec. The contact angle reduction rate of the first curable resin composition may be about 7° / sec to about 13° / sec.

[0185] The second curable resin composition may have a contact angle reduction rate.

[0186] The contact angle reduction rate of the second curable resin composition may be about 6° / sec to about 14° / sec. The contact angle reduction rate of the second curable resin composition may be about 7° / sec to about 13° / sec.

[0187] A method for manufacturing a battery module according to one embodiment includes the steps of injecting and filling a silicone-based resin composition into a case, and curing a portion of the silicone-based resin composition to form a capping portion.

[0188] Therefore, the method for manufacturing a battery module according to an embodiment may reduce the time required to cure the curable resin composition. That is, after forming the capping portion, the method for manufacturing a battery module according to an embodiment may cure the remaining curable resin composition.

[0189] In particular, the silicone-based resin composition may have a cure rate within the above range, i.e., the silicone-based resin composition may have a high cure rate at high temperatures and a low cure rate at low temperatures.

[0190] Therefore, the curable resin composition in the open portion of the case can be rapidly cured under high temperature conditions, and therefore, the method for manufacturing a battery module according to one embodiment can firmly and rapidly form the capping portion.

[0191] Therefore, the method for manufacturing a battery module according to an embodiment may prevent the curable resin composition from flowing out even if the curable resin composition is not completely cured. In addition, the method for manufacturing a battery module according to an embodiment may prevent the curable resin composition from moving away from a desired position.

[0192] In addition, the curable resin composition has a low cure rate at room temperature, so the viscosity increase of the curable resin composition can be minimized until the two-component composition is mixed and then poured.

[0193] That is, the curable resin composition has a low curing rate at low temperatures, which can reduce process problems during mixing and injection. Therefore, the silicone-based resin composition can be easily applied to battery module manufacturing methods.

[0194] In particular, since the silicone-based resin composition has a low curing rate at low temperatures, the method for manufacturing a battery module according to an embodiment may facilitate injection of the curable resin composition.

[0195] In addition, the manufacturing method of the battery module according to the embodiment can inject the curable resin composition uniformly into the desired position of the case as a whole without leaving any unfilled space.

[0196] FIG. 7 is a schematic diagram illustrating a battery pack according to an embodiment, and FIG. 8 is a schematic diagram illustrating a vehicle according to an embodiment of the present invention.

[0197] 7 and 8, a battery pack 1 may include at least one battery module 10 according to the above embodiment and a pack case 50 for packaging the at least one battery module 10.

[0198] Battery pack 1 may be provided in vehicle V as a fuel source for vehicle V. For example, battery pack 1 may be provided in electric vehicles, hybrid vehicles, and other vehicles V that can use battery pack 1 as a fuel source.

[0199] Additionally, the battery pack 1 may be provided in other devices, apparatuses, and facilities in addition to the vehicle V, such as energy storage systems that use secondary batteries.

[0200] As such, equipment, devices, and facilities such as a battery pack 1 according to this embodiment and a vehicle V including the battery pack 1 may be equipped with the battery module 10, and the battery pack 1 may have all the advantages of the battery module 10, and equipment, devices, and facilities such as a vehicle V equipped with the battery pack 1 may be implemented.

[0201] According to the various embodiments described above, a battery module 10 capable of supporting the battery cells 100 more stably, and a vehicle V including the battery pack 1 and the battery module 10 may be provided.

[0202] In addition, according to the various embodiments described above, a battery module 10 may be provided that can improve the safety of the battery cells 100 by preventing damage to the battery cells 100 due to external impact, as well as a vehicle V equipped with a battery pack 1 and the battery module 10.

[0203] Hereinafter, the present invention will be described in more detail with reference to examples and comparative examples for the purpose of clarifying the present invention, but the present invention is not limited thereto. [Example]

[0204] A: a polysiloxane compound having a viscosity of about 150 mPa·s to about 220 mPa·s at 23°C and containing silicon-bonded alkenyl groups and represented by Chemical Formula 4 B: a polysiloxane compound having a viscosity of about 40,000 mPa·s to about 50,000 mPa·s at 23°C and containing silicon-bonded alkenyl groups and represented by Chemical Formula 4 C-1: A hydrogen polysiloxane compound having a viscosity of about 150 mPa·s to about 250 mPa·s at 23°C and having hydrogen groups bonded to its side chains and represented by Chemical Formula 8 C-2: A hydrogen polysiloxane compound having a viscosity of about 60 mPa·s to about 90 mPa·s at 23°C and having hydrogen groups bonded to its terminals, represented by chemical formula 6. D: Platinum-divinyltetramethyldisiloxane complex E: 1-ethynyl-1-cyclohexanol F: Bubble glass (3M, Glass bubble K15, density 0.15g / cm 3 ) G: Color pigment (ELASTOSIL® COLOR PASTE FL ULTRAMARINE BLUE RAL 5002)

[0205] The components were mixed uniformly using a planetary mixer at room temperature for 1 hour at a speed of about 40 rpm, thereby preparing a first curable resin composition summarized in Table 1 below and a second curable resin composition summarized in Table 2 below.

[0206] [Table 1]

[0207] [Table 2]

[0208] <Measurement Example> 1.Curing speed The first curable resin composition and the second curable resin composition were mixed uniformly in a weight ratio of 1:1 for about 1 minute, and the viscosity of the mixed composition was measured at about 23°C at intervals of about 10 seconds at a speed of about 10 rpm using a viscometer (Brookfield viscometer, model DV2T).

[0209] In addition, the first composition and the second composition were mixed uniformly under the same conditions as above, the temperature was raised to about 70°C, and the viscosity of the mixed composition was measured using a viscometer at intervals of about 10 seconds.

[0210] 2. Consistency The first and second compositions were mixed uniformly under the same conditions as above and cured at 60°C for about 1 hour to produce a silicone resin block having a diameter of about 60 mm and a height of about 70 mm. The penetration depth of the silicone resin block was measured according to ISO 2137 using a 9.38 g hollow cone.

[0211] 3.Contact angle The first composition and the second composition were mixed uniformly under the same conditions as above, and 0.02 ml of the mixed composition was dropped onto a glass. The contact angle over time was measured using a contact angle measuring device (Phoenix 300 analyzer). The contact angles of the first composition and the second composition were measured in the same manner.

[0212] 4.Flame retardant Measurement was performed according to the UL94 test method.

[0213] 5. Injection characteristics The mixed composition was poured into a stainless steel tube having a diameter of about 1.94 mm, and it was observed whether the mixed composition was expelled by its own weight.

[0214] [Table 3]

[0215] [Table 4]

[0216] [Table 5]

[0217] [Table 6]

[0218] [Table 7]

[0219] As summarized in Tables 3 to 7, the silicone-based curable resin compositions according to the examples exhibited suitable curing speeds, suitable mechanical strengths, and suitable surface properties. In addition, in the battery pack manufacturing method, the silicone-based curable resin composition was filled uniformly and entirely without gaps. [Explanation of symbols]

[0220] Cell 100 Module Case 200 Busbar material 300 Circuit Board Assembly 400 Support plate 500 Buffer part 600

Claims

1. Providing a case configured to house a plurality of battery cells therein; Filling the case with a curable resin composition; curing a portion of the curable resin composition to form a capping portion; A method for manufacturing a battery module comprising: the curable resin composition comprises a silicone-based polymer, a curing catalyst, a crosslinking agent, and a hollow filler; the curable resin composition has a curing rate of 10 mPa·s / min to 70 mPa·s / min at 23°C; The curable resin composition has a curing rate of 400 mPa·s / min to 2000 mPa·s / min at 70°C. method.

2. A plurality of battery cells; a case configured to house the battery cell; a buffer portion disposed in the case and configured to surround the battery cell; A battery module comprising: the buffer portion comprises a curable resin composition, the curable resin composition includes a silicone-based polymer, a curing catalyst, a crosslinking agent, and a hollow filler; the curable resin composition has a curing rate of 10 mPa·s / min to 70 mPa·s / min at 23°C; The curable resin composition has a curing rate of 400 mPa·s / min to 2000 mPa·s / min at 70°C. Battery module.

3. a silicone-based polymer; A curing catalyst; a cross-linking agent; A hollow filler; A curable resin composition for producing a battery module, comprising: the curable resin composition has a first curing rate of 10 mPa·s / min to 70 mPa·s / min at 23°C; the curable resin composition has a second curing rate of 400 mPa·s / min to 2000 mPa·s / min at 70°C; Curable resin composition.

4. The curable resin composition according to claim 3, wherein the curable resin composition has a viscosity of 500 mPa·s to 1200 mPa·s at 23°C.

5. The curable resin composition according to claim 4, wherein the curable resin composition has a viscosity of 400 mPa·s to 1100 mPa·s at 70°C.

6. 4. The curable resin composition according to claim 3, wherein the ratio of the second curing rate to the first curing rate is 10 to 60.

7. The curable resin composition according to claim 3 , further comprising a pigment or a dye.

8. The curable resin composition according to claim 3 , further comprising a reaction inhibitor.

9. 9. The curable resin composition according to claim 8, wherein the curable resin composition is formed by mixing a first resin composition containing the curing catalyst and the reaction inhibitor with a second resin composition containing the crosslinking agent.

10. The curable resin composition according to claim 3, wherein the consistency of the curable resin composition measured according to the following measurement method is 20 1 / 10 mm to 50 1 / 10 mm. [Measurement method] The curable resin composition is mixed and cured at 25°C for 3 hours to produce a silicone-based resin block with a diameter of 60 mm and a height of 70 mm, and the penetration depth of the silicone-based resin block is measured according to ISO 2137 using a 9.38 g hollow cone.

11. The curable resin composition according to claim 3, wherein the contact angle of the curable resin composition measured according to the following measurement method is 10° to 30°. [Measurement method] The curable resin composition is added dropwise to a glass plate in a volume of 10 ml, and after 5 seconds, the contact angle between the glass plate and the curable resin composition is measured.

12. The curable resin composition according to claim 11, wherein the contact angle reduction rate of the curable resin composition measured according to the following measurement method is 5° / sec to 15° / sec. [Measurement method] The curable resin composition was added dropwise to the glass plate in the volume specified above, and after 0.25 seconds, the contact angle between the glass plate and the curable resin composition was measured. The contact angle reduction rate was a value obtained by dividing the difference between the contact angle at 0.25 seconds and the contact angle at 5 seconds by 4.75 seconds.

13. A curable resin composition for manufacturing a battery module, the curable resin composition comprising: a first silicone resin composition comprising a first organopolysiloxane, a crosslinker, and a chain extender; a second silicone resin composition comprising a second organopolysiloxane, a curing catalyst, and a reaction inhibitor; comprising at least one of the first silicone resin composition and the second silicone resin composition comprises hollow beads; When the first silicone resin composition and the second silicone resin composition are mixed and cured, the curable resin composition has a first curing rate of 10 mPa·s / min to 70 mPa·s / min at 23°C; the curable resin composition has a second curing rate of 400 mPa·s / min to 2000 mPa·s / min at 70°C; Curable resin composition.

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