Display panel and method for manufacturing the same

Abstract

This application provides a display panel (100) and a method for manufacturing the same. The manufacturing method includes providing an array substrate (10), coating an active base material onto a first electrode pattern layer (13) to form a binding layer (21), placing the array substrate (10) in a reaction solution (40) containing a light-emitting material to adhere the light-emitting material to the binding layer (21) to form a light-emitting layer (22), and forming a second electrode pattern layer (23) on the light-emitting layer (22). Here, the active base material has a first functional group (21a), and the light-emitting material has a second functional group (22b) and a third functional group (22c). In the reaction step, the second functional group (22b) and the first functional group (22a) undergo a graft copolymerization reaction to adhere the light-emitting material to the binding layer (21), and a polymerization reaction occurs between the third functional group (22c) to form a light-emitting layer (22) having a predetermined thickness (d). This manufacturing method does not require vapor deposition, which can reduce production costs and improve the utilization rate of luminescent materials.

Description

Technical Field

[0001] <Cross - reference to related cases> This application claims priority from a Chinese patent application with the application number 2023111132323 filed on August 31, 2023, and the entire content of this Chinese patent application is incorporated herein by reference into this application.

[0002] This application relates to the technical field of display panels, and particularly to display panels and their manufacturing methods.

Background Art

[0003] Compared with a liquid crystal display (LCD) panel, an organic light - emitting diode (OLED) display panel has many advantages such as being all - solid - state, actively emitting light, having high brightness, high contrast, being ultra - thin, having low power consumption, having no viewing - angle limitation, and having a wide operating temperature range, and is being increasingly emphasized.

[0004] In the manufacturing process of OLED devices, the most important and costly process is the deposition of light - emitting materials. In the prior art, a vacuum evaporator is often combined with a fine metal mask (FMM) to deposit light - emitting materials. However, firstly, the manufacturing cost of the vacuum evaporator is high, there are few suppliers, and it is difficult to achieve domestic production. Secondly, the FMM belongs to consumable core components, and a set of mask plates can only be applied to one type of display product and cannot be mass - produced currently, and it is difficult to purchase high - end FMM. Thirdly, in this process, the actual utilization rate of expensive light - emitting materials is less than 20%, and it is difficult to recycle, causing a large amount of material waste. Therefore, there is an urgent need to find an alternative means for depositing light - emitting materials on a substrate and a production method for producing OLED display panels without using FMM.

Summary of the Invention

[0005] This application provides a display panel and a method for manufacturing the same, with the aim of solving the problems of high requirements for alignment accuracy in the conventional deposition process, high costs, and low utilization rates of light-emitting materials.

[0006] To solve the above technical problems, the first technical solution employed in this application provides a method for manufacturing a display panel, the manufacturing method comprising the steps of: providing an array substrate, the array substrate comprising a substrate, a drive circuit layer formed on one side of the substrate, and a first electrode pattern layer formed on the side of the drive circuit layer away from the substrate, the first electrode pattern layer comprising first electrodes distributed in an array; manufacturing an emissive layer on the array substrate; and manufacturing a second electrode pattern layer on the emissive layer, the second electrode pattern layer comprising second electrodes corresponding one-to-one with the first electrodes. The process includes, wherein the step of manufacturing a light-emitting layer on the array substrate includes coating the first electrode pattern layer with an active base material to form a binding layer, and placing the array substrate in a reaction solution containing a light-emitting material to adhere the light-emitting material to the binding layer and form a light-emitting layer, wherein the active base material has a first functional group, and the light-emitting material has a second functional group and a third functional group, and in the reaction step, the second functional group and the first functional group undergo a graft copolymerization reaction to adhere the light-emitting material to the binding layer, and a polymerization reaction occurs between the third functional group and the third functional group to form a light-emitting layer having a predetermined thickness.

[0007] Here, the step of placing the array substrate in a reaction solution containing a light-emitting material, adhering the light-emitting material to the binder layer, and forming a light-emitting layer includes: placing the array substrate in a first reaction solution containing a light-emitting material and adjusting the first reaction environment so that the light-emitting material adheres to the binder layer; and placing the array substrate in a second reaction solution containing a light-emitting material and adjusting the second reaction environment to form the light-emitting layer having a predetermined thickness.

[0008] Hereinafter, before the step of placing the array substrate in a reaction solution containing the light-emitting material, a photoresist is applied to the binding layer and exposed and developed to expose the portion of the binding layer corresponding to the first electrode. After the step of placing the array substrate in a reaction solution containing the light-emitting material, adhering the light-emitting material to the binding layer, and forming the light-emitting layer is completed, the photoresist is further removed.

[0009] Here, the light-emitting layer includes a first light-emitting layer, a second light-emitting layer, and a third light-emitting layer, and the manufacturing method includes repeatedly taking the step of manufacturing a light-emitting layer on the array substrate to form the first light-emitting layer, the second light-emitting layer, and the third light-emitting layer, respectively.

[0010] Here, when repeating the step of manufacturing the light-emitting layer on the array substrate, the step of applying the active substrate material coating layer to the first electrode pattern layer is performed only once, and the orthographic projection of the bonding layer onto the first electrode pattern layer covers the first electrode pattern layer.

[0011] Here, the manufacturing method includes manufacturing a sealing layer on the second electrode pattern layer and filling the gap between adjacent light-emitting layers with the sealing layer; providing a color film substrate, the color film substrate including at least a black matrix; and bonding the color film substrate and the array substrate.

[0012] To solve the above technical problems, the second technical solution provided in this application provides a display panel, the display panel comprising a drive substrate, a light-emitting layer, and a second electrode pattern layer, wherein the drive substrate comprises a substrate, a drive circuit layer installed on one side of the substrate, and a first electrode pattern layer installed on one side of the drive circuit layer away from the substrate, the first electrode pattern layer comprises first electrodes distributed in an array, the light-emitting layer is installed on one side of the first electrode pattern layer away from the substrate, and the second electrode pattern layer is installed on one side of the light-emitting layer away from the first electrode pattern layer, and the second electrode The pattern layer includes a plurality of second electrodes that correspond one-to-one with the first electrode, wherein the display panel further includes a bonding layer, which is placed between the first electrode pattern layer and the light-emitting layer, wherein the bonding layer includes an active base material, which has a first functional group, and the light-emitting layer includes a light-emitting material, which has a second functional group and a third functional group, wherein the first and second functional groups are grafted so that the light-emitting layer is attached to the bonding layer, and the third functional group is polymerized with the third functional group so that the light-emitting material forms the light-emitting layer having a predetermined thickness.

[0013] Here, the light-emitting material is an organic light-emitting material and / or an inorganic light-emitting material, the organic light-emitting material having the second functional group and the third functional group, and the inorganic light-emitting material comprising an inorganic core and an organic shell layer coated on the inorganic core, the organic shell layer having the second functional group and the third functional group.

[0014] Here, the display panel further includes a sealing layer and a color film layer, wherein the sealing layer is installed on one side of the second electrode pattern layer away from the light-emitting layer and fills the gap between adjacent light-emitting layers, and the color film layer is installed on one side of the sealing layer away from the second electrode pattern layer.

[0015] Here, the light-emitting layer includes a first light-emitting layer, a second light-emitting layer, and a third light-emitting layer of different colors, the first light-emitting layer, the second light-emitting layer, and the third light-emitting layer are arranged in a predetermined order, and the display panel further includes a sealing layer, the sealing layer is installed on one side of the second electrode pattern layer away from the light-emitting layer and fills the gap between adjacent light-emitting layers. [Effects of the Invention]

[0016] The beneficial effects of this application are as follows: Unlike conventional methods, this application provides a display panel and a method for manufacturing the same, in which a bonding layer is formed by coating an active substrate material onto a first electrode pattern layer of an array substrate, and then, using a wet process, the array substrate is placed in a reaction solution containing a light-emitting material, thereby depositing the light-emitting material onto the bonding layer to form a light-emitting layer. This method allows for the deposition of a light-emitting material without using expensive equipment and materials such as high-definition fine metal masks (FMMs) and vacuum deposition machines, effectively reducing production costs and improving product competitiveness. Specifically, the active base material has a first functional group, and the luminescent material has a second and a third functional group. After the array substrate is placed in the reaction solution, the luminescent material and the active group of the binder undergo a polymerization reaction. During the reaction, the second and first functional groups undergo a graft copolymerization reaction, attaching the luminescent material to the binder. Polymerization reactions occur between the luminescent material molecules and between the third functional groups, causing "aggregation" between the luminescent material molecules to form a film layer with a predetermined thickness, i.e., a luminescent layer. Furthermore, this wet process film formation method significantly improves the utilization rate of the luminescent material and avoids material waste. [Brief explanation of the drawing]

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings that may be used in the description of the embodiments are briefly described below. Clearly, the drawings in the following description represent only a few embodiments of this application. Those skilled in the art can obtain other drawings from these without any creative effort. [Figure 1]It is a flowchart of a method for manufacturing a display panel provided in the first embodiment of the present application. [Figure 2] It is a schematic structural diagram of a display panel provided in the first embodiment of the present application. [Figure 3] It is a flowchart of a method for manufacturing a light-emitting layer provided in one embodiment of the present application. [Figure 4] It is a process flowchart of a method for manufacturing a light-emitting layer provided in one embodiment of the present application. [Figure 5] It is a schematic structural diagram of a first state in which an array substrate provided in one embodiment of the present application is placed in a reaction solution. [Figure 6] It is a schematic structural diagram of a second state in which an array substrate provided in one embodiment of the present application is placed in a reaction solution. [Figure 7] It is a flowchart of step (S22) provided in one embodiment of the present application. [Figure 8] It is a flowchart of a method for manufacturing a display panel provided in the second embodiment of the present application. [Figure 9] It is a flowchart of a method for manufacturing a display panel provided in the third embodiment of the present application. [Figure 10] It is a process chart for manufacturing a light-emitting layer by the manufacturing method provided in FIG. 9. [Figure 11] It is a schematic structural diagram of a display panel manufactured by the manufacturing method provided in FIG. 9.

Embodiments for Carrying Out the Invention

[0018] Hereinafter, the solution means of the embodiments of the present invention will be described in detail with reference to the drawings of this specification.

[0019] In the following description, specific details such as specific system structures, interfaces, and technologies are provided for the purpose of explanation rather than limitation, to facilitate a complete understanding of the present application.

[0020] Hereinafter, the technical solutions of the embodiments of the present application will be clearly and completely described while referring to the drawings of the embodiments of the present application. As can be understood, the described embodiments are only a part of the embodiments of the present application, not all of them. Based on the embodiments of the present application, all other embodiments that those skilled in the art can obtain without the need for inventive labor all belong to the protection scope of the present application.

[0021] The terms "first", "second", and "third" in the present application are only used for the purpose of explanation and cannot be understood as indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" can explicitly or implicitly include at least one of these features. In the description of the present application, "a plurality" means at least two, for example, two, three, etc., unless there is a clear and specific definition to the contrary. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are used to interpret the relative positional relationship, movement status, etc. between each component in a specific posture (such as shown in the drawings). When the specific posture changes, the directionality changes accordingly. The terms "comprising", "having" and any variations thereof used in this specification are intended to cover non-exclusive inclusion. For example, a process, method, product or apparatus including a series of steps or units is not limited to the listed steps or units, and may further include steps or units not selectively listed, or may further include other steps or units specific to these processes, methods, products or apparatuses.

[0022] The "embodiment" referred to in this specification means that a specific feature, structure or characteristic described by referring to the embodiment may be included in at least one embodiment of the present application. The appearance of this conjunction at each place in the specification does not necessarily mean that they all refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. As those skilled in the art can understand explicitly and implicitly, the embodiments described in this specification can be combined with other embodiments.

[0023] The present application will be described in detail below with reference to the attached drawings and embodiments.

[0024] Referring to Figures 1 and 2, Figure 1 is a flowchart of a method for manufacturing a display panel provided by a first embodiment of this application, and Figure 2 is a schematic diagram of the structure of a display panel provided by a first embodiment of this application. This embodiment provides a method for manufacturing a display panel 100. The method is specifically used to manufacture an OLED display panel 100, and the manufacturing method specifically includes the following steps. Step (S10): Provide an array substrate 10, which includes a substrate 11, a drive circuit layer 12 formed on one side of the substrate 11, and a first electrode pattern layer 13 formed on the side of the drive circuit layer 12 away from the substrate 11, the first electrode pattern layer 13 including first electrodes 131 distributed in an array. Step (S20): A light-emitting layer 22 is manufactured on the array substrate 10. Step (S30): A second electrode pattern layer 23 is fabricated on the light-emitting layer 22, and the second electrode pattern layer 23 includes a second electrode 231 that corresponds one-to-one with the first electrode 131.

[0025] Here, as shown in Figure 2, the array substrate 10 provided in step (S10) includes a substrate 11, a drive circuit layer 12, and a first electrode pattern layer 13. The drive circuit layer 12 is installed on one side of the substrate 11 and is used to provide drive signals to the light-emitting unit 20. Specifically, the drive circuit layer 12 includes a plurality of pixel drive circuits distributed in an array, each used to provide a drive signal to the corresponding light-emitting unit 20. The first electrode pattern layer 13 includes a plurality of first electrodes 131 distributed in an array, and the first electrodes 131 are installed in one-to-one correspondence with the pixel drive circuits and are electrically connected.

[0026] In step (S20), a light-emitting layer 22 is formed on the first electrode pattern layer 13, and one light-emitting layer 22 is formed on each first electrode 131. In step (S30), a second electrode pattern layer 23 is manufactured on the light-emitting layer 22, and the second electrode pattern layer 23 includes a plurality of second electrodes 231, and the second electrodes 231 are installed in one-to-one correspondence with the first electrodes 131, and the light-emitting layer 22 is positioned between the first electrode 131 and the second electrodes 231, thereby forming a light-emitting unit 20, and the second electrodes 231 are electrically connected to the drive circuit layer 12, thereby enabling the light-emitting unit 20 to receive a drive signal and emit light. Specifically, the first electrode 131 and the second electrode 231 are the anode and cathode, respectively, and normally the first electrode 131 is the anode and the second electrode 231 is the cathode, or, if necessary, the first electrode 131 can be set as the cathode and the second electrode 231 as the anode.

[0027] Referring to Figures 3 and 4, Figure 3 is a flowchart of a method for manufacturing the light-emitting layer 22 provided by one embodiment of this application, and Figure 4 is a flowchart of the manufacturing process for the light-emitting layer 22 provided by one embodiment of this application. Specifically, in step (S20), a wet film deposition process is used to achieve FMM-free production, eliminating the need to use expensive equipment and materials such as FMMs and vacuum deposition machines, thereby reducing production costs and improving product competitiveness. Here, step (S20) includes the following steps. Step (S21): An active substrate material is applied to the first electrode pattern layer 13 to form a binding layer 21. Step (S22): The array substrate 10 is placed in the reaction solution 40 containing the light-emitting material, the light-emitting material is attached to the bonding layer 21, and the light-emitting layer 22 is formed.

[0028] Referring to Figures 5 and 6, Figure 5 is a schematic diagram of the structure of a first state in which the array substrate 10 provided by one embodiment of this application is placed in the reaction solution 40, and Figure 6 is a schematic diagram of the structure of a second state in which the array substrate 10 provided by one embodiment of this application is placed in the reaction solution 40. Specifically, the active base material has a first functional group 21a, that is, the active base material molecule has a first functional group 21a, and the active base material forms a bonding layer 21 on the first electrode pattern layer 13. The light-emitting material has a second functional group 22b and a third functional group 22c, that is, the light-emitting material molecule has a second functional group 22b and a third functional group 22c. Here, as shown in Figure 5, under specific chemical conditions, a graft copolymerization reaction can occur between the first functional group 21a and the second functional group 22b, and the active base molecule and the light-emitting material molecule are integrally bonded by grafts of the first functional group 21a and the second functional group 22b. As shown in Figure 6, under other specific chemical conditions, polymerization reactions occur between the third functional groups 22c and 32c within the luminescent material molecules, and this polymerization of the third functional groups 22c between molecules causes the luminescent material molecules to bond to each other.

[0029] Specifically, the active base material may be a chemical base material containing a triazine structure. The luminescent material may include an organic luminescent material and / or an inorganic luminescent material. Here, the organic luminescent material has a second functional group 22b and a third functional group 22c. For example, the organic material can be selectively grafted with the second functional group 22b and the third functional group 22c by chemical modification. The second functional group 22b may be any functional group such as a hydroxyl group or an amino group that can undergo graft copolymerization with the first functional group 21a, and the third functional group 22c may be any functional group that can undergo polymerization, such as a double bond or an acid / alcohol carbonyl group, and can be set according to actual needs. The functional groups described above in this application are merely examples and can be selected according to actual needs, but are not limited thereto. Here, the inorganic light-emitting material includes an inorganic core 22a and an organic shell layer 22s covering the inorganic core 22a, and the organic shell layer 22s is grafted with appropriate second functional groups 22b and third functional groups 22c by chemical modification.

[0030] In step (S22), the array substrate 10 is placed in the reaction solution 40 containing the luminescent material. The first functional group 21a of the active substrate and the second functional group 22b of the luminescent material are strongly bonded by a graft copolymerization reaction, allowing the luminescent material to be firmly attached to the bonding layer 21. In addition, the third functional group 22c of the luminescent material undergoes a polymerization reaction and bonds, thereby firmly bonding the luminescent materials together and forming a luminescent layer 22 with a predetermined thickness d.

[0031] The above manufacturing method makes it possible to form a film of light-emitting material by a wet chemical reaction method without using FMM or expensive equipment and materials such as vacuum deposition machines, significantly reducing production costs and providing stronger and more stable bonding between the light-emitting layer 22 and the array substrate 10, making it less prone to detachment. Furthermore, this wet film formation method eliminates the need to manufacture the pixel definition layer PDL and spacer PS on the array substrate 10, thus omitting the pre-manufacturing process for PDL and PS, further reducing production material costs and process time. At the same time, the above wet film formation method significantly improves the utilization rate of the light-emitting material, reducing waste and environmental pollution. Moreover, as the reaction progresses, the concentration of the reaction solution 40 containing the light-emitting material decreases, and it is only necessary to replenish the light-emitting material as needed, eliminating the need to discard the entire reaction solution 40, further reducing waste and improving the utilization rate of the light-emitting material. Furthermore, since vapor deposition is not required, the spacing between the first electrodes 131 only needs to satisfy the machine's limits, critical dimension deviation, and fitting accuracy, effectively improving the pixel aperture ratio of the display panel 100 and expanding the deposition area of ​​the light-emitting material. The spacing between light-emitting layers 22 of different colors is not limited to the vapor-deposited gray area, and the spacing between adjacent first electrodes 131 is reduced, thereby significantly improving the display resolution and enhancing the display effect.

[0032] Referring to Figure 7, Figure 7 is a flowchart of step (S22) provided in one embodiment of the present application. In this embodiment, step (S22) specifically includes the following steps. Step (S221): The array substrate 10 is placed in the first reaction solution 41 containing the light-emitting material, and the first reaction environment is adjusted so that the light-emitting material adheres to the binding layer 21. Step (S222): The array substrate 10 is placed in the second reaction solution 42 containing the light-emitting material to adjust the second reaction environment and form a light-emitting layer 22 having a predetermined thickness d.

[0033] In this embodiment, first, the array substrate 10 is placed in a first reaction solution 41 containing a light-emitting material. The concentration of the light-emitting material in the first reaction solution 41 can be set according to production needs, and the first reaction environment is adjusted so that the light-emitting material and the active group material can undergo a graft copolymerization reaction. After a single layer of light-emitting material is uniformly coated onto the surface of the binding layer 21, the array substrate 10 is removed and placed in a second reaction solution 42 containing a light-emitting material. The concentration of the light-emitting material in the second reaction solution 42 is similarly set according to production needs, and the second reaction environment is adjusted so that the third functional group 22c on the light-emitting material undergoes a polymerization reaction, and the reaction time is controlled until the thickness of the film layer of light-emitting material on the binding layer 21 reaches a predetermined thickness d. Then the array substrate 10 is removed and the next process is carried out. Specifically, the thickness of the light-emitting layer 22 can be adjusted by controlling the reaction time, and the reaction rate can be controlled by controlling the reaction condition parameters.

[0034] Specifically, referring to Figure 8, which is a flowchart of a method for manufacturing the display panel 100 provided by a second embodiment of this application. In this embodiment, the method for manufacturing the display panel 100 specifically includes the following steps. Step (S10): Provide the array substrate 10. Step (S211): An active substrate material is applied to the first electrode pattern layer 13 to form a binding layer 21. Step (S212): Photoresist PR is applied to the bonding layer 21, and exposure and development are performed to expose the portion of the bonding layer 21 corresponding to the first electrode 131. Step (S221): The array substrate 10 is placed in the first reaction solution 41 containing the light-emitting material, and the first reaction environment is adjusted so that the light-emitting material adheres to the binding layer 21. Step (S222): The array substrate 10 is placed in the second reaction solution 42 containing the light-emitting material to adjust the second reaction environment and form a light-emitting layer 22 having a predetermined thickness d. Step (S223): Remove photoresist PR. Step (S30): A second electrode pattern layer 23 is fabricated on the light-emitting layer 22, and the second electrode pattern layer 23 includes a second electrode 231 that corresponds one-to-one with the first electrode 131. Step (S40): A sealing layer 24 is manufactured on the second electrode pattern layer 23, and the sealing layer 24 is filled into the gap between adjacent light-emitting layers 22. Step (S50): Provide a color film substrate 30, which includes at least a black matrix 31. Step (S60): The color film substrate 30 and the array substrate 10 are bonded together.

[0035] Specifically, in this embodiment, after step (S211), a photoresist PR is first applied to the bonding layer 21 and exposed and developed through a mask plate, thereby exposing the portion of the bonding layer 21 corresponding to the first electrode 131. Next, in steps (S221) and (S222), a light-emitting layer 22 of a predetermined thickness d is formed in the region of the bonding layer 21 corresponding to the first electrode 131. Then, the photoresist PR is removed, and a second electrode pattern layer 23 is manufactured on the light-emitting layer 22, thereby forming light-emitting units 20 distributed in an array manner on the array substrate 10. In this embodiment, the light-emitting material may be a white light-emitting material, and the light emitted by the formed light-emitting units 20 is white. In step (S40), a sealing layer 24 is formed on the light-emitting unit 20, and the sealing layer 24 is filled into the gap between adjacent light-emitting units 20, thereby sealing the light-emitting units 20 and preventing external water, oxygen, etc., from entering and affecting the light-emitting units 20, which would shorten the service life of the display panel 100. The color film substrate 30 is bonded to the sealing layer 24 to form the display panel 100. Here, the color film substrate 30 includes a black matrix 31 and a color film layer 32. Multiple pixel openings 311 are formed in the black matrix 31, and the pixel openings 311 are positioned corresponding to the light-emitting unit 20. The color film layer 32 is positioned within the pixel openings 311, and the color film layer 32 includes a first color resist layer 321, a second color resist layer 322, and a third color resist layer 323, thereby realizing color display.

[0036] In this embodiment, the light-emitting layer 22 is formed by a wet film deposition method, eliminating the need for vapor deposition and reducing production costs. Furthermore, it reduces the waste of light-emitting material, significantly improving the utilization rate of the light-emitting material. In addition, the pre-processing steps of PDL and PS are omitted, significantly reducing process time and production material costs. Moreover, the spacing between light-emitting units 20 is not affected by the vapor-deposited gray area, allowing for reduced spacing and improving the pixel aperture ratio and display resolution.

[0037] Specifically, referring to Figures 9 to 11, Figure 9 is a flowchart of a method for manufacturing the display panel 100 provided by the third embodiment of this application, Figure 10 is a process chart for manufacturing the light-emitting layer by the manufacturing method shown in Figure 9, and Figure 11 is a schematic diagram of the structure of the display panel 100 manufactured by the manufacturing method shown in Figure 9. In this embodiment, the method for manufacturing the display panel 100 specifically includes the following steps. Step (S10): Provide the array substrate 10. Step (S211): An active substrate material is applied to the first electrode pattern layer 13 to form a binding layer 21. Step (S212): Photoresist PR is applied to the bonding layer 21 and exposure development is performed to expose the portion of the bonding layer 21 corresponding to the pixel design area. Step (S221): The array substrate 10 is placed in the first reaction solution 41 containing the light-emitting material, and the first reaction environment is adjusted so that the light-emitting material adheres to the binding layer 21. Step (S222): The array substrate 10 is placed in a second reaction solution 42 containing a light-emitting material to adjust the second reaction environment and form a first light-emitting layer 221 having a predetermined thickness d. Step (S223): Remove photoresist PR. Step (S224): Steps (S212), (S221), (S222), and (S223) are repeated twice to form a second light-emitting layer 222 and a third light-emitting layer 223, each having a predetermined thickness d. Step (S30): A second electrode pattern layer 23 is fabricated on the light-emitting layer 22, and the second electrode pattern layer 23 includes a second electrode 231 that corresponds one-to-one with the first electrode 131. Step (S40): A sealing layer 24 is manufactured on the second electrode pattern layer 23, and the sealing layer 24 is filled into the gap between adjacent light-emitting layers 22. Step (S50): Provide a color film substrate 30, which includes at least a black matrix 31. Step (S60): The color film substrate 30 and the array substrate 10 are bonded together.

[0038] The differences between this embodiment and the second embodiment are as follows. In this embodiment, a first light-emitting layer 221, a second light-emitting layer 222, and a third light-emitting layer 223 of different colors are formed on the drive substrate by three wet film deposition processes, thereby forming a first light-emitting unit 251, a second light-emitting unit 252, and a third light-emitting unit 253 of different colors after step (S30), thereby realizing color display of the display panel 100. As a result, in this embodiment, the color film substrate 30 may not have a color film layer 32 and may only include a black matrix 31. The black matrix 31 is used to prevent cross-color problems between adjacent light-emitting units 20, thereby improving the contrast of the display panel 100. Of course, in other embodiments, the black matrix 31 may not be installed, and can be installed as needed. Simultaneously, in the process of forming the first light-emitting layer 221, the second light-emitting layer 222, and the third light-emitting layer 223, step (S211) only needs to be performed once, and the orthogonal projection of the bonding layer 21 onto the first electrode pattern layer 13 is used to cover the first electrode pattern layer 13 and connect the light-emitting material and the first electrode 131.

[0039] To make it easier to understand, in the process of forming the first light-emitting layer 221, in step (S212), the photoresist PR is exposed and developed through a mask plate to expose the bonding layer 21 of the design region of the first light-emitting unit 251, thereby forming the first light-emitting layer 221 in the design region of the first light-emitting unit 251 after steps (S221) and (S222) have been performed. The light-emitting material in the first reaction solution 41 and the second reaction solution 42 in steps (S221) and (S222) is a first-color light-emitting material. In the process of forming the second light-emitting layer 222, in step (S212), the photoresist PR is exposed and developed through a mask plate to expose the bonding layer 21 of the design region of the second light-emitting unit 252, thereby forming the second light-emitting layer 222 in the design region of the second light-emitting unit 252 after performing steps (S221) and (S222). The light-emitting material in the first reaction solution 41 and the second reaction solution 42 in steps (S221) and (S222) is a second-color light-emitting material. In the process of forming the third light-emitting layer 223, in step (S212), the photoresist PR is exposed and developed through a mask plate to expose the bonding layer 21 of the design region of the third light-emitting unit 253, thereby performing steps (S221) and (S222), after which the second light-emitting layer 222 is formed in the design region of the third light-emitting unit 253, and the light-emitting material in the first reaction solution 41 and the second reaction solution 42 in steps (S221) and (S222) is a third-color light-emitting material.

[0040] In this embodiment, the display panel 100 manufactured by a wet film deposition process does not require deposition, and the spacing between the first electrodes 131 only needs to satisfy the machine frame limits, critical dimensional deviations, and fitting accuracy. This reduces the spacing between the first electrodes 131, thereby increasing the area of ​​the first electrodes 131, further increasing the area of ​​the light-emitting layer 22, effectively improving the pixel aperture ratio, and the spacing between different light-emitting layers 22 is not limited by the deposition process. This reduces the spacing between adjacent light-emitting units 20, significantly improving the display resolution and enhancing the display effect.

[0041] In the above embodiment, the structure of the display panel 100 and its manufacturing method can be modified. For example, a hole transport layer, an electron blocking layer, or other film layer can be added to the first electrode 131, and these film layers can all be formed by the wet film deposition process described above. At the same time, the active base material is used to connect the light-emitting material and the underlying material (first electrode 131), and can be a single-layer or multi-layer structure as long as the purpose of connecting the light-emitting material and the underlying material is achieved. The polymerization reaction of the light-emitting material is to make the light-emitting layer 22 reach a predetermined thickness d. Whether it is a polymerization reaction or another type of chemical reaction of light-emitting material components such as electrostatic attraction or condensation reaction of functional groups between light-emitting material molecules, it is sufficient as long as the light-emitting material can be polymerized and grown to a predetermined thickness d. In the above embodiment, the process sequence of the first light-emitting layer 221, the second light-emitting layer 222, and the third light-emitting layer 223 is adjustable and can be set according to actual production needs.

[0042] The above describes embodiments of the present application and does not limit the scope of the patent of this application. Any equivalent structural or process transformations performed using the contents of the specification and drawings of this application, or any other related technical applications that are directly or indirectly applied, are similarly included within the scope of the patent protection of this application. [Explanation of Symbols]

[0043] 100 Display Panels 10 Array substrates 11 A board 12. Drive circuit layer 13. First electrode pattern layer 131 1st electrode 20 Light-emitting units 21 Bonding layer 21a 1st functional group 22. Emitting layer 221 First light-emitting layer 222 Second Emitting Layer 223 Third light-emitting layer 22a Inorganic Core 22s Organic Shell Layer 22b Second functional group 22c Tertiary functional group 23 Second electrode pattern layer 231 2nd electrode 24 sealing layer 251 First light-emitting unit 252 Second Light-Emitting Unit 253 Third Light-Emitting Unit 30 Color film substrates 31 Black Matrix 311 pixel aperture 32 color film layers 321 First color resist layer 322 Second color resist layer 323 Third color resist layer 40 Reaction solution 41 First reaction solution 42 Second reaction solution PR Photoresist d Pre-set thickness

Claims

1. The method for manufacturing the display panel is: A step of providing an array substrate, wherein the array substrate includes a substrate, a drive circuit layer formed on one side of the substrate, and a first electrode pattern layer formed on one side of the drive circuit layer away from the substrate, the first electrode pattern layer including first electrodes distributed in an array, The steps include manufacturing a light-emitting layer on the array substrate, A step of manufacturing a second electrode pattern layer on the light-emitting layer, wherein the second electrode pattern layer includes a second electrode that corresponds one-to-one with the first electrode, Here, the step of manufacturing the light-emitting layer on the array substrate is: The first electrode pattern layer is coated with an active substrate material to form a binding layer, The process includes placing the array substrate in a reaction solution containing a light-emitting material, adhering the light-emitting material to the binding layer, and forming a light-emitting layer. Herein, the active base material has a first functional group, the light-emitting material has a second functional group and a third functional group, and in the reaction step, the second functional group and the first functional group undergo a graft copolymerization reaction to attach the light-emitting material to the binding layer, and a polymerization reaction occurs between the third functional group and the third functional group to form the light-emitting layer having a predetermined thickness, a method for manufacturing a display panel.

2. The method for producing a display panel according to claim 1, wherein the active material is a chemical material containing a triazine structure, the second functional group is a hydroxyl group or an amino group, and the third functional group is a double bond or an acid / alcohol carbonyl group.

3. A method for manufacturing a display panel according to claim 1, wherein the step of placing the array substrate in a reaction solution containing a light-emitting material, adhering the light-emitting material to a binding layer, and forming a light-emitting layer comprises: placing the array substrate in a first reaction solution containing a light-emitting material and adjusting the first reaction environment so that the light-emitting material adheres to the binding layer; and placing the array substrate in a second reaction solution containing a light-emitting material and adjusting the second reaction environment to form the light-emitting layer having a predetermined thickness.

4. A method for manufacturing a display panel according to claim 3, comprising the steps of placing the array substrate in a second reaction solution containing a light-emitting material, adjusting the second reaction environment, and forming the light-emitting layer having a predetermined thickness, wherein the thickness of the light-emitting layer is adjusted by controlling the reaction time and the reaction rate is controlled by controlling the reaction condition parameters.

5. The step of placing the array substrate in a reaction solution containing the light-emitting material further includes coating the bonding layer with photoresist and performing exposure development to expose the portion of the bonding layer corresponding to the first electrode, A method for manufacturing a display panel according to claim 1, further comprising the steps of placing the array substrate in a reaction solution containing a light-emitting material, adhering the light-emitting material to the bonding layer, and, after the step of forming the light-emitting layer is completed, removing the photoresist.

6. The method for manufacturing a display panel according to claim 1, wherein the light-emitting layer includes a first light-emitting layer, a second light-emitting layer, and a third light-emitting layer, and the method for manufacturing the display panel includes repeatedly taking the step of manufacturing a light-emitting layer on the array substrate to form the first light-emitting layer, the second light-emitting layer, and the third light-emitting layer, respectively.

7. The first light-emitting layer and the first and second electrodes corresponding to the first light-emitting layer form a first light-emitting unit, the second light-emitting layer and the first and second electrodes corresponding to the second light-emitting layer form a second light-emitting unit, and the third light-emitting layer and the first and second electrodes corresponding to the third light-emitting layer form a third light-emitting unit. In the step of forming the first light-emitting layer, a photoresist is applied to the bonding layer, and exposure and development are performed so that the bonding layer in the design region of the first light-emitting unit is exposed. In the step of forming the second light-emitting layer, a photoresist is applied to the bonding layer, and exposure and development are performed so that the bonding layer in the design region of the second light-emitting unit is exposed. The method for manufacturing a display panel according to claim 6, wherein in the step of forming the third light-emitting layer, a photoresist is applied to the bonding layer, and exposure and development are performed so that the bonding layer in the design region of the third light-emitting unit is exposed.

8. The method for manufacturing a display panel according to claim 6, wherein when repeating the step of manufacturing a light-emitting layer on the array substrate, the step of applying an active substrate material coating layer to the first electrode pattern layer is performed only once, and the orthographic projection of the bonding layer onto the first electrode pattern layer covers the first electrode pattern layer.

9. A method for manufacturing a display panel according to claim 6, wherein the step of manufacturing an emissive layer on the array substrate is repeated to form the first emissive layer, the second emissive layer, and the third emissive layer, respectively, and the order of the steps of forming the first emissive layer, the second emissive layer, and the third emissive layer is adjustable.

10. The method for manufacturing the aforementioned display panel is as follows: A sealing layer is manufactured on the second electrode pattern layer, and the sealing layer is filled into the gap between the adjacent light-emitting layers. A color film substrate is provided, wherein the color film substrate includes at least a black matrix, The process involves bonding the aforementioned color film substrate and the aforementioned array substrate together, A method for manufacturing a display panel according to claim 1, including the method described in claim 1.

11. The method for manufacturing a display panel according to claim 1, wherein in the step of forming the first electrode pattern layer, the spacing between adjacent first electrodes satisfies the mechanical limit, critical dimensional deviation, and fitting accuracy.

12. The method for manufacturing a display panel according to claim 1, wherein the light-emitting material forms the light-emitting layer of a predetermined thickness by electrostatic attraction between molecules or contraction reactions of functional groups between molecules.

13. A display panel comprising a drive substrate, a light-emitting layer, and a second electrode pattern layer, The drive substrate includes a substrate, a drive circuit layer installed on one side of the substrate, and a first electrode pattern layer installed on one side of the drive circuit layer away from the substrate, the first electrode pattern layer includes first electrodes distributed in an array, The light-emitting layer is installed on one side of the first electrode pattern layer that is separated from the substrate. The second electrode pattern layer is installed on one side of the light-emitting layer, away from the first electrode pattern layer, and the second electrode pattern layer includes a plurality of second electrodes that correspond one-to-one with the first electrode. The display panel further includes a bonding layer, the bonding layer being placed between the first electrode pattern layer and the light-emitting layer, wherein the bonding layer includes an active base material, the active base material having a first functional group, the light-emitting layer includes a light-emitting material, the light-emitting material having a second functional group and a third functional group, the first functional group being grafted with the second functional group so that the light-emitting layer adheres to the bonding layer, and the third functional group being polymerized with the third functional group so that the light-emitting material forms the light-emitting layer having a predetermined thickness.

14. The light-emitting material is an organic light-emitting material and / or an inorganic light-emitting material. The organic light-emitting material has the second functional group and the third functional group, The display panel according to claim 13, wherein the inorganic light-emitting material comprises an inorganic core and an organic shell layer covering the inorganic core, and the organic shell layer has the second functional group and the third functional group.

15. The display panel according to claim 13, further comprising a sealing layer and a color film layer, wherein the sealing layer is installed on one side of the second electrode pattern layer away from the light-emitting layer and fills the gap between adjacent light-emitting layers, and the color film layer is installed on one side of the sealing layer away from the second electrode pattern layer.

16. The display panel according to claim 15, further comprising a color film substrate bonded to the sealing layer, wherein the color film substrate comprises a black matrix and the color film layer, the black matrix having a plurality of pixel apertures, the pixel apertures being arranged corresponding to light-emitting units, the color film layer being arranged within the pixel apertures, and the color film layer comprising a first color resist layer, a second color resist layer, and a third color resist layer of different colors.

17. The display panel according to claim 13, wherein the light-emitting layer comprises a first light-emitting layer, a second light-emitting layer, and a third light-emitting layer of different colors, the first light-emitting layer, the second light-emitting layer, and the third light-emitting layer are arranged in a predetermined order, and the display panel further comprises a sealing layer, the sealing layer is installed on one side of the second electrode pattern layer away from the light-emitting layer and fills the gap between adjacent light-emitting layers.

18. The display panel according to claim 17, further comprising a color film substrate bonded to the sealing layer, the color film substrate comprising a black matrix, the black matrix having a plurality of pixel apertures, and the pixel apertures being arranged corresponding to light-emitting units.

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