Quadrax electrical cable with wafer insulation displacement contact connection

Abstract

The tail end assembly of an electrical connector includes an electrical cable and a coupling assembly. The electrical cable includes multiple conductive wires. The coupling assembly defines an internal spacing and is coupled to the electrical cable so that the conductive wires extend through the internal spacing. The coupling assembly is configured to removably couple the tail end assembly to the electrical connector.

Description

Technical Field

[0001] Cross - reference to Related Applications This application claims the benefit of U.S. Patent Application No. 63 / 480,748, filed on January 20, 2023, which is hereby incorporated by reference in its entirety.

Background Art

[0002] High - speed electrical connectors transmit high - speed signals with low loss. Such high - speed electrical connectors can be used, for example, for the transmission and reception of various types of data related to defense and commercial applications. In certain applications, these high - speed electrical connectors are attached to a printed circuit board to establish an electrical connection with its circuit traces. However, the processing of these high - speed data connectors can be costly and time - consuming, especially due to high cycle times.

Summary of the Invention

[0003] According to non - limiting embodiments, an electrical cable assembly includes an electrical connector and a tail - end assembly. The electrical connector includes a connector housing that defines an internal region. The connector housing extends from a mating - interface end that defines a mating - interface opening to a cable - interface end that defines a cable - interface opening. The tail - end assembly is configured to be coupled to an IDC wafer adapter assembly that includes a plurality of IDC wafers. The tail - end assembly is configured to be removably coupled to the cable - interface end.

[0004] In addition to, or alternatively to, one or more of the above features, in a further embodiment, the coupling assembly further includes a first mating portion coupled to the cable and a second mating portion configured to couple the first mating portion to the electrical connector.

[0005] In addition to or alternative to one or more of the above features, in further embodiments, the first mating portion includes a bushing coupled to a cable, and the second mating portion includes a ferrule assembly coupled to the bushing.

[0006] In addition to or alternative to one or more of the above features, in further embodiments, the bushing includes a bushing body having a bushing screw configured to mate with a connector screw of an electrical connector to detachably connect the bushing to the electrical connector.

[0007] In addition to or alternative to one or more of the above features, in further embodiments, the ferrule assembly includes a rear ferrule coupled to a bushing configured to receive a cable, and a front ferrule coupled to the rear ferrule and configured to allow conductive wiring to pass through an electrical connector.

[0008] In addition to or alternative to one or more of the above features, in further embodiments, the cable includes a cable braid covering the conductive wiring and a cable sheath covering the cable braid.

[0009] In addition to or alternative to one or more of the above features, in further embodiments, the cable braid is positioned on the upper surface of the cable sheath and includes a folded portion sandwiched between the outer surface of the rear ferrule and the inner surface of the front ferrule.

[0010] In addition to or alternative to one or more of the above features, in further embodiments, the tail end assembly includes a cable containing a plurality of conductive wires and a coupling assembly that defines an internal spacing and is coupled to the cable so that the conductive wires extend through the internal spacing. The coupling assembly is configured to detachably couple the tail end assembly to an electrical connector.

[0011] In addition to or alternative to one or more of the above features, in further embodiments, the coupling assembly further includes a first mating portion coupled to a cable and a second mating portion configured to couple the first mating portion to an electrical connector.

[0012] In addition to or alternative to one or more of the above features, in further embodiments, the first mating portion includes a bushing coupled to a cable, and the second mating portion includes a ferrule assembly coupled to the bushing.

[0013] In addition to or alternative to one or more of the above features, in further embodiments, the bushing includes a bushing body having a bushing screw configured to mate with a connector screw of an electrical connector to detachably connect the bushing to the electrical connector.

[0014] In addition to or alternative to one or more of the above features, in further embodiments, the ferrule assembly includes a rear ferrule coupled to a bushing configured to receive a cable, and a front ferrule coupled to the rear ferrule and configured to allow conductive wiring to pass through an electrical connector.

[0015] In addition to or alternative to one or more of the above features, in further embodiments, the cable includes a cable braid covering the conductive wiring and a cable sheath covering the cable braid.

[0016] In addition to or alternative to one or more of the above features, in further embodiments, the cable braid is positioned on the upper surface of the cable sheath and includes a folded portion sandwiched between the outer surface of the rear ferrule and the inner surface of the front ferrule.

[0017] According to another non-limiting embodiment, the tail end assembly of an electrical connector comprises a cable and a coupling assembly. The cable includes a plurality of conductive wires. The coupling assembly defines an internal spacing and is coupled to the cable so that the conductive wires extend through the internal spacing. The coupling assembly is configured to detachably couple the tail end assembly to the electrical connector.

[0018] The technologies of this disclosure realize additional technical features and advantages. Embodiments and aspects of this disclosure are described in detail herein. For a better understanding, please refer to the detailed description and drawings.

[0019] The above and other features of the embodiment will become apparent from the following detailed description in conjunction with the attached drawings. [Brief explanation of the drawing]

[0020] [Figure 1A] This is a perspective view of an electrical cable assembly according to a non-limiting embodiment of the present disclosure. [Figure 1B] Figure 1A is an exploded view of an electrical cable assembly shown in accordance with a non-restrictive embodiment of the present disclosure. [Figure 1C] This is a cross-sectional view along line 1-1 of the front connector included in the electrical cable assembly shown in Figure 1B according to a non-limiting embodiment of the present disclosure. [Figure 2A] This is a perspective view of a tail end assembly included in an electrical cable assembly shown in Figure 1B, according to a non-limiting embodiment of the present disclosure. [Figure 2B] This is a cross-sectional view along line 2-2 of the tail end assembly shown in Figure 2A, according to a non-limiting embodiment of the present disclosure. [Figure 3] Figure 2A shows a process diagram for assembling the coupling assembly contained within the tail-end assembly shown in this disclosure, according to a non-limiting embodiment of this disclosure. [Figure 4A] This is a schematic diagram of an assembled IDC wafer adapter assembly according to a non-restrictive embodiment of the present disclosure. [Figure 4B] A cross-sectional view taken along line 3-3 of the IDC wafer adapter assembly shown in FIG. 4A according to a non-limiting embodiment of the present disclosure. [Figure 4C] A cross-sectional view taken along line 4-4 of the IDC wafer adapter assembly shown in FIG. 4A according to a non-limiting embodiment of the present disclosure. [Figure 4D] An exploded view of the IDC wafer adapter assembly shown in FIG. 4A according to a non-limiting embodiment of the present disclosure. [Figure 4E] A pre-assembly view of the wire housing included in the IDC wafer adapter assembly shown in FIG. 4D according to a non-limiting embodiment of the present disclosure. [Figure 4F] The wire housing shown in FIG. 4E with the adapter plug removed from the wire housing according to a non-limiting embodiment of the present disclosure. [Figure 4G] A cross-sectional view taken along line 5-5 of the wire housing shown in FIG. 4E according to a non-limiting embodiment of the present disclosure. [Figure 4H] A rear view of the wire housing shown in FIG. 4E according to a non-limiting embodiment of the present disclosure. [Figure 4I] An IDC wafer according to a non-limiting embodiment of the present disclosure is shown. [Figure 5A] A process diagram showing the process of assembling an IDC wafer adapter assembly using each wire is shown. A disassembled IDC wafer adapter assembly including a plurality of wires inserted into a wire housing to provide first and second differential wire pairs is shown according to a non-limiting embodiment of the present disclosure. [Figure 5B] A process diagram showing the process of assembling an IDC wafer adapter assembly using each wire is shown. The IDC wafer adapter assembly shown in FIG. 5A after inserting the first differential IDC wafer pair to establish an electrical connection with the first differential wire pair is shown according to a non-limiting embodiment of the present disclosure. [Figure 5C]A process diagram is shown for assembling the IDC wafer adapter assembly using each wire. Figure 5B shows the IDC wafer adapter assembly after inserting a second differential IDC wafer pair to establish an electrical connection with a second differential wire pair, according to a non-limiting embodiment of the present disclosure. [Figure 6A] This is an exploded view of an IDC wafer adapter assembly according to a non-restrictive embodiment of the present disclosure. [Figure 6B] Figure 6A is a perspective view of the IDC wafer adapter assembly shown in accordance with a non-restrictive embodiment of the present disclosure. [Figure 7A] Figure 1A shows a process diagram for assembling the electrical cable assembly shown. It also shows the electrical cable assembly after the tail end assembly has been coupled to the cable housing, according to a non-limiting embodiment of the present disclosure. [Figure 7B] Figure 1A shows a process diagram for assembling the electrical cable assembly shown. Figure 7A shows the electrical cable assembly after an IDC wafer has been inserted into a wire housing to establish electrical connections with multiple wires, according to a non-limiting embodiment of the present disclosure. [Figure 7C] Figure 1A shows a process diagram for assembling the electrical cable assembly shown. Figure 7B shows the electrical cable assembly after the assembled IDC wafer adapter assembly has been coupled to the front connector, according to a non-limiting embodiment of the present disclosure. [Figure 7D] Figure 1A shows a process diagram for assembling the electrical cable assembly shown. Figure 7C shows the electrical cable assembly after the assembled IDC wafer adapter assembly has been inserted into the connector housing and the connector housing has been coupled to the tail end assembly, according to a non-limiting embodiment of the present disclosure. [Figure 8A] A process diagram for manufacturing a pair of IDC wafers is shown. In accordance with a non-limiting embodiment of this disclosure, a pair of electrical terminals is shown having a first end coupled to a contact according to a metal stamping process and an opposing second end coupled to a blade. [Figure 8B]A process diagram for manufacturing a pair of IDC wafers is shown. The contacts shown in Figure 8A are illustrated according to a non-limiting embodiment of this disclosure, following a metal plating process. [Figure 8C] A process diagram for manufacturing a pair of IDC wafers is shown. Figure 8B shows a pair of electrical terminals formed by an overmolding process to create a pair of IDC wafers, according to a non-limiting embodiment of this disclosure. [Figure 8D] A process diagram for manufacturing a pair of IDC wafers is shown. Figure 8C shows the pair of IDC wafers after the carrier strip has been cut to separate the first IDC wafer from the second IDC wafer, according to a non-limiting embodiment of this disclosure. [Figure 8E] In accordance with non-limiting embodiments of this disclosure, a first IDC wafer having a first length and a second IDC wafer having a second length longer than the first length are shown, and the carrier strip is removed from the first and second IDC wafers. [Modes for carrying out the invention]

[0021] The figures shown herein are conceptual. Many variations are possible in the figures or operations described herein without departing from the spirit of this disclosure. For example, operations can be performed in a different order, or operations can be added, deleted, or modified. Furthermore, the term “joining” and its variations indicate that there is a communication path between two elements, and may include a direct connection without intervening elements or connections between the elements, or an indirect connection, for example, through one or more intervening elements or connections. All these variations are considered part of the specification. It should also be understood that features of one embodiment can be combined with features of one or more other embodiments described herein.

[0022] In the attached diagram and the detailed explanation below, the various elements shown in the diagram are assigned two- or three-digit reference numbers.

[0023] Various embodiments are described herein with reference to the relevant drawings. Alternative embodiments can be conceived without departing from the scope of this disclosure. Various connections and positional relationships between elements (e.g., above, below, adjacent, first direction, second direction, etc.) are shown in the following description and drawings. These connections and / or positional relationships may be direct or indirect unless otherwise specified, and this disclosure is not intended to limit them in this respect. Thus, the joining of entities may refer to either direct or indirect joining, and the positional relationships between entities may be direct or indirect. Furthermore, various tasks and process steps described herein can be incorporated into more comprehensive procedures or processes with additional steps or functions not described in detail herein.

[0024] The following definitions and abbreviations shall be used for interpretation of the claims and specification. As used herein, “comprises,” “comprising,” “includes,” “including,” “has,” “having,” “contains,” or “containing,” or any other variation thereof, are intended to extend to non-exclusive inclusion. For example, a composition, mixture, process, method, article, or apparatus that includes an enumeration of elements is not necessarily limited to those elements alone and may include other elements that are not expressly enumerated or are not specific to such composition, mixture, process, method, article, or apparatus.

[0025] Additionally, the term “exemplary” as used herein means “to serve as an example, instance, or illustration.” The various non-limiting embodiments or designs described herein are “exemplary” and should not necessarily be construed as preferable or advantageous to other embodiments or designs. The terms “at least one” and “one or more” include any number of one or more, e.g., 1, 2, 3, 4, etc. The term “multiple” includes any number of two or more, e.g., 2, 3, 4, 5, etc. The term “connection” includes both indirect and direct connections.

[0026] The terms “approximately,” “substantially,” “about,” and their variations are intended to include the degree of error associated with the measurement of a particular quantity, based on the equipment available at the time of filing.

[0027] Moving on to an overview of the technology relating to aspects of this disclosure, a conventional Quadrax connector may use differential machined contact pairs in which each machined contact contained within each differential pair is arranged diagonally opposite to each other. A manufacturing method used to establish a differential contact pair includes stamping one or more contacts, crimping the contacts to wires, overmolding a dielectric wafer body around and over the contacts, exposing the tail ends of the contacts, cutting and removing a carrier strip from the overmolded wafer body, inserting the crimped wires into a ferrule, inserting the ferrule into a connector shell, and crimping the connector shell to the ferrule. However, the overmolding process may permanently fix the contacts and wires in the dielectric wafer body. Also, the connector crimping process may permanently fix the ferrule to the connector shell and deform the connector shell. If one or more contacts are damaged, the entire cable assembly may need to be replaced.

[0028] One or more non-limiting embodiments described herein provide an electrical cable assembly for implementing an insulating displacement contact (IDC) connection. The cable assembly includes an electrical connector, an IDC wafer adapter assembly, and a tail-end assembly. The IDC wafer adapter assembly utilizes a wire housing that arranges multiple wires bundled in the tail-end assembly into a Quadrax arrangement, providing a fully symmetric connection between differential contact pairs in a Quadrax arrangement. A fully symmetric connection is defined, for example, by arranging the contacts in the differential pairs equidistant from the central axis over the entire length of the connector assembly. The wire housing receives multiple individual IDC wafers, each having an IDC contact that establishes an IDC connection with each wire. The electrical connector is detachably coupled to the IDC wafer adapter assembly and the tail-end. This detachability eliminates the need to replace the entire electrical cable assembly if one or more front contacts are damaged.

[0029] Currently, as shown in Figures 1A and 1B, the electrical cable assembly 100 is shown in accordance with a non-limiting embodiment of the present disclosure. Figure 1A is a perspective view showing the external components of the electrical cable assembly 100, including the external portion of the tail end assembly 300, which includes an electrical connector and cable 350. Figure 1B is an exploded view showing the external components and various internal components of the electrical cable assembly 100, including a front contact assembly 500 that is detachably coupled to the IDC wafer adapter assembly 400, and a coupling assembly 301 that allows the IDC wafer adapter assembly 400 to be coupled to the tail end assembly 300.

[0030] The electrical connector 200 includes a connector housing 202. While the connector housing 202 is shown to have a cylindrical shape, it should be understood that the connector housing 202 may have other shapes (e.g., box shape) without departing from the scope of the invention. The connector housing 202 extends from a mating interface end 204 to a cable interface end 206, the mating interface end 204 defining a mating interface opening 208, and the cable interface end 206 defining a cable interface opening 210. The cable interface opening 210 is configured to receive a front contact assembly 500, an IDC wafer adapter assembly 400, and a portion of the tail assembly 300 (e.g., a coupling assembly).

[0031] The cable interface end 206 is configured to be detachably coupled to the tail end assembly 300. In one or more non-limiting embodiments, the cable interface end 206 includes connector threads formed on its inner surface. The connector threads are configured to mate with threads formed on the coupling assembly 301. In this way, the connector housing 202 can be screwed (e.g., coupled) and unscrewed (discoupled) from the tail end assembly 300. While at least one non-limiting embodiment of this disclosure describes screw connections as a mechanism to facilitate coupling and discoupling of the connector housing 202 and the tail end assembly 300, it should be understood that other techniques can also be implemented in coupling / discoupling mechanisms, including, but not limited to, press-fitting of the connector housing 202 and the tail end assembly 300, and clip and hook assemblies for securing and discoupling the connector housing 202 and the tail end assembly 300.

[0032] Cable 350 is coupled to one end of coupling assembly 301. Cable 350 includes a cable sheath 302 and an internal cable braid 303. The cable sheath 302 bundles together several conductive wires 304a, 304b, 304c, and 304d (collectively referred to as 304a-304d). Each of the conductive wires 304a-304d includes an insulating layer that electrically insulates the conductive wires 304a-304d from each other. The internal cable braid 303 shields the several conductive wires 304a-304d from electrical crosstalk noise and / or electromagnetic (EM) interference.

[0033] The coupling assembly 301 is configured to couple the cable 350 and the IDC wafer adapter assembly 400. The coupling assembly 301 includes a first mating portion 306 coupled to the cable 350 and a second mating portion 308 coupled to the IDC wafer adapter assembly 400. Thus, the cable 350 and the IDC wafer adapter assembly 400 are coupled by coupling the first mating portion 306 to the second mating portion 308.

[0034] The IDC wafer adapter assembly 400 includes several IDC wafers 404a, 404b, 404c, and 404d (collectively referred to as IDC wafers 404a-404d - see Figure 4A). Each IDC wafer 404a-404d establishes an IDC connection with its respective wire 304a-304d, thereby establishing electrical conductivity between the wire 304a-304d and its respective connector pins 402a-402d formed on the IDC wafers 404a-404d.

[0035] The front contact assembly 500 includes a front portion 501 and a rear portion 503. The front portion 501 includes a plurality of front contacts 502a, 502b, 502c, and 502d (collectively referred to as front contacts 502a to 502d). The rear portion 503 is configured to receive the connector pins 402a to 402d of the IDC wafer adapter assembly 400, so that each connector pin 402a to 402d makes physical contact with each contact 502a to 502d. Thus, the front contact assembly 500 establishes electrical conductivity between the connector pins 402a to 402d and the plurality of contacts 502a to 502d.

[0036] As described herein, the front contact assembly 500 is inserted into the connector housing 202, and the connector housing 202 is coupled to the tail end assembly 300, so that the front contacts 502a-502d extend through the connector housing 202 and are exposed by the mating interface opening 208. Thus, the mating interface end 204 can be connected to a separate electrical connector (not shown) or a corresponding mating connector (not shown) mounted on a circuit board (not shown).

[0037] If the front contact assembly 500 and / or one or more front contacts 502a-502d are damaged, the electrical connector 200 can be detached from the tail end assembly 300. The damaged front contact assembly 500 can be replaced with a new front contact assembly 500, and the electrical connector 200 can be reconnected to the tail end assembly 300. In this way, the electrical cable assembly 100 provides desirable maintainability characteristics.

[0038] Figure 1C is a cross-sectional view along line 2-2 of a front contact assembly 500 included in the electrical cable assembly 100 shown in Figure 1B. The front contact assembly 500 includes a front socket 505 and a rear opening 507. Each front socket 505 supports front contacts 502a-502d, each positioned therein. Each rear opening 507 is positioned to receive connector pins 402a-402d, each insertable therein. In one or more non-limiting embodiments, the front contact assembly 500 may include clips 509 positioned in each rear opening 507. The clips 509 can be spring-loaded or elastically biased against the connector pins 402a-402d inserted into each rear opening 507. Therefore, the clip 509 can secure the connector pins 402a to 402d located in the rear opening 507 when the front contact assembly 500 is attached to the IDC wafer adapter assembly 400, while also allowing the front contact assembly 500 to be discoupled from the IDC wafer adapter assembly 400 as needed, for example, when servicing the electrical cable assembly 100 as described herein.

[0039] Next, we move to Figures 2A and 2B, where the tail end assembly 300 is shown in more detail. The tail end assembly 300 includes a cable 350, a coupling assembly 301, and a collar 310. As described herein, the coupling assembly 301 includes a first mating portion 306 and a second mating portion 308. According to a non-limiting embodiment, the first mating portion 306 is implemented as a bushing 306 and the second mating portion is implemented as a ferrule assembly 308.

[0040] The bushing 306 can detachably connect the tail end assembly 300 to the electrical connector 200. The bushing 306 includes a bushing head 305 and a bushing body 307. The bushing head 305 receives the cable sheath 302 and includes an opening through which the cable sheath passes into the hollow bushing body 307. The bushing body 307 includes a plurality of bushing screws 309 formed on its outer surface and may also include a hollow profile through which the cable sheath 302 passes into the ferrule assembly 308. The bushing screws 309 mate with connector screws formed on the inner surface of the cable interface end 206 of the connector housing 202.

[0041] The ferrule assembly 308 is configured to connect the bushing 306 to the IDC wafer adapter assembly 400. The ferrule assembly 308 includes a rear ferrule 311 and a front ferrule 313. The rear ferrule 311 is connected to the bushing body 307 and is configured to receive the cable sheath 302. The front ferrule 313 is connected to the rear ferrule 311 and is configured to allow the wires 304a to 304d from the cable sheath 302 to pass through to the IDC wafer adapter assembly 400.

[0042] Collar 310 can be implemented to further support the coupling between the coupling assembly 301 and the IDC wafer adapter assembly 400. In one or more non-limiting embodiments, collar 310 may include, but is not limited to, adhesive or epoxy, and may include a first portion coupled to the ferrule assembly 308 (e.g., front ferrule 313) and a second portion coupled to the IDC wafer adapter assembly 400.

[0043] Moving to Figure 2B, a cross-sectional view of the tail end assembly 300 along line 2-2 shown in Figure 2A is shown according to a non-limiting embodiment. As described herein, the bushing 306 and ferrule assembly 308 pass through the cable sheath 302 and carry the wires 304a-304d from the cable 350 to the IDC wafer adapter assembly 400. According to a non-limiting embodiment, the coupling assembly 301 is configured to restrain the cable 350 and prevent it from moving unintentionally.

[0044] In a non-limiting embodiment, a portion of the cable sheath 302 is removable to expose the braid 303, which is then insertable into the bushing 306 for transport over the end of the front ferrule 313. The excess portion of the braid 303 is then folded over the outer surface of the rear ferrule 311, and the front ferrule 313 is slidable over the outer surface of the rear ferrule 311, so that the folded portion of the braid 303 may be pushed or pinched between the inner surface of the front ferrule 313 and the outer surface of the rear ferrule 311. In one or more non-limiting embodiments, the outer surface of the rear ferrule 311 includes a serration 315 configured to "pass" the cable braid 303 through and secure it to the rear ferrule 311. When the connector housing 202 is coupled to the coupling assembly 301, a tensile force is applied to the cable braid 303, and the braid 303 is further constrained to a predetermined position, preventing the electrical cable 350 from moving away from the coupling assembly 301.

[0045] Figures 2A and 2B illustrate the coupling assembly 301 with the first mating portion 306 as a bushing 306 and the second mating portion 308 as a ferrule assembly 305, but it should be understood that other types of coupling assemblies 301 can be used to couple the cable 350 and the IDC wafer adapter assembly 400 without departing from the scope of the present invention. For example, in one or more non-limiting embodiments, the first mating portion 306 can be implemented as a clip or fastener, and the second mating portion 308 can be implemented as a hook or slot configured to mate with the clip or fastener, thereby coupling the cable 350 to the IDC wafer adapter assembly 400 when coupled with the fastener or clip.

[0046] Next, we move to Figure 3, a process diagram illustrating the preparation of the cable 350 for assembly according to a non-limiting embodiment of the present disclosure. The process begins with operation 362, in which a portion of the cable sheath is removed (e.g., stripped) to expose a portion of the underlying cable braid 303. In process 364, the rear ferrule 311 and bushing 306 are coupled to a portion of the braid 303. In process 366, the exposed portion of the braid 303 is trimmed to expose the wires 304a-304d. In process 368, the remaining portion of the braid 303 is folded over and onto the outer surface of the rear ferrule 311. In operation 370, the front ferrule 313 is slid over the folded braid 303 and the rear ferrule 311, thereby constraining the braid 303 in place.

[0047] Next, referring to Figures 4A to 4I, an IDC wafer adapter assembly 400 is shown according to a non-limiting embodiment of the present disclosure. This IDC wafer adapter assembly 400 includes a wire housing 401 and a plurality of IDC wafers 404a to 404d. The wire housing 401 extends from a front end 403 to a rear end 405 and includes a plurality of wire holes 408a, 408b, 408c, and 408d, which are collectively referred to as wire slots 408a to 408d (see Figure 4B). Each of the wire holes 408a to 408d receives the corresponding wires 304a to 304d. That is, each wire hole 408a to 408d receives the respective wires 304a to 304 included in the electrical cable 350.

[0048] The wire housing 401 is configured to arrange the conductive wires 304a to 304d in a Quadrax arrangement (e.g., multiple differential wire pairs). According to a non-limiting embodiment, a first differential wire pair includes a second wire 304b opposite a first wire 304a arranged along a first axis (Ac1), and a second differential wire pair includes a fourth wire 304d opposite a third wire 304c arranged along a second axis (Ac2) extending perpendicular to the first axis (Ac1).

[0049] As shown in Figure 4F, the wire housing 401 includes an insertable adapter plug 412 with stoppers 413a and 413b, which are insertable into the corresponding wire holes 408a and 408b, respectively. The stoppers 413a and 413b partially block the wire holes 408a and 408b, preventing the wires 304a to 304d from coming into contact with each other, i.e., short-circuiting. In one or more non-limiting embodiments, the adapter plug 412 may further include one or more guide pins 417 that are insertable into corresponding pin holes 419 to guide the insertion of the adapter plug 412 into the wire housing 401.

[0050] In accordance with non-limiting embodiments of this disclosure, wafer spaces 410a to 410d include a first differential wafer space pair (e.g., 410a and 410b) and a second differential wafer space pair (e.g., 410c and 410d). The first differential wafer space pair includes a first differential wafer space 410a configured to receive a first IDC wafer 404a and a second differential wafer space 410b configured to receive a second IDC wafer 404b. Similarly, the second differential wafer space pair includes a third differential wafer space 410c configured to receive a third IDC wafer 404c and a fourth differential wafer space 410d configured to receive a fourth IDC wafer 404d.

[0051] The wire housing 401 may also include a plurality of braces 414a to 414d, respectively, arranged in wafer spaces 410a to 410d. Each brace 414a to 414d includes IDC slots 416a to 416d. According to a non-limiting embodiment of this disclosure, the braces 414a to 414d include a first differential brace pair (e.g., 414a and 414b) and a second differential brace pair (e.g., 414c and 414d). The first differential brace pair includes a first brace 414a located in the first wafer space 410a and a second brace 414b located in the second wafer space 410b. The first and second braces 414a and 414b each extend from a first end to an opposing end, contacting the shoulder portion 415 of the wire housing 401 and defining the first brace length. The second differential brace pair includes a third brace 414c located in the third wafer space 410c and a fourth brace 414d located in the fourth wafer space 410d. The third and fourth braces 414c and 414d each extend from a first end to an opposing end, contacting the rear end of the wire housing 401 and defining a second brace length that is greater than the first brace length.

[0052] As shown in Figures 4A to 4D, each IDC wafer 404a to 404d establishes an IDC connection with each wire 304a to 304d located in their respective wire slots 408a to 408d. Figure 4I shows examples of a first IDC wafer 404a (e.g., a short IDC wafer) and a second IDC wafer 404c (e.g., a long IDC wafer). While IDC wafers 404a and 404c are shown, it should be understood that IDC wafer 404a can also represent IDC wafer 404b, and IDC wafer 404c can represent IDC wafer 404d. Each IDC wafer 404a to 404d includes a conductive IDC connection assembly for establishing a physical IDC connection with each wire 304a to 304d. According to a non-restrictive embodiment, the number of IDC connections corresponds to the number of IDC wafers 404a to 404d. For example, as shown in Figure 4D, each of the four individual IDC wafers 404a to 404d establishes its own IDC connection with the respective designated wires 304a to 304d. Therefore, the four IDC connections correspond to the number of individual IDC wafers 404a to 404d, i.e., four IDC wafers 404a to 404d.

[0053] The IDC connection assembly includes conductive connector pins 402a to 402d, conductive terminals 407a to 407d having first ends coupled to the connector pins 402a to 402d, and conductive blades 406a to 406d coupled to the opposing second ends of the conductive terminals 407a to 407d.

[0054] The conductive blades 406a to 406d are configured to make direct contact with their respective wires 304a to 304d, establishing an electrical connection between their respective conductive wirings 304a to 304d and their respective connector pins 402a to 402d. According to a non-limiting embodiment, each of the conductive blades 406a to 406d includes a pair of spaced-apart opposing claws 409a to 409d to define a blade slot 411 configured to receive a wire inserted therein. Thus, the claws 409a to 409d can penetrate the wire insulation layer as needed and establish physical contact with their respective wires 304a to 304d. In one or more non-limiting embodiments, each IDC wafer 404a to 404d includes a single blade 406a to 406d that establishes an IDC connection with a single wire 304a to 304d located in a wire housing 401.

[0055] According to a non-restrictive embodiment, the plurality of IDC wafers 404a to 404d include a first differential IDC wafer pair and a second differential IDC wafer pair. The first differential IDC wafer pair includes a first IDC wafer 404a configured to contact a first wire 304a and a second IDC wafer 404b configured to contact a second wire 304b. The second differential IDC wafer pair includes a third IDC wafer 404c configured to contact a third wire 304c and a fourth IDC wafer 404d configured to contact a fourth wire 304d. Thus, perfect symmetry is established between pairs of differential connector pins (e.g., connector pins 402a and 402b, and 402c and 402d), and further perfect symmetry is achieved between front contact pairs 502a and 502b and front contact pairs 502c and 502d.

[0056] The first and second IDC wafers 404a and 404b extend from a first end supporting connector pins 402a and 402b to an opposing second end supporting conductive blades 406a and 406b, defining a first wafer length. The second and third IDC wafers 404c and 404d extend from a first end supporting connector pins 402c and 402d to an opposing second end supporting conductive blades 406c and 406d, defining a second wafer length. According to a non-limiting embodiment, the second wafer length of the second and third IDC wafers 404c and 404d is longer than the first wafer length of the first and second IDC wafers 404a and 404b.

[0057] According to a non-limiting embodiment, IDC wafers 404a-404d are manufactured according to a stamping and overmolding process. For each individual IDC wafer 404a-404d, conductive connector pins 402a-402d, conductive terminals 407a-407d, and conductive blades 406a-406d are stamped from a conductive material. According to a non-limiting embodiment, the conductive material is a metal such as copper, brass, tin, silver, or gold. The stamped connector pins 402a-402d, stamped conductive terminals 407a-407d, and stamped conductive blades 406a-406d can be overmolded with a polymer material (e.g., plastic) to form a plurality of IDC wafers 404a-404d. In one or more non-limiting embodiments, the stamped connector pins 402a-402d, stamped conductive terminals 407a-407d, and stamped conductive blades 406a-406d are plated with a metallic material before overmolding. The plated metallic material may include, for example, gold, but it should be understood that other metals are also available. The manufacturing process flow for IDC wafers 404a-404d is described in detail below.

[0058] Referring to Figures 5A to 5C, process diagrams for assembling the IDC wafer adapter assembly 400 using multiple wires 304a to 304d are shown according to a non-limiting embodiment. Figure 5A provides a disassembled IDC wafer adapter assembly 400 with the multiple wires 304a to 304d inserted into the wire housing 401. In this arrangement, wires 304a and 304b are in a first differential wire pair configuration, and wires 304c and 304d are in a second differential wire pair configuration.

[0059] Referring to Figure 5B, the IDC wafer adapter assembly 400 is shown after the first differential IDC wafer pair 404a and 404b have been inserted into the wire housing 401, establishing electrical connections with the first differential wire pair 304a and 304b, respectively. Referring to Figure 5C, the IDC wafer adapter assembly 400 is shown after the second differential IDC wafer pair 404c and 404d have been inserted into the wire housing 401, establishing electrical connections with the second differential wire pair 304c and 304d, respectively.

[0060] Next, referring to Figures 6A to 6B, an IDC wafer adapter assembly 600 is shown according to another non-limiting embodiment. The IDC wafer adapter assembly 600 includes a wire housing 601 and a pair of IDC wafers 604a and 604b. The wire housing 601 extends from a front end 611 to a rear end 613. The wire housing 601 includes a plurality of wire slots 605a to 605d, each receiving a plurality of conductive wires 304a to 304d and configured to place the wires 304a to 304d into their respective guide paths 607a to 607d. IDC slots 603a to 603d formed in the wire housing 601 provide access to their respective guide paths 607a to 607d.

[0061] In a non-limiting embodiment, the wire housing 601 facilitates the arrangement of conductive wires 304a to 304d in a Quadrax configuration. That is, the wire housing 601 arranges the wires 304a to 304d in a plurality of differential wire pairs. A differential wire pair includes a first differential wire pair comprising a second wire 304d facing a first wire 304a arranged along a first axis Ac1 extending in a first direction, and a second differential wire pair comprising a third wire 304b facing a fourth wire 304c arranged along a second axis Ac2 extending in the opposite direction to the first direction of the first axis Ac1.

[0062] IDC wafers 604a and 604b are implemented as multi-blade IDC wafers. In other words, each IDC wafer 604a and 604b includes multiple blades configured to establish IDC connections with their respective wires 304a to 304d. Thus, the first IDC wafer 604a can establish IDC connections with the first group of wires 304a and 304b from among the multiple conductive wirings 304a to 304d, and the second IDC wafer can establish IDC connections with the second group of wires 304c and 304d from among the multiple wires 304a to 304d.

[0063] In a non-limiting embodiment, the first IDC wafer 604a includes a first IDC connection assembly and a second IDC connection assembly. The first IDC connection assembly includes a first conductive connector pin 602a, a first conductive terminal 608a having a first end coupled to the first conductive connector pin 602a, and a first conductive blade 610a coupled to the opposing second end of the first conductive terminal 608a. The second first IDC connection assembly includes a second conductive connector pin 602b, a second conductive terminal 608b having a first end coupled to the second conductive connector pin 602b, and a second conductive blade 610b coupled to the opposing second end of the second conductive terminal 608b.

[0064] The first conductive blade 610a is inserted into the first IDC slot 603a and connected to the first wire 304a, establishing an electrical connection between the first conductive pin 602a and the first wire 304a. Similarly, the second conductive blade 610b is inserted into the second IDC slot 603b and connected to the second wire 304b, establishing an electrical connection between the second conductive pin 602b and the second wire 304b.

[0065] The second IDC wafer 604b includes a third IDC connection assembly and a fourth IDC connection assembly. The third IDC connection assembly includes a third conductive connector pin 602c, a third conductive terminal 608c having a first end coupled to the third conductive connector pin 602c, and a third conductive blade 610c coupled to the opposing second end of the third conductive terminal 608c. The fourth IDC connection assembly includes a fourth conductive connector pin 602d, a fourth conductive terminal 608d having a first end coupled to the second conductive connector pin 602d, and a fourth conductive blade 610d coupled to the opposing second end of the fourth conductive terminal 608d.

[0066] The third conductive blade 610c is inserted into the third IDC slot 603c and connected to the third wire 304c, establishing an electrical connection between the third conductive pin 602c and the third wire 304c. Similarly, the fourth conductive blade 610d is inserted into the fourth IDC slot 603d and connected to the fourth wire 304d, establishing an electrical connection between the fourth conductive pin 602d and the fourth wire 304d.

[0067] In a non-restrictive embodiment, the first blade 610a in the first IDC wafer 604a and the fourth blade 610d in the fourth IDC wafer 604d establish a first differential blade pair (e.g., 610a and 610d). Similarly, the second blade 610b in the second IDC wafer 604b and the third blade 610c in the third IDC wafer 604c establish a second differential blade pair (e.g., 610b and 610c). Thus, each blade 610a and 610b and each blade 610c and 610d of the first IDC wafer 604a establish IDC connections with wires 304a and 304b, respectively, and each blade 610c and 610d of the second IDC wafer 604b establish IDC connections with wires 304c and 304d, respectively. In this way, the multi-blade wafers 604a and 604b can establish at least partial symmetry between pairs of differential connector pins (e.g., connector pins 602a and 602d, and 602b and 602c), and as a result, at least partial symmetry is also achieved between front contact pairs 502a and 502d, and front contact pairs 502b and 502c.

[0068] As described herein, one or more non-limiting embodiments of the present disclosure provide an IDC wafer adapter assembly (e.g., IDC wafer adapter assembly 400 or IDC wafer adapter assembly 600) that uses a plurality of individual IDC wafers (e.g., IDC wafers 404a-404d or IDC wafers 604a-604b) to establish IDC connections with wires 304a-304d arranged in a wire housing (e.g., wire housing 401 or wire housing 601). Each IDC wafer includes at least one of a first conductive connector pin (e.g., 402a or 602a), a first conductive terminal (e.g., 407a or 608a) whose first end is coupled to the first conductive connector pin, and a first conductive blade (e.g., 406a or 610a) coupled to the opposing second end of the first conductive terminal.

[0069] Referring to Figures 7A to 7D, process diagrams for assembling the electrical cable assembly shown in Figure 1A are shown according to non-limiting embodiments of the present disclosure. In Figure 7A, the electrical cable assembly 100 is shown after the tail end assembly 300 has been coupled to the wire housing 401.

[0070] Moving to Figure 7B, the electrical cable assembly 100 is shown to establish electrical connections with the multiple wires 304a to 304d after inserting the IDC wafers 404a to 404d into the wire housing 401. According to a non-limiting embodiment, the first differential IDC wafer pair 404a and 404b establish IDC connections with the first wire pair 304a and 304b, respectively, and the second differential IDC wafer pair 404c and 404d establish IDC connections with the second wire pair 304c and 304d, respectively.

[0071] Moving to Figure 7C, the electrical cable assembly 100 is shown after the assembled IDC wafer adapter assembly 400 has been coupled to the front contact assembly 500. The rear portion 503 of the front contact assembly 500 receives the connector pins 402a to 402d of the IDC wafer adapter assembly 400, so that each connector pin 402a to 402d makes physical contact with each contact 502a to 502d. Thus, the front contact assembly 500 establishes electrical conductivity between the connector pins 402a to 402d and the multiple contacts 502a to 502d.

[0072] Referring to Figure 7D, the electrical cable assembly 100 is shown after the assembled IDC wafer adapter assembly 400 has been inserted into the connector housing 202 and the connector housing 202 has been coupled to the tail end assembly 300. As described herein, the cable interface end 206 of the cable housing 202 includes connector threads formed on its inner surface, which are configured to mate with threads formed on the coupling assembly 301 (e.g., on the outer surface of the bushing 306). In this way, the connector housing 202 can be screwed (e.g. coupled) and unscrewed (discoupled) from the tail end assembly 300, providing a serviceability feature not provided in conventional electrical cable assemblies. As described herein, other techniques can be implemented in coupling / discoupling mechanisms, including, but not limited to, press-fitting of the connector housing 202 and the tail end assembly 300, and clip and hook assemblies for securing and discoupling the connector housing 202 and the tail end assembly 300.

[0073] The serviceability provided by the electrical connector assembly 100 includes facilitating the replacement of the front contact assembly 500. For example, a service method for the electrical cable assembly 100 includes uncoupling the connector housing 202 from the tail end assembly 300 and removing the IDC wafer adapter assembly 400 and the front contact assembly 500 coupled to the tail end assembly from within the connector housing 202. The method then includes removing the front contact assembly 500 from the IDC wafer adapter assembly 400 and coupling another front contact assembly 500 to the IDC wafer adapter assembly 400. The newly coupled front contact assembly 500 may include a front contact assembly 500 of the same type with one or more damaged parts removed, or it may include a front contact assembly 500 of a different type. The method then includes inserting the newly coupled front contact assembly 500 and the IDC wafer adapter assembly 400 into the connector housing 202 and coupling the electrical connector housing 202 to the tail end assembly 300.

[0074] Now, moving to Figures 8A to 8D, process diagrams for manufacturing a pair of IDC wafers 404a and 404c are shown according to a non-limiting embodiment. As shown in Figure 8A, the pair of electrical terminals 404a and 404c are shown after being stamped from a metal sheet 800. The metal sheet 800 can be formed from any known metallic material. The first terminal 404a includes a first end that is coupled to contact 402a and an opposing second end that is coupled to blade 406a. Similarly, the second terminal 407c includes a first end that is coupled to contact 402c and an opposing second end that is coupled to blade 406c. According to the non-limiting embodiment shown in Figures 8C to 8E, the first terminal 404a may be formed with a first length (L1), and the second terminal 404c may be formed with a second length (L2) that is longer than the first length (L1) of the first terminal 404a.

[0075] Turning to Figure 8B, contacts 402a and 402c are followed by a metal plating process. According to a non-limiting embodiment, a metallic material such as gold can be applied according to a variety of application processes, including, but not limited to, immersing contacts 402a and 402c in liquid metal or spraying the metallic material onto contacts 402a and 402c. Although Figure 8B shows the application of metal only to contacts 402a and 402c, it should be understood that the metal can also be applied to terminals 407a and 407c, and / or blades 406a and 406c, without departing from the scope of the invention.

[0076] Referring to Figure 8C, terminals 407a and 407c are shown following an overmolding process to form a pair of IDC wafers 404a and 404c. In a non-limiting embodiment, the overmolding process may include overmolding terminals 407a and 407c with a plastic or polymer material. Each of the IDC wafers 404a and 404c includes a wafer body extending along a first direction defining the wafer length, a second direction perpendicular to the first direction defining the wafer width, and a third direction perpendicular to the first and second directions defining the wafer thickness.

[0077] Moving to Figure 8D, the IDC wafers 404a and 404c are shown after the carrier strip 802 has been cut to separate the first IDC wafer 404a from the second IDC wafer 404c. This provides a pair of IDC wafers 404a and 404c, as shown in Figure 8E. According to a non-restrictive embodiment, the first IDC wafer 404a (e.g., a short IDC wafer) is formed to a first length (L1), and the second IDC wafer 404c (e.g., a long IDC wafer) is formed to a second length (L2) that is greater than the first length (L1) of the first wafer 404a. In this way, a differential pair of the first short IDC wafer (e.g., 404a and 404b) and a differential pair of the second long wafer (e.g., 404c and 404d) are formed as shown in Figure 4D.

[0078] Figures 8A to 8E illustrate the manufacturing of a single wafer using a single IDC connection assembly (e.g., a single blade). It should be understood that the manufacturing processes described in Figures 8A to 8E can be applied to the manufacturing of single wafers and multi-IDC connection assemblies (e.g., a single wafer and a multi-blade wafer) as shown in Figures 6A to 6B, without departing from the scope of the invention.

[0079] As described herein, various non-limiting embodiments of this disclosure provide an electrical cable assembly for implementing an IDC connection. The cable assembly may include an electrical connector, an IDC wafer adapter assembly, and a tail-end assembly. The IDC wafer adapter assembly may utilize a wire housing that arranges multiple wires bundled in the tail-end assembly into a Quadrax arrangement that provides symmetry (e.g., perfect symmetry) between differential contact pairs in a Quadrax arrangement. The wire housing may also receive multiple individual IDC wafers having IDC contacts configured to establish an IDC connection with each wire. An electrical connector may further be detachably coupled to the IDC wafer adapter assembly and the tail-end. In this way, if one or more contacts are damaged, it is not necessary to replace the entire electrical cable assembly.

[0080] The teachings described herein can be implemented as apparatus and / or methods in integration at any level of technical detail. Aspects of this disclosure are described with reference to flowcharts and / or block diagrams of one or more methods. In some alternative implementations, the functions described in the blocks may occur in a different order than shown in the diagrams. For example, two blocks shown consecutively may actually be executed substantially simultaneously, or blocks may sometimes be executed in reverse order.

[0081] While descriptions of various embodiments have been presented for illustrative purposes, they are not intended to be exhaustive or to limit oneself to the embodiments described. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the embodiments described. The terminology used herein has been selected to best represent the principles of the embodiments, their practical applications or technical improvements to the art found in the market, or to enable those skilled in the art to understand the embodiments described herein.

Claims

1. A tail end assembly for an electrical connector, An electrical cable containing multiple conductive wires, A coupling assembly that defines an internal gap and is coupled to the electrical cable so that the conductive wiring extends through the internal gap, Equipped with, The coupling assembly is configured to detachably couple the tail end assembly to the electrical connector, wherein the coupling assembly is a tail end assembly.

2. The tail end assembly according to claim 1, further comprising a first mating portion coupled to the electrical cable and a second mating portion configured to couple the first mating portion to the electrical connector.

3. The tail end assembly according to claim 2, wherein the first mating portion includes a bushing coupled to the electrical cable, and the second mating portion includes a ferrule assembly coupled to the bushing.

4. The tail end assembly according to claim 3, wherein the bushing includes a bushing body having a bushing screw configured to detachably connect the bushing to the electrical connector by engaging with a connector screw on the electrical connector.

5. The ferrule assembly is A rear ferrule coupled to the bushing configured to receive the aforementioned electrical cable, A front ferrule is coupled to the rear ferrule and configured to allow the conductive wiring to pass through the electrical connector. The tail end assembly according to claim 4, including the tail end assembly described in claim 4.

6. The tail end assembly according to claim 5, wherein the electrical cable includes a cable braid covering the conductive wiring and a cable sheath covering the cable braid.

7. The tail end assembly according to claim 6, wherein the cable braid is positioned on the upper surface of the cable sheath and includes a folded portion sandwiched between the outer surface of the rear ferrule and the inner surface of the front ferrule.

8. An electrical cable assembly, An electrical connector including a connector housing that defines an internal region, wherein the connector housing has a mating interface end that defines a mating interface opening and a cable interface end that defines a cable interface opening, A tail end assembly configured to be coupled to an IDC wafer adapter assembly including multiple IDC wafers, wherein the tail end assembly is configured to be detachably coupled to the cable interface end, and An electrical cable assembly comprising:

9. The tail end assembly is An electrical cable containing multiple conductive wires, Includes a coupling assembly that defines an internal gap and is coupled to the electrical cable so that the conductive wiring extends through the internal gap, The electrical cable assembly according to claim 8, wherein the coupling assembly is configured to detachably couple the tail end assembly to the electrical connector.

10. The electrical cable assembly according to claim 9, further comprising a first mating portion coupled to the electrical cable and a second mating portion configured to couple the first mating portion to the electrical connector.

11. The electrical cable assembly according to claim 10, wherein the first mating portion includes a bushing coupled to the electrical cable, and the second mating portion includes a ferrule assembly coupled to the bushing.

12. The electrical cable assembly according to claim 11, wherein the bushing includes a bushing body having a bushing screw configured to engage with a connector screw of the electrical connector to detachably connect the bushing to the electrical connector.

13. The ferrule assembly is A rear ferrule coupled to the bushing configured to receive the aforementioned electrical cable, A front ferrule is coupled to the rear ferrule and configured to allow the conductive wiring to pass through the electrical connector. An electrical cable assembly according to claim 12, including the following:

14. The electrical cable assembly according to claim 13, wherein the electrical cable includes a cable braid covering the conductive wiring and a cable sheath covering the cable braid.

15. The electrical cable assembly according to claim 14, wherein the cable braid is positioned on the upper surface of the cable sheath and includes a folded portion sandwiched between the outer surface of the rear ferrule and the inner surface of the front ferrule.

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