Heat dissipation devices, heat dissipation modules, and antenna devices including the same

Abstract

This invention provides a heat dissipation device that enables active heat exchange in the heat exchange region and facilitates the design of an expanded heat dissipation surface area, thereby improving heat dissipation performance. [Solution] The heat dissipation device includes a heat storage section that collects heat generated from a heating element, and a heat release section that diffuses the heat collected in the heat storage section to perform heat exchange, and is formed such that at least its tip extends to the heat exchange region outside the housing body equipped with the heating element and occupies a part of the heat exchange region.

Description

Technical Field

[0001] The present invention relates to a heat dissipation device, a heat dissipation module, and an antenna apparatus including the same (HEAT DISSIPATION DEVICE, HEAT DISSIPATION MODULE AND ANTENNA APPARATUS INCLUDING THE SAME), and more particularly, to a heat dissipation device, a heat dissipation module, and an antenna apparatus including the same that can improve the heat dissipation performance of an electronic device with intense operation heat generation including the antenna apparatus.

Background Art

[0002] Wireless communication technology, for example, MIMO (Multiple Input Multiple Output) technology is a technology that epochally increases the data transmission capacity using a plurality of antennas. In a transmitter, different data is transmitted through each transmission antenna, and in a receiver, it is a Spatial multiplexing method that classifies the transmitted data by appropriate signal processing.

[0003] Therefore, by simultaneously increasing the number of transmit and receive antennas, the channel capacity increases and more data can be transmitted. For example, when the number of antennas is increased to 10, approximately 10 times the channel capacity is ensured using the same frequency band compared to the current single-antenna system.

[0004] In 4G LTE-advanced, up to 8 antennas are used. Products equipped with 64 or 128 antennas have already been developed at the pre-5G stage, and in 5G, base station devices with a much larger number of antennas are used, which is called Massive MIMO technology. Since the current Cell operation is two-dimensional, when Massive MIMO technology is introduced, 3D-Beamforming becomes possible, so it is also called FD-MIMO (Full Dimension).

[0005] In Massive MIMO technology, as the ANT number increases, the resulting transmitter and filter numbers also increase accordingly.

[0006] However, considering the leasing costs of the installation site and spatial constraints, it is necessary to manufacture RF components (antennas / filters / power amplifiers / transceivers, etc.) to be small, light, and inexpensive. But when manufacturing at high power levels such as 320W or 640W to expand the coverage of Massive MIMO, the power consumption and heat generated by the aforementioned high-power components (RF components) act as negative factors in reducing weight and size.

[0007] Therefore, recent research has focused on improving the heat dissipation performance of radio units (RUs), which are fixed to a fixed structure such as a support pole, by separating the antenna unit, which is tilted or steered to adjust the direction of radiation beam at the site where the antenna device is installed, to reduce its weight, and concentrating the heat-generating elements in the radio unit (RU). [Overview of the Initiative] [Problems that the invention aims to solve]

[0008] The present invention has been made to solve the above technical problems, and aims to provide a heat dissipation device, a heat dissipation module, and an antenna device including the same that can effectively dissipate heat generated from electronic devices such as antenna devices, while preventing an increase in the weight of antenna units that require directional adjustment, thereby improving workability in the field.

[0009] In addition, the present invention aims to provide a heat dissipation device, a heat dissipation module, and an antenna device including the same, which overcome the limitations of increasing the heat dissipation surface area due to the thermal conductivity of the material itself, and enable the design of various forms of heat dissipation structures.

[0010] The problems addressed by the present invention are not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0011] A heat dissipation device according to one embodiment of the present invention includes a heat storage section that collects heat generated from a heating element, and a heat release section that diffuses the heat collected in the heat storage section to perform heat exchange, and is formed such that at least its tip extends to a heat exchange region outside the housing body equipped with the heating element and occupies a part of the heat exchange region.

[0012] Here, the heat exchange region occupied by the heat dissipation section can correspond to the area directly above the housing body.

[0013] Furthermore, the heat storage section and the heat release section can be manufactured as a single integrated unit.

[0014] Furthermore, the heat storage section may be a heat pipe filled with a refrigerant that flows while undergoing a phase change internally, and the heat dissipation section may be a heat sink fin that is thermally contact-coupled to the tip of the heat pipe.

[0015] Furthermore, the heat storage section may be a heat pipe filled with a refrigerant that flows while undergoing a phase change internally, and the heat dissipation section may be a vapor chamber filled with a refrigerant that flows while undergoing a phase change internally.

[0016] Furthermore, the heat storage section and the heat release section may be formed with a refrigerant flow space such that they are filled with a refrigerant that flows while undergoing a phase change internally.

[0017] Furthermore, the heat storage section may include an evaporation region in which the refrigerant undergoes a phase change to a gaseous state, and the heat release section may include a condensation region in which the refrigerant undergoes a phase change to a liquid state through heat exchange with the outside air in the heat exchange region.

[0018] Furthermore, the heat storage section and the heat dissipation section can be integrally molded and manufactured using a predetermined metal material.

[0019] Furthermore, when the heat dissipation portion is arranged so as to overlap the front or rear portion of the housing body in the front-rear direction, the heat dissipation portion may be extended to extend above the upper end of the housing body and to occupy at least a portion of the heat exchange area corresponding to the area directly above the front-rear thickness direction of the housing body.

[0020] Furthermore, when multiple heat dissipation devices are connected to the front and rear portions of the housing body, the rear end of the heat dissipation portion of the heat dissipation device provided on the front portion of the housing body and the front end of the heat dissipation portion of the heat dissipation device provided on the rear portion of the housing body may be arranged to have a predetermined separation distance in the front-rear direction, with the heat exchange area in between.

[0021] Furthermore, the distance between the upper end of the heat dissipation section and the upper end of the housing body can be designed differently depending on the amount of heat generated from the heat-generating element.

[0022] Furthermore, the heat receiving section can receive heat from the heating element by having one surface surface thermal contact with the heating surface of the heating element and being coupled to the other surface of a coupling heat transfer body provided to mediate the coupling to the housing body.

[0023] Furthermore, the heat receiving portion may have a thickness and length that allows it to be inserted into a fixed slit formed on the other side of the heat transfer body for coupling.

[0024] Furthermore, the heat dissipation portion may have an edge that is bent at a predetermined angle from the heat containment portion so as to occupy the heat exchange region.

[0025] A heat dissipation module according to an embodiment of the present invention includes a heat storage part that collects heat generated from a heat generating body, and a heat dissipation part that diffuses the heat collected by the heat storage part for heat exchange, and at least a tip of which extends into a heat exchange region outside the housing body provided with the heat generating body and is formed to occupy a part of the heat exchange region. A heat collection part includes a heat dissipation device, and a substrate storage part is formed on one surface to accommodate a PA board, and a plurality of fixing slits are formed on the other surface so that the heat dissipation device is provided thereon, and a coupling heat transfer body filled with a phase-changeable refrigerant is provided inside.

[0026] Here, the heat collection part may further include a shielding cover coupled to the coupling heat transfer body so as not to leak the internal refrigerant while forming one surface of the coupling heat transfer body, and a plurality of support pins disposed between the other surface of the coupling heat transfer body and the shielding cover.

[0027] Also, one end of the plurality of support pins may be supported by the shielding cover, and the other end may be supported by the other surface between the plurality of fixing slits of the other surface of the coupling heat transfer body.

[0028] Also, the refrigerant flow spaces formed inside the coupling heat transfer body and inside the plurality of heat dissipation devices can be formed to communicate with each other.

[0029] An antenna device according to an embodiment of the present invention includes a housing body in which an installation space provided with an RF filter part is formed, and a heat dissipation module coupled to the front surface part or the back surface part of the housing body. The heat dissipation module includes a heat storage part that collects heat generated from a heat generating body, and a heat dissipation part that diffuses the heat collected by the heat storage part for heat exchange, and at least a tip of which extends into a heat exchange region outside the housing body provided with the heat generating body and is formed to occupy a part of the heat exchange region. The heat dissipation module includes a heat dissipation device.

[0030] Here, the housing body includes a center housing in which the installation space for the RF filter is provided is formed, a front heat dissipation housing coupled to the front of the center housing, and a rear heat dissipation housing coupled to the rear of the center housing, and the heat dissipation module includes a front heat dissipation module provided in the front heat dissipation housing and a rear heat dissipation module provided in the rear heat dissipation housing, and the front heat dissipation housing and the rear heat dissipation housing may have a plurality of module coupling grooves that mediate the coupling of the front heat dissipation module and the rear heat dissipation module.

[0031] Furthermore, when the heat dissipation portions of the front heat dissipation module and the rear heat dissipation module are arranged so as to overlap the front or rear portion of the housing body in the front-rear direction, the heat dissipation portions may be extended to extend above the upper end of the housing body and to occupy at least a portion of the heat exchange area corresponding to the area directly above the front-rear thickness direction of the housing body.

[0032] Furthermore, the upper end of the housing body may further include a guide panel in which a plurality of guide slits are formed, into which the upper ends of the heat dissipation devices of the front heat dissipation module and the rear heat dissipation module are inserted. [Effects of the Invention]

[0033] According to one embodiment of the present invention, a heat dissipation device, a heat dissipation module, and an antenna device including the same, the heat generated from electronic equipment including the antenna device can be effectively dissipated while preventing an increase in the overall weight of the product, thereby improving workability on site.

[0034] Furthermore, according to one embodiment of the present invention, a heat dissipation device, a heat dissipation module, and an antenna device including the same, the limitations of the thermal conductivity of the material itself can be overcome, and the size of the product can be increased while designing to increase the heat dissipation surface area. [Brief explanation of the drawing]

[0035] [Figure 1A] This is a front perspective view showing an example of an antenna device that includes a heat dissipation device and a heat dissipation module according to one embodiment of the present invention. [Figure 1B] This is a rear perspective view showing an example of an antenna device that includes a heat dissipation device and a heat dissipation module according to one embodiment of the present invention. [Figure 2] Figures 1A and 1B are front views. [Figure 3] These are side views of Figures 1A and 1B. [Figure 4A] This is a front perspective view showing the rear clamping section attached. [Figure 4B] This is a rear perspective view showing the rear clamping section attached. [Figure 5A] Figure 4A is an exploded perspective view showing the rear clamping section disassembled. [Figure 5B] Figure 4B is an exploded perspective view of the rear clamping section. [Figure 6] This is a perspective view showing the side clamping section attached. [Figure 7A] Figure 1A is an overall decomposed perspective view. [Figure 7B] Figure 1B is an overall decomposed perspective view. [Figure 8] This is an exploded perspective view of the finger guard panel assembly, one of the components of Figure 1A. [Figure 9] These are front and rear perspective views showing the arrangement of heat dissipation devices according to one embodiment of the present invention. [Figure 10A] Figure 9 is a front-side exploded perspective view. [Figure 10B] Figure 9 is a rear-side exploded perspective view. [Figure 11] This is a perspective view showing a heat dissipation device according to one embodiment of the present invention. [Figure 12] This is a perspective view of the configuration shown in Figure 8, with the finger guard panel assembly removed. [Figure 13A]Figure 11 is a disassembled front perspective view showing only one front heat dissipation module, which is assembled with a heat dissipation device according to one embodiment of the present invention and is located on the front of the housing body. [Figure 13B] Figure 11 is a rear-section exploded perspective view showing only one forward heat dissipation module, which is assembled with a heat dissipation device according to one embodiment of the present invention and is located on the front of the housing body. [Figure 14] Figure 2 is a perspective view of the incision along line AA. [Figure 15] Figure 2 is a cross-sectional view along line AA, showing various examples of heat dissipation devices and heat dissipation modules. [Figure 16] Figure 1 is an exploded perspective view showing the installation of the front heat dissipation housing, heat dissipation device, and front heat dissipation module relative to the center housing. [Modes for carrying out the invention]

[0036] Hereinafter, a heat dissipation device, a heat dissipation module, and an antenna device including the same, according to one embodiment of the present invention, will be described in detail with reference to the attached drawings.

[0037] When assigning reference numerals to the components in each drawing, it should be noted that, as far as possible, identical components should have the same reference numeral even if they are shown in other drawings. Furthermore, when describing embodiments of the present invention, if it is determined that a specific description of such known configurations or functions would hinder understanding of the embodiments of the present invention, such detailed description will be omitted.

[0038] In describing the components of the embodiments of the present invention, terms such as First, Second, A, B, (a), (b), etc., may be used. Such terms are merely for distinguishing a component from other components, and do not limit the nature, order, or procedure of that component. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the art to which the present invention pertains. Terms as defined in commonly used dictionaries should be interpreted as having the meaning consistent with their meaning in the context of the relevant art, and not in an ideal or overly formal sense unless explicitly defined in this application.

[0039] Figures 1A and 1B are front and rear perspective views showing an example of an antenna device including a heat dissipation device and heat dissipation module according to one embodiment of the present invention; Figure 2 is a front view of Figures 1A and 1B; Figure 3 is a side view of Figures 1A and 1B; Figures 4A and 4B are front and rear perspective views showing the rear clamping section attached; Figures 5A and 5B are exploded perspective views of the rear clamping section of Figures 4A and 4B; and Figure 6 is a perspective view showing the side clamping section attached.

[0040] As shown in Figures 1 to 6, a heat dissipation device 210 according to one embodiment of the present invention is provided in a radio unit 1, an example of an electronic device, and is installed inside the radio unit 1 and operates to receive heat from a heat-generating element (not shown) that generates system heat and dissipate that heat.

[0041] Here, the term "electronic device" is a concept that includes any type of device that has an internal configuration similar to the heating element described above. However, for the sake of explanation, the antenna device (or radio unit 1), which is an important product of the business operated by the applicant of the present invention, will be described below as an example of its application.

[0042] In particular, before describing one embodiment of the present invention, we define a combination of multiple heat dissipation devices 210 (described later) as a "heat dissipation module 200," and define and describe a product in which multiple such heat dissipation devices 210 and multiple heat dissipation modules 200 are applied and installed as an "antenna device (or radio unit 1)." However, it can be understood that the antenna device 1 here refers only to the radio unit, excluding the antenna unit, which is an assembly of antenna radiating elements.

[0043] In addition, while semiconductors are a typical example of electrically driven heating elements found inside electronic devices, they are not limited to semiconductors, and do not exclude RF components in communication antenna devices, displays and energy storage systems (ESS), artificial intelligence (AI), and other internal driving elements in electrical and electronic devices.

[0044] Since the electronic device to which the heat dissipation device 210 according to one embodiment of the present invention is applied is a radio unit 1, which is one of the antenna devices, the heat-generating element will be used as a PA element 223a mounted on the PA board 223, as will be explained later.

[0045] A radio unit 1 to which a heat dissipation device 210 according to one embodiment of the present invention is applied is configured to play the role of a repeater in a base station antenna device, and by separating the antenna unit, which is equipped with an antenna radiating element that substantially forms and radiates an antenna beam, the weight of the single product can be reduced and the working environment at the site can be improved.

[0046] Here, unlike the antenna unit (not shown), the radio unit 1 does not require tilting or steering adjustment for setting the direction of the radiated beam, and only requires stable fixing to a structure such as the support pole P described later. This indirectly provides the advantage of enabling the lightweight manufacture of an antenna unit that is required to be installed at a higher location.

[0047] Such a radio unit 1 may further include a finger guard panel assembly 10, which is provided to surround a heat dissipation device 210 according to one embodiment of the present invention, as shown in Figures 1A to 2, to prevent injuries such as burns to workers. The specific configuration and coupling structure of the finger guard panel assembly 10 will be described in more detail later.

[0048] On the other hand, as shown in Figures 1 to 6, the radio unit 1 may include an RF filter section 120, a housing body 100 that mediates the fixing of the RF filter section 120, and a heat dissipation device 210 according to one embodiment of the present invention that is coupled to the housing body 100.

[0049] Here, the radio unit 1 can be stably attached to the support pole P via the clamping portion 30, as shown in Figures 4A to 5B and Figure 6.

[0050] As shown in Figures 4A to 5B, the clamping section 30 may include a rear clamping section 30R provided on the rear of the radio unit 1 for attaching the radio unit 1 to the support pole P, and a side clamping section 30S provided on the side of the radio unit 1 for attaching the radio unit 1 to the support pole P.

[0051] Here, since the rear clamping portion 30R is not exposed to the outside by the finger guard panel assembly 10 on the rear of the housing body 100, by further providing the rear mounting bracket 20, it can be installed on the left and right sides of the housing body 100 that are exposed to the outside by the finger guard panel assembly 10.

[0052] For reference, the side clamping portion 30S can be directly connected to either the left or right side of the housing body 100, which is exposed and not concealed by the finger guard panel assembly 10, without the aforementioned intermediary configuration.

[0053] As shown in Figure 5A, the rear mounting bracket 20 extends horizontally and parallel to the rear of the radio unit 1, with both ends bent forward. The clamp fixing screws 27 pass through the screw through holes 25 formed at both ends and fasten into the screw fastening holes 117 formed on both the left and right sides of the housing body 100, thereby fixing it to the radio unit 1.

[0054] On the other hand, the rear clamping section 30R and the side clamping section 30S differ only in whether or not they use the rear mounting bracket 20 described above, and all other configurations are identical. Therefore, with reference to Figures 5A and 5B, only the rear clamping section 30R will be described in detail below, and the explanation of the side clamping section 30S will be replaced by the explanation of the configuration of the rear clamping section 30R.

[0055] The rear clamping section 30R, as shown in Figures 5A and 5B, may include a first fixing plate section 31 fixed to the rear mounting bracket 20, a second fixing plate section 32 tightly coupled to the rear surface of the first fixing plate section 31, and a clamping bar 33 provided to surround the support pole P, which is coupled via a pair of stud bolts 34 to a pair of left and right boss sections 32a of four boss sections 32a formed at the square corners of the rear surface of the second fixing plate section 32.

[0056] The first fixing plate portion 31 is manufactured to a single standard that can be installed on the rear mounting bracket 20 provided on the rear of the radio unit 1 or on the side of the radio unit 1 (in the case of the side clamping portion 30S), and can be used to fix the second fixing plate portion 32, which is manufactured to various standards, to the radio unit 1 in a general-purpose manner regardless of the size (diameter, etc.) of the support pole P.

[0057] Unlike the first fixing plate section 31, which is manufactured to a single standard, the second fixing plate section 32 is manufactured to various standards according to the size (diameter, etc.) of the support pole P to be installed, as described above, and can be selected according to the specifications of the support pole P and attached to the first fixing plate section 31.

[0058] Here, at least one pair of screw through-holes 31h-1 are formed at the upper and lower ends of the first fixing plate portion 31, and the first fixing plate portion 31 can be fixed to the rear mounting bracket 20 by fastening multiple assembly screws 37s-1 through the screw through-holes 31h-1 to screw fastening holes 20h-1 that are pre-formed in the rear mounting bracket 20.

[0059] On the other hand, mold-fitting grooves 31a are formed at the left and right ends of the back surface of the first fixing plate portion 31, respectively, into which mold-fitting ribs 32b protruding forward from the second fixing plate portion 32 are fitted. With the mold-fitting ribs 32b fitted into the mold-fitting grooves 31a, the second fixing plate portion 32 can be firmly fixed to the first fixing plate portion 31 via the plate assembly screws 37s-2.

[0060] For this purpose, a screw through-hole 31h-2 may be formed in the upper part of the first fixing plate portion 31 where the mold-fitting groove 31a is formed, through which the plate assembly screw 37s-2 passes, and a screw fastening hole 32h-2 may be formed in the upper part of the mold-fitting rib 32b of the second fixing plate portion 31, through which the plate assembly screw 37s-2 is fastened.

[0061] Here, even when the second fixing plate portion 32 is manufactured in various specifications according to the size of the support pole P, the aforementioned mold-fitting rib 32b and mold-fitting groove 31a are formed to the same specifications, thereby enabling the first fixing plate portion 31 to be universally connected to the second fixing plate portion 32 of various specifications.

[0062] On the other hand, the clamping bar 33 may include an upper clamping bar 30U located relatively above and a lower clamping bar 30D located relatively below.

[0063] Here, the upper clamping bar 30U and the lower clamping bar 30D are formed in an inverted U-shape with approximately one side open, and stud bolts 34 that pass through both ends in the front-rear direction while surrounding one side of the outer surface of the support pole P can be bolted to the bolt fastening bosses 32a formed at each corner end on the rear side of the second fixing plate portion 32 via bolt guide rods 35 that can be inserted into connecting bosses 33a provided at both ends of the clamping bar 33.

[0064] The upper and lower ends of the rear portion of the second fixing plate portion 32, and the upper clamping bar 30U and lower clamping bar 30D may each be provided with clamping gears 36 for clamping the outer surface of the support pole P, such that the amount of protrusion to the outside can be adjusted.

[0065] The clamping gears 36 are provided in pairs, spaced apart vertically, allowing clamping at four points on the outer surface of at least one support pole P.

[0066] On the other hand, as already explained, the side clamping portion 30S differs from the rear clamping portion 30R in that, as shown in Figure 6, the configuration corresponding to the first fixing plate portion 31 is fastened directly to the screw fastening holes 117 formed on the left and right sides of the housing body 100 using assembly screws 27, without an intermediary configuration such as the rear mounting bracket 20.

[0067] Figures 7A and 7B are exploded perspective views of Figures 1A and 1B, respectively, while Figure 8 is an exploded perspective view of the finger guard panel assembly, which is part of the configuration shown in Figure 1A.

[0068] The housing body 100 may include, as shown in Figures 7A and 7B, a center housing 110C having an installation space for an RF filter section 120 (described later), a front heat dissipation housing 110F provided on the front of the center housing 110C and mediating the installation of a front heat dissipation module 200A, which is provided in a modular form by combining a plurality of heat dissipation devices 210 according to one embodiment of the present invention, and a rear heat dissipation housing 110R provided on the rear of the center housing 110C and mediating the installation of a rear heat dissipation module 200B, which is provided in a modular form by combining a plurality of heat dissipation devices 210 according to one embodiment of the present invention.

[0069] In other words, as shown in Figures 7A and 7B, the radio unit 1 includes a housing body 100, a front heat dissipation module 200A located at the front of the housing body 100, and a rear heat dissipation module 200B located at the rear of the housing body 100. It can be seen that the front heat dissipation module 200A and the rear heat dissipation module 200B are composed of multiple heat dissipation devices 210 according to one embodiment of the present invention, arranged in a modular configuration.

[0070] In addition, the radio unit 1 may further include an RF filter section 120, as shown in Figures 7A and 7B.

[0071] Here, the RF filter section 120 may include a cavity filter type filter body (see reference numeral "121" in Figure 16) that has multiple resonators (see reference numeral "122" in Figure 16) inside. However, the RF filter section 120 is not necessarily limited to a cavity filter type, and may also be a waveguide filter type.

[0072] For reference, as shown in Figure 16 later, the filter body 121 is formed with one side having a cavity and is open, and the open side can be shielded by a filter tuning cover 123 which is provided with a plurality of stamped sections 124 for fine frequency tuning.

[0073] The housing body 100 is formed in a square frame shape and may include a center housing 110C formed to penetrate in the front-to-back direction so as to be provided with an RF filter section 120, and a front heat dissipation housing 110F and a rear heat dissipation housing 110R which are coupled to the front and rear portions of the center housing 110C, respectively.

[0074] The front heat dissipation housing 110F and the rear heat dissipation housing 110R are connected to the front and rear portions of the center housing 110C, which is provided with an RF filter section 120, respectively. Multiple heat dissipation fins 115F and 115R can be integrally formed on the front portion of the front heat dissipation housing 110F and the rear portion of the rear heat dissipation housing 110R, respectively, for dissipating heat to the outside through heat exchange with the outside air.

[0075] The front heat dissipation housing 110F and the rear heat dissipation housing 110R are provided in a panel shape having approximately the same size as the center housing 110C, and can be formed to a size that can completely cover the front and back of the center housing 110C, which penetrates in the front-to-back direction.

[0076] Multiple heat dissipation fins 115F and 115R can be integrally formed on the lower ends of the front surface of the front heat dissipation housing 110F and the rear surface of the rear heat dissipation housing 110R.

[0077] Here, the multiple heat dissipation fins 115F and 115R formed on the front surface of the front heat dissipation housing 110F and the back surface of the rear heat dissipation housing 110R are formed to be elongated in the vertical direction so that when the released heat forms an upward airflow, it is not interfered with by adjacent heat dissipation fins 115F and 115R and no flow resistance is generated.

[0078] Furthermore, the multiple heat dissipation fins 115F and 115R may include a front heat dissipation fin 115F that protrudes forward from the front of the panel-shaped front heat dissipation housing 110F, and a rear heat dissipation fin 115R that protrudes rearward from the back of the panel-shaped rear heat dissipation housing 110R.

[0079] Here, the front heat dissipation housing 110F and the rear heat dissipation housing 110R are made of a thermally conductive material (metal material) capable of transferring a predetermined amount of heat, and it goes without saying that the front heat dissipation fins 115F and the rear heat dissipation fins 115R are also made of a thermally conductive material, since they are integrally formed.

[0080] However, even if the front heat dissipation fins 115F and rear heat dissipation fins 115R are made of a metal material with excellent thermal conductivity, it is impossible to extend them indefinitely from the point where the heat-generating element is installed in order to increase the surface area for heat dissipation, due to the limitations of the thermal conductivity of the material itself. Therefore, the design of the front end position and the rear end and lower end positions must be optimally designed according to the surrounding environment.

[0081] The front heat dissipation housing 110F and the rear heat dissipation housing 110R may be formed with a plurality of module coupling grooves 113A, 113B that mediate the coupling of a module-shaped front heat dissipation module 200A and a rear heat dissipation module 200B, which are composed of multiple heat dissipation devices 210 according to one embodiment of the present invention.

[0082] The multiple module coupling grooves 113A and 113B are provided in the form of square through-holes at the upper ends of the front heat dissipation housing 110F and the rear heat dissipation housing 110R, as shown in Figures 7A and 7B, and multiple grooves may be formed spaced apart in the left-right direction.

[0083] Here, multiple module coupling grooves 113A and 113B are formed to penetrate the front heat dissipation housing 110F and the rear heat dissipation housing 110R in the front-rear direction, but since the clamshell cover 114, which will be described later, is coupled to them and shields them in the front-rear direction, the component is given the name "coupling groove" rather than "coupling hole".

[0084] As an example, the front heat dissipation housing 110F and the rear heat dissipation housing 110R may be provided with multiple module coupling grooves 113A and 113B in such a configuration that four front heat dissipation modules 200A and four rear heat dissipation modules 200B are provided in the front and rear directions, respectively, with each module coupling groove being a combination of multiple heat dissipation devices 210 according to one embodiment of the present invention, which will be described later.

[0085] In addition, once the installation of the front heat dissipation module 200A and the rear heat dissipation module 200B, which consist of a combination of heat dissipation devices 210 according to one embodiment of the present invention, in the front heat dissipation housing 110F and the rear heat dissipation housing 110R is complete, a finger guard panel assembly 10 may be provided to cover the entire heat dissipation device 210 and heat dissipation modules 200A and 200B to prevent burns to workers or outsiders due to the high temperature heat emitted from the heat dissipation device 210.

[0086] The finger guard panel assembly 10 may have multiple airflow holes 15 formed in a grill shape to ensure smooth airflow to the heat exchange region 50, which will be described later.

[0087] The finger guard panel assembly 10 may be positioned to cover all or the upper ends of the center housing 110C, which will be described later, and the heat dissipation device 210 and heat dissipation module 200, which are provided in the front heat dissipation housing 110F and rear heat dissipation housing 110R respectively, according to one embodiment of the present invention, as shown in Figures 7A to 8.

[0088] More specifically, the finger guard panel assembly 10 may include a front finger guard panel 10A coupled to the front portion of the front heat dissipation housing 110F, and a rear finger guard panel 10B coupled to the rear portion of the rear heat dissipation housing 110R.

[0089] The front finger guard panel 10A has a rectangular parallelepiped shape with its rear and bottom surfaces open, and the rear finger guard panel 10B has a rectangular parallelepiped shape with its front and bottom surfaces open. The front finger guard panel 10A and the rear finger guard panel 10B may have a plurality of airflow holes 15 formed therein so that external air can exchange heat with the heat dissipation device 210 according to one embodiment of the present invention.

[0090] The front finger guard panel 10A is screw-fixed at its lower end to a plurality of heat dissipation fins 115F integrally formed on the lower end of the front heat dissipation housing 110F (described later) by lower fixing screws 11s-1. The left and right sides may be screw-fixed to screw fastening holes 110h-2 provided on the left and right sides of the center housing 110C and screw fastening holes 40h-3 provided on the left and right sides of the guide panel 40 (described later) by first side fixing screws 11s-2 and second side fixing screws 11s-3, respectively. For this purpose, a screw fastening hole 115h into which the lower fixing screw 11s-1 is fastened can be integrally formed at the upper end of at least one of the plurality of heat dissipation fins 115F, and multiple lower screw through holes 11h-1 through which the lower fixing screws 11s-1 pass can be formed at the lower end of the front finger guard panel 10A.

[0091] In addition, multiple screw through-holes 11h-4 are formed vertically through the rear end of the upper part of the front finger guard panel 10A, and screw fastening holes 40h-4 are formed at the upper end of the guide panel 40, which will be described later, into which upper fixing screws 11s-4 pass through the multiple screw through-holes 11h-4 before being fastened, and the panel may be screw-fixed by multiple upper fixing screws 11s-4.

[0092] The coupling structure of the rear finger guard panel 10B to the rear heat dissipation housing 110R and guide panel 40, which has not been described, is exactly the same as that of the front finger guard panel 10A described above, so this description will suffice.

[0093] On the other hand, as shown in Figures 7A and 7B, a front board (130F, for example, a PSU board (Power Supply Unit Board)) on which a heat-generating element (heat-generating component) that generates a predetermined amount of driving heat is mounted may be placed between the front of the RF filter section 120 and the front heat dissipation housing 110F, and the heat generated by the heat-generating element (for example, a PSU component) mounted on the front board 130F can be dissipated through the aforementioned front heat dissipation fins 115F.

[0094] Furthermore, as shown in Figures 7A and 7B, a rear board (130R, for example, a PBA (Printed Board Assembly)) may be placed between the rear of the RF filter section 120 and the rear heat dissipation housing 110R, and the heat generated by the heat-generating elements (for example, FPGA elements) mounted on the rear board 130R can be dissipated through the rear heat dissipation fins 115R described above.

[0095] Here, as shown in Figure 7B, a front board mounting groove 140A may be formed on the rear surface of the front heat dissipation housing 110F for stacking and mounting the front board 130F (PSU board). Multiple PSU elements may be mounted on the front surface of the PSU board, which is the front board 130F. The heat-generating surfaces of the PSU elements are in close contact with the inner surface (front) of the front board mounting groove 140A, and heat exchange with the outside air using the front heat dissipation fins 115F is performed by surface thermal contact with the front heat dissipation housing 110F, thereby enabling forward heat dissipation.

[0096] In addition, a rear board mounting groove 140B may be formed on the front surface of the rear heat dissipation housing 110R, as shown in Figure 7A, for stacking and mounting the rear board 130R (or PBA). Multiple FPGA elements may be mounted on the front surface of the PBA, which is the rear board 130R. The heat-generating surfaces of the FPGA elements are in close contact with the inner surface (rear surface) of the rear board mounting groove 140B, and heat dissipation to the rear is possible through heat exchange with the outside air using the rear heat dissipation fins 115R due to surface thermal contact with the rear heat dissipation housing 110R.

[0097] Figure 9 is a front and rear perspective view showing the arrangement of a heat dissipation device according to one embodiment of the present invention; Figures 10A and 10B are exploded perspective views of the front and rear of Figure 9; Figure 11 is a perspective view showing a heat dissipation device according to one embodiment of the present invention; Figure 12 is a perspective view of the configuration in Figure 8 with the finger guard panel assembly removed; and Figures 13A and 13B are exploded perspective views of the front and rear of the configuration in Figure 11, showing only one front heat dissipation module assembled with a heat dissipation device according to one embodiment of the present invention provided on the front of the housing body.

[0098] As shown in Figures 7A and 7B, one embodiment of the present invention, the heat dissipation device 210, can be formed by combining at least two or more front heat dissipation modules 200A provided on the front surface of the front heat dissipation housing 110F, and a plurality of rear heat dissipation modules 200B provided on the front surface of the rear heat dissipation housing 110R.

[0099] Here, the front heat dissipation module 200A and the rear heat dissipation module 200B are identical in their detailed configuration and coupling relationships, differing only in their installation location (front heat dissipation housing 110F or rear heat dissipation housing 110R). Therefore, the following explanation will focus on the front heat dissipation module 200A, and the rear heat dissipation housing 110R will be described in place of the front heat dissipation housing 200A.

[0100] On the other hand, as shown in Figures 7A and 7B, an antenna device (radio unit) 1 according to one embodiment of the present invention may further include a guide panel 40 that supports the upper ends of the heat dissipation devices 210 of the front heat dissipation module 200A and the rear heat dissipation module 200B.

[0101] The guide panel 40 is provided in a roughly square frame shape, is formed to penetrate in the front-to-back direction and forms a heat exchange region 50, which will be described later, and can be screw-assembled to the upper end of the center housing 110C using a plurality of panel assembly screws 43.

[0102] In addition, screw fastening holes 40h-3 may be formed on the left and right sides of the guide panel 40 to provide fastening points for the second side fixing screws 11s-3, which are assembled with screws via the sides of the front finger guard panel 10A and the rear finger guard panel 10B.

[0103] Furthermore, the upper end of the guide panel 40 is provided in a grille shape to ensure smooth ventilation of outside air to the heat exchange area 50, and guide slits 41 may be formed at the front and rear ends of the upper end, into which the upper ends of each heat dissipation device 210 are inserted when the front heat dissipation module 200A and the rear heat dissipation module 200B are coupled to the housing body 100.

[0104] The guide slits 41 of the guide panel 40 serve to prevent damage to the heat dissipation devices 210 by limiting the lateral movement (play distance) of the upper ends of the multiple heat dissipation devices 210 that extend beyond the upper end of the center housing 110C of the housing body 100.

[0105] Furthermore, the guide panel 40 can provide a screw assembly portion for stably connecting the finger guard panel assembly 10.

[0106] The forward heat dissipation module 200A may include a coupling heat transfer body 221 and at least two or more heat dissipation devices 210 coupled to the coupling heat transfer body 221, as shown in Figure 9.

[0107] In this configuration, the forward heat dissipation module 200A can be coupled to the forward heat dissipation housing 110F (or rear heat dissipation housing 110R) via the coupling heat transfer members 221 by inserting coupling heat transfer members 221 into the multiple module coupling grooves 113A and 113B formed in the forward heat dissipation housing 110F (or rear heat dissipation housing 110R).

[0108] In this case, the coupling heat transfer body 221 may have a groove-shaped substrate housing portion 222h that houses a PA board in which a heating element (for example, a PA element 223a which generates a slightly larger amount of heat among RF components) with properties different from the heating element mounted on the front board 130F and the heating element mounted on the rear board 130R described above is mounted separately from the front board 130F and the rear board 130R.

[0109] In particular, the coupling heat transfer element 221 may be provided in the form of a vapor chamber, which is filled with a coolant and undergoes a phase change due to the heat transferred from the heat source, thereby transferring heat while flowing.

[0110] Generally, a vapor chamber is a heat transfer means that acts as a medium for transferring heat from one side to another. When heat is transferred from the outside, the liquid phase refrigerant evaporates into a gaseous phase refrigerant through a wick structure formed to contain numerous pores inside, flows, then condenses in a low-temperature region, and undergoes a phase change back to a liquid phase refrigerant, repeating this process.

[0111] However, the coupling heat transfer element 221 does not necessarily have to be in the form of a vapor chamber. In other words, the coupling heat transfer element 221 may be provided in the form of a simple metal (thermal conductive material) panel, to the extent that it can transfer the heat generated from the heating element to the heat dissipation device 210 according to one embodiment of the present invention.

[0112] Multiple screw fastening grooves 225h-1 and 225h-2 are provided in a semicircular shape at the left and right edges of the coupling heat transfer body 221 and the shielding cover 222, which will be described later. Multiple module assembly screws 225s, each having a flat head, are locked into the multiple screw fastening grooves 225h-1 and 225h-2, and are then coupled by a screw coupling method to screw fastening holes (not indicated in the drawing reference numerals) formed corresponding to the edges of the module coupling grooves 113A and 113B of the front heat dissipation housing 110F and the rear heat dissipation housing 110R, respectively. This allows the front heat dissipation module 200A and the rear heat dissipation module 200B to be stably fixed to the front heat dissipation housing 110F and the rear heat dissipation housing 110R.

[0113] On the other hand, one surface of the coupling heat transfer body 221 is formed facing the heating element of the PA board 223 (i.e., the PA element 223a), and a plurality of fixing slits 221a may be formed on the other surface of the coupling heat transfer body 221 so as to be provided with a heat dissipation device 210 according to one embodiment of the present invention. That is, the heat dissipation device 210 according to one embodiment of the present invention can receive heat from the heating element via the coupling heat transfer body 221.

[0114] On the other side of the coupling heat transfer body 221, at least two (six in this embodiment) heat dissipation devices 210 according to one embodiment of the present invention can be coupled perpendicularly to the other side of the coupling heat transfer body 221.

[0115] Here, one surface of the coupling heat transfer body 221 may be positioned to make surface thermal contact with the heating element (PA element 223a) of the PA board 223, which is located on the front or rear surface of the RF filter section 120 and is separated from the front board 130F and the rear board 130R. Preferably, as shown in Figures 9 and 10A, it is possible to make surface thermal contact with the heating element (PA element 223a) of the PA board housed in the substrate housing section 222h.

[0116] More specifically, multiple heat-generating elements are mounted on the front of the front board 130F and the back of the rear board 130R. In the case of radio unit 1, the front board 130F may be a PSU board, and the rear board 130R may be a PBA-type main board. Typically, a variety of heat-generating elements, such as digital drive elements like the FPGA elements and analog drive elements like the PA element 223a mentioned above, can be concentrated on the main board.

[0117] Among such heat-generating elements, the PA element 223a belongs to the category of heat-generating elements that consume relatively large amounts of power while operating and generate a moderate amount of heat. However, each PA board 223 is manufactured separately so that only the PA element 223a is mounted, and is inserted into the substrate housing portion 222h provided in the coupling heat transfer body 221 for multiple front heat dissipation modules 200A and rear heat dissipation modules 200B. The PA board 223 is then housed and positioned in the substrate housing portion 222h on one side of the coupling heat transfer body 221, allowing the heat generated from the PA element 223a to be directly transferred and dissipated to the heat dissipation device 210 according to one embodiment of the present invention via the coupling heat transfer body 221.

[0118] The coupling heat transfer element 221 and the substrate housing section 222h can be separated by the shielding cover 222, and the shielding cover 222 can play a role in transferring the heat generated by the heat-generating element to the coupling heat transfer element 221.

[0119] On the other hand, since multiple heat dissipation devices 210 according to one embodiment of the present invention are connected, multiple fixing slits 221a are formed on the other side of the connecting heat transfer body 221, spaced apart to the left and right, which may reduce the rigidity of the other side portion of the connecting heat transfer body 221.

[0120] To prevent a decrease in the rigidity of the coupling heat transfer body 221 itself, a plurality of support pins 226 may be provided, one end of which is supported by the shielding cover 222 and the other end of which is supported between adjacent fixing slits 221a.

[0121] The multiple support pins 226 not only reinforce the rigidity of the coupling heat transfer body 221 by preventing it from being pushed by external forces transmitted from one side and the other side, but also serve to prevent the refrigerant filled inside from leaking out.

[0122] The interior of the heat transfer body 221 configured in this way can be formed by interconnecting refrigerant flow spaces 205 formed inside multiple heat dissipation devices 210 via multiple fixed slits 221a, so that the refrigerant is shared.

[0123] On the other hand, the PA board 223 is shielded by the clamshell cover 114 that covers the substrate housing portion 222h of the coupling heat transfer body 221, thereby blocking the intrusion and interference of external radio waves.

[0124] Here, although not shown, the clamshell cover 114 can also be coupled to the coupling heat transfer body 221 so as to completely cover the PA board housed in the substrate housing portion 222h of the coupling heat transfer body 221, and as shown in Figures 7A and 7B, it can also be provided coupled to the module coupling grooves 113A and 113B of the front heat dissipation housing 110F and the rear heat dissipation housing 110R.

[0125] Thus, the heat dissipation device 210 according to one embodiment of the present invention is manufactured as a modularized forward heat dissipation module 200A or rear heat dissipation module 200B by combining multiple units together with a PA board 223 bonded to one side of the coupling heat transfer body 221. This has the advantage of being easily installed and applied to products after being actively redesigned to suit a variable design environment such as the heat generation amount of the heat source.

[0126] Here, the coupling heat transfer element 221, the PA board 223, and the clamshell cover 114 (only when the clamshell cover 114 is not provided in a state where it is coupled to the modular coupling grooves 113A and 113B of the front heat dissipation housing 110F and the rear heat dissipation housing 110R) can be manufactured as modules and can be defined as a heat collection unit 220 corresponding to the heat dissipation device 210 according to one embodiment of the present invention.

[0127] As shown in Figures 9 to 13B, a heat dissipation device 210 according to one embodiment of the present invention may include a heat storage section 211 that collects heat generated from a heating element (particularly a PA element 223a), and a heat release section 212 that diffuses the heat collected in the heat storage section 211 to exchange heat with the outside air, and is formed so as to extend at least its tip to the heat exchange region outside the upper end of the housing body 100 equipped with the heating element (see reference numeral "50" in Figure 15, described later), and occupy at least a portion of the heat exchange region 50 corresponding to directly above the housing body 100.

[0128] In other words, in one embodiment of the present invention, even when the heat storage portion 211 is arranged to overlap in the front-rear direction with respect to the front portion of the front heat dissipation housing 110F or the rear portion (back side) of the rear heat dissipation housing 110R within the housing body 100, the heat dissipation portion 212 is formed to extend above the upper end of the housing body 100, and in this case, the heat dissipation portion 212 may be arranged so that at least a part of it occupies at least a part of the heat exchange region 50 which corresponds to directly above the front-rear thickness direction of the housing body 100.

[0129] According to this embodiment of the present invention, even when increasing the heat dissipation area of ​​the heat dissipation section 212 that performs the substantial heat dissipation function, the heat dissipation area can be increased in the heat exchange region 50 corresponding to the area directly above the front-to-rear thickness direction of the housing body 100 without extending the housing body 100 in the front-to-rear thickness direction. This provides the advantage of avoiding the need to enlarge the size of the product.

[0130] Here, the heat containment section 211 and the heat release section 212 are described separately in terms of their functions, but this does not mean that they have a physically complete partition line (point).

[0131] For example, the heat storage section 211 and the heat release section 212 can be molded together as a single unit. In this case, the heat storage section 211 and the heat release section 212 are not physically separated by a boundary; however, it is preferable to interpret the heat release section 212 as meaning the portion that protrudes and extends into the heat exchange region 50 corresponding to the upper end of the housing body 100, as described above.

[0132] Here, it is preferable that the heat absorbing portion 211 is formed to have a thickness and length that allows it to be inserted into a fixed slit 221a formed on the other side of the bonding heat transfer body 221. That is, the thickness and length of the heat absorbing portion 211 should be understood as being formed so that it can be easily fixed to the fixed slit 221a by a press-fit or press-fit coupling method without going through another welding process. However, it should be noted that this does not mean that welding is excluded from the coupling method of the heat absorbing portion 211 to the fixed slit 221a.

[0133] In particular, as shown in Figure 11, the heat absorbing portion 211 may have a fitting end 211a that protrudes toward the fixed slit 221a by a predetermined length with reference to a virtual straight line B, which is the same as the end of the neck portion 211b, at the lower part of a virtual boundary point T corresponding to the starting point from which the heat dissipation portion 212 extends, so that a portion of the heat absorbing portion 211 is fitted into the fixed slit 221a by an insertion method.

[0134] Here, the heat dissipation device 210 according to one embodiment of the present invention is provided to form a refrigerant flow space 205 in which a refrigerant is filled, as shown in Figure 11.

[0135] In this case, the heat dissipation device 210 can be manufactured by first preparing a single metal panel member having a predetermined thermal conductivity in a pressing process using a sheet metal die, and then bending at least one side to join the edges, thereby forming a sealed refrigerant flow space 205. Alternatively, it can be manufactured by separately manufacturing two metal panel members having a predetermined thermal conductivity in a pressing process, and then joining them along their edges so that a sealed refrigerant flow space 205 is formed inside.

[0136] In this case, the portion forming one side of the refrigerant fluid space 205 will be referred to as the one-side heat conduction panel 210-1, and the portion forming the other side of the refrigerant fluid space 205 will be referred to as the other-side heat conduction panel 210-2.

[0137] When the heat dissipation device 210 according to one embodiment of the present invention is arranged vertically in the vertical direction with respect to the direction of gravity, liquid phase refrigerant is stored on the heat storage portion 211 side where a fitting end 211a is formed, which is inserted and fixed into a fixed slit 221a corresponding to the heat collection portion 220, and evaporated gaseous phase refrigerant diffuses into the heat release portion 212, which is the upper part with respect to the remaining upper boundary point T, and condensation into liquid phase refrigerant is possible through heat exchange with the outside air in the heat exchange region 50.

[0138] Referring to Figure 11, it is impossible to physically completely separate the refrigerant flow space 205. However, as a functional classification based on the phase change of the refrigerant, the portion of the heat storage section 211 where the fitting end 211a close to the heat-generating element is formed can be defined as the first refrigerant flow path 210-F1, and the portion partitioned by the inclined guide 210-F3 (described later) and where the inclined flow of liquid-phase refrigerant is induced can be defined as the second refrigerant flow path 210-F2.

[0139] When the gaseous refrigerant diffused through the heat containment section 211 and the heat release section 212 undergoes condensation through heat exchange with the outside air in the heat exchange region 50 and changes phase to a liquid refrigerant, it is distributed in a homogeneous amount through the second refrigerant flow path 210-F2 formed in a plurality of inclined guides 210-F3 that are formed to be inclined downward toward the first refrigerant flow path 210-F1, and its flow is guided toward the first refrigerant flow path 210-F1, thereby enabling smoother gas-liquid circulation.

[0140] On the other hand, the heat dissipation device 210 according to one embodiment of the present invention is generally manufactured from a very thin SUS metal panel member by the pressing process described above. However, vibration (flow) may be induced due to pressure changes caused by phase changes in the refrigerant flow space 205. Therefore, multiple joints 210-F4 can be simultaneously processed and formed during the pressing process to prevent this.

[0141] Multiple joints 210-F4 are formed to protrude to a predetermined depth toward the refrigerant flow space 205 from one heat conduction panel 210-1 and the other heat conduction panel 210-2. They are joined to each other by a joining method including welding during the joining process to seal the refrigerant flow space 205, thereby reinforcing the rigidity of the one heat conduction panel 210-1 and the other heat conduction panel 210-2 themselves.

[0142] Thus, the heat dissipation device 210 according to one embodiment of the present invention offers the advantage that, instead of relying on heat exchange that depends on the thermal conductivity of the metal material itself, it is possible to design the device so that heat exchange in the heat exchange region 50 can be effectively performed not by heat exchange that depends on heat transmitted from the heat source, but by heat discharge section 212 extending above the upper end of the center housing 110C of the housing body 100.

[0143] On the other hand, the heat storage section 211 and the heat dissipation section 212 do not necessarily have to be molded together as one unit as described above. Although not shown in the figures, the heat storage section 211 may be a heat pipe filled with a refrigerant that flows while undergoing a phase change internally, and the heat dissipation section 212 may be a heat sink fin that is thermally contact-coupled to the tip of the heat pipe.

[0144] In this context, a heat pipe refers to a device that has a wick structure inside, similar to the vapor chamber described above, but with a pipe-like external shape, capable of functioning as a heat transfer medium that transmits (transfers) heat supplied to one end to the other over a long distance.

[0145] Furthermore, it is preferable to interpret the term "heat sink fin" here as generally referring to a configuration that transfers heat using the thermal conductivity of its own material without the assistance of a phase-change substance such as a refrigerant.

[0146] In addition, in a heat dissipation device 210 according to one embodiment of the present invention, the heat storage section 211 may be a heat pipe filled with a refrigerant that flows while undergoing a phase change internally, and the heat discharge section 212 may be a vapor chamber filled with a refrigerant that flows while undergoing a phase change internally.

[0147] However, the heat dissipation device 210 according to one embodiment of the present invention is not necessarily limited to being used only in a structure that increases the heat transfer coefficient due to the phase change of the refrigerant. The heat storage section 211 and the heat discharge section 212 may be made of a general heat sink fin integrally molded from a predetermined metal material.

[0148] Here, assuming that the heat dissipation device 210 according to one embodiment of the present invention uses a refrigerant as its heat transport and heat exchange medium, the heat storage section 211 may include an evaporation region in which the refrigerant undergoes a phase change to a gaseous state, and the heat release section 212 may include a condensation region in which the refrigerant undergoes a phase change to a liquid state by exchanging heat with the outside air of the heat exchange region 50.

[0149] Figure 14 is a dissected perspective view along line AA in Figure 2, Figure 15 is a cross-sectional view along line AA in Figure 2, showing various embodiments of heat dissipation devices and heat dissipation modules, and Figure 16 is an exploded perspective view showing the installation of the front heat dissipation housing, heat dissipation device, and front heat dissipation module relative to the center housing in the configuration of Figure 1.

[0150] Referring to Figures 14 to 16, the heat dissipation portion 212 of the heat dissipation device 210 may extend above the upper end 110C-U of the center housing 110C of the housing body 100, and may be extended to occupy a heat exchange region 50 that corresponds to at least the upper part of the housing body 100 in the front-to-back thickness direction.

[0151] At this time, the outer end of the heat dissipation section 212 is provided to have a protrusion amount that matches the outer ends of the multiple heat dissipation fins 115F and 115R formed on the front heat dissipation housing 110F and the rear heat dissipation housing 110R, respectively, and the inner end of the heat dissipation section 212 may be extended and its area increased starting from the portion where the edge end 212a described later is formed, so as to occupy the heat exchange region 50 corresponding to the front-rear thickness direction of the housing body 100.

[0152] On the other hand, since the heat exchange region 50 is an area protected from the outside by the finger guard panel assembly 10, the flow of outside air may be restricted, so an outside air flow fan (not shown) may be provided inside the heat exchange region 50. The outside air flow fan is preferably provided in the heat exchange region 50, which corresponds to the space between the heat dissipation sections 212 of the heat dissipation devices 210 provided in the front heat dissipation housing 110F and the rear heat dissipation housing 110R, respectively (not shown).

[0153] Thus, when multiple heat dissipation devices 210 according to one embodiment of the present invention are combined on the front and rear portions of a housing body 100 using a front heat dissipation module 200A and a rear heat dissipation module 200B, the rear end of the heat dissipation portion 212 of the heat dissipation device 210 provided on the front portion of the front heat dissipation housing 110F and the front end of the heat dissipation portion 212 of the heat dissipation device 210 provided on the rear portion of the rear heat dissipation housing 110R may be arranged to have a predetermined separation distance (see reference numerals "D1, D2" in Figure 15) in the front-rear direction, with the heat exchange area 50 in between.

[0154] Here, as shown in Figures 15(a) and (b), the length of the heat dissipation section 212 extending upward from the upper end 110C-U of the center housing 110C of the housing body 100 is designed differently depending on the amount of heat generated by the heating element. For example, if the amount of heat generated by the heating element is relatively small, the length of the extension can be designed to be reduced by "L1". In other words, the distance between the extended tip of the heat dissipation section 212 and the edge of the housing body 100 can be designed differently depending on the amount of heat generated by the heating element.

[0155] Furthermore, as shown in Figure 15(c), the inner ends of the heat dissipation sections 212 of the heat dissipation devices 210 provided in the front heat dissipation housing 110F and the rear heat dissipation housing 110R can be designed so that the distance between them is extended from "D1" to "D2".

[0156] For this purpose, the heat dissipation section 212 may have an edge portion 212a that is bent at a predetermined angle from the heat containment section 211 so as to occupy the heat exchange region 50.

[0157] Thus, the heat dissipation device 210 according to one embodiment of the present invention has the advantage of improving overall heat dissipation performance by reducing interference from rising airflow during heat dissipation and enabling more sufficient heat exchange with the outside air in the heat exchange region 50 of the extended portion, by providing a heat dissipation portion 212 that extends to the heat exchange region 50 outside the edge of the housing body 100 or coupling heat transfer body 221 which is equipped with a heat-generating element to be dissipated.

[0158] This offers the advantage that, without altering the radio unit 1 which is manufactured to a predetermined size, the size and shape of the heat dissipation section 212 can be changed according to the amount of heat generated by the heat source, etc., allowing for a corresponding design.

[0159] Furthermore, by designing and manufacturing the heat dissipation section 212 with differentiated external dimensions and extension length, taking into account the heat generation capacity of the heating element, and by using modular manufacturing, the product can be easily adapted to the specifications of the heating element, thereby improving design versatility.

[0160] A heat dissipation device according to one embodiment of the present invention has been described in detail above with reference to the attached drawings. However, it goes without saying that the embodiments of the present invention are not necessarily limited to the embodiment described above, and that various modifications and equivalent implementations are possible by persons with ordinary skill in the art to which the present invention pertains. Therefore, the true scope of the rights of the present invention is defined by the claims described later. [Industrial applicability]

[0161] The present invention provides a heat dissipation device, a heat dissipation module, and an antenna device including the same, which effectively dissipate heat generated from electronic devices such as antenna devices, while preventing an increase in the weight of antenna units that require directional adjustment, thereby improving on-site workability, overcoming the limitations of increasing the heat dissipation surface area due to the thermal conductivity of the material itself, and enabling the design of various forms of heat dissipation structures. [Explanation of Symbols]

[0162] 1: Radio unit, 10: Finger guard panel assembly 20: Rear mounting bracket, 20h-1: Screw fastening hole 25: Screw through hole, 27: Fixing screw 30: Clamping section, 30R: Back clamping section 30S: Side clamping part, 31: First fixing plate part 32: Second fixing plate section, 33: Clamping bar 34: Stud bolt, 35: Bolt guide rod 40: Guide panel, 41: Guide slit 50: Heat exchange area, 100: Housing body 110C: Center housing, 110F: Front heat dissipation housing 110R: Rear heat dissipation housing, 120: RF filter section 121: Filter body, 122: Resonator 123: Filter tuning cover, 124: Stamping section 130F: Front board (PSU board), 130R: Rear board (PBA) 140A: Front board mounting groove, 140B: Rear board mounting groove 200: Heat dissipation module, 200A: Front heat dissipation module 200B: Rear heat dissipation module, 205: Coolant flow space 210: Heat dissipation device, 210-1: Single-sided heat conduction panel 210-2: Other side heat conduction panel, 210-F1: First refrigerant flow path 210-F2: Second refrigerant flow path, 210-F3: Inclined guide 210-F4: Joint, 211: Heat absorbing section 212: Heat release section, 220: Heat collection section 221: Heat transfer element for coupling, 222: Shielding cover 222b: Welding dot area, 223: PA board 230: filler metal, 230a: inner filler metal 230b: Edge welding material, 230c: Welding material for fixed slits

Claims

1. A heat containment section that collects heat generated from the heat source, A heat dissipation device comprising: a heat dissipation section that diffuses the heat collected in the heat receiving section to perform heat exchange, and a heat dissipation section formed such that at least its tip extends to a heat exchange area outside the housing body equipped with the heating element and occupies a portion of the heat exchange area.

2. The heat dissipation device according to claim 1, wherein the heat exchange region occupied by the heat dissipation section corresponds to the area directly above the housing body.

3. The heat dissipation device according to claim 1, wherein the heat receiving section and the heat dissipation section are integrally molded.

4. The heat storage section is a heat pipe filled with a refrigerant that flows while undergoing a phase change internally. The heat dissipation device according to claim 1, wherein the heat dissipation portion is a heat sink fin that is thermally contact-coupled with the tip of the heat pipe.

5. The heat storage section is a heat pipe filled with a refrigerant that flows while undergoing a phase change internally. The heat dissipation device according to claim 1, wherein the heat dissipation section is a vapor chamber filled with a refrigerant that flows while undergoing a phase change internally.

6. The heat dissipation device according to claim 1, wherein the heat receiving section and the heat dissipation section are filled with a refrigerant flow space such that a refrigerant flows while undergoing a phase change internally.

7. The heat storage section includes an evaporation region in which the refrigerant undergoes a phase change to a gaseous state. The heat dissipation device according to claim 6, wherein the heat dissipation section includes a condensation region in which the refrigerant undergoes a phase change to a liquid state by exchanging heat with the outside air in the heat exchange region.

8. The heat dissipation device according to claim 1, wherein the heat receiving section and the heat dissipation section are integrally molded from a predetermined metal material.

9. The heat dissipation device according to claim 1, wherein when the heat receiving portion is arranged to overlap the front or rear portion of the housing body in the front-rear direction, the heat dissipation portion extends above the upper end of the housing body and is extended to occupy at least a portion of the heat exchange area corresponding to directly above the front-rear thickness direction of the housing body.

10. When multiple heat dissipation devices are attached to the front and rear of the housing body, The heat dissipation device according to claim 9, wherein the rear end of the heat dissipation part of the heat dissipation device provided on the front part of the housing body and the front end of the heat dissipation part of the heat dissipation device provided on the rear part of the housing body are arranged to have a predetermined separation distance in the front-rear direction with respect to the heat exchange area.

11. The heat dissipation device according to claim 1, wherein the heat receiving portion has one surface thermal contact with the heat-generating surface of the heat-generating element and is coupled to the other surface of a coupling heat transfer member provided to mediate the coupling to the housing body, thereby receiving heat from the heat-generating element.

12. The heat dissipation device according to claim 11, wherein the heat receiving portion has a thickness and length that allows it to be inserted into a fixed slit formed on the other side of the coupling heat transfer body.

13. The heat dissipation device according to claim 1, wherein the heat dissipation portion has an edge end that extends from the heat receiving portion at a predetermined angle so as to occupy the heat exchange area.

14. A heat dissipation device including a heat storage section that collects heat generated from a heating element, and a heat release section that diffuses the heat collected in the heat storage section to perform heat exchange, and is formed such that at least its tip extends to the heat exchange area outside the housing body in which the heating element is provided and occupies a part of the heat exchange area, A heat dissipation module comprising a heat collection section including a coupling heat transfer body, which has a substrate housing section formed on one side to house a PA board, and a plurality of fixing slits formed on the other side to accommodate the heat dissipation device, and which is filled with a phase-changeable refrigerant inside.

15. The heat collection unit includes a shielding cover that forms one surface of the heat transfer body and is coupled to the heat transfer body to prevent leakage of the internal refrigerant, The heat dissipation module according to claim 14, further comprising a plurality of support pins disposed between the other surface of the coupling heat transfer body and the shielding cover.

16. The heat dissipation module according to claim 15, wherein one end of the plurality of support pins is supported by the shielding cover and the other end is supported by the other surface of the coupling heat transfer body between the plurality of fixing slits.

17. The heat dissipation module according to claim 14, wherein the refrigerant flow spaces formed inside the coupling heat transfer element and inside the plurality of heat dissipation devices are interconnected.

18. A housing body having an installation space formed in which an RF filter section is provided, The housing body includes a heat dissipation module coupled to the front or rear portion of the housing body, The heat dissipation module includes a heat dissipation device comprising: a heat storage section for collecting heat generated from a heat-generating element; and a heat release section that diffuses the heat collected in the heat storage section to perform heat exchange, with at least its tip extending to a heat exchange area outside the housing body equipped with the heat-generating element and occupying a portion of the heat exchange area.

19. The housing body includes a center housing in which the installation space for the RF filter is provided is formed, a front heat dissipation housing coupled to the front of the center housing, and a rear heat dissipation housing coupled to the rear of the center housing. The heat dissipation module includes a front heat dissipation module provided in the front heat dissipation housing and a rear heat dissipation module provided in the rear heat dissipation housing. The antenna device according to claim 18, wherein the front heat dissipation housing and the rear heat dissipation housing are formed with a plurality of module coupling grooves that mediate the coupling of the front heat dissipation module and the rear heat dissipation module.

20. The antenna device according to claim 19, wherein the heat dissipation portions of the front heat dissipation module and the rear heat dissipation module are extended to extend above the upper end of the housing body and occupy at least a portion of the heat exchange area corresponding to directly above the front-to-rear thickness direction of the housing body when the heat storage portion is arranged to overlap in the front-to-rear direction with respect to the front or rear portion of the housing body.

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