Head and shoulder physical therapy machine

Abstract

The neck and shoulder physical therapy device of this application comprises a housing, a light source assembly disposed within the housing, and a light-transmitting front-end assembly, wherein the housing is provided with an irradiation window, the front-end assembly is mounted at a position corresponding to the irradiation window of the housing, and the light emitted from the light source assembly is emitted from the irradiation window via the front-end assembly. This application can perform contact or non-contact irradiation therapy on the neck and shoulders, and can contact the skin via the front-end assembly to obtain the required irradiation temperature or contact temperature, thus enabling non-contact irradiation therapy and contact massage therapy effects.

Description

Technical Field

[0001] This application relates to the field of massage devices, and particularly to neck and shoulder physical therapy devices.

Background Art

[0002] In modern society, due to the busyness of work and the stress of life, it is often necessary to maintain a certain posture during work. As a result, the muscles are stretched and the blood flow is not smooth, causing pain and discomfort, which is more common and obvious especially in the shoulders and neck. Generally, some people exercise to promote metabolism and relieve muscle stiffness and pain. However, it may be difficult to find time for exercise in a busy life. Therefore, massage has gradually become a method that can promote blood circulation, metabolism, and appropriately remove the pain in the neck and shoulders outside of busy work. In response to the needs of modern life and the consumer market, many massage devices for various parts have been developed, such as foot massage devices, foot massage devices, back massage chairs, etc. For massage for the neck and shoulder parts, there are specialized neck and shoulder massage devices.

[0003] Currently, the devices or tools for relieving fatigue in the shoulders / neck commercially available use the EMS method or the mechanical massage method, and many of the prior arts use contact relaxation treatment means. The EMS method uses micro-current to simulate muscle movement signals, causes internal muscle movement in the shoulders / neck, and mainly acts on the muscle layer to achieve a comfortable massage effect. On the other hand, the mechanical kneading and mechanical vibration methods have great limitations on the strength and pattern of kneading and the area of the kneading site, and the perception of vibration on the head is also poor.

Summary of the Invention

Problems to be Solved by the Invention

[0004] The objective of this application is to provide a neck and shoulder physical therapy device having an irradiation treatment function.

Means for Solving the Problems

[0005] To achieve the objectives of this application, the following technical means are provided.

[0006] This application provides a neck and shoulder physical therapy device comprising a housing, a light source assembly disposed within the housing, and a light-transmitting front-end assembly, wherein the housing is provided with an irradiation window, the front-end assembly is mounted at a position corresponding to the irradiation window of the housing, and the light emitted from the light source assembly is emitted through the front-end assembly and out of the irradiation window.

[0007] In some embodiments, the front-end assembly is provided with optical sheets, such as corresponding light-gathering / scattering filters, which can adjust the form and energy of the light output as needed. The front-end assembly may also be provided with light-transmitting sheets that provide protection. In some embodiments, the front-end assembly includes a cooling member.

[0008] A front-end assembly is provided, and by arranging an optical sheet that filters a certain wavelength, a portion of the energy of the light source is separated, or light rays of a specific wavelength are selectively emitted. Alternatively, a cooling member can be arranged to achieve heating, cooling, or a constant temperature effect, and the desired irradiation temperature or contact temperature can be obtained by bringing the front-end assembly into contact with the skin.

[0009] In some embodiments, the irradiation window is located on the front side of the housing, i.e., the side closer to the human body when the user wears the neck and shoulder physical therapy device. There may be one or more irradiation windows. If there is one irradiation window, a wider window can be provided along the front wall of the housing, which allows for a relatively large contact area and irradiation area. If there are two or more irradiation windows, they can be arranged regularly along the front wall of the housing, which allows for targeted light output and contact therapy to the corresponding physical therapy site.

[0010] In some embodiments, the light source assembly includes a light source member, which may comprise a dual light source or a single light source. Specifically, the light source member may use one or two of the following light sources: IPL, tungsten filament lamps, and carbon filament lamps. Specifically, a dual light source may have two or more lamps installed, each using two of the following light sources: IPL, tungsten filament lamps, and carbon filament lamps. A single light source may have one or more lamps installed, each using one of the following light sources: IPL, tungsten filament lamps, and carbon filament lamps. By irradiating the treatment area with a tungsten filament lamp, a carbon lamp, or an IPL lamp as a single or mixed infrared light source, the desired irradiation wavelength can be obtained, and an ideal therapeutic effect can be achieved.

[0011] In some embodiments, the light source assembly further includes a reflecting member positioned behind the light source member, which reflects the light emitted to the rear toward the illumination window. The rear of the light source member refers to the side facing the illumination window, and the reflecting member can reduce energy loss and increase the emitted light energy.

[0012] In some embodiments, the shape and number of the front-end assemblies may conform to the number and shape of the illumination windows designed. Specifically, the shape and size of the front-end assemblies may be such that they fit snugly into the illumination windows, with one front-end assembly corresponding to one illumination window, and two or more front-end assemblies corresponding to two or more illumination windows. The number of front-end assemblies does not have to correspond to the number of illumination windows designed. When one illumination window is opened, two or more front-end assemblies may be provided and regularly arranged to correspond to the illumination window. The total light-emitting area of ​​the regularly arranged front-end assemblies tends to coincide with the illumination window, and the regularly arranged front-end assemblies can be regularly attached together using light-transmitting members and fixed to the location of the illumination window in the front housing. When two or more illumination windows are opened, a single front-end assembly may be provided that is embedded in the housing and partially exposed to the illumination window.

[0013] In some embodiments, the front-end assembly is in the form of an arcuate surface, a curved surface, or a planar surface.

[0014] Generally, when using a single large-area front-end assembly, the use of an arcuate or curved surface shape allows for better matching of the housing shape and a better fit to the user's neck. When using two or more front-end assemblies, a rational and regular arrangement of planar front-end assemblies allows the entire assembly to closely conform to the shape and curvature of the housing. Using a single large-area front-end assembly results in a larger irradiation area and a wider treatment area in non-contact applications.

[0015] In some embodiments, the front-end assembly includes a cooling member. Specifically, the cooling member is electrically connected to the electrical control assembly. In specific embodiments, the cooling member may be an NTC semiconductor cooling member. Semiconductor heating and cooling technology is a technology that achieves both heating and cooling by utilizing the properties of semiconductor materials, and achieves heating and cooling functions by achieving energy conversion through the thermoelectric and electrothermal effects of semiconductor materials. Using the semiconductor cooling member, preheating can be performed when using the neck and shoulder physical therapy device in winter, increasing the sensation on the skin. When using the cooling effect, it can also be used for freezing analgesia. A constant temperature effect can also be obtained using the semiconductor cooling member, and when performing contact physical therapy using the neck and shoulder physical therapy device, the constant temperature effect of the semiconductor cooling member can be used to maintain the temperature of the treatment area in a certain range, making the warming sensation more comfortable. The cooling member includes a cold surface layer and a hot surface layer, with a semiconductor electric double layer placed between the cold surface layer and the hot surface layer.

[0016] In some embodiments, the cooling member is provided with a temperature sensor connected to the electrical control assembly. The temperature sensor is used to detect the temperature of the hot or cold surface layer and transmit the temperature data to the electrical control assembly, so that the electrical control assembly controls the power supply to the cooling member based on the temperature data received.

[0017] In some embodiments, the temperature sensor includes positive and negative electrodes, the cooling member includes positive and negative electrodes, the positive and negative electrodes of the cooling member are connected via an H-bridge driver to an electrical control assembly or a control circuit board on which the electrical control assembly is provided, and the temperature sensor is electrically or communically connected to the electrical control assembly or the control circuit board on which the electrical control assembly is provided to transmit temperature data.

[0018] In some embodiments, the temperature sensor is located in a semiconductor electric double layer, and in other embodiments, the temperature sensor is located in a hot surface layer or a cold surface layer, specifically, the temperature sensor may be provided in close contact with the inner surface of the hot surface layer or the cold surface layer, or may be directly embedded in the substrate of the hot surface layer or the cold surface layer.

[0019] In some embodiments, the shapes of the cold surface layer and the hot surface layer are compatible with each other, and the p-type and n-type semiconductor particles of the semiconductor electric double layer are laid flat on the inner surfaces of the cold surface layer and the hot surface layer, so that the entire cold surface layer of the semiconductor cooling member forms overall cooling, or the entire hot surface layer forms overall heating. In some embodiments, the semiconductor electric double layer and the temperature sensor are placed between the cold surface layer and the hot surface layer.

[0020] In some embodiments, through-holes are formed in a localized region of the semiconductor cooling member, penetrating the cold and hot layers, and a light-emitting region is formed corresponding to the through-holes, allowing the semiconductor electric double layer to arrange semiconductor electric dipole particles while avoiding the light-emitting region. That is, semiconductor electric dipole particles can be arranged in other regions outside the light-emitting region. Alternatively, if the cold and / or hot layers of the semiconductor cooling member are transparent substrates, and the p-type and n-type semiconductor electric dipole particles of the semiconductor electric double layer are arranged inside the localized region of the semiconductor cooling member, and no p-type and n-type semiconductor electric dipole particles are arranged in other regions of the semiconductor cooling member, forming empty regions, and if the cold and hot layers are transparent substrates, a light-emitting region is formed corresponding to the empty regions. Alternatively, one of the cold or hot surface layer is a transparent substrate with through-holes formed in a localized area of ​​the other, and the p-type and n-type semiconductor electric dipole particles of the semiconductor electric double layer are arranged in the corresponding areas without through-holes, and the cold and hot surface layers cooperate with each other at the locations corresponding to the through-holes to form a light-emitting region.

[0021] In some embodiments, the p-type and n-type semiconductor electric dipole particles of the semiconductor electric double layer are arranged in an annular band, and no p-type or n-type semiconductor electric dipole particles are present in the central internal region, forming an empty region. The cold surface layer and / or hot surface layer corresponding to the central internal region of the semiconductor electric double layer are configured as through holes, or one of the cold surface layer and / or hot surface layer is a transparent substrate and the other correspondingly forms a through hole, and the cold surface layer and hot surface layer cooperate with each other to form a light emission region.

[0022] The overall external shape of the semiconductor cooling member may be adapted to the shape of a specific element when applied to a particular product, as required by actual needs. Furthermore, materials may be used as required by actual needs. For example, the cold surface layer and / or hot surface layer may be a metallic material or a transparent substrate. The through-holes or open areas may be adapted to the shape of a specific element when applied to a particular product, as required by actual needs. Furthermore, the specific shape, size, and position of the through-holes or open areas may be defined as required by actual needs. In some embodiments, the cold surface layer and the hot surface layer are thermal conductive material substrates, and the thermal conductive material substrates are ceramic material substrates, aluminum substrates, copper substrates, or transparent crystalline substrates.

[0023] The semiconductor cooling member of this application incorporates a temperature sensor inside the semiconductor cooling member, which is placed in the semiconductor electric double layer or in the hot or cold surface layer and bonded to the hot or cold surface layer of the semiconductor cooling member, and is used to detect the temperature of the cold or hot surface layer. By reducing the error and time of intermediate temperature transfer and accurately monitoring the temperature change of the cooling member up to the first time, the temperature sensor is electrically connected to a main control unit or control circuit board, which controls the power supply to the semiconductor cooling member based on the received temperature data, thereby maintaining the temperature at all times within the desired temperature range. Furthermore, the semiconductor cooling member has a simpler and more compact structure and is less prone to damage to the temperature sensor.

[0024] In some embodiments, the shoulder and neck physical therapy device further comprises a heat dissipation device disposed on the rear side of the light source. In a specific example, the heat dissipation device can be a fan. The fan may be disposed on the rear side of the light source.

[0025] In some embodiments, the shoulder and neck physical therapy device further comprises an air intake hole and a heat dissipation hole disposed in the housing, the heat dissipation hole is provided at a position corresponding to the fan of the housing, and may be configured to discharge hot air through the heat dissipation hole. The air intake hole may be provided at a position that effectively forms convection with the heat dissipation hole of the housing. For example, the fan is provided in a cooling cavity protruding outside the rear housing, the heat dissipation hole is disposed on the wall of the cooling cavity and communicates with the air duct of the fan, the air intake hole is disposed on a wall at a certain distance from the heat dissipation hole of the housing and distributed on both sides of the light source assembly, so that the air flow entering the housing passes through the light source assembly, takes away the heat therein, and is further discharged through the heat dissipation hole, thereby realizing effective temperature reduction. A plurality of the air intake holes and the heat dissipation holes are provided.

[0026] In some embodiments, the housing includes a front housing and a rear housing, the irradiation window is provided on the front wall of the front housing, and a cavity for accommodating the light source assembly is provided in the housing.

[0027] Specifically, a cavity for accommodating a power supply assembly, a light source assembly, a heat dissipation device, and an electrical control assembly is provided in the housing.

[0028] In some embodiments, the shoulder and neck physical therapy device further comprises a power supply assembly and an electrical control assembly, the power supply assembly includes a battery, and the power supply assembly and the light source assembly are electrically connected to the electrical control assembly.

[0029] The battery can be a rechargeable battery or a primary battery.

[0030] The electric control assembly includes a circuit board / PCBA with an electrical interface for charging or plugging in, and the housing is provided with a corresponding socket that communicates with the electrical interface.

[0031] The neck and shoulder physical therapy device further includes an air pump for closely attaching the skin irradiation target surface to the device by sucking the skin. The air pump can be arranged behind the irradiation window.

Advantages of the Invention

[0032] Compared with the prior art, the advantages of the present application are as follows.

[0033] This application enables contact or non-contact irradiation therapy of the neck and shoulders using infrared rays in the light waves of a light source member. The neck and shoulder physical therapy device of this application is equipped with a front-end assembly, which contacts the skin and allows the necessary irradiation or contact temperature to be obtained, thus enabling non-contact irradiation therapy and contact massage therapy effects. By providing a cooling member in the front-end assembly, the constant temperature effect of the semiconductor cooling member can be utilized when used in contact mode to maintain the temperature of the treatment area within a certain range, making the warming sensation more comfortable. Due to the functional effect of the semiconductor cooling member, the epidermis can be preheated in winter to increase the perceived warmth, enabling ice-point analgesia and constant temperature therapy. This application enables obtaining the desired irradiation wavelength and achieving ideal therapeutic effects by irradiating the treatment area with a tungsten filament lamp, carbon lamp, or IPL lamp as a single or mixed infrared light source. The cooling member described in this application incorporates a temperature sensor inside the cooling member to accurately detect the temperature of the cold or hot surface layer, thereby reducing the error and time of intermediate temperature transfer, and enabling accurate monitoring of the temperature change of the cooling member up to the first time. The temperature sensor is electrically connected to a main control unit or control circuit board, and the main control unit or control circuit board controls the power supply to the semiconductor cooling member based on the received temperature data, thereby maintaining the temperature within a desired temperature range at all times. Furthermore, the structure of the cooling member is simpler and more compact, and the temperature sensor is less likely to be damaged. [Brief explanation of the drawing]

[0034] [Figure 1] This is a first perspective view of Embodiment 1 of the neck and shoulder physical therapy device of this application. [Figure 2] This is a second perspective view of Embodiment 1 of the neck and shoulder physical therapy device of this application. [Figure 3] This is an exploded view of Embodiment 1 of the neck and shoulder physical therapy device of this application. [Figure 4] This is a cross-sectional view of Embodiment 1 of the neck and shoulder physical therapy device of this application. [Figure 5]This is a schematic diagram of a different form of the front-end assembly of the neck and shoulder physical therapy device of this application. [Figure 6] This is a schematic cross-sectional view of the first method of use of the neck and shoulder physical therapy device of this application, as described in Example 1. [Figure 7] This is a second schematic cross-sectional view of the usage method of Embodiment 1 of the neck and shoulder physical therapy device of this application. [Figure 8] This is an exploded view of an embodiment of light source conversion in Embodiment 1 of the neck and shoulder physical therapy device of this application. [Figure 9] This is a perspective view of Embodiment 2 of the neck and shoulder physical therapy device of this application. [Figure 10] This is an exploded view of Embodiment 2 of the neck and shoulder physical therapy device of this application. [Figure 11] This is an exploded view of an embodiment of light source conversion in Embodiment 2 of the neck and shoulder physical therapy device of this application. [Figure 12] This is an exploded schematic diagram of one embodiment of a cooling member in the neck and shoulder physical therapy device of this application. [Figure 13] This is a side view of one embodiment of a cooling member in the neck and shoulder physical therapy device of this application. [Figure 14] This is an exploded schematic diagram of another embodiment of the cooling member in the neck and shoulder physical therapy device of this application. [Figure 15] This is a side view of another embodiment of the cooling member in the neck and shoulder physical therapy device of this application. [Figure 16] This is an exploded schematic diagram of another embodiment of the cooling member in the neck and shoulder physical therapy device of this application. [Figure 17] This is a side view of another embodiment of the cooling member in the neck and shoulder physical therapy device of this application. [Figure 18] This is a control circuit diagram of one embodiment of a cooling member in a neck and shoulder physical therapy device for which this application was filed. [Modes for carrying out the invention]

[0035] The following describes exemplary embodiments of this application in detail with reference to the drawings. While the drawings illustrate exemplary embodiments of this application, it should be understood that this application is not limited to the embodiments described herein and can be realized in various forms. Conversely, by providing these embodiments, this application can be understood more clearly and completely, and its scope can be fully conveyed to those skilled in the art.

[0036] Furthermore, it should be understood that the terms used herein are intended solely to describe specific exemplary embodiments and are not intended to be limiting. Unless explicitly stated otherwise in the context, the singular forms “1,” “one,” and “the foregoing” as used herein also include the plural forms. The terms “equip,” “include,” “have,” and “possess,” are inclusive and thus indicate the presence of the described features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein should not be construed as necessarily having to be performed in a specific order described or explained unless the order of execution is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0037] In this specification, terms such as “first,” “second,” and “third” may be used to describe multiple elements, components, regions, layers, and / or sections, but these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or section from another region, layer, or section. Unless explicitly stated in the context, terms such as “first,” “second,” and other numerical terms, when used herein, do not imply order or sequence. Accordingly, the first element, component, region, layer, or section described below may be referred to as the second element, component, region, layer, or section without departing from the teaching of the exemplary embodiments.

[0038] For ease of explanation, this specification may use spatial relational terms such as “inside,” “outside,” “inside,” “outside,” “bottom,” “downward,” “top,” “upward,” “front,” and “back” to describe the relationship between one element or feature and another, as shown in the drawings. Such spatial relational terms are intended to include different orientations of the apparatus in use or operation other than those shown in the drawings. For example, if the apparatus in the drawing is turned over, the element described as “bottom of the other element or feature” or “below the other element or feature” will then be oriented as “top of the other element or feature” or “above the other element or feature.” Thus, the exemplary term “below the other…” may include both top and bottom positions. The apparatus may also be oriented in other directions (90-degree rotation or other directions), and the spatial relational descriptors used herein will be interpreted accordingly.

[0039] Referring to Figures 1 to 8, the neck and shoulder physical therapy device according to the embodiment of this application comprises a housing 100, a light source assembly, a front-end assembly 210, a heat dissipation device, a power supply assembly, and an electrical control assembly. The light source assembly is located inside the housing 100, the housing 100 is provided with an irradiation window 310, the front-end assembly 210 is light-transmitting and is mounted in a position corresponding to the irradiation window 310 of the housing 100, and the light emitted from the light source assembly is emitted from the irradiation window 310 via the front-end assembly 210. The light source assembly and the heat dissipation device are connected to the power supply assembly and the electrical control assembly.

[0040] The housing 100 is provided with a cavity for housing the light source assembly, heat dissipation device, power supply assembly, and electrical control assembly. The housing 100 includes a front housing 110 and a rear housing 120, both of which constitute a main body including a C-shaped treatment area and two arms extending on both sides of the main body, making them suitable for attachment to the user's neck. The irradiation window 310 is located on the front wall of the main body portion of the front housing 110, that is, on the side closer to the back of the user's neck when the user wears and uses the neck and shoulder physical therapy device. The light source assembly and heat dissipation device are arranged in order behind the irradiation window 310, and the power supply assembly and electrical control assembly are located in the cavities of the two arms of the housing 100, respectively.

[0041] The front-end assembly 210 includes a cooling member (not shown) electrically connected to the electrical control assembly. The cooling member may be an NTC semiconductor cooling member. Semiconductor heating and cooling technology is a technology that achieves both heating and cooling by utilizing the properties of semiconductor materials, and achieves heating and cooling functions by achieving energy conversion through the thermoelectric and electrothermal effects of semiconductor materials. When the semiconductor cooling member is used, preheating can be performed when using the neck and shoulder physical therapy device in winter, increasing the sensation on the skin. When using the cooling effect, it can also be used for freezing analgesia. A constant temperature effect can also be obtained using the semiconductor cooling member, and when performing contact physical therapy using the neck and shoulder physical therapy device, the constant temperature effect of the semiconductor cooling member can be used to maintain the temperature of the treatment area in a certain range, making the warming sensation more comfortable. The front-end assembly 210 is provided with optical sheets such as corresponding focusing / scattering filters, and the form and energy of the light output can be adjusted as needed. The front-end assembly 210 may be provided with a light-transmitting sheet that provides a protective function.

[0042] The semiconductor cooling material uses two specific types of semiconductors, p-type and n-type. Alternating p-type and n-type semiconductor particles are arranged thermally parallel to each other and electrically connected in series to form a semiconductor electric double layer. One side of the semiconductor electric double layer is connected to a cooling substrate to form a cold surface layer, and the other side is connected to a heat-conducting substrate to form a hot surface layer. When a direct current flows through the semiconductor junction, a temperature difference is generated, causing the cold surface layer to absorb heat, which is then transmitted to the hot surface layer via semiconductor electric dipole particles.

[0043] The illumination windows 310 can be one, two, or more in number. The shape and number of the front-end assembly 210 can be adapted to the designed number and shape of the illumination windows 310. Specifically, the shape and size of the front-end assembly 210 can be fitted just into the illumination windows 310.

[0044] Referring to Figures 1 to 8, in Embodiment 1, two irradiation windows 310 are provided, arranged laterally along the front wall of the housing 100. The shape of these windows conforms to the curvature of the housing 100, and this design allows for targeted light emission and contact therapy corresponding to the physical therapy site. Two corresponding front-end assemblies 210 are provided, and the outer contour of each front-end assembly 210 conforms to the irradiation windows 310. The front-end assembly 210 can be in the form of an arcuate surface, a curved surface, or a planar surface, and as shown in Figure 5, this applies to the arcuate surface front-end assembly 210 of Embodiment 1 and the planar surface front-end assembly 201 of other embodiments. When using two or more front-end assemblies 210, the entire assembly can be made to conform well to the shape and curvature of the housing 100 by arranging the planar surface front-end assemblies 210 in a rational and regular manner, but using the arcuate surface or curved surface front-end assembly 210 can improve comfort during contact therapy.

[0045] Referring to Figures 9 to 11, in Embodiment 2, one irradiation window 320 is provided laterally along the front wall of the housing 100. The irradiation window 320 has a wide lateral width, and its shape conforms to the arc of the housing 100. This design allows for a large contact area and irradiation area. A corresponding front end assembly 220 is provided. Generally, when using a single large-area front end assembly 220, it is possible to better match the shape of the housing 100 using an arcuate or curved surface shape, and to fit well to the user's neck.

[0046] The front-end assemblies do not have to correspond to the designed number of illumination windows. When one illumination window is provided, two or more front-end assemblies may be provided and regularly arranged in correspondence with the illumination window. The total light-emitting area of ​​the regularly arranged front-end assemblies tends to coincide with the illumination window, and the regularly arranged front-end assemblies can be regularly attached together using light-transmitting members and fixed to the location of the illumination window on the front housing 110. When two or more illumination windows are provided, a single front-end assembly may be provided that is embedded in the housing 100 and partially exposed to the illumination window.

[0047] The light source assembly includes a light source member, which may comprise a dual light source or a single light source. The light source member can use one or two of the following light sources: IPL, tungsten filament lamp, or carbon filament lamp.

[0048] Infrared light waves, also known as "life waves" in well-known technology, are radiation with the frequency closest to that of human tissue. According to Kirchhoff's laws of radiation, any good radiator is necessarily a good absorber. The human body constantly emits infrared radiation, and the large amount of infrared radiation abundant in light waves penetrates the body, resonating with the atoms and molecules of the body's cells and tissues. This resonance creates an internal thermal effect, promoting an increase in deep subcutaneous temperature and dilation of microvessels, accelerating blood circulation, and lowering blood lipid concentration. This improves the body's metabolic capacity and cellular oxygen content, promotes enzyme production, and plays a role in sedation, calming, and relieving fatigue, protecting the body from fatigue and injury. Furthermore, research shows that irradiating local tissues with infrared light can increase the formation of gap junctions in vascular endothelial cells, improve microcirculation, reduce blood viscosity, promote metabolism, alleviate muscle fatigue, and improve blood circulation. Animal studies have shown that near-infrared irradiation significantly increases blood flow velocity in rat skeletal muscle and can improve circulatory disorders caused by ischemia-reperfusion injury.

[0049] Specifically, as shown in Figures 3, 4, 6, and 7, the first conversion form of the light source member 401 in Embodiment 1 employs two dual light source light pipes corresponding to the front end assembly 210 and the illumination window 310, which are arranged laterally, and can use one or two types of light sources from IPL, tungsten filament lamps, and carbon filament lamps. As shown in Figure 8, this is the second conversion form of the light source member 402 in Embodiment 1, in which two light pipes are provided behind each front end assembly 210, which are arranged vertically, and can use one or two types of light sources from IPL, tungsten filament lamps, and carbon filament lamps. In Embodiment 1, the light source assembly further includes a reflector member 410 positioned behind the light source member, which reflects the light emitted to the rear back to the illumination window 310. The rear of the light source member refers to the side facing the illumination window, and the reflector member 410 can reduce energy loss and increase the emitted light energy. The size of the reflective member 410 is such that it fits the emission window and the front end assembly, and covers the light-emitting portions of the light source members 401 and 402.

[0050] As shown in Figure 10, the first conversion form of the light source member 403 in Embodiment 2 employs a single light pipe positioned corresponding to the rear of the front end assembly 220 and the emission window 320, and can use one of the following light sources: IPL, tungsten filament lamp, or carbon filament lamp. As shown in Figure 11, the second conversion form of the light source member 404 in Embodiment 2 employs two longitudinally aligned dual light source light pipes corresponding to the front end assembly 220 and the emission window 320, and can use one or two of the following light sources: IPL, tungsten filament lamp, or carbon filament lamp. In Embodiment 2, the light source assembly further includes a reflector member 410 positioned behind the light source member, which reflects the light emitted to the rear toward the irradiation window 310. The rear of the light source member refers to the side facing the irradiation window, and the reflector member 410 can reduce energy loss and increase the emitted light energy. The size of the reflective member 420 is such that it fits the emission window and the front end assembly, and covers the light-emitting portions of the light source members 403 and 404.

[0051] The heat dissipation device is positioned behind the light source. In a specific embodiment, the heat dissipation device may be a fan 510, which is provided in a cooling cavity 130 protruding to the outside of the rear housing 120, and the wall of the cooling cavity 130 is provided with heat dissipation holes 102, which communicate with the air passage of the fan 510, and can discharge hot air through the heat dissipation holes 102. The neck and shoulder physical therapy device further includes intake holes 101 provided in the housing 100, which are provided in the wall at a certain distance from the two arms of the housing 100 and the heat dissipation holes 102, and are distributed on both sides of the light source assembly in positions that form effective convection with the heat dissipation holes 102, so that the airflow entering the housing 100 passes through the light source assembly, removes heat from it, and is further discharged through the heat dissipation holes 102, thereby achieving effective temperature reduction. Multiple intake holes 101 and heat dissipation holes 102 are provided.

[0052] The electrical control assembly includes a circuit board 610 with an electrical interface 601 for charging or plugging in, and the housing 100 is provided with a corresponding socket communicating with the electrical interface 602. The power supply assembly may include a battery 620, for example, a rechargeable battery or a primary battery. The neck and shoulder physical therapy device further includes an air pump (not shown) for adsorbing the skin to bring the device into closer contact with the skin surface to be irradiated.

[0053] Referring to Figure 6, the neck and shoulder physical therapy device of this application is used as a non-contact treatment and is achieved by irradiating light from a light source. The irradiation area and irradiation angle are adapted to the user's neck and shoulders, and the emitted light beam can be selected as needed. This can be achieved by placing a filter sheet in the light source assembly or by applying a filter film to the light source member. Alternatively, this can be achieved by placing a filter sheet in the front assembly or by applying a filter film to the optical sheet of the front assembly.

[0054] Referring to Figure 7, the neck and shoulder physical therapy device of this application can also be used for contact therapy, and in addition to the light irradiation therapy effect, it makes contact with the user's neck and shoulders via the front assembly. The front assembly may be configured as an embodiment of a vibrating massage connection drive device to massage the contact area. Since the front assembly is provided with the cooling member, using the semiconductor cooling member allows for preheating when using the neck and shoulder physical therapy device in winter, increasing the sensation on the skin. When using the cooling effect, it can also be used for freezing analgesia. A constant temperature effect can also be obtained using the semiconductor cooling member, and when performing contact physical therapy using the neck and shoulder physical therapy device, the constant temperature effect of the semiconductor cooling member can be utilized to maintain the temperature of the treatment area within a certain range, making the warming sensation more comfortable. Specifically, the cooling member includes a cold surface layer and a hot surface layer, with a semiconductor electric double layer disposed between the cold surface layer and the hot surface layer.

[0055] In some specific embodiments, the cooling member is provided with a temperature sensor connected to the electrical control assembly. The temperature sensor is used to detect the temperature of the hot or cold surface layer and transmit the temperature data to the electrical control assembly, so that the electrical control assembly controls the power supply to the cooling member based on the temperature data received.

[0056] As shown in Figures 12 to 18, this is a specific embodiment of the structure of a semiconductor cooling member used in a specific embodiment of this application. The semiconductor cooling member 700 includes an intermediate semiconductor electric double layer 710 and hot surface layers 730 and cold surface layers 720 on both sides, with the semiconductor electric double layer 710 interposed between the hot surface layer 730 and the cold surface layer 720. A temperature sensor 740 is built into the semiconductor cooling member 700. The semiconductor electric double layer 710 is formed by arranging alternating p-type and n-type semiconductor particles thermally parallel to each other and electrically connecting them in series. Cold and hot ends are formed at both ends of the p-type and n-type semiconductor particles. The cold end is connected to a cooling substrate to form the cold surface layer 720, and the hot end on the other side is connected to a thermal conductive substrate to form the hot surface layer 730. The hot surface layer 730 and the cold surface layer 720 are thermal conductive material substrates. For example, these may be thermal conductive materials such as ceramic, aluminum, copper, or transparent crystal. The hot surface layer 730 and the cold surface layer 720 may be opaque, translucent, or transparent substrate materials as required by the actual application. The temperature sensor 740 may be an NTC sensor. In the embodiments of this application, the temperature sensor 740 is embedded inside the semiconductor cooling member 700. In some embodiments, the temperature sensor 740 is located in an intermediate semiconductor electric double layer 710 and is bonded to the hot surface layer 730 / cold surface layer 720 of one side of the cooling member 700 to directly detect the temperature of the cold surface layer 720 / hot surface layer 730 of the cooling member. In other embodiments, the temperature sensor may be located in the hot surface layer 730 or the cold surface layer 720 and be provided in close contact with the inner surface of the hot surface layer 730 or the cold surface layer 720, or it may be directly embedded in the substrate of the hot surface layer 730 or the cold surface layer 720.

[0057] The overall external shape of the semiconductor cooling member may adopt an adaptive shape to match the shape of a specific element when applied to a particular product, as required by actual needs. Furthermore, materials may be used as required by actual needs. For example, the cold surface layer and / or hot surface layer may be a metallic material or a transparent substrate, etc. The through-holes or empty areas may adopt an adaptive shape to match the shape of a specific element when applied to a particular product, as required by actual needs. Furthermore, the specific shape, size, and position of the through-holes or empty areas may be defined as required by actual needs. As shown in the embodiments in Figures 12 to 17, the shape of the semiconductor cooling member 700 and the shape of the through-holes or empty areas are merely simplified examples. When the semiconductor cooling member 700 is applied to the front-end assembly 201 of Embodiment 1 of the neck and shoulder physical therapy device, the external contour of the semiconductor cooling member 700 can match the external contour of the front-end assembly 201, and the changes in shape and radii of the semiconductor cooling member 700 can match the changes in shape and radii of the front-end assembly 201. When the semiconductor cooling member 700 is applied to the front-end assembly 202 of Embodiment 2 of the neck and shoulder physical therapy device, the outer contour of the semiconductor cooling member 700 can match the outer contour of the front-end assembly 202, and the changes in shape and radii of the semiconductor cooling member 700 can match the changes in shape and radii of the front-end assembly 202. The position, size, and shape of the light-transmitting regions of the semiconductor cooling member 700 can all be arranged according to the specific application needs of the neck and shoulder physical therapy device, and more than one light-transmitting region can be arranged.

[0058] As shown in Figures 12 and 13, this is one embodiment of a semiconductor cooling member 700, which includes an intermediate semiconductor electric double layer 710 and hot surface layers 730 and cold surface layers 720 at both ends thereof, and a temperature sensor 740 is built into the semiconductor cooling member 700. In this embodiment, the entire cold surface layer 720 of the semiconductor cooling member 700 forms overall cooling, or the entire hot surface layer 730 forms overall heating, and semiconductor electric dipole particles are laid flat or nearly flat on the inner surfaces of the cold surface layer 720 and the hot surface layer 730, the shapes of the cold surface layer 720 and the hot surface layer 730 are matched, and the semiconductor electric double layer 710 and the temperature sensor 740 are located between the cold surface layer and the hot surface layer. The temperature sensor 740 is bonded to the hot surface layer 730 or to the cold surface layer 720. The positive and negative electrodes 741 of the temperature sensor 740 and the positive and negative electrodes 711 of the semiconductor electric double layer 710 extend to the outside of the semiconductor cooling member 700 and are electrically connected to the control circuit board or main control unit.

[0059] As shown in Figures 14 and 15, there is another embodiment of the semiconductor cooling member 700, which includes an intermediate semiconductor electric double layer 710 and hot surface layers 730 and cold surface layers 720 on both sides, and a temperature sensor 740 is built into the semiconductor cooling member 700. In this embodiment, through holes 751 are secured in local areas of the semiconductor cooling member 700, and the through holes 751 can be used as light emission regions 751. For example, if the semiconductor cooling member is used in a photon beauty device or a physical therapy device, it can be used as a light emission region. The through holes 751 may be formed by extending the substrate of the cold surface layer 720 or the hot surface layer 730, or they may be formed by opening through holes 751 corresponding to local areas of both the cold surface layer 720 and the hot surface layer 730 substrates. The p-type and n-type semiconductor electric dipole particles of the semiconductor electric double layer are arranged inside the local region of the semiconductor cooling member, avoiding the through-hole 751, and empty regions are formed where p-type and n-type semiconductor electric dipole particles are absent within the semiconductor cooling member. The shapes of the cold surface layer 720 and the hot surface layer 730 are compatible, and the semiconductor electric double layer 710 and the temperature sensor 740 are located between the cold surface layer and the hot surface layer. Using the reference numerals in the drawing as an example, the temperature sensor 740 is bonded to the hot surface layer 730, and of course, it may also be bonded to the cold surface layer 720. The positive and negative electrodes 741 of the temperature sensor 740 and the positive and negative electrodes 711 of the semiconductor electric double layer 710 extend outside the semiconductor cooling member 700 and are electrically connected to the control circuit board or main control unit.

[0060] As shown in Figures 16 and 17, another embodiment of the semiconductor cooling member 700 includes an intermediate semiconductor electric double layer 710 and hot surface layers 730 and cold surface layers 720 on both sides, and the semiconductor cooling member 700 has a temperature sensor 740 built into it. In this embodiment, the p-type and n-type semiconductor electric dipole particles of the semiconductor electric double layer 710 inside the semiconductor cooling member 700 are arranged in an annular band, and no p-type and n-type semiconductor electric dipole particles are arranged in the central internal region, forming an empty region. The cold surface layer 720 / hot surface layer 730 includes an annular region 752 corresponding to the semiconductor electric double layer 710. The intermediate region of the cold surface layer 720 / hot surface layer 730 is a through hole. Alternatively, a through hole is formed correspondingly in one of the cold surface layer substrate / hot surface layer substrate, and the other substrate is a transparent substrate (e.g., transparent crystal). Alternatively, as shown in Figure 17, both the cold surface layer substrate and the hot surface layer substrate are transparent substrates (e.g., transparent crystal). Therefore, the semiconductor cooling member 700 has an annular hot surface layer, a cold surface layer, and an intermediate semiconductor electric double layer, and the empty areas are through holes, through holes / transparent substrates, or transparent substrate areas, which can function as light emission areas 752. For example, when the semiconductor cooling member 700 is applied to photon beauty devices or physical therapy devices, it can function as a light emission area. The cold surface layer corresponding to one side of the annular semiconductor electric double layer 710 of the semiconductor cooling member 700 can form overall cooling, or the hot surface layer 730 on one side can form overall heating. The shapes of the cold surface layer 720 and the hot surface layer 730 are compatible, and the semiconductor electric double layer 710 and the temperature sensor 740 are located between the cold surface layer and the hot surface layer. Using the reference numerals in the drawings as an example, the temperature sensor 740 is bonded to the hot surface layer 730, and of course, it may also be bonded to the cold surface layer 720. The positive and negative electrodes 741 of the temperature sensor 740 and the positive and negative electrodes 711 of the semiconductor electric double layer 710 extend to the outside of the semiconductor cooling member 700 and are electrically connected to the control circuit board or main control unit.

[0061] The positive and negative electrodes 711 of the semiconductor cooling member 700 and the positive and negative electrodes 741 of the temperature sensor 740 are electrically connected to the control circuit board or main control unit of the electrical control assembly and supplied with power. The control circuit board is provided with a main control unit, and the temperature sensor 740 is electrically connected to the control circuit board or main control unit, or communicates with it to transmit temperature data. Referring to Figure 18, the operating principle of the semiconductor cooling member 700 of this application is as follows: The semiconductor cooling member 700, which has a built-in temperature sensor 740, has the temperature sensor 740 detect temperature data of the cold surface layer 720 or the hot surface layer 730, and transmits the temperature data to the main control unit on the control circuit board. The main control unit controls and outputs a control signal for the semiconductor cooling element based on the analysis of temperature data and the requirement for a predetermined temperature range, thereby controlling the power supply to the semiconductor cooling element 700. Utilizing the forward power supply cooling and reverse power supply heating characteristics of the semiconductor cooling element, the H-bridge driver supplies power to the semiconductor cooling element 700 in either the forward or reverse direction to adjust the operating state of the semiconductor cooling element 700, maintaining a precise and constant temperature within the desired temperature range. An independent control circuit board can be placed to control the operation of the semiconductor cooling element 700, and this independent control circuit board is electrically connected to the PCBA inside the electrical appliance using the semiconductor cooling element 700. Alternatively, the electrical control assembly can be integrated into the PCBA inside the electrical appliance utilizing the semiconductor cooling element 700.

[0062] The number of temperature sensors 740 can be one or more, depending on the area and shape of the semiconductor cooling member. The physical therapy device of this application utilizes the cold surface layer 720 of the semiconductor cooling member 700 in the above embodiment as an end face that contacts the skin or provides a cooling effect to the skin. The semiconductor cooling member 700 is attached to the front end assembly of the neck and shoulder physical therapy device, and its end face contacts the skin, providing a beauty end face cooled by the semiconductor cooling member and providing an ice coating effect to the contacting skin. The built-in temperature sensors 740 detect the temperature of the cold surface layer or hot surface layer of the semiconductor cooling member, and the temperature sensors 740 can be electrically connected to a control circuit board to feed back the temperature data. The control circuit board analyzes the temperature data and controls the power supply operation of the positive and negative electrodes 711 of the semiconductor cooling member according to the requirements of a predetermined temperature range, so that the temperature of the cold surface layer 720 or the beauty end face is always maintained within the predetermined temperature range.

[0063] In a specific embodiment, the cold surface layer 720 of the semiconductor cooling member 700 is in contact with the optical output panel (not shown) in the front-end assembly. For example, it is provided around the optical output panel. Alternatively, the cold surface layer 720 of the semiconductor cooling member 700 and the optical output panel are connected to the optical output panel via a cold conductive member (thermal conductive element or thermal conductive member). The cold conductive member is a heat transfer structural member that can quickly transfer heat from the optical output panel to the semiconductor cooling member, thereby achieving a cooling effect on the work surface and creating a cold adhesion or pre-cooling effect on the surface of the skin in contact with the work surface.

[0064] In each of the above embodiments, a temperature sensor is built into the semiconductor cooling member 700 to detect the temperature of the cold surface layer 720 or the hot surface layer 730 of the semiconductor cooling member, and the temperature data is transmitted to a control circuit board. After processing by the main control unit on the control circuit board, the power supply to the positive and negative electrodes 711 of the semiconductor cooling member is controlled to adjust the operating state of the semiconductor cooling member, thereby achieving precise temperature control by maintaining an accurate and constant temperature within a desired temperature range. A physical therapy device using the semiconductor cooling member 700 can accurately control the temperature of the work surface or edge surface that comes into contact with the skin.

[0065] The foregoing description is merely a preferred embodiment of the present application, and the scope of protection of this application is not limited thereto. Any equivalent transformations based on the technical solutions of this application are also covered by the scope of protection of this application.

Claims

1. A neck and shoulder physical therapy device comprising a housing, a light source assembly disposed within the housing, and a light-transmitting front-end assembly, wherein the housing is provided with an irradiation window, the front-end assembly is mounted at a position corresponding to the irradiation window of the housing, and the light emitted from the light source assembly is emitted from the irradiation window via the front-end assembly.

2. The neck and shoulder physical therapy device according to claim 1, characterized in that the light source assembly includes a light source member that can provide a dual light source or a single light source.

3. The neck and shoulder physical therapy device according to claim 2, characterized in that the light source member can use one or two of the following light sources: IPL, tungsten filament lamp, and carbon filament lamp.

4. The neck and shoulder physical therapy device according to claim 3, wherein the light source assembly further includes a reflective member positioned behind the light source member and reflecting the light emitted to the rear toward the irradiation window.

5. The neck and shoulder physical therapy device according to claim 1, characterized in that the front end assembly has an arcuate surface shape, a curved surface shape, or a planar surface shape.

6. The neck and shoulder physical therapy device according to claim 1, further comprising an electrical control assembly electrically connected to the light source assembly.

7. The neck and shoulder physical therapy device according to claim 6, characterized in that the front end assembly includes a cooling member connected to the electrical control assembly.

8. The neck and shoulder physical therapy device according to claim 7, characterized in that the cooling member is provided with a temperature sensor connected to the electrical control assembly.

9. The neck and shoulder physical therapy device according to claim 8, characterized in that the cooling member comprises a semiconductor electric double layer, a hot surface layer, and a cold surface layer, and the temperature sensor is disposed in the semiconductor electric double layer, the hot surface layer, or the cold surface layer.

10. The neck and shoulder physical therapy device according to claim 7 or 8, wherein the cooling member comprises a semiconductor electric double layer, a hot surface layer, and a cold surface layer, through holes are formed in a local region of the cooling member that penetrate the cold surface layer and the hot surface layer, a light emission region is formed corresponding to the through holes, and the semiconductor electric double layer has semiconductor electric dipole particles arranged to avoid the light emission region.

11. The neck and shoulder physical therapy device according to claim 7 or 8, wherein the cooling member comprises a semiconductor electric double layer, a hot surface layer, and a cold surface layer, the cold surface layer and / or the hot surface layer being a transparent substrate, the semiconductor electric dipole particles of the semiconductor electric double layer being arranged in local areas of the cooling member, and the areas where the semiconductor electric dipole particles are not arranged forming empty areas.

12. The neck and shoulder physical therapy device according to claim 7 or 8, wherein the cooling member comprises a semiconductor electric double layer, a hot surface layer, and a cold surface layer, one of the cold surface layer or the hot surface layer being a transparent substrate, through holes formed in a local region of the other, and semiconductor electric dipole particles of the semiconductor electric double layer being arranged in the corresponding region where no through holes are formed.

13. The neck and shoulder physical therapy device according to claim 7 or 8, characterized in that the external shape and size of the cooling member conform to the external shape and size of the front end assembly, and at least one light emission region is provided within the cooling member.

14. The neck and shoulder physical therapy device according to claim 8, characterized in that the temperature sensor includes positive and negative electrodes, the cooling member includes positive and negative electrodes, the positive and negative electrodes of the cooling member are connected via an H-bridge driver to the electrical control assembly or a control circuit board on which the electrical control assembly is provided, and the temperature sensor is electrically or communically connected to the electrical control assembly or a control circuit board on which the electrical control assembly is provided to transmit temperature data.

15. The neck and shoulder physical therapy device according to claim 1, further comprising a heat dissipation device provided on the rear side of the light source, wherein the housing is provided with heat dissipation holes and intake holes communicating with the air passage of the heat dissipation device, the intake holes are provided on the wall of the housing at a certain distance from the heat dissipation holes, and are distributed on both sides of the light source assembly in a position to form effective convection with the heat dissipation holes.

16. The neck and shoulder physical therapy device according to claim 1, characterized in that the housing includes a front housing and a rear housing, the irradiation window is provided on the front wall of the front housing, and a cavity for housing the light source assembly is provided inside the housing.

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