In particular, induction devices and electrodynamic brakes for electrodynamic brakes

The induction device with pin clusters in a hexagonal honeycomb structure addresses inefficiencies in electrodynamic brakes by optimizing current density and power density, ensuring effective cooling and high fill factor.

JP2026513096APending Publication Date: 2026-04-23DEUTSCHES ZENTRUM FÜR LUFT UND RAUMFAHRT E V
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
DEUTSCHES ZENTRUM FÜR LUFT UND RAUMFAHRT E V
Filing Date
2023-10-24
Publication Date
2026-04-23

AI Technical Summary

Technical Problem

Existing electrodynamic brakes face challenges in optimizing current density and power density while maintaining a high fill factor and effective cooling, leading to inefficiencies in performance.

Method used

The induction device comprises a support element with pin clusters arranged in a hexagonal honeycomb structure, enclosed by an encapsulation material, and optimized pin placement to reduce the skin effect and enhance current density, while maintaining a high fill factor and ensuring effective cooling.

Benefits of technology

This configuration achieves improved current density and power density, with enhanced cooling capabilities and reduced risk of short circuits, resulting in a more efficient electrodynamic brake.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present invention relates in particular to an induction device (300) for an electrodynamic brake (100), wherein at least one support element (400) has a plurality of openings (402), and a plurality of pins (410) are divided into a plurality of pin clusters (416), with one pin cluster (416) positioned in each opening (402). The present invention further relates to the electrodynamic brake (100).
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Description

Technical Field

[0001] The present invention particularly relates to an induction device for an electro-dynamic brake, and to an electro-dynamic brake having this induction device.

Background Art

[0002] Eddy current brakes are known in the prior art. For example, German Patent Application Publication No. 950939 discloses an eddy current brake, in which the magnetic pole cores of the inductor are arranged on both sides of an armature movable relative to the inductor. This eddy current brake consists of one or more bodies having good electrical conductivity forming an eddy current path, and a portion having good magnetic flux conductivity extending through the above-mentioned body (bodies). The portion inducing the magnetic flux protrudes beyond the body (bodies) forming the eddy current path on both sides. As a result, the ends of these portions form protrusions that improve the cooling of the armature.

[0003] An electro-dynamic brake having a magnetic device for providing a magnetic field is known from German Patent Application Publication No. 102016108646. The magnetic device has at least two magnetic pole elements and cooperates with an induction device. Here, the induction device is arranged to be at least partially exposed to the magnetic field provided through the magnetic pole elements of the magnetic device in the braking mode. The induction device is formed such that a current is induced by a magnetic field that changes inside it. The induction device and the magnetic pole elements of the magnetic device are movable relative to each other along a predetermined movement path.

[0004] Using the latter electro-dynamic brake and its material structure consisting of steel pins and a perforated plate, it has already been possible to significantly reduce the skin effect in eddy current brakes, thereby realizing an improvement in current distribution. In particular, as a result of the plate arranged around the steel pins, the surface for cooling the brake can be significantly increased, and thus the power density can be increased.

Summary of the Invention

[0005] The objective of this invention is to propose an improved electrodynamic brake having improved performance.

[0006] This objective is achieved according to the present invention by an induction device according to the features of claim 1 and an electrodynamic brake according to the features of claim 13. Advantageous configurations are expressed in the respective relevant dependent claims.

[0007] Therefore, this objective is achieved in particular by an induction device for electrodynamic brakes, the induction device comprising at least one support element and a plurality of pins, the at least one support element having a plurality of openings. The plurality of pins are divided into a plurality of pin clusters, and as a result, each pin cluster comprises a portion of the plurality of pins, one of the pin clusters is positioned in each of the individual openings of the at least one support element.

[0008] The present invention is based on the idea of ​​reducing the size of individual pins and grouping multiple pins into their respective pin clusters in order to place them in the individual openings of at least one support element.

[0009] By using relatively small individual pins, the so-called skin effect within each individual pin can be reduced.

[0010] Here, the pin cluster allows for optimization of the current density at the support element, which also functions as a conductive plate. A higher or optimized power density can be achieved.

[0011] At the same time, in contrast to using individual pins for each opening in the support element, the fill factor or total fill factor of the pins can be maintained in this way. Here, the total fill factor is related to the cross-sectional area of ​​the pins positioned relative to the rest of the support element in the corresponding plan view.

[0012] An advantageous embodiment may be that the openings, and thus the pin clusters, are distributed in a uniform grid or pattern. It is advantageous that this grid or pattern is interrupted or discontinued only in part of the support elements, in which part of the support elements the entire area for the openings, including sufficient adjacent web width (web area), is no longer available.

[0013] The openings are preferably incorporated perpendicularly to the support elements such that the theoretical central opening axis extends perpendicularly to the surface of the support elements. Ideally, the openings are all designed to be identical or substantially identical.

[0014] Alternatively, the configuration of the openings may be modified to achieve a symmetrical pattern along the surface of each support element. Therefore, the pin clusters may be designed to correspond to each opening.

[0015] The support element is preferably made from a conductive material having low magnetic permeability. Ideally, the support element may contain aluminum or copper.

[0016] It is advantageous that the pins may be made from a material with high magnetic permeability, such as steel. For example, the type of steel provided may be steel having a material number of 1.0178.

[0017] In one embodiment, the opening may have a circular or polygonal basic structure. A hexagonal honeycomb structure is particularly advantageous as it can be provided as a basic structure such that the support elements comprise a grid or grid region having hexagonal openings.

[0018] The hexagonal basic structure results in a particularly uniform distribution of web areas surrounding the web, web nodes, or openings, and as a result, magnetic and electric field lines can flow particularly uniformly through the material of the supporting elements. Furthermore, uniform flow is achieved because extremely narrow points can be avoided.

[0019] While a hexagonal basic structure is particularly advantageous, the opening may also have, in essence, a triangular, square, or other polygonal basic structure. Generally, an advantageous basic structure for an opening is one in which a very uniform web or web area is created as a support grid to achieve the highest possible density and uniform distribution along the top surface of each support element.

[0020] In an improved embodiment, the pin cluster may be enclosed within an opening of at least one support element by an encapsulation element, preferably comprising an epoxy resin or an acrylic resin. In particular, the pin cluster may be enclosed within all openings of all support elements.

[0021] Here, the encapsulating material should be of a type that is permanently stable at temperatures of 120°C to 200°C in its cured state, and in particular, of a type that is permanently stable at temperatures of 120°C to 160°C. Therefore, it is advantageous to use epoxy resin or acrylic resin as the encapsulating material.

[0022] In further improvements to this embodiment, the pin cluster may be enclosed within the openings of the top and bottom support elements by an encapsulation element, preferably an encapsulation element comprising an epoxy resin or an acrylic resin, and in particular, may be exclusively enclosed within the openings of the top and bottom support elements or two outer support elements together with three or more support elements.

[0023] As a result, optimal cooling in the internal region and clearance of the induction device can be achieved without any disadvantage to the strength and positional stability of the pin cluster. Further improvements may involve pouring the encapsulation material onto the ends of the pins of the pin cluster at the end positions within the support element, or flowing around the ends of the pins, so that the encapsulation material flows into the gap region (crack) over at least a portion of the length of the pin, where it hardens.

[0024] In a further advantageous embodiment, an additional sealing element independent of the support element is provided as a frame, lattice and / or mesh element within at least some of the openings, through which the pin clusters or the pins of the pin clusters are guided during assembly. The sealing element serves, in particular, to determine the position of the individual pins of the pin cluster and serves as a seal for the encapsulating material within the area of the opening.

[0025] In an advantageous embodiment, the sealing element is incorporated into at least some of the openings of the support element by an additive manufacturing process as a circumferential frame or as a guide for the individual pins.

[0026] It is essentially advantageous if the highest possible density of pins is achieved within the opening. Thus, in an improved embodiment, the pins of each pin cluster have a cross-sectional area A and each of the individual openings of at least one support element has a cross-sectional area B, with respect to the opening area B of each opening, the ratio of the sum of the cross-sectional areas of all the pins of the individual pin clusters is within the range of 0.85 + / - 0.1, advantageously within the range of 0.85 + / - 0.05, and particularly may be within the range of 0.85 + / - 0.01.

[0027] The packing density is advantageously such that the substantially cylindrical pins are arranged parallel to each other and are filled as closely to each other as possible. ​​​​​​​​

[0030] Similarly, there may be advantages to each circumferential web having a web width being formed between two openings of at least one support element, where the ratio of half the web width to the opening width is in the range of 0.05 to 0.3, particularly in the range of 0.08 to 0.12. In this way, the internal clearance and flow path can be fabricated to be sufficiently available for heat dissipation while simultaneously providing a high pin occupancy rate.

[0031] The hexagonal honeycomb structure of the openings gives a very uniform and stable web structure with only slightly enlarged node regions having a small area, thus demonstrating the unique advantages of the hexagonal honeycomb structure of the openings.

[0032] In a further improved embodiment, the pins of the pin cluster may be arranged to abut each other over at least a partial length along the longitudinal range, in particular, each pin of the pin cluster may be arranged to be in contact with at least three adjacent pins along at least a partial length.

[0033] In a further improved embodiment, at least some of the outer pins of the pin cluster may be in contact with the support element.

[0034] This means that the outer pin contacts one of the opening edges of the opening, thereby providing support. In the case of a cylindrical pin and a straight opening edge, the two shapes contact each other along the contact line.

[0035] To avoid short circuits and to optimally form magnetic field lines, further improvements may include having an electrical insulating material on the outer surface of at least some of the pins. This may be an additive coating such as a phosphate coating, or another electrical insulating coating.

[0036] In an improved embodiment, a return element may be provided for later installation of an induction device having a magnetic device on one side, the return element is preferably made from a magnetically soft composite or ceramic ferrite, and is particularly formed as an iron-containing return element.

[0037] This return element may form a terminal element, for example, in the form of a plate or a ring.

[0038] In particular, the return element may be in contact with one longitudinal end of the pin or pin cluster.

[0039] In the installed state, the return element is preferably positioned on the side of the induction device that is away from the magnetic pole or magnetic pole shoe. The return element is formed parallel to the support element.

[0040] The pins or pin clusters may be enclosed within or on the return element.

[0041] In the context of the present invention, in particular, various reversion and / or exciton deformations, such as those known from, for example, German Patent Application Publication No. 102016108646, may be provided.

[0042] For example, a disk-shaped return element, or a spirally wound steel strip for forming a disk-shaped return element, may be provided.

[0043] Furthermore, the exciter coil or pole element can be positioned, for example, on one side of the induction device, or on both sides of the induction device by replacing it with a return element. The exciter coil or pole element may be formed exclusively as a north pole, or at least some of the pole elements may be provided in the form of permanent magnets instead of coils wound around a core. In particular, when the pole elements are positioned on both sides, the north pole or south pole may be positioned exclusively on one side of each carrier plate, respectively.

[0044] In the context of the present invention, the magnetic pole element may be provided as a rotor in particular, and the induction device may be provided as a stator.

[0045] In further improved embodiments, at least one spacer, in particular in the form of a silicone cord, plastic cord, silicone ring, or plastic ring, may be positioned between two adjacent support elements among a plurality of support elements, thereby providing a minimum space between the two adjacent support elements.

[0046] For this purpose, one or more flexible spacers may be placed between two support elements, for example, one or more silicone cords. In particular, silicone or plastic rings may also be placed around multiple pin clusters, with subsequent support elements leaning against or in contact with the pin clusters. Support elements with one positioned on top of the other are advantageous in providing a structure that allows for open flow.

[0047] According to a further advantageous embodiment of the present invention, the induction device may have at least one cover element, in particular at least one cover plate, the at least one cover element provided on the opposite side and / or in the area of ​​the longitudinal ends of the plurality of pins, and the cover element has a conductivity lower than that of at least one support element.

[0048] For example, the cover element may include materials such as stainless steel.

[0049] Furthermore, it is preferable that the cover element or cover plate be positioned in contact with the encapsulation element.

[0050] In particular, the cover element may be provided on the side of the induction device opposite the return element.

[0051] When magnetic pole elements or coils are provided on both sides of the induction device, the induction device may be formed having two cover elements, one of which in each case is positioned over or within a region of one of the longitudinal ends of a plurality of pins, which are preferably in contact with the respective encapsulation element or encapsulation material.

[0052] The cover element preferably has the lowest possible conductivity.

[0053] As a result of the cover element having low conductivity, the encapsulating element, such as epoxy resin, can be protected from strong or excessive heat input.

[0054] The present invention further comprises an electrodynamic brake having a magnetic device for providing a magnetic field. Preferably, the magnetic device has at least one magnetic pole element and an induction device according to the present invention.

[0055] The induction device may be arranged in force mode to be at least partially exposed to a magnetic field provided through the magnetic pole elements of the magnetic device, and the induction device and the magnetic pole elements of the magnetic device are movable relative to each other along a predetermined movement path.

[0056] Further details and advantages of the present invention will be described in more detail here with reference to exemplary embodiments shown in the drawings. [Brief explanation of the drawing]

[0057] [Figure 1] Figure I shows a perspective view of an exemplary embodiment of the induction device, and Figure II shows an enlarged detail of the second part. [Figure 2] A cross-sectional view of an exemplary embodiment of the guidance device in a perspective view is shown. [Figure 3] A perspective view of one exemplary embodiment of a partially manufactured induction device is shown. [Figure 4] A perspective view of an exemplary embodiment of an induction device having enclosed pin clusters is shown. [Figure 5] A perspective view of an exemplary embodiment of an electrodynamic brake is shown in partial cross-section. [Modes for carrying out the invention]

[0058] Figure 1 shows an exemplary embodiment of an induction device 300 for an electrodynamic brake 100.

[0059] According to Figure 1, the induction device 300 may have seven horizontal support elements 400, each support element having multiple openings 402.

[0060] The clusters of pins 410 that form the pin cluster 416 are each located within the respective openings 402.

[0061] In partial image I, the pin clusters 416, each having multiple pins 410, are shown in a schematicly simplified form as cylinders.

[0062] The pin cluster 416 penetrates all seven support elements 400.

[0063] As shown in Figure 1, the longitudinal axis of the pin cluster 416 coincides with or is coaxial with the opening axis 404 of each opening 402.

[0064] The wall elements 418 (shown in a simplified form) are positioned inside and outside the induction device 300, and these wall elements are part of the electrodynamic brake 100, defining the induction device 300 on both sides of the narrow surface.

[0065] Multiple magnetic pole elements 102 are shown below the induction device 300 in Figure 1 and can be arranged along at least one broad surface of the induction device 300.

[0066] The magnetic pole element 102 has a ferrite core and an exciter coil 110 extending around the core 112.

[0067] The exciter coil 110 can be energized by a power supply (also not shown) so as to be controlled and / or regulated by a control unit (not shown).

[0068] In the normal operation of the illustrated induction device 300 or electrodynamic brake 100, the induction device 300 is rotatably mounted via a shaft (not shown), and the energized magnetic pole element 102 is stationary.

[0069] Force transmission and deceleration of the induction device 300 can occur when the coil 110 of the magnetic pole element 102 is energized and acts on the induction device 300, as is described in detail in Figure 5.

[0070] In the sub-figure II of Figure 1, the hexagonal basic structure of the opening 402 is shown in detail as a plan view of the induction device 300.

[0071] The honeycomb grid pattern of the web 406 is created by a plurality of hexagonal openings 402.

[0072] The pin clusters 416 are positioned within each opening 402, and the pin clusters are aligned coplane with the opening axis 404.

[0073] For example, the narrow width 420 of the opening 402 may be 6.3 mm, and therefore 31.17 mm. 2 It may have an opening area.

[0074] In the example shown in Part II of Figure 1, the pin cluster 416 comprises a total of 37 individual pins 410.

[0075] For example, each pin 410 may have a pin width of 422 or a diameter of 1 mm, and therefore, in total, 29.06 mm within the opening. 2 It can occupy an area of ​​[this size].

[0076] Furthermore, the web width 408 outside the node area may be 1.38 mm. This is 38.37 mm. 2 This results in a theoretical occupied area, which is calculated by adding half the web area around each opening 402 to the aforementioned opening area.

[0077] Based on the example shown above, the 1 mm of the support element 400 2 Each unit of area is given the occupation of 0.964 pins.

[0078] In particular, occupancy of up to 0.98 nodes can be achieved if the web width of 408 is further reduced.

[0079] Regarding the uniform, non-clustered arrangement of individual pins 410, such occupation would only be achievable with considerable effort, if possible.

[0080] Furthermore, despite the high occupancy, a sufficient web width 408 can be ensured. During the operation of the induction device 300, sufficient heat dissipation can be guaranteed through the support element 400.

[0081] Figure 2 shows a perspective view of a further embodiment of the arrangement of the induction device 300, enlarged in a longitudinal section.

[0082] The adjacent wall element 418 is positioned at the left edge in the image in Figure 2.

[0083] For example, the opening width 420 of the hexagonal opening 402 may be 6.3 mm, the web width 408 may be 1.38 mm, and the diameter 422 of each pin 410 may be 1.0 mm.

[0084] In Figure 2, the individual openings 402 are shown without the pin cluster 416 for illustrative purposes.

[0085] The support element 400 may have a material thickness 428 of, for example, 4 mm, and may contain a material such as aluminum.

[0086] Multiple support elements 400 may be positioned between two encapsulation elements or encapsulation resins 426. Furthermore, at least one cover element or cover plate 440 may be provided, preferably positioned in the region of the longitudinal ends of the multiple pins 410. A structure through which the coolant can flow is formed using the flow channels 436 between the individual pin clusters 416 and the support elements 400 (see also clearance 412 in Figure 1).

[0087] In general, it should be understood that information regarding gravity, such as “up,” “down,” “lowering,” “seated,” “upright,” and “suspended,” is for illustrative purposes only and serves only to describe elements shown in specific positions. This information should not be understood as being limited to the alignment of the induction device during use or assembly, and is provided similarly for different alignments, such as the vertical alignment of the induction device.

[0088] Figure 3 shows a pin cluster 416 according to an exemplary embodiment, which is positioned within a bottom support element 400 and aligned perpendicularly to the bottom support element 400.

[0089] The wall elements 418 are positioned to the left and right of the induction device 300, and the cooling channel 104 is provided within the radially outer wall element 418 shown on the right side.

[0090] According to Figure 3, the main shape 424 of the induction device 300 may be a ring or an annular portion.

[0091] In Figure 3, the induction device 300 is shown in a manufacturing step before completion. In particular, according to Figure 3, (at least) one upper support element 400 may be lowered onto the illustrated pin cluster 416 for completion, and the support element can then be encapsulated together with the ends of the pin cluster 416 by an encapsulation element / resin, preferably epoxy resin or acrylic resin, as shown in Figure 4.

[0092] Figure 4 shows the induction device 300 according to Figure 3 after the support element 400 (not visible) has been encapsulated together with the pin cluster 416 by the encapsulation element / encapsulation resin 426.

[0093] The encapsulation resin 426 is poured into the space above the web 406 and web node 434 and cured. Furthermore, the encapsulation resin 426 can be poured onto the free ends of the pins 410 of the pin cluster 416 so that it can also penetrate a certain distance into the cracks between the individual pins 410 and cure there.

[0094] In Figure 5, the electrodynamic brake 100 is shown in a partially cross-sectional view in a released state. The induction device 300 represents a component fixed to the schematically illustrated shaft 106 and subjected to braking.

[0095] The magnetic pole element 102 (shown in parallel cross-section) is positioned and fastened to a carrier plate 108 (shown in front view) which is stationary and does not rotate with the shaft 106.

[0096] Each magnetic pole element 102 has a core 112 with a wider radially outward surface and a narrower radially inward surface, and is therefore designed similarly to a ring segment.

[0097] The multilayer exciter coils 110 are arranged around the core 112 in each case, and the exciter coils can operate in a manner not shown in more detail, through which current can flow.

[0098] The induction device 400 is designed in the same manner as in the above embodiment. That is, the induction device 400 has a plurality of pin clusters 416.

[0099] In the example for two parallel limbs, the current flows through adjacent, parallel limbs of the exciter coil 102 of adjacent magnetic pole elements 102 having the same current direction 120, i.e., a radially outward current direction.

[0100] Therefore, in the exemplary embodiment shown in Figure 5, magnetic field lines 430 are formed, and in the case of the left core 112, the magnetic field lines 430 emerge from the viewing plane and enter the right core 112 (shown in cross-section).

[0101] In parallel with this, pin 410 is actuated electrodynamically in a well-known manner, for example, as described in German Patent Application Publication No. 102016108646, resulting in braking of the induction device 400.

[0102] In the illustrated example, the magnetic pole elements 102 are positioned on both sides of the broad surface of the induction device 300. Alternatively, the formation of the magnetic field can be ensured via iron-containing or ferrite return elements. [Explanation of Symbols]

[0103] 100 Brake 102 Magnetic pole element 104 cooling channels 106 Shaft 108 Carrier Plate 110 Exciter Coil 112 cores 120 Current direction 300 Guidance device 400 Support elements 402 Opening 404 Opening axis 406 Web 408 web width 410 pins 412 Clearance 416 Pin Cluster 418 Wall elements 420 width 422 web width 424 Main Shapes 426 Encapsulation resin / encapsulation element 428 Material thickness 430 Magnetic field lines 434 web nodes 436 Channels 440 Cover elements / cover plates A cross section B Opening area

Claims

1. In particular, an induction device (300) for an electrodynamic brake (100), comprising at least one support element (400) and a plurality of pins (410), The at least one support element (400) has a plurality of openings (402), The plurality of pins (410) are divided into a plurality of pin clusters (416), and as a result, each pin cluster (416) comprises a portion of the plurality of pins (410). An induction device (300) wherein one of the pin clusters (416) is positioned in each of the individual openings (402) of the at least one support element (410).

2. The induction device (300) according to claim 1, characterized in that the opening (402) has a circular or polygonal basic structure, and in particular has a hexagonal honeycomb structure as the basic structure.

3. The induction device (300) according to claim 1 or 2, characterized in that the cluster of pins (410) is sealed within the opening (402) of at least one support element (400) by an encapsulation element (426), preferably an epoxy resin, and in particular, sealed within all openings (402) of all support elements (400).

4. The induction device (300) according to claim 1 or 2, characterized in that the pin cluster (410) is enclosed within the opening (402) of the top and bottom support elements (400) by an encapsulation element (426), preferably an epoxy resin, and in particular, is exclusively enclosed within the opening (402) of the top and bottom support elements (400) together with three or more support elements (400).

5. Each pin cluster (416) has a pin (410) with a cross-sectional area A, and each of the individual openings (402) of the at least one support element (400) has a cross-sectional area B. The ratio of the opening area B of each opening (402) The induction device (300) according to any one of claims 1 to 4, characterized in that the ratio of the sum of the cross-sectional areas A of all pins (410) of an individual pin cluster (416) is within the range of 0.85 ± 0.1, and more particularly within the range of 0.85 ± 0.

05.

6. A guide device (300) according to any one of claims 1 to 5, characterized in that each circumferential web (406) having a web width (408) is formed between two openings (402) of at least one support element (400), and the ratio of half the web width (408) to the width (420) of the opening (402) is in the range of 0.05 to 0.

3.

7. The induction device (300) according to any one of claims 1 to 6, characterized in that the pins (410) of the pin cluster (416) are arranged to abut each other over at least a partial length along the longitudinal direction, and in particular, each pin (410) of the pin cluster (416) is arranged to be in contact with at least three adjacent pins (410) along at least a partial length.

8. The induction device (300) according to any one of claims 1 to 7, characterized in that at least some of the outer pins (410) of the pin cluster (416) are in contact with the support element (400).

9. The induction device (300) according to any one of claims 1 to 8, characterized in that at least some of the pins (410) are covered with a coating having an electrical insulating material as an additive coating, and in particular having a phosphate coating as an additive coating.

10. An induction device (300) according to any one of claims 1 to 9, wherein a return element is provided, the return element is preferably made from a magnetically soft composite or ceramic ferrite, and in particular contains iron.

11. The induction device (300) according to any one of claims 1 to 10, characterized in that a single spacer (432), in particular in the form of a silicone cord, plastic cord, silicone ring, or plastic ring, is placed between two adjacent support elements (400) among the plurality of support elements (400), thereby providing a minimum space between the two adjacent support elements (400).

12. The induction device (300) according to any one of claims 1 to 11, wherein the induction device (300) has at least one cover element (440), in particular at least one cover plate, the at least one cover element (440) is provided on the opposite side of and / or in the region of the longitudinal ends of the plurality of pins (410), and the cover element has conductivity lower than that of the at least one support element (400).

13. An electrodynamic brake (100) having a magnetic device for providing a magnetic field, the magnetic device having at least one magnetic pole element (102) and an induction device (300) according to any one of claims 1 to 12.