Acoustic transducer array assembly

Abstract

This disclosure relates to an acoustic transducer array assembly including a printed circuit board having at least one plated through-hole and a matching layer containing an acoustic medium configured to provide acoustic impedance matching between at least one piezoelectric element and the acoustic impedance of a target sample, configured to provide acoustic pressure waves to at least one sample location. The acoustic transducer array assembly further comprises at least one acoustic transducer having at least one signal electrode electrically connected to at least one plated through-hole and acoustically coupled to the matching layer, at least one ground electrode electrically connected to at least one plated through-hole and acoustically coupled to the matching layer, and at least one piezoelectric element electrically connected to the at least one signal electrode and the at least one ground electrode.

Description

Background Art

[0001] (Cross-reference to related applications) This application was filed as a PCT international application on May 10, 2024, claiming the benefit and priority of U.S. Provisional Patent Application No. 63 / 501,988, filed on May 12, 2023, the disclosure of which is hereby incorporated by reference in its entirety.

[0002] Acoustic transduction can be used to convert electrical energy into acoustic waves suitable for measuring small volumes of liquid. In one embodiment, a piezoelectric element having electrodes on each side can be attached to a printed circuit board (PCB) such that they are in electrical contact with a circuit such as a trace or pad on the PCB. Electrical contact between the PCB circuit and the piezoelectric electrodes can be facilitated by placing a conductive material between each piezoelectric electrode and the PCB circuit. When a voltage is applied across each of the piezoelectric electrodes, the piezoelectric element expands or contracts, which produces an acoustic pressure wave that travels through solids and liquids (including reflected waves that return to the piezoelectric element).

Summary of the Invention

Means for Solving the Problems

[0003] The present disclosure relates to an acoustic transducer. Specifically, the present disclosure relates to an acoustic transducer that includes one or more piezoelectric elements that are in acoustic contact with the bottom of one or more containers containing a liquid sample. In one application, one or more piezoelectric elements are arranged to accommodate a sample that is arranged in an array such as a linear array. In one application, acoustic energy can be used to measure the sample from the container. In one application, an acoustic transducer array assembly is configured to apply an acoustic pressure wave successively from a plurality of acoustic transducers to a plurality of samples.

[0004] In one embodiment, the acoustic transducer array assembly includes a printed circuit board configured to provide an acoustic pressure wave to at least one sample location and includes at least one plated through-hole and a matching layer containing an acoustic medium configured to provide acoustic impedance matching between at least one piezoelectric element and the acoustic impedance of a target sample. The acoustic transducer array assembly further includes at least one acoustic transducer having at least one signal electrode electrically connected to at least one plated through-hole and acoustically coupled to the matching layer, at least one ground electrode electrically connected to at least one plated through-hole and acoustically coupled to the matching layer, and at least one piezoelectric element electrically connected to the at least one signal electrode and at least one ground electrode, wherein the at least one piezoelectric element is configured to produce an acoustic pressure wave when an electrical voltage between the at least one signal electrode and at least one ground electrode is applied to the piezoelectric element.

[0005] In another embodiment, a method for providing an acoustic pressure wave to at least one location is to provide an acoustic transducer array assembly, the acoustic transducer array assembly comprising at least one printed circuit board including at least one plated through-hole and at least one matching layer containing an acoustic medium configured to provide acoustic impedance matching between at least one piezoelectric element and at least one target sample; at least one acoustic transducer including at least one signal electrode electrically connected to at least one plated through-hole and acoustically connected to at least one matching layer, at least one ground electrode electrically connected to at least one plated through-hole and acoustically connected to at least one matching layer, and at least one piezoelectric element electrically connected to at least one signal electrode and at least one ground electrode. The method further comprises applying an electrical voltage between at least one signal electrode and at least one ground electrode to at least one piezoelectric element, converting the electrical voltage into an acoustic pressure wave, and projecting the acoustic pressure wave to at least one location, wherein at least one signal reflection of the acoustic pressure wave is minimized due to acoustic impedance matching.

[0006] In yet another embodiment, a method for fabricating an acoustic transducer array assembly, the method comprising providing an acoustic transducer array assembly, the acoustic transducer array assembly comprising a printed circuit board having at least one plated through-hole and at least one matching layer configured to provide acoustic impedance matching between at least one piezoelectric element and at least one target sample. The method further comprises electrically connecting at least one signal electrode to the acoustic transducer array assembly and acoustically connecting at least one signal electrode to at least one matching layer, electrically connecting at least one ground electrode to the acoustic transducer array assembly and acoustically connecting at least one ground electrode to at least one matching layer, and electrically connecting at least one piezoelectric element to at least one signal electrode and at least one ground electrode.

[0007] Various additional aspects will be described in the following explanation. These aspects may relate to individual features and combinations of features. It should be understood that both the above general explanation and the following detailed explanation are illustrative and descriptive only, and do not limit the broader concept of the invention on which the embodiments disclosed herein are based. [Brief explanation of the drawing]

[0008] The following drawings illustrate embodiments of the present disclosure and are not intended to limit the scope of the present disclosure. Embodiments of the present disclosure are described hereafter in reference to the accompanying drawings, and similar numbers indicate similar elements.

[0009] [Figure 1] Figure 1 shows a block diagram of an acoustic transducer array assembly, which includes a PCB and at least one acoustic transducer.

[0010] [Figure 2]Figure 2 shows a perspective view of the acoustic transducer and acoustic transducer array assembly shown in Figure 1, where the acoustic transducer array assembly includes multiple acoustic transducers.

[0011] [Figure 3] Figure 3 shows an isometric view of the acoustic transducer shown in Figure 1.

[0012] [Figure 4] Figure 4 shows an isometric view of the bottom of the acoustic transducer shown in Figure 1.

[0013] [Figure 5] Figure 5 shows a cross-sectional view of the acoustic transducer shown in Figure 3.

[0014] [Figure 6] Figure 6 shows an exploded view of the acoustic transducer array assembly of Figure 1, where the piezoelectric elements include piezoelectric disks positioned in each through-hole.

[0015] [Figure 7] Figure 7 shows a side isometric view of the acoustic transducer array assembly shown in Figure 6.

[0016] [Figure 8] Figure 8 shows a cross-sectional view of the acoustic transducer array assembly shown in Figures 6 and 7.

[0017] [Figure 9] Figure 9 shows a cross-sectional view of the acoustic transducer array assembly from Figures 6-8, including the matching layer integrated into the PCB.

[0018] [Figure 10] Figure 10 shows an exploded view of another embodiment of the acoustic transducer array assembly of Figure 1, in which the piezoelectric element includes a piezoelectric plate.

[0019] [Figure 11]FIG. 11 shows a side isometric view of the acoustic transducer array assembly of FIG. 10.

[0020] [Figure 12] FIG. 12 shows an exploded view of another embodiment of the acoustic transducer array of FIG. 1, the acoustic transducer array including at least one high density connector, and the piezoelectric element including piezoelectric disks positioned in each of the plated through holes.

[0021] [Figure 13] FIG. 13 shows a side isometric view of the acoustic transducer array assembly of FIG. 12.

[0022] [Figure 14] FIG. 14 shows a cross-sectional view of the acoustic transducer array assembly of FIG. 12.

[0023] [Figure 15] FIG. 15 shows an exploded view of another embodiment of the acoustic transducer array of FIG. 12, the acoustic transducer array including a matching layer and a lens.

[0024] [Figure 16] FIG. 16 shows a side isometric view of the acoustic transducer array assembly of FIG. 15.

[0025] [Figure 17] FIG. 17 shows a cross-sectional view of the acoustic transducer array assembly of FIG. 15.

[0026] [Figure 18] FIG. 18 shows an exemplary side view of an acoustic transducer, with various signal connections arranged in parallel connection.

[0027] [Figure 19] FIG. 19 shows an exemplary side view of an acoustic transducer, with various signal connections arranged in series connection.

[0028] [Figure 20] Figure 20 shows a bottom view of a PCB or flexible circuit, illustrating the first layer of the PCB or flexible circuit having multiple column multiplexed traces.

[0029] [Figure 21] Figure 21 shows a top view of a PCB or flexible circuit, illustrating the first layer of the PCB or flexible circuit having multiple row multiplexed traces.

[0030] [Figure 22] Figure 22 shows a flowchart of a method for providing acoustic vibrations to at least one sample-test location.

[0031] [Figure 23] Figure 23 shows a schematic diagram of the electronic system for operating the acoustic transducer array assembly.

[0032] In the attached diagram, similar components and / or features may have the same reference mark. [Modes for carrying out the invention]

[0033] Detailed explanation Various embodiments are described in detail with reference to the drawings, where similar reference numerals represent similar parts and assemblies throughout several figures.

[0034] Generally, this disclosure relates to acoustic transducer array assemblies configured to provide acoustic pressure waves to various laboratory materials. In some embodiments, the acoustic transducer array assembly provides acoustically driven pressure waves through solid and liquid materials. In some embodiments, as non-limiting embodiments, the acoustic transducer array assembly is configured to provide acoustic pressure waves to at least one sample test location.

[0035] The term “printed circuit board” (PCB) is sometimes used to refer to a flat, rigid board comprising one or more nonconductive substrate materials such as fiberglass or plastic, but is not intended to be limited thereto in this disclosure. For example, in some embodiments, a PCB is a flexible circuit (also known as flexible electronic equipment) or includes a flexible circuit. A PCB may include nonconductive substrate materials, which can be various possibilities used to mechanically support components within a transducer array assembly, as well as electrically conductive materials (electrical traces, conductive pads, grounding surfaces, etc.) for electrically connecting to electronic components. Specifically, embodiments of printed circuit boards include rigid printed circuit boards (often comprising fiberglass or plastic) or flexible circuits (including flexible substrates such as polyimide or conductive polyester film). Thus, the PCBs described herein may include rigid circuit boards, flexible circuit boards, or combinations thereof.

[0036] Furthermore, this disclosure relates to an acoustic transducer array assembly configured to provide multiple acoustic transducers, which work together to increase efficiency and reduce the cost of automated manufacturing processes.

[0037] Figure 1 shows a block diagram of an acoustic transducer array assembly 100, which includes a PCB 102 and at least one acoustic transducer 108.

[0038] PCB 102 is used to electrically connect and organize electronic components. PCB 102 has a plurality of conductive pads 105 (as illustrated and described in more detail with respect to Figures 18-19) configured to electrically connect to other electronic components through conductive connections such as soldered connections. In some embodiments, PCB 102 is a flexible circuit including a flexible substrate such as polyimide or conductive polyester film. The flexible circuit is configured to electrically connect and mechanically couple a plurality of electronic devices. In some embodiments, the flexible circuit may be manufactured using similar components contained within a rigid PCB 102. In some embodiments, it is desirable to include a flexible circuit because the flexible substrate has acoustic impedance properties that provide impedance matching between at least one piezoelectric element 114 and the acoustic impedance of a target sample. In some embodiments, the flexible circuit includes a matching layer 106 integrated into the flexible circuit.

[0039] PCB 102 includes at least one plated through-hole 104, which is an electrical connection between copper layers within PCB 102. The plated through-hole 104 can be created by drilling a hole through two or more adjacent layers of PCB 102. In some embodiments, the plated through-hole 104 includes copper plating that electrically connects the elements of PCB 102 to the constituent wires received in the plated through-hole 104. In some embodiments, PCB 102 includes a plurality of plated through-holes 104. In some embodiments, PCB 102 includes a plurality of plated through-holes 104 arranged in a linear array. In some embodiments, PCB 102 includes a plurality of plated through-holes 104 ranging from 1 to 384. In some embodiments, PCB 102 includes a plurality of plated through-holes 104 arranged in a one-dimensional array. In some embodiments, PCB 102 includes 96 plated through-holes 104 arranged in an 8 × 12 two-dimensional linear array with a center-to-center spacing of 9 mm. In some embodiments, the PCB 102 includes 384 plated through-holes 104 arranged in a 16 × 24 linear array. In some embodiments, the PCB 102 includes 384 plated through-holes 104 arranged in a symmetrical linear array with a center-to-center spacing of 4.5 mm. In some embodiments, the pitch between each plated through-hole 104 is in the range of 4.5 mm to 36 mm. In some embodiments, the PCB includes more than 384 plated through-holes.

[0040] Furthermore, the PCB 102 includes at least one matching layer 106 containing an acoustic medium configured to provide acoustic impedance matching between at least one piezoelectric element 114 and the acoustic impedance of a target sample. In some embodiments, the matching layer 106 provides acoustic impedance matching to a layer adjacent to the matching layer 106. In some embodiments, the matching layer 106 provides acoustic impedance matching between the piezoelectric element 114 and the lens 302, which is illustrated and described in more detail with respect to Figures 3–8. In some embodiments, the acoustic medium includes a polymer material. In some embodiments, the polymer material includes at least one of polyimide, polyester, polystyrene, polyvinylidene fluoride (PDVF), aluminum, glass, polyphenylene oxide, or polypropylene. Impedance matching is desirable to minimize signal reflections that produce destructive interference while maximizing power transfer. The PCB 102, plated through-holes 104, and at least one matching layer are further discussed below with reference to Figures 6–14.

[0041] At least one acoustic transducer 108 is configured to be electrically connected to the PCB 102, acoustically coupled, and to produce an acoustic pressure wave. In some embodiments, the input voltage signal includes a frequency range of 1 MHz to 20 MHz. In some embodiments, at least one acoustic transducer 108 is acoustically coupled to the PCB 102 and electrically connected to the PCB 102 at each plated through-hole 104. In some embodiments, the acoustic transducer 108 is electrically connected to the PCB 102 using soldered connections or conductive epoxy. In some embodiments, the acoustic transducer 108 is aligned coaxially with the plated through-hole 104 to provide two-dimensional alignment of its components. The acoustic transducer 108 includes at least one signal electrode 110, at least one ground electrode, at least one electrical connection 112, and at least one piezoelectric element 114.

[0042] At least one signal electrode 110 is configured to produce a signal output within the acoustic transducer array assembly 100. At least one signal electrode 110 is electrically connected to at least one ground electrode 111. A voltage potential exists between the at least one signal electrode and the at least one ground electrode, which is described below, so that a voltage can be applied to components between the signal electrode 110 and the ground electrode 111, such as a piezoelectric element 114. In some embodiments, the at least one ground electrode includes an electrical ground ("RF ground") used in radio frequency systems. It is desirable to establish an electrical ground such as an RF ground and to provide a voltage from the signal electrode 110 to the ground electrode 111 across at least one piezoelectric element 114 (discussed below). In some embodiments, it is desirable to establish a good electrical connection between the signal electrode 110 and the ground electrode 111 to reduce electromagnetic interference and improve the efficiency and performance of the acoustic transducer array assembly 100.

[0043] In some embodiments, at least one acoustic transducer 108 includes at least one electrical connection 112. In some embodiments, at least one electrical connection 112 provides an electrical connection between a ground electrode 111 and a second layer 102B of the PCB. In some embodiments, at least one electrical connection 112 provides an electrical connection between a signal electrode 110 and a first layer 102A of the PCB. In some embodiments, the electrical connection 112 includes either an electrically conductive junction or a non-conductive junction between the ground electrode 111 and the second layer 102B of the PCB. In some embodiments, the electrical connection 112 includes either an electrically conductive junction or a non-conductive junction between the signal electrode 110 and the first layer 102A of the PCB.

[0044] In one embodiment, the conductive junction includes a soldered connection. In another embodiment, the conductive junction includes a conductive epoxy, such as a silver-filled epoxy, positioned within a plated through-hole 104 that electrically connects at least one signal electrode 110 to a first layer 102A of the PCB and at least one ground electrode 111 to a second layer 102B of the PCB.

[0045] In one embodiment, the non-conductive junction includes a capacitive connection containing an electrical voltage potential between the signal electrode 110 and the ground electrode 111. In another embodiment, the non-conductive junction includes a connection using a metallic material such as aluminum between the piezoelectric element 114 and the ground electrode 111. In another embodiment, the metallic material contacts the piezoelectric element 114 to facilitate the transport of electrical voltage from the electric field to the piezoelectric element 114. In yet another embodiment, the metallic material includes an aluminum sheet.

[0046] In one embodiment, the acoustic transducer array assembly includes signal electrodes 110 positioned between each plated through-hole 104 on the PCB 102. In one embodiment, at least one connector 1101 is provided on the acoustic transducer array assembly, providing an electrical voltage through each acoustic transducer 108 to the PCB trace. The at least one connector 1101 is illustrated and described in more detail with respect to Figures 12–17.

[0047] At least one piezoelectric element 114 is configured to produce an acoustic pressure wave through a process called the inverse piezoelectric effect, in which electrical energy is converted into mechanical energy in the form of an acoustic wave. The piezoelectric element 114 performs this function by receiving an electrical voltage and releasing energy in the form of an acoustic pressure wave.

[0048] In some embodiments, at least one piezoelectric element 114 includes a piezoelectric plate that straddles one or more plated through-holes 104. In some applications, having a single piezoelectric plate may be desirable because it increases manufacturing efficiency and reduces production costs while generating piezoelectric elements 114 for multiple acoustic transducers 108. Piezoelectric elements including piezoelectric plates are described and illustrated in more detail with respect to Figures 10-12.

[0049] In some embodiments, at least one piezoelectric element 114 includes at least one piezoelectric disk positioned in each plated through-hole 104. It may be desirable to include individual piezoelectric disks within each acoustic transducer 108, as this allows the piezoelectric elements 114 of each acoustic transducer 108 to be uncoupled from each other when multiple acoustic transducers 108 are included on a single acoustic transducer array assembly 100, and the piezoelectric disks to expand or contract freely. Piezoelectric elements 114 including at least one piezoelectric disk are described and illustrated in more detail with respect to Figures 6–9.

[0050] In some embodiments, at least one acoustic transducer array assembly 100 is arranged in the orientation shown in this figure, with the components stacked on top of each other. In one embodiment, two layers 102A, 102B of the PCB include a matching layer 106 integrated as part of a flexible circuit and plated through-holes 104. The two layers 102A, 102B of the PCB are electrically connected to the acoustic transducer 108 via electrical connections 112, as described above. Furthermore, the acoustic transducer 108 includes a signal electrode 110 electrically connected to the first layer 102A of the PCB and a ground electrode 111 electrically connected to the second layer 102B of the PCB. A voltage potential exists between the signal electrode 110 and the ground electrode 111, thereby allowing an electrical voltage to be carried to the piezoelectric element.

[0051] The acoustic transducer 108, at least one signal electrode 110, at least one ground electrode 111, at least one electrical connection 112, and at least one piezoelectric element 114 are further discussed below with reference to Figures 3-5.

[0052] Figure 2 shows a perspective view of the acoustic transducer 108 and the acoustic transducer array assembly 100 of Figure 1, the acoustic transducer array assembly 100 including a plurality of acoustic transducers 108.

[0053] It is desirable to (1) provide acoustic pressure waves to multiple sample sites, (2) provide easily accessible electrical connections to each acoustic transducer 108 on an acoustic transducer array assembly, and (3) minimize unintended signal reflections that generate destructive interference while maximizing power transfer of the acoustic pressure waves. This figure illustrates the arrangement of multiple acoustic transducers 108 arranged in an 8 × 12 linear array within an acoustic transducer array assembly 100. The linear array of acoustic transducers can be easily incorporated into existing laboratory equipment that utilizes similar linear array patterns while providing acoustic pressure waves to multiple sample sites. Furthermore, each plated through-hole 104 located on the PCB 102 provides an accessible connection between the acoustic transducer 108 and the PCB 102. In addition, a matching layer 106 is configured to provide acoustic impedance matching between at least one piezoelectric element 114 and the acoustic impedance of the target sample.

[0054] Figure 3 shows an isometric view of the acoustic transducer 108 shown in Figure 1.

[0055] In this figure, the acoustic transducer 108 includes a PCB 102, plated through-holes 104, and a piezoelectric element 114. In this embodiment, the piezoelectric element 114 is a piezoelectric disk configured to receive an electrical voltage through a voltage potential between a signal electrode 110 and a ground electrode 111. The PCB 102 includes a first layer 102A and a second layer 102B. In one embodiment, the first layer 102A is configured to receive a voltage from the signal electrode 110 and carry the voltage to the piezoelectric element 114 through an electrical connection 112. The second layer 102B is configured to ground the acoustic transducer 108. In one embodiment, the acoustic transducer 108 includes a single acoustic transducer 108.

[0056] The acoustic transducer 108 further includes individual components, an acoustic lens 302, an acoustic transducer matching layer 304, and a piezoelectric backing material 306. The acoustic lens 302 is configured to focus acoustic waves onto a target at a desired location, using a desired frequency and amplitude. In some embodiments, the acoustic transducer matching layer 304 is provided in conjunction with the matching layer 106 to further adjust the acoustic impedance of the acoustic transducer array assembly 100. The piezoelectric backing material 306 is configured to absorb acoustic energy, reduce the reflection of acoustic pressure waves returning to the piezoelectric element 114, and focus the transmitted acoustic waves onto the front side of the piezoelectric element. In some embodiments, the assembly of the various components of the acoustic transducer 108 is achieved by connecting the layers with a liquid epoxy layer, which is a cured solid. In some embodiments, the piezoelectric backing material 306 includes tungsten powder and at least one of epoxy, conductive epoxy, and other polymers.

[0057] In addition, this figure includes a signal electrode 110 located on the upper side of the piezoelectric element 114. The electrical connection between the signal electrode 110 and the first layer 102A of the PCB is illustrated and described in more detail with respect to Figure 1. The electrical connection between the ground electrode 111 and the second layer 102B of the PCB is illustrated and described in more detail with respect to Figure 1.

[0058] Figure 4 shows an isometric view of the bottom of the acoustic transducer 108 shown in Figure 1.

[0059] This figure includes a similar component discussed in Figure 3. In addition, this figure includes a ground electrode 111 located on the bottom side of the piezoelectric element 114. The electrical connection between the signal electrode 110 and the first layer 102A of the PCB is illustrated and described in more detail with respect to Figure 1. The electrical connection between the ground electrode 111 and the second layer 102B of the PCB is illustrated and described in more detail with respect to Figure 1.

[0060] Figure 5 shows a cross-sectional view of the acoustic transducer 108 shown in Figure 3.

[0061] This figure includes many of the same components as those in Figure 3. The acoustic transducer 108 is located in a plated through-hole 104 of the PCB 102. The acoustic lens 302 is located on the front side of the acoustic transducer 108. The piezoelectric element 114 is located between two sections of the PCB 102, including a first layer 102A and a second layer 102B. The acoustic transducer matching layer 304 is located on the front side of the piezoelectric element 114, between the acoustic lens 302 and the piezoelectric element 114, and the piezoelectric backing material 306 is located on the back side of the piezoelectric element 114. In this configuration, the plated through-hole 104 is also used to position the components coaxially with the piezoelectric element 114 and to provide a receptacle for receiving the piezoelectric backing material 306 until it hardens.

[0062] Figure 6 shows an exploded view of the acoustic transducer array assembly of Figure 1, in which the piezoelectric element 114 includes a piezoelectric disk positioned in each plated through-hole 104.

[0063] The plated through-holes 104, PCB 102, and individual components (including the acoustic lens 302, the acoustic transducer matching layer 304, and the piezoelectric element 114) are similar to the components discussed above. The acoustic transducer array assembly 100 includes an acoustic transducer array assembly frame 502 and an acoustic transducer array assembly bracket 508 for securing components within the acoustic transducer array assembly 100 and for mounting the acoustic transducer array assembly 100 onto other devices in the assembly.

[0064] In this figure, the acoustic transducer array assembly 100 includes a plurality of signal electrodes 110 that are electrically connected to PCB 102A. In some embodiments, the signal electrodes 110 are electrically connected to PCB 102A using direct connections, such as soldered connections. In some embodiments, the signal electrodes 110 are electrically connected to PCB 102A using direct connection cables that are directly screw-fitted into PCB 102.

[0065] Furthermore, the acoustic transducer array assembly 100 includes an electrical connection 112 configured to provide an electrical voltage to the piezoelectric element 114. As illustrated, in some embodiments, the electrical connection 112 may include direct connections such as a plurality of conductive rings 308 configured to electrically connect to the PCB 102 around each plated through-hole 104. The piezoelectric element 114 expands and contracts as an electrical voltage is applied across the piezoelectric element 114 from the electrical connection 112, producing an acoustic wave. The acoustic wave is focused onto a desired target using an acoustic lens 302 described and illustrated in Figures 3-5. Furthermore, each acoustic transducer 108 may include an acoustic transducer matching layer 304 to provide acoustic impedance matching between at least one piezoelectric element 114 and the acoustic impedance of the target sample. Each element of the acoustic transducer is fixed to the front side of the acoustic transducer array assembly by the upper layer of the PCB 102 and the acoustic transducer array assembly frame 502.

[0066] Figure 7 shows a side isometric view of the acoustic transducer array assembly 100 of Figure 6. This figure includes the same components as in Figure 6 and illustrates the layers of each component of the acoustic transducer array assembly 100 from the side view. In some embodiments, the assembly of the various components of the acoustic transducer 108 is achieved by connecting the layers with liquid epoxy layers, which are cured solids.

[0067] Figure 8 shows a cross-sectional view of the acoustic transducer array assembly 100 of Figures 6-7. The cross-sectional view includes an acoustic transducer 108, which is centered in the figure. The acoustic transducer 108 includes many of the same components discussed above. In some embodiments, the piezoelectric element 114 receives an electrical voltage between a signal electrode 110 electrically connected to a first layer 102A of the PCB and a ground electrode 111 electrically connected to a second layer 102B of the PCB. The electrical voltage passes through the conductive ring 308, across the piezoelectric backing material 306, to the piezoelectric element 114 (shown here as a piezoelectric disk). The piezoelectric element 114 then expands and / or contracts as the electrical voltage is received. The expansion / contraction of the piezoelectric element 114 generates an acoustic pressure wave, which travels through the acoustic transducer matching layer 304, matching the impedance of the piezoelectric element 114 with that of the target sample. The acoustic pressure wave is then focused toward the desired target by the acoustic lens 302. Additional acoustic pressure waves propagating in the opposite direction from the back side of the piezoelectric element 114 are absorbed by the piezoelectric backing material 306.

[0068] Figure 9 shows a cross-sectional view of the acoustic transducer array assembly 100 of Figures 6-8, including a matching layer 106 integrated into the PCB 102. In some embodiments, it is desirable to include a matching layer 106 integrated into the PCB 102 that minimizes signal reflection while maximizing power transfer of acoustic pressure waves. Furthermore, the integrated matching layer 106 provides the desired impedance matching quality without the need to provide an additional impedance matching layer. In some embodiments, the integrated matching layer 106 comprises at least one of polyimide or polyester. In some embodiments, the matching layer 106 is integrated into a second layer 102B of the PCB that acts as a ground layer. In some embodiments, the piezoelectric element 114 is located below the PCB 102 and the integrated matching layer 106.

[0069] Figure 10 shows an exploded view of another embodiment of the acoustic transducer array assembly 100 of Figure 1, in which the piezoelectric element 114 includes a piezoelectric plate and a flexible circuit. In some embodiments, the flexible circuit may replace the PCB 102.

[0070] This figure includes many of the same elements as the acoustic transducer array assembly 100 discussed in Figures 1-9, including the acoustic transducer array assembly bracket 508, the signal electrode 110, the first layer 102A of the PCB, the conductor ring 308, the plated through-hole 104, the piezoelectric backing layer 306, and the second layer 102B of the PCB in the form of a flexible circuit that crosses the piezoelectric element 114 and serves as a grounding layer for the electrical voltage field.

[0071] Furthermore, the figure includes at least one piezoelectric element 114, which is shown as a piezoelectric plate. The piezoelectric plate is supported by a non-conductive alumina or epoxy backing material 902, which also contacts a conductive ring 308. The alumina or epoxy backing material 902 is placed between the conductive rings 308, which are filled with a conductive backing material 306 to prevent short circuits in the voltage field between the signal electrodes 110. In some embodiments, the conductive backing material includes tungsten metal or conductive epoxy. Furthermore, the piezoelectric plate is fixed on the front side of the piezoelectric plate using an acoustic transducer array assembly frame 502. The acoustic transducer array assembly frame 502 is electrically connected to the second layer 102B of the PCB in the form of a flexible circuit that acts as a ground layer. In some embodiments, the matching layer 106 is located above the second layer 102B of the PCB and provides acoustic impedance matching to the target sample for acoustic pressure waves generated by the expansion and contraction of the piezoelectric plate.

[0072] Figure 11 shows a side isometric view of the acoustic transducer array assembly of Figure 10. This figure includes similar components described above. In some embodiments, the assembly of the various components of the acoustic transducer array assembly 100 is achieved by connecting layers with liquid epoxy, which is a cured solid.

[0073] Figure 12 shows an exploded view of another embodiment of the acoustic transducer array 100 of Figure 1, the acoustic transducer array 100 including at least one connector 1101, and the piezoelectric element 114 including a piezoelectric disk positioned in each plated through-hole 104.

[0074] In this figure, the acoustic transducer array 100 includes many of the same components as in Figures 6-8, including a second layer 102B of the PCB 102 in the form of a flexible circuit that serves as a ground layer, an acoustic transducer array assembly frame 502, a piezoelectric element 114, a second layer of the PCB 102 that serves as a signal connection layer, and individual piezoelectric backing layers 306.

[0075] In addition, in this figure, the acoustic transducer array 100 includes at least one connector 1101. In one embodiment, the connector 1101 includes electrical connector pins for electrically connecting the PCB 102 in the second layer 102B to the first end 1107. The electrical connector pins provide an electrical voltage to the second layer 102B, and the second layer 102B electrically connects various components to the second layer 102B through the PCB traces. In one embodiment, the at least one connector 1101 includes 64 electrical connector pins for connecting the piezoelectric element 114 and the signal electrode 110 to a multiplexing electronic device (not shown). In one embodiment, the at least one connector 1101 includes two connectors 1101 located on the opposite end of the second layer 102B. In one embodiment, the connector 1101 includes a receptacle 1103.

[0076] In addition, in this figure, the acoustic transducer array 100 includes a spacer 1105 to provide a gap between the first layer 102A and the second layer 102B. In one embodiment, the spacer 1105 allows the piezoelectric element 114 to be positioned in a precise lateral position within the plated through-hole 104 of the PCB 102. In one embodiment, the spacer 1105 has a thickness substantially identical to that of the piezoelectric element 114.

[0077] Figure 13 is a side exploded view of the acoustic transducer array assembly shown in Figure 12. This figure includes similar components described above. In some embodiments, the assembly of the various components of the acoustic transducer array assembly 100 is achieved by connecting layers with liquid epoxy, which is a cured solid.

[0078] Figure 14 shows a cross-sectional view of the acoustic transducer array assembly of Figure 12. This figure includes a piezoelectric element 114, a piezoelectric backing material 306, a first layer 102A of PCB 102 acting as a signal-conductive layer, a second layer 102B of PCB 102 acting as a ground layer, and a spacer 1105, which are similar components to those described above.

[0079] Figure 15 shows an exploded view of another embodiment of the acoustic transducer array assembly 100 of Figure 12, which includes an acoustic transducer individual matching layer 304 and a lens 302.

[0080] Figure 16 shows a side isometric view of the acoustic transducer array assembly of Figure 15. This figure includes similar components described above. In some embodiments, the assembly of the various components of the acoustic transducer array assembly 100 is achieved by connecting layers with liquid epoxy, which is a cured solid.

[0081] Figure 17 shows a cross-sectional view of the acoustic transducer array assembly of Figure 15. This figure includes a piezoelectric element 114, a piezoelectric backing material 306, a first layer 102A of PCB 102 acting as a signal-conducting layer, a second layer 102B of PCB acting as a ground layer, a spacer 1105, a lens 302, and an acoustic transducer matching layer 304, the spacer 1105 being for providing precise lateral positioning of the piezoelectric disk and the plated through-holes 104 of PCBs 102A and 102B.

[0082] Figure 18 shows a block diagram of the acoustic transducer 108, where various acoustic connections are arranged in parallel.

[0083] In this figure, the acoustic transducer 108 includes similar components discussed above. The acoustic components within the acoustic transducer 108 are arranged in parallel, and the acoustic pressure wave produced by the piezoelectric element 114 can pass through a signal connection in the plated through-hole 104 and through an integrated layer including either the piezoelectric backing material 306 or the acoustic matching material 304. The signal electrode 110 and the ground electrode 111 are electrically connected to the PCB 102 in the first layer 102A and the second layer 102B, respectively. The first layer 102A and the second layer 102B each include an annular ring surrounding the acoustic matching layer 304 and the piezoelectric backing layer 306, respectively. Furthermore, the acoustic transducer 108 includes the signal electrode 110 and the ground electrode 111, which are electrically connected to the opposing ends of the piezoelectric element 114. Furthermore, the first layer 102A includes a piezoelectric backing layer 306, and the second layer 102B includes an acoustic matching layer 304.

[0084] Figure 19 shows a block diagram of the acoustic transducer 108, where various acoustic connections are arranged in series.

[0085] In this figure, the acoustic transducer assembly 100 includes similar components discussed above. The acoustic components within the acoustic transducer 108 are arranged in series, and the acoustic pressure wave produced by the piezoelectric element 114 can pass through multiple layers, including signal connections in conductive pads 105 on the PCB 102 and either piezoelectric backing material 306 or acoustic matching material 304. The signal electrode 110 and the ground electrode 111 are electrically connected to the PCB 102 in the conductive pads 105 on the PCB 102, in the first layer 102A and the second layer 102B, respectively.

[0086] Figure 20 shows a bottom view of PCB102 or flexible circuit, illustrating the first layer of PCB102A or flexible circuit having multiple column multiplexed traces 1200.

[0087] The column multiplexing trace 1200 provides electrical connections between acoustic transducers 108 located within a single column on the transducer array assembly 100. In one embodiment, the column multiplexing trace 1200 provides an electrical voltage to one acoustic transducer 108 at once. In another embodiment, the column multiplexing trace 1200 provides an electrical voltage to acoustic transducers continuously along the column multiplexing trace 1200. In one embodiment, it may be desirable to energize a single acoustic transducer 108 within the column multiplexing trace 1200 without energizing neighboring acoustic transducers, thereby preventing destructive interference from acoustic pressure waves from neighboring acoustic transducers 108.

[0088] In one embodiment, the transducer array assembly 100 includes 8 or 12 rows of multiplexing traces 1200 configured to provide electrical connections to an acoustic transducer array assembly having an 8 × 12 array of acoustic transducers 108. In another embodiment, the transducer array assembly 100 includes 16 or 24 rows of multiplexing traces 1200 configured to provide electrical connections to an acoustic transducer array assembly having a 16 × 24 array of acoustic transducers 108.

[0089] Figure 21 shows a bottom view of PCB 102 or flexible circuit, illustrating the first layer of PCB 102A or flexible circuit having multiple row multiplexed traces 1202.

[0090] The row multiplexing trace 1202 provides electrical connections between acoustic transducers 108 located within a single row on the transducer array assembly 100. In one embodiment, the row multiplexing trace 1202 provides an electrical voltage to one acoustic transducer 108 at once. In another embodiment, the row multiplexing trace 1202 provides an electrical voltage to acoustic transducers sequentially along the row multiplexing trace 1202. In one embodiment, it may be desirable to energize a single acoustic transducer 108 within the row multiplexing trace 1202 without energizing neighboring acoustic transducers, thereby preventing destructive interference from acoustic pressure waves from neighboring acoustic transducers 108.

[0091] In one embodiment, the acoustic transducer array assembly 100 includes eight or twelve rows of multiplexing traces 1202 configured to provide electrical connections to an acoustic transducer array assembly having an eight × l² array of acoustic transducers 108. In another embodiment, the transducer array assembly 100 is configured to provide electrical connections to sixteen or twenty-four rows of multiplexing traces 1202 including an acoustic transducer array assembly having an l⁶ × 24 array of acoustic transducers 108. In yet another embodiment, the transducer array assembly 100 includes more than 24 rows or columns containing column multiplexing traces 1200 and / or row multiplexing traces 1202.

[0092] In one embodiment, the column multiplexing trace 1200 and the row multiplexing trace 1200 provide the ability to excite any single acoustic transducer 108 located on the acoustic transducer array assembly 100 by providing specific columns and rows for supplying electrical energy.

[0093] In some embodiments, it is desirable to utilize column-multiplexed traces 1200 or row-multiplexed traces 1202 to reduce the number of PCB traces required to electrically connect to the acoustic transducers 108 located in each plated through-hole 104. Furthermore, in some embodiments, the use of column-multiplexed traces 1200 or row-multiplexed traces 1202 reduces the cost of assembling the acoustic transducer array assembly 100. Moreover, in some embodiments, the use of column-multiplexed traces 1200 or row-multiplexed traces 1202 reduces the time required to assemble the acoustic transducer array assembly 100.

[0094] Figure 22 shows a flowchart of a method for providing an acoustic pressure wave to at least one sample location 1400.

[0095] Method 1400 includes a first step 1402 of providing an acoustic transducer array assembly 100 including at least one piezoelectric element 114, the at least one piezoelectric element 14 receiving an electrical voltage between at least one signal electrode 110 and at least one ground electrode 111.

[0096] The method includes a second step 1404 of providing a voltage to at least one piezoelectric element 114 using at least one signal electrode 110 and at least one ground electrode 111. In some embodiments, the at least one signal electrode 110 and at least one ground electrode 111 provide a voltage to at least one piezoelectric element 114 at a single location. In some embodiments, the at least one signal electrode 110 and at least one ground electrode 111 provide a voltage to at least one piezoelectric element 114 at multiple locations.

[0097] The method includes a third step 1406 of converting a voltage into an acoustic pressure wave using at least one piezoelectric element 114. The at least one piezoelectric element 114 is configured to receive a voltage from a signal electrode 110 and a ground electrode 111, and to expand or contract to produce an acoustic pressure wave.

[0098] The method includes a fourth step 1408 of projecting an acoustic pressure wave onto at least one sample location, wherein at least one signal reflection of the acoustic pressure wave is minimized due to acoustic impedance matching between at least one piezoelectric element 114 and the acoustic impedance of the target sample. In one embodiment, the acoustic pressure wave generated by the acoustic transducer array assembly 100 is transmitted within the electronic system 1500, as shown in Figure 24. In this embodiment, it is desirable to maximize the desired signal reflection, which is amplified by the signal receiving amplifier 1514 and transmitted to the multiplexer 1502 when the switch 1504 is in the receiving position. In this embodiment, it is desirable to minimize unintended signal reflection caused by impedance mismatch between adjacent layers or interfaces. In some embodiments, acoustic impedance matching is achieved by providing a matching layer 106 or an acoustic transducer matching layer 304 for each individual acoustic transducer 108.

[0099] Figure 23 shows a schematic diagram of the electronic system 1500 for operating the acoustic transducer array assembly 100.

[0100] The acoustic transducer array assembly 100 provides an acoustic pressure wave to a target sample, as discussed above. Furthermore, the acoustic transducer array assembly 100 transmits and receives signals from the multiplexer 1502. In one embodiment, an input voltage signal including a frequency range of 1 MHz to 20 MHz is provided to the acoustic transducer array assembly.

[0101] The multiplexer 1502 is configured to receive input signals from the acoustic transducer array assembly 100 or to provide output signals to the acoustic transducer array assembly 100. The multiplexer 1502 can transfer selected signals received from the acoustic transducer array or signal receiving amplifier 1514 to output lines in the electronic system 1500. In one embodiment, the multiplexer 1502 may combine multiple input signals into a single output signal. In one embodiment, the multiplexer 1502 may be implemented using logic gates.

[0102] The signal output from the multiplexer 1502 is received by a switch 1504 that determines whether to transmit the signal received from the multiplexer 1502 to the signal transmission amplifier 1506, or to transmit the signal received from the signal reception amplifier 1514 to the multiplexer 1502. In one embodiment, the switch 1504 includes an RX switch and / or a transmit / receive (TR) switch.

[0103] The signal transmission amplifier 1506 is configured to receive a signal from the multiplexer 1502 when the switch 1504 is in the signal transmission position. The signal transmission amplifier 1506 increases the amplitude of the signal received by the multiplexer 1502 and transmits the signal to the signal capture device 1508.

[0104] The signal acquisition device 1508 captures the electronic signal received by the signal transmission amplifier 1506 and converts the analog signal into a digital signal. It is desirable that the signal acquisition device 1508 converts real-world signals (audio, video, or other sensor data, etc.) into digital signals that can be processed by the computing device 1510.

[0105] The computing device 1510 receives a signal from the signal acquisition device and processes the signal before transmitting it to the analog signal generation device 1512. In some embodiments, the signal includes a chirp signal or a pulse signal. In some embodiments, the chirp signal or pulse signal includes a square voltage signal.

[0106] In one embodiment, the computing device 1510 includes at least one processing device, such as a central processing unit (CPU). In another embodiment, the computing device also includes system memory and a system bus that connects various system components, including the system memory, to the processing device. The system bus is one of any number of bus structures, including a memory bus or memory controller, a peripheral bus, and a local bus, using any of the various bus architectures.

[0107] System memory includes read-only memory and random-access memory. Basic input / output systems containing basic routines that operate to transport information within the computing device, such as during startup, are typically stored in read-only memory. Some embodiments include non-transient media. In addition, such computer-readable storage media may include local storage or cloud-based storage.

[0108] In some embodiments, the user provides input to the computing device 1510 through one or more input devices. These inputs may include commands for generating signals in the acoustic transducer array assembly 100. The input devices are often connected to the processing device through input / output interfaces coupled to a system bus. These input devices can be connected by any number of input / output interfaces, such as parallel ports, serial ports, game ports, or a universal serial bus. Wireless communication between the input devices and interfaces is also possible and, in some possible embodiments, includes infrared, Bluetooth® wireless technology, 802.1la / b / g / n, cellular, or other radio frequency communication systems.

[0109] Computer-readable storage media include volatile and non-volatile removable and non-removable media implemented within any device configured to store information such as computer-readable instructions, data structures, program modules, or other data. Computer-readable storage media also include, but are not limited to, random-access memory, read-only memory, electrically erasable programmable read-only memory, flash memory or other memory technologies, compact disk read-only memory, digital multipurpose disks or other optical storage, magnetic cassettes, magnetic tapes, magnetic disk storage or other magnetic storage devices, or any other media that may be used to store desired information and may be accessed by a computing device. Computer-readable storage media do not include computer-readable communication media.

[0110] The analog signal generation device 1512 receives the digital signal produced by the computing device 1510 and converts the digital signal into an analog signal. In one embodiment, the analog signal generation device 1512 generates an analog waveform, such as an audio signal or a control signal, from the digital data.

[0111] The signal receiving amplifier 1514 is configured to receive an analog signal from the analog signal generating device 1512 when the switch 1504 is in the signal receiving position, amplify the signal, and transmit the signal to the multiplexer 1502.

[0112] The above description is illustrative and not limiting. Many modifications of the invention will become apparent to those skilled in the art upon closer examination of this disclosure. The scope of the invention should therefore not be determined by reference to the above description, but rather by reference to the pending claims together with their full scope or equivalents.

[0113] One or more features from any embodiment may be combined with one or more features from any other embodiment without departing from the scope of the present invention.

Claims

1. An acoustic transducer array assembly configured to provide an acoustic pressure wave to at least one sample location, A printed circuit board, At least one plated through-hole, A matching layer comprising an acoustic medium configured to provide acoustic impedance matching between at least one piezoelectric element and the acoustic impedance of a target sample. Printed circuit boards, At least one acoustic transducer, At least one signal electrode is electrically connected to the at least one plated through-hole and acoustically coupled to the matching layer, At least one ground electrode electrically connected to the at least one plated through-hole and acoustically coupled to the matching layer, The at least one piezoelectric element electrically connected to the at least one signal electrode and the at least one ground electrode, wherein the at least one piezoelectric element is configured to produce the acoustic pressure wave when an electrical voltage between the at least one signal electrode and the at least one ground electrode is applied to the piezoelectric element. including at least one acoustic transducer and An acoustic transducer array assembly comprising:

2. The acoustic transducer array assembly according to claim 1, wherein the matching layer comprises a polymer material.

3. The acoustic transducer array assembly according to claim 2, wherein the polymer material comprises at least one of polyimide, polyester, polyphenylene oxide, or polypropylene.

4. The acoustic transducer array assembly according to any one of claims 1 to 3, wherein the printed circuit board includes a plurality of plated through-holes arranged in a linear array.

5. The acoustic transducer array assembly according to claim 4, wherein the at least one acoustic transducer includes a plurality of signal electrodes arranged in the linear array, a plurality of ground electrodes, and a plurality of piezoelectric elements.

6. The acoustic transducer array assembly according to claim 5, wherein the linear array includes a matrix configuration having at least one column and at least one row, the at least one column including the plurality of signal electrodes electrically connected in series, the plurality of ground electrodes, and the plurality of piezoelectric elements.

7. The acoustic transducer array assembly according to claim 5, wherein the linear array includes a matrix configuration having at least one column and at least one row, the at least one row including the plurality of signal electrodes electrically connected in parallel, the plurality of ground electrodes, and the plurality of piezoelectric elements.

8. The acoustic transducer array assembly according to any one of claims 1 to 7, wherein the printed circuit board includes a positive side and a negative side.

9. The acoustic transducer array assembly according to any one of claims 1 to 8, wherein the acoustic connections within the acoustic transducer are arranged in series.

10. The acoustic transducer array assembly according to any one of claims 1 to 9, wherein the acoustic connections within the acoustic transducer are arranged in parallel.

11. The acoustic transducer array assembly according to any one of claims 1 to 10, wherein the at least one piezoelectric element includes at least one piezoelectric disk.

12. The acoustic transducer array assembly according to any one of claims 1 to 11, wherein the at least one piezoelectric element includes at least one piezoelectric plate.

13. A method for providing an acoustic pressure wave to at least one location, the method being To provide an acoustic transducer array assembly, the acoustic transducer array assembly is A printed circuit board comprising at least one plated through-hole and at least one matching layer comprising an acoustic medium configured to provide acoustic impedance matching between at least one piezoelectric element and at least one target sample, At least one acoustic transducer comprising at least one signal electrode electrically connected to the at least one plated through-hole and acoustically connected to the at least one matching layer, at least one ground electrode electrically connected to the at least one plated through-hole and acoustically connected to the at least one matching layer, and at least one piezoelectric element electrically connected to the at least one signal electrode and the at least one ground electrode, and This includes, Applying an electrical voltage between the at least one signal electrode and the at least one ground electrode to the at least one piezoelectric element, Converting the aforementioned electrical voltage into the aforementioned acoustic pressure wave, Projecting the aforementioned acoustic pressure wave to the at least one location, wherein at least one signal reflection of the acoustic pressure wave is minimized due to the acoustic impedance matching. Methods that include...

14. The method according to claim 13, wherein the at least one matching layer comprises a polymer material.

15. The method according to claim 14, wherein the polymer material comprises at least one of polyimide, polyester, polyphenylene oxide, or polypropylene.

16. The method according to any one of claims 13-15, wherein the printed circuit board includes a plurality of plated through-holes arranged in a linear array and a plurality of acoustic transducers configured to engage with the plurality of plated through-holes.

17. The method according to any one of claims 13-16, further comprising projecting the acoustic pressure wave onto the at least one location in sequence using a plurality of acoustic transducers.

18. A method for fabricating an acoustic transducer array assembly, wherein the method is: The present invention provides an acoustic transducer array assembly comprising a printed circuit board including at least one plated through-hole and at least one matching layer configured to provide acoustic impedance matching between at least one piezoelectric element and at least one target sample, At least one signal electrode is electrically connected to the acoustic transducer array assembly, and at least one signal electrode is acoustically connected to the at least one matching layer, At least one ground electrode is electrically connected to the acoustic transducer array assembly, and the at least one ground electrode is acoustically connected to the at least one matching layer, The at least one piezoelectric element is electrically connected to the at least one signal electrode and the at least one ground electrode. Methods that include...

19. The method according to claim 18, further comprising enclosing the acoustic transducer array assembly within an enclosure.

20. The method according to any one of claims 18-19, further comprising acoustically connecting at least one piezoelectric backing material to the back side of the at least one piezoelectric element.

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