Manufacturing method for a board material having a three-dimensional wood grain pattern on its surface

Abstract

The object of the present invention is to solve the problem in the prior art of insufficient accuracy in matching the three-dimensional solid wood grain layer on the surface of a board material with the underlying wood grain layer, and to achieve more accurate visual and tactile correspondence. The present invention relates to the field of surface structure manufacturing, and more particularly to a method for manufacturing a board material having a three-dimensional solid wood grain on its surface, and the method includes at least the following steps: acquiring a wood grain pattern and processing it to extract a wood surface database, the database including at least an underlying wood grain print dataset and a three-dimensional wood grain print dataset. A first printing device outputs to the board material surface using the underlying wood grain print dataset to obtain an underlying wood grain layer that matches the wood grain pattern. A second printing device outputs a wood grain precursor liquid above the underlying wood grain layer using the three-dimensional wood grain print dataset to obtain a wood grain precursor that matches the wood grain. This application makes it possible to obtain a three-dimensional solid wood grain layer that perfectly matches the underlying wood grain layer on the board material surface through the corresponding cooperative relationship between the underlying wood grain print dataset and the three-dimensional wood grain print dataset, thereby effectively improving the accuracy of matching the two.

Description

Technical Field

[0001] The present invention relates to the field of manufacturing surface structures, and particularly to a method for forming a three-dimensional solid wood grain pattern on the surface of a board material.

Background Art

[0002] Currently, in the field of board material manufacturing, manufacturers can use advanced technologies and materials to create products with a visual and tactile feel similar to natural wood, using artificial board materials or non-wood board materials as the base material. These products are expected to have better performance and durability, meeting consumers' demands for high-quality, low-maintenance, and low-cost products. In addition, these products similar to natural wood can reduce dependence on natural resources and promote environmental protection and sustainable development.

[0003] In order to obtain a texture similar to natural wood on the surface of artificial board materials or non-wood board materials, manufacturers usually adopt the following methods:

[0004] 1. Printing technology: Using high-resolution printing technology to print the texture pattern of natural wood on the surface of the board material;

[0005] 2. Veneer facing: Attaching a thin wood board to the surface of the board material to imitate the appearance and texture of natural wood;

[0006] 3. Coating technology: Forming a texture and color similar to natural wood on the surface of the board material through a special coating process.

[0007] These methods can imitate the appearance and texture of natural wood to a certain extent, but there are also certain defects. For example: Printing technology cannot completely replicate the texture of natural wood; Veneer facing is easily deformed or cracked by moisture; Coating technology may have an adverse impact on the environment.

[0008] The patent with publication number CN 101659073 B discloses a wood grain treatment process for the surface of a waterproof flooring substrate, which involves printing a simulated wood grain onto the surface of the wood-plastic flooring and then adding an abrasion-resistant layer on top of the simulated wood grain to protect the wood grain pattern and maintain the wood grain texture effect for a long period of time. However, boards with only a two-dimensional planar image printed on the surface like this cannot satisfy people's demand for a more realistic combination of sight and touch.

[0009] Therefore, forming a three-dimensional wood grain pattern on the surface of a board that corresponds to a two-dimensional planar image and more closely resembles the feel of wood is currently attracting widespread attention in this field.

[0010] In the prior art, several different technical methods have been proposed for forming a three-dimensional structure on the surface of a substrate. The usual methods include three types: the mold press method, the upper lamination method, and the lower indentation method.

[0011] Traditional mold pressing methods reproduce printed structures on sheet material by pressing with a mold, roller, or belt. This method can be carried out by pressing onto incompletely cured resin, thermoplastic material, or photocrosslinked resin, while simultaneously performing radiation and photopolymerization.

[0012] For technologies related to the mold pressing method, please refer to the following patents:

[0013] The patent with publication number CN115027117A discloses reinforced wood-textured flooring, which includes a foam core having a shell body and an adhesive distributed on the surface of the shell body, the shell body being formed from a first-color resin and the adhesive on the surface of a second-color resin. During the manufacturing process, embossing is performed with an embossing roller, and a portion of the second-color resin layer is pressed into the surface below the shell body, so that the shell body and the second-color resin layer together present a wood texture.

[0014] The patent with publication number CN115122452A discloses a method for manufacturing highly imitation rare wood species flooring, which involves using a laser engraving method to engrave a 3D texture onto a steel plate of a flat press or a roller cylinder of a roller coating machine, and then pressing the texture onto a base material to produce aesthetically pleasing high-grade wood flooring with a highly imitation rare wood species grain pattern.

[0015] The top lamination method uses a resin material as a base and laminates it layer by layer using a printing or printing method, ultimately forming a flooring with a three-dimensional structure through a continuous lamination process.

[0016] For technologies related to the upward stacking method, please refer to the following patents:

[0017] The patent with publication number CN 112455110 A discloses a process for manufacturing wood flooring using inkjet printing. The patent describes how additive ink can be continuously printed onto a printed pattern texture to form a raised, three-dimensional wood grain pattern on the pattern texture surface.

[0018] The downward recession method involves spraying a layer of an inhibitory substance that inhibits or delays the polymerization of the unsolidified resin onto its surface. After the subsequent resin solidification process, the resin in the areas containing the inhibitory substance remains liquid. In subsequent processing steps, these liquid resins are simply brushed downwards to remove them, thereby forming a downward-concave three-dimensional structure.

[0019] For technologies related to the downward sinking method, please refer to the following patents:

[0020] The patent with publication number CN 110177691 B discloses a method and apparatus for producing an emboss on a substrate using digital printing technology, the method comprising applying an embossing liquid onto a non-polymerized resin layer, performing subsequent polymerization of the resin using UV curing, and then removing the embossing liquid to form a three-dimensional surface.

[0021] The patent with publication number CN 112739463 A discloses a novel method and apparatus for generating a surface structure, comprising the following steps: A) applying resin A to a material surface; B) applying liquid B to at least a portion of resin A while resin A is in a liquid or partially solid state; C) polymerizing resin A and liquid B, respectively; D) removing the polymerized liquid B.

[0022] The patent, publication number CN 112996649 A, discloses a method for manufacturing a three-dimensional structure on a flat substrate surface, the resulting substrate, and a substrate production apparatus based on the method, wherein a material for forming wood grain joints is dropped onto the substrate surface in advance, a solidifiable resin is then applied to areas of the substrate surface not covered by the material for forming wood grain joints, the material for forming wood grain joints is removed after the resin has solidified, and wood grain joints are formed in the solidified resin.

[0023] Currently, when measuring the degree of similarity between a three-dimensional wood grain pattern and a natural wood grain pattern, the dimensions usually considered are as follows: (1) the similarity between the width and depth of the three-dimensional wood grain pattern and the natural wood grain pattern; and (2) the degree of correspondence between the three-dimensional wood grain pattern and the two-dimensional planar structure of the base. However, regardless of whether the mold press method, the top lamination method, or the bottom indentation method is adopted, there are unavoidable defects. For example, the main focus of the published prior art is on how to form a three-dimensional wood grain pattern that has a high degree of similarity to a natural wood grain pattern, meaning that the prior art can only solve the first dimension described above. On the other hand, the prior art does not provide a good solution for how to better correspond the three-dimensional wood grain pattern and the two-dimensional planar structure of the base, and therefore defects such as inaccurate alignment are likely to occur during the board manufacturing process, ultimately leading to problems of visual and tactile discrepancies. Furthermore, in the process of manufacturing flooring with a three-dimensional structure using the mold press method, the mold is prone to wear during operation, resulting in a short service life for the mold, differences in the surface structure of the flooring between different batches, and ultimately higher flooring manufacturing costs.

[0024] Therefore, in order to obtain a three-dimensional stereoscopic wood grain pattern with a high degree of similarity to the natural wood grain pattern, not only should we consider a method of preparing a three-dimensional stereoscopic structure similar to the natural wood structure, but we also need to consider more a method of corresponding the bottom two-dimensional planar image with the three-dimensional stereoscopic structure. Only by considering simultaneously the forming effect of the three-dimensional stereoscopic structure and the correspondence between the three-dimensional stereoscopic structure and the bottom two-dimensional planar image can we obtain the key to getting a texture similar to natural wood on the surface of artificial board materials or non-wood board materials. However, among the currently published technologies, no relevant precedents can be found. Summary of the Invention

[0025] In order to overcome the defect in the prior art that it is difficult to form a three-dimensional stereoscopic wood grain pattern on the surface of a board material and to correspond it with the bottom printed image, the present invention provides a method for manufacturing a board material having a three-dimensional stereoscopic wood grain pattern on its surface, and effectively solves the problem of inaccurate matching between the three-dimensional stereoscopic wood grain pattern and the bottom printed image.

[0026] In order to achieve the above invention object, the present invention is realized by the following technical solutions:

[0027] In the first aspect, the present invention first provides a method for manufacturing a board material having a three-dimensional stereoscopic wood grain pattern on its surface, including at least the following steps:

[0028] (S.1) Obtaining wood grain information, processing it, and extracting a wood surface database;

[0029] The database includes at least a lower-layer wood grain printing dataset and a three-dimensional wood grain printing dataset;

[0030] Here, the three-dimensional wood grain printing dataset includes a two-dimensional stereoscopic wood grain printing shape data subset corresponding to the lower-layer wood grain printing dataset, and a stereoscopic wood grain printing depth data subset corresponding to the stereoscopic wood grain printing shape data subset;

[0031] (S.2) Assigning the lower-layer wood grain printing dataset to a first printing device;

[0032] Assigning a three-dimensional wood grain print dataset to a second printing device;

[0033] (S.3) Using the first printing apparatus, output the lower wood grain print data set onto the surface of the board material to obtain a lower wood grain layer that matches the wood grain information;

[0034] (S.4) Using the second printing apparatus, output a wood grain precursor liquid using the three-dimensional wood grain printing dataset to obtain a wood grain precursor that forms a three-dimensional solid wood grain and conforms to the lower wood grain layer, and the height of the wood grain precursor (i.e., the distance between the upper end surface and the lower end surface of the wood grain precursor) corresponds to a subset of three-dimensional wood grain printing depth data with different values.

[0035] The applicant of this invention has conducted extensive and in-depth research on natural wood panels and has discovered that natural wood materials vary to varying degrees in color, grain pattern, and surface structure depending on the type of wood and growing environment. Consequently, the visual and tactile effects that each natural wood panel can present also differ. Based on this discovery, in order to create a more realistic three-dimensional wood grain pattern on the surface of an artificial panel, it is necessary to consider the visual similarity between a two-dimensional planar structure and a natural wood grain pattern, as well as the visual and tactile similarity between a three-dimensional structure and a natural wood grain pattern.

[0036] Conventional techniques have numerous methods for forming a two-dimensional underlay wood grain layer on the surface of artificial board material, such as printing processes and high-precision printing processes. These processes can accurately reproduce the color and grain pattern of genuine natural wood material, and can make these patterns visually closer to natural wood grain. However, obtaining a three-dimensional, three-dimensional wood grain pattern on top of the underlay wood grain layer, whose shape conforms to the underlay wood grain layer and whose tactile feel is close to that of natural wood grain, is a challenge in this field.

[0037] Typically, to form a three-dimensional wood grain pattern on a board surface, the shape of the two-dimensional underlying wood grain layer to be printed is first referenced. Based on this two-dimensional underlying wood grain layer, the board to be printed is modeled, and the printing device prints based on the established three-dimensional model, obtaining a three-dimensional wood grain pattern that matches the wood grain shape and the length, width, and depth of the target model. In this mode, a single three-dimensional model corresponds to only one type of board with a specific two-dimensional underlying wood grain layer. If it is necessary to change any variable of the board formation independently, the model must be redrawn and adjusted. This method of forming a three-dimensional wood grain pattern has low flexibility, making it difficult to adapt the board to the pattern in a short time, resulting in high production costs. Therefore, companies that manufacture boards with three-dimensional wood grain patterns on their surfaces using this traditional method usually have a single product line, making it difficult to meet customization demands based on customer requirements.

[0038] To overcome the shortcomings of the prior art described above, the applicant of this invention conducted further in-depth research on planar underlayer wood grain and three-dimensional wood grain patterns. After studying the planar underlayer wood grain, the applicant discovered that the elements forming the underlayer wood grain typically include the base color of the wood grain and the wood grain shape set on the base color, and that by simply combining the base color and wood grain shape of the typical wood grain, wood grain patterns suitable for different wood materials can be formed. On the other hand, after in-depth research on three-dimensional wood grain patterns, the applicant discovered that the elements forming the three-dimensional wood grain pattern typically include the wood grain shape and depth corresponding to different wood grain shapes, and that by combining the wood grain shape with different depth information, a three-dimensional wood grain pattern closer to the natural wood grain structure can be constructed.

[0039] Therefore, based on the above findings, the present invention analyzes and processes information including natural wood grain patterns, classifies and organizes the formation parameters of natural wood grain patterns, and obtains a lower layer wood grain print dataset and a three-dimensional wood grain print dataset, compared to the prior art. Of these, the lower layer wood grain print dataset records data information for controlling the formation of the lower layer wood grain, and the three-dimensional wood grain print dataset records data information for controlling the formation of a three-dimensional solid wood grain pattern. Furthermore, since the three-dimensional wood grain print dataset of this application includes a subset of two-dimensional solid wood grain print shape data corresponding to the lower layer wood grain print dataset, after the information regarding the lower layer wood grain printing is determined, it is possible to select three-dimensional wood grain shape data that matches the shape and size of the lower layer wood grain from the two-dimensional solid wood grain print shape data subset, thereby effectively realizing the correspondence between the shape and position of the lower layer wood grain and the upper three-dimensional solid wood grain pattern, and avoiding the problem of inaccurate alignment between the two.

[0040] Furthermore, after the shape of the three-dimensional wood grain pattern is determined, a subset of three-dimensional wood grain printing depth data is called up to assign one or more wood grain depths to each different shape of wood grain, ensuring that different shapes of three-dimensional wood grain patterns correspond to different depths. These depths can be varied according to the different shapes of three-dimensional wood grain patterns, better matching the structure of natural wood grain patterns and increasing the similarity between the resulting three-dimensional wood grain pattern and natural wood grain patterns.

[0041] Therefore, by the method described in this application, a three-dimensional wood grain pattern similar to that of natural wood boards can be obtained on the surface of artificial or non-wood boards, and by processing the wood grain information as data, the lower wood grain layer printing process and the three-dimensional wood grain pattern printing process above the lower wood grain layer can be precisely matched, overcoming the problem of difficulty in "matching" the patterns in the prior art.

[0042] Finally, this method also has the advantage of high flexibility. Compared to the prior art, the three-dimensional wood grain pattern of this application does not require three-dimensional modeling of individual lower wood grain layers. It only requires analyzing the wood grain shape contained in the lower wood grain layers. Based on this wood grain shape, it is retrieved from a subset of the three-dimensional wood grain print shape data of the three-dimensional wood grain print dataset. By matching the shape data recorded in the three-dimensional wood grain print shape data subset with the depth data recorded in the three-dimensional wood grain print depth data subset, a three-dimensional wood grain pattern closer to natural wood grain can be created. This effectively simplifies the process of constructing the three-dimensional wood grain pattern, allowing manufacturing companies to customize products based on customer demand, expand the richness of their product lines, effectively reduce production costs, and improve production efficiency.

[0043] Preferably, the wood grain information is obtained by scanning natural wood board material, the data for the underlying wood grain print dataset is obtained by a high-resolution optical scanner, and the depth information of the wood grain is obtained by a device such as a laser contour meter.

[0044] Preferably, the underlayer wood grain print dataset includes a plurality of underlayer wood grain print base color data subsets and a plurality of underlayer wood grain print shape data subsets.

[0045] The underlying wood grain printing dataset of the present invention includes a subset of underlying wood grain printing base color data, which is used to print the wood base colors exhibited by different wood materials. For example, in the printing process for cedar and Japanese cedar, the base color is pale yellow; for woods such as fir, white sappanwood, and yellow paulownia, the base color is yellowish-white; for pagoda tree, Chinese cypress, catalpa, and mulberry, the base color is brown; for woods such as red cedar, red pine, willow cedar, and camphor, the base color is reddish-brown; for rosewood, Indian sandalwood, and Indian rosewood, the base color is deep purplish-red; and for black cedar, the base color is black. Therefore, by calling up data from the underlying wood grain printing base color data subset, the base colors of different natural woods can be simulated. On the other hand, the lower layer wood grain print shape data subset can record information about different wood grain shapes. For example, the lower layer wood grain print shape data subset can record information including annular growth rings, semi-annular porosity, streaky structure, wave pattern, and burl texture. Therefore, by randomly calling data from the lower layer wood grain print shape data subset, it is possible to simulate the wood grain structure of natural wood with different shapes.

[0046] This method allows for the combination of a large number of base layer wood grain patterns by matching the base color data subset and the base shape data subset of the base layer wood grain print, thereby significantly meeting customer customization needs.

[0047] Preferably, the lower layer wood grain print base color data subset includes a plurality of base color print point coordinate data, each base color print point coordinate data is labeled with color information, and the first printing device performs printing based on the base color print point coordinate data and the color information corresponding to the base color print point coordinate data.

[0048] The base color printing point coordinate data of the base color data subset of the lower layer wood grain printing of the present invention records the color information of each coordinate point on the surface of the board material, and then the first printing device sequentially outputs based on the color information of each coordinate point to obtain a wood grain base color that matches the natural wood grain pattern.

[0049] Preferably, the lower layer wood grain print shape data subset includes multiple groups of two-dimensional planar wood grain print coordinate data for printing wood grain, each planar wood grain print coordinate data being labeled with color information, the first printing device performs printing based on the planar wood grain print coordinate data and the color information corresponding to the planar wood grain print coordinate data, and each lower layer wood grain print shape data subset corresponds to a single lower layer wood grain print path.

[0050] The underlying wood grain print shape data subset of the present invention includes multiple two-dimensional planar wood grain print coordinate data for printing wood grain, and this data also corresponds to color information, and this color information should be different from the wood grain base color, so that the planar wood grain pattern is distinguishable from the base color and the wood grain pattern is displayed on the base color surface. At the same time, since the two-dimensional planar wood grain print coordinate data records the coordinates of each point that constitutes the wood grain pattern, the first printing device can output and print the wood grain pattern based on this planar wood grain print coordinate data.

[0051] Preferably, the colors of the underlying wood grain print base color data subset and the underlying wood grain print shape data subset are obtained by superimposing at least one or more standard colors.

[0052] Preferably, the standard color includes at least red, blue, light red, yellow, black, and light black.

[0053] Preferably, the print resolution of the base color print point coordinate data and the planar wood grain print coordinate data is 100 DPI or higher.

[0054] The applicant of this invention has discovered that the printing resolution during the process of outputting and distributing the base color printing point coordinate data and the planar wood grain printing coordinate data to the first printing device has a clear effect on the visual effect of the final lower layer wood grain. When the printing resolution is less than 100 DPI, the display effect after printing is relatively blurry, and the wood grain pattern effect cannot be shown well.

[0055] Preferably, the three-dimensional wood grain print shape data subset includes multiple two-dimensional three-dimensional wood grain print coordinate data for printing wood grain, each three-dimensional wood grain print shape data subset corresponds to a single three-dimensional wood grain print path, and each of the multiple three-dimensional wood grain print paths overlaps with multiple underlying wood grain print paths on a two-dimensional plane.

[0056] The two-dimensional wood grain print coordinate data included in the three-dimensional wood grain print shape data subset of this application records the planar coordinates of each point constituting the three-dimensional wood grain pattern. Since this data can correspond on a two-dimensional plane to the coordinate information described in the lower layer wood grain print shape data subset of the lower layer wood grain print dataset, after determining the planar wood grain coordinate information described in the lower layer wood grain print shape data subset and the three-dimensional wood grain print coordinate data described in the three-dimensional wood grain print shape data subset, the second printing device can perform output printing along a predetermined printing line and complete the alignment process between the three-dimensional wood grain pattern and the lower layer wood grain.

[0057] Preferably, the subset of three-dimensional wood grain print shape data includes print depth data for each three-dimensional wood grain print coordinate data.

[0058] Preferably, the wood grain information processing in step (S.1) includes at least one of the following operations:

[0059] Geometric transformation, color and / or brightness and / or contrast correction, removal of unnecessary image elements, image distortion, image deformation.

[0060] Preferably, the board material includes wood plastic board, stone plastic board, wood board, metal board or other types of artificial board material.

[0061] Preferably, the following steps are included after step (S.4):

[0062] A three-dimensional wood grain layer is formed on the surface of the lower wood grain layer by a step in which the wood grain precursor is solidified.

[0063] As described in the background art, there are multiple methods for producing a three-dimensional wood grain layer, and in some preferred embodiments of this application, an upward lamination method can be employed to form a three-dimensional wood grain layer on the surface of a lower wood grain layer. In this method, a solidifiable wood grain precursor liquid is continuously laminated upward to form a wood grain precursor with uneven depth, length, and width. At this time, it is only necessary to solidify the wood grain precursor, and the solidified wood grain precursor becomes a three-dimensional wood grain layer. The solidification method of the wood grain precursor depends on the physicochemical properties of the wood grain precursor liquid applied. If the wood grain precursor liquid contains a heat-solidifying resin, a heat-solidification method can be selected during the solidification process. If the wood grain precursor liquid contains a photocatalytic resin, solidification of the wood grain precursor can be induced simply by irradiating the wood grain precursor with ultraviolet light under the condition that a photoinitiator is present. Generally, adopting a photo-solidification method results in high solidification efficiency and can effectively improve the molding efficiency of the three-dimensional wood grain layer.

[0064] Preferably, the wood grain precursor is at least a photocatalytic resin; and,

[0065] It contains a photoinitiator for inducing polymerization of the photocatalytic resin.

[0066] Preferably, the photocatalytic resin contained in the wood grain precursor liquid includes acrylic resins, epoxy resins, or other photocurable resins.

[0067] Preferably, an intermediate step is included between step (S.3) and step (S.4), the intermediate step being:

[0068] - Using an application tool, apply a solidifiable liquid resin to the lower wood grain layer to form a liquid resin layer;

[0069] In step (S.4), the wood grain precursor liquid is applied to the surface of the liquid resin layer, and the wood grain precursor is formed by the wood grain precursor liquid and / or at least a portion of the liquid resin mixed with the wood grain precursor liquid and / or at least a portion of the liquid resin covered with the wood grain precursor liquid.

[0070] Preferably, the wood grain precursor liquid contains at least an inhibitor to prevent or delay the polymerization of the solidifiable liquid resin.

[0071] Preferably, the following steps are included after step (S.4):

[0072] - A step to solidify the liquid resin other than the wood grain precursor formed in the previous step;

[0073] -By removing the wood grain precursor, a three-dimensional wood grain layer is formed on the surface of the lower wood grain layer.

[0074] As described above, the formation of a three-dimensional wood grain layer includes not only the top-layering method but also the bottom-indentation method. Compared to the top-layering method, the bottom-indentation method allows for control over the width of the formed texture, resulting in a greater depth and therefore a stronger sense of three-dimensionality. At the same time, wood grain deformation does not occur during the printing process, resulting in high printing accuracy.

[0075] Conventional techniques have employed a step of applying a wood grain precursor liquid to an incompletely solidified resin layer. However, actual test results have shown that the high viscosity of the incompletely solidified resin layer makes it difficult for the wood grain precursor liquid to penetrate the resin layer, leading to the following problems: (1) The depth to which the wood grain precursor liquid penetrates the resin layer is low, resulting in a low depth of wood grain and poor three-dimensional effect of the overall three-dimensional wood grain layer; (2) Due to the high viscosity of the incompletely solidified resin layer, the wood grain precursor liquid tends to accumulate on the surface of the incompletely solidified resin layer after application, and the wood grain precursor liquid tends to diffuse easily onto the resin layer surface, resulting in a final wood grain shape and width that does not easily match the lower wood grain layer, causing problems with inaccurate flower arrangement; (3) Incompletely solidified resin layer (4) Due to its low fluidity, it is difficult to mix with the wood grain precursor liquid in a short time, resulting in blurred and non-sharp edges on the formed three-dimensional wood grain layer, and a clear difference from the structure of natural wood grain patterns; (5) Due to the high viscosity of the incompletely solidified resin layer, the viscosity of the wood grain precursor obtained after mixing with the wood grain precursor liquid is relatively high, and although the wood grain precursor cannot be completely solidified in the subsequent solidification process, the viscosity increases to a certain extent, making it difficult to completely remove these high-viscosity wood grain precursors in the subsequent mechanical removal process, often resulting in residue, causing the wood grain texture to be unclear and blurred, further widening the gap between the texture and actual natural wood material.

[0076] Therefore, the present invention not only employs a pretreatment step in the manufacturing process, but also adopts a technical method of directly applying the wood grain precursor liquid to the surface of the unsolidified liquid resin during the pretreatment step. Compared to applying the wood grain precursor liquid to the resin layer after it has semi-solidified, this change in step brings about the following beneficial effects: (1) Because the viscosity of the unsolidified liquid resin is low, it has good fluidity, and after applying the wood grain precursor liquid to the unsolidified liquid resin, it smoothly penetrates downward into the unsolidified liquid resin, greatly improving the depth of the prepared wood grain and effectively enhancing the three-dimensional effect of the three-dimensional wood grain layer. (2) At the same time, because the wood grain precursor liquid can penetrate downward into the interior of the unsolidified liquid resin, diffusion to the surface of the unsolidified liquid resin is avoided, and the shape and width of the wood grain that is finally formed can match the ink layer below, effectively improving the accuracy of the flower matching. (3) Because the mixing effect of the unsolidified liquid resin and the wood grain precursor liquid is good, the edges of the wood grain precursor liquid or the wood grain precursor obtained by mixing the wood grain precursor liquid with the unsolidified liquid resin are more orderly and sharp, and the resulting three-dimensional wood grain layer is closer to a natural wood grain pattern. (4) After solidification, the viscosity of the wood grain precursor liquid or the wood grain precursor obtained by mixing the wood grain precursor liquid with the unsolidified liquid resin remains low, making it easy to remove after solidification, and no residue is left after removal of the wood grain precursor, resulting in a cleaner wood grain with sharper edges.

[0077] Preferably, immediately after the completion of step (S.3), the pretreatment step is carried out in succession, and the pretreatment step is:

[0078] The process includes the steps of covering at least a portion of the upper surface of the lower wood grain layer with a solidifiable liquid resin, and solidifying at least a portion of the solidifiable liquid resin on the surface of the lower wood grain layer to form a three-dimensional wood grain sublayer.

[0079] In the conventional downward recession method for forming three-dimensional wood grain patterns, a portion of the underlying wood grain layer is exposed during the process of removing the wood grain precursor to obtain the three-dimensional wood grain layer. This exposed underlying wood grain layer is easily abraded or peeled off by external forces. Therefore, it is necessary to consider the depth of downward removal during the mechanical removal of the wood grain precursor, and in order to prevent abrasion of the underlying wood grain layer, it becomes difficult to increase the depth of the three-dimensional wood grain layer.

[0080] In the manufacturing process of a three-dimensional structure, a three-dimensional wood grain sublayer is first covered by solidifying a liquid resin that can solidify on the surface of the lower wood grain layer, and then another three-dimensional wood grain layer is formed on the surface of the lower wood grain layer. Due to the presence of the lower wood grain layer, the lower wood grain layer is not exposed to the outside during the process of removing the wood grain precursor and forming the three-dimensional wood grain layer, and is covered by the lower wood grain layer, so the lower wood grain layer does not wear down or peel off due to external forces. Therefore, the maximum downward excavation is possible during the process of mechanically removing the wood grain precursor, effectively increasing the depth of the three-dimensional wood grain layer.

[0081] Furthermore, in order for the board material containing the three-dimensional wood grain pattern manufactured by the present invention to obtain a texture close to that of natural wood, it is necessary to consider not only the wear of the lower wood grain layer and the depth of the three-dimensional wood grain layer, but also the correspondence between the lower wood grain layer and the upper three-dimensional wood grain layer, i.e., the issue of their alignment. Regarding the alignment issue, the applicant has found that the following influencing factors cause defects of inaccurate alignment between the lower wood grain layer and the upper three-dimensional wood grain layer: (1) Deformation of the three-dimensional wood grain layer or the lower wood grain layer due to shrinkage during the solidification process of the solidifiable liquid resin material during the manufacturing process of the upper three-dimensional wood grain layer; (2) Insufficient compatibility between the wood grain precursor liquid and the solidifiable liquid resin during the manufacturing process of the three-dimensional wood grain layer, resulting in the depth, width, and edge shape of the three-dimensional wood grain layer not matching expectations. The applicant has found that by considering the above two points simultaneously, a texture close to that of natural wood can be truly obtained.

[0082] Regarding influencing factor (1), the applicant discovered that during the solidification process of the solidifiable liquid resin, the solidification energy (UV or heat) is usually input from above the liquid resin, causing the upper liquid resin to solidify first and the lower liquid resin to solidify later. The solidification process of the liquid resin is often accompanied by a certain volume shrinkage, generating a certain internal stress. This internal stress accumulates downwards, reaching its maximum value at the bottom of the liquid resin. If the liquid resin is in direct contact with the lower wood grain layer at this time, and the maximum internal stress is greater than the adhesive force between the lower wood grain layer and the board surface, slippage occurs between the lower wood grain layer and the board surface, making it difficult to match the lower wood grain layer with the upper three-dimensional wood grain pattern, causing problems with inaccurate alignment and seriously affecting the visual effect of the board. Furthermore, if the amount of liquid resin applied above the lower wood grain layer is large, peeling and detachment occur between the lower wood grain layer and the board surface, seriously reducing the yield rate of the product.

[0083] Therefore, in order to overcome the above problems, the present invention first covers at least a portion of the surface of the lower wood grain layer with a liquid resin, and solidifies this partial liquid resin first to form the wood grain lower layer. At this time, since the amount of this partial liquid resin used is small, the internal stress after solidification is weak and does not affect the space between the lower wood grain layer and the surface of the board material.

[0084] After covering the lower wood grain layer with a liquid resin for forming a three-dimensional wood grain layer and allowing it to solidify to obtain the three-dimensional wood grain layer, the affinity and adhesive force between the lower wood grain layer and the three-dimensional wood grain layer are strong, preventing problems of sliding and peeling between them. Furthermore, because the mechanical strength of the lower wood grain layer after solidification is high, the internal stress during the solidification of the three-dimensional wood grain layer is insufficient for the deformation of the lower wood grain layer, and the internal stress during the solidification of the three-dimensional wood grain layer is not transmitted to the lower wood grain layer below the lower wood grain layer. Therefore, by adding this pretreatment step, the problem of inaccurate alignment between the three-dimensional wood grain layer and the lower wood grain layer can be effectively prevented in subsequent production processes.

[0085] Preferably, the solidification method of the solidifiable liquid resin includes thermal solidification or photosolidification.

[0086] Preferably, when the solidification method of the solidifiable liquid resin is thermal solidification, the liquid resin includes at least a thermosetting resin.

[0087] Preferably, the thermosetting resin includes one or a combination of epoxy resins, phenolic resins, melamine-formaldehyde resins, furan resins, unsaturated polyester resins, organosilicone resins, and polybutadiene resins.

[0088] Preferably, the resin liquid further contains a solidifying agent.

[0089] Preferably, when the solidification method of the solidifiable liquid resin is photosolidification, the liquid resin includes at least a photocrosslinking resin and a photoinitiator.

[0090] In another preferred embodiment of the present invention, the photocrosslinked resin includes one or a combination of any and more of the following: unsaturated polyester, epoxy resin, acrylic resin, acrylic-modified polyurethane resin, acrylic-modified organic silicone resin, acrylic-modified epoxy resin, aqueous epoxy acrylate, aqueous polyurethane acrylate, and aqueous polyester acrylic.

[0091] In another preferred embodiment of the present invention, the photoinitiator comprises one of a free-group polymerization initiator, a cationic polymerization initiator, an energy transfer initiator, or an ionic initiator.

[0092] Preferably, after preparing the three-dimensional wood grain layer, further:

[0093] The process includes the step of covering at least a portion of the surface of a three-dimensional wood grain layer with a surface coating and allowing it to harden to obtain a surface coating layer.

[0094] Preferably, prior to step (S.3), the sheet material includes the following steps:

[0095] A step of covering at least a portion of the surface of a board material with a primer and allowing it to harden to obtain a primer layer.

[0096] Secondly, the present invention further provides a board material having a three-dimensional wood grain pattern on its surface, said board material being manufactured by the method described above.

[0097] In a third aspect, the present invention further provides applications of board material having a three-dimensional wood grain pattern on its surface to flooring, decorative wall panels, or suspended ceiling panels.

[0098] The present invention has the following beneficial effects:

[0099] This invention obtains a surface database of natural wood by scanning real natural wood, and further classifies this surface database to obtain a base layer wood grain print dataset for forming a base layer wood grain pattern whose base color and pattern match the natural wood grain pattern, and a three-dimensional wood grain print dataset for forming a three-dimensional wood grain pattern that has the same tactile feel as the natural wood grain pattern. Through the corresponding collaborative relationship between the base layer wood grain print dataset and the three-dimensional wood grain print dataset, a three-dimensional wood grain layer that perfectly matches the base layer wood grain layer can be obtained on the surface of the board material, effectively improving the accuracy of the matching between the two. At the same time, this application simplifies the manufacturing process of the three-dimensional wood grain layer and improves production efficiency by processing different shape, color, and depth information separately. [Brief explanation of the drawing]

[0100] [Figure 1] Figure 1 is a schematic diagram of a typical structure of natural wood.

[0101] [Figure 2] Figure 2 shows image data that matches the natural wood image obtained by scanning.

[0102] [Figure 3] Figure 3 is a schematic representation of steps (S.1) to (S.11) of Example 1.

[0103] [Figure 4] Figure 4 is a schematic representation of steps (S.12) to (S.13) of Example 1.

[0104] [Figure 5]Figure 5 is a schematic diagram of the three-dimensional structure of the board material having a three-dimensional wood grain pattern, which was manufactured in Example 1.

[0105] [Figure 6] Figure 6 is a schematic diagram of the top surface structure of the board material having a three-dimensional wood grain pattern, manufactured in Example 1.

[0106] [Figure 7] Figure 7 is a schematic representation of steps (S.1) to (S.9) of Example 2.

[0107] Among them: board material 10, base coat layer 11, color coat layer 12, lower wood grain layer 13, three-dimensional wood grain lower layer 14, liquid resin layer 15, wood grain precursor 16, three-dimensional solid wood grain layer 17, first surface coat layer 18, second surface coat layer 19, conveying device 20, first roller coating machine 21, second roller coating machine 22, first printing device 23, third roller coating machine 24, fourth roller coating machine 25, fifth roller coating machine 26, second printing device 27, cleaning device 28, sixth roller coating machine 29, seventh roller coating machine 30, wood surface database 100, lower wood grain print dataset 110, lower wood grain print base color data subset 110a, lower wood grain print shape data subset 110b, three-dimensional wood grain print dataset 120, solid wood grain print shape data subset 120a, solid wood grain print depth data subset 120b.

[0108] Specific Embodiments

[0109] The present invention will be further described below in combination with the specifications, drawings, and specific embodiments. Those skilled in the art can implement the present invention based on this description. Furthermore, the embodiments of the present invention included in the following description are usually partial embodiments of the present invention, not all embodiments. Accordingly, all other embodiments that those skilled in the art can obtain without creative work based on the embodiments of the present invention should fall within the scope of protection of the present invention.

[0110] In the first embodiment of the present invention, first, a scanner is used to scan multiple different natural woods (Figure 1 is a schematic diagram of a typical structure of natural wood) to obtain grain information of multiple different natural woods. The grain information includes image data of the grain and three-dimensional depth information of the grain. The image data includes base color images displayed by various types of wood and grain shape images displayed on the surface of various types of wood. Of these, the base color images usually include the base color that each type of natural wood presents itself. For example, the base color images of common natural woods are as follows, but are not limited to these: the base color of cedar and Japanese cedar is pale yellow; the base color of woods such as fir, white sappanwood, and yellow paulownia is yellowish-white; the base color of pagoda tree, Chinese cypress, catalpa, and mulberry is brown; the base color of woods such as red cedar, red pine, willow cedar, and camphor is reddish-brown; the base color of rosewood, Indian sandalwood, and Indian rosewood is deep purplish-red; and the base color of black cedar is black. For example, a typical natural wood grain pattern image includes, but is not limited to, structures such as closed, semi-closed, or fully open annual ring textures, semi-ring-porous structures, streaky structures, wave-like structures, and burl textures. The obtained base color image and wood grain pattern image are processed using image processing software. For example, the base color image is corrected for color and / or brightness and / or contrast, and at least one of the following operations is performed on the wood grain pattern image: geometric transformation, removal of unnecessary image elements, image distortion, and image deformation. After processing, the wood grain information is analyzed to extract and establish a wood surface database 100.

[0111] [Figure 2] As can be seen from Figure 2, the data of the wood surface database 100 in this embodiment is divided into at least a lower layer wood grain print dataset 110 and a three-dimensional wood grain print dataset 120.

[0112] Of these, the lower layer wood grain print dataset 110 is used to record the base color information and wood grain shape information of the wood surface. Therefore, in some embodiments, the lower layer wood grain print dataset 110 can be further classified and divided into multiple lower layer wood grain print base color data subsets 110a and multiple lower layer wood grain print shape data subsets 110b.

[0113] The lower layer wood grain print base color data subset 110a includes multiple base color print point coordinate data (X,Y), and each base color print point coordinate data (X,Y) is labeled with color information that matches different colors of the wood grain pattern. The color information that constitutes these base colors is obtained by superimposing at least one or more standard colors.

[0114] The lower layer wood grain print shape data subset 110b includes multiple groups of two-dimensional planar wood grain print coordinate data for printing wood grain, each planar wood grain print coordinate data being labeled with color information, and the color information constituting these wood grains is also obtained by superimposing at least one or more standard colors, the color information constituting the wood grain is distinguishable from the color information constituting the base color, and the lower layer wood grain shape can be displayed on the base color. After the planar wood grain print coordinate data is finalized, each lower layer wood grain print shape data subset 110b corresponds to a single lower layer wood grain print path.

[0115] In some preferred embodiments, standard colors for the base and wood grain are obtained by presenting at least a series of colors such as red, blue, light red, yellow, black, and light black individually, or by superimposing multiple standard colors on each other. For example, these standard colors and their corresponding RGB values ​​are shown in Table 1 below:

[0116] [Table 1]

[0117] In this embodiment, in order to form a lower wood grain layer that matches the wood grain pattern by outputting color ink to the surface of the board material, a lower wood grain printing base color data subset 110a and a lower wood grain printing shape data subset 110b are assigned to the first printing device 200. The first printing device 200 prints on the surface of the board material based on the base color printing point coordinate data recorded in the lower wood grain printing base color data subset 110a and the color information corresponding to the base color printing point coordinate data, and outputs color ink to form the base color on the surface of the board material.

[0118] After the base color printing is completed, the first printing device 200 prints on the base color surface according to the lower layer wood grain printing path corresponding to each lower layer wood grain printing shape data subset 110b, based on multiple groups of two-dimensional planar wood grain printing coordinate data for printing wood grain recorded in the lower layer wood grain printing shape data subset 110b and the color information corresponding to the planar wood grain printing coordinate data, and outputs color ink to form the wood grain shape on the base color surface.

[0119] After the base color and wood grain pattern are printed, the base color and wood grain pattern are superimposed on each other to form a lower wood grain layer that matches the target wood grain pattern. To ensure clarity of the entire lower wood grain layer after printing, the first printing device 200 must maintain a printing resolution of 100 DPI or higher during the process of printing the planar wood grain printing coordinate data for base color formation and the planar wood grain printing coordinate data for wood grain pattern formation.

[0120] The color ink used in the first printing apparatus 200 is preferably a photocurable ink, and after printing is completed, the formed lower wood grain layer is subjected to a photocurable treatment to maintain the stability and abrasion resistance of the lower wood grain layer. To ensure the photocurability of the color ink, in this embodiment the color ink necessarily includes a photocurable resin, a photoinitiator to induce photocurable resin solidification, and a pigment to provide different colors.

[0121] Furthermore, the source of the board material used in this embodiment is wood plastic board, stone plastic board, wood board, metal board, or other types of board material, and since the inherent color of each type of board material is different, after printing and forming the underlying wood grain layer on the surface of different board materials, the inherent color of the board material causes a certain shift in the color of the underlying wood grain layer. Therefore, in some preferred embodiments of this application, it is necessary to first perform a certain surface modification treatment on the board material.

[0122] The surface modification treatment of the sheet material includes the following steps:

[0123] First, a curable primer is applied to the molded SPC board (for example, the primer contains 90% photocurable clear lacquer HYS01-1, 5% photoinitiator 184, 0.5% photoinitiator TPO, and 4.5% diluent hydroxyethyl acrylate). During the contact process between the SPC board material and the application roller, 12 g / m² of primer is applied to the surface of the SPC board material and cured with a UV lamp at 395 nm and 8 W / cm² to form a primer layer.

[0124] The SPC sheet material obtained in the above step is passed through a roller coating machine again, and a photocurable white paint is applied to the surface of the coating roller of the roller coating machine (for example, the white paint contains 50% photocurable epoxy HYS01-1, 30% titanium white powder, 5% photoinitiator 184, 0.5% photoinitiator TPO, and 14.5% diluent hydroxyethyl acrylate). During the contact process between the SPC sheet material and the coating roller, 18 g / m² of the white paint is applied to the base coat surface and cured with a UV lamp at 395 nm and 8 W / cm² to obtain a white colored paint layer.

[0125] The first printing apparatus 200 outputs to the surface of the white colored paint layer, forming an underlying wood grain layer on the surface of the colored paint layer, and the inherent color of the SPC board material obscures the influence of the underlying wood grain layer.

[0126] Continuing from Figure 2, the three-dimensional wood grain print dataset 120 is used to record three-dimensional wood grain shape information and different depth information of the three-dimensional wood grain. Therefore, in some embodiments, the three-dimensional wood grain print dataset 120 can be classified and divided into multiple two-dimensional three-dimensional wood grain print shape data subsets 120a and multiple three-dimensional wood grain print depth data subsets 120b.

[0127] The 3D wood grain print shape data subset 120a includes multiple 3D wood grain print coordinate data for printing wood grain, with each 3D wood grain print shape data subset 120a corresponding to a single three-dimensional wood grain print path. The 3D wood grain print depth data subset 120b includes print depth data for each three-dimensional print point coordinate data.

[0128] In order to form a three-dimensional wood grain pattern on the surface of the lower wood grain layer that conforms to the wood grain shape in the lower wood grain layer, in this embodiment, the three-dimensional wood grain print shape data subset 120a and multiple three-dimensional wood grain print depth data subsets 120b of the three-dimensional wood grain print dataset 120 are assigned to the second printing device 300, respectively, and the three-dimensional wood grain pattern is formed during the printing process of the second printing device 300.

[0129] As described in the background information, there are various methods for forming three-dimensional wood grain patterns; therefore, the method for printing three-dimensional wood grain patterns using the second printing apparatus 300 must also be explained separately.

[0130] The steps of a preferred embodiment for forming a three-dimensional wood grain pattern using the top-lamination method are as follows:

[0131] (1) Prepare the wood grain precursor liquid: In this embodiment, since the wood grain precursor liquid needs to be layered on top to form a three-dimensional wood grain pattern, the wood grain precursor liquid used must necessarily contain at least a solidifiable resin and a photoinitiator (for example, the wood grain precursor liquid applied to the top layering method contains 90% Dow Corning 65 Additive, 5% photoinitiator 184, 0.5% photoinitiator TPO, and 4.5% diluent hydroxyethyl acrylate).

[0132] (2) The second printing apparatus 300 prints on the lower wood grain layer surface based on three-dimensional printing point coordinate data corresponding to the three-dimensional wood grain printing shape data subset 120a and three-dimensional wood grain printing paths corresponding to each three-dimensional wood grain printing shape data subset 120a, outputting wood grain precursor liquid to the base color surface. The height of the wood grain precursor liquid is controlled by the second printing apparatus 300 by applying the three-dimensional wood grain printing depth data subset 120b, and the wood grain precursor is finally formed during the continuous layering height process of the wood grain precursor liquid. In this embodiment, multiple three-dimensional wood grain printing paths corresponding to multiple three-dimensional wood grain printing shape data subsets 120a each overlap with multiple lower wood grain printing paths on a two-dimensional plane, completing the alignment between the three-dimensional three-dimensional wood grain pattern and the lower wood grain.

[0133] (3) The wood grain precursor is sequentially irradiated with a 395 nm and 8 W / cm² UV lamp and a 160 w / cm² Hg lamp to convert the liquid wood grain precursor into a solidified three-dimensional wood grain layer.

[0134] The steps of a preferred embodiment for forming a three-dimensional wood grain pattern using the downward recession method are as follows:

[0135] (1) Preparation of the wood grain precursor solution: In this embodiment, since the wood grain precursor solution needs to penetrate downward into the liquid resin layer to form a three-dimensional wood grain pattern, the wood grain precursor solution used must necessarily contain at least an inhibitor that inhibits or delays the polymerization of the resin liquid layer (for example, the wood grain precursor solution applied to the upward lamination method contains 45.5% dipropylene glycol diacrylate monomer PEG600DA, 20.5% hydroquinone monomethyl ether HQMME, 10% 2-tert-butylhydroquinone MTBHQ, and 24% diethylene glycol butyl ether).

[0136] (2) Using an application tool, a solidifiable liquid resin is applied to the lower wood grain layer. The amount of solidifiable liquid resin applied is 50 to 200 g / m2. If the amount of solidifiable liquid resin applied exceeds 150 g / m2, it is applied in batches to form a liquid resin layer.

[0137] (3) The second printing apparatus 300 prints on the surface of the liquid resin layer based on the three-dimensional wood grain printing coordinate data corresponding to the three-dimensional wood grain printing shape data subset 120a and the three-dimensional wood grain printing path corresponding to each three-dimensional wood grain printing shape data subset 120a, outputting a wood grain precursor liquid to the surface of the liquid resin layer. The depth of the wood grain precursor liquid is controlled by the second printing apparatus 300 applying the three-dimensional wood grain printing depth data subset 120b, and a wood grain precursor is formed by the wood grain precursor liquid and / or at least a portion of the liquid resin mixed with the wood grain precursor liquid and / or at least a portion of the liquid resin covered with the wood grain precursor liquid. In this embodiment, multiple three-dimensional wood grain printing paths corresponding to multiple three-dimensional wood grain printing shape data subsets 120a each overlap with multiple lower layer wood grain printing paths on a two-dimensional plane, completing the alignment between the three-dimensional wood grain pattern and the lower layer wood grain.

[0138] (4) The liquid resin layer on the surface of the SPC board obtained in the above step is sequentially irradiated with a 395 nm and 8 W / cm2 UV lamp and a 160 w / cm2 Hg lamp to solidify it deeply. The obtained SPC board is then transported to a cleaning device including a steel brush, where the wood grain precursor is brushed off with the steel brush to form a three-dimensional wood grain layer.

[0139] In some preferred embodiments, in order to improve the abrasion resistance and scratch resistance of the lower wood grain layer, and to improve the three-dimensional and visual effects of the three-dimensional wood grain layer, a pretreatment step is performed immediately after obtaining the lower wood grain layer, and the pretreatment step is:

[0140] This step involves covering and solidifying at least a portion of the upper surface of the lower wood grain layer with a solidifiable liquid resin. The amount of resin applied by roller is approximately 45 g / m2 of photo-solidifiable resin (the resin contains 90% Dow Corning 65 Additive, 5% photoinitiator 184, 0.5% photoinitiator TPO, and 4.5% diluent hydroxyethyl acrylate), which is then sequentially irradiated and solidified with a 395 nm and 8 W / cm2 UV lamp and a 160 w / cm2 Hg lamp to form the lower wood grain layer. Subsequently, the three-dimensional wood grain layer is formed above the lower wood grain layer.

[0141] In some preferred embodiments, in order to improve the tactile feel of the board material and adjust its optical properties, after preparing the three-dimensional wood grain layer, at least one layer of surface coating is continuously applied to the surface of the three-dimensional wood grain layer and allowed to harden to obtain a surface coating layer.

[0142] Example 1

[0143] As shown in Figure 3, the method for manufacturing a board material having a three-dimensional wood grain pattern on its surface includes the following steps:

[0144] (S.1) Place an SPC sheet material 10 with a length, width, and thickness of 1260mm*970mm*4.85mm on the surface of a conveying device 20 that moves in a fixed direction;

[0145] (S.2) The SPC sheet material 10 first passes through the first roller coating machine 21 during the transport process, and a photocurable primer is applied to the surface of the coating rollers of the roller coating machine (the primer contains 90% photocurable clear lacquer HYS01-1, 5% photoinitiator 184, 0.5% photoinitiator TPO, and 4.5% diluent hydroxyethyl acrylate). During the contact process between the SPC sheet material 10 and the coating rollers, 12 g / m2 of the primer is applied to the surface of the SPC sheet material 10 and cured with a UV lamp at 395 nm and 8 W / cm2 to form a primer layer 11;

[0146] (S.3) The SPC sheet material 10 obtained in the above step is passed through the second roller coating machine 22 again, and a photocurable white paint is attached to the surface of the coating roller of the roller coating machine (the white paint contains 50% photocurable epoxy HYS01-1, 30% titanium white powder, 5% photoinitiator 184, 0.5% photoinitiator TPO, and 14.5% diluent hydroxyethyl acrylate). During the contact process between the SPC sheet material 10 and the coating roller, 18 g / m2 of the white paint is applied to the surface of the base coat layer 11 and cured with a UV lamp at 395 nm and 8 W / cm2 to obtain a white colored paint layer 12;

[0147] (S.4) The SPC board material 10 obtained in the above step is transported to the first printing apparatus 23, and the first printing apparatus 50 retrieves the lower layer wood grain print base color data subset 110a and the lower layer wood grain print shape data subset 110b of the lower layer wood grain print dataset 110, sprays 6-8 g / m2 of ink onto the surface of the color paint layer 12 by the first printing apparatus 50, and solidifies the ink to form a lower layer wood grain layer 13 on the surface of the base paint layer 11 that matches the wood grain information;

[0148] (S.5) The SPC board material 10 obtained in the above step is transported to the third roller coating machine 24, and a photo-curable resin liquid (containing 90% Dow Corning 65 Additive, 5% photoinitiator 184, 0.5% photoinitiator TPO, and 4.5% diluent hydroxyethyl acrylate) is applied to the surface of the lower wood grain layer 13 by roller application at a rate of 45 g / m2. This is then sequentially cured by irradiation with a 395 nm and 8 W / cm2 UV lamp and a 160 w / cm2 Hg lamp to form a three-dimensional wood grain lower layer 14;

[0149] (S.6) The SPC board material 10 obtained in the above step is transported to the fourth roller coating machine 25, and the coating rollers of the fourth roller coating machine apply 80 g / m2 of resin liquid to the surface of the wood grain sublayer in the direction of transport of the SPC board material 10 (the rollers themselves rotate clockwise) (the resin liquid contains 90% Dow Corning 65 Additive, 5% photoinitiator 184, 0.5% photoinitiator TPO, and 4.5% diluent hydroxyethyl acrylate);

[0150] (S.7) After the first layer of resin liquid is applied, the SPC sheet material 10 is conveyed forward to the surface of the conveying device 20, and the fourth roller applicator 80 ensures that no force is applied to the resin liquid before it is conveyed to the next roller applicator;

[0151] (S.8) The SPC sheet material 10 obtained in the above step is transported to the fifth roller coating machine 26, and the coating rollers of the fifth roller coating machine 90 continuously apply 75 g / m2 of resin liquid in the opposite direction to the transport direction of the SPC sheet material 10 (the rollers themselves rotate clockwise) to obtain a liquid resin layer 15;

[0152] (S.9) The SPC board material 10 obtained in the above step is transported to the second printing apparatus 27, which retrieves the three-dimensional wood grain print shape data subset 120a and the three-dimensional wood grain print depth data subset 120b of the three-dimensional wood grain print dataset 120, sprays 6-8 g / m2 of wood grain precursor liquid onto the surface of the liquid resin layer 15 (the wood grain precursor liquid contains 45.5% dipropylene glycol diacrylate monomer PEG600DA, 20.5% hydroquinone monomethyl ether HQMME, 10% 2-butyl vase benzenediol MTBHQ, and 24% diethylene glycol butyl ether), and allows the wood grain precursor liquid to seep downward into the liquid resin layer 15 and mix with the solidifiable liquid resin to form a wood grain precursor 16, the depth change of the wood grain precursor 16 corresponds to the three-dimensional wood grain print depth data subset 120b;

[0153] (S.10) The liquid resin portions on the surface of the SPC board material 10 obtained in the above step, excluding the wood grain precursor 16, are sequentially irradiated with a 395 nm and 8 W / cm2 UV lamp and a 160 w / cm2 Hg lamp to solidify them deeply;

[0154] (S.11) The SPC board material 10 obtained in the above step is transported to the washing device 28 including a steel brush, and the wood grain precursor 16 is brushed off with the steel brush to form a three-dimensional wood grain layer 17;

[0155] As shown in Figure 4, after the preparation of the three-dimensional wood grain layer 17 is complete, the following steps are carried out:

[0156] (S.12) The SPC board material 10 obtained in the above step is passed through a sixth roller coating machine 29 and a UV ultraviolet lamp with a wavelength of 395 nm and 8 W / cm2 to apply 12 g / m2 of first-surface coating to the three-dimensional wood grain layer surface, and this is solidified to obtain the first-surface coating layer 18;

[0157] (S.13) The SPC plate material 10 obtained in the above step is passed through the seventh roller coating machine 30 and a UV ultraviolet lamp with an emission of 395 nm and 8 W / cm2 to apply 12 g / m2 of the second surface coating to the surface of the first surface coating layer 17, and this is solidified to obtain the second surface coating layer 19.

[0158] The surface of the three-dimensional solid-structured plate material 10 manufactured in Example 1 was analyzed with a laser contour meter to obtain Figures 5 and 6. Of these, Figure 5 is a schematic diagram of the three-dimensional solid-grain structure, and Figure 6 is a schematic diagram of the top surface structure of the three-dimensional solid-grain structure.

[0159] Example 2

[0160] As shown in Figure 7, the method for manufacturing a board material having a three-dimensional wood grain pattern on its surface includes the following steps:

[0161] (S.1) Place an SPC sheet material 10 with a length, width, and thickness of 1260mm*970mm*4.85mm on the surface of a conveying device 20 that moves in a fixed direction;

[0162] (S.2) The SPC sheet material 10 first passes through the first roller coating machine 21 during the transport process, and a photocurable primer is applied to the surface of the coating rollers of the roller coating machine (the primer contains 90% photocurable clear lacquer HYS01-1, 5% photoinitiator 184, 0.5% photoinitiator TPO, and 4.5% diluent hydroxyethyl acrylate). During the contact process between the SPC sheet material 10 and the coating rollers, 12 g / m2 of the primer is applied to the surface of the SPC sheet material 10 and cured with a UV lamp at 395 nm and 8 W / cm2 to form a primer layer 11;

[0163] (S.3) The SPC sheet material 10 obtained in the above step is passed through the second roller coating machine 22 again, and a photocurable white paint is attached to the surface of the coating roller of the roller coating machine (the white paint contains 50% photocurable epoxy HYS01-1, 30% titanium white powder, 5% photoinitiator 184, 0.5% photoinitiator TPO, and 14.5% diluent hydroxyethyl acrylate). During the contact process between the SPC sheet material 10 and the coating roller, 18 g / m2 of the white paint is applied to the surface of the base coat layer 11 and cured with a UV lamp at 395 nm and 8 W / cm2 to obtain a white colored paint layer 12;

[0164] (S.4) The SPC board material 10 obtained in the above step is transported to the first printing apparatus 23, and the first printing apparatus 50 retrieves the lower layer wood grain print base color data subset 110a and the lower layer wood grain print shape data subset 110b of the lower layer wood grain print dataset 110, sprays 6-8 g / m2 of ink onto the surface of the color paint layer 12 by the first printing apparatus 50, and solidifies the ink to form a lower layer wood grain layer 13 on the surface of the base paint layer 11 that matches the wood grain information;

[0165] (S.5) The SPC board material 10 obtained in the above step is transported to the third roller coating machine 24, and a photo-curable resin liquid (containing 90% Dow Corning 65 Additive, 5% photoinitiator 184, 0.5% photoinitiator TPO, and 4.5% diluent hydroxyethyl acrylate) is applied to the surface of the lower wood grain layer 13 by roller application at a rate of 45 g / m². This is then sequentially cured by irradiation with a 395 nm and 8 W / cm² UV lamp and a 160 w / cm² Hg lamp to form a three-dimensional wood grain lower layer 14;

[0166] (S.6) The SPC board material 10 containing the three-dimensional wood grain underlayer 14 obtained in the above step is transported to the second printing apparatus 27. The second printing apparatus 27 retrieves the three-dimensional wood grain print shape data subset 120a and the three-dimensional wood grain print depth data subset 120b from the three-dimensional wood grain print dataset 120, sprays 6-8 g / m2 of wood grain precursor liquid onto the surface of the liquid resin layer 15 (the wood grain precursor liquid contains 90% Dow Corning 65 Additive, 5% photoinitiator 184, 0.5% photoinitiator TPO, and 4.5% diluent hydroxyethyl acrylate), forming a wood grain precursor 16. The depth changes of the wood grain precursor 16 correspond to the three-dimensional wood grain print depth data subset 120b;

[0167] (S.7) The wood grain precursor 16 on the surface of the SPC board material 10 obtained in the above step is sequentially irradiated with a 395 nm and 8 W / cm2 UV lamp and a 160 w / cm2 Hg lamp to solidify deeply and form a three-dimensional wood grain layer 17;

[0168] (S.8) The SPC board material 10 obtained in the above step is passed through a sixth roller coating machine 29 and a UV ultraviolet lamp 30 with an emission of 395 nm and 8 W / cm2 to apply 12 g / m2 of first-surface coating to the surface of the three-dimensional wood grain layer 17, and this is solidified to obtain the first-surface coating layer 18;

[0169] (S.9) The SPC plate material 10 obtained in the above step is passed through the seventh roller coating machine 30 and a UV ultraviolet lamp 31 with an emission of 395 nm and 8 W / cm2 to apply 12 g / m2 of the second surface coating to the surface of the first surface coating layer 17, and this is solidified to obtain the second surface coating layer 19.

[0170] In general, the method described in this application makes it possible to obtain a three-dimensional wood grain pattern similar to that of natural wood boards on the surface of artificial or non-wood boards. By digitizing the wood grain information, the lower wood grain layer printing process and the three-dimensional wood grain pattern printing process above the lower wood grain layer can be precisely matched, overcoming the problem of difficulty in "matching" the patterns in the prior art.

[0171] At the same time, based on the above principle, the method of this application also has the advantage of high flexibility. Compared to the prior art, the three-dimensional solid wood grain pattern of this application does not require three-dimensional modeling of individual lower wood grain layers, but only requires analyzing the wood grain shape contained in the lower wood grain layers. Based on this wood grain shape, it is obtained by searching from a subset of three-dimensional wood grain print shape data of the three-dimensional wood grain print dataset, and by matching the shape data recorded in the three-dimensional wood grain print shape data subset with the depth data recorded in the three-dimensional wood grain print depth data subset, it is possible to create a three-dimensional solid wood grain pattern that is closer to natural wood grain. This effectively simplifies the process of constructing three-dimensional solid wood grain patterns, enables customized production of products based on customer demand, expands the richness of a company's product line, effectively reduces production costs, and improves production efficiency.

Claims

1. A method for manufacturing a board material having a three-dimensional wood grain on its surface, characterized by comprising at least the following steps: (S.1) Obtain wood grain information, process it, and extract a wood surface database; The database includes at least a lower layer wood grain print dataset and a three-dimensional wood grain print dataset; Here, the three-dimensional wood grain print dataset includes a two-dimensional three-dimensional wood grain print shape data subset corresponding to the lower layer wood grain print dataset and a three-dimensional wood grain print depth data subset corresponding to the shape data subset; (S.2) Assign the lower layer wood grain print data set to the first printing device; Assigning a three-dimensional wood grain print dataset to the second printing device; (S.3) Using the first printing apparatus, print on the surface of the board material based on the lower layer wood grain print data set to obtain a lower layer wood grain that matches the wood grain information; (S.4) Using a second printing apparatus, output a wood grain precursor liquid based on a three-dimensional wood grain printing dataset to form a three-dimensional solid wood grain and obtain a wood grain precursor that is compatible with the lower wood grain layer, and to accommodate a subset of three-dimensional wood grain printing depth data with different heights of the wood grain precursor.

2. The method according to claim 1, characterized in that the lower layer wood grain print dataset includes a plurality of lower layer wood grain print base color data subsets and a plurality of lower layer wood grain print shape data subsets.

3. The method according to claim 2, characterized in that the lower layer wood grain print base color data subset includes a plurality of base color print point coordinate data, each base color print point coordinate data is labeled with color information, and the first printing device performs printing based on the base color print point coordinate data and the color information.

4. The method according to claim 2, characterized in that the lower layer wood grain print shape data subset includes multiple groups of two-dimensional planar wood grain print coordinate data for printing wood grain, each coordinate data is labeled with color information, the first printing device performs printing based on the coordinate data and the color information, and each lower layer wood grain print shape data subset corresponds to a single lower layer wood grain print path.

5. The method according to claim 2, 3, or 4, characterized in that the labeled color information in the lower layer wood grain print base color data subset and the lower layer wood grain print shape data subset is obtained by superimposing at least one or more standard colors.

6. The method according to claim 5, characterized in that the standard color includes at least red, blue, light red, yellow, black, and light black.

7. The method according to claim 6, characterized in that the print resolution of the base color print point coordinate data and the planar wood grain print coordinate data is 100 DPI or higher.

8. The method according to claim 4, characterized in that the three-dimensional wood grain printing shape data subset includes multiple two-dimensional three-dimensional wood grain printing coordinate data for printing wood grain, each three-dimensional wood grain printing shape data subset corresponds to a single three-dimensional wood grain printing path, and the multiple three-dimensional wood grain printing paths overlap with the multiple lower layer wood grain printing paths on a two-dimensional plane.

9. The method according to claim 8, characterized in that the subset of three-dimensional wood grain print shape data includes print depth data for each three-dimensional wood grain print coordinate data.

10. The method according to claim 1, characterized in that the wood grain information is obtained by scanning natural wood plywood.

11. The method according to claim 1 or 10, characterized in that the wood grain information processing in step (S.1) includes at least one of geometric transformation, color and / or brightness and / or contrast correction, removal of unnecessary image elements, image distortion, and image deformation.

12. The method according to claim 1, characterized in that it includes a step of solidifying the wood grain precursor after step (S.4) to form a three-dimensional wood grain layer on the surface of the lower wood grain layer.

13. The method according to claim 12, characterized in that the wood grain precursor comprises at least a photocatalytic resin and a photoinitiator that induces polymerization of the photocatalytic resin.

14. The method according to claim 1, characterized in that an intermediate step is included between step (S.3) and step (S.4), the intermediate step includes a step of applying a solidifiable liquid resin on top of the lower wood grain layer using a coating tool to form a liquid resin layer, in which step (S.4) a wood grain precursor liquid is applied to the upper surface of the liquid resin layer, and a wood grain precursor is formed by the wood grain precursor liquid and / or at least a portion of the liquid resin mixed with the wood grain precursor liquid and / or at least a portion of the liquid resin covered with the wood grain precursor liquid.

15. The method according to claim 14, characterized in that the wood grain precursor liquid contains at least an inhibitor that inhibits or delays the polymerization of the liquid resin.

16. The method according to claim 14, characterized in that, after step (S.4), the liquid resin other than the wood grain precursor formed in the previous step is solidified to remove the wood grain precursor and form a three-dimensional wood grain layer on the surface of the lower wood grain layer.

17. The method according to any one of claims 12 to 16, characterized in that a pretreatment step is performed immediately after the completion of step (S.3), the pretreatment step includes a step of covering at least a portion of the surface above the lower wood grain layer with a solidifiable liquid resin, and solidifying at least a portion of the liquid resin on the surface of the lower wood grain layer to form a three-dimensional wood grain lower layer.

18. The method according to claim 12 or 16, characterized by including the step of forming a three-dimensional wood grain layer, then covering at least a portion of the surface with a surface coating, and solidifying it to form a surface coating layer.

19. The method according to claim 1, 12, or 14, characterized by including a step of covering at least a portion of the surface of the board material with a primer before step (S.3) and allowing it to solidify to form a primer layer.

20. A board material having a three-dimensional wood grain on its surface, characterized in that it is manufactured by the method described in any one of claims 1 to 19.

21. Application of the board material having a three-dimensional solid wood grain on its surface as a flooring material, decorative wall panel, or suspended ceiling panel, as described in claim 20.

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