Dynamic seal deposition system for epitaxial applications

Abstract

This disclosure provides an epitaxial dynamic seal deposition apparatus and belongs to the field of semiconductor equipment. The epitaxial dynamic seal deposition apparatus includes a bottom plate, a positioning adjustment means provided above the bottom plate, the positioning adjustment means used for horizontal positioning adjustment, a lifting and rotating means provided above the positioning adjustment means, a process chamber provided above the lifting and rotating means, a housing and ejection means provided inside the process chamber, and the lifting and rotating means used to lift and rotate the housing and ejection means. The present invention provides an epitaxial dynamic seal deposition apparatus and solves the technical problems of conventional deposition equipment, which have poor deposition uniformity and poor deposition quality.

Description

Technical Field

[0001] This disclosure claims the priority of a Chinese patent application filed on May 16, 2023, with the application number 202310550073.7, and all of its content is incorporated herein by reference.

[0002] This disclosure relates to the field of semiconductor device technology, and particularly to a dynamic seal deposition device for epitaxy.

Background Art

[0003] Epitaxial equipment is a deposition device widely used in semiconductor processing equipment, and its plating process needs to be carried out in a vacuum environment. Conventional epitaxial equipment is difficult to ensure that the wafer is deposited at the center of the process chamber during the installation and adjustment process, has poor deposition uniformity, and when an offset occurs in the deposition position of the wafer, the deposition position of the wafer cannot be adjusted, and the optimal deposition effect cannot be achieved.

Summary of the Invention

Means for Solving the Problems

[0004] This disclosure provides an epitaxial dynamic seal deposition apparatus, the epitaxial dynamic seal deposition apparatus, comprising a bottom plate, a positioning adjustment means provided above the bottom plate, a lifting and rotating means provided above the positioning adjustment means, a magnetic fluid dynamic seal member provided above the lifting and rotating means, a process chamber provided above the magnetic fluid dynamic seal member, a housing and ejection means provided within the process chamber, the positioning adjustment means comprising an X-axis adjustment plate, a Y-axis adjustment plate and an adjustment assembly provided at one end of the X-axis adjustment plate and the Y-axis adjustment plate, the bottom of the X-axis adjustment plate being connected to the bottom plate via a first linear guide rail provided laterally, the bottom of the Y-axis adjustment plate being connected to the X-axis adjustment plate via a second linear guide rail provided vertically, and the adjustment assembly comprising a first adjustment block and the X-axis adjustment provided on the bottom plate The process chamber includes a second adjustment block provided on the nodal plate, the first adjustment block is provided with a first rotary knob, the first rotary knob is connected to the second adjustment block, the second adjustment block is provided with a second rotary knob, the second rotary knob is connected to the Y-axis adjustment plate, and the horizontal adjustment of the lifting and lowering rotation means is achieved by sequentially rotating the first rotary knob and the second rotary knob, the housing and ejection means includes a support arm, the top of the support arm is provided with a preheating ring, the bottom of the support arm is connected to the magnetic fluid dynamic sealing member, a butt groove for housing a wafer is opened in the inner top of the preheating ring, a push-up pin is slidably provided on the support arm, the process chamber is provided with a stopper support opposite to the bottom of the push-up pin, and the lifting and lowering rotation means is used to lift and lower and rotate the support arm.

[0005] This disclosure provides an epitaxial dynamic seal deposition apparatus, which is an epitaxial dynamic seal deposition apparatus, The base plate and A positioning adjustment means is provided above the bottom plate and includes an X-axis adjustment plate, a Y-axis adjustment plate, and an adjustment assembly. A lifting and lowering rotating means provided above the positioning adjustment means, with a magnetic fluid dynamic sealing member provided above it, wherein a process chamber is provided above the magnetic fluid dynamic sealing member, The accommodating ejection means is provided inside the process chamber and includes a support arm, the bottom of which is connected to the magnetic fluid dynamic sealing member, the top of which is used to accommodate a wafer, and the lifting and rotating means is configured to lift and rotate the support arm, The adjustment assembly is provided at one end of the X-axis adjustment plate and the Y-axis adjustment plate, and is configured to enable horizontal adjustment of the lifting and rotating means. [Brief explanation of the drawing]

[0006] [Figure 1] This is a schematic diagram of the structure of an epitaxial dynamic seal deposition apparatus according to some embodiments of the present disclosure. [Figure 2] This is a cross-sectional view of a dynamic seal deposition apparatus for epitaxial applications according to some embodiments of the present disclosure. [Figure 3] This is a first perspective view of the positioning adjustment means in Figure 1. [Figure 4] This is a second perspective view of the positioning adjustment means in Figure 1. [Figure 5] Figure 1 shows a schematic diagram of the structure of the first and second rotary knobs. [Figure 6] Figure 1 is a schematic diagram of the structure of the water-cooled seal block. [Figure 7] This is a cross-sectional view of the water-cooled seal block in Figure 1. [Modes for carrying out the invention]

[0007] The present disclosure will be further described below with reference to the drawings. The following embodiments are used solely to illustrate the technical concepts of the present disclosure and will not thereby limit the scope of protection of the present disclosure.

[0008] As shown in Figures 1 to 7, the epitaxial dynamic seal deposition apparatus according to this disclosure includes a bottom plate 40, and above the bottom plate 40 is a positioning adjustment means for horizontal positioning adjustment. Specifically, the positioning adjustment means includes an adjustment assembly, which includes a first adjustment block 52 and a second adjustment block 60. A lateral mounting groove is provided at the top of the bottom plate 40, and a first linear guide rail 75 is fixedly mounted in the lateral mounting groove via bolts. An X-axis adjustment plate 59 is fixedly mounted on the top of the first linear guide rail 75 via bolts. Longitudinal mounting grooves are provided on both sides of the top of the X-axis adjustment plate 59, and a second linear guide rail 79 is fixedly mounted in the longitudinal mounting grooves via bolts. A Y-axis adjustment plate 66 is fixedly mounted on the tops of the two second linear guide rails 79 via bolts. In other words, the primary function of the first linear guide rail 75 and the two second linear guide rails 79 is to serve as guides and support, and the linear guide rail may also be understood as being composed of sliding rails and sliders, i.e., the linear guide rail is fixed relative to the sliding rail, but the slider can reciprocate along the rail. The sliding rail in the first linear guide rail 75 may be fixed via bolts in the lateral mounting groove of the base plate 40, and the X-axis adjustment plate 59 may be fixedly connected via bolts to the top of the slider in the first linear guide rail 75. The sliding rail in the second linear guide rail 79 may be fixed via bolts in the longitudinal mounting groove of the X-axis adjustment plate 59, and the Y-axis adjustment plate 66 may be fixedly connected via bolts to the top of the slider in the second linear guide rail 79.A first positioning groove is provided at one end of the X-axis adjustment plate 59, and the second adjustment block 60 is fixed to the first positioning groove via bolts. A first mounting groove is provided at the top of the end of the bottom plate 40 closest to the second adjustment block 60, and the first adjustment block 52 is fixed to the first mounting groove via bolts. A first U-shaped groove 62 is provided at the top of the first adjustment block 52, and a first rotary knob 61 is provided in the first U-shaped groove 62 for locking. An extension plate 54 is integrally provided on the second adjustment block 60, facing outwards, and the first rotary knob 61 is... The extension plate 54 is screw-connected to the first adjustment block 52, and the first set screw 53 is screw-connected to the end of the first adjustment block 52 away from the X-axis adjustment plate 59, and the first set screw 53 is provided opposite the first rotary knob 61. A second U-shaped groove is made on the side of the second adjustment block 60 away from the first adjustment block 52, and the second rotary knob 57 is locked and provided inside the second U-shaped groove, and the second rotary knob 57 is screw-connected to the Y-axis adjustment plate 66, and a second set screw 58 is screw-connected to the top of the second adjustment block 60, and the second set screw 58 is provided opposite the second rotary knob 57.

[0009] As shown in Figures 3 and 5, in the embodiments of the present disclosure, the first rotary knob 61 and the second rotary knob 57 each include a roller 81, a knob head 82, and a male screw column 80, with stopper columns 83 integrally provided at both ends of the roller 81, the knob head 82 integrally provided at one stopper column 83, and the male screw column 80 integrally provided at the other stopper column 83. In other words, the first rotary knob 61 and the second rotary knob 57 each include a knob head 82, a roller 81, and a male screw column 80 connected in sequence, with stopper columns 83 connected between the knob head 82 and the roller 81, and between the roller 81 and the male screw column 80. In the first rotary knob 61, the roller 81 is located within the first U-shaped groove 62, and the stopper column 83 of the first rotary knob 61 is in close contact with the outside of the first U-shaped groove 62, making it easy to stop the roller 81 of the first rotary knob 61. In the first rotary knob 61, the male screw column 80 is screw-connected to the extension plate 54, and the first set screw 53 is provided opposite the roller 81 of the first rotary knob 61. In the second rotary knob 57, the roller 81 is located within the second U-shaped groove, and the stopper column 83 of the second rotary knob 57 is in close contact with the outside of the second U-shaped groove, making it easy to stop the roller 81 of the second rotary knob 57. In the second rotary knob 57, the male screw column 80 is screw-connected to the Y-axis adjustment plate 66, and the second set screw 58 is provided opposite the roller 81 of the second rotary knob 57.

[0010] During the adjustment process, the knob head 82 on the first rotary knob 61 is rotated to adjust the position of the X-axis adjustment plate 59 in the X-axis direction. After the adjustment is complete, the first set screw 53 is rotated to bring the first set screw 53 into contact with the roller 81 on the first rotary knob 61, and the knob head 82 on the second rotary knob 57 is rotated to adjust the position of the Y-axis adjustment plate 66 in the Y-axis direction. After the adjustment is complete, the second set screw 58 is rotated to bring the second set screw 58 into contact with the roller 81 on the second rotary knob 57. By adjusting the horizontal X and Y directions, the wafer 36 can be centered in the process chamber during mounting adjustment, which not only significantly improves deposition uniformity, but also allows for readjustment of the wafer 36's deposition position if an offset occurs, thereby achieving an optimal deposition effect. Furthermore, as shown in Figure 3, the first adjustment block 52 and the second adjustment block 60 are located at the same end; that is, the adjustment assembly is provided on the same side of the X-axis adjustment plate 59 and the Y-axis adjustment plate 66. This arrangement effectively improves ease of operation and reduces labor costs.

[0011] As shown in Figure 4, the positioning adjustment means further includes a positioning assembly, the positioning assembly includes a first fixed block 71 and a second fixed block 76, the bottom plate 40 having a second mounting groove at the top located on one side of the X-axis adjustment plate 59, the first fixed block 71 being fixedly mounted in the second mounting groove by bolts, the first cheese head screw 70 being screw-connected to the first fixed block 71, the first cheese head screw 70 being provided facing the X-axis adjustment plate 59, and the first lock nut 69 being screw-connected to the first cheese head screw 70, in this embodiment the first lock nut 69 being located on the side of the threaded portion of the first cheese head screw 70 that is closer to the screw head portion of the first cheese head screw 70, but is not limited to this, and the first lock nut 69 may be located on the side of the threaded portion of the first cheese head screw 70 that is further away from the screw head portion of the first cheese head screw 70.

[0012] The base plate 40 has a third mounting groove at its top, located on the other side of the X-axis adjustment plate 59. The second fixing block 76 is fixedly mounted in the third mounting groove via bolts. A second cheese head screw 78 is screw-connected to the second fixing block 76. The second cheese head screw 78 is positioned opposite the X-axis adjustment plate 59. A second lock nut 77 is screw-connected to the second cheese head screw 78. In this embodiment, the second lock nut 77 is located on the side of the threaded portion of the second cheese head screw 78 that is closer to the screw head portion. However, it is not limited to this, and the second lock nut 77 may be located on the side of the threaded portion of the second cheese head screw 78 that is further away from the screw head portion. A third cheese head screw 55 is screw-connected to the second adjustment block 60, and the third cheese head screw 55 is provided facing the Y-axis adjustment plate 66. A third lock nut 56 is screw-connected to the third cheese head screw 55. In this embodiment, the third lock nut 56 is located at the end of the threaded portion of the third cheese head screw 55 that is close to the thread head portion of the third cheese head screw 55, but is not limited to this, and the third lock nut 56 may be located at the end of the threaded portion of the third cheese head screw 55 that is far from the thread head portion of the third cheese head screw 55.

[0013] A second positioning groove is provided at the end of the X-axis adjustment plate 59 away from the second adjustment block 60, and a third fixing block 72 is fixedly attached to the second positioning groove via bolts. A fourth cheese head screw 73 is screw-connected to the third fixing block 72, and the fourth cheese head screw 73 is provided facing the Y-axis adjustment plate 66. A fourth lock nut 74 is screw-connected to the fourth cheese head screw 73. In this embodiment, the fourth lock nut 74 is located at the end of the threaded portion of the fourth cheese head screw 73 that is close to the screw head portion of the fourth cheese head screw 73, but is not limited to this, and the fourth lock nut 74 may be located at the end of the threaded portion of the fourth cheese head screw 73 that is far from the screw head portion of the fourth cheese head screw 73.

[0014] In the application, after the adjustment of the X-axis adjustment plate 59 is completed, the first cheese head screw 70 is rotated to bring the first cheese head screw 70 into contact with the X-axis adjustment plate 59, the first lock nut 69 is rotated to fasten the first lock nut 69 to the first fixing block 71, then the second cheese head screw 78 is rotated to bring the second cheese head screw 78 into contact with the X-axis adjustment plate 59, and finally the second lock nut 77 is rotated to fasten the second lock nut 77 to the second fixing block 76, thereby completing the positioning of the X-axis adjustment plate 59. After the adjustment of the Y-axis adjustment plate 66 is completed, the third cheese head screw 55 is rotated to bring it into contact with the Y-axis adjustment plate 66, fastening the third lock nut 56 to the second adjustment block 60, then the fourth cheese head screw 73 is rotated to bring it into contact with the Y-axis adjustment plate 66, and finally the fourth lock nut 74 is rotated to fasten the fourth lock nut 74 to the third fixing block 72, completing the positioning of the Y-axis adjustment plate 66.

[0015] As shown in Figures 3 and 4, a fourth mounting groove is made at the top of the bottom plate 40 on the side closest to the second fixing block 76, and the fourth fixing block 50 is fixedly attached to the fourth mounting groove via bolts, a first clamping hole is made in the fourth fixing block 50, a first dial gauge 48 is clamped in the first clamping hole, the gauge head of the first dial gauge 48 abuts against the X-axis adjustment plate 59, a first lock gap 51 is made at the top of the fourth fixing block 50, the first lock gap 51 communicates with the first clamping hole, a first through hole 49 is made at one end of the fourth fixing block 50, and a first screw hole is made at the other end, the first screw hole is provided opposite the first through hole 49 and the first screw hole and the first through hole 49 each communicate with the first lock gap 51, and a first lock bolt is provided in the first through hole 49. When fastening, the first lock bolt is screw-connected to the first screw hole, the first lock bolt is passed through the first lock gap 51, and at least a portion of the first dial gauge 48 is restricted to the first clamping hole on one side of the first lock bolt.

[0016] A third positioning groove is provided at the top of the end of the X-axis adjustment plate 59 closest to the first adjustment block 52, and a fifth fixing block 64 is mounted inside the third positioning groove. A second clamping hole is provided in the fifth fixing block 64, and a second dial gauge 68 is clamped inside the second clamping hole. The gauge head of the second dial gauge 68 is in contact with the Y-axis adjustment plate 66. A second lock gap 65 is provided at the top of the fifth fixing block 64, and the second lock gap 65 communicates with the second clamping hole. A second through hole 63 is provided on one side of the fifth fixing block 64, and a second screw hole 67 is provided on the other side. The second screw hole 67 is provided opposite the second through hole 63, and both the second screw hole 67 and the second through hole 63 communicate with the second lock gap 65. A second lock bolt is provided inside the second through hole 63. When fastening, the second lock bolt is screw-connected to the second screw hole 67, the second lock bolt 2 is passed through the second lock gap 65, and at least a portion of the second dial gauge 68 is restricted to the second clamping hole on one side of the second lock bolt.

[0017] By providing the first dial gauge 48 and the second dial gauge 68, the offset positions of the X-axis adjustment plate 59 and the Y-axis adjustment plate 66 can be accurately measured, and the deposition position of the wafer 36 can be recorded. If an offset occurs in the deposition position of the wafer 36, the deposition position of the wafer 36 can be readjusted based on the positions recorded by the first dial gauge 48 and the second dial gauge 68, thereby achieving an optimal deposition effect.

[0018] As shown in Figures 1 and 2, a lifting and rotating means is provided above the positioning adjustment means. Specifically, the lifting and rotating means includes a direct drive rotary motor 18. A mounting seat 19 is fixedly connected to one side of the Y-axis adjustment plate 66 via bolts. A linear cylinder 41 is fixedly connected to the top of the mounting seat 19 via bolts. A lifting plate 22 is fixedly connected to the output end of the linear cylinder 41 via bolts. A magnetic fluid dynamic seal member 20 is fixedly connected to the bottom of the lifting plate 22 via bolts. The magnetic fluid dynamic seal member 20 is fixedly connected to the output end of the direct drive rotary motor 18 via a plum blossom coupling 17. A motor seat 16 is fixedly connected to the drive rotary motor 18 via bolts, a guide shaft 15 is fixedly connected to the side of the Y-axis adjustment plate 66 away from the linear cylinder 41 via bolts, a linear bearing 14 is fixedly connected to the side of the motor seat 16 closer to the guide shaft 15 via bolts so as to be slidable to the guide shaft 15, a bracket 42 is fixedly connected to the linear cylinder 41 via bolts, and a first photoelectric sensor 44, a second photoelectric sensor 45, and a third photoelectric sensor 46 are mounted on the bracket 42 in the order of height direction, i.e., the second photoelectric sensor 45 is located below the third photoelectric sensor 46, and the first photoelectric sensor 44 is located below the second photoelectric sensor 45. A detection sheet 43 is fixedly connected to the side of the lifting plate 22 closer to the bracket 42 via a hex socket pan head screw.

[0019] In this embodiment, in the protruding state, the detection sheet 43 is detected by the first photoelectric sensor 44; in the initial state, the detection sheet 43 is detected by the second photoelectric sensor 45; and in the process state, the detection sheet 43 is detected by the third photoelectric sensor 46. The lifting and rotating means can not only realize the rotation process of the wafer 36, but also realize the adjustment in different states, improving the practicability of the processing of the wafer 36. In this embodiment, the second photoelectric sensor 45 is located at the end of the bracket 42 close to the first photoelectric sensor 44. In the initial state, it is necessary to perform positioning detection on the detection sheet 43 and the second photoelectric sensor 45. In the positioning method, since the positioning search is performed in the moving method in which the detection sheet 43 descends between the first photoelectric sensor 44 and the third photoelectric sensor 46 and then ascends, the second photoelectric sensor 45 is located at the end of the bracket 42 close to the first photoelectric sensor 44, so that the time for positioning detection can be effectively shortened and the cost can be reduced.

[0020] A process chamber is provided above the lifting and rotating mechanism, specifically the process chamber including a lower glass cover 32, an upper glass cover 35 and a gas cavity 5, a bellows 25 is fixedly connected to the top of the lifting plate 22 via a hex socket cheese head screw, the bellows 25 is provided opposite the magnetic fluid dynamic sealing member 20, a water-cooled seal block 26 is fixedly connected to the top of the bellows 25 via a hex socket cheese head screw, a retaining block 30 is fixedly connected to the top of the water-cooled seal block 26 via a hex socket cheese head screw, a projection 29 is provided outwardly on the bottom of the lower glass cover 32, the projection 29 is provided to engage between the water-cooled seal block 26 and the retaining block 30, and a lower clamp ring 6 is fixedly connected to the bottom of the gas cavity 5 via a hex socket cheese head screw, gas A clamp plate 3 is fixedly connected to the outer top of the cavity 5 via a hex socket cheese head screw, and an upper clamp ring 2 is fixedly connected to the top of the clamp plate 3 via a hex socket cheese head screw, and a first annular locking edge 7 is integrally provided outward on the top of the lower glass cover 32, and the first annular locking edge 7 is provided to lock between the gas cavity 5 and the lower clamp ring 6, and a second annular locking edge 1 is integrally provided outward on the upper glass cover 35, and the second annular locking edge 1 is provided to lock between the gas cavity 5 and the upper clamp ring 2, and an intake channel 4 is provided on one side of the gas cavity 5 and an exhaust channel 31 is provided on the other side, and the intake channel 4 is provided opposite to the exhaust channel 31, and a push port is opened at one end of the gas cavity 5 and a gate valve 47 is attached to the push port. When operation begins, the gate valve 47 opens, and an externally connected mechanical arm pushes the wafer 36 into the push port. During the deposition process, the gate valve 47 closes, and when the deposition process is complete, the gate valve 47 opens, and an externally connected mechanical arm pulls the wafer 36 out of the push port.

[0021] The process chamber can not only meet the requirement that the lifting and rotating means adjusts the deposition position of the wafer 36 in the process chamber, but also provide a sealed process space, thereby saving space costs. The clamp plate 3 is located between the gas cavity 5 and the upper clamp ring 2. Since frequent attachment and detachment are required between the gas cavity 5 and the upper clamp ring 2, when attaching and detaching, the fixed connection between the gas cavity 5 and the clamp plate 3 is maintained, and only the attachment and detachment between the upper clamp ring 2 and the clamp plate 3 are required. Excessive wear of the gas cavity 5 due to long-term replacement between the gas cavity 5 and the upper clamp ring 2 is effectively avoided, and the service life of the gas cavity 5 is further improved.

[0022] In this embodiment, at both ends of the bottom of the lower clamp ring 6, support arm plates 39 are fixedly connected via cheese head screws with hexagonal holes. Between the support arm plates 39, a beam 12 is fixedly connected via cheese head screws with hexagonal holes. An opening through which the bellows 25 can penetrate is formed in the beam 12. The beam 12 is fixedly connected to the bottom of the water-cooled seal block 26 via cheese head screws with hexagonal holes. At the bottom of the beam 12, a first support column 13 is fixedly connected via cheese head screws with hexagonal holes. The bottom of the first support column 13 is screw-connected to the bottom plate 40.

[0023] A housing ejection mechanism is provided inside the process chamber, and a lifting and rotating mechanism is used to lift and rotate the housing ejection mechanism. Specifically, the housing ejection mechanism includes a polygonal internal bush 24, a support arm, and a preheating ring 8. The support arm includes a second support column 34, and a polygonal locking column 23 is provided at the bottom of the second support column 34. The polygonal locking column 23 is locked inside the polygonal internal bush 24, and the polygonal internal bush 24 is a magnetic fluid dynamic seal via an adapter block 21. The second support column 34 is fixedly connected to member 20, and a plurality of support claws are integrally provided at the top of the second support column 34 at equal outward angles. The support claws include an inclined portion 11 and a horizontal portion 9. One end of the inclined portion 11 is integrally provided with the support arm, and the other end is integrally provided with the horizontal portion 9. The top of the horizontal portion 9 is engaged with the preheating ring 8 via a support pin. A sliding column 38 is integrally provided at the top of the inclined portion 11. The sliding column 38 and the inclined portion 11 have corresponding sliding holes, and a push-up pin 37 is slidably connected within the sliding hole.

[0024] A locking groove is provided at the top of the sliding column 38, and a locking portion is integrally provided at the top of the push-up pin 37 to abut against the locking groove. When the height to which the sliding column 38 has risen exceeds the height of the push-up pin 37, the sliding column 38 moves the push-up pin 37 upward. A wafer 36 is placed on the top of the push-up pin 37, and a stopper support portion 10 is integrally provided on the inner wall of the lower glass cover 32, and the stopper support portion 10 is provided opposite the push-up pin 37, and a butt groove 33 for accommodating the wafer 36 is provided at the inner top of the preheating ring 8, and the wafer 36 can be accommodated in the butt groove 33 because the top of the sliding column 38 is not higher than the bottom of the butt groove 33. By combining the receiving and ejecting means with the lifting and rotating means, not only can the wafer deposition process of the wafer 36 be realized, but the wafer 36 can also be separated from the preheating ring 8 when placing and removing the wafer 36, effectively avoiding damage to the wafer 36 caused by minute rigid collisions between the wafer 36 and the preheating ring 8, and significantly improving the deposition quality of the wafer 36.

[0025] In the application, initially, the detection sheet 43 is detected by the second photoelectric sensor 45. When the epitaxial dynamic sealing device is in operation, the detection sheet 43 is detected by the first photoelectric sensor 44, the linear cylinder 41 moves the support arm downward, and the stopper support part 10 extends the push-up pin 37. The gate valve 47 opens, and an externally connected mechanical arm sends the wafer 36 above the push-up pin 37 and slowly lowers it, positioning the wafer 36 on the push-up pin 37. Subsequently, the externally connected mechanical arm stops descending and moves outward, the gate valve 47 closes, the detection sheet 43 is detected by the third photoelectric sensor 46, and the linear cylinder 41 moves the support arm upward, housing the wafer 36 in the butt groove 33 and moving it upward to the intake channel 4 and exhaust channel 31. The direct-drive rotary motor 18 rotates the support arm at a constant speed, allowing the reaction gas to flow from the intake channel 4 and deposit onto the top surface of the wafer 36. The reaction gas is discharged through the exhaust channel 31. After the deposit is complete, the detection sheet 43 is detected by the first photoelectric sensor 44, the linear cylinder 41 moves the support arm downward, the push-up pin 37 separates the wafer 36 from the preheating ring 8, the gate valve 47 opens, and an externally connected mechanical arm penetrates the bottom of the wafer 36, lifts the wafer 36, and removes it from the push port. The gate valve 47 closes, the detection sheet 43 is detected by the second photoelectric sensor 45, and returns to its initial state.

[0026] In this embodiment, a seal ring 28 is provided between the projection 29 and the water-cooled seal block 26, and a water inlet 86 and a water outlet 89 are provided on the outside of the water-cooled seal block 26. An annular water channel 27 is connected between the water inlet 86 and the water outlet 89. The installation of the annular water channel 27 effectively prevents hardening of the seal ring 28 at high temperatures, thereby effectively improving the service life of the seal ring 28. An intake pipe 87 and a detection pipe 88 are further provided on the outside of the water-cooled seal block 26. The intake pipe 87 communicates with the process chamber, and before the epitaxial dynamic sealing device operates, the intake channel 4 and the intake pipe 87 simultaneously flow the reaction gas into the process chamber, thereby effectively removing air from the process chamber, improving exhaust efficiency, and further enhancing the deposition effect in the process state. The detection conduit 88 communicates with the connection point between the projection 29 and the water-cooled seal block 26. A pressure sensor 84 is connected to the outside of the detection conduit 88, and a vacuum pump 85 is attached to the end of the pressure sensor 84 that is away from the detection conduit 88. Before removing the air, it is convenient to start the vacuum pump 85 and use the pressure sensor 84 to detect the airtightness between the projection 29 and the water-cooled seal block 26. Not limited to this, seal rings 28 are provided between the water-cooled seal block 26 and the beam 12, between the lifting plate 22 and the bellows 25, between the lifting plate 22 and the magnetic fluid dynamic seal member 20, between the gas cavity 5 and the first annular locking edge 7, between the first annular locking edge 7 and the lower clamp ring 6, between the upper clamp ring 2 and the second annular locking edge 1, between the second annular locking edge 1 and the gas cavity 5, and between the gas cavity 5 and the upper clamp ring 2.

[0027] It should be noted that the above are merely preferred embodiments of the present disclosure, and several improvements and modifications can be made without departing from the technical principles of the present disclosure, and these improvements and modifications should also be considered within the scope of protection of the present disclosure. [Explanation of symbols]

[0028] 1. Second ring-shaped locking edge 2. Upper clamp ring 3. Clamp plate 4. Intake channel 5. Gas cavity 6. Lower clamp ring 7. First ring-shaped locking edge 8. Preheating ring 9, horizontal part 10. Stopper support section 11, slope part 12. Beam 13, 1st support pillar 14. Linear bearings 15. Guide axis 16. Motor seat 17. Plum Blossom Coupling 18. Direct drive rotary motor 19. Mounting base 20. Magnetic fluid dynamic sealing member 21. Adapter Block 22. Lifting platform 23. Polygonal locking post 24. Polygonal internal bushing 25. Bellows 26. Water cooling seal block 27. Circular waterway 28. Seal ring 29, protrusion 30. Retaining block 31. Exhaust channel 32. Lower glass cover 33. Butt groove 34, second support column 35. Upper glass cover 36. Wafer 37. Push-up pin 38, sliding column 39. Support arm plate 40, bottom plate 41. Linear cylinder 42. Bracket 43. Detection Sheet 44. First photoelectric sensor 45. Second photoelectric sensor 46. ​​Third photoelectric sensor 47. Gate valve 48. First dial gauge 49. First through hole 50. Fourth fixed block 51. First lock gap 52. First adjustment block 53. First set screw 54, extension plate 55. Third cheese head screw 56. Third lock nut 57. Second rotation knob 58. Second set screw 59, X-axis adjustment plate 60. Second adjustment block 61. First rotation knob 62, 1st U-shaped groove 63. Second through hole 64. Fifth fixed block 65. Second lock gap 66, Y-axis adjustment plate 67. Second screw hole 68. Second dial gauge 69. First lock nut 70. First cheese head screw 71. First fixed block 72. Third fixed block 73. Fourth cheese head screw 74. Fourth lock nut 75. First linear guide rail 76. Second fixed block 77. Second lock nut 78. Second cheese head screw 79. Second linear guide rail 80, Male screw column 81. Roller 82. Knob head 83. Stopper column 84. Pressure sensor 85. Vacuum pump 86, water inlet 87. Intake line 88. Detection pipeline 89, water outlet.

Claims

1. A dynamic seal deposition apparatus for epitaxial applications, Including a base plate, a positioning adjustment means is provided above the base plate, a lifting and rotating means is provided above the positioning adjustment means, a magnetic fluid dynamic sealing member is provided above the lifting and rotating means, a process chamber is provided above the magnetic fluid dynamic sealing member, and a housing and ejection means is provided inside the process chamber. The positioning adjustment means includes an X-axis adjustment plate, a Y-axis adjustment plate, and an adjustment assembly provided at one end of the X-axis adjustment plate and the Y-axis adjustment plate, wherein the bottom of the X-axis adjustment plate is connected to the bottom plate via a first linear guide rail provided in the lateral direction, and the bottom of the Y-axis adjustment plate is connected to the X-axis adjustment plate via a second linear guide rail provided in the vertical direction. The adjustment assembly includes a first adjustment block provided on the bottom plate and a second adjustment block provided on the X-axis adjustment plate, the first adjustment block is provided with a first rotary knob, the first rotary knob is connected to the second adjustment block, the second adjustment block is provided with a second rotary knob, the second rotary knob is connected to the Y-axis adjustment plate, and the horizontal adjustment of the lifting and lowering rotation means is achieved by rotating the first rotary knob and the second rotary knob in sequence. The receiving and ejecting means includes a support arm, the top of the support arm is provided with a preheating ring, the bottom of the support arm is connected to the magnetic fluid dynamic seal member, a butt groove for receiving a wafer is provided in the inner top of the preheating ring, a push-up pin is slidably provided on the support arm, the process chamber is provided with a stopper support opposite to the bottom of the push-up pin, and the lifting and rotating means is used to lift and rotate the support arm, wherein the device is an epitaxial dynamic seal deposition apparatus.

2. A first U-shaped groove is provided on the top of the first adjustment block, and the first rotary knob is provided locked in the first U-shaped groove; an extending plate is provided on the second adjustment block facing outward, and the first rotary knob is connected to the extending plate; a first set screw is provided on one end of the first adjustment block, and the first set screw is provided opposite to the first rotary knob; a second U-shaped groove is provided on one side of the second adjustment block, and the second rotary knob is provided locked in the second U-shaped groove; a second set screw is provided on the top of the second adjustment block, and the second set screw is provided opposite to the second rotary knob, as described in claim 1.

3. The first and second rotary knobs each include a roller, a knob head, and a male screw column, stopper columns are connected to both ends of the roller, the knob head is connected to the stopper column at one end, the male screw column is connected to the stopper column at the other end, the roller in the first rotary knob is provided in the first U-shaped groove, the stopper column in the first rotary knob is in close contact with the outside of the first U-shaped groove, and the male screw column in the first rotary knob extends The epitaxial dynamic seal deposition apparatus according to claim 2, wherein the first set screw is connected to a plate, the first set screw is provided opposite to the roller of the first rotary knob, the roller of the second rotary knob is provided in the second U-shaped groove, the stopper column of the second rotary knob is in close contact with the outside of the second U-shaped groove, the male screw column of the second rotary knob is connected to the Y-axis adjustment plate, and the second set screw is provided opposite to the roller of the second rotary knob.

4. The positioning adjustment means further includes a positioning assembly, the positioning assembly includes a first fixed block and a second fixed block, the first fixed block is attached to the bottom plate and located on one side of the X-axis adjustment plate, the first fixed block is provided with a first cheese head screw, the first cheese head screw is provided facing the X-axis adjustment plate, and the first cheese head screw is connected to a first lock nut for stopping the first cheese head screw, the second fixed block is attached to the bottom plate and located on the other side of the X-axis adjustment plate, the second fixed block is provided with a second cheese head screw, the second cheese head screw is provided facing the X-axis adjustment plate, and the second cheese head screw is A second lock nut is connected to stop the second cheese head screw; a third cheese head screw is provided on the second adjustment block; the third cheese head screw is provided opposite the Y-axis adjustment plate; a third lock nut is connected to the third cheese head screw to stop the third cheese head screw; a third fixing block is attached to the end of the X-axis adjustment plate away from the second adjustment block; a fourth cheese head screw is provided on the third fixing block; the fourth cheese head screw is provided opposite the Y-axis adjustment plate; and a fourth lock nut is connected to the fourth cheese head screw to stop the fourth cheese head screw, as described in claim 2.

5. A fourth fixing block is attached to the side of the base plate closest to the second fixing block, a first clamping hole is made in the fourth fixing block, a first dial gauge is clamped in the first clamping hole, the gauge head of the first dial gauge abuts against the X-axis adjustment plate, a first lock gap is made at the top of the fourth fixing block, the first lock gap communicates with the first clamping hole, a first through hole is made at one end of the fourth fixing block, and a first screw hole is made at the other end, the first screw hole is provided opposite the first through hole and the first screw hole and the first through hole each communicate with the first lock gap, a first lock bolt is provided in the first through hole, the first lock bolt is connected to the first screw hole, and the first adjustment block of the X-axis adjustment plate A fifth fixing block is attached to the end closest to the cubic, a second clamping hole is made in the fifth fixing block, a second dial gauge is clamped in the second clamping hole, the gauge head of the second dial gauge is in contact with the Y-axis adjustment plate, a second lock gap is made at the top of the fifth fixing block, the second lock gap communicates with the second clamping hole, a second through hole is made on one side of the fifth fixing block, and a second screw hole is made on the other side, the second screw hole is provided opposite the second through hole, and the second screw hole and the second through hole each communicate with the second lock gap, a second lock bolt is provided in the second through hole, and the second lock bolt is connected to the second screw hole, as described in claim 4.

6. The lifting and lowering rotation means includes a direct drive rotary motor, a mounting seat is provided on one side of the Y-axis adjustment plate, a linear cylinder is provided on the top of the mounting seat, a lifting plate is connected to the output end of the linear cylinder, a magnetic fluid dynamic seal member is connected to the bottom of the lifting plate, the magnetic fluid dynamic seal member is connected to the output end of the direct drive rotary motor via a plum blossom coupling, a motor seat is connected between the magnetic fluid dynamic seal member and the direct drive rotary motor, a guide shaft is connected to the side of the Y-axis adjustment plate away from the linear cylinder, and the motor A linear bearing slidably connected to the guide shaft is connected to the side of the seat closest to the guide shaft, a bracket is connected to the linear cylinder, a first photoelectric sensor, a second photoelectric sensor, and a third photoelectric sensor are mounted sequentially on the bracket along the height direction, a detection sheet is connected to the side of the lifting plate closest to the bracket, the detection sheet is detected by the first photoelectric sensor in the protruding state, the detection sheet is detected by the second photoelectric sensor in the initial state, and the detection sheet is detected by the third photoelectric sensor in the process state, as described in claim 2.

7. The process chamber includes a lower glass cover, an upper glass cover, and a gas cavity, a bellows connected to the top of the lifting plate, the bellows facing the magnetic fluid dynamic sealing member, a water-cooled seal block connected to the top of the bellows, a retaining block connected to the top of the water-cooled seal block, a projection outwardly provided on the bottom of the lower glass cover, the projection engaging between the water-cooled seal block and the retaining block, and a lower clamping ring at the bottom of the gas cavity. The epitaxial dynamic seal deposition apparatus according to claim 6, wherein a clamp plate is connected to the outer top of the gas cavity, an upper clamp ring is connected to the top of the clamp plate, a first annular locking edge is provided outward on the top of the lower glass cover, the first annular locking edge is provided to lock between the gas cavity and the lower clamp ring, and a second annular locking edge is provided outward on the upper glass cover, the second annular locking edge is provided to lock between the gas cavity and the upper clamp ring.

8. The epitaxial dynamic seal deposition apparatus according to claim 7, wherein support arm plates are connected to both ends of the bottom of the lower clamp ring, a beam is connected between the support arm plates, the beam has openings through which a bellows can pass, the beam is connected to the bottom of the water-cooled seal block, a first support column is connected to the bottom of the beam, and the first support column is connected to the bottom plate.

9. The receiving and protruding means further includes a polygonal internal bush, the support arm includes a second support column, a polygonal locking column is provided at the bottom of the second support column, the polygonal locking column is provided locked within the polygonal internal bush, the polygonal internal bush is connected to the magnetic fluid dynamic sealing member via an adapter block, a plurality of support claws are provided at the top of the second support column, facing outward at equal angles, the support claws include an inclined portion and a horizontal portion, the inclined portion is The epitaxial dynamic seal deposition apparatus according to claim 7, wherein one end is connected to the support arm and the other end is connected to the horizontal portion, the top of the horizontal portion is connected to the preheating ring via a support pin, a sliding column is provided at the top of the inclined portion, a sliding hole is made in the sliding column corresponding to the inclined portion, the push-up pin is provided in the sliding hole, the stopper support portion is provided on the inner wall of the lower glass cover, and the top of the sliding column is not higher than the bottom of the butt groove.

10. A seal ring is provided between the projection and the water-cooled seal block, a water inlet and a water outlet are provided on the outside of the water-cooled seal block, an annular water channel is connected between the water inlet and the water outlet, an intake line and a detection line are further provided on the outside of the water-cooled seal block, the intake line is connected to the process chamber, the detection line is connected to the connection point between the projection and the water-cooled seal block, a pressure sensor is connected to the outside of the detection line, and a vacuum pump is attached to the end of the pressure sensor away from the detection line, as described in claim 7.

11. A dynamic seal deposition apparatus for epitaxial applications, The base plate and A positioning adjustment means is provided above the bottom plate and includes an X-axis adjustment plate, a Y-axis adjustment plate, and an adjustment assembly. A lifting and lowering rotating means provided above the positioning adjustment means, with a magnetic fluid dynamic sealing member provided above it, wherein a process chamber is provided above the magnetic fluid dynamic sealing member, The accommodating ejection means is provided inside the process chamber and includes a support arm, the bottom of which is connected to the magnetic fluid dynamic sealing member, the top of which is used to accommodate a wafer, and the lifting and rotating means is configured to lift and rotate the support arm, The adjustment assembly is provided at one end of the X-axis adjustment plate and the Y-axis adjustment plate, and the adjustment assembly is configured to enable horizontal adjustment of the lifting and rotating means, in an epitaxial dynamic seal deposition apparatus.

12. The epitaxial dynamic seal deposition apparatus according to claim 11, wherein the bottom of the X-axis adjustment plate is connected to the bottom plate via a first linear guide rail provided in the horizontal direction, and the bottom of the Y-axis adjustment plate is connected to the X-axis adjustment plate via a second linear guide rail provided in the vertical direction.

13. The adjustment assembly is A first adjustment block provided on the base plate and the X-axis adjustment plate, and equipped with a first rotary knob, The epitaxial dynamic seal deposition apparatus according to claim 11, further comprising a second adjustment block connected to the first rotation knob and provided with a second rotation knob, wherein the second rotation knob is connected to the Y-axis adjustment plate, and the horizontal adjustment of the lifting and lowering rotation means is achieved by sequentially rotating the first rotation knob and the second rotation knob.

14. A preheating ring is provided at the top of the support arm, a butt groove for accommodating the wafer is provided at the inner top of the preheating ring, and a push-up pin is slidably provided on the support arm. The epitaxial dynamic seal deposition apparatus according to claim 11, wherein the process chamber is provided with a stopper support opposite to the bottom of the push-up pin.

Images