Method for manufacturing an SMD semiconductor assembly equipped with circuit carriers, SMD semiconductor assembly, and circuit carriers

Abstract

The present invention relates to a method for manufacturing an SMD semiconductor assembly equipped with a circuit carrier. The method comprises the steps of: providing an SMD circuit carrier, preferably an IMS substrate or lead frame, having contacts between a conductor path structure and an insulator; providing a circuit carrier having a first main surface on which an electrical conductor is at least partially provided and a second main surface facing the first main surface and also on which an electrical conductor is at least partially provided, wherein the circuit carrier is provided with at least one blind hole having the electrical conductor and a blind hole bottom, the blind hole bottom preferably formed by only at least one layer of the electrical conductor; and positioning the blind hole bottom of the circuit carrier in contact with the contacts of the SMD circuit carrier, and making electrical contact by melting the blind hole bottom of the circuit carrier and the contacts of the SMD circuit carrier by laser welding.

Description

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[0001] This patent application claims priority based on International Patent Application No. PCT / EP2024 / 056513, entitled "Method for Manufacturing an SMD Semiconductor Assembly with a Circuit Carrier, SMD Semiconductor Assembly, and Circuit Carrier", filed on March 12, 2024. This document claims priority based on German Patent Application No. 10 2023 110 343.1, entitled "Method for Manufacturing an SMD Semiconductor Assembly with a Circuit Carrier, SMD Semiconductor Assembly, and Circuit Carrier", filed on April 24, 2023. The subject matter of International Patent Application No. PCT / EP2024 / 056513 and German Patent Application No. 10 2023 110 343.1 is hereby incorporated by reference in its entirety. Statement regarding research or development supported by the federal government

[0002] Not applicable. Incorporation by reference of materials submitted on compact discs

[0003] Not applicable.

Technical Field

[0004] The present invention relates to a method for manufacturing an SMD semiconductor assembly with a circuit carrier.

[0005] The present invention further relates to an SMD semiconductor assembly and a circuit carrier used in the above method.

Background Art

[0006] DE 40 02 326 A1 discloses a method and apparatus for drilling through a printed circuit board. To manufacture a circuit board with connection holes, first a guide hole is generated with a drill, and then a laser is used to remove the synthetic resin material down to the copper foil on the lower surface. Then, the connection holes thus formed are coated with a copper layer, and a wiring pattern is formed by etching.

[0007] DE 10 2014 209 411 A1 relates to an electronic control module for transmission control and a method for manufacturing it. On the side of the circuit board facing the electrical components, there are connections for the electrical components, which must be made in contact via press-fit connections of press contacts pre-pressed into openings in the circuit board. For this purpose, the component connections are welded to the press-fit connections of the press contacts using a laser. The openings in the circuit board housing the press contacts must be covered with a plastic frame to protect them from contamination. Manufacturing this electrical component is complex and costly. [Overview of the Initiative]

[0008] The objective of this invention is to enable the assembly of circuit carriers onto SMD circuit carriers in a highly reliable and cost-effective manner, while consuming virtually no installation space. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a highly simplified schematic diagram showing an example of an SMD semiconductor assembly according to the present invention. [Figure 2] Figure 2 is a highly simplified schematic diagram illustrating the process of electrically contacting circuit carriers with other SMD circuit carriers by laser welding for manufacturing the SMD semiconductor assembly shown in Figure 1. [Figure 3] Figure 3 shows an example of a circuit carrier as an assembly unit with electrical and / or electronic components pre-installed, for forming the electronic contacts shown in Figure 2. [Figure 4] Figure 4 shows an alternative example of a multilayer circuit carrier designed as an assembly unit with electrical and / or electronic components pre-mounted, for forming electronic contact with the SMD circuit carrier by laser welding. [Figure 5] Figure 5 is a highly simplified schematic diagram showing the laser performing the laser welding connection described in Figure 2. [Figure 6]Figure 6 is a plan view of the top surface of the circuit carrier shown in Figure 3, and shows the area of ​​the blind hole before laser welding. [Figure 7] Figure 7 is a plan view of the top surface of the circuit carrier relating to Figure 3, showing the region of blind holes during the laser welding process. [Figure 8] Figure 8 is a highly simplified schematic diagram showing an alternative example of an SMD semiconductor assembly according to the present invention. [Figure 9] Figure 9 is a simplified perspective view showing another example of circuit carrier connection according to the present invention, in which the connection is made by laser welding to the power semiconductor connection element of the SMD circuit carrier in the blind hole of the circuit carrier. [Modes for carrying out the invention]

[0010] The present invention will be described in more detail below with reference to the drawings.

[0011] The object of the present invention is achieved with respect to the manufacturing method described in claim 1, the SMD semiconductor assembly described in claim 10, and the circuit carrier described in claim 17. Preferred embodiments of the present invention are described in their respective dependent claims.

[0012] The method according to the present invention includes the following steps.

[0013] The step of providing an SMD circuit carrier, preferably having contacts between a foil-like or layered conductor path structure and an insulator, and preferably in the form of an IMS substrate or a lead frame.

[0014] The step of providing a circuit carrier having a first main surface at least partially covered with an electrical conductor and a second main surface facing the first main surface and at least partially covered with an electrical conductor, wherein the circuit carrier is provided with at least one blind hole that is covered with the electrical conductor and has a blind hole bottom, and the blind hole bottom is preferably formed by at least one layer of the electrical conductor.

[0015] The step of positioning the bottom of the blind hole of the circuit carrier in contact with the contact of the SMD circuit carrier, and then making an electrical contact by melting the bottom of the blind hole of the circuit carrier and the contact of the SMD circuit carrier by laser welding. The method according to the present invention makes it possible to weld an SMD circuit carrier to a circuit carrier using a clean technique with reliable conductive electrical contact without using soldering techniques, i.e., without using fluxers, radiant heaters, or solder waves. This makes it possible to reliably assemble an SMD circuit carrier, preferably in the form of an IMC substrate or lead frame, to a circuit carrier in a particularly cost-effective manner. In addition, since no additional connecting parts are used, connections can be made in a minimum space. Eliminating additional connecting parts improves the quality and reliability of the connection.

[0016] It is possible to additionally bond SMD circuit carriers to other circuit carriers after the laser welding process. This can further enhance reliability.

[0017] Preferably, the SMD circuit carriers are bonded together using a so-called underfilling with a fluid adhesive. By using underfilling, it is possible to fill the gaps between the SMD circuit carriers with adhesive.

[0018] Alternatively or additionally, the circuit carrier can be fixed to the SMD circuit carrier by a mechanical holder, preferably a retaining plate. The circuit carrier is crimped between the holder and the SMD circuit carrier. Preferably, this also allows each power semiconductor 4 to be electrically and thermally contacted in its coating 6, forming a pressure contact on the SMD circuit carrier 1. Thus, laser welding is required only in the area of ​​the connection element. In the area of ​​the laser welding point, the holder can be provided with an opening for the laser beam. This allows laser welding with the retaining plate pre-assembled.

[0019] The method of the present invention makes it possible to electrically connect a circuit carrier, on which electrical and / or electronic components are pre-mounted, by laser welding the bottom of the blind holes in the circuit carrier to the contacts of the SMD circuit carrier. Thus, such a circuit carrier can be advantageously prepared in advance as a completed assembly module by the method of the present invention, and the SMD circuit carrier can be connected or assembled in, for example, a single process step.

[0020] An SMD circuit carrier may also include at least one power semiconductor on the side to which the circuit carrier is mounted. Specifically, the power semiconductor is a component with high current capacity (e.g., a component designed for a minimum current of 100A). The higher the current in such a component, the greater the heat generated at the contact points. Such an SMD semiconductor assembly containing a power semiconductor can be complemented by a circuit carrier to which electrical and / or electronic components are mounted using the method according to the present invention. For example, the electrical and / or electronic components of the circuit carrier may be a processor or microchip for electronic control, and / or a sensor and / or data acquisition (data logger), and / or a data transmission module or data interface such as a wireless module. Such functions can be fully or partially integrated into a microchip that can be mounted on the circuit carrier.

[0021] In particular, at least one power semiconductor has a connecting element positioned in contact with the contacts of the SMD circuit carrier, and the connecting element is also electrically contacted with the associated contacts using laser welding. Thus, it is possible to electrically contact at least one power semiconductor and the component-side circuit carrier of the SMD circuit carrier using laser welding.

[0022] In the welding process, the laser beam preferably scans the surface of the SMD semiconductor using inspection optics, optically directs the laser to each welding position, and laser welding can be sequentially performed at the points identified by the inspection optics.

[0023] Both the electrical contact between the bottom of the blind hole of the circuit carrier and the contacts of the SMD circuit carrier, and the electrical contact between the connecting element of at least one power semiconductor and the associated contacts of the SMD circuit carrier are particularly advantageous in terms of manufacturing technology when implemented by laser welding. In this way, it is possible to sequentially and permanently electrically contact both the power semiconductor and, in particular, the circuit carrier to which electrical and / or electronic components can be pre-mounted, using a laser in one process step.

[0024] The method according to the invention can also be advantageously used when the SMD circuit carrier has a cooler in the form of a heat-dissipating metal layer, a cooling structure, or an active cooling device (e.g., cooling by coolant) on the side opposite to the side on which the circuit carrier is mounted.

[0025] An IMS substrate is one in which an insulator in the form of a layer of insulator or dielectric is formed on a metal substrate (preferably an aluminum substrate), and a conductor path structure (particularly in the form of a metal foil, preferably a copper foil) is arranged thereon. In addition to ensuring mechanical stability, the metal substrate also functions to dissipate heat, for example, to a cooler. A lead frame is a frame-shaped stamped metal conductor carrier that is attached on an insulating carrier or within a housing.

[0026] The present invention further relates to an SMD semiconductor assembly comprising an SMD circuit carrier having contacts between a conductor path structure and an insulator, preferably in the form of an IMS substrate or lead frame, having a first main surface and a second main surface, and having at least one circuit carrier on which electrical and / or electronic components are mounted, the circuit carrier also provided on the first main surface of the SMD circuit carrier, wherein the circuit carrier has at least one blind hole having a blind hole bottom, the blind hole bottom preferably formed by only at least one electrical conductor layer, and the electrical contact between the circuit carrier and the SMD circuit carrier is provided in the form of a laser welded connection at the blind hole bottom.

[0027] Preferably, the first main surface of the SMD circuit carrier is further provided with at least one power semiconductor.

[0028] Since the electrical contact between at least one power semiconductor and the first main surface of the SMD circuit carrier is provided in the form of a laser-welded connection on the power semiconductor's connecting element, the assembly or electrical contact between the SMD circuit carrier and at least one power semiconductor and the circuit carrier can be carried out in a single process step.

[0029] Preferably, electrical contact between at least one power semiconductor and the first main surface of the SMD circuit carrier is provided in the form of a laser-welded connection on the connecting element (connecting leg) of the power semiconductor.

[0030] To fix the circuit carriers, an adhesive layer, preferably in the form of an underfill adhesive layer, can be provided between the SMD circuit carriers. The adhesive material is preferably an insulator or dielectric. Alternatively or additionally, circuit carriers, preferably including power semiconductors, can be crimped onto the SMD circuit carriers between a holder, preferably a retaining plate, and the SMD circuit carriers.

[0031] According to one effective embodiment, the SMD circuit carrier is provided with a cooler, specifically in the form of a cooling structure and / or a metal layer and / or an active cooling device (e.g., cooling by a coolant), on the side opposite to the side on which the circuit carrier is mounted.

[0032] The SMD circuit carrier is preferably an IMS substrate. An IMS substrate is a metal substrate (preferably an aluminum substrate) on which an insulating or dielectric layer is formed, and on which a conductive path structure is formed. The metal substrate is used for heat dissipation and therefore provides a thermally conductive contact with the cooler.

[0033] The present invention further relates to a circuit carrier having at least one blind hole having a blind hole bottom made of a conductive material, for use in the methods described in claims 1 to 9. According to the present invention, the circuit carrier is configured as an assembly unit for laser welding processes, with electrical and / or electronic components pre-mounted.

[0034] Reference numeral 1 in Figure 1 refers to a multilayer SMD circuit carrier. The SMD circuit carrier 1 includes a base body 7 and a conductive path structure 2a provided on the component side of the SMD circuit carrier 1. Between them is a layer of insulator 2 or dielectric. The conductive path structure 2a is preferably a copper layer, specifically in the form of coated and structured copper foil. The corresponding SMD circuit carrier 1 is also called an IMS (Insulating Metal Substrate). The base body 7 is a substrate based on metal, specifically aluminum or copper. The base body 7 has excellent mechanical stability and high thermal conductivity, making it suitable for functioning as a cooler for an SMD semiconductor assembly, or at least for establishing a thermal conductive contact with a cooler 110, indicated by a dashed line (as shown in Figure 1).

[0035] On the component side of the SMD circuit carrier 1, at least one, preferably more, power semiconductors 4 are electrically contacted. This electrical contact is made, on the one hand, through the conductive and thermally conductive base surface 4a of the power semiconductor 4 and the contact point of the conductive path structure 2a of the SMD circuit carrier 1. The conductive and thermally conductive base surface 4a can be provided with a coating 6 made of silver or a silver alloy. On the other hand, the connecting element 5 (connecting leg) of the power semiconductor 4 is electrically contacted with the contact point 3 of the conductive path structure 2a by a laser-welded connection part 16a. Furthermore, the power semiconductor 4 can be mechanically fixed to the SMD circuit carrier 1 with a constant contact pressure via a retaining part (not shown in Figure 1) located on the upper surface of the component and connected to the SMD circuit carrier 1.

[0036] The power semiconductor 4 is specifically a component with a high current-carrying capacity (for example, a component designed for a minimum current of 100A). In such power semiconductors, the heat generated at the contact points increases as the current increases. In this respect, the laser-welded connection 16a has a particularly advantageous effect in terms of current-carrying capacity compared to the soldered joint.

[0037] Such power semiconductors can be used, in particular, to control electromechanical devices, such as brushless DC motors.

[0038] Furthermore, the SMD circuit carrier 1 in Figure 1 is equipped with at least one circuit carrier 100 on its component side, which includes electrical components and / or electronic components 105. Specifically, the electronic components may be a processor or microchip for electronic control and / or data acquisition (data logger), and / or a data transmission module or communication technology (such as a wireless module), and / or a data interface. Such functions can be fully or partially integrated into a microchip that can be mounted on the circuit carrier 100. For example, the electrical component 105 in Figure 1 may be an electronic control processor, a data logger, or a wireless module.

[0039] The circuit carrier 100 comprises an insulating layer 109. The insulating layer 109 has a first main surface 102 on the component side of the circuit carrier 100 and a second main surface 103 opposite to the first main surface 102. Both main surfaces 102 and 103 are preferably provided with a structured electrical conductor, for example, in the form of a structured copper layer. A more detailed illustration of the layer arrangement can be seen in Figures 2 to 4.

[0040] The SMD circuit carrier 1 forms an SMD semiconductor assembly by combining a power semiconductor 4 electrically contacted on its component side with at least one circuit carrier 100. Such an SMD semiconductor assembly is placed on a cooler 110. The cooler 110 is schematically shown in Figure 1 by dashed lines in a highly simplified manner.

[0041] Figure 2 illustrates in detail the electrical contact and fixation of the circuit carrier 100 of the SMD semiconductor assembly in Figure 1 onto the SMD circuit carrier 1. The electrical contact between the circuit carrier 100 and the SMD circuit carrier 1 is made by laser welding in the region of the blind hole 108 of the circuit carrier 100. The blind hole 108 is preferably a blind hole in which a blind hole bottom 104 is formed, which is formed only by an electrically conductive layer in the form of an electroplating layer 101 and an underside metallization 118 (also called "via metallization") of the circuit carrier 100. This means that the material of the insulating layer 109 is not present in the region of the blind hole bottom 104. During laser welding, it is necessary to melt only the blind hole bottom 104, which consists of the electrical conductor or the relevant contact of the conductive path structure 2a, to form the laser-welded connection 16b. Reference numeral 117 indicates the topside metallization of the circuit carrier 100, on which the electroplating layer 101 is also located.

[0042] In the welding process, it is preferable to use a laser equipped with a scanner 24, preferably a fiber laser 22. The scanner 24 recognizes the relevant contacts to be welded and can align the laser beam 18 to them according to the position of the contacts to be welded. It is preferable that the laser beam is always irradiated at a 90° angle to the contacts to be welded. Each alignment of the laser 22 is performed in the scanner 24. This is simplified and schematicly shown in Figure 2 by adding dashed laser beams. This makes it possible to sequentially expose individual contacts of the welded, located in different blind holes, to the laser beam, preferably at a 90° angle.

[0043] The laser light is guided by the laser through a glass fiber 19, and the laser beam 18 is directed to each welding point via a scanner 24 and the optical system located therein.

[0044] Therefore, electrical contact between the blind hole bottom 104 of the circuit carrier 100 and the contact 3 of the SMD circuit carrier 1, and electrical contact between the connecting element 5 of at least one power semiconductor 4 and the corresponding contact 3 of the SMD circuit carrier 1, can be advantageously performed by laser welding. The laser beam 18 is sequentially optically aligned to each welding position by its inspection optical system (scanner 24). This advantageously allows the SMD circuit carrier 1 to be electrically connected to both the power semiconductor 4 and the circuit carrier 100 comprising the electronic component 105 in a single process step without using complex soldering techniques.

[0045] To further enhance the mechanical strength of the circuit carrier 100 on the SMD circuit carrier 1, the SMD circuit carrier 1 and the circuit carrier 100 are preferably bonded together after laser welding.

[0046] For this purpose, an adhesive 106 that is fluid in its initial state is used. The adhesive 106 penetrates into the gap between the circuit carrier 100 and the SMD circuit carrier 1 in the form of an underfill, and ensures mechanical adhesion after curing. A particular advantage of the present invention is that a pre-assembled circuit carrier 100 can be kept on hand at all times and electrically brought into contact with the SMD circuit carrier 1 in the manner described above.

[0047] Figure 3 shows an example of such a circuit carrier 100 with electrical and / or electronic components 105 pre-mounted, which can be used as an assembly unit for a laser welding process.

[0048] As clearly shown in Figure 3, the bottom of the blind hole 104 is formed solely of an electrical conductor. The electrical conductor can include several layers in the region of the bottom of the blind hole 104 (for example, two layers, namely the electroplating layer 101 and the bottom metallization 118, as visible in Figure 3). Although not shown, an electroplating layer can also be provided on the bottom surface. In this case, this layer may form an additional layer of electrical conductor.

[0049] The present invention is not limited to a circuit carrier 100 having a single insulating layer 109, but is also applicable to a circuit carrier 100 having multiple insulating layers 109 separated by further metallization 119, as illustrated in Figure 4.

[0050] Figure 5 shows a highly simplified schematic diagram illustrating the operating modes of the laser used to form the laser-welded joint 16b. Preferably, this is a so-called fiber laser 22, where the laser beam 18 is supplied via a glass fiber 19. A scanner 24 can be used to move the laser beam 18 according to the desired purpose. The scanner 24 can ensure that the laser beam 18 performs, for example, a circular motion KB around a central axis, as shown in Figure 5. Alternatively or additionally, the laser beam 18 can also perform a oscillating motion WB, as also shown in Figure 5. Figure 5 shows an example of the bonding surface 23 of the laser beam 18 in a snap image between the circular motion KB and the oscillating motion WB. Preferably, the laser is an IR laser.

[0051] The diameter of the laser's focal spot is in the range of 20 to 50 μm, specifically in the range of 30 to 40 μm. The molten region 21 generated by the laser beam 18 is at least substantially continuous and is, for example, point-like or circular. The diameter of the molten region 21 is in the range of 60 to 100 μm, preferably in the range of 70 to 90 μm.

[0052] Figure 6 shows the bottom 104 of the blind hole in the circuit carrier 100 before the laser welding process. In contrast, Figure 7 shows a snapshot during welding, illustrating how the bonding surface 23 of the laser beam 18 changes during the welding process, for example, during the circular motion KB. The oscillating motion WB can be superimposed on the circular motion KB. This makes it possible to form point-like or circular molten regions 21.

[0053] Alternatively or in addition to bonding the circuit carrier 100 using adhesive 106 (see Figure 2), the circuit carrier 100 according to the embodiment shown in Figure 8 can be fixed or crimped to the SMD circuit carrier 1 using a mechanical holder, preferably a retaining plate 113. In this case, the circuit carrier 100 can be crimped between the holder and the SMD circuit carrier, for example, using retaining screws 114 or retaining pins. In the area of ​​the laser welding point 16a for the power semiconductor 4, i.e., the area of ​​each connecting element 5, or in the area of ​​the laser welding point 16b for the circuit carrier 100, i.e., the area of ​​each blind hole 108, the holder may have through holes 115 and 116 for the laser beam 18. This allows laser welding with the retaining plate 113 pre-assembled. Figure 9 shows another method of connecting the circuit carrier 100 to the power semiconductor 4 of the SMD circuit carrier 1. For clarity, Figure 9 shows only a portion of the circuit carrier 100, the conductor path structure 2a which is part of the SMD circuit carrier 1, and the power semiconductor 4 which is part of the SMD circuit carrier located below. Of the SMD circuit carrier 1, only the conductor path structure 2a is partially shown. The blind hole design corresponds to the blind hole design in Figure 3 or Figure 4.

[0054] In this embodiment, laser welding is performed through a blind hole 108 in the area of ​​the connection element 5 or connection pin of the power semiconductor 4. Therefore, the blind hole 108 of the circuit carrier 100 is aligned with the position of the connection element 5 located below it. The circuit carrier 100 is directly connected to the connection element 5 through the bottom of the blind hole 108 by laser welding. This is a particularly space-saving solution because it eliminates the need to provide island-like regions on the SMD circuit carrier as contact points. Consequently, the surface area of ​​the cooler can also be designed to be smaller. [Industrial applicability]

[0055] This invention enables the manufacture of small SMD semiconductor assemblies with high reliability and high current capacity through a relatively simple process sequence. Therefore, this invention makes an extremely important contribution to the relevant technical field.

Claims

1. A method for manufacturing an SMD semiconductor assembly equipped with circuit carriers, The steps include providing an SMD circuit carrier, preferably an IMS substrate or lead frame, which has contacts between a conductor path structure and an insulator, A circuit carrier having a first main surface on which an electrical conductor is provided at least partially, and a second main surface facing the first main surface on which an electrical conductor is also provided at least partially, wherein the circuit carrier is provided with at least one blind hole having the electrical conductor and a blind hole bottom, and the blind hole bottom is preferably formed by only at least one layer of the electrical conductor, A method characterized by comprising the steps of positioning the bottom of the blind hole of the circuit carrier at the contact of the SMD circuit carrier, and making electrical contact by melting the bottom of the blind hole of the circuit carrier and the contact of the SMD circuit carrier by laser welding.

2. The method according to claim 1, wherein the SMD circuit carrier and the circuit carrier are bonded together after the laser welding.

3. The method according to claim 2, wherein the adhesion between the SMD circuit carrier and the circuit carrier is performed by underfilling with an adhesive that is fluid in the initial state.

4. The method according to any one of claims 1 to 3, wherein the circuit carrier is fixed to the SMD circuit carrier by a mechanical holder, preferably a retaining plate.

5. The method according to any one of claims 1 to 4, wherein a circuit carrier on which electrical components and / or electronic components are pre-mounted is electrically brought into contact with the bottom of the blind hole of the circuit carrier and the contact of the SMD circuit carrier by laser welding.

6. The method according to any one of claims 1 to 5, wherein the SMD circuit carrier comprises at least one power semiconductor on the side on which the circuit carrier is mounted.

7. The method according to any one of claims 1 to 6, wherein the at least one power semiconductor has a connecting element, the connecting element is positioned in contact with a contact of the SMD circuit carrier, and the connecting element is electrically brought into contact with the associated contact by melting by laser welding.

8. The method according to claim 7, wherein electrical contact between the bottom of the blind hole of the circuit carrier and the contact of the SMD circuit carrier is made via the connecting element of the power semiconductor disposed between them.

9. The method according to any one of claims 1 to 8, wherein the electrical contact between the bottom of the blind hole of the circuit carrier and the contact of the SMD circuit carrier, and the electrical contact between the connecting element of the at least one power semiconductor and the associated contact of the SMD circuit carrier are performed by laser welding, which involves sequentially optically positioning a laser beam to each welding position using an inspection optical system (scanner).

10. The method according to any one of claims 1 to 9, wherein the SMD circuit carrier is provided with a cooler on the side opposite to the side on which the circuit carrier is mounted.

11. SMD semiconductor assembly, An SMD circuit carrier having contacts between a conductor path structure and an insulator, preferably an IMS substrate or lead frame, comprising an SMD circuit carrier having a first main surface and a second main surface, In an SMD semiconductor assembly comprising at least one circuit carrier on which electrical and / or electronic components are mounted, the circuit carrier also provided on the first main surface of the SMD circuit carrier, The circuit carrier has at least one blind hole having a blind hole bottom, and the blind hole bottom is preferably formed by at least one electrical conductor layer. An SMD semiconductor assembly characterized in that the electrical contact between the circuit board and the SMD circuit carrier is provided in the form of a laser-welded connection at the bottom of the blind hole.

12. The SMD semiconductor assembly according to claim 11, wherein the first main surface of the SMD circuit carrier is further provided with at least one power semiconductor.

13. The SMD semiconductor assembly according to claim 11 or 12, wherein the electrical contact between the at least one power semiconductor and the first main surface of the SMD circuit carrier is provided in the form of a laser-welded connection on the connecting element of the power semiconductor.

14. The SMD semiconductor assembly according to any one of claims 11 to 13, wherein an adhesive layer, preferably in the form of an underfill adhesive layer, is provided between the SMD circuit carriers to fix the circuit carriers.

15. The SMD semiconductor assembly according to any one of claims 11 to 14, wherein the circuit carrier is crimped between a holder, preferably a retaining plate, and the SMD circuit carrier.

16. The SMD semiconductor assembly according to any one of claims 11 to 15, wherein the SMD circuit carrier comprises a cooler, specifically a cooler in the form of a cooling structure and / or a metal layer and / or an active cooling device, on the side opposite to the side on which the circuit carrier is mounted.

17. The SMD semiconductor assembly according to any one of claims 11 to 16, wherein an IMS substrate is provided as the SMD circuit carrier.

18. A circuit carrier for use in the methods described in claims 1 to 10, the circuit carrier having at least one blind hole having a blind hole bottom made of a conductive material, preferably made of a conductive material only, The circuit carrier is characterized in that it is configured as an assembly unit for a laser welding process, with electrical and / or electronic components pre-mounted on it.

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