High-voltage substrate processing equipment

Abstract

The present invention provides a high-pressure substrate processing apparatus comprising: an internal chamber formed to contain a substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure; an external housing housing the internal chamber and an external door formed to be movable between a closed state that closes the external housing and an open state that opens the external housing, and an external chamber formed to contain a protective gas supplied at a second pressure set in relation to the first pressure; and a fastening module comprising a support projection installed on the external housing, a rotating member rotatably installed on the external door, and a locking projection formed protruding from the rotating member and positioned on the support projection when the rotating member rotates in the closed state.

Description

Technical Field

[0001] The present invention relates to a processing apparatus used for processing a substrate in a high-pressure environment.

Background Art

[0002] Generally, various processes are performed on a semiconductor substrate during the progress of a semiconductor element manufacturing process. Examples of such processes include oxidation, nitridation, silicidation, ion implantation, and deposition processes. There is also a hydrogen or deuterium heat treatment process for improving the interface characteristics of a semiconductor element.

[0003] The gas used for processing the substrate is supplied to the chamber at high pressure and acts on the semiconductor substrate. In order to maintain the chamber at high pressure, the door must be securely closed against the housing of the chamber.

[0004] If the closed state of the chamber is loosened by the high-pressure gas, there is a possibility that a gap may occur between the housing and the door. Such a gap becomes a passage for the gas inside the chamber to flow out to the outside.

[0005] The background art described above is technical information that the inventor possessed for deriving embodiments of the present invention or acquired during the derivation process, and it cannot necessarily be said to be publicly known technology that was publicly disclosed to the general public before this application.

Summary of the Invention

Problems to be Solved by the Invention

[0006] One object of the present invention is to provide a high-pressure substrate processing apparatus that can firmly maintain the closed state between the housing and the door even when the pressure inside the chamber is high.

[0007] Another object of the present invention is to provide a high-pressure substrate processing apparatus that can minimize the power required for fastening between the housing and the door.

Means for Solving the Problems

[0008] A high-pressure substrate processing apparatus according to one aspect of the present invention for achieving the above-mentioned problems may include an internal chamber formed to contain a substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure; an external housing containing the internal chamber and an external door formed to be movable between a closed state that closes the external housing and an open state that opens the external housing, and an external chamber formed to contain a protective gas supplied at a second pressure set in relation to the first pressure; and a fastening module comprising a support projection installed on the external housing, a rotating member rotatably installed on the external door, and a locking projection formed to protrude from the rotating member and positioned on the support projection when the rotating member rotates in the closed state.

[0009] Here, the rotating member may be located within the area defined by the external housing.

[0010] Here, the rotating member may include a rotating ring having a ring shape.

[0011] A high-pressure substrate processing apparatus according to another aspect of the present invention includes an internal chamber formed to contain a substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure; an external housing containing the internal chamber and an external door formed to be movable between a closed state that closes the external housing and an open state that opens the external housing, and an external chamber formed to contain a protective gas supplied at a second pressure set in association with the first pressure; and a fastening module comprising a support projection installed on the external housing and a locking projection positioned on the support projection in a state connected to the external door by movement in the closed state, wherein the external door includes an upper plate that contacts the external housing in the closed state, and the locking projection may be positioned below the upper plate.

[0012] Here, the exterior door further includes a lower plate positioned at a different level from the upper plate, and the locking projection may be positioned between the upper plate and the lower plate.

[0013] Here, the locking projection may include one of the following: an upper portion positioned to correspond to the side surface of the upper plate; and a lower portion positioned to correspond to the side surface of the lower plate.

[0014] Here, the external door further includes a sealing material that contacts the external housing in the closed state, and the locking projection may be formed to rotate independently of the contact between the sealing material and the external housing.

[0015] Here, the fastening module may further include a drive unit formed to rotate the locking projection.

[0016] Here, the fastening module further includes a rotating member on which the locking projection is formed, and the drive unit may be configured to rotate the rotating member about a pivot axis positioned along the opening and closing direction of the outer door.

[0017] Here, the drive unit may include a driven gear formed on the rotating member; a drive gear that meshes with the driven gear; and a motor that rotates the drive gear.

[0018] A high-pressure substrate processing apparatus according to yet another aspect of the present invention includes a chamber comprising a housing formed to accommodate a substrate to be processed and a process gas supplied at a pressure higher than atmospheric pressure, and a door formed to move between a closed state that closes the housing and an open state that opens the housing; and a fastening module comprising a support projection installed on the housing and a locking projection positioned on the support projection in a state connected to the door by movement in the closed state, wherein the door comprises an upper plate that contacts the housing in the closed state, and the locking projection may be positioned below the upper plate.

[0019] Here, the door further includes a lower plate positioned at a different level from the upper plate, and the locking projection may be positioned between the upper plate and the lower plate.

[0020] Here, the fastening module further includes a rotating member that is rotatably mounted on the door and has a locking projection protruding from it, the locking projection may be supported by the support projection as the rotating member rotates.

[0021] Here, the door further includes a sealing material installed on the upper plate, and the locking projection may be formed to move independently of the contact between the housing and the sealing material when the door is closed.

[0022] Here, the process gas includes a reaction gas containing an active gas and a protective gas which is an inactive gas, and the housing includes an inner housing formed to accommodate the substrate to be processed and the reaction gas; and an outer housing which accommodates the inner housing and is coupled to the inner housing to form a closed space for the inner housing and the protective gas, and the door may be formed to close the inner housing. [Effects of the Invention]

[0023] According to the high-pressure substrate processing apparatus of the present invention configured as described above, the housing and door containing the substrate and high-pressure gas are kept fastened together by a fastening module, and the fastening module is configured such that a locking projection moves relative to the outer door and is positioned on a support projection installed on the housing, thereby firmly maintaining the closed state between the housing and the door even when the pressure inside the chamber is high due to the fastening between the locking projection and the support projection.

[0024] In addition, since the locking projection moves independently of the door, only the locking projection excluding the door needs to move for fastening between the housing and the door. Thereby, the power required for fastening between the housing and the door can be minimized.

Brief Description of Drawings

[0025] [Figure 1] It is a conceptual diagram of a high-pressure substrate processing apparatus 100 according to an embodiment of the present invention. [Figure 2] It is an exploded perspective view showing the open state of the high-pressure substrate processing apparatus 100 of FIG. 1. [Figure 3] It is a cross-sectional view showing the closed state of the high-pressure substrate processing apparatus 100 of FIG. 2. [Figure 4] It is a cutaway perspective view for explaining the configuration for driving the rotary ring 157 of FIG. 3. [Figure 5] It is a cross-sectional view showing the main part of a high-pressure substrate processing apparatus 100' according to a modification of the high-pressure substrate processing apparatus 100 of FIG. 3. [Figure 6] It is a cross-sectional view showing the main part of a high-pressure substrate processing apparatus 100'' according to another modification of the high-pressure substrate processing apparatus 100 of FIG. 3. [Figure 7] It is a cross-sectional view showing the closed state of a high-pressure substrate processing apparatus 200 according to another embodiment of the present invention.

Modes for Carrying Out the Invention

[0026] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. [[ID=3�]]

[0027] The present invention is not limited to the embodiments disclosed below, but can be modified in various ways and implemented in a variety of different forms. However, these embodiments are provided to ensure the complete disclosure of the present invention and to fully inform those in the ordinary skill of the scope of the invention. Accordingly, the present invention should be understood to include all modifications, equivalents, or substitutes that fall within the technical spirit and scope of the present invention, as well as the substitution or addition of the configurations of one embodiment to the configurations of another embodiment.

[0028] The accompanying drawings are intended solely to facilitate understanding of the embodiments disclosed herein, and should not be understood as limiting the technical ideas disclosed herein, including all modifications, equivalents, or substitutions that fall within the concept and technical scope of the present invention. Components in the drawings may be exaggerated in size or thickness for ease of understanding, but this should not be interpreted as restricting the scope of protection of the present invention.

[0029] The terms used herein are used solely to describe specific examples or embodiments and are not intended to limit the invention. Furthermore, singular expressions include plural expressions unless the context clearly indicates otherwise. In the specification, terms such as "contains" or "comprise" are intended to indicate the existence of features, figures, stages, operations, components, parts, or combinations thereof described herein. That is, terms such as "contains" or "comprise" in the specification should be understood as not preemptively excluding the possibility of the existence or addition of one or more other features, figures, stages, operations, components, parts, or combinations thereof.

[0030] Terms including ordinal numbers, such as "first," "second," etc., can be used to describe a variety of components, but the components are not limited by such terms. These terms are used solely for the purpose of distinguishing one component from another.

[0031] When it is mentioned that one component is "linked" or "connected" to another component, it should be understood that it may be directly linked or connected to the other component, but there may also be other components in between. Conversely, when it is mentioned that one component is "directly linked" or "directly connected" to another component, it should be understood that there are no other components in between.

[0032] When one component is described as being "above" or "below" another, it should be understood that this means not only that it is positioned directly above the other component, but that there may also be other components in between.

[0033] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as they would be generally understood by a person of ordinary skill in the art to which this invention pertains. Terms that are commonly used and predefined should be interpreted as having the meaning consistent with their meaning in the context of the relevant art, and not as ideal or overly formal unless explicitly defined herein.

[0034] Figure 1 is a conceptual diagram of a high-voltage substrate processing apparatus 100 according to one embodiment of the present invention.

[0035] Referring to this drawing, the high-voltage substrate processing apparatus 100 may include an internal chamber 110, an external chamber 120, an air supply module 130, and an exhaust module 140.

[0036] The internal chamber 110 forms a processing space for housing the object to be processed. The internal chamber 110 may be made of a non-metallic material, such as quartz, to reduce contamination in the high-temperature and high-pressure working environment. By operating a heater (not shown) located outside the internal chamber 110, the temperature of the internal chamber 110 can reach several hundred to several thousand degrees Celsius. The object to be processed may be, for example, a semiconductor substrate W (see Figure 2) mounted on a holder. The holder may be a wafer boat 113 (see Figure 2) capable of stacking multiple layers of substrates W to be processed.

[0037] The external chamber 120 forms an internal space that houses the internal chamber 110. The external chamber 120 is located outside the internal chamber 110. Unlike the internal chamber 110, the external chamber 120 is free from the problem of inducing contamination of the object, and therefore may be made of metal.

[0038] The air supply module 130 is configured to supply gas to the internal chamber 110 and the external chamber 120. The air supply module 130 has a gas supply unit 131 which serves as the gas source. The gas supply unit 131 can selectively supply the internal chamber 110 with gases such as hydrogen gas (H2), deuterium gas (D2), fluorine gas (F2), ammonia gas (NH3), chlorine gas (Cl2), nitrogen gas (N2), etc., as reaction gases for the heat treatment process. The gas supply unit 131 can supply the external chamber 120 with a protective gas, such as an inert gas like nitrogen gas or argon gas (Ar). The reaction gases and protective gases may also be simply called process gases. The process gases are supplied to the internal chamber 110 or the external chamber 120 via the reaction gas line 133 or the protective gas line 135, respectively. The protective gas supplied to the external chamber 120 is specifically supplied to the space between the external chamber 120 and the internal chamber 110 (protective space).

[0039] The process gas may be supplied to form a pressure higher than atmospheric pressure (high pressure), for example, a pressure reaching several to tens of atmospheres. When the pressure of the reaction gas is the first pressure and the pressure of the protective gas is the second pressure, they can be maintained in a set relationship. For example, the second pressure may be set to be slightly higher than the first pressure. Such a pressure difference has the advantage of preventing the reaction gas from leaking from the internal chamber 110.

[0040] The exhaust module 140 is configured for exhausting the process gas. An exhaust pipe 141 is connected to the top of the internal chamber 110 to exhaust the reaction gas from the internal chamber 110. Similarly, an exhaust pipe 145 communicating with the external chamber 120 may be provided to exhaust the protective gas from the external chamber 120. Since these exhaust pipes 141 and 145 are integrated into one, the reaction gas is diluted with the protective gas during the exhaust process, resulting in a lower concentration.

[0041] The fastening structure of the external chamber 120 will be explained with reference to Figures 2 and 3. Figure 2 is an exploded perspective view showing the high-voltage substrate processing apparatus 100 in the open state as shown in Figure 1, and Figure 3 is a cross-sectional view showing the high-voltage substrate processing apparatus 100 in the closed state as shown in Figure 2.

[0042] Referring to this drawing, the internal chamber 110 includes an internal housing (not shown) and an internal door 115. The internal housing forms the processing space for accommodating the substrate W to be processed, and its lower part is open. The internal door 115 closes the open lower part of the internal housing. The internal door 115 may have the shape of a feed trough that is open downwards overall.

[0043] When the internal door 115 is lowered, the processing space is opened (open state, see Figure 2). In the open state, the substrate to be processed is unloaded from the boat 113, and a new substrate to be processed is loaded into the boat 113. When the internal door 115 is raised, the processing space is closed (closed state, see Figure 3). In the closed state, processing is performed on the substrate W, such as heat treatment or vapor deposition.

[0044] The external chamber 120 also includes an external housing 121 and an external door 125. The external housing 121 is sized to accommodate the internal chamber 110. An internal housing (not shown) is mounted on the external housing 121. The external housing 121 can also be opened and closed by the movement of the external door 125. The external door 125 can be connected to the internal door 115 by a support member 119. The support member 119 may have a spring support structure that elastically expands and contracts along the opening and closing direction (E). The opening and closing direction (E) is the direction in which the external door 125 moves to switch between the closed state and the open state. If the external housing 121 is upright, the opening and closing direction (E) may be approximately the same as the vertical or vertical direction. In the process of switching from the open state to the closed state, the support member 119 allows the external door 125 to move toward the internal door 115. In an alternative embodiment, the support member 119 may be, for example, an O-ring. In another embodiment, the inner door 115 and the outer door 125 can be integrated with each other to form a single component.

[0045] The exterior door 125 moves up and down together with the interior door 115 to open and close the exterior housing 121. In contrast to the above, the interior door 115 and the exterior door 125 are not connected to each other and can be opened and closed independently.

[0046] The high-pressure substrate processing apparatus 100 may further include a fastening module 150 for fastening the outer housing 121 and the outer door 125 in the closed state. Since the inner door 115 is supported by the outer door 125 by a support member 119, the fastening module 150 may also ensure that the inner door 115 is in close contact with the inner housing. The fastening module 150 ensures that the protective gas in the outer chamber 120 is maintained at the second pressure. The fastening module 150 also exerts a fastening force so that the reaction gas in the inner chamber 110 is maintained at the first pressure.

[0047] The fastening module 150 may specifically include a support projection 151 and a locking projection 155.

[0048] The support projection 151 is a projection installed on the outer housing 121. The support projection 151 may be installed on the inner circumferential surface of the outer housing 121, as in this embodiment. Multiple support projections 151 may be arranged along the circumferential direction of the inner circumferential surface. Multiple support projections 151 may be arranged on the same level or plane along the vertical direction (E).

[0049] The locking projection 155 is sized to pass between a pair of adjacent support projections 151 when the outer door 125 moves in the vertical direction (E). Multiple locking projections 155 may be provided, like the support projections 151. The locking projection 155 is formed to move relative to the outer door 125 in the closed state and be positioned on the support projections 151.

[0050] According to this embodiment, the locking projection 155 can move while remaining connected to the exterior door 125. The locking projection 155 may, for example, be rotatably mounted on the exterior door 125.

[0051] In contrast to the above, the locking projection 155 may also be movably mounted on the external housing 121. The locking projection 155 moves from the external housing 121 toward the external door 125 and engages with the external door 125. For this purpose, the external door 125 may have a groove-like configuration (not shown) that accommodates the locking projection 155.

[0052] If the locking projection 155 is positioned on the support projection 151 by movement, it may be supported by the support projection 151 (fastened state). This allows the outer door 125 to remain firmly fastened to the outer housing 121 even when the process gas is at high pressure.

[0053] If multiple locking projections 155 are provided, the multiple locking projections 155 can rotate individually. Alternatively, the locking projections 155 can remain integrated with the rotating member 157 and rotate together with the rotating member 157. The rotating member 157 may have a ring shape, as illustrated. In such embodiments, the rotating member 157 may be referred to as a rotating ring. The locking projections 155 may be formed to protrude outward from the outer circumferential surface of the rotating ring 157. The rotating ring 157 may be arranged to rotate along the rotational direction (R) {about a rotation axis along the vertical direction (E)}.

[0054] The rotating ring 157 can be rotatably coupled to the outer door 125. The outer door 125 has an upper plate 126, and the rotating ring 157 {and locking projection 155} may be located below the upper plate 126. If the outer door 125 also has a lower plate 127, the rotating ring 157 can be positioned between plates 126 and 127. Bearings 159 may be positioned between the upper plate 126 and the lower plate 127 and the rotating ring 157, respectively. Thrust bearings may be used as bearings 159. The rotating ring 157 may also be located within a region limited by the outer housing 121 {and support projection 151}.

[0055] The upper plate 126 is positioned to contact the outer housing 121 in the closed state. The upper plate 126 and the lower plate 127 can be connected by a spacer 128. This allows the lower plate 127 to be positioned at a different level from the upper plate 126. The spacer 128 may have a smaller diameter or width than the upper plate 126 and / or the lower plate 127. The spacer 128 may be formed as a separate component from the upper plate 126 and the lower plate 127, or as a single component with either of them. The rotating ring 157 and the locking projection 155 are positioned in the space secured by the spacer 128. The rotating ring 157 can be positioned approximately parallel to the outer door 125 with the spacer 128 inserted into its hollow portion.

[0056] In the closed state, while the rotating ring 157 is rotating, the outer door 125 may not rotate in conjunction with the rotation of the rotating ring 157. That is, while the upper plate 126 maintains contact with the outer housing 121 via the sealing material 129, the rotating ring 157 can rotate independently of the contact state. The sealing material 129 may be an O-ring installed on the upper surface of the upper plate 126.

[0057] The configuration for driving the rotating ring 157 will be explained with reference to Figure 4. Figure 4 is a sectional perspective view illustrating the configuration for driving the rotating ring 157 shown in Figure 3.

[0058] Referring further to this drawing, the rotating ring 157 can be rotationally driven by the drive unit 161.

[0059] The drive unit 161 may have a driven gear 163, a drive gear 164, and a motor 165. The driven gear 163 may be formed on the inner circumferential surface of the rotating ring 157. The drive gear 164 may be a gear that meshes with the driven gear 163. The drive gear 164 may be located between the rotating ring 157 and the spacer 128.

[0060] In this configuration, the rotational force of the motor 165 is transmitted to the drive gear 164. The transmission shaft connecting the output shaft of the motor 165 and the drive gear 164 may be arranged to pass through the lower plate 127. The rotation of the drive gear 164 also causes the driven gear 163, which meshes with the drive gear 164, to rotate. The rotation of the driven gear 163 causes the rotating ring 157 to rotate, and the locking projection 155 also rotates along the direction of rotation (R, see Figure 2). The locking projection 155 can move onto the support projection 151 or move to a position away from the support projection 151 as a result of its rotation.

[0061] During the rotation of the locking projection 155, the outer door 125 does not rotate together with the locking projection 155. The power output from the motor 165 is sufficient to rotate the locking projection 155, excluding the outer door 125.

[0062] Although the drive unit 161 has been described as comprising gears 163, 164 and a motor 165, the present invention is not limited thereto. The drive unit can also be configured using other actuators such as cylinders.

[0063] Other embodiments of the high-voltage substrate processing apparatus 100 will be described with reference to Figures 5 and 6. Figure 5 is a cross-sectional view showing the main parts of a high-voltage substrate processing apparatus 100' based on one modification of the high-voltage substrate processing apparatus 100 of Figure 3, and Figure 6 is a cross-sectional view showing the main parts of a high-voltage substrate processing apparatus 100' based on another modification of the high-voltage substrate processing apparatus 100 of Figure 3. In these drawings, the same components as in Figure 3 are given the same reference numerals, and the bearing 159 is omitted for the sake of simplicity in the drawings.

[0064] Referring to Figure 5, the locking projection 155' differs from the aforementioned locking projection 155 in that it further has an upper portion 155a. The upper portion 155a is positioned to correspond to the side surface of the upper plate 126'.

[0065] The upper surface of the upper portion 155a can be at approximately the same level as the upper surface of the upper plate 126'. This allows the upper surface of the locking projection 155' to contact the outer housing 121', and the lower surface of the locking projection 155' to contact the support projection 151.

[0066] Referring to Figure 6, the locking projection 155'' differs from the aforementioned locking projection 155 in that it further has an upper portion 155a and a lower portion 155b. The upper portion 155a is positioned to correspond to the side surface of the upper plate 126'. The lower portion 155b is positioned to correspond to the side surface of the lower plate 127'.

[0067] The upper surface of the upper portion 155a can be at approximately the same level as the upper surface of the upper plate 126'. The lower surface of the lower portion 155b can be at approximately the same level as the lower surface of the lower plate 127'. As a result, the upper surface of the locking projection 155" contacts the outer housing 121", and the lower surface of the locking projection 155" contacts the support projection 151.

[0068] As described above, the drive unit 161, which was explained with reference to Figure 4, can also be applied to this modified example for driving the rotation of the rotating rings 157' and 157''.

[0069] In an alternative embodiment, a rotating disk (not shown) may be used as the rotating member instead of the rotating rings 157, 157', and 157”. The rotating disk is a solid disc that can be rotatably connected to the bottom surface of the upper plates 126, 126', and 126”. For this connection, a recess may be formed in either the rotating disk or one of the upper plates 126, 126', or 126”, to accommodate the protrusion of the other. A bearing may be placed between the protrusion and the recess. A ring gear may be installed on the bottom surface of the rotating disk and it may be rotationally driven by a motor and a pinion gear.

[0070] The fastening modules 150, 150', and 150'' described above can also be applied to semi-double chambers, which have a slightly different configuration from the double chambers described above. This will be explained with reference to Figure 7, which shows an example of the fastening modules being applied to the semi-double chamber. Figure 7 is a cross-sectional view showing the closed state of a high-voltage substrate processing apparatus 200 according to another embodiment of the present invention. In the embodiments described above, similar reference numerals are assigned to the same configurations, and specific explanations therein are omitted.

[0071] Referring to the drawings, the semi-double chamber may have two housings {an inner housing 211 and an outer housing 221} and one door 225. The two housings 211, 221 may correspond to the inner housing and outer housing 121 of the previously described embodiment. The two housings 211, 221 may be joined by their own shapes or with the intervention of other members to form a closed space (CS, corresponding to the protective space). As in the previously described embodiment, the substrate and the reaction gas may be introduced into the inner housing 211. The inner housing 211 may also be protected by the protective gas injected into the closed space (CS). Unlike the previously described embodiment, the door 225 may not be protected by the protective gas.

[0072] Door 225 may correspond to the external door 125 in the above-described embodiment. Door 225 can open and close the internal housing 211. Fastening modules 250 are applied to the external housing 221 and door 225. The specific configuration of fastening module 250 may be substantially the same as that of fastening modules 150, 150', and 150'' described above.

[0073] In this specification, high-pressure substrate processing apparatuses 100, 100', 100”, 200 have been described as having double chambers and semi-double chambers, but the present invention is not limited thereto. Processing apparatuses having a single chamber also fall within the scope of the present invention. The single chamber consists of one housing and one door. A wafer substrate is placed inside the chamber, and process gases, specifically reaction gases, are supplied for processing the wafer substrate. The fastening modules 150, 150', 150”, 250 can also be applied to such a single chamber. The fastening modules 150, 150', 150”, 250 ensure that the door is securely fastened to the housing despite the gas pressure.

[0074] While this specification illustrates batch-type processing equipment, the present invention is not limited thereto. The present invention can also be directly applied to single-wafer type processing equipment. [Industrial applicability]

[0075] This invention has industrial applicability in the field of manufacturing high-voltage substrate processing equipment.

Claims

1. An internal chamber formed to contain the substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure; An external housing for housing the internal chamber, and an external door formed to be movable between a closed state that closes the external housing and an open state that opens the external housing, the external chamber being formed to contain a protective gas supplied at a second pressure set in relation to the first pressure; and A high-voltage substrate processing apparatus including a fastening module comprising a support projection installed on the external housing, a rotating member rotatably installed on the external door, and a locking projection formed protruding from the rotating member and positioned on the support projection when the rotating member rotates in the closed state.

2. The aforementioned rotating member is The high-voltage substrate processing apparatus according to claim 1, wherein the external housing is located within a limited area.

3. The aforementioned rotating member is The high-voltage substrate processing apparatus according to claim 1, comprising a rotating ring having a ring shape.

4. An internal chamber formed to contain the substrate to be processed and a reaction gas supplied at a first pressure higher than atmospheric pressure; An external housing for housing the internal chamber, and an external door formed to be movable between a closed state that closes the external housing and an open state that opens the external housing, the external chamber being formed to contain a protective gas supplied at a second pressure set in relation to the first pressure; and The fastening module includes a support projection installed on the external housing and a locking projection that is positioned on the support projection when connected to the external door by moving in the closed state, The aforementioned exterior door is Includes an upper plate that contacts the external housing in the closed state, The aforementioned locking projection is A high-voltage substrate processing apparatus positioned below the upper plate.

5. The aforementioned exterior door is The system further includes a lower plate positioned at a different level from the upper plate, The aforementioned locking projection is The high-voltage substrate processing apparatus according to claim 4, which is disposed between the upper plate and the lower plate.

6. The aforementioned locking projection is An upper portion positioned to correspond to the side surface of the upper plate; and The high-voltage substrate processing apparatus according to claim 5, further comprising one of the lower portions arranged to correspond to the side surface of the lower plate.

7. The aforementioned exterior door is The material further includes a sealing material that contacts the external housing in the closed state, The aforementioned locking projection is The high-voltage substrate processing apparatus according to claim 1, which is formed to rotate independently of the contact between the sealing material and the external housing.

8. The fastening module is The high-voltage substrate processing apparatus according to claim 1, further comprising a drive unit formed to rotate the locking projection.

9. The fastening module is The rotating member having the aforementioned locking projection is further included, The aforementioned drive unit is The high-voltage substrate processing apparatus according to claim 8, wherein the rotating member is formed to rotate around a rotation axis arranged in the direction of opening and closing of the external door.

10. The aforementioned drive unit is A driven gear formed on the rotating member; A drive gear that meshes with the driven gear; and The high-voltage substrate processing apparatus according to claim 9, further comprising a motor for rotating the drive gear.

11. A chamber comprising a housing formed to accommodate a substrate to be processed and a process gas supplied at a pressure higher than atmospheric pressure, and a door formed to move between a closed state that closes the housing and an open state that opens the housing; and The fastening module includes a support projection installed on the housing and a locking projection that is positioned on the support projection when connected to the door by moving in the closed state, The aforementioned door is Includes an upper plate that contacts the housing in the closed state, The aforementioned locking projection is A high-voltage substrate processing apparatus positioned below the upper plate.

12. The aforementioned door is The system further includes a lower plate positioned at a different level from the upper plate, The aforementioned locking projection is The high-voltage substrate processing apparatus according to claim 11, which is disposed between the upper plate and the lower plate.

13. The fastening module is The invention further includes a rotating member that is rotatably mounted on the door and has the locking projection protruding from it, The aforementioned locking projection is The high-voltage substrate processing apparatus according to claim 11, wherein the rotating member is supported by the support projection as it rotates.

14. The aforementioned door is The above-mentioned upper plate further includes a sealing material, The aforementioned locking projection is The high-voltage substrate processing apparatus according to claim 11, which is formed to move independently of the contact between the housing and the sealing material in the closed state.

15. The aforementioned process gas is It includes a reaction gas containing an active gas and a protective gas which is an inactive gas. The aforementioned housing is An internal housing formed to accommodate the substrate to be processed and the reaction gas; and Includes an outer housing that houses the inner housing and is coupled to the inner housing to form a closed space for housing the inner housing and the protective gas, The aforementioned door is The high-voltage substrate processing apparatus according to claim 11, which is formed to close the internal housing.

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