Semiconductor process equipment

Abstract

This application discloses a semiconductor process apparatus comprising a process chamber 100, a first joint 210, a second joint 220, and a connecting device 300, wherein the first joint 210 is connected to the process chamber 100, and the connecting device 300 comprises a first clamping member 330, a second clamping member 340, and a connecting assembly 350, wherein the first clamping member 330 is fitted onto the first joint 210, and the second clamping member 340 is fitted onto the second joint 220, and the first clamping member 330 and the second clamping One of the members 340 has a positioning column 331, and the other has a positioning hole 341. The positioning column 331 is positioned and fitted into the positioning hole 341, so that the central axis of the first joint 210 and the central axis of the second joint 220 are aligned, and there is a gap between the first joint 210 and the second joint 220. One end of the positioning column 331 passes through the positioning hole 341 and is connected to the connecting assembly 350, which clamps the first joint 210 and the second joint 220.

Claims

1. A semiconductor process apparatus comprising a process chamber, a first joint, a second joint, and a connecting device, wherein the first joint is connected to the process chamber. The connecting device includes a first clamping member and a second clamping member, which are used to clamp the first joint and the second joint, and to seal and fit the first joint and the second joint together to form a gas transport pipeline. A semiconductor process apparatus comprising: a first clamping member fitted onto the first joint; a second clamping member fitted onto the second joint; one of the first and second clamping members having a positioning column and the other having a positioning hole; the positioning column being position-fitted into the positioning hole; the central axis of the first joint and the central axis of the second joint being aligned, with a gap between the first and second joints.

2. The semiconductor process apparatus according to claim 1, wherein one of the surfaces of the first joint facing the second joint and the surface of the second joint facing the first joint has a joining projection, the other of the surfaces of the first joint facing the second joint and the surface of the second joint facing the first joint has a joining groove, at least a portion of the joining projection is located within the joining groove, and there is a gap between the surface of the joining projection and the inner wall of the joining groove.

3. The semiconductor process apparatus according to claim 1, wherein the number of positioning columns and positioning holes is at least two, the at least two positioning columns are provided at intervals along the circumferential direction of the first joint, and each positioning column is fitted into a positioning hole in a one-to-one correspondence.

4. The at least two positioning columns include a first positioning column, a second positioning column, and a third positioning column, wherein two of each of the first, second, and third positioning columns are provided opposite each other, and the first distance between the second positioning column and the first positioning column is equal to the second distance between the second positioning column and the third positioning column. The semiconductor process apparatus according to claim 3, wherein both the first clamping member and the second clamping member have a U-shaped structure, the first positioning column and the third positioning column are located at both ends of the U-shaped structure, and the second positioning column is located at the bent portion of the U-shaped structure.

5. The semiconductor process apparatus according to claim 1, wherein the positioning column has a third positioning plane, and the third positioning plane is positioned and joined to a first positioning plane of the first flange portion of the first joint and a second positioning plane of the second flange portion of the second joint in the circumferential direction of the first joint, respectively.

6. The semiconductor process apparatus according to any one of claims 1 to 5, wherein the connecting device further includes a connecting assembly, one end of the positioning column is connected to the connecting assembly through the positioning hole and used to cause the first joint and the second joint to be clamped by the first clamping member and the second clamping member.

7. The semiconductor process apparatus according to claim 6, wherein the connecting assembly is fitted to the positioning column and can rotate relative to the positioning column to a position in which the positioning column is positioned and fitted to the first joint in the circumferential direction, and the first joint and the second joint are sealed and fitted together.

8. The number of positioning columns and positioning holes is at least two, and the at least two positioning columns are provided at intervals along the circumferential direction of the first joint, and each positioning column is fitted into a positioning hole in a one-to-one correspondence. The semiconductor process apparatus according to claim 6, wherein there are a plurality of connection assemblies, each of which is fitted to the positioning column in a one-to-one correspondence, each connection assembly can be rotated to a position in which it is positioned and fitted to the positioning column in the circumferential direction of the first joint with respect to the corresponding positioning column, and each connection assembly is at the same height as the positioning and fitting position of the corresponding positioning column.

9. The connection assembly includes a connection sleeve and a locking member, the connection sleeve being fitted onto the positioning column, A mounting groove is provided in one of the inner wall of the connecting sleeve and the circumferential surface of the positioning column, the locking member is movably provided in the mounting groove, a positioning groove is provided in the other of the inner wall of the connecting sleeve and the circumferential surface of the positioning column, and in the process of the connecting sleeve being fitted to the positioning column along the positioning column, the locking member retracts into the mounting groove, and when the connecting sleeve reaches a position corresponding to the locking member and the mounting groove, a part of the locking member protrudes from the opening of the mounting groove and is positioned and fitted into the positioning groove in the circumferential direction of the first joint, as described in claim 6.

10. The semiconductor process apparatus according to claim 9, wherein the locking member includes an elastic drive unit and a positioning unit connected to each other, the elastic drive unit can drive a part of the positioning unit to protrude from the opening of the mounting groove, and the positioning unit is positioned and fitted into the positioning groove.

11. The semiconductor process apparatus according to claim 10, wherein the mounting groove includes a first housing chamber and a second housing chamber communicating with each other, the elastic drive unit is provided in the first housing chamber, the positioning unit is provided in the second housing chamber, the end of the second housing chamber away from the first housing chamber has a stopper side wall, the opening is made in the stopper side wall, the elastic drive unit can be driven to press the positioning unit against the stopper side wall, a part of the positioning unit is in close contact with the stopper side wall, and the stopper side wall is used to restrict a part of the positioning unit to the mounting groove.

12. The semiconductor process apparatus according to claim 11, wherein the positioning portion is a positioning ball, the stopper side wall has an arc-shaped structure that can closely contact a part of the positioning ball, and the cross-sectional area of ​​the stopper side wall gradually decreases in the direction extending from the first housing chamber to the second housing chamber.

13. The semiconductor process apparatus according to claim 6, wherein the positioning column includes positioning segments and connecting segments connected to each other, the second clamping member is fitted to the positioning segments via the positioning holes, the positioning segments are positioned and fitted into the positioning holes in the circumferential direction of the first joint, the cross-sectional shape of the positioning segments is polygonal, the positioning holes are polygonal holes whose shape conforms to the positioning segments, and the connecting assembly is connected to the connecting segments.

14. The semiconductor process apparatus according to claim 6, wherein the positioning column includes a bare surface segment and a screw connection segment connected to each other, the diameter of the bare surface segment being larger than the diameter of the screw connection segment, a positioning end face is formed between the bare surface segment and the screw connection segment, the connection assembly is screwed into the screw connection segment and position-fitted into the bare surface segment, and the connection assembly can be position-joined to the positioning end face in the axial direction of the positioning column.

15. The semiconductor process apparatus according to any one of claims 1 to 5, wherein the connecting device further includes a protective sleeve, the protective sleeve is fitted onto the positioning column, the protective sleeve is located between the first clamping member and the second clamping member, and the protective sleeve is provided in a one-to-one correspondence with the positioning column.

16. The semiconductor process apparatus according to any one of claims 1 to 5, wherein the connecting device further includes a first cushion pad and a second cushion pad, the first cushion pad being provided between the first clamping member and the first flange portion of the first joint, and the second cushion pad being provided between the second clamping member and the second flange portion of the second joint.

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