PCB transport device

Abstract

The substrate processing apparatus includes a frame, a substrate transport apparatus having an end effector with a substrate holding station having a predetermined center, a linear image array sensor configured to provide on-the-fly sensing of the edges of a substrate held on the end effector while the substrate transport apparatus is in operation, and at least one simple polygon defining a center determination feature area integrated with the substrate transport apparatus, wherein at least one simple polygon is arranged such that a linear image array sensor intersecting the simple polygon decomposes the simple polygon on the fly into a set of three or more substantially collinear points in combination with at least one further side or edge of the substrate transport apparatus different from the simple polygon, and the decomposition into a set of points provides determination of a predetermined center of the substrate holding station on the end effector.

Description

[Technical Field]

[0001] [Cross-reference of related applications] This application is a non-provisional application of U.S. Provisional Patent Application No. 63 / 509,553, filed on 22 June 2023, which is incorporated herein by reference in its entirety, and claims its benefit.

[0002] [Technical field] This disclosure relates in general to robotic systems, and more specifically to robotic transport systems. [Background technology]

[0003] Automated processing systems, such as semiconductor processing systems, include multiple components that support the execution of processes that deliver a predetermined level of quality and repeatability in semiconductor chip manufacturing. Substrate placement accuracy and motion throughput in semiconductor processing systems directly impact semiconductor yield and tool ownership costs, thus contributing to substrate quality and repeatability.

[0004] Generally, semiconductor systems employ transmitted beam or reflected laser sensors to enable substrate placement, along with a control system that can latch the position of the substrate transporter each time the laser sensor is triggered by the substrate (for example, when the substrate moves past the laser sensor). The control system employs an algorithm to estimate the substrate center position with respect to these transitions. These laser sensor systems are limited in the following ways: the number of data samples provided to determine the substrate center is limited; the accuracy of the laser sensor system is affected by the presence of orientation features on the substrate (such as orientation notches); and the laser sensor cannot reliably detect defects on the substrate. Other semiconductor systems employ vision-based sensors to locate the substrate in space and assist the substrate transporter in properly positioning the substrate at the target location. Vision-based systems require a sufficiently large field of view to reliably detect reference features on the end effector in addition to the substrate edge, which presents a challenge to mechanical packaging design.

[0005] The sensing systems described above, but not limited to them, also face additional challenges that contribute to reduced accuracy in substrate placement by substrate transport devices, including substrate noise and hysteresis, delays (in software or hardware) during substrate edge detection, algorithmic limitations, mechanical hysteresis of the mechanism, substrate slippage on its way to the target position, and thermal expansion / contraction of the arm links of the substrate transport device.

[0006] Therefore, this disclosure addresses many of these issues. [Overview of the project]

[0007] The aforementioned aspects and other features of this disclosure are described in the following description relating to the attached drawings. [Brief explanation of the drawing]

[0008] [Figure 1A] This is a schematic diagram of the substrate processing apparatus according to the present disclosure. [Figure 1B] It is a schematic diagram of a substrate processing apparatus according to the present disclosure. [Figure 1C] It is a schematic diagram of a substrate processing apparatus according to the present disclosure. [Figure 1D] It is a schematic diagram of a substrate processing apparatus according to the present disclosure. [Figure 1E] It is a schematic diagram of a substrate processing apparatus according to the present disclosure. [Figure 1F] It is a schematic diagram of a substrate processing apparatus according to the present disclosure. [Figure 1G] It is a schematic diagram of a substrate processing apparatus according to the present disclosure. [Figure 1H] It is a schematic diagram of a substrate processing apparatus according to the present disclosure. [Figure 1I] It is a schematic diagram of a substrate processing apparatus according to the present disclosure. [Figure 2A] It is a schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure that can be used in any of the substrate processing apparatuses of FIGS. 1A to 1I. [Figure 2B] It is a schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure that can be used in any of the substrate processing apparatuses of FIGS. 1A to 1I. [Figure 2C] It is a schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure that can be used in any of the substrate processing apparatuses of FIGS. 1A to 1I. [Figure 2D] It is a schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure that can be used in any of the substrate processing apparatuses of FIGS. 1A to 1I. [Figure 2E] It is a schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure that can be used in any of the substrate processing apparatuses of FIGS. 1A to 1I. [Figure 2F] It is a schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure that can be used in any of the substrate processing apparatuses of FIGS. 1A to 1I. [Figure 2G] It is a schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure that can be used in any of the substrate processing apparatuses of FIGS. 1A to 1I. [Figure 2H] It is a schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure that can be used in any of the substrate processing apparatuses of FIGS. 1A to 1I. [Figure 3]It is a schematic diagram of a part of the substrate processing apparatus of FIGS. 1A to 1I according to the present disclosure. [Figure 4A] It is a schematic diagram of a part of the substrate processing apparatus of FIGS. 1A to 1I according to the present disclosure. [Figure 4B] It is a schematic diagram of a part of the substrate processing apparatus of FIGS. 1A to 1I according to the present disclosure. [Figure 4C] It is a schematic diagram of a part of the substrate processing apparatus of FIGS. 1A to 1I according to the present disclosure. [Figure 4D] It is a schematic diagram of a part of the substrate processing apparatus of FIGS. 1A to 1I according to the present disclosure. [Figure 4E] It is a schematic diagram of a part of the substrate processing apparatus of FIGS. 1A to 1I according to the present disclosure. [Figure 4F] It is a schematic diagram of a part of the substrate processing apparatus of FIGS. 1A to 1I according to the present disclosure. [Figure 4G] It is a schematic diagram of a part of the substrate processing apparatus of FIGS. 1A to 1I according to the present disclosure. [Figure 4H] It is a schematic diagram of a part of the substrate processing apparatus of FIGS. 1A to 1I according to the present disclosure. [Figure 4I] It is a schematic diagram of a part of the substrate processing apparatus of FIGS. 1A to 1I according to the present disclosure. [Figure 5A] It is a schematic diagram of a part of the substrate processing apparatus of FIGS. 1A to 1I according to the present disclosure. [Figure 5B] It is a schematic diagram of a part of the substrate processing apparatus of FIGS. 1A to 1I according to the present disclosure. [Figure 5C] It is a schematic diagram of a part of the substrate processing apparatus of FIGS. 1A to 1I according to the present disclosure. [Figure 5D] It is a schematic diagram of sensor data according to the present disclosure. [Figure 6A] It is a schematic diagram of substrate center search sensor data and data convergence according to the present disclosure. [Figure 6B] It is a schematic diagram of substrate center search sensor data and data convergence according to the present disclosure. [Figure 6C] It is a schematic diagram of substrate center search sensor data and data convergence according to the present disclosure. [Figure 7A] It is a schematic diagram of substrate center search sensor data according to the present disclosure. [Figure 7B] This is a schematic diagram of the substrate center search sensor data provided in this disclosure. [Figure 7C] This is a schematic diagram of the substrate center search sensor data provided in this disclosure. [Figure 8] Figures 2A to 2H are schematic diagrams of a portion of the substrate transport apparatus as disclosed herein. [Figure 9A] These are schematic diagrams of a part of the substrate processing apparatus shown in Figures 1A to 1I of this disclosure. [Figure 9B] This is a schematic diagram of the sensor data provided in this disclosure. [Figure 10A] These are schematic diagrams of a part of the substrate processing apparatus shown in Figures 1A to 1I of this disclosure. [Figure 10B] These are schematic diagrams of a part of the substrate processing apparatus shown in Figures 1A to 1I of this disclosure. [Figure 11A] This is a schematic diagram of the sensor data provided in this disclosure. [Figure 11B] This is a schematic diagram of the sensor data provided in this disclosure. [Figure 11C] This is a schematic diagram of the sensor data provided in this disclosure. [Figure 11D] This is a schematic diagram of the sensor data provided in this disclosure. [Figure 11E] This is a schematic diagram of the sensor data provided in this disclosure. [Figure 11F] This is a schematic diagram of the sensor data provided in this disclosure. [Figure 12] These are schematic diagrams of a part of the substrate processing apparatus shown in Figures 1A to 1I of this disclosure. [Figure 13] These are schematic diagrams of a part of the substrate processing apparatus shown in Figures 1A to 1I of this disclosure. [Figure 14] This is an illustrative flowchart of the method described herein. [Figure 15] This is an illustrative flowchart of the method described herein. [Figure 16] This is an illustrative flowchart of the method described herein. [Figure 17] This is an illustrative flowchart of the method described herein. [Figure 18] These are schematic diagrams of a part of the substrate processing apparatus shown in Figures 1A to 1I of this disclosure. [Modes for carrying out the invention]

[0009] The following detailed explanation is intended to aid the understanding of those skilled in the art and is not intended in any way to unduly limit the claims relating to or related to this disclosure.

[0010] The following detailed explanation refers to various drawings, but here, regardless of whether a specific drawing is referenced or not, the same reference numbers across the various drawings refer to the same components and features.

[0011] As used herein, the word “each” refers to a single object (i.e., an object) in the case of a single object, and to each object in the case of multiple objects. As used herein, the words “a,” “an,” and “the” encompass “at least one” and “one or more” so as not to limit the noun being referred to to its “singular” form.

[0012] Figures 1A to 1I are schematic diagrams of the substrate processing apparatus according to the present disclosure. The present disclosure will be described with reference to the drawings, but it should be understood that it can be embodied in many forms. Furthermore, elements or materials of any appropriate size, shape, or type may be used.

[0013] This disclosure may provide a measurement system 300 configured to elucidate and track the slippage of a substrate on its way to a target or destination position. The measurement system 300 may be configured to scan a unique edge profile on the end effector 211 (see Figure 2A) to elucidate and track the location of the end effector 211 of a transport unit module 104 (also referred to herein as a substrate transporter) that carries the substrate in real time. Real-time position tracking of the end effector 211 can compensate for the effects of temperature on both the kinematics of the substrate transporter 104 and the end effector. The measurement system 300 may provide real-time position feedback of the end effector 211 during the picking or placement of the substrate at the target position in accordance with this disclosure. According to this disclosure, the measurement system 300 may provide simultaneous real-time tracking of the substrate center position and the end effector spatial position. This disclosure may provide automatic centering of the substrate to teach the substrate transporter the substrate processing position within the substrate processing apparatus.

[0014] Continuing to refer to Figures 1A-1I, substrate processing equipment 100A, 100B, 100C, 100D, 100E, 100F, 100G, such as a semiconductor tool station, are shown in accordance with this disclosure. Although a semiconductor tool station is shown in the drawings, this disclosure can be applied to applications utilizing any tool station or robotic manipulator. Processing equipment 100A, 100B, 100C, 100D, 100E, 100F, 100G are shown having a cluster tool arrangement (for example, having a substrate holding station connected to a central chamber), but the processing equipment may have linearly arranged tools or any suitable tool station. Processing equipment 100A, 100B, 100C, 100D, 100E, 100F, 100G generally include an atmospheric front end 101, at least one vacuum load lock 102, 102A, 102B, and a vacuum back end 103. At least one vacuum load lock 102, 102A, 102B can be connected in any suitable configuration to any suitable port or opening (one or more) of the front end 101 and / or back end 103. For example, one or more load locks 102, 102A, 102B can be arranged side by side in a common horizontal plane, as can be seen in Figures 1B, 1D-1H. One or more load locks can be arranged in a grid, as shown in Figure 1I, such that at least two load locks 102A, 102B, 102C, 102D are arranged in rows (e.g., with spaced horizontal planes) and columns (e.g., with spaced vertical planes). One or more load locks can be a single inline load lock 102, as shown in Figure 1A. At least one load lock 102, 102E can be arranged in a stacked inline configuration, as shown in Figure 1C.While load locks are exemplified on the ends 100E1 or facets 100F1 of the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G, in other embodiments, one or more load locks may be located on any number of sides 100S1, 100S2, ends 100E1, 100E2, or facets 100F1-100F8 of the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G. Each of at least one load lock may include one or more substrate resting surfaces WRP (Figure 1C), where the substrate is held on appropriate supports within each load lock. The tool station configurations described herein are illustrative, and the tool station may have any suitable configuration.

[0015] Each component of the front end 101, at least one load lock 102, 102A, 102B, and back end 103 may be connected to a controller 110, which may be part of any suitable control architecture, such as a clustered architecture control unit. The control system may be a closed-loop controller having a master controller, a cluster controller, and an autonomous remote controller, such as the one disclosed in U.S. Patent No. 7,904,182, published March 8, 2011, entitled “Scalable Motion Control System,” which is incorporated herein by reference in its entirety. Any suitable controller and / or control system may be utilized.

[0016] The front end 101 generally includes a load port module 105 and a mini-environment 106, such as an equipment front end module (EFEM). The load port module 105 may be a 300mm load port, an unpacker / loader-tool standard (BOLTS) interface compliant with SEMI standards E15.1, E47.1, E62, E19.5 or E1.9 for boxes / pods and cassettes with front or bottom openings. The load port module may be configured as a 200mm wafer / substrate interface, a 450mm wafer / substrate interface, or any other suitable substrate interface, such as larger or smaller semiconductor wafers / substrates, flat panels for flat panel displays, solar panels, reticles or any other suitable object. Figures 1A, 1B, 1D, 1E, 1F, 1G, and 1H show three load port modules 105, but any appropriate number of load port modules may be incorporated into the front end 101. The load port modules 105 may be configured to receive substrate carriers or cassettes C from an overhead transport system, an automated guided vehicle (AGV), a manned AGV, a rail-type AGV, or any other suitable transport method. The load port modules 105 may interface with a mini-environment 106 via a load port 107. The load port 107 may allow substrates to pass between the substrate cassette and the mini-environment 106.

[0017] The mini-environment 106 generally includes any suitable transport robot 108 that can incorporate one or more features of the disclosure as described herein. The robot 108 may be a truck-mounted robot, such as those described in U.S. Patent No. 6,002,840 issued December 14, 1999, U.S. Patent No. 8,419,341 issued April 16, 2013, and U.S. Patent No. 7,648,327 issued January 19, 2010, the entire disclosure of which is incorporated herein by reference, or the transport robot 108 may be substantially similar to those described herein with respect to the backend 103. The mini-environment 106 may provide a controlled, clean area for transporting substrates between multiple load port modules.

[0018] At least one vacuum load lock 102, 102A, 102B may be located between the mini-environment 106 and the backend 103 and connected to them, but the load port 105 may be substantially directly connected to at least one load lock 102, 102A, 102B or to the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G, where the substrate carrier C is pumped down to the vacuum of the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G, and the substrate is transported directly between the substrate carrier C and the load lock or transport chamber. When the substrate carrier C is pumped down to vacuum, the substrate carrier C may act as a load lock so that the processing vacuum of the transport chamber extends into the substrate carrier C. If the substrate carrier C is substantially directly connected to the load lock via a suitable load port, any suitable transfer device may be provided within the load lock or otherwise have access to the substrate carrier C for transferring substrates to and from the substrate carrier C. The term vacuum as used herein refers to the 1 × 10⁻¹⁶ vacuum in which the substrates are being processed. -5This can mean a high vacuum, such as below Torr. At least one load lock 102, 102A, 102B generally includes atmospheric and vacuum slot valves. The slot valves of load locks 102, 102A, 102B (and processing station 130) may provide environmental separation, used to evacuate the load lock after loading substrates from the atmospheric front end and to maintain a vacuum inside the transport chamber when venting the load lock with an inert gas such as nitrogen. The slot valves of the processing units 100A, 100B, 100C, 100D, 100E, 100F, and 100G may be arranged in the same plane (as described above with respect to the load ports), or in different vertically stacked planes, or in combination of slot valves arranged in the same plane and slot valves arranged in different vertically stacked planes, to accommodate the transfer of substrates to / from at least the processing stations 130 and load locks 102, 102A, and 102B connected to the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G. At least one load lock 102, 102A, and 102B (and / or front end 101) may include an aligner ALN for aligning the reference of the substrate to the desired position for processing, or any other suitable substrate measuring instrument. Vacuum load locks may be located in any suitable place in the processing unit and may have any suitable configuration.

[0019] The vacuum backend 103 generally includes transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G, one or more processing stations 130, and any suitable number of transport unit modules 104 (also referred to herein as substrate transport devices) including one or more transport robots which may include one or more features of the disclosure as described herein. The transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G may have any suitable shape and size, for example, in accordance with the SEMI standard E72 guidelines. One or more transfer unit modules 104 and one or more transfer robots, as described below, may be at least partially located within transfer chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G to transport substrates between load locks 102, 102A, 102B and (or cassette C located in the load port) and various processing stations 130. The transfer unit modules 104 may be removable from the transfer chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G as modular units to comply with SEMI standard E72 guidelines.

[0020] The processing station 130 can operate on the substrate through various deposition, etching, or other types of processes to form electrical circuits or other desired structures on the substrate. Typical processes include, but are not limited to, vacuum-based thin-film processes such as plasma etching or other etching processes, implantation such as chemical vapor deposition (CVD), plasma vapor deposition (PVD), ion implantation, measurement, rapid thermal processing (RTP), dry strip atomic layer deposition (ALD), oxidation / diffusion, nitride formation, vacuum lithography, epitaxy (EPI), wire bonding and evaporation, or other thin-film processes using vacuum pressure. The processing station 130 is connected to the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G in any suitable way, such as via slot valves SV, allowing the substrate to pass from the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G to the processing station 130 or vice versa. The slot valve SV of the transport chamber 125 may be positioned to allow connection of pairs (for example, more than one substrate processing chamber located in a common housing) or side-by-side process stations 130T1, 130T2, a single process station 130S, and / or stacked process modules / load locks (Figures 1C and 1I).

[0021] Transfer of substrates to / from processing stations 130 and / or load locks 102, 102A, 102B (or cassette C) connected to transfer chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G may occur when one or more arms of the transfer unit module 104 are aligned with a predetermined processing station 130. One or more substrates may be transferred to each predetermined processing station 130 individually or substantially simultaneously (for example, when substrates are picked / placed from side-by-side or tandem processing stations, as shown in Figures 1B, 1D, and 1H). The transfer unit module 104 may be mounted on a boom arm 143 (see, for example, Figures 1E, 1F, 1H) or a linear carriage 144 (see, for example, Figure 1C), such as those described in U.S. Patent No. 10,777,438, published September 15, 2020, titled "Processing Apparatus," and International Patent Application No. PCT / US13 / 25513, published February 11, 2013, titled "Substrate Processing Apparatus."

[0022] Figures 2A and 2B illustrate exemplary boom arm configurations to which a transfer unit module 104 may be connected. The boom arm 143 and the transfer unit module 104 together may be referred to as a substrate transport device (however, if the transfer unit module 104 is used without the boom arm 143, the transfer unit module may be referred to as a substrate transport device as described herein). Here, the boom arm 143 may be a single non-articulated link boom arm 220 (Figure 2A) or an articulated link boom arm 222 (Figure 2B).

[0023] Referring to Figure 2A, a single non-articulated link boom arm 220 is rotatably connected to the frame or base 201 of the transport device. The base 201 includes a drive section 200 configured to rotate the boom arm 220 around the boom arm rotation axis BSX. The transport unit module 104 is connected to the distal end of the boom arm 143 (opposite the boom arm rotation axis BSX). The transport unit module 104 is exemplified as having a SCARA arm 210 (or dual SCARA arm 210, 210A) configuration, but the transport unit module 104 may have any suitable arm configuration, including, but not limited to, those described herein.

[0024] Referring to Figure 2B, the articulated boom arm 220 includes an upper boom link 220, which is rotatably connected at its proximal end to the frame or base 201 of the transport device (on the boom arm rotation axis BAX). The other or distal end of the upper boom link 220 is rotatably connected to the proximal end of the forearm boom link 221 on the boom articulated rotation axis BEX, where the transport unit module 104 is connected to and supported by the forearm boom link 221 at its distal end. The drive section is configured to rotate the upper boom link around axis 220 and to rotate the forearm boom link 221 around axis BEX in any suitable manner. For example, the upper boom link 220 may be driven by a motor in the drive section 20, while the forearm boom link 221 is rotationally driven (for example, a band and pulley transmission makes the rotation of the forearm boom link 221 dependent on the frame 201), although the forearm boom link 221 and the upper boom link 220 may each be driven by their respective motors in the drive section 200. The articulated link boom arm 222 is illustrated with two links, but the articulated link boom arm 222 may have any suitable number of links connected in series with one another. A suitable example of a boom arm that may be utilized in this disclosure is described in U.S. Patent Application No. 15 / 215,143, filed July 20, 2016, entitled “Substrate Processing Apparatus”, the entire disclosure of which is incorporated herein by reference.

[0025] In Figures 2A and 2B, the transport unit module 104 is exemplified as having a SCARA arm 210 (or dual SCARA arm 210, 210A) configuration, but the transport unit module 104 may have any suitable transport arm configuration, including, but not limited to, those described herein. For example, the transport unit module 104 may have any other desired arrangement, such as a frog leg arm 216 (Figure 2C) configuration, a leap frog arm 217 (Figure 2D) configuration, or a bidirectional symmetric arm 218 (Figure 2E) configuration. As another example, referring to Figure 2F, the transport unit module 104 may be configured as a transport arm 219. The transport arm 219 includes at least first and second articulated SCARA arms 210, 210A, where each arm 210, 210A includes an end effector 211 configured to hold at least two substrates S1, S2 side by side on a common transport plane (each substrate holding position of the end effector 211 shares a common drive for picking and positioning substrates S1, S2), where the distance DX between substrates S1, S2 corresponds to a fixed distance between the side by side substrate holding positions. Referring to Figures 2F and 2G, the SCARA arm 210 (and arm 210A) includes an upper arm 213, a forearm 212, and an end effector 211, which are connected in series with each other to form an articulated chain of arm links. The end effector 211 described herein has at least one substrate holding station 211S, where each substrate holding station 211S has a predetermined center or end effector reference point 211C. The end effector 211 is configured to hold a substrate S (also referred to herein as a wafer, but not limited to, any suitable substrate including a flat panel, reticle, or any other suitable object as described herein) in a substrate holding station 211S and to transport the substrate within a substrate processing apparatus.At least one of the arm links 213, 212, and 211 is driven by the respective drive motors of the drive section, but one or more of the arm links, such as the forearm 212 and / or end effector 211, may be rotationally driven by any suitable band and pulley transmission (or other suitable transmission) to bring about extension and retraction of the SCARA arm.

[0026] Suitable examples of transport arms that may be used in this disclosure are U.S. Patent No. 6,231,297 issued on 15 May 2001, U.S. Patent No. 5,180,276 issued on 19 January 1993, U.S. Patent No. 6,464,448 issued on 15 October 2002, U.S. Patent No. 6,224,319 issued on 1 May 2001, U.S. Patent No. 5,447,409 issued on 5 September 1995, U.S. Patent No. 7,578,649 issued on 25 August 2009, and U.S. Patent No. 7,578,649 issued on 18 August 1998, the entire disclosure of which is incorporated herein by reference. U.S. Patent No. 5,794,487, U.S. Patent No. 7,946,800 issued on 24 May 2011, U.S. Patent No. 6,485,250 issued on 26 November 2002, U.S. Patent No. 7,891,935 issued on 22 February 2011, U.S. Patent No. 11,569,111 issued on 31 January 2023, U.S. Patent No. 8,752,449 issued on 17 June 2014, U.S. Patent No. 8,918,203 issued on 23 December 2014, and U.S. Patent No. 11,235,935 issued on 1 February 1, 2022, as well as "Dual Applicable examples can be found in U.S. Patent Application No. 13 / 293,717, filed November 10, 2011, titled “Arm Robot”, and in U.S. Patent Application No. 13 / 270,844, filed October 11, 2011, titled “Coaxial Drive Vacuum Robot”. Suitable examples of band / pulley transmissions that may be used in this disclosure are found in U.S. Patent No. 5,682,795, published November 4, 1997, U.S. Patent No. 5,778,730, published July 14, 1998, and U.S. Patent No. 11,201,073, published December 14, 2021, the entire disclosure of which is incorporated herein by reference.

[0027] Referring to Figure 2H, another transport unit module 104 is illustrated. The transport unit module of Figure 2H, like other transport unit modules described herein, can be coupled to the boom arm 143 (see, for example, Figures 1H, 2A, and 2B) so as to be transported by the boom arm 143, or to the linear carriage 144 (see, for example, Figure 1G) so as to be transported by the linear carriage 144, or can be fixedly mounted to the frame (or frame of the mini-environment 106) of the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G (illustrated in Figures 1A-1I). The transport unit module 104 includes a frame 266F to which a turret 266 is rotatably coupled for rotation around the turret rotation axis TAX. The drive section 200 includes a turret drive unit 200R disposed on the turret rotation axis TAX, which drives the rotation of the turret 266 in direction T3. The turret 266 includes transport arm support sections 270A, 270B extending from both sides of the turret 266, to which (one or more) transport arms 210, 210A, 216, 217, 218 are connected. The transport arm supports 270A and 270B are spaced apart from each other so that each transport arm is supported by a turret 266 in an aligned arrangement (for example, in a manner similar to that described with respect to Figure 2F, and as described in U.S. Patent No. 10,134,621 issued November 20, 2018, the entire disclosure of which is incorporated herein by reference), and each aligned transport arm includes one or more end effectors 211 configured to hold at least one substrate side by side in a common transport plane, wherein the distance DX between substrates S1 and S2 corresponds to a fixed distance between the aligned substrate holding positions.

[0028] The turret 266 may include one or more linear motors 200LM connected to each transfer arm support 270A, 270B to move each transfer arm support 270A, 270B in directions 271A, 271B, resulting in adjustment of distance DX (or independent adjustment of distances DX1, DX2 from axis TAX) to account for variations between board holding stations and to provide independent automatic board centering for one or more transfer arms held on each transfer arm support 270A, 270B. The turret 266 provides individual or independent Cartesian adjustments for each of the respective transport arm supports 270A, 270B (and each of the (one or more) transport arms connected thereto) to maintain substrate alignment, and the position correction resulting from the positioning of the Cartesian coordinates (e.g., XY) of the end effector 211 of at least one transport arm connected to the transport arm support 270A is performed in parallel with the positioning of the Cartesian coordinates of the end effectors 211, 211DS, 211DE, 211DT, 211DQ of at least one other transport arm connected to the transport arm support 270B, thereby reducing substrate swapping time. Each transfer arm support section 270A, 270B may include its own Z-axis drive for moving each of the (one or more) transfer arms held by the transfer arm support sections 270A, 270B independently of the Z-axis motion of each transfer arm held by the other transfer arm support sections 270A, 270B, but another Z-axis drive may be provided for moving the turret 266 and any transfer arms connected thereto as a unit in the Z direction.

[0029] Referring to Figure 3, an exemplary measurement system 300 is illustrated. The measurement system includes at least one sensor 310, 310A, 310B, 310C, 310D, 310E, 310F (see also Figures 5A-5C and 13) and a controller 110. At least one sensor 310 is coupled to a frame (such as a transport chamber or front-end module illustrated in Figures 1A-1I) and is configured to provide on-the-fly sensing of at least the edges of a substrate S held on an end effector 211 while the substrate transport device is in operation. At least one sensor 310, 310A, 310B, 310C, 310D, 310E, 310F is coupled to the controller 110 by an optional suitable wired or wireless data network 199. For illustrative purposes, the network 199 may be an EtherCat network. The controller 110 is connected to the drive section 200 of the board transport device (only a portion of which is illustrated in Figure 3) by any suitable wireless or wired method so that the controller 110 has real-time access to the position of the end effector 211 in addition to sensor data within the same execution thread of the control software algorithm used by the controller 110 to move the board transport device (for example, the controller 110 recognizes the output from at least one sensor 310, 310A, 310B, 310C, 310D, 310E, 310F (e.g., sensor output) for the position of the end effector in space). The positions of at least one sensor 310, 310A, 310B, 310C, 310D, 310E, 310E, 310F in the substrate processing apparatus 100A, 100B, 100C, 100D, 100E, 100G (see Figures 1A-1I) are such that at least one sensor 310, 310A, 310B, 310C, 310D, 310E, 310F captures (or otherwise senses) one or more images of the substrate S and the end effector 211 near the final placement location of the substrate S in the substrate holding position.

[0030] At least one sensor 310, 310A, 310B, 310C, 310D, 310E, 310F is any suitable linear sensor that brings about detection and scanning of the edge profile of the substrate S (e.g., carried and supported by the end effector 211) and / or the profile of one or more center-determining (also called datum) feature portions 410, 410A, 410B, 410C, 410D (see also Figures 5A-5C) of the end effector 211. For example, each of at least one sensor 310, 310A, 310B, 310C, 310D, 310E, 310F is a linear image array sensor, examples of which include, but are not limited to, cameras, Lidar (light detection and ranging), CCD line scan sensors, laser scan micrometers, CMOS sensors, CCD sensors, or any other suitable line scan or area scan non-contact inspection and / or measurement tools having a transmitted beam, reflected beam, or photographic imaging configuration configured to detect edge profiles and / or end effector features of a substrate (as described herein). Referring briefly to Figures 1A to 1I, at least one sensor 310, 310A, 310B, 310C, 310D, 310E, 310F is positioned adjacent to the slot valve SV within the substrate processing apparatus 100A, 100B, 100C, 100D, 100E, 100F, 100G to capture or scan one or more images of the substrate S and / or end effector 211 as the substrate S and / or end effector 211 pass through the slot valve SV and enter the process module 130 or load lock 102A, 102B. As the substrate S and / or end effector 211 passes through the slot valve, at least one sensor 310, 310A, 310B, 310C, 310D, 310E, 310F senses the substrate and / or end effector 211, and the sensor signals are broadcast to the data network 199 so that the controller 110 has access to each of the sensor outputs in a real-time execution thread.

[0031] Referring to Figures 4A-4I and 5A, the center deterministic feature or datum feature 401A-410C of the end effector 211 are shaped to be detected by at least one sensor 310A, 310B (approximately similar to sensor 310) during operation 499 of the substrate transport device (for example, on the fly) as the substrate S and / or end effector 211 are moved over at least one sensor 310A, 310B, and are positioned, for example, on the end effector 211. Operation 499 of the end effector 211 may be one or more of the following: linear motion of the end effector 211 (for example, extension of the end effector), rotational motion of the end effector (for example, rotation of the end effector around one or more axes SX, EX, WX of the substrate transport device), or any other suitable linear or curved motion. The center determination feature units 401A to 410C are positioned relative to a substrate S held on an end effector 211 so as to be sensed by at least one sensor 310A, 310B, while the substrate S is held or supported by the end effector 211. For example, the end effector 211 includes a substrate holding station 211S that is not obstructed by the center determination feature units 401A to 410C. It should also be noted that the center determination feature units 401A to 410C are not obstructed by any substrate S held by the end effector 201.

[0032] The substrate S can be held in a central position on the end effector 211 (for example, the center SC of the substrate S coincides with the end effector reference point 211C). At least one sensor 310A, 310B is configured to detect the on-the-fly migration of the substrate S through each sensor 310A, 310B and the migration of the center-determining feature sections 401A-410C through each sensor 310A, 310B during the operation 499 of the end effector 211. The substrate S can be placed on the end effector 211 with an arbitrary eccentricity or offset (where eccentricity or offset is the distance between the substrate center SC and the end effector reference point 211C, and the eccentricity in Figures 4A-4I and 5A is illustrated to be substantially zero for illustrative purposes only). The center determination feature units 401A to 410C have a predetermined deterministic spatial relationship with the end effector reference point 211C to provide (separately from arm position data obtained from motor encoders) one or more of the following: identification of a substrate center offset (e.g., eccentricity) independent of any teaching fixture; identification of the end effector reference position 211C relative to at least one sensor 310A, 310B when a substrate transport device (e.g., at least its arms) is under thermal displacement (e.g., expansion or contraction); identification of the end effector reference position 211C relative to (one or more) sensors 310A, 310B that can identify and teach the substrate holding position (e.g., of process module 130 or load lock 102A, 102B); and minimization of hysteresis effects (e.g., sensor delay) in detecting the position associated with the end effector position relative to at least one sensor 310A, 310B.

[0033] Each of the center determination feature sections 401A to 410C has a known predetermined shape that defines a unique deterministic solution for detecting the respective edge profile scanned by at least one sensor 310A, 310B relative to the end effector reference point 211C. This known predetermined shape is detected or sensed by at least one sensor 310A, 310B as described herein to determine the position of the end effector reference point 211C, regardless of the thermal effect on the arm links of the substrate transport device, and is decoupled from the arm position data. At least one sensor 310A, 310B is positioned within the substrate processing tool such that one or more of the at least one sensor 310A, 310B are offset with respect to the longitudinal centerline CL of the end effector 211 as the end effector 211 moves through at least one sensor 310A, 310B. At least one sensor 310A, 310B includes two sensors 310A, 310B located on opposite sides of the longitudinal centerline CL, but at least one sensor may be a single sensor extending across the centerline CL so as to span the entire width of the end effector (and substrate), or more than one sensor may be located on the common side of the centerline CL, or a single sensor may be located on only one side of the centerline CL.

[0034] Figures 4A-4I and 5A illustrate two center determination feature units that are connected to each end effector 211, or otherwise formed within each end effector 211, or integrated with each end effector 211. For example, Figure 4A illustrates center determination feature units 401A and 401B connected to (integrated with) an end effector 211. Figure 4B illustrates center determination feature units 402A and 402B connected to (integrated with) an end effector 211. Figure 4C illustrates center determination feature units 403A and 403B connected to (integrated with) an end effector 211. Figure 4D illustrates center determination feature units 404A and 404B connected to (integrated with) an end effector 211. Figure 4E illustrates center determination feature units 405A and 405B connected to (integrated with) the end effector 211. Figure 4F illustrates center determination feature units 406A and 406B connected to (integrated with) the end effector 211. Figure 4G illustrates center determination feature units 407A and 407B connected to (integrated with) the end effector 211. Figure 4H illustrates center determination feature units 408A and 408B connected to (integrated with) the end effector 211. Figure 4I illustrates center determination feature units 409A and 409B connected to (integrated with) the end effector 211. Figure 5A illustrates center determination feature units 410A, 410B, and 410C connected to (integrated with) the end effector 211. One central determination feature section 410 may be connected to the end effector 211 (see Figure 3).Referring to Figure 4B (it should be noted that the center determination feature sections 401A, 401B, 403A-409B in Figures 4A and 4C-4I and the center determination feature sections 410, 410A-410C in Figures 3 and 5A-5B are similarly configured, but each has (one or more) unique edge profiles), two center determination feature sections 402A, 402B extend from, extend from, or otherwise form on opposing lateral sides of the end effector 211 (lateral direction is generally the X direction, and the longitudinal axis is defined by the center line CL of the end effector and may be called the Y direction), however the number of center determination feature sections 402A, 402B may be more or less than two. The center-determining features 402A and 402B are exemplified as extending from the lateral side of the end effector 211, but the center-determining features may be one or more openings (e.g., slots or holes), recesses, etchings, or other features machined or otherwise formed in the end effector 211 (see Figures 5A and 5B).

[0035] Each of the center determination feature units 402A and 402B has (one or more) appropriate edge profiles and configurations to result in the determination of the end effector reference point 211C in the manner described herein. For example, one or more of the center determination feature units 402A and 402B are shaped and dimensioned to be scanned in one or more directions to determine the position and orientation of the scanned edge profile of each center determination feature unit 402A and 402B, where the position and orientation are used by the controller 110 to determine the position and orientation of the end effector relative to at least one sensor 310A and 310B (for example, by determining the position of the end effector reference point 211C having a known spatial position relative to the determined edge profile of each center determination feature unit 402A and 402B). The center determination feature sections 402A and 402B are shaped and dimensional so as to be scanned by at least one sensor 310A and 310B during the movement 499 of the end effector 211 to the substrate holding position, where the sensing by the center determination feature sections 402A and 402B provides direct determination of the position of the end effector 211 to result in the placement of the substrate S at the substrate holding position, regardless of the thermal effect on the arm links of the substrate transport device, it should be noted that the end effector is constructed of a thermally stable material so as to be substantially invariant to temperature changes, and that the center determination feature sections 402A and 402B have a predetermined spatial relationship with the end effector reference point 211C. The shapes and number of center-determining feature sections 401A to 410C arranged on each end effector are typical, but there may be any number of center-determining feature sections, each having any appropriate edge profile (one or more), in order to determine the spatial orientation and position of the end effector 211 (and its end effector reference point 211C).

[0036] Referring to Figures 3, 5A, and 5B, at least one center-determining feature section 410, 410A to 410C includes an array of side sections S1 to S3 that define the center-determining feature section 410, 410A to 410C, which is integrated with the substrate transport device, and the array of side sections S1 to S3 is arranged such that at least two inclined side sections S1 and S2 are oriented toward each other at a predetermined angle θ. At least one additional side S3 is oriented at different angles θ1, θ2 with respect to at least one of the two inclined side sections S1, S2, and so, in combination with at least one additional side section S3, at least one sensor 310, 310A, 310B intersects with at least two inclined side sections S1, S2, and decomposes the intersecting side sections S1, S2 on the fly into one or more substantially aligned linear segments (see Figure 9A) that result in the determination of a predetermined center (e.g., end effector reference point 211C) of the substrate holding station 211S on the end effector 211. There may be a single sensor 310 corresponding to each center-determining feature section 410, which senses the respective feature section. The sensor 310 may be a segmented sensor having linear sensor segments 310S1 to 310S5 (see Figure 12), where the linear sensor segments 310S1 to 310S5 are substantially aligned with each other, and each of the linear sensor segments 310S1 to 310S5 is arranged to sense each side of the array of side sections S1 to S3.

[0037] At least one center-determining feature section 410, 410A-410C and its array of sides S1-S3 can form at least one simple polygon SP1-SP4 (for example, a polygon having straight, non-intersecting line segments or sides joined in pairs to form a single closed path). Each simple polygon is exemplified as a triangle, but any suitable simple polygon may be used. At least one other side S1-S3 and at least two sides S1-S3 from at least one of the two inclined sides S1, S2 are sides of a common simple polygon. The array of sides and the simple polygon formed thereby can provide as many sensor transitions as can be elucidated by at least one sensor 310, 310A, 310B. According to the present invention, at least one sensor 310, 310A, 310B senses the side of at least one center determination feature section 410, 410A, 410C and simultaneously reads at least three transitions of the side via at least one sensor 310, 310A, 310B. From these at least three transitions, the controller 110 determines the rotation of the end effector 211 relative to the at least one sensor 310, 310A, 310B (and the substrate holding position of the load lock or process module associated with at least one sensor 310, 310A, 310B), as well as the X and Y positions of the end effector.

[0038] Center-determining feature sections 410, 410A, 410C, defined by at least one simple polygon SP1 to SP4, are integrated into the substrate transport device (such as an end effector 211 as described herein), and at least one sensor 310, 310A, 310B (arranged to intersect the simple polygon SP1 to SP4 as described herein) determines the simple polygon SP1 to SP4 from at least one further side or edge S1 of the substrate transport device distinct from the simple polygon SP1 to SP4. ~S3 (for example, a further side or edge of the substrate transport device is a side or edge of another different simple polygon SP1~SP4 or a side or edge of the end effector 211 arranged on the substrate transport device in a predetermined relationship with respect to the simple polygon SP1~SP4) is arranged to decompose on the fly into a set of three or more substantially collinear points A~E or A~H (see Figures 9A and 10) that are decomposed by at least one sensor 310, 310A, 310B. Decomposition into a set of points results in the determination of the end effector reference point 211C of the substrate holding station 211S on the end effector 211. As can be seen at least in Figures 3, 5A, and 5B, the simple polygons SP1-SP4 and at least one additional side or edge S1-S3 form a substantially sawtooth shape on the substrate transport device (for example, at least two sides S1-S3 (of the simple polygon) and at least one other side S1-S3 form a substantially sawtooth shape on the substrate transport device).

[0039] The substrate transport device has an end effector 211 from which a substrate handler extends (see Figures 2A-2H), and a set of points of three or more substantially collinear points is substantially decoupled from the position data of the substrate handler (e.g., the position data of the substrate handler obtained from the motor encoder 200EN of the drive section 200) to provide real-time pose determination of the end effector 211 with at least three degrees of freedom. The substrate handler is illustrated in the drawings as an articulated arm for illustrative purposes only, but the substrate handler may have any suitable configuration, including, but not limited to, an articulated arm, a carriage, a magnetic levitation platen / cart, or any other suitable handler. At least three degrees of freedom include the lateral and longitudinal (X and Y) offsets of a predetermined center from a predetermined position of the end effector reference point 211C (e.g., a motion model of a substrate transport device), and the yaw angle of the end effector 211 from a predetermined end effector pose (e.g., the longitudinal centerline CL of the end effector 211 substantially aligned with the extension axis) (see, for example, Figure 5A). At least three degrees of freedom may include one or more of the offsets of the end effector 211 in a direction perpendicular to the substrate transport surface (e.g., the Z direction) (see, for example, Figure 5B) and the pitch angle of the end effector 211 from a predetermined end effector pose (e.g., one substantially aligned with the substrate transport surface). The center determination feature 410C in Figure 5B can provide redundant Y longitudinal positions (as in Figure 5A). A set of two determination feature units 410C, positioned to the left and right (oriented along the Z direction) of the end effector centerline 499, can provide the orientation of the end effector's roll angle in real time.

[0040] Referring to Figures 3 and 5A, the Disclosure may provide different measurement decisions, including, but not limited to, one or more of the following: substrate centering, substrate slip detection, determination of the end effector reference point 211C, and real-time position feedback of the end effector, such as during the placement of the substrate S. Another measurement decision that may be provided is temperature feedback for determining the temperature of the centering feature section 401A-410C and therefore the temperature of the end effector 211. As seen in Figures 3 and 5A, different measurement decisions may be provided when the end effector moves (e.g., on the fly) through at least one sensor 310, 310A, 310B, with at least one sensor 310 positioned in a predetermined area along the end effector 211.

[0041] Referring to Figures 3, 5A, and 6A-7C, at least one sensor 310, 310A, 310B that senses the edge of the substrate S elucidates a substrate edge profile that determines the substrate center SC, and the substrate edge profile and substrate center SC are elucidated on the fly. For example, in state 499 where the end effector is moved so that at least one sensor 310, 310A, 310B is within the substrate center search area, at least one sensor 310, 310A, 310B detects the edge profile of the substrate S, thereby allowing the controller 110 to map the substrate edge data received by the controller 110 from the sensor output. The determination of the substrate center SC and the end effector reference point 211C of the end effector substrate holding station is brought about by the common passage of the end effector 211 to at least one sensor 310, 310A, 310B, thereby determining the substrate eccentricity and enabling automatic substrate centering (for example, relative to a predetermined substrate holding position of a process module, load lock, or other suitable holding position) to be brought about in real time, substantially decoupled from the position data of the substrate handler (from a motor encoder 200EN, etc.).

[0042] Referring to Figures 7A–7C, the center SC of the substrate can be determined from a calibration shape corresponding to a portion of the substrate in a manner similar to the method described in U.S. Patent No. 7,880,155, issued February 1, 2011, the entire disclosure of which is incorporated herein by reference. Figures 7A–7C geometrically illustrate the determination of values ​​ΔX and ΔY, which are coordinates of the substrate offset. Figure 7A shows a substrate S with a calibration shape C superimposed on it. The calibration shape C, shown as a shaded area, represents a portion of the substrate that can be sensed using at least one sensor 310, 310A, 310B in the calibration procedure, or otherwise determined via computer modeling or other techniques. The calibration shape C may, for example, represent a shape on the substrate to which the light beam of the sensor moves during the alignment procedure when the substrate is positioned in the desired location. Figure 7A schematically shows sensors 310, 310B at one position relative to the substrate S, but sensors 310, 310B may be at any suitable position. As illustrated in Figure 7A, the substrate S may or may not completely pass through sensors 310, 310B during the alignment procedure, because the extension of only a small portion of the substrate S through sensors 310, 310B in the direction of movement 499 may be sufficient for sensors 310, 310B to sense the calibration area. Since the position of the substrate S can be determined before the substrate S completely passes through sensors 310, 310B, the movement of the substrate transport device can be quickly adjusted according to the determined substrate position (for example, in the determination of the end effector reference position 211C). Figures 7B and 7C show a sensed shape M that can be compared to the calibration shape to determine the coordinates ΔX and ΔY of the substrate position, respectively. Shape M can be sensed in a manner similar to the sensed calibration shape C. Shape M can be defined by the edge of the light beam of sensors 310, 310B along one straight side that is substantially perpendicular to the direction of movement 499. Along other straight sides that are substantially parallel to the direction of movement, the shape M can be defined by the sensing limits of sensors 310, 310B (e.g., the ends of the light beams).For example, the controller 110 may begin collecting data representing the shape sensed by sensors 310, 310B at a predetermined radial extension position of the substrate transport device, and may end such data collection at another predetermined radial extension position of the transport device. At the starting position, the substrate S may be positioned outside the light beam, while at the ending position, the light beam may intersect the substrate. Between these two positions, the sensors may sense a portion of the substrate that defines the sensed shape M. Any other suitable arrangement may be employed to sense the shape on the substrate, and the sensed shape may be defined in any suitable way. Although the sensed shape is exemplified as a two-dimensional shape, the sensed shape may have any suitable number of dimensions. For example, the shape of a one-dimensional curve along a section around the perimeter of the substrate may be sensed. This sensed curve may be used to determine the substrate offset in two directions by comparing the sensed curve with a calibration curve, or by calculating the position of the sensed curve on the substrate using a computer model.

[0043] Figure 7A shows a calibration shape C that may correspond to the perceived shape obtained when the substrate S is in a desired position. The calibration shape C can have various embodiments that can be expressed quantitatively and used as a reference for comparison with other shapes. For example, the calibration shape C has a limited region. The calibration shape C has a centroid, and its position is in coordinate X as shown in Figure 7A. C and Y C It can be represented as follows: The perceived shape M is the coordinates of each region and its centroid in one direction (for example, X C ) can be compared to the calibrated shape C based on (for example, X C and Y C (Using both) centroid coordinates in more than one direction may be used for comparing shape C and shape M, or any other suitable criterion for comparing shapes may be utilized.

[0044] FIG. 7B illustrates an example of a sensed shape M that can result when the substrate is offset in the -X direction (only) from a desired (known calibration) position. The distance marked “-ΔX” represents the distance by which the substrate is offset in the -X direction. In the example illustrated in FIG. 7B, the offset in the -X direction results in a sensed shape M (shown shaded) having an area smaller than the area of the calibrated shape C. In FIG. 7B, the value X C and Y C represent the coordinates of the centroid of the sensed shape M. FIG. 7C illustrates an example of a sensed shape M that can result when the substrate is offset in the -Y direction (only) from a desired position. In FIG. 7C, the values X C and Y C represent the coordinates of the centroid of the sensed shape M. As illustrated in FIGS. 7B and 7C, different substrate positions can result in different sensed shapes M, but it is also possible to make the area of the sensed shape M the same even when the substrate position is different. Therefore, comparing the area values alone may not be sufficient to determine the substrate position in some cases. In this example, the value X C is used, together with the area of the sensed shape M, to determine the position of the substrate along both the X-axis and the Y-axis. FIGS. 7B and 7C illustrate two sensed shapes M corresponding to different substrate positions. The sensed shapes M are shown with the same area, but the values for X C are different. In this example, the aspect of the sensed shape used to determine the substrate position is the area of M and the centroid coordinate X C (alternatively, Y C) For example, by knowing the ΔX and ΔY of the substrate S relative to a known calibration position from the above, the controller can obtain the eccentricity of the substrate relative to the end effector reference point 211C by comparing the X and Y coordinates of the end effector reference point 211C (as determined from at least one center determination feature in this specification) with the ΔX and ΔY of the substrate relative to the known calibration position. The center SC of the substrate can be determined by any suitable method, such as generating an edge profile of the substrate S using one or more sensors 310, 310A, 310B (for example, as the substrate moves through at least one of the sensors 310, 310A, 310B) and determining the center SC based on the edge profile. This center SC (determined from the edge profile) can be compared with the end effector reference position 211C to determine the eccentricity of the substrate relative to the end effector 211.

[0045] Simultaneously with the reception of sensor outputs by the controller 110, the controller 110 may also receive spatial position data for the end effector 211 (from a motor position feedback encoder, also known as the drive motor encoder 200EN of the drive section 200). Exemplary sensor signals output from at least one sensor 310, 310A, 310B (embodying the detection of their respective substrate edge profiles) are illustrated in Figure 6A. These sensor signals can be used by the controller 110 (including any appropriate center-finding algorithm) to determine the center SC of the substrate. Figure 6B illustrates an exemplary plot of (one or more) substrate edge profiles, where the positions of the substrate edges detected by at least one sensor 310, 310A, 310B are plotted along the vertical axis, and the elongated positions of the end effectors (determined, for example, by any appropriate encoder 200EN of the drive section 200) are plotted along the horizontal axis. Although it is illustrated that opposing edges of the substrate are detected and plotted, the center SC of the substrate may be determined from a sensor signal output from a single sensor, such as sensor 310 (e.g., as a convergence point or focus of the substrate edge profile). The determined substrate center position SC may be compared with calibration data (e.g., calibration data obtained by holding a calibration substrate on the end effector 211 such that the substrate center SC coincides with the end effector reference point 211C, and / or the calibration data is a known or determined spatial position of the end effector reference point 211C) to determine the substrate offset relative to the end effector reference point 211C. If motor encoder data is used, the motor encoder data may be updated as described herein to correct encoder errors based on the corresponding position determination (in this example, the center position of substrate s) provided by the center determination feature units 410, 410A, 410B, 410C, and 410D.

[0046] During the determination of the substrate center as described above, the controller 110 may monitor the deviation of the sensor data and position data from the curve fit established during the substrate scan to detect defects on the substrate S. If the curve fit deviates from the sensor data and / or position data, there is a possibility that defects are present on the substrate S.

[0047] Still referring to Figures 3 and 5A, at least one sensor 310, 310A, 310B that senses the edge of the substrate elutes a substrate edge profile that determines at least one of the substrate slip states relative to the substrate center and the end effector 211, where the substrate edge profile and at least one of the substrate center and the substrate slip state are elucidated on the fly. For example, the occurrence of substrate slip relative to the end effector 211 can be determined as the end effector moves toward and through at least one sensor 310, 310A, 310B. The occurrence of substrate slip can be determined at least partially concurrently with the substrate centering search, or after the determination of the substrate centering search is complete. For example, if no substrate slip occurs during movement 499, the determined substrate center position SC is predicted to be unique, and the convergence or elucidation of the substrate center position occurs as an artifact of the numerical precision of the substrate centering search algorithm. However, if substrate slip occurs relative to the end effector 211 during movement 499, the substrate center position will not converge to a unique solution when the substrate S is detected or scanned by at least one sensor 310, 310A, 310B. The non-convergence of the substrate center is used by the controller 110 to determine the occurrence of substrate slip relative to the end effector 211 in the placement of the substrate at the substrate holding position corresponding to at least one sensor 310, 310A, 310B. Figure 6C shows the curve fitting process and the convergence of the substrate center to a unique position (e.g., in the absence of substrate slip) when more of the substrate edge is sensed by at least one sensor 310, 310A, 310B. The shape of the curve fitting can be a circle, more commonly an ellipse, or any other suitable shape. The controller 110C may be configured to fit the curve based on the sensor data using a least-squares fitting algorithm (or any other suitable fitting algorithm). A convergence signature (as illustrated in Figure 6C) may be recorded in the memory of the controller 110 as part of the calibration and may be performed with various sets of end effector movement speeds and accelerations up to the point where substrate slip occurs.It is expected that different numerical convergence signatures will be observed for each different set of end effector movement speed and acceleration. The controller 110 may include a machine learning model that brings about convergence of the substrate center search and determination of substrate slippage.

[0048] Referring still to Figures 3 and 5A, and also to Figures 8 and 18, temperature feedback may be provided to determine the temperature of the center determination feature sections 401A-410C and therefore the temperature of the end effector 211. The center determination feature sections 401A-410C or the end effector 211 include a temperature determination section or flag 377, which is constructed of a material with a high coefficient of thermal expansion such that there is an identifiable change in the length L1 of the temperature determination section 377 (for example, based on temperature change) that leads to the determination of the temperature of the center determination feature sections 401A-410C by the controller 110. For example, the temperature of the center determination feature sections 401A-410C is set to a reference temperature T ref The measured length L1 of the temperature determination unit 377 and the reference temperature T ref Temperatures other than T other This can be determined by comparing each measured value of length L1 at the center. Length L1 changes depending on the temperature, and this change in length is determined by the temperature T of the center determination feature section 401A~410C at the center determination feature section 401A~410C by the controller 110. other It is used to determine the temperature. As an example, still referring to Figures 3, 5A, and 8, at least one sensor 310, 310A, 310B is arranged / configured to scan the lateral side of the temperature determination unit 377. At least one sensor 310, 310A, 310B has an effective length L2, where,

[0049]

number

[0050] In the formula, L2 is a known sensor distance, X1 and X2 are sensor readings, and L1 is the length of the temperature determination unit 377. Since the length L1 expands and contracts in response to the temperature of the end effector, L1 is (for example, the reference temperature T ref Temperatures other than T other So, it is not known. Here, the reference temperature T ref The length L1 is,

[0051]

number

[0052] Reference temperature T ref Temperatures other than T other The length of the temperature determination unit 377 is

[0053]

number

[0054] Temperature T of the temperature determination unit 377 (and end effector 211) other teeth,

[0055]

number

[0056] Here, α is the thermal expansion coefficient of the temperature determination unit 377.

[0057] As seen above, the temperature of the end effector 211 can be determined and compared with the temperature of the substrate S being picked, so as to substantially avoid thermal shock to the substrate S when the end effector 211 comes into contact with the substrate S.

[0058] As can be understood, if the center-determining feature sections 401A-410C are constructed of a material other than the thermally stable material of the end effector 211, temperature measurements may be used by the controller 110 to determine any thermal effects on the center-determining feature sections 401A-410C. For example, the controller 110 may include a table that correlates temperature with changes in the dimensions of the center-determining feature sections 401A-410C, where the end effector reference point 211C is determined by the temperature T in any suitable way. other The temperature is determined based on the dimensions of the corresponding center determination feature sections 401A to 410C (for example, each temperature T determined by the center determination feature sections 401A to 410C by a table or any other suitable method). other (For example, if it has a common point with the end effector reference point 211C that has a known spatial relationship (e.g., a center point, a convergence point, etc.).

[0059] Referring here to Figures 3, 5A, and 9A-10, along with the operation 499 of the end effector 211 such that at least one center determination feature section 401A-410C is positioned for the determination of the end effector reference point 211C, at least one sensor 310, 310A, 310B scans or otherwise senses the array of sides S1-S3 (such as each simple polygon SP) of the respective center determination feature sections 401A-410C. The geometric shapes of the center determination feature sections 401A to 410C are such that the profiles of the center determination feature sections 401A to 410C determine the position of the end effector reference point 211C (for example, each center determination feature section 401A to 410C has a predetermined spatial relationship with the end effector reference point 211C such that the position determination of each center determination feature section 401A to 410C determines the end effector reference point 211C).

[0060] Referring to Figure 9A, the center determination feature section 410 (which is substantially similar to the center determination feature sections 410A and 410B) includes at least two simple polygons, each of which has its own array of side sections S1 to S3 (one of which may be common between adjacent simple polygons). In the example illustrated in Figure 9A, the center determination feature unit 410 yields five data points A, B, C, D, and E (which may instead be data linear segments AS, BS, CS, DS, ES, FS, GS, HS, and IS, as illustrated in Figure 10A, elucidated by at least one sensor 310, 310A, or 310B). However, the center determination feature unit 410 may provide as few as three data points / data linear segments or more than five data points / data linear segments using a single sensor 310 and a single center determination feature unit 410 (see Figures 9A and 10A), or multiple sensors 310A, 310B and multiple center determination feature units 410A, 10B (see Figure 10B). Figure 9B illustrates the center determination feature unit 410 of Figure 9A as scanned by sensor 310.

[0061] See also Figures 11A-11C, the controller 110 is configured to use the length obtained between data points or points on a data line segment to determine, for example, the absolute rotation β of the end effector 211 with respect to the movement 499 along the linear extension path of the end effector 211 to the substrate holding position. For example, Ro is the length between two points (e.g., points A and E, but any two points may be used) where there is no rotation of the end effector 211 with respect to the movement 499 (see Figure 11A). The length Ro can be obtained by the controller 110 from a table, calibration data, or any other suitable method. R is the length between the same two points (here, points A and E) with rotation (see Figures 11B and 11C). The absolute rotation β of the end effector 211 is,

[0062]

number

[0063] The controller 110 is configured to determine the direction of rotation β1 by comparing two distances obtained from at least three of points A to E. The distance AB between points A and B is compared with the distance CD between points C and D (however, any distance, such as the distance AB between points A and B and the distance BC between points B and C, may be compared). If distance AB is longer than distance CD, the rotation of the end effector 211 with respect to the motion will be clockwise. If distance CD is longer than distance AB, the rotation of the end effector 211 with respect to the motion will be counterclockwise.

[0064] Referring also to Figures 11D to 11F, the controller is configured to determine the X and Y positions of the center determination feature section 410 relative to the sensor 310 by utilizing two data points (or points along a data linear segment), such as points A and D, the absolute rotation β, and the known dimensions of the center determination feature section 410. Knowing the fixed, predetermined spatial relationship between the sensor 310 and each substrate holding position (such as a load lock or process module) and the predetermined spatial relationship between the center determination feature section 410 and the end effector reference point 211C, the controller 110 is configured to determine the X and Y positions of the end effector reference point 211C relative to each substrate holding position using any appropriate algorithm. For example, referring to Figure 11F, the controller 110 uses the following equations set for ΔX and ΔY to determine the X and Y positions of the center determination feature portion relative to the sensor 310 (and therefore, the position of the end effector reference point 211C relative to each substrate holding position, taking into account the known spatial relationships between the sensor and the substrate holding position and between the center determination feature portion and the end effector reference point):

[0065]

number

[0066]

number

[0067] Here, β is the absolute rotation angle, β1 is the angle illustrated in Figure 11F, and C1 is the original Y-intercept determined from the calibration data of the sensor 310 (the calibration data provides the X and Y positions of the center determination feature section 410 relative to the sensor 310, with the end effector aligned along the linear axis of the operation 499 and moving through the sensor 310) and the known dimensions of the center determination feature section 410.

[0068] To reduce noise that may be present in the sensor signal affecting the position determination of the end effector 211 relative to the substrate holding station, the number of data points or data linear segments may be increased. The absolute rotation β, rotation direction, and the X and Y positions of the end effector reference point 211C may be determined using multiple different sets of points. For example, to reduce noise in the absolute rotation solution, the absolute rotation β may be determined for each of the data point sets A and C, A and E, A and G, A and I, C and E, C and G, C and I, E and G, E and G, G and I, B and D, D and F, and F and H, as described above. The resulting absolute rotation solutions for each data point set may be combined using a least-squares (or other suitable) algorithm to provide a combined absolute rotation solution that is more accurate than any one of the (uncombined) absolute rotation solutions. Similarly, to reduce noise in the rotational solutions, the rotational direction can be determined, as described above, by comparing the distance of any one line segment AB, CD, DF, GH with the distance of any other line segment AB, CD, DF, GH, where the further apart the line segments are, the greater the difference in length between the line segments being compared. Noise in the solutions for the X and Y positions can be reduced by determining the X and Y positions using each of the data point sets A and D, A and F, A and H, C and F, C and H, E and H, or any other combination of two of the points A, B, C, D, E, F, G, H, I. The respective X and Y position solutions for each data point set can be combined using a least-squares (or other suitable) algorithm to provide a combined X and Y position solution that is more accurate than any one of the (uncombined) X and Y position solutions.

[0069] Referring again to Figures 5A and 5B, and also to Figure 5C, the present disclosure allows the position / orientation of the end effector 211 to be sensed in at least three degrees of freedom or at least five degrees of freedom. For example, by sensing one of the center determination feature units 410A, 410B with one of each of the sensors 310A, 310B (although two center determination feature units 410A, 410B and two sensors 310A, 310B are illustrated, the present disclosure may be provided with only one center determination feature unit and each sensor), the end effector 211 can be positioned in three degrees of freedom, such as in the X and Y directions with a rotation Rz (yaw) around the Z axis. The substrate handler may include another center-determining feature section 410C on the list of end effectors 211, where the other center-determining feature section is oriented in a plane (e.g., the ZY plane) substantially orthogonal to the plane (e.g., the XY plane) in which the (one or more) center-determining feature sections 410A, 410B are oriented. Furthermore, another sensor 310C (substantially similar to sensor 310) is disposed within the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G to sense, or otherwise detect, the center-determining feature section 410C in order to determine the position / orientation of the end effectors with two degrees of freedom Z, Rx (pitch). See also Figure 5D, in a manner similar to the method described herein with respect to Figure 11F, the controller 110 determines the absolute rotation β of the center-determining feature section 410C from the sensor signal received from the sensor 310C that detects the center-determining feature section 410C. RX and Z position (and therefore the absolute rotation β of the end effector 211, taking into account the known spatial relationship between the center determination feature section 410C and the end effector reference point 211C) RXIt is configured to determine the rotation Ry of the end effector.66 degrees of freedom Ry (roll) and the Z position.To obtain the position / orientation of the end effector 211 in the 6 degrees of freedom Ry (roll), a center determination feature unit 410D may be positioned on the opposite side of the center determination feature unit 410C in the ZY plane.Another sensor 310D (approximately similar to sensor 310) is positioned in the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G to sense the center determination feature unit 410D to determine the position / orientation of the end effector in at least the Z direction (in a manner similar to the method described above with respect to Figure 11F), or otherwise to detect it.The rotation Ry of the end effector can be determined by the controller 110 by comparing the Z position solution obtained from detecting the center determination feature unit 410C with the Z position solution obtained from detecting the center determination feature unit 410D (by any suitable method such as simple trigonometry).

[0070] Referring to Figures 5A-5C and 14, the determination of the end effector 211 in at least three degrees of freedom can lead to real-time resolution of any position error of the drive motor encoder 200EN (see Figures 2A and 2B). For example, the controller 110 contains the kinematic characteristics of the substrate transport device in its memory. These kinematic characteristics model the motion of the substrate handler and lead to the determination of the predicted position of the substrate handler for any given movement of the substrate handler. To resolve encoder errors in real time, the position of the end effector 211 is determined by the controller 110 based on sensing of at least center-determining feature units 410, 410A, 410B, 410C, and 410D in at least three degrees of freedom (e.g., at least the X and Y directions, and further degrees of freedom including one or more of the yaw (Rz) or Z direction, roll direction (Ry), and pitch direction (Rx)) in the manner described herein (Figure 14, block 1400). The controller 110 determines the position of the end effector 211 based on a signal from the motor encoder 200EN (for example, referred to herein as the encoder determination position) (Figure 14, block 1410). The controller may compare the encoder determination position of the substrate handler with the kinematically predicted position of the substrate handler (Figure 14, block 1420), and based on this comparison, may determine any existing encoder errors (Figure 14, block 1430). The controller 110 is configured to utilize the real-time position of the end effector 211, determined by sensing at least one center determination feature section 410, 410A, 410B, 410C, 410D, to correct encoder errors (Figure 14, block 1440), where correction of encoder errors includes one or more of the following: resetting, updating, or otherwise calibrating or recalibrating the encoder position (one or more). Encoder error correction can be performed by the controller 110 at any appropriate time interval, such as once per predetermined operating time of the substrate transport device or a predetermined number of times per day, each time at least one center determination feature unit passes through at least one sensor 310, 310A, 310B, 310C, or 310D.The controller 110 is configured to determine the amount of thermal expansion / contraction of each substrate handler link of a substrate transport device in order to bring substrate centering on the fly in a manner substantially similar to the method described in U.S. Patent No. 10,134,623 issued November 20, 2018, which is incorporated herein by reference in its entirety.

[0071] Referring to Figure 12, at least one center determination feature unit 410A, 410B is positioned on the end effector 211 such that it remains within the scan range of its respective sensors 310A, 310B when the substrate S is positioned in a substrate holding position (e.g., within the process module 130 or load lock 102 or other suitable substrate holding position). Center determination feature units 410C, 410D may be positioned on the end effector 211 such that it remains within the scan range of its respective sensors 310C, 310D when the substrate S is positioned in a substrate holding position (e.g., within the process module 130 or load lock 102 or other suitable substrate holding position). At least one sensor 310A, 310B provides the controller 110 with real-time positional feedback regarding the spatial position of the end effector 211 relative to the substrate holding position, regardless of the thermal effect on the substrate handler link and without utilizing positional information obtained from the motor encoder 200EN of the drive section 200 or kinematic calculations of the substrate handler's operation. The controller 110 can continuously determine the position / orientation of the end effector based on signals received from at least one sensor 310A, 310B that sense their respective center-determining feature units 410A, 410B in the manner described above, but it should be noted again that at least one sensor 310A, 310B has a fixed predetermined spatial relationship with the substrate holding position and at least one center-determining feature unit 410A, 410B has a predetermined spatial relationship with the end effector reference point 211C. Once the eccentricity or offset of the substrate S relative to the end effector reference point 211C is known, the controller 110 commands the motor of the drive section 200 to move so that the center of the substrate S substantially coincides with the center of the substrate holding position, based on position feedback obtained from at least one sensor 310A, 310B (one or more of sensors 310C, 310D may also be used).

[0072] Referring to Figure 13, at least one additional sensor 310E, 310F may be provided in the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G. The at least one additional sensor 310E, 310F is spaced apart from at least one sensor 310A, 310B so that the substrate S and at least one center-determining feature section 410A, 410B are simultaneously sensed by at least one sensor 310A, 310B and at least one additional sensor 310E, 310F. The determination of the substrate center and the position / orientation of the end effector can be simultaneously determined by the controller in the manner described herein.

[0073] An exemplary substrate processing method is described with reference to Figures 1A-3, 5A-5C, 9A-11F, and 15. According to this method, substrate processing devices 100A, 100B, 100C, 100D, 100E, 100F, and 100G are provided (Figure 15, block 1500). A linear image array sensor connected to the frame (for example, at least one of sensors 310, 310A, 310B, 310C, 310D, and 310E) senses the edges of the substrate S held on the end effector 211 on the fly while the substrate transport device is in operation (Figure 15, block 1510). Decomposition into a set of points results in the determination of a predetermined center of the substrate holding station on the end effector 211 (also referred to herein as the end effector reference point 211C) (Figure 15, block 1520), where at least one simple polygon SP, SP1-SP4, and at least one sensor 310, 310A, 310B, 310C, 310D intersecting the simple polygon SP, SP1-SP4, are arranged to decompose on the fly into a set of points A-E of three or more substantially collinear points A-E, in combination with at least one further side or edge S1-S3 of a substrate transport device different from the simple polygon SP, SP1-SP4.

[0074] Referring to Figures 1A-3, 5A-5C, 9A-11F, and 16, another exemplary substrate processing method is described. According to this method, substrate processing devices 100A, 100B, 100C, 100D, 100E, 100F, and 100G are provided (Figure 16, block 1600). A linear image array sensor connected to the frame (for example, at least one of sensors 310, 310A, 310B, 310C, 310D, and 310E) senses the edges of the substrate S held on the end effector 211 on the fly while the substrate transport device is in operation (Figure 16, block 1610). Using one or more substantially aligned linear segments AS, BS, CS, DS, ES, FS, GS, HS, IS (as illustrated in Figure 10A), a determination of a predetermined center of the substrate holding station on the end effector 211 (also referred to herein as the end effector reference point 211C) is made (Figure 16, block 1620), where the array of sides S1-S3 is such that at least two inclined sides S1, S2 are oriented toward each other at a predetermined angle θ, and at least one other side S3 (or different simple polygonal sides S1-S) 3) is positioned such that it is oriented at different angles θ, θ1, θ2 with respect to at least one of the two inclined sides S1, S2, and thereby, in combination with at least one other side S3 (or different simple polygonal sides S1-S3), at least one sensor 310, 310A, 310B, 310C, 310D intersects at least two inclined sides S1, S2, and decomposes the intersecting side into one or more substantially aligned linear segments AS, BS, CS, DS, ES, FS, GS, HS, IS on the fly.

[0075] An exemplary substrate processing method is described with reference to Figures 1A-13 and 17. Calibration data for the measurement system 300 is generated according to this method (Figure 17, block 1700). The calibration data may include, but is not limited to, the calibration shape / edge profile of the substrate S, known spatial relationships between at least one sensor 310, 310A, 310B, 310B, 310D and substrate holding positions (e.g., load lock 102, process module 130, aligner, etc.), known spatial relationships between at least one center-determining feature 410, 410A, 410B, 410C, 410D and end effector reference point 211C, known dimensions of at least one center-determining feature 410, 410A, 410B, 410C, 410D, or any other suitable calibration data.

[0076] The controller 110 commands the drive section 200 to operate the substrate transport device so that it moves the end effector 211 toward a substrate holding position (e.g., a process module, load lock, aligner, etc.) passing through at least one sensor 310, 310A, 310B, 310C, 310D corresponding to the substrate holding position (Figure 17, block 1705). When the end effector is holding a substrate S, at least one sensor 310, 310A, 310B, 310C, 310D senses the substrate S while the end effector is operating (Figure 17, block 1710). The controller 110 may determine the center SC of the substrate while the end effector 211 is operating by the method described herein (Figure 17, block 1715). The controller 110 can also determine the occurrence of substrate slippage relative to the end effector 211 while the end effector 211 is in operation, by the method described herein (Figure 17, block 1720).

[0077] As the end effector moves toward the substrate holding position, at least one sensor 310, 310A, 310B, 310C, 310D senses a temperature determination flag 377 while the end effector is operating (Figure 17, block 1725). Based on the sensor data obtained from sensing the temperature determination flag 377, the controller 110 determines the temperature of one or more of the at least one center determination feature section 410, 410A, 410B, 410C, 410D and the end effector 211 (in the manner described herein) while the end effector 211 is operating (Figure 17, block 1730).

[0078] As the end effector 211 moves continuously toward the substrate holding position, at least one sensor 310, 310A, 310B, 310C, 310D senses the center determination feature section 410, 410A, 410B, 410C, 410D (Figure 17, block 1735). While the end effector is still operating, the controller 110 determines the end effector reference point 211C (as described herein) based on sensor data obtained from sensing at least one center determination feature section 410, 410A, 410B, 410C, 410D (Figure 17, block 1740). When the end effector 211 is holding the substrate S, and the spatial positions of both the substrate center SC and the end effector reference point 211C are known, the controller 110 determines the offset between the substrate center SC and the end effector reference point 211C (as described herein). Given a known spatial relationship between at least one sensor 310, 310A, 310B, 310C, 310D and a substrate holding position (e.g., a load lock, process module, aligner, etc., corresponding to the sensor), and the positions of the substrate center SC and the end effector reference point 211C (when the substrate is held on the end effector) are determined relative to the coordinates of at least one sensor 310, 310A, 310B, 310C, 310D, the controller adjusts the spatial position of the end effector 211 to align the center of the substrate SC with the substrate holding position (when the substrate is held on the end effector), or to align the end effector reference point 211C with the substrate holding position (when the substrate is not held on the end effector), while providing real-time positional feedback of the end effector position (and therefore the substrate position) as described herein (Figure 17, block 1755).When real-time position feedback is provided by sensing at least one center determination feature 410, 410A, 410B, 410C, 410D, the controller 110 continues to move the end effector 211 so that the substrate S is positioned such that the substrate center SC is substantially aligned with / contiguous with the substrate holding position when the substrate S is held on the end effector 211 (Figure 17, block 1760). When the substrate S is not held on the end effector, the controller 110 continues to move the end effector 211 so that the end effector reference point 211C is substantially aligned with the substrate holding position in order to pick the substrate S from the substrate holding position (Figure 17, block 1765).

[0079] The following features of this disclosure are provided, which may be used individually, in any combination with each other, and / or in any combination with the features described above.

[0080] The substrate processing apparatus includes a substrate transport apparatus having a frame and an end effector connected to the frame and having a substrate holding station having a predetermined center, wherein the end effector is configured to hold a substrate at the substrate holding station and transport the substrate within the substrate processing apparatus; a linear image array sensor connected to the frame, configured to provide on-the-fly sensing of the edges of a substrate held on the end effector while the substrate transport apparatus is in operation; and at least one simple polygon defining a center determination feature area integrated with the substrate transport apparatus, wherein at least one simple polygon is arranged such that a linear image array sensor intersecting the simple polygon decomposes the simple polygon on the fly into a set of three or more substantially collinear points in combination with at least one further side or edge of the substrate transport apparatus different from the simple polygon, and the decomposition into a set of points results in the determination of a predetermined center of the substrate holding station on the end effector.

[0081] At least one additional side or edge is a different simple polygon arranged in a predetermined relationship to the simple polygon on the substrate transport device.

[0082] A simple polygon and at least one further side or edge form a substantially sawtooth shape on the substrate transport device.

[0083] The substrate transport device has an end effector from which a substrate handler extends, and a set of points of three or more substantially collinear points is substantially decoupled from the position data of the substrate handler to provide real-time pose determination of the end effector with at least three degrees of freedom.

[0084] At least three degrees of freedom include lateral and vertical offsets of a given center from a given position of a given center, and the yaw angle of the end effector from a given end effector pose.

[0085] At least three degrees of freedom include the offset of the end effector in a direction perpendicular to the substrate transport surface and the pitch angle of the end effector from a given end effector position.

[0086] A linear image array sensor that detects the edges of the substrate elucidates the substrate edge profile that determines the substrate center, and both the substrate edge profile and the substrate center are determined on the fly.

[0087] The determination of the substrate center and the center of the substrate holding station is performed during the common passage of the end effector to the linear image array sensor, thereby determining the substrate eccentricity and enabling automatic substrate centering in real time, substantially decoupled from the substrate handler's position data.

[0088] A linear image array sensor that senses the edges of the substrate elucidates a substrate edge profile that determines at least one of the substrate slip states relative to the substrate center and end effectors, and the substrate edge profile and at least one of the substrate center and substrate slip states are elucidated on the fly.

[0089] A linear image array sensor comprises linear sensor segments that are substantially aligned with one another.

[0090] The substrate transport device includes an end effector and a temperature determination flag that results in the determination of the temperature of one or more of at least one simple polygon.

[0091] Determining a predetermined center of the substrate holding station on the end effector results in on-the-fly updating of position information for at least one encoder in the drive section of the substrate transport device.

[0092] The substrate processing apparatus includes a substrate transport apparatus having a frame and an end effector connected to the frame and having a substrate holding station having a predetermined center, wherein the end effector is configured to hold a substrate at the substrate holding station and transport the substrate within the substrate processing apparatus; a linear image array sensor connected to the frame, configured to provide on-the-fly sensing of the edges of a substrate held on the end effector while the substrate transport apparatus is in operation; and a side array for defining a center determination feature integrated with the substrate transport apparatus, wherein the side array is arranged such that at least two inclined sides are oriented at a predetermined angle to each other, and at least another side is oriented at a different angle to at least one of the two inclined sides, thereby allowing a linear image array sensor intersecting at least two inclined sides in combination with at least one other side to decompose the intersecting side into one or more substantially aligned linear segments on the fly, resulting in the determination of a predetermined center of the substrate holding station on the end effector.

[0093] At least two sides, consisting of at least one other side and at least one of the at least two inclined sides, are sides of a common simple polygon.

[0094] At least two sides and at least one other side form a substantially sawtooth shape on the substrate transport device.

[0095] The substrate transport device has an end effector from which a substrate handler extends, and substantially aligned linear segments are substantially decoupled from the position data of the substrate handler to provide real-time pose determination of the end effector with at least three degrees of freedom.

[0096] At least three degrees of freedom include lateral and vertical offsets of a given center from a given position of a given center, and the yaw angle of the end effector from a given end effector pose.

[0097] At least three degrees of freedom include the offset of the end effector in a direction perpendicular to the substrate transport surface and the pitch angle of the end effector from a given end effector position.

[0098] A linear image array sensor that detects the edges of the substrate elucidates the substrate edge profile that determines the substrate center, and both the substrate edge profile and the substrate center are determined on the fly.

[0099] The determination of the substrate center and the center of the substrate holding station is performed during the common passage of the end effector to the linear image array sensor, thereby determining the substrate eccentricity and enabling automatic substrate centering in real time, substantially decoupled from the substrate handler's position data.

[0100] A linear image array sensor that senses the edges of the substrate elucidates a substrate edge profile that determines at least one of the substrate slip states relative to the substrate center and end effectors, and the substrate edge profile and at least one of the substrate center and substrate slip states are elucidated on the fly.

[0101] A linear image array sensor comprises linear sensor segments that are substantially aligned with one another.

[0102] The substrate transport device includes an end effector and a temperature determination flag that results in the determination of the temperature of one or more of at least one simple polygon.

[0103] Determining a predetermined center of the substrate holding station on the end effector results in on-the-fly updating of position information for at least one encoder in the drive section of the substrate transport device.

[0104] A substrate processing method provides a substrate processing apparatus, comprising the steps of: providing a substrate processing apparatus, wherein the substrate processing apparatus comprises a frame, a substrate transport apparatus having an end effector connected to the frame and equipped with a substrate holding station having a predetermined center, wherein the end effector is configured to hold a substrate at the substrate holding station and transport the substrate within the substrate processing apparatus, and at least one simple polygon defining a center determination feature integrated with the substrate transport apparatus; sensing the edge of a substrate held on the end effector on the fly while the substrate transport apparatus is in operation using a linear image array sensor connected to the frame; and determining a predetermined center of the substrate holding station on the end effector by decomposition into a set of points, wherein at least one simple polygon is arranged such that a linear image array sensor intersecting the simple polygon decomposes the simple polygon on the fly into a set of points of three or more substantially collinear points by combining it with at least one further side or edge of the substrate transport apparatus that is different from the simple polygon.

[0105] At least one additional side or edge is a different simple polygon arranged in a predetermined relationship to the simple polygon on the substrate transport device.

[0106] A simple polygon and at least one further side or edge form a substantially sawtooth shape on the substrate transport device.

[0107] The substrate transport device has an end effector from which a substrate handler extends, and the method further includes a step of using a set of points of three or more substantially collinear points to provide real-time pose determination of the end effector with at least three degrees of freedom, substantially decoupled from the position data of the substrate handler.

[0108] At least three degrees of freedom include lateral and vertical offsets of a given center from a given position of a given center, and the yaw angle of the end effector from a given end effector pose.

[0109] At least three degrees of freedom include the offset of the end effector in a direction perpendicular to the substrate transport surface and the pitch angle of the end effector from a given end effector position.

[0110] A linear image array sensor that detects the edges of the substrate elucidates the substrate edge profile that determines the substrate center, and both the substrate edge profile and the substrate center are determined on the fly.

[0111] The determination of the substrate center and the center of the substrate holding station is performed during the common passage of the end effector to the linear image array sensor, thereby determining the substrate eccentricity and enabling automatic substrate centering in real time, substantially decoupled from the substrate handler's position data.

[0112] A linear image array sensor that senses the edges of the substrate elucidates a substrate edge profile that determines at least one of the substrate slip states relative to the substrate center and end effectors, and the substrate edge profile and at least one of the substrate center and substrate slip states are elucidated on the fly.

[0113] A linear image array sensor comprises linear sensor segments that are substantially aligned with one another.

[0114] The method includes a step of determining the temperature of the end effector and one or more of the at least one simple polygon using a temperature determination flag of the substrate transport device.

[0115] The method includes updating the position information of at least one encoder of the drive section of the substrate transport device on the fly, based on the determination of a predetermined center of the substrate holding station on the end effector.

[0116] A substrate processing method is a step of providing a substrate processing apparatus, wherein the substrate processing apparatus is a substrate transport apparatus having a frame and an end effector connected to the frame and having a substrate holding station having a predetermined center, wherein the end effector is configured to hold the substrate at the substrate holding station and transport the substrate within the substrate processing apparatus, and the substrate transport apparatus has a side array that defines a center determination feature part integrated with the substrate transport apparatus, and a linear image array sensor connected to the frame is used to sense the edge of the substrate held on the end effector on the fly while the substrate transport apparatus is in operation. The steps include determining a predetermined center of a substrate holding station on an end effector using one or more substantially aligned linear segments, wherein an array of sides is arranged such that at least two inclined sides are oriented at a predetermined angle to each other, and at least one other side is oriented at a different angle to at least one of the two inclined sides, and so that a linear image array sensor intersecting at least two inclined sides in combination with at least one other side decomposes the intersecting sides into one or more substantially aligned linear segments on the fly.

[0117] At least two sides, consisting of at least one other side and at least one of the at least two inclined sides, are sides of a common simple polygon.

[0118] At least two sides and at least one other side form a substantially sawtooth shape on the substrate transport device.

[0119] The substrate transport device has an end effector from which a substrate handler extends, and the method further includes a step of using substantially aligned linear segments to provide real-time pose determination of the end effector with at least three degrees of freedom, substantially decoupled from the position data of the substrate handler.

[0120] At least three degrees of freedom include lateral and vertical offsets of a given center from a given position of a given center, and the yaw angle of the end effector from a given end effector pose.

[0121] At least three degrees of freedom include the offset of the end effector in a direction perpendicular to the substrate transport surface and the pitch angle of the end effector from a given end effector position.

[0122] A linear image array sensor that detects the edges of the substrate elucidates the substrate edge profile that determines the substrate center, and both the substrate edge profile and the substrate center are determined on the fly.

[0123] The determination of the substrate center and the center of the substrate holding station is performed during the common passage of the end effector to the linear image array sensor, thereby determining the substrate eccentricity and enabling automatic substrate centering in real time, substantially decoupled from the substrate handler's position data.

[0124] A linear image array sensor that senses the edges of the substrate elucidates a substrate edge profile that determines at least one of the substrate slip states relative to the substrate center and end effectors, and the substrate edge profile and at least one of the substrate center and substrate slip states are elucidated on the fly.

[0125] A linear image array sensor comprises linear sensor segments that are substantially aligned with one another.

[0126] The method includes a step of determining the temperature of the end effector and one or more of the at least one simple polygon using a temperature determination flag of the substrate transport device.

[0127] The method includes updating the position information of at least one encoder of the drive section of the substrate transport device on the fly, based on the determination of a predetermined center of the substrate holding station on the end effector.

[0128] It should be understood that the foregoing description is merely illustrative of the present disclosure. Various alternatives and modifications can be attempted by those skilled in the art without departing from the present disclosure. Accordingly, the present disclosure is intended to encompass all such alternatives, modifications, and variations that fall within the scope of any claims appended to this specification. Furthermore, the mere fact that different features are described in different dependent or independent claims does not indicate that any combination of these features cannot be used to their advantage, or that such combinations remain within the scope of the present disclosure.

Claims

1. A substrate processing apparatus, wherein the substrate processing apparatus is Frame and, A substrate transport device having an end effector connected to the frame and equipped with a substrate holding station having a predetermined center, wherein the end effector is configured to hold the substrate at the substrate holding station and transport the substrate within the substrate processing device, A linear image array sensor connected to the frame, configured to sense the edge of the substrate held on the end effector in the fly while the substrate transport device is in operation, At least one simple polygon defining a center-determining feature portion integrated with the substrate transport device, wherein the at least one simple polygon is positioned such that a linear image array sensor intersecting the simple polygon decomposes the simple polygon on the fly into a set of three or more substantially collinear points, in combination with at least one further side or edge of the substrate transport device different from the simple polygon, and the decomposition into the set of points results in the determination of the predetermined center of the substrate holding station on the end effector. A substrate processing apparatus comprising:

2. The substrate processing apparatus according to claim 1, wherein the at least one further side or edge is a different simple polygon arranged on the substrate transport device in a predetermined relationship with respect to the simple polygon.

3. The substrate processing apparatus according to claim 1, wherein the simple polygon and the at least one further side or edge form a substantially sawtooth shape on the substrate transport device.

4. The substrate transport apparatus according to claim 1, wherein the substrate transport apparatus has an end effector from which a substrate handler extends, and the set of three or more substantially collinear points is substantially decoupled from the position data of the substrate handler to provide real-time pose determination of the end effector in at least three degrees of freedom.

5. The substrate processing apparatus according to claim 1, wherein the linear image array sensor that senses the edge of the substrate determines a substrate edge profile that determines the center of the substrate, and the substrate edge profile and the center of the substrate are determined on the fly.

6. The substrate processing apparatus according to claim 1, wherein the linear image array sensor comprises linear sensor segments substantially aligned with each other.

7. The substrate processing apparatus according to claim 1, wherein the substrate transport device includes a temperature determination flag that gives a determination of the temperature of the end effector and one or more of the at least one simple polygon.

8. The substrate processing apparatus according to claim 1, wherein the determination of the predetermined center of the substrate holding station on the end effector results in an on-the-fly update of position information of at least one encoder of the drive section of the substrate transport device.

9. A substrate processing apparatus, wherein the substrate processing apparatus is Frame and, A substrate transport device having an end effector connected to the frame and equipped with a substrate holding station having a predetermined center, wherein the end effector is configured to hold the substrate at the substrate holding station and transport the substrate within the substrate processing device, A linear image array sensor connected to the frame, configured to sense the edge of the substrate held on the end effector in the fly while the substrate transport device is in operation, A side array for defining a center determination feature portion integrated with the substrate transport device, wherein the side array is arranged such that at least two inclined sides are oriented at a predetermined angle to each other, and at least one other side is oriented at a different angle to at least one of the two inclined sides, and so that the linear image array sensor intersecting the at least two inclined sides in combination with at least one other side decomposes the intersecting side into one or more substantially aligned linear segments on the fly, resulting in the determination of the predetermined center of the substrate holding station on the end effector, and A substrate processing apparatus comprising:

10. The substrate processing apparatus according to claim 9, wherein at least two sides from the at least one other side and at least one of the at least two inclined sides are sides of a common simple polygon.

11. The substrate processing apparatus according to claim 9, wherein the at least two sides and the at least other side form a substantially sawtooth shape on the substrate transport device.

12. The substrate processing apparatus according to claim 9, wherein the substrate transport apparatus has an end effector from which a substrate handler extends, and the substantially aligned linear segment is substantially decoupled from the position data of the substrate handler to provide real-time pose determination of the end effector in at least three degrees of freedom.

13. The substrate processing apparatus according to claim 9, wherein the linear image array sensor that senses the edge of the substrate determines a substrate edge profile that determines the center of the substrate, and the substrate edge profile and the center of the substrate are determined on the fly.

14. The substrate processing apparatus according to claim 9, wherein the linear image array sensor comprises linear sensor segments substantially aligned with each other.

15. The substrate processing apparatus according to claim 9, wherein the substrate transport device includes a temperature determination flag that gives a determination of the temperature of the end effector and one or more of the at least one simple polygon.

16. The substrate processing apparatus according to claim 9, wherein the determination of the predetermined center of the substrate holding station on the end effector results in an on-the-fly update of position information of at least one encoder of the drive section of the substrate transport device.

17. A substrate processing method, wherein the substrate processing method is A step of providing a substrate processing apparatus, wherein the substrate processing apparatus is Frame and, A substrate transport device having an end effector connected to the frame and equipped with a substrate holding station having a predetermined center, wherein the end effector is configured to hold the substrate at the substrate holding station and transport the substrate within the substrate processing device, A simple polygon defining the center-determining feature portion integrated into the substrate transport device and A process having, A step of using a linear image array sensor connected to the frame to sense the edge of the substrate held on the end effector in the fly while the substrate transport device is in operation, A step of determining the predetermined center of the substrate holding station on the end effector by decomposition into a set of points, wherein the at least one simple polygon is arranged such that the linear image array sensor intersecting the simple polygon decomposes the simple polygon on the fly into a set of points of three or more substantially collinear points by combining the simple polygon with at least one further side or edge of the substrate transport device that is different from the simple polygon. Methods that include...

18. The method according to claim 17, wherein the substrate transport device has an end effector having a substrate handler extending therefrom, and the method further includes the step of using a set of three or more substantially collinear points to provide real-time pose determination of the end effector in at least three degrees of freedom, substantially decoupled from the position data of the substrate handler.

19. The method according to claim 17, further comprising the step of determining the temperature of the end effector and one or more of the at least one simple polygon using the temperature determination flag of the substrate transport device.

20. The method according to claim 17, further comprising the step of updating the position information of at least one encoder of the drive section of the substrate transport device on the fly, based on the determination of the predetermined center of the substrate holding station on the end effector.

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