Solution supply device and semiconductor device

Abstract

The present invention discloses a solution supply device for supplying a mixed solution to a processing device, comprising a first solution input terminal, a second solution input terminal, a first transport pipeline, a second transport pipeline, a mixing tank located at the junction of the first and second transport pipelines, a main transport pipeline connected to the mixing tank, a main discharge pipeline of the main transport pipeline connected between the mixing tank and the processing device, and a control component that communicates with the main discharge pipeline and the main transport pipeline, wherein the control component is intended to discharge the mixed solution with an unstable flow rate via the main discharge pipeline before the main transport pipeline supplies the mixed solution to the processing device. The present invention achieves the effect of improving the accuracy of the volume ratio of each chemical component in the mixed solution.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor devices, and more particularly to a solution supply device and a semiconductor device.

Background Art

[0002] In semiconductor wet cleaning and etching devices, it is necessary to proportionally mix different solutions. In order to stabilize the amount of etched thin film of the product within a certain range, there is a high requirement for the stability of the concentration of the mixed solution. Common mixed solutions include, for example, DHF solution (a mixture of water and 49% hydrogen fluoride), SC1 solution (a mixture of ammonia water, hydrogen peroxide, and water with a volume ratio of 1:2:50), and HF / HNO3 solution (a mixture of hydrogen fluoride and nitric acid). The existing device end controls the compounding volume of the chemical solution of each component by adjusting the injection flow rate of the chemical solution in different input pipelines, so as to achieve the purpose of arranging a solution with a target concentration.

[0003] However, since there are limitations such as a certain time required for pipeline design and response control of valve members, the fluctuation of the concentration during the process of mixing solutions is relatively large. Moreover, as the number of online real-time replenishment operations increases, a cumulative effect appears in the concentration drift, and further, the etching amount of the solution on the product thin film becomes unstable, and in severe cases, it even leads to the abandonment of the product.

[0004] For example, an invention patent with application number 200510075183.4 discloses a chemical mixing and supplying apparatus and method, and as shown in Figure 1, the chemical mixing and supplying apparatus comprises a first chemical source section 112, a second chemical source section 122, a first transport pipeline 114, a second transport pipeline 124, a main transport pipeline 140, a mixer 142 located in the main transport pipeline 140, first and fourth flow meters 116, 126, a discharge pipeline 150, and a control component 130 that controls the flow rate of chemicals by comparing the chemical mixing ratio calculated based on flow rate data supplied from the first and fourth flow meters 116, 126 with a preset chemical mixing ratio. The discharge pipeline 150 is connected to the first and second transport pipelines 114 and 124, respectively, and can be connected to the chemical source sections 112 and 122, respectively. However, the flow rate of the first transported chemical becomes very unstable, and the first transported chemical is discharged from the discharge pipeline 150 within 3 to 5 seconds. After that, a stable flow rate is maintained, i.e., the chemical is discharged during the process in which the flow rate is adjusted.

[0005] The discharge pipeline 150 described above can be used to discharge chemicals with unstable flow rates in the first and second transport pipelines 114 and 124, and plays a role in preventing chemicals with unstable flow rates from flowing into the main transport pipeline 140 and mixer 142. However, when the transport of chemicals to the discharge pipeline 150 is stopped and the transport of chemicals to the main transport pipeline 140 is started, the chemicals transported from the first transport pipeline 114 and the second transport pipeline 124 are mixed in the main transport pipeline 140, and the pipe resistance and pressure inside the pipeline change before and after the valve is opened and closed. As a result, the flow rates of chemicals in the first transport pipeline 114 and the second transport pipeline 124 change rapidly, the flow rate of chemicals mixed from the first transport pipeline 114 and the second transport pipeline 124 and input into the main transport pipeline 140 becomes unstable, an imbalance occurs in the mixing ratio of chemicals input from the main transport pipeline 140 into the mixer 142, and an imbalance occurs in the concentration of the chemical solution supplied from the mixer 142 to the processing device 10.

[0006] Therefore, this patent aims to improve the accuracy of the volume ratio of each chemical component in a mixed liquid. [Overview of the project]

[0007] This invention has been made in view of the above technical problems, and aims to improve the accuracy of the volume ratio of each chemical component in a mixed liquid. To achieve this objective, the present invention provides a solution supply device and a semiconductor device.

[0008] In some embodiments, the present invention provides a solution supply device for supplying a mixed solution to a processing device.

[0009] The apparatus comprises a first solution input terminal for receiving an injected first solution, a second solution input terminal for receiving an injected second solution, a first transport pipeline connected to the first solution input terminal, a second transport pipeline connected to the second solution input terminal, a mixing tank connected to one end of the first transport pipeline away from the first solution input terminal and one end of the second transport pipeline away from the second solution input terminal, for mixing the first solution and the second solution to form a mixed solution, a main transport pipeline connected between the mixing tank and the apparatus for supplying the mixed solution to the apparatus, a main discharge pipeline connected to the main transport pipeline, and a control component that is in communication with the main discharge pipeline and the main transport pipeline, for discharging a mixed solution with an unstable flow rate via the main discharge pipeline before the main transport pipeline supplies the mixed solution to the apparatus.

[0010] In some embodiments, the present invention provides a semiconductor device comprising a processing apparatus for processing semiconductors and a solution supply apparatus.

[0011] The present invention has the following beneficial effects compared to the prior art.

[0012] In this invention, by adding a main discharge pipeline after the mixing of the chemical solution is complete, solutions with abnormal concentrations due to unstable flow rates in the initial stages of the mixture are discharged through the main discharge pipeline, and then transported to the processing device after the flow rate of the liquid distribution has stabilized, thereby improving the accuracy of the volume ratio of each component in the mixture. Furthermore, in this invention, by providing a regulator in the pipeline to stabilize the transported liquid pressure, a liquid with a stable flow rate is transported to the processing device, thereby improving the accuracy of the volume ratio of each component in the mixed solution. [Brief explanation of the drawing]

[0013] The features and performance of the present invention will be further described by the following embodiments and their drawings. [Figure 1] Figure 1 is a diagram showing the configuration of a chemical mixing and supply device related to the technical background of the present invention. [Figure 2] Figure 2 is a schematic diagram of one embodiment of the solution supply device according to the present invention. [Figure 3] Figure 3 is a schematic diagram of another embodiment of the solution supply device according to the present invention. [Figure 4] Figure 4 is a schematic diagram of another embodiment of the solution supply device according to the present invention. [Figure 5] Figure 5 is a schematic diagram of another embodiment of the solution supply device according to the present invention. [Modes for carrying out the invention]

[0014] Hereinafter, in order to more clearly explain embodiments of the present invention or technical proposals in the prior art, specific embodiments of the present invention will be described with reference to the accompanying drawings. Clearly, the drawings in the following description represent only some embodiments of the present invention, and those skilled in the art can obtain other drawings and other embodiments based on these drawings, without paying any inventive labor.

[0015] To simplify the drawings, each drawing schematically shows only the parts relating to the present invention and does not represent the actual structure of the product. Furthermore, to make the drawings easy to understand, some drawings schematically illustrate only one of the components having the same structure or function, or only one component is shown. In this specification, "one" may mean not only "only one" but also "one or more."

[0016] In this specification, unless otherwise explicitly defined and limited, the terms “attachment,” “connection,” and “connection” should be understood in a broad sense, for example, that connections may be fixed, detachable, or integral. Connections may be mechanical or electrical. Connections may be direct, indirect via an intermediate medium, or internally connected between two elements. Those skilled in the art will understand the specific meaning of these terms in the present invention on a case-by-case basis.

[0017] Furthermore, in the description of this application, the terms "first" and "second" are used solely to distinguish between the descriptions and cannot be understood as indicating or implying relative importance.

[0018] Embodiment 1 As shown in Figure 2, this embodiment discloses a solution supply device 200, which comprises a first solution input terminal 211, a second solution input terminal 221, a first transport pipeline 210, a second transport pipeline 220, a main transport pipeline 230, a main discharge pipeline 240, a mixing tank 250, and a control component 270.

[0019] Here, the first solution input terminal 211 is used to receive the injected first solution, and the second solution input terminal 221 is used to receive the injected second solution, and the first solution is different from the second solution. The first transport pipeline 210 is connected to the first solution input terminal 211, and the second transport pipeline 220 is connected to the second solution input terminal 221. The mixing tank 250 is connected to one end of the first transport pipeline 210 away from the first solution input terminal 211 and to the other end of the second transport pipeline 220 away from the second solution input terminal 221. That is, the mixing tank 250 is located at the junction of the first transport pipeline 210 and the second transport pipeline 220, or the first transport pipeline 210 and the second transport pipeline 220 are each connected to the mixing tank 250, and the mixing tank is used to mix the solutions transported by the first transport pipeline 210 and the second transport pipeline 220, respectively. The main transport pipeline 230 is connected between the mixing tank 250 and the processing unit 300 and is used to supply the mixed liquid to the processing unit 300.

[0020] Furthermore, the main discharge pipeline 240 is connected to the main transport pipeline 230 and corresponds to one branch of the main transport pipeline 230. The control component 270 is communicated with the main transport pipeline 230 and the main discharge pipeline 240, respectively, and is used to discharge the solution with an unstable flow rate along the DR direction shown in Figure 2 via the main discharge pipeline 240 before the main transport pipeline 230 supplies the mixed solution to the processing device 300. In this embodiment, the mixed solution in the mixing tank 250 can be stably transported to the processing device 300, the accuracy of the volume ratio of each component in the mixed solution can be improved, and a mixed solution of the correct concentration can be supplied each time it is supplied to the processing device 300.

[0021] This application does not restrict how the solution is discharged. In some embodiments, a second control valve 241 is provided in the main discharge pipeline 240, and a first control valve 231 is provided on the main transport pipeline 230 between the main discharge pipeline 240 and the processing unit 300, with the first control valve 231 located between the main discharge pipeline 240 and the processing unit 300, and the first and second control valves 241 are each communicated with a control component 270. Before the main transport pipeline 230 supplies the mixed solution to the processing unit 300, the control component 270 discharges the solution with an unstable flow rate through the main discharge pipeline 240 by closing the first control valve 231 and opening the second control valve 241. On the other hand, when the main transport pipeline 230 supplies the mixed solution to the processing unit 300, the control component 270 first opens the first regulating valve 231. At this time, the solution in the main transport pipeline 230 is divided into two parts, one of which is continued to be discharged from the main discharge pipeline 240, and the other part is supplied to the processing unit 300. After a preset time has elapsed since the first regulating valve 231 and the second regulating valve 241 were simultaneously open, the flow rate of the solution in the main transport pipeline 230 is stabilizing. At this point, the second regulating valve 241 is closed again, and all of the solution in the main transport pipeline 230 is supplied to the processing unit 300.

[0022] Preferably, a second flow meter 242 is provided in the main discharge pipeline 240. In the main transport pipeline 230, a first flow meter 232 is provided between the main discharge pipeline 240 and the processing device 300, and the first flow meter 232 and the second flow meter 242 are respectively connected to the control component 270 in a communication manner. Here, the second flow meter 242 detects, as a first detection value, the flow rate value when the solution flow rate in the main discharge line 240 is stable before the main transport pipeline 230 supplies the mixed solution to the processing device 300. When the main transport pipeline 230 supplies the mixed solution to the processing device 300, by opening the first regulating valve 231, the flow rate of the solution in the main transport pipeline 230 changes. At this time, the first flow meter 232 detects, as a second detection value, the real-time value of the flow rate of the solution transported from the main transport pipeline 230 to the processing device 300 (that is, the flow rate of the solution in the branch portion 233 of the main transport pipeline 230), and the second flow meter 242 detects, as a third detection value, the real-time value of the flow rate of the solution in the main discharge line 240. The control component 270 adjusts the opening speed of the first regulating valve 231 and the closing speed of the second regulating valve 241 so that the sum of the second detection value and the third detection value is equal to the first detection value, thereby stabilizing the flow rate in the main transport pipeline 230. Finally, the first regulating valve 231 is fully opened, and the second regulating valve 241 is fully closed. At this time, the second detection value becomes equal to the first detection value, and the third detection value becomes equal to zero.

[0023] Preferably, as shown in FIG. 3, on the main transport pipeline 230, a supply tank 234 (daily use tank) may be further provided. The supply tank 234 is located between the main discharge pipeline 240 and the processing device 300 and is used to buffer the mixed liquid from the mixing tank 250 and supply it to the processing device 300. Also, in the drawings of this embodiment, the supply tank 234 is provided behind the first regulating valve 231 and the second flow meter 242 and in front of the processing device 300, to improve the accuracy of the volume ratio of each component in the mixed solution entering the supply tank 234. Further, each time the mixed solution is supplied from the supply tank 234 to the processing device 300, a mixed solution with an accurate concentration is supplied.

[0024] In some embodiments, the first transport pipeline 210 is provided with a third control valve 212 and a third flow meter 213, the third control valve 212 located between the first solution input end 211 and the third flow meter 213; the second transport pipeline 220 is provided with a fourth control valve 222 and a fourth flow meter 223, the fourth control valve 222 located between the second solution input end 221 and the fourth flow meter 223, i.e., located along the direction of solution flow in the first transport pipeline 210 or the second transport pipeline 220; the third flow meter 213 is located downstream of the third control valve 212; and the fourth flow meter 223 is located downstream of the fourth control valve 222, detecting the actual flow rate that may fluctuate in the first transport pipeline 210 or the second transport pipeline 220 due to the operation of the third control valve 212 or the fourth control valve 222. Furthermore, the third control valve 212 and the fourth control valve 222, and the third flow meter 213 and the fourth flow meter 223 are each connected to a control component 270 via communication. The control component 270 receives flow information signals transmitted from the third flow meter 213 and the fourth flow meter 223 and can adjust the flow rate of each pipeline by controlling the opening of the third control valve 212 and the fourth control valve 222. While the first control valve 231, the second control valve 241, the third control valve 212, and the fourth control valve 222 are preferably flow control valves (FCVs), they may also be ordinary gate valves.

[0025] When the third adjustment valve 212 and the fourth adjustment valve 222 select the flow control valve, the control component 270 can control the flow rate ratio of the solutions in the first transport pipeline 210 and the second transport pipeline 220 with the flow control valves respectively to control the concentration mixing ratio. That is, the control component 270 detects the flow rate data in the first transport pipeline 210 and the second transport pipeline 220 with the third flow meter 213 and the fourth flow meter 223 respectively, calculates the flow rate ratio value of the different chemical solutions injected into the first solution input end 211 and the second solution input end 221, compares the calculated flow rate ratio value with the preset solution volume mixing ratio, outputs a control signal for controlling the opening rate of the third adjustment valve 212 and the fourth adjustment valve 222, and further, the first solution and the second solution are mixed to form a mixed solution having the preset solution volume mixing ratio described above, and the concentration of the mixed solution can be controlled so as to achieve the preset concentration mixing ratio described above.

[0026] In an actual application, an example is given where an HF (hydrogen fluoride) solution is injected into the first solution input end 211 and DIW (deionized water) is injected into the second solution input end 221.

[0027] First, only the second adjustment valve 241, the third adjustment valve 212, and the fourth adjustment valve 222 are opened, the first adjustment valve 231 is closed, and the control component 270 controls the solution flow rate ratio of HF or DIW in the first transport pipeline 210 and the second transport pipeline 220 through the third adjustment valve 212 and the fourth adjustment valve 222 respectively to adjust the concentration of the mixed solution in the mixing tank 250, and moreover, the HF / DIW mixed solution with large flow rate fluctuations due to changes in pressure and pipe resistance is discharged from the transport pipeline 240. Next, after the second flow meter 242 detects that the solution flow rate in the main discharge pipeline 240 has stabilized, the control component 270 opens the first adjustment valve 231 to inject a stable flow rate of HF / DIW mixed solution into the supply tank 234, and during the above process, the control component 270 adjusts the opening speed of the first adjustment valve 231 and the closing speed of the second adjustment valve 241 in the aforementioned control manner to stabilize the flow rate in the main transport pipeline 230.

[0028] Embodiment 2 As shown in Figure 4, this embodiment discloses a solution supply device 200 similar to Embodiment 1, which comprises a first solution input terminal 211, a second solution input terminal 221, a first transport pipeline 210, a second transport pipeline 220, a main transport pipeline 230, a main discharge pipeline 240, a mixing tank 250, a supply tank 234, and a control component 270. The connection method between each of the above components and the pipelines is the same as in Embodiment 1, and will not be repeated here, but the difference between this embodiment and Embodiment 1 is that a buffer tank 214 and a circulation pipeline 215 are added to the first transport pipeline 210, and a secondary discharge pipeline 224 is added to the second transport pipeline 220.

[0029] Here, a buffer tank 214 is located between the first solution input terminal 211 and the third control valve 212. One end of the circulation pipeline 215 is connected to the first transport pipeline 210 located between the buffer tank 214 and the first solution input terminal 211, and the other end is connected to the first transport pipeline 210 located between the buffer tank 214 and the third control valve 212. The circulation pipeline 215 is also equipped with a fifth control valve 216 and a fifth flow meter 217. One end of the secondary discharge pipeline 224 is connected to the first transport pipeline 210 located between the solution input terminal 221 and the fourth control valve 222. The secondary discharge pipeline 224 is also equipped with a sixth control valve 225 and a sixth flow meter 226. The fifth control valve 216, sixth control valve 225, fifth flow meter 217, and sixth flow meter 226 are also each communicated with the control component 270.

[0030] In practical applications, an example is to inject HF (hydrogen fluoride) solution into the first solution input terminal 211 and DIW (deionized water) into the second solution input terminal 221.

[0031] First, only the fifth control valve 216 and the sixth control valve 225 are opened, and only the first control valve 231, the second control valve 241, the third control valve 212, and the fourth control valve 222 are closed, allowing the HF solution to circulate inside the buffer tank 214 and circulation pipeline 215 at the set flow rate, while the DIW flow rate stabilization adjustment is started by the secondary discharge pipeline 224. Next, after the flow rates of both the HF solution and the DIW have reached the set values ​​and stabilized for a certain period of time, the fifth control valve 216 and the sixth control valve 225 are closed, and at the same time the second control valve 241, the third control valve 212, and the fourth control valve 222 are opened, while the first control valve 231 remains closed. The flow of HF solution into the circulation pipeline 215 is stopped, and the discharge of DIW from the secondary discharge pipeline 224 is stopped, the HF solution and DIW merge in the mixing tank 250, and the HF / DIW mixed solution that has passed through the mixing tank 250 flows into the main discharge pipeline 240, and the HF / DIW mixed solution, which has large fluctuations in flow rate due to changes in pressure and pipe resistance, is discharged from the main discharge pipeline 240. Finally, after the second flow meter 242 detects that the flow rate has stabilized, the first control valve 231 is opened and the HF / DIW mixed solution with a stable flow rate is injected into the supply tank 234.

[0032] Embodiment 3 As shown in Figure 5, this embodiment discloses a solution supply device 200 similar to Embodiment 1, which comprises a first solution input terminal 211, a second solution input terminal 221, a first transport pipeline 210, a second transport pipeline 220, a main transport pipeline 230, a mixing tank 250, a supply tank 234, and a control component 270. The connection method between each of the above components and the pipelines is the same as in Embodiment 1 and will not be repeated here, but the difference between this embodiment and Embodiment 1 is that regulators 260 are added to the first transport pipeline 210 and the second transport pipeline 220, respectively.

[0033] Furthermore, the first transport pipeline 210 and the second transport pipeline 220 maintain a constant pressure within the pipes by the regulator 260, so that the pressure at which the solution flows into the main transport pipeline 230 remains constant, ensuring a dynamic stabilization effect on the flow rate. In other words, the regulator 260 can exhibit the same technical effects as the main discharge pipeline 240 in Embodiment 1, so in this embodiment, the main transport pipeline 230 does not need to be connected to the main discharge pipeline 240. Here, the regulator 260 may be a hydraulic balance valve, or it may consist of a controller, a pressure sensor and a flow control valve, where the pressure sensor communicates with the inside of the pipe and transmits a pressure signal to the controller, and the controller controls the opening degree of the flow control valve according to the received pressure signal so that the pressure inside the pipe is maintained at a constant state, and the controller may be independent of the control component 270 or may belong to the control component 270.

[0034] In practical applications, an example is to inject HF (hydrogen fluoride) solution into the first solution input terminal 211 and DIW (deionized water) into the second solution input terminal 221.

[0035] If the main discharge pipeline 240 is connected to the main transport pipeline 230, first the second control valve 241, third control valve 212, and fourth control valve 222 are opened, and the first control valve 231 is closed, so that the HF solution and DIW each flow into the mixing tank 250 via the pipeline regulator 260, and the HF / DIW mixed solution is discharged for a predetermined time via the main discharge pipeline 240. Subsequently, if the supply tank 234 needs additional fluid, the second control valve 241 is closed, and the first control valve 231 is opened to inject the HF / DIW mixed solution into the supply tank 234 at a stable flow rate.

[0036] If the main discharge pipeline 240 is not connected to the main transport pipeline 230, the first control valve 231, third control valve 212, and fourth control valve 222 are opened directly to combine the HF solution and DIW into the mixing tank 250 via the pipeline regulators 260, respectively, and to inject the HF / DIW mixed solution into the supply tank 234. The regulators 260 on the first transport pipeline 210 and second transport pipeline 220 maintain the dynamic balance of the liquid pressure in the main transport pipeline 230, supplying a stable flow rate to the supply tank 234 and ensuring the accuracy of the concentration of the HF / DIW mixed solution.

[0037] Embodiment 4 This embodiment discloses a semiconductor device comprising a processing apparatus 300 and a solution supply device 200 in any one of the embodiments described above. The processing apparatus 300 includes, but is not limited to, a wafer cleaning tank or a wafer etching tank, and the solution supply device 200 can perform etching and cleaning processes on a wafer by supplying a mixed solution to one or more of the wafer cleaning tanks and wafer etching tanks via a main transport pipeline 230. By installing the above-described solution supply device 200 in a semiconductor device, this embodiment can improve the stability of the amount of etched thin film in the etching process and improve the cleanliness of the substrate surface in the cleaning process.

[0038] Furthermore, the above embodiments can be freely combined as needed. The above are merely preferred embodiments of the present invention, and a person ordinary in the art can make several improvements and modifications without departing from the principles of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A solution supply device for supplying a mixed solution to a processing device, A first solution input terminal for receiving the injected first solution, A second solution input terminal for receiving the injected second solution, A first transport pipeline connected to the first solution input terminal, A second transport pipeline connected to the second solution input terminal, A mixing tank is connected to one end of the first transport pipeline away from the first solution input end and to the other end of the second transport pipeline away from the second solution input end, for mixing the first solution and the second solution to form a mixed solution, A main transport pipeline is connected between the mixing tank and the processing apparatus to supply the mixed liquid to the processing apparatus, The main discharge pipeline connected to the main transport pipeline, A solution supply device comprising: a control component which is communicated with the main discharge pipeline and the main transport pipeline, and which discharges a mixed solution with an unstable flow rate through the main discharge pipeline before the main transport pipeline supplies the mixed solution to the processing device.

2. A solution supply device according to claim 1, The main transport pipeline is provided with a first control valve, and the first control valve is located between the main discharge pipeline and the processing device. The main discharge pipeline is provided with a second control valve. The control component is connected to the first and second control valves via communication, and is configured to close the first control valve and open the second control valve before the main transport pipeline supplies the mixed liquid to the processing device, thereby discharging the mixed solution with an unstable flow rate through the main discharge pipeline. The solution supply device is characterized in that the control component controls the opening of the first control valve when the main transport pipeline supplies a mixed liquid to the processing device, and controls the closing of the second control valve after both the first and second control valves have been opened within a preset time.

3. A solution supply device according to claim 1, The main transport pipeline is provided with a first control valve and a first flow meter in that order, and the first control valve and the first flow meter are arranged between the main discharge pipeline and the processing device. The main discharge pipeline is equipped with a second control valve and a second flow meter in that order. The control component is communicated with the first control valve, the first flow meter, the second control valve, and the second flow meter, respectively. Before the main transport pipeline supplies the mixed solution to the processing device, the control component closes the first control valve and opens the second control valve, and the second flow meter detects the flow rate value when the solution flow rate in the main discharge pipeline is stable as the first detected value. A solution supply device characterized in that, when the main transport pipeline supplies a mixed solution to the processing device, the first flow meter detects a real-time value of the solution flow rate transported by the main transport pipeline to the processing device as a second detection value, the second flow meter detects a real-time value of the solution flow rate in the main discharge pipeline as a third detection value, and the control component is arranged to adjust the opening speed of the first adjustment valve 231 and the closing speed of the second adjustment valve 241 so that the sum of the second detection value and the third detection value is equal to the first detection value.

4. A solution supply device according to claim 1, A solution supply device characterized in that the main transport pipeline is provided with a supply tank, the supply tank is located between the main discharge pipeline and the processing device, and is used to buffer the mixed solution from the mixing tank and supply it to the processing device.

5. A solution supply device according to claim 1, The first transport pipeline is provided with a third control valve and a third flow meter. The second transport pipeline is provided with a fourth control valve and a fourth flow meter. A solution supply device characterized in that the control component receives flow rate data detected from the third flow meter and the fourth flow meter, calculates the flow rate ratio of the first solution and the second solution, and outputs a control signal to control the opening rate of the third and fourth control valves by comparing the flow rate ratio with a preset mixing ratio, so that the first solution and the second solution are mixed to form a mixed solution having the preset mixing ratio.

6. A solution supply device according to claim 1, A solution supply device characterized in that the first transport pipeline and the second transport pipeline are each provided with regulators for stabilizing the liquid pressure within the first transport pipeline and the second transport pipeline.

7. A solution supply device according to claim 1, A buffer tank provided in the first transport pipeline, A solution supply device comprising: a circulation pipeline connected before and after the buffer tank of the first transport pipeline for recovering the first solution, which has an unstable flow rate, via a circulation pipeline before the first transport pipeline supplies the first solution to the mixing tank.

8. A solution supply device according to claim 1 or 7, A solution supply device characterized in that a secondary discharge pipeline is connected to the second transport pipeline and is used to discharge the second solution, which has an unstable flow rate, via the secondary discharge pipeline before the second transport pipeline supplies the second solution to the mixing tank.

9. A solution supply device that supplies a mixed solution to a processing device, A first solution input terminal for receiving the injected first solution, A second solution input terminal for receiving the injected second solution, A first transport pipeline connected to the first solution input terminal, A second transport pipeline connected to the second solution input terminal, A mixing tank is connected to one end of the first transport pipeline away from the first solution input end and to the other end of the second transport pipeline away from the second solution input end, for mixing the first solution and the second solution to form a mixed solution, The system comprises a main transport pipeline connected between the mixing tank and the processing apparatus for supplying the mixed liquid to the processing apparatus, A solution supply device characterized in that the first transport pipeline and the second transport pipeline are each provided with regulators for stabilizing the liquid pressure within the first transport pipeline and the second transport pipeline.

10. It is a semiconductor device, A semiconductor device comprising a processing apparatus for processing semiconductors and a solution supply apparatus according to any one of claims 1 to 9.

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