earphones

Abstract

This application provides an earphone (01) and relates to the technical field of electronic equipment. The earphone (01) comprises a housing (10) and at least one waterproof acoustic module (20), wherein the inner wall of the housing (10) is formed with at least one housing cavity (130) and at least one sound hole (140) that penetrates the housing (10) and communicates with the at least one housing cavity (130), the waterproof acoustic module (20) comprises a communication hole (240) and a waterproof assembly (220), the waterproof assembly (220) is configured to prevent liquid from passing through the communication hole (240) into the waterproof acoustic module (20), the at least one waterproof acoustic module (20) is installed in the at least one housing cavity (130) and covers the at least one sound hole (140) to prevent the liquid from passing through the at least one sound hole (140) into the internal space of the housing (10). By using a waterproof acoustic module (20), the sensitivity difference of the acoustic sensors installed inside the earphones (01) can be controlled, thereby ensuring that the sensitivity difference between different earphones (01) remains within a deviation range and guaranteeing the consistency between different earphones (01).

Description

[Technical Field]

[0001] This invention relates to the field of electronic equipment, and more specifically, to earphones. [Background technology]

[0002] Earphones typically have multiple acoustic sensors, and when earphones are used outdoors or in humid environments, liquids can easily enter the earphones through the sound vents. For example, if a user wears earphones during underwater activities (e.g., swimming), water can enter the earphones through the sound vents. Therefore, earphones used in humid environments need to have a moisture-proof and waterproof design.

[0003] During the assembly process of the acoustic sensor into the earphone, its sensitivity may be affected. Due to moisture and liquid resistance requirements, the acoustic sensor must be sealed and installed inside the earphone in combination with a waterproof structure, making it difficult to remove and adjust. Consequently, adjusting the sensitivity of the acoustic sensor becomes difficult, making it difficult to keep the sensitivity differences between earphones of the same batch within an ideal deviation range, resulting in a lower yield rate for earphones of the same batch.

[0004] Therefore, it is necessary to design earphones that have waterproof properties and a structure that can solve the problem of low yield of earphones in the same lot, as well as acoustic module components used in such earphones. [Overview of the Initiative] [Means for solving the problem]

[0005] This specification provides an earphone, the earphone comprising a housing and at least one waterproof acoustic module, wherein the inner wall of the housing has formed at least one housing cavity and at least one sound hole penetrating the housing and communicating with the at least one housing cavity, the at least one waterproof acoustic module comprising a communication hole and a waterproof assembly, the waterproof assembly configured to prevent liquid from passing through the communication hole and entering the waterproof acoustic module, the at least one waterproof acoustic module being installed in the at least one housing cavity and covering the at least one sound hole to prevent liquid from passing through the at least one sound hole and entering the internal space of the housing.

[0006] In some embodiments, the at least one waterproof acoustic module includes a first waterproof acoustic module and a second waterproof acoustic module, the at least one housing cavity includes a first housing cavity and a second housing cavity, the at least one sound vent includes a first sound vent and a second sound vent, the first waterproof acoustic module is installed in the first housing cavity and covers the first sound vent, and the second waterproof acoustic module is installed in the second housing cavity and covers the second sound vent.

[0007] In some embodiments, the inner wall of the housing includes a housing bottom wall and a housing side wall, the first housing cavity is installed in the housing bottom wall, the second housing cavity is installed in the housing side wall, and the first waterproof acoustic module and the second waterproof acoustic module are connected by a flexible circuit board.

[0008] In some embodiments, the first waterproof acoustic module and the second waterproof acoustic module each include a first acoustic sensor and a second acoustic sensor, the first acoustic sensor and the second acoustic sensor being a microphone or a speaker.

[0009] In some embodiments, the first waterproof acoustic module and the second waterproof acoustic module each include a first circuit board and a second circuit board, and the inner wall of the housing forms a first housing side wall of a first housing cavity and a second housing side wall of a second housing cavity, wherein the height of the first housing side wall is higher than the upper surface of the first circuit board to form a first housing space for housing a sealing material, and / or the height of the second housing side wall is higher than the upper surface of the second circuit board to form a second housing space for housing a sealing material.

[0010] In some embodiments, the first circuit board and the second circuit board are connected by a flexible circuit board.

[0011] In some embodiments, each of the housing cavities includes a housing side wall and a housing bottom wall, each of the sound holes penetrates the corresponding housing bottom wall to communicate the internal and external spaces of the housing, each of the waterproof acoustic modules includes a base, the waterproof assembly, an acoustic assembly, and a circuit board, the base includes a base side wall, a base bottom wall, and the communication holes, the base side wall and the base bottom wall form a base housing cavity, the communication holes penetrate the base bottom wall to communicate with the base housing cavity, the base and the housing cavity are sealed together, the waterproof assembly is located within the base housing cavity and covers the communication holes to prevent liquid from passing through the communication holes into the base housing cavity, the acoustic assembly includes an acoustic sensor installed on the side of the waterproof assembly away from the base bottom wall, the circuit board is located between the acoustic sensor and the waterproof assembly and is mechanically connected to the acoustic sensor.

[0012] In some embodiments, a first sealing member and a second sealing member are further included, wherein the base bottom wall and the housing bottom wall abut to form a first gap, the base side wall and the housing side wall form a second gap, the first sealing member seals the first gap, and the second sealing member seals the second gap.

[0013] In some embodiments, the first sealing member is obtained by curing after supplying a fluid sealing material to the first gap, and / or the second sealing member is obtained by curing after supplying a fluid sealing material to the second gap.

[0014] In some embodiments, the first sealing member is a gasket manufactured in advance.

[0015] In some embodiments, a first position limiting portion is installed on the base bottom wall along the circumferential direction of the communication hole, a second position limiting portion is installed on the accommodation bottom wall along the circumferential direction of the sound conduction hole, and the first position limiting portion and the second position limiting portion engage and abut to form a third gap.

[0016] In some embodiments, a third sealing member is further included. The third sealing member seals the third gap and is obtained by curing after supplying a fluid sealing material to the third gap. The first position limiting portion and the second position limiting portion engage and abut to prevent the fluid sealing material from flowing into the sound conduction hole.

[0017] In some embodiments, the first position limiting portion includes a groove installed on the base along the circumferential direction of the communication hole, and the second position limiting portion includes a corresponding protrusion installed on the accommodation bottom wall along the circumferential direction of the sound conduction hole.

[0018] In some embodiments, the circuit board is connected to a flexible circuit board beyond the accommodation side wall from a target segment of the accommodation side wall, and the target segment of the accommodation side wall is designed to be smoother than other portions of the accommodation side wall so as to reduce the bend of the accommodation side wall with respect to the circuit board.

[0019] In some embodiments, the target segment includes a guide opening formed in the housing side wall and an inclined guide surface, the guide opening and the inner wall of the housing being connected by the guide surface to support the circuit board.

[0020] In some embodiments, the diameter of the sound passage hole in the inner wall of the housing is less than or equal to the diameter of the sound passage hole in the outer wall of the housing.

[0021] In some embodiments, the central axis of the sound passage is installed at an inclination with respect to the bottom wall of the housing cavity.

[0022] As can be seen from the above technical means, the earphones according to this specification use an acoustic sensor mounting structure that has a liquid-proof effect. During the process of assembling the acoustic sensor into the earphone, its sensitivity may be affected, and because there are moisture-proof and liquid-proof requirements, the acoustic sensor must be sealed and installed in the housing in combination with a waterproof assembly, making it difficult to remove and adjust. Therefore, it becomes difficult to adjust the sensitivity of the acoustic sensor, making it difficult to keep the sensitivity difference of earphones of the same lot within an ideal range, and further affecting the yield of the earphones. In this specification, the acoustic sensor and waterproof assembly are installed in a single pre-manufactured acoustic module, and then the acoustic module is attached to the earphone. The acoustic module is adjusted to fit the earphone based on predetermined sensitivity difference requirements. This allows for flexible adjustment of the sensitivity difference of multiple acoustic sensors in the same earphone, ensuring that the sensitivity difference of earphones of the same lot is kept within an ideal range, and thus ensuring the yield of the earphones.

[0023] Other features of the earphones relating to this specification are listed in part in the following description. The inventive step of the earphones relating to this specification can be fully interpreted by practicing or using the methods, apparatus and combinations described in the following specific examples.

[0024] To more clearly illustrate the technical means in the embodiments described herein, the following drawings necessary for describing the embodiments are briefly introduced. Clearly, the drawings in the following description are only a part of the embodiments described herein, and those skilled in the art can obtain other drawings based on these without any creative effort. [Brief explanation of the drawing]

[0025] [Figure 1A] This is a schematic diagram of an earphone according to some embodiments of this specification. [Figure 1B] This is a cross-sectional view of the earphone shown in Figure 1A of this specification. [Figure 2A] This is a schematic diagram showing how a waterproof acoustic module according to some embodiments of this specification is installed in a housing cavity. [Figure 2B] This is a schematic diagram of a waterproof acoustic module according to some embodiments of this specification. [Figure 2C] Figure 2B of this specification is a cross-sectional view of the BB of the waterproof acoustic module. [Figure 3] This is a schematic diagram of another waterproof acoustic module according to an embodiment of this specification. [Figure 4A] This is a schematic diagram of an acoustic assembly and housing cavity according to some embodiments of this specification. [Figure 4B] This is another cross-sectional view (AA) of the earphone shown in Figure 1 of this specification. [Figure 4C] This is an enlarged view of area C shown in Figure 4B of this specification. [Figure 5] This is a schematic diagram of a first waterproof acoustic module according to some embodiments of this specification. [Figure 6] This is a schematic diagram of a first containment side wall according to some embodiments of this specification. [Figure 7A] This is a line graph of the sensitivity of an acoustic sensor in means A according to some embodiments of this specification. [Figure 7B] This is a line graph of the sensitivity of the acoustic sensor in means B according to some embodiments of this specification. [Modes for carrying out the invention]

[0026] To enable those skilled in the art to implement and use the contents of this specification, specific application scenarios and requirements of this specification are described below. Those skilled in the art will see various partial modifications to the disclosed examples, and the general principles defined herein can be applied to other examples and uses without departing from the spirit and scope of this specification. Therefore, this specification is not limited to the examples shown, but is the broadest scope that coincides with the claims.

[0027] The terms used herein are for illustrative purposes only and are not limiting. For example, unless the context explicitly indicates otherwise, the singular forms “one,” “one,” and “the” as used herein may include the plural form. As used herein, the terms “include,” “equip,” and / or “contain” mean the presence of the relevant integers, steps, actions, elements, and / or assemblies, but do not preclude the presence of one or more other features, integers, steps, actions, elements, assemblies, and / or groups, or the addition of other features, integers, steps, actions, elements, assemblies, and / or groups to the system / method.

[0028] In this application, the directions or positional relationships indicated by terms such as "up," "down," "left," "right," "front," "back," "top," "bottom," "inside," "outside," "vertical," "horizontal," "lateral," and "vertical" are based on the directions or positional relationships shown in the drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to necessarily having a specific direction or being configured and operated in a specific direction.

[0029] Furthermore, some of the above terms may be used to express meanings other than those related to direction or position. For example, the term "above" may, in some cases, be used to express a subordinate or connecting relationship. A person skilled in the art will be able to understand the specific meaning of these terms in this application depending on the specific circumstances.

[0030] Furthermore, the terms "attach," "install," "provide," "connect," and "link" should be understood in a broad sense. For example, they may be fixed connections, removable connections, or integral structures; they may be mechanical or electrical connections; they may be direct connections or indirect connections via an intermediate medium; or they may be internal communication between two devices, elements, or components. Those skilled in the art will be able to understand the specific meaning of the above terms in this application depending on the specific circumstances.

[0031] In this specification, "X includes at least one of A, B, or C" means that X includes at least A, or X includes at least B, or X includes at least C. In other words, X may include only one of A, B, or C, or it may include any combination of A, B, and C and other possible contents / elements simultaneously. Any combination of A, B, and C may be A, B, C, AB, AC, BC, or ABC.

[0032] In this specification, unless explicitly stated otherwise, relationships between structures may be direct or indirect. For example, when it is written "A is connected to B," unless explicitly stated that A is directly connected to B, it should be understood that A may be directly connected to B or indirectly connected to B. Similarly, when it is written "A is on B," unless explicitly stated that A is directly on B (A is adjacent to B and on B), it should be understood that A may be directly on B or indirectly on B (another element is interposed between A and B, and A is on B). By analogy,

[0033] Considering the following descriptions, these and other features of this specification, the operation and function of the related elements of the structure, and the economics of assembly and manufacture of the components can be significantly improved. Referring to the drawings, all of these drawings constitute part of this specification. However, it should be clearly understood that the drawings are for illustrative and illustrative purposes only and are not intended to limit the scope of this specification. Furthermore, it should be understood that the drawings are not drawn to actual size.

[0034] When an earphone 01 has two or more acoustic sensors, differences in sensitivity (i.e., Sgap) usually occur between the acoustic sensors assembled in the earphone 01 due to mounting errors, differences in acoustic sensor elements, etc. Furthermore, the consistency of the assembled sensitivity (also called assembly sensitivity) between each earphone 01 is low during the assembly process, affecting the yield of the earphone 01. The consistency of assembly sensitivity is the difference in Sgap between different earphones 01, and low consistency of assembly sensitivity indicates a large difference in Sgap between each earphone 01. In this case, the consistency of sensitivity between multiple earphones 01 can be adjusted by a predetermined algorithm. For example, the difference in assembly sensitivity between multiple acoustic sensors in earphone A is Sgap A Therefore, the difference in assembly sensitivity between the multiple acoustic sensors of earphone B is Sgap B Therefore, the difference in assembly sensitivity between multiple acoustic sensors in earphone C is Sgap C Therefore, it is desirable to use the same circuit design or algorithm to adjust the gap between multiple acoustic sensors in earphones A, B, and C. A Sgap B and Sgap C It is necessary to keep the difference between any two Sgap values ​​within a predetermined range, that is, to ensure a high degree of consistency in assembled sensitivity. However, algorithmic adjustments usually have a certain threshold range, making it difficult to simultaneously improve the sensitivity consistency between multiple earphones and guarantee a high yield.

[0035] Therefore, this application provides an earphone using a waterproof acoustic module. The waterproof acoustic module is an independent module separated from the housing. Because the waterproof acoustic module is treated to be water-resistant, the assembly sensitivity of the waterproof acoustic module is almost constant. By installing an independent acoustic module 20, the difference in assembly sensitivity of the earphones 01 can be flexibly adjusted, and the consistency of the assembly sensitivity of different earphones 01 can be further improved. In other words, the yield of earphones 01 can be guaranteed by ensuring that the difference between the assembly sensitivity gap Sgap of different earphones 01 is kept within a predetermined range.

[0036] The present application will be described in detail below with reference to specific examples.

[0037] Figure 1A is a schematic diagram of an earphone 01 according to some embodiments of this specification. Figure 1B is a cross-sectional view AA of the earphone 01 shown in Figure 1A of this specification. The earphone shown in Figure 1A is a wireless earphone. The wireless earphone may be a bone conduction earphone, an air conduction earphone, or an earphone that combines bone conduction and air conduction, and the earphone may also be a wired earphone. As shown in Figure 1B, the earphone 01 may include a housing 10 and at least one waterproof acoustic module 20.

[0038] The housing 10 may be a mounting assembly for the earphone 01. Other components of the earphone 01 (e.g., a waterproof acoustic module 20) can be mounted using the housing 10 as a carrier. The housing 10 may include an inner wall and an outer wall. The outer wall may be the visible surface of the earphone 01 that is ultimately seen by the user. The outer wall may be a smooth curved surface. The inner wall may be provided with grooves or protrusions to facilitate assembly. As shown in Figure 2A, the inner wall of the housing 10 may include a housing bottom wall 110 and a housing side wall 120. The housing bottom wall 110 and the housing side wall 120 together enclose an internal space, and other components of the earphone 01 may be installed within this internal space.

[0039] The shape of the housing 10 may be any shape, such as a racetrack shape (rounded rectangle) or a circle. In some embodiments, the housing 10 may include two parts, and after assembling the other parts, the two parts are engaged to form the visible appearance of the earphone 01 to the user. The shape of the housing 10 may be any shape. For example, the housing 10 of the earphone 01 may be shaped to conform to the contour of a human ear so that the wireless earphone can be worn more stably on the user's ear. The material of the housing 10 may be any material, such as a metal material, a plastic material, or a polymer material. This application does not limit the shape and material of the housing 10.

[0040] As shown in Figure 1B, the inner wall of the housing 10 may form at least one housing cavity 130. Specifically, the inner wall of the housing 10 may form a housing side wall 131 and a housing bottom wall 132 of the housing cavity 130. For example, the housing bottom wall 110 of the housing 10 forms the housing side wall 131 and the housing bottom wall 132. Alternatively, the housing bottom wall 110 forms part of the housing side wall 131 and the housing bottom wall 132, and the housing side wall 120 forms other parts of the housing side wall 131 and the housing bottom wall 132. In some embodiments, the housing cavity 130 may be a space surrounded by other components.

[0041] At least one sound-conducting hole 140 may be formed in the inner wall of the housing 10. At least one sound-conducting hole 140 penetrates the housing 10 and communicates with at least one housing cavity 130. For example, a sound-conducting hole 140 may be formed in the housing bottom wall 132 of each housing cavity 130. The sound-conducting hole 140 may penetrate the housing bottom wall 132 and communicate the internal space and the external space of the housing 10. In some embodiments, the diameter of the sound-conducting hole 140 in the inner wall of the housing 10 may be smaller than the diameter of the sound-conducting hole 140 in the outer wall of the housing 10. The diameter of the hole refers to the opening diameter on the wall surface of the sound-conducting hole. In other words, the sound-conducting hole 140 may have a trumpet shape, being larger on the outside and smaller on the inside. Designing the sound-conducting hole 140 in a trumpet shape makes it easier for the user to clean foreign matter such as solids or liquids that enter the sound-conducting hole 140, while also making it easier to remove the sound-conducting hole 140 during the manufacturing process.

[0042] In some embodiments, the central axis of the sound vent 140 is installed at an inclination with respect to the housing bottom wall 132 to prevent water from passing through the sound vent 140 and entering the housing 10. The central axis of the sound vent 140 may be the connection line between the center of the first opening on the inner wall of the housing 10 and the center of the second opening on the outer wall of the housing 10. The angle at which the central axis of the sound vent 140 is inclined with respect to the housing bottom wall 132 can be selected according to the product design and manufacturing needs, provided that it does not affect the acoustic performance of the earphone 01. In some embodiments, the range of the inclination angle may be [30, 90] degrees. When the inclination angle is [60, 90] degrees, a certain degree of inclination is guaranteed, and the manufacturing difficulty of the second sound vent 111-C is also reduced. When the inclination angle is [30, 60] degrees, the ability to prevent water from passing through the sound vent 140 and entering the housing 10 can be further improved by ensuring that the inclination angle is within this range. In some application scenarios, such as swimming, by installing the sound vent 140 at an angle, water does not flow directly into the sound vent 140 when the earphone 01 is subjected to dynamic water pressure, thereby improving the waterproofing capability of the earphone 01 under dynamic water pressure. The shape of the sound vent 140 may be any shape, such as circular, elliptical, square, rectangular, or L-shaped, and this specification does not limit the shape of the sound vent 140.

[0043] In some embodiments, the earphone 01 may include at least one housing cavity 130, each housing a plurality of components, for example, at least one waterproof acoustic module 20. In some embodiments, the housing cavity 130 may include a first housing cavity and a second housing cavity. The first housing cavity may include a first sound vent, and the second housing cavity may include a second sound vent. The first housing cavity may be installed in the housing bottom wall 110. The second housing cavity may be installed in the housing side wall 120 so that the sound vents 140 in the different housing cavities receive sound from different directions or transmit sound in different directions. In some embodiments, the first and second housing cavities may be installed in the housing bottom wall 110 or the housing side wall 120 to improve the ability of the sound vents 140 to receive sound from the same direction or transmit sound in the same direction.

[0044] At least one waterproof acoustic module 20 is installed within at least one housing cavity 130 and covers at least one sound vent 140 to prevent liquid from passing through the at least one sound vent 140 into the internal space of the housing 10. Figure 2A is a schematic diagram of a waterproof acoustic module 20 according to some embodiment of this specification when it is installed in the housing cavity 130. Figure 2B is a schematic diagram of a waterproof acoustic module 20 according to some embodiment of this specification. Figure 2C is a cross-sectional view of BB of the waterproof acoustic module 20 shown in Figure 2B of this specification. The waterproof acoustic module 20 may include a base 210, a waterproof assembly 220, an acoustic assembly 230, and a communication hole 240.

[0045] As shown in Figure 2A, the overall shape of the base 210 may conform to the housing space of the housing cavity 130 so that it can be installed inside the housing cavity 130. As shown in Figure 2C, the base 210 may include base side walls 211 and base bottom walls 212. The base side walls 211 and base bottom walls 212 form a base housing cavity 213 to accommodate other components (e.g., a waterproof assembly 220, an acoustic assembly 230, etc.). Communication holes 240 may be formed in the base 210. The communication holes 240 may penetrate the base bottom wall 212 and communicate with the base housing cavity 213. For example, the communication holes 240 may be formed in the base bottom wall 212. After the base 210 is installed inside the housing cavity 130, the communication holes 240 can communicate with sound holes 140 in the housing cavity 130 to ensure that sound enters and exits through the two holes. In some embodiments, the communication hole 240 is not coaxial with the opening of the sound-conducting hole 140 located on the wall surface of the housing bottom wall 132 facing the base 210. In some embodiments, the communication hole 240 may be coaxial with the opening of the sound-conducting hole 140 located on the wall surface of the housing bottom wall 132 facing the base 210, so that the sound transmission path is shortest and the earphone 01 has excellent acoustic performance. The statement that the communication hole 240 may be coaxial with the opening of the sound-conducting hole 140 located on the wall surface of the housing bottom wall 132 facing the base 210 may mean that the central axis of the communication hole 240 coincides with the central axis of the opening of the sound-conducting hole 140 located on the wall surface of the housing bottom wall 132 facing the base 210.

[0046] As shown in Figure 2C, the waterproof assembly 220 is mounted inside the base housing cavity 213, sealed and connected to the base housing cavity 213, and covers the communication hole 240 to prevent liquid (water) from passing through the communication hole 240 into the base housing cavity 213. The acoustic assembly 230 may be located on the side of the waterproof assembly 220 away from the base bottom wall 212.

[0047] In some embodiments, the waterproof assembly 220 may include a waterproof membrane 221 and a buffer member 222. The waterproof membrane 221 can allow air to pass through and prevent water from passing through. The buffer member 222 may have a central hole 222-A. The buffer member 222 may abut against the edge region of the waterproof membrane 221, specifically, the non-opening edge region of the buffer member 222 may abut against the edge region of the waterproof membrane 221. In some embodiments, the central hole 222-A is not coaxial with the opening of the sound-permeable hole 140 in the inner wall of the housing 10. In some embodiments, the central hole 222-A may be coaxial with the opening of the sound-permeable hole 140 in the inner wall of the housing 10, so that the waterproof membrane 221 can receive the water pressure of the water flowing in from the sound-permeable hole 140 uniformly, preventing the waterproof membrane 221 from being damaged by uneven water pressure and reducing or eliminating the waterproofing effect of the waterproof assembly 220. To say that the central hole 222-A is coaxial with the opening of the sound-permeable hole 140 in the inner wall of the housing 10 may mean that the central axis of the central hole 222-A and the central axis of the opening of the sound-permeable hole 140 in the inner wall of the housing 10 coincide. The shape of the central hole 222-A may be any shape such as circular, elliptical, square, or rectangular, and this specification does not limit the shape of the central hole 222-A. In some embodiments, the shape of the central hole 222-A may match the shape of the sound-permeable hole 140, and the diameter of the sound-permeable hole 140 may be less than or equal to the diameter of the central hole 222-A, thereby providing the waterproof membrane 221 with a large area that can withstand water pressure and is less prone to damage. Here, the diameter of the hole refers to the diameter of the hole.

[0048] In some embodiments, the waterproof assembly 220 may have an adhesive surface, which, after the waterproof assembly 220 is placed in the base housing cavity 213, adheres to the base bottom wall 212, thereby achieving a sealed connection between the two and fixing the waterproof assembly 220 in place. For example, the waterproof assembly 220 may have a first adhesive surface 222-B and a second adhesive surface 222-C. The first adhesive surface 222-B can adhere the waterproof assembly 220 to the base housing cavity 213 after being subjected to external pressure. The external pressure may be gravity from the acoustic assembly 230 or pressure applied by a pressure jig. The second adhesive surface 222-C can seal and bond the waterproof assembly 220 and the acoustic assembly 230 when the waterproof assembly 220 comes into contact with the acoustic assembly 230.

[0049] Specifically, the waterproof assembly 220 may have two cushioning members 222 distributed on both sides of the waterproof membrane 221. The two surfaces of the cushioning members 222 facing the base housing cavity 213 and the acoustic assembly 230 may be adhesive. By providing adhesive surfaces, the waterproof assembly 220 is fixed in the base housing cavity 213 by adhesive, achieving a waterproof effect while ensuring simplicity and convenience in the operation process.

[0050] Furthermore, the cushioning member 222 may be elastic. The cushioning member 222 can uniformly distribute the high-speed physical pressure (impact energy) received by the waterproof assembly 220, and furthermore, during the installation process of the waterproof assembly 220, the cushioning member 222 can protect the waterproof membrane 221 from being subjected to a large impact, causing wrinkles and affecting the waterproof and acoustic performance. In some embodiments, the cushioning member 222 may be a urethane foam tape, an elastic acrylic adhesive, or a foam + elastic acrylic adhesive. In some embodiments, the thickness range of a single cushioning member 222 is 0.1 mm or more. If the cushioning member 222 has a certain thickness, the height / thickness of the waterproof assembly 220 can be increased to fit the waterproof assembly 220 to the depth of a pre-installed assembly space in the housing 10, for example, the base housing cavity 213. Furthermore, if the cushioning member 222 has a certain thickness, the deformability of the waterproof assembly 220 is improved to accommodate different manufacturing tolerances of the base housing cavity 213, and the waterproof assembly 220 can be assembled more easily within the base 210.

[0051] The acoustic assembly 230 includes an acoustic sensor 231 and a circuit board 232. The acoustic sensor 231 is located on the side of the waterproof assembly 220 away from the base bottom wall 212. The circuit board 232 may be located between the acoustic sensor 231 and the waterproof assembly 220.

[0052] The acoustic sensor 231 may include a sound transmission hole 231-A. In some embodiments, the acoustic sensor 231 may include at least one microphone. The microphone can receive ambient sound that has passed through the waterproof assembly 220 via the sound transmission hole 231-A. In some embodiments, the acoustic sensor 231 may include at least one speaker. The speaker can emit a target sound when in operation. The target sound can be transmitted through the sound transmission hole 231-A, through the waterproof assembly 220, and out of the earphone 01. The waterproof assembly 220 covers the communication hole 240 to prevent water from entering the waterproof assembly 220 and coming into contact with the acoustic sensor 231.

[0053] The circuit board 232 may be mechanically connected to the acoustic sensor 231. The mechanical connection described herein may be by bonding, welding, seam joining, riveting, etc. For example, the acoustic sensor 231 may be fixed to the circuit board 232 by welding. As described above, the acoustic assembly 230 may be bonded to the waterproof assembly 220 via the second bonding surface 222-C, specifically, the circuit board 232 may be bonded to the waterproof assembly 220 via the second bonding surface 222-C. In some embodiments, the circuit board 232 can be bonded more firmly to the second bonding surface 222-C by further applying pressure to the acoustic assembly 230. For example, pressure can be applied by pressing down on the acoustic assembly 230 with a pressure jig. Alternatively, for example, pressure can be applied by placing a weight on the acoustic assembly 230.

[0054] In some embodiments, the circuit board 232 may be located at least partially within the base housing cavity 213. In some embodiments, the circuit board 232 may be located outside the base housing cavity 213. For example, the circuit board 232 may be located outside the base housing cavity 213 and abut against the top surface of the base side wall 211.

[0055] In some embodiments, the circuit board 232 may be flush with the edge of the base 210. For example, as shown in Figure 2A, the edge of the circuit board 232 and the edge of the base sidewall 211 are flush. In some embodiments, the area covered by the circuit board 232 may extend beyond the base 210. Figure 3 is a schematic diagram of another waterproof acoustic module 20 according to an embodiment of this specification. As shown in Figure 3, the right side of the circuit board 232 extends beyond the edge of the base sidewall 211. The portion of the circuit board 232 that extends beyond the edge may be bent beyond the base sidewall 211 until it contacts the housing bottom wall 110 or the housing sidewall 120. Designing the circuit board 232 to extend beyond the base 210 makes it easier to connect waterproof acoustic modules 20 when there are multiple waterproof acoustic modules 20.

[0056] In some embodiments, the circuit board 232 may be provided with a plurality of positioning holes 232-A, and the top surface of the base side wall 211 may be provided with a plurality of positioning protrusions 232-B corresponding to the plurality of positioning holes 232-A. By providing the positioning holes 232-A and positioning protrusions 232-B, the sound transmission hole 231-A and the central hole 222-A of the buffer member 222 can be positioned opposite each other, ensuring that the sound transmission path is as short as possible and that the earphone 01 has excellent acoustic performance. The number of positioning protrusions 232-B and positioning holes 232-A may be three, as shown in Figure 2B. The number of positioning protrusions and positioning holes is not limited in this specification. In some embodiments, to facilitate positioning, the plurality of positioning protrusions 232-B may surround the waterproof assembly 220 or the acoustic sensor 231 almost evenly. For example, the connecting lines of the three positioning protrusions 232-B in Figure 2B surround a triangle and are distributed almost evenly around the acoustic sensor 231.

[0057] In some embodiments, the positioning projection 232-B may be cylindrical, as shown in Figure 2B. In some embodiments, the positioning projection 232-B may be a frustoconical shape, narrower at the top and wider at the bottom, thereby avoiding interference with the positioning hole 232-A during installation. In some embodiments, the positioning projection 232-B includes a columnar body and a large columnar head. The columnar body is inserted into the corresponding positioning hole 232-A.

[0058] In some embodiments, the circuit board 232 may be a printed circuit board (PCB). Because PCBs are resistant to bending and have a certain degree of rigidity, they can effectively support the acoustic sensor 231.

[0059] In some embodiments, the circuit board 232 may be a flexible printed circuit board (FPC). As described above, the FPC may be subjected to local or overall reinforcement to improve the local thickness or stiffness of the FPC and to ensure the flatness of the FPC. In some embodiments, the acoustic assembly 230 may further include a steel plate or PI (Polymide, PI) material as a reinforcing plate 233 to reinforce the FPC. PI material is an engineering plastic with excellent mechanical properties, characterized by being lightweight, thin, and having excellent bendability. The reinforcing plate 233 for improving the strength of the circuit board 232 may be located between the circuit board 232 and the waterproof assembly 220, as shown in Figure 2C. The reinforcing plate 233 may abut the top surface of the base sidewall 211. In some embodiments, the thickness of the reinforcing plate 233 may range from 0.05 mm to 0.5 mm in order to reduce the space it occupies, with the aim of improving the strength of the circuit board 232.

[0060] As a result, multiple positioning holes 232-A may be installed in the reinforcing plate 233. As shown in Figure 2B, three positioning holes 232-A are formed in the reinforcing plate 233, and the three positioning holes 232-A form a triangle and are distributed almost evenly around the acoustic sensor 231.

[0061] In some embodiments, the positioning projection 232-B is made of a hot-melt material, and the end of the positioning projection 232-B is hot-melted and pressurized to form a large column head. Forming the positioning projection 232-B into a rivet-like structure by hot-melt pressurization is not only easy to operate and highly efficient, but the hot-melt material seals the gap between the positioning projection 232-B and the positioning hole 232-A, eliminating the need to reseal the gap between the positioning projection 232-B and the positioning hole 232-A, making it easy to operate, highly efficient, and cost-effective.

[0062] Figure 4A is a schematic diagram of a waterproof acoustic module 20 and housing cavity 130 according to some embodiments of this specification. Figure 4B is another cross-sectional view AA of the earphone 01 shown in Figure 1 of this specification. Figure 4C is an enlarged view of location C shown in Figure 4B of this specification.

[0063] To reduce the difficulty of assembling the waterproof acoustic module 20 and the housing cavity 130, the dimensions of the waterproof acoustic module 20 may be slightly smaller than the dimensions of the housing cavity 130. This may create a gap between the waterproof acoustic module 20 and the housing side wall 131. In some embodiments, as shown in Figure 4A, the base side wall 211 and the housing side wall 131 form a second gap I2. The second sealing member 40 that seals the second gap I2 may be obtained by supplying a fluid sealant to the second gap and then curing it. For example, the second sealing member 40 may be silicone, hot melt adhesive, UV adhesive, etc. All of the above sealants have advantages such as strong adhesion, low contamination, and fast curing.

[0064] In some embodiments, after the waterproof acoustic module 20 is mounted in the housing cavity 130, the base bottom wall 212 of the base 210 abuts against the housing bottom wall 132 to form a first gap I1, as shown in Figure 4A. The first gap I1 may be sealed by a first sealing member 30.

[0065] In some embodiments, the first sealing member 30 may be a pre-fabricated gasket. After the first sealing member 30 is pre-bonded to the housing bottom wall 132, the waterproof acoustic module 20 can be placed on the first sealing member 30 to fix the waterproof acoustic module 20 within the housing cavity 130. In some embodiments, the gasket may be double-sided tape, urethane foam tape, or foam + double-sided tape.

[0066] As described above, the housing side walls 131 and housing bottom wall 132 of the housing cavity 130 may be formed inside the housing 10. In some embodiments, the housing bottom wall 132 may include a first step. As shown in Figure 4B, the first step may divide the housing bottom wall 132 into a first bottom wall 132-A and a second bottom wall 132-B. The communication hole 240 penetrates the first bottom wall 132-A and communicates with the housing cavity 130. The base 210 may abut against the second bottom wall 132-B. The first gap I1 described above may be formed between the base 210 and the first bottom wall 132-A. The first sealing member 30 may be placed in the first gap I1 and seal the first gap I1. In this case, the first sealing member 30 may be obtained by supplying a fluid sealing material to the first gap I1 and then curing it.

[0067] During the flow process, the fluid sealing material may enter the sound passage hole 140 and fill part or all of the sound passage hole 140, potentially affecting sound introduction. If the sound passage hole 140 is installed at an angle, cleaning the fluid sealing material that has flowed into the hole becomes more difficult. In some embodiments, the fluid sealing material can be prevented from flowing into the sound passage hole 140 by installing positional limiting sections on the base bottom wall 212 and the housing bottom wall 132.

[0068] In some embodiments, a first position limiting portion 212-A is provided on the base bottom wall 212 along the circumferential direction of the communication hole 240, and a second position limiting portion is provided on the housing bottom wall 132 along the circumferential direction of the communication hole 240. For example, as shown in Figure 4B, the first position limiting portion 212-A is provided around the base bottom wall 212 along the opening of the communication hole 240. The second position limiting portion 212-B is provided around the housing bottom wall 132 along the opening of the sound-conducting hole 140. The first position limiting portion 212-A is provided on the side of the base bottom wall 212 facing the housing cavity 130. The engagement and contact between the first position limiting portion 212-A and the second position limiting portion 212-B prevents the fluid sealing material from flowing into the sound-conducting hole 140. By installing the first position limiting section 212-A and the second position limiting section 212-B around the perimeter, each path through which the fluid sealing material can flow into the sound passage hole 140 is blocked.

[0069] In some embodiments, as shown in Figure 4B, the first position limiting portion 212-A includes a groove installed in the base bottom wall 212 along the circumferential direction of the communication hole 240, and the second position limiting portion 212-B includes a second step installed in the housing bottom wall 132 along the circumferential direction of the sound hole 140. By installing the second step or a similar projection, the fluid sealing material is prevented from flowing into the sound hole 140. By installing the corresponding groove, the base bottom wall 212 and the second position limiting portion 212-B can better contact and engage, thereby better preventing the fluid sealing material from flowing into the sound hole 140. By installing the groove and the second step, not only can the fluid sealing material not flow into the sound hole 140 be prevented, but they can also serve to position the waterproof acoustic module 20 when it is placed in the housing cavity 130.

[0070] In some embodiments, considering the reduction of manufacturing accuracy errors and the difficulty of assembling the waterproof acoustic module 20 and the housing cavity 130, the groove opening may be slightly larger than the second step. Therefore, the first position limiting portion 212-A and the second position limiting portion 212-B may form a third gap. As shown in Figure 4C, the third gap may be sealed by a third sealing member 50. The third sealing member 50 may be obtained by supplying a fluid sealing material to the third gap and then curing it. In some embodiments, the third sealing member 50 may be a UV adhesive, silicone, or hot melt adhesive. In some embodiments, after the fluid sealing material of the first sealing member 30 flows into the first gap, any excess enters the third gap, and the third gap may be further sealed by the first sealing member 30. The presence of the third gap not only ensures that the fluid sealant does not flow into the sound passage hole 140, but also extends the containment path of the fluid sealant, allowing more fluid sealant to be placed between the waterproof acoustic module 20 and the containment cavity 130, thereby improving the strength of the connection between the two.

[0071] As described above, the earphone 01 may include at least one waterproof acoustic module 20. In some embodiments, the earphone 01 may include a single acoustic module 20. In some embodiments, the earphone 01 may include multiple acoustic modules 20, thereby including multiple acoustic sensors 231 to achieve more functionality. Any two of the circuit boards 232 of the waterproof acoustic module 20 may be connected by a flexible circuit board to connect two waterproof acoustic modules. Any two of the circuit boards 232 of the waterproof acoustic module 20 may be directly connected to connect two waterproof acoustic modules.

[0072] In some embodiments, the earphone 01 may include two acoustic modules 20, thereby including two acoustic sensors 231. For example, if the acoustic sensors 231 are microphones, noise reduction can be achieved by placing two microphones inside the earphone. One microphone may be a general-purpose microphone used when the user makes a call and collects human voices. The other microphone may have a noise collection function to easily collect ambient noise.

[0073] As described above, the housing 10 may include two housing cavities 130. Each of the two housing cavities 130 may house two waterproof acoustic modules 20, namely a first waterproof acoustic module 20-A and a second waterproof acoustic module 20-B (not shown). Figure 5 is a schematic diagram of the first waterproof acoustic module 20-A according to some embodiments of this specification.

[0074] The first waterproof acoustic module 20-A is installed in the first housing cavity 130-A and covers the first sound vent 140-A. The first waterproof acoustic module 20-A may also include a first acoustic sensor 231-A and a first circuit board 232-A. As described above, the inner wall of the housing 10 may form the first housing side wall 130-A1 of the first housing cavity 130-A. The height of the first housing side wall 130-A1 is higher than the upper surface of the first circuit board 232-A, thereby forming a first housing space S1 for housing a sealing material. The sealing material may be the sealant described above.

[0075] The second waterproof acoustic module is installed in the second housing cavity and covers the second sound vent. The second waterproof acoustic module may include a second acoustic sensor and a second circuit board. As described above, the inner wall of the housing 10 may form the second housing side wall of the second housing cavity. The height of the second housing side wall may be higher than the top surface of the second circuit board, thereby forming a second housing space for housing the sealing material. The structure of the second housing space may be the same as that of the first housing space.

[0076] The first circuit board and the second circuit board may be directly connected to each other to enable connection between the first waterproof acoustic module and the second waterproof acoustic module, or they may be connected by a separate flexible circuit board.

[0077] In some embodiments, both the first circuit board 232-A and the second circuit board may be circuit boards 232 whose right side extends beyond the edge of the base sidewall 211. Therefore, the portions of the first circuit board 232-A and the second circuit board that extend beyond the edge may be further bent after crossing the respective base sidewalls 211 and come into contact with the housing bottom wall 110 or the housing sidewall 120. In some embodiments, the first circuit board 232-A and the second circuit board may be in contact, and the contacting portions may be directly welded. In some embodiments, if the first circuit board 232-A and the second circuit board are PCBs, they may be electrically connected via board-to-board connectors (BTB connectors). In some embodiments, the portions of the first circuit board 232-A and the second circuit board that extend outside the base sidewall 211 cannot come into contact with each other. The two circuit boards 232 may be connected by another connecting circuit board. The connecting circuit board may be an FPC or a PCB.

[0078] As described above, the first circuit board 232-A may be an FPC, and the right side of the first circuit board 232-A may extend beyond the edge of the base sidewall in which it is located. Therefore, if the height of the first housing sidewall 130-A1 is higher than the top surface of the first circuit board 232-A, the first circuit board 232-A must be bent within the first housing cavity 130-A so as to connect to the connecting circuit board or the second circuit board, then protrude from the first housing cavity 130-A, extend beyond the first housing sidewall 130-A1, and bend further to the housing bottom wall 110 / housing sidewall 120.

[0079] Figure 6 is a schematic diagram of a first housing sidewall 130-A1 according to some embodiments of this specification. Figure 6 does not show the portion of the first circuit board 232-A that extends beyond the edge of the first housing sidewall 130-A1. In order to reduce the degree of bending when the first circuit board 232-A extends beyond the first housing cavity 130-A and to prevent damage to the first circuit board 232-A due to excessive bending at the first housing sidewall 130-A1, a target segment 131-A shown in Figure 6 may be installed on the first housing sidewall 130-A1. The first circuit board 232 may extend beyond the first housing sidewall 130-A1 from the target segment 131-A of the first housing sidewall 130-A1.

[0080] The target segment 131-A may have a flatter design than the other parts of the first housing side wall 130-A1, thereby reducing the degree of bending of the first circuit board 232-A at the first housing side wall 130-A1 and further extending the service life of the first circuit board 232-A. For example, if the corners of the other parts of the first housing side wall 130-A1 are all sharp right angles, the flatter design of the target segment 131-A may have rounded corners. Alternatively, for example, if the corners of the other parts of the first housing side wall 130-A1 have small-angle rounding, the flatter design of the target segment 131-A may have large-angle rounding. Also, for example, if the height difference between the other parts of the first housing side wall 130-A1 and the inner wall of the housing 10 is high, the flatter design of the target segment 131-A may have a small height difference between it and the inner wall of the housing 10, and there may be inclined support between it and the inner wall of the housing 10. As shown in Figure 6, the target segment 131-A may include a guide opening 131-a1 formed in the first housing side wall 130-A1 and an inclined guide surface 131-a2. The upper surface of the first circuit board 232-A may be flush with the upper surface of the guide opening 131-a1, thereby eliminating the need to bend the first circuit board 232-A beyond the first housing side wall 130-A1. The guide opening 131-a1 and the inner wall of the housing 10 may be connected by the inclined guide surface 131-a2. Since there is a certain height difference between the guide opening 131-a1 and the inner wall of the housing 10, the guide surface 131-a2 can be installed to support the circuit board 232, preventing the circuit board 232 from floating in mid-air and reducing the risk of damage to the circuit board 232.

[0081] In some embodiments, the degree of bending at the sidewall portion of the first housing sidewall 130-A1 of the first circuit board 232-A can be evaluated based on the bending angle of the first circuit board 232-A. The smaller the bending angle, the lower the degree of bending. For example, when the bending angle is acute, the degree of bending is lower than when the bending angle is right angle. If the guide surface 131-a2 is not installed, the first circuit board 232-A must be bent at a right angle along the first housing sidewall 130-A1. As shown in Figure 6, since the inclined guide surface 131-a2 is installed, it is possible to avoid a sharp bending angle when bending the first circuit board 232-A downwards. With the support of the guide surface 131-a2, the bending angle of the first circuit board 232-A becomes acute, and that angle is very small. In some embodiments, the target segment 131-A may use a rounded design in contrast to the right-angle design of the other segments, so that when the first circuit board 232-A crosses the first housing side wall 130-A1, it does not bend directly but bends along the curve, reducing damage to the first circuit board 232-A.

[0082] In some embodiments, the second housing cavity (mainly the second housing side wall) housing the second waterproof acoustic module may have the same design as the first housing cavity, and such details are omitted here. By installing a target segment on the second housing side wall, it is possible to avoid sharp bending angles when bending the second circuit board, thereby reducing damage to the second circuit board.

[0083] As described above, the waterproof acoustic module 20 is composed of standard components separated from the housing 10 and is subjected to liquid (water) proof treatment, so the sensitivity of the entire acoustic module 20 is almost constant. By installing the independent acoustic module 20, the sensitivity difference of the earphone 01 can be adjusted flexibly, and the consistency of the sensitivity of different earphones 01 can be improved. That is, it is possible to ensure that the difference between the sensitivity differences Sgap of different earphones 01 is within a predetermined range, thereby ensuring the yield of the earphone 01. Therefore, when the earphone 01 includes two acoustic sensors, at least one of these two acoustic sensors is from the waterproof acoustic module 20. In some embodiments, by installing two waterproof acoustic modules 20 in the earphone 01 respectively, the sensitivity after the assembly of the acoustic sensors can be more easily controlled, and the consistency of different earphones 01 can be ensured.

[0084] FIG. 7A is a sensitivity line graph of an acoustic sensor in solution means A according to some embodiments of the present specification.

[0085] FIG. 7B is a sensitivity line graph of an acoustic sensor in solution means B according to some embodiments of the present specification. Taking as an example the case where two acoustic sensors are installed in the earphone 01 and the two acoustic sensors are microphones (MIC1 and MIC2).

[0086] Solution means A is a sensitivity line graph when the waterproof acoustic module 20 is not used in the earphone 01. FIG. 7A shows the sensitivity values of MIC1 and MIC2 of each earphone 01 at 200 Hz to 4 kHz for three earphones A, B, and C among a plurality of earphones. The sensitivity of the microphones of the same earphone 01 is indicated by the same line. The sensitivity difference between the two microphones is denoted as Sgap. The average value of the sensitivity differences of the two microphones of earphone A is Sgap A is. The average value of the sensitivity differences of the two microphones of earphone B is Sgap B is. The average value of the sensitivity differences of the two microphones of earphone C is Sgap C is. SgapA and Sgap B The difference between Sgap A-B This is approximately 1.07 dB, and Sgap A and Sgap C The difference between Sgap A-C This is approximately 1.9 dB, and Sgap B and Sgap C The difference between Sgap B-C This is approximately 0.83 dB. Therefore, if it is necessary to adjust the sensitivity consistency between each earphone, the adjustment threshold is at least 1.9 dB.

[0087] Solution B is a sensitivity line graph for the case where one microphone of earphone 01 is from the waterproof acoustic module 20, and the other microphone is not from the waterproof acoustic module 20. Figure 7B shows the sensitivity values ​​of MIC1 and MIC2 of three earphones A', B', and C' from among multiple earphones in the range of 200Hz to 4kHz. For the sensitivity of the microphones of the same earphone 01, the difference in sensitivity between the two microphones is shown by the same line graph and is labeled Sgap'. The average value of the difference in sensitivity between the two microphones of earphone A' is Sgap A The average of the sensitivity difference between the two microphones of earphone B is Sgap B The average of the sensitivity difference between the two microphones of earphone C is Sgap C ' is. Sgap A 'and Sgap B 'Sgap A ' -B ' is approximately 0.47 dB, Sgap A 'and Sgap C 'Sgap A ' -C ' is approximately 0.85 dB, Sgap B 'and Sgap C 'Sgap B ' -C This is approximately 0.38 dB. In other words, if it is necessary to adjust the sensitivity consistency between each earphone, the adjustment threshold should reach 0.85 dB.

[0088] As can be seen from the data above, the maximum difference between Sgap' when at least one waterproof acoustic module 20 is used (Solution B) is considerably smaller than the maximum difference between Sgap when the waterproof acoustic module 20 is not used (Solution A). After detecting and statistically analyzing the microphone sensitivity of approximately 100 earphones 01 using Solution A and Solution B, it was found that the average difference in Sgap for earphones using Solution A was approximately 0.83 dB to 2.1 dB, and the average difference in Sgap' for earphones using Solution B was approximately 0.3 dB to 0.84 dB. Therefore, it is considered that earphones 01 using the waterproof acoustic module 20 have higher consistency and a higher yield.

[0089] Therefore, as can be easily seen, the above effect can also be achieved when the two microphones of the earphone 01 come from two waterproof acoustic modules 20, that is, when the two waterproof acoustic modules 20 are each mounted inside the housing 10. In particular, when two waterproof acoustic modules 20 are each mounted inside the earphone 01, the sensitivity of each waterproof acoustic module 20 can be measured, and if the sensitivity difference is too large compared to other earphones 01, the sensitivity difference between the two waterproof acoustic modules 20 can be adjusted by replacing one of the two waterproof acoustic modules 20, and the appropriate waterproof acoustic module 20 can be mounted inside the housing 10. Thus, by configuring the waterproof acoustic module 20 as a standard component, it is not only possible to mass-produce the waterproof acoustic module 20, but it is also possible to ensure that the difference between the sensitivity differences of different earphones 01 is kept within a predetermined range, and the yield of earphones 01 in the same batch can be guaranteed.

[0090] Specific embodiments of this specification have been described above. Other embodiments are within the scope of the appended claims. In some cases, the operations or steps described in the claims may be performed in a different order than those in the embodiments, and the desired results can still be achieved. Furthermore, the processes depicted in the drawings do not necessarily require a specific order or sequence to achieve the desired results. In some embodiments, multitasking and parallel processing are possible or may be advantageous.

[0091] From the above, it will be clear to those skilled in the art, after reading the detailed disclosure, that the aforementioned detailed disclosure may be presented merely as examples and may not be limiting. Although not explicitly stated herein, those skilled in the art will understand that this specification includes various reasonable changes, improvements, and modifications to the examples. These changes, improvements, and modifications are intended to be suggested herein and are within the spirit and scope of the exemplary examples herein.

[0092] Furthermore, some terms used herein are used to describe the embodiments herein. For example, “one embodiment,” “embodiment,” and / or “several embodiments” mean that certain features, structures, or properties described in relation to such embodiment may be included in at least one embodiment herein. Therefore, it should be emphasized and understood that two or more references to “embodiment,” “one embodiment,” or “alternative embodiment” in any part of this specification do not necessarily all refer to the same embodiment. Also, certain features, structures, or properties may be appropriately combined in one or more embodiments herein.

[0093] In the preceding description of the embodiments herein, please understand that for the purpose of simplifying this specification and to aid in understanding a single feature, various features are sometimes grouped into a single embodiment, drawing, or description thereof. However, this does not mean that these combinations of features are essential, and it is entirely possible for those skilled in the art to extract some of these features and understand them as separate embodiments when reading this specification. That is, the embodiments herein may be understood as combinations of multiple sub-embodied embodiments. Furthermore, the content of each sub-embodied embodiment may be less than all the features of a single embodiment previously disclosed.

[0094] All patents, patent applications, published patent gazettes, and other materials such as documents, books, specifications, publications, documents, articles, etc., referenced herein are incorporated by reference, with the exception of application history documents that do not match or contradict the content of this specification, and documents (currently or later attached to this specification) that limit the broadest scope of the claims herein. They are currently or will be associated with this specification. For example, if there is any inconsistency or contradiction between the explanations, definitions and / or use of terms relating to any material included herein and the explanations, definitions and / or use of terms relating to this specification, the terms herein shall prevail.

[0095] Finally, it should be understood that the embodiments of the present application disclosed herein are intended to illustrate the principles of the embodiments herein. Other modified embodiments are also within the scope of this specification. Therefore, the embodiments disclosed herein are illustrative and not limiting. Those skilled in the art can implement the invention herein by alternative configurations based on the embodiments herein. Therefore, the embodiments herein are not limited to those precisely described herein. [Explanation of symbols]

[0096] 01 Earphones 10 Housing 110 Housing bottom wall 120 Housing side wall 130 capacity cavity 131 Containment side wall 132 Enclosure bottom wall 130-A First containment cavity 130-A1 First containment side wall 131-A Target Segment 131-a1 Information Entrance 131-a2 Information surface S1 First containment space 212-B Second position limiting section 140 tone holes 140-A First tone hole 111-C 2nd sound hole 20 Waterproof Acoustic Modules 20-A First Waterproof Acoustic Module 231-A First Acoustic Sensor 232-A First Circuit Board 20-B Second Waterproof Acoustic Module 210 base 211 Base side wall 212 Base bottom wall 212-A First position limiting section 213 Base housing cavity 220 Waterproof Assembly 230 Acoustic Assembly 231 Acoustic Sensor 232 Circuit boards 240 Communication hole 30 First sealing member 40 Second sealing member 50 Third sealing member I1 First gap I2 Second gap

Claims

1. A housing wherein the inner wall of the housing has at least one housing cavity and at least one sound-conducting hole that penetrates the housing and communicates with the at least one housing cavity, A waterproof acoustic module comprising at least one waterproof acoustic module including a communication hole and a waterproof assembly, wherein the waterproof assembly is configured to prevent liquid from passing through the communication hole and entering the waterproof acoustic module, The earphone is characterized in that the at least one waterproof acoustic module is installed in the at least one housing cavity and covers the at least one sound port to prevent the liquid from passing through the at least one sound port and entering the internal space of the housing.

2. The at least one waterproof acoustic module includes a first waterproof acoustic module and a second waterproof acoustic module, the at least one housing cavity includes a first housing cavity and a second housing cavity, and the at least one sound channel includes a first sound channel and a second sound channel. The first waterproof acoustic module is installed in the first housing cavity and covers the first sound vent, The earphone according to claim 1, characterized in that the second waterproof acoustic module is installed in the second housing cavity and covers the second sound port.

3. The inner wall of the housing includes the housing bottom wall and the housing side wall, The earphone according to claim 2, characterized in that the first housing cavity is installed in the bottom wall of the housing, the second housing cavity is installed in the side wall of the housing, and the first waterproof acoustic module and the second waterproof acoustic module are connected by a flexible circuit board.

4. The earphone according to claim 2 or 3, characterized in that the first waterproof acoustic module and the second waterproof acoustic module each include a first acoustic sensor and a second acoustic sensor, and the first acoustic sensor and the second acoustic sensor are a microphone or a speaker.

5. The first waterproof acoustic module and the second waterproof acoustic module each include a first circuit board and a second circuit board, The inner wall of the housing forms the first housing side wall of the first housing cavity and the second housing side wall of the second housing cavity. The height of the first housing side wall is higher than the upper surface of the first circuit board, thereby forming a first housing space for housing the sealing material, and / or, The earphone according to claim 2, characterized in that the height of the second housing side wall is higher than the upper surface of the second circuit board, thereby forming a second housing space for housing sealing material.

6. The earphone according to claim 5, characterized in that the first circuit board and the second circuit board are connected by a flexible circuit board.

7. Each of the housing cavities includes a housing side wall and a housing bottom wall, and each of the sound holes penetrates the corresponding housing bottom wall to connect the internal space and the external space of the housing. Each of the aforementioned waterproof acoustic modules is A base comprising a base side wall, a base bottom wall, and the communication hole, wherein the base side wall and the base bottom wall form a base housing cavity, the communication hole penetrates the base bottom wall and communicates with the base housing cavity, and the base and the housing cavity are sealed together, the base and The waterproof assembly is located within the base housing cavity and covers the communication hole to prevent liquid from passing through the communication hole and entering the base housing cavity, An acoustic assembly including an acoustic sensor installed on the side of the waterproof assembly away from the base bottom wall, The earphone according to any one of claims 1 to 6, further comprising a circuit board located between the acoustic sensor and the waterproof assembly and mechanically connected to the acoustic sensor.

8. Further including a first sealing member and a second sealing member, The base bottom wall and the housing bottom wall abut against each other to form a first gap, and the base side wall and the housing side wall form a second gap. The earphone according to claim 7, characterized in that the first sealing member seals the first gap, and the second sealing member seals the second gap.

9. The first sealing member is obtained by supplying a fluid sealing material to the first gap and then curing it, and / or The earphone according to claim 8, characterized in that the second sealing member is obtained by supplying a fluid sealing material to the second gap and then curing it.

10. The earphone according to claim 8 or 9, characterized in that the first sealing member is a pre-manufactured gasket.

11. A first position limiting portion is provided on the base bottom wall along the circumferential direction of the communication hole. The earphone according to claims 8 to 10, characterized in that a second position limiting portion is provided on the housing bottom wall along the circumferential direction of the sound passage hole, and the first position limiting portion and the second position limiting portion engage and come into contact with each other to form a third gap.

12. The present invention further includes a third sealing member, the third sealing member sealing the third gap, and the third sealing member is obtained by supplying a fluid sealing material to the third gap and then curing it. The earphone according to claim 11, characterized in that the first position limiting portion and the second position limiting portion engage and come into contact with each other to prevent the fluid sealing material from flowing into the sound passage hole.

13. The first position limiting portion includes a groove installed in the base along the circumferential direction of the communication hole, The earphone according to claim 11 or 12, characterized in that the second position limiting portion includes a corresponding projection installed on the housing bottom wall along the circumferential direction of the sound passage hole.

14. The circuit board is connected to the flexible circuit board from the target segment of the housing side wall, beyond the housing side wall, The earphone according to any one of claims 7 to 13, wherein the target segment of the housing side wall is designed to be smoother than other parts of the housing side wall so as to reduce the curvature of the housing side wall relative to the circuit board.

15. The earphone according to claim 14, wherein the target segment includes a guide opening formed in the housing side wall and an inclined guide surface, and the guide opening and the inner wall of the housing are connected by the guide surface to support the circuit board.

16. The earphone according to any one of claims 1 to 15, characterized in that the diameter of the sound passage hole in the inner wall of the housing is less than or equal to the diameter of the sound passage hole in the outer wall of the housing.

17. The earphone according to any one of claims 1 to 16, characterized in that the central axis of the sound-conducting hole is installed at an inclination with respect to the bottom wall of the housing cavity.

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