Electronic device casing with radiator and fan
The electronic casing design with vertically extending cooling fins and pins, along with a fan positioned on these pins, addresses inefficiencies in airflow and heat dissipation, enhancing cooling efficiency and compactness without additional parts, suitable for automotive applications.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- CONTINENTAL AUTOMOTIVE TECHNOLOGIES GMBH
- Filing Date
- 2024-05-22
- Publication Date
- 2026-07-03
AI Technical Summary
Existing electronic device casings with heat sinks and blower fans are inefficient in cooling all electronic components due to the fan's placement parallel to the heatsink, obstructing airflow and limiting effective heat dissipation from components beneath the fan's smooth portion, while also degrading airflow performance.
The electronic casing design includes a heat sink with vertically extending cooling fins and pins, and a blower fan positioned on these pins with its rotation axis perpendicular to the heatsink bottom wall, creating an air passage and optimizing airflow to enhance heat dissipation from both types of heat dissipation elements.
This configuration improves heat dissipation efficiency by ensuring all components benefit from forced airflow, maintains compactness, and maintains production costs without increasing part count, suitable for automotive applications.
Smart Images

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