Solar cell modules and their manufacturing methods, photovoltaic power generation equipment, power consumption devices and power generation devices

Abstract

This application relates to a solar cell module and a method for manufacturing the same, a photovoltaic power generation device, a power consumption device and a power generation device, wherein in two adjacent sub-batteries, a conductor is connected to the conductive layer of one of the sub-batteries, and at least a portion of the conductor protrudes outside at least one end along the second direction of the conductive layer. At this time, the electrode layer of the other sub-battery can be connected to the protruding portion of the conductor outside the sub-battery, thus enabling a series connection between the two sub-batteries outside the sub-batteries. This eliminates the need to perform two scribe operations before depositing the electrode layers to achieve a series connection, as in the conventional method, and only a disconnection operation is required between the sub-batteries. By designing in this way, a conductor is provided protruding at at least one end along the second direction of the conductive layer, and the two scribe operations before the series connection of the sub-batteries can be canceled, making it easier to realize a single-disconnection manufacturing method, simplifying the manufacturing process and improving manufacturing efficiency. At the same time, by canceling the two scribe operations before the series connection, the probability of an increase in series resistance between the sub-batteries is reduced, improving module performance.

Description

[Technical Field]

[0001] (Cross-reference of related applications) This application claims priority to a Chinese patent application filed on November 30, 2023, with application number 2023116292812, titled "Solar cell module and method for manufacturing the same, photovoltaic power generation equipment, power consumption device and power generation device," the entire contents of which are incorporated into this application by reference. (Technical field)

[0002] This application relates to the technology of solar cells, and more particularly to solar cell modules and methods for manufacturing the same, photovoltaic power generation equipment, power consumption devices and power generation devices. [Background technology]

[0003] A solar cell module is a device that converts light energy into electrical energy using the photovoltaic effect. In the manufacturing process, a scribe method is generally used to connect each sub-cell in the module in series. For example, the P1 scribe cuts the conductive layer, the P2 scribe cuts the semiconductor layer and the two upper and lower transport layers, and at the same time allows contact between the metal electrode layer and the conductive layer, and the P3 scribe cuts two adjacent sub-cells.

[0004] However, conventional solar cell modules are limited by their structural design and complex manufacturing process, which makes them more susceptible to damage during scribing, leading to a decrease in their performance. [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] Based on this, there is a need to provide a solar cell module and its manufacturing method, photovoltaic power generation equipment, power consumption equipment and power generation equipment that facilitate the simplification of the manufacturing process, reduce the probability of cuts to the structure of the solar cell module during the manufacturing process, and facilitate the improvement of module performance. [Means for solving the problem]

[0006] According to a first aspect, the present application provides a solar cell module comprising at least two sub-cells, spaced apart along a first direction, and each sub-cell comprising a conductive layer, a group of functional layers, and an electrode layer, each sub-cell being stacked and installed, the solar cell module further comprising a conductor, in two adjacent sub-cells, the conductor being connected to the conductive layer of one of the sub-cells and at least partially protruding from at least one end of the conductive layer along a second direction, the portion of the conductor protruding from the conductive layer being connected to the electrode layer of the other sub-cell, the first direction intersects the second direction, and the plane formed by the two intersects the thickness direction of the solar cell module.

[0007] The above solar cell module connects a conductor to the conductive layer of one of two adjacent sub-batteries, and extends at least a portion of the conductor beyond at least one end along the second direction of this conductive layer. That is, the conductor is located at least partially outside the sub-battery, and the electrode layer of the other sub-battery can be connected to the protruding portion of the conductor outside the sub-battery. In this way, a series connection between the two sub-batteries can be achieved outside the sub-batteries, eliminating the need for two scribe operations before depositing the electrode layers to achieve a series connection, and requiring only a disconnection operation between the sub-batteries. By designing it this way, the conductor is provided protruding at at least one end along the second direction of the conductive layer, eliminating the need for two scribe operations before the series connection of the sub-batteries, making it easier to realize a single-disconnection manufacturing method, simplifying the manufacturing process, and improving manufacturing efficiency. At the same time, by eliminating the two scribe operations before series connection, the probability of disconnection damage to the conductive layer is reduced, the probability of increased series resistance between the sub-batteries is effectively reduced, and module performance can be improved.

[0008] In some embodiments, the conductor is located on the side of the conductive layer facing the functional layers and extends outward from at least one end along the second direction of the conductive layer. This design is advantageous in that the conductor is placed on one side of the conductive layer, facilitating the rapid conduction of current through the conductor in the conductive layer along the second direction, reducing resistance in the current conduction process, and improving module performance.

[0009] In some embodiments, both ends of a conductor located in a sub-battery protrude outwards from the opposing ends along a second direction of the conductive layer, and at least one of the ends of the conductor is connected to the electrode layer of an adjacent sub-battery. For example, both ends of the conductor are designed to protrude outwards from the conductive layer, facilitating connection of the electrode layer of the adjacent sub-battery to the conductive layer of that sub-battery via the protruding portion of the conductor, thereby realizing a series connection between the sub-batteries.

[0010] In some embodiments, one of the ends of the conductor of a sub-battery protrudes from one end along a second direction of the conductive layer. This design allows for a connection between the electrode layer of an adjacent sub-battery and the conductive layer of that sub-battery via one end of the conductor, thereby enabling a series connection between the sub-batteries.

[0011] In some embodiments, the conductor includes a first member and a second member, which are distributed discontinuously, and which protrude outward from both ends of the conductive layer of the sub-battery in which they are located, along the second direction, and which are both connected to the electrode layer of an adjacent sub-battery. This design facilitates the realization of a series connection between two adjacent sub-batteries via the disconnected first and second members.

[0012] In some embodiments, an etching groove is provided between two adjacent sub-batteries, and the conductor is located on the side of the etching groove along a first direction and is provided on the conductive layer. By designing in this way, the conductor is placed on one side of the etching groove, facilitating the connection between the electrode layer and the conductor, and enabling a series connection between the sub-batteries.

[0013] In some embodiments, the solar cell module includes a plurality of etching grooves and a plurality of conductors, with at least one conductor between two adjacent etching grooves. By designing in this way, the conductors are positioned between two adjacent etching grooves, facilitating sequential connection of each electrode layer and the conductors, thereby forming a series connection.

[0014] In some embodiments, the size of the conductor along the first direction is smaller than the size of the conductive layer along the first direction. By designing in this way, it is advantageous to reduce the dead zone on the conductive layer and improve module performance by controlling the size relationship between the conductor and the conductive layer.

[0015] In some embodiments, the size of the conductor along the first direction is denoted as W, where 30 μm ≤ W ≤ 200 μm. By designing in this way, the size of the conductor in the first direction can be controlled between 30 μm and 200 μm, which not only satisfies the rapid flow of current but also controls the size of the dead zone on the conductive layer, thereby improving the performance of the solar cell module.

[0016] In some embodiments, the further condition that size W satisfies is 80 μm ≤ W ≤ 100 μm. By designing in this way, the size of the conductor in the first direction can be further controlled between 80 μm and 100 μm, thereby enabling the conductor design to more effectively balance its own conductive performance with the effective area on the conductive layer.

[0017] In some embodiments, the size along the thickness direction of the conductor is denoted as h, where h > 0 nm. By designing in this way, a conductor is introduced to achieve a series connection between two sub-cells, replacing the conventional scribes of P1 and P2, simplifying the manufacturing process, effectively reducing the probability that the solar cell module is cut, and being advantageous for improving the performance of the module.

[0018] In some embodiments, the condition further satisfied by the size h is h ≥ 40 nm. By designing in this way, the thickness of the conductor is controlled to be 40 nm or more, giving the conductor good electrical conductivity performance.

[0019] In some embodiments, the condition further satisfied by the size h is 40 nm ≤ h ≤ 300 nm. By designing in this way, the size in the thickness direction of the conductor is controlled to be 40 nm to 300 nm, and on the premise of satisfying the stability of the structure of the solar cell module, the solar cell module is given good overcurrent capability.

[0020] In some embodiments, the condition further satisfied by the size h is 50 nm ≤ h ≤ 150 nm. By designing in this way, the size in the thickness direction of the conductor is controlled to be 40 nm to 300 nm, and on the premise of satisfying the stability of the structure of the solar cell module, the solar cell module is given good overcurrent capability. In some embodiments, the condition further satisfied by the size h is 80 nm ≤ h ≤ 150 nm. By designing in this way, the size in the thickness direction of the conductor is further controlled to be between 80 nm and 150 nm. On the premise of satisfying the stability of the structure, the overcurrent capability of the solar cell module is further improved, and the performance of the module is further improved.

[0021] In some embodiments, the conductivity of the conductor is not less than the conductivity of the conductive layer. By designing in this way, the conductivity of the conductor is reasonably designed, which is advantageous for the current to be quickly transmitted on the conductor, thereby improving the conductive performance of the module.

[0022] In some embodiments, the conductivity of the conductor is ≥ 5×10 S / m. By designing in this way, the conductivity of the conductor is reasonably designed, which is advantageous for the current to be transmitted rapidly on the conductor, thereby improving the conductive performance of the module.

[0023] In some embodiments, the material of the conductor may be a single metal, such as silver, copper, gold, aluminum, magnesium, tungsten, molybdenum, zinc, cobalt, nickel, potassium, lithium, iron, platinum, tin, etc., or may be a non-metallic material, such as carbon fiber, zinc oxide, conductive polymer material, conductive polymer material, conductive ceramic material, etc.

[0024] In some embodiments, the conductive layer includes at least one of tin oxide doped with indium, tin oxide doped with fluorine, zinc oxide doped with aluminum, indium oxide doped with lanthanoid metal, tin oxide doped with antimony, zinc oxide doped with boron, indium zinc oxide, gallium zinc oxide, indium tungsten oxide. By designing in this way, the material of the conductive layer is reasonably selected to endow the conductive layer with good conductive performance.

[0025] In some embodiments, each electrode layer includes a main body portion and a connection portion connected to the main body portion. The main body portion is provided on the side facing away from the conductive layer of the functional layer group. The connection portion is located on at least one side along the second direction of the sub-battery. In two adjacent sub-batteries, the connection portion of one of the sub-batteries is connected to the conductor of the other sub-battery. By designing in this way, the electrode layer is designed as the main body portion and the connection portion. The main body portion is used to cover the functional layer group, and the current is likely to gather on the main body portion. At the same time, the connection portion is used to facilitate the connection between the electrode layer and the conductor of the next sub-battery along the current direction, and realize a stable series connection between the sub-batteries.

[0026] <0000In some embodiments, the opposing ends of the functional layer group along the second direction each extend beyond the conductive layer in the second direction. By designing in this way, the conductive layer is not exposed in the second direction by using the functional layer group to cover it, thereby reducing the risk of the electrode layer coming into direct contact with the conductive layer and causing a short circuit.

[0027] In some embodiments, the solar cell module further includes a substrate, and the conductive layer is provided on the substrate. Thus, the introduction of the substrate facilitates the formation of a support and protective role for the functional layers.

[0028] In some embodiments, the functional layer group includes a first transport layer, a perovskite layer, and a second transport layer stacked in order, with the first transport layer provided on a conductive layer and the electrode layer provided on the second transport layer. By introducing the first transport layer, the perovskite layer, and the second transport layer in this way, it is easy to form a stable perovskite battery module.

[0029] In some embodiments, the first transport layer is a hole transport layer, and the second transport layer is an electron transport layer. By designing in this way, a transformer-structured solar cell module can be formed.

[0030] In some embodiments, the first transport layer is an electron transport layer, and the second transport layer is a hole transport layer. By designing in this way, a solar cell module with a formal structure can be formed.

[0031] According to a second aspect, the present application provides a method for manufacturing a solar cell module, comprising the steps of: forming a conductive layer on a substrate extending in a first direction; placing a conductor on the conductive layer, wherein the conductor protrudes at least partially from at least one end of the conductive layer in a second direction, the first direction intersects the second direction, and the plane formed by the two intersects the thickness direction of the solar cell module; sequentially forming a group of functional layers and an electrode layer on the conductive layer, and connecting the electrode layer to the portion of the conductor protruding from the conductive layer; and cutting the electrode layer at a location on the side of the conductor in the first direction, and cutting it on the substrate.

[0032] The above solar cell module manufacturing method involves forming a conductor such that at least a portion of the conductor protrudes outside the conductive layer at least at one end along the second direction. That is, the conductor is located at least partially outside the sub-cell, and the electrode layer of another sub-cell can be connected to the protruding portion of the conductor outside the sub-cell. In this way, a series connection between the two sub-cells can be achieved outside the sub-cells, eliminating the need for two scribe operations before depositing the electrode layers to achieve a series connection, and requiring only a disconnection operation between the sub-cells. By designing in this way, the conductor is formed at at least one end along the second direction of the conductive layer, eliminating the need for two scribe operations before the series connection of the sub-cells, making it easier to realize a single-disconnection manufacturing method, simplifying the manufacturing process, and improving manufacturing efficiency. At the same time, by eliminating the two scribe operations before series connection, disconnection damage to the conductive layer is reduced, the probability of increased series resistance between sub-cells is effectively reduced, and module performance can be improved.

[0033] In some embodiments, the step of placing a conductor on a conductive layer includes forming the conductor on a side of the conductive layer facing away from the substrate, and controlling that at least one end of the conductor protrudes outside the conductive layer along a second direction. By designing in this way, it is advantageous to form a conductor on one side of the conductive layer, facilitate the rapid conduction of current through the conductor in the conductive layer along a second direction, reduce resistance in the current conduction process, and improve the performance of the module.

[0034] In some embodiments, in the step of forming a conductor on the side of the conductive layer facing away from the substrate, the conductor comprises multiple conductors, and at least some of the conductors are distributed at intervals along a first direction in the conductive layer. By designing in this way, sub-batteries formed by installing and cutting multiple conductors can all achieve a stable series connection via the conductors.

[0035] In some embodiments, the step of sequentially forming a group of functional layers and an electrode layer on a conductive layer, and connecting the electrode layer to a portion of the conductor protruding from the conductive layer, includes the steps of forming the group of functional layers on the conductive layer, forming the main body of the electrode layer on the side of the group of functional layers facing away from the conductive layer, and forming a connection portion of the electrode layer at at least one end of the group of functional layers along a second direction, wherein the conductor has connection portions on both sides along the first direction, and the conductor is connected to one of these connection portions and disconnected from the other. By designing in this way, the electrode layer is designed as a main body and a connection portion, the main body is used to cover the group of functional layers, current easily accumulates in the main body, and at the same time, the connection portion is used to facilitate the connection between the electrode layer and the conductor, achieving a stable series connection between sub-batteries.

[0036] In some embodiments, after forming a conductive layer stretched on a substrate along a first direction, the process further includes etching at least one edge of the surface of the conductive layer along a second direction and etching down to the substrate to form an etched region, the etched region not containing the conductive layer. In this way, the etching method reduces the active area of ​​the conductive layer, allowing the functional layer group to cover the conductive layer in the second direction during the subsequent synthesis process, preventing direct contact between the electrode layer and the conductive layer, thereby reducing the risk of short circuits caused by direct contact with the conductive layer during the electrode layer formation process.

[0037] In some embodiments, the step of forming a conductive layer extending along a first direction on a substrate includes the step of covering at least one edge of the substrate surface along a second direction with a mask plate, and the step of forming a conductive layer on the substrate having the mask plate. In this way, the mask plate method reduces the active area of ​​the conductive layer, allowing the functional layer group to cover the conductive layer in the second direction during the subsequent synthesis process, preventing direct contact between the electrode layer and the conductive layer, thereby reducing the risk of short circuits caused by direct contact with the conductive layer during the electrode layer formation process.

[0038] According to a third aspect, the present application provides a photovoltaic power generation device including any one of the above-described solar cell modules.

[0039] According to a fourth aspect, the present application provides a power consumption device including any one of the above-described solar cell modules.

[0040] According to the fifth aspect, the present application provides a power generation device including a solar cell module as described in any one of the above paragraphs.

[0041] To more clearly illustrate the technical concept of the embodiments of this application, the following briefly introduces the drawings that may be used in the embodiments of this application. It is obvious that the drawings in the following description are only a few of the embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without expending any creative effort. [Brief explanation of the drawing]

[0042] [Figure 1] This is a front view of the structure of a solar cell module described in some embodiments of this application. [Figure 2] This is a structural top view of a solar cell module described in some embodiments of this application. [Figure 3] This is a front view of the structure of a solar cell module described in some other embodiments of this application. [Figure 4] This is a schematic diagram of the structure of the conductive layer of a conductor described in some embodiments of this application. [Figure 5] Figures (a) and (b) in the above are schematic diagrams of structures in which the conductors described in several other embodiments of this application are distributed differently on the conductive layer. [Figure 6] This is a schematic diagram of the structure of the conductive layer of a conductor described in some other embodiments of this application. [Figure 7] This is a magnified schematic diagram of the structure at point A in Figure 2. [Figure 8] Figures (a) and (b) below are current trend analysis diagrams in solar cell modules from different perspectives. [Figure 9] This is one of the manufacturing flowcharts for a solar cell module described in some embodiments of this application. [Figure 10] This is a schematic diagram of a structure in which a conductive layer is formed on a substrate as described in some embodiments of this application. [Figure 11] This is a schematic diagram of a structure in which a group of functional layers is formed on a conductive layer as described in some embodiments of this application. [Figure 12] This is a schematic diagram of a structure in which an electrode layer is formed in a group of functional layers described in some embodiments of this application. [Figure 13] This is the second manufacturing flowchart for a solar cell module described in some embodiments of this application. [Figure 14] This is the third manufacturing flowchart for a solar cell module described in some embodiments of this application. [Figure 15] This is the fourth manufacturing flowchart of a solar cell module described in some embodiments of this application. [Modes for carrying out the invention]

[0043] To make the above-mentioned objectives, features, and advantages of this application clearer, specific embodiments of this application will be described in detail below, accompanied by drawings. The following description includes many specific details to ensure a full understanding of this application. However, this application can be implemented in many ways different from the other methods described herein, and those skilled in the art can make similar improvements without departing from the spirit of this application; therefore, this application is not limited to the specific embodiments disclosed below.

[0044] In the description of this application, when terms such as "center," "vertical," "horizontal," "length," "width," "thickness," "top," "bottom," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inside," "outside," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" appear, the orientations or positional relationships indicated by these terms are those shown based on the drawings and are merely used to simplify the description of this application. They do not indicate or imply that the mentioned devices or elements have a specific orientation or must be configured and operated in a specific orientation, and therefore should not be understood as limitations on this application.

[0045] Where the terms "first" and "second" appear, these terms are used solely for descriptive purposes and should not be understood as implying relative importance or implicitly indicating the number of technical features being referred to. Thus, features limited by "first" and "second" may explicitly or implicitly include at least one such feature. Where the term "plural" appears in the description of this application, unless otherwise clearly and specifically limited, it means at least two, for example, two, three, etc.

[0046] In this application, unless otherwise explicitly defined or limited, terms such as “attachment,” “connection,” “connection,” and “fixing” should be understood in a broad sense. For example, a fixed connection may be a detachable connection, or an integral connection may be a mechanical connection, or an electrical connection may be a direct connection, or an indirect connection through an intermediate medium, or internal communication between two elements or the interrelationship of roles between two elements, unless otherwise explicitly defined. Those skilled in the art will be able to understand the specific meaning of the above terms in this application depending on the specific circumstances.

[0047] In this application, unless otherwise explicitly defined or limited, where similar descriptions appear, such as the first feature being "above" or "below" the second feature, the meaning is that the first feature may be in direct contact with the second feature, or the first feature may be indirectly in contact with the second feature through an intermediate medium. Furthermore, "above," "above," and "on the top surface" of the second feature means that the first feature is directly above or diagonally above the second feature, or simply that the horizontal height of the first feature is higher than that of the second feature. "Below," "below," and "on the bottom surface" of the second feature means that the first feature is directly below or diagonally below the second feature, or simply that the horizontal height of the first feature is lower than that of the second feature.

[0048] It should be noted that when an element is referred to as "fixed to" or "installed on" another element, it may be directly located on the other element or there may be an intervening element. When one element is considered to be "connected" to another element, it may be directly connected to the other element or there may be an intervening element. Where applicable, the terms “vertical,” “horizontal,” “up,” “down,” “left,” “right,” and similar expressions used in this application are for illustrative purposes only and do not represent only one embodiment.

[0049] With the advancement of science, the development of new energy sources continues to make great strides. For example, solar cells, such as perovskite and organic thin-film batteries, have made groundbreaking progress. Because these types of solar cells have advantages such as high efficiency and low cost, they are expected to replace silicon-based solar cells.

[0050] To obtain appropriate voltage and current output from a solar cell module, scribing is generally performed using a laser or mechanical scribe to separate and connect sub-cells in series. For example, a conductive layer is deposited on a substrate, and P1 scribing is performed on the conductive layer using a laser or mechanical scribe to complete the separation of the conductive layer. Next, a first transport layer, a semiconductor layer, and a second transport layer are deposited (the semiconductor layer may be a perovskite layer, etc.), and P2 scribing is performed using a laser or mechanical scribe to complete the scribing of the series connection channels of the sub-cells. Finally, a top electrode film layer is deposited, and P3 scribing is performed using a laser or mechanical scribe to separate two adjacent sub-cells.

[0051] Due to flaws in the structural design of conventional solar cell modules, P1 and P2 scribe operations must be performed before the series connection of sub-cells can be achieved. At the same time, when scribing P2, if the scribe energy is too low, the two transport and semiconductor layers cannot be scribed and cut, and the transport or semiconductor layer is likely to remain. Thus, the electrode layer cannot make direct contact with the conductive layer. For example, if the scribe energy is too low, the perovskite layer is likely to remain, hindering sufficient contact between the electrode and the conductive layer and affecting the performance of the device. If the scribe energy is too high, the conductive layer is more likely to be scribed, similarly causing an increase in the series resistance between sub-cells and degrading the performance of the module.

[0052] Based on this, in response to the complex manufacturing process of conventional solar cell modules and the tendency to cause problems such as increased series resistance of sub-batteries, this application provides a solar cell module in which, in two adjacent sub-batteries, a conductor is connected to the conductive layer of one of the sub-batteries, and at least a portion of the conductor protrudes outside at least one end along the second direction of this conductive layer. That is, the conductor is located at least partially outside the sub-battery, and at this time the electrode layer of the other sub-battery can be connected to the protruding portion of the conductor outside the sub-battery, thus enabling a series connection between the two sub-batteries outside the sub-batteries, eliminating the need to perform two scribe operations before depositing the electrode layers to achieve a series connection, and only a cutting operation between the sub-batteries is required. By designing in this way, a conductor is provided protruding at at least one end along the second direction of the conductive layer, eliminating the need for two scribe operations before connecting the sub-batteries in series, making it easier to realize a single-cut manufacturing method, simplifying the manufacturing process and improving manufacturing efficiency. At the same time, by canceling the two scribes before the series connection, it is possible to reduce breakage damage to the conductive layer, effectively reduce the probability of increased series resistance between sub-batteries, and improve module performance.

[0053] Embodiments of this application provide a power consumption device that uses a battery as a power source, which may be, but is not limited to, a tablet, laptop computer, electric toy, power tool, battery car, electric vehicle, steamship, spacecraft, space station, etc. Here, electric toys may include stationary or mobile electric toys, such as game consoles, electric vehicle toys, electric steamship toys, and electric airplane toys.

[0054] Referring to some embodiments of this application, specifically Figures 1 and 2, the application provides a solar cell module 100 comprising at least two sub-batteries 20 and a conductor 40. The sub-batteries 20 are spaced apart along a first direction X, and each sub-battery 20 includes a conductive layer 21, a group of functional layers 22, and an electrode layer 23, which are stacked and installed. Here, in two adjacent sub-batteries 20, the conductor 40 is connected to the conductive layer 21 of one of the sub-batteries 20 and at least partially protrudes outward from at least one end along a second direction Y of the conductive layer 21. The portion of the conductor 40 protruding from the conductive layer 21 is connected to the electrode layer 23 of the other sub-battery 20, the first direction X intersects with the second direction Y, and the plane formed by the two intersects with the thickness direction Z of the solar cell module 100.

[0055] The conductive layer 21 may be a transparent conductive oxide thin film, having an average transmittance of approximately 80% or more in the visible light range (the energy corresponding to wavelengths of 380 nm to 760 nm is 3.26 eV to 1.63 eV), high conductivity, and a resistivity of 1 × 10⁻¹⁶ -3The material is lower than Ω·cm (ohms·centimeter). There are several options for the material, including, but are not limited to, indium-doped tin oxide (ITO), fluorine-doped tin oxide (FTO), aluminum-doped zinc oxide (AZO), lanthanide-doped indium oxide, antimony-doped tin oxide, boron-doped zinc oxide (BZO), indium zinc oxide (IZO), gallium zinc oxide (GZO), and indium tungsten oxide (IWO).

[0056] The functional layer group 22 refers to the core structure of the solar cell module 100, and is a component that can convert absorbed light energy into electrical energy. Taking a perovskite cell module as an example, the functional layer group 22 may include a first transport layer 221, a perovskite layer 222, and a second transport layer 223. Here, the first transport layer 221 and the second transport layer 223 refer to layer structures that are stacked on both sides of the perovskite layer, and mainly play a role in transporting electrons or holes. The first transport layer 221 may be an electron transport layer and the second transport layer 223 may be a hole transport layer, in which case the solar cell module 100 is a nip type (formal structure), or the first transport layer 221 may be a hole transport layer and the second transport layer 223 may be an electron transport layer, in which case the solar cell module 100 is a pin type (transformer structure). The electron transport layer can perform the function of blocking holes in addition to transporting electrons, and there are various material options for it, such as TiO2, ZnO, SnO2, or organic materials (e.g., PCBM, C60, etc.). The hole transport layer can also block the action of electrons in addition to transporting holes, and its material may be, but is not limited to, spiro-OMeTAD, PTAA (poly[bis(4-phenyl)(2,4,6-trimethylphenyl)amine]), nickel oxide, etc.

[0057] In one embodiment, at least one of the first transport layer 221, the perovskite layer 222, and the second transport layer 223 may be modified as needed, or a modifying layer, such as a passivation layer, may be added between any two layers.

[0058] The electrode layer 23, also called the metal electrode layer 23 or back electrode, may be made of Ag, Au, Pt, Cu, etc., but is not limited to these. The sub-batteries 20 are distributed at intervals along the first direction X, and for example, there is an etching groove 30 between two adjacent sub-batteries 20. The purpose of this is to divide the entire conductive layer 21 into multiple block structures, making it easier to reduce the resistance of the sub-batteries 20, and at the same time, to separate the electrode layers 23 from each other, so that two adjacent electrode layers 23 are not directly connected.

[0059] The separated sub-batteries 20 need to be connected in series between them. In the conventional series connection method, first, the conductive layer 21 is scribed, dividing the conductive layer 21 into multiple blocks along the first direction X, then the functional layer group 22 is deposited, and after deposition, the functional layer group 22 is scribed to expose the conductive layer 21 at the bottom, and when the electrode layer 23 is deposited in this way, the electrode layer 23 can come into contact with the conductive layer 21 of the next sub-battery 20, thus realizing a series connection. However, this method is not only complex but also prone to damaging the conductive layer 21, affecting the performance of the module.

[0060] Therefore, in this embodiment, the conductor 40 is installed at least one end of the conductive layer 21 along the second direction Y, which is equivalent to extending the conductive layer 21 outward. This makes it easier for the electrode layer 23 to achieve a series connection with the conductive layer 21 outside the sub-battery 20, and thus the scribe operation on the conductive layer 21 and the functional layer can be reversed. It should be noted that when the electrode layer 23 achieves a connection with the conductive layer 21 via the conductor 40, the connection between two adjacent electrode layers 23 is disconnected and not directly connected. At the same time, in the same sub-battery 20 having the conductor 40, it is not possible to directly connect the conductor 40 and the electrode layer 23 in the same sub-battery 20. If the two were directly connected, direct conductivity would occur between the conductive layer 21 and the electrode layer 23 located in the same sub-battery 20, which could cause a short circuit in the module.

[0061] The conductor 40 refers to a component having a conductive function, and it may be a structure formed by the conductive layer 21 extending outward and protruding, and its conductive performance may be superior to that of the conductive layer 21. For example, its material may be Ag, Au, Pt, Cu, etc., but is not limited to these. The conductor 40 may protrude from one end of the current conductive layer 21 along the second direction Y, or it may protrude from both ends of the current conductive layer 21 along the second direction Y, and in this case the electrode layers 23 of adjacent sub-batteries may be connected to the conductors 40 protruding from both ends of the conductive layer 21.

[0062] Here, it should be understood that when the conductor 40 is connected to the conductive layer 21, the conductor 40 protrudes outward from at least one end of the conductive layer 21 to which it is connected. The connection between the conductor 40 and the conductive layer 21 may be a direct connection, such as direct contact, or an indirect connection, such as the conductor 40 and the conductive layer 21 being connected via a conductive member. At the same time, the first direction X, the second direction Y, and the thickness direction Z are set to intersect each other in pairs, and the three directions are not in the same plane. Specifically in some embodiments, the first direction X, the second direction Y, and the thickness direction Z are perpendicular to each other in pairs.

[0063] Furthermore, Figure 3 can be referenced to facilitate understanding of the connection relationships between each sub-battery 20. The sub-battery 20 may include a first sub-battery 2a and a second sub-battery 2b, and of course, the number of sub-batteries 20 is not limited to the two shown in Figure 3, but may be other, for example, three, four, five or more. The first sub-battery 2a includes a first conductive layer 2a1, a first functional layer group 2a2, and a first electrode layer 2a3, which are stacked and installed, and the second sub-battery 2b includes a second conductive layer 2b1, a second functional layer group 2b2, and a second electrode layer 2b3, which are stacked and installed. The conductor 40 is connected to the second conductive layer 2b1 and protrudes at least partially outward from at least one end of the second conductive layer 2b1 along the second direction Y. The protruding portion of the conductor 40 is connected to the first electrode layer 2a3. In this way, the first electrode layer 2a3 of the first sub-battery 2a communicates with the second conductive layer 2b1 of the second sub-battery 2b via the conductor 40, thereby realizing a series connection between the first sub-battery 2a and the second sub-battery 2b.

[0064] In some examples, the first functional layer group 2a2 and the second functional layer group 2b2 both include a first transport layer 221, a perovskite layer 222, and a second transport layer 223, which are stacked in order. At the same time, in order to realize a stable circuit and reduce the risk of short circuits, the second electrode layer 2b3 in the second sub-battery 2b cannot be electrically connected to the conductor 40.

[0065] By designing in this way, a conductor 40 is provided as a protrusion at at least one end along the second direction Y of the conductive layer 21, which allows for the cancellation of two scribes before the sub-batteries 20 are connected in series. This facilitates a single-cut manufacturing method, simplifies the manufacturing process, and improves manufacturing efficiency. At the same time, canceling the two scribes before series connection reduces cut damage to the conductive layer 21, effectively reduces the probability of increased series resistance between the sub-batteries 20, and improves module performance.

[0066] According to some embodiments of this application, referring to Figure 4, the conductor 40 is provided on the side of the conductive layer 21 toward the functional layer group 22 and extends outward from at least one end along the second direction Y of the conductive layer 21.

[0067] The conductor 40 is placed on one side of the conductive layer 21 and at least one end can protrude out of the conductive layer 21 along the second direction Y, indicating that the conductor 40 can extend at least partially along the second direction Y in the conductive layer 21. In this case, current can be rapidly conducted along the second direction Y by the conductor 40 and then conducted to the conductive layer 21 by the conducted current. Specifically in some embodiments, the conductor 40 extends along the second direction Y, and both ends protrude from the conductive layer 21, in which case the conductor 40 crosses the conductive layer 21 in the second direction Y, and thus current is easily conducted in the second direction Y through the conductor 40, reducing resistance.

[0068] By designing in this way, the conductor 40 is placed on one side of the conductive layer 21, facilitating the rapid conduction of current through the conductor 40 in the conductive layer 21 along the second direction Y, which is advantageous in reducing resistance during the current conduction process and improving the performance of the module.

[0069] According to some embodiments of this application, referring to Figure 4, both ends of the conductor 40 protrude outward from the ends of the conductive layer 21 along the second direction Y, and at least one of the ends of the conductor 40 is connected to the electrode layer 23 in the adjacent sub-battery 20.

[0070] The distribution of the conductor 40 in the conductive layer 21 may be of multiple types. For example, the stretching direction of the conductor 40 in the conductive layer 21 may coincide with the second direction Y, or the stretching direction of the conductor 40 may intersect with the second direction Y, or the conductor 40 may exhibit nonlinear stretching in the conductive layer 21.

[0071] Both ends of the conductor 40 protrude outwards from the ends of the conductive layer 21 along the second direction Y, and one of the protruding ends does not have to be connected to the electrode layer 23 of the other sub-battery, although both ends may, of course, be connected to the electrode layer 23 of the other sub-battery.

[0072] In some specific examples, at least one of the ends of the conductor 40 is connected to the electrode layer 23 of the front sub-battery 20 along the current direction, where the current direction refers to the direction in which the current is formed as it passes sequentially through each sub-battery 20 when the solar cell module 100 is operating, for example when it receives light. You may also refer to Figure 3, in which the current direction is the direction in which the current flows from the first sub-battery 2a to the second sub-battery 2b. In this case, the first electrode layer 2a3 of the first sub-battery 2a is connected to at least one end of the conductor 40 of the second sub-battery 2b.

[0073] By designing it in this way, both ends of the conductor 40 are designed to protrude outside the conductive layer 21, making it easy for the electrode layer 23 of the other sub-battery 20 to be connected to the conductive layer 21 via the protruding portion of the conductor 40, thereby realizing a series connection between the sub-batteries 20.

[0074] According to some embodiments of this application, referring to Figure 5, one of the ends of the conductor 40 protrudes from one end of the conductive layer 21 along the second direction Y.

[0075] In the conductive layer 21, the conductor 40 protrudes from the conductive layer 21 at only one end; that is, one end protrudes from the conductive layer 21 along the second direction Y, while the other end does not protrude from the conductive layer 21. If there are multiple conductors 40, they may protrude from the same end of the conductive layer 21, as can be seen in detail in Figure 5(a). Alternatively, some of the conductors 40 may protrude from one end of the conductive layer, while others may protrude from the other end, as can be seen in detail in Figure 5(b).

[0076] By designing it in this way, the electrode layer 23 and the conductive layer 21 can be connected via one end of the conductor 40.

[0077] According to some embodiments of this application, referring to Figure 6, the conductor 40 includes a first member 41 and a second member 42, the first member 41 and the second member 42 being discontinuously distributed. The first member 41 and the second member 42 each protrude outward from opposite ends along the second direction Y of the conductive layer 21 and are both connected to the electrode layer 23 of the adjacent sub-battery 20.

[0078] As can be seen from the above, the conductor 40 has a structure of two or more layers in the conductive layer 21, namely a first member 41 and a second member 42. The first member 41 and the second member 42 may each be connected to the electrode layer 23 on the previous sub-battery 20, and in this way the current on the previous sub-battery 20 is transmitted from the first member 41 and the second member 42, respectively, to the conductive layer 21 on the current sub-battery 20, thereby realizing a series connection.

[0079] Furthermore, it should be explained that the connection of the first member 41 and the second member 42 to the electrode layer 23 of the adjacent sub-battery 20 may be understood as the connection of the first member 41 and the second member 42 to the electrode layer 23 of the preceding sub-battery 20 along the current direction. Of course, in some examples, as shown in Figure 2, the sub-battery 20 may be understood to include a first sub-battery 2a and a second sub-battery 2b. The first member 41 and the second member 42 are each connected to the first electrode layer 2a3 of the first sub-battery 2a.

[0080] This design facilitates the realization of a series connection between two adjacent sub-batteries 20 via the cut first member 41 and second member 42.

[0081] According to some embodiments of this application, referring to Figure 1, an etching groove 30 is provided between two adjacent sub-batteries 20, and the conductor 40 is located on at least one side along the first direction X of the etching groove 30 and is provided on the conductive layer 21.

[0082] The etching groove 30 refers to a structure that can separate the two sub-batteries 20. During the manufacturing process, by cutting along the thickness direction Z in the electrode layer 23, the electrode layer 23, the functional layer group 22, and the conductive layer 21 can be divided into multiple structures in the first direction X.

[0083] The etching grooves 30 can form multiple sub-batteries 20, but the space they occupy causes a dead zone in the solar cell module 100, meaning that this region cannot receive photons. Therefore, the size of the etching grooves 30 along the first direction X needs to be as small as possible. For example, the size D of the etching grooves 30 along the first direction X may be 30 μm to 100 μm, but is not limited to this. Of course, in other embodiments, the size D of the etching grooves 30 along the first direction X may be 40 μm to 50 μm.

[0084] The distribution positions of the conductor 40 in the conductive layer 21 may be of multiple types. For example, the conductor 40 may be adjacent to the side of the etching groove 30 along the first direction X, thereby facilitating connection between the electrode layer 23 of the adjacent sub-battery 20 and the conductor 40. Here, the conductor 40 may be located on either side of the etching groove 30 along the first direction X. For example, in Figure 1, the conductor 40 may be located on the left side of the etching groove 30, or on the right side of the etching groove 30 in Figure 1. Specifically, in some embodiments, the conductor 40 is provided on the side of the conductive layer 21 facing the functional layer group 22 and located on the side of the etching groove 30 along the first direction X. Here, the conductor 40 extends along the second direction Y and protrudes outward from at least one end of the conductive layer 21 along the second direction Y.

[0085] By designing it in this way, the conductor 40 is placed on one side of the etching groove 30, facilitating the connection between the electrode layer 23 and the conductor 40, and enabling a series connection between the sub-batteries 20.

[0086] According to some embodiments of this application, a solar cell module includes a plurality of etching grooves 30 and a plurality of conductors 40, with at least one conductor 40 between two adjacent etching grooves 30.

[0087] The number of etching grooves 30 is multiple, and the number of sub-batteries 20 in the first direction X is at least three. In this case, the conductors 40 are installed corresponding to the etching grooves 30, that is, each sub-battery 20 located on one side of the etching grooves 30 has at least one conductor 40. Since each sub-battery 20 needs to be connected in series in sequence, a conductor 40 may or may not be installed in the first sub-battery 20 in the arrangement. For example, in Figure 1, a conductor 40 is not installed in the first sub-battery 20 along the current direction, while at least one conductor 40 is installed in each of the remaining sub-batteries 20 along the current direction.

[0088] When each conductor 40 is located on one side corresponding to the etching groove 30, the electrode layer 23 on one side of the etching groove 30 is connected to the conductor 40 on the other side of the etching groove 30, thereby realizing a sequential series connection between the sub-batteries 20. Specifically in some embodiments, each conductor 40 may be located on one side corresponding to the etching groove 30.

[0089] Here, "corresponding etching groove 30" may be understood as the etching groove 30 closest to the conductor 40 that corresponds to this conductor 40. "Same side" means that each etching groove 30 has both sides in the first direction X, but each conductor 40 is located on the same side of its corresponding etching groove 30. To facilitate understanding, Figure 1 is used as an example, where the etching groove 30 has a left side and a right side in the first direction X, and in Figure 1, each conductor 40 is located on the right side of its corresponding etching groove 30.

[0090] Furthermore, in addition to being able to install the conductor 40 between the etching grooves 30, it is also necessary to install the conductor 40 on one side of the last etching groove 30 along the direction of the current.

[0091] By designing it in this way, the conductor 40 is positioned between two adjacent etching grooves 30, making it easier to connect each electrode layer 23 and the conductor 40 in sequence, thus forming a series connection.

[0092] According to some embodiments of this application, the size of the conductor 40 along the first direction X is smaller than the size of the conductive layer 21 along the first direction X.

[0093] By placing the conductor 40 on the conductive layer 21, the current conduction area of ​​both can be increased. However, this occupies an active region on the conductive layer 21, causing this region to be unable to receive or conduct photons, thus forming a dead zone on the conductive layer 21. Therefore, it is necessary to control the size of the conductor 40 in the first direction X so that it is smaller than the size of the conductive layer 21 along the first direction X. Here, the size of the conductor 40 in the first direction X is much smaller than the size of the conductive layer 21 along the first direction X.

[0094] By designing in this way, controlling the size relationship between the conductor 40 and the conductive layer 21 reduces the dead zone area on the conductive layer 21, which is advantageous in improving the performance of the module.

[0095] According to some embodiments of this application, referring to Figure 1, the size of the conductor 40 along the first direction X is denoted as W, where 30 μm ≤ W ≤ 200 μm.

[0096] The size of the conductor 40 in the first direction X affects the conductive performance of the conductor 40 and also affects the dead zone on the conductive layer 21. For example, if the size of the conductor 40 in the first direction X is too small, it will exhibit an elongated structure, reducing the overcurrent cross-sectional area and increasing resistance. If the size is too large, the dead zone on the conductive layer 21 will increase, degrading the performance of the module.

[0097] Therefore, the size W may be a value between 30 μm and 200 μm. For example, the size W may be 30 μm, 40 μm, 50 μm, 80 μm, 100 μm, 150 μm, 200 μm, etc., but is not limited to these.

[0098] By designing in this way, the size of the conductor 40 in the first direction X can be controlled between 30 μm and 200 μm, which not only ensures rapid current flow but also controls the size of the dead zone on the conductive layer 21, thereby improving the performance of the solar cell module 100.

[0099] According to some embodiments of this application, the further condition that size W satisfies is 80 μm ≤ W ≤ 100 μm.

[0100] The size W may also be a value between 80 μm and 100 μm. For example, the size W may be 80 μm, 82 μm, 84 μm, 86 μm, 88 μm, 90 μm, 92 μm, 94 μm, 96 μm, 98 μm, 100 μm, etc., but is not limited to these.

[0101] By designing in this way, the size of the conductor 40 in the first direction X can be further controlled to between 80 μm and 100 μm, thereby enabling the design of the conductor 40 to more effectively balance its own conductive performance with the effective area on the conductive layer 21.

[0102] According to some embodiments of this application, referring to Figure 1, the size of the conductor 40 along the thickness direction Z is denoted as h, and h > 0 nm.

[0103] The size of the conductor 40 along the thickness direction Z is greater than 0, indicating the presence of the conductor 40, and enabling a series connection between two adjacent sub-batteries 20 instead of the conventional scribes P1 and P2.

[0104] By designing in this way, the conductor 40 is introduced, enabling a series connection between the two sub-batteries 20, replacing the conventional scribing of P1 and P2, simplifying the manufacturing process, effectively reducing the probability of the solar cell module 100 being damaged, and thus improving the performance of the module.

[0105] According to some embodiments of this application, referring to Figure 1, the size of the conductor 40 along the thickness direction Z is denoted as h, and h ≥ 40 nm.

[0106] As can be seen from the above, the thickness of the conductor 40 can be controlled to 40 nm or more, thereby satisfying the requirement that the conductivity of the conductor 40 itself reaches a certain level, and improving the conductivity performance of the module.

[0107] By designing it in this way, the thickness of the conductor 40 can be controlled to 40 nm or more, giving the conductor 40 good conductivity.

[0108] According to some embodiments of this application, referring to Figure 1, the further condition that size h satisfies is 40 nm ≤ h ≤ 300 nm.

[0109] The size of the conductor 40 in the thickness direction Z can affect its conductivity. For example, if the size of the conductor 40 in the thickness direction Z is too small, its overcurrent cross-sectional area decreases and its resistance increases. Of course, a size that is too large is also undesirable, as it affects the bonding gap between the conductive layer 21 and the functional layer group 22.

[0110] Therefore, the size h may be a value between 40nm and 300nm. For example, the size h may be 40nm, 50nm, 80nm, 100nm, 110nm, 120nm, 140nm, 150nm, 200nm, 300nm, etc., but is not limited to these.

[0111] By designing in this way, the size of the conductor 40 in the thickness direction Z is controlled to be between 40 nm and 300 nm, and the solar cell module 100 is given good overcurrent capability while satisfying the structural stability requirements of the solar cell module 100.

[0112] According to some embodiments of this application, the further condition that size h satisfies is 50 nm ≤ h ≤ 150 nm.

[0113] The size h may also be a value between 50nm and 150nm. For example, the size h may be 50nm, 60nm, 80nm, 84nm, 88nm, 90nm, 95nm, 100nm, 105nm, 110nm, 115nm, 120nm, 150nm, etc., but is not limited to these.

[0114] By designing in this way, the size of the conductor 40 in the thickness direction Z can be further controlled to between 50nm and 150nm, and while ensuring structural stability, the overcurrent capability of the solar cell module 100 can be further improved, thereby further enhancing the performance of the module.

[0115] According to some embodiments of this application, the further condition that size h satisfies is 80 nm ≤ h ≤ 150 nm.

[0116] The size h may also be a value between 80nm and 150nm. For example, the size h may be 80nm, 84nm, 88nm, 90nm, 95nm, 100nm, 105nm, 110nm, 115nm, 120nm, 150nm, etc., but is not limited to these.

[0117] By designing in this way, the size of the conductor 40 in the thickness direction Z can be further controlled to between 80nm and 150nm, and while ensuring structural stability, the overcurrent capability of the solar cell module 100 is further improved, thereby enhancing the overall performance of the module.

[0118] According to some embodiments of this application, referring to Figures 3 and 7, each electrode layer 23 includes a main body 231 and a connecting portion 232 connected to the main body 231. The main body 231 is provided on the side facing away from the conductive layer 21 of the functional layer group 22, and the connecting portion 232 is located on at least one side along the second direction Y of the sub-battery 20. In two adjacent sub-batteries 20, the connecting portion 232 of one sub-battery 20 is connected to the conductor 40 of the other sub-battery 20.

[0119] The main body portion 231 refers to a structure that covers the side of the functional layer group 22 facing away from the conductive layer 21, and the connecting portion 232 is a structure located on at least one side along the second direction Y of the sub-battery 20. For example, the connecting portion 232 may extend at least partially along the thickness direction Z, with one end connected to the main body portion 231 and the other end connected to the conductor 40.

[0120] At the same time, when manufacturing the electrode layer 23, the main body 231 should not extend beyond the functional layer group 22. For example, referring to Figures 3 and 7, neither of the opposing ends of the main body 231 along the second direction Y extends beyond the functional layer group 22. If it does extend beyond the functional layer group 22, the main body 231 and the conductor 40 will be connected, resulting in a short circuit.

[0121] If the connection portion 232 is located on at least one side along the second direction Y of the sub-battery 20, the connection portion 232 should not come into contact with the conductive layer 21 in the same sub-battery 20, thereby reducing the risk of a short circuit occurring in the same sub-battery 20. At the same time, attention should also be paid to the structural design between the electrode layers 23 in two adjacent sub-batteries 20. For example, if the connection portion 232 is connected to a conductor 40 in the next sub-battery 20 along the current direction, care must be taken to ensure that the connection between the conductor 40 and the connection portion 232 located in the same sub-battery 20 is broken so that they do not connect and cause a short circuit. Of course, for ease of understanding, one can refer to Figure 3. The sub-battery 20 may include a first sub-battery 2a and a second sub-battery 2b, and both the first electrode layer 2a3 of the first sub-battery 2a and the second electrode layer 2b3 of the second sub-battery 2b include a main body 231 and a connection portion 232 connected to the main body 231. The conductor 40 is placed on the second conductive layer 2b1 of the second sub-battery 2b. The connection portion 232 of the first electrode layer 2a3 is connected to the conductor 40, and the second electrode layer 2b3 is not electrically connected to the conductor 40.

[0122] Within the same electrode layer 23, there may be one or two connection portions 232. If there are two connection portions 232, the two connection portions 232 are connected to opposite sides of the main body 231, and the two connection portions 232 are located on opposite sides of the sub-battery 20 along the second direction Y.

[0123] When the connection portion 232 is connected to the adjacent conductor 40 and the series connection between the sub-batteries 20 is completed, the current trend of the solar cell module 100 can be seen in Figures 8(a) and 8(b). In Figure 8(a), the current is conducted sequentially from the conductive layer 21 along the thickness direction Z to the main body portion 231 of the electrode layer 23. In Figure 8(b), the current in the main body portion 231 flows to the connection portions 232 on both sides and is conducted from the connection portions 232 to the conductor 40 of the next sub-battery 20. The current in the conductor 40 is then rapidly conducted to the conductive layer 21 of the same sub-battery 20. The current in the conductive layer 21 is then sequentially conducted along the thickness direction Z to the main body portion 231 of the electrode layer 23, and so on, with the current being conducted repeatedly in this order.

[0124] Furthermore, the shape of the connection portion 232 can be designed in multiple ways, as long as it can be connected to the conductor 40 of an adjacent sub-battery 20. For example, the connection portion 232 may include a first portion 23a and a second portion 23b, where the first portion 23a is connected to the main body 231 and protrudes at least partially along the second direction Y and away from the main body 231, and the second portion 23b is connected between the first portion 23a and the conductor 40. In some examples, when cutting the electrode layer 23, the electrode layer 23 may be cut at a position between the connected first portion 23a and the conductor 40, i.e., the formed etching groove 30 may be located between the first portion 23a and the conductor 40 that are connected to each other.

[0125] By designing in this way, the electrode layer 23 is incorporated into the main body 231 and the connecting portion 232. The main body 231 is used to cover the functional layer group 22, making it easier for current to concentrate in the main body 231. At the same time, the connecting portion 232 is used to facilitate the connection between the electrode layer 23 and the conductor 40, thereby achieving a stable series connection between the sub-batteries 20.

[0126] According to some embodiments of this application, referring to Figure 7, in the same sub-battery 20 having a conductor 40, there is no short circuit between the electrode layer 23 and the conductor 40.

[0127] The absence of a short circuit between the electrode layer 23 and the conductor 40 may be understood as the portion of the electrode layer 23 that extends beyond the functional layer group 22 along a direction intersecting the thickness direction Z of the solar cell module 100 (for example, a first direction X or a second direction Y) not short-circuiting with the conductor 40. In this case, the conductor 40 does not directly conduct electricity with the electrode layer 23 located on the same sub-battery 20, reducing the risk of short-circuit connection, and conducts electricity with the electrode layer 23 of an adjacent sub-battery 20. For example, the conductor 40 is connected to the electrode layer 23 of the preceding sub-battery 20 along the current direction. Specifically in some embodiments, the electrode layer 23 includes a main body 231 and a connection portion 232 connected to the main body 231. The conductor 40 is connected to the connection portion 232 of one preceding sub-battery 20 along the current direction, but not to the main body 231 and connection portion 232 on the same sub-battery 20.

[0128] By preventing a short circuit between the electrode layer 23 and the conductor 40 in the same sub-battery 20, current flows sequentially through the conductor 40, the conductive layer 21, the functional layer group 22, and the electrode layer 23 in the same sub-battery 20, or sequentially through the electrode layer 23, the functional layer group 22, the conductive layer 21, and the conductor 40. To ensure that there is no direct electrical contact between the electrode layer 23 and the conductor 40 in the same sub-battery 20, an insulating material may be installed between the electrode layer 23 and the conductor 40, or a gap may be installed. For example, in the same sub-battery 20 having a conductor 40, the connection portion 232 on the electrode layer 23 and the conductor 40 have a break gap 233 in a first direction X, where the break gap 233 refers to the gap that exists between the connection portion 232 and the conductor 40 in the same sub-battery 20. This gap interrupts the connection between the two and reduces short circuits caused by the conductive layer 21 directly conducting with the electrode layer 23 via the conductor 40. There may be multiple methods for forming the cut gap 233. For example, when forming the electrode layer 23, a mask plate may be placed on the side of the conductor 40 that is away from the corresponding etching groove 30. In this way, one side of the conductor 40 cannot be deposited during deposition or sputtering, forming the cut gap 233, or after forming the electrode layer 23, the conductor 40 may be cut on one side to form the cut gap 233, etc.

[0129] By designing it in this way, the conductor 40 and the electrode layer 23 are not directly connected within the same sub-battery 20, effectively reducing the risk of short circuits and improving the reliability of the module.

[0130] According to some embodiments of this application, referring to Figure 3, the opposing ends of the functional layer group 22 along the second direction Y each extend beyond the conductive layer 21 in the second direction Y.

[0131] The fact that the functional layer group 22 extends beyond the conductive layer 21 indicates that the conductive layer 21 is covered by the functional layer group 22 in the second direction Y, and thus the conductive layer 21 is not exposed to the outside in the second direction Y, and as a result the electrode layer 23 does not come into direct contact with the conductive layer 21 during the formation process.

[0132] In some other embodiments, the functional layer group 22 may extend beyond the conductive layer 21 in the first direction X, thereby allowing the functional layer group 22 to effectively cover the effective region of the conductive layer 21.

[0133] By designing in this way, the functional layer group 22 is used to cover the conductive layer 21 in the second direction Y, preventing the conductive layer 21 from being exposed in the second direction Y, thereby reducing the risk of the electrode layer 23 coming into direct contact with the conductive layer 21 and causing a short circuit.

[0134] According to some embodiments of this application, referring to Figure 1, the solar cell module 100 further includes a substrate 10, and the conductive layer 21 is provided on the substrate 10.

[0135] The substrate 10 is also called the base or substrate. The material of the substrate 10 may be glass, tempered glass, quartz, organic flexible material, etc., but is not limited to these, and may of course be transparent conductive glass, stainless steel conductive flexible substrate, polyethylene glycol terephthalate (PET) conductive flexible substrate, etc.

[0136] In this way, by introducing the substrate 10, it is easier to form a support and protective role for the functional layer group 22.

[0137] According to some embodiments of this application, referring to Figure 1, the functional layer group 22 includes a first transport layer 221, a perovskite layer 222, and a second transport layer 223, which are stacked in order. The first transport layer 221 is provided on the conductive layer 21, and the electrode layer 23 is provided on the second transport layer 223.

[0138] The first transport layer 221 and the second transport layer 223 refer to layer structures that are stacked on both sides of the perovskite layer 222, and primarily play a role in transporting electrons or holes. The first transport layer 221 may be an electron transport layer and the second transport layer 223 may be a hole transport layer, in which case the solar cell module 100 is a nip type (formal structure), or the first transport layer 221 may be a hole transport layer and the second transport layer 223 may be an electron transport layer, in which case the solar cell module 100 is a pin type (transformer structure). In addition to transporting electrons, the electron transport layer can also block holes, and there are several options for its material, including, for example, at least one of the following: [6,6]-phenyl-C61-butyrate isomethyl ester, C60, cyano group-containing polyphenylacetylene, boron-containing polymer, vasocuproin, vasophenanthroline, hydroxyquinoline aluminum, oxadiazole compounds, benzimidazole compounds, naphthalenetetracarboxylate, perylene derivatives, phosphine oxide compounds, phosphorus sulfide compounds, fluoro group-containing phthalocyanines, titanium dioxide (TiO2), zinc oxide (ZnO), tin oxide (SnO2), indium oxide (In2O3), gallium oxide (Ga2O3), tin sulfide (SnS), indium sulfide (In2O3), lithium fluoride (LiF), sodium fluoride (NaF), magnesium fluoride (MgF2), and zinc sulfide (ZnS). In addition to transporting holes, the hole transport layer can also play a role in blocking electrons, and its material may include at least one of the following: thiophene, phthalocyanine, porphyrin, 2,2',7,7-tetrakis(N,N-di-p-methoxyaniline)-9,9'-spirobifluorene, molybdenum oxide (MoO3), vanadium oxide (V2O5), tungsten oxide (WO3 and / or WO2), nickel oxide (NiO), copper oxide (CuO), tin oxide (SnO2), molybdenum sulfide (MoS2), tungsten sulfide (WS2), copper sulfide (CuS), tin sulfide (SnS), copper thiocyanate (CuSCN), copper iodide (CuI), fluorine-containing phosphonic acid, carbonyl group-containing phosphonic acid, carbon nanotubes, and graphene.

[0139] The perovskite layer 222 refers to a material commonly used in perovskite batteries in the art and has a structure capable of absorbing light and exciting electron / hole pairs. The chemical formula of the perovskite material satisfies ABX3 or A2CDX6, where A is an inorganic cation or an organic ammonium cation or a mixture of the two, and may be at least one of formamidinium ion (FA), methylammonium ion (MA), and Cs, B is an inorganic metal cation, Pb 2+ , Sn 2+ , Fe 2+ , Mn 2+ , Ni 2+ , Ge 2+ , Co 2+ and Sb 2+ may be one or more of them, C is a noble metal cation, generally Ag + , D is a heavy metal or rare metal cation, and the bismuth cation Bi 3+ , the antimony cation Sb 3+ , and the indium cation In 3+ may be at least one of them, and the X oxygen or halogen element may be at least one of O, Cl - , Br - , I - may be at least one of them.

[0140] Thus, by introducing the first transport layer 221, the perovskite layer 222, and the second transport layer 223, it is easy to form a stable perovskite battery module.

[0141] According to some embodiments of the present application, the conductivity of the conductor 40 is greater than the conductivity of the conductive layer 21.

[0142] Conductivity can represent the ease of charge flow in a substance, and the larger the value, the better the conductive performance of the object. Setting the conductivity of the conductor 40 to be greater than the conductivity of the conductive layer 21 indicates that the current transmitted to the conductor 40 can be transmitted more quickly.

[0143] In some examples, the conductivity of conductor 40 is ≥ 5 × 10 6 The ratio is S / m. Specifically, in some examples, the material of the conductor 40 may be a single metal, such as silver, copper, gold, aluminum, magnesium, tungsten, molybdenum, zinc, cobalt, nickel, potassium, lithium, iron, platinum, tin, etc., or it may be a non-metallic material, such as carbon fiber, zinc oxide, conductive polymer material, conductive ceramic material, etc.

[0144] By designing in this way, the conductivity of the conductor 40 can be rationally designed, which is advantageous for the rapid transfer of current on the conductor 40, thereby improving the conductive performance of the module.

[0145] According to some embodiments of this application, referring to Figure 9, this application provides a method for manufacturing the above-mentioned solar cell module, the manufacturing method comprising the following steps: In S100, a conductive layer 21 extending along a first direction X is formed on the substrate 10, and specifically, refer to Figure 10. In S200, a conductor 40 is placed on the conductive layer 21, where the conductor 40 protrudes at least partially from at least one end along the second direction Y of the conductive layer 21, the first direction X intersects with the second direction Y, and the plane formed by these two intersects with the thickness direction Z of the solar cell module 100. Specifically, see Figure 4. In S300, a group of functional layers 22 and an electrode layer 23 are formed sequentially on the conductive layer 21, and the electrode layer 23 is connected to the portion of the conductor 40 that protrudes from the conductive layer 21. Specifically, please refer to Figures 11 and 12. In S400, the electrode layer 23 is cut at a point located along the first direction X of the conductor 40, and the cut is also made on the substrate 10. Specifically, please refer to Figure 3.

[0146] In step S100, there are multiple methods for forming the conductive layer 21. For example, the conductive layer 21 may be formed using magnetron sputtering, vapor deposition, printing slurry, spraying, etc., but is not limited to these.

[0147] In step S200, there are several possible methods for installing the conductor 40 on the conductive layer 21. For example, the conductors 40 can be arranged on the conductive layer 21 along the second direction Y, or the conductor 40 can be connected to one end of the conductive layer 21 along the second direction Y, causing it to protrude from the conductive layer 21.

[0148] In step S300, the functional layer group 22 may include a first transport layer 221, a perovskite layer 222, and a second transport layer 223. Here, the first transport layer 221 and the second transport layer 223 refer to layer structures that are stacked on both sides of the perovskite layer 222, and mainly play a role in transporting electrons or holes. At the same time, there are several types of molding methods for the first transport layer 221, the perovskite layer 222, and the second transport layer 223, such as vapor deposition, sputtering, and slurry coating.

[0149] In step S400, the conductor 40 is cut along the first direction X, which not only effectively divides the multiple sub-batteries 20, but also enables a series connection between two adjacent sub-batteries 20 by the electrode layer 23 and the conductor 40.

[0150] In the above solar cell module manufacturing method, when forming the conductor 40, at least a portion of the conductor 40 is made to protrude outside at least one end of the conductive layer 21 along the second direction Y. That is, the conductor 40 is at least partially located outside the sub-battery 20, and at this time the electrode layer 23 of the other sub-battery 20 can be connected to the protruding portion of the conductor 40 outside the sub-battery 20. In this way, a series connection between the two sub-batteries 20 can be achieved outside the sub-batteries 20, eliminating the need to perform two scribe operations before depositing the electrode layer 23 to achieve a series connection, and only a cutting operation between the sub-batteries 20 is required. By designing in this way, the conductor 40 is formed at at least one end along the second direction Y of the conductive layer 21, and the two scribe operations before connecting the sub-batteries 20 in series can be undone, making it easier to realize a one-cut manufacturing method, simplifying the manufacturing process and improving manufacturing efficiency. At the same time, by undone the two scribe operations before series connection, cutting damage to the conductive layer 21 is reduced, the probability of an increase in series resistance between the sub-batteries 20 is effectively reduced, and module performance can be improved.

[0151] According to some embodiments of this application, referring to Figure 13, in S200, the step of placing the conductor 40 on the conductive layer 21 includes: In step S210, a conductor 40 is formed on the side surface of the conductive layer 21 facing away from the substrate 10, and at least one end of the conductor 40 is controlled to protrude outside the conductive layer 21 along the second direction Y.

[0152] In step S210, the conductive area between the conductor 40 and the conductive layer 21 can be increased by directly forming the conductor 40 on one side surface of the conductive layer 21. Since at least one end of the conductor 40 can protrude outside the conductive layer 21, the conductor 40 can be extended at least partially along the second direction Y in the conductive layer 21. In this case, the current can be rapidly conducted along the second direction Y by the conductor 40 and then conducted to the conductive layer 21 by the conducted current. Specifically in some embodiments, the conductor 40 is extended along the second direction Y, and both ends protrude from the conductive layer 21, so that the conductor 40 crosses the conductive layer 21 in the second direction Y, and thus the current is easily conducted in the second direction Y through the conductor 40, reducing resistance.

[0153] Furthermore, there may be multiple methods for forming the conductor 40 in the conductive layer 21. For example, the conductor 40 may be placed directly on one side of the conductive layer 21, or the conductor 40 may be formed on one side of the conductive layer 21 by methods such as vapor deposition, sputtering, or coating.

[0154] By designing in this way, a conductor 40 is formed on one side surface of the conductive layer 21, facilitating the rapid conduction of current through the conductor 40 in the conductive layer 21 along the second direction Y, which is advantageous in reducing resistance during the current conduction process and improving the performance of the module.

[0155] According to some embodiments of this application, in the step of forming a conductor 40 on a side surface of the conductive layer 21 facing away from the substrate 10, the conductor 40 comprises a plurality of conductors, and at least some of the conductors 40 are distributed at intervals along a first direction X in the conductive layer 21.

[0156] When there are multiple conductors 40, when cutting the electrode layer 23, each conductor 40 may be cut on the same side. For example, as shown in Figure 3, each conductor 40 may be cut on its left side during the cutting process, thereby forming an etching groove 30 on the left side of each conductor 40. Because the cutting is done on the left side of the conductor 40, the leftmost sub-battery 20 does not have a conductor 40. When cutting, it should be noted that a conductor may or may not be placed in the first sub-battery 2a along the current direction, but a conductor must be placed in all of the remaining sub-batteries, thereby ensuring that each sub-battery can be connected in series.

[0157] By designing it in this way, multiple conductors 40 can be installed and cut to form sub-batteries 20, all of which can be connected in a stable series via the conductors 40.

[0158] According to some embodiments of this application, referring to Figure 14, in S300, the step of sequentially forming a group of functional layers 22 and an electrode layer 23 on the conductive layer 21, and connecting the electrode layer 23 to the portion of the conductor 40 protruding from the conductive layer 21, includes the following: In S310, a group of functional layers 22 is formed on the conductive layer 21. In S320, the main body portion 231 of the electrode layer 23 is formed on the side of the functional layer group 22 that is away from the conductive layer 21, and a plurality of connection portions 232 of the electrode layers 23 are formed at at least one end of the functional layer group 22 along the second direction Y, where the conductor 40 has connection portions 232 on both sides along the first direction X, and the conductor 40 is connected to one of the connection portions 232 and disconnected from the other connection portion 232.

[0159] The main body portion 231 refers to a structure that covers the side of the functional layer group 22 that is away from the conductive layer 21, and the connecting portion 232 is a structure located on at least one side along the second direction Y of the sub-battery 20. For example, the connecting portion 232 may extend at least partially along the thickness direction Z, with one end connected to the main body portion 231 and the other end connected to the conductor 40. It should be noted that when manufacturing the electrode layer 23, the main body portion 231 should not extend beyond the functional layer group 22. For example, referring to Figure 12, neither of the opposing ends of the main body portion 231 along the second direction Y extends beyond the functional layer group 22. If it does extend beyond the functional layer group 22, the main body portion 231 and the conductor 40 will be connected and a short circuit will occur.

[0160] After performing step S320, when performing step S400, the electrode layer 23 can be cut at the surface of the main body 231, thereby forming multiple sub-batteries 20 on the substrate 10, where the features of the sub-batteries 20 can refer to the features disclosed in any one of the above embodiments and will not be described further here. When a connection portion 232 is formed on at least one side along the second direction Y of the sub-battery 20, the connection portion 232 of the previous sub-battery 20 is connected to the conductor 40 in the current sub-battery 20, and the connection portion 232 should not come into contact with the conductor layer 21 in the same sub-battery 20, thereby reducing the risk of a short circuit occurring in the same sub-battery 20. At the same time, attention should also be paid to the contact problem between electrode layers 23 in two adjacent sub-batteries 20, for example, when a connection portion 232 is connected to an adjacent conductor 40, care must be taken to ensure that the connection between it and the adjacent electrode layer 23 is broken so that they do not come into contact and cause a short circuit.

[0161] Within the same electrode layer 23, there may be one or two connection portions 232. If there are two connection portions 232, the two connection portions 232 are connected to opposite sides of the main body 231, and the two connection portions 232 are located on opposite sides of the sub-battery 20 along the second direction Y.

[0162] Furthermore, the shape of the connection portion 232 can be designed in multiple ways, as long as it can be connected to the conductor 40 of an adjacent sub-battery 20. For example, the connection portion 232 may include a first portion 23a and a second portion 23b, where the first portion 23a is connected to the main body 231 and protrudes at least partially along the second direction Y and away from the main body 231, and the second portion 23b is connected between the first portion 23a and the conductor 40. In some examples, when cutting the electrode layer 23, the electrode layer 23 may be cut at a position between the connected first portion 23a and the conductor 40, i.e., the formed etching groove 30 may be located between the first portion 23a and the conductor 40 that are connected to each other.

[0163] By designing in this way, the electrode layer 23 is incorporated into the main body 231 and the connecting portion 232. The main body 231 is used to cover the functional layer group 22, making it easier for current to concentrate in the main body 231. At the same time, the connecting portion 232 is used to facilitate the connection between the electrode layer 23 and the conductor 40, thereby achieving a stable series connection between the sub-batteries 20.

[0164] According to some embodiments of this application, after the step of cutting the conductor 40 on the electrode layer 23 at a location along the first direction X, at least two sub-batteries 20 can be obtained on the substrate 10, and along the current direction of the solar cell module 100, the first sub-battery 20 located will not have the conductor 40.

[0165] The first sub-battery 20 located along the direction of the current may be understood as the first sub-battery 20 along the direction of the current. Since no current is input to the first sub-battery 20 from the outside, there is no need to install a conductor 40 on this sub-battery 20. Here, "along the direction of the current" refers to the fact that when the solar cell module 100 is operating, for example when it receives light, it outputs a current to the outside, and the current flows sequentially from the first sub-battery 20 to the last sub-battery 20, and the direction formed at this time is the direction of the current.

[0166] Of course, in some other embodiments, each sub-battery 20 may have at least one conductor 40. For example, the first sub-battery 20 located along the current direction of the solar cell module 100 may also have a conductor 40, thereby reducing the resistance of this sub-battery 20, allowing current to flow quickly, and improving the conductive performance of the module.

[0167] By designing it in this way, assuming a series connection between the sub-batteries 20, the amount of conductor 40 used is reduced, thereby lowering costs.

[0168] According to some embodiments of this application, referring to Figure 15, in S100, after the step of forming a conductive layer 21 extending along a first direction X on the substrate 10, further, Step S500 includes etching at least one edge along a second direction Y on the surface of the conductive layer 21 and etching up to the substrate 10 to form an etched region 11, wherein the etched region 11 does not include the conductive layer 21.

[0169] In step S500, the edges of the conductive layer 21 are etched to remove a portion of the conductive layer 21, thereby reducing the effective area for forming the conductive layer 21 and exposing a portion of the substrate 10. In this way, when the functional layer group 22 is formed subsequently, the area of ​​the functional layer group 22 can be increased, allowing the functional layer group 22 to cover the conductive layer 21 in the second direction Y, thereby preventing the electrode layer 23 from directly contacting the conductive layer 21 and causing a short circuit.

[0170] The etching region 11 may be one or multiple. For example, during etching, two edges along the second direction Y of the conductive layer 21 may be etched, or the edge portion along the first direction X of the conductive layer 21 may be etched.

[0171] In this way, the etching method reduces the effective area of ​​the conductive layer 21, allowing the functional layer group 22 to cover the conductive layer 21 in the second direction Y during the subsequent synthesis process, thereby preventing direct contact between the electrode layer 23 and the conductive layer 21, and thereby reducing the risk of short circuits caused by direct contact with the conductive layer 21 during the formation process of the electrode layer 23.

[0172] According to some embodiments of this application, in S100, the step of forming a conductive layer 21 extending along a first direction X on a substrate 10 includes the step of covering at least one edge on the surface of the substrate 10 along a second direction Y with a mask plate, and the step of forming the conductive layer 21 on the substrate 10 having the mask plate.

[0173] As can be seen from the above, a mask plate may be placed on at least one edge along the second direction Y on the substrate 10 before forming the conductive layer 21, and the conductive layer 21 cannot be formed in the area covered by it. Of course, in other embodiments, a mask plate may be placed on at least one edge along the first direction X on the substrate 10. Here, a mask plate refers to a structure that can prevent the conductive layer 21 from being formed on the substrate 10, and therefore, when forming the conductive layer 21, the conductive layer 21 is not included in the area covered by the mask plate on the substrate 10.

[0174] In this way, the mask plate method reduces the effective area of ​​the conductive layer 21, allowing the functional layer group 22 to cover the conductive layer 21 in the second direction Y during the subsequent synthesis process, thereby preventing direct contact between the electrode layer 23 and the conductive layer 21, and thereby reducing the risk of short circuits caused by direct contact between the electrode layer 23 and the conductive layer 21 during the formation process.

[0175] According to some embodiments of this application, this application provides a photovoltaic power generation device including any one of the above-described solar cell modules 100.

[0176] According to some embodiments of this application, this application provides a power consumption device including the above-described solar cell module 100.

[0177] According to some embodiments of this application, this application provides a power generation device including the above-described solar cell module 100.

[0178] According to some embodiments of this application, referring to Figures 1 to 15, this application provides a method for manufacturing a solar cell module, in which the edges of a conductive layer 21 are etched by an etching method to form an etched region 11 surrounding the conductive layer 21, a plurality of conductors 40 are formed on the conductive layer 21 at intervals along a first direction X, and both ends of the conductors 40 are made to protrude outside the conductive layer 21 along a second direction Y, a group of functional layers 22 is formed on the conductive layer 21, and the perovskite layer 222 in the group of functional layers 22 is controlled to cover an active region beyond the conductive layer 21, an electrode layer 23 is formed on the group of functional layers 22, the electrode layer 23 is connected to the portion of the conductor 40 protruding from the conductive layer 21, and finally, each conductor 40 is cut on the same side so that a plurality of sub-batteries 20 are formed in the first direction X. In two adjacent sub-batteries 20, the electrode layer 23 of one sub-battery 20 is connected to the conductor 40 of the other sub-battery 20, and the electrode layer 23 of the same sub-battery 20 is not short-circuited with the conductor 40. That is, referring to Figure 3, along the direction of current, the electrode layer 23 of the first sub-battery 20 is connected to the conductor 40 of the second sub-battery 20, the electrode layer 23 of the second sub-battery 20 is connected to the conductor 40 of the third sub-battery 20, and so on, repeated in sequence.

[0179] To make the purpose, technical proposal, and merits of this application more concise, this application will be described using the following specific embodiments, but this application is not limited to these embodiments. The embodiments described below are merely relatively good embodiments of this application and may be used to describe this application, and should not be understood as limitations on the scope of this application. It should be noted that any modifications, equivalent replacements, and improvements made within the spirit and principles of this application should all be included within the scope of protection of this application.

[0180] To better illustrate this application, a transformer-type perovskite battery module will be described as an example, and the contents of this application will be further explained below in conjunction with the examples. The following are specific examples.

[0181] Comparative Example 1 Manufacturing of the conductive layer 21 A conductive layer 21 was sputtered onto glass, and a 3cm x 3cm FTO conductive glass was etched using an etching method. The thickness of the FTO conductive glass was 350nm. It was washed twice in sequence with acetone and isopropyl alcohol, then immersed in deionized water and ultrasonically treated for 10 minutes. Next, it was dried in a forced-air oven, placed in a glove box (N2 atmosphere), washed, and then P1 scribes were made on the FTO conductive glass using a laser cutting method. There were 5 P1 scribes, and the width of the P1 scribes was 50μm.

[0182] Hole transport layer manufacturing The washed conductive glass was irradiated with an ultraviolet ozone machine for 10 minutes. 50 mg of nickel nitrate hexahydrate was weighed and dissolved in 1 ml of methanol. The mixture was stirred with a magnetic stirrer for 2 hours to obtain a pale green, clear, and clarified liquid. The liquid was filtered, the supernatant was taken, and the supernatant was swiftly coated onto the conductive glass. The glass was then annealed according to the following process: held at 80°C for 10 minutes, the temperature was raised to 345°C within 30 minutes, then held at 345°C for 30 minutes, then cooled to 100°C and removed to obtain the hole transport layer.

[0183] Manufacturing of perovskite layer 222 80 mg of iodoformamidine (FAI), 223 mg of lead iodide (PbI2), and 15 mg of chloromethylamine (MACl) were dissolved in 1 ml of solvent, which was a mixed solvent of N,N-dimethylformamide (DMF) and dimethyl sulfoxide (DMSO), with a volume ratio of 4:1 (DMF:DMSO). The perovskite solution was stirred at room temperature for 1 hour using a magnetic stirrer, filtered, and the supernatant was collected. The hole transport layer was irradiated with UV light for 15 mins, and then 60 μL of the supernatant of the perovskite solution was added dropwise to the hole transport layer. The mixture was then rotated in a spin coater for 30 s and an annealing process was performed. The annealing temperature was 150°C and the duration was 10 mins.

[0184] Manufacturing of electron transport layers Preparation of a [6,6]-phenyl-C61-methyl butyrate (PCBM, commercially available) solution: The concentration was 20 mg / ml, and the solvent was chlorobenzene. Using a LEBOSEMI spin coater, 60 μL of the prepared PCBM solution was rotationally coated onto a conductive glass containing perovskite layer 222 for 30 s. Next, it was annealed at 100°C for 10 min, then removed from the instrument and cooled to room temperature to obtain the electron transport layer. After obtaining the electron transport layer, P2 scribes were made using a laser cutting method, resulting in 5 P2 scribes with a width of 100 μm.

[0185] Manufacturing of electrode layer 23 The remaining functional layers 22 were wiped off with a cleaning solution, then placed on a deposition mask plate (Mask), and 80 nm silver was deposited using a vacuum deposition apparatus at a deposition rate of 0.1 angstroms (A / s). After deposition was complete, P3 scribes were performed to obtain a complete perovskite battery module. There were 5 P3 scribes, and the width of the P3 scribes was 50 μm.

[0186] Comparative Example 2 This is almost identical to Comparative Example 1, the only difference being that P1 scribes and P2 scribes are not performed after manufacturing the conductive layer 21 and the electron transport layer.

[0187] Example 1 This is almost identical to Comparative Example 1, the only difference being that P1 scribing is not performed after manufacturing the conductive layer 21, and four silver grid lines (i.e., conductors 40) are deposited on the conductive layer 21 at intervals along the first direction X. Here, both ends of each silver grid line protrude 1 cm from the conductive layer 21, and the width of the silver grid line along the first direction X is 100 μm, and the thickness along the thickness direction Z is 10 nm. P2 scribing was not performed after manufacturing the electron transport layer.

[0188] Furthermore, when the electrode layer 23 is deposited, the electrode layer 23 is in contact with the silver grid line and scribed at intervals of 6 mm, so that the distance between the formed etching grooves 30 is 6 mm, the etching grooves 30 penetrate the electrode layer 23 to the conductive layer 21, and the conductive layer, hole transport layer, perovskite layer, and electron transport layer between adjacent sub-batteries do not come into contact with each other, and the width of the etching grooves 30 is 50 μm, in the five sub-batteries 20 formed in this way, the leftmost sub-battery 20 along the current direction (i.e., the first sub-battery 20) does not have a silver grid line, while the remaining sub-batteries 20 each have one silver grid line. Simultaneously, each electrode layer 23 formed by vapor deposition includes a main body 231 and a connecting portion 232. The main body 231 covers the functional layer group 22, and the connecting portion 232 is connected to the end of the silver grid wire of the next sub-battery 20. At the same time, the electrode layer 23 on the same sub-battery 20 is not directly connected to the silver grid wire of the sub-battery 20 in question. In this case, along the direction of the current, the connecting portion 232 of the first sub-battery 20 is connected to the silver grid wire of the second sub-battery 20, the connecting portion 232 of the second sub-battery 20 is connected to the silver grid wire of the third sub-battery 20, and so on, repeated in sequence. In the remaining four sub-batteries 20, the distance between the silver grid wire and the etching groove 30 located on the left side was 1 mm.

[0189] Example 2 This example is almost identical to Example 1, the only difference being that the thickness of the silver grid line along the thickness direction Z is 20 nm.

[0190] Example 3 This example is almost identical to Example 1, the only difference being that the thickness of the silver grid line along the thickness direction Z is 40 nm.

[0191] Example 4 This example is almost identical to Example 1, the only difference being that the thickness of the silver grid line along the thickness direction Z is 50 nm.

[0192] Example 5 This example is almost identical to Example 1, the only difference being that the thickness of the silver grid line along the thickness direction Z is 60 nm.

[0193] Example 6 This example is almost identical to Example 1, the only difference being that the thickness of the silver grid line along the thickness direction Z is 80 nm.

[0194] Example 7 This example is almost identical to Example 1, the only difference being that the thickness of the silver grid line along the thickness direction Z is 100 nm.

[0195] Example 8 This example is almost identical to Example 1, the only difference being that the thickness of the silver grid line along the thickness direction Z is 120 nm.

[0196] Example 9 This example is almost identical to Example 1, the only difference being that the thickness of the silver grid line along the thickness direction Z is 150 nm.

[0197] Example 10 This example is almost identical to Example 1, the only difference being that the thickness of the silver grid line along the thickness direction Z is 300 nm.

[0198] The perovskite battery modules manufactured in the above examples and comparative examples were tested, and the obtained battery efficiencies are shown in Table 1.

[0199] Tests were conducted using a solar simulator, performing an IV test with a single solar field. The solar simulator simulated sunlight irradiating the battery, and the IV characteristics of the battery were tested using a digital source meter. The results conformed to the national standard IEC61215, and parameters such as open-circuit voltage, short-circuit current, filling factor, and efficiency were obtained. Here, efficiency = open-circuit voltage × short-circuit current × filling factor.

[0200] [Table 1]

[0201] As can be seen from Comparative Examples 1 and 2, and Examples 1 through 10, when a silver grid wire is present, this application allows for the acquisition of a solar cell module with only one cut, simplifying the manufacturing process and simultaneously reducing the probability of cutting the structure of the solar cell module during the manufacturing process. Furthermore, when the thickness of the silver grid wire is between 10 nm and 100 nm, the battery efficiency increases with increasing thickness, resulting in better performance. When the thickness of the silver grid wire is ≥ 40 nm, the performance of the solar cell module of this application is not significantly different from, and is even better than, the performance of, a solar cell module obtained by the conventional scribing method. Moreover, when the thickness of the silver grid wire is controlled between 50 nm and 300 nm, the battery efficiency is mostly higher than that of batteries that have been properly cut, which is advantageous for improving the performance of the module.

[0202] To verify the influence of the material and distribution location of the conductor 40 on the performance of the solar cell module, the contents of this application will be further explained below, along with examples. The following are specific examples.

[0203] Example 11 This example is almost identical to Example 7, the only difference being that the material of the conductor 40 is copper.

[0204] Example 12 This example is almost identical to Example 7, the only difference being that the material of the conductor 40 is gold.

[0205] Example 13 This example is almost identical to Example 7, the only difference being that the material of the conductor 40 is aluminum.

[0206] Example 14 This example is almost identical to Example 7, the only difference being that the material of the conductor 40 is zinc.

[0207] Example 15 This example is almost identical to Example 7, the only difference being that the distance between the silver grid line and the etching groove 30 located on the left side is 2 mm.

[0208] Example 16 This example is almost identical to Example 7, the only difference being that the distance between the silver grid line and the etching groove 30 located on the left side is 3 mm.

[0209] The perovskite battery modules manufactured in the above examples and comparative examples were tested (see the test steps above), and the obtained battery efficiencies are shown in Table 2.

[0210] [Table 2]

[0211] As can be seen from Examples 7 and 11 to 14, the conductivity is greater than that of the conductive layer 21, and in particular, conductivity ≥ 5 × 10 6When multiple types of materials with an S / m ratio are used as the conductor 40, the objective of simplifying the module manufacturing process can be achieved, and at the same time, the performance of the solar cell module can be effectively improved. Furthermore, when the material of the conductor 40 is a non-metallic material, such as carbon fiber, conductive polymer material, conductive ceramic material, etc., similar effects to those in Example 7 can be similarly achieved.

[0212] As can be seen from Examples 7, 15, and 16, the closer the position of the conductor 40 in the conductive layer 21 is to the etching groove 30, the higher the battery efficiency, but the change in efficiency is not significant.

[0213] Let W be the size of the conductor 40 along the first direction X, where 30 μm ≤ W ≤ 200 μm. By controlling the size of the conductor 40 in the first direction X between 30 μm and 200 μm, it is possible to not only ensure rapid current flow but also control the size of the dead zone on the conductive layer, thereby improving the performance of the solar cell module. Preferably, by controlling it to 80 μm ≤ W ≤ 100 μm, and further controlling the size of the conductor in the first direction between 80 μm and 100 μm, the design of the conductor can more effectively balance its own conductive performance with the active area on the conductive layer.

[0214] Furthermore, to further illustrate this application, a formal perovskite battery module will be described as an example, and the contents of this application will be further explained below in conjunction with the examples. The following are specific examples.

[0215] Comparative Example 3 This is almost identical to Comparative Example 1, with the only differences being the distribution locations of the electron transport layer and hole transport layer, and the manufacturing process. Here, the conductive layer, electron transport layer, perovskite layer, hole transport layer, and electrode layer are stacked in that order, as shown below: Manufacturing of electron transport layers The cleaned conductive glass was irradiated with an ultraviolet ozone machine for 10 minutes. First, an aqueous SnO2 solution was prepared with a concentration of 15 wt%. 500 μL of the aqueous SnO2 solution was rotary coated onto an FTO glass substrate at a rotational speed of 5000 rpm for 60 seconds, annealed at 150°C for 15 minutes, and cooled to room temperature to obtain an electron transport layer.

[0216] Hole transport layer manufacturing 500 μL of Spiro solution was applied by rotation at a rotation speed of 2000 rpm for 30 seconds without annealing. The concentration of the Spiro solution was 40 mg / ml.

[0217] Comparative Example 4 This is almost identical to Comparative Example 3, the only difference being that P1 scribes and P2 scribes are not performed after the conductive layer 21 and electron transport layer are manufactured.

[0218] Example 17 This is almost identical to Comparative Example 3, the only difference being that P1 scribing is not performed after manufacturing the conductive layer 21, and four silver grid lines (i.e., conductors 40) are deposited on the conductive layer 21 at intervals along the first direction X. Here, both ends of each silver grid line protrude 1 cm from the conductive layer 21, and the width of the silver grid line along the first direction X is 100 μm, and the thickness along the thickness direction Z is 10 nm. P2 scribing was not performed after manufacturing the electron transport layer.

[0219] Furthermore, when the electrode layer 23 is deposited, the electrode layer 23 is in contact with the silver grid line, and P3 scribing is performed at intervals of 6 mm, so that the distance between the formed etching grooves 30 is 6 mm, the etching grooves 30 penetrate the electrode layer 23 to the conductive layer 21, and the conductive layer, hole transport layer, perovskite layer, and electron transport layer between adjacent sub-batteries do not come into contact with each other, and the width of the etching grooves 30 is 50 μm, in the five sub-batteries 20 formed in this way, the leftmost sub-battery 20 along the current direction (i.e., the first sub-battery 20) does not have a silver grid line, while the remaining sub-batteries 20 each have one silver grid line. Simultaneously, each electrode layer 23 formed by vapor deposition includes a main body 231 and a connecting portion 232. The main body 231 covers the functional layer group 22, and the connecting portion 232 is connected to the end of the silver grid wire of the next sub-battery 20 along the current direction. At the same time, the electrode layer 23 on the same sub-battery 20 is not connected to the silver grid wire of the sub-battery 20 where it is located. In this case, along the current direction, the connecting portion 232 of the first sub-battery 20 is connected to the silver grid wire of the second sub-battery 20, the connecting portion 232 of the second sub-battery 20 is connected to the silver grid wire of the third sub-battery 20, and so on, repeated in sequence. Here, in the remaining four sub-batteries 20, the distance between the silver grid wire and the etching groove 30 located on the left side was 1 mm.

[0220] Example 18 This example is almost identical to Example 17, the only difference being that the thickness of the silver grid line along the thickness direction Z is 20 nm.

[0221] Example 19 This example is almost identical to Example 17, the only difference being that the thickness of the silver grid line along the thickness direction Z is 40 nm.

[0222] Example 20 This example is almost identical to Example 17, the only difference being that the thickness of the silver grid line along the thickness direction Z is 50 nm.

[0223] Example 21 This example is almost identical to Example 17, the only difference being that the thickness of the silver grid line along the thickness direction Z is 60 nm.

[0224] Example 22 This example is almost identical to Example 17, the only difference being that the thickness of the silver grid line along the thickness direction Z is 80 nm.

[0225] Example 23 This is almost identical to Example 17, the only difference being that the thickness of the silver grid line along the thickness direction Z is 100 nm.

[0226] Example 24 This is almost identical to Example 17, the only difference being that the thickness of the silver grid line along the thickness direction Z is 120 nm.

[0227] Example 25 This is almost identical to Example 17, the only difference being that the thickness of the silver grid line along the thickness direction Z is 150 nm.

[0228] Example 26 This is almost identical to Example 17, the only difference being that the thickness of the silver grid line along the thickness direction Z is 300 nm.

[0229] The perovskite battery modules manufactured in the above examples and comparative examples were tested, and the obtained battery efficiencies are shown in Table 3.

[0230] [Table 3]

[0231] As can be seen from Comparative Examples 3 and 4, and Examples 17 to 26, whether in a transformer structure or a formal structure, when the thickness of the silver grid wire is between 10 nm and 100 nm, the battery efficiency increases and performance improves as the thickness increases. At the same time, when the thickness of the silver grid wire is controlled between 50 nm and 300 nm, the battery efficiency is higher than that of a battery that is mostly properly cut, which is advantageous for improving the performance of the module.

[0232] Each of the technical features of the embodiments described above can be combined in any way, and for the sake of brevity, not all possible combinations of each technical feature in the embodiments described above are described; however, as long as there is no contradiction in these combinations of technical features, they should all be considered to fall within the scope described herein.

[0233] The embodiments described above represent only a few embodiments of this application, and while their descriptions are more specific and detailed, they should not be understood as limiting the scope of the claims. It should be noted that a person skilled in the art can make several further modifications and improvements without departing from the concept of this application, and all of these fall within the scope of protection of this application. Therefore, the scope of protection of this patent application shall be in accordance with the attached claims. [Explanation of Symbols]

[0234] 100: Solar cell module, 10: Substrate, 11: Etching area, 20: Sub-battery, 21: Conductive layer, 22: Functional layer group, 221: First transport layer, 222: Perovskite layer, 223: Second transport layer, 23: Electrode layer, 231: Main body, 232: Connection part, 23a: First part, 23b: Second part, 233: Cutting gap, 2a: First sub-battery, 2a1: First conductive layer, 2a2: First functional layer group, 2a3: First electrode layer, 2b: Second sub-battery, 2b1: Second conductive layer, 2b2: Second functional layer group, 2b3: Second electrode layer, 30: Etching groove, 40: Conductor, 41: First component, 42: Second component, X: First direction, Y: Second direction, Z: Thickness direction.

Claims

1. Solar cell module, It includes at least two sub-batteries, which are distributed at intervals along a first direction, and each sub-battery includes a conductive layer, a group of functional layers, and an electrode layer, which are stacked and installed. The solar cell module further includes a conductor, wherein in two adjacent sub-batteries, the conductor is connected to the conductive layer of one of the sub-batteries and at least partially protrudes from at least one end along a second direction of the conductive layer, the portion of the conductor protruding from the conductive layer is connected to the electrode layer of the other sub-battery, the first direction intersects the second direction, and the plane formed by both intersects the thickness direction of the solar cell module.

2. The solar cell module according to claim 1, wherein the conductor is provided on the side of the conductive layer toward the functional layer group and extends outward from at least one end along the second direction of the conductive layer.

3. The solar cell module according to claim 2, wherein both ends of the conductor each protrude outward from the ends of the conductive layer along the second direction, and at least one of the ends of the conductor is connected to the electrode layer in the adjacent sub-battery.

4. The solar cell module according to claim 2 or 3, wherein the conductor includes a first member and a second member, the first member and the second member are distributed discontinuously, the first member and the second member each protrude outward from opposite ends of the conductive layer along the second direction, and both are connected to the electrode layer of an adjacent sub-battery.

5. A solar cell module according to any one of claims 1 to 4, wherein an etching groove is provided between two adjacent sub-batteries, and the conductor is located on at least one side of the etching groove along the first direction and is provided on the conductive layer.

6. The solar cell module according to claim 5, wherein the solar cell module includes a plurality of etching grooves and a plurality of conductors, and has at least one conductor between two adjacent etching grooves.

7. The solar cell module according to any one of claims 2 to 6, wherein the size of the conductor along the first direction is smaller than the size of the conductive layer along the first direction.

8. The solar cell module according to claim 7, wherein the size of the conductor along the first direction is denoted as W, where 30 μm ≤ W ≤ 200 μm.

9. The solar cell module according to claim 8, wherein the size W further satisfies the condition 80 μm ≤ W ≤ 100 μm.

10. The solar cell module according to any one of claims 2 to 9, wherein the size of the conductor along the thickness direction is denoted as h, and where h > 0 nm.

11. The solar cell module according to claim 10, wherein the size h further satisfies the condition that h ≥ 40 nm.

12. The solar cell module according to claim 10 or 11, wherein the size h further satisfies the condition 40 nm ≤ h ≤ 300 nm.

13. The solar cell module according to any one of claims 10 to 12, wherein the size h further satisfies the condition 50 nm ≤ h ≤ 150 nm.

14. The solar cell module according to any one of claims 10 to 13, wherein the size h further satisfies the condition 80 nm ≤ h ≤ 150 nm.

15. Each electrode layer includes a main body and a connecting portion connected to the main body, the main body is provided on the side of the functional layer group facing away from the conductive layer, and the connecting portion is located on at least one side of the sub-battery along the second direction. The solar cell module according to any one of claims 1 to 14, wherein in two adjacent sub-batteries, the connection portion of one of the sub-batteries is connected to the conductor of the other sub-battery.

16. The solar cell module according to any one of claims 1 to 15, wherein the opposing ends of the functional layer group along the second direction each protrude beyond the conductive layer in the second direction.

17. The solar cell module further includes a substrate, and the conductive layer is provided on the substrate, according to any one of claims 1 to 16.

18. The solar cell module according to any one of claims 1 to 17, wherein the functional layer group includes a first transport layer, a perovskite layer, and a second transport layer stacked in order, the first transport layer being provided on the conductive layer, and the electrode layer being provided on the second transport layer.

19. The solar cell module according to claim 18, wherein the first transport layer is a hole transport layer and the second transport layer is an electron transport layer.

20. The solar cell module according to claim 18, wherein the first transport layer is an electron transport layer, and the second transport layer is a hole transport layer.

21. The solar cell module according to any one of claims 1 to 20, wherein the conductivity of the conductor is greater than the conductivity of the conductive layer.

22. The conductivity of the aforementioned conductor is ≥ 5 × 10 ６ The solar cell module according to claim 21, wherein the S / m ratio is S / m.

23. The solar cell module according to claim 21 or 22, wherein the conductor is at least one of silver, copper, gold, aluminum, magnesium, tungsten, molybdenum, zinc, cobalt, nickel, potassium, lithium, iron, platinum, tin, carbon fiber, zinc oxide, conductive polymer material, conductive polymer material, and conductive ceramic material.

24. The solar cell module according to any one of claims 1 to 23, wherein the conductive layer comprises at least one of indium-doped tin oxide, fluorine-doped tin oxide, aluminum-doped zinc oxide, lanthanide metal-doped indium oxide, antimony-doped tin oxide, boron-doped zinc oxide, indium zinc oxide, gallium zinc oxide, and indium tungsten oxide.

25. A method for manufacturing a solar cell module according to any one of claims 1 to 24, The steps include forming a conductive layer on a substrate that extends along a first direction, A step of placing a conductor on the conductive layer, wherein the conductor protrudes at least partially from at least one end along a second direction of the conductive layer, the first direction intersects the second direction, and the plane formed by both intersects the thickness direction of the solar cell module. The steps include sequentially forming a group of functional layers and an electrode layer on the conductive layer, and connecting the electrode layer to the portion of the conductor that protrudes from the conductive layer, A method for manufacturing a solar cell module according to any one of claims 1 to 24, comprising the step of cutting the electrode layer at a location on the side of the conductor along the first direction, and cutting the substrate.

26. The step of placing a conductor on the conductive layer is, A method for manufacturing a solar cell module according to claim 25, comprising forming a conductor on a side surface of the conductive layer facing away from the substrate, and controlling at least one end of the conductor to protrude out of the conductive layer along the second direction.

27. The method for manufacturing a solar cell module according to claim 26, wherein in the step of forming a conductor on a side surface of the conductive layer facing away from the substrate, the conductor comprises a plurality of conductors, and at least some of the conductors are distributed at intervals along the first direction in the conductive layer.

28. The step of sequentially forming a group of functional layers and an electrode layer on the conductive layer, and connecting the electrode layer to the portion of the conductor that protrudes from the conductive layer, The steps include forming a group of functional layers on the conductive layer, A method for manufacturing a solar cell module according to any one of claims 25 to 27, comprising the steps of forming a main body portion of an electrode layer on the side of the functional layer group facing away from the conductive layer, and forming a plurality of connection portions of the electrode layers at at least one end of the functional layer group along the second direction, wherein the conductor has the connection portions on both sides along the first direction, and the conductor is connected to one of the connection portions and disconnected from the other connection portion.

29. After the step of forming a conductive layer extending along a first direction on the substrate, A method for manufacturing a solar cell module according to any one of claims 25 to 28, comprising the step of etching at least one edge along a second direction on the surface of the conductive layer and etching up to the substrate to form an etched region, wherein the etched region does not include the conductive layer.

30. The step of forming a conductive layer extending along a first direction on a substrate is: The steps include: covering at least one edge of the substrate surface along a second direction with a mask plate; A method for manufacturing a solar cell module according to any one of claims 25 to 28, comprising the step of forming a conductive layer on the substrate having the mask plate.

31. A photovoltaic power generation device comprising a solar cell module according to any one of claims 1 to 24.

32. A power consumption device comprising a solar cell module according to any one of claims 1 to 24.

33. A power generation device comprising a solar cell module according to any one of claims 1 to 24.

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