Thermal sensor

Abstract

To provide a heat detector capable of easily reducing an exposed portion thereof from an installation surface.SOLUTION: A heat detector 100 includes: a case lid 30 with a first hole 31 formed on the underside; a case 80 comprising a case body 10; a substrate 20 stored in the case 80; a sensor 40 having a heat-sensitive part attached to the substrate 20 and exposed through the first hole 31; and a protector 60 comprising a top plate 60, a pillar 63 and a cover 64 that protect the heat-sensitive part. The substrate 20 is positioned vertically and the sensor is positioned parallel to or as an extension of the substrate 20.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a heat detector having a sensor for detecting heat. [Background technology]

[0002] Conventionally, heat detectors are equipped with sensors such as thermistors that detect heat, and detect the occurrence of a fire by detecting the heat of hot air currents generated by a fire. Some heat detectors have a circuit board arranged inside a case (detector body), and the sensor is mounted on the board so that the heat-sensing part is exposed through an opening provided on the underside of the detector body (see, for example, Patent Document 1). In the heat detector of Patent Document 1, the circuit board is arranged inside the case so as to be parallel to the installation surface, such as the ceiling surface, on which the heat detector is installed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2-357399 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in a configuration in which the board is arranged parallel to the installation surface, such as the heat detector in Patent Document 1, the width of the case in which the board is stored must be greater than or equal to the area of ​​the board, making it difficult to reduce the size of the heat detector visible to the user.

[0005] The present invention has been made to solve the above-mentioned problems, and aims to provide a heat detector that makes it easy to reduce the size of the heat detector exposed from the installation surface. [Means for solving the problem]

[0006] The heat detector of the present invention comprises: a case having a hole formed on a bottom surface thereof; The plate-shaped member has a width greater than the minimum opening width of the hole, is arranged in the vertical direction, and is generally A substrate housed in the case and a Sensor base A heat-sensing portion exposed through the hole of the case and an intermediate portion extending in the vertical direction and connecting the sensor base portion and the heat sensing portion. and a protector for protecting the heat-sensing unit. Ta It is something. In addition, in the above heat detector, the intermediate portion has a rod-shaped lead portion connected to the heat-sensing portion and a connection portion that is thicker than the lead portion and connects the lead portion to the sensor base, and a cutout portion is formed at the lower end of the substrate in which the connection portion of the sensor is positioned.

[0007] Also, The heat detector of the present invention comprises a case having a hole formed on its underside, a board housed in the case, a sensor attached to the board, having a lead portion and a heat-sensing portion provided at the tip of the lead portion and exposed through the hole in the case, and a protector for protecting the heat-sensing portion, wherein the board is arranged in a vertical direction, the sensor is arranged parallel to the board or on an extension of the board, a cutout portion is formed in the board where a connection portion with the sensor is located, and the sensor is arranged so that the lead portion extends in a vertical direction.

[0008] Also, The heat detector of the present invention comprises a case having a hole formed on its underside, a substrate housed in the case, a sensor attached to the substrate and having a lead portion and a heat-sensing portion provided at the tip of the lead portion and exposed through the hole in the case, and a protector for protecting the heat-sensing portion, wherein the substrate is arranged in a vertical direction and the sensor is arranged parallel to the substrate, and the substrate is arranged eccentrically within the case so that the sensor is located at the center of the case when viewed from below.

[0009] In addition, in the above heat detector, The hole has a cone shape with an opening width gradually increasing from the surface on the lower surface facing the substrate toward the surface on the protector side. Effect of the Invention

[0010] According to the present invention, the substrate is disposed vertically and the sensor is disposed parallel to the substrate or on an extension of the substrate, so that the substrate is disposed approximately perpendicular to the installation surface such as a ceiling. Therefore, compared to the conventional case where the substrate is disposed parallel to the installation surface, it is easier to reduce the size of the heat detector exposed from the installation surface. [Brief description of the drawings]

[0011] [Figure 1] 1 is a perspective view showing an external appearance of a heat detector according to a first embodiment; [Diagram 2] FIG. 2 is an exploded perspective view showing the configuration of the heat detector of FIG. [Diagram 3] FIG. 2 is a side view showing the heat detector of FIG. 1 installed on a ceiling. [Figure 4] FIG. 2 is a bottom view of the heat detector of FIG. [Diagram 5] 5 is a cross-sectional view showing the section AA of FIG. 4. [Figure 6] FIG. 5 is a cross-sectional view showing the cross section BB of FIG. [Figure 7] 5 is an explanatory diagram showing the positional relationship between a protector and a case in the heat detector of FIG. 4. [Figure 8] FIG. 6 is a cross-sectional view showing the cross section DD of FIG. 5. [Figure 9]5 is a cross-sectional view showing the CC section of FIG. 4. [Figure 10] 6 is an explanatory diagram showing a state in which a light source in the heat detector of FIG. 5 emits light. FIG. [Figure 11] FIG. 11 is a perspective view showing the appearance of a heat detector according to a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Embodiment 1 1 is a perspective view showing the appearance of a heat detector according to embodiment 1. Heat detector 100 is installed in a monitored space in a building, for example, and monitors the surrounding temperature. When the surrounding temperature reaches or exceeds a certain temperature, heat detector 100 outputs a signal indicating a fire to a fire receiver (not shown).

[0013] Fig. 2 is an exploded perspective view showing the configuration of the heat detector of Fig. 1. As shown in Fig. 2, the heat detector 100 includes a case body 10 having an opening 11, a substrate 20, a sensor 40 that detects heat, a light source 50 that emits light, a case lid 30 that is placed in the opening 11 of the case body 10, and a protector 60 that protects the sensor 40.

[0014] As shown in FIG. 2, the substrate 20 is housed in the case body 10 through the opening 11. Various electronic components including the sensor 40 and the light source 50 are mounted on the substrate 20. The case lid 30 is detachably attached to the case body 10 in which the substrate 20 is housed. A first hole 31 through which the sensor 40 is inserted is formed in the central portion 30c of the case lid 30. The protector 60 is provided to protect the tip of the sensor 40 that protrudes in the heat detector 100. The protector 60 is formed with a second hole 61 through which airflow passes. The second hole 61 will be described later. In addition, the central portion 30c of the case lid 30 is exposed from a third hole 64a provided in the center of a cover portion 64 of the protector 60, which will be described later, and the central portion 30c of the case lid 30 forms the central portion 30c of the heat detector 100, and similarly, the first hole 31 forms the first hole 31 of the heat detector 100.

[0015] Fig. 3 is a side view showing the heat detector of Fig. 1 installed on a ceiling. As shown in Fig. 3, the heat detector 100 is installed on, for example, a ceiling 200 in which a recess 202 is formed on the opposite side to the monitored space. Specifically, the heat detector 100 is installed on the ceiling 200 so that the case body 10 is accommodated in the recess 202 of the ceiling 200 and the protector 60 protrudes from the ceiling surface 201 into the monitored space.

[0016] In each drawing, the arrow Z direction is described as representing the height direction (up-down direction) of the heat detector 100 when it is installed on the ceiling 200. That is, in a state where the heat detector 100 is installed on the ceiling 200 as shown in FIG. 3, the side closer to the floor is defined as the bottom. In a state where the heat detector 100 is installed on the ceiling 200, the case body 10 constituting the upper outer surface of the heat detector 100 faces the inner surface of the recess 202 of the ceiling 200, and the protector 60 constituting the lower outer surface of the heat detector 100 is exposed to the room. Also, the arrow X direction in each drawing is defined as representing the width direction (left-right direction) of the heat detector 100, and the arrow Y direction is defined as representing the depth direction (front-back direction) of the heat detector 100. As shown in FIG. 2, the opening 11 of the case body 10 is formed on the lower surface of the case body 10. In the example shown in FIG. 2, the case body 10 has a box shape with an open lower surface. Also, the first hole portion 31 is formed in the center portion 30c of the case lid 30. The following describes an example in which the case 80 covering the substrate 20 is composed of the case body 10 and the case lid 30, but it is also possible to omit the case lid 30. In this case, the case 80 is, for example, in the shape of a hollow box, and a first hole through which the sensor 40 is inserted is formed in the center of the bottom surface of the case 80.

[0017] (Configuration of protector 60) Fig. 4 is a bottom view of the heat detector of Fig. 1. Fig. 5 is a cross-sectional view showing the AA cross section of Fig. 4. Fig. 6 is a cross-sectional view showing the BB cross section of Fig. 4. As shown in Figs. 1, 2, 5 to 6, the protector 60 has a top plate 62 facing the central portion 30c, a cover portion 64 provided above the top plate 62, and a plurality of supports 63 supporting the top plate 62. The cover portion 64 is attached to the case body 10, and is disposed below the case body 10 so as to cover the recess 202 of the ceiling 200 when the heat detector 100 is attached to the ceiling 200. The plurality of supports 63 connect the top plate 62 and the cover portion 64.

[0018] 1, 2, and 5-6, a third hole 64a is formed in the center of the cover portion 64, and the cover portion 64 has a disk shape as shown in Figs. 1, 2, and 4. The sensor 40 protruding from the case body 10 via the first hole 31 of the center portion 30c is inserted into the third hole 64a.

[0019] Although not shown, the cover portion 64 of the protector 60 is provided with two springs extending from the surface on the side of the case body 10 toward the outer periphery. As shown in Fig. 3, when the case body 10 is housed in the recess 202 of the ceiling 200, the two springs provided on the protector 60 press the left and right inner surfaces of the recess 202, thereby preventing the case body 10 from falling out of the recess 202 of the ceiling 200. Note that the mounting configuration of the heat detector 100 to the ceiling 200 is not limited to this configuration.

[0020] Fig. 7 is an explanatory diagram showing the positional relationship between the protector and the case in the heat detector of Fig. 4. As shown in Fig. 3, the outer diameter Do2 of the cover part 64 is set to a dimension larger than the width of the case body 10, and the case body 10 and the recess 202 are configured so that they are not visible to the user. Specifically, as shown in Fig. 7, the outer diameter Do2 of the cover part 64 is set to a dimension larger than the length W of the diagonal of the case body 10, which has a rectangular cross section.

[0021] As shown in Figs. 1, 2, 4 to 6, a top plate opening 61a is formed in the center of the top plate 62, and as shown in Figs. 1, 2 and 4, the top plate 62 has a disk shape. As shown in Figs. 3 and 4, in the protector 60, the outer diameter Do1 of the top plate 62 is smaller than the outer diameter Do2 of the cover portion 64. The outer diameter Do1 of the top plate 62 and the outer diameter Do2 of the cover portion 64 may be the same diameter, or the outer diameter Do1 of the top plate 62 may be larger than the outer diameter Do2 of the cover portion 64. The outer diameter, inner diameter, or difference between the outer diameter and the inner diameter of the top plate 62 is determined so that the central portion 30c is visible through the second hole portion 61 (see Fig. 2) of the protector 60 when the user looks at the heat detector 100 at a predetermined elevation angle. Here, the predetermined elevation angle is the angle at which a user looks up at the heat detector 100, and may be, for example, the angle at which a user located 15 meters away from the heat detector 100 looks up at a heat detector 100 installed at a height of 3 meters from the floor. As shown in Fig. 5, the inner diameter Di1 of the top plate 62, i.e., the opening width of the top plate opening 61a, is preferably set to a dimension (e.g., 8 mm or less) that prevents a test finger or the like from entering.

[0022] As shown in Fig. 4, when viewed from below of the heat detector 100, the center of the top plate opening 61a of the top plate 62 coincides with the center of the third hole 64a (see Fig. 1) of the cover portion 64. Also, as shown in Fig. 5, the center of the top plate opening 61a and the center of the third hole 64a in the protector 60 and the center of the first hole 31 are located on a straight line extending in the vertical direction (arrow Z direction), and the sensor 40 is disposed along this straight line.

[0023] 5, the inner diameter Di1 of the top plate 62, i.e., the opening width of the top plate opening 61a, is set to a dimension equal to or smaller than the inner diameter Di2 of the cover portion 64, i.e., the opening width of the third hole 64a. The opening widths of the top plate opening 61a and the third hole 64a are set to a dimension larger than the diameter Ds of the tip of the sensor 40 to be inserted, and preferably larger than the opening width Di0 of the first hole 31 of the case lid 30. With this configuration, in a bottom view of the heat detector 100 as shown in FIG. 4, the central portion 30c of the case lid 30 located inside the protector 60 is visible from the outside of the heat detector 100 through the top plate opening 61a of the protector 60.

[0024] As shown in Figs. 1 and 2, the support 63 of the protector 60 is made of, for example, a plate-shaped member, and the multiple support 63 are arranged radially with a gap G between adjacent support 63. The gap G is preferably set to a dimension (for example, 8 mm or less) that can prevent a test finger or the like from entering. The multiple support 63 and the top plate 62 provided below the central portion 30c constitute a protective portion that protects the tip of the sensor 40 from a finger or the like. In the first embodiment, the support 63 is made of an opaque material. As shown in Figs. 1 and 5, each support 63 extends downward from the periphery of the third hole portion 64a on the lower surface of the cover portion 64 and is connected to the periphery of the top plate opening 61a on the upper surface of the top plate 62. And, as shown in Fig. 3, the outer diameter Do1 of the top plate 62 is set to a dimension larger than the outer diameter Do3 formed by the multiple support 63 arranged radially. With this configuration, as shown in Figs. 1 and 3, the multiple support columns 63 of the heat detector 100 can be made less visible to the user, improving the design.

[0025] As shown in FIGS. 5 and 6, the top plate 62, the plurality of supports 63, the cover portion 64, and the central portion 30c of the protector 60 form an airflow circulation space SP in the protector 60. When the heat detector 100 is installed on the ceiling 200, a vertical airflow flows into the circulation space SP through the top plate opening 61a. Here, the vertical airflow refers to an airflow that flows in a direction perpendicular to the ceiling surface 201. In addition, a horizontal airflow flows into the circulation space SP through the gap G formed between the supports 63, and the airflow in the circulation space SP flows out of the heat detector 100. Here, the horizontal airflow refers to an airflow that flows in a direction parallel to the ceiling surface 201. In other words, the top plate opening 61a provided in the top plate 62 and the gap G between the plurality of supports 63 each function as a second hole portion 61 (see FIG. 2) through which the airflow flows in the protector 60.

[0026] (Configuration of case lid 30) As shown in FIG. 5, the first hole 31 formed in the central portion 30c of the case lid 30 has a size equal to or larger than the diameter Ds of the heat sensing portion of the sensor 40 protruding from the case lid 30 so that the sensor 40 can be inserted when assembling the heat detector 100. The case lid 30 has a frame member 34 and is configured to cover the lower end of the substrate 20 while exposing the heat sensing portion 41 of the sensor 40 to the outside from the first hole 31 of the central portion 30c. Here, the central portion 30c of the case lid 30 is specifically an area of ​​the case lid 30 exposed to the flow space SP. In the example shown in FIG. 2, the frame member 34 has a rectangular shape, and the central portion 30c is formed in the center of the frame member 34. Note that the frame member 34 and the central portion 30c of the case lid 30 may be configured of different members. Also, the frame member 34 is not limited to a rectangular shape.

[0027] The case lid 30 covers the lower end of the substrate 20 while exposing the heat-sensing part 41 to the outside, and the case lid 30 may be formed only by the frame member 34, and the central part 30c may be formed separately from the case lid 30. In this case, the central part 30c may be formed integrally with the cover part 64 of the protector 60.

[0028] The case lid 30 is made of a light-transmitting member. The first hole 31 has a mortar shape in which the opening width gradually increases from the upper surface to the lower surface of the case lid 30. In other words, the opening width of the first hole 31 gradually increases from the surface on the substrate 20 side to the surface on the protector 60 side of the lower surface of the case 80. In this embodiment, the first hole 31 has been described as having a mortar shape, but the shape of the first hole 31 is not limited to this. The opening width Di0 of the first hole 31 above the central portion 30c is larger than the thickness Ds of the tip of the sensor 40 inserted into the first hole 31, and is the same diameter as or smaller than the inner diameter Di1 of the top plate 62 of the protector 60.

[0029] 2, the case lid 30 is formed with an injection port 32 for injecting a filler into the case body 10 when manufacturing the heat detector 100. The filler will be described later. The injection port 32 is provided outside the first hole portion 31 formed in the center of the case lid 30, and is provided at each of the four corners of the case lid 30 in the example shown in FIG. 2. Note that the injection port 32 can be omitted, and in that case, the filler can be injected through the first hole portion 31.

[0030] (Substrate 20) Various electronic components are mounted on the board 20 to form a control circuit. As shown in Fig. 2, the board 20 is, for example, a rectangular printed circuit board. In the example shown in Fig. 2, the board 20 is substantially rectangular with long sides extending in the vertical direction (arrow Z direction), and is disposed in the case body 10 so that both sides of the board 20 face forward and backward. In other words, the board 20 is disposed in the vertical direction so that the lower surface of the case 80, i.e., the case lid 30, and the lower end of the board 20, i.e., the lower short side, face each other.

[0031] In this way, by arranging the substrate 20 substantially perpendicular to the ceiling surface 201 inside the case body 10, the length W of the diagonal of the case body 10 can be set smaller than when it is conventionally arranged substantially parallel to the ceiling surface. Therefore, it is also possible to make the cover portion 64 of the protector 60 covering the bottom surface of the case 80 smaller than conventionally, and it becomes easy to reduce the size of the heat detector 100 exposed from the installation surface.

[0032] Fig. 8 is a cross-sectional view showing the DD cross section of Fig. 5. As shown in Fig. 5 and Fig. 8, the light source 50 and the sensor 40 are attached by soldering at predetermined positions on the front surface 21 of the substrate 20. A first cutout portion 23 is formed in the center in the left-right direction (arrow X direction) at the lower end of the substrate 20. In addition, second cutout portions 24 are formed at positions a certain distance K to the left and right from the center in the left-right direction (arrow X direction) at the lower end of the substrate 20.

[0033] The control circuit formed on the substrate 20 receives the output value of the sensor 40 and determines the ambient temperature based on the output value. When the control circuit determines that the ambient temperature is equal to or higher than a certain temperature, it transmits a fire signal to a receiver (not shown) and controls the light source 50 to light up or blink. The control circuit may be configured to transmit a fire signal to the receiver when there is a temperature change of equal to or higher than a set value in a short period of time, or may transmit temperature information to the receiver and have the receiver determine whether or not there is a fire.

[0034] (Sensor 40) 5 and 6, the sensor 40 has a heat-sensing unit 41 that detects heat, and detects the heat of the airflow that has flowed into the circulation space SP. The heat-sensing unit 41 is composed of, for example, a thermistor whose resistance changes depending on the heat transmitted from the airflow, and converts the temperature change into an electrical signal for output.

[0035] The sensor 40 is composed of, for example, a heat-sensing part 41, a rod-shaped lead part 42 made of a lead wire, a sensor base 44 having two pins attached to the substrate 20, and a connection part 43 connecting the lead part 42 and the sensor base 44. The heat-sensing part 41 is attached to the tip part of the lead part 42, and the heat-sensing part 41 and the lead part 42 are integrally coated. The connection part 43 connects the base end of the lead part 42 to the tip parts of the two pins of the sensor base 44, and is covered with resin or the like. The two pins of the sensor base 44 are fixed to the front surface 21 of the substrate 20 by soldering, and the heat-sensing part 41 is electrically connected to the control circuit of the substrate 20.

[0036] The heat-sensing part 41 is disposed in the flow space SP directly above the center of the top plate opening 61a of the protector 60 in order to detect the heat of the vertical airflow. Specifically, the heat-sensing part 41 is disposed at a preset position in the flow space SP by the sensor base 44 and the lead part 42 connected to the sensor base 44. In the example shown in Figures 5 and 6, the sensor 40 is disposed parallel to the substrate 20 disposed in the vertical direction (arrow Z direction) within the case body 10.

[0037] As described above, since the sensor 40 is composed of a plurality of components, the thickness of the sensor 40 is not constant in the vertical direction, and for example, the connection portion 43 is the thickest. Therefore, in this embodiment, the sensor 40 is disposed in the first cutout portion 23 of the substrate 20. More specifically, as shown in FIGS. 5 and 6, the connection portion 43 of the sensor 40 is disposed in the first cutout portion 23 of the substrate 20. With this configuration, even when a sensor 40 having a non-constant thickness is used, the sensor 40 can be disposed so that the lead portion 42 extends in the vertical direction (arrow Z direction) while preventing the sensor 40 from contacting the substrate 20 at portions other than the sensor base 44.

[0038] The sensor 40 may be configured such that the sensor base 44 is fixed to the lower end of the front surface 21 of the substrate 20 so as to be located on a line extending downward from the substrate 20. In this case, the connection portion 43 of the sensor 40 may be disposed between the lower end of the substrate 20 and the inner surface of the case lid 30, and the first cutout portion 23 can be omitted.

[0039] (light source 50) 9 is a cross-sectional view showing the CC cross section of FIG. 4. The light source 50 is, for example, an LED (Light Emitting Diode) or the like. As shown in FIGS. 5, 8 to 9, the light source 50 is soldered to the front surface 21 of the substrate 20 at an upper portion thereof so that the light emitting surface 51 (see FIG. 9) faces downward. The light source 50 is preferably mounted on the front surface 21 of the substrate 20 at a lower end portion on the central portion 30c side of the case lid 30. By providing the light source 50 in this manner in the vertical direction (arrow Z direction), it is possible to prevent the light emitted from the light source 50 from being blocked by the substrate 20.

[0040] In the example shown in Figs. 2, 5 and 8, two light sources 50 are mounted on the board 20, one light source 50 is disposed to the right of the sensor 40, and the other light source 50 is disposed to the left of the sensor 40. Specifically, as shown in Fig. 5, when the board 20 is viewed from the front, the upper part of the light source 50 is fixed to the front surface 21 of the board 20 at the periphery of the second cutout portion 24 of the board 20 so that at least a part of the light emitting surface 51 does not overlap with the board 20 disposed behind the light source 50. With this configuration, it is possible to prevent the progression of light emitted from the light emitting surface 51 of the light source 50 toward the rear and downward from being blocked by the board 20, and more light can be incident on the central portion 30c compared to a case in which the second cutout portion 24 is not provided.

[0041] In this embodiment, the central portion 30c provided in the case lid 30 is described as being made of a light-transmitting material, but the central portion 30c may be made of a non-light-transmitting material and a light-transmitting hole for emitting light may be provided in the central portion 30c. In this case, the first hole portion 31 may be a light-transmitting hole, or a light-transmitting hole separate from the first hole portion 31 may be provided in the central portion 30c.

[0042] 5, the light source 50 is provided so that the center of the light emitting surface 51 and the center of the second cutout portion 24 coincide with each other in the left-right direction (arrow X direction). That is, the distance between the center position of the sensor 40 and the center position of each light source 50 is the same as the distance K between the center of the first cutout portion 23 and the center of each second cutout portion 24, and is the same for the two light sources 50. It is preferable that the distance (2K) between the two light sources 50 in the left-right direction (arrow X direction) is equal to or smaller than the inner diameter Di2 of the cover portion 64 of the protector 60, i.e., the opening width of the third hole portion 64a. In this case, the light of each light source 50 can be more easily viewed through the first hole portion 31.

[0043] Furthermore, in this embodiment, since the central portion 30c is made of a light-transmitting member, light can be emitted from the central portion 30c through the flow space SP. In addition, in this embodiment, since the first hole portion 31 is made in a cone shape in the central portion 30c made of a light-transmitting member, the light emitted from the light source 50 can be diffused in the central portion 30c.

[0044] When the central portion 30c is made of a light-transmitting member, the distance (2K) between the two light sources 50 in the left-right direction (arrow X direction) may be longer than the opening width Di0 of the first hole portion 31 so that the light from the two light sources 50 enters the case lid 30. This allows the light emitted by the light source 50, particularly light that is intense and travels downward, to be incident on the light-transmitting member of the case lid 30 and diffused, thereby suppressing the directionality of the light.

[0045] In addition, the distance (2K) between the two light sources 50 in the left-right direction (arrow X direction) may be further increased to a dimension larger than the opening width of the top plate opening 61a (the inner diameter Di1 of the top plate 62). This allows the top plate 62 to cover the locally bright part directly below the light source 50 in the central portion 30c.

[0046] In order to allow the light emitted by the light source 50 provided at the lower end of the substrate 20 to be incident on as wide an area as possible of the central portion 30c, it is preferable that there is a certain distance between the lower end of the substrate 20 and the central portion 30c, as shown in FIG. 5.

[0047] (Case body 10) As shown in Fig. 8, the case body 10 (see Fig. 5) has a case outer shell 12 having a box shape with an open bottom, and a substrate holding portion 13 formed on the inner surface of the case outer shell 12 and holding the substrate 20. When the heat detector 100 is installed on the ceiling 200, the outer surface of the case outer shell 12 faces the inner surface of the recess 202 of the ceiling 200 (see Fig. 3).

[0048] As shown in FIG. 8, the board holding portion 13 is provided on the inner surface of each of the left side wall and the right side wall of the case outer shell 12. The board holding portion 13 provided on the right side wall of the case outer shell 12 is composed of two protrusions 13a arranged in the front-rear direction (arrow Y direction) protruding from the inner surface of the right side wall, and a groove portion 13b formed between the two protrusions 13a. The board holding portion 13 provided on the left side wall of the case outer shell 12 is composed of two protrusions 13a arranged in the front-rear direction (arrow Y direction) protruding from the inner surface of the left side wall, and a groove portion 13b formed between the two protrusions 13a. The width of each groove portion 13b is slightly wider than the thickness of the board 20, and the right end portion and the left end portion of the board 20 are fitted into the groove portions 13b of the two board holding portions 13, respectively, so that the board 20 is arranged at a set position within the case body 10.

[0049] Also, as shown in Figure 2, the two protrusions 13a in each substrate holding portion 13 each extend in the vertical direction (arrow Z direction) of the heat detector 100, and also function as a guide for the substrate 20 when the substrate 20 is inserted into the case body 10 through the opening 11.

[0050] As shown in FIG. 8, the center position (represented by point C1) of each groove portion 13b in the front-rear direction (arrow Y direction) is slightly shifted backward from the center position (represented by virtual line L1) of the case outer shell 12 in the front-rear direction (arrow Y direction). By providing the board holding portion 13 in this manner, the board 20 can be arranged slightly rearward of the center position of the case outer shell 12 represented by the virtual line L1 in the case main body 10. Therefore, as shown in FIG. 8, even if the sensor 40 is fixed to the front surface 21 of the board 20, the sensor 40 can be arranged at the center position of the heat detector 100 in the front-rear direction (arrow Y direction). In addition, the light source 50, which is fixed to the front surface 21 of the board 20 like the sensor 40, can also be arranged at approximately the center position of the heat detector 100 in the front-rear direction (arrow Y direction), and can be viewed from the central portion 30c.

[0051] Although not shown, the space in the case body 10 is filled with a filler through the injection port 32 of the case lid 30 during the manufacture of the heat detector 100, and the board 20 on which various electronic components are mounted, the case body 10, and the case lid 30 are fixed together by the filling agent solidifying. The board 20 is also waterproofed by the filling agent solidifying. A transparent or translucent light-transmitting material such as polyurethane is used as the filling agent. The filling agent is preferably provided so that the light source 50 mounted on the board 20 is covered by the filling agent. This allows the light emitted by the light source 50 to be diffused in the filling agent, and prevents the light from being concentrated and incident locally on the central portion 30c.

[0052] 3 and 6, the flow of air currents during a fire will be described. When a fire breaks out in the monitored space, a vertical air current is generated from the source of the fire toward the ceiling 200, and after the vertical air current reaches the ceiling 200, the direction of the air current becomes parallel to the ceiling 200 and flows along the ceiling 200 as a horizontal air current. If the source of the fire is directly below the heat detector 100, the vertical air current reaches the top plate 62 or the cover part 64 of the protector 60. If the source of the fire is not directly below the heat detector 100, all the vertical air currents rising from the source of the fire reach the ceiling 200, flow as a horizontal air current along the ceiling surface 201, reach the heat detector 100, and flow in through the gap G of the support 63. The hot air current that flows into the circulation space SP from the gap G of the support 63 passes through the circulation space SP and flows out from the gap G between other supports 63.

[0053] Of the hot air currents that reach the protector 60 from the source of the fire, those that reach the center of the top plate 62 flow into the circulation space SP from the top plate opening 61a, pass through the circulation space SP, and flow out of the heat detector 100 through the gap G between the other supports 63. Of the hot air currents that reach the protector 60, those that reach the periphery of the top plate opening 61a in the top plate 62 flow along the top plate 62, and a part of them flows into the circulation space SP through the top plate opening 61a. The hot air current that flows into the circulation space SP through the top plate opening 61a passes through the circulation space SP and flows out of the heat detector 100 through the gap G between the supports 63. The remaining hot air currents that flow along the top plate 62 rise from the outer peripheral surface of the top plate 62 to the cover part 64, merge with the hot air current that flows out of the circulation space SP through the gap G between the supports 63, and flow through the ceiling 200.

[0054] Of the hot air current that reaches the protector 60 from the source of the fire, the hot air current that reaches the cover portion 64 travels along the cover portion 64, and when it reaches the vicinity of the pillars 63, it flows into the protector 60 through the gaps G between the pillars 63, passes through the circulation space SP, and flows out from the gaps G between other pillars 63.

[0055] Heat is transferred from the hot air current passing through the center of the circulation space SP to the heat-sensing part 41. When the heat is transferred to the heat-sensing part 41, the control circuit detects a temperature change based on a signal sent to the board 20 via the lead part 42, and a fire signal is sent from the control circuit to a receiver (not shown), and the control circuit drives the light source 50 to emit light.

[0056] Fig. 10 is an explanatory diagram showing a state in which the light source emits light in the heat detector of Fig. 5. In Fig. 10, the dashed arrows represent an example of a group of light rays emitted into the flow space SP through the central portion 30c, among the light emitted by the light source 50. Also, in Fig. 10, the dashed arrows represent an example of a group of light rays emitted to the outside of the heat detector 100 through the second hole portion 61 (see Fig. 2) of the protective portion in the protector 60, among the light emitted into the flow space SP through the central portion 30c.

[0057] The light emitted by the light source 50 is emitted into the circulation space SP in the protector 60 through the circular first hole 31 formed in the central portion 30c, and illuminates the portion of the protector 60 facing the circulation space SP. The light emitted into the circulation space SP is then emitted to the outside of the heat detector 100 through the circular top plate opening 61a formed in the center of the top plate 62 of the protector 60 and the gaps G between the multiple support columns 63 radially arranged on the side surface of the protector 60. Therefore, since light is emitted from the central portion 30c (see FIG. 4) of the heat detector 100, the light emission indicating the operation of the heat detector 100 can be visually recognized from any direction from which the user looks at the sensor 40 as the center. As described above, when the central portion 30c is made of a translucent material, the heat detector 100 can emit light through the central portion 30c without emitting light through the first hole 31. Furthermore, when the central portion 30c is made of a non-translucent material, the user can visually recognize the light emitted from the light source 50 (FIG. 10) through a light-transmitting hole provided in the central portion 30c.

[0058] Moreover, since the central portion 30c is made of a light-transmitting material and the first hole portion 31 is shaped like a mortar, the surface area from which light is emitted at the central portion 30c is increased, and the heat detector 100 is easily visible even when viewed from the side (front, back, left, or right). In this embodiment, the central portion 30c is provided on the case lid 30, and the entire case lid 30 is made of a light-transmitting material, so that there is no need to provide a light guide separately from the case lid 30 as in the conventional case. Moreover, compared to the conventional case where light is guided by an L-shaped light guide, the loss of light can be reduced and light can be used with high efficiency.

[0059] In Fig. 10, two white arrows E1 and E2 respectively represent the user's line of sight with different angles of elevation. Below, components that can be seen by the user will be described for each case. Hereinafter, the elevation angle indicated by the white arrow E1 will be referred to as the first elevation angle, and the elevation angle indicated by the white arrow E2 will be referred to as the second elevation angle. The second elevation angle is an elevation angle smaller than the first elevation angle.

[0060] When a user looks at the heat detector 100 at a first elevation angle indicated by a white arrow E1, the central portion 30c can be seen through the top plate opening 61a of the protector 60, and the emitted light of the light source 50 can be confirmed. When a user looks at the heat detector 100 at a second elevation angle indicated by a white arrow E2, the central portion 30c can be seen through the gaps G (FIG. 2) between the multiple supports 63 of the protector 60. In this case, when a user looks up at the heat detector 100 from the left side as shown in FIG. 10, the right inner surface of the first hole portion 31 having a mortar shape in the central portion 30c can be seen from approximately the front, and the light can be confirmed.

[0061] As described above, in the first embodiment, the heat detector 100 includes the case 80 having a hole (first hole 31) formed on the bottom surface, the board 20 housed in the case 80, the sensor 40 having the heat-sensing part 41, and the protector 60 protecting the heat-sensing part 41. The sensor 40 is attached to the board 20, and the heat-sensing part 41 of the sensor 40 is exposed through the first hole 31 of the case 80. The board 20 is disposed in the case 80 in the up-down direction (direction of the arrow Z). The sensor 40 is disposed parallel to the board 20 or on an extension of the board 20.

[0062] As a result, the substrate 20 is disposed in the vertical direction (arrow Z direction) within the case 80, and the sensor 40 is disposed parallel to the substrate 20 or on an extension of the substrate 20, so that the substrate 20 is disposed approximately perpendicular to the ceiling surface 201. Therefore, compared to the conventional case in which the substrate is disposed parallel to the ceiling surface, it is easier to reduce the size of the heat detector 100 exposed from the ceiling surface 201.

[0063] The embodiment of the present invention is not limited to the above embodiment, and various modifications can be made. For example, the shape of the case outer shell 12 is not limited to the above, and it can be, for example, a cylindrical shape having an upper surface. For example, the case where the entire case lid 30 is made of a light-transmitting material has been described, but only the central portion 30c of the case lid 30 may be made of a light-transmitting material, and the portion other than the central portion 30c of the case lid 30 may be made of a non-light-transmitting material. In addition, the second hole portion 61 is configured by the top plate opening 61a and the gap G, but is not limited to this, and may be configured only by the top plate opening 61a or only by the gap G. The above-mentioned heat detector 100 can also be installed on the side wall of the room. In this case, the heat detector 100 is installed on the side wall so that the protector 60 side of the heat detector 100, i.e., the heat-sensing portion 41 side of the sensor 40, faces the room. Even in this case, the substrate 20 is arranged approximately perpendicular to the side wall which is the installation surface, so that it is easier to reduce the size of the heat detector 100 exposed from the installation surface compared to the conventional case in which the substrate is arranged parallel to the installation surface.

[0064] Embodiment 2 11 is a perspective view showing the appearance of a heat detector according to embodiment 2. Heat detector 100 of embodiment 2 differs from embodiment 1 in that two lid protrusions 33 are provided on case lid 30, and a portion of a plurality of supports 63 is configured with lid protrusions 33. Heat detector 100 of embodiment 2 also differs from embodiment 1 in that band-shaped springs 70 extending outward are provided on the left and right walls of case body 10. Note that the shape of springs 70 is not particularly limited to this.

[0065] When the case body 10 is housed in the recess 202 in the ceiling 200 (see Figure 3), the two springs 70 provided on the case body 10 press the left and right inner surfaces of the recess 202 in the ceiling 200, thereby preventing the case body 10 from falling out of the recess 202 in the ceiling 200.

[0066] The two lid protrusions 33 are provided on the right and left sides of the cone-shaped first hole 31, protruding towards the protector 60. More specifically, the two lid protrusions 33 are provided along the center line of the case lid 30 in the front-rear direction (arrow Y direction) so as to be located directly below the two light sources 50 fixed to the substrate 20. The case lid 30, including the two lid protrusions 33, is made of a light-transmitting member.

[0067] In addition, the cover portion 64 of the protector 60 is provided with two first through holes 64b on the right and left sides of the third hole portion 64a. In addition, the top plate 62 of the protector 60 is provided with two second through holes 62b at positions facing the two first through holes 64b of the cover portion 64. The two lid protrusions 33 extending downward from the case lid 30 are inserted into the first through holes 64b of the cover portion 64 of the protector 60, and are exposed from the protector 60 through the second through holes 62b of the top plate 62. That is, in the heat detector 100 of the second embodiment, the support of the protector 60 is composed of the opaque support 63 and the two lid protrusions 33 made of a translucent member.

[0068] This allows the light from the light source 50 to be guided straight down via the I-shaped lid protrusion 33 provided on the case lid 30 and emitted from the protector 60, making it possible to use the light from the light source 50 more efficiently than when an L-shaped light guide is used as in the conventional case.

[0069] When removing the heat detector 100 from the installation wall, the worker may hold the top plate 62 and the support pillars 63 of the protector 60. For this reason, it is preferable to have a certain number of support pillars or more to ensure the strength of the protector 60. On the other hand, in order to improve the visibility of the heat detector 100 when the light source 50 is emitting light, it is preferable to have the size of the gap G between the support pillars or more. In the heat detector 100 of the second embodiment, a part of the support pillar is configured with two lid protrusions 33 made of a translucent member, so that it is possible to ensure the strength by having a certain number of support pillars or more, while making it easier to see inside the protector 60 and improving visibility. [Explanation of symbols]

[0070] 10 case body, 11 opening, 12 case outer shell, 13 board holding portion, 13a protrusion portion, 13b groove portion, 20 board, 21 front surface, 23 first notch portion, 24 second notch portion, 30 case lid, 30c center portion, 31 first hole portion, 32 inlet, 33 lid protrusion portion, 34 frame member, 40 sensor, 41 heat sensing portion, 42 lead portion, 43 connection portion, 44 sensor base portion, 50 light source, 51 light emitting surface, 60 protector, 61 second hole portion, 61a top plate opening, 62 top plate, 62b second through hole, 63 support, 64 cover portion, 64a third hole portion, 64b first through hole, 70 spring, 80 case, 100 heat detector, 200 ceiling, 201 ceiling surface, 202 Recess, Di0 opening width, Di1 inner diameter, Di2 inner diameter, Do1 outer diameter, Do2 outer diameter, Do3 outer diameter, Ds diameter, G gap, K distance, L1 virtual line, SP flow space.

Claims

1. A case having a hole formed on a bottom surface thereof; a substrate having a plate shape with a width wider than the minimum opening width of the hole, arranged in a vertical direction, and entirely housed in the case; a sensor having a sensor base attached to the substrate, a heat-sensing part exposed through the hole of the case, and an intermediate part extending in a vertical direction and connecting the sensor base and the heat-sensing part; A protector for protecting the heat-sensing unit. heat detector.

2. The intermediate portion has a rod-shaped lead portion connected to the heat-sensing portion and a connection portion that is thicker than the lead portion and connects the lead portion to the sensor base, A cutout portion in which the connection portion of the sensor is disposed is formed at the lower end portion of the substrate. The heat detector according to claim 1.

3. A case having a hole formed on a bottom surface thereof; A substrate housed in the case; a sensor attached to the substrate, the sensor having a lead portion and a heat-sensing portion provided at a tip of the lead portion and exposed through the hole in the case; A protector for protecting the heat-sensing unit, The substrate is arranged in a vertical direction, The sensor is disposed parallel to the substrate or in an extension of the substrate; The substrate is formed with a notch in which a connection portion for the sensor is disposed, and the sensor is disposed so that the lead portion extends in the vertical direction. heat detector.

4. A case having a hole formed on a bottom surface thereof; A substrate housed in the case; a sensor attached to the substrate, the sensor having a lead portion and a heat-sensing portion provided at a tip of the lead portion and exposed through the hole in the case; A protector for protecting the heat-sensing unit, The substrate is arranged in a vertical direction, The sensor is disposed parallel to the substrate; The substrate is eccentrically disposed within the case so that the sensor is located at the center of the case when viewed from below. heat detector.

5. The hole has a cone shape with an opening width gradually increasing from the surface on the lower surface facing the substrate toward the surface on the protector side. A heat detector according to any one of claims 1 to 4.

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