Package Structure

Abstract

To obtain a packaging structure that can suppress the occurrence of electromagnetic field coupling in a closed loop inside a module casing while suppressing an increase in the number of components.SOLUTION: A packaging structure includes a substrate 6 having recesses 6d, 6d, a first transmission system MMIC amplifier 2 mounted in one recess 6d, a second transmission system MMIC amplifier 3 mounted in the other recess 6d, a transmitting / receiving circuit, a module housing 1 made of metal or whose surface is covered with metal and housing the substrate 6 therein, and a plate portion 16 made of metal or whose surface is covered with metal, which is a plate that covers the first transmission system MMIC amplifier 2 and the second transmission system MMIC amplifier 3.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to a package structure with a monolithic microwave integrated circuit amplifier. [Background technology]

[0002] Some transmission and reception modules used in communication or radar systems include a high-frequency amplifier using a monolithic microwave integrated circuit (MMIC), as shown in Patent Document 1. In the following description, a high-frequency amplifier using a monolithic microwave integrated circuit will be referred to as a monolithic microwave integrated circuit amplifier or an MMIC amplifier.

[0003] In such a transmitter / receiver module, radiation from the connection of the monolithic microwave integrated circuit amplifier can cause electromagnetic field coupling in a closed loop inside the module housing, which can cause the transmitter / receiver module to oscillate or deteriorate its frequency characteristics.

[0004] In order to solve this problem, in the prior art, the inside of the module housing was divided by partitions to ensure isolation and suppress the occurrence of electromagnetic field coupling. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2016-116209 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, because the inside of the housing is divided by walls, the boards installed inside the housing also need to be divided into small rooms that fit into the walls, which increases the number of parts, and also causes problems such as a complicated structure of the housing and an increase in the number of connections that connect the divided boards together.

[0007] The present disclosure has been made in consideration of the above, and aims to obtain a packaging structure that can suppress electromagnetic field coupling from occurring in a closed loop inside the module housing while minimizing an increase in the number of parts. [Means for solving the problem]

[0008] In order to solve the above-mentioned problems and achieve the object, the package structure according to the present disclosure includes a substrate having a mounting surface and a first recess and a second recess formed on the mounting surface, and a semiconductor device mounted in the first recess of the substrate. It is a circuit component of the transmission system. a first monolithic microwave integrated circuit amplifier mounted in a second recess of the substrate; A circuit component of a transmission system, which is electrically connected in series to the first monolithic microwave integrated circuit amplifier and is a circuit component different from the first monolithic microwave integrated circuit amplifier. a second monolithic microwave integrated circuit amplifier; a transmitting / receiving circuit mounted on the mounting surface of the substrate and different from the first monolithic microwave integrated circuit amplifier and the second monolithic microwave integrated circuit amplifier; a housing made of metal or having a surface covered with metal and housing the substrate therein; and a transmitting / receiving circuit disposed directly on the mounting surface and different from the first monolithic microwave integrated circuit amplifier. The first recess is and second monolithic microwave integrated circuit amplifier The second recess is and a shielding portion which is a metal plate covering the insulating film and which is made of metal or has a surface covered with metal. Effect of the Invention

[0009] The present disclosure has an effect of obtaining a package structure that can suppress an increase in the number of parts while suppressing the occurrence of electromagnetic field coupling in a closed loop inside the module housing. [Brief description of the drawings]

[0010] [Figure 1]FIG. 1 is a diagram showing an internal configuration of a transmitting / receiving module having a package structure according to a first embodiment of the present invention; [Diagram 2] Cross-sectional view taken along line II-II in FIG. [Diagram 3] Functional block diagram of a transmission / reception module according to the first embodiment [Figure 4] FIG. 13 is a diagram showing an internal configuration of a transmitting / receiving module having a package structure according to a second embodiment of the present invention; [Diagram 5] Cross-sectional view taken along line VV in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, a package structure according to an embodiment of the present disclosure will be described in detail with reference to the drawings.

[0012] Embodiment 1 Fig. 1 is a diagram showing an internal configuration of a transceiver module having a package structure according to the first embodiment. Fig. 2 is a cross-sectional view taken along line II-II shown in Fig. 1. Fig. 3 is a functional block diagram of the transceiver module according to the first embodiment. In Fig. 3, protection circuits for an attenuator, a phase shifter, and an LNA (Low Noise Amplifier) ​​are omitted because they are not necessary for explaining the present disclosure.

[0013] The transceiver module 50 includes a module housing 1. The module housing 1 is provided with a housing section 1a capable of housing circuit components, which will be described later.

[0014] The circuit components accommodated in the accommodation section 1a of the module housing 1 include a first transmitting MMIC (Monolithic Microwave Integrated Circuit) amplifier 2, a second transmitting MMIC amplifier 3, an MMIC transmit / receive switch 4, a receiving MMIC amplifier 5, a bias application section 7, a first RF connector 8, a second RF connector 9, and a transmitting / receiving circuit 10. Here, the MMIC transmit / receive switch 4 may include a phase shifter.

[0015] The above-mentioned circuit components are mounted on a mounting surface 6a of an MMIC substrate 6 housed in the housing portion 1a. The MMIC substrate 6 is, for example, a ceramic substrate. The first transmitting MMIC amplifier 2 and the MMIC substrate 6 are connected by a wire 11. The second transmitting MMIC amplifier 3 and the MMIC substrate 6 are also connected by a wire 11.

[0016] The housing 1a is provided with a metal pillar 15 that is a blocking section. As shown in Fig. 1, the pillar 15 is provided between the first transmitting MMIC amplifier 2 and the second transmitting MMIC amplifier 3. A space is provided between the pillar 15 and a side wall surface 1b that surrounds the MMIC substrate 6 when viewed along a direction perpendicular to the mounting surface 6a among the inner wall surfaces that constitute the housing 1a. In other words, the pillar 15 is not a wall that divides the inside of the housing 1a.

[0017] As shown in Fig. 2, the pillar portion 15 extends from the bottom surface 1d, which is a second wall surface facing the back surface 6b of the mounting surface 6a, toward the top surface 1c, which is a first wall surface facing the mounting surface 6a among the inner wall surfaces constituting the storage portion 1a. The pillar portion 15 is formed integrally with the bottom surface 1d. The pillar portion 15 may be formed integrally with the top surface 1c and extending toward the bottom surface 1d, or may be formed separately from the top surface 1c and the bottom surface 1d.

[0018] The MMIC substrate 6 has holes 6c through which the pillars 15 penetrate. If the pillars 15 extend from the top surface 1c toward the bottom surface 1d and are formed to a length that does not penetrate the MMIC substrate 6, it is not necessary to form the holes 6c in the MMIC substrate 6. If the pillars 15 are formed to a length that does not penetrate the MMIC substrate 6, it is preferable that the tips of the pillars 15 contact the mounting surface 6a of the MMIC substrate 6.

[0019] In the transmission and reception module 50, for example, radiation from the second transmission system MMIC amplifier 3 generates an electromagnetic field 20 that couples with the wire 11 connecting the first transmission system MMIC amplifier 2 and the MMIC substrate 6. In the first embodiment, the column portion 15 provided between the first transmission system MMIC amplifier 2 and the second transmission system MMIC amplifier 3 ensures isolation, thereby weakening the electromagnetic field 20 that couples with the wire 11. This makes it possible to suppress electromagnetic field coupling from occurring in a closed loop inside the module housing 1.

[0020] Furthermore, since the pillar portion 15 is not a wall that divides the accommodation portion 1a of the module housing 1, there is no need to divide the MMIC substrate 6 accommodated in the accommodation portion 1a. This makes it possible to reduce the number of parts. Furthermore, compared to a case where a wall is provided to divide the accommodation portion 1a of the module housing 1, the structure of the module housing 1 can be simplified in the transceiver module 50 according to the first embodiment. Furthermore, if the MMIC substrate 6 is divided, a connection portion is required to connect the substrates together. However, since there is no need to divide the MMIC substrate 6 in the transceiver module 50 according to the first embodiment, the above-mentioned connection portion is also unnecessary.

[0021] The entire column 15 may be made of metal, or the surface of a base made of a material other than metal may be covered with metal.

[0022] Embodiment 2 Fig. 4 is a diagram showing an internal configuration of a transceiver module having a package structure according to the second embodiment. Fig. 5 is a cross-sectional view taken along line VV shown in Fig. 4. Note that the same components as those in the first embodiment are denoted by the same reference numerals and detailed description thereof will be omitted.

[0023] In the transmission and reception module 51 according to the second embodiment, a metal plate portion 16 serving as a blocking portion is provided on the mounting surface 6a of the MMIC substrate 6. The plate portion 16 is provided between the first transmitting system MMIC amplifier 2 and the second transmitting system MMIC amplifier 3, and covers the first transmitting system MMIC amplifier 2 and the second transmitting system MMIC amplifier 3 from the mounting surface 6a side. To prevent the first transmitting system MMIC amplifier 2 and the second transmitting system MMIC amplifier 3 from coming into direct contact with the plate portion 16, a recess 6d is formed on the mounting surface 6a of the MMIC substrate 6 at a portion where the first transmitting system MMIC amplifier 2 and the second transmitting system MMIC amplifier 3 are to be mounted.

[0024] Furthermore, a space is provided between side wall surface 1b, which is one of the inner wall surfaces constituting housing portion 1a and surrounds MMIC substrate 6 when viewed along a direction perpendicular to mounting surface 6a, and plate portion 16. That is, similar to column portion 15 described in the first embodiment, plate portion 16 is not a wall that divides the interior of housing portion 1a.

[0025] In the second embodiment, the plate portion 16 provided between the first transmitting system MMIC amplifier 2 and the second transmitting system MMIC amplifier 3 and covering the first transmitting system MMIC amplifier 2 and the second transmitting system MMIC amplifier 3 ensures isolation, thereby weakening the electromagnetic field 20 that couples with the wire 11. This makes it possible to suppress electromagnetic field coupling from occurring in a closed loop inside the module housing 1.

[0026] Furthermore, since the pillar portion 15 is not a wall that divides the accommodation portion 1a of the module housing 1, there is no need to divide the MMIC substrate 6 accommodated in the accommodation portion 1a. This makes it possible to reduce the number of parts. Furthermore, compared to a case where a wall is provided to divide the accommodation portion 1a of the module housing 1, the structure of the module housing 1 can be simplified in the transceiver module 51 according to the second embodiment. Furthermore, if the MMIC substrate 6 is divided, a connection portion is required to connect the substrates together. However, since there is no need to divide the MMIC substrate 6 in the transceiver module 51 according to the second embodiment, the above-mentioned connection portion is also unnecessary.

[0027] The plate portion 16 may be entirely made of metal, or the surface of a substrate made of a material other than metal may be covered with metal.

[0028] The configurations shown in the above embodiments are merely examples, and may be combined with other known technologies, or the embodiments may be combined with each other. Also, parts of the configurations may be omitted or modified without departing from the spirit of the invention. [Explanation of symbols]

[0029] 1 module housing, 1a storage section, 1b side wall surface, 1c top surface, 1d bottom surface, 2 first transmitting system MMIC amplifier, 3 second transmitting system MMIC amplifier, 4 MMIC transmit / receive switch, 5 receiving system MMIC amplifier, 6 MMIC substrate, 6a mounting surface, 6b back surface, 6c hole, 6d recess, 7 bias application section, 8 first RF connector, 9 second RF connector, 10 transmitting / receiving circuit, 15 pillar section, 16 plate section, 50, 51 transmitting / receiving module.

Claims

1. a substrate having a mounting surface and a first recess and a second recess formed in the mounting surface; a first monolithic microwave integrated circuit amplifier which is a circuit component of a transmission system mounted in the first recess of the substrate; a second monolithic microwave integrated circuit amplifier which is a circuit component of a transmission system mounted in the second recess of the substrate and is electrically connected in series with the first monolithic microwave integrated circuit amplifier and is a circuit component different from the first monolithic microwave integrated circuit amplifier; a transmitting / receiving circuit mounted on the mounting surface of the substrate and different from the first monolithic microwave integrated circuit amplifier and the second monolithic microwave integrated circuit amplifier; a housing made of metal or having a surface covered with metal, the housing housing the substrate therein; a shielding portion which is a plate made of metal or has a surface covered with metal, the shielding portion being arranged directly on the mounting surface and covering the first recess in which the first monolithic microwave integrated circuit amplifier is mounted and the second recess in which the second monolithic microwave integrated circuit amplifier is mounted.

2. A package structure as described in claim 1, characterized in that the transmitting / receiving circuit has a circulator that outputs microwaves amplified by a second monolithic microwave integrated circuit amplifier and receives the input microwaves.

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