Joint member, liquid ejection head, liquid ejection unit, and liquid ejection device

Abstract

To avoid a situation in which proper jointing is inhibited because an adhesive protrudes from a recess, even when dimensions of the recess on a joint surface are small.SOLUTION: In a joint member, a joint component 10 is joined to a component 20 to be joined. The component to be joined has a recess 24 provided on a joint surface 20a to which the joint component is to be joined. A base part 26, the height of which is smaller in dimension than the depth of the recess, is provided on a bottom surface of the recess. The adhesion held on the base part makes the joint component joined to the component to be joined.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The present invention relates to a joint member, a liquid ejection head, a liquid ejection unit, and an apparatus for ejecting liquid. [Background technology]

[0002] Conventionally, a joining member in which a joining part is joined to a joined part is known. For example, Patent Document 1 discloses a liquid ejection head in which a nozzle plate (joining part) having a nozzle is joined to an actuator substrate including a flow path member forming an individual liquid chamber communicating with the nozzle. This head has a recess in the joining surface of the actuator substrate to which the nozzle plate is joined, and an ultraviolet-curing adhesive is applied to the bottom surface of the recess so that it protrudes from the opening surface of the recess. Thereafter, the nozzle plate is aligned with the joining surface of the actuator substrate, and the adhesive is irradiated with ultraviolet light to harden it, thereby joining the nozzle plate to the actuator substrate. Summary of the Invention [Problem to be solved by the invention]

[0003] However, as the joining members become smaller, the dimensions of the recesses that can be formed on the joining surfaces become smaller, which poses a problem that the adhesive may overflow from the recesses and prevent proper joining. [Means for solving the problem]

[0004] In order to solve the above-mentioned problems, the present invention provides a joining member in which a joining part is joined to a joined part, the joined part having a recess on a joining surface to which the joining part is joined, a base portion on a bottom surface of the recess that is lower than the depth of the recess, and an adhesive held on the base portion. In addition, another adhesive is applied around the recess on the joining surface. The joining part is joined to the joined part by The adhesive held on the base is a photocurable adhesive, and the other adhesive held on the joining surface is a thermosetting adhesive. It is characterized by: Effect of the Invention

[0005] According to the present invention, even if the dimensions of the recess on the bonding surface are small, it is possible to prevent the adhesive from spilling out of the recess and hindering proper bonding. [Brief description of the drawings]

[0006] [Figure 1] FIG. 2 is an external perspective view of a liquid ejection head according to an embodiment. [Diagram 2] FIG. [Diagram 3] FIG. [Figure 4] FIG. 2 is an exploded perspective view of the liquid ejection head excluding a frame member. [Diagram 5] FIG. 2 is a cross-sectional perspective view illustrating a flow path portion of the liquid ejection head. [Figure 6] FIG. 2 is an enlarged perspective sectional view of a flow path portion of the liquid ejection head; [Figure 7] FIG. 4 is a plan view illustrating a flow path portion of the liquid ejection head. [Figure 8] FIG. 2 is a plan view of the liquid ejection head as viewed from the nozzle plate side. [Figure 9] 9 is an enlarged plan view of a portion surrounded by a dashed line indicated by reference symbol B in FIG. 8, of the bonding surface of the individual flow path member to which the nozzle plate is bonded. [Figure 10] FIG. 10 is a cross-sectional view taken along the line A-A' in FIG. [Figure 11] 1A is a cross-sectional view showing the state of the adhesive on the base before bonding, and FIG. 1B is a cross-sectional view showing the state of the adhesive on the base after bonding. [Figure 12] FIG. 11 is an enlarged plan view of a portion of a bonding surface of an individual flow path member in a modified example. [Figure 13] FIG. 13 is a cross-sectional view taken along the line A-A' in FIG. [Figure 14] FIG. 13 is a plan view showing an example in which a protruding portion for preventing adhesive from flowing out is provided on a wall portion of a modified example. [Figure 15] FIG. 13 is a plan view showing an example in which a gap is provided between the wall portion and the base portion in a modified example. [Figure 16] FIG. 2 is an exploded perspective view of a head module according to the embodiment. [Figure 17]FIG. 2 is an exploded perspective explanatory view of the head module according to the embodiment, as viewed from the nozzle surface side. [Figure 18] FIG. 1 is a schematic explanatory diagram of a printing apparatus according to an embodiment. [Figure 19] FIG. 2 is a plan view illustrating an example of a head unit of a printing device. [Figure 20] FIG. 1 is a plan view illustrating a main portion of an example of a printing device. [Figure 21] FIG. 2 is a side view illustrating a main part of an example of a printing device. [Figure 22] FIG. 2 is a plan view illustrating a main portion of an example of a liquid ejection unit. [Figure 23] FIG. 2 is a front view illustrating an example of a liquid ejection unit. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] Hereinafter, an embodiment in which the present invention is applied to a liquid ejection head provided in an apparatus for ejecting liquid will be described. FIG. 1 is an explanatory perspective view showing the appearance of a liquid ejection head according to the present embodiment. FIG. 2 is an exploded perspective view of the liquid ejection head. FIG. 3 is a cross-sectional perspective view of the liquid ejection head. FIG. 4 is an exploded perspective view of the liquid ejection head excluding a frame member. FIG. 5 is a cross-sectional perspective view illustrating a flow path portion of the liquid ejection head. FIG. 6 is an enlarged perspective cross-sectional view of a flow path portion of the liquid ejection head. FIG. 7 is a plan view illustrating a flow path portion of the liquid ejection head.

[0008] The liquid ejection head 1 of this embodiment comprises a nozzle plate 10, a flow path plate (individual flow path member) 20, a vibration plate member 30, a common flow path member 50, a damper member 60, a frame member 80, and a substrate (flexible wiring substrate) 101 on which a drive circuit 102 is mounted.

[0009] A plurality of nozzles 11 for ejecting liquid are provided on the nozzle plate 10. The plurality of nozzles 11 are arranged in a two-dimensional matrix, and are aligned in three directions, a first direction F, a second direction S, and a third direction T, as shown in FIG.

[0010] The individual flow path member 20 forms a plurality of pressure chambers (individual liquid chambers) 21 each communicating with the plurality of nozzles 11, a plurality of individual supply flow paths 22 each communicating with the plurality of pressure chambers 21, and a plurality of individual recovery flow paths 23 each communicating with the plurality of pressure chambers 21. One pressure chamber 21 and the individual supply flow path 22 and individual recovery flow path 23 communicating therewith are collectively referred to as an individual flow path 25.

[0011] The vibration plate member 30 forms a vibration plate 31 which is a deformable wall surface of the pressure chamber 21, and a piezoelectric element 40 is integrally provided with the vibration plate 31. The vibration plate member 30 is also formed with a supply side opening 32 which communicates with the individual supply flow path 22, and a recovery side opening 33 which communicates with the individual recovery flow path 23. The piezoelectric element 40 is a pressure generating means which deforms the vibration plate 31 to pressurize the liquid in the pressure chamber 21.

[0012] The individual flow path member 20 and the diaphragm member 30 are not limited to being separate members. For example, the individual flow path member 20 and the diaphragm member 30 can be integrally formed of the same member by using an SOI (Silicon On Insulator) substrate. That is, an SOI substrate in which a silicon oxide film, a silicon layer, and a silicon oxide film are formed in this order on a silicon substrate can be used to form the individual flow path member 20, and the diaphragm 31 can be formed of the silicon oxide film, the silicon layer, and the silicon oxide film. In this configuration, the layer configuration of the silicon oxide film, the silicon layer, and the silicon oxide film of the SOI substrate becomes the diaphragm member 30. In this way, the diaphragm member 30 includes one formed of a material formed on the surface of the individual flow path member 20.

[0013] The common flow path member 50 forms a plurality of common supply flow path tributaries 52 leading to two or more individual supply flow paths 22 and a plurality of common recovery flow path tributaries 53 leading to two or more individual recovery flow paths 23, which are alternately adjacent to each other in the second direction S of the nozzle 11.

[0014] The common flow path member 50 is formed with a through hole which serves as a supply port 54 communicating between the supply side opening 32 of the individual supply flow path 22 and the common supply flow path tributary 52, and a through hole which serves as a recovery port 55 communicating between the recovery side opening 33 of the individual recovery flow path 23 and the common recovery flow path tributary 53.

[0015] In addition, the common flow path member 50 forms one or more common supply flow path main streams 56 that communicate with the multiple common supply flow path tributaries 52, and one or more common return flow path main streams 57 that communicate with the multiple common return flow path tributaries 53.

[0016] The damper member 60 has a supply side damper 62 facing (opposing) the supply port 54 of the common supply flow path branch 52 and a recovery side damper 63 facing (opposing) the recovery port 55 of the common recovery flow path branch 53.

[0017] Here, the common supply flow path branch 52 and the common recovery flow path branch 53 are formed by sealing grooves arranged alternately in the common flow path member 50, which is the same member, with a supply side damper 62 or a recovery side damper 63 of a damper member 60. Note that it is preferable to use a metal thin film or an inorganic thin film that is resistant to organic solvents as the damper material of the damper member 60. The thickness of the supply side damper 62 and the recovery side damper 63 of the damper member 60 is preferably 10 μm or less.

[0018] Next, the joining member of this embodiment will be described. In this embodiment, a joining member is constituted by joining a nozzle plate 10, which is a joining component, to an individual flow path member 20, which is a joined component, with an adhesive 90. Here, the surface of the individual flow path member 20 that is joined to the nozzle plate 10 is referred to as a joining surface 20a.

[0019] 8 is a plan view of the liquid ejection head 1 of this embodiment as viewed from the nozzle plate 10 side. Note that the nozzles 11 are omitted from the illustration. FIG. 9 is an enlarged plan view of a portion surrounded by a dashed line indicated by reference symbol B in FIG. 8, of the bonding surface 20a of the individual flow path member 20 to which the nozzle plate 10 is bonded. FIG. 10 is a cross-sectional view taken along line AA' in FIG. The member indicated by the reference numeral 15 is a nozzle cover.

[0020] The individual flow path member 20 has recesses 24 that open to the bonding surface 20a side near the four corners of the bonding surface 20a with the nozzle plate 10. The recesses 24 in this embodiment are provided on the outer circumferential edge portion of the bonding surface 20a, and the recess side on the outer circumferential edge side also opens to the side surface 20b of the individual flow path member 20.

[0021] When bonding the individual flow path member 20 and the nozzle plate 10, in this embodiment, an adhesive 91 for temporary bonding is applied into each of the recesses 24 at the four corners of the bonding surface 20a, and another adhesive 90 for actual bonding is applied to predetermined locations on the bonding surface 20a of the individual flow path member 20. For example, a photocurable adhesive, particularly an ultraviolet-curable adhesive, can be suitably used as the adhesive 91 for temporary bonding.

[0022] When an ultraviolet-curing adhesive is used as the adhesive 91 for temporary bonding applied inside the recess 24, it is necessary to irradiate the ultraviolet-curing adhesive in the recess 24 with ultraviolet rays after positioning the nozzle plate 10 on the bonding surface 20a of the individual flow path member 20. In this embodiment, since the side of the recess is opened to the side surface 20b of the individual flow path member 20, even after positioning the nozzle plate 10 on the bonding surface 20a of the individual flow path member 20, ultraviolet rays can be easily irradiated to the ultraviolet-curing adhesive in the recess 24 from the side surface 20b of the individual flow path member 20.

[0023] Any adhesive 90 for the main bonding can be used depending on the required mechanical strength, liquid contact, elastic modulus, and adhesion to the parts. Examples include epoxy resin adhesives, urethane resin adhesives, and elastomer resin adhesives. In particular, a thermosetting adhesive is preferable as the adhesive 90 for the main bonding. Methods for applying the adhesive 90 include thin film printing, spray application, and dispensing.

[0024] After the nozzle plate 10 is temporarily joined to the individual flow path member 20 with the temporary joining adhesive 91, a heat treatment is performed to harden the thermosetting adhesive for main joining 90. During this heat treatment, it is necessary to prevent the positioned nozzle plate 10 from moving relative to the joining surface 20a of the individual flow path member 20, so in this embodiment, the nozzle plate 10 is temporarily joined in advance with the temporary joining adhesive 91.

[0025] For temporary bonding, the adhesive 91 supplied into the recess 24 needs to be held in the recess 24 so as to overflow from the opening surface of the recess 24 (so as to overflow above the bonding surface 20a). That is, it is necessary to supply an amount of adhesive 91 sufficient for the adhesive 91 to be held in a state where it overflows from the opening surface of the recess 24.

[0026] Here, as the liquid ejection head 1 becomes smaller, the area in which the recesses 24 can be formed on the bonding surface 20a of the individual flow path member 20 becomes smaller, so that it is necessary to reduce the dimensions of the recesses 24 (the opening area of ​​the recesses 24 when viewed from the normal direction of the bonding surface 20a). As a result, when attempting to supply an amount of adhesive 91 sufficient to hold the adhesive 91 in a state where it protrudes from the opening surface of the recesses 24 into the recesses 24, the adhesive droplets 91 become larger than the opening of the recesses 24, and the adhesive 91 protrudes from the recesses 24.

[0027] When the adhesive 91 is appropriately supplied onto the bottom surface of the recess 24, the adhesive 91 maintains a rounded, bulging shape due to its own surface tension due to the influence of wettability, and can have a height sufficient to protrude beyond the opening surface of the recess 24. However, if the adhesive 91 overflows from the recess 24, the surface tension of the adhesive 91 collapses, and the adhesive 91 flows inside the recess 24 and flows out from the side surface 20b of the individual flow path member 20, making it impossible to perform temporary bonding appropriately. Furthermore, if the adhesive 91 overflows from the recess 24, the adhesive 91 will be mixed with the adhesive 90 for main bonding, which may reduce the adhesiveness of the adhesive 90 for main bonding and reduce the bonding strength.

[0028] Even if the droplet of adhesive 91 is smaller than the opening of recess 24, if there is not a sufficient margin in the distance between the inner wall surface of recess 24 and adhesive 91, the adhesive 91 may come into contact with the inner wall surface of recess 24 due to an error in the amount of adhesive 91 supplied or an error in the supply position of adhesive 91. In this case, the surface tension of the adhesive 91 collapses, and the adhesive 91 flows inside recess 24 and flows out from the side surface 20b of the individual flow path member 20, making it impossible to perform temporary bonding appropriately.

[0029] 9 and 10, in this embodiment, a pedestal 26 having a height h2 lower than the depth h1 of the recess 24 is provided on the bottom surface of the recess 24, and an adhesive 91 is supplied to the upper surface of the pedestal 26 to hold it in place. For example, a method of forming such a pedestal 26 may be a method of etching such that the pedestal 26 remains on the bottom surface of the pedestal 26 when the step of forming the recess 24 in the individual flow path member 20 is performed by etching. Another example is a method of later attaching the pedestal 26 to the bottom surface of the recess 24 after the recess 24 is formed in the individual flow path member 20. Note that the method of forming the pedestal 26 is not limited to these methods.

[0030] In the conventional configuration in which adhesive 91 is supplied onto the bottom surface of recess 24 that does not have pedestal 26 and held thereon, an amount of adhesive 91 is required to make the height of adhesive 91 higher than the depth h1 of recess 24. In contrast, in this embodiment, the pedestal 26 is raised by the height h2, and the height required for adhesive 91 can be reduced by the height of h1-h2. As a result, with a smaller amount of adhesive 91 than in the conventional configuration, adhesive 91 can be held so as to protrude from the opening surface of recess 24, as shown in FIG. 11(a). For example, when the height h2 of pedestal 26 is 1 / 2 the depth h1 of the recess (h2=h1 / 2), the amount (volume) of adhesive 91 required can be approximately 1 / 8 of that in the conventional configuration.

[0031] By reducing the amount of adhesive 91 required in this way, it is possible to prevent the adhesive 91 from spilling out of the recess 24 or flowing out of the recess 24, and an appropriate temporary bond is achieved as shown in Fig. 11(b). It is also possible to prevent the adhesive 91 from mixing with the adhesive 90 for main bonding, thereby preventing a decrease in the adhesiveness of the adhesive 90 for main bonding, which would result in a decrease in bonding strength.

[0032] It is also possible to achieve a state in which the adhesive 91 protrudes from the opening surface of the recess 24 with a small amount of adhesive 91 by forming the recess 24 shallow without providing the pedestal portion 26 within the recess 24. However, the recess 24 of the individual flow path member 20 is formed in the same process as other processed parts such as the pressure chamber (individual liquid chamber) 21 and the individual flow paths 25 provided in the individual flow path member 20, and there are restrictions on changing the depth of the recess 24. Therefore, it is desired that the adhesive 91 protrudes from the opening surface of the recess 24 with a small amount of adhesive 91 without changing the depth of the recess 24.

[0033] [Modifications] Next, a modification of the liquid ejection head 1 of the above-described embodiment will be described. FIG. 12 is an enlarged plan view of a portion of the bonding surface 20a of the individual flow path member 20 in this modified example. FIG. 13 is a cross-sectional view taken along line AA' in FIG.

[0034] In this modification, a wall portion 27 is provided on the bottom surface of the recess 24 in the above-described embodiment so as to surround the periphery of the base portion 26. This wall portion 27 has a height equal to or less than the depth h1 of the recess 24, and in this modification, has the same height as the depth h1 of the recess 24. The wall portion 27 having the same height as the depth h1 of the recess 24 has the advantage of simplifying the manufacturing process.

[0035] 11, the wall portion 27 is chipped at a portion facing the open recess side (the side surface 20b of the individual flow path member 20), and the wall portion 27 is interposed between the base portion 26 and the inner wall surface of the recess 24 at other three locations. As a result, even if an excessive amount of adhesive 91 is supplied to the base portion 26, the adhesive 91 is blocked by the wall portion 27, and it is possible to prevent the adhesive 91 from flowing beyond the inner wall surface of the recess 24 and onto the joining surface 20a of the individual flow path member 20. Therefore, it is possible to more stably prevent the adhesive 91 from mixing with the adhesive 90 for main bonding on the joining surface 20a, and it is possible to stably prevent a situation in which the adhesiveness of the adhesive 90 for main bonding is reduced and the joining strength is reduced.

[0036] Moreover, the wall portion 27 of this modified example is provided so as to have a gap between it and the inner wall surface of the recess 24. As a result, even if the adhesive 91 flows out beyond the wall portion 27, the flowed-out adhesive 91 is held in the gap between the wall portion 27 and the inner wall surface of the recess 24, and is prevented from flowing out beyond the inner wall surface of the recess 24 onto the joining surface 20a.

[0037] In addition, since the wall portion 27 in this modified example is missing a portion facing the open recess side (the side surface 20b of the individual flow path member 20) and is open, the wall portion 27 does not get in the way when ultraviolet light is applied to the adhesive 91 (ultraviolet-curing adhesive) on the base portion 26.

[0038] Furthermore, because the portion of the wall portion 27 is thus missing and open, if the adhesive 91 flows out from above the base portion 26, the adhesive 91 flows out from the missing portion of the wall portion 27 and flows toward the side surface 20b of the individual flow path member 20. This makes it possible to more stably prevent the flowing adhesive 91 from mixing with the adhesive 90 for main bonding on the bonding surface 20a, and stably suppress a situation in which the adhesiveness of the adhesive 90 for main bonding is reduced and the bonding strength is reduced.

[0039] In this modified example, as shown in Fig. 14, an outflow suppression portion that suppresses outflow of the adhesive 91 may be provided at the missing portion of the wall portion 27. In the example of Fig. 13, a protruding portion 27a is provided as an outflow suppression portion so as to block a part of the missing portion of the wall portion 27. With this, when the adhesive 91 leaks out from above the base portion 26, the adhesive 91 is less likely to leak out from the missing portion of the wall portion 27, and the amount of adhesive 91 that flows out from the side surface 20b of the individual flow path member 20 can be suppressed. This makes it possible to suppress adverse effects (such as impeding the joining of the nozzle cover 15) of the adhesive 91 flowing out from the side surface 20b of the individual flow path member 20.

[0040] 15, a gap may be provided between the wall portion 27 and the base portion 26. With this, even if the adhesive 91 flows out from the top of the base portion 26, the flowed-out adhesive 91 is held in the gap between the base portion 26 and the wall portion 27, and is prevented from flowing out beyond the wall portion 27.

[0041] Next, an example of a head module including the liquid ejection head 1 of this embodiment will be described with reference to FIGS. FIG. 16 is an exploded perspective view illustrating the head module of the present embodiment. FIG. 17 is an exploded perspective explanatory diagram of the head module of this embodiment as viewed from the nozzle surface side.

[0042] The head module 100 includes a liquid ejection head (hereinafter also simply referred to as a "head") 1 that ejects liquid, a base member 103 that holds the multiple heads 1, and a cover member 113 that serves as a nozzle cover 15 for the multiple heads 1. The head module 100 also includes a heat dissipation member 104, a manifold 105 that forms a flow path that supplies liquid to the multiple heads 1, a printed circuit board (PCB) 106 that connects to the flexible wiring member 101, and a module case 107.

[0043] Next, an example of a liquid ejecting device according to the present invention will be described with reference to FIGS. FIG. 18 is a schematic explanatory diagram of a printing apparatus, which is an inkjet recording apparatus serving as an apparatus for discharging liquid in this embodiment. FIG. 19 is an explanatory plan view of an example of a head unit of a printing device of this embodiment.

[0044] The printing device 500, which is a device for ejecting this liquid, is equipped with an input means 501 for inserting a continuous body 510, a guide and conveying means 503 for guiding and conveying the continuous body 510 introduced from the input means 501 to a printing means 505, a printing means 505 for ejecting liquid onto the continuous body 510 to perform printing to form an image, a drying means 507 for drying the continuous body 510, and an ejection means 509 for ejecting the continuous body 510.

[0045] The continuous web 510 is sent out from a main winding roller 511 of the carry-in means 501, guided and transported by the rollers of the carry-in means 501, the guide and transport means 503, the drying means 507, and the carry-out means 509, and taken up by a take-up roller 591 of the carry-out means 509. In the printing means 505, the continuous web 510 is transported on a transport guide member 559 facing the head unit 550, and an image is printed by liquid ejected from the head unit 550.

[0046] In a printing device 500 of this embodiment, a head unit 550 includes the two head modules 100A and 100B according to this embodiment described above, mounted on a common base member 552.

[0047] When the direction in which the heads 1 are lined up in the direction perpendicular to the transport direction of the head modules 100A and 100B is defined as the head arrangement direction, the head rows 1A1 and 1A2 of the head module 100A eject liquid of the same color. Similarly, the head rows 1B1 and 1B2 of the head module 100A are grouped together, the head rows 1C1 and 1C2 of the head module 100B are grouped together, and the head rows 1D1 and 1D2 are grouped together, and each ejects liquid of the required color.

[0048] Next, another example of a printing apparatus as a liquid ejecting apparatus according to the present invention will be described with reference to FIGS. FIG. 20 is an explanatory plan view of the main part of the printing apparatus of this embodiment. FIG. 21 is an explanatory side view of the main part of the printing apparatus of this embodiment.

[0049] The printing device 500 of this example is a serial type device, and the carriage 403 is reciprocated in the main scanning direction by a main scanning movement mechanism 493. The main scanning movement mechanism 493 includes a guide member 401, a main scanning motor 405, a timing belt 408, etc. The guide member 401 is hung between left and right side plates 491A and 491B to movably hold the carriage 403. The carriage 403 is reciprocated in the main scanning direction by the main scanning motor 405 via a timing belt 408 hung between a drive pulley 406 and a driven pulley 407.

[0050] This carriage 403 is equipped with a liquid ejection unit 440 that integrates a head 1, which is a droplet ejection head according to the present invention, and a head tank 441. The head 1 of the liquid ejection unit 440 ejects liquid of each color, for example, yellow (Y), cyan (C), magenta (M), and black (K). The liquid ejection head 1 has a nozzle row made up of a plurality of nozzles arranged in a sub-scanning direction perpendicular to the main scanning direction, and is mounted with the ejection direction facing downward. The liquid ejection head 1 is connected to a liquid circulation device, and liquid of the required color is circulated and supplied.

[0051] The printing device 500 includes a transport mechanism 495 for transporting the paper 410. The transport mechanism 495 includes a transport belt 412 as a transport means, and a sub-scanning motor 416 for driving the transport belt 412. The transport belt 412 attracts the paper 410 and transports it at a position facing the head 1. The transport belt 412 is an endless belt that is stretched between a transport roller 413 and a tension roller 414. The transport roller 413 can be attracted by electrostatic attraction or air suction. The transport belt 412 moves in a circular motion in the sub-scanning direction by the transport roller 413 being rotated and driven by the sub-scanning motor 416 via a timing belt 417 and a timing pulley 418.

[0052] Furthermore, a maintenance and recovery mechanism 420 that maintains and recovers the liquid ejection head 1 is disposed on one side of the carriage 403 in the main scanning direction, beside the conveyor belt 412. The maintenance and recovery mechanism 420 is composed of, for example, a cap member 421 that caps the nozzle face of the head 1, a wiper member 422 that wipes the nozzle face, and the like. Furthermore, the main scanning movement mechanism 493, the maintenance and recovery mechanism 420, and the conveyor mechanism 495 are attached to a housing that includes side plates 491A and 491B, and a back plate 491C.

[0053] In the printing device 500 configured in this manner, the paper 410 is fed onto and adsorbed to the conveyor belt 412, and the paper 410 is conveyed in the sub-scanning direction by the circular movement of the conveyor belt 412. Then, by driving the head 1 in response to an image signal while moving the carriage 403 in the main scanning direction, liquid is ejected onto the stationary paper 410 to form an image.

[0054] Next, another example of the liquid discharge unit according to the present invention will be described with reference to FIG. FIG. 22 is a plan view illustrating the main parts of the liquid discharge unit of this embodiment.

[0055] This liquid ejection unit 440 is composed of a housing portion composed of side plates 491A, 491B and a back plate 491C, a main scanning movement mechanism 493, a carriage 403, and a head 1, among the members that make up the device that ejects the liquid.

[0056] It is also possible to configure a liquid discharge unit in which the above-mentioned maintenance and recovery mechanism 420 is further attached to, for example, the side plate 491B of this liquid discharge unit 440.

[0057] Next, still another example of the liquid discharge unit according to the present invention will be described with reference to FIG. FIG. 23 is a front view illustrating the liquid discharge unit of this embodiment.

[0058] This liquid discharge unit 440 is composed of a head 1 to which a flow path part 444 is attached, and a tube 456 connected to the flow path part 444 .

[0059] The flow path part 444 is disposed inside the cover 442. A head tank 441 may be included instead of the flow path part 444. Furthermore, a connector 443 for electrically connecting with the liquid ejection head 1 is provided on the upper part of the flow path part 444.

[0060] In the present application, the liquid to be ejected may have a viscosity and surface tension that allows it to be ejected from the head, and is not particularly limited, but it is preferable that the viscosity of the liquid is 30 mPa·s or less at room temperature and pressure, or by heating or cooling. More specifically, the liquid may be a solution, suspension, emulsion, etc., containing a solvent such as water or an organic solvent, a colorant such as a dye or pigment, a functionalizing material such as a polymerizable compound, a resin, or a surfactant, a biocompatible material such as DNA, amino acids, proteins, or calcium, an edible material such as a natural colorant, etc., and these can be used for applications such as inkjet ink, surface treatment liquid, a liquid for forming a component of an electronic element or a light-emitting element, an electronic circuit resist pattern, a material liquid for three-dimensional modeling, etc.

[0061] Energy sources for ejecting liquid include piezoelectric actuators (laminated piezoelectric elements and thin-film piezoelectric elements), thermal actuators that use electrothermal conversion elements such as heating resistors, and electrostatic actuators consisting of a vibration plate and an opposing electrode.

[0062] A "liquid ejection unit" is a liquid ejection head integrated with functional parts and mechanisms, and includes a collection of parts related to ejecting liquid. For example, a "liquid ejection unit" includes a combination of a liquid ejection head and at least one of the following components: a head tank, a carriage, a supply mechanism, a maintenance and recovery mechanism, a main scanning movement mechanism, and a liquid circulation device.

[0063] Here, integration includes, for example, a liquid ejection head, a functional part, and a mechanism that are fixed to each other by fastening, bonding, engaging, etc., and one is held movably relative to the other. Also, the liquid ejection head, the functional part, and the mechanism may be configured to be detachable from each other.

[0064] For example, there are liquid ejection units in which the liquid ejection head and the head tank are integrated together, and there are also liquid ejection units in which the liquid ejection head and the head tank are integrated together by being connected to each other by a tube, etc. Here, a unit including a filter can be added between the head tank and the liquid ejection head of these liquid ejection units.

[0065] Furthermore, there is a liquid ejection unit in which the liquid ejection head and the carriage are integrated.

[0066] In addition, there is a liquid ejection unit in which the liquid ejection head is movably held by a guide member constituting a part of the scanning movement mechanism, and the liquid ejection head and the scanning movement mechanism are integrated together, and in addition, there is a liquid ejection unit in which the liquid ejection head, the carriage, and the main scanning movement mechanism are integrated together.

[0067] Furthermore, there is a liquid ejection unit in which a cap member, which is part of the maintenance and recovery mechanism, is fixed to a carriage on which the liquid ejection head is attached, thereby integrating the liquid ejection head, carriage, and maintenance and recovery mechanism.

[0068] In addition, some liquid ejection units have a head tank or a liquid ejection head to which a flow path component is attached, and a tube is connected to the liquid ejection head, integrating the liquid ejection head with a supply mechanism. Liquid is supplied from a liquid storage source to the liquid ejection head via this tube.

[0069] The main scanning movement mechanism includes the guide member alone, and the supply mechanism includes the tube alone and the loading unit alone.

[0070] Note that, here, the "liquid ejection unit" is described in combination with a liquid ejection head, but the "liquid ejection unit" also includes a head module or head unit including the liquid ejection head described above, which is integrated with the functional components and mechanisms described above.

[0071] The term "liquid ejection device" includes devices that are equipped with a liquid ejection head, a liquid ejection unit, a head module, a head unit, etc., and that eject liquid by driving the liquid ejection head. Liquid ejection devices include not only devices that can eject liquid onto objects to which the liquid can adhere, but also devices that eject liquid into air or liquid.

[0072] This "liquid ejecting device" can also include means for feeding, transporting, and discharging items onto which liquid can be attached, as well as pre-processing devices and post-processing devices.

[0073] For example, examples of "devices that eject liquid" include image forming devices that eject ink to form an image on paper, and three-dimensional modeling devices that eject modeling liquid onto a powder layer formed by layering powder in order to create a three-dimensional object (a three-dimensional model).

[0074] In addition, the term "liquid ejection device" is not limited to devices that use ejected liquid to visualize meaningful images such as letters and figures. For example, it also includes devices that form patterns that have no meaning in themselves and devices that create three-dimensional images.

[0075] The above-mentioned "object to which liquid can adhere" means an object to which liquid can adhere at least temporarily, and to which the liquid adheres and sticks, or to which the liquid adheres and penetrates, etc. Specific examples include media such as paper, recording paper, film, cloth, and other recording media, electronic boards, electronic components such as piezoelectric elements, powder layers, organ models, and test cells, and unless otherwise specified, includes all objects to which liquid can adhere.

[0076] The material of the above-mentioned "object to which liquid can adhere" may be any material to which liquid can adhere even temporarily, such as paper, thread, fiber, cloth, leather, metal, plastic, glass, wood, and ceramics.

[0077] Furthermore, the "liquid ejection device" may be a device in which a liquid ejection head and an object to which liquid can be attached move relatively, but is not limited to this. Specific examples include a serial type device in which a liquid ejection head moves, a line type device in which a liquid ejection head does not move, etc.

[0078] Other examples of "liquid ejecting devices" include a treatment liquid application device that ejects a treatment liquid onto paper to apply the treatment liquid to the surface of the paper for purposes such as modifying the surface of the paper, and an injection granulation device that ejects a composition liquid in which raw materials are dispersed through a nozzle to granulate fine particles of the raw materials.

[0079] In the present application, the terms image formation, recording, printing, imprinting, printing, modeling, and the like are all synonymous.

[0080] The above description is merely an example, and each of the following aspects provides unique effects. [First aspect] The first aspect is a joining member (e.g., liquid ejection head 1) in which a joining part (e.g., nozzle plate 10) is joined to a joined part (e.g., individual flow path member 20), the joined part has a recess 24 on a joining surface (e.g., joining surface 20a) to which the joining part is joined, and has a base portion 26 on a bottom surface of the recess that is lower than the depth h1 of the recess, and the joining part is joined to the joined part by an adhesive 91 held on the base portion. In this embodiment, since the adhesive is held on a pedestal provided on the bottom surface of the recess, a smaller amount of adhesive can be applied so that the adhesive overflows from the opening surface of the recess than in a conventional configuration in which the adhesive is held on the bottom surface of a recess without a pedestal. This eliminates the need for an amount of adhesive so large that the area of ​​the adhesive that is occupied by the adhesive as viewed from the normal direction of the bonding surface exceeds the opening surface of the recess, thereby preventing the adhesive from overflowing from the recess and hindering proper bonding.

[0081] [Second aspect] The second aspect is characterized in that, in the first aspect, the joining part is joined to the joined part not only by adhesive 91 held on the base portion, but also by another adhesive 90 applied around the recess on the joining surface. When a part is bonded to another part by a separate adhesive applied around a recess on the bonding surface, if the adhesive in the recess overflows from the recess, the adhesive may be mixed with the other adhesive. If such mixing occurs, the adhesiveness of the other adhesive may be reduced, and the bonding strength of the other adhesive may be reduced. According to this aspect, as described above, the adhesive is held by the pedestal provided on the bottom surface of the recess, which prevents the adhesive from spilling out of the recess. This prevents the adhesiveness of the other adhesive from decreasing, and prevents the bonding strength of the other adhesive from decreasing, thereby preventing proper bonding.

[0082] [Third aspect] A third aspect is the second aspect, characterized in that the adhesive held on the base is a light-curing adhesive, and the other adhesive held on the joining surface is a heat-curing adhesive. According to this method, after temporary bonding with the light-curing adhesive, the main bonding can be performed with the heat-curing adhesive.

[0083] [Fourth aspect] A fourth aspect is the device according to any one of the first to third aspects, characterized in that the base portion has a height equal to or greater than half the depth of the recessed portion. This allows the amount of adhesive needed to be applied so that it overflows from the opening surface of the recess to be sufficiently small, making it possible to reliably avoid a situation in which the adhesive overflows from the recess and prevents proper bonding.

[0084] [Fifth aspect] The fifth aspect is characterized in that, in any of the first to fourth aspects, the recess is provided on the outer peripheral edge portion of the joining surface, and the side of the recess on the outer peripheral edge side opens to a side surface of the joined parts. According to this, even if the adhesive in the recess flows out, the adhesive can flow to the outer periphery of the joining surface, and can be prevented from flowing onto the joining surface, and it is possible to more stably avoid a situation in which proper joining is hindered. Also, since the side of the recess is open to the side of the joined parts in this way, when a light-curing adhesive is used as the adhesive applied to the base, it is easy to irradiate the adhesive with light, and the manufacturing process can be simplified.

[0085] [Sixth aspect] The sixth aspect is the fifth aspect, characterized in that a wall portion 27 having a height equal to or less than the depth of the recess is provided on the bottom surface of the recess so as to surround the pedestal portion, and the wall portion is missing a portion facing the open side of the recess. According to this, even if the adhesive applied to the base flows out of the base, the adhesive is blocked by the wall and prevented from flowing out of the recess. Therefore, it is possible to more stably avoid a situation in which the adhesive overflows from the recess and prevents proper bonding. In addition, since the wall is missing in this way, when a photocurable adhesive is used as the adhesive applied to the base, it is easy to irradiate the adhesive with light, and the manufacturing process can be simplified.

[0086] [Seventh aspect] A seventh aspect is the sixth aspect, characterized in that the wall portion has an outflow suppression portion (for example, a protruding portion 27a) for suppressing outflow of the adhesive at the cutout portion. With this, even if adhesive leaks out from the missing portion in the wall portion, the leakage prevention portion prevents the adhesive from leaking out, making it possible to more reliably avoid a situation in which the adhesive overflows from the recess and prevents proper bonding.

[0087] [Eighth aspect] An eighth aspect is the sixth or seventh aspect, characterized in that there is a gap between the wall portion and the base portion. With this, even if the adhesive applied to the base flows out of the base, the adhesive is held in the gap between the base and the wall and is less likely to flow out of the recess. This makes it possible to more reliably prevent the adhesive from spilling out of the recess and preventing proper bonding.

[0088] [Ninth aspect] A ninth aspect is a liquid ejection head comprising the bonding member according to any one of the first to eighth aspects. According to this aspect, it is possible to provide a liquid ejection head including a joint member that is appropriately joined.

[0089] [Tenth aspect] The tenth aspect is characterized in that, in the liquid ejection head of the ninth aspect, one of the joining part and the joined part is a nozzle plate 10 having a nozzle for ejecting liquid, and the other is a flow path member (e.g., an individual flow path member 20) that forms an individual liquid chamber communicating with the nozzle. This makes it possible to provide a liquid ejection head in which the nozzle plate and the flow path member are appropriately joined together.

[0090] [Eleventh aspect] An eleventh aspect is a liquid ejection unit, characterized in that it includes the liquid ejection head of the ninth or tenth aspect. According to this aspect, it is possible to provide a liquid ejection unit including a joint member that is appropriately joined.

[0091] [12th aspect] A twelfth aspect is a device for ejecting liquid, characterized in that it comprises a joining member according to any one of the first to eighth aspects, a liquid ejection head according to the ninth or tenth aspect, or a liquid ejection unit according to the eleventh aspect. According to this aspect, it is possible to provide a device for discharging liquid that includes a joint member that is appropriately joined. [Explanation of symbols]

[0092] 1: Liquid ejection head 10: Nozzle plate 11: Nozzle 15: Nozzle cover 20: Individual flow path components 20a: Joint surface 20b: Side 21: Pressure chamber 22: Individual supply flow path 23: Individual collection channel 24: Recess 25: Individual flow path 26: Base 27: Wall 27a: protruding part 30: Diaphragm material 31: Vibration plate 32: Supply side opening 33: Collection side opening 40: Piezoelectric element 50: Common flow path member 52: Common supply channel tributary 53: Common recovery channel tributary 54: Supply port 55: Collection port 56: Common supply main stream 57: Main common recovery channel 60: Damper material 62: Supply side damper 63: Recovery side damper 80: Frame member 90: Adhesive 91: Adhesive 100: Head module 440: Liquid discharge unit 500:Printing device [Prior art documents] [Patent documents]

[0093] [Patent Document 1] JP 2017-74731 A

Claims

1. A joining member in which a joining part is joined to a joined part, The joined parts have a recess on a joining surface to which the joining part is joined, a platform portion on a bottom surface of the recess portion, the platform portion being lower than the depth of the recess portion; The joining part is joined to the joined part not only by the adhesive held on the base part but also by another adhesive applied around the recess on the joining surface, the adhesive held on the base is a light-curing adhesive, A joining member, wherein the other adhesive held on the joining surface is a thermosetting adhesive.

2. A joining member in which a joining part is joined to a joined part, The joined parts have a recess on a joining surface to which the joining part is joined, a platform portion on a bottom surface of the recess portion, the platform portion being lower than the depth of the recess portion; The joining part is joined to the joined part by an adhesive held on the base part, A joining member characterized in that the recess is provided on the outer peripheral edge of the joining surface, and the side of the recess on the outer peripheral edge side opens to a side surface of the joined parts.

3. The joining member according to claim 2, a wall portion having a height equal to or less than the depth of the recess portion is provided on a bottom surface of the recess portion so as to surround the periphery of the base portion; A joining member, wherein the wall portion is missing a portion facing the side of the open recess.

4. The joining member according to claim 3, A joining member, wherein the wall portion has an outflow suppression portion at the missing portion, which suppresses outflow of adhesive.

5. The joining member according to claim 3 or 4, A joining member having a gap between the wall portion and the base portion.

6. The joining member according to any one of claims 2 to 5, A joining member characterized in that the joining part is joined to the joined part not only by the adhesive held on the base portion, but also by another adhesive applied around the recess on the joining surface.

7. In the joining member according to claim 6, the adhesive held on the base is a light-curing adhesive, A joining member, wherein the other adhesive held on the joining surface is a thermosetting adhesive.

8. The joining member according to any one of claims 1 to 7, A joining member, wherein the base portion has a height equal to or greater than half the depth of the recess.

9. A liquid ejection head comprising the joining member according to claim 1 .

10. 10. The liquid ejection head according to claim 9, A liquid ejection head, characterized in that one of the joining part and the joined part is a nozzle plate having nozzles for ejecting liquid, and the other is a flow path member that forms individual liquid chambers communicating with the nozzles.

11. A liquid ejection unit comprising the liquid ejection head according to claim 9 or 10.

12. 12. A liquid ejection device comprising: a joining member according to claim 1; a liquid ejection head according to claim 9; or a liquid ejection unit according to claim 11.

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