Tactile Sensor

Abstract

The tactile sensor includes a contact portion (1) that receives pressure transmitted when a manipulator grasps a target object and transmits the pressure to a sensing portion (2), a sensing portion (2) that is located on one side of the contact portion and moves in a direction away from the contact portion (1) under the action of the pressure, and a detection portion (4) that is located on the side of the sensing portion (2) that is away from the contact portion (1) and senses changes in the position of the sensing portion (2) to generate a sensing signal, the sensing signal being set to determine contact parameters between the manipulator and the target object.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority to a Chinese patent application bearing application number 202010599981.1 and entitled "Tactile Sensor" filed with the China Patent Office on June 28, 2020, the contents of which are incorporated herein by reference in their entirety. [Technical field]

[0002] The present invention relates to the technical field of sensors, and in particular to tactile sensors. [Background technology]

[0003] In the related art, a manipulator is an automatic operating device that can grasp, transport, and operate tools according to a certain procedure by imitating certain motion functions of the human hand and arm, which can replace heavy labor by humans to realize mechanization and automation of production, and can also operate in harmful environments to protect human safety, so it is widely used in machinery manufacturing, metallurgy, electronics, light industry, nuclear power, and other sectors. In the process of grasping, the manipulator needs to sense the contact point between the manipulator and the object to be grasped, and the magnitude of the grasping force at the contact point (i.e., tactile and force sense).

[0004] Currently, most of the contact sensors commonly used in manipulators are pressure sensors, which do not have tactile and force feedback and are greatly affected by their flexibility, which significantly reduces the accuracy of grasping objects and often causes objects to fall due to tilted grasping. In addition, current pressure sensors are usually single-point pressure sensors, for example, a sensor array is applied to the joints of the manipulator, and the array is used to measure the parameters of the contact points. However, in this method, although an array pressure sensor is applied, the space inside the manipulator is very small, so the number of pressure sensors in the array is limited, and the position of the contact point cannot be accurately sensed, which cannot meet the requirements of the manipulator to grasp fine objects.

[0005] No effective solution has yet been proposed for the above problems. Summary of the Invention

[0006] An embodiment of the present invention provides a tactile sensor to at least solve a technical problem in which in the prior art, manipulators use pressure sensors that make it impossible to accurately sense the contact point between the manipulator and an object, resulting in a significant decrease in accuracy when grasping an object.

[0007] According to one aspect of an embodiment of the present invention, there is provided a tactile sensor for application to a manipulator, the tactile sensor including: a contact portion that receives pressure transmitted when the manipulator grasps a target object and transmits the pressure to a sensing portion; a sensing portion located on one side of the contact portion and moving in a direction away from the contact portion under the action of the pressure; and a detection portion located on a side of the sensing portion away from the contact portion that senses a change in position of the sensing portion and generates a sensing signal, the sensing signal being configured to determine a contact parameter between the manipulator and the target object.

[0008] Preferably, the tactile sensor further includes an elastic portion located on one side of the contact portion, and the sensing portion is located between the contact portion and the elastic portion.

[0009] Preferably, the sensing portion includes a sensing electrode.

[0010] Preferably, the detection unit includes a detection substrate and a sensor chip located on the detection substrate, the sensing electrode having a projection on the sensor chip, and the sensor chip being electrically connected to the detection substrate via a bonding wire.

[0011] Preferably, the detection board includes an electrical interface connected to an external device, providing an electrical control signal to the detection board, and transmitting the sensing signal to the outside.

[0012] Preferably, the sensor chip includes a plurality of detection electrodes forming an electric field together with the sensing electrodes, and the detection electrodes are arranged in the same direction as the sensing electrodes.

[0013] Preferably, the sensor chip further includes electrical connection electrodes for providing operating voltages and drive signals to the sensor chip, the drive signals including at least one of a clock signal CLK, a row drive signal SI, and an output signal SIG.

[0014] Preferably, the detection unit further includes a housing having an accommodating cavity and an opening, in which the detection substrate and the sensor chip are positioned, and a protective structure that surrounds the housing to form an enclosed space.

[0015] Preferably, the protective structure is one of a protective cover plate and a sealing adhesive.

[0016] Preferably, the material of the contact portion is a flexible material, and the material of the elastic portion is a rubber material.

[0017] In an embodiment of the present invention, the contact unit receives the pressure transmitted when the manipulator grasps the target object, and transmits the pressure to the sensing unit, and the sensing unit moves away from the contact unit under the action of the pressure, and the detection unit senses the change in the position of the sensing unit to generate a sensing signal, where the sensing signal is set to determine the contact parameters between the manipulator and the target object. In this embodiment, a tactile sensor is provided that can accurately detect the contact point between the object and the manipulator, and the tactile sensor outputs and feeds back the sensed pressure in the form of a sensing signal to the outside in real time, continuously monitors the gripping state of the manipulator, and adjusts the contact point when the manipulator grasps the object to improve the gripping accuracy of the object, thereby solving the technical problem that in the prior art, the manipulator uses a pressure sensor, which cannot accurately sense the contact point between the manipulator and the object, and the accuracy of gripping the object is significantly reduced. [Brief description of the drawings]

[0018] The drawings described herein are provided to facilitate a better understanding of the invention and constitute a part of this application, and the exemplary embodiments of the invention and the description thereof are intended to explain the invention and are not intended to unduly limit the invention. [Figure 1] 1 is a schematic view of an exterior of a preferred tactile sensor according to an embodiment of the present invention; [Diagram 2] 1 is a cross-sectional structural schematic diagram of a preferred tactile sensor according to an embodiment of the present invention. [Diagram 3] FIG. 2 is a schematic diagram of a preferred detection substrate according to an embodiment of the present invention. [Figure 4] FIG. 1 is a schematic diagram of a preferred sensor chip according to an embodiment of the present invention. [Diagram 5] FIG. 2 is a schematic diagram of a preferred electrical connection electrode output signal according to an embodiment of the present invention. [Figure 6] FIG. 2 is a schematic diagram of another preferred tactile sensor according to an embodiment of the present invention. [Figure 7]FIG. 2 is a schematic diagram of another preferred sensor chip according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] In order to make those skilled in the art better understand the solutions of the present invention, the following clearly and completely describes the technical solutions in the embodiments of the present invention with reference to the drawings in the embodiments of the present invention, but obviously, the described embodiments are only a part of the embodiments of the present invention, and not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work should belong to the protection scope of the present invention.

[0020] It should be noted that the terms "first", "second", and the like in the present specification and claims as well as in the above drawings are intended to distinguish between similar objects and are not necessarily intended to describe a particular order or sequence of precedence or terminating. It should be understood that the numbers used in this manner may be interchanged under appropriate circumstances such that the embodiments of the present invention described herein may be performed in other orders than those illustrated or described herein. Furthermore, the terms "comprise" and "have", as well as any variations thereof, are intended to cover non-exclusive inclusions, e.g., a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to the steps or units expressly recited, and may include other steps or units that are not expressly recited or inherent to these processes, methods, products, or devices.

[0021] The following embodiments of the present invention can be applied to various manipulators, and by providing a new tactile sensor in the manipulator, different contact pressures act on the contact portion and the elastic portion, causing different displacements in the sensing electrodes of the sensing portion, and at the same time, different amounts of charge are generated in the detection electrodes, thereby outputting different sensing signals, and the magnitude of the contact force and the position of the contact point can be calculated based on the magnitude of the output signal and the output waveform of the signal.

[0022] FIG. 1 is a schematic external view of a preferred tactile sensor according to an embodiment of the present invention applied to a manipulator. As shown in FIG. 1, the tactile sensor includes a contact portion 1, a sensing portion 2, and a detection portion 4, where the contact portion 1 receives pressure transmitted when the manipulator grasps a target object and transmits the pressure to the sensing portion.

[0023] The contact portion 1 is capable of coming into contact with an external object to be grasped, and receives pressure from the external contact, and at the same time transmits the pressure to the sensing portion 2 and the elastic portion 3 .

[0024] The sensing portion 2 is located on one side of the contact portion, and under the action of pressure the sensing portion moves in a direction away from the contact portion.

[0025] Preferably, the sensing unit includes a sensing electrode, which may be a flat sheet-like electrode, configured to produce a corresponding deformation in response to a magnitude of a force applied when the target object contacts the manipulator.

[0026] In FIG. 1, the tactile sensor further includes an elastic portion 3 located on one side of the contact portion, and the sensing portion is located between the contact portion and the elastic portion.

[0027] In a preferred embodiment of the present invention, the material of the contact portion may be a flexible material, and the material of the elastic portion may be a rubber material.

[0028] The elastic portion 3 receives an external pressure transmitted from the contact portion 1 and drives the sensing electrode 2 to cause a corresponding deformation, so that the distance D from the sensing electrode 2 to the detection portion 4 changes due to the action of the external force.

[0029] The sensing electrode includes a base voltage and can form an electric field with the detection electrode (disposed in the detection unit) to form a charge on the detection electrode. The sensing electrode is located between the contact unit 1 and the elastic unit 3 and can be deformed according to the deformation degree of the contact unit 1 and the elastic unit 3. When an external force acts on the contact unit 1 (for example, when the manipulator grasps the target object), the acting force of contacting the target object is transmitted to the inside through the contact unit 1, and as a result, the sensing electrode 2 and the elastic unit 3 are deformed according to the magnitude of the acting force. When the sensing electrode 2 is deformed, the distance D between the sensing electrode and the surface of the detection unit 4 changes. The larger the contact force, the larger the deformation amount of the sensing electrode 2, the smaller the value of D, and the closer the sensing electrode is to the detection unit 4. If the position of the contact point is different, the position where D changes will also be different, so that the magnitude of the pressure and the position of the force application point, i.e., the position of the contact point and the magnitude of the contact force, can be determined.

[0030] The base voltage included in the sensing electrode may be applied in advance, may be supplied by the detection unit 4, or may be supplied directly as required. The voltage value of the base voltage is an important parameter of the entire tactile sensor, and the magnitude of the voltage value is related to the flexibility and thickness of the contact unit 1 and the elastic unit 3, and also to the initial distance D from the sensing electrode to the detection unit 4, i.e., the upper limit design value of the initial weight of the object to be grasped, which is the usage environment of the tactile sensor. When the grasped weight is large, the flexibility of the contact unit 1 and the elastic unit 3 needs to be low and the thickness needs to be large, which increases the distance between the sensing electrode and the detection unit 4, and at this time the voltage applied to the detection electrode 2 is high, and otherwise the voltage applied is low.

[0031] FIG. 2 is a schematic cross-sectional structure diagram of a preferred tactile sensor according to an embodiment of the present invention. As shown in FIG. 2, the tactile sensor includes a contact portion 1, a sensing portion 2 (which can be understood as a sensing electrode), an elastic portion 3, and a detection portion 4.

[0032] The detection unit 4 is located on a side of the sensing unit away from the contact portion, and the detection unit senses a change in the position of the sensing unit to generate a sensing signal, and the sensing signal is configured to determine contact parameters between the manipulator and the target object.

[0033] In an embodiment of the present invention, the detection unit 4 includes a detection substrate and a sensor chip located on the detection substrate, where the sensing electrodes have projections on the sensor chip, and the sensor chip is electrically connected to the detection substrate via bonding wires.

[0034] The detection unit 4 measures a change in charge induced in the corresponding detection electrode due to a change in position of the sensing electrode 2 caused by deformation.

[0035] As shown in FIG. 2, the detection unit 4 includes a detection substrate 41, a sensor chip 42, and bonding wires 43.

[0036] Preferably, the sensing board includes an electrical interface for connecting to an external device, providing an electrical control signal to the sensing board, and transmitting the sensing signal to the outside. As shown in FIG.

[0037] A sensor chip 42 is mounted on the detection substrate 41, and detection electrodes 421 are provided on the sensor chip 42, and the detection electrodes 421 are linearly arranged along the chip surface. Here, the type of the sensor chip may be a charge sensing sensor chip.

[0038] The sensor chip on the detection unit 4 includes a detection electrode 421 and an electrical connection electrode 422 .

[0039] 3 is a schematic diagram of a preferred detection substrate according to an embodiment of the present invention, and as shown in FIG. 3, a sensor chip is provided on the detection substrate, and the sensor chip includes a detection electrode 421 and an electrical connection electrode 422. The sensor chip 42 is electrically connected to the detection substrate 41 via a bonding wire 43, and an electrical interface 44 for connecting to the outside is also provided on the detection substrate 41, and an electrical control signal is provided to the detection substrate 41 via the electrical interface 44, and a detected sensing signal is output to the outside.

[0040] FIG. 4 is a schematic diagram of a preferred sensor chip according to an embodiment of the present invention. As shown in FIG. 4, a sensor chip 42 is provided with a plurality of detection electrodes 421 and electrical connection electrodes 422 arranged in parallel.

[0041] The detection electrode 421 forms an electric field with the sensing electrode, and each detection electrode is arranged in the same direction as the sensing electrode. The sensing electrodes are arranged in the same direction as the detection electrode 421 and can be arranged directly above the detection electrode 421, and an electric field is formed between the voltage applied to the sensing electrode and the detection electrode 421, and a sensing charge is generated in the detection electrode 421, and thus the sensor chip 42 can convert the charge signal generated in the detection electrode 421 into a voltage signal to obtain a sensing signal, and output this sensing signal to the outside. The detection electrode 421 is a planar metal electrode manufactured by a semiconductor process, and the material used includes aluminum material, and the detection electrode 421 is connected to a shift circuit inside the IC through a conventional logic switch, and converted into a serial signal and output to the outside.

[0042] The electrical connection electrodes 422 provide operating voltages and driving signals to the sensor chip, the driving signals including at least one of a clock signal CLK, a row driving signal SI, and an output signal SIG. The driving signals are not limited to the aforementioned clock signal CLK and row driving signal SI.

[0043] 5 is a schematic diagram of a preferred electrical connection electrode output signal according to an embodiment of the present invention, as shown in FIG. 5, under the driving of a clock signal, the sensor chip performs one row scanning every time one row driving signal SI (positive pulse) is sent out, and outputs one row of voltage signals corresponding to each detection electrode 421. In a continuous working state, the tactile sensor can output sensing signals to the outside in real time, and after the control system / console receives the sensing signals, it can convert them into pressure signals and position signals, so as to continuously monitor the working state of the manipulator.

[0044] 4 can be arbitrarily selected, and the sensor chip is a chip (unpackaged bare chip) manufactured by a semiconductor CMOS process, with detection electrodes 421 and electrical connection electrodes 422 arranged on the surface of the chip. The detection electrodes 421 are arranged evenly along the length of the chip, and the size of the detection electrodes 421 can be set according to the required resolution.

[0045] Preferably, the detection unit further includes a housing having an accommodating cavity and an opening, with the detection substrate and the sensor chip positioned within the accommodating cavity, and a protective structure surrounding the housing to form a sealed space.

[0046] In an embodiment of the present invention, the protective structure is one of a protective cover plate and a sealing adhesive. As shown in FIG. 2, the protective cover plate is 45 and the housing is 46. The detection substrate 41 is mounted inside the housing 46, and the protective cover plate 45 can be mounted on the top surface of the housing 46 to protect the sensor chip 42.

[0047] In FIG. 2, D between the sensing unit 2 and the protective cover plate 45 indicates the distance between the sensing electrode and the surface of the detection unit.

[0048] In the above-mentioned tactile sensor, the contact unit 1 can receive the pressure transmitted when the manipulator grasps the target object and transmit the pressure to the sensing unit, the sensing unit 2 moves in a direction away from the contact unit under the action of the pressure, and the detection unit 4 senses the change in the position of the sensing unit 2 to generate a sensing signal, where the sensing signal is set to determine the contact parameters between the manipulator and the target object. In this embodiment, a tactile sensor is provided that can accurately detect the contact point between the object and the manipulator, and the tactile sensor outputs and feeds back the sensed pressure in the form of a sensing signal to the outside in real time, continuously monitors the gripping state of the manipulator, adjusts the contact point when the manipulator grasps the object, and improves the gripping accuracy of the object, thereby solving the technical problem that in the prior art, the manipulator uses a pressure sensor, so that the contact point between the manipulator and the object cannot be accurately sensed, and the accuracy of gripping the object is significantly reduced.

[0049] When the sensor chip 42 is in a connected operating state, it outputs a signal to the outside in real time (even without contact with an external object), and therefore outputs and feeds back the sensed pressure in the form of a sensing signal to the outside in real time, allowing the control system to continuously monitor the gripping status of the manipulator.

[0050] In an embodiment of the present invention, the direction of the sensing electrode can be set in the same direction as the arrangement direction of the detection electrode 421, and can be provided directly above the detection electrode 421, and the plane on which the sensing electrode is located is parallel to the plane on which the detection electrode 421 is located. The sensing electrode and the detection electrode 421 form a plate capacitor structure, and according to the principle of the plate capacitor, C=q / V, where C is the capacitance of the capacitor, q is the charge value sensed by the detection electrode, and V is the base voltage applied to the sensing electrode. According to the plate capacitor structure, the capacitance of the capacitor can also be expressed as C=ε S / D, where C is the capacitance of the capacitor, ε is the dielectric constant of the medium between the plates, S is the area of ​​the detection electrode 421, and D is the distance between the sensing electrode and the detection electrode 421, from which the sensing charge value q=ε S*V / D of the detection electrode can be calculated.

[0051] The amount of charge sensed by the detection electrode 421 is mainly determined by the base voltage V applied to the sensing electrode and the distance D between the sensing electrode and the detection electrode 421. The amount of charge is proportional to the applied base voltage, so that the higher the base voltage V, the more charge is sensed, whereas the amount of charge is inversely proportional to the distance D, so that the closer the distance D, the more charge is sensed.

[0052] In the embodiment of the present invention, a thin elastic part 3 and contact part 1 are used, mainly for the purpose of gripping a relatively light object, and for example, the elastic part is 2 mm thick and made of a rubber material, and the contact part 1 is 5 mm thick and made of a rubber material as well. When selecting a material for the sensing electrode, a different material is selected according to the mass of the object that each manipulator needs to grip. For example, a copper foil with a thickness of 0.03 mm and a width of 2 mm is used for the sensing electrode, and this copper foil is bonded and fixed between the contact part 1 and the elastic part 3.

[0053] The strength of the sensing signal output by the tactile sensor can be converted into the magnitude of the contact force, and the position of the point of contact can be converted according to the magnitude of the output value of each detection electrode indicated by the output waveform.

[0054] When a relatively heavy object needs to be grasped, the contact portion 1 and the elastic portion 3 can be made thicker and less flexible to increase the distance between the sensing electrode and the detection portion 4, enabling the tactile sensor to withstand a larger acting force. When the distance between the sensing electrode and the detection portion 4 increases, the charge sensed by the detection electrode 421 decreases, and the sensitivity to the acting force decreases. At this time, the voltage of the sensing electrode can be increased to increase the strength of the output signal.

[0055] FIG. 6 is a schematic diagram of another preferred tactile sensor according to an embodiment of the present invention. As shown in FIG. 6, instead of a protective cover plate attached on top of the chip, the sensor chip is protected by a sealing layer 451, where the sealing layer 451 can be formed by applying a sealing adhesive, and the use of the sealing adhesive can shorten the distance from the detection portion surface to the sensor chip surface, and accordingly shorten the distance from the sensing electrode to the detection electrode on the chip surface, improving the measurement accuracy and sensitivity.

[0056] Another difference in Figure 6 is that the elastic part 3 is provided only around the surface of the detection part 4, and the area between the sensing electrode and the surface of the detection part is empty (air can also be considered as the medium), which allows the position change range of the sensing electrode to be expanded and the pressure measurement range to be expanded.

[0057] Furthermore, when the object to be grasped is relatively large, the size of the tactile sensor can be increased and multiple sensor chips 42 can be arranged on the detection substrate 41 to expand the detection range.

[0058] FIG. 7 is a schematic diagram of another preferred sensor chip according to an embodiment of the present invention. As shown in FIG. 7, three sensor chips 42 are arranged on a detection substrate 41, and an electrical interface 44 is also arranged on the detection substrate 41. In this case, the number of detection electrodes 421 included is 108, and the detection range can reach 54.9 mm.

[0059] If it is desired to grasp larger objects, multiple tactile sensors can be arranged, for example the tactile sensors shown in FIG. 1, spaced apart on the grasping jaws of the manipulator to form a multi-contact point sensing structure.

[0060] The numbers of the above embodiments of the present invention are for the purpose of explanation and do not indicate superiority or inferiority of the embodiments.

[0061] In the above-described embodiments of the present invention, the description of each embodiment has its own emphasis, and for parts that are not described in detail in a specific embodiment, reference may be made to the relevant descriptions of other embodiments.

[0062] In some embodiments provided in the present application, it should be understood that the disclosed technical contents may be implemented in other ways. The above-mentioned device embodiments are merely exemplary, and for example, the division of the above units may be a logical division of functions, and other division methods may exist in actual implementation, for example, multiple units or components may be combined or integrated into another system, or some features may be omitted or not implemented. Furthermore, the illustrated or discussed mutual couplings or direct couplings or communication connections may be indirect couplings or communication connections via some interfaces, units or modules, and may be in electrical or other forms.

[0063] Units described as separate parts may or may not be physically separated, and parts shown as units may or may not be physical units, i.e., located in one location or distributed across multiple units.

[0064] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, each unit may exist physically alone, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or a software functional unit.

[0065] The above-mentioned integrated units can be implemented in the form of software functional units and stored in a computer-readable storage medium when sold or used as an independent product. Based on such understanding, the technical solution of the present invention can be essentially or the part contributing to the prior art, or the whole or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium and includes some instructions for making a computer device (which may be a personal computer, a server, or a network device, etc.) execute all or some steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes various media that can store program codes, such as USB memory, read-only memory (ROM), random access memory (RAM), mobile hard disk, magnetic disk, or optical disk.

[0066] It should be noted that the above are only preferred embodiments of the present invention, and those skilled in the art may make some improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be regarded as within the protection scope of the present invention. [Industrial Applicability]

[0067] The solution provided in the embodiment of the present application can be used to continuously monitor the gripping state of the manipulator, adjust the contact point when the manipulator grips an object, and improve the gripping accuracy of the object. The technical solution provided in the embodiment of the present application can be applied to various manipulators, and by providing a new tactile sensor in the manipulator, different contact pressures act on the contact part and the elastic part, and different displacements occur on the sensing electrodes of the sensing part, while different amounts of charge are generated on the detection electrodes, thereby outputting different sensing signals, and the magnitude of the contact force and the position of the contact point can be calculated based on the magnitude of the output signal and the output waveform of the signal, thus solving the technical problem that in the prior art, the manipulator uses a pressure sensor, so that the contact point between the manipulator and the object cannot be accurately sensed, and the accuracy of gripping the object is significantly reduced. The embodiment of the present application can output the sensed pressure in the form of a sensing signal to the outside in real time and feed it back, thereby continuously monitoring the gripping state of the manipulator, adjusting the contact point when the manipulator grips an object, and improving the gripping accuracy of the object.

Claims

1. A tactile sensor applied to a manipulator, a contact unit that receives a pressure transmitted when the manipulator grasps a target object and transmits the pressure to a sensing unit; the sensing portion being located on one side of the contact portion and moving in a direction away from the contact portion under the action of the pressure; a detection unit located on a side of the sensing unit away from the contact unit, the detection unit configured to sense a change in position of the sensing unit and generate a sensing signal, the sensing signal being configured to determine a contact parameter between the manipulator and the target object; The contact parameters include a position of a contact point and a value of a contact force; The sensing unit includes a sensing electrode, The detection unit is A detection board; a sensor chip located on the detection substrate, the sensing electrodes having projections on the sensor chip, the sensor chip being electrically connected to the detection substrate via bonding wires.

2. The tactile sensor according to claim 1 , further comprising an elastic portion located on one side of the contact portion, and the sensing portion is located between the contact portion and the elastic portion.

3. The detection substrate includes: The tactile sensor according to claim 1 , further comprising an electrical interface connected to an external device, providing an electrical control signal to the detection substrate, and transmitting the sensing signal to the outside.

4. The tactile sensor according to claim 1 , wherein the sensor chip includes a plurality of detection electrodes that form an electric field together with the sensing electrodes, and the detection electrodes are arranged in the same direction as the sensing electrodes.

5. The tactile sensor of claim 1 , wherein the sensor chip further includes electrical connection electrodes for providing operating voltages and drive signals to the sensor chip, the drive signals including at least one of a clock signal CLK, a row drive signal SI, and an output signal SIG.

6. The detection unit is a housing having a receiving cavity and an opening, the detection substrate and the sensor chip being located within the receiving cavity; The tactile sensor according to claim 2 , further comprising a protective structure that, together with the housing, surrounds the sensor to form a sealed space.

7. The tactile sensor of claim 6 , wherein the protective structure is one of a protective cover plate and a sealing adhesive.

8. The tactile sensor according to claim 7 , wherein the material of the contact portion is a flexible material, and the material of the elastic portion is a rubber material.

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