Light-emitting plate, circuit board and display device

Abstract

A light-emitting plate, a circuit board, and a display device are provided. The light-emitting plate includes a base substrate (100) and a light-emitting unit (200) located on the base substrate (100). The light-emitting unit (200) includes a light-emitting subunit (201), and the light-emitting subunit (201) includes a connection circuit unit (210) and one light-emitting diode chip (220) connected to the connection circuit unit (210). The connection circuit unit (210) includes at least two pairs of electrical contacts (211), each pair of electrical contacts (211) including a first electrode contact (2112) and a second electrode contact (2111). In each connection circuit unit (210), the second electrode contacts (2111) are electrically connected to each other and the first electrode contacts (2112) are electrically connected to each other, and only one pair of electrical contacts (211) of each connection circuit unit (210) is connected to the light-emitting diode chip (220). The light emitting plate not only improves the binding yield of the product by providing spare electrical contact pairs, but also reduces the power consumption of the negative wiring.

Description

[Technical field]

[0001] At least one embodiment of the present disclosure relates to a light-emitting plate, a circuit board, and a display device. [Background technology]

[0002] At present, with the continuous advancement of display technology, users' requirements for the performance of products such as brightness and contrast are also continuously increasing. On the one hand, mini light-emitting diodes (Mini LEDs) can be used as backlights. When mini LEDs are combined with traditional liquid crystal display panels as backlights, by controlling the switching of mini LEDs in the partitions, the liquid crystal display device can have high contrast comparable to that of organic light-emitting diode displays. On the other hand, mini LEDs can be directly fabricated into even larger size display products, which has good market prospects. Summary of the Invention [Means for solving the problem]

[0003] The embodiments of the present disclosure provide a light-emitting board, a circuit board, and a display device.

[0004] A light-emitting plate according to at least one embodiment of the present disclosure includes a base substrate, and a plurality of light-emitting units arranged in an array on the base substrate along a first direction and a second direction, each light-emitting unit including at least one light-emitting subunit, the light-emitting subunit including a connection circuit unit and one light-emitting diode chip connected to the connection circuit unit, and the light-emitting diode chip located on a side of the connection circuit unit away from the base substrate. Each connection circuit unit includes at least two pairs of electrical contacts, each pair of electrical contacts including a first electrode contact and a second electrode contact, in each connection circuit unit, the first electrode contacts are electrically connected to each other, the second electrode contacts are electrically connected to each other, and only one of the at least two pairs of electrical contacts is connected to the light-emitting diode chip.

[0005] For example, the light emitting plate further includes a plurality of first electrode wirings extending along a first direction, the plurality of first electrode wirings include a plurality of first electrode wirings of a first type and a plurality of first electrode wirings of a second type, and a row of light emitting subunits arranged along the first direction includes a plurality of first light emitting subunits and a plurality of second light emitting subunits, the first light emitting subunits are connected to the first electrode wirings of the first type via first electrode contacts, and the second light emitting subunits are connected to the first electrode wirings of the second type via first electrode contacts.

[0006] For example, the first type first electrode wirings and the second type first electrode wirings connected to a row of light emitting subunits arranged along the first direction are located on both sides of the light emitting subunits in that row.

[0007] For example, each first electrode wiring of the first type includes a first sub-electrode wiring and a second sub-electrode wiring extending along the same straight line and electrically insulatingly spaced apart from each other, a portion of the plurality of first light-emitting subunits close to the first sub-electrode wiring is connected to the first sub-electrode wiring and a portion of the plurality of first light-emitting subunits close to the second sub-electrode wiring is connected to the second sub-electrode wiring, and each first electrode wiring of the second type includes a third sub-electrode wiring and a fourth sub-electrode wiring extending along the same straight line and electrically insulatingly spaced apart from each other, a portion of the plurality of second light-emitting subunits close to the third sub-electrode wiring is connected to the third sub-electrode wiring and a portion of the plurality of second light-emitting subunits close to the fourth sub-electrode wiring is connected to the fourth sub-electrode wiring.

[0008] For example, the light emitting plate further includes a plurality of second electrode wirings extending along the second direction and located between the first electrode wirings and the base substrate, and each connection circuit unit further includes a second electrode connector, the second electrode connector being provided in the same layer as the first electrode wirings, and the second electrode contacts in each connection circuit unit being connected to the second electrode wirings via the second electrode connector.

[0009] For example, the second electrode contact and the second electrode connection portion are of one unitary structure.

[0010] For example, in the first direction, the orthogonal projection of each second electrode wiring onto the base substrate overlaps with the orthogonal projection of one electrode contact pair and some of the second electrode connecting portions onto the base substrate.

[0011] For example, each light-emitting unit includes three light-emitting subunits of different colors arranged along the second direction, the second electrode wiring includes a first type of second electrode wiring and a second type of second electrode wiring, and a light-emitting subunit of the light-emitting unit is connected to the first type of second electrode wiring, and the other two light-emitting subunits of the light-emitting unit are connected to the second type of second electrode wiring.

[0012] For example, each connection circuit unit includes two pairs of electrical contacts, each connection circuit unit further includes two first electrode connection portions connected to each of the first electrode contacts, the first electrode connection portions are located on a side of the first electrode contacts away from the second electrode contacts, the first electrode contacts are connected to a first electrode wiring via the first electrode connection portions, and an orthogonal projection of at least a portion of the first electrode connection portions onto the base substrate does not overlap with an orthogonal projection of the second electrode wiring onto the base substrate.

[0013] A circuit board according to at least one embodiment of the present disclosure includes a base substrate and a plurality of connection circuit units arranged in an array on the base substrate along a first direction and a second direction, each connection circuit unit including at least two pairs of electrical contacts, each pair of electrical contacts including a first electrode contact and a second electrode contact, and in each connection circuit unit, the first electrode contacts are electrically connected to each other and the second electrode contacts are electrically connected to each other.

[0014] For example, the circuit board further includes a plurality of first electrode wirings extending along a first direction, the plurality of first electrode wirings include a plurality of first electrode wirings of a first type and a plurality of first electrode wirings of a second type, a row of connection circuit units arranged along the first direction includes a plurality of first connection circuit units and a plurality of second connection circuit units, the first electrode contacts of the first connection circuit units are connected to the first electrode wirings of the first type, and the first electrode contacts of the second connection circuit units are connected to the first electrode wirings of the second type.

[0015] For example, the first type first electrode wirings and the second type first electrode wirings connected to one row of connection circuit units arranged along the first direction are located on both sides of the connection circuit units in that row.

[0016] For example, each first type first electrode wiring includes a first sub-electrode wiring and a second sub-electrode wiring that extend along the same straight line and are insulatedly spaced apart from each other, a portion of the multiple first connection circuit units that is close to the first sub-electrode wiring is connected to the first sub-electrode wiring and a portion of the multiple first connection circuit units that is close to the second sub-electrode wiring is connected to the second sub-electrode wiring, each second type first electrode wiring includes a third sub-electrode wiring and a fourth sub-electrode wiring that extend along the same straight line and are insulatedly spaced apart from each other, a portion of the multiple second connection circuit units that is close to the third sub-electrode wiring is connected to the third sub-electrode wiring and a portion of the multiple second connection circuit units that is close to the fourth sub-electrode wiring is connected to the fourth sub-electrode wiring.

[0017] For example, the circuit board further includes a plurality of second electrode wirings extending along the second direction and located on the side of the first electrode wirings facing the base substrate. Each connection circuit unit further includes a second electrode connection portion, the second electrode connection portion being provided in the same layer as the first electrode wirings, and the second electrode contacts in each connection circuit unit are connected to the second electrode wirings via the second electrode connection portion.

[0018] For example, in the first direction, the orthogonal projection of each second electrode wiring onto the base substrate overlaps with the orthogonal projection of one electrode contact pair and some of the second electrode connecting portions onto the base substrate.

[0019] For example, three adjacent connection circuit units arranged along the second direction are configured into a connection circuit unit group, the second electrode wiring includes a first type of second electrode wiring and a second type of second electrode wiring, a connection circuit unit in the connection circuit unit group is connected to the first type of second electrode wiring, and the other two connection circuit units in the connection circuit unit group are connected to the second type of second electrode wiring, and along the first direction, the width of the first type of second electrode wiring is smaller than the width of the second type of second electrode wiring.

[0020] For example, each connection circuit unit includes two pairs of electrical contacts, each connection circuit unit further includes two first electrode connection portions connected to each of the first electrode contacts, the first electrode connection portions are located on a side of the first electrode contacts away from the second electrode contacts, the first electrode contacts are connected to a first electrode wiring via the first electrode connection portions, and an orthogonal projection of at least a portion of the first electrode connection portions onto the base substrate does not overlap with an orthogonal projection of the second electrode wiring onto the base substrate.

[0021] A display device according to an embodiment of the present disclosure includes the above-mentioned light-emitting plate, which is a display panel.

[0022] In order to more clearly describe the technical solutions in the embodiments of the present disclosure, the following briefly introduces drawings of the embodiments. Obviously, the accompanying drawings described below only relate to some embodiments of the present disclosure, and are not intended to limit the present disclosure. [Brief description of the drawings]

[0023] [Figure 1A] FIG. 2 is a diagram showing a partial planar structure of a light emitting plate according to an embodiment of the present disclosure. [Figure 1B] FIG. 1B is a diagram showing a cross-sectional structure taken along line AA shown in FIG. 1A. [Diagram 2] 1B is a diagram showing the circuits of two light-emitting units included in the light-emitting board shown in FIG. 1A. [Diagram 3]FIG. 13 is a diagram showing a partial planar structure of a light emitting plate according to another embodiment of the present disclosure. [Figure 4] 1 is a schematic diagram showing a partial planar structure of a circuit board according to an embodiment of the present disclosure. [Diagram 5] FIG. 2 is a diagram showing a partial planar structure of a circuit board according to another embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] In order to more clearly describe the objectives, technical solutions and advantages of the embodiments of the present disclosure, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are only some embodiments of the present disclosure, but not all embodiments. Based on the described embodiments of the present disclosure, other embodiments that a person skilled in the art can obtain without creative labor are all included in the protection scope of the present disclosure.

[0025] Unless otherwise defined, technical or scientific terms used in this disclosure have the ordinary meaning as understood by those skilled in the art to which this disclosure belongs. The terms "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are merely used to distinguish different components. Similarly, similar terms such as "comprise" or "include" mean that the elements or things appearing before this term include the elements or things listed after this term and their equivalents, but do not exclude other elements or things.

[0026] The embodiments of the present disclosure provide a light-emitting plate, a circuit board, and a display device. The light-emitting plate includes a base substrate and a plurality of light-emitting units located on the base substrate. The plurality of light-emitting units are arranged in an array on the base substrate along a first direction and a second direction, and each light-emitting unit includes at least one light-emitting subunit, and the light-emitting subunit includes a connection circuit unit and a light-emitting diode chip connected to the connection circuit unit, and the light-emitting diode chip is located on a side of the connection circuit unit away from the base substrate. Each connection circuit unit includes at least two pairs of electrical contacts, and each pair of electrical contacts includes a first electrode contact and a second electrode contact, and in each connection circuit unit, the first electrode contacts are electrically connected to each other, and the second electrode contacts are electrically connected to each other, and only one of the at least two pairs of electrical contacts is connected to the light-emitting diode chip. In an embodiment of the present disclosure, all of the first electrode contacts in at least two electrical contact pairs provided in each connection circuit unit are electrically connected to each other, and all of the second electrode contacts are electrically connected to each other, and when a defect occurs in a light-emitting diode chip connected to one electrical contact pair in a connection circuit unit, the light-emitting subunit can be repaired by connecting a spare light-emitting diode chip to the other spare electrical contact pair.

[0027] Hereinafter, a light emitting plate, a circuit board, and a display device provided according to embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0028] FIG. 1A is a diagram showing a partial planar structure of a light emitting plate according to an embodiment of the present disclosure. FIG. 1B is a diagram showing a cross-sectional structure cut along line AA shown in FIG. 1A. FIG. 2 is a diagram showing the circuits of two light emitting units included in the light emitting plate shown in FIG. 1A. As shown in FIG. 1A, the light emitting plate in the embodiment of the present disclosure includes a base substrate 100 and a plurality of light emitting units 200 located on the base substrate 100. The plurality of light emitting units 200 are arranged in an array on the base substrate 100 along a first direction and a second direction, and in FIG. 1A, the X direction is the first direction and the Y direction is the second direction, for example, the first direction and the second direction intersect, for example, the first direction and the second direction are perpendicular, and the embodiment of the present disclosure includes but is not limited to this. In the embodiment of the present disclosure, the first direction is the column direction and the second direction is the row direction, for example. The column direction and row direction here are relative, e.g. the first direction and the second direction are also interchangeable, i.e. the first direction can also refer to the row direction and the second direction can also refer to the column direction.

[0029] As shown in FIG. 1A and FIG. 1B, each light-emitting unit 200 includes at least one light-emitting subunit 201, and the light-emitting subunit 201 includes a connection circuit unit 210 and one light-emitting diode chip 220 connected to the connection circuit unit 210, and the light-emitting diode chip 220 is located on the side of the connection circuit unit 210 away from the base substrate 100. Each connection circuit unit 210 includes at least two pairs of electrical contacts 211, and each pair of electrical contacts 211 includes a positive electrode contact 2111 and a negative electrode contact 2112, and in each connection circuit unit 210, each positive electrode contact 2111 is electrically connected to each other, and each negative electrode contact 2112 is electrically connected to each other, and only the electrical contact pair 211 of the at least two pairs of electrical contacts 211 is connected to the light-emitting diode chip 220. That is, in each connection circuit unit, all positive electrode contacts are electrically connected, and all negative electrode contacts are electrically connected. The positive electrode contact 2111 is connected to the positive electrode of the light-emitting diode chip 220, and the negative electrode contact 2112 is connected to the negative electrode of the light-emitting diode chip 220. In the embodiment of the present disclosure, each connection circuit unit includes at least two electrical contact pairs, one of which is used to connect the light-emitting diode chip, and the other is used as a spare electrical contact pair. When a defect occurs in the light-emitting diode chip connected to one of the electrical contact pairs, or when the light-emitting diode chip cannot emit light due to a problem such as a disconnection in the electrical contact pair, the light-emitting diode chip can be bound to any of the other spare electrical contact pairs to realize the repair of the light-emitting subunit. The present disclosure will be described by taking an example in which the second electrode contact is a positive electrode contact and the first electrode contact is a negative electrode contact, but is not limited thereto, and both are replaceable.

[0030] For example, as shown in FIG. 1A , in the embodiment of the present disclosure, each connection circuit unit 210 is described as including two electrical contact pairs 211, one of which is connected to the light-emitting diode chip, and the other electrical contact pair is used as a spare electrical contact pair, but the embodiment of the present disclosure is not limited thereto.

[0031] For example, the light-emitting diode chip in the embodiment of the present disclosure may be a miniLED. For example, the miniLED has a maximum size of 500 microns or less in a direction parallel to the base substrate 100. For example, the size of the miniLED may be 0.1 mm×0.17 mm. The embodiment of the present disclosure is not limited thereto, and the light-emitting diode chip may be a micro light-emitting diode chip (microLED). Since the size of the light-emitting diode chip used in the embodiment of the present disclosure is small, for example, the proportion of each light-emitting diode chip in the pixel area / light-emitting area where the light-emitting unit is located is very low (for example, about 2%), it has enough space to set spare electrical contact pairs compared with other types of display panels.

[0032] For example, the connection circuit unit may further include three or more electrical contact pairs, and when the connection circuit unit includes three or more electrical contact pairs, one of the electrical contact pairs is connected to the light-emitting diode chip, and the other electrical contact pairs are used as spare electrical contact pairs. For example, the situation in which a defect occurs in the light-emitting diode chip may include a short circuit or disconnection between the positive and negative electrodes of the light-emitting diode chip. In this case, the connection between the negative electrode and the negative wiring of the defective light-emitting diode chip and then the spare light-emitting diode chip are connected to the spare electrical contact pair, thereby realizing the repair of the light-emitting subunit. Note that the spare light-emitting diode chip connected to the spare electrical contact pair and the defective light-emitting diode chip should be chips that emit light of the same color.

[0033] For example, as shown in Fig. 1A, the light emitting plate further includes a plurality of negative wirings 300 extending along a first direction (X direction). The negative wirings 300 include a first negative wiring 310 and a second negative wiring 320, and one row of light emitting subunits 201 arranged along the first direction includes a first light emitting subunit 2011 and a second light emitting subunit 2012, the first light emitting subunit 2011 is connected to the first negative wiring 310 via a corresponding negative contact 2112, the second light emitting subunit 2012 is connected to the second negative wiring 320 via a corresponding negative contact 2112, and the light emitting subunits in one row are connected to the corresponding two negative wirings.

[0034] Compared with the general case where one row of light-emitting subunits (e.g., one row of subpixels) is connected to one negative wiring, in the embodiment of the present disclosure, a portion of the multiple light-emitting subunits arranged along the first direction is connected to a first negative wiring and another portion is connected to a second negative wiring, thereby reducing the number of light-emitting subunits connected to each negative wiring, i.e., reducing the number of light-emitting diode chips connected to each negative wiring, and further effectively reducing the current on each negative wiring, thereby reducing the power consumption of the negative wiring.

[0035] For example, in one embodiment of the present disclosure, the light-emitting plate may adopt a double-sided driving, and the light-emitting plate may further include two drivers connected to the negative wiring, and these two drivers are respectively located on both side edges of the light-emitting plate along the first direction. The first negative wiring may be connected to one driver, and the second negative wiring may be connected to another driver. The first negative wiring and the second negative wiring connected to a column of light-emitting subunits may be located on the same side as the light-emitting subunits of the column, or may be located on both sides of the light-emitting subunits of the column.

[0036] For example, taking the positive direction of the X direction (the direction indicated by the arrow) shown in FIG. 1A as an example, the light-emitting subunits in the same row may be divided into two parts, upper and lower, and the number of light-emitting subunits in the two parts may be the same or different. If the interval between the light-emitting subunits in the two parts is a partition line, the first negative wiring and the second negative wiring may be located on both sides of the partition line, respectively, thereby being connected to the light-emitting subunits located on both sides of the partition line. The embodiment of the present disclosure is not limited thereto, and both the first negative wiring and the second negative wiring can pass through the above-mentioned partition line as long as the first negative wiring and the second negative wiring are respectively connected to the light-emitting subunits on both sides of the partition line.

[0037] For example, when the first negative wiring and the second negative wiring are located on both sides of the partition line, the first negative wiring and the second negative wiring connected to one row of light-emitting subunits can be located not only on the same side as the light-emitting subunits in the row, but also on both sides of the light-emitting subunits in the row, as long as the orthogonal projections of the first negative wiring and the second negative wiring do not overlap. In this case, each negative wiring may be provided to have a wider line width in order to reduce power consumption.

[0038] For example, in another example of the embodiment of the present disclosure, the light-emitting plate may adopt one-sided driving, and the light-emitting plate may further include one driver connected to each negative wiring, the driver being located at either side edge of the light-emitting plate along the first direction. Both the first negative wiring and the second negative wiring are connected to the driver. The first negative wiring and the second negative wiring connected to a column of light-emitting subunits may be located on both sides of the light-emitting subunits in the column.

[0039] In the embodiment shown in Fig. 1A, both the first negative wiring and the second negative wiring are continuous wiring. The embodiment shown in Fig. 1A takes as an example, but is not limited to, each negative wiring has one signal input terminal.

[0040] For example, as shown in FIG. 1A, the first negative electrode wiring 310 and the second negative electrode wiring 320 connected to one row of light-emitting subunits 201 arranged along the first direction are located on both sides of the light-emitting subunits 201 in the row, respectively, so that the negative electrode contacts in the light-emitting subunits in the row do not cross other negative electrode wirings when connecting to the corresponding negative electrode wirings, making it easier to design the wiring. Two negative electrode wirings 300 are provided between two adjacent rows of light-emitting subunits 201 arranged along the second direction, and the interval between the two negative electrode wirings 300 is a safety distance to ensure that the two are not short-circuited, for example, the interval between the two negative electrode wirings 300 may be 15 microns or more. For example, when ensuring that the interval between the two negative electrode wirings 300 between the two adjacent rows of light-emitting subunits 201 meets the safety distance, the line width of each negative electrode wiring 300 can be set as wide as possible, which not only ensures the flatness of the negative electrode wiring, but also reduces the resistance of the negative electrode wiring.

[0041] For example, as shown in Fig. 1A, the first light-emitting subunits 2011 and the second light-emitting subunits 2012 may be arranged alternately along the first direction, thereby ensuring the uniformity of the light emission of the light-emitting subunits. The embodiment of the present disclosure is not limited to the arrangement and number of the first light-emitting subunits and the second light-emitting subunits, and it is only necessary that the first light-emitting subunits are connected to the first negative wiring and the second light-emitting subunits are connected to the second negative wiring, and the number of light-emitting subunits connected to each negative wiring is reduced.

[0042] For example, since the number of first light-emitting subunits 2011 and second light-emitting subunits 2012 is the same, it is possible to ensure as much as possible that the current flowing through each negative wiring is approximately equal, thereby preventing large power consumption in individual negative wiring.

[0043] For example, as shown in FIG. 1A, the luminescent plate further includes a plurality of positive wirings 400 extending along the second direction (Y direction), and the positive wirings 400 are located between the negative wirings 300 and the base substrate 100. Each connection circuit unit 210 further includes a positive electrode connector 212, and the positive electrode connector 212 and the negative wirings 300 are provided in the same layer, and the positive electrode contacts 2111 in each connection circuit unit 210 are connected to the positive wirings 400 via the positive electrode connector 212. The present disclosure will be described by way of example in which the first electrode wiring is a negative electrode wiring and the second electrode wiring is a positive electrode wiring. However, this is not limited thereto, and both are interchangeable, that is, the first electrode wiring may be a positive electrode wiring and the second electrode wiring may be a negative electrode wiring.

[0044] 1A, the positive contact 2111 and the negative contact 2112 may be provided in the same layer as the negative wiring 300 and may be made of the same material. For example, the positive contact 2111, the negative contact 2112, and the negative wiring 300 may be formed by employing the same patterning process on the same material. For example, the material of the negative wiring 300 may include copper.

[0045] For example, as shown in FIG. 1A, the positive electrode connector 212 and the negative electrode wiring 300 may be formed by employing the same patterning process on the same material.

[0046] For example, when a safe distance is maintained between the positive electrode connection part 212 and the negative electrode wiring 300 located on either side of it, the line width of the positive electrode connection part 212 can be made as wide as possible to reduce the resistance of the positive electrode connection part 212 and further reduce power consumption.

[0047] For example, as shown in FIG. 1A, the positive contact 2111 may be a unitary structure with the positive connector 212 for ease of manufacturing.

[0048] For example, as shown in FIG. 1A, when the connection circuit unit 210 includes two pairs of electrical contacts 211, along the first direction, the two positive electrode contacts 2111 are respectively located on both side edges of the positive electrode connection portion 212, and the two negative electrode contacts 2112 are located on the side away from the positive electrode connection portion 212 of the corresponding positive electrode contact 2111 and are spaced apart from each other.

[0049] 1A, an insulating layer (not shown) is provided between the positive electrode connector 212 and the positive electrode wiring 400, and the positive electrode connector 212 can achieve electrical connection with the positive electrode wiring 400 through via holes 500 penetrating the insulating layer. For example, each positive electrode connector 212 can be electrically connected to the positive electrode wiring 400 through a plurality of via holes 500 to ensure electrical connection results.

[0050] For example, as shown in FIG. 1A, in each line unit 210, the distance between the two positive electrical contacts 2111 is greater than 20 micrometers, so that the positive connection portion 212 and the via hole 500 are provided between the two positive contacts 2111.

[0051] 1A, in the first direction, the orthogonal projection of each positive electrode wiring 400 onto the base substrate 100 overlaps with the orthogonal projection of one electrical contact pair 211 and a part of the positive electrode connection portions 212 onto the base substrate 100. In the embodiment of the present disclosure, by setting the line width of the positive electrode wiring to be wide, the power consumption of the wiring can be reduced.

[0052] For example, as shown in FIG. 1A, each connection circuit unit 210 further includes two negative electrode connecting parts 213 connected to each negative electrode contact 2112, the negative electrode connecting parts 213 are located on the side of the negative electrode contact 2112 away from the positive electrode contact 2111, the negative electrode contact 2112 is connected to the negative electrode wiring 300 via the negative electrode connecting parts 213, and the positive projection of at least a part of the negative electrode connecting parts 213 onto the base substrate 100 does not overlap with the positive projection of the positive electrode wiring 400 onto the base substrate 100. In the embodiment of the present disclosure, by providing a negative electrode connecting part that does not at least partially overlap both the positive electrode wiring and the negative electrode wiring, when a defect occurs in the light-emitting diode chip, the negative electrode connecting parts can be cut by means such as laser cutting to cut the connection between the negative electrode contacts and the negative electrode wiring, thereby realizing the repair of the light-emitting subunit. By providing a negative electrode connecting part, it is possible to avoid the cutting process affecting the positive electrode wiring and the negative electrode wiring.

[0053] For example, as shown in FIG. 1A, the negative electrode connection part 213 may be provided integrally with the negative electrode contact 2112. For example, the negative electrode connection part 213 may include a first part extending along a first direction and a second part extending along a second direction, the first part being used to connect to the negative electrode wiring 300, and the second part being used to connect to the negative electrode contact. The present disclosure will be described using an example in which the first electrode connection part is a negative electrode connection part and the second electrode connection part is a positive electrode connection part. Without being limited thereto, the first electrode connection part may be a positive electrode connection part, and the second electrode connection part may be a negative electrode connection part.

[0054] For example, as shown in FIG 1A, each light-emitting unit 200 may include three different color light-emitting subunits 201 arranged along the second direction, where the positive wiring 400 includes a first positive wiring 410 and a second positive wiring 420, and one light-emitting subunit 201 in the light-emitting unit 200 is connected to the first positive wiring 410, and the other two light-emitting subunits 201 in the light-emitting unit 200 are connected to the second positive wiring 420. In the embodiment of the present disclosure, by connecting each light-emitting unit to two positive wirings, the light-emitting subunits of one color may be independently controlled.

[0055] For example, the light-emitting unit can include a red light-emitting subunit, a green light-emitting subunit and a blue light-emitting subunit. Since the green light-emitting unit and the blue light-emitting unit have a close lighting voltage (referring to the operating voltage when the luminance of the device reaches 1cd / m2), and the difference between the lighting voltage of the red light-emitting subunit and the lighting voltage of the above two is large, the red light-emitting subunit is connected to the first positive wiring alone, and the green light-emitting subunit and the blue light-emitting subunit are connected to the second positive wiring, so that it can be guaranteed that the lighting voltage corresponding to each light-emitting subunit is applied, which not only can save electrical energy, but also can prevent an overload voltage from being applied to a light-emitting subunit of a certain color.

[0056] For example, as shown in FIG. 1A, along the first direction, both the first positive wire 410 and the second positive wire 420 have a minimum width. Taking the first positive wire as an example, assuming that M light emitting units are arranged along the second direction, the voltage drop value of the first positive wire IRdrop=I t *R and I t is the total current of the M light-emitting units arranged along the second direction, R is the resistance of the first positive wiring in the light-emitting unit, and satisfies R=Rs*P / Wr. Rs is the sheet resistance of the first positive wiring, Wr is the width of the first positive wiring, and P is the period of the light-emitting unit along the second direction. Combining the above two equations, Wr=(I t *Rs*P) / (IR drop). In order to guarantee uniformity of display brightness, the voltage drop (IR drop) of the first positive wiring must be less than a certain value K, and when IR drop=K, the minimum width of Wr is Wrm. Similarly, the second positive wiring 420 has a minimum width.

[0057] For example, along the first direction, the width of the first positive wiring 410 may be smaller than the width of the second positive wiring 420, but is not limited to this, and the dimensional relationship between the widths of the two positive wirings may be determined according to the dimensional relationship between the flowing currents.

[0058] For example, as shown in Fig. 1B, the base substrate 100 may be a glass substrate. In the embodiment of the present disclosure, a glass substrate provided with a line connection unit, such as a printed circuit board (PCB substrate) for electrically connecting a light-emitting diode chip in a backlight or display panel, is used instead of a commonly used substrate, thereby overcoming the problem of poor heat dissipation performance of a typical PCB substrate.

[0059] For example, as shown in Figures 1A and 1B, the material of the first negative electrode wiring 310, the second negative electrode wiring 320 and the positive electrode wiring 400 may be a conductive material such as copper. Taking the material of the above wiring as copper as an example, the two copper layers may be deposited on the base substrate by a sputtering method, or may be formed on the base substrate by electroplating. For example, the thicker the first negative electrode wiring, the second negative electrode wiring and the positive electrode wiring are, the lower the power consumption will be, and when the luminescent plate is used as a display panel, the higher the display effect will be.

[0060] For example, as shown in FIG. 1A and FIG. 1B, a first buffer layer 103 is provided between the positive electrode wiring 400 and the base substrate 100, and the material of the first buffer layer 103 can include silicon nitride. A second buffer layer 104, a flat layer 105, and a passivation layer 106 are sequentially provided between the positive electrode wiring 400 and the first negative electrode wiring 310. The material of the flat layer 105 can be a resin, and the thicker the flat layer 105 is, the smaller the coupling capacitance between the wiring layers located on both sides of it is. The materials of the second buffer layer 104 and the passivation layer 106 can both be silicon nitride, and are used to avoid the problem of poor adhesion caused by direct contact between the flat layer 105 and the metal layers on both sides.

[0061] For example, as shown in FIGS. 1A and 1B, a via hole 500 is provided in the second buffer layer 104, the flat layer 105, and the passivation layer 106 so that the positive electrode connection portion 212 can be electrically connected to the positive electrode wiring.

[0062] For example, as shown in FIG. 1B , an insulating layer 107 is provided on the side of the line connection unit 210 away from the base substrate 100, and the insulating layer 107 includes two via holes for exposing the positive contact 2111 and the negative contact 2112, respectively, and the light-emitting diode chip 220 is located on the side of the insulating layer 107 away from the line connection unit 210, and the positive and negative electrodes included in the light-emitting diode chip 220 are electrically connected to the positive contact 2111 and the negative contact 2112, respectively, through the via holes in the insulating layer 107.

[0063] For example, as shown in FIG. 1B, the positive electrode contact 2111 and the positive electrode connection portion 212 have an integral structure, and the positive electrode connection portion 212 is connected to the positive electrode wiring 400 through a plurality of via holes 500 so as to electrically connect the positive electrode wiring 400 to the positive electrode of the light-emitting diode chip 220.

[0064] For example, as shown in FIG. 1B, positive contact 2111 and negative contact 2112 are provided on the same layer and are spaced apart from each other.

[0065] For example, the surfaces of the positive electrode contact 2111 and the negative electrode contact 2112 away from the base substrate 100 can be located in the same plane as the surface of the positive electrode connection part 212 away from the base substrate 100, and the present disclosure is not limited thereto. For example, the positive electrode contact 2111 and the negative electrode contact 2112 include two protrusions extending into two via holes in the insulating layer 107, respectively, and the positive electrode and the negative electrode included in the light-emitting diode chip 220 are electrically connected to the protrusions of the electrical contact pair through the above-mentioned via holes. The above-mentioned protrusions may be made by the same film forming process as the film layer in which the positive electrode connection part 212 is located, and may be formed in a sequential patterning process by a halftone mask process.

[0066] 1A and 2, each light emitting unit 200 may include two bind areas (light emitting diode chip connection areas), i.e., a first bind area 2201 and a second bind area 2202. Two pairs of electrical contacts 211 included in each connection circuit unit 210 are located in the first bind area 2201 and the second bind area 2202, respectively, and the positive electrode connection part 212 is located between the two bind areas to realize electrical connection with the positive electrode wiring 400.

[0067] For example, as shown in FIG. 1A and FIG. 2, a plurality of light-emitting subunits 201 in a light-emitting unit 200 can be all bound to a first bind area to realize the centralized setting of the light-emitting positions of three light-emitting subunits, and the display is uniform. When a defect occurs in a light-emitting diode chip in any of the light-emitting subunits bound to the first bind area 2201, a light-emitting diode chip of the same color can be bound to a spare electrical contact pair in the second bind area 2202, and the spare electrical contact pair and the spare electrical contact pair connected to the defective light-emitting diode chip can be located in a straight line. Of course, the embodiment of the present disclosure is not limited thereto, and a plurality of light-emitting subunits in a light-emitting unit can be all bound to a second bind area, and the electrical contact pairs in the first bind area are all used as spare electrical contact pairs.

[0068] For example, the light-emitting unit 200 includes three light-emitting subunits 201 arranged along the second direction, and the light-emitting subunits 201 located on both sides may be bound to the same binding area, and the light-emitting subunit 201 located in the center is bound to another binding area, and the connecting lines of the binding positions of the three light-emitting subunits 201 form a triangle, which is more advantageous in achieving uniformity of light emission.

[0069] The light-emitting plate shown in Fig. 1A may be a display panel, for example, a passive matrix (PM) display panel, the light-emitting unit is a pixel unit, and the light-emitting subunit included in the light-emitting unit is a sub-pixel. The display panel according to the embodiment of the present disclosure can provide a spare pair of electrical contacts to not only improve the binding yield of the product, but also reduce the power consumption of the negative wiring.

[0070] Of course, the luminescent plate according to the embodiments of the present disclosure may further be used as a backlight to be combined with a liquid crystal display panel, and the embodiments of the present disclosure are not limited thereto.

[0071] 3 is a diagram showing a partial planar structure of a luminescent plate according to another embodiment of the present disclosure. As shown in FIG. 3, compared with the embodiment shown in FIG. 1A, the difference of the embodiment shown in FIG. 3 is that the first negative electrode wire 310 is not a continuous wire, but is cut in the center to form the first sub-negative electrode wire 311 and the second sub-negative electrode wire 312, and the two ends of the first sub-negative electrode wire 311 and the second sub-negative electrode wire 312 that are apart from each other are two signal input terminals 301 and 302, and the second negative electrode wire 320 is not a continuous wire, but is cut in the center to form the third sub-negative electrode wire 321 and the fourth sub-negative electrode wire 322, and the two ends of the third sub-negative electrode wire 321 and the fourth sub-negative electrode wire 322 that are apart from each other are configured as two signal input terminals 303 and 304. This disclosure will be described using an example in which the first sub-electrode wiring is the first sub-negative wiring, the second sub-electrode wiring is the second sub-negative wiring, the third sub-electrode wiring is the third sub-negative wiring, and the fourth sub-electrode wiring is the fourth sub-negative wiring.

[0072] For example, each first negative wiring 310 includes a first sub-negative wiring 311 and a second sub-negative wiring 312 which extend along the same straight line and are insulatingly spaced apart from each other, and the spacing between the first sub-negative wiring 311 and the second sub-negative wiring 312 is equal to or smaller than the spacing between two adjacent light-emitting subunits, and each second negative wiring 320 includes a third sub-negative wiring 321 and a fourth sub-negative wiring 322 which extend along the same straight line and are insulatingly spaced apart from each other, and the spacing between the third sub-negative wiring 321 and the fourth sub-negative wiring 322 is equal to or smaller than the spacing between two adjacent light-emitting subunits.

[0073] As shown in FIG. 3, the luminescent plate according to this embodiment may adopt a double-sided driving, in which the first sub-negative wire 311 and the second sub-negative wire 312 included in the first negative wire 310 are respectively connected to two drivers, and the third sub-negative wire 321 and the fourth sub-negative wire 322 included in the second negative wire 320 are respectively connected to the above-mentioned two drivers, and these two drivers may be located on both side edges of the luminescent plate along the first direction, respectively.

[0074] For example, as shown in FIG. 3, the signal input terminal 301 of the first sub-negative wiring 311 and the signal input terminal 303 of the third sub-negative wiring 321 may be connected to the same driver, and the signal input terminal 302 of the second sub-negative wiring 312 and the signal input terminal 304 of the fourth sub-negative wiring 322 may be connected to the same driver.

[0075] For example, as shown in FIG. 3, the first sub-negative wire 311 and the second sub-negative wire 312 may be positioned on the same straight line, and the third sub-negative wire 321 and the fourth sub-negative wire 322 may be positioned on the same straight line.

[0076] 3, among the multiple first light-emitting subunits 2011, a portion close to the first sub-negative wiring 311 is connected to the first sub-negative wiring 311, and among the multiple first light-emitting subunits 2011, a portion close to the second sub-negative wiring 312 is connected to the second sub-negative wiring 312. Among the multiple second light-emitting subunits 2012, a portion of the third sub-negative wiring 321 is connected to the third sub-negative wiring 321, and among the multiple second light-emitting subunits 2012, a portion close to the fourth sub-negative wiring 322 is connected to the fourth sub-negative wiring 322.

[0077] For example, a plurality of light-emitting subunits in the same row may be divided into two parts along the first direction, and the number of light-emitting subunits in the two parts may be the same or different. If the interval between the light-emitting subunits in the two parts is a partition line, the first sub-negative wiring and the second sub-negative wiring are located on both sides of the partition line, respectively, and are connected to the light-emitting subunits located on both sides of the partition line, and the third sub-negative wiring and the fourth sub-negative wiring are located on both sides of the partition line, respectively, and are connected to the light-emitting subunits located on both sides of the partition line.

[0078] Compared with the general case where one column of light-emitting subunits (e.g., one column of subpixels) is connected to one negative wiring, in the embodiment of the present disclosure, one column of light-emitting subunits arranged along a first direction includes four parts of light-emitting subunits, in which the first part of the light-emitting subunits is connected to the first sub-negative wiring, the second part of the light-emitting subunits is connected to the second sub-negative wiring, the third part of the light-emitting subunits is connected to the third sub-negative wiring, and the fourth part of the light-emitting subunits is connected to the fourth sub-negative wiring, i.e., one column of light-emitting subunits is connected to four negative wirings, thereby further reducing the number of light-emitting subunits connected to each negative wiring, i.e., reducing the number of light-emitting diode chips connected to each negative wiring, and further effectively reducing the current on each negative wiring, thereby reducing the power consumption of the negative wiring.

[0079] The characteristics of the positive electrode wiring in the embodiments of the present disclosure, the number and arrangement of light-emitting subunits included in the light-emitting unit, and the characteristics of the connection circuit unit included in the light-emitting subunit are all the same as those of the embodiments shown in Figures 1A and 2, and therefore will not be described here.

[0080] 3 is a display panel, the light-emitting unit is a pixel unit, and the light-emitting subunit included in the light-emitting unit is a sub-pixel. The display panel according to the embodiment of the present disclosure can provide a spare pair of electrical contacts to not only improve the binding yield of the product, but also reduce the power consumption of the negative wiring.

[0081] Of course, the luminescent plate according to the embodiments of the present disclosure may further be used as a backlight to be combined with a liquid crystal display panel, and the embodiments of the present disclosure are not limited thereto.

[0082] A display device according to another embodiment of the present disclosure includes any one of the display panels described above. The display device provided by the embodiment of the present disclosure can provide a spare pair of electrical contacts to improve the binding yield of the product, as well as reduce the power consumption of the negative wiring.

[0083] Fig. 4 is a diagram showing a partial planar structure of a circuit board according to an embodiment of the present disclosure. As shown in Fig. 4, the circuit board includes a base substrate 100 and a plurality of connection circuit units 210 located on the base substrate 100. The plurality of connection circuit units 210 are arranged in an array on the base substrate 100 along a first direction and a second direction, and in Fig. 4, the X direction is the first direction and the Y direction is the second direction as an example.

[0084] As shown in FIG. 4, each connection circuit unit 210 includes at least two electrical contact pairs 211, each of which includes a positive contact 2111 and a negative contact 2112, and in each connection circuit unit 210, the positive contacts 2111 are electrically connected to each other, and the negative contacts 2112 are electrically connected to each other. The positive contact 2111 and the negative contact 2112 of only one of the at least two electrical contact pairs 211 are configured to be connected to the positive and negative electrodes of one light-emitting diode chip, respectively. In the embodiment of the present disclosure, each connection circuit unit includes at least two electrical contact pairs, and one of the at least two electrical contact pairs is used to connect the light-emitting diode chip, and the other electrical contact pair is used as a spare electrical contact pair. When a defect occurs in a light-emitting diode chip connected to one of the electrical contact pairs, the light-emitting diode chip can be bound to any of the other spare electrical contact pairs to realize the repair of the light-emitting subunit.

[0085] 4, in the embodiment of the present disclosure, each connection circuit unit 210 is described as including two electrical contact pairs 211, one of which is configured to be connected to the light-emitting diode chip, and the other electrical contact pair is used as a spare electrical contact pair. However, the embodiment of the present disclosure is not limited thereto, and the connection circuit unit may further include three or more electrical contact pairs, and when the connection circuit unit includes three or more electrical contact pairs, one of the electrical contact pairs is configured to be connected to the light-emitting diode chip, and the other electrical contact pair is used as a spare electrical contact pair.

[0086] For example, as shown in Fig. 4, the circuit board further includes a plurality of negative wirings 300 extending along a first direction (X direction). The negative wirings 300 include a first negative wiring 310 and a second negative wiring 320, and one row of connection circuit units 210 arranged along the first direction includes a plurality of first connection circuit units 2101 and a plurality of second connection circuit units 2102, and the negative contacts 2112 of the first connection circuit units 2101 are connected to the first negative wiring 310, and the negative contacts 2112 of the second connection circuit units 2102 are connected to the second negative wiring 320. For example, if one row of connection circuit units arranged along the first direction is one row of connection circuit units, the one row of connection circuit units is connected to two corresponding negative wirings.

[0087] Compared with the case where one row of connection circuit units (e.g., one row of connection circuit units is configured to be connected to one row of sub-pixels) is connected to one negative electrode wiring, in the embodiment of the present disclosure, the connection circuit units arranged along the first direction are connected to two negative electrode wirings, thereby reducing the number of connection circuit units connected to each negative electrode wiring, i.e., reducing the number of light-emitting diode chips connected to each negative electrode wiring, and further effectively reducing the current on each negative electrode wiring, thereby reducing the power consumption of the negative electrode wiring.

[0088] For example, as shown in FIG. 4, the first negative wiring 310 and the second negative wiring 320 connected to one row of the connection circuit units 210 arranged along the first direction are located on both sides of the connection circuit units 210 of the row, and as a result, the negative contacts in the light-emitting subunits of the row do not cross other negative wirings when connecting to the corresponding negative wirings, making it easier to design the wiring. Taking the example of one row of light-emitting subunits arranged along the first direction as one row of light-emitting subunits, two negative wirings 300 are provided between two adjacent rows of connection circuit units 210 arranged along the second direction, and the interval between the two negative wirings 300 is a safety distance to ensure that the two are not short-circuited, for example, the interval between the two negative wirings 300 may be 15 microns or more. For example, when ensuring that the interval between the two negative wirings 300 between the two adjacent rows of connection circuit units 210 satisfies the safety distance, the line width of each negative wiring 300 can be set as wide as possible (for example, 30 microns), and the resistance of the negative wiring can also be reduced.

[0089] For example, the first connection circuit unit 2101 and the second connection circuit unit 2102 may be alternately arranged along the first direction as shown in Fig. 4. The embodiment of the present disclosure is not limited to this, and it is sufficient that the first connection circuit unit is connected to the first negative wiring, and the second connection circuit unit is connected to the second negative wiring, thereby reducing the number of connection circuit units connected to each negative wiring.

[0090] For example, the number of first connection circuit units 2101 and the number of second connection circuit units 2102 are the same.

[0091] 4, the circuit board further includes a plurality of positive wirings 400 extending along the second direction (i.e., the Y direction), and the positive wirings 400 are located between the negative wirings 300 and the base substrate 100. Each connection circuit unit 210 further includes a positive connector 212, and the positive connector 212 and the negative wirings 300 are provided in the same layer, and the positive contacts 2111 in each connection circuit unit 210 are connected to the positive wirings 400 via the positive connector 212.

[0092] For example, as shown in FIG. 4, the positive contact 2111 may be a unitary structure with the positive connector 212 for ease of manufacturing.

[0093] For example, as shown in FIG. 4, when the connection circuit unit 210 includes two pairs of electrical contacts 211, along the first direction, the two positive electrode contacts 2111 are respectively located on both side edges of the positive electrode connection portion 212, and the two negative electrode contacts 2112 are located on the side away from the positive electrode connection portion 212 of the corresponding positive electrode contact 2111 and are spaced apart from each other.

[0094] For example, as shown in FIG. 4, an insulating layer (not shown) is provided between the positive electrode connection portion 212 and the positive electrode wiring 400, and the positive electrode connection portion 212 can achieve electrical connection with the positive electrode wiring 400 through a via hole 500 that penetrates the insulating layer.

[0095] 4, in the first direction, the orthogonal projection of each positive electrode wiring 400 onto the base substrate 100 overlaps with the orthogonal projection of one electrical contact pair 211 and a portion of the positive electrode connection portions 212 onto the base substrate 100. In the embodiment of the present disclosure, by setting the line width of the positive electrode wiring to be wide, the power consumption of the wiring can be reduced.

[0096] For example, as shown in FIG. 4, each connection circuit unit 210 further includes two negative electrode connecting parts 213 connected to each negative electrode contact 2112, the negative electrode connecting parts 213 are located on the side of the negative electrode contact 2112 away from the positive electrode contact 2111, the negative electrode contact 2112 is connected to the negative electrode wiring 300 via the negative electrode connecting parts 213, and the positive projection of at least a part of the negative electrode connecting parts 213 onto the base substrate 100 does not overlap with the positive projection of the positive electrode wiring 400 onto the base substrate 100. In the embodiment of the present disclosure, by providing a negative electrode connecting part that does not at least partially overlap both the positive electrode wiring and the negative electrode wiring, when a defect occurs in the light-emitting diode chip, the negative electrode connecting part can be cut by means such as laser cutting, and the connection between the negative electrode contact and the negative electrode wiring can be cut, thereby realizing the repair of the light-emitting subunit. By providing a negative electrode connecting part, it is possible to avoid the cutting process affecting the positive electrode wiring and the negative electrode wiring.

[0097] 4, three adjacent connection circuit units 210 arranged along the second direction are configured into a connection circuit unit group 2100, the positive wiring 400 includes a first positive wiring 410 and a second positive wiring 420, the connection circuit unit 210 in the connection circuit unit group 2100 is connected to the first positive wiring 410, and the other two connection circuit units 210 in the connection circuit unit group 2100 are connected to the second positive wiring 420, and along the first direction, the width of the first positive wiring 410 is smaller than the width of the second positive wiring 420. In the embodiment of the present disclosure, each connection circuit unit group is connected to two positive wirings, so that one connection circuit unit may be independently controlled.

[0098] For example, the three connection circuit units are respectively connected to a red light-emitting diode chip, a green light-emitting diode chip, and a blue light-emitting diode chip. For example, the connection circuit unit connected to the red light-emitting diode chip may be connected to the first positive wiring, and the connection circuit units connected to the green light-emitting diode chip and the blue light-emitting diode chip may be connected to the second positive wiring to ensure that the lighting voltage corresponding to each light-emitting subunit is applied, which not only can save electrical energy but also can prevent an overload voltage from being applied to a light-emitting subunit of a certain color.

[0099] The circuit board shown in FIG. 4 is a structure of the light emitting plate shown in FIG. 1A other than the light emitting diode chip, and the specific features of the circuit board are the same as those of the circuit board shown in FIG. 1A. Therefore, for the features of the circuit board in the embodiment of FIG. 4, reference can be made to the embodiment corresponding to FIG. 1A. The circuit board may be applied to a display panel or a backlight, and the circuit board provided by the embodiment of the present disclosure can provide a spare pair of electrical contacts to not only improve the binding yield of the product, but also reduce the power consumption of the negative wiring.

[0100] Fig. 5 is a diagram showing a partial planar structure of a circuit board according to another embodiment of the present disclosure. As shown in Fig. 5, compared with the embodiment shown in Fig. 4, the difference of the embodiment shown in Fig. 1 is that the first negative electrode wire 310 is not a continuous wire, but is cut in the center to form the first sub-negative electrode wire 311 and the second sub-negative electrode wire 312, and the second negative electrode wire 320 is not a continuous wire, but is cut in the center to form the third sub-negative electrode wire 321 and the fourth sub-negative electrode wire 322.

[0101] As shown in FIG. 5, the circuit board provided by this embodiment may be used for double-sided driving, in which the first sub-negative wiring 311 and the second sub-negative wiring 312 included in the first negative wiring 310 are respectively connected to two drivers, and the third sub-negative wiring 321 and the fourth sub-negative wiring 322 included in the second negative wiring 320 are respectively connected to the above-mentioned two drivers, and these two drivers can be located on both side edges of the circuit board along the first direction, respectively.

[0102] For example, as shown in FIG. 5, the first sub-negative wire 311 and the second sub-negative wire 312 may be positioned on the same straight line, and the third sub-negative wire 321 and the fourth sub-negative wire 322 may be positioned on the same straight line.

[0103] 5, among the multiple first connection circuit units 2101, a portion close to the first sub-negative wiring 311 is connected to the first sub-negative wiring 311, and among the multiple first connection circuit units 2101, a portion close to the second sub-negative wiring 312 is connected to the second sub-negative wiring 312. Among the multiple second connection circuit units 2102, a portion of the third sub-negative wiring 321 is connected to the third sub-negative wiring 321, and among the multiple second connection circuit units 2102, a portion close to the fourth sub-negative wiring 322 is connected to the fourth sub-negative wiring 322.

[0104] For example, a plurality of connection circuit units in the same column may be divided into two parts along the first direction, and the number of connection circuit units in the two parts may be the same or different. If the interval between the connection circuit units in the two parts is a partition line, the first sub-negative wiring and the second sub-negative wiring are located on both sides of the partition line, respectively, and are connected to the connection circuit units located on both sides of the partition line, and the third sub-negative wiring and the fourth sub-negative wiring are located on both sides of the partition line, respectively, and are connected to the connection circuit units located on both sides of the partition line.

[0105] Compared with the case where one row of connection circuit units (e.g., one row of connection circuit units is configured to be connected to one row of sub-pixels) is connected to one negative electrode wiring, in the embodiment of the present disclosure, one row of connection circuit units is connected to four negative electrode wirings, thereby reducing the number of connection circuit units connected to each negative electrode wiring, i.e., reducing the number of light-emitting diode chips connected to each negative electrode wiring, and further effectively reducing the current on each negative electrode wiring, thereby reducing the power consumption of the negative electrode wiring.

[0106] The features of the positive electrode wiring and the number and arrangement of the connection circuit units in the embodiment of the present disclosure are all the same as those in the embodiment shown in FIG. 4, and therefore description thereof will be omitted here.

[0107] The circuit board shown in FIG. 5 is a structure of the light emitting plate shown in FIG. 3 other than the light emitting diode chip, and the specific features of the circuit board are the same as those of the circuit board shown in FIG. 3. Therefore, for the features of the circuit board in the embodiment of FIG. 5, reference can be made to the embodiment corresponding to FIG. 3. The circuit board may be applied to a display panel or a backlight, and the circuit board provided by the embodiment of the present disclosure can not only improve the binding yield of the product by providing a spare pair of electrical contacts, but also reduce the power consumption of the negative wiring.

[0108] A few points need to be explained: (1) The accompanying drawings of the embodiments of the present disclosure relate only to the structure of the embodiments of the present disclosure, and for other structures, reference may be made to the general design. (2) Where there is no inconsistency, features in the same and different embodiments of the present disclosure may be combined with each other.

[0109] The above are merely exemplary embodiments of the present disclosure, and are not intended to limit the protection scope of the present disclosure, which is determined by the appended claims. [Explanation of symbols]

[0110] 100 Base Board 103 First buffer layer 104 Second buffer layer 105 Flat layer 106 Passivation Layer 107 Insulating layer 200 Light Units 201 Light-emitting subunit 210 Connection circuit unit 2101 First connection circuit unit 2102 Second connection circuit unit 2100 Connection Circuit Unit Group 211 Electrical contact pair 2111 Positive contact 2112 Negative contact 212 Positive electrode connection 213 Negative electrode connection part 220 Light Emitting Diode Chip 2201 1st Bind Area 2202 2nd Bind Area 300 Negative Wiring 301 Signal input terminal 302 Signal input terminal 303 Signal input terminal 304 Signal input terminal 310 1st negative electrode wiring 311 1st sub negative wiring 320 2nd negative electrode wiring 2011 First light-emitting subunit 2012 Second light-emitting subunit 310 1st negative electrode wiring 311 1st sub negative wiring 312 Second sub negative wiring 320 2nd negative electrode wiring 321 3rd sub negative wiring 322 4th negative electrode wiring 400 Positive Wiring 410 1st positive wire 420 2nd positive wiring 500 Beer Hall

Claims

1. A light-emitting plate, A base substrate; a plurality of light-emitting units arranged in an array on the base substrate along a first direction and a second direction, each of the light-emitting units including at least one light-emitting subunit, the light-emitting subunit including a connection circuit unit and one light-emitting diode chip connected to the connection circuit unit, the light-emitting diode chip being located on a side of the connection circuit unit away from the base substrate; A plurality of first electrode wirings extending along the first direction; a plurality of second electrode wirings extending along the second direction and including a first type second electrode wiring and a second type second electrode wiring; Including, Each of the connection circuit units includes at least two pairs of electrical contacts, each pair of electrical contacts including a first electrode contact and a second electrode contact, in each of the connection circuit units, the first electrode contacts are electrically connected to each other, the second electrode contacts are electrically connected to each other, and only one of the at least two pairs of electrical contacts is connected to the light-emitting diode chip; Each of the plurality of light-emitting units includes three light-emitting subunits of different colors arranged along the second direction, one of the three light-emitting subunits in each of the plurality of light-emitting units is connected to the first type second electrode wiring, and the other two of the three light-emitting subunits in each of the plurality of light-emitting units are connected to the second type second electrode wiring; the second electrode wiring is located between the first electrode wiring and the base substrate, each of the connection circuit units further includes a second electrode connection portion, the second electrode connection portion is provided in the same layer as the first electrode wiring, and in a direction perpendicular to the base substrate, the second electrode connection portion overlaps with the first type second electrode wiring and the second type second electrode wiring corresponding to the same connection circuit unit.

2. 2. The light-emitting plate of claim 1, wherein the light-emitting subunits of the plurality of light-emitting units are arranged along a first direction and a second direction to form a plurality of rows and a plurality of columns of light-emitting subunits, and the light-emitting subunits in the same row include three light-emitting subunits of different colors, with one color of the light-emitting subunits connected to the first type of second electrode wiring and the other two colors of the light-emitting subunits connected to the second type of electrode wiring.

3. The light-emitting subunit connected to the first type second electrode wiring is a red light-emitting subunit, and the light-emitting subunit connected to the second type second electrode wiring is 3. The luminescent plate according to claim 1, which comprises a green light-emitting subunit and a blue light-emitting subunit.

4. The plurality of first electrode wirings include a plurality of first electrode wirings of a first type and a plurality of first electrode wirings of a second type, and the light emitting subunits in one row arranged along the first direction are 2. The light-emitting plate of claim 1, comprising a plurality of first light-emitting subunits and a plurality of second light-emitting subunits, the first light-emitting subunits being connected to the first type of first electrode wiring via the first electrode contacts, and the second light-emitting subunits being connected to the second type of first electrode wiring via the first electrode contacts.

5. The light-emitting plate according to claim 4 , wherein the first type first electrode wirings and the second type first electrode wirings connected to the light-emitting subunits in a row arranged along the first direction are each located on both sides of the light-emitting subunits in the row.

6. Each of the first electrode wirings of the first type includes a first sub-electrode wiring and a second sub-electrode wiring that extend along the same straight line and are insulatedly spaced apart from each other, a portion of the plurality of first light-emitting subunits close to the first sub-electrode wiring is connected to the first sub-electrode wiring, and a portion of the plurality of first light-emitting subunits close to the second sub-electrode wiring is connected to the second sub-electrode wiring; 6. The light-emitting plate according to claim 4 or 5, wherein each of the second type first electrode wirings includes a third sub-electrode wiring and a fourth sub-electrode wiring extending in the same straight line and insulatedly spaced apart from each other, and among the plurality of second light-emitting subunits, a portion close to the third sub-electrode wiring is connected to the third sub-electrode wiring, and among the plurality of second light-emitting subunits, a portion close to the fourth sub-electrode wiring is connected to the fourth sub-electrode wiring.

7. An emission board described in any one of claims 4 to 6, wherein the second electrode contact in each connection circuit unit is connected to the second electrode wiring via the second electrode connection portion.

8. The luminescent plate according to claim 7 , wherein the second electrode contact and the second electrode connection portion are integral with each other.

9. The light-emitting plate according to claim 7 or 8, wherein in the first direction, an orthogonal projection of each of the second electrode wirings onto the base substrate overlaps with an orthogonal projection of one of the electrical contact pairs and a portion of the second electrode connection portions onto the base substrate.

10. Each of the connection circuit units includes two pairs of electrical contacts, and each of the connection circuit units further includes two first electrode connectors connected to the respective first electrode contacts, the first electrode connectors being located on a side of the first electrode contacts away from the second electrode contacts, and the first electrode contacts are: The light-emitting plate according to claim 7 , wherein the light-emitting plate is connected to the first electrode wiring via the first electrode connection portion, and an orthogonal projection of at least a portion of the first electrode connection portion onto the base substrate does not overlap with an orthogonal projection of the second electrode wiring onto the base substrate.

11. 1. A circuit board comprising: A base substrate; a plurality of connection circuit units arranged in an array on the base substrate along a first direction and a second direction; A plurality of first electrode wirings extending along the first direction; A plurality of second electrode wirings extending along the second direction; Including, Each of the connection circuit units includes at least two pairs of electrical contacts, each pair of electrical contacts including a first electrode contact and a second electrode contact, and in each of the connection circuit units, the first electrode contacts are electrically connected to each other, and the second electrode contacts are electrically connected to each other; three adjacent connection circuit units arranged along the second direction constitute a connection circuit unit group, the second electrode wiring includes a first type second electrode wiring and a second type electrode wiring, one of the three connection circuit units in the connection circuit unit group is connected to the first type second electrode wiring, and the other two of the three connection circuit units in the connection circuit unit group are connected to the second type second electrode wiring, a second electrode wiring located on a side of the first electrode wiring facing the base substrate, each of the connection circuit units further including a second electrode connection portion, the second electrode connection portion being provided in the same layer as the first electrode wiring, and the second electrode connection portion overlapping with the first type second electrode wiring and the second type second electrode wiring corresponding to the same connection circuit unit in a direction perpendicular to the base substrate.

12. The plurality of first electrode wirings include a plurality of first electrode wirings of a first type and a plurality of first electrode wirings of a second type, and the connection circuit units arranged in one row along the first direction include 12. The circuit board of claim 11, comprising a plurality of first connection circuit units and a plurality of second connection circuit units, the first electrode contacts of the first connection circuit units being connected to the first electrode wiring of the first type, and the first electrode contacts of the second connection circuit units being connected to the first electrode wiring of the second type.

13. 13. The circuit board according to claim 12, wherein the first type first electrode wiring and the second type first electrode wiring connected to the connection circuit units in one row arranged along the first direction are each located on both sides of the connection circuit units in that row.

14. each of the first type first electrode wirings includes a first sub-electrode wiring and a second sub-electrode wiring that extend along the same straight line and are insulatedly spaced apart from each other, a portion of the plurality of first connection circuit units close to the first sub-electrode wiring is connected to the first sub-electrode wiring, and a portion of the plurality of first connection circuit units close to the second sub-electrode wiring is connected to the second sub-electrode wiring; 14. The circuit board according to claim 13, wherein each of the second type first electrode wirings includes a third sub-electrode wiring and a fourth sub-electrode wiring that extend in the same straight line and are insulatedly spaced apart from each other, and among the plurality of second connection circuit units, a portion close to the third sub-electrode wiring is connected to the third sub-electrode wiring, and among the plurality of second connection circuit units, a portion close to the fourth sub-electrode wiring is connected to the fourth sub-electrode wiring.

15. A circuit board described in any one of claims 12 to 14, wherein the second electrode contact in each connection circuit unit is connected to the second electrode wiring via the second electrode connection portion.

16. The circuit board according to claim 15 , wherein in the first direction, an orthogonal projection of each of the second electrode wirings onto the base substrate overlaps with an orthogonal projection of one of the electrical contact pairs and a portion of the second electrode connection portions onto the base substrate.

17. Each of the connection circuit units includes two pairs of electrical contacts, and each of the connection circuit units further includes two first electrode connectors connected to the respective first electrode contacts, the first electrode connectors being located on a side of the first electrode contacts away from the second electrode contacts, and the first electrode contacts are:

17. The circuit board according to claim 15, wherein the circuit board is connected to the first electrode wiring via the first electrode connection portion, and an orthogonal projection of at least a portion of the first electrode connection portion onto the base substrate does not overlap with an orthogonal projection of the second electrode wiring onto the base substrate.

18. A display device comprising the light-emitting plate according to claim 1 , the light-emitting plate being a display panel.

Images