Rotational deposition apparatus and method for manufacturing electronic device

Abstract

To provide a rotary deposition device that further stabilizes the rotation of a substrate and a mask and allows for higher-definition deposition, and a method for producing an electronic device.SOLUTION: A rotary deposition device has: a mask holder that holds a mask; a substrate holder that holds a substrate; a center shaft that is coupled to the substrate holder and moves the substrate holder along the center line of rotation of the substrate and the mask; rotation torque transmission means that is coupled to one of the mask holder and the substrate holder; and a guide mechanism that does not change the relative positions of the mask holder and the substrate holder in the rotation direction and supports them so as to be relatively movable in a direction parallel with the center line of rotation.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a rotary film-forming apparatus in which a substrate and a mask rotate together relative to a film-forming source, and a method for manufacturing an electronic device. [Background technology]

[0002] Recently, organic electroluminescent displays (OLEDs) have been in the spotlight as flat panel displays. Organic electroluminescent displays are self-emitting displays that have superior characteristics to LCD panel displays in terms of response speed, viewing angle, and thinness, and are rapidly replacing existing LCD panel displays in monitors, televisions, and various mobile devices such as smartphones. Their application fields are also expanding to include automotive displays.

[0003] A known example of a conventional rotary film-forming apparatus is a mask deposition apparatus (film-forming apparatus) as described in Patent Document 1. This mask deposition apparatus has a vacuum chamber, and a film-forming target (substrate), a deposition mask (mask), and an evaporation source that supplies deposition molecular evaporation source particles to the film-forming target are arranged inside the vacuum chamber. The film-forming target and the mask are held by a magnet unit (substrate support member) supported by a rotation mechanism equipped with a rotation shaft, and during deposition, the magnet unit, the film-forming target, and the mask are rotated as a unit around the rotation shaft by the rotation mechanism.

[0004] However, with the recent increase in substrate size, there is an increasing demand for more stable rotation. As substrates become larger, the levelness of the substrate and mask decreases, making rotation unstable. To reduce the deflection of the mask and substrate, each structural component needs to be made highly rigid, but increasing the rigidity increases the size and weight.

[0005] On the other hand, Patent Document 2 describes a film forming apparatus including an alignment unit for aligning a substrate and a mask in a vacuum chamber, a transport tray for receiving the substrate and the mask from the alignment unit, and a film forming means such as an evaporation source and a sputtering target arranged along the transport path of the transport tray. The alignment unit has a substrate holding unit for holding the substrate and a mask holder (mask holding member) for supporting the mask, and the mask holder is connected to a support shaft (corresponding to a center shaft) via a guide rod with a guide bush. The support shaft can be rotated by a motor, and can be moved in the XY directions perpendicular to the support shaft by an XY direction moving unit. The mask holder also rotates in synchronization with the support shaft and moves in the XY directions to perform alignment with the stationary substrate. After alignment, the mask and substrate are lowered and placed on the transport tray, and the mask holder is lowered by the guide action of the guide rod, ensuring a predetermined alignment accuracy.

[0006] However, this mask holder rotates the mask for alignment purposes, and during film formation, it is transferred from the alignment unit to a transport tray; it is not designed to rotate during the film formation process, and therefore cannot be used in a rotary film formation apparatus. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] JP 2010-185107 A [Patent Document 2] JP 2005-248249 A Summary of the Invention [Problem to be solved by the invention]

[0008] An object of the present invention is to provide a rotary film-forming apparatus and a method for manufacturing an electronic device, which can more stabilize the rotation of a substrate and a mask and enable film formation with higher resolution. [Means for solving the problem]

[0009] In order to achieve the above object, the film forming apparatus of the present invention comprises: 1. A film formation apparatus for forming a film of a film formation material on a substrate through a mask while rotating the substrate and the mask together, the mask comprising: A mask holding part that holds the mask; A substrate holder for holding the substrate; a center shaft connected to the substrate holder and configured to move the substrate holder along a rotation center line of the substrate and the mask; The mask holder To the department Connected A rotation torque is transmitted between the mask holding part and the substrate holding part. A rotational torque transmission means 、 before a position changing means for changing a relative position between the mask holding part and the substrate holding part in a direction parallel to the rotation center line; a guide means for restricting a change in a relative position between the mask holding part and the substrate holding part in a rotational direction, the guide means including a guide shaft arranged parallel to the rotation center line, and a fitting member fitted to the guide shaft so as to be movable relative to the guide shaft; the fitting member is attached to the mask holding portion, and one end of the guide shaft that is inserted into the fitting member is fixed to the substrate holding portion, the rotational torque transmission means includes a drive shaft connected to the mask holding portion, The drive shaft of the rotational torque transmission means is hollow, The center shaft is inserted into the hollow portion of the drive shaft. It is characterized by the above.

[0010] The present invention also provides a method for producing an electronic device, comprising the steps of: The present invention is characterized in that an electronic device is manufactured using the above-mentioned rotating film forming apparatus. Effect of the Invention

[0011] According to the present invention, the horizontality of the substrate and mask can be improved, rotation can be stabilized, and high-definition film formation can be achieved. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a schematic diagram of a portion of an electronic device manufacturing apparatus. [Diagram 2] FIG. 2 is a schematic configuration diagram of the rotary film-forming apparatus according to the embodiment during film formation. [Diagram 3] FIG. 3 is a schematic diagram of the state before the film is formed in FIG. 2. [Figure 4] 3A is a partially enlarged cross-sectional view of a mounting portion of a center shaft in FIG. 2, and FIG. 3B is a partially enlarged cross-sectional view of a portion of a guide shaft in FIG. 2. [Diagram 5] 1A is a partial cross-sectional view showing a state in which a shim is inserted into a connecting portion of a guide bush, and FIG. 1B is a plan view showing a schematic diagram of a contact state of the shim. [Figure 6] 3 is a perspective view showing the configuration of a mask holding unit and a substrate holding unit in FIG. 2. [Figure 7] 3 is an explanatory diagram of an alignment process and a film formation process of the film formation apparatus of FIG. 2. [Figure 8] 1 is a schematic diagram of an organic EL display device manufactured by the manufacturing method of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, the embodiments of the present invention will be described in detail with reference to the drawings. However, the following embodiments merely exemplify preferred configurations of the present invention, and the scope of the present invention is not limited to these configurations. Furthermore, in the following description, the hardware and software configurations of the device, the process flow, manufacturing conditions, size, material, shape, etc. are not intended to limit the scope of the present invention to only those unless specifically stated.

[0014] <Electronic device manufacturing equipment> Fig. 1 is a top view showing a schematic diagram of a part of the configuration of an electronic device manufacturing apparatus. The manufacturing apparatus in Fig. 1 is used, for example, to manufacture a display panel of an organic EL display device for a smartphone. In the case of a display panel for a smartphone, for example, an organic EL film is formed on a substrate having a size of about 1800 mm x about 1500 mm and a thickness of about 0.5 mm, and then the substrate is diced to produce a plurality of small panels. 1, an electronic device manufacturing apparatus generally has a plurality of film formation chambers 111, 112 and a transfer chamber 110. A transfer robot 119 that holds and transfers a substrate 3 is provided inside the transfer chamber 110. The transfer robot 119 is, for example, a robot having a structure in which a robot hand that holds a substrate is attached to an articulated arm, and carries the substrate 3 in and out of each film formation chamber. A film formation apparatus (also called a deposition apparatus) is provided in each of the film formation chambers 111 and 112. A series of film formation processes, such as the transfer of the substrate 3 to the transfer robot 119, adjustment of the relative positions of the substrate 3 and the mask (alignment), fixing the substrate 3 on the mask, and film formation (deposition), are automatically performed by the film formation apparatus.

[0015] The configuration of the film formation device provided in the film formation chamber will be described below. <Film forming equipment> FIG. 2 is a schematic diagram showing the configuration of the rotational film forming apparatus 1 according to the embodiment of the present invention during film formation, and FIG. 3 is a schematic diagram showing the configuration before film formation. In the following explanation, an XYZ Cartesian coordinate system is used, with the vertical direction defined as the Z direction, and the directions perpendicular to the Z direction and perpendicular to each other defined as the X and Y directions. During film formation, the substrate is fixed so as to be parallel to the horizontal plane (XY plane), and the short side direction (parallel to the short side) of the substrate at this time is defined as the X direction, and the long side direction (parallel to the long side) is defined as the Y direction. The rotation angle around the Z axis is represented as θ.

[0016] The film forming apparatus 1 has a vacuum chamber 100. The inside of the vacuum chamber 100 is maintained in a reduced pressure atmosphere such as a vacuum, or in an inert gas atmosphere such as nitrogen gas. In the upper space inside the vacuum chamber 100, there are a mask holding unit (mask holding section) 20 for holding a mask 2, and a substrate holding unit (substrate holding section) for holding a substrate 3, which is an object to be film-formed and placed on the mask 2. A support portion (holding portion) 30 is disposed. A center shaft 32 is connected to the substrate holding unit 30, and a hollow rotating shaft (drive shaft) 15 serving as a rotational torque transmission means is connected to the mask holding unit 20. The center shaft 32 is inserted into the inner periphery of the hollow rotating shaft 15 so as to be able to slide freely. Also, a guide mechanism 10 is provided to support the mask holding unit 20 and the substrate holding unit 30 so that they can move relatively in a direction parallel to the rotation centerline without changing their relative positions in the rotation direction. The rotation torque transmitted from the hollow rotation shaft 15 is transmitted from the mask holding unit 20 to the substrate holding unit 30 via this guide mechanism 10, causing the mask holding unit 20 and the substrate holding unit 30 to rotate integrally. Meanwhile, an evaporation source 50 is installed in the lower space inside the vacuum chamber 100, and a film forming material is evaporated onto the substrate 3 through a mask. The evaporation source 50 is composed of a crucible that contains the evaporation material, a heater, a shutter, an evaporation source drive mechanism, an evaporation rate monitor, and the like (all not shown). The shutter covers the substrate 3 except when a film is being formed on the substrate 3, and prevents the evaporation material evaporated from the evaporation source 50 from accumulating on the substrate 3.

[0017] In addition to the mask holding unit 20 and the substrate holding unit 30, a substrate lifting unit 40 is provided which includes a support 41 for receiving the substrate 3 from the transport robot 119 in the transport chamber 110, transports the substrate 3 onto the mask 2 held by the mask holding unit, and places the substrate 3 on top of the mask.

[0018] The configuration of each part will be described in detail below. Configuration of the mask holding unit 20 The mask holding unit 20 is a frame structure having a mask stage 21 on which the mask 2 is placed, a support plate 22 arranged parallel to and spaced apart from the mask stage 21 at a predetermined distance, and a connecting member 23 connecting the mask stage 21 and the support plate 22. , which is a metal mask having an opening pattern corresponding to the thin film pattern to be formed on the substrate 3. The mask stage 21 is a frame structure that holds the periphery of the mask 2, and the substrate 3 is placed on the mask 2 during film formation. Therefore, the mask 2 also serves as a support for placing the substrate 3. A hollow rotating shaft 15 is connected to this mask holding unit 20. The hollow rotating shaft 15 is inserted from the outside of the vacuum chamber 100 and transmits rotational torque to the mask holding unit 20. An end of the hollow rotating shaft 15 is connected and fixed to the center of the support plate 22.

[0019] Configuration of the substrate holding unit 30 The substrate holding unit 30 is disposed between the mask table 21 and the support plate 22 of the mask holding unit 20 . FIG. 4A is a partial configuration diagram showing an example of the substrate holding unit 30. As shown in FIG. That is, the substrate holding unit 30 is a laminated unit having a cooling plate 31, a magnet 33a, a yoke plate 33 supporting the magnet 33a, and a fixing plate 34, and is also called a cooling plate unit. The cooling plate 31 is disposed opposite the mask table 21, and is a member that adheres closely to the substrate 3 (the surface opposite to the mask 2) during film formation to suppress a temperature rise of the substrate 3. The yoke plate 33 is laminated with a yoke plate 33 supporting the magnet 33a superimposed on the cooling plate 31, and magnetically attracts the mask 2 by magnetic force, thereby increasing the adhesion between the substrate 3 and the mask 2 during film formation. Furthermore, the cooling plate 31 may also serve as a magnet or a yoke plate. The fixing plate 34 is a base plate of the substrate holding unit 30, and the yoke plate 33, the magnet 33a, and the cooling plate 31 are laminated and fixed to the fixing plate 34. One end of a center shaft 32 that penetrates the support plate 22 of the mask holding unit 20 and is slidably inserted into the inner periphery of the hollow rotation shaft 15 is connected to the center of this fixed plate 34. This center shaft 32 raises and lowers the substrate holding unit 30 in the Z-axis direction.

[0020] Configuration of guide mechanism 10 2 and 3, the guide mechanism 10 includes a guide shaft 11 arranged parallel to a rotation center line N of the substrate holding unit 30 and the mask holding unit 20, and a guide bush 12 as a fitting member that fits relatively movably with the guide shaft 11. The guide bush 12 is attached to a support plate 22 of the mask holding unit 20, and one end of the guide shaft 11 that is inserted into the guide bush 12 is fixed to the substrate holding unit 30. FIG. 4B is a diagram showing a fixed state of the guide shaft 11 and the substrate holding unit 30. As shown in FIG. The end of the guide shaft 11 is inserted into a receiver 13 with a hat-shaped cross section provided on a fixed plate 34 of the substrate holding unit 30, and is fixed to its bottom surface with a bolt. The tip of the guide bush 12 can also be inserted into the receiver 13, and the end of the guide bush abuts against the bottom surface, restricting the upward movement of the substrate holding unit 30. Next, the guide mechanism 10 will be described with reference to FIG. FIG. 6 is a perspective view showing the mask holding unit and the substrate holding unit. As shown in FIG. 6, a plurality of guide shafts 11 are provided, and a plurality of pairs of guide shafts 11 and guide bushes 12 are provided, four pairs in this example. are arranged symmetrically with respect to the rotation center line N. In this example, the support plates 22 of the mask holding unit 20 are rectangular plate-like members arranged at the four corner positions. The guide shafts 11 and the center shaft 32 are arranged parallel to each other, and the guide bushes 12 are also assembled so that their center lines are parallel to the rotation center line N.

[0021] <Adjusting the guide shaft inclination using shims> Next, adjustment of the inclination of each guide shaft 11 will be described with reference to FIG. FIG. 5(A) is a partial cross-sectional view of a state in which a shim is inserted into a connecting portion of a guide bush, and (B) is a plan view showing a schematic diagram of a contact state of the shim. In this embodiment, shims 18 are inserted as adjustment means for adjusting the inclination of the guide shaft 11 at four connection points (A, B, C, D) between the guide bush 12 and the support plate 22 of the mask holding unit 20. That is, the fixed flange 12a of the guide bush 12 is fixed by bolts 13 at four circumferential points. By adjusting the gaps at these four points with the shims 18, the central axis of the guide bush 12 can be inclined in any direction in the XY axis direction with respect to the Z axis direction, and the inclination of the guide shaft 11 that fits thereto can be adjusted. The insertion points of the shims 18 may be provided at the connection points between the guide shaft 11 and the substrate holding unit 30, or may be provided at both the connection points between the guide shaft 11 and the guide bush 12. As a method for adjusting the inclination of the guide shaft 11, in addition to the method of inserting the shim 18, an inclination adjustment screw may be provided to adjust the inclination of the connection portion, and the method is not limited to inserting the shim 18.

[0022] Regarding the upper (outer) structure of the vacuum chamber 100 Next, returning to FIG. 2 and FIG. 3, the upper (outer) structure of the vacuum chamber 100 will be described. Provided at the upper outside of the vacuum chamber 100 are a rotary joint 120, a magnetic seal 125, an X actuator 130X and a Y actuator 130Y that move the hollow rotating shaft 15 in the X and Y directions, and a θ actuator 130θ that rotates it, as well as a Z actuator 130Z that moves the substrate holding unit in the Z-axis direction via a center shaft 32.

[0023] The X actuator 130X and the Y actuator 130Y move a first stage 141 in the X and Y directions relative to the vacuum chamber 100, and the hollow rotating shaft 15 is supported on this first stage 141 via a magnetic seal 125. Furthermore, a second stage 142 fixed via a support 142a is provided on the first stage 141, and a rotary joint 120 is fixed to this second stage 142. In addition, a θ actuator 130θ is attached to this second stage 142, and drives and rotates the hollow rotating shaft 15 via a drive transmission member 135 such as a gear. Moreover, a third stage 143 is further provided above the second stage 142 via a support pillar 143a, and a Z actuator 130Z is provided on this third stage 143 to move the center shaft 32 in the Z-axis direction.

[0024] The rotary joint 120 circulates a cooling medium through the cooling plate 31 of the substrate holding unit 30, and is configured such that a supply passage and a discharge passage are provided in the hollow rotating shaft 15, and the ports of the supply passage and the discharge passage are connected to a supply port and a discharge port provided in the rotary joint via annular flow paths.

[0025] The magnetic seal 125 is a magnetic fluid seal that uses a magnet to attract magnetic fluid into the gap between a rotating ring that rotates together with the hollow rotating shaft 15 and a fixed ring that is fixed to the first stage, thereby sealing the vacuum chamber 100. Furthermore, the space between the magnetic seal 125 and the insertion hole 102 for the hollow rotating shaft 15 provided in the upper wall 101 of the vacuum chamber 100 is sealed by a deformable bellows 150 .

[0026] Further, a substrate lifting actuator 160 for driving the substrate lifting unit 40 is separately provided on the upper wall 101 of the vacuum chamber 100 . The X actuator 130X, the Y actuator 130Y, and the θ actuator 130θ move the mask holding unit 20 in the X direction, the Y direction, and rotate it in the θ direction via the hollow rotation shaft 15, and move the mask 2 relative to the stationary substrate 3 during alignment. Then, alignment adjustment is performed between the substrate 3 and the mask 2. During film formation, the hollow rotating shaft 15 is rotationally driven by the θ actuator 130θ, whereby a driving torque is transmitted to the substrate holding unit 30 via the mask holding unit 20 and the guide mechanism 10, so that the mask holding unit 20 and the substrate holding unit 30 are rotated as a whole in an integrated manner.

[0027] A camera (not shown) is provided above (outside) the vacuum chamber 100 to measure the positions of the substrate 3 and mask 2 for alignment adjustment between the substrate 3 and mask 2. The camera photographs the substrate 3 and mask 2 through a window provided in the vacuum chamber 100. By recognizing the alignment marks on the substrate 3 and the mask 2 from the image, it is possible to measure the respective XY positions and the relative deviation within the XY plane.

[0028] The film forming apparatus 1 includes a control unit 170. The control unit 170 controls the X actuator 130X, the Y actuator 130Y, the Z actuator 130Z, the θ actuator 130θ, the substrate lifting actuator 160, the camera (not shown), the evaporation source 50, and the like, and executes a series of processes including the transportation of the substrate 3, the alignment process, and the film forming process. The control unit 170 can be configured by a computer having, for example, a processor, a memory, a storage, an I / O, and the like. In this case, the function of the control unit 170 is realized by the processor executing a program stored in the memory or the storage. As the computer, a general-purpose personal computer may be used, or an embedded computer or a PLC (programmable logic controller) may be used. Alternatively, some or all of the functions of the control unit 170 may be configured by a circuit such as an ASIC or an FPGA. Note that a control unit 170 may be provided for each film forming apparatus, or one control unit 170 may control multiple film forming apparatuses.

[0029] Next, the basic procedure for film formation will be described with reference to FIG. FIG. 7 is an explanatory diagram of an alignment process and a film formation process of the film formation apparatus of FIG. Alignment process 7(A), before film formation, the substrate 3 is supported at a predetermined position by the support 41 of the substrate lifting unit 40. The position of the substrate 3 is between the mask stage 21 and the substrate holding unit 30. At this position, the hollow rotation shaft 15 is moved in the XY directions and rotated in the θ direction about the rotation center line N by the X actuator 130X, the Y actuator 130Y, and the θ actuator 130θ, and the mask 2 held by the mask holding unit 20 connected to the hollow rotation shaft 15 is moved relative to the substrate 3, thereby performing alignment adjustment. At this time, the substrate holding unit 30 , which is connected to the mask holding unit 20 via the guide mechanism 10 , also moves in synchronization with the mask holding unit 20 .

[0030] After the alignment adjustment, as shown in FIG. 7B, the substrate 3 is lowered by the substrate lifting unit 40 and placed on the mask 2 supported by the mask stage 21, and the support 41 is retracted from the substrate 3 by an actuator (not shown). 7(C), the Z actuator 130Z (see FIGS. 2 and 3) lowers the substrate holding unit 30 via the center shaft 32, and the cooling plate 31 is brought into contact with the surface of the substrate 3 opposite to the mask 2. The mask 2 is attracted to the substrate 3 by the magnet 33a provided on the substrate holding unit 30 so as to be in close contact with the substrate 3.

[0031] Film forming process During film formation, the mask holding unit 20 is rotationally driven via the hollow rotating shaft 15 by the θ actuator 130θ used for alignment. The rotation torque of the mask holding unit 20 is transmitted to the substrate holding unit 30 via the four guide shafts 11 and guide bushes 12 of the guide mechanism 10, and the mask holding unit 20 and the substrate holding unit 30 are rotated. are rotated integrally. At this time, stable rotation is maintained since it is guided by the guide shaft 11 and the guide bush 12. The rotation is usually performed at a speed of about 50 rpm, but the rotation speed is optional. This allows the film-forming material to be deposited evenly on the substrate 3, producing a coating with a uniform thickness.

[0032] In the above embodiment, the hollow rotating shaft 15 is used as a rotation torque transmission means, and torque is transmitted from the mask holding unit 20 to the substrate holding unit 30 via the guide mechanism 10. However, the center shaft 32 may be used as a rotation torque transmission means, and torque may be transmitted from the substrate holding unit 30 to the mask holding unit 20 via the guide mechanism 10. For example, various configurations can be adopted, such as providing the θ actuator 130θ on the center shaft 32 side. Specifically, the actuator 130θ may be configured to rotate the center shaft 32 via a ball spline mechanism, and the Z actuator 130Z may be configured to convert the rotational motion into linear motion via a ball screw mechanism. In this way, the θ actuator 130θ rotates the center shaft 32 via the ball spline mechanism, while the Z actuator 130Z also rotates the nut of the ball screw mechanism so that the center shaft 32 does not move in the axial direction, thereby realizing only the rotational motion. In short, the configuration may be such that the rotational torque from the rotational torque transmission means is transmitted from one of the mask holding part and the substrate holding part to the other via the guide mechanism, causing the mask holding part and the substrate holding part to rotate integrally. In addition, while the guide mechanism 10 in the above embodiment is configured by a guide shaft and a guide bush, any mechanism that is unable to rotate relative to the guide mechanism and is able to move linearly relative to the guide mechanism in a direction parallel to the center line of rotation may be used. For example, a linear guide configured by a track rail and a slide table that moves along the track rail may be used, and the mechanism is not limited to a guide shaft and a guide bush.

[0033] <Example of a method for manufacturing an electronic device> Next, an example of a method for manufacturing an electronic device using the film forming apparatus of this embodiment will be described below. As an example of the electronic device, the configuration of an organic EL display device and a method for manufacturing the same will be described.

[0034] First, the organic EL display device to be manufactured will be described. Fig. 8(A) is an overall view of an organic EL display device 60, and Fig. 8(B) shows the cross-sectional structure of one pixel. As shown in FIG. 8(A), a plurality of pixels 62 each including a plurality of light-emitting elements are arranged in a matrix in a display region 61 of an organic EL display device 60. Although details will be described later, each light-emitting element has a structure including an organic layer sandwiched between a pair of electrodes. Note that the pixel here refers to the smallest unit that allows a desired color to be displayed in the display region 61. In the case of the organic EL display device according to this embodiment, the pixel 62 is configured by a combination of a first light-emitting element 62R, a second light-emitting element 62G, and a third light-emitting element 62B that emit light different from each other. The pixel 62 is often configured by a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may also be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and is not particularly limited as long as it is at least one color.

[0035] FIG. 8(B) is a partial cross-sectional schematic diagram taken along the line AB in FIG. 8(A). The pixel 62 has an organic EL element provided on a substrate 63, the organic EL element including a first electrode (anode) 64, a hole transport layer 65, any one of the light-emitting layers 66R, 66G, and 66B, an electron transport layer 67, and a second electrode (cathode) 68. Of these, the hole transport layer 65, the light-emitting layers 66R, 66G, and 66B, and the electron transport layer 67 correspond to organic layers. In this embodiment, the light-emitting layer 66R is an organic EL layer that emits red light, the light-emitting layer 66G is an organic EL layer that emits green light, and the light-emitting layer 66B is an organic EL layer that emits blue light. The light-emitting layers 66R, 66G, and 66B are light-emitting elements ( The first electrodes 64 are formed in a pattern corresponding to the light emitting elements (sometimes referred to as organic EL elements). The first electrodes 64 are formed separately for each light emitting element. The hole transport layer 65, the electron transport layer 67, and the second electrodes 68 may be formed in common with a plurality of light emitting elements, or may be formed for each light emitting element. In order to prevent the first electrodes 64 and the second electrodes 68 from being shorted by foreign matter, an insulating layer 69 is provided between the first electrodes 64. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 70 is provided to protect the organic EL elements from moisture and oxygen.

[0036] In order to form an organic EL layer for each light-emitting element, a method of forming a film through a mask is used. In recent years, display devices have become increasingly finer, and masks with openings several tens of μm wide are used to form the organic EL layer. In the case of film formation using such a mask, if the mask is subjected to heat from the evaporation source during film formation and is thermally deformed, the positions of the mask and the substrate will be misaligned, and the thin film pattern formed on the substrate will be formed in a position that is different from the desired position. Therefore, the film formation apparatus (vacuum deposition apparatus) according to the present invention is preferably used to form these organic EL layers.

[0037] Next, an example of a method for manufacturing an organic EL display device will be specifically described. First, a substrate 63 on which a circuit (not shown) for driving the organic EL display device and a first electrode 64 are formed is prepared. An acrylic resin is formed by spin coating on the substrate 63 on which the first electrode 64 is formed, and the acrylic resin is patterned by lithography so as to form an opening in the portion where the first electrode 64 is formed, thereby forming an insulating layer 69. This opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0038] The substrate 63 on which the insulating layer 69 has been patterned is carried into a first film forming apparatus, and the substrate is held by a substrate holding unit, and a hole transport layer 65 is formed as a common layer on the first electrodes 64 in the display area. The hole transport layer 65 is formed by vacuum deposition. In practice, the hole transport layer 65 is formed to be larger than the display area 61, so that a high-definition mask is not required.

[0039] Next, the substrate 63 on which the hole transport layer 65 has been formed is carried into a second film forming apparatus and held by a substrate holding unit. The substrate and the mask are aligned, the substrate is placed on the mask, and a red light emitting layer 66R is formed on the portion of the substrate 63 where the red light emitting element is to be disposed. According to this example, the mask and the substrate can be well aligned, and highly accurate film formation can be performed.

[0040] Similar to the deposition of the light-emitting layer 66R, a third deposition apparatus deposits a green-emitting light-emitting layer 66G, and a fourth deposition apparatus deposits a blue-emitting light-emitting layer 66B. After the deposition of the light-emitting layers 66R, 66G, and 66B is completed, a fifth deposition apparatus deposits an electron transport layer 67 over the entire display area 61. The electron transport layer 67 is formed as a layer common to the three light-emitting layers 66R, 66G, and 66B. The substrate on which the electron transport layer 67 has been formed is transferred to a sputtering device, where the second electrode 68 is formed, and then transferred to a plasma CVD device where the protective layer 70 is formed, thereby completing the organic EL display device 60.

[0041] If the substrate 63 on which the insulating layer 69 is patterned is exposed to an atmosphere containing moisture or oxygen from the time when it is carried into the film forming apparatus until the film formation of the protective layer 70 is completed, the light emitting layer made of an organic EL material may be deteriorated by moisture or oxygen. Therefore, in this example, the substrate is carried in and out of the film forming apparatus in a vacuum atmosphere or an inert gas atmosphere. In the organic EL display device obtained in this manner, the light-emitting layer is formed with high precision for each light-emitting element, and therefore, by using the above-described manufacturing method, it is possible to suppress the occurrence of defects in the organic EL display device due to misalignment of the light-emitting layer. [Explanation of symbols]

[0042] 1 Rotational deposition device, 2 Mask, 3 Substrate, 10 guide mechanism, 11 guide shaft, 12 guide bush, 15 hollow rotating shaft (torque transmission means), 18 Sim, 20 mask holding unit, 21 mask table, 22 support plate 23 Connecting members 30 substrate holding unit, 31 cooling plate, 33 yoke plate, 33a Magnet 32 Center shaft 40 substrate lifting unit, 41 support 50 Evaporation Source 100 Vacuum Chamber 130θ θ actuator 130Z Z Actuator N Rotational centerline

Claims

1. 1. A film formation apparatus for forming a film of a film formation material on a substrate through a mask while rotating the substrate and the mask together, the mask comprising: A mask holding part that holds the mask; A substrate holder for holding the substrate; a center shaft connected to the substrate holder and configured to move the substrate holder along a rotation center line of the substrate and the mask; a rotational torque transmission means coupled to the mask holding portion and configured to transmit a rotational torque between the mask holding portion and the substrate holding portion; a position changing means for changing a relative position between the mask holding part and the substrate holding part in a direction parallel to the rotation center line; a guide means for restricting a change in a relative position between the mask holding part and the substrate holding part in a rotational direction, the guide means including a guide shaft arranged parallel to the rotation center line, and a fitting member fitted to the guide shaft so as to be movable relative to the guide shaft; the fitting member is attached to the mask holding portion, and one end of the guide shaft that is inserted into the fitting member is fixed to the substrate holding portion, the rotational torque transmission means includes a drive shaft connected to the mask holding portion, The drive shaft of the rotational torque transmission means is hollow, The film forming apparatus according to claim 1, wherein the center shaft is inserted into a hollow portion of the drive shaft.

2. 2. The film forming apparatus according to claim 1, wherein a rotational torque is transmitted from the mask holding part to the substrate holding part via the guide means.

3. The film forming apparatus according to claim 1 , comprising a plurality of the guide shafts.

4. The film deposition apparatus according to claim 3 , wherein the plurality of guide shafts are disposed at symmetrical positions with respect to the center line of rotation.

5. The film forming apparatus according to any one of claims 1 to 4, characterized in that a means for adjusting the parallelism between the substrate holding surface of the substrate holding part and the mask holding surface of the mask holding part is provided at a connection point between at least one of the guide shaft and the fitting member, and at least one of the mask holding part and the substrate holding part.

6. 6. The film forming apparatus according to claim 5, wherein the adjusting means is a shim.

7. The mask holding portion is a mask table on which the mask is placed; a support plate disposed above the mask table in parallel with the mask table at a predetermined interval; a connecting member that connects the mask table and the support plate, the substrate holder is disposed between the mask table and the support plate; The film forming apparatus according to claim 1 , wherein the fitting member is attached to the support plate of the mask holding portion.

8. The mask holding portion is a mask table on which the mask is placed; a support plate disposed above the mask table in parallel with the mask table at a predetermined interval; a connecting member that connects the mask table and the support plate, the substrate holder is disposed between the mask table and the support plate; the center shaft passes through the support plate of the mask holder and is connected to the substrate holder; The film deposition apparatus according to claim 1 , wherein the center shaft serves as the position changing means and moves the substrate holding part in an axial direction.

9. 9. The film deposition apparatus according to claim 1, further comprising alignment means for moving the substrate holding part and the mask holding part in two directions that are perpendicular to the rotation center line and perpendicular to each other.

10. 10. The film forming apparatus according to claim 9, wherein the alignment means aligns the substrate and the mask while the position changing means changes the relative position between the mask holding portion and the substrate holding portion so that the mask and the substrate are spaced apart.

11. 1. A film formation apparatus for forming a film of a film formation material on a substrate through a mask while rotating the substrate and the mask together, the mask comprising: A mask holding part that holds the mask; A substrate holder for holding the substrate; a center shaft connected to the substrate holder and configured to move the substrate holder along a rotation center line of the substrate and the mask; a rotational torque transmission means coupled to the mask holding portion and configured to transmit a rotational torque between the mask holding portion and the substrate holding portion; a guide means for restricting a change in the relative position between the mask holding part and the substrate holding part in a rotational direction and allowing a change in the relative position between the mask holding part and the substrate holding part in a direction parallel to the rotation center line, The guide means is A guide shaft disposed parallel to the rotation center line; a fitting member that is fitted to the guide shaft so as to be movable relative to the guide shaft, the fitting member is attached to the mask holding portion, and one end of the guide shaft that is inserted into the fitting member is fixed to the substrate holding portion, the rotational torque transmission means includes a drive shaft connected to the mask holding portion, The drive shaft of the rotational torque transmission means is hollow, The center shaft is inserted into the hollow portion of the drive shaft. A film forming apparatus comprising:

12. 12. The film deposition apparatus according to claim 11, wherein a rotational torque is transmitted from the mask holding part to the substrate holding part via the guide means.

13. The film forming apparatus according to claim 11 , comprising a plurality of the guide shafts.

14. A film forming apparatus as described in any one of claims 11 to 13, characterized in that a means for adjusting the parallelism between a substrate holding surface of the substrate holding part and a mask holding surface of the mask holding part is provided at a connection point between at least one of the guide shaft and the fitting member, and at least one of the mask holding part and the substrate holding part.

15. 15. The film deposition apparatus according to claim 11, wherein the center shaft changes a position of the substrate holding part, thereby changing a relative position between the mask holding part and the substrate holding part.

16. The mask holding portion is a mask table on which the mask is placed; a support plate disposed above the mask table in parallel with the mask table at a predetermined interval; a connecting member that connects the mask table and the support plate, the substrate holder is disposed between the mask table and the support plate; 16. The film deposition apparatus according to claim 11, wherein the center shaft penetrates the support plate of the mask holding part and is connected to the substrate holding part.

17. 16. The film deposition apparatus according to claim 11, further comprising an alignment unit that moves the substrate holding unit and the mask holding unit in two directions that are perpendicular to the rotation center line and perpendicular to each other.

18. a position changing means for changing a relative position between the mask holding part and the substrate holding part in a direction parallel to the rotation center line, 18. The film formation apparatus according to claim 17, wherein the alignment means aligns the substrate and the mask while the position changing means changes the relative position between the mask holding part and the substrate holding part so that the mask and the substrate are spaced apart.

19. 1. A method for manufacturing an electronic device, comprising: A method for manufacturing an electronic device, comprising the steps of: manufacturing an electronic device by using the film forming apparatus according to claim 1 ;

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