RF module for antenna and antenna device including same

Abstract

By spatially separating the heat generated from the heat generating element of the antenna device, it is possible to dissipate the heat in a dispersed manner in the front-to-rear direction of the antenna device, thereby achieving the effect of greatly improving the heat dissipation performance. [Solution] The RF module for antenna according to the present invention includes an amplifier module disposed between a main board and an RF filter and having at least one built-in analog amplifier element. The amplifier module includes an amplifier body, an amplifier board mounted inside the amplifier body and having a front edge connected to the RF filter and a rear edge connected to the main board, an amplifier cover provided to cover the amplifier board, and a vapor chamber located between the amplifier body and the amplifier board or between the amplifier cover and the amplifier board to mediate the transfer of heat generated from an analog amplifier element mounted on the amplifier board.

Description

[Technical field]

[0001] The present invention relates to an RF module for an antenna and an antenna device including the same, and more particularly to an RF module for an antenna and an antenna device including the same, which completely separates a radiating element module and an RF element from a main board and arranges them so as to be exposed to the outside air at the front, and which can eliminate the difficulty of heat dissipation design to the front side where a conventional radiating element is provided. [Background technology]

[0002] Base station antennas, including repeaters used in mobile communication systems, come in a variety of shapes and structures, but typically have a structure in which multiple radiating elements are appropriately arranged on at least one reflector that stands upright in the longitudinal direction.

[0003] Recently, there has been active research into achieving compact, lightweight, and low-cost structures while satisfying the high performance requirements for MIMO-based antennas. In particular, in the case of antenna devices that use patch-type radiating elements to achieve linear or circular polarization, a method is widely used in which a radiating element made of a dielectric substrate made of plastic or ceramic material is plated and soldered to a PCB (printed circuit board) or the like.

[0004] Fig. 1 is an exploded perspective view showing an example of an antenna device according to the conventional technology. In the conventional antenna device 1, as shown in Fig. 1, a plurality of radiating elements 35 are arranged on the front side of an antenna housing main body 10, which is the beam output direction, so that the radiating elements 35 are output in a desired direction to facilitate beamforming, and a radome 50 is attached to the front end of the antenna housing main body 10, sandwiching the plurality of radiating elements 35, for protection from the external environment.

[0005] More specifically, the antenna device 1 according to the conventional technology includes an antenna housing body 10 having a thin rectangular box shape with an open front and a plurality of heat dissipation fins 11 integrally formed on the rear surface, a main board 20 arranged in a layered manner on the rear surface inside the antenna housing body 10, and an antenna board 30 arranged in a layered manner on the front surface inside the antenna housing body 10. A patch type radiating element or a dipole type radiating element 35 is mounted on the front surface of the antenna board 30, and a radome 50 is provided on the front surface of the antenna housing body 10 to protect the internal components from the outside while facilitating smooth radiation from the radiating element 35.

[0006] However, in the example (1) of the antenna device according to the prior art, the front part of the antenna housing main body 10 is completely shielded by a single radome 50, and the radome 50 becomes an element that inhibits heat dissipation of the antenna device. Here, if the radome 50 is removed to expose the radiating element 35 to the outside, the antenna board 30 is also inevitably exposed to the outside, which means that protection from the external environment becomes extremely insufficient.

[0007] In addition, the antenna board 30 is also made of FR-4 material, which is a general PCB material with low thermal conductivity, and the front of the installation space (not shown) in which the main board is installed, which is a space that generates a lot of heat, is completely shielded like the radome 50, which makes it difficult to change the heat dissipation design to the front. For this reason, of the front and rear surfaces of the main board, not only the digital elements but also all of the analog amplification elements must be concentrated on the rear surface in the heat dissipation direction, which causes a problem that the heat dissipation area is biased and the overall heat dissipation performance of the antenna device 1 is reduced. Summary of the Invention [Problem to be solved by the invention]

[0008] The present invention has been made to solve the above-mentioned technical problems, and aims to provide an antenna RF module and an antenna device including the same, which can significantly improve heat dissipation performance by positioning the antenna RF module forward so that it is exposed to the outside air, thereby enabling distributed heat dissipation to the front and rear of the system.

[0009] In addition, the present invention aims to provide an RF module for an antenna that includes a plurality of reflector grill fins that simultaneously perform a ground function for a radiating element and a reflector function to block signal interference with electrical elements behind, and an antenna device that includes the same.

[0010] It is yet another object of the present invention to provide an RF module for antennas including a plurality of RF modules that can be easily modularized and assembled into a front housing that separates an installation space of a main board from a front outdoor space by modularizing unit RF filters, unit radiating element modules, and unit radome covers, and an antenna device including the same.

[0011] Another object of the present invention is to provide an RF module for antennas and an antenna device including the same, which allows the amplifier element and surge board, which were conventionally mounted on a main board, to be completely separated from the installation space in which the main board is installed or to be spaced apart from the main board, thereby simplifying the design of the components before and after the main board.

[0012] It is yet another object of the present invention to provide an RF module for an antenna, which is provided with a vapor chamber for smooth heat dissipation of an amplifier module located in an outside air space, and an antenna device including the same.

[0013] The technical problems of the present invention are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0014] One embodiment of an RF module for an antenna according to the present invention includes an RF filter arranged on the front surface of a main board, a radiating element module arranged on the front surface of the RF filter, and an amplifier module arranged between the main board and the RF filter and having at least one built-in analog amplifier element, the amplifier module including: an amplifier body having a board mounting space with one or the other side open in the width direction; an amplifier board mounted inside the amplifier body and having a front edge signal-connected to the RF filter and a rear edge signal-connected to the main board; an amplifier cover provided to cover the amplifier board; and a vapor chamber located between the amplifier body and the amplifier board or between the amplifier cover and the amplifier board, for mediating the transfer of heat generated from the analog amplifier element mounted on the amplifier board.

[0015] Here, the vapor chamber is formed with an element through-portion through which a part of the analog amplifying element mounted on the amplifying section substrate passes.

[0016] In addition, one of the one or other sides of the vapor chamber is formed flat so as to be in surface thermal contact with the flat inner surface of the amplifier body or the flat inner surface of the amplifier cover, and the other of the one or other sides of the vapor chamber has an element-type alignment groove formed therein so that the analog amplifier element mounted on the opposing surface of the amplifier board and protruding therefrom is aligned to increase the area of ​​surface thermal contact.

[0017] In addition, of the two surfaces of the amplifier substrate, a PA element and an LNA element that realize 2T2R as analog amplification elements are mounted and arranged on the surface facing the vapor chamber, and the PA element, which generates a relatively high amount of heat, is arranged to pass through the element penetration part of the vapor chamber, and the LNA element, which generates a relatively low amount of heat, is molded into the element mold matching groove of the vapor chamber.

[0018] In addition, a PA element and an LNA element that realize 1T1R as analog amplification elements are mounted on one of the two surfaces of the amplifier unit board, and a PA element and an LNA element that realize 1T1R as analog amplification elements are mounted on the other of the two surfaces of the amplifier unit board, and the vapor chambers are respectively disposed between the inner surface of the amplifier unit body and one surface of the amplifier unit board, and between the inner surface of the amplifier unit cover and the other surface of the amplifier unit board.

[0019] The antenna further includes at least one reflector grill fin disposed between the RF filter and the radiating element module to ground (GND) the radiating element module and to allow outside air to flow in from the front to the rear of the RF filter or to allow outside air to flow out from the rear to the front of the RF filter, and a radome cover coupled to the front of the RF filter to protect the radiating element module from the outside, and the at least one reflector grill fin is integrally formed with the RF filter.

[0020] The RF filter also includes a filter body having a plurality of cavities opening forward, and resonant bars disposed inside the cavities, and the reflector grill fins are disposed so as to extend in the upper, lower, left and right directions along the front edge of the filter body, and are spaced apart from each other by a predetermined distance.

[0021] Also, the reflector grill fins can perform a reflector function together with a filter outer panel arranged to shield the front surface of the filter body. Also, the reflector grill fins are set in consideration of the length of the radiating element included in the radiating element module.

[0022] Moreover, the RF filter and the reflector grill fins are manufactured integrally by a die-casting method using a metallic molding material.

[0023] In addition, a portion of the reflector grill fin is extended to overlap with a reflector grill fin formed on an adjacent RF filter.

[0024] According to an embodiment of the present invention, an antenna device including an RF module for an antenna includes a main board having at least one digital element mounted on a front or rear surface thereof, a box-shaped rear housing having an opening at the front of an installation space in which the main board is installed, a front housing arranged to shield the open front of the rear housing and to separate the installation space of the rear housing from an external space, and a plurality of RF modules for an antenna arranged in front of the front housing and connected to the main board via an electrical signal line, each of the plurality of RF modules for an antenna including an RF filter arranged on the front surface of the main board and a signal line arranged in front of the RF filter. and an amplifier module disposed between the main board and the RF filter and having at least one analog amplifier element mounted thereon, the amplifier module including: an amplifier body having a board mounting space with one or the other side open in a width direction; an amplifier board mounted inside the amplifier body and having a front edge signal-connected to the RF filter and a rear edge signal-connected to the main board; an amplifier cover provided to cover the amplifier board; and a vapor chamber located between the amplifier body and the amplifier board or between the amplifier cover and the amplifier board, for mediating the transfer of heat generated from the analog amplifier element mounted on the amplifier board. Effect of the Invention

[0025] According to an embodiment of an RF module for an antenna and an antenna device including the same according to the present invention, the following various effects can be achieved.

[0026] First, by spatially separating the heat generated from the heat generating element of the antenna device, it is possible to dissipate the heat in the front and rear directions of the antenna device, thereby providing the effect of greatly improving the heat dissipation performance.

[0027] Second, by changing the design of the existing single radome that prevents heat dissipation to the front of the antenna to a unit radome that is combined with each RF module, it is possible to remove heat dissipation obstacles and more effectively protect the radiating element module.

[0028] Third, the RF-related amplifying elements, which were previously centrally mounted on the main board, are now configured as an RF module together with an RF filter, and the outside air space is located outside at the front, which has the effect of greatly improving the overall heat dissipation performance of the antenna device.

[0029] Fourth, by separating the RF-related amplifying elements and the RFIC board from the main board, the number of layers of the main board, which is a multi-layer board, is significantly reduced, resulting in an effect of reducing the manufacturing cost of the main board.

[0030] Fifth, RF-related parts having frequency dependency are configured as an RF module, which is detachably coupled so that signals are connected via the front housing which further has a heat dissipation function. Therefore, if any of the individual RF-related parts constituting the antenna device are defective or damaged, only the RF module can be replaced, which makes it easy to maintain and repair the antenna device.

[0031] Sixth, since the antenna device can dissipate heat in a dispersed manner, the length and volume of the heat sink (heat dissipation fins) formed integrally with the rear housing can be reduced, which facilitates the design of a slim product overall.

[0032] Seventh, in the configuration of the RF module, the RF filter and the amplifier module are completely separated in the front-rear direction, which has the effect of minimizing the thermal influence between them.

[0033] Eighth, by further providing a vapor chamber inside the amplifier module exposed to the outside air space, it is possible to further improve the dissipation of heat generated from the analog amplifier element to the outside.

[0034] The effects of the present invention are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims. [Brief description of the drawings]

[0035] [Figure 1] FIG. 1 is an exploded perspective view showing an example of an antenna device according to a conventional technique. [Diagram 2] 1 is a perspective view showing an antenna device according to an embodiment of the present invention; [Diagram 3] FIG. 3 is an exploded perspective view of FIG. 2. [Figure 4] 11 is an exploded perspective view for explaining attachment and detachment of an RF module assembly to and from a front housing. FIG. [Diagram 5] FIG. 2 is an exploded perspective view showing a state in which the front housing and the rear housing are separated. [Figure 6] FIG. 4 is an exploded perspective view showing the assembly of the front housing to the rear housing. [Figure 7] FIG. 3 is a perspective view showing the configuration of FIG. 2 with a ventilation panel removed. [Figure 8A] FIG. 2 is an exploded perspective view showing the assembly relationship of various boards to the rear housing. [Figure 8B] FIG. 2 is an exploded perspective view showing the assembly relationship of various boards to the rear housing. [Figure 9] FIG. 3 is an exploded perspective view showing how a surge substrate part is joined in the configuration of FIG. 2. [Figure 10] FIG. 3 is an exploded perspective view showing a coupling position of an RFIC substrate portion in the configuration of FIG. 2. [Figure 11] 11 is an exploded perspective view showing a state in which the RFIC board portion of FIG. 10 is coupled to the rear surface of the front housing. FIG. [Figure 12]3 is an exploded perspective view showing the state in which an RF module is installed in a front housing of the configuration shown in FIG. 2. [Figure 13] 1 is an enlarged perspective view showing the front surface of a front housing to which an RF module is attached and detached, and the rear surface of the RF module. [Figure 14] 1 is a cutaway perspective view showing how the RF module is coupled to the main board; [Figure 15] FIG. 3 is a perspective view showing a unit RF module in the configuration of FIG. 2. [Figure 16] FIG. 16 is an exploded perspective view of FIG. [Figure 17A] FIG. 2 is an exploded perspective view showing the arrangement of an amplifier module and a radiating element module in the configuration of the RF module. [Figure 17B] FIG. 2 is an exploded perspective view showing the arrangement of an amplifier module and a radiating element module in the configuration of the RF module. [Figure 17C] FIG. 2 is an exploded perspective view showing the arrangement of an amplifier module and a radiating element module in the configuration of the RF module. [Figure 17D] FIG. 2 is an exploded perspective view showing the arrangement of an amplifier module and a radiating element module in the configuration of the RF module. [Figure 18] FIG. 2 is an exploded perspective view showing the installation of a radome as part of the configuration of the RF module. [Figure 19A] FIG. 2 is an exploded perspective view showing the installation of a radiating element module in the configuration of the RF module. [Figure 19B] FIG. 2 is an exploded perspective view showing the installation of a radiating element module in the configuration of the RF module. [Figure 20] FIG. 13 is a perspective view showing another embodiment of an amplifier module in the configuration of the RF module. [Figure 21] FIG. 21 is an exploded perspective view showing the arrangement of a radiating element module, an RF filter, and an amplifier module in the configuration of FIG. 20. [Figure 22A] FIG. 21 is an exploded perspective view showing the state of installation of an amplifier module in the configuration of FIG. 20. [Figure 22B] FIG. 21 is an exploded perspective view showing the state of installation of an amplifier module in the configuration of FIG. 20. [Diagram 23] FIG. 13 is a perspective view showing still another embodiment of the amplifier module in the configuration of the RF module. [Figure 24] FIG. 24 is an exploded perspective view of FIG. 23. [Diagram 25] 24 is a cross-sectional view and a cutaway perspective view taken along line CC in FIG. 23. [Figure 26A] FIG. 2 is an exploded perspective view of a radiating element module. [Figure 26B] FIG. 2 is an exploded perspective view of a radiating element module. [Figure 27] FIG. 2 is an exploded perspective view showing the state of installation of a radiation director in a radome, which is one of the components of the radiating element module. [Figure 28] 3 is a perspective view and a partially enlarged view showing the shape and arrangement of reflector grill fins in the configuration of the RF module in FIG. 2. [Figure 29] FIG. 4 is a partially enlarged perspective view showing the arrangement of reflector grill fins. [Figure 30A] 16 is a cross-sectional view taken along line AA in FIG. 15 and a partially enlarged view. [Figure 30B] 16 is a cross-sectional view taken along line BB in FIG. 15 and a partially enlarged view. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0036] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an RF module for an antenna and an antenna device including the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

[0037] In assigning reference symbols to components in each drawing, it should be noted that the same components are assigned the same symbols as much as possible even if they are displayed in different drawings. In addition, in describing the embodiments of the present invention, if it is determined that a detailed description of such known configurations or functions would hinder understanding of the embodiments of the present invention, the detailed description will be omitted.

[0038] In describing components of the embodiments of the present invention, terms such as 1, 2, A, B, (a), (b) and the like may be used. Such terms are merely used to distinguish the components from other components, and do not limit the nature, order or sequence of the components. In addition, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention belongs. Terms as defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless expressly defined in this application.

[0039] The present invention has a technical idea of ​​providing a unit radome that is combined with each RF module instead of the single radome of a conventional antenna device, and configuring RF-related components mounted on a main board inside an antenna housing as an RF module together with an RF filter or configuring them separately from the main board, thereby spatially separating and dispersing heat generated from various heat-generating elements of the antenna device. Hereinafter, an RF module 200 for antenna, an RF module assembly and an antenna device including the same will be described based on one embodiment shown in the drawings.

[0040] FIG. 2 is an oblique view showing an antenna device according to one embodiment of the present invention, FIG. 3 is an exploded oblique view of FIG. 2, FIG. 4 is an exploded oblique view for explaining the attachment and detachment of an RF module assembly to a front housing, FIG. 5 is an exploded oblique view showing a state in which the front housing and the rear housing are separated, FIG. 6 is an exploded oblique view showing the assembly of the front housing to the rear housing, FIG. 7 is a perspective view showing a state in which the ventilation panel has been removed from the configuration of FIG. 2, FIGS. 8A and 8B are exploded oblique views showing the assembly relationship of various boards to the rear housing, FIG. 9 is an exploded oblique view showing the coupling of the surge substrate section in the configuration of FIG. 2, FIG. 10 is an exploded oblique view showing the coupling position of the RFIC substrate section in the configuration of FIG. 2, and FIG. 11 is an exploded oblique view showing a state in which the RFIC substrate section of FIG. 10 is coupled to the rear surface of the front housing.

[0041] As shown in Figs. 2 to 7, an antenna device 100 according to an embodiment of the present invention includes a rear housing 110 that forms the rear exterior of the antenna device 100, and a front housing 140 that forms part of the front exterior of the antenna device.

[0042] The antenna device 100 also includes a main board 170 closely installed in the installation space 115 of the rear housing 110, a PSU board section 180 arranged on the upper side of the main board 170, a surge board section 190 arranged further rearward from the main board 170, an RFIC board section 150 closely installed on the rear surface of the front housing 140, and an antenna RF module (Radio Frequency Module) 200 (hereinafter abbreviated as "RF module") stacked on the front surface of the front housing 140.

[0043] The rear housing 110 and the front housing 140 are combined with the RF module 200 to form the overall appearance of the antenna device 100, and may also function as a medium for coupling to a support pole (not shown) provided for installation of the antenna device 100. However, unless there is a restriction in the installation space of the antenna device 100, the combined body of the rear housing 110 and the front housing 140 does not necessarily have to be coupled to a support pole, and may be directly installed and fixed in a wall-mounted type on a vertical structure such as an inner or outer wall of a building. In particular, in the case of the antenna device 100 according to an embodiment of the present invention, it is significant to design the front and rear thicknesses to be minimal to facilitate wall-mounted installation. This will be described in more detail later.

[0044] The rear housing 110 and the front housing 140 are made of a metal material with excellent thermal conductivity to facilitate heat dissipation through thermal conduction overall, and are formed in a rectangular box shape with a thin thickness in the front-to-rear direction. In particular, the front of the rear housing 110 is opened to provide a predetermined installation space 115, thereby serving as an intermediary for the installation of a main board 170 on which digital elements (e.g., a Field Programmable Gate Array (FPGA) element 173 is mounted), a PSU board section 180 on which a Power Supply Unit (PSU) element is mounted, and a surge board section 190 on which surge component elements are mounted.

[0045] Meanwhile, although not shown, the inner surface of the rear housing 110 is formed into a shape that matches the outer protruding shape of the digital elements (such as the FPGA element 173) mounted on the rear surface of the main board 170 and / or the PSU element 183 mounted on the rear surface of the PSU board unit 180, and the surge component elements mounted on the rear surface of the surge board unit 190. This is to maximize the thermal contact area with the rear surfaces of the main board 170, the PSU board unit 180, and the surge board unit 190, thereby maximizing heat dissipation performance.

[0046] Handles 130 are further provided on both the left and right sides of the rear housing 110 so that a worker can grip the antenna device 100 according to one embodiment of the present invention at the site to easily transport the antenna device 100 or manually install it on a support pole (not shown) or an inner or outer wall of a building.

[0047] In addition, various external mounting members 400 for cable connection with a base station device (not shown) and adjustment of internal parts can be inserted and assembled on the outside of the lower end of the rear housing 110. The external mounting member 400 is provided in the form of at least one optical cable connection terminal (socket), and each connection terminal is connected to a connection terminal of a coaxial cable (not shown).

[0048] 2, a plurality of rear heat dissipation fins 111 are integrally formed in a predetermined pattern on the rear surface of the rear housing 110. Here, heat generated from each heat generating element of the main board 170, the PSU board unit 180, and the surge board unit 190 provided in the installation space 115 of the rear housing 110 is directly dissipated rearward through the plurality of rear heat dissipation fins 111.

[0049] As shown in FIG. 4B, the rear heat dissipation fins 111 are arranged with an upward inclination toward the left and right ends with respect to the middle part of the left-right width as a reference, and can be designed to form an ascending air current in which heat dissipated to the rear of the rear housing 110 is dispersed toward the left and right directions of the rear housing 110, respectively, so that the heat can be dispersed more quickly. However, the shape of the rear heat dissipation fins 111 is not necessarily limited to this. If a blower fan module (not shown) is further provided on the rear side of the rear housing 110 to facilitate the flow of outside air, although not shown, the rear heat dissipation fins 111 may be formed in parallel to the left and right ends of the blower fan module arranged in the middle, so that the heat dissipated by the blower fan module can be discharged more quickly.

[0050] Although not shown, a mounting portion (not shown) to which a clamping device (not shown) for connecting the antenna device 1 to a support pole (not shown) is connected is integrally formed on some of the rear heat dissipation fins 111. Here, the clamping device may be configured to rotate the antenna device 100 according to an embodiment of the present invention provided at its tip in the left-right direction or tilt it in the up-down direction to adjust the directionality of the antenna device 100.

[0051] However, it is not necessary to couple a clamping device to the mounting portion for tilting and rotating the antenna device 100. For example, when the antenna device 100 is installed as a wall-mounted type on the inner or outer wall of a building, a clamp panel in the form of a latch plate that is easy to couple to a wall-mounted type may be coupled to the mounting portion.

[0052] Meanwhile, as shown in Figures 1 to 7, one embodiment of the antenna device 1 may further include a surge board section 190 that is arranged at a distance behind the main board 170 in the installation space 115 of the rear housing 110 and is closely attached to the front surface of the rear housing 110, and a PSU board section 180 that is arranged to have a front surface matching the front surface of the main board 170 in the installation space 115 of the rear housing 110 and is arranged above the main board 170.

[0053] Here, the surge board unit 190 has a front end supported by the rear surface of the main board 170 and a rear end supported by a front surface of the surge board unit 190 and is disposed at a predetermined distance rearward from the main board 170 by a plurality of spacing supporters 197 .

[0054] 8A and 8B, the surge board unit 190 and the PSU board unit 180, and the main board 170 and the PSU board unit 180 can be electrically connected to each other through at least one bus bar 195, 185. More specifically, the surge board unit 190 is disposed relatively lower in the installation space 115 of the rear housing 110 across the main board 170, and conversely, the PSU board unit 180 is disposed relatively upper in the installation space 115 of the rear housing 110 across the main board 170, so that they can be electrically connected to each other through a long type bus bar 195. The long type bus bar 195 has its end and middle portions stably fastened and fixed by a plurality of bus bar fastening screws 195'.

[0055] In addition, since the PSU board unit 180 is disposed in direct contact with the upper end of the main board 170, they can be electrically connected to each other via short type bus bars 185. Each end of the short type bus bars 185 is stably fastened and fixed by a plurality of bus bar fastening screws 185'.

[0056] Meanwhile, one embodiment of the antenna device 1 may further include an RFIC substrate unit 150 disposed in front of the main board 170 in the installation space 115 of the rear housing 110 and in close contact with the rear surface of the front housing 140, as shown in Figures 9 and 10. An RFIC element (not shown in the drawing) corresponding to the FPGA element 173 mounted on the main board 170 is mounted on the RFIC substrate unit 150. The RFIC substrate unit 150 separates the RFIC element that was previously mounted on the front or rear surface of the main board 170 together with the above-mentioned FPGA element 173, from the main board 170, and is disposed so as to be in surface thermal contact with the rear surface of the front housing 140, which is essentially a core component of the front heat dissipation.

[0057] 10, the RFIC substrate unit 150 is disposed at a predetermined distance forward from the main board 170 by a plurality of spacing supporters 157 whose front end is supported by the rear surface of the front housing 140 and whose rear end is supported by the front surface of the main board 170. By disposing the RFIC substrate unit 150 at a distance forward from the main board 170 in this manner, thermal isolation between the RFIC substrate unit 150 and the main board 170 can be achieved.

[0058] The rear of the RFIC substrate unit 150 is electrically connected to the main board 170 through a thermal isolation plate 160 provided for physical thermal isolation from the main board 170, as shown in Fig. 11. More specifically, a plurality of intermediate female socket parts 155 for socket pin coupling with a male socket part 235a of an amplifier board 235 of the RF module 200 described later is formed on the front side of the RFIC substrate unit 150 as shown in Fig. 10, and an intermediate male socket part 161 for socket pin coupling with a final female socket part 171 formed on the front side of the main board 170 is formed on the rear side of the RFIC substrate unit 150 as shown in Fig. 11. Here, the intermediate male socket part 161 is formed on the rear side of the RFIC substrate unit 150 and can be exposed to the rear side of the thermal isolation plate 160 by penetrating the thermal isolation plate 160 so as to be socket pin coupled with the final female socket part 171 of the main board 170.

[0059] The intermediate female socket portion 155 formed on the RFIC board portion 150 can be exposed to the front side by penetrating a socket penetrating portion 143 (see FIG. 12 described later) formed on the front housing 140. In this manner, the male socket portion 235a of the amplifier board 235 is socket-pin coupled to the intermediate female socket portion 155 exposed to the front.

[0060] It is preferable that the thermal isolation plate 160 is made of a heat insulating material so as to prevent the heat generated from the RFIC substrate 150 from moving toward the installation space 115 of the rear housing 110, which is the relatively rear space, and to immediately guide the heat to be dissipated forward through the front housing 140.

[0061] As shown in FIGS. 10 and 11, the front housing 140 includes a main board 170 and a PSU board section that are mounted in the installation space 115 of the rear housing 110. 180, surge board 190 and front RF module 200. In addition, front housing 140 is provided with a partition to distinguish installation space 115 on the rear housing 110 side from other spaces, thereby performing thermal insulation and isolation functions so that heat generated in installation space 115 on the rear housing 110 side does not affect RF module 200. Here, the meaning of "thermal insulation" is preferably understood as blocking heat generated from RF module 200 located in the front outside air (or front space) defined in front of the front surface of front housing 140 from entering the rear space of front housing 140 (i.e., installation space 115 of rear housing 110), and the meaning of "thermal isolation" is preferably understood as separating a part of a plurality of heat generating elements mounted in a concentrated and distributed manner on the front and rear of main board 170 stacked in installation space 115 of rear housing 110, and distributing the heat in a separated thermal configuration so that not only rear heat dissipation but also front heat dissipation is possible.

[0062] A plurality of front heat dissipation fins 141 are integrally formed on the front surface of the front housing 140. The front housing 140 and the plurality of front heat dissipation fins 141 are made of a metal material having excellent thermal conductivity, so that heat in the installation space 115 of the rear housing 110 or heat generated from the RFIC element 153 can be easily dissipated forward by thermal conduction through the front housing 140.

[0063] In addition, an embodiment of the antenna device 100 according to the present invention may further include at least one ventilation panel 120, 120a to 120d, as shown in Fig. 5. The front ends of the plurality of RF modules 200 are located further forward from the edge of the front housing 140, and the at least one ventilation panel 120, 120a to 120d is coupled to the edge of the front housing 140 and is coupled in a form surrounding the side of the plurality of RF modules 200 arranged at the outermost periphery.

[0064] In one embodiment of the antenna device 100 according to the present invention, as shown in FIG. 6, the first ventilation panel 120a and the second ventilation panel 120b are coupled to shield the upper and lower portions of the RF modules 200 located at the upper and lower ends of the multiple RF modules 200 coupled to the front surface of the front housing 140, respectively, and the third ventilation panel 120c and the fourth ventilation panel 120d are coupled to shield the left and right portions of the RF modules 200 located at the left and right sides of the multiple RF modules 200 coupled to the front surface of the front housing 140, respectively.

[0065] Here, at least one ventilation panel 120, 120a to 120d is formed with ventilation holes of a predetermined size throughout, and external air from the external space can flow into the front side of the front housing 140 through the ventilation holes, or hot air dissipated to the front of the front housing 140 can smoothly flow out to the external space, thereby increasing ventilation. If the ventilation of the external air is increased, the heat dissipation performance to the front side of the front housing 140 can be greatly improved.

[0066] In addition, as described below, since the RF module 200 is exposed to the outside air at the front defined by the front of the front housing 140, at least one ventilation panel 120 is arranged to shield at least a side portion of the RF module 200 exposed to the outside air at the front, thereby serving to block external access by unauthorized users without access authority as well as external foreign objects.

[0067] Here, as shown in FIG. 5, at least one ventilation panel 120 is coupled to the edge portion of the front housing 140 by sequentially fastening a plurality of fastening screws 125 into a plurality of ventilation panel fastening grooves 120' formed at the rear end of at least one ventilation panel 120 and ventilation panel fastening holes 140' formed at intervals along the edge portion of the front housing 140.

[0068] In addition, as shown in FIG. 7, at least one ventilation panel 120 is arranged so that the reflector grill fin 224 formed integrally with the RF filter 220 of the RF module 200 described later is spaced apart from the front housing 140, and thus the front end portion is electrically contact-coupled to the reflector grill fin 224 so as to smoothly perform the role of ground (GND), which is one of the functions of the reflector grill fin 224.

[0069] 12 is an exploded perspective view showing the installation of the RF module in the front housing of the configuration of FIG. 2, FIG. 13 is an enlarged perspective view showing the front surface of the front housing to which the RF module is attached and detached, and the rear surface of the RF module, FIG. 14 is a cutaway perspective view showing the connection of the RF module to the main board, FIG. 15 is a perspective view showing a unit RF module of the configuration of FIG. 2, FIG. 16 is an exploded perspective view of FIG. 15, and FIGS. 17A to 17D are exploded perspective views showing the installation of the amplifier module and the radiating element module of the RF module. 19A and 19B are exploded oblique views showing the installation of a radiating element module in the configuration of the RF module; FIG. 20 is a perspective view showing another embodiment of an amplifier module in the configuration of the RF module; FIG. 21 is an exploded oblique view showing the installation of a radiating element module, an RF filter, and an amplifier module in the configuration of FIG. 20; and FIGS. 22A and 22B are exploded oblique views showing the installation of an amplifier module in the configuration of FIG. 20.

[0070] 12 to 22B, one embodiment of an RF module 200 for an antenna according to the present invention includes an RF filter 220 arranged on the front side of a main board 170, a radiating element module 210 arranged on the front side of the RF filter 220, and at least one reflector grill fin 224 arranged between the RF filter 220 and the radiating element module 210 to ground (GND) the radiating element module 210 and to allow outside air to flow from the front to the rear of the RF filter 220 or allow outside air to flow from the rear to the front of the RF filter.

[0071] The RF module 200 is an assembly of analog RF components, and assuming that the amplifier module 230 is an RF component including an amplifier board 235 on which an analog amplifier element for amplifying an RF signal is mounted, the RF filter 220 is an RF component for frequency filtering an input RF signal to a desired frequency band, and the radiating element module 210 is an RF component for receiving and transmitting an RF signal. Therefore, the antenna RF module 200 according to the present invention can be defined as another embodiment as follows.

[0072] The RF module 200 for an antenna according to the present invention is an RF module 200 for an antenna including analog RF components, and the analog RF components can be realized in an embodiment including an RF filter 220, a radiating element module 210 arranged in front of the RF filter 220, and an analog amplifying element (not shown) on an amplifier module 230 arranged behind the RF filter 220.

[0073] Here, the amplifier module 230 is electrically connected to the main board 170 inside the rear housing 110 via the amplifier board 235 described below. In addition, as already described, the RFIC board 150 can be interposed between the amplifier board 235 and the main board 170 for such electrical connection.

[0074] Meanwhile, a RF module assembly for antenna 300, which will be described later, can be configured by providing a plurality of RF modules 200 realized in the various embodiments described above. Therefore, from the viewpoint of a manufacturer of RF components, it is advantageous that a new market environment can be created by manufacturing, distributing, and selling RF components in a state where a plurality of RF modules 200 are pre-assembled in front housing 140 or in units of RF modules 200 or RF module assemblies 300 that can be pre-assembled, and distributing and selling the RF components can be created in a state where a plurality of RF modules 200 are pre-assembled in front housing 140 or in units of modules that can be pre-assembled.

[0075] At the same time, at least one reflector grill fin 224 is molded integrally with the RF filter 220. That is, the RF filter 220 can be manufactured by a die-casting method using a molding material of a metal component. Here, the reflector grill fin 224 is also made of a metal material for its function, and therefore the RF filter 220 and the reflector grill fin 224 can be manufactured integrally by the same die-casting method as the manufacturing method of the RF filter 220 using a molding material of the same metal component. However, the material of the RF filter 220 and the reflector grill fin 224 should not necessarily be limited to a metal material, and it would also be possible for them to be molded with a dielectric material and have their outer surfaces coated with a conductive material.

[0076] Here, one embodiment of the RF module 200 for an antenna according to the present invention may further include an amplifier module 230 disposed between the main board 170 and the RF filter 220 and having at least one analog amplifier element (not shown in the drawing).

[0077] In this manner, the RF module 200, in which the radiating element module 210 is coupled to the front of the RF filter 220 and the amplifier module 230 is coupled to the rear thereof, is socket-pin coupled to the main board 170 via the front housing 140 for each unit module, as shown in Figures 12 to 14.

[0078] 12 to 14, a socket through-hole 143 is formed penetrating the front housing 140 in the front-rear direction, and a surface mounting portion 147 is formed around the socket through-hole 143. A ring mounting groove 149 is formed in the surface mounting portion 147, into which a foreign matter inflow prevention ring 144, which will be described later, is inserted and interposed. Additionally, module assembly screws 146 for installing the RF module 200 are provided vertically spaced apart inside the socket through-hole 143. The module assembly screws 146 penetrate forward from the rear part of the front housing 140 and are fastened to the rear side of the RF module 200.

[0079] Meanwhile, as shown in FIG. 13(b), a joining flange 238 is formed on the rear part of the RF module 200 so that a male socket part 235a of an amplifier board 235 described later penetrates and is exposed rearward and joined to a surface mounting part 147 of the front housing 140. A screw boss 239 is formed on the joining flange 238 to which a module assembly screw 146 is fastened and fixed. Here, since the RF module 200 is provided so as to be exposed to the outside air in the front part corresponding to the front of the front housing 140, it is necessary to prevent the inflow of foreign matter including rain or dust. As shown in FIG. 14, the RF module 200 according to an embodiment of the present invention is such that the joining flange 238 of the RF module 200 is brought into close contact with the surface mounting part 147 of the front housing 140, and when the fastening force is increased using the module assembly screw 146, the foreign matter inflow prevention ring 144 interposed in the ring mounting groove 149 can seal between the joining flange 238 of the RF module 200 and the surface mounting part of the front housing 140.

[0080] Meanwhile, the amplifier module 230 receives a signal from the main board 170 and a signal from the RF filter 220, respectively, amplifies the signal by a predetermined value, and outputs the amplified signal. Here, the amplifier module 230 includes an amplifier body 231 having a substrate mounting space 233 with one or the other side open in the width direction, an amplifier board 235 mounted inside the amplifier body 231 and having a front edge signal-connected to the RF filter 220 and a rear edge signal-connected to the main board 170 (in the case where the RFIC board unit 150 is provided separately from the main board 170 according to the embodiment, the RFIC board unit 150 corresponds to this), and an amplifier cover 236 provided to cover the amplifier board 235. As shown in FIGS. 17A to 17D, the amplifier module 230 is simply electrically connected to the RF filter 220 (described later) by a feed-through pin connection, and is physically connected to the amplifier module 230 by a module assembly screw 250 fastened through a screw assembly groove 234a of an assembly panel 234 formed in the amplifier body 231.

[0081] The amplifier board 235 is feed-through pin-coupled to the RF filter 220 via a through pin terminal 229, and is socket pin-coupled to the main board 170 (more preferably, the RFIC board section 150). The amplifier board 235 is provided with at least one male socket section 235a for socket pin coupling to the main board (or to the RFIC board section 150 in an embodiment in which the RFIC board section 150 is provided separately from the main board 170).

[0082] Amplification unit board 235a is tightly coupled to the inner surface of amplification unit body 231, and a plurality of amplification unit heat sink fins 232 for radiating heat generated from the analog amplification element of amplification unit board 235 to the external space are integrally formed on the outer surface of amplification unit body 231. At least one of a PA element and an LNA element is mounted on amplification unit board 235 as an analog amplification element.

[0083] The analog amplification elements (PA element and LNA element), which are the main heat generating elements, were conventionally components mounted on a main board 170 provided in the installation space 115 between the rear housing 110 and the front housing 140. However, in one embodiment of the present invention, the elements are manufactured as modular units such as the amplification section module 230 and the design is modified so that they are exposed to the front outside air side defined by the front space of the front housing 140, which is a space where heat dissipation is easy. This not only distributes thermal overload in the installation space 115, but also creates the advantage of improving heat dissipation performance.

[0084] Here, as shown in Figures 19A and 19B, the amplifier board 235 is mounted so that one side is in intimate contact with the inner surface of the board mounting space 233 of the amplifier body 231, and two PAs 251, 252, which are power amplifiers among the analog amplification elements, are mounted on the other side to form a 2T2R.

[0085] The heat generated from the two PAs 251, 252 can be easily dissipated to the outside through a plurality of amplifier heat sink fins 232 formed adjacent to and integral with the inner surface of the substrate mounting space 233. However, the two PAs 251, 252 do not necessarily need to be concentrated on the other side of the amplifier substrate 235, but are mounted and arranged one by one on both sides of the amplifier substrate 235 as shown in Fig. 20 to Fig. 22B. That is, as shown in Fig. 22A, one 251 of the PAs 251, 252 that realize 2T2R in one RF module 200a can be mounted and arranged on the other side of the amplifier substrate 235 (i.e., the side facing the amplifier cover 236a described later) so as to realize 1T1R.

[0086] 22B, the other one 252 of the PAs 251 and 252 that realize 2T2R with one RF module 200a can be mounted and arranged to realize 1T1R on one surface of the amplifier board 235 (i.e., the surface facing the inner surface of the board mounting space 233). Therefore, each surface of the amplifier board 235 realizes 1T1R, and 2T2R is realized with one RF module 200a. At the same time, as shown in FIG. 22A and FIG. 22B, a plurality of amplifier cover heat sink fins 236b corresponding to the plurality of amplifier heat sink fins 232 integrally formed on the outer surface of the amplifier body 231 described above are integrally formed on the outer surface of the amplifier cover 236a provided to cover the board mounting space 233 of the amplifier body 231.

[0087] According to another embodiment of the amplifier module 230 having such a configuration, two PAs 251, 252 which realize 2T2R within one RF module 200a are distributed on both sides of the amplifier board 235 so as to realize 1T1R, respectively, and the heat generated from both sides of the amplifier board 235 is dispersed and dissipated through both sides of the amplifier body 231 and the amplifier cover 236a, thereby providing the advantage of maximizing heat dissipation performance.

[0088] FIG. 23 is a perspective view showing yet another embodiment of the amplifier module in the configuration of the RF module, FIG. 24 is an exploded perspective view of FIG. 23, and FIG. 25 is a cross-sectional view and a cutaway perspective view taken along line CC of FIG. 23.

[0089] 23 to 25, another embodiment of the amplifier module 200b may further include a heat transfer medium (see reference numeral 260 in FIGS. 23 to 25). More specifically, referring to FIGS. 23 to 25, another embodiment of the amplifier module 200b may further include a vapor chamber 260 as a heat transfer medium for transferring heat generated from the analog amplifier element of the amplifier board 235 to the amplifier heat sink fins 232 or the amplifier cover heat sink fins 236b in the amplifier body 231 or amplifier cover 236 in which the amplifier board 235 is disposed.

[0090] Here, the heat transfer medium is not necessarily limited to a vapor chamber, and it goes without saying that a heat pipe can be used depending on the distance between the analog amplifier element that generates heat and the plurality of amplifier part heat sink fins 232 or the plurality of amplifier part cover heat sink fins 236b. In addition, a structure in which the vapor chamber and the heat pipe are used together can be used.

[0091] If, due to the internal structural design of the amplifier body 231, the outer surface of the analog amplifier element mounted on the amplifier board 235 does not come into direct surface thermal contact with the inner surface of the amplifier body 231 on which multiple amplifier heat sink fins 232 are formed or the inner surface of the amplifier cover 236 on which multiple amplifier cover heat sink fins 236b are formed, and the space between them is relatively small, it is preferable to use a plate-shaped vapor chamber 260, and if the space between them is relatively large, it is preferable to use a heat pipe (not shown).

[0092] 23 to 25, a further embodiment (200b) of the amplifier module is illustrated as having no amplifier cover heat sink fins 236b formed on the outer surface of the amplifier cover 236, and therefore the following description will be limited to the vapor chamber 260 being located between the inner surface of the amplifier body 231 and the amplifier board 235. However, the use of a heat pipe as a heat transfer medium and its installation position are not excluded or limited.

[0093] Furthermore, the vapor chamber 260 of yet another embodiment (200b) of the amplifier module shown in Figures 23 to 25 is illustrated as being manufactured separately from the amplifier body 231 and provided inside the amplifier body 231, but the vapor chamber 260 does not necessarily have to be manufactured separately from the amplifier body 231, and it is also possible for it to be formed integrally with the amplifier body 231 or the amplifier cover 236, as described below.

[0094] 24, the vapor chamber 260 is attached to the space opened on one side of the amplifier body 231 before the amplifier substrate 235 is provided. At this time, it is preferable that one surface of the vapor chamber 260 is formed flat and placed in close contact with the flat inner surface of the amplifier body 231 so as to be in thermal contact with the surface.

[0095] Here, an element type matching groove 263 is formed on the other surface of the vapor chamber 260 so that the analog amplification element mounted on the opposing surface of the amplifier board 235 and protruding therefrom is type-matched to increase the area of ​​surface thermal contact. This is because, unlike the embodiment (200) and the other embodiment (200a) of the amplifier module, the target surface with which the analog amplification element comes into direct surface thermal contact is not the amplifier body 231 but the vapor chamber 260.

[0096] 24 and 25, the heat generating element that generates a relatively large amount of heat among the multiple analog amplifying elements mounted on the amplifying board 235 is disadvantageous in dissipating heat by heat transfer through the vapor chamber 260, and therefore an element through-hole 261 is further formed in the vapor chamber 260 to prevent the amplifying element from coming into direct surface thermal contact with the inner surface of the amplifying body 231. The analog amplifying element disposed to pass through the element through-hole 261 comes into direct surface thermal contact with the inner surface of the amplifying body 231, and thus dissipates heat to the outside while maintaining a higher heat dissipation performance.

[0097] For example, if it is assumed that a PA element and an LNA element that realize 2T2R as analog amplification elements are mounted on the surface of the amplifier board 235 facing the vapor chamber 260, a PA element that generates a relatively high amount of heat is inserted through the element penetration portion 261 of the vapor chamber 260, and an LNA element that generates a relatively low amount of heat is molded into the element mold alignment groove 263 of the vapor chamber 260.

[0098] Here, when a PA element and an LNA element that realize 1T1R as analog amplification elements are mounted on one of the two surfaces of the amplifier board 235, and a PA element and an LNA element that realize 1T1R as analog amplification elements are mounted on the other of the two surfaces of the amplifier board 235, vapor chambers 260 are respectively arranged between the inner surface of the amplifier body 231 and one surface of the amplifier board 235, and between the inner surface of the amplifier cover 236 and the other surface of the amplifier board 235, although not shown.

[0099] Meanwhile, a plurality of screw fastening grooves 265 are formed at the edge of the vapor chamber 260, which are partially cut out for fastening the assembly screws 237 to the amplifier body 231 when the amplifier cover 236 is fastened to the amplifier body 231 using the assembly screws 237. With one side of the vapor chamber 260 placed in intimate contact with the inner side of the amplifier body 231, the amplifier board 235 is brought into intimate contact with the other side of the vapor chamber 260, and then the amplifier cover 236 is fixed to the amplifier body 231 using the assembly screws 237, whereby the vapor chamber 260 can be stably fixed inside the amplifier body 231.

[0100] Also, although not shown, it is also possible to first provide the amplifier board 235 in the space opening on one side of the amplifier body 231, and then provide the vapor chamber 260 so as to cover the outer side of the amplifier board 235 before providing the amplifier cover 236, and provide the surface of the analog amplifier element of the amplifier board 235 in surface thermal contact with the inner side of the vapor chamber 260, and then provide the amplifier cover 236 in surface thermal contact with the outer side of the vapor chamber 260. Additionally, it goes without saying that it is also possible to provide all of the vapor chambers 260 described above on both sides, respectively, based on the amplifier board 235 provided inside the amplifier body 231.

[0101] 25, by disposing the vapor chamber 260 between the amplifier board 235 and the amplifier heat sink fins 232 of the amplifier body 231, heat generated from the analog amplifier element of the amplifier board 235 can be rapidly conducted to the amplifier heat sink fins 232 using the vapor chamber 260 as a heat transfer medium, which has the advantage of greatly improving heat dissipation performance. Meanwhile, although not shown, the vapor chamber 260 is formed integrally with the amplifier body 231 or the amplifier cover 236a. That is, the amplifier body 231 or the amplifier cover 236a is provided so that a refrigerant filling portion (not shown in the drawing) in which a refrigerant is filled is formed on a part of the inner surface, and the vapor chamber 260 can be realized by filling the refrigerant in the refrigerant filling portion.

[0102] Fig. 26A and Fig. 26B are exploded perspective views of the radiating element module, and Fig. 27 is an exploded perspective view showing the state of installation of the radiation director on the radome, which is one of the components of the radiating element module. Meanwhile, as shown in Fig. 12 to Fig. 22B, the RF filter can include a filter body 221 having a plurality of cavities 222 formed therein and opening forward, resonating bars 223 respectively arranged inside the cavities 222, and a filter outer panel 228 arranged to shield the front surface of the filter body 221. A filter tuning cover 227 is coupled between the filter outer panel 228 and the filter body 221.

[0103] Here, the radiating element module 210 is mounted and coupled to the inside of the filter body 221 so as to cover the front surface of the outer panel 228. Meanwhile, the RF module 200 may further include a radome cover 240 coupled to the front end of the RF filter 220 and protecting the radiating element module 210 from the outside. A plurality of hook coupling parts 241 are formed at the edge of the radome cover 240, and the radome cover 240 is hook-coupled by coupling the hook coupling parts to the stepped parts of the filter body 221. The radome cover 240 is made of the same material as that of an existing single radome panel, and is coupled to each unit RF module 200 one by one. That is, the radome cover 240 may be made of a resin material that easily transmits radio waves, or may be made of a heat insulating material that is not related to heat dissipation because only a small amount of heat is generated when the radiating element module 210 is driven.

[0104] The radome cover 240 can protect the radiating element module 210 from the external environment (foreign objects, etc.) by being coupled to the filter body 221 while concealing the radiating element module 210 from the outside. In particular, since the radome cover 240 is installed so that the RF module 200 is exposed to the front outside air, which is the front space of the front housing 140 (not shown), it is preferable that the radome cover 240 has a sealing structure that completely blocks foreign objects such as rainwater from entering the interior where the radiating element module 210 is provided.

[0105] Here, the RF filter 220 and the radiating element module 210 can be electrically connected to each other by a feed through-pin coupling method using a through pin terminal 226 as shown in FIG.

[0106] Hereinafter, the RF module for an antenna 200 according to the present invention, which is realized in the above-mentioned various embodiments, will be described in more detail with reference to the accompanying drawings.

[0107] 12 to 20, the RF module 200 is stacked on the front surface of the main board 170 with the front housing 140 interposed therebetween. In the antenna device 100 according to an embodiment of the present invention, a plurality of RF modules 200 are provided to form one component of an RF module assembly 300 for an antenna.

[0108] 12 and 22B, a total of eight RF modules 200 are arranged adjacent to each other in the left-right direction, and a total of four rows of such RF modules 200 are arranged in the up-down direction. However, this is not necessarily limited to this, and it goes without saying that the arrangement positions and the number of RF modules 200 can be variously modified in design.

[0109] In addition, in one embodiment of the present invention, the RF filter 220 is described as a cavity filter having a predetermined cavity 222 formed on one side and a resonator bar 223 made of a dielectric resonator (DR) or a metallic resonator bar in the cavity 222. However, the RF filter 220 is not limited to this, and various filters such as a dielectric filter can be used.

[0110] In addition, the plurality of radiating element modules 210 are coupled in accordance with the number of the plurality of RF filters 220, and each of the radiating element modules 210 can realize 2T2R. Therefore, the antenna device 100 according to an embodiment of the present invention illustrates a model in which a total of 64T64R is realized, but is not limited thereto. For example, if the layout area of ​​the radiating elements can be doubled, each of the radiating element modules 210 can be provided to realize 1T1R, and if it is assumed that the heat dissipation performance can be further improved, each of the radiating element modules 210 can be provided to realize 4T4R.

[0111] Generally, to realize beamforming, a plurality of radiating element modules 210 are required as an array antenna as shown in Figures 2 to 10, and the plurality of radiating element modules 210 can increase radio wave concentration in a specified direction by generating a narrow directional beam. Recently, the plurality of radiating element modules 210 are most frequently used as a dipole antenna or a patch antenna, and are designed and arranged at a distance from each other to minimize signal interference between them.

[0112] In one embodiment of the RF module for antenna 200 according to the present invention, as shown in Figures 26A and 26B, the radiating element module 210 may include a printed circuit board 211 for radiating element which is long in the vertical direction and arranged on the front surface of a plurality of RF filters 220, at least one antenna patch circuit section 212 formed by pattern printing on the front surface of the printed circuit board 211 for radiating element, and a feed line 213 which feeds and connects each of the at least one antenna patch circuit section 212.

[0113] On the front surface of the radiating element printed circuit board 211, as shown in Fig. 26A, the above-mentioned antenna patch circuit section 212 is printed and formed as a dual polarized patch element that generates dual polarized waves of either orthogonal ±45 polarized waves or vertical / horizontal polarized waves. Three antenna patch circuit sections 212 are printed and formed at intervals in the vertical direction (longitudinal direction), and each antenna patch circuit section 212 can be interconnected by a feed line 213. Meanwhile, on the radiating element printed circuit board 211, as shown in Figs. 26A and 26B, an input side feeding line and an output side feeding line are formed branching from the feed line 213 to apply or output a feed signal, and an input side through hole 214a and an output side through hole 214b are formed penetrating the tips of the input side feeding line and the output side feeding line, into which a through pin terminal arranged at the rear of the radiating element printed circuit board 211 is inserted. A through pin terminal 226, which is one of the components of the RF filter 220, can be inserted into the input through hole 214a and the output through hole 214b to allow electrical current to flow between the input through hole 214a and the output through hole 214b and the power supply line 213.

[0114] Meanwhile, the radiation director 217 is formed of a thermally conductive or conductive metal material and is electrically connected to the antenna patch circuit unit 212. The radiation director 217 can guide the direction of radiation beams in all directions. In the RF module 200 for antenna according to an embodiment of the present invention, a total of three radiation directors 217 are arranged in each RF module 200 to ensure maximum gain. In addition, the radiation director 217 is formed with a plurality of coupling holes 217a into which a plurality of coupling protrusions 247a formed on the rear surface of the radome cover 240 are fitted and coupled, as shown in Figs. 26A and 26B. Therefore, the radiation director 217 is easily assembled by being modularly coupled to the rear surface of the radome cover 240 together with the printed circuit board 211 for radiating element through the above-mentioned plurality of coupling protrusions 247a and the plurality of coupling holes 217a, and then the radome cover 240 is coupled to the RF filter 220 through the hook coupling portion 241.

[0115] Meanwhile, in the antenna device, the reflector serves to provide a ground for the antenna circuit and also functions as a reflective surface. If a dual polarized antenna has a rear radiation, it will reflect the rear radiation in the main radiation direction, thereby improving the beam efficiency of the dual polarized antenna. In one embodiment of the present invention, the reflector grill fins 224 and the filter outer panel 228, which will be described later, can both perform the reflector function.

[0116] FIG. 28 is a perspective view and a partially enlarged view showing the shape and arrangement of reflector grill fins in the configuration of the RF module in FIG. 2, and FIG. 29 is a partially enlarged perspective view showing the arrangement of the reflector grill fins.

[0117] 28 and 29, the reflector grill fins 224 of adjacent RF filters 220 may be combined to form a mesh shape with grill-shaped heat dissipation holes. The heat dissipation holes formed by the reflector grill fins 224 facilitate ventilation of heat dissipated from the front housing 140, which is the rear side of the RF filters 220 corresponding to the rear, with the external space, and may serve as heat exhaust holes that exhaust heat generated inside between the front surface of the front housing 140 and the reflector grill fins 224 to the outside. This allows the front external air to be actively used for heat dissipation of the antenna device 100.

[0118] 28 and 29, a portion 224-1 of the reflector grill fin 224 is extended so as to overlap with a reflector grill fin 224-2 formed on an adjacent RF filter 220 in the left-right direction. Also, as shown in Fig. 28 and 29, a portion 224-3 of the reflector grill fin 224 is extended so as to be in a vertical line with a reflector grill fin 224-4 formed on an adjacent RF filter 220 in the up-down direction.

[0119] As shown in Fig. 28, each of the reflector grill fins 224-1 to 224-4 can play a sufficient role of ground (GND) and at the same time, the reflector grill fins 224-1, 224-3 formed on one side of the RF filter 220 and the reflector grill fins 224-2, 224-4 formed on the other side of the RF filter 220 adjacent thereto do not contact each other so as to maintain a predetermined ventilation performance, but can form a heat dissipation hole of the above-mentioned predetermined size. Here, the separation distances d1, d2 between the reflector grill fins 224 can be appropriately designed by simulating the durability and heat dissipation characteristics, and can be preferably set in consideration of the arrangement distance of the radiating elements included in the radiating element module 210. In addition, the separation distances d1, d2 between the reflector grill fins 224 can be designed in consideration of the wavelength of the operating frequency, as described later. For example, the separation distances d1, d2 between the reflector grill fins 224 are set to have a size within a range of 1 / 10λ to 1 / 20λ of the operating frequency. Here, the spacing of 1 / 10λ serves as an upper threshold for the radiating element module 210 to function as a sufficient ground (GND), and the spacing of 1 / 20λ serves as a lower threshold for ensuring a minimum outside air flow through the heat dissipation holes formed by the multiple reflector grill fins 224.

[0120] Therefore, it is preferable that the intervals d1, d2 between the reflector grill fins 224 are greater than 1 / 20λ of the operating frequency and less than 1 / 10λ of the operating frequency. More specifically, when the RF filters 220 are arranged adjacent to each other in the left-right direction as shown in Fig. 29, the reflector grill fins 224-1, 224-3 are arranged to overlap each other, and it is preferable that the interval d2 between the reflector grill fins 224-1, 224-3 is set to be less than 1 / 20λ of the operating frequency.

[0121] Furthermore, as shown in FIG. 29, when the RF filters 220 are arranged adjacent to each other in the vertical direction, it is preferable that the reflector grill fins 224-2, 224-4 are aligned in a vertical line, and the distance d1 between the reflector grill fins 224-2, 224-4 is set to be smaller than 1 / 10λ of the wavelength.

[0122] In addition, the reflector grill fins 224 are arranged to cover the front surface of the plurality of RF filters 220 together with the above-mentioned outer panel 228, and can serve as a ground (GND) for the plurality of radiating element modules 210. For this reason, it is preferable that the filter outer panel 228, the filter body 221 of the RF filter 220, and the reflector grill fins 224 are all made of metal materials.

[0123] In terms of a ground (GND) function, the reflector grill fin 224 is defined as a configuration that functions to expand a common ground area between the plurality of RF filters 220 and the plurality of radiating element modules 210 together with the above-mentioned filter outer panel 228. Furthermore, the reflector grill fin 224 can not only serve as a ground for the radiating element module 210, but also serve to protect the RF filter 220 exposed to the front outside air defined in front of the front surface of the front housing 140 from the outside.

[0124] Fig. 30A and Fig. 30B are a cross-sectional view and a partially enlarged view taken along the lines AA and BB in Fig. 15. Referring to Fig. 30A, when the radome cover 240 is assembled in close contact with the RF filter 220 toward the rear in a state where the radiating element module 210 is coupled to the radome cover 240, an assembly force is generated at the connection space 226a where the through pin terminal 226 is provided, and the feedthrough pin coupling is immediately completed at a predetermined position while the assembly tolerance is eliminated by the elastic support of the elastic ground washer 226b arranged at the front side of the connection space 226a.

[0125] Also, referring to FIG. 30B, when the RF filter 220 and the amplifier module 230 are tightly coupled to each other, if the through pin terminal 229 is provided inside the RF filter 220 and is connected to the through pin connection terminal 229c which mediates the electrical connection with the amplifier module 230, the feed through pin coupling can be completed immediately at a specified position while being elastically supported by the elastic ground washer 229b arranged on the rear side of the RF filter 220, eliminating assembly tolerances.

[0126] Therefore, the assembly of each component of RF module 200 can be completed in a simple manner by feed-through pin coupling, and at the same time, when RF module 200 itself is connected to the front surface of main board 170, as described above, it can be performed by the simple operation of socket pin coupling, thereby greatly improving the overall ease of assembly.

[0127] In this way, the antenna device 100 according to one embodiment of the present invention has a unit radome cover 240 that is separated for each RF module 200 instead of the existing single-type radome, thereby effectively protecting each radiating element module 210, and can easily dissipate internal system heat of the antenna device 100 in all directions including not only the rear but also the front, thereby significantly improving heat dissipation performance compared to the conventional art.

[0128] An embodiment of an RF module for an antenna and an antenna device including the same according to the present invention has been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiment, and it is obvious that various modifications and equivalent implementations are possible by those skilled in the art to which the present invention pertains. Therefore, the true scope of the present invention is defined by the claims set forth below. [Industrial Applicability]

[0129] The present invention provides an RF module for an antenna, which completely separates the radiating element module and RF element from the main board and arranges them so that they are exposed to the outside air at the front, while eliminating the difficulties of heat dissipation design to the front side where the conventional radiating element is located, and an antenna device including the same. [Explanation of symbols]

[0130] 100: Antenna device 110: Rear housing 111: Rear heat dissipation fin 115: Installation space 120, 120a to 120d: ventilation panel 130: handle 140: Front housing 141: Front heat dissipation fin 143: Socket penetration part 144: Foreign object inflow prevention ring 146: Module assembly screw 147: Surface attachment part 149: Ring mounting groove 150: RFIC board section 153: RFIC element 155: Intermediate female socket part 157: Separation supporter 160: Heat separation plate 161: Intermediate male socket part 170: Main board 171: Final female socket part 173: Digital element 180: PSU board section 183: PSU element 185: Busbar 185': Busbar fastening screw 190: Surge board section 195: Bus bar 195': Busbar fastening screw 200: RF module 210: Radiating element module 211: Printed circuit board for radiating element 212: Antenna patch circuit section 213: Power supply line 214a: Input through hole 214b: Output through hole 217: Radiation director 217a: Multiple coupling holes 220: RF filter 221: Filter body 222: Cavity 223: Resonating bar 224: Reflector grill fin 226: Through pin terminal 227: Filter tuning cover 228: Filter outer panel 229: Through pin terminal 230: Amplification module 231: Amplifier body 232: Amplifier heat sink fin 233: Substrate placement space 234: Assembly panel 235: Amplification board 235a: Male socket part 236: Amplification section cover 238: Joint flange 239: Screw boss 240: Radome cover 241: Hook joint portion 247a: Multiple joint projections 250: Module assembly screw 260: Vapor chamber 261: Element through-hole 263: Element-type matching groove 265: Screw fastening groove 300: Antenna RF module assembly 400: Outer mounting member

Claims

1. An RF filter arranged on the front surface of the main board; a radiating element module disposed in front of the RF filter; an amplifier module having at least one analog amplifier element built therein, the amplifier module being disposed between the main board and the RF filter; The amplifier module includes: an amplifier body having a substrate mounting space that is open on one or the other side in the width direction; an amplifier circuit board mounted inside the amplifier body, the front end of which is signal-connected to the RF filter and the rear end of which is signal-connected to the main board; an amplifier cover provided to cover the amplifier board; a vapor chamber located between the amplifier body and the amplifier board or between the amplifier cover and the amplifier board, for mediating the transfer of heat generated from an analog amplifier element mounted on the amplifier board; The RF module for antennas, wherein the vapor chamber has an element through-portion through which a portion of the analog amplifying element mounted on the amplifying section substrate passes.

2. Either one side or the other side of the vapor chamber is formed flat so as to be in surface thermal contact with the flat inner side surface of the amplifier body or the flat inner side surface of the amplifier cover; 2. The RF module for antennas as described in claim 1, wherein the other of the one or other surfaces of the vapor chamber has an element-type matching groove formed therein so that the analog amplification element mounted on the opposing surface of the amplifier board and protruding therefrom is matched to increase the area of ​​surface thermal contact.

3. A PA element and an LNA element that realize 2T2R as analog amplification elements are mounted on the surface of the amplifier board that faces the vapor chamber, The PA element, which generates a relatively large amount of heat compared to the LNA element, is disposed through the element through-hole of the vapor chamber; 3. The antenna RF module according to claim 2, wherein the LNA element, which generates less heat than the PA element, is molded into the element mold-matching groove of the vapor chamber.

4. A PA element and an LNA element that realize a 1T1R configuration as analog amplification elements are mounted on one of the two surfaces of the amplifier board, A PA element and an LNA element that realize a 1T1R amplifier as analog amplifier elements are mounted on the other of the two surfaces of the amplifier board, 3. The antenna RF module according to claim 2, wherein the vapor chambers are respectively arranged between an inner surface of the amplifier body and one surface of the amplifier board, and between an inner surface of the amplifier cover and the other surface of the amplifier board.

5. An RF filter arranged on a front surface of a main board; a radiating element module disposed in front of the RF filter; an amplifier module having at least one analog amplifier element built therein, the amplifier module being disposed between the main board and the RF filter; The amplifier module includes: an amplifier body having a substrate mounting space that is open on one or the other side in the width direction; an amplifier circuit board mounted inside the amplifier body, the front end of which is signal-connected to the RF filter and the rear end of which is signal-connected to the main board; an amplifier cover provided to cover the amplifier board; a vapor chamber located between the amplifier body and the amplifier board or between the amplifier cover and the amplifier board, for mediating the transfer of heat generated from an analog amplifier element mounted on the amplifier board; At least one reflector grill fin disposed between the RF filter and the radiating element module to ground the radiating element module and to allow outside air to flow from the front to the rear of the RF filter or to flow from the rear to the front of the RF filter; a radome cover coupled to a front surface of the RF filter and protecting the radiating element module from the outside; The at least one reflector grill fin is integrally molded with the RF filter.

6. An RF filter arranged on a front surface of a main board; a radiating element module disposed in front of the RF filter; an amplifier module having at least one analog amplifier element built therein, the amplifier module being disposed between the main board and the RF filter; The amplifier module includes: an amplifier body having a substrate mounting space that is open on one or the other side in the width direction; an amplifier circuit board mounted inside the amplifier body, the front end of which is signal-connected to the RF filter and the rear end of which is signal-connected to the main board; an amplifier cover provided to cover the amplifier board; a vapor chamber located between the amplifier body and the amplifier board or between the amplifier cover and the amplifier board, and mediating the transfer of heat generated from an analog amplifier element mounted on the amplifier board; The RF filter includes a filter body having a plurality of cavities formed therein and opening forward, and resonant bars disposed inside the cavities, respectively. the reflector grill fins extend in upper, lower, left and right directions along the front edge of the filter body and are arranged with a predetermined spacing therebetween.

7. 7. The antenna RF module of claim 6, wherein the reflector grill fins function as a reflector together with a filter outer panel arranged to shield a front surface of the filter body.

8. The RF module for antennas according to claim 6 , wherein the reflector grill fins are set in consideration of a length of the radiating element included in the radiating element module.

9. 6. The antenna RF module according to claim 5, wherein the RF filter and the reflector grill fins are integrally manufactured by a die-casting method using a metallic molding material.

10. 6. The RF module for an antenna according to claim 5, wherein a portion of the reflector grill fin is extended to overlap a reflector grill fin formed on an adjacent RF filter.

11. a main board having at least one digital device mounted on its front or rear surface; a rear housing having a box shape and an opening at the front of an installation space in which the main board is provided; a front housing arranged to cover the open front of the rear housing and to separate an installation space of the rear housing from an external space; a plurality of antenna RF modules disposed in front of the front housing and connected to the main board via electrical signal lines; Each of the plurality of antenna RF modules includes: an RF filter arranged on a front surface of the main board; a radiating element module disposed in front of the RF filter; an amplifier module having at least one analog amplifier element mounted thereon, the amplifier module being disposed between the main board and the RF filter; The amplifier module includes: an amplifier body having a substrate mounting space that is open on one or the other side in the width direction; an amplifier circuit board mounted inside the amplifier body, the front end of which is signal-connected to the RF filter and the rear end of which is signal-connected to the main board; an amplifier cover provided to cover the amplifier board; a vapor chamber located between the amplifier body and the amplifier board or between the amplifier cover and the amplifier board, for mediating the transfer of heat generated from an analog amplifier element mounted on the amplifier board; The antenna device, wherein the vapor chamber has an element through-portion through which a portion of the analog amplifying element mounted on the amplifying section substrate passes.

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