Electronic device and imaging module thereof

Abstract

This application discloses an electronic device and its imaging module, which belongs to the field of communication devices. The imaging module includes a lens, a driving member, and a photosensitive chip, the photosensitive chip is a Bayer array sensor, and includes a plurality of pixel regions arranged in a matrix, each pixel region includes four sub-pixel regions, the photosensitive chip is connected to the driving member, and the driving member can drive the photosensitive chip to switch between a first position and a second position relative to the lens, when the photosensitive chip is in the first position, the light incident from the lens forms a first image in the first sub-pixel region of the photosensitive chip, and when the photosensitive chip is in the second position, the light incident from the lens forms a second image in the second sub-pixel region of the photosensitive chip, the contents of the first image and the second image are the same, and the equivalent sub-pixel regions in the same pixel region of the first sub-pixel region and the second sub-pixel region are any two sub-pixel regions in the pixel region.

Description

[Technical field]

[0001] The present application relates to the technical field of communication devices, and more particularly to an electronic device and an imaging module thereof. [Background technology]

[0002] With the development of science and technology, electronic devices such as mobile phones play an increasingly important role in production and life, and electronic devices are usually equipped with an imaging module to facilitate imaging operations by users. As the market competition becomes increasingly fierce, electronic devices usually have at least one excellent performance to differentiate themselves from other electronic devices and increase the market competitiveness of the electronic devices. For example, the electronic device has a high refresh rate, thereby having high display performance, or the electronic device has dual speakers, thereby having high audio-visual effect, and for example, the electronic device has high imaging performance. Regarding the imaging performance of electronic devices, the performance of the imaging module can be improved in various ways.

[0003] Take image definition as an example. For the same size of the photosensitive chip, the increase in the number of pixels will reduce the photosensitive ability of the imaging module and also have a negative impact on the imaging result, so the industry usually uses single-frame interpolation and multi-frame synthesis to improve the definition. However, in the process of forming an image by single-frame interpolation, the actual photosensitive pixels are not increased, so the effect of improving the definition is limited, and in some cases, it is easy to cause interpolation errors. In addition, in the process of forming an image by multi-frame synthesis, it is very difficult to control the pixel displacement, and the effect of the synthesized image is also low. Summary of the Invention [Problem to be solved by the invention]

[0004] The present application discloses an electronic device and an imaging module thereof that can enhance image clarity. [Means for solving the problem]

[0005] In order to solve the above problems, the embodiment of the present application is realized as follows.

[0006] In a first aspect, an embodiment of the present application includes a lens, a driving member, and a photosensitive chip, the photosensitive chip being a Bayer array sensor, the photosensitive chip including a plurality of pixel regions arranged in a matrix, each of the pixel regions including four sub-pixel regions; the photosensitive chip is connected to the driving member, the driving member being capable of driving the photosensitive chip to switch between a first position and a second position relative to the lens; The present invention discloses an imaging module, in which when the photosensitive chip is in a first position, light incident from the lens forms a first image in a first sub-pixel region of the photosensitive chip, and when the photosensitive chip is in a second position, light incident from the lens forms a second image in a second sub-pixel region of the photosensitive chip, the contents of the first image and the second image are the same, and equivalent sub-pixel regions in the same pixel region of the first sub-pixel region and the second sub-pixel region are any two of the sub-pixel regions in the pixel region.

[0007] In a second aspect, an embodiment of the present application discloses an electronic device including the imaging module described above. Effect of the Invention

[0008] The embodiment of the present application provides an imaging module, in which a lens and a photosensitive chip are combined, and the photosensitive chip can be switched between a first position and a second position, so that when the position of the photosensitive chip is changed, a first image and a second image can be formed in a first sub-pixel region and a second sub-pixel region of the photosensitive chip respectively, and the contents of the first image and the second image are the same. In addition, the equivalent sub-pixel regions in the same pixel region of the first sub-pixel region and the second sub-pixel region are any two in the pixel region, so that in two imaging processes, the filter processing results of the photosensitive chip for the incident light are different; and, by using a preset algorithm to synthesize the first image and the second image, the actual photosensitive pixels of each filter channel in the formed synthetic image can be increased, so as to increase the image resolution, improve the picture expression effect, and improve the image quality level and user experience of the final image. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic diagram illustrating the configuration of an imaging module disclosed in an embodiment of the present application. [Diagram 2] 1 is an assembly diagram of a photosensitive chip and a position restriction member in an imaging module disclosed in an embodiment of the present application. [Diagram 3] 1A and 1B are schematic diagrams of a position restriction member in an imaging module disclosed in an embodiment of the present application. [Figure 4] 1 is a schematic diagram showing the configuration of a pixel region of a photosensitive chip in an imaging module disclosed in an embodiment of the present application. [Diagram 5] 11 is a diagram comparing the relative positions of a pixel region in which a first sub-pixel region is located and a pixel region in which a second sub-pixel region is located in an imaging module disclosed in an embodiment of the present application. FIG. [Figure 6] 13 is another diagram for comparing the relative positions of a pixel region in which a first sub-pixel region is located and a pixel region in which a second sub-pixel region is located in an imaging module disclosed in an embodiment of the present application. FIG. [Figure 7]13 is a further diagram for comparing the relative positions of a pixel region in which a first sub-pixel region is located and a pixel region in which a second sub-pixel region is located in an imaging module disclosed in an embodiment of the present application. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The drawings described in this specification are intended to provide a further understanding of the present application and to constitute a part of the present application, and the illustrative embodiments and the description thereof are intended to interpret the present application and are not intended to unduly limit the present application.

[0011] In order to make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the present application will be described clearly and completely below with reference to the specific embodiments of the present application and the corresponding drawings. Of course, the described embodiments are only a part of the embodiments of the present application, and are not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without any creative effort shall fall within the scope of protection of the present application.

[0012] The technical solutions disclosed in each embodiment of the present application will be described in detail below with reference to the drawings.

[0013] As shown in Figures 1 to 3, the present application discloses an imaging module, which includes a lens 200, a driving member, and a photosensitive chip 400. The imaging module further includes a housing 100, in which any of the above-mentioned devices can be mounted, and the housing 100 may be made of materials such as plastic or metal. Of course, the imaging module may further include other structures, which will not be described here for convenience.

[0014] The photosensitive chip 400 is an image forming sensor, and the photosensitive chip 400 is a Bayer array sensor, that is, all the photosensitive pixels in the photosensitive chip 400 are arranged in a Bayer array. The photosensitive chip 400 includes a plurality of pixel regions arranged in a matrix, and each pixel region includes four sub-pixel regions, and the four sub-pixel regions are arranged in a 2×2 matrix. The four sub-pixel regions may include two green pixels, one blue pixel, and one red pixel, and the two green pixels are arranged in a diagonal direction. The four sub-pixel regions in each pixel region may be a first sub-pixel region, a second sub-pixel region, a third sub-pixel region, and a fourth sub-pixel region, respectively.

[0015] Typically, the photosensitive chip 400 may include a filter array layer and a photosensitive layer, where light is passed through the filter array layer to irradiate the photosensitive layer, and the filter array layer can filter colors such that only one color component, such as red, blue, or green, is retained from the light passing through the filter array layer.

[0016] As described above, the photosensitive chip 400 includes a plurality of pixel regions, each of which includes four sub-pixel regions; in particular, each sub-pixel region is a part of the photosensitive chip 400; that is, each sub-pixel region may include a sub-filter layer and a sub-photosensitive layer, and the number of sub-pixel regions is plural; further, all the sub-filter layers jointly constitute a filter array layer, and all the sub-photosensitive layers jointly constitute a photosensitive layer.

[0017] Each pixel region of the Bayer array sensor has four filters in its filter array layer, which correspond to four sub-pixel regions in one pixel region, and the four filters generally include one red filter, one blue filter, and two green filters, and are abbreviated as RGGB. When the types of filters provided in the different sub-pixel regions of the photosensitive layer are different, the colors of the images formed in the regions corresponding to the different sub-pixel regions of the photosensitive layer are also different.

[0018] In the imaging module provided in the embodiments of the present application, the photosensitive chip 400 is connected to a driving member, and the driving member can drive the photosensitive chip 400 to move relative to the lens 200, and by keeping the lens 200 fixed and controlling only the photosensitive chip 400 to move, the control accuracy can be improved and the difficulty of control can be reduced.

[0019] Specifically, the lens 200 can be fixedly connected to the housing 100, and the photosensitive chip 400 can form a movable connection relationship with the housing 100 by a driving member. The lens 200 can be fixed to the housing 100 by a method such as gluing, the driving member can be a micro linear motor, etc., the driving member can be attached to the housing 100 by a connecting member such as a screw, and the photosensitive chip 400 is connected to a driving head of the driving member, so that the driving member can drive the photosensitive chip 400 to move relative to the housing 100, that is, generate a relative movement between the photosensitive chip 400 and the lens 200.

[0020] More specifically, the driving member can drive the photosensitive chip 400 to switch between a first position and a second position relative to the lens 200. In this case, by adjusting the position at which the photosensitive chip 400 is located, the relative positions of the lens 200 and the photosensitive chip 400 can be changed. Furthermore, light incident from the same position on the lens 200 can be projected to different positions on the photosensitive chip 400 to form images with the same content at different positions on the photosensitive chip 400.

[0021] When the photosensitive chip 400 is in a first position, the light incident from the lens 200 forms a first image in a first sub-pixel region of the photosensitive chip 400, and when the photosensitive chip 400 is in a second position, the light incident from the lens 200 forms a second image in a second sub-pixel region of the photosensitive chip 400.

[0022] It should be noted that after one of the first and second images is formed, the other is formed only after the driving member operates to drive the photosensitive chip 400 to change its position. Although the photosensitive chip 400 undergoes a certain displacement with respect to the framing area during the two imaging processes, the edge position of the image formed on the photosensitive chip 400 is generally not shown in the final image, and the displacement of the photosensitive chip 400 is extremely small, so that when the entire imaging module is kept fixed, the contents of the images formed in the two imaging processes before and after can be regarded as being substantially the same, and further, it can be guaranteed that the contents of the first image and the second image formed in one sub-pixel region of the photosensitive chip 400 are the same.

[0023] In the process of forming the first and second images, the relative positions of the lens 200 and the photosensitive chip 400 change, so that the position at which light passes through the lens 200 and is projected onto the photosensitive chip 400 may also change, i.e., the first image is formed within the first sub-pixel region of the photosensitive chip 400, and the second image is formed within the second sub-pixel region of the photosensitive chip 400.

[0024] When the displacement amount of the photosensitive chip 400 is different, the distance between the first sub-pixel region and the second sub-pixel region is also different, so that the first sub-pixel region and the second sub-pixel region may not be in the same pixel region. However, even if the first sub-pixel region and the second sub-pixel region are in two pixel regions, respectively, a filter is associated with each of the first sub-pixel region and the second sub-pixel region, and the structures of the multiple pixel regions of the photosensitive chip 400 are all the same, so that the pixel region in which the first sub-pixel region is located necessarily includes one sub-pixel region with the same filter as the filter corresponding to the second sub-pixel region, and accordingly, the pixel region in which the second sub-pixel region is located necessarily includes one sub-pixel region with the same filter as the filter corresponding to the first sub-pixel region, so that the first sub-pixel region can be made equivalent to another sub-pixel region in the pixel region in which the second sub-pixel region is located. Equivalent subpixel regions within the same pixel region, that is, a first subpixel region and a second subpixel region, are any two subpixel regions within the pixel region; that is, if the first subpixel region is made equivalent to one within the pixel region in which the second subpixel region is located, then the equivalent to the first subpixel region is necessarily not the second subpixel region, and correspondingly, if the second subpixel region is made equivalent to one within the pixel region in which the first subpixel region is located, then the equivalent to the second subpixel region is necessarily not the first subpixel region.

[0025] When adopting the above technical solution, taking the above-mentioned light beam incident from the center of the lens 200 as an example, the light beam is projected onto the photosensitive chip 400 through the lens 200 to form a first image, and then the photosensitive chip 400 is driven to move, and the light beam incident from the center of the lens 200 is again projected onto the photosensitive chip 400 to form a second image.

[0026] By designing the displacement amount and displacement direction of the photosensitive chip 400, the above-mentioned light beam may be projected through the lens 200 onto a first sub-pixel region corresponding to a red filter of the photosensitive chip 400 at a first position, and then projected through the lens 200 onto a second sub-pixel region corresponding to a green filter of the photosensitive chip 400 at a second position. Alternatively, the above-mentioned light beam may be first projected onto the first sub-pixel region corresponding to a blue filter of the photosensitive chip 400, and then projected onto the second sub-pixel region corresponding to a green filter of the photosensitive chip 400. Alternatively, the above-mentioned light beam may be first projected onto a first sub-pixel region corresponding to a first green filter of the photosensitive chip 400, and then projected onto a second sub-pixel region corresponding to a second green filter of the photosensitive chip 400, in which the one adjacent to the lower side of the first green filter is a red filter, the one adjacent to the right side of the first green filter is a blue filter, the one adjacent to the upper side of the second green filter is a red filter, and the one adjacent to the left side of the second green filter is a blue filter, that is, the positions of the first green filter and the second green filter within one pixel region are different.

[0027] As a result, the result of filtering the above-mentioned light beam by the filter corresponding to the first sub-pixel region of the photosensitive chip 400 is different from the result of filtering the above-mentioned light beam by the filter corresponding to the second sub-pixel region of the photosensitive chip 400, so that the same light can be processed by two kinds of filters respectively to form two images with the same content but different colors. Based on the first image and the second image, by synthesizing according to a preset algorithm, the actual photosensitive pixels of each filter channel in the synthesized image can be increased, the image resolution can be increased, the photo expression effect can be improved, and the image quality level of the final image and the user experience can be improved.

[0028] As described above, the purpose of making the first and second images formed have the same contents but different colors can be achieved by designing the displacement amount and displacement direction of the photosensitive chip 400. More specifically, the displacement amount of the photosensitive chip 400 can be the side length of the sub-pixel region and the displacement direction of the photosensitive chip 400 can be the extension direction of the edge of the sub-pixel region, or the displacement amount of the photosensitive chip 400 can be the sum of the side length of the sub-pixel region and the side lengths of n pixel regions, where n is an integer value and n≧0.

[0029] In addition, the moving direction of the photosensitive chip 400 can be determined based on the actual situation, for example, the photosensitive chip 400 may cause a displacement of the side length of one sub-pixel region to the left in a plane perpendicular to its own optical axis, or the photosensitive chip 400 may cause a displacement of the side length of one sub-pixel region to the downward direction in a plane perpendicular to its own optical axis, or the photosensitive chip 400 may cause a displacement equal to the diagonal dimension of one sub-pixel region to the lower left direction in a plane perpendicular to its own optical axis, which is not limited in the present text. In addition, when the moving direction of the photosensitive chip 400 is different, the types of filters corresponding to the first sub-pixel region and the second sub-pixel region are also different.

[0030] More intuitively, as shown in FIG. 4, which shows the distribution of four sub-pixel regions in each pixel region in the photosensitive chip 400, namely the first sub-pixel region 401, the second sub-pixel region 402, the third sub-pixel region 403, and the fourth sub-pixel region 404, the first sub-pixel region 401 of the photosensitive chip 400 at the first position may face the center of the lens 200, that is, when the photosensitive chip 400 is at the first position, the light incident from the center of the lens 200 may be projected into the first sub-pixel region 401. Accordingly, when the position of the photosensitive chip 400 changes, the corresponding relationship between the lens 200 and the photosensitive chip 400 also changes, specifically, after the photosensitive chip 400 moves to the second position, it may be the second sub-pixel region 402′ that faces the center of the lens 200, that is, when the photosensitive chip 400 is at the second position, the light incident from the center of the lens 200 may be projected into the second sub-pixel region 402′. Here, the second sub-pixel region 402' and the second sub-pixel region 402 may correspond to the same type of filter, but they may be located within two pixel regions respectively, and the pixel region in which the second sub-pixel region 402' is located further includes a first sub-pixel region 401', a third sub-pixel region 403', and a fourth sub-pixel region 404'.

[0031] In the process of driving and moving the photosensitive chip 400, the photosensitive chip 400 displaces the side length of one sub-pixel region to the left or downward within a plane perpendicular to its own optical axis, or displaces the diagonal length of one sub-pixel region to the bottom left, so that the relative positions of the pixel region in which the first sub-pixel region 401 is located and the pixel region in which the second sub-pixel region 402' is located can correspond to Figures 5 to 7, respectively.

[0032] The embodiment of the present application provides an imaging module, in which a lens and a photosensitive chip are combined, and the photosensitive chip 400 can be switched between a first position and a second position, so that when the position of the photosensitive chip 400 is changed, a first image and a second image can be formed in the first sub-pixel region and the second sub-pixel region of the photosensitive chip respectively, and the contents of the first image and the second image are the same. In addition, the equivalent sub-pixel regions in the same pixel region of the first sub-pixel region and the second sub-pixel region are any two in the pixel region, so that in the two imaging processes, the filter processing results of the photosensitive chip for the incident light are different; and, by synthesizing the first image and the second image using a preset algorithm, the actual photosensitive pixels of each filter channel in the formed composite image can be increased, so as to increase the image resolution, improve the picture expression effect, and improve the image quality level and user experience of the final image.

[0033] Optionally, in the imaging module provided in the embodiment of the present application, the driving member can further drive the photosensitive chip 400 to move to a third position, that is, the driving member can drive the photosensitive chip 400 to switch between a first position, a second position, and a third position relative to the lens 200, and specifically, the number of the driving members can be multiple, or the driving member can provide a multi-directional driving force. When the photosensitive chip 400 is in the third position, the light incident from the lens 200 forms a third image in a third sub-pixel region of the photosensitive chip 400, and the third image has the same content as the first image, and the equivalent sub-pixel regions in the same pixel region of the first sub-pixel region, the second sub-pixel region, and the third sub-pixel region are any three sub-pixel regions in the pixel region.

[0034] By adopting the above technical solution, the pattern of the filtering result for the same light can be further increased, and when the first image, the second image, and the third image are synthesized using a preset algorithm, the actual photosensitive pixels of each filter channel in the synthesized image can be further increased, and the resolution of the image can be further improved. Specifically, the relative positional relationship between the photosensitive chip 400 and the lens 200 can be changed by controlling the moving direction of the photosensitive chip 400, and the sub-pixel area corresponding to the light incident from the lens 200 can be changed, that is, the type of filter through which the light incident from the lens 200 passes can be changed, thereby achieving the purpose of increasing the filtering result for the same light. Optionally, the first sub-pixel area, the second sub-pixel area, and the third sub-pixel area can correspond to a green filter, a red filter, and a blue filter, respectively, so that the resolution of the photosensitive pixels corresponding to RGB in the image can all be improved, and the effect of the formed image can be improved.

[0035] Furthermore, in the imaging module provided in the embodiments of the present application, the driving member can further drive the photosensitive chip 400 to move to a fourth position, that is, the driving member can drive the photosensitive chip 400 to switch between a first position, a second position, a third position, and a fourth position relative to the lens 200. When the photosensitive chip 400 is in the fourth position, the light incident from the lens 200 forms a fourth image in a fourth sub-pixel region of the photosensitive chip 400, the fourth image has the same content as the first image, and the equivalent sub-pixel regions in the same pixel region of the first sub-pixel region, the second sub-pixel region, the third sub-pixel region, and the fourth sub-pixel region are four sub-pixel regions in the pixel region.

[0036] By adopting the above technical solution, the pattern of the filter processing result for the same light can be further increased, and by synthesizing the first image, the second image, the third image, and the fourth image using a preset algorithm, the actual light-sensitive pixels of each filter channel in the synthesized image can be further increased, and the image resolution can be further improved. When the above technical solution is adopted, compared with the means in which the light is directly incident on the light-sensitive chip, the resolution of the R and B images is improved by three times, and the resolution of the G image is improved by one time, and the clarity of the image is greatly improved.

[0037] In the process of the driving member driving the photosensitive chip 400 to move, the driving amount of the driving member can be accurately controlled to ensure that the photosensitive chip 400 can move a predetermined displacement amount during movement, and the predetermined displacement amount can be the side length of one sub-pixel area. In order to reduce the difficulty of controlling the imaging module, in another embodiment of the present application, optionally, the imaging module further includes a position limiting member 600, and the photosensitive chip is movably coupled to the lens by the position limiting member.

[0038] The position regulating member 600 includes a position regulating base 601 and a connecting portion 602, and the position regulating base 601 and the connecting portion 602 are movably connected to each other. The photosensitive chip 400 and the driving head of the driving member may both be connected to the position regulating base 601, or both may be connected to the connecting portion 602, thereby controlling the amount of displacement of the photosensitive chip 400 by the position regulating engagement relationship between the position regulating base 601 and the connecting portion 602. For example, the position regulating base 601 may be fixed to the housing 100, and the photosensitive chip 400 and the driving head of the driving member are both connected to the connecting portion 602.

[0039] The position control base 601 has a first position control groove, a second position control groove, a third position control groove, and a fourth position control groove, and the first position control groove, the second position control groove, the third position control groove, and the fourth position control groove are connected to each other to form a movable space 603, thereby ensuring that the connection part 602 can move within the movable space and is positioned by each of the above four grooves.

[0040] When the connection portion 602 is positioned within the first position restriction groove, the photosensitive chip 400 is at the first position, when the connection portion 602 is positioned within the second position restriction groove, the photosensitive chip 400 is at the second position, when the connection portion 602 is positioned within the third position restriction groove, the photosensitive chip 400 is at the third position, and when the connection portion 602 is positioned within the fourth position restriction groove, the photosensitive chip 400 is at the fourth position.

[0041] Generally, when the above technical solution is adopted, the position control member 600 can limit the displacement amount of the photosensitive chip 400; when the photosensitive chip 400 needs to be moved, the driving member drives the connecting member to move it to the corresponding position, and the position control base 601 can provide a reliable position control effect, so that when the connecting member can no longer move in the corresponding direction, it can be regarded that the photosensitive chip 400 has been driven to the target position, and the difficulty of the driving member to control its own driving amount is reduced.

[0042] Specifically, the specific dimensions and structures of the first position restricting groove, the second position restricting groove, the third position restricting groove, and the fourth position restricting groove can all be determined based on the actual situation such as the dimensions and shape of the connection part. Optionally, the first position restricting groove, the second position restricting groove, the third position restricting groove, and the fourth position restricting groove can all be square structures with the same dimensions as the size of one sub-pixel region. Accordingly, in order to ensure that the connection part can be normally positioned, the connection part can be a columnar structure with a square bottom.

[0043] Alternatively, the above four elements can be connected to each other to form a square structure, i.e., the four elements correspond to four sub-pixel areas in the pixel area, respectively, and are distributed in a 2×2 manner. In this case, when the connecting portion 602 is engaged with each of the four elements, the photosensitive chip 400 can be positioned at a first position, a second position, a third position, and a fourth position, respectively, thereby forming a first image, a second image, a third image, and a fourth image on the photosensitive chip 400, respectively.

[0044] In another embodiment of the present application, the second position limiting groove is connected to the third position limiting groove, the first position limiting groove is on one side of the arrangement direction of the second position limiting groove and the third position limiting groove, the fourth position limiting groove is on the other side of the arrangement direction, and the first position limiting groove is connected to the second position limiting groove, and the fourth position limiting groove is connected to the third position limiting groove. In simple terms, the second position limiting groove is connected to the right side of the first position limiting groove, the third position limiting groove is connected below the second position limiting groove, and the fourth position limiting groove is connected to the right side of the third position limiting groove, which may be regarded as forming a substantially "Z"-shaped structure.

[0045] When the above technical solution is adopted, whenever the connection part 602 moves between any two adjacent ones of the above four, the position of the connection part 602 can be restricted in a certain direction by the position restriction base 601, and by combining the driving force supplied from the driving member, the moving direction of the connection part 602 can be made unique, which further reduces the difficulty of driving and improves the accuracy of the movement.

[0046] As described above, the dimensions of the first position restriction groove etc. in the position restriction base can be determined based on parameters such as the structure and dimensions of the connection part, and optionally, in the arrangement direction of the first position restriction groove and the second position restriction groove and the arrangement direction of the second position restriction groove and the third position restriction groove, the dimensions of the connection part are all equal to the dimensions of the sub-pixel region, in this case, the shapes and dimensions of the bottom surfaces of the first position restriction groove, the second position restriction groove, the third position restriction groove, and the fourth position restriction groove can be made identical to the shapes and dimensions of the sub-pixel region, respectively, thereby reducing the difficulty of designing and processing the first position restriction groove etc., and ensuring that the connection part and each position restriction groove have a reliable position restriction relationship. Specifically, the connection part may be a columnar structure with a square bottom, and in another embodiment of the present application, the connection part 602 may be a cylindrical structure, in which case the contact area between the connection part 602 and the position restriction base 601 is small, thereby reducing the difficulty of the relative movement between them and reducing the difficulty of driving.

[0047] The optical axis of the lens is perpendicular to the photosensitive surface of the photosensitive chip 400, that is, the photosensitive chip faces the lens. In this case, the design and installation of the lens and the photosensitive chip are relatively less difficult, and the amount of light exposed by the photosensitive chip 400 can be increased, and the imaging effect can be improved. Of course, if there is a corresponding requirement, the photosensitive chip 400 does not need to face the lens 200, for example, the imaging module can be a periscope module, so as to increase the zoom magnification of the imaging module.

[0048] Optionally, the imaging module provided in the embodiment of the present application further includes an infrared filter 500, which is disposed on the light exit side of the lens, i.e., on the light entrance side of the photosensitive chip 400. The infrared filter 500 can provide a filtering effect to the light incident into the imaging module through the lens 200, thereby filtering out unnecessary light projected onto the photosensitive chip 400, preventing false color and / or moire from occurring on the photosensitive chip 400, and improving the effective resolution and color reproducibility of the photosensitive chip 400.

[0049] Optionally, the lens 200 is an extended depth of field lens, and the passing focal points of the three R, G, and B filter channels of the lens 200 are located at different positions and the three passing focal points are designed to cover three focal ranges, thereby increasing the longitudinal chromatic aberration of the three wavelength bands of R, G, and B, and achieving the purpose of covering three distances, far, middle, and near, where the three distances, far, middle, and near, are relative concepts, that is, the far distance is a position farther than the middle distance, and the close distance is a position closer than the middle distance.

[0050] By adopting the above technical solution in the lens 200, three pictures corresponding to R, G, and B can be taken, and the three pictures are focused on the above three distances of far, middle, and near, respectively. Then, based on the restoration algorithm, a window detection function can be used to detect the entire field of view, and it can be determined which of the three pictures corresponding to R, G, and B in each window is the clearest, and then the clearest picture is used as the basis, and the other two pictures are subjected to the sharpness transformation by the deconvolution algorithm to synthesize a picture with clearness in all distances.

[0051] Based on the imaging module disclosed in any of the above embodiments, an embodiment of the present application further provides an electronic device, which includes the imaging module provided in any of the above embodiments, and of course, the electronic device further includes other devices such as a display module, a housing, and a battery, which will not be introduced here one by one for convenience of description.

[0052] The electronic device disclosed in the embodiments of the present application may be a smartphone, a tablet computer, an e-book reader, or a wearable device. Of course, the electronic device may be other devices, and the embodiments of the present application are not limited thereto.

[0053] In the above-described embodiments of the present application, the emphasis has been on the differences between the embodiments, and the different optimization features between the embodiments can be arbitrarily combined to form a more preferred embodiment, provided they are not inconsistent, and for the sake of brevity, the description will be omitted here.

[0054] The above is merely an embodiment of the present application, and is not intended to limit the present application. Those skilled in the art may make various modifications and changes to the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of the claims of the present application.

[0055] (CROSS REFERENCE TO RELATED APPLICATIONS) This application claims priority to a Chinese patent application filed with the China Patent Office on December 31, 2020, bearing application number 202011639272.8 and titled "Electronic device and imaging module thereof," the entire contents of which are incorporated herein by reference. [Explanation of symbols]

[0056] 100 Case 200 Lenses 400 Photosensitive chip 401 First sub-pixel region 402 Second sub-pixel region 403 Third sub-pixel region 404 Fourth sub-pixel region 401' first sub-pixel region 402' second sub-pixel region 403' Third sub-pixel region 404' Fourth sub-pixel region 500 Infrared Filter 600 Position control member 601 Location Regulation Base 602 Connection 603 Movable space

Claims

1. An imaging module, comprising: The present invention includes a lens, a driving member, and a photosensitive chip, the photosensitive chip being a Bayer array sensor and including a plurality of pixel regions arranged in a matrix, each of the pixel regions including four sub-pixel regions; the photosensitive chip is connected to the driving member, the driving member being capable of driving the photosensitive chip to switch between a first position and a second position relative to the lens; When the photosensitive chip is at the first position, the light incident from the lens forms a first image in a first sub-pixel region of the photosensitive chip, and when the photosensitive chip is at the second position, the light incident from the lens forms a second image in a second sub-pixel region of the photosensitive chip, the contents of the first image and the second image are the same, and among the first sub-pixel region and the second sub-pixel region, equivalent sub-pixel regions in the same pixel region are any two of the sub-pixel regions in the pixel region; the driving member can drive the photosensitive chip to switch between the first position, the second position, and a third position relative to the lens; When the photosensitive chip is in the third position, the light incident from the lens forms a third image in a third sub-pixel region of the photosensitive chip, the third image has the same content as the first image, and equivalent sub-pixel regions in the same pixel region among the first sub-pixel region, the second sub-pixel region, and the third sub-pixel region are any three of the sub-pixel regions in the pixel region; the driving member can drive the photosensitive chip to switch between the first position, the second position, the third position, and a fourth position relative to the lens; When the photosensitive chip is in the fourth position, the light incident from the lens forms a fourth image in a fourth sub-pixel region of the photosensitive chip, the fourth image has the same content as the first image, and among the first sub-pixel region, the second sub-pixel region, the third sub-pixel region, and the fourth sub-pixel region, equivalent sub-pixel regions in a same pixel region are four of the sub-pixel regions in the pixel region; the imaging module further includes a position restricting member, the photosensitive chip is movably coupled to the lens by the position restricting member, the position restricting member includes a position restricting base and a connecting portion, the position restricting base or the connecting portion is connected to the driving member, the position restriction base is provided with a first position restriction groove, a second position restriction groove, a third position restriction groove, and a fourth position restriction groove which are connected to each other, when the connection portion is position restricted by the first position restriction groove, the photosensitive chip is at the first position, when the connection portion is position restricted by the second position restriction groove, the photosensitive chip is at the second position, when the connection portion is position restricted by the third position restriction groove, the photosensitive chip is at the third position, and when the connection portion is position restricted by the fourth position restriction groove, the photosensitive chip is at the fourth position; Imaging module.

2. 2. The imaging module of claim 1, wherein the second position regulating groove is connected to the third position regulating groove, the first position regulating groove is on one side of the arrangement direction of the second position regulating groove and the third position regulating groove, and the fourth position regulating groove is on the other side of the arrangement direction, the first position regulating groove is connected to the second position regulating groove, and the fourth position regulating groove is connected to the third position regulating groove.

3. 2. The imaging module according to claim 1, wherein in an arrangement direction of the first position restriction groove and the second position restriction groove and in an arrangement direction of the second position restriction groove and the third position restriction groove, the dimensions of the connection portion are all equal to the side length of the sub-pixel region.

4. The imaging module according to claim 3 , wherein the connection portion is a cylindrical structure.

5. The imaging module according to claim 1 , further comprising an infrared filter provided on a light exit side of the lens.

6. The imaging module of claim 1 , wherein the lens is an extended depth of field lens.

7. An electronic device comprising the imaging module according to claim 1 .

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