RFID labels and how to use them

Abstract

To make only a new RFID label including different information to readable if attaching the RFID label including the different information to an adherend which already has an RFID label attached.SOLUTION: An RFID label comprises: an RFID inlay that has an inlay substrate, an RFID antenna formed on a part of the inlay substrate, and an IC chip connected to the RFID antenna; a label substrate laminated on one side of the RFID inlay via a laminating adhesive layer; and an adhesive layer for an adherend formed on the other surface of the RFID inlay. A shielding layer containing a conductive material is formed in at least a part of an area other than the RFID antenna of the inlay substrate.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to RFID labels and methods of using RFID labels. [Background technology]

[0002] Conventionally, a method of using labels has been proposed in which, when information relating to an object to be adhered is updated or added to a label that has information pre-printed on it, a label with the updated information printed on it is affixed over the label already affixed to the object, thereby making it impossible to use the information printed on the label already affixed to the object (see Patent Document 1).

[0003] In Patent Document 1, a label with a barcode containing updated information is affixed to an already affixed label so as to cover the barcode printed on the label, making it impossible to read the barcode on the already affixed label. This makes it possible to update information about the adherend. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2009-98494 A Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, in fields such as product manufacturing, management, and distribution, RFID media such as RFID tags and RFID labels that support RFID (Radio Frequency Identification) technology, which sends and receives information via contactless communication from IC chips that have product-related and identification information written on them, have become widespread.

[0006] RFID labels are read using non-contact communication, so when the label usage method described in Patent Document 1 is applied to an RFID label, multiple RFID labels will be present on the adherend, and it may not be possible to read any of the RFID labels, or information from an RFID label other than the desired one may be read.

[0007] Therefore, an object of the present invention is to make it possible, when an RFID label containing different information is affixed to an article to which an RFID label has already been affixed, to read only the new RFID label containing the different information. [Means for solving the problem]

[0008] According to one aspect of the present invention, there is provided an RFID inlay having an inlay base material, an RFID antenna formed on a part of the inlay base material, and an IC chip connected to the RFID antenna; first A label base material laminated with an adhesive layer and an adherend formed on the other side of the RFID inlay The second and a pressure-sensitive adhesive layer, and a shielding layer containing a conductive material is formed in at least a part of the area of ​​the inlay base material other than the RFID antenna. The second pressure-sensitive adhesive layer is formed at least in an area corresponding to an area where the shielding layer is formed. An RFID label is provided. Effect of the Invention

[0009] According to the present invention, a shielding layer containing a conductive material is formed in at least a part of the region of the inlay substrate other than the RFID antenna, and therefore, when the RFID label is attached to an adherend so as to cover the RFID inlay of the already attached RFID label with the shielding layer, only the RFID label containing other information can be read. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is an external view of an RFID label according to an embodiment of the present invention. [Diagram 2]FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Diagram 3] FIG. 3 is an external view illustrating an RFID inlay included in an RFID label. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. [Diagram 5] FIG. 5 is a schematic diagram illustrating a state in which the first RFID label is attached to a bag as an adherend. [Figure 6] FIG. 6 is a schematic diagram illustrating a state in which a second RFID label is attached to a bag body so as to overlap a first RFID label. [Figure 7] FIG. 7 is a schematic diagram illustrating a state in which a first RFID label is attached to a cylindrical test tube. [Figure 8] FIG. 8 is a schematic diagram illustrating a state in which a second RFID label is attached to a test tube so as to overlap a first RFID label. [Figure 9] FIG. 9 is a cross-sectional view of an RFID label according to a first modified example. [Figure 10] FIG. 10 is a cross-sectional view of an RFID label according to the second modified example. [Figure 11] FIG. 11 is an external view of an RFID label according to the third modified example. [Figure 12] FIG. 12 is a schematic diagram illustrating a state in which an RFID label of the third modified example is attached to a test tube. [Figure 13] FIG. 13 is an external view of an RFID label according to the fourth modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] [RFID label] Fig. 1 is an external view of an RFID label 10 according to an embodiment of the present invention. Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1.

[0012] FIG. 3 is an external view illustrating the RFID inlay 6 included in the RFID label 10, and FIG. 4 is a cross-sectional view taken along line IV-IV in FIG.

[0013] The RFID label 10 includes an antenna pattern 1 and an RFID inlay 6 having an IC chip 5 of RFID specifications connected thereto.

[0014] The antenna pattern 1 includes an inlay substrate 2 (hereinafter, referred to as substrate 2 ), an RFID antenna 3 formed on the substrate 2 , and a shielding layer 4 formed on the substrate 2 .

[0015] The RFID antenna 3 is formed across the width direction of the RFID label 10 (the X direction in FIG. 1).

[0016] Moreover, the shielding layer 4 is formed in the region of the base material 2 other than the RFID antenna 3 by a material containing a conductive material.

[0017] As shown in FIG. 2, the RFID label 10 includes a label substrate 7 laminated on the surface of the RFID inlay 6 opposite to the surface on which the IC chip 5 is disposed, via an adhesive layer for lamination (hereinafter referred to as a first adhesive layer A1).

[0018] The RFID label 10 also includes, on the surface on which the IC chip 5 is disposed, an adhesive layer for an adherend (hereinafter, referred to as a second adhesive layer A2) for attaching the RFID label 10 to an adherend.

[0019] The label substrate 7 has a print surface as an information recording surface on which information can be printed by a thermal method or a thermal transfer method.

[0020] In addition, a separator S is temporarily attached to the RFID label 10 via a second adhesive layer A2.

[0021] Materials that can be used as the substrate 2 include a single resin film such as polyvinyl chloride, polyethylene terephthalate, polypropylene, polyethylene, or polyethylene naphthalate, or a multilayer film formed by laminating a plurality of these resin films.

[0022] In this embodiment, in addition to the above-mentioned resin film substrate, a paper substrate such as thick paper, high-quality paper, medium-quality paper, or coated paper having a coating layer formed thereon can be used as the substrate 2. Thermal paper can also be used as the substrate 2.

[0023] In this embodiment, the thickness of the substrate 2 can be 10 μm or more and 300 μm or less. When paper is used as the substrate 2, the thickness of the substrate 2 can be 50 μm or more and 260 μm or less within the above range, and is usually preferably 80 μm.

[0024] When a resin film is used as the substrate 2, the thickness is from 25 μm to 200 μm within the above range, and particularly, the thickness of the substrate 2 can be from 10 μm to 200 μm. These thicknesses can be appropriately selected depending on the application.

[0025] The RFID antenna 3 may be formed of a conductive sheet containing a conductive material. The conductive sheet may be a metal foil, particularly an aluminum or copper sheet. The RFID antenna 3 may be printed on a predetermined area of ​​the substrate 2 using a conductive ink.

[0026] As shown in Figures 3 and 4, the RFID antenna 3 comprises a loop portion 31, an IC chip connection portion 32 on which the IC chip 5 is mounted, meanders 33, 34 extending symmetrically from the loop portion 31 in the label width direction (X direction), and capacitor hats 35, 36 connected to the ends of the meanders 33, 34.

[0027] In this embodiment, the RFID antenna 3 is, for example, a UHF band RFID antenna designed to have an antenna length and antenna line width compatible with the UHF band (300 MHz to 3 GHz, particularly 860 MHz to 960 MHz).

[0028] Additionally, the RFID antenna 3 may be designed to have a pattern compatible with specific frequency bands such as microwaves (1 to 30 GHz, particularly around 2.4 GHz) and HF bands (3 MHz to 30 MHz, particularly around 13.56 MHz) depending on the RFID specifications.

[0029] The thickness of the metal foil that can form the RFID antenna 3 can be set in consideration of the thickness of the antenna pattern 1 or the thickness of an RFID label manufactured using the antenna pattern 1, and manufacturing costs, and is preferably 3 μm to 50 μm. In this embodiment, from the viewpoint of reducing manufacturing costs, an aluminum foil having a thickness of 20 μm is used as an example.

[0030] Although not shown in the drawings, the RFID antenna 3 is adhered to the base material 2 by a laminating adhesive layer made of an adhesive or bonding agent such as an acrylic, urethane, silicone, or rubber adhesive. That is, in order to adhere the RFID antenna 3 to the base material 2, a first adhesive layer A1 can be used.

[0031] The shielding layer 4 has an effect of shielding radio waves, and is formed in a part of the region of the base material 2 other than the region in which the RFID antenna 3 is formed, and on the same surface as the RFID antenna 3.

[0032] For example, when the antenna pattern 1 is used for an RFID label, the shielding layer 4 is attached to an RFID label so as to overlap the inlay of another RFID label that has been attached to an adherend in advance. This makes it possible to block communication between the previously attached RFID label and a reader.

[0033] The shielding layer 4 can be formed of a conductive sheet containing a conductive material as a material having an effect of shielding radio waves. The conductive sheet can be a metal foil, particularly an aluminum or copper sheet. The shielding layer 4 may be printed in a predetermined area of ​​the substrate 2 using a conductive ink. The shielding layer 4 is preferably formed of the same material as the RFID antenna 3 described above.

[0034] As a result, when an RFID label including the shielding layer 4 is affixed over the RFID inlay of another RFID label that has already been affixed, the information stored in the IC chip of the other RFID label that has already been affixed cannot be read.

[0035] In this embodiment, the IC chip 5 is compatible with the UHF band, and is a semiconductor package designed to be capable of communicating with a reader (not shown) that is a reading device for the IC chip 5.

[0036] The IC chip 5 is electrically and mechanically connected to an IC chip connection portion 32 provided in a part of the loop portion 31 of the RFID antenna 3 by an anisotropic conductive material such as an anisotropic conductive adhesive or an anisotropic conductive film.

[0037] In the RFID label 10, the label base material 7 is attached by a first adhesive layer A1 to the surface of the base material 2 opposite to the surface on which the IC chip 5 is mounted. That is, the first adhesive layer A1 serves to laminate the label base material 7 to the RFID inlay 6.

[0038] In the RFID label 10, a separator S is temporarily attached via a second adhesive layer A2 to the surface of the substrate 2 on which the IC chip 5 is mounted. The RFID label 10 can be peeled off from the separator S and attached to an adherend via the second adhesive layer A2.

[0039] <Effects> The RFID label 10 according to this embodiment includes a shielding layer 4 that has the effect of shielding radio waves. Therefore, when the shielding layer 4 of the RFID label 10 is attached to an adherend so as to cover the RFID inlay of another RFID label that is already attached to an adherend, the information stored in the IC chip of the other RFID label cannot be read by a reading device.

[0040] In addition, the shielding layer 4 is formed in an area other than the area where the RFID antenna 3 is formed. Therefore, the RFID antenna 3 is not affected by the shielding layer 4. Therefore, the reader can read only the information stored in the IC chip 5 connected to the RFID antenna 3.

[0041] [How to use RFID labels] Next, a description will be given of a method of using the above-mentioned RFID label 10. Fig. 5 to Fig. 8 are diagrams for explaining a method of using the RFID label 10.

[0042] FIG. 5 is a schematic diagram illustrating a state in which a first RFID label 10A is affixed to a bag body P1 as an adherend, and FIG. 6 is a schematic diagram illustrating a state in which a second RFID label 10B is affixed on top of the first RFID label 10A in the bag body P1.

[0043] The first RFID label 10A shown in Fig. 5 is a general RFID label equipped with an RFID antenna 101 and an RFID inlay 103 having an IC chip 102 connected to the RFID antenna 101. The second RFID label 10B shown in Fig. 6 corresponds to the RFID label 10 described above.

[0044] In a method of using the RFID label 10 according to this embodiment, as shown in FIG. 6, the second RFID label 10B is attached on top of the first RFID label 10A so as to cover the RFID inlay 103 of the first RFID label 10A with the shielding layer 4.

[0045] As a result, the shielding layer 4 blocks radio waves from reaching the RFID antenna 101 of the first RFID label 10A, making it impossible for a reader to read the information stored in the IC chip 102 of the first RFID label 10A.

[0046] In the second RFID label 10B, the shielding layer 4 is formed in an area other than the area where the RFID antenna 3 is formed. Therefore, the RFID antenna 3 is not affected by the shielding layer 4. Therefore, the reader can read only the information stored in the IC chip 5 connected to the RFID antenna 3.

[0047] Next, a case where the present invention is applied to a cylindrical test tube P2 as another form of adherend will be described.

[0048] FIG. 7 is a schematic diagram illustrating a state in which a first RFID label 10A is affixed to a cylindrical test tube P2, and FIG. 8 is a schematic diagram illustrating a state in which a second RFID label 10B is affixed on top of the first RFID label 10A in the test tube P2.

[0049] 7 and 8, similarly to FIGS. 5 and 6, the first RFID label 10A is a general RFID label, and the second RFID label 10B corresponds to the RFID label 10 described above.

[0050] In a method of using the RFID label 10 according to this embodiment, as shown in FIG. 8, a second RFID label 10B is attached on top of the first RFID label 10A in such a way that the RFID inlay 103 of the first RFID label 10A is covered with the shielding layer 4, also for a cylindrical adherend such as a test tube P2.

[0051] As a result, the shielding layer 4 blocks radio waves from reaching the RFID antenna 101 of the first RFID label 10A, making it impossible for a reader to read the information stored in the IC chip 102 of the first RFID label 10A.

[0052] Moreover, the shielding layer 4 of the second RFID label 10B is formed in an area other than the area where the RFID antenna 3 is formed. Therefore, the RFID antenna 3 is not affected by the shielding layer 4. Therefore, the reader can read only the information stored in the IC chip 5 connected to the RFID antenna 3.

[0053] [Modification of RFID label] <First Modification> FIG. 9 is a cross-sectional view of an RFID label 20 according to a first modified example.

[0054] Although the first modified example has a layered structure different from that of the RFID label 10, the appearance of the RFID label 20 is the same as that of the RFID label 10 shown in Fig. 1. Therefore, a description of the appearance of the RFID label 20 will be omitted. The cross-sectional view shown in Fig. 9 is a cross-sectional view of the RFID label 20 cut at the same position as the line II-II of the RFID label 10 shown in Fig. 1.

[0055] In an RFID label 20 according to the first modification, in an RFID inlay 61, the surface on which the label base 7 is laminated and the surface on which the second adhesive layer A2 is laminated are reversed from those in the RFID label .

[0056] 9, in the RFID label 20, a label base material 7 is laminated via a first adhesive layer A1 on the surface of the base material 2 in the antenna pattern 1 on which the RFID antenna 3 is formed, and a second adhesive layer A2 is laminated on the surface opposite to the surface on which the antenna pattern 1 is formed. A separator S is temporarily attached to the RFID label 20 via the second adhesive layer A2.

[0057] Unlike the RFID label 10, the RFID label 20 is attached to an object with the surface of the base material 2 opposite to the surface on which the IC chip 5 is mounted facing the object.

[0058] The RFID label 20 according to the first modification includes a shielding layer 4 that has the effect of shielding radio waves. Therefore, when the shielding layer 4 of the RFID label 20 is attached to an adherend so as to cover the RFID inlay of another RFID label that is already attached to an adherend, the information stored in the IC chip of the other RFID label cannot be read by a reading device.

[0059] <Second Modification> FIG. 10 is a cross-sectional view of an RFID label 30 according to the second modified example.

[0060] The RFID label 30 as the second modified example differs from the RFID label 10 in that the RFID label 30 does not include the label base material 7 .

[0061] Although the RFID label 30 has a different layered structure from the RFID label 10, the appearance of the RFID label 30 is similar to that of the RFID label 10 shown in Fig. 1. Therefore, a description of the appearance of the RFID label 30 will be omitted. The cross-sectional view shown in Fig. 10 is a cross-sectional view of the RFID label 30 cut at the same position as the line II-II of the RFID label 10 shown in Fig. 1.

[0062] The RFID label 30 includes an RFID inlay 62 in which an IC chip 5 conforming to RFID specifications is connected to an antenna pattern 12.

[0063] The antenna pattern 12 comprises a substrate 22, an RFID antenna 3 formed on the substrate 22, and a shielding layer 4. The substrate 22 constituting the antenna pattern 12 has a printed surface formed as an information recording surface, and the RFID antenna 3 and the shielding layer 4 are formed on the side opposite the printed surface of the substrate 22.

[0064] A second adhesive layer A2 for attaching to an adherend is laminated on the surface of the base material 22 on which the RFID antenna 3 is formed, and a separator S is temporarily attached via the second adhesive layer A2. Therefore, the RFID label 20 is attached to an adherend with the surface of the base material 2 on which the RFID antenna 3 and the IC chip 5 are mounted facing the adherend.

[0065] The RFID label 30 according to the second modification includes a shielding layer 4 that has the effect of shielding radio waves. Therefore, when the shielding layer 4 of the RFID label 30 is attached to an adherend so as to cover the RFID inlay of another RFID label that is already attached to an adherend, the information stored in the IC chip of the other RFID label cannot be read by a reading device.

[0066] Furthermore, by using the substrate 22 having an information recording surface, the RFID label 30 does not require the label substrate 7. This makes it possible to reduce manufacturing costs.

[0067] <Third Modification> FIG. 11 is an external view of an RFID label 40 according to the third modified example.

[0068] The RFID label 40 according to the third modification has an external shape different from that of the RFID label 10 .

[0069] As shown in FIG. 11, an RFID label 40 of the third modified example is formed in an L-shape having a label base 41 where the RFID antenna 3 is located, and a label narrow portion 42 that is formed narrower than the label base 41 in the X direction, which is the label width direction.

[0070] The RFID label 40 according to the third modification includes an RFID inlay 63 in which an IC chip 5 conforming to RFID specifications is connected to an L-shaped antenna pattern 13.

[0071] The antenna pattern 13 comprises an L-shaped substrate 23 having an inlay base 23a forming a label base 41 and an inlay narrow portion 23b forming a label narrow portion 42, an RFID antenna 3 formed on the inlay base 23a in the substrate 23, and a shielding layer 43 formed on the inlay narrow portion 23b in the substrate 23.

[0072] In the RFID label 40, a label base material 73 having a shape corresponding to the shape of the RFID inlay 63 is laminated on one surface of the RFID inlay 63. Although not shown in Fig. 11, a second adhesive layer A2 for attaching the RFID inlay 63 to an adherend is laminated on the other surface of the RFID inlay 63.

[0073] FIG. 12 is a schematic diagram illustrating a state in which an RFID label 40 of the third modified example is attached to a test tube P2.

[0074] Because the RFID label 40 has an L-shape, when it is attached to the test tube P2, a gap G is generated between the label ends of the narrow portion 42 as shown in Fig. 12. This makes it possible to visually confirm the content of the test tube P2.

[0075] Furthermore, the RFID label 40 is attached so that the base 41 covers the entire circumference of the test tube P2, forming an overlapping portion D. Therefore, the RFID label 40 is less likely to peel off from the surface of the test tube P2 than if the overlapping portion D were not formed.

[0076] For example, when the adherend is a test tube P2, moisture or frost may be present on the surface of the test tube P2, making it difficult to attach an RFID label to the test tube P2. Also, when the diameter of the test tube P2 is particularly small, it becomes difficult for the RFID label to bend along the surface of the test tube P2, which causes the RFID label to easily peel off from the test tube P2.

[0077] In contrast, the RFID label 40 of the third modified example can ensure visibility of the contents due to the gap G, and the base 41 has the overlapping portion D, which makes the RFID label 40 less likely to peel off, making it suitable for use in a cylindrical test tube P2.

[0078] The RFID label 40 may have any of the laminated structures shown in FIG. 2, FIG. 9 and FIG.

[0079] <Fourth modified example> FIG. 13 is an external view of an RFID label 40 according to the fourth modified example.

[0080] The RFID label 50 according to the fourth modification has an external shape different from that of the RFID label 10 .

[0081] The RFID label 50 has a protruding portion 51 that protrudes in the X direction, which is the label width direction, at a part of an end portion in the X direction.

[0082] In an RFID label 50 according to the fourth modification, the antenna pattern 14 includes a base material 24 having a protrusion 24a, an RFID antenna 3 formed on the base material 24, and a shielding layer 4 formed on the base material 24.

[0083] In the RFID label 50, a label base material 74 having a shape corresponding to the shape of the RFID inlay 64 is laminated on one surface of the RFID inlay 64. Although not shown in Fig. 13, a second adhesive layer A2 for attaching the RFID inlay 64 to an adherend is laminated on the other surface of the RFID inlay 64.

[0084] When the RFID label 50 is applied to, for example, a test tube P2, it covers the entire circumference of the test tube P2, and the protruding portion 51 is attached to a part of the RFID label 50, forming an overlapping portion D similar to the example shown in Fig. 12. This makes it difficult for the RFID label 50 to peel off from the surface of the test tube P2.

[0085] The RFID label 50 may have any of the laminated structures shown in FIG. 2, FIG. 9 and FIG.

[0086] [Other embodiments] Although the embodiments of the present invention have been described above, the above-mentioned embodiments merely illustrate some of the application examples of the present invention, and are not intended to limit the technical scope of the present invention to the specific configurations of the above-mentioned embodiments.

[0087] In this embodiment, it is sufficient that a shielding layer 4 containing a conductive material is formed in at least a part of the area other than the RFID antenna 3 of the substrate 2 constituting the RFID inlay 6, and the laminated structure constituting the RFID label is not limited to the structures shown in Figures 2, 9, and 10.

[0088] 8 illustrates a method of using the second RFID label 10B such that the extension direction of the RFID antenna 3 coincides with the circumferential direction of the test tube P2. However, the second RFID label 10B may be attached such that the extension direction of the RFID antenna 3 coincides with the axial direction of the test tube P2.

[0089] The RFID label 10, RFID label 20, and RFID label 30 according to the present embodiment may be so-called linerless labels to which the separator S is not temporarily attached. In this case, in the RFID label 10 and the RFID label 20, a release agent layer is provided on the surface of the label base material 7. In the RFID label 30, a release agent layer is provided on the surface of the base material 22 opposite to the surface on which the RFID antenna 3 is formed. This makes it possible to eliminate the need for the separator S.

[0090] 5-8, the first RFID label 10A may also be the RFID label 10. In this case, the shielding layer 4 is sized to cover the RFID inlay 6 of the RFID label 10.

[0091] In the present embodiment, the adherend is described as being a bag P1 or a test tube P2, but the form of the adherend is not limited to these. [Explanation of symbols]

[0092] 1 Antenna Pattern 2 Inlay base material (base material) 3 RFID antenna 4 Shielding layer 5. IC chip 6 RFID Inlay 7 Label substrate 10, 10A, 10B RFID labels 12,13,14 Antenna Pattern 20 RFID Labels 22,23 Inlay base material (base material) 23a Inlay base 23b Inlay narrow section 24 Base material 24a Protrusion 30 RFID Labels 31 Loop section 32 IC chip connection part 33,34 Meander 35,36 Capacitor Hat 40 RFID Labels 41 Label base 42 Narrow section of label 43 Shielding layer 50 RFID labels 51 Protrusion 61,63,64 RFID inlay 73,74 Label substrate 101 RFID Antenna 102 IC chip 103 RFID Inlay A1 First adhesive layer (adhesive layer for lamination) A2 Second adhesive layer (adhesive layer for adherend) P1 bag body P2 Test Tube S Separator

Claims

1. an RFID inlay having an inlay substrate, an RFID antenna formed on a part of the inlay substrate, and an IC chip connected to the RFID antenna; A label base laminated on one surface of the RFID inlay via a first adhesive layer; A second adhesive layer for an adherend formed on the other surface of the RFID inlay; A shielding layer including a conductive material is formed on at least a part of the region of the inlay base material other than the RFID antenna; The second pressure-sensitive adhesive layer is formed at least in an area corresponding to an area where the shielding layer is formed. RFID label.

2. 2. The RFID label of claim 1, The shielding layer and the RFID antenna are formed on the same surface of the inlay substrate. RFID label.

3. 3. The RFID label according to claim 1, The RFID antenna and the shielding layer are the same material. RFID label.

4. 4. The RFID label according to claim 1, The RFID antenna and the shielding layer are aluminum or copper. RFID label.

5. 4. The RFID label according to claim 1, The RFID antenna and the shielding layer are formed of conductive ink. RFID label.

6. 6. The RFID label according to claim 1, a surface of the label substrate laminated on the opposite surface of the inlay substrate to the RFID antenna is an information recording surface; RFID label.

7. An RFID label according to any one of claims 1 to 6, the second adhesive layer is formed in an area corresponding to an area where the RFID antenna is formed and an area corresponding to an area where the shielding layer is formed; RFID label.

8. an RFID inlay having an inlay substrate, an RFID antenna formed on a part of the inlay substrate, and an IC chip connected to the RFID antenna; An adhesive layer for an adherend formed on the RFID inlay; A shielding layer including a conductive material is formed on at least a part of the region of the inlay base material other than the RFID antenna; The pressure-sensitive adhesive layer is formed at least in an area corresponding to an area where the shielding layer is formed. RFID label.

9. 9. The RFID label of claim 8, The surface of the inlay substrate opposite to the surface on which the RFID antenna is formed is an information recording surface. RFID label.

10. The RFID label of claim 8 or 9, The adhesive layer is formed in an area corresponding to an area where the RFID antenna is formed and an area corresponding to an area where the shielding layer is formed. RFID label.

11. A method for using an RFID label, comprising attaching a second RFID label to an article to which a first RFID label has been attached, comprising the steps of: The second RFID label comprises: An RFID label comprising: an inlay substrate, an RFID inlay having an RFID antenna formed on a portion of the inlay substrate, and an IC chip connected to the RFID antenna; and an adhesive layer formed on the RFID inlay for use as an adherend, the RFID label having a shielding layer containing a conductive material formed on at least a portion of an area of ​​the inlay substrate other than the RFID antenna, attaching the second RFID label to the first RFID label so as to cover the RFID inlay of the first RFID label with the shielding layer; How to use RFID labels.

12. A method of using the RFID label of claim 11, comprising: covering an RFID inlay of the first RFID label with the shielding layer of the second RFID label to shield communications of the first RFID label; How to use RFID labels.

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