Electrical device and manufacturing method for electrical device

Abstract

To provide a damper formed of wire material which can be preliminarily fixed to a given position, a method of manufacturing the damper, electrical equipment including the damper, and a method of manufacturing the electrical equipment.SOLUTION: Electrical equipment 1 includes a component 2 and a case 3. Between the component 2 and the case 3, a damper element 30 is arranged. The damper element 30 is formed of wire material. The damper element 30 is preliminarily fixed to the component 2 or the case 3. For preliminary fixation, the damper element 30 includes a wire material piece 50 extending from a block body 40. For preliminary fixation, the component 2 or the case 3 includes a fixing part 60. The wire material piece 50 is preliminarily fixed to the fixing part 60. As a result, the falling of the damper element 30 is suppressed.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The disclosure of this specification , Electrical Equipment and a manufacturing method for electrical equipment. [Background technology]

[0002] Patent Document 1 discloses a vibration damper for an optical disk drive. The vibration damper is made of rubber and has a locking protrusion having a locking portion. The frame has a through hole into which the locking protrusion is inserted. The vibration damper is coupled to the frame.

[0003] Patent Document 2 discloses a wire damper. The wire damper has a locking protrusion 12. The contents of the prior art document are incorporated by reference as explanations of technical elements in this specification. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 10-64181 [Patent Document 2] DE102018102068A1 Summary of the Invention [Problem to be solved by the invention]

[0005] The rubber locking protrusion of Patent Document 1 or the wire locking protrusion of Patent Document 2 requires rubber with a non-negligible volume and weight. In addition, the rubber vibration absorbing damper may be limited in its application and use due to its material. In addition, from another point of view, the locking protrusion generates stress in the member to which it is locked. In the above-mentioned points of view, or in other points of view not mentioned, further improvements are required in the damper, the electric device, and the manufacturing method of the electric device.

[0007] Disclosed OneIt is an object of the present invention to provide an electric device having a damper made of wire that can be preliminarily fixed in a specified position, and a method for manufacturing the electric device. [Means for solving the problem]

[0010] The electrical device disclosed herein includes a part (2) that includes an electrical element and needs to be protected from impact, a case (3) that houses the part, and A damper comprising a block body (40) formed into a predetermined shape by an assembly of flexible wires (42), and a flexible wire piece (50) formed by the wires and extending from the block body, A block is placed between the part and the case to reduce the transmission of shock. Ruda The component and / or the case includes a fixing portion (60) that is connected to the wire piece to at least preliminarily fix the block body.

[0011] According to the disclosed electric device, the block body is preliminarily fixed to the component and / or case by the wire piece. Preliminarily fixing the block body suppresses the block body from falling off. Furthermore, the connection between the wire piece and the component and / or case suppresses stress generated in the component and / or case.

[0012] The method for manufacturing an electrical device disclosed herein comprises forming a block body (40) by assembling flexible wires (42) into a predetermined shape, forming flexible pieces of wire extending from the block body during or after the block body forming process, and at least preliminarily fixing the block body by connecting the pieces of wire to a component (2) that includes an electrical element and should be protected from shock and / or a fixing portion (60) provided on a case (3) that houses this component, and finally fixing the block body after the preliminarily fixing the block body.

[0013] According to the disclosed manufacturing method for an electric device, the block body is preliminarily fixed to the component and / or the case by the wire pieces. As a result, after the block body is preliminarily fixed, the block body is prevented from falling off. Prevention of the block body from falling off is provided in the manufacturing method until the block body is finally fixed. Furthermore, the connection between the wire pieces and the component and / or the case suppresses stress generated in the component and / or the case.

[0014] The various embodiments disclosed in this specification employ different technical means to achieve their respective objectives. The claims and the parenthetical symbols described in this section are merely illustrative of the corresponding relationship with the embodiments described below, and are not intended to limit the technical scope. The objectives, features, and effects disclosed in this specification will become more apparent by referring to the following detailed description and the accompanying drawings. [Brief description of the drawings]

[0015] [Figure 1] FIG. 1 is an exploded perspective view of an electrical device according to a first embodiment. [Diagram 2] FIG. 2 is a partially enlarged cross-sectional view of the electrical device according to the first embodiment. [Diagram 3] FIG. 4 is a plan view showing the material of the damper element. [Figure 4] FIG. 2 is an exploded perspective view showing the damper element and electrical components. [Diagram 5] FIG. 2 is an exploded cross-sectional view showing a damper element and an electrical component. [Figure 6] FIG. 11 is a partially enlarged cross-sectional view of an electrical device according to a second embodiment. [Figure 7] FIG. 11 is a partially enlarged cross-sectional view of an electrical device according to a third embodiment. [Figure 8] FIG. 11 is a partially enlarged cross-sectional view of an electrical device according to a fourth embodiment. [Figure 9] FIG. 11 is a partially enlarged cross-sectional view of an electrical device according to a fifth embodiment. [Figure 10] FIG. 13 is a partially enlarged cross-sectional view of an electrical device according to a sixth embodiment. [Figure 11] FIG. 13 is a partially enlarged cross-sectional view of an electrical device according to a seventh embodiment. [Figure 12] FIG. 13 is a partially enlarged cross-sectional view of an electrical device according to an eighth embodiment. [Figure 13] FIG. 13 is a partially enlarged cross-sectional view of an electrical device according to a ninth embodiment. [Figure 14] FIG. 23 is a partially enlarged cross-sectional view of an electrical device according to a tenth embodiment. [Figure 15] FIG. 23 is a partially enlarged cross-sectional view of an electrical device according to an eleventh embodiment. [Figure 16] FIG. 23 is a partially enlarged cross-sectional view of an electrical device according to a twelfth embodiment. [Figure 17] FIG. 23 is a partially enlarged cross-sectional view of an electrical device according to a thirteenth embodiment. [Figure 18] FIG. 23 is a partially enlarged cross-sectional view of an electrical device according to a fourteenth embodiment. [Figure 19] FIG. 23 is a partially enlarged cross-sectional view of an electrical device according to a fifteenth embodiment. [Figure 20] FIG. 21 is a partially enlarged cross-sectional view of an electrical device according to a sixteenth embodiment. [Figure 21] FIG. 21 is a partially enlarged cross-sectional view of an electrical device according to a seventeenth embodiment. [Figure 22] FIG. 21 is a partially enlarged cross-sectional view of an electrical device according to an eighteenth embodiment. [Figure 23] FIG. 23 is a partially enlarged cross-sectional view of an electrical device according to a nineteenth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] A number of embodiments will be described with reference to the drawings. In a number of embodiments, functionally and / or structurally corresponding and / or associated parts may be given the same reference numerals or reference numerals with different digits of 100 or more. For corresponding and / or associated parts, reference may be made to the description of other embodiments.

[0017] First embodiment structure FIG. 1 shows an exploded perspective view of an electric device 1. In the following description, the X-axis direction may be referred to as the width direction, the Y-axis direction as the depth direction, and the Z-axis direction as the thickness direction. The Z-axis direction may also be referred to as the disassembly direction or the axial direction. The electric device 1 has a flat box-like outer shape. The electric device 1 has a major plane extending along the XY plane in the figure.

[0018] The electric device 1 is an electric circuit device that provides a control device. The electric device 1 may also be called, for example, an electronic control unit (ECU). One example of the electric device 1 is a computer including at least one processor (hardware processor). In this case, the electric device 1 is also called a control device. Another example of the electric device 1 is a circuit component such as a relay circuit, a breaker circuit, and an inverter circuit. Yet another example of the electric device 1 is a battery.

[0019] The electric device 1 provides a control device for a vehicle. Here, the term vehicle should be interpreted in a broad sense. The term vehicle may include a car that moves on the ground, a ship that moves on the water, an aircraft that moves in the air, or a combination of these moving bodies. Note that the use of the electric device 1 is not limited to moving bodies such as vehicles. The electric device 1 may provide stationary or portable equipment such as a generator, an air conditioner, a lighting device, or a water pump.

[0020] The electrical device 1 includes a component 2 and a case 3. The component 2 is a component that needs to be protected from impact. Here, the impact includes (i) forces associated with thermal expansion and contraction, (ii) forces due to distortion associated with assembly, and (iii) forces associated with external or internal mechanical vibrations. The impact is assumed to be a force that may damage or cause defects in the solder or elements themselves when acting on the component 2. The component 2 is a single electrical element or a composite electrical component including multiple electrical elements. The component 2 may include, for example, multiple electrical elements and a circuit board on which those elements are mounted. The component 2 may also be an electrical and mechanical element, such as a relay housed in a container.

[0021] The case 3 houses the component 2. The case 3 is also called a protective case that protects the component 2. The case 3 is made of resin or metal. In this embodiment, the case 3 is conductive. The case 3 is made of metal. The case 3 includes a first case 4 and a second case 5. The first case 4 is an aluminum member formed by a die casting method. The second case 5 is an iron plate member formed by a sheet metal processing method.

[0022] The first case 4 and the second case 5 define a volume therebetween for accommodating the component 2. The first case 4 has a recess to provide this volume. The second case 5 provides a lid member for the first case 4. The first case 4 is also called a cup member. The second case 5 is also called a cover member.

[0023] The case 3 includes at least one fastening mechanism 6. The fastening mechanism 6 connects and fixes the first case 4 and the second case 5. The fastening mechanism 6 tightens the first case 4 and the second case 5 together to form a predetermined volume between the first case 4 and the second case 5. The predetermined volume accommodates the component 2. The case 3 includes one fastening mechanism 6 or multiple fastening mechanisms 6.

[0024] The fastening mechanism 6 can be provided by various mechanisms such as a screw mechanism, a snap-fit ​​mechanism, a bayonet lock mechanism, an adhesive fixing mechanism, and a welding fixing mechanism. In this embodiment, the fastening mechanism 6 is provided by a screw mechanism. The fastening mechanism 6 includes a screw 7. The screw 7 includes a large-diameter head. The screw 7 may include at least one of a washer, a spring washer, and the like. The fastening mechanism 6 includes a first seat portion 8 and a second seat portion 9 that are fastened by the screw 7. The first seat portion 8 is provided in an annular shape on the outer edge of the first case 4. The second seat portion 9 is provided in an annular shape on the outer edge of the second case 5. The second seat portion 9 is a portion that is pressed by the large-diameter head of the screw 7. The second seat portion 9 is provided by a through hole formed in the second case 5 or an edge of a notched groove. A seal member that seals between the first case 4 and the second case 5 may be disposed between the first seat portion 8 and the second seat portion 9. The seal member can be provided by an adhesive, a gasket, or the like. The fastening mechanism 6 includes a screw hole 10. The screw hole 10 receives the screw 7, and is screwed into the screw 7 when the screw 7 is screwed in. The screw hole 10 is disposed in the first case 4. The first case 4 has one or more screw holes 10.

[0025] In the manufacturing method of the electric device 1, a step of closing the case 3 is performed. In this step, the first case 4 and the second case 5 are first arranged in a predetermined positional relationship. Next, the screw 7 is placed in the through hole or the notch groove of the second case 5. Furthermore, the screw 7 is screwed into the screw hole 10. As a result, the screw 7 brings the first seat portion 8 and the second seat portion 9 close to each other and tightens them together. As a result, the first case 4 and the second case 5 are fixed together, and the case 3 is formed.

[0026] Alternatively, instead of the illustrated embodiment, the screw hole 10 may be provided in the second case 5, and the second seat portion 9 may be provided in the first case 4. The screw hole 10 may also be provided by a separate nut. In this case, the screw hole 10 is replaced by a through hole or a notched groove and a nut.

[0027] The first case 4 has a recess 11 formed therein. The recess 11 provides a volume for accommodating the component 2. The first case 4 is shallow and dish-shaped. The first case 4 has, at least on its inner surface, a multi-stepped cylindrical inner wall surface having a plurality of steps on the inner surface.

[0028] The first case 4 has an opening 12 for arranging an electrical connection member for the component 2. The opening 12 is formed in the bottom surface of the recess 11 as a through hole penetrating the first case 4. The opening 12 is used for arranging a connector, which will be described later. Alternatively, the opening 12 may be formed in the mating surface between the first case 4 and the second case 5. The opening 12 may also be formed in the second case 5.

[0029] The first case 4 has a fixing surface 13 to which the component 2 is fixed. The fixing surface 13 is located inside the first seat portion 8. The fixing surface 13 is located between the first seat portion 8 and the opening 12. In this embodiment, the fixing surface 13 is provided by one step of a multi-step cylinder on the inner surface of the first case 4. A screw hole 14 that provides a fastening mechanism 26 described below is formed in the fixing surface 13. The first case 4 has one or more screw holes 14.

[0030] In this embodiment, the component 2 is also called a circuit unit 20. The circuit unit 20 includes a plurality of electric elements 21, 22, 23, 24, and 25. The circuit unit 20 includes a circuit board 21 and a plurality of electric elements 22, 23, 24, and 25 mounted on the circuit board 21. The plurality of electric elements 22, 23, 24, and 25 are disposed on the outer surface of the circuit board 21. The plurality of electric elements 22, 23, 24, and 25 are disposed in a dispersed manner on both sides of the circuit board 21. The circuit board 21 and the plurality of electric elements 22, 23, 24, and 25 are electrically connected by solder.

[0031] The circuit board 21 is mainly made of an insulating material and has wiring as an electric circuit inside and on its surface. The main material is provided by resin, ceramic, or the like. The wiring is provided by a conductive film. The conductive film is provided by, for example, copper foil. The circuit board 21 is also called a printed circuit board. In the illustrated example, the circuit board 21 is quadrilateral. The circuit board 21 is plate-shaped.

[0032] The circuit board 21 has a first surface 21a and a second surface 21b. The first surface 21a and the second surface 21b are opposite surfaces. At least one of the first surface 21a and the second surface 21b provides a mounting surface for mounting electrical elements. In the illustrated embodiment, both the first surface 21a and the second surface 21b provide mounting surfaces for mounting electrical elements. The circuit board 21 is also called a double-sided board. The first surface 21a and the second surface 21b are convenient names, and may be called the front surface and the back surface, or the connector surface and the opposite surface, respectively.

[0033] The circuit board 21 includes a plurality of electrical elements 22, 25 on the first surface 21a. The circuit board 21 includes a plurality of electrical elements 23, 24 on the second surface 21b. The elements 22, 23 are active elements or passive elements. The element 24 is an electrical multi-electrode connector. The element 24 is positioned within the opening 12 when the circuit board 21 is positioned at a specified position. The element 24 is used to connect the electrical device 1 and the external device EX. The element 25 includes a plurality of electrodes for electrically connecting and mechanically fixing the element 24 to the circuit board 21. The element 25 is also called an electrode group.

[0034] The electric device 1 includes at least one fastening mechanism 26. The fastening mechanism 26 connects and fixes the component 2 and the case 3. Specifically, the fastening mechanism 26 connects and fixes the component 2 and the first case 4. The fastening mechanism 26 tightens the component 2 and the first case 4 together so as to accommodate the component 2 within a predetermined volume of the case 3. The electric device 1 includes one fastening mechanism 26 or multiple fastening mechanisms 26.

[0035] The fastening mechanism 26 can be provided by a variety of mechanisms, such as a threaded mechanism, a snap fit mechanism, a bayonet lock mechanism, an adhesive fastening mechanism, a weld fastening mechanism, etc. In this embodiment, the fastening mechanism 26 is provided by a threaded mechanism.

[0036] The fastening mechanism 26 includes a screw 27 as a first fastening member. The screw 27 has a large diameter head. The screw 27 may include at least one of a washer, a spring washer, etc., in the large diameter head. The fastening mechanism 26 fastens a part of the circuit board 21 to the fixing surface 13 of the first case 4 by the screw 27. The circuit board 21 has a portion that is pressed by the large diameter head of the screw 27. This portion is provided by a through hole 28 formed in the circuit board 21 or an edge of a notched groove.

[0037] The fastening mechanism 26 includes a screw hole 14. The screw hole 14 is disposed in the first case 4. The first case 4 provides a second fastening member that pairs with the screw 27. The second fastening member may be provided by a nut that is separate from the first case 4. The screw hole 14 receives the screw 27, and is screwed into the screw hole 14 to screw in the screw 27. The screw 27 is coupled to the first case 4 by screwing into the screw hole 14, and becomes a part of the first case 4. The first case 4 has one or more screw holes 14. A damper element 30, which will be described later, is disposed between the component 2 and the first case 4.

[0038] In the manufacturing method of the electric device 1, a step of connecting the component 2 and the case 3 is performed. In this step, the component 2 and the first case 4 are first arranged in a predetermined positional relationship. Next, the screw 27 is arranged in the through hole 28 or the notch groove of the circuit board 21. Furthermore, the screw 27 is screwed into the screw hole 14. As a result, the screw 27 brings the circuit board 21 and the first case 4 close to each other and fastens them together. As a result, the component 2 is fixed to the first case 4. In this step, the damper element 30 described later is arranged between the component 2 and the first case 4. The damper element 30 is sandwiched between the component 2 and the case 3 by the fastening mechanism 26 fastening the component 2 and the case 3. As a result, the damper element 30 is finally fixed between the component 2 and the case 3 in an immovable state. The damper element 30 is moved by the fastening mechanism 26 from a preliminary fixed state in which it is slightly movable to a final fixed state in which it is immovable at a final position.

[0039] As an alternative to the illustrated embodiment, the screw holes 14 may be provided in the circuit board 21 and the through holes 28 may be provided in the first case 4. The screw holes 14 may also be provided by separate nuts. In this case, the screw holes 14 are replaced by through holes or notched grooves and nuts.

[0040] The electric device 1 includes at least one damper element 30. The damper element 30 is disposed between the component 2 and the case 3. The damper element 30 is disposed so as to intervene in the shock propagation path between the component 2 and the case 3. The electric device 1 includes one damper element 30 or multiple damper elements 30. In the illustrated embodiment, the electric device 1 includes a number of damper elements 30 corresponding to the number of fastening mechanisms 26.

[0041] The damper element 30 suppresses the propagation of an impact between the component 2 and the case 3. The damper element 30 suppresses the propagation of an impact from the case 3 to the component 2. The damper element 30 suppresses the propagation of an impact from the component 2 to the case 3. In one example, the damper element 30 protects the circuit unit 20 from an external impact applied to the case 3. The damper element 30 protects at least one electrical element included in the circuit unit 20 from the impact. The damper element 30 can be understood as a component belonging to the component 2. Alternatively, the damper element 30 may be understood as a component belonging to the case 3. In this embodiment, the damper element 30 belongs to the component 2 and belongs to the circuit unit 20.

[0042] In the manufacturing method of the electric device 1, a step of arranging and fixing the damper element 30 between the component 2 and the case 3 is performed. In this step, the damper element 30 is preliminarily fixed to at least one of the component 2 and the case 3. In this embodiment, the damper element 30 is preliminarily fixed to the circuit board 21 as one of the elements belonging to the component 2. Alternatively, the damper element 30 may be preliminarily fixed to the first case 4. Alternatively, the damper element 30 may be preliminarily fixed to both the circuit board 21 and the first case 4. Here, the term preliminarily fixed means that the damper is positioned at a predetermined position prior to the subsequent main fixing in the completed state. The damper element 30 in the preliminarily fixed state can move within an allowable range. The preliminarily fixed state is also called a temporary fixation or an intermediate stage fixation.

[0043] In the manufacturing method of the electric device 1, after the damper element 30 is preliminarily fixed, the screw 27 is placed in the through hole 28 or the notch groove of the circuit board 21. Furthermore, the screw 27 is screwed into the screw hole 14. In this process, the damper element 30 described below is placed between the component 2 and the first case 4. The damper element 30 is fastened by the fastening mechanism 26. As a result, the screw 27 brings the circuit board 21, the damper element 30, and the first case 4 close to each other and fastens them together. As a result, the component 2 is fixed to the first case 4 via the damper element 30. When the fastening process of the fastening mechanism 26 is completed, the damper element 30 reaches a fully fixed state in the completed state.

[0044] In FIG. 2, the fastening mechanism 26 includes a screw 27. The screw 27 has a central axis AX. The screw 27 is screwed into the first case 4. A damper element 30 and a circuit board 21 are disposed between the screw 27 and the first case 4. The damper element 30 is disposed around the central axis AX. The damper element 30 and the circuit board 21 are held in a compressed state between an enlarged head 27a of the screw 27 and the first case 4. The damper element 30 and the circuit board 21 are fixed between the enlarged head 27a of the screw 27 and the first case 4 so as not to move.

[0045] The damper element 30 includes a first damper element 31 and a second damper element 32. The first damper element 31 is disposed between the enlarged head portion 27a and the circuit board 21. The second damper element 32 is disposed between the circuit board 21 and the first case 4. In this embodiment, the component 2 is the circuit board 21 that has electrical elements mounted thereon and is fixed within the case 3. The damper elements 30 are disposed on both sides of the circuit board 21.

[0046] Consider the propagation of an impact from the case 3 to the component 2 virtually. In this case, a first propagation path can be considered that travels from the first case 4 through the screw 27, through the enlarged head 27a, to the first surface 21a of the circuit board 21, and a second propagation path can be considered that travels from the first case 4 to the second surface 21b of the circuit board 21. The first damper element 31 is disposed on the first impact propagation path. The second damper element 32 is disposed on the second impact propagation path. In other words, each of the multiple damper elements 31, 32 is disposed on each of the multiple impact propagation paths. The damper element 30 may be disposed on at least one of the multiple impact propagation paths.

[0047] Each of the damper elements 31, 32 is provided by a block body 40. The block body 40 is cylindrical and surrounds the screw 27. In this embodiment, the block body 40 is an annular cylindrical body. The block body 40 in the embodiment is characterized by a through hole 40a. Alternatively, the block body 40 may be provided by a rectangular parallelepiped or an incomplete annular body such as a C-shape. In either configuration, the block body 40 is interposed in the propagation path of the shock. Thus, the damper element 30 reduces the propagation of the shock by disposing the block body 40 between the component 2 and the case 3.

[0048] The block body 40 is in contact with both the enlarged head portion 27a and the circuit board 21. The cylindrical block body 40 providing the damper element 32 is in contact with both the circuit board 21 and the first case 4. In the drawing, a radial gap is formed between the block body 40 and the screw 27. Alternatively, the block body 40 may be in contact with the screw 27 over a portion of the circumferential direction and / or a portion of the axial direction. Alternatively, the block body 40 may be in contact with the screw 27 over the entire circumferential direction and / or the entire axial direction.

[0049] 3, a material 41 forming the block body 40 is shown. The material 41 includes wire rods 42. The block body 40 is formed into a predetermined shape via the material 41 as an intermediate form. Thus, the block body 40 is formed into a predetermined shape by an assembly of wire rods 42.

[0050] The wire 42 and the material 41 are also called the base material of the block body 40. The wire 42 has flexibility. The wire 42 has a degree of flexibility that allows an operator to deform the wire 42 manually without using tools. The physical and mechanical properties of the wire 42 can also be called viscoelasticity. In this respect, the wire 42 is provided by a viscoelastic material. The wire 42 is elastically deformable. The wire 42 is a material that can be plastically and elastically deformed. The parameters that specify the properties of the wire 42 are selected so that the shock absorbing performance required for the damper element 30 is realized. The parameters include, for example, material, wire diameter, etc. The wire 42 may include a plurality of wires 42 having different properties.

[0051] The block body 40 is a molded body formed by compression molding the material 41 into a predetermined three-dimensional shape. Therefore, in the block body 40, the wires 42 do not only exist in the regular shapes shown in FIG. 3, but also include irregularly shaped portions. In other words, inside the block body 40, the wires 42 are arranged in a complex entangled manner. In the block body 40, the wires 42 are plastically deformed, and the shape of the block body 40 is maintained by the shape after the plastic deformation. Inside the block body 40, the wires 42 are elastically deformable. Inside the block body 40, the wires 42 are able to move slightly while rubbing against each other.

[0052] The block body 40 includes one continuous wire 42 or a plurality of wires 42. In this embodiment, the block body 40 is provided by one continuous wire 42. In this case, the block body 40 provides an advantage that it is difficult to generate small pieces of the wire 42. The material 41 can be understood as a net made of wires. The net may be formed by knitting, which repeats loops of the wire. The net may be formed by weaving, which includes wires corresponding to meridians and latitudes.

[0053] The wire material 42 is made of metal or resin. The wire material 42 may include metal wire material and / or resin wire material. The wire material 42 included in the block body 40 may include only metal wire material. The wire material 42 included in the block body 40 may include only resin wire material. The wire material 42 included in the block body 40 may include both metal wire material and resin wire material.

[0054] In this embodiment, the wire 42 is made of metal. The metal may be copper, stainless steel, iron, etc. The material 41 is a knitted metal wire mesh. The knitted metal wire mesh has few cut ends of the metal wires or only a pair of cut ends. The knitted metal wire mesh provides an advantage of being less likely to produce metal chips. The block body 40 is made of the knitted metal wire mesh.

[0055] When the wire 42 includes a resin wire, a material that can withstand the heat applied in the manufacturing method of the electric device 1 is selected. For example, a heat-resistant viscoelastic material that maintains the necessary material properties even in the solder reflow process described below is selected. For example, a heat-resistant resin such as Teflon (registered trademark) is selected.

[0056] 3 shows an example of a loop 51 described later. The loop 51 can also be called a wire piece 50 extending from the block body 40. The wire piece 50 can be manufactured by drawing a part of the wire 42 from the block body 40 after compression molding of the block body 40. Alternatively, the wire piece 50 may be drawn in the state of the material 41, and the block body 40 may be compression molded. Alternatively, the wire piece 50 may be drawn during the process of weaving the material 41.

[0057] Returning to FIG. 2, the damper element 30, i.e., each of the multiple damper elements 31 and 32, has at least one wire piece 50. The wire piece 50 is provided by the wire 42. The wire piece 50 extends from the block body 40. The wire piece 50 protrudes from the block body 40 to the outside of the block body 40. The wire piece 50 is flexible. The wire piece 50 has a degree of flexibility that allows an operator to manually deform it without using a tool.

[0058] When one damper element 30 includes multiple wire pieces 50, the multiple wire pieces 50 may be disposed at equal intervals with respect to the block body 40. For example, n wire pieces 50 may be disposed in a rotationally symmetrical positional relationship with respect to the cylindrical block body 40 at intervals of 360 / n degrees. The wire pieces 50 disposed at equal intervals enable the block body 40 to be stably fixed.

[0059] In this embodiment, the wire piece 50 is provided by a loop 51. The loop 51 may be a closed loop or an open loop. A closed loop does not include the cut end of the wire 42. An open loop includes the cut end of the wire 42. Alternatively, an open loop may be provided by a bent closed loop. In this case, the open loop may be provided without the cut end of the wire 42.

[0060] The wire piece 50 is provided by a loop 51 formed by at least one wire 42. The loop 51 in this embodiment includes one continuous wire 42. In the loop 51, the continuous wire 42 extends from the block body 40, passes through the loop 51, and then returns to the block body 40. The wire piece 50 may include two or more wires 42. The number of wires 42 in the wire piece 50 is the number that gives the wire piece 50 a softness that is clearly easier to deform than the block body 40. For example, the block body 40 provides a hardness that makes it difficult for an operator to deform it using only human force without tools. On the other hand, the wire piece 50 has such flexibility that an operator can deform it manually without tools. The number of wires 42 in the wire piece 50 is one or more and is a number of tens or less.

[0061] The loop 51 of the wire piece 50 has at least one bent portion in order to exert an elastic force necessary for preliminary fixing, which will be described later. In the example shown in the figure, the oval loop 51 has a curved bent portion at its end. The bent portion can elastically change its bending angle.

[0062] The wire piece 50 has flexibility due to the wire 42. The wire piece 50 can maintain its shape to an extent that it can realize the fall-off prevention function described later. The wire piece 50 has flexibility to an extent that the shape can be changed relatively easily when the shape is intentionally changed. As a guideline, the wire piece 50 has flexibility to an extent that an operator can deform the wire piece 50 manually without using tools. For example, the flexibility of the wire piece 50 allows the block body 40 to move slightly even after the block body 40 is preliminarily fixed by the preliminarily fixing process described later. For example, the flexibility of the wire piece 50 allows the block body 40 to move on the surface of the circuit board 21 so that the screw 27 can pass through both the through hole 41a and the through hole 28. In addition, when the block body 40 is completely fixed to the circuit board 21, the flexibility of the wire piece 50 allows the block body 40 and the circuit board 21 to maintain a predetermined positional relationship even if thermal expansion and contraction occur. The loop 51 also has flexibility as the wire piece 50.

[0063] The wire piece 50 is used to preliminarily fasten the block body 40 to a member with which the block body 40 is in contact. In the illustrated example, the wire piece 50 is used to preliminarily fasten the block body 40 to the circuit board 21 belonging to the component 2. Alternatively, the wire piece 50 may be used to preliminarily fasten the block body 40 to the first case 4 belonging to the case 3 or to the screw 27.

[0064] The block body 40 has one loop 51 or multiple loops 51. When multiple loops 51 are provided, they may have different shapes or similar shapes. In the illustrated embodiment, the block body 40 has multiple loops 51. The multiple loops 51 extend from two separate positions on the outer surface of the block body 40. In the illustration, two loops 51 extend from two diagonal positions of the block body 40 located on a diagonal line passing through the central axis AX. As a result, the multiple loops 51 are arranged at a distance from each other on the surface of the block body 40. This configuration provides the advantage that the block body 40 can be stably fixed.

[0065] The member with which the block body 40 is in contact has a fixing portion 60. The fixing portion 60 is connected to the wire piece 50 to preliminarily fix the block body 40. Here, the term "mechanical relationship" includes a frictional relationship due to contact between members, an engagement relationship with a visible engagement portion, an adhesive relationship using metal or resin, and the like. In the illustrated embodiment, the circuit board 21 has the fixing portion 60. The fixing portion 60 may be provided on the screw 27, which is one of the members with which the block body 40 is in contact, or on the first case 4. Thus, the component 2 and / or the case 3 has the fixing portion 60 that is connected to the wire piece 50 to at least preliminarily fix the block body 40.

[0066] The fixing portion 60 is provided by a hole 61 formed to open on the first surface 21a of the circuit board 21. The hole 61 can have various cross-sectional shapes such as a circular cross-section, a rectangular cross-section, a slit-like cross-section, etc. The hole 61 has a depth capable of receiving the wire piece 50. In the illustrated example, the hole 61 is provided by a through hole that penetrates the circuit board 21 from the first surface 21a to the second surface 21b and provides openings on both surfaces. Alternatively, the hole 61 may be provided by a blind hole that does not penetrate the circuit board 21.

[0067] The circuit board 21 has a plurality of holes 61 at positions corresponding to the positions of the plurality of loops 51. In this embodiment, the holes 61 are opened at two diagonal positions located on a diagonal line passing through the central axis AX.

[0068] The loop 51 is positioned inside the hole 61. The loop 51 is in partial contact with a part of the inner wall of the hole 61. Furthermore, the loop 51 is pressed against the inner wall of the hole 61 by its own elasticity. As a result, a frictional relationship is generated between the loop 51 and the hole 61, and the loop 51 is preliminarily fixed inside the hole 61. In other words, the block body 40 is preliminarily fixed onto the circuit board 21. The multiple loops 51 and the multiple holes 61 positioned diagonally contribute to stably fixing the block body 40.

[0069] Fig. 4 illustrates the positional relationship between the damper element 30 and the circuit board 21 at an intermediate stage of the manufacturing method of the electric device 1. Fig. 2 illustrates a cross section passing through the central axis AX at the line II-II in Fig. 4. In the following description, each of the multiple loops 51 and the multiple holes 61 may be identified by the identifiers a, b, c, and d.

[0070] The two loops 51a, 51b of the first damper element 31 extend from two positions on the diagonal axis DGX1 of the first damper element 31. The diagonal axis DGX1 approximately corresponds to one diameter line of the first damper element 31. In the illustrated state, the two loops 51a, 51b extend downward from the first damper element 31 toward the circuit board 21.

[0071] The two loops 51c, 51d of the second damper element 32 extend from two positions on the diagonal axis DGX2 of the second damper element 32. The diagonal axis DGX2 approximately corresponds to one diameter line of the second damper element 32. In the illustrated state, the two loops 51c, 51d extend upward from the second damper element 32 toward the circuit board 21.

[0072] The diagonal axes DGX1 and DGX2 are in a mutually intersecting relationship on the XY plane, i.e., with respect to the circuit board 21. Specifically, the diagonal axes DGX3 and DGX4 are in a mutually orthogonal relationship on the XY plane, i.e., with respect to the circuit board 21.

[0073] The circuit board 21 has two holes 61a, 61b for the two loops 51a, 51b of the first damper element 31. These holes 61a, 61b open at least to the first surface 21a. The holes 61a, 61b open at two positions on the diagonal axis DGX3 parallel to the diagonal axis DGX1 on the first surface 21a. The diagonal axis DGX3 corresponds to an arbitrary diameter of the through hole 28.

[0074] Furthermore, the circuit board 21 has two holes 61c, 61d for the two loops 51c, 51d of the second damper element 32. These holes 61c, 61d open at least to the second surface 21b. The holes 61c, 61d open to two positions on a diagonal axis DGX4 parallel to the diagonal axis DGX2 on the second surface 21b. The diagonal axis DGX4 corresponds to an arbitrary diameter of the through hole 28.

[0075] The diagonal axis DGX3 and the diagonal axis DGX4 are in a mutually intersecting relationship on the XY plane, i.e., with respect to the circuit board 21. Specifically, the diagonal axis DGX3 and the diagonal axis DGX4 are in a mutually orthogonal relationship on the XY plane, i.e., with respect to the circuit board 21.

[0076] The two holes 61a, 61b and the two holes 61c, 61d are disposed at positions corresponding to the multiple loops 51. As a result, the first damper element 31 is preliminarily fixed to the first surface 21a, which is one surface of the circuit board 21. The second damper element 32 is preliminarily fixed to the second surface 21b, which is the other surface of the circuit board 21. The first damper element 31 and the second damper element 32 are preliminarily fixed without interference between the multiple loops 51 and the multiple holes 61.

[0077] In FIG. 5, the block body 40 is cylindrical and has a through hole 40a. The block body 40 is arranged coaxially with the central axis AX. The block body 40 has one end face 40b and the other end face 40c in the axial direction. The end face 40c is a face positioned on the circuit board 21 side. The end face 40b is an opposite face positioned on the opposite side to the end face 40c. The block body 40 has an outer surface 40d as a cylindrical body. The outer surface 40d is the outer peripheral surface of the cylinder. The block body 40 has an inner surface 40e as a cylindrical body. The inner surface 40e is the inner peripheral surface of the cylinder.

[0078] The loop 51 that provides the wire piece 50 extends from near the boundary between the end face 40c and the outer face 40d. Alternatively, the loop 51 may be formed to extend from the end face 40c or the outer face 40d and extend from a corner on the boundary line. The wire piece 50 can extend from any position on the outer surface of the block body 40.

[0079] FIG. 5 illustrates the dimensions of the loop 51 before and after the damper element 30 is preliminarily fixed to the circuit board 21. The first damper element 31 is illustrated in the figure. The second damper element 32 and its loop 51 also have the same dimensions as the first damper element 31. The first damper element 31 and the second damper element 32 may have different dimensions depending on the required shock mitigation characteristics. For example, the first damper element 31 may be formed smaller than the second damper element 32. Also, the first damper element 31 may be formed larger than the second damper element 32.

[0080] Loop 51 extends axially along the axial direction AX from the block body 40. Before the preliminary fixing stage, loop 51 extends annularly along an arbitrary plane. The arbitrary plane can vary diversely according to the shape of loop 51. The arbitrary plane can be, for example, the Z-X plane. The arbitrary plane can also be the Z-Y plane. The arbitrary plane may be a slightly twisted curved surface. The arbitrary plane can also be the X-Y plane. In this case, loop 51 may extend in a spiral shape with respect to the axis of hole 61.

[0081] Loop 51 has a maximum width W51 on an arbitrary plane. Further, loop 51 has a length L51 in the Z-axis direction, that is, the direction of the central axis AX. The width W51 and the length L51 are variable dimensions that vary with the deformation of loop 51. Loop 51 has a standard shape characterized by the width W51 and the length L51 before preliminary fixing. The width W51 and the length L51 can also be called the standard dimensions before deformation.

[0082] The hole 61 in the circuit board 21 is a round hole. The hole 61 has a diameter D61. The diameter D61 is the maximum width of the hole 61. When the hole 61 is provided by a square hole, the diameter D61 is replaced by the maximum width of the square hole in the X-Y plane. The hole 61 has a depth L61 in the central axis AX direction. The width W51 is larger than the diameter D61 (W51 > D61). The length L51 is smaller than the depth L61 (L51 < L61). Alternatively, the length L51 may be greater than or equal to the depth L61 (L51 ≧ L61). In this case, the block body 40 and the first case 4 may be electrically connected through the wire piece 50.

[0083] Loop 51 is inserted into the hole 61 in the manufacturing method of the electric device 1. In the process of inserting loop 51 into the hole 61, the width is deformed in a shrinking manner from W51 to D61. The maximum width of loop 51 in the hole 61 is D61. In the process of inserting loop 51 into the hole 61, the length is deformed in a slightly stretching manner from L61.

[0084] The loop 51 undergoes at least elastic deformation in the process of reducing its width from W51 to D61. The reduction deformation of the loop 51 may be caused by plastic deformation of a part of the reduced width (W51-D61). The loop 51 has an elastic deformation amount equivalent to at least a part of the reduced width (W51-D61) even in the hole 61. As a result, the outer surface of the wire of the loop 51 contacts the inner wall surface of the hole 61. Furthermore, the outer surface of the wire of the loop 51 is fixed to the inner wall surface of the hole 61 with friction due to the elasticity of the loop 51. This frictional force is enough to prevent the first damper element 31 from falling even when the first damper element 31 is positioned below the circuit board 21 in the gravity direction. As a result, the wire piece 50 and the fixing part 60 provide a preliminary fixing mechanism for preliminary fixing the damper element 30.

[0085] Manufacturing method The manufacturing method of the electric device 1 includes a preparation step of preparing a plurality of elements. The preparation step includes a step of preparing a plurality of electric elements 21, 22, 23, 24, and 25 that constitute the component 2. The preparation step includes a step of preparing a plurality of elements that constitute the case 3. In this step, a first case 4, a second case 5, a plurality of screws 7, and a plurality of screws 27 are prepared. The preparation step includes a damper preparation step of preparing a damper element 30. The damper preparation step is also called a damper formation step. The plurality of steps included in the preparation step are performed according to any order.

[0086] In the damper forming process, the damper element 30 is formed. In this process, a forming die is used to compress the material 41 to form the shape of the damper element 30. For example, a cylindrical damper element 30 is formed from a cylindrically woven material 41. Thus, a process of forming a block body 40 by assembling flexible wires 42 into a predetermined shape is carried out.

[0087] The damper forming process includes a wire piece forming process in which the wire piece 50 is formed so that the wire piece 50 extends from the damper element 30. In the wire piece forming process, the blank 41 is deformed so that a loop 51 extends from the damper element 30. For example, the wire piece forming process is performed by drawing out the loop 51 from the block body 40. The wire piece forming process includes a shaping process in which the shape of the wire piece 50 is shaped into a predetermined shape, for example, the shape of the loop 51. For example, the loop 51 is shaped into an ellipse that may be called an oval, a spindle, or a teardrop shape. Therefore, during or after the process of shaping the block body 40, a process of forming the flexible wire piece 50 so that the wire piece 50 extends from the block body 40 is performed.

[0088] The manufacturing method of the electric device 1 includes a component assembly process of assembling the components 2 after the preparation process. This component assembly process includes a process of fixing and electrically connecting a plurality of electrical elements 22, 25 to the first surface 21a of the circuit board 21. This process is also called a first element process. The first element process includes a soldering process. The soldering process is performed, for example, by a solder reflow process. The solder reflow process is performed while holding the first surface 21a facing upward in the direction of gravity. The solder reflow process includes a printing process of printing a solder layer on the first surface 21a, an arrangement process of arranging electrical elements on the first surface 21a, and a reflow process of melting the solder layer to solder the elements and hardening the solder. The molten solder adheres to the electrodes and hardens to provide electrical and / or mechanical connection.

[0089] Furthermore, the component assembly process includes a process of fixing and electrically connecting a plurality of electrical elements 23, 24 to the second surface 21b of the circuit board 21. This process is also called a second element process. The second element process includes a soldering process. For example, the soldering process is performed by a solder reflow process. The solder reflow process is performed while holding the second surface 21b facing upward in the direction of gravity. The solder reflow process includes a printing process of printing a solder layer on the second surface 21b, an arrangement process of arranging electrical elements on the second surface 21b, and a reflow process of melting the solder layer to solder the elements and hardening the solder. The molten solder adheres to the electrodes and hardens to provide electrical and / or mechanical connection. The first element process and the second element process are performed in this order or in the reverse order.

[0090] The component assembly process includes a preliminary fixing step of preliminarily fixing the damper element 30 to the circuit board 21. The preliminary fixing step includes a first fixing step of preliminarily fixing the first damper element 31 to the circuit board 21. The preliminary fixing step includes a second fixing step of preliminarily fixing the second damper element 32 to the circuit board 21. The first fixing step and the second fixing step are separately performed before and after an inversion step of inverting the circuit board 21. The first fixing step and the second fixing step can be performed in this order or in the reverse order.

[0091] In the first fixing step, the first damper element 31 is disposed so as to contact the first surface 21a of the circuit board 21. The first damper element 31 is disposed at a specified position from above the circuit board 21 or from below the circuit board 21. The first fixing step includes an insertion step of forcibly inserting the loop 51 into the hole 61. The insertion step is also called a press-fit step because the loop 51 is press-fitted into the hole 61. In the insertion step, the loop 51 is gradually inserted into the hole 61. In the insertion step, the loop 51 is gradually deformed due to interference between the loop 51 and the hole 61. From this point of view, the insertion step can also be called a deformation step of deforming the loop 51. The loop 51 is deformed so that the width W51 is gradually reduced. At this time, the length of the loop 51 is slightly extended from the length L51. Even in a state in which the loop 51 is completely accommodated in the hole 61, the length L51 does not exceed the length L61.

[0092] In the first fixing step, the loop 51 is elastically fixed to the hole 61. At the same time, the first damper element 31 is fixed to the circuit board 21. This fixing has a fixing strength sufficient to prevent the first damper element 31 from falling off. The fixing force can be set assuming a force that will cause the first damper element 31 to fall off during the manufacturing method of the electric device 1. The first damper element 31 can be relatively easily removed from the circuit board 21 in the preliminary fixing stage. The first damper element 31 can be removed by pulling the loop 51 out of the hole 61 with a force that exceeds the fixing force to the hole 61 due to the elasticity of the loop 51.

[0093] The preliminary fixing step prevents the first damper element 31 or the second damper element 32 from falling off from the circuit board 21 throughout the duration of the manufacturing method. The preliminary fixing step is particularly effective when the manufacturing method includes an inversion step of inverting the circuit board 21. The preliminary fixing step prevents the first damper element 31 or the second damper element 32 from falling off from the circuit board 21 even if an inversion step is performed after the preliminary fixing step.

[0094] In one example, the preliminary fixing step suppresses the dropping off of the damper element 30 in the first element step and / or the second element step. For example, the above-mentioned first element step and second element step may include an inversion step of inverting the circuit board 21.

[0095] For example, assume that the first damper element 31 is placed at a specified position with the first surface 21a facing upward in the direction of gravity, and then the above-mentioned second element step is performed. In this case, in the second element step, the circuit board 21 is held with the first surface 21a facing downward in the direction of gravity. By performing the preliminary fixing step, the first damper element 31 is prevented from falling off the first surface 21a.

[0096] For example, assume that the second damper element 32 is placed at a specified position with the second surface 21b facing upward in the direction of gravity, and then the above-mentioned first element step is performed. In this case, in the first element step, the circuit board 21 is held with the second surface 21b facing downward in the direction of gravity. By performing the preliminary fixing step, the second damper element 32 is prevented from falling off the second surface 21b.

[0097] According to this embodiment, a preliminary fixing step is performed in the step of arranging the damper element 30 at a specified position. The preliminary fixing step at least preliminarily fixes the block body 40 by connecting the wire piece 50 to the fixing portion 60 provided on the part 2 including an electric element and to be protected from impact and / or the case 3 housing the part 2. The preliminary fixing step forms a connection relationship between the part 2 and / or the case 3 and the wire piece 50. This prevents the damper element 30 from falling off throughout the manufacturing method of the electric device 1. The preliminary fixing state is maintained until the tightening step described later. Specifically, the preliminary fixing state is maintained at least until the screw 27 penetrates the through hole 40a of the damper element 30.

[0098] The manufacturing method of the electric device 1 includes, after the component assembly step, a case assembly step of housing the component 2 in the case 3. The case assembly step includes an internal step of fixing the component 2 to the first case 4. Furthermore, the case assembly step includes an external step of attaching the second case 5 to the first case 4.

[0099] The internal process includes an arrangement process in which the component 2 is positioned at a specified position in the first case 4. The internal process includes a tightening process in which the screws 27 are screwed into the first case 4 after the arrangement process. The tightening process gradually compresses the damper elements 30 by tightening the screws 27. The tightening process ends the tightening by the screws 27 in a state in which the damper elements 30 maintain their shock absorbing force. The damper elements 30 are tightened by the fastening mechanism 26. The damper elements 30 are fixed in a final position, not a preliminary position, by the fastening mechanism 26. After the tightening process, the tightening force by the screws 27 is continuously maintained, and the component 2 is fixed to the case 3. Therefore, after the block body 40 is provisionally fixed, the component 2 is accommodated in the case 3 and a tightening process is performed in which the block body 40 is finally fixed.

[0100] The exterior process includes an arrangement process of positioning the second case 5 at a specified position of the first case 4. After the arrangement process, the exterior process includes a tightening process of screwing a plurality of screws 7 into the first case 4. In the tightening process, the first case 4 and the second case 5 are connected and fixed together by tightening the plurality of screws 7.

[0101] As a result of the manufacturing method of the electric device 1 according to this embodiment, the component 2 is fixed to the case 3 in a buffered state by the multiple damper elements 30. This protects the component 2 from impact. Furthermore, consideration of durability against impact in the component 2 is alleviated. For example, it becomes possible to arrange the solder and elements relatively freely in the component 2. For example, it becomes possible to arrange the solder and elements near the screw 27. As a result, it may be possible to realize high-density mounting of the solder and elements in the component 2. Moreover, one damper element 30 or all of the multiple damper elements 30 are preliminarily fixed in the manufacturing method of the electric device 1. This suppresses the detachment of the damper elements 30 throughout the manufacturing method of the electric device 1. As a result, the production of the electric device 1 is facilitated.

[0102] In this embodiment, the damper element 30 is preliminarily fixed by a wire piece 50 extending from the block body 40. The damper including the block body 40 can be at least preliminarily fixed by utilizing the flexible wire piece 50. Furthermore, the wire piece 50 suppresses stress generated in the member in contact with the wire piece 50.

[0103] According to the disclosed electric device 1, the block body 40 is preliminarily fixed to the component 2 and / or the case 3 by the wire pieces 50. Preliminarily fixing the block body 40 suppresses the block body 40 from falling off. Furthermore, the connection between the wire pieces 50 and the component 2 and / or the case 3 suppresses stress generated in the component 2 and / or the case 3.

[0104] According to the disclosed manufacturing method of the electric device 1, the block body 40 is preliminarily fixed to the component 2 and / or the case 3 by the wire pieces 50. As a result, after the block body 40 is preliminarily fixed, the block body 40 is prevented from falling off. Prevention of the block body 40 from falling off is provided in the manufacturing method until the block body 40 is finally fixed. Furthermore, the connection between the wire pieces 50 and the component 2 and / or the case 3 suppresses stress generated in the component 2 and / or the case 3. Since the wire pieces 50 are flexible, they can be slightly deformed even after the preliminary fixing step. As a result, fine adjustment of the block body 40 and the wire pieces 50 is permitted even after the preliminary fixing step.

[0105] Second embodiment This embodiment is a modification based on the preceding embodiment. In the preceding embodiment, the block body 40 includes a plurality of wire pieces 50. Instead, in this embodiment, the block body 40 includes a single wire piece 50.

[0106] 6 shows the circuit board 21 and the damper element 31 of this embodiment. The damper element 31 includes a single wire piece 50 extending from one point of the block body 40. The wire piece 50 is provided by a single loop 251. This embodiment can also achieve the same effects as the preceding embodiment. The use of the single wire piece 50 can also be applied to the other embodiments illustrated in this specification.

[0107] Third embodiment This embodiment is a modification of the preceding embodiment as a basic form. In the preceding embodiment, the block body 40 has wire pieces 50 at its corners. Instead of this, in this embodiment, the block body 40 has wire pieces 50 at its end faces.

[0108] FIG. 7 shows the circuit board 21 and the damper element 31 of this embodiment. The damper element 31 includes a wire piece 50 extending from a flat portion of the end face 40c of the block body 40 on the circuit board 21 side. The wire piece 50 is provided by a loop 351. The loop 351 extends from the block body 40 in the axial direction. The circuit board 21 includes a fixing portion 60. The fixing portion 60 is provided by a hole 361 provided at a position corresponding to the wire piece 50. The wire piece 50 is hidden by the block body 40. The fixing portion 60 is also hidden by the block body 40. This embodiment can also achieve the same effects as the preceding embodiment. Forming the wire piece 50 so that it extends from the flat surface of the block body 40 can also be applied to other embodiments exemplified in this specification.

[0109] Fourth embodiment This embodiment is a modification based on the preceding embodiment. In the preceding embodiment, the wire piece 50 is preliminarily fixed in the independent hole 61. Instead, in this embodiment, the wire piece 50 is preliminarily fixed in the through hole 28.

[0110] FIG. 8 shows the circuit board 21 and the damper element 31 of this embodiment. The damper element 31 includes a wire piece 50 extending from a corner between the end face 40c on the circuit board 21 side of the block body 40 and the inner face 40e. The wire piece 50 is arranged along the inner face of the through hole 28. Therefore, the wire piece 50 does not hinder the work process in which the screw 27 is arranged in the through hole 28. The wire piece 50 presses the wire piece 50 against the inner face of the through hole 28 by its own elasticity. As a result, the block body 40 is preliminarily fixed at a specified position above the through hole 28. In this case, the through hole 28 functions as the fixing portion 60. The through hole 28 may have a recess as the fixing portion 60. The wire piece 50 is provided by a loop 451.

[0111] In this embodiment, the same effect as in the preceding embodiment can be obtained. Forming the wire piece 50 so as to extend from the inner corner of the block body 40 can also be applied to the other embodiments illustrated in this specification. The configuration in which the wire piece 50 is elastically brought into contact with the inner surface of the through hole 28 and the damper element 31 is preliminarily fixed to the through hole 28 can also be applied to the other embodiments illustrated in this specification.

[0112] Fifth embodiment This embodiment is a modification based on the preceding embodiment, in which the wire piece 50 is provided by a loop 51. Instead of this, in this embodiment, the wire piece 50 is provided by a loop 552 having an end, i.e., an open loop.

[0113] 9 shows the circuit board 21 and the damper element 31 of this embodiment. The damper element 31 includes a wire piece 50 extending from the block body 40. The wire piece 50 is provided with a loop 552.

[0114] The loop 552 has a shape that can be called a J-shape, an inverted J-shape, a U-shape, a hook shape, or the like. The loop 552 has at least one bent portion in order to exert a predetermined elasticity. In this embodiment, the bent portion is provided at a portion near the tip. Instead of the illustrated example, the loop 552 may be arranged in a meandering or spiral shape with respect to the direction of the central axis of the hole 61.

[0115] In this embodiment, the same effects as those of the preceding embodiment can be obtained. Providing the wire piece 50 by the loop 552 is also applicable to the other embodiments illustrated in this specification.

[0116] Sixth embodiment This embodiment is a modification of the preceding embodiment, in which the wire piece 50 is preliminarily fixed by the elastic force of the loop 51 or the loop 552. Instead, in this embodiment, the wire piece 50 is arranged to engage with the edge of the circuit board 21.

[0117] FIG. 10 shows the circuit board 21 and the damper element 31 of this embodiment. The damper element 31 includes a wire piece 50 extending from a block body 40. The wire piece 50 has a shape that can be called a J-shape, an inverted J-shape, a U-shape, a hook shape, or the like. The loop 652 that provides the wire piece 50 is provided by an open loop. The wire piece 50 is not only pressed against the fixed part 60 by its own elasticity. In this embodiment, the wire piece 50 is disposed to mesh with the fixed part 60 and engages with the fixed part 60. In other words, the wire piece 50 is wound incompletely around the fixed part 60.

[0118] The wire piece 50 extends from an inner corner of the block body 40. The wire piece 50 enters the through hole 28 from the opening on the first surface 21a side. The wire piece 50 is arranged along the inner surface of the through hole 28. The wire piece 50 extends outward from the opening on the second surface 21b side of the through hole 28. The wire piece 50 is bent at the opening on the second surface 21b side. Furthermore, the wire piece 50 is arranged along the second surface 21b. The wire piece 50 uses the through hole 28 as a fixing portion 60. The wire piece 50 is arranged so as to be wound around the edge of the through hole 28. The wire piece 50 engages with the circuit board 21.

[0119] In this embodiment, the same effect as in the preceding embodiment can be obtained. Engaging the wire piece 50 with the fixing portion 60 can be additionally or alternatively applied to the other embodiments illustrated in this specification.

[0120] Seventh embodiment This embodiment is a modification based on the preceding embodiment, in which the wire piece 50 is provided by a loop 652. Instead, in this embodiment, the wire piece 50 is provided by a loop 751.

[0121] FIG. 11 shows the circuit board 21 and the damper element 31 of this embodiment. Instead of the loop 652 shown in FIG. 10, a loop 751 is provided. In this embodiment, the loop 751 is engaged with the fixed portion 60. In other words, the loop 751 is incompletely wound around the fixed portion 60. This embodiment can also provide the same effects as the preceding embodiment. Engaging the wire piece 50 with the fixed portion 60 can also be applied to the other embodiments illustrated in this specification.

[0122] Eighth embodiment This embodiment is a modification of the preceding embodiment as a basic form. In the preceding embodiment, the wire piece 50 uses the hole 61 or the through hole 28 provided in the circuit board 21 as the fixing portion 60. Instead, in this embodiment, the wire piece 50 uses the outer edge of the circuit board 21 as the fixing portion.

[0123] FIG. 12 shows the circuit board 21 and the damper element 31 of this embodiment. The wire piece 50 extends on the first surface 21a of the circuit board 21 toward the outer edge. The wire piece 50 is arranged so as to extend along the outer surface of the circuit board 21 in the thickness direction. The wire piece 50 is bent from the outer surface toward the second surface 21b. Furthermore, the wire piece 50 is arranged along the second surface 21b. The wire piece 50 is arranged so as to be wound around the outer edge of the circuit board 21. The wire piece 50 engages with the circuit board 21. In this embodiment, the outer edge of the circuit board 21 functions as the fixing portion 60. The wire piece 50 is provided by a loop 851 extending from the block body 40. The wire piece 50 may be provided by an open loop.

[0124] In this embodiment, the same effect as in the preceding embodiment can be obtained. Engaging the wire piece 50 with the outer edge of the circuit board 21 can be additionally or alternatively applied to the other embodiments illustrated in this specification.

[0125] Ninth embodiment This embodiment is a modification based on the preceding embodiment. In the preceding embodiment, the wire piece 50 and the circuit board 21 are connected by the elasticity of the wire piece 50 and / or the meshing of the wire piece 50 and the circuit board 21. Instead, in this embodiment, the wire piece 50 is connected to the circuit board 21 by using a joining member 964.

[0126] 13 shows the circuit board 21 and damper element 31 of this embodiment. The wire piece 50 is provided with a lead 953. The lead 953 is provided with a slightly curved but nearly straight wire 42. The lead 953 is disposed in the hole 961 without making strong contact with the hole 961.

[0127] The circuit board 21 has a conductive through hole 962. The through hole 962 is disposed under the outer edge of the block body 40. The through hole 962 is a through hole for electrically connecting a lead terminal extending from an electrical element by a conductive member. The through hole 962 is disposed across both the first surface 21a and the second surface 21b. The through hole 962 has a length equivalent to the thickness of the circuit board 21. The through hole 962 has a metal layer 963 made of a conductive metal. The metal layer 963 is cylindrical. The through hole 962 forms a hole 961 inside the metal layer 963. The lead 953 is disposed in the hole 961 without being in strong contact with the metal layer 963. The lead 953 may be in partial contact with the metal layer 963. The metal layer 963 is provided by a plating layer.

[0128] A bonding member 964 is disposed between the metal layer 963 and the lead 953. The bonding member 964 fills the hole 961 over its entire length. The bonding member 964 bonds the metal layer 963 and the lead 953 together.

[0129] The bonding member 964 is in a cured state. The bonding member 964 is applied in a molten state or in an uncured fluid state. The bonding member 964 is then cured by cooling or a curing process. The bonding member 964 is provided by, for example, solder. In this case, the bonding member 964 may be supplied in a solder reflow process. The bonding member 964 may be provided by a resin adhesive.

[0130] In this embodiment, the block body 40 is preliminarily fixed on the surface of the circuit board 21 by using the joining member 964. In other words, the component 2 and / or the case 3 and the damper element 30 are joined by the joining member 964. The wire piece 50 may be provided by a loop as disclosed in the preceding embodiment. In this embodiment, the same effect as in the preceding embodiment can be obtained. The joining member 964 can be additionally or alternatively applied to the other embodiments illustrated in this specification.

[0131] Tenth embodiment This embodiment is a modification of the previous embodiment. In the previous embodiment, the through-hole 962 is disposed on both the first surface 21a and the second surface 21b. Instead, in this embodiment, a through-hole A62 that is shorter than the thickness of the circuit board 21 is used.

[0132] FIG. 14 shows the circuit board 21 and the damper element 31 of this embodiment. The wire piece 50 is provided by the lead 953. The hole A61 is provided by the through hole A62 having the metal layer A63 in a part of the thickness of the circuit board 21. The through hole A62 is disposed under the outer edge of the block body 40. The hole A61 has a first portion A61a provided by the resin material of the circuit board 21 and a second portion A61b formed inside the metal layer A63. A bonding member 964 is disposed between the metal layer A63 and the lead 953. The amount of the bonding member 964 in the tenth embodiment is less than the amount of the bonding member 964 in the ninth embodiment.

[0133] The lead 953 is not connected to the circuit board 21 at the first portion A61a. The first portion A61a is located at a position close to the block body 40. The lead 953 is connected to the circuit board 21 at the second portion A61b. The second portion A61b is located at a position farther away from the block body 40 than the first portion A61a. As a result, the lead 953 has a non-connected portion that is not connected to the circuit board 21 and a portion that is connected to the circuit board 21. The non-connected portion is located at a position closer to the block body 40 than the connected portion. The non-connected portion allows deformation of the lead 953 due to the flexibility of the lead 953. As a result, the lead 953 enables flexible preliminary fixation of the block body 40 and the circuit board 21.

[0134] In this embodiment as well, the same effects as those of the preceding embodiment can be obtained.

[0135] Eleventh embodiment This embodiment is a modification of the preceding embodiment as a basic form. In the above embodiment, the through holes 962 and A62 are arranged below the outer edge of the block body 40. Instead, in this embodiment, a through hole B62 is used that is arranged directly below the block body 40 so as to be hidden by the block body 40.

[0136] FIG. 15 shows the circuit board 21 and damper element 31 of this embodiment. The wire piece 50 is provided by the lead B53. The lead B53 extends from the end face 40c of the block body 40 on the circuit board 21 side. The through hole B62 is disposed directly below the block body 40. The through hole B62 is disposed so as to be hidden by the block body 40. The hole B61 opens directly below the block body 40. The hole B61 opens so as to be hidden by the block body 40. The lead B53 is joined to the metal layer A63 by a joining member 964. In this embodiment as well, the same effects as those of the preceding embodiment can be obtained.

[0137] Twelfth embodiment This embodiment is a modification of the preceding embodiment as a basic form. In the preceding embodiment, the damper element 30 is preliminarily fixed by associating the wire piece 50 with the hole 61 or the like as the fixing portion 60. Instead, in this embodiment, the preliminarily fixing is provided by utilizing a flat surface on the circuit board 21 without using a hole.

[0138] 16 shows the circuit board 21 and the damper element 31 of this embodiment. The wire piece 50 is provided by a loop C51. The loop C51 extends from the block body 40. The loop C51 is formed so as to extend from the block body 40 radially outward beyond the block body 40. The loop C51 is disposed along the surface of the circuit board 21, i.e., the first surface 21a. The loop C51 is disposed along a land C65 (described later) serving as the fixing portion 60.

[0139] The circuit board 21 has lands C65 as fixing parts 60 on the surface. In the illustrated example, the lands C65 are disposed on the first surface 21a. The lands C65 are conductive films for applying a joining member such as solder. The lands C65 are provided by, for example, copper foil. The lands C65 are firmly joined to the first surface 21a.

[0140] A joining member 964 is provided on the land C65. A loop C51 is embedded in the joining member 964. The joining member 964 is provided by a conductive joining material such as solder. The loop C51 and the land C65 are joined by the joining member 964. In this embodiment, the component 2 and / or the case 3 are joined to the damper element 30 by the joining member 964. As a result, the block body 40 is preliminarily fixed on the surface of the circuit board 21. The loop C51 may be replaced with an open loop or a lead disclosed in the preceding embodiment. In this embodiment, the same effects as those in the preceding embodiment can be obtained.

[0141] Thirteenth embodiment This embodiment is a modification of the preceding embodiment as a basic form. In the preceding embodiment, solder is used as the joining member 964. Instead, in this embodiment, a resin member is used as the joining member.

[0142] 17 shows the circuit board 21 and the damper element 31 of this embodiment. The wire piece 50 is provided by a loop C51. The loop C51 is disposed along the first surface 21a of the circuit board 21.

[0143] A joining member D64 is provided on the first surface 21a of the circuit board 21 so as to be attached to the loop C51. The joining member D64 is a resin material. The joining member D64 is provided by an adhesive or the like. The loop C51 is embedded in the joining member D64. The loop C51 and the first surface 21a are joined by the joining member D64. As a result, the block body 40 is preliminarily fixed on the surface of the circuit board 21. The loop C51 is preliminarily fixed to the circuit board 21 without the land C65. The loop C51 may be replaced with an open loop or a lead disclosed in the preceding embodiment. In this embodiment, the component 2 and / or the case 3 and the damper element 30 are joined by the joining member 964. In this embodiment, the same effects as those in the preceding embodiment can be obtained.

[0144] Fourteenth embodiment This embodiment is a modification based on the preceding embodiment. The joining members 964 and D64 disclosed in the above embodiment may be additionally applied to the preceding embodiment. This embodiment is an example in which the joining member D64 is additionally applied to the first embodiment.

[0145] In FIG. 18, the block body 40 has a loop 51 as a wire piece 50. The loop 51 is disposed inside a hole 61 provided in the circuit board 21. Furthermore, a joining member D64 is disposed inside the hole 61. The loop 51 is embedded in the joining member D64. The joining member D64 is attached to the inner surface of the hole 61. The joining member D64 is a resin material. The joining member D64 is provided by an adhesive or the like. In this embodiment as well, the same effects as those of the preceding embodiment can be obtained.

[0146] Fifteenth embodiment This embodiment is a modification based on the preceding embodiment. In the preceding embodiment, the damper elements 30 are disposed on both sides of the circuit board 21. Instead, in this embodiment, the damper elements 30 are disposed only between the circuit board 21 and the first case 4.

[0147] 19, the damper element 30 includes a damper element F32 disposed only between the circuit board 21 and the first case 4. The damper element F30 is applicable when the impact propagated from the screw 27 to the opening board can be tolerated.

[0148] Sixteenth embodiment This embodiment is a modification of the preceding embodiment. In the preceding embodiment, one block body 40 has one property. Instead, in this embodiment, multiple block bodies 40 with different properties are used as the damper element 30.

[0149] In Fig. 20, the damper element 30 includes a first block body 40 similar to that of the first embodiment, and an additional second block body G40. The block body 40 and the block body G40 are arranged in a layered manner in the axial direction. In other words, the block body 40 and the block body G40 are arranged in order on the shock transmission path. The wire piece 50 extends from the block body 40.

[0150] The block body 40 has a first property. The block body G40 has a second property different from the block body 40. Here, the property may be a shock mitigation characteristic as a damper. For example, the frequency band of the shock in which the block body 40 shows high shock mitigation performance is different from the frequency band of the shock in which the block body 40G shows high shock mitigation performance. The block body 40 and the block body G40 may exhibit different properties by including different wire materials. For example, the block body 40 and the block body G40 may include wire materials of different materials, wire materials of different hardness, or wire materials of different wire diameters. The block body 40 and the block body G40 may have different densities of the wire materials 42. The difference in density may produce different properties such as hardness as a block body. These damper elements 30 may also be called hybrid dampers. The damper element 30 may obtain the desired shock mitigation characteristic by including both the block body 40 and the block body G40.

[0151] Alternatively or additionally, the property may be good adhesion to a joining member. The joining member is, for example, solder. For example, the block body 40 providing the wire piece 50 may be formed from a wire material that is relatively more compatible with molten solder than the wire material forming the block body G40. Alternatively or additionally, the property is selected according to the performance required for the damper, such as heat resistance and chemical resistance.

[0152] In one specific example, the block body 40 and the block body G40 may be formed from wires having different wire diameters. For example, a wire having a diameter of 0.2 mm and a wire having a diameter of 0.6 mm may be used as the different wires. In this case, the block body 40 and the block body G40 are expected to exhibit different shock mitigation properties. Furthermore, the wires contained in one block body may include wires having two or more different diameters.

[0153] In another specific example, the block body 40 and the block body G40 may be formed from wires made of different materials. For example, a stainless steel wire and a Teflon wire may be used as the different wires. In this case, the wire material included in one block body may include wires made of two or more different materials.

[0154] In this embodiment, it is possible to adjust the shock absorbing characteristics of the damper element 30. As a result, it is possible to provide a damper element 30 that meets a variety of requirements that vary depending on the application.

[0155] Seventeenth embodiment This embodiment is a modification based on the preceding embodiment. In the preceding embodiment, one block body 40 has one type of wire material 42. Instead, in this embodiment, one block body 40 has two or more different types of wire materials.

[0156] In FIG. 21, the material H41 as the base material forming the damper element 30 is formed into a predetermined shape as an assembly of wires 42. The wires 42 are a mixture of a first wire 42a and a second wire 42b having properties different from those of the first wire 42a. Here, the mixture refers to a state in which two or more different wires are not fused together in terms of material and still maintain the shape of a wire. In the mixture, the multiple wires may be entangled with each other, but still maintain the shape of a wire. As described above, the properties are shock mitigation properties, bondability with a bonding member, heat resistance, chemical resistance, etc. The properties may be understood by the material and diameter of the wires.

[0157] For example, the wire 42a is made of stainless steel, and the wire 42b is made of copper. The wires 42a and 42b are woven together to form a material H41. Such a material H41 may be called a hybrid material. In this embodiment, the wires 42 constituting the block 40 include a plurality of wires 42a and 42b having different properties. The material H41 can be used to form the block disclosed in this specification.

[0158] Eighteenth embodiment This embodiment is a modification based on the preceding embodiment. In the above embodiment, the damper element 30 is preliminarily fixed to the circuit board 21, which is one of the elements constituting the component 2. Alternatively, the damper element 30 can be preliminarily fixed to either the component 2 or the case 3. In this embodiment, the block body 40 providing the first damper element 31 is preliminarily fixed to the circuit board 21. The block body 40 providing the second damper element 32 is preliminarily fixed to the first case 4.

[0159] In Fig. 22, the first damper element 31 and the circuit board 21 are preliminarily fixed using a configuration similar to the preceding embodiment. The second damper element 32 is preliminarily fixed to the first case 4. The second damper element 32 includes a wire piece 50. The wire piece 50 is provided with a loop 51. The second damper element 32 is arranged such that the loop 51 extends toward the first case 4. In Fig. 22, a lowercase i is used to distinguish between letters and numbers.

[0160] The first case 4 has a hole i61 as a fixing portion 60. The hole i61 is formed at a position of the first case 4 corresponding to the position of the loop 51. The loop 51 is inserted into the hole i61. The loop 51 preliminarily fixes the first case 4 and the block body 40. As a result, after the second damper element 32 is preliminarily fixed to the first case 4, the second damper element 32 is prevented from falling off from the first case 4. For example, even if the first case 4 is inverted with respect to the direction of gravity after the second damper element 32 is preliminarily fixed to the first case 4, the second damper element 32 is held in a specified position.

[0161] As described in this embodiment, damper element 30 is preliminarily fixed to either part 2 or case 3 by wire piece 50. It should be understood that the disclosure of this specification includes both an embodiment in which damper element 30 is preliminarily fixed to part 2 and an embodiment in which damper element 30 is preliminarily fixed to case 3.

[0162] Nineteenth embodiment This embodiment is a modification based on the preceding embodiment. In the preceding embodiment, the damper element 30 is provided by a cylindrical block body 40. Alternatively, the damper element 30 may be provided by a solid block body.

[0163] 23, the block body 40 that provides the damper element 30 has a core J40f without a through hole in the center. In the illustrated example, the block body 40 is a cylindrical solid body. In this embodiment, the wire piece 50 also preliminarily fixes the block body 40 to the part 2 or the case 3.

[0164] In this embodiment, the part 2 is fixed to the case 3 by a fastening mechanism such as a screw that does not penetrate the damper element 30. In this embodiment, as in the preceding embodiment, the part 2 is preliminarily fixed to the damper element 30 by a wire piece 50 prior to final fixation. As a result, the same effects as in the preceding embodiment can be obtained.

[0165] Other embodiments The disclosure in this specification and drawings, etc. is not limited to the exemplified embodiments. The disclosure includes the exemplified embodiments and modifications based thereon by those skilled in the art. For example, the disclosure is not limited to the combination of parts and / or elements shown in the embodiments. The disclosure can be implemented by various combinations. The disclosure can have additional parts that can be added to the embodiments. The disclosure includes the omission of parts and / or elements of the embodiments. The disclosure includes the substitution or combination of parts and / or elements between one embodiment and another embodiment. The disclosed technical scope is not limited to the description of the embodiments. Some disclosed technical scopes are indicated by the description of the claims, and should be interpreted as including all modifications within the meaning and scope equivalent to the description of the claims.

[0166] The disclosure in the specification and drawings is not limited by the claims. The disclosure in the specification and drawings includes the technical ideas described in the claims, and extends to more diverse and broader technical ideas than the technical ideas described in the claims. Therefore, various technical ideas can be extracted from the disclosure in the specification and drawings without being bound by the claims.

[0167] In the above embodiment, an electric device is exemplified as an application example of the damper element 30. Here, the term "electric device" should be interpreted broadly without being limited to the illustrated control device example. For example, the damper element 30 can be applied to a component 2 that does not include a circuit board, in addition to a component 2 that includes a circuit board. For example, the damper element 30 may be applied between a group of electric devices and a chassis. Also, the damper element 30 may be applied between a component arranged on a single circuit board and the circuit board.

[0168] In the above embodiment, an electric device is exemplified as an application example of the damper element 30. Alternatively, the damper element 30 can be used for various applications other than electric devices. The damper element 30 can be widely applied to mechanical elements having moving parts, such as rotating machines such as pumps, compressors, and windmills, and reciprocating machines such as engines. The damper element 30 can also be widely applied to legs of chemical equipment, support arms that support chemical elements, and the like. The damper element 30 can be applied to a wide range of applications that will be understood by those skilled in the art upon reading the disclosure of this specification. [Explanation of symbols]

[0169] 1 Electrical equipment, 2 Parts, 3 Case, 4 Case 1, 5 Case 2, 20 circuit unit, 21 circuit board, 22 to 25 elements, 26 connecting mechanism, 27 screw, 28 through hole, 14 screw hole, 30, 31, 32, F32 damper element, 40, G40 block body, 41, H41 material, 42 wire, J40f core, 50 wire rod pieces, 51, 251, 351, 451, 751, 851, C51 Loop, 552, 652 Loop, 953, B53 Lead, 60 Fixed part, 61, 361, 961, A61, B61, i61 holes, 964, D64 joint members, C65 land.

Claims

1. A part (2) containing electrical elements and to be protected from shocks; A case (3) for housing the components; a block body (40) formed into a predetermined shape by an assembly of flexible wires (42); and a flexible wire piece (50) formed by the wires and extending from the block body, the block body being disposed between the component and the case to reduce the propagation of an impact, The component and / or the case is provided with a fixing portion (60) that is connected to the wire piece to at least preliminarily fix the block body.

2. The electrical device according to claim 1 , wherein the component and / or the case and the damper are joined by a joining member.

3. the component is a circuit board carrying the electrical elements and fixed within the case; 3. The electrical device according to claim 1, wherein the dampers are disposed on both sides of the circuit board.

4. The electrical device according to claim 1 , wherein the wire is elastically deformable.

5. The electric device according to claim 1 , wherein the wire material includes a metal wire material and / or a resin wire material.

6. The electric device according to claim 1 , wherein the wire includes a plurality of wires having different properties.

7. The electrical device according to claim 1 , wherein the wire is a single continuous piece.

8. The electrical device according to claim 1 , wherein the piece of wire is a loop of the wire.

9. A block body (40) is formed by assembling flexible wires (42) into a predetermined shape; forming a flexible wire piece extending from the block body during or after the step of forming the block body; The block body is at least preliminarily fixed by connecting the wire piece to a fixing portion (60) provided on a part (2) including an electrical element and to be protected from shock and / or a case (3) that houses the part; The method for manufacturing an electric device includes preliminarily fixing the block body and then finally fixing the block body.

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