Substrate processing apparatus and clamping mechanism

Abstract

To suppress generation of particles.SOLUTION: A substrate treatment apparatus includes: a treatment chamber for applying surface treatment to a substrate 11; a substrate holding part 13 including a clamp mechanism 30 and disposed in the treatment chamber; and a mask. The clamp mechanism 30 includes: a movable arm 70 exposed from a side face of the substrate holding part 13; and a clamp part 80 capable of supporting the substrate 11. The clamp part 80 includes: an arm support part 81 supported by the movable arm 70; a substrate contact part 84 capable of coming into contact with the substrate 11; and an extension arm 82 positioned between the arm support part 81 and the substrate contact part 84. A direction in which the extension arm 82 extends and a direction in which the movable arm 70 extends intersect each other.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a substrate processing apparatus and a clamping mechanism. [Background technology]

[0002] 2. Description of the Related Art In the fields of semiconductor devices and flat panel displays (FPDs), sputtering apparatuses and vapor deposition apparatuses are known as film formation apparatuses for forming various thin films on substrates (objects to be processed).

[0003] In a sputtering apparatus, a substrate is placed facing a target attached to a cathode in a chamber in which a reduced pressure atmosphere is maintained, and material molecules are ejected from the target to form a film on the substrate exposed through an opening in a mask.

[0004] Furthermore, for example, in the deposition apparatus disclosed in Patent Document 1, material molecules are evaporated from a deposition source in a chamber in which a reduced pressure atmosphere is maintained, and a film is formed on a substrate exposed through an opening in a mask. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2010-165571 A Summary of the Invention [Problem to be solved by the invention]

[0006] In the film forming apparatus, a plurality of clamping mechanisms are used to bring the substrate into close contact with a substrate holding part that holds the substrate. A plurality of openings are provided in the outer peripheral region of the substrate holding part. The clamping mechanisms are housed inside each of the plurality of openings.

[0007] Meanwhile, material molecules emitted from a target or a deposition source fly so as to pass through the gap between the mask and the substrate. Furthermore, the material molecules pass through a plurality of openings that house the clamping mechanism and enter the space between the plurality of components that make up the substrate holder. In this space, the material molecules directly adhere to the surfaces of the components, or adhere to the surfaces of the components after being reflected from the surfaces of the components. Such material molecules become deposits that accumulate on the surfaces of the components. This deposit is prone to peeling off from the surfaces of the components, and is problematic in that it becomes a source of particle generation.

[0008] Furthermore, in order to prevent the generation of particles in advance, maintenance is required in which the operation of the film formation apparatus is temporarily stopped, the atmosphere inside the film formation apparatus is made atmospheric, the substrate holder is disassembled, and used components with deposits attached thereto are replaced with unused components. However, the frequency of maintenance cannot be reduced, and the time and labor required for maintenance increase, resulting in a problem of reduced productivity due to the stoppage of the film formation apparatus.

[0009] The present invention has been made in consideration of the above circumstances, and achieves the following objects. 1. In a substrate processing apparatus, material molecules passing through the gap between a mask and a substrate are prevented from penetrating into the inside of a substrate holder. 2. Suppress particle generation. 3. Reduce the time and labor required for maintenance, and improve the productivity of the equipment. [Means for solving the problem]

[0010] A substrate processing apparatus according to one aspect of the present invention includes a processing chamber for performing a surface treatment on a substrate, a substrate placement part on which the substrate is placed, and a clamping mechanism capable of supporting the substrate placed on the substrate placement part, the processing chamber including a substrate holder and a mask including a frame part having a mask opening having a shape corresponding to a processing target region of the substrate. do.The clamp mechanism includes a movable arm exposed from a side surface of the substrate holder and a clamp portion capable of supporting the substrate. a fixed base supported by the substrate holding portion, a rotating shaft supported by the fixed base portion, a first movable portion, a second movable portion, and a movable base having a shaft support portion; Have The first movable part is capable of moving away from or approaching the fixed base part in a direction in which the movable arm extends. The second movable part is located on the opposite side of the rotation shaft to the first movable part in the direction in which the movable base part extends. The second movable part supports the movable arm. The shaft support part is provided between the first movable part and the second movable part and is supported by the rotation shaft. The clamp portion has an arm support portion supported by the movable arm, a substrate contact portion capable of contacting the substrate on the substrate mounting portion, and an extension arm positioned between the arm support portion and the substrate contact portion, and the direction in which the extension arm extends and the direction in which the movable arm extends intersect with each other.

[0011] In other words, the extension arm extends from the arm support portion to the substrate contact portion in a direction substantially parallel to the substrate placement portion. The movable arm extends in a direction substantially perpendicular to the substrate placement portion, for example, in a vertical direction. The movable arm faces a side surface of the substrate holding portion. The extension arm and the movable arm are connected to each other at the arm support, and the extension arm and the movable arm form a substantially L-shape. That is, the extension arm and the movable arm can be called an L-arm. The L-arm faces the corner between the top surface and the side surface of the substrate holder.

[0012] According to this configuration, it is not necessary to provide the movable arm inside the substrate holding part. That is, it is not necessary to provide an opening for accommodating the movable arm in the substrate holding part as in the conventional method. Therefore, the material molecules flying in the substrate processing apparatus fly so as to pass through the gap between the mask and the substrate, but the material molecules are prevented from penetrating inside the substrate holding part. Therefore, it is possible to prevent the material molecules from penetrating into the space between the multiple components constituting the substrate holding part. Specifically, it is possible to prevent the material molecules from directly adhering to the surfaces of the components. In addition, it is possible to prevent the material molecules from adhering to the surfaces of the components after the material molecules are reflected by the surfaces of the components. This makes it possible to prevent the deposition of the material molecules on the surfaces of the components. Therefore, it is possible to prevent the generation of particles caused by the deposition of the material molecules on the surfaces of the components.

[0013] Furthermore, since deposition of material molecules on the surfaces of the components constituting the substrate holding unit can be suppressed, the components constituting the substrate holding unit can be used for a long period of time while maintaining a state in which particle generation is suppressed. Therefore, the frequency of maintenance such as replacing used components with unused components can be reduced. As a result, the time and labor required for maintenance can be reduced, the film forming apparatus can be used continuously for a longer period of time, and the productivity of the substrate processing apparatus can be improved.

[0015] According to this configuration, the movable arm can be rotated around the rotation axis with the movable arm exposed from the side surface of the substrate holding part. As the movable arm rotates, the substrate contact part can support the substrate or release the substrate from its supported state.

[0016] In one embodiment of the present invention, the clamping mechanism has a protrusion provided between the fixed base portion and the first movable portion, the fixed base portion has a first fixed base surface facing the first movable portion and a second fixed base surface facing the second movable portion, the first movable portion has a first magnet, the first fixed base surface has a second magnet facing the first magnet, the second movable portion has a third magnet, and the second fixed base surface has a fourth magnet facing the third magnet, the first magnet and the second magnet each have a magnetic property that attracts each other, and the third magnet and the fourth magnet each have a magnetic property that repels each other, and when the fixed base portion and the first movable portion are in contact at the protrusion, the first magnet and the second magnet may be separated from each other.

[0017] According to this configuration, the state of the clamp mechanism in the substrate clamping state or the clamping release state can be stabilized by utilizing the attractive force of the magnets attracting each other and the repulsive force of the magnets repelling each other. Furthermore, the protrusion can prevent contact between the two magnets acting on the attractive force. In other words, no spring is used in such a clamp mechanism. Generally, in a mechanism using a spring, friction occurs between the spring and the seating surface that holds the spring, and particles are generated from the friction part. In contrast, in a mechanism that uses the attractive and repulsive forces of magnets instead of the restoring force of the spring, the generation of particles can be suppressed. Furthermore, since the protrusion maintains a non-contact state between the first magnet and the second magnet on which an attractive force acts, the first magnet and the second magnet can be easily separated from each other.

[0018] In the substrate processing apparatus according to one aspect of the present invention, the clamp portion is located between the arm support portion and the substrate contact portion and has a flange provided on the extension arm, and the substrate placement portion has an outer periphery placement portion that supports an outer periphery region of the substrate, and a flange that protrudes from the outer periphery placement portion in a thickness direction of the substrate. Multiple The protrusion and the substrate are arranged in a direction parallel to the side of the substrate. Multiple Convex Between two adjacent convex parts of a cutout portion provided in the extension arm, a portion of the extension arm being inserted into the cutout portion, and the flange may cover the cutout portion in a direction from the arm support portion toward the board contact portion.

[0019] According to this configuration, when the substrate is supported by the clamping portion, the notch of the substrate holding portion is covered by the flange. Therefore, flying material molecules in the substrate processing apparatus are prevented from passing through the notch of the substrate holding portion. The scattering of material molecules that have passed through the notch can be prevented. Therefore, the generation of particles can be prevented.

[0020] In a substrate processing apparatus according to one aspect of the present invention, the processing chamber includes a first chamber for performing a surface treatment on the substrate, and a second chamber adjacent to the first chamber, the second chamber including a transport port through which the substrate passes, and a rotary support mechanism having a rotary support shaft for supporting and rotating the substrate holding part, and for rotating and moving the substrate holding part between a horizontal position and an upright position, the mask being located at the boundary between the first chamber and the second chamber and arranged to stand upright so as to be approximately parallel to the direction of gravity, and in the horizontal position of the substrate holding part, the substrate holding part supports the substrate in a horizontal direction so as to enable transport through the transport port, and in the upright position of the substrate holding part, the substrate holding part is arranged close to the mask so as to expose the region of the substrate to be treated to the mask opening of the upright mask, and surface treatment may be performed on the region of the substrate to be treated through the mask opening.

[0021] According to this configuration, a vertical substrate processing apparatus can be realized that includes a substrate holding section having the above-mentioned clamping mechanism.

[0022] In a substrate processing apparatus according to one aspect of the present invention, the extension arm of the clamping portion has a recess that is recessed in a direction in which the movable arm extends, the substrate placement portion has an outer periphery placement portion that supports an outer periphery region of the substrate and a protrusion that protrudes from the outer periphery placement portion in a thickness direction of the substrate, and the frame portion has a frame surface that faces the clamping portion and a first mask protrusion portion that protrudes from the frame surface. and a second mask protrusion portion. The first mask protrusion portion can be inserted into the recess with a gap therebetween. The second mask protrusion portion is arranged so as to be adjacent to the convex portion with a gap therebetween in a direction parallel to the substrate and to be opposed to the outer periphery mounting portion with a gap therebetween. The first mask protrusion is provided at a different position from the first mask protrusion. 。When the substrate holding portion is moved to the upright position by the rotating support mechanism, the first mask protrusion portion is inserted into the recess with a gap therebetween, and a first curved space that bends in a direction parallel to the substrate is formed in the space formed between the recess and the first mask protrusion portion, the protrusion portion faces the frame surface with a gap therebetween, and the second mask protrusion portion faces the outer periphery mounting portion with a gap therebetween and is located next to the protrusion portion with a gap therebetween in the direction parallel to the substrate, and a second curved space that bends in a direction parallel to the substrate is formed in the space formed between the protrusion portion and the second mask protrusion portion.

[0023] In other words, each of the first curved space and the second curved space has a labyrinth structure. According to this configuration, when the substrate holder is in the upright position, the passage of the material molecules through the first curved space causes collision, reflection, and adhesion of the material molecules to the extension arm, the recess, the frame surface, and the first mask protrusion. Similarly, the passage of the material molecules through the second curved space causes collision, reflection, and adhesion of the material molecules to the outer peripheral placement portion, the protrusion, the frame surface, and the second mask protrusion of the substrate holder. Therefore, when the flying material molecules flow from the first chamber to the second chamber, the material molecules can be attached to the first curved space and the second curved space having a labyrinth structure, and the intrusion of the material molecules into the second chamber can be suppressed. That is, the first curved space and the second curved space can provide a trapping effect for trapping the material molecules.

[0024] Therefore, since the first and second bending spaces have a trapping effect on the material molecules, when performing maintenance on the processing chamber, it is possible to replace only the parts that have trapped the material molecules. Specifically, maintenance can be completed by simply replacing only the parts to which the material molecules are attached, such as the mask, the clamp unit, and the parts that constitute the outer periphery mounting unit. In addition, the above-mentioned trapping effect can suppress adhesion of material molecules to parts that are difficult to replace among the components that make up the second chamber. Therefore, in maintenance work, it is only necessary to replace the parts to which the material molecules are attached, excluding the parts that are difficult to replace, improving maintainability.

[0025] In the substrate processing apparatus according to the aspect of the present invention, the first chamber may have a deposition source, and a deposition process may be performed in the first chamber.

[0026] According to the above configuration, when a film is formed on a substrate by vapor deposition, it is possible to suppress the intrusion of material molecules into the inside of the substrate holder. It is possible to suppress the generation of particles caused by the deposition of material molecules. It is possible to reduce the time and labor required for maintenance, it is possible to use the film forming apparatus continuously for a longer period of time, and it is possible to improve the productivity of the substrate processing apparatus.

[0027] In the substrate processing apparatus according to one aspect of the present invention, the first chamber may have a cathode, and a sputtering process may be performed in the first chamber.

[0028] According to the above configuration, when a film is formed on a substrate by sputtering, it is possible to suppress the intrusion of material molecules into the inside of the substrate holding part. It is possible to suppress the generation of particles caused by the deposition of material molecules. It is possible to reduce the time and labor required for maintenance, it is possible to use the film forming apparatus continuously for a longer period of time, and it is possible to improve the productivity of the substrate processing apparatus.

[0029] A clamp mechanism according to one aspect of the present invention is a clamp mechanism for supporting a substrate in a substrate holding part constituting a substrate processing apparatus, the clamp mechanism including: a fixed base part supported by the substrate holding part; a rotating shaft supported by the fixed base part; a movable base portion having a first movable portion, a second movable portion, and a pivot portion;a clamp section capable of supporting the substrate, the clamp section having a movable arm supported by the second movable section, an arm support section supported by the movable arm, a substrate contact section capable of contacting the substrate, and an extension arm located between the arm support section and the substrate contact section; a protrusion provided between the fixed base portion and the first movable portion; Equipped with The first movable part is movable toward or away from the fixed base part. The second movable part is located on the opposite side of the rotation shaft to the first movable part in the extending direction of the movable base part. The shaft support part is provided between the first movable part and the second movable part and is supported by the rotation shaft. The extending direction of the extension arm and the extending direction of the movable arm intersect with each other. The fixed base portion has a first fixed base surface facing the first movable portion and a second fixed base surface facing the second movable portion. The first movable portion has a first magnet. The first fixed base surface has a second magnet facing the first magnet. The second movable portion has a third magnet. The second fixed base surface has a fourth magnet facing the third magnet. The first magnet and the second magnet each have magnetic properties that attract each other. The third magnet and the fourth magnet each have magnetic properties that repel each other. In a state in which the fixed base portion and the first movable portion are in contact with each other at the protruding portion, the first magnet and the second magnet may be spaced apart from each other.

[0030] According to this configuration, it is possible to obtain the same effects as those of the above-mentioned substrate processing apparatus.

[0032] According to this configuration, it is possible to obtain the same effects as those of the above-mentioned substrate processing apparatus.

[0033] In the clamp mechanism according to one aspect of the present invention, the clamp portion may have a flange located between the arm support portion and the board contact portion and provided on the extension arm.

[0034] According to this configuration, it is possible to obtain the same effects as those of the above-mentioned substrate processing apparatus. Effect of the Invention

[0035] According to the substrate processing apparatus and the clamping mechanism of the present invention, it is possible to prevent material molecules passing through the gap between the mask and the substrate in the substrate processing apparatus from entering the inside of the substrate holder. It is possible to prevent generation of particles. It is possible to reduce the time and labor required for maintenance, and to improve the productivity of the apparatus. [Brief description of the drawings]

[0036] [Figure 1] 1 is a schematic plan view showing a substrate processing apparatus according to an embodiment of the present invention; [Diagram 2] 1 is a perspective view showing a part of a film formation chamber in a substrate processing apparatus according to an embodiment of the present invention, the view showing a platen chamber, a substrate holding unit, a rotation support mechanism, and a mask. [Diagram 3] 3 is a diagram showing a part of a substrate holding unit according to an embodiment of the present invention, and is an enlarged perspective view showing a portion indicated by reference symbol G in FIG. 2. FIG. [Figure 4] 5A to 5C are side views showing a clamp mechanism according to an embodiment of the present invention, illustrating the operation of the clamp mechanism. [Diagram 5] 5 is a schematic side view showing a process performed in a film formation chamber in the substrate processing apparatus according to the embodiment of the present invention. FIG. [Figure 6] 5 is a schematic side view showing a process performed in a film formation chamber in the substrate processing apparatus according to the embodiment of the present invention. FIG. [Figure 7] 5 is a schematic side view showing a process performed in a film formation chamber in the substrate processing apparatus according to the embodiment of the present invention. FIG. [Figure 8] 5 is a schematic side view showing a process performed in a film formation chamber in the substrate processing apparatus according to the embodiment of the present invention. FIG. [Figure 9] FIG. 2 is a schematic cross-sectional view showing a process performed in a film formation chamber in the substrate processing apparatus according to the embodiment of the present invention, illustrating a mask, a clamping mechanism, and a main part of a substrate holding unit. [Figure 10] FIG. 2 is a schematic cross-sectional view showing a process performed in a film formation chamber in the substrate processing apparatus according to the embodiment of the present invention, illustrating a mask and a main part of a substrate holding unit. [Figure 11A] 11A and 11B are diagrams illustrating a case in which a labyrinth structure is not obtained in the substrate processing apparatus according to the embodiment of the present invention. [Figure 11B] 13A and 13B are diagrams illustrating a labyrinth structure formed by a mask, a clamp unit, and a substrate holder in a substrate processing apparatus according to a modified example of an embodiment of the present invention. [Figure 11C] 13A and 13B are diagrams illustrating a labyrinth structure formed by a mask, a clamp unit, and a substrate holder in a substrate processing apparatus according to a modified example of an embodiment of the present invention. [Figure 11D] 13A and 13B are diagrams illustrating a labyrinth structure formed by a mask, a clamp unit, and a substrate holder in a substrate processing apparatus according to a modified example of an embodiment of the present invention. [Figure 11E]13A and 13B are diagrams illustrating a labyrinth structure formed by a mask, a clamp unit, and a substrate holder in a substrate processing apparatus according to a modified example of an embodiment of the present invention. [Figure 12A] 13A and 13B are diagrams illustrating a labyrinth structure formed by a mask, a clamp unit, and a substrate holder in a substrate processing apparatus according to a modified example of an embodiment of the present invention. [Figure 12B] 13A and 13B are diagrams illustrating a labyrinth structure formed by a mask, a clamp unit, and a substrate holder in a substrate processing apparatus according to a modified example of an embodiment of the present invention. [Figure 12C] 13A and 13B are diagrams illustrating a labyrinth structure formed by a mask, a clamp unit, and a substrate holder in a substrate processing apparatus according to a modified example of an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0037] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A substrate processing apparatus according to an embodiment of the present invention will now be described with reference to the drawings. It should be noted that the present embodiment is specifically described to allow a better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

[0038] In this embodiment, the positional relationship of each component is described by setting an XYZ orthogonal coordinate system. The direction of gravity, that is, the direction parallel to the vertical direction, is referred to as the Z direction. Of the Z directions, the direction that coincides with the direction of gravity is referred to as the downward direction (downward) or the -Z direction. The opposite direction to the direction of gravity is referred to as the upward direction (upward) or the +Z direction. In the following description, "planar view" means viewing an object in the direction of gravity or downward. The transport direction of the glass substrate is referred to as the X direction. Of the X directions, the direction in which the substrate is transported from the transport chamber to the film formation chamber is referred to as the +X direction. The direction in which the substrate is transported from the film formation chamber to the transport chamber is referred to as the -X direction. The direction in which the rotation support shaft extends is referred to as the Y direction. Of the Y directions, the direction from the rotation drive unit toward the film formation chamber is referred to as the +Y direction. The opposite direction to the +Y direction is referred to as the -Y direction. The X and Y directions are referred to as horizontal directions.

[0039] <Substrate processing equipment> FIG. 1 is a schematic plan view showing a substrate processing apparatus according to the present embodiment. In FIG. 1, reference numeral 1 denotes a substrate processing apparatus. The substrate processing apparatus 1 is applied to an interback type sputtering apparatus that performs heating, film formation, etching, and the like in a vacuum environment on a substrate made of glass or resin, and a deposition apparatus used in the manufacture of organic EL. The substrate processing apparatus 1 is used, for example, in the manufacturing process of FPD (Flat Panel Display). In this case, for example, TFT (Thin Film Transistor) can be formed on the substrate. In this embodiment, a case where the substrate processing apparatus 1 is a sputtering apparatus will be described. In other words, the surface treatment performed in the substrate processing apparatus 1 is a film formation process, that is, a sputtering process. In this embodiment, a case where a glass substrate is used as the substrate will be described.

[0040] The substrate processing apparatus 1 includes a film-forming chamber 4, 4A and a load-unloading chamber 2, 2A. The film-forming chamber 4, 4A and the load-unloading chamber 2, 2A are arranged to surround the periphery of the transfer chamber 3. The film-forming chamber 4, 4A and the load-unloading chamber 2, 2A are, for example, adjacent chambers. The transfer chamber 3 is a transfer chamber. The substrate processing apparatus 1 also includes a control device (not shown) that controls the substrate processing apparatus 1. The control device controls the operation in the film-forming chamber 4, 4A and the load-unloading chamber 2, 2A. As described later, the control device controls the rotation operation of the rotary support mechanism 10 in the film-forming chamber 4, 4A. The control device also controls the clamp drive mechanism 14 that drives the clamp mechanism 30.

[0041] <Loading and unloading room> For example, one of the load / unload chambers 2 functions as a load chamber for carrying in the glass substrate 11 from the outside to the inside of the substrate processing apparatus 1. The other load / unload chamber 2A functions as an unload chamber for carrying out the glass substrate 11 from the inside to the outside of the substrate processing apparatus 1. The same film formation process may be performed in the film formation chamber 4 and the film formation chamber 4A, or different film formation processes may be performed in each chamber. The glass substrate 11 is an example of a "substrate".

[0042] Gate valves are respectively arranged between the load / unload chamber 2 and the transfer chamber 3, between the load / unload chamber 2A and the transfer chamber 3, between the film formation chamber 4 and the transfer chamber 3, and between the film formation chamber 4A and the transfer chamber 3.

[0043] A positioning member is arranged in the load / unload chamber 2. A glass substrate 11 that is brought into the load / unload chamber 2 from the outside is placed on the positioning member. The positioning member sets the position of the glass substrate 11, enabling alignment of the glass substrate 11. A roughing exhaust unit that reduces the pressure (roughly evacuates) inside the load / unload chamber 2 is connected to the load / unload chamber 2. The roughing exhaust unit is, for example, a rotary pump.

[0044] <Delivery room> 1, the transfer chamber 3 includes a transfer device 3a disposed inside the transfer chamber 3. The transfer device 3a is, for example, a transfer robot. The transport device 3a has a rotating shaft, a drive source for rotating the rotating shaft, a robot arm attached to the rotating shaft, a robot hand formed on a part of the robot arm, and a vertical movement mechanism. The robot arm has a first moving rail and a second moving rail that cross each other, a first base that can move the second moving rail relative to the first moving rail, and a second base that can move the robot hand relative to the second moving rail. The transport device 3a can move the glass substrate 11, which is the object to be transported, between the film formation chambers 4, 4A and the load / unload chambers 2, 2A. The robot arm may be composed of a first active arm, a second active arm, a first driven arm, and a second driven arm that are mutually bendable.

[0045] <Film forming chamber> The film formation chambers 4 and 4A have the same configuration. Below, only the film formation chamber 4 will be described, and a description of the film formation chamber 4A will be omitted. The film formation chamber 4 is composed of a plasma chamber 4m and a platen chamber 4n. The plasma chamber 4m is an example of a "first chamber." The platen chamber 4n is an example of a "second chamber."

[0046] <Plasma chamber> In the plasma chamber 4m, a target 7 and a backing plate 6 which constitute a cathode unit 5 are disposed. The plasma chamber 4m includes a power source 4p, a gas atmosphere setting mechanism 4g, and the cathode unit 5. The power source 4p, the gas atmosphere setting mechanism 4g, and the cathode unit 5 are used to perform a film formation process on a glass substrate 11. In the plasma chamber 4m, a film formation process is performed on the glass substrate 11. In other words, the surface treatment performed in the plasma chamber 4m is a film formation process, that is, a sputtering process.

[0047] <Power supply, gas atmosphere setting mechanism> The power supply 4p is connected to a backing plate 6 of the cathode unit 5 described later. The power supply 4p applies a negative sputtering voltage to the backing plate 6. The gas atmosphere setting mechanism 4g is configured to set a gas atmosphere inside the plasma chamber 4m. The gas atmosphere setting mechanism 4g has a gas inlet that introduces a processing gas into the plasma chamber 4m, and a high vacuum exhaust unit that reduces the pressure (high vacuum) of the internal space of the plasma chamber 4m. The gas inlet is connected to a gas supply source. The gas inlet is, for example, a mass flow controller that adjusts the flow rate of the gas supplied from the gas supply source. The high vacuum exhaust unit is, for example, a turbo molecular pump.

[0048] <Cathode unit> The cathode unit 5 is provided upright inside the plasma chamber 4m. The cathode unit 5 has a target 7 and a backing plate 6 that holds the target 7. The cathode unit 5 is an example of a "cathode". The backing plate 6 functions as a cathode electrode. The backing plate 6 is erected at a position farthest from the transfer port 4a located between the transfer chamber 3 and the film formation chamber 4 inside the plasma chamber 4m. A target 7 is fixed to the front side of the backing plate 6 so as to face the glass substrate 11 in a substantially parallel manner when the glass substrate 11 is processed. The backing plate 6 is an electrode for applying a negative sputtering voltage to the target 7.

[0049] A magnetron magnetic circuit for forming a predetermined magnetic field on the target 7 is installed on the rear side of the backing plate 6. The magnetron magnetic circuit is attached to a rocking mechanism. The rocking mechanism has a drive device for rocking the magnetron magnetic circuit. The drive device of the rocking mechanism is configured to be able to rock the magnetron magnetic circuit.

[0050] <Modification of cathode unit> As a modified example of the cathode unit 5, multiple rotary cathodes may be applied to the plasma chamber 4m. The multiple rotary cathodes may be configured such that multiple cylindrical cathodes are arranged in parallel and a target is provided on the outer circumferential surface of each cathode. Each of the multiple rotary cathodes may be rotatable around a cylindrical axis. The plasma chamber 4m may include a rocking mechanism that rocks the magnetron magnetic circuit approximately parallel to the glass substrate 11 relative to the multiple rotary cathodes when the glass substrate 11 is processed.

[0051] <Platen chamber> Next, the platen chamber, the mask, the substrate holding unit, the supporting and rotating mechanism, and the clamping mechanism will be described with reference to FIGS. FIG. 2 is a perspective view showing a part of the film formation chamber 4 in the substrate processing apparatus 1 according to this embodiment, showing a platen chamber, a substrate holder, a rotation support mechanism, and a mask.

[0052] The platen chamber 4n has a film formation port 4b that opens toward the plasma chamber 4m. The platen chamber 4n is adjacent to the plasma chamber 4m via the film formation port 4b. In the film formation port 4b, a mask 20 is disposed at a boundary 4c between the plasma chamber 4m and the platen chamber 4n. The mask 20 is disposed so as to stand up and be approximately parallel to the Z direction. Here, "approximately parallel to the Z direction" means a direction that coincides with the direction of gravity or a direction that is inclined at an angle of several degrees with respect to the direction of gravity. In the pre-film formation process, the position of the mask 20 can be aligned by a mask alignment unit (not shown).

[0053] The platen chamber 4n has a transfer port 4a that opens toward the transfer chamber 3. The platen chamber 4n is adjacent to the transfer chamber 3 via the transfer port 4a. The transfer port 4a is an opening through which the glass substrate 11 passes when the glass substrate 11 is transferred. A gate valve is disposed in the transfer port 4a. By opening and closing the gate valve, the platen chamber 4n and the transfer chamber 3 are communicated with each other or the platen chamber 4n is isolated from the transfer chamber 3.

[0054] <Mask> The mask 20 has a substantially rectangular mask frame 20a and multiple ribs 20b stretched lengthwise and widthwise on the mask frame 20a. The mask frame 20a surrounds a mask opening 20c having a shape corresponding to a film formation target region 11T of the glass substrate 11. The multiple ribs 20b define the region of the mask opening 20c, i.e., the inner region of the mask frame 20a. The mask frame 20a is an example of a "frame portion." The film formation target region 11T is an example of a "processing target region."

[0055] The mask frame 20a has a frame front surface 20T facing the plasma chamber 4m and a frame back surface 20R opposite to the frame front surface 20T. The frame back surface 20R is an example of a "frame surface." The frame back surface 20R is a portion that faces a clamp unit 80 of the clamp mechanism 30, which will be described later, when the substrate holding unit 13 moves to the standing position P2 (see FIG. 8).

[0056] <Mask protrusion> 9 and 10, the frame rear surface 20R is provided with a first mask protrusion 20F and a second mask protrusion 20S. The first mask protrusion 20F protrudes from the frame rear surface 20R. The second mask protrusion 20S is provided at a position different from the first mask protrusion 20F and protrudes from the frame rear surface 20R.

[0057] The mask frame 20a is made of a rigid metal such as SUS. The ribs 20b are made of metal foil such as Invar. The ribs 20b are fixed to the mask frame 20a with both ends of the ribs 20b pulled by the mask frame 20a. An area surrounded by the multiple ribs 20b stretched lengthwise and widthwise inside the mask frame 20a corresponds to the film formation target area 11T.

[0058] <Substrate holding part> As shown in Fig. 2, a substrate holding unit 13 is disposed inside the platen chamber 4n. The substrate holding unit 13 is, for example, a platen. The substrate holding unit 13 includes a substrate placement unit 15 on which the glass substrate 11 is placed, and a clamp mechanism 30 capable of supporting the glass substrate 11 placed on the substrate placement unit 15. When the substrate holding unit 13 is in the horizontal position P1 (see Figs. 5 to 7), the shape of the substrate holding unit 13 is a substantially rectangular flat plate when viewed in the Z direction. The substrate holding unit 13 is capable of supporting the rear surface of the glass substrate 11 inside the platen chamber 4n.

[0059] 3 is a diagram showing a part of the substrate holding portion 13 according to this embodiment, and is an enlarged perspective view showing the portion G in FIG. 2. FIG. 3 shows a structure in which a clamp mechanism 30 is provided on the substrate holding portion 13. FIG. 3 also shows a case in which the substrate holding portion 13 is in a horizontal position P1. As shown in FIG. 3, the substrate holding portion 13 has an X side surface 16X extending in the X direction and a Y side surface 16Y extending in the Y direction. In the following description, the X side surface 16X and the Y side surface 16Y may be simply referred to as side surfaces 16.

[0060] 3, substrate holding part 13 has a substrate holding base part 17, a temperature adjustment part 18, and an outer peripheral plate 19, which are stacked in the Z direction. Temperature adjustment part 18 is provided on the upper surface of substrate holding base part 17 in the Z direction. The upper surface of temperature adjustment unit 18 in the Z direction is substrate mounting unit 15. Temperature adjustment unit 18 adjusts the temperature of glass substrate 11 mounted on substrate mounting unit 15. Temperature adjustment unit 18 is, for example, a heater that heats glass substrate 11. The configuration of temperature adjustment unit 18 is not limited to a heater, and may be a cooler that cools glass substrate 11. Substrate holding base unit 17 is a member that supports clamp mechanism 30.

[0061] The outer periphery plate 19 is fixed to the substrate holding base portion 17 by known fastening members B such as bolts. The outer periphery plate 19 is composed of an X-plate 19X extending in the X-direction and a Y-plate 19Y extending in the Y-direction. Each of the X-plate 19X and the Y-plate 19Y has a plate cutout portion 19C. The shape of the plate cutout portion 19C corresponds to the shape of the flange 83 of the clamp portion 80 that constitutes the clamp mechanism 30.

[0062] The outer peripheral portion 15P of the substrate placement portion 15 in the X and Y directions is provided with an outer peripheral placement portion 15M. The outer peripheral placement portion 15M has a plurality of support pins 15S, a plurality of extending protrusions 15T, and a plurality of notches 15C. The plurality of support pins 15S are members that support the rear surface of the glass substrate 11 opposite to the film formation target region 11T. The support pins 15S are provided so as to protrude from the outer peripheral placement portion 15M in the +Z direction. The plurality of extending protrusions 15T are provided on the outer edge 15E of the outer peripheral placement portion 15M and protrude in the Z direction from the upper surface of the outer peripheral placement portion 15M. Each of the plurality of extending protrusions 15T extends in the X and Y directions. The extending protrusions 15T are an example of a "protrusion". In each of the X and Y directions, a notch 15C is formed between two adjacent extending protrusions 15T. A part of an extension arm 82, which will be described later, is inserted into the cutout portion 15C.

[0063] In other words, the substrate mounting portion 15 has an outer peripheral mounting portion 15M that supports the outer peripheral region 11E of the glass substrate 11. The outer peripheral mounting portion 15M has an extending protrusion 15T that protrudes from the outer peripheral mounting portion 15M in the thickness direction of the glass substrate 11. Furthermore, the outer peripheral mounting portion 15M has a notch 15C provided next to the extending protrusion 15T in a direction parallel to the sides of the glass substrate 11 that extend in the X and Y directions. A part of the extending arm 82 is inserted into the notch 15C. The flange 83 covers the notch 15C in the direction from the arm support portion 81 toward the substrate contact portion 84.

[0064] That is, a portion of the extension arm 82 constituting the clamp mechanism 30 provided on the Y side surface 16Y is inserted into a notch 15C formed between two extending protrusions 15T extending in the Y direction. In this case, the flange 83 covers the notch 15C when viewed in the X direction. Similarly, a portion of the extension arm 82 constituting the clamp mechanism 30 provided on the X side surface 16X is inserted into a notch 15C formed between two extending protrusions 15T extending in the X direction. In this case, the flange 83 covers the notch 15C when viewed in the Y direction.

[0065] A plurality of clamp mechanisms 30 are provided on each of the X side 16X and the Y side 16Y of the substrate holding part 13. The pitch of the plurality of clamp mechanisms 30 provided on the X side 16X and the Y side 16Y, i.e., the distance between two adjacent clamp mechanisms 30, is, for example, 200 to 300 mm.

[0066] <Rotation support mechanism> As shown in FIG. 2, a rotation support mechanism 10 is disposed inside the platen chamber 4n. The rotary support mechanism 10 has a rotary support shaft 12 that supports and rotates a substrate holder 13. The rotary support shaft 12 is rotatable about the center of rotation of the rotary support shaft 12. The substrate holder 13 is attached to the rotary support shaft 12.

[0067] A rotation drive unit 12A is connected to the rotation support shaft 12. The rotation drive unit 12A is capable of rotating the rotation support shaft 12 around its axis. The rotation support shaft 12 penetrates a side wall that forms the platen chamber 4n. The rotation drive unit 12A is disposed outside the platen chamber 4n.

[0068] The rotary support mechanism 10 is configured to rotate and move the substrate holding portion 13 between a horizontal position P1 and an upright position P2 in a state in which the glass substrate 11 is supported by the substrate holding portion 13. In other words, the rotary support mechanism 10 can position the substrate holding portion 13 at the horizontal position P1 or at the upright position P2.

[0069] When the substrate holding unit 13 is placed in the horizontal position P1 by the rotary support mechanism 10, the substrate holding unit 13 supports the glass substrate 11 so that it faces in the horizontal direction so that the glass substrate 11 can be moved through the transfer opening 4a. This makes it possible to transfer the glass substrate 11 from the transfer chamber 3 to the film formation chamber 4 through the transfer opening 4a in the platen chamber 4n, or to transfer the glass substrate 11 from the film formation chamber 4 to the transfer chamber 3 through the transfer opening 4a. In the horizontal position, it is possible to maintain the support state of the glass substrate 11 by the clamp mechanism 30 of the substrate holding unit 13, and to release the support state.

[0070] When the substrate holding part 13 is disposed in the standing position P2 by the rotary support mechanism 10, the substrate holding part 13 is disposed close to the mask 20. As a result, the film formation target region 11T of the glass substrate 11 is exposed to the mask opening 20c of the standing mask 20. The glass substrate 11 is held (supported) so as to face the target 7, and a film formation process can be performed on the film formation target region 11T of the glass substrate 11 exposed in the mask opening 20c. At the standing position P2, the support state of the glass substrate 11 by the clamp mechanism 30 of the substrate holding part 13 is maintained. As a result, the glass substrate 11 in the standing state does not slip off the substrate holding part 13, and the position of the glass substrate 11 relative to the mask 20 does not shift.

[0071] <Clamp drive mechanism> As shown in FIG. 2, the platen chamber 4n is provided with a clamp drive mechanism 14. The clamp drive mechanism 14 includes a rod 14R, which will be described later, and a moving mechanism 14M that moves the rod 14R in the Z direction. The rod 14R and the moving mechanism 14M are disposed inside the platen chamber 4n. The moving mechanism 14M is located at the bottom of the platen chamber 4n, and faces, for example, the substrate holder 13 that is disposed in a horizontal position. The rod 14R is inserted into the substrate holder 13 through an opening provided on the surface of the substrate holder 13 opposite to the substrate placement portion 15. Inside the substrate holder 13, the rod 14R is capable of pressing a movable tip portion 64, which will be described later and which constitutes the clamp drive mechanism 14, and is configured to drive the clamp drive mechanism 14.

[0072] <Clamp mechanism> FIG. 4 is a side view showing the clamp mechanism 30 according to the present embodiment. In FIG. 4, the substrate holder 13 on which the clamp mechanism 30 is installed is shown by a dotted line.

[0073] In the following description, the clamp mechanism 30 provided on the Y side surface 16Y will be described with reference to Fig. 4. If the X direction is read as the Y direction and the Y direction is read as the X direction in Fig. 4, the clamp mechanism 30 will be provided on the X side surface 16X. Therefore, a description of the clamp mechanism 30 provided on the X side surface 16X will be omitted. The clamp mechanism 30 has a fixed base portion 40 , a rotating shaft 50 , a movable base portion 60 , a movable arm 70 , and a clamp portion 80 .

[0074] <Fixed base part> The fixed base portion 40 is a portion supported by the substrate holding portion 13. The fixed base portion 40 has an L-shape. For this reason, the fixed base portion 40 can be referred to as a bent portion. The fixed base portion 40 has a horizontal base 42 extending in the X direction and a vertical base 41 extending in the Z direction. The vertical base 41 is fixed to the side surface 16 of the substrate holding base portion 17 of the substrate holding portion 13 by a known fastening member B such as a bolt. The horizontal base 42 has a rotating shaft support portion 43. The rotating shaft support portion 43 supports a rotating shaft 50, which will be described later. The horizontal base 42 is inserted into a hole 17H ​​extending in the X direction provided in the substrate-holding base 17. Since the vertical base 41 is fixed to the side surface 16 of the substrate-holding base 17, the position of the horizontal base 42 inside the hole 17H ​​is fixed. Known metallic materials can be used as the material for forming the fixed base portion 40. For example, aluminum and stainless steel such as SUS304 can be used.

[0075] <Rotation axis> The rotating shaft 50 is supported by the horizontal base 42 of the fixed base unit 40. The rotating shaft 50 has an axis center parallel to the direction in which the multiple clamping mechanisms 30 are arranged. In the example shown in Fig. 4, the rotating shaft 50 has an axis center extending in the Y direction in which the multiple clamping mechanisms 30 installed on the Y side surface 16Y are arranged. Known metal materials can be used as materials for the parts of the rotating shaft 50 that require strength. For example, aluminum and stainless steel such as SUS304 can be used. The rotating shaft 50 has a sliding part that slides against the shaft support part 63 of the movable base part 60 and the rotating shaft support part 43 of the fixed base part 40. Resin materials can be used as materials for the sliding part. Materials that are excellent in outgassing properties, plasma resistance, durability, etc. are selected as the resin material, and Vespel (registered trademark) can be used, for example.

[0076] <Movable base part> The movable base unit 60 has a first movable part 61, a second movable part 62, and a pivot support part 63. The first movable part 61 can move away from or approach the horizontal base 42 of the fixed base unit 40 in the Z direction in which the movable arm 70 extends. The second movable part 62 is located on the opposite side of the pivot support part 63 to the first movable part 61. The second movable part 62 supports the movable arm 70. As described below, the second movable part 62 is connected to the movable arm 70 by a fastening member B. The pivot support part 63 is provided between the first movable part 61 and the second movable part 62. The pivot support part 63 is supported by the rotating shaft 50. This allows the movable base unit 60 to rotate around the rotating shaft 50.

[0077] The first movable part 61 has a movable tip 64. The movable tip 64 is a part that comes into contact with the rod 14R that constitutes the clamp drive mechanism 14. The rod 14R is disposed in a hole 17P that is provided inside the substrate holding base 17 and extends in the Z direction. In the movable base part 60, when the rod 14R presses the movable tip 64 in the +Z direction, the first movable part 61 moves and the movable base part 60 rotates around the rotation axis 50.

[0078] The movable base part 60 has a protruding part 65 provided between the horizontal base 42 and the first movable part 61. The protruding part 65 is provided on the first movable part 61. The protruding part 65 protrudes from the first movable part 61 towards the horizontal base 42 in the Z direction. A contact part 66 is provided at a position on the horizontal base 42 facing the protruding part 65. The contact part 66 is a part that comes into contact with the protruding part 65. An example of a material constituting the contact part 66 is a resin material. As the resin material, a material that is also excellent in outgassing properties, plasma resistance, durability, etc. is selected, and for example, Vespel (registered trademark) or the like can be used. Known metallic materials can be used as materials for forming the movable base portion 60. For example, aluminum and stainless steel such as SUS304 can be used.

[0079] 4, a configuration is adopted in which the protrusion 65 is provided on the first movable part 61, and the contact part 66 is provided on the horizontal base 42. A configuration may also be adopted in which the protrusion 65 is provided on the horizontal base 42, and the contact part 66 is provided on the first movable part 61. Also, the protrusions 65 may be provided on both the horizontal base 42 and the first movable part 61. In this case, the contact part 66 is provided on one of the two protrusions 65 facing each other.

[0080] <Magnetic structure in the fixed base part and the movable base part> The horizontal base 42 constituting the fixed base portion 40 has a first fixed base surface 44 and a second fixed base surface 45. The first fixed base surface 44 faces the first movable portion 61. The second fixed base surface 45 faces the second movable portion 62. The first movable part 61 constituting the movable base part 60 has a first movable base surface 67 facing the first fixed base surface 44. A first magnet M1 is attached to the first movable base surface 67. A second magnet M2 facing the first magnet M1 is attached to the first fixed base surface 44. The first magnet M1 and the second magnet M2 each have magnetism that attracts each other. For example, when the first magnet M1 has S-pole magnetism, the second magnet M2 has N-pole magnetism. Conversely, when the first magnet M1 has N-pole magnetism, the second magnet M2 has S-pole magnetism. In other words, an attractive force acts between the first fixed base surface 44 and the first movable part 61, attracting the first fixed base surface 44 and the first movable part 61 to each other.

[0081] The second movable part 62 constituting the movable base part 60 has a second movable base surface 68 facing the second fixed base surface 45. A third magnet M3 is attached to the second movable base surface 68. A fourth magnet M4 facing the third magnet M3 is attached to the second fixed base surface 45. The third magnet M3 and the fourth magnet M4 each have magnetism that repels each other. For example, when the first magnet M1 has S-pole magnetism, the second magnet M2 has S-pole magnetism. Conversely, when the first magnet M1 has N-pole magnetism, the second magnet M2 has N-pole magnetism. In other words, a repulsive force acts between the second fixed base surface 45 and the second movable part 62, causing the second fixed base surface 45 and the second movable part 62 to repel each other.

[0082] As shown in FIG. 4, in a state where the protrusion 65 of the first movable part 61 is in contact with the contact part 66 of the horizontal base 42, the first magnet M1 and the second magnet M2 are separated from each other. In other words, the protrusion 65 separates the first magnet M1 and the second magnet M2, on which an attractive force acts. In particular, a force is generated in which the protrusion 65 presses the contact part 66 due to the action of the attractive force generated by the first magnet M1 and the second magnet M2 and the repulsive force generated by the third magnet M3 and the fourth magnet M4. Therefore, the protrusion 65 does not separate from the contact part 66. Due to the action of such a magnetic force, the protrusion 65 and the contact part 66 are stably maintained in a stationary state.

[0083] <Movable arm> The movable arm 70 is exposed from the side surface 16 of the substrate holding unit 13. In other words, in the internal space of the platen chamber 4n, the movable arm 70 is exposed to the surrounding space facing the side surface 16 of the substrate holding unit 13. Specifically, the movable arm 70 of the clamp mechanism 30 attached to the Y side surface 16Y is exposed in the space between the inner wall forming the internal space of the platen chamber 4n and the Y side surface 16Y in the Y direction. The movable arm 70 of the clamp mechanism 30 attached to the X side surface 16X is exposed in the space between the transfer port 4a and the X side surface 16X in the X direction, and is also exposed in the space between the film formation port 4b and the X side surface 16X in the X direction.

[0084] The movable arm 70 has a lower connection portion 71 and an upper connection portion 72. The movable arm 70 extends in the Z direction from the lower connection portion 71 toward the upper connection portion 72. The upper connection portion 72 can be referred to as a first connection portion of the movable arm 70. The lower connection portion 71 can be referred to as a second connection portion of the movable arm 70. The lower connection portion 71 is fixed to the second movable portion 62 of the movable base portion 60 by a known fastening member B such as a bolt. That is, the movable arm 70 is supported by the second movable portion 62.

[0085] A guide groove may be provided at a portion where the lower connection part 71 and the second movable part 62 contact each other. This makes it possible to relatively move the lower connection part 71 and the second movable part 62 in the X direction via the guide groove. Therefore, it is possible to freely and easily adjust the position of the lower connection part 71 in the X direction relative to the second movable part 62 of the movable base part 60. Known metallic materials can be used as materials for forming the movable arm 70. For example, aluminum and stainless steel such as SUS304 can be used.

[0086] <Clamp section> The clamp portion 80 is capable of supporting the glass substrate 11 placed on the substrate placement portion 15 . The clamp portion 80 has an arm support portion 81, an extension arm 82, a flange 83, and a board contact portion 84.

[0087] <Arm support part> The arm support part 81 is a part supported by the upper connection part 72 of the movable arm 70. The arm support part 81 has an L-shape. Therefore, the arm support part 81 can be called a bent part. The arm support part 81 has a horizontal part 81H extending in the X direction and a vertical part 81V extending in the Z direction. The vertical part 81V is fixed to the movable arm 70 by a known fastening member B such as a bolt. A guide groove may be provided at a part where the vertical part 81V and the movable arm 70 contact each other. This makes it possible to move the vertical part 81V and the movable arm 70 relatively in the Z direction via the guide groove. Therefore, it is possible to freely and easily adjust the position of the arm support part 81 in the Z direction with respect to the upper connection part 72 of the movable arm 70. The horizontal part 81H is connected to a flange 83. In other words, the arm support part 81 is provided with a flange 83. When the clamp mechanism 30 is provided on the substrate holding base portion 17, the arm support portion 81 and the flange 83 are located outward from the side surface 16 of the substrate holding portion 13. In other words, the arm support portion 81 and the flange 83 are disposed so as to protrude from the side surface 16 in the +X direction, that is, outward from the side surface 16 of the substrate holding portion 13.

[0088] <Extended arm> The extension arm 82 is located between the arm support portion 81 and the board contact portion 84. The extension arm 82 has an extension portion 82A, an inclined portion 82B, and a tip portion 82C. The extension portion 82A is provided with a flange 83 located between the arm support portion 81 and the board contact portion 84. In other words, the flange 83 is provided between the extension portion 82A and the horizontal portion 81H.

[0089] The extending portion 82A extends in the -X direction from the flange 83. The inclined portion 82B extends in an inclined direction ID inclined with respect to the X direction. The inclined portion 82B is connected to the extending portion 82A and is located on the opposite side of the arm support portion 81 with respect to the extending portion 82A. The tip portion 82C is connected to the inclined portion 82B and extends in the X direction from the end of the inclined portion 82B. The tip portion 82C is located on the opposite side of the inclined portion 82B from the extending portion 82A. The tip portion 82C is a portion that supports the board contact portion 84, which will be described later.

[0090] A recess 82D is formed in the extension arm 82. In the X direction, the recess 82D is located between the board contact portion 84 and the extension portion 82A. The recess 82D is formed between the board contact portion 84 and the inclined portion 82B. The recess 82D is formed so as to be recessed in the direction in which the movable arm 70 extends, i.e., in the Z direction. The angle of the inclination direction ID of the inclined portion 82B with respect to the X direction is not particularly limited. The angle of the inclination direction ID is set appropriately depending on the shape of the recess 82D. For example, the recess 82D may have an inclination angle of about 30 degrees with respect to the X direction. Moreover, the shape of the recess 82D can be appropriately changed according to the shape of the labyrinth structure described later.

[0091] <Flange> 3 and 4, when the clamp mechanism 30 is installed in the temperature adjustment section 18 of the substrate holding section 13, the extension arm 82 is disposed in the cutout 15C of the outer periphery mounting section 15M. The flange 83 has a shape that overlaps with the cutout 15C so that no through hole is formed in the cutout 15C when viewed in the -X direction. The area of ​​the flange 83 when viewed in the -X direction is larger than the opening area of ​​the cutout 15C of the substrate holding section 13. The shape of the flange 83 when viewed in the X direction is, for example, a substantially rectangular shape. As long as a shape that overlaps with the cutout 15C can be obtained, the shape of the flange 83 is not limited to a substantially rectangular shape.

[0092] In this embodiment, the direction in which the extension portion 82A of the extension arm 82 extends intersects with the direction in which the movable arm 70 extends. The angle at which the extension arm 82 extends and the extension arm 70 extend intersect is, for example, a right angle. The arm formed by the extension arm 82 and the movable arm 70 can be referred to as an L-shaped arm. When the clamp mechanism 30 is provided on the substrate holding portion 13, the extension arm 82 is located inside the side surface 16 of the substrate holding portion 13. That is, the extension arm 82 is provided so as to protrude from the side surface 16 of the substrate holding portion 13 in the -X direction. In other words, the extension arm 82 is provided so as to protrude from the flange 83 in the direction from the side surface 16 of the substrate holding portion 13 toward the glass substrate 11 placed on the substrate placement portion 15. Known metallic materials can be used as materials for forming the arm support portion 81, the extension arm 82, and the flange 83. For example, aluminum or stainless steel such as SUS304 can be used.

[0093] <Substrate contact section> The board contact portion 84 is fixed to the tip portion 82C of the extension arm 82 by a known fastening member B such as a bolt. The board contact portion 84 is a portion of the substrate mounting portion 15 that can come into contact with the peripheral portion 11P of the glass substrate 11. Furthermore, the substrate contact portion 84 also has a function of aligning the position of the glass substrate 11 on the substrate mounting portion 15 by coming into contact with the peripheral portion 11P of the glass substrate 11. The substrate contact portion 84 is formed of a resin material. Therefore, when the substrate contact portion 84 comes into contact with the glass substrate 11, the glass substrate 11 is prevented from being scratched and the glass substrate 11 is prevented from being chipped or broken. As the resin material used for the substrate contact portion 84, a material having excellent outgassing properties, plasma resistance, durability, etc. is selected, and for example, Vespel (registered trademark) or the like can be used.

[0094] <Clamp mechanism drive> The state of the clamp mechanism 30 is a substrate clamping state or an unclamping state. <Board clamping state> The substrate clamp state means a position where the clamp unit 80 supports the glass substrate 11 placed on the substrate placement unit 15 and adheres the glass substrate 11 to the substrate placement unit 15. FIG. 4 shows the state of the clamp mechanism 30 in the substrate clamp state. In the substrate clamp state, the rod 14R of the clamp drive mechanism 14 does not press the movable tip 64 of the movable base unit 60. In this case, a force that brings the first fixed base surface 44 and the first movable unit 61 closer to each other is applied by the attraction force acting between the first magnet M1 and the second magnet M2 and the repulsion force acting between the third magnet M3 and the fourth magnet M4. However, since the protrusion 65 is in contact with the contact unit 66 and presses the contact unit 66, the state in which the first magnet M1 and the second magnet M2 are separated from each other is stably maintained.

[0095] Therefore, the positions of the movable arm 70 connected to the movable base portion 60, the extension arm 82 connected to the movable arm 70 via the arm support portion 81, and the substrate contact portion 84 fixed to the tip portion 82C of the extension arm 82 are also stably maintained. In such a substrate clamped state, the position of the glass substrate 11 supported by the substrate contact portion 84 is stable, and the glass substrate 11 can be closely attached to the substrate mounting portion 15.

[0096] <Clamp released state> The unclamped state refers to a position where the glass substrate 11 is no longer supported by the clamp portion 80. To put the clamp mechanism 30 in an unclamped state, first, the rod 14R constituting the clamp drive mechanism 14 presses the movable tip 64 in the +Z direction. When the pressing force of the rod 14R pressing the movable tip 64 becomes greater than the pressing force of the protrusion 65 pressing the contact portion 66 due to the action of magnetic force, the movable tip 64 moves in the +Z direction. In this case, the movable base portion 60 rotates in the rotation direction R1. As the movable base portion 60 rotates, the movable arm 70 connected to the movable base portion 60, the extension arm 82 connected to the movable arm 70 via the arm support portion 81, and the board contact portion 84 fixed to the tip portion 82C of the extension arm 82 also rotate in the rotation direction R1. In such an unclamped state, the substrate contact portion 84 moves away from the glass substrate 11, making it possible to remove the glass substrate 11 from the substrate mounting portion 15.

[0097] In contrast, when the pressure of the rod 14R against the movable tip 64 is released, the pressure of the protruding portion 65 pressing the contact portion 66 due to the action of the magnetic force becomes greater than the pressure of the rod 14R pressing the movable tip 64. In this case, the movable tip 64 moves in the -Z direction. In this case, the movable base portion 60 rotates in the rotation direction R2. With the rotation of the movable base portion 60, the movable arm 70 connected to the movable base portion 60, the extension arm 82 connected to the movable arm 70 via the arm support portion 81, and the substrate contact portion 84 fixed to the tip portion 82C of the extension arm 82 also rotate in the rotation direction R2. This makes it possible to realize the substrate clamped state shown in FIG. 4. In such a substrate clamped state, the position of the glass substrate 11 supported by the substrate contact portion 84 is stabilized, and the glass substrate 11 can be closely attached to the substrate placement portion 15.

[0098] <Processes carried out in the film formation chamber> 5 to 10, the steps performed in the film formation chamber 4 and the flow of material molecules passing through the gap between the glass substrate 11 and the mask 20 will be described. 5 to 8 are schematic side views showing the steps carried out in the film formation chamber 4 according to this embodiment. FIG. 9 is a schematic side view showing a process carried out in the film formation chamber 4 according to this embodiment, and is a schematic cross-sectional view showing the main parts of the mask 20, the clamping mechanism 30, and the substrate holding part 13. As shown in FIG. FIG. 10 is a schematic side view showing a process carried out in the film formation chamber 4 according to this embodiment, and is a schematic cross-sectional view showing the main parts of the mask 20 and the substrate holding part 13. As shown in FIG. Fig. 9 is a cross-sectional view including a cross section of the clamp mechanism 30. Fig. 10 is a cross-sectional view not including a cross section of the clamp mechanism 30. Figs. 9 and 10 are views for explaining the flow of material molecules passing through the gap between the glass substrate 11 and the mask 20.

[0099] FIG. 5 shows the state before the glass substrate 11 is transferred to the film formation chamber 4. 5, the rotary drive unit 12A is driven to rotate the substrate holding unit 13, and the substrate holding unit 13 is placed at a horizontal position P1. The clamping mechanism 30 is in an unclamped state. In addition, a plurality of lift pins (not shown) are in a standby position protruding from the surface of the substrate holding unit 13. This places the film formation chamber 4 in a standby state before receiving the glass substrate 11.

[0100] In the transfer chamber 3, the transfer device 3a operates, and the robot hand of the transfer device 3a is inserted into the load / unload chamber 2. In the load / unload chamber 2, the glass substrate 11 placed on the positioning member is supported by the robot hand of the transfer device 3a. The glass substrate 11 is removed from the load / unload chamber 2 by the transfer device 3a.

[0101] Next, as shown in Fig. 6, a gate valve installed at the transfer port 4a of the film formation chamber 4 is opened, and the transfer port 4a is opened. This allows the transfer chamber 3 and the platen chamber 4n to communicate with each other. Thereafter, the transfer device 3a transfers the glass substrate 11 from the transfer chamber 3 to the film formation chamber 4 in the direction indicated by the symbol A. The glass substrate 11 that has arrived at the film formation chamber 4 is handed over to a plurality of lift pins protruding from the substrate holding portion 13 by the transfer device 3a. Even in this state, the clamp mechanism 30 is in an unclamped state.

[0102] 7, the lift pins are lowered and the glass substrate 11 is placed on the substrate placement portion 15. Thereafter, the state in which the movable tip portion 64 is pressed by the rod 14R is released, and the clamp mechanism 30 enters the substrate clamping state due to the action of the magnetic force described above. The substrate contact portion 84 comes into contact with the peripheral portion 11P of the glass substrate 11, aligns the position of the glass substrate 11, and holds the glass substrate 11.

[0103] Next, as shown in Fig. 8, the rotation drive unit 12A is driven to rotate the substrate holding unit 13 in the direction indicated by the symbol C, and the substrate holding unit 13 is disposed in the upright position P2. In this state, the clamp mechanism 30 is in a substrate clamping state. As a result, the film formation port 4b is almost closed by the glass substrate 11 and the substrate holding unit 13. At the same time, the glass substrate 11 approaches the mask 20.

[0104] In this state, a mask alignment unit (not shown) aligns the position of the mask 20 within the plane of the mask 20. Specifically, an imaging device (not shown) detects the positions of the mask 20 and the glass substrate 11 within the plane. Based on the detection result, the mask alignment unit drives the mask 20 to align the contours of the mask 20 and the glass substrate 11.

[0105] Next, after the alignment of the position within the plane of the mask 20 is completed, the mask alignment unit moves the mask 20 in a direction perpendicular to the plane of the mask 20, and brings the mask 20 closer to the glass substrate 11. By moving the mask 20, the substrate contact portions 84 in contact with the mask 20 are pressed by the mask 20. As a result, the glass substrate 11 is supported by the support pins 15S and the substrate contact portions 84, as shown in FIG.

[0106] 9, when the substrate holding part 13 is moved to the standing position P2 by the rotary support mechanism 10, the first mask protrusion 20F is inserted into the recess 82D of the extension arm 82 with a gap therebetween. A space 91 is formed between the recess 82D and the first mask protrusion 20F. This space 91 is a first bent space 91 that is bent with respect to a direction parallel to the glass substrate 11. 10, the extending protrusion 15T faces the frame rear surface 20R with a gap therebetween. The second mask protrusion 20S faces the outer periphery mounting portion 15M with a gap therebetween. The second mask protrusion 20S is located next to the extending protrusion 15T with a gap therebetween in a direction parallel to the glass substrate 11. A space 92 is formed between the extending protrusion 15T and the second mask protrusion 20S. This space 92 is a second bent space 92 that is bent with respect to a direction parallel to the glass substrate 11. In other words, in the structure shown in FIGS. 9 and 10, each of the first curved space 91 and the second curved space 92 forms a labyrinth structure.

[0107] Through the above-mentioned steps, the film formation target region 11T of the glass substrate 11 is exposed to the plasma chamber 4m through the mask opening 20c. In this state, a film formation step is carried out in the plasma chamber 4m. In the film formation process, sputtering gas and reactive gas are supplied to the plasma chamber 4m from the gas inlet of the gas atmosphere setting mechanism 4g. In the film formation process, a sputtering voltage is applied to the backing plate 6 from an external power source 4p. In addition, in the film formation process, a predetermined magnetic field is formed on the target 7 by the magnetron magnetic circuit. At the same time, the backing plate 6 or the magnetron magnetic circuit performs the necessary swinging or rotating motion.

[0108] As a result, ions of the sputtering gas are excited by the plasma generated in the plasma chamber 4m. The ions of the sputtering gas collide with the target 7 on the backing plate 6, causing particles of the film-forming material to fly out. Then, the material molecules of the film-forming material flying out from the target 7 combine with the reactive gas, and the combined material molecules and reactive gas adhere to the glass substrate 11. As a result, a predetermined film is formed on the surface of the glass substrate 11, that is, on the film-forming target region 11T of the glass substrate 11.

[0109] Generally, material molecules that fly out of a target have the property of scattering in all directions. Also, material molecules have the property of either directly attaching to the surface that the material molecules first collide with, or being reflected by the colliding surface and attaching to another surface, depending on the amount of energy that the material molecules have. The number of reflections is not limited, but as the number of reflections increases, the energy that the material molecules have gradually decreases, and they finally attach to the surface that they collided with.

[0110] Here, the behavior of the material molecules will be described with reference to FIG. 9 and FIG. 9, the material molecules 95 pass through the gap between the glass substrate 11 and the mask 20 and enter the first bent space 91. The material molecules 95 pass through the first bent space 91. At this time, collision, reflection, and adhesion of the material molecules 95 occur with the extension arm 82, the recessed portion 82D, the frame rear surface 20R, and the first mask protruding portion 20F.

[0111] 10, the material molecules 95 pass through the gap between the glass substrate 11 and the mask 20 and enter the second curved space 92. The material molecules 95 pass through the second curved space 92. At this time, collision, reflection, and adhesion of the material molecules 95 occur with the outer periphery mounting portion 15M, the extending convex portion 15T, the frame rear surface 20R, and the second mask protrusion portion 20S.

[0112] Therefore, when the flying material molecules 95 flow from the plasma chamber 4m toward the platen chamber 4n, the material molecules 95 can be attached to the first curved space 91 and the second curved space 92 having a labyrinth structure, and the intrusion of the material molecules 95 into the platen chamber 4n can be suppressed. In other words, the first curved space 91 and the second curved space 92 can provide a trapping effect for trapping the material molecules 95.

[0113] <Effects> According to the substrate processing apparatus 1 of this embodiment, it is not necessary to provide the movable arm 70 inside the substrate holding unit 13. That is, it is not necessary to provide an opening for accommodating the movable arm 70 in the substrate holding unit 13 as in the conventional method. Therefore, the material molecules 95 flying in the substrate processing apparatus 1 fly so as to pass through the gap between the mask 20 and the glass substrate 11, but the material molecules 95 are prevented from penetrating inside the substrate holding unit 13. This makes it possible to prevent the material molecules 95 from penetrating into the space between the multiple components constituting the substrate holding unit 13. Specifically, it is possible to prevent the material molecules 95 from directly adhering to the surface of the component. In addition, it is possible to prevent the material molecules 95 from adhering to the surface of the component after the material molecules 95 are reflected by the surface of the component. This makes it possible to prevent the deposition of the material molecules 95 on the surface of the component. Therefore, it is possible to prevent the generation of particles caused by the deposition of the material molecules 95 on the surface of the component.

[0114] Furthermore, since deposition of material molecules 95 on the surfaces of the components constituting the substrate holding unit 13 can be suppressed, the components constituting the substrate holding unit 13 can be used for a long period of time while maintaining a state in which particle generation is suppressed. Therefore, the frequency of maintenance such as replacing used components with unused components can be reduced. As a result, the time and labor required for maintenance can be reduced, the film forming apparatus can be used continuously for a longer period of time, and the productivity of the substrate processing apparatus 1 can be improved.

[0115] Moreover, in a state in which the movable arm 70 is exposed from the side surface of the substrate holding base portion 17, the movable arm 70 can be rotated around the rotation axis 50. As the movable arm 70 rotates, the substrate contact portion 84 can support the glass substrate 11 or can release the support state of the glass substrate 11.

[0116] According to this configuration, the state of the clamp mechanism 30 in the substrate clamping state or the clamping release state can be stabilized by utilizing the attractive force of the magnets M1, M2 which attract each other and the repulsive force of the magnets M3, M4 which repel each other. Furthermore, the protrusion 65 maintains a non-contact state between the first magnet M1 and the second magnet M2 on which the attractive force acts, so that the first magnet M1 and the second magnet M2 can be easily separated from each other. The protrusion 65 can prevent contact between the two magnets M1, M2 on which the attractive force acts, and suppress the generation of particles.

[0117] According to this configuration, in a state in which the glass substrate 11 is supported by the clamp portion 80, the notch portion 15C of the substrate holding portion 13 is covered by the flange 83. Therefore, the flying material molecules 95 in the substrate processing apparatus are prevented from passing through the notch portion 15C of the substrate holding portion 13. The flange 83 can prevent the scattering of the material molecules 95 that have passed through the notch portion 15C. Therefore, the generation of particles can be suppressed.

[0118] In addition, the first curved space 91 and the second curved space 92 provide a trapping effect for trapping the material molecules 95, thereby suppressing adhesion of the material molecules 95 to the substrate holding portion 13 arranged in the platen chamber 4n and components constituting the rotation support mechanism 10. Therefore, when performing maintenance on the processing chamber, it is possible to replace only the parts that have trapped the material molecules 95. Specifically, maintenance can be completed by simply replacing only the parts to which the material molecules 95 are attached, such as the mask 20, the clamp unit 80, and the parts that constitute the outer periphery mounting unit 15M. In addition, the above-described trapping effect can suppress adhesion of the material molecules 95 to parts that are difficult to replace among the components that make up the platen chamber 4n. Therefore, in maintenance work, it is only necessary to replace only the parts to which the material molecules 95 are attached, excluding the parts that are difficult to replace, improving maintainability.

[0119] <Variation 1> The surface treatment performed in the substrate processing apparatus 1 according to the embodiment described above is the sputtering treatment, but the surface treatment is not limited to the sputtering treatment. A deposition treatment may be performed instead of the sputtering treatment. In this case, the first chamber has a deposition source, and the deposition treatment is performed in the first chamber.

[0120] <Variation 2> Next, the labyrinth structure formed by the mask, the clamp portion, and the substrate holding portion will be described with reference to FIGS. 11A to 12C. 11A to 12C, the same members as those in the above-described embodiment are denoted by the same reference numerals, and their description will be omitted or simplified.

[0121] Fig. 11A shows a structure in which a labyrinth structure is not formed. In the structure shown in Fig. 11A, only a linear space 101 extending linearly is formed in a member 100. In this structure, the material molecules 95 are not reflected in the linear space 101. In other words, the number of reflections of the material molecules 95 in the linear space 101 is zero. When the structure shown in Fig. 11A is applied to a mask, a clamp unit, and a substrate holder, the trapping effect of the material molecules cannot be obtained, and scattering and adhesion of the material molecules 95 to the inside of the substrate holder and the inside of the platen chamber cannot be suppressed.

[0122] 11B to 12C show modified examples of the first curved space 91 and the second curved space 92. In the following description, the first curved space 91 and the second curved space 92 will be simply referred to as a curved space 93. In FIGS. 11B to 12C, the members indicated by reference numeral 200 correspond to the mask 20, the clamp mechanism 30, and the substrate holding unit 13.

[0123] 11B, the bent space 93 has two straight portions 96 and one bent portion 97. The two straight portions 96 are connected via the bent portion 97. A material molecule 95 passing through the bent space 93 collides with the bent portion 97 when passing through the two straight portions 96. Alternatively, the material molecule 95 is reflected at the bent portion 97. Since the bent space 93 has one bent portion 97, the material molecule 95 is reflected once in the bent space 93.

[0124] 11C , the bent space 93 has three straight portions 96 and two bent portions 97. The three straight portions 96 are connected via the two bent portions 97. A material molecule 95 passing through the bent space 93 collides with the two bent portions 97 when passing through the three straight portions 96. Alternatively, the material molecule 95 is reflected at the two bent portions 97. Since the two bent portions 97 are provided in the bent space 93, the material molecule 95 is reflected twice in the bent space 93.

[0125] 11D, the bent space 93 has four straight portions 96 and three bent portions 97. The four straight portions 96 are connected via the three bent portions 97. A material molecule 95 passing through the bent space 93 collides with the three bent portions 97 when passing through the four straight portions 96. Alternatively, the material molecule 95 is reflected at the three bent portions 97. Since the bent space 93 has three bent portions 97, the material molecule 95 is reflected three times in the bent space 93.

[0126] 11E, the bent space 93 has five straight portions 96 and four bent portions 97. The five straight portions 96 are connected via the four bent portions 97. A material molecule 95 passing through the bent space 93 collides with the four bent portions 97 when passing through the five straight portions 96. Alternatively, the material molecule 95 is reflected at the four bent portions 97. Since the bent space 93 has four bent portions 97, the material molecule 95 is reflected four times in the bent space 93.

[0127] 11B to 11E, a labyrinth structure is obtained. The curved space can have the effect of trapping the material molecules 95. In particular, the structure shown in FIG. 11E can have a more excellent effect of trapping the material molecules 95.

[0128] 11B to 11E, the shape of the bent portion 97 is a right angle, and the directions in which the two straight portions 96 connected to the bent portion 97 extend are right angles. The shape of the bent portion 97 is not limited to a right angle. Fig. 12A shows a case where the angle formed by the two straight line portions 96 connected to the bent portion 97 is an obtuse angle. Fig. 12A shows a case where the angle formed by the two straight line portions 96 connected to the bent portion 97 is an acute angle. Fig. 12C shows a case where the bent portion 97 has a curved surface. The shape of the bent portion 97 shown in Figures 12A to 12C can be applied to the structures shown in Figures 11B to 11E. Even when the bent portion 97 shown in Figures 12A to 12C is used, the trapping effect of the material molecules 95 can be obtained.

[0129] Although preferred embodiments and variants of the present invention have been described and illustrated above, it should be understood that they are illustrative of the present invention and should not be considered as limiting. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the present invention. Thus, the present invention should not be considered as limited by the foregoing description. [Explanation of symbols]

[0130] 1...substrate processing apparatus, 2, 2A...loading / unloading chamber, 3...transfer chamber, 3a...transfer device, 4, 4A...film formation chamber, 4a...transfer port, 4b...film formation port, 4c...boundary portion, 4g...gas atmosphere setting mechanism, 4m...plasma chamber, 4n...platen chamber, 4p...power source, 5...cathode unit, 6...backing plate, 7...target, 10...rotation support mechanism, 11...substrate, 11...glass substrate, 11E...periphery region, 11P...periphery, 11T...film formation target region, 12...rotation support shaft, 12A...rotation drive unit, 13...substrate holder, 14...clamp drive mechanism, 14M...moving mechanism, 14R...rod, 15...substrate placement portion, 15C...notch portion, 15E...outer edge, 15M...periphery placement portion, 15P...periphery portion, 15S...support pin, 15T...extending convex portion, 16...side, 16X...side, 16Y...side, 17...substrate holding base portion, 17H...hole portion, 17P...hole portion, 18...temperature adjustment portion, 19...periphery plate, 19C...plate notch portion, 19X...X plate, 19Y...Y plate, 20...mask, 20a...mask frame, 20b...rib, 20c...mask opening, 20c...mask opening, 20F...first mask protrusion portion, 2 0R...rear surface of frame, 20S...second mask protrusion, 20T...surface of frame, 30...clamp mechanism, 40...fixed base portion, 41...vertical base, 42...horizontal base, 43...rotating shaft support portion, 44...first fixed base surface, 45...second fixed base surface, 50...rotating shaft, 60...movable base portion, 61...first movable portion, 62...second movable portion, 63...axis support portion, 64...movable tip portion, 65...protrusion portion, 66...contact portion, 67...first movable base surface, 68...second movable base surface, 70...movable arm, 71...lower connection portion, 72...upper connection portion, 80...clamp portion, 81...arm support Holding portion, 81H... horizontal portion, 81V... vertical portion, 82... extension arm, 82A... extension portion, 82B... inclined portion, 82C... tip portion, 82D... recess, 83... flange, 84... board contact portion, 91... first bent space, 91... space, 92... second bent space, 92... space, 93... bent space, 95... material molecule, 96... straight portion, 97... bent portion, 100... member, 101... straight space, M1... first magnet (magnet), M2... second magnet (magnet), M3... third magnet (magnet), M4... fourth magnet (magnet), P1... horizontal position, P2... standing position, R1... direction of rotation, R2... direction of rotation

Claims

1. An apparatus for processing a substrate, comprising: a processing chamber for performing a surface treatment on the substrate; a substrate holder disposed within the processing chamber, the substrate holder comprising: a substrate placement portion on which the substrate is placed; and a clamping mechanism capable of supporting the substrate placed on the substrate placement portion; a mask having a frame portion with a mask opening having a shape corresponding to a region to be processed of the substrate; Equipped with The clamp mechanism includes: a movable arm exposed from a side surface of the substrate holding portion; A clamp portion capable of supporting the substrate; a fixed base supported by the substrate holder; A rotating shaft supported by the fixed base portion; a movable base portion having a first movable portion, a second movable portion, and a pivot support portion; having the first movable portion is movable toward or away from the fixed base portion in a direction in which the movable arm extends, the second movable portion is located on an opposite side to the first movable portion with respect to the rotation axis in a direction in which the movable base portion extends, The second movable portion supports the movable arm, the shaft support portion is provided between the first movable portion and the second movable portion and is supported by the rotation shaft, the clamp portion has an arm support portion supported by the movable arm, a board contact portion capable of contacting the board on the board placement portion, and an extension arm located between the arm support portion and the board contact portion; The direction in which the extension arm extends and the direction in which the movable arm extends intersect with each other. Substrate processing equipment.

2. the clamp mechanism has a protrusion provided between the fixed base portion and the first movable portion, The fixed base portion is a first fixed base surface facing the first movable portion; a second fixed base surface facing the second movable portion; having The first movable portion has a first magnet, the first fixed base surface has a second magnet facing the first magnet, The second movable portion has a third magnet, the second fixed base surface has a fourth magnet facing the third magnet, the first magnet and the second magnet have magnetic properties that attract each other, the third magnet and the fourth magnet have magnetic properties that repel each other, When the fixed base portion and the first movable portion are in contact with each other at the protruding portion, the first magnet and the second magnet are spaced apart from each other. The substrate processing apparatus according to claim 1 .

3. The clamp portion is a flange located between the arm support portion and the board contact portion and provided on the extension arm; having the substrate mounting portion includes an outer periphery mounting portion that supports an outer periphery region of the substrate, a plurality of protruding portions that protrude from the outer periphery mounting portion in a thickness direction of the substrate, and a notch portion that is provided between two adjacent protruding portions of the plurality of protruding portions in a direction parallel to an edge of the substrate, A part of the extension arm is inserted into the notch, The flange covers the notch in a direction from the arm support portion toward the board contact portion. The substrate processing apparatus according to claim 1 or 2.

4. The processing chamber includes: a first chamber for subjecting the substrate to a surface treatment; a second chamber adjacent to the first chamber; Equipped with The second chamber is a transfer port through which the substrate passes; a rotation support mechanism having a rotation support shaft that supports and rotates the substrate holding portion, and that rotates and moves the substrate holding portion between a horizontal position and an upright position; Equipped with The mask comprises: the first chamber and the second chamber, and is disposed so as to stand upright and be substantially parallel to the direction of gravity; When the substrate holder is in the horizontal position, the substrate holder supports the substrate in a horizontal direction so that the substrate can be transported through the transport port; In the upright position of the substrate holding part, the substrate holding part is disposed close to the mask so as to expose the processing target region of the substrate to the mask opening of the upright mask, and a surface treatment can be performed on the processing target region of the substrate through the mask opening. The substrate processing apparatus according to claim 1 or 2.

5. The extension arm of the clamp portion has a recess that is recessed in a direction in which the movable arm extends, the substrate mounting portion includes an outer periphery mounting portion that supports an outer periphery region of the substrate, and a protrusion that protrudes from the outer periphery mounting portion in a thickness direction of the substrate, the frame portion has a frame surface facing the clamp portion, and a first mask protrusion portion and a second mask protrusion portion protruding from the frame surface, The first mask protrusions are insertable into the recesses at intervals; the second mask protrusion portion is provided at a position different from that of the first mask protrusion portion so that the second mask protrusion portion can be positioned adjacent to the convex portion at a distance in a direction parallel to the substrate and can face the outer periphery mounting portion at a distance; When the substrate holder is moved to the upright position by the rotation support mechanism, The first mask protrusions are inserted into the recesses at intervals, a first bent space that is bent with respect to a direction parallel to the substrate is formed in a space between the recess and the first mask protrusion, The protrusion faces the frame surface with a gap therebetween, the second mask protrusion portion faces the outer periphery mounting portion with a gap therebetween and is located next to the protrusion portion with a gap therebetween in a direction parallel to the substrate, a second bent space bent with respect to a direction parallel to the substrate is formed in a space between the convex portion and the second mask protrusion portion; The substrate processing apparatus according to claim 4 .

6. the first chamber has a deposition source; A deposition process is performed in the first chamber. The substrate processing apparatus according to claim 4 .

7. The first chamber has a cathode, A sputtering process is performed in the first chamber. The substrate processing apparatus according to claim 4 .

8. A clamp mechanism for supporting a substrate in a substrate holder constituting a substrate processing apparatus, comprising: a fixed base supported by the substrate holder; A rotating shaft supported by the fixed base portion; a movable base portion having a first movable portion, a second movable portion, and a pivot support portion; A movable arm supported by the second movable portion; a clamp section having an arm support section supported by the movable arm, a board contact section capable of contacting the board, and an extension arm positioned between the arm support section and the board contact section, and capable of supporting the board; a protrusion provided between the fixed base portion and the first movable portion; Equipped with the first movable portion is movable toward or away from the fixed base portion, the second movable portion is located on an opposite side to the first movable portion with respect to the rotation axis in a direction in which the movable base portion extends, the shaft support portion is provided between the first movable portion and the second movable portion and is supported by the rotation shaft, a direction in which the extension arm extends and a direction in which the movable arm extends intersect with each other, The fixed base portion is a first fixed base surface facing the first movable portion; a second fixed base surface facing the second movable portion; having The first movable portion has a first magnet, the first fixed base surface has a second magnet facing the first magnet, The second movable portion has a third magnet, the second fixed base surface has a fourth magnet facing the third magnet, the first magnet and the second magnet have magnetic properties that attract each other, the third magnet and the fourth magnet have magnetic properties that repel each other, When the fixed base portion and the first movable portion are in contact with each other at the protruding portion, the first magnet and the second magnet are spaced apart from each other. Clamping mechanism.

9. the clamp portion is located between the arm support portion and the board contact portion and has a flange provided on the extension arm; The clamping mechanism of claim 8.

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