Electronic device and memory device
JP7632865B2Active Publication Date: 2025-02-19INTEL CORP
Patent Information
- Application Number
- JP2020194873
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2020-04-21
- Filing Date
- 2020-11-25
- Publication Date
- 2025-02-19
- Estimated Expiration
- 2040-11-25
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Abstract
To provide a technique for end-to-end DBI that enables power saving in a stacked memory device.SOLUTION: In a memory device 10, a data bus inversion (DBI) technique is used and utilized in various parallel input / output (IO) circuits in order to limit the number of simultaneous lane-switching and reduce electric power and simultaneous switching operation (SSO) noise. In a stacked memory device such as a high bandwidth memory (HBM) device, DBI is extended to a memory core, for significant reduction in one or more of power consumption, voltage droop and SSO noise. A memory core, a plurality of through silicon vias (TSV), and a data bus inversion logic connected between the memory core and the TSV may be included. The data bus inversion logic encodes and decodes a data signal on a signal path through the TSV according to data bus inversion of the data signal.SELECTED DRAWING: Figure 1
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Citation Information
Patent Citations
Semiconductor memory device
JP2017016727A
Semiconductor apparatus and data bit inversion
US20150269979A1
Semiconductor apparatus having multiple ranks with noise elimination
US20170162237A1
Semiconductor layered device with data bus
US20180047432A1