Electronic component manufacturing method and electronic component manufacturing device

Abstract

To provide a method for manufacturing an electronic component, enabling suppression of the occurrence of cracks and enabling plating processing to be performed at a desired plating thickness.SOLUTION: A method for manufacturing an electronic component comprises: a first contact step of bringing an electrode imparting potential to a plating object into contact with a first place of the plating object; a first plating step of plating the plating object by imparting the potential to the electrode while the first place and the electrode are in contact with each other; a second contact step of relatively moving the plating object and the electrode after the first plating step, thereby forming a state in which the first place and the electrode separate from each other and a second place and the electrode are in contact with each other; and a second plating step of performing plating by imparting potential to the electrode while the first place and the electrode are separated from each other and the second place and the electrode are in contact with each other after the second contact step.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a method and an apparatus for manufacturing electronic components. [Background technology]

[0002] In the manufacture of electronic components, it is known to perform a plating process on an object to be plated (for example, see Patent Document 1). For example, the plating process is performed by applying a potential to the object to be plated via an electrode. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 11-354378 Summary of the Invention [Problem to be solved by the invention]

[0004] As shown in Patent Document 1, a technique is known in which a plurality of objects to be plated and a plurality of plating media are placed in a barrel and plating is performed while rotating the barrel. The plurality of objects to be plated are, for example, electronic components before plating. In such an electrolytic barrel plating method, cracks occur in some of the objects to be plated due to collisions between the objects to be plated or between the plating media and the objects to be plated in the barrel. Even if the cracks are not visible on the outside, there are cases where cracks have occurred inside. It is not easy to remove such electronic components with cracks from the production line. Since plating is applied not only to the objects to be plated but also to the plating media, it is difficult to reduce power consumption and material consumption.

[0005] For this reason, it is conceivable to perform plating by contacting an electrode with a predetermined portion of each object to be plated. However, since the electrode acts as an obstacle to the portion where the object to be plated is in contact with the electrode, it is more difficult to plate the portion than the portion where the electrode is not in contact. Therefore, it is sometimes difficult to perform plating to a desired thickness. For example, it is difficult to perform plating to a uniform thickness.

[0006] It is an object of one aspect of the present invention to provide a method for manufacturing electronic components that can suppress the occurrence of cracks and can perform plating to a desired thickness. It is an object of another aspect of the present invention to provide an apparatus for manufacturing electronic components that can suppress the occurrence of cracks and can perform plating to a desired thickness. [Means for solving the problem]

[0007] A method for manufacturing an electronic component according to one aspect of the present invention includes a first contact step, a first plating step, a second contact step, and a second plating step. In the first contact step, an electrode for applying a potential to the object to be plated is brought into contact with a first location 10a of the object to be plated. In the first plating step, a potential is applied to the electrode in a state in which the first location and the electrode are in contact with each other, thereby performing a plating process on the object to be plated. In the second contact step, a state in which the first location and the electrode are separated from each other and the second location and the electrode are in contact with each other is formed by performing a relative movement between the object to be plated and the electrode after the first plating step. The second location is a location of the object to be plated that is different from the first location. In the second plating step, a potential is applied to the electrode in a state in which the first location and the electrode are separated from each other and the second location and the electrode are in contact with each other after the second contact step, thereby performing a plating process on the object to be plated.

[0008] In this method for manufacturing electronic components, a plating process is performed on the object to be plated while the first location and the electrode are in contact with each other, and then the electrode and the object to be plated are moved relative to each other. Then, while the first location and the electrode are spaced apart from each other and the second location and the electrode are in contact with each other, the object to be plated is plated. In this case, plating can be applied to a desired thickness even at the first location, where plating was difficult to apply. Therefore, plating can be applied to a desired thickness while suppressing the occurrence of cracks.

[0009] In the above-mentioned aspect, the method may further include a holding step in which the plurality of objects to be plated are held by a holding member while being spaced apart from one another. In the second contact step, the electrode and the holding member may be moved relative to one another to form a state in which the first location and the electrode are spaced apart from one another and the second location and the electrode are in contact with one another. In this case, a plating process of a desired thickness can be applied to the plurality of objects to be plated. As a result, production throughput can be improved.

[0010] In one of the above aspects, the electrode that applies a potential to the object to be plated may include first and second electrode terminals that face each other. When the first location and the electrode are in contact with each other, the first location and the first electrode terminal may be in contact with each other. When the second location and the electrode are in contact with each other, the second location and the second electrode terminal may be in contact with each other. In this case, since the first electrode terminal and the second electrode terminal face each other, the position at which the object to be plated and the electrode are in contact can be easily switched.

[0011] In the above aspect, the first and second electrode terminals may extend in a direction intersecting a direction in which the first and second electrode terminals face each other, whereby plating can be easily performed on a plurality of objects to be plated.

[0012] In one of the above aspects, the object to be plated may have a plurality of parts to be plated. Each of the plurality of parts to be plated may include a first location and a second location and may be spaced apart from one another. In the first plating step, the object to be plated may be plated by applying a potential to the electrode in a state in which the first location of each part to be plated is in contact with the electrode. In the second plating step, the object to be plated may be plated by applying a potential to the electrode in a state in which the first location of each part to be plated is in contact with the electrode and the electrode is spaced apart from one another and the second location of each part to be plated is in contact with the electrode. In this case, the plating is performed in parallel on the plurality of parts to be plated that are spaced apart from one another. Therefore, the time required for the plating is reduced.

[0013] In one of the above embodiments, the object to be plated may have a pair of end faces facing each other and a side face located between the pair of end faces. The first and second locations may be included in the side faces. In this case, plating can be performed without contacting the electrode with the end faces that are difficult to plate. This can reduce variation in plating thickness between each end face and the side faces.

[0014] In the above-mentioned one embodiment, in the second contact step, the relative movement may be performed by applying a force to the electrode, which reduces damage to the plating object.

[0015] In another aspect of the present invention, an electronic component manufacturing apparatus includes an electrode and a drive unit. The electrode applies an electric potential to an object to be plated in a plating process. The drive unit performs relative movement between the object to be plated and the electrode so that the object to be plated and the electrode have a predetermined positional relationship. The drive unit switches, by the relative movement, between a state in which a first location of the object to be plated and the electrode are in contact with each other, and a state in which the first location and the electrode are separated from each other and a second location and the electrode are in contact with each other. The second location is a location of the object to be plated that is different from the first location.

[0016] In this electronic component manufacturing apparatus, the drive unit switches between a state in which the first location and the electrode are in contact with each other and a state in which the second location and the electrode are in contact with each other. In this case, the first location, which was difficult to plate in a plating process in which the first location and the electrode were in contact with each other, can be plated to a desired thickness in a plating process in which the second location and the electrode are in contact with each other. Therefore, plating can be performed to a desired thickness while suppressing the occurrence of cracks.

[0017] In the above-mentioned another aspect, the manufacturing apparatus may further include a holding member. The holding member may hold the plurality of objects to be plated in a state in which the objects are spaced apart from one another. The driving unit may switch between a state in which a first portion of the object to be plated and the electrode are in contact with one another and a state in which the first portion and the electrode are spaced apart and the second portion and the electrode are in contact with one another by relative movement between the electrode and the holding member. In this case, a plating process of a desired thickness can be applied to the plurality of objects to be plated. As a result, production throughput can be improved.

[0018] In the above-mentioned another aspect, the plate may further include a control unit that controls the drive unit. The control unit may control the drive unit so that after plating is performed on the object to be plated with the first location and the electrode in contact with each other, the state where the first location and the electrode are in contact with each other is switched to a state where the first location and the electrode are separated from each other and the second location and the electrode are in contact with each other. In this case, after plating is performed on the object to be plated with the first location and the electrode in contact with each other, the state is switched to a state where the first location is separated from the electrode and the second location and the electrode are in contact with each other. Therefore, plating to a desired thickness can be applied to the first location, which was difficult to plate in the plating process with the first location and the electrode in contact with each other.

[0019] In the above-mentioned another aspect, the electrode that applies a potential to the plating object may include first and second electrode terminals that face each other. When the first location and the electrode are in contact with each other, the first location and the first electrode terminal may be in contact with each other. When the second location and the electrode are in contact with each other, the second location and the second electrode terminal may be in contact with each other. In this case, since the first electrode terminal and the second electrode terminal face each other, the position where the electrode and the plating object are in contact can be easily switched.

[0020] In the above-mentioned another aspect, the first and second electrode terminals may extend in a direction intersecting a direction in which the first and second electrode terminals face each other. In this case, a plating process of a desired thickness can be performed on a plurality of plating objects. As a result, production throughput can be improved.

[0021] In the above-mentioned another aspect, the driving unit may switch between a state in which the first location of each of the plurality of plating parts, each of which includes a first location and a second location, is in contact with the electrode and a state in which the first location of each of the plating parts is separated from the electrode and the second location of each of the plating parts is in contact with the electrode by the relative movement. The plurality of plating parts may be included in the plating object and separated from each other. In this case, plating processing can be performed in parallel on the plurality of plating parts that are separated from each other. This can reduce the time required for plating processing.

[0022] In the above-mentioned another aspect, the first and second locations may be included in a side surface located between a pair of opposing end surfaces of the object to be plated. In this case, the plating process can be performed without contacting the electrode with the end surface to which plating is difficult to be applied. This can reduce the variation in plating thickness between each end surface and the side surface.

[0023] In the above-mentioned another aspect, the driving unit may perform the relative movement by applying a force to the electrode. In this case, damage to the object to be plated is reduced. Effect of the Invention

[0024] One aspect of the present invention provides a method for manufacturing electronic components that can suppress the occurrence of cracks and can plate a desired thickness. Another aspect of the present invention provides an apparatus for manufacturing electronic components that can suppress the occurrence of cracks and can plate a desired thickness. [Brief description of the drawings]

[0025] [Figure 1] 1 is a schematic diagram of an electronic component manufacturing apparatus according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a partial cross-sectional view of a portion of the manufacturing apparatus. [Diagram 3] FIG. [Figure 4] FIG. [Diagram 5] FIG. 1 is a diagram showing an example of an object to be plated. [Figure 6] 1(a) to 1(d) are diagrams showing the positional relationship between an object to be plated and a holding member. [Figure 7] 11A and 11B are diagrams showing the positional relationship between a holding member and an outer frame. [Figure 8] 13(a) and (b) are diagrams showing the positional relationship between a holding member and an electrode frame. [Figure 9] 1A to 1D are diagrams showing the positional relationship between the electrodes and the electrode frame. [Figure 10] FIG. 4 is a partial enlarged view of an electrode frame on which electrodes are provided. [Figure 11] 13(a) and (b) are diagrams showing the positional relationship between a holding member and an electrode frame. [Figure 12] 4 is a flowchart showing a method for manufacturing an electronic component in the present embodiment. [Figure 13] 13(a) and 13(b) are views for explaining a step in which the holding member is housed in the outer frame. [Figure 14] 5(a) and 5(b) are plan views for explaining the relative movement between the holding member and the electrode frame. FIG. [Figure 15] 5(a) to 5(c) are partial enlarged views for explaining the relative movement between the holding member and the electrode frame. [Figure 16] FIG. 11 is a side view of a holding member in a modified example of the embodiment. [Figure 17] 13(a) and 13(b) are diagrams showing the configuration of a holding member in a modified example of the present embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0026] Hereinafter, an embodiment of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent elements are designated by the same reference numerals, and duplicated descriptions will be omitted.

[0027] First, the configuration of the electronic component manufacturing apparatus in this embodiment will be described with reference to FIG. 1 to FIG. 11. FIG. 1 to FIG. 4 show an example of the electronic component manufacturing apparatus in this embodiment. The manufacturing apparatus 1 includes an outer frame 11, a holding member 12, a pair of electrode frames 13, an electrode 14, wiring 15, a driving unit 16, and a control unit 18. In this embodiment, the X-axis, the Y-axis, and the Z-axis are defined based on the outer frame 11. The X-axis, the Y-axis, and the Z-axis are perpendicular to each other. FIG. 1 is a schematic diagram of the manufacturing apparatus. In FIG. 1, a part excluding the control unit 18 is shown in a front view. FIG. 2 is a cross-sectional view of the manufacturing apparatus 1 excluding the control unit 18. FIG. 3 is a plan view of the manufacturing apparatus 1 excluding the control unit 18. FIG. 4 is a perspective view of the manufacturing apparatus 1 excluding the control unit 18.

[0028] The manufacturing apparatus 1 performs a plating process on the object 5 to be plated while immersed in a plating solution. By performing the plating process on the object 5 to be plated, an electronic component is formed. Hereinafter, in this specification, "plating process" means plating process on the object 5 to be plated. An electronic component formed by plating the object 5 to be plated is, for example, a capacitor component. The object 5 to be plated is, for example, a chip before being subjected to plating process. The chip includes, for example, an element body and a sintered electrode. For example, the plating process imparts plating to the sintered electrode.

[0029] Fig. 5 is a diagram showing an example of an object to be plated 5. As shown in Fig. 5, the object to be plated 5 has a pair of end faces 6 facing each other and a side face 7 located between the pair of end faces 6. In this embodiment, the object to be plated 5 has a rectangular parallelepiped shape. In Fig. 5, direction D1 is a direction in which the pair of end faces 6 face each other, direction D2 is a direction intersecting direction D1, and direction D3 is a direction intersecting direction D1 and direction D2.

[0030] The side surface 7 includes a pair of side surfaces 7a, 7b facing each other in the direction D2, and a pair of side surfaces 7c, 7d facing each other in the direction D3. In other words, the pair of end faces 6 are located on opposite sides to each other in the direction D1. The pair of side surfaces 7a, 7b are located on opposite sides to each other in the direction D2. The pair of side surfaces 7c, 7d are located on opposite sides to each other in the direction D3. In this embodiment, the directions D1, D2, and D3 are mutually orthogonal. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges.

[0031] The object 5 has a plurality of plated parts 8a, 8b spaced apart from each other. The object 5 has a pair of plated parts 8a, 8b spaced apart from each other on a pair of end faces 6. Each of the plated parts 8a, 8b is plated. Each of the plated parts 8a, 8b includes a sintered electrode. Each of the plated parts 8a, 8b constitutes the entire corresponding end face 6, and constitutes a part of each of the side faces 7a, 7b and a part of each of the side faces 7c, 7d. The sintered electrode of each of the plated parts 8a, 8b covers a part of the element body 9, and the element body 9 is exposed in the part where the sintered electrode is not provided. The sintered electrode of each of the plated parts 8a, 8b includes at least one of copper, silver, nickel, and palladium as a material, for example.

[0032] The outer frame 11 accommodates the pair of electrode frames 13 and the holding member 12. The outer frame 11 ensures the robustness of the entire manufacturing apparatus 1. At least when performing plating, the outer frame 11 is immersed in a plating solution, and the plating solution penetrates into the outer frame 11. The outer frame 11 has a bottom plate portion 11a, a pair of side wall portions 11b, and a pair of reinforcing portions 11c. The pair of side wall portions 11b face each other in the X-axis direction. Each side wall portion 11b extends in the Z-axis direction and is disposed perpendicular to the bottom plate portion 11a. Each reinforcing portion 11c extends in the X-axis direction and connects the pair of side wall portions 11b. Each reinforcing portion 11c is located on the opposite side of the bottom plate portion 11a across the pair of side wall portions 11b. The outer frame 11 has insulating properties and contains, for example, a resin.

[0033] The holding member 12 holds the object 5 to be plated. FIGS. 6(a) to 6(d) show a state in which the object 5 to be plated is held by the holding member 12. The holding member 12 holds each of the objects 5 to be plated in a state in which the objects 5 to be plated are spaced apart from one another. In this embodiment, the holding member 12 has a silicone member 21 and a pair of plate materials 22. The holding member 12 is configured by sandwiching the silicone member 21 between the pair of plate materials 22. The pair of plate materials 22 prevents the silicone member 21 from losing its shape. The silicone member 21 is insulating and contains silicone. Each plate material 22 contains, for example, stainless steel.

[0034] The silicone member 21 has a plurality of holes 21a. The pair of plate materials 22 has a plurality of holes 22a corresponding to the plurality of holes 21a. Each hole 21a is smaller than each hole 22a. One object 5 to be plated is fitted into each hole 22a and hole 21a. The object 5 to be plated is in contact with the edge of the hole 21a but is not in direct contact with the edge of the hole 22a. Each object 5 to be plated is held by the elasticity and friction of the silicone member 21. The plurality of holes 22a are, for example, circular.

[0035] 6(a) and 6(d), when viewed from the thickness direction of the pair of plate materials 22, the holding member 12 has a plurality of holes 22a arranged in a matrix. Similarly, the holding member 12 has a plurality of holes 21a arranged in a matrix. When the holding member 12 is housed in the outer frame 11, the thickness direction of the pair of plate materials 22 coincides with the Y-axis direction. Each of the objects 5 to be plated is inserted into the corresponding hole 21a, 22a and arranged to pass through the holding member 12.

[0036] In this embodiment, each object 5 to be plated is held by the holding member 12 such that direction D1 in which the pair of end faces 6 face each other coincides with the thickness direction of the pair of plate materials 22. Each object 5 to be plated is held by the holding member 12 such that direction D2 in which the pair of side faces 7a, 7b face each other coincides with the direction perpendicular to the thickness direction of the pair of plate materials 22 and the X-axis direction. When the holding member 12 is accommodated in the outer frame 11, direction D1 coincides with the Y-axis direction, direction D2 coincides with the X-axis direction, and direction D3 coincides with the Z-axis direction.

[0037] Fig. 7 shows a state in which the holding member 12 is housed in the outer frame 11. In Fig. 7, the electrode frame 13 and the electrodes 14 have been removed. The holding member 12 is fixed at least in the X-axis direction and the Y-axis direction when housed in the outer frame 11. In other words, when housed in the outer frame 11, movement of the holding member 12 is restricted at least in the X-axis direction and the Y-axis direction.

[0038] As shown in Figs. 2 and 4, a pair of electrode frames 13 are housed in an outer frame 11. Figs. 8(a) and 8(b) are diagrams showing the positional relationship between the holding member and the electrode frames. An electrode 14 is arranged in each electrode frame 13. Each electrode frame 13 positions the electrode 14. The pair of electrode frames 13 are arranged opposite each other to form a space in which the holding member 12 is arranged. As shown in Figs. 8(a) and 8(b), when plating is performed, the holding member 12 is arranged between the pair of electrode frames 13. Each electrode frame 13 has insulating properties and contains, for example, resin.

[0039] 9(a) to 9(d) show the positional relationship between the electrode frame 13 and the electrodes 14. FIG. 10 is a partial enlarged view of region R1 in FIG. 9(d). FIGS. 9(a) to 9(d) and 10 show one electrode frame 13, and the electrodes 14 and wiring 15 corresponding to the electrode frame 13. Each electrode frame 13 is provided with a plurality of slits 31. Each slit 31 extends in the Z-axis direction. Each slit 31 is arranged parallel to one another in the X-axis direction. The electrodes 14 are arranged along edges 31a of the slits 31. The edges 31a extend in the Z-axis direction. Each electrode frame 13 is provided with wiring 15 connected to the electrodes 14 provided in the electrode frame 13.

[0040] In this embodiment, the pair of electrode frames 13 are movable, and are moved in the X-axis direction relative to the outer frame 11 and the holding member 12 by the driving unit 16. The pair of electrode frames 13 are reciprocated in the X-axis direction by the driving unit 16.

[0041] The electrode 14 applies a potential to the object 5 to be plated in the plating process. The electrode 14 is provided on each electrode frame 13. In this embodiment, the electrode 14 includes a plurality of electrode terminals 14a, 14b. A pair of the electrode terminals 14a, 14b is arranged along each slit 31. The pair of electrode terminals 14a, 14b corresponding to each slit 31 face each other in the X-axis direction. In other words, the pair of electrode terminals 14a, 14b face each other in the Y-axis direction. The plurality of electrode terminals 14a, 14b extend in the Z-axis direction. Each of the plurality of electrode terminals 14a, 14b extends in parallel to each other. The electrode terminal 14a is a first electrode terminal, and the electrode terminal 14b is a second electrode terminal.

[0042] 11(a) and 11(b) are diagrams showing the positional relationship between the holding member and the electrode frame. As shown in FIG. 11(b), the electrode 14 contacts a first location 10a and a second location 10b included in each of the plurality of plating target portions 8a, 8b during plating. The first location 10a and the second location 10b are located in predetermined different locations on the plating target object 5. In this embodiment, the first location 10a is included in the side surface 7a. The second location 10b is included in the side surface 7b. The electrode terminal 14a contacts the first location 10a, and the electrode terminal 14b contacts the second location 10b.

[0043] In this embodiment, the electrode 14 includes two electrode terminals 14a and two electrode terminals 14b for one plating object 5. In this embodiment, in the plating process, one of the two electrode terminals 14a contacts the first location 10a of the plating object 8a, and the other contacts the first location 10a of the plating object 8b. In the plating process, one of the two electrode terminals 14b contacts the second location 10b of the plating object 8a, and the other contacts the second location 10b of the plating object 8b. A plurality of plating objects 5 contact one of the electrode terminals 14a and 14b in parallel in time. A plurality of plating objects 5 arranged in the Z-axis direction contact each of the electrode terminals 14a and 14b. A plurality of plating objects 5 arranged in the same row contact the same electrode terminals 14a and 14b.

[0044] The electrode terminal 14a and the electrode terminal 14b are connected to each other and have the same polarity. The electrode terminal 14a and the electrode terminal 14b are, for example, cathodes. The electrode terminal 14a and the electrode terminal 14b are at the same potential.

[0045] The electrode 14 comes into contact with the object 5 to be plated due to the relative movement between the holding member 12 and the electrode frame 13. The electrode 14 comes into contact with the object 5 to be plated during the plating process. The wiring 15 is connected to the electrode 14. The wiring 15 is connected to a power source (not shown). During the plating process, a potential is applied to the electrode 14 via the wiring 15.

[0046] The driving unit 16 performs relative movement between the holding member 12 and the pair of electrode frames 13. This causes relative movement between the holding member 12 and the electrodes 14. The driving unit 16 performs relative movement between the electrodes and the multiple objects to be plated 5 held by the holding member 12 so that the objects to be plated 5 and the electrodes 14 have a predetermined positional relationship. The driving unit 16 performs the above-mentioned relative movement by applying a force to at least one of the holding member 12 and the pair of electrode frames 13. In this embodiment, the driving unit 16 applies a force to each electrode frame 13 to move the electrode frame 13 in the X-axis direction relative to the holding member 12. In other words, the driving unit 16 applies a force to the electrode 14 via the electrode frame 13 to move the electrode 14 in the X-axis direction relative to the objects to be plated 5.

[0047] The drive unit 16 switches, by the above-mentioned relative movement, between a state in which the first point 10a of the object 5 and the electrode 14 are in contact with each other and a state in which the first point 10a and the electrode 14 are separated and the second point 10b of the object 5 and the electrode 14 are in contact with each other. In this embodiment, the drive unit 16 switches, by the above-mentioned relative movement, between a state in which the first point 10a is in contact with the electrode terminal 14a and a state in which the second point 10b is in contact with the electrode terminal 14b. As a result, either the first point 10a or the second point 10b is in contact with the electrode 14.

[0048] The drive unit 16 includes, for example, a pair of rails 61 and a power unit 62. As shown in Figs. 3 and 4, each rail 61 extends in the X-axis direction and engages with a corresponding electrode frame. In this embodiment, each electrode frame 13 moves in the X-axis direction along the corresponding rail 61 by a force applied from the power unit 62. The power unit 62 is, for example, fixed to the electrode frame 13, and applies a force in the X-axis direction to the corresponding rail 61. In this case, the power unit 62 has, for example, a motor (not shown) that abuts against the corresponding rail 61 to transmit a rotational force.

[0049] The control unit 18 controls the driving unit 16. The control unit 18 includes, for example, a microcomputer. The control unit 18 controls the driving unit 16 based on data input by a user and data stored in advance. For example, the control unit 18 controls the driving unit 16 so that a state is formed in which the second location 10b and the electrode 14 are spaced apart from each other and the first location 10a and the electrode 14 are in contact with each other. After a plating process is performed in a state in which the first location 10a and the electrode 14 are in contact with each other, the control unit 18 controls the driving unit 16 so that the state is switched from the state in which the first location 10a and the electrode 14 are in contact with each other to the state in which the first location 10a and the electrode 14 are spaced apart from each other and the second location 10b and the electrode 14 are in contact with each other.

[0050] The control unit 18 may further control the drive unit 16 so as to switch from a state in which the second location 10b and the electrode 14 are in contact with each other to a state in which the second location 10b and the electrode 14 are separated from each other and the first location 10a and the electrode 14 are in contact with each other after the plating process is performed in a state in which the second location 10b and the electrode 14 are in contact with each other. In this embodiment, the control unit 18 controls the drive unit 16 so that the electrode terminal 14a is in contact with the first location 10a in a state in which the first location 10a and the electrode 14 are in contact with each other, and the electrode terminal 14b is in contact with the second location 10b in a state in which the second location 10b and the electrode 14 are in contact with each other.

[0051] Next, a method for manufacturing an electronic component in this embodiment will be described with reference to Figs. 12 to 15. Fig. 12 is a flow chart showing the method for manufacturing an electronic component in this embodiment. Figs. 13(a) and 13(b) are views for explaining the step of housing the holding member 12 in the outer frame 11. Figs. 14(a) and 14(b) are plan views for explaining the relative movement between the holding member 12 and the electrode frame 13. Figs. 15(a) to 15(c) are partial enlarged views for explaining the relative movement between the holding member 12 and the electrode frame 13. Figs. 15(a) to 15(c) are partial enlarged views of the region R2 in Figs. 14(a) and 14(b). The dashed and dotted lines γ1 and γ2 indicate reference positions based on the object 5 to be plated.

[0052] First, the objects to be plated 5 are held by the holding member 12 (step S1). The holding member 12 holds the objects to be plated 5 in a state in which they are spaced apart from one another.

[0053] Next, the holding member 12 is accommodated inside the outer frame 11 (step S2). As shown in Figs. 13(a) and 13(b), the holding member 12, which holds multiple plating objects 5, is accommodated inside the outer frame 11 by moving in the direction of arrow α. The direction of arrow α coincides with the Z-axis direction. At this time, the holding member 12 is inserted between a pair of electrode frames 13. In step S2, the outer frame 11 is already immersed in the plating solution. As a modification of this embodiment, the outer frame 11 may be immersed in the plating solution together with the holding member 12 after step S2.

[0054] Next, the first location 10a of the object 5 to be plated is brought into contact with the electrode 14 (step S3). By moving the object 5 to be plated and the electrode 14 relatively, the second location 10b is separated from the electrode 14 and the first location 10a is brought into contact with the electrode 14. In this case, the drive unit 16 moves the holding member 12 and the electrode frame 13 relatively. For example, the drive unit 16 applies a force to the electrode frame 13 and the electrode 14 provided on the electrode frame 13 to perform the above-mentioned relative movement. As a result, as shown in FIG. 14(a) and FIG. 15(a), a state is formed in which the first location 10a and the electrode terminal 14a are in contact with each other.

[0055] As shown in FIG. 15(a), the movement of the electrode frame 13 by the driving unit 16 causes the first location 10a and the electrode terminal 14a in each of the plating target portions 8a, 8b to be separated from each other and to be in contact with each other. Therefore, the electrode 14 contacts the first location 10a of the plating target portion 8a and the first location 10a of the plating target portion 8b in parallel in time. In this embodiment, the first location 10a of the plating target portion 8a and the first location 10a of the plating target portion 8b contact different electrode terminals 14a that are separated from each other. Each electrode terminal 14a has the same polarity.

[0056] Next, in a state where the first location 10a and the electrode 14 are in contact with each other, a plating process is performed (step S4). In a state where the second location 10b and the electrode 14 are separated from each other and the first location 10a and the electrode 14 are in contact with each other, a potential is applied to the electrode 14. In this embodiment, in a state where the first location 10a and the electrode 14 are in contact with each other, the first location 10a and the electrode terminal 14a are in contact with each other. As a result, a potential is applied to the plated portions 8a, 8b of the plating object 5 via the electrode terminal 14a, and the plating process is performed.

[0057] In this embodiment, the plating process of the parts 8a and 8b to be plated in step S4 is performed in parallel. A potential is applied to the parts 8a and 8b to be plated by different electrode terminals 14a that are spaced apart from each other. The potentials applied to the parts 8a and 8b to be plated are, for example, equipotential. During the plating process, the driving unit 16 is stopped.

[0058] Next, the second location 10b of the object 5 to be plated is brought into contact with the electrode 14 (step S5). By moving the object 5 to be plated and the electrode 14 relatively, the first location 10a is separated from the electrode 14 and the second location 10b is brought into contact with the electrode 14. In this case, the drive unit 16 moves the holding member 12 and the electrode frame 13 relatively. For example, the drive unit 16 applies a force to the electrode frame 13 and the electrode 14 provided on the electrode frame 13 to perform the above-mentioned relative movement. The drive unit 16 moves the electrode frame 13 and the electrode 14 in the direction of the arrow β from the state shown in FIG. 14(a) to the state shown in FIG. 14(b). As a result, the electrode 14 changes from a state in contact with the first portion 10a as shown in Fig. 15(a) to a state in which it is not in contact with either the first portion 10a or the second portion 10b as shown in Fig. 15(b), and then to a state in which it is in contact with the second portion 10b as shown in Fig. 15(c). As shown in Fig. 14(b) and Fig. 15(c), a state in which the second portion 10b and the electrode terminal 14b are in contact with each other is formed.

[0059] As shown in FIG. 15(c), the movement of the electrode frame 13 by the driving unit 16 causes the second location 10b and the electrode terminal 14b in each of the plating target portions 8a, 8b to be separated from each other, and the second location 10b and the electrode terminal 14b to be in contact with each other. Therefore, the electrode 14 contacts the second location 10b of the plating target portion 8a and the second location 10b of the plating target portion 8b in parallel in time. In this embodiment, the second location 10b of the plating target portion 8a and the second location 10b of the plating target portion 8b contact different electrode terminals 14b that are separated from each other. Each electrode terminal 14b has the same polarity.

[0060] Next, in a state where the second location 10b and the electrode 14 are in contact with each other, a plating process is performed (step S6). In a state where the first location 10a and the electrode 14 are separated from each other and the second location 10b and the electrode 14 are in contact with each other, a potential is applied to the electrode 14. In this embodiment, in a state where the second location 10b and the electrode 14 are in contact with each other, the second location 10b and the electrode terminal 14b are in contact with each other. As a result, a potential is applied to the plated portions 8a, 8b of the plating object 5 via the electrode terminal 14b, and the plating process is performed.

[0061] In this embodiment, the plating process of the parts 8a and 8b to be plated is performed in parallel in step S6. A potential is applied to the parts 8a and 8b to be plated by different electrode terminals 14b spaced apart from each other. The potentials applied to the parts 8a and 8b to be plated are, for example, equipotential. During the plating process, the driving unit 16 is stopped.

[0062] In steps S3, S4, S5, and S6, a potential may be constantly applied to the electrode 14, or a potential may be constantly applied to the electrode 14 only in steps S4 and S6. When a potential is constantly applied to the electrode 14, step S4 starts at the same time that the first location 10a and the electrode 14 are brought into contact with each other in step S3, and step S6 starts at the same time that the second location 10b and the electrode 14 are brought into contact with each other in step S5. Steps S3 and S4 may be performed in the reverse order to steps S5 and S6.

[0063] Next, the effects of the electronic component manufacturing method and manufacturing apparatus according to this embodiment will be described.

[0064] In the above-described method for manufacturing electronic components, the plating process is performed on the object 5 in a state where the first location 10a and the electrode 14 are in contact with each other in step S4, and then the electrode 14 and the object 5 are moved relatively in step S5. Thereafter, in step S6, the plating process is performed in a state where the first location 10a and the electrode 14 are spaced apart from each other and the second location 10b and the electrode 14 are in contact with each other. Therefore, the first location 10a, which was difficult to plate in step S4, can be plated to a desired thickness in step S6. Therefore, compared to the case where a barrel is used, the occurrence of cracks is suppressed and a plating process to a desired thickness can be performed.

[0065] In plating using a barrel, not only multiple objects to be plated but also multiple plating media are placed in the barrel. Therefore, plating using a barrel requires the work of removing the plating media after plating, making it difficult to improve production throughput. However, the above-mentioned manufacturing method improves production throughput compared to plating using a barrel.

[0066] The manufacturing method in the above-described embodiment includes a step S1 in which the plurality of objects 5 to be plated are held by a holding member 12 while the objects 5 are spaced apart from one another. In step S5, the electrode 14 and the holding member 12 are moved relative to one another, so that the first location 10a and the electrode 14 are spaced apart from one another and the second location 10b and the electrode 14 are in contact with one another. This allows the plurality of objects 5 to be plated to a desired thickness. As a result, production throughput can be improved.

[0067] The electrode 14 that applies a potential to the object 5 to be plated includes electrode terminals 14a and 14b that face each other. When the first location 10a and the electrode 14 are in contact with each other, the first location 10a and the electrode terminal 14a are in contact with each other. When the second location 10b and the electrode 14 are in contact with each other, the second location 10b and the electrode terminal 14b are in contact with each other. Therefore, since the electrode terminal 14a and the electrode terminal 14b face each other, the position where the object 5 to be plated and the electrode 14 are in contact with each other can be easily switched. For example, the position where the object 5 to be plated and the electrode 14 are in contact with each other can be easily switched by simply moving the electrode 14 and the object 5 to be plated in the X-axis direction.

[0068] The electrode terminals 14a, 14b extend in the Z-axis direction intersecting with the X-axis direction in which the electrode terminals 14a, 14b face each other. This allows the plating process to be easily performed on a plurality of objects 5 to be plated. For example, the plurality of objects 5 to be plated can be easily brought into contact with the same electrode terminal. As a result, the plating processes are performed in parallel in terms of time, which can improve production throughput.

[0069] The object 5 to be plated has a plurality of parts to be plated 8a, 8b. Each of the plurality of parts to be plated 8a, 8b includes a first portion 10a and a second portion 10b, and is spaced apart from each other. In step S4, the object 5 to be plated is plated by applying a potential to the electrode 14 in a state in which the first portion 10a of each of the parts to be plated 8a, 8b is in contact with the electrode 14. In step S6, the object 5 to be plated is plated by applying a potential to the electrode 14 in a state in which the first portion 10a of each of the parts to be plated 8a, 8b is in contact with the electrode 14, and the second portion 10b of each of the parts to be plated 8a, 8b is in contact with the electrode 14. Therefore, the plurality of parts to be plated 8a, 8b that are spaced apart from each other are plated in parallel. Therefore, the time required for the plating is reduced.

[0070] The object 5 to be plated has a pair of end faces 6 facing each other, and a side face 7 located between the pair of end faces 6. The first location 10a and the second location 10b are included in the side face 7. For this reason, plating is performed without bringing the electrode 14 into contact with the end face 6, which is difficult to plate. Therefore, variation in the thickness of the plating between each end face 6 and the side face 7 can be reduced.

[0071] In step S5, the relative movement is performed by applying a force to the electrode 14. Since the relative movement is performed without applying a force to the object 5 to be plated, damage to the object 5 to be plated is reduced.

[0072] In the electronic component manufacturing apparatus 1 described above, the driving unit 16 switches between a state in which the first location 10a and the electrode 14 are in contact with each other and a state in which the second location 10b and the electrode 14 are in contact with each other. Therefore, even in the first location 10a where plating is difficult to impart in a plating process in which the first location 10a and the electrode 14 are in contact with each other, plating can be imparted to a desired thickness in a plating process in which the second location 10b and the electrode 14 are in contact with each other. Therefore, plating can be performed to a desired thickness while suppressing the occurrence of cracks.

[0073] The manufacturing apparatus 1 includes a holding member 12. The holding member 12 holds the plurality of objects 5 to be plated in a state in which the objects 5 are spaced apart from one another. The driving unit 16 switches between a state in which the first point 10a of the objects 5 to be plated and the electrode 14 are in contact with one another and a state in which the first point 10a and the electrode 14 are spaced apart from one another and the second point 10b and the electrode 14 are in contact with one another by moving the electrode 14 relative to one another. This allows plating of a desired thickness to be applied to the plurality of objects 5 to be plated. As a result, production throughput can be improved.

[0074] The apparatus includes a control unit 18 that controls the drive unit 16. After a plating process is performed with the first location 10a and the electrode 14 in contact with each other, the control unit 18 controls the drive unit 16 so as to switch from a state in which the first location 10a and the electrode 14 are in contact with each other to a state in which the first location 10a and the electrode 14 are separated from each other and the second location 10b and the electrode 14 are in contact with each other. Therefore, plating can be applied to a desired thickness even at the first location 10a, which was difficult to plate during plating when the first location 10a and the electrode 14 were in contact with each other.

[0075] The driving unit 16, by relative movement, switches between a state in which the first locations 10a in each of the portions to be plated 8a, 8b, each of which includes a first location 10a and a second location 10b, contact the electrode 14 and a state in which the second locations 10b in each of the portions to be plated 8a, 8b contact the electrode 14. The portions to be plated 8a, 8b are separated from each other and included in the object to be plated 5. Therefore, plating can be performed in parallel on the portions to be plated 8a, 8b that are separated from each other.

[0076] Although the embodiment of the present invention has been described above, the present invention is not necessarily limited to the above-described embodiment, and various modifications are possible without departing from the gist of the present invention.

[0077] For example, in the above-mentioned embodiment, a capacitor component has been described as an example of an electronic component formed by plating the object 5, but the present invention is not limited to this. For example, the above-mentioned manufacturing method and manufacturing apparatus can also be applied to other electronic components such as a laminated coil component, a laminated varistor, a laminated piezoelectric actuator, a laminated thermistor, or a laminated composite component.

[0078] In the above-described embodiment, the first location 10a and the second location 10b of the object 5 to be plated are in contact with different electrode terminals 14a, 14b of the electrode 14, respectively, when a potential is applied to the object 5 to be plated. However, the first location 10a and the second location 10b of the object 5 to be plated may be in contact with the same electrode terminal of the electrode 14 due to relative movement between the electrode 14 and the object 5 to be plated, when a potential is applied to the object 5 to be plated.

[0079] In the above-described embodiment, the plurality of objects 5 to be plated arranged in the same row are in contact with the same electrode terminals 14a, 14b. However, the plurality of objects 5 to be plated may be in contact with different electrode terminals 14a, 14b for each object 5 to be plated. The plurality of objects 5 to be plated may be in contact with different electrode terminals 14a, 14b for each portion to be plated.

[0080] In the above-described embodiment, an example has been described in which the electrode 14 comes into contact with the first location 10a and the second location 10b once each due to the relative movement caused by the driving unit 16. However, the electrode 14 may come into contact with the first location 10a and the second location 10b multiple times each in one plating process by repeating the relative movement caused by the driving unit 16.

[0081] In the above-described embodiment, the driving unit 16 applies a force only to the electrode frame 13 to move the electrode frame 13 in the X-axis direction. However, the driving unit 16 may apply a force to at least one of the object to be plated 5 and the electrode frame 13 to move the at least one of them in the X-axis direction. In step S4, the driving unit 16 may move at least one of the object to be plated 5 and the electrode frame 13 in two directions instead of one direction. In step S4, the driving unit 16 may rotate the object to be plated 5 to bring the first location 10a and the second location 10b into contact with the same electrode terminal.

[0082] In the above-described embodiment, plating is applied to the sintered electrodes of the chip in the plating process. However, the chip may further include a resin electrode layer provided on the sintered electrodes, and plating may be applied to the resin electrode layer in the plating process. In this case, each of the plated portions 8a and 8b includes a resin electrode layer. This resin electrode layer is, for example, a thermosetting conductive resin layer containing Cu as a metal component and, for example, an epoxy or phenolic resin component as a resin component.

[0083] In the above-described embodiment, the manufacturing apparatus 1 includes a holding member 12. The holding member 12 is configured by sandwiching a silicone member 21 between a pair of plate members 22. The manufacturing apparatus 1 may include a holding member 72 shown in FIG. 16, FIG. 17(a), and FIG. 17(b) instead of the holding member 12. When the holding member 72 is used, the holding member 72 is housed in the outer frame 11 instead of the holding member 12. FIG. 16 is a side view of the holding member 72. FIG. 17(a) shows a cross section of the holding member 72 shown in FIG. 16 taken along the line S1-S1. FIG. 17(b) shows a cross section of the holding member 72 shown in FIG. 16 taken along the line S2-S2.

[0084] As shown in Fig. 16, the holding member 72 has a plurality of holes 72a. Each hole 72a corresponds to holes 21a and 22a of the holding member 12. The plurality of holes 72a are arranged in a matrix. The plurality of holes 72a are arranged at equal intervals. One object 5 to be plated is fitted into each hole 72a. Each object 5 to be plated is inserted into the corresponding hole 72a and disposed so as to pass through the holding member 12. The plurality of holes 72a are, for example, circular.

[0085] Each object 5 to be plated is held by the holding member 72 such that the direction D1 in which the pair of end faces 6 face each other coincides with the thickness direction of the holding member 12, as in the case where the object 5 is held by the holding member 72. Each object 5 to be plated is held by the holding member 72 such that the direction D2 in which the pair of side faces 7a, 7b face each other coincides with the direction perpendicular to the thickness direction of the holding member 72 and the X-axis direction. When the holding member 72 is housed in the outer frame 11, the thickness direction of the holding member 72 coincides with the Y-axis direction. When the holding member 72 is housed in the outer frame 11, the direction D1 coincides with the Y-axis direction, the direction D2 coincides with the X-axis direction, and the direction D3 coincides with the Z-axis direction.

[0086] As shown in Fig. 17(a) and Fig. 17(b), the holding member 72 has, for example, a silicone member 81 and a plate material 82. In the holding member 72, the plate material 82 is covered by the silicone member 81. In this case, even when a plating process is performed, plating of the plate material 82 is suppressed. For example, the plate material 82 is not exposed from the silicone member 81. The plate material 82 prevents the silicone member 81 from losing its shape. The silicone member 81 has insulating properties and contains silicone. The plate material 82 contains, for example, stainless steel.

[0087] 17(b), the silicone member 81 is provided with a plurality of holes 81a corresponding to the plurality of holes 72a. The holes 72a and the holes 81a are located in one-to-one correspondence. The plate material 82 is provided with a plurality of holes 82a corresponding to the plurality of holes 81a. The holes 81a and the holes 82a are located in one-to-one correspondence. When viewed from the thickness direction of the holding member 12, the plurality of holes 81a and the plurality of holes 82a are arranged in a matrix. When the holding member 72 is housed in the outer frame 11, the thickness direction of the plate material 82 coincides with the Y-axis direction.

[0088] Each hole 81a is smaller than each hole 82a. The silicone member 81 covers the entire edge of each hole 82a of the plate material 82. Each hole 72a of the holding member 72 is defined by the silicone member 81. The object 5 to be plated contacts the edge of the corresponding hole 81a, but does not directly contact the edge of the hole 82a. Each object 5 to be plated is held by the elasticity and friction of the silicone member 81. [Explanation of symbols]

[0089] 1... manufacturing apparatus, 5... object to be plated, 6... end surface, 7, 7a, 7b... side surface, 8a, 8b... part to be plated, 10a... first location, 10b... second location, 12, 72... holding member, 14... electrode, 14a, 14b... electrode terminal, 16... drive unit, 18... control unit.

Claims

1. A first contact step of contacting a first electrode terminal of a first and second electrode terminals facing each other included in an electrode that applies a potential to an object to be plated with a first location on the object to be plated; a first plating step of performing a plating process on the object to be plated by applying a potential to the first electrode terminal in a state in which the first location and the first electrode terminal are in contact with each other; a second contacting step of moving the object to be plated and the electrode relatively in a direction in which the first electrode terminal and the second electrode terminal face each other after the first plating step, thereby forming a state in which the first location and the first electrode terminal are separated from each other and a second location of the object to be plated, which is different from the first location, and the second electrode terminal are in contact with each other; a second plating step of performing a plating process on the object to be plated by applying a potential to the second electrode terminal while the first location and the first electrode terminal are spaced apart from each other and the second location and the second electrode terminal are in contact with each other after the second contact step.

2. The object to be plated has first and second end faces opposing each other, and first and second side faces located between the first and second end faces and opposing each other, and includes a first plated portion covering the first end face and portions of the first and second side faces, and a second plated portion spaced apart from the first plated portion and covering the second end face and portions of the first and second side faces; The first location is a portion of the first and second plated portions that is located on the first side surface, The method for manufacturing an electronic component according to claim 1 , wherein the second location is a portion of the first and second plated portions that is located on the second side surface.

3. The electrode further includes a third electrode terminal facing the first electrode terminal in a direction intersecting the direction in which the first electrode terminal and the second electrode terminal face each other, and a fourth electrode terminal facing the second electrode terminal in a direction intersecting the direction in which the first electrode terminal and the second electrode terminal face each other and facing the third electrode terminal in the direction in which the first electrode terminal and the second electrode terminal face each other; In the first contacting step, the first electrode terminal is brought into contact with the first location of the first plated portion, and the third electrode terminal is brought into contact with the first location of the second plated portion; in the first plating step, in a state in which the first location of the first plated portion and the first electrode terminal are in contact with each other and the first location of the second plated portion and the third electrode terminal are in contact with each other, a potential is applied to the first and third electrode terminals, thereby performing a plating process on the plated object; In the second contacting step, the second electrode terminal is brought into contact with the second location of the first plated portion, and the fourth electrode terminal is brought into contact with the second location of the second plated portion; 3. The method for manufacturing an electronic component according to claim 2, wherein in the second plating step, a plating process is performed on the object to be plated by applying a potential to the second and fourth electrode terminals while the second location of the first plated portion and the second electrode terminal are in contact with each other and the second location of the second plated portion and the fourth electrode terminal are in contact with each other.

4. The first and second electrode terminals extend in a direction intersecting a direction in which the first and second electrode terminals face each other, In the first contact step, the first electrode terminal is brought into contact with the first location of each of the plating objects using a holding member that holds the plurality of plating objects so that the plating objects are spaced apart from each other and arranged in a direction intersecting a direction in which the first and second electrode terminals face each other, In the first plating step, a plating process is performed on each of the objects to be plated by applying a potential to the first electrode terminal in a state in which the first location of each of the objects to be plated and the first electrode terminal are in contact with each other; in the second contact step, after the first plating step, the holding member and the electrode are moved relatively in a direction in which the first electrode terminal and the second electrode terminal face each other, thereby forming a state in which the first location of each of the plating objects and the first electrode terminal are separated from each other and the second location of each of the plating objects and the second electrode terminal are in contact with each other, 4. The method for manufacturing an electronic component according to claim 1, wherein in the second plating step, after the second contact step, the first location of each of the objects to be plated and the first electrode terminal are spaced apart from each other and the second location of each of the objects to be plated and the second electrode terminal are in contact with each other, a potential is applied to the second electrode terminal to perform a plating process on each of the objects to be plated.

5. A method for manufacturing an electronic component described in any one of claims 1 to 4, wherein in the second contact step, the relative movement is achieved by applying a force to at least one of the electrode and the object to be plated in a direction in which the first electrode terminal and the second electrode terminal face each other.

6. The method for manufacturing an electronic component according to claim 1 , wherein in the second contacting step, the relative movement is performed by applying a force to the electrodes.

7. An electrode including first and second electrode terminals facing each other and applying a potential to an object to be plated in a plating process; a drive unit that relatively moves the object to be plated and the electrode in a direction in which the first electrode terminal and the second electrode terminal face each other so that the object to be plated and the electrode have a predetermined positional relationship; The driving unit switches, by the relative movement, between a state in which a first location of the object to be plated and the first electrode terminal are in contact with each other, and a state in which the first location and the first electrode terminal are separated from each other and a second location of the object to be plated, different from the first location, and the electrode are in contact with each other.

8. The object to be plated has first and second end faces opposing each other, and first and second side faces located between the first and second end faces and opposing each other, and includes a first plated portion covering the first end face and portions of the first and second side faces, and a second plated portion spaced apart from the first plated portion and covering the second end face and portions of the first and second side faces, The first location is a portion of the first and second plated portions that is located on the first side surface, The electronic component manufacturing apparatus according to claim 7 , wherein the second location is a portion of the first and second plating portions that is located on the second side surface.

9. The electrode further includes a third electrode terminal facing the first electrode terminal in a direction intersecting the direction in which the first electrode terminal and the second electrode terminal face each other, and a fourth electrode terminal facing the second electrode terminal in a direction intersecting the direction in which the first electrode terminal and the second electrode terminal face each other and facing the third electrode terminal in the direction in which the first electrode terminal and the second electrode terminal face each other; The electronic component manufacturing apparatus of claim 8, wherein the drive unit switches between a state in which the first location of the first plated portion and the first electrode terminal are in contact with each other and the first location of the second plated portion and the third electrode terminal are in contact with each other, and a state in which the first location of the first plated portion and the first electrode terminal are separated from each other and the first location of the second plated portion and the third electrode terminal are separated from each other, the second location of the first plated portion and the second electrode terminal are in contact with each other, and the second location of the second plated portion and the fourth electrode terminal are in contact with each other, by the relative movement.

10. a holding member that holds the plurality of objects to be plated such that the objects are spaced apart from one another and arranged in a direction intersecting a direction in which the first and second electrode terminals face each other, the first and second electrode terminals extend in a direction intersecting a direction in which the first and second electrode terminals face each other, The electronic component manufacturing apparatus according to any one of claims 7 to 9, wherein the driving unit switches between a state in which a first location of the plating object and the first electrode terminal are in contact with each other and a state in which the first location and the first electrode terminal are separated and the second location and the second electrode terminal are in contact with each other by relatively moving the electrode and the holding member in a direction in which the first electrode terminal and the second electrode terminal face each other.

11. A control unit for controlling the drive unit is further provided. The electronic component manufacturing apparatus of any one of claims 7 to 10, wherein the control unit controls the drive unit so that after a plating process is performed on the object to be plated in a state in which the first location and the electrode are in contact with each other, the state in which the first location and the electrode are in contact with each other is switched to a state in which the first location and the electrode are separated from each other and the second location and the electrode are in contact with each other.

12. An electronic component manufacturing apparatus as described in any one of claims 7 to 11, wherein the relative movement is performed by applying a force to at least one of the electrode and the object to be plated in a direction in which the first electrode terminal and the second electrode terminal face each other.

13. The electronic component manufacturing apparatus according to claim 7 , wherein the drive section performs the relative movement by applying a force to the electrodes.

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