Heat Dissipation Device and Control Device Assembly

Abstract

The present invention relates to a heat dissipation device (10) and a control device assembly in a vehicle with such a heat dissipation device (10), the heat dissipation device (10) comprising a storage space (11) open on at least one side and at least one mosaic segment (14) arranged in the storage space (11), the at least one mosaic segment (14) comprising a thermally conductive and elastic compensation element (16) and a thermally conductive and low-adhesive contact area (18), the at least one mosaic segment (14) being arranged such that the thermally conductive and elastic compensation element (16) of the at least one mosaic segment (14) abuts against an inner surface of a bottom (11.1) of the storage space (11). The mosaic segments are arranged in the storage space (11) in such a way that at least the thermally conductive, low-adhesion contact area (18) of at least one mosaic segment (14) partially protrudes from the storage space (11) on an open side of the storage space (11) opposite the bottom (11.1), the outer surface of the bottom (11.1) of the storage space (11) forming a rigid first contact surface for the heat source (7) or heat sink (9), and the thermally conductive, low-adhesion contact area (18) of the at least one mosaic segment (14) forming a soft second contact surface for the heat sink (9) or heat source (7).

Description

[Technical field]

[0001] The present invention relates to a heat dissipation device, in particular for a control unit assembly in a vehicle.Furthermore, the present invention relates to a control unit assembly, in particular for a vehicle, equipped with such a heat dissipation device. [Background technology]

[0002] From the prior art, different heat dissipation techniques are known for operating electrical modules, such as, for example, control devices, power final stages, etc., or individual electrical components, such as, for example, power semiconductors, microcontrollers, etc., within a certain temperature range. In this case, the thermal coupling of the component, which is the heat source, with a heat sink, such as, for example, a cooling device, plays a major role. In the control device assembly 100 shown in FIG. 7, the control device assembly 100 comprises a control device 3 and a heat sink 9 configured as a cooling device 9A, the control device 3 comprising a housing 4 and at least one heat source 7 arranged inside the housing 4, such as, for example, an electrical module 7A arranged on a printed circuit board 6, the control device 3 being separably connected to the cooling device 9A. In this case, the at least one heat source 7 is thermally coupled to the housing 4 of the control device 3 via a first thermal interface 8. The first thermal interface 8 can, for example, consist of a thermally conductive material 8A, also called thermal interface material (TIM). Thus, for example, a so-called gap filler, preferably made of a thermally conductive elastomer, can be arranged as TIM 8A between the heat source 7 and the heat dissipation dome 5.1 formed on the bottom 5 of the housing 4 and form the first thermal interface 8. Since neither the outwardly flat surface of the cooling device 9A nor the bottom 5 of the housing 4 of the control device, which faces the cooling device 9A, are strictly flat, when the control device 3 is assembled on the cooling device 9A, except for a few resting points in the corresponding mounting area, air gaps LS occur, which prevent good heat dissipation due to their low thermal conductivity. As can be seen from Fig. 7, the heat dissipation paths WAP of the heat generated by the at least one heat source 7 are distributed on first heat dissipation paths WAP1, which dissipate a part of the heat generated by the heat source via the bottom 5 of the housing 4 of the control device 3 and via the mounting area to the cooling device 9A. The second heat dissipation path WAP2 dissipates a portion of the heat generated by the at least one heat source 7 as radiation heat and thermal conduction through air molecules across the gap LS to the cooling device 9A.From the prior art it is known to use thermally conductive materials, such as for example thermally conductive pastes or gap fillers, to bridge the air gap LS, in order to achieve an improved thermal conductivity also between the control device 3 and the cooling device 9A. However, such a solution prevents a simple replacement of the control unit 3, since when removing the control unit 3, residues of the thermally conductive material used remain on the cooling device 9A, which must first be removed by a laborious cleaning process. Furthermore, when fitting the replacement control device, a corresponding thermally conductive material must be provided, which requires a bubble-free deposition, which is demanding and difficult to test. Summary of the Invention [Means for solving the problem]

[0003] Disclosure of the Invention The heat dissipation device with the features of independent claim 1 and the control device assembly with the features of independent claim 11 each have the advantage that irregularities between the heat source and the heat sink can be compensated for. In this case, the mosaic segments adapt to the surface irregularities on the basis of compressible, thermally conductive and elastic compensation elements. This allows even the joined surfaces with irregularities to be in contact over a large area and thus have good heat transfer. Furthermore, a high robustness against contamination is obtained, since individual contaminating particles in the gaps can be blocked only by the abutment of the individual mosaic segments. This further ensures good heat transfer of all other mosaic segments. The intermediate spaces of the mosaic segments can act as "volume buffers". In the presence of particles or local irregularities, these spaces can act as volume compensations, for example, for the adhesive that holds the mosaic segments in the corresponding receiving spaces. Due to the improved heat transfer, the life of the electric components that are the heat source can be extended. Furthermore, more advantageous materials with relatively poor heat conducting properties can be used for the housing. Furthermore, more advantageous manufacturing methods can be used on the basis of the increased tolerance range. The thermally conductive, low-adhesion contact areas of the individual mosaic segments allow them to be easily re-picked up from the corresponding surface of the heat sink or heat source.

[0004] According to an embodiment of the heat dissipation device of the present invention, it is possible to compensate for unevenness errors on the cooling surface, and even if the surface is uneven or there are particles between the surfaces, good heat transfer can be achieved without leaving any air gaps between the heat source and the cooling device.

[0005] An embodiment of the present invention provides a heat dissipation device, in particular for a control device assembly in a vehicle, comprising an accommodation space with at least one open side and at least one mosaic segment arranged in the accommodation space, the at least one mosaic segment including a thermally conductive and elastic compensation element and a thermally conductive and low-adhesive contact area. The at least one mosaic segment is arranged in the accommodation space such that the thermally conductive and elastic compensation element of the at least one mosaic segment abuts against an inner surface of a bottom of the accommodation space and at least the thermally conductive and low-adhesive contact area of ​​the at least one mosaic segment partially protrudes from the accommodation space on the open side of the accommodation space opposite the bottom. In this case, the outer surface of the bottom of the accommodation space forms a rigid first contact surface for a heat source or a heat sink and the thermally conductive and low-adhesive contact area of ​​the at least one mosaic segment forms a flexible second contact surface for a heat sink or a heat source.

[0006] Furthermore, a control device assembly, in particular for a vehicle, is proposed, which comprises a control device and a heat sink configured as a cooling device, the control device comprising a housing and at least one heat source arranged inside the housing. The control device is separably connected to the cooling device, the at least one heat source being thermally coupled to the housing of the control device via a first thermal interface. Between the control device and the cooling device, at least one heat dissipation device according to the invention is arranged, which forms a second thermal interface between the housing and the cooling device and dissipates heat generated by the at least one heat source to the cooling device. In this case, the heat generated by the at least one heat source is thermally dissipated directly to the cooling device via the first thermal interface, via the housing of the control device and via at least one mosaic segment forming the second thermal interface.

[0007] Advantageous improvements of the heat dissipation device according to the independent claim 1 and of the control device assembly according to the independent claim 11 are possible by means of the measures and developments specified in the dependent claims.

[0008] It is particularly advantageous if the at least one mosaic segment is inseparably connected to the inner surface of the receiving space. The at least one mosaic segment can be connected to the inner surface of the receiving space, for example, by gluing, welding, brazing, clamping, riveting.

[0009] In a particularly advantageous embodiment of the heat dissipation device, at least one mosaic segment can be constructed from a plurality of parts. In this case, the thermally conductive and elastic compensation element of the at least one mosaic segment can be constructed preferably as a gap filler, for example having a thickness of 1 mm to 5 mm. The thermally conductive and low-adhesion contact area of ​​the at least one mosaic segment can be constructed preferably as a metal pad, which can be bonded to the gap filler. The metal pad of the mosaic segment can be produced, for example, as a stamped or laser cut part and can have, for example, a side length between 5 mm and 20 mm and a thickness in the range of 0.1 mm to 1.5 mm. Thus, a high degree of geometric freedom is obtained, which allows the metal pad to be easily adapted to the requirements regarding the geometry and material selection of the individual mosaic segments and the area proportion in relation to the total cooling surface. The metal pad can be produced, for example, from aluminum, copper, steel or other suitable metals. Since the gap filler is covered over a large area by the individual metal pads and no adhesive structure occurs between the metals, the thermally conductive and low-adhesion contact areas can be easily removed from the metal surface of the cooling device or control device housing. Thus, for example, if there are multiple metal pads, the gap filler can be bonded over a large area to the inner surface of the receiving space. The individual metal pads of the mosaic segments can then be bonded to the applied gap filler. This means that multiple mosaic segments can have one common thermally conductive and elastic compensation element.

[0010] In an alternative embodiment of the heat dissipation device, the at least one mosaic segment can be constructed from a single part. The at least one mosaic segment can therefore comprise at least one spring element forming a thermally conductive and elastic compensation element. In this case, the spring end of the at least one spring element can form the thermally conductive and low-adhesion contact area. The at least one spring element can be made, for example, from copper, steel or other suitable metal and can be welded or riveted to the inner surface of the receiving space. Since no adhesive structure occurs between the at least one spring element and the metal surface of the cooling device or control device housing, the thermally conductive and low-adhesion contact area can be easily removed again from the corresponding surface.

[0011] In a further advantageous embodiment of the heat dissipation device, at least one mosaic segment can be configured as a metal foam element forming a thermally conductive and elastic compensation element. In this case, a mounting surface of the metal foam element facing away from the bottom of the receiving space can form a thermally conductive and low-adhesion contact area. The metal foam element can be made, for example, from copper or another suitable metal and can be glued, welded, brazed or clamped to the inner surface of the receiving space. Alternatively, at least one mosaic segment can be configured as a metal wool element forming a thermally conductive and elastic compensation element. In this case, a mounting surface of the metal wool element facing away from the bottom of the receiving space can form a thermally conductive and low-adhesion contact area. The metal wool element can be made, for example, from copper, steel or another suitable metal and can be glued, welded or brazed to the inner surface of the receiving space. Since no adhesive structure is formed between the metal foam or metal wool member and the metal surface of the cooling device or control device housing, the corresponding thermally conductive and low-adhesion contact areas can be easily removed again from the corresponding surfaces.

[0012] In a further alternative embodiment of the heat dissipation device, at least one mosaic segment can be configured as a sheet structure, also called "skived fins", which comprises a number of sheets protruding from a base plate, which form a thermally conductive and elastic compensation element. In this case, the base plate can abut against the inner surface of the bottom of the receiving space, and the edges of the sheets facing away from the base plate can form a thermally conductive and low-adhesion contact area. As a further alternative, at least one mosaic segment can be configured as a metal bump film, which comprises a number of protrusions protruding from a base surface, which form a thermally conductive and elastic compensation element. In this case, the base surface of the metal bump film can abut against the inner surface of the bottom of the receiving space and can be glued or welded. The protrusions facing away from the base plate can form a thermally conductive and low-adhesion contact area.

[0013] In an advantageous embodiment of the control device assembly, at least one heat dissipation device can have a plurality of mosaic segments and can be formed over a large area on the housing of the control device or on the cooling device, so that, for example, a metallic base surface of a power module can be thermally coupled over a large area to a corresponding surface of the cooling device. The cooling device can, for example, have a metal plate with a water cooling section. Alternatively, a plurality of heat dissipation devices can be formed partly distributed on the housing of the control device or on the cooling device, so that heat source electric modules located in so-called "hot spots" can be cooled in a targeted manner.

[0014] In a further advantageous embodiment of the control device assembly, the accommodation space of the at least one heat dissipation device can be formed in a recess in the area of ​​the first thermal interface of the housing of the control device. Alternatively, the accommodation space of the at least one heat dissipation device can be formed in a recess in a surface of the cooling device facing the control device, the recess being arranged in the area of ​​the first thermal interface of the housing of the control device in the assembled state of the control device assembly.

[0015] Exemplary embodiments of the invention are illustrated in the drawings and are explained in more detail in the following description, in which components or elements performing the same or similar functions are provided with the same reference signs. [Brief description of the drawings]

[0016] [Figure 1] 1 is a schematic cross-sectional view of a part of a first embodiment of a control device assembly according to the invention, particularly in a vehicle, comprising a first embodiment of a heat dissipation device according to the invention; [Diagram 2] 3 is a schematic cross-sectional view of a portion of a second embodiment of a control device assembly according to the invention, particularly in a vehicle, comprising a second embodiment of a heat dissipation device according to the invention; [Diagram 3] FIG. 2 is a schematic cross-sectional view of a part of a third embodiment of a control device assembly according to the invention, particularly in a vehicle, comprising a third embodiment of a heat dissipation device according to the invention; [Figure 4] 4 is a schematic cross-sectional view of a part of a fourth embodiment of a control device assembly according to the invention, particularly in a vehicle, comprising a fourth embodiment of a heat dissipation device according to the invention; [Diagram 5] 2 is a schematic diagram of the bottom of a controller housing for a controller assembly according to the present invention; FIG. [Figure 6] 6 is a schematic cross-sectional view of a portion of a fifth embodiment of a control device assembly according to the present invention, particularly in a vehicle, comprising a fifth embodiment of a heat dissipation device according to the present invention and the control device of FIG. 5; [Figure 7]2 is a schematic cross-sectional view of a control device assembly, particularly in a vehicle, without a heat dissipation device according to the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] EMBODIMENTS OF THE PRESENTINVENTION As can be seen from Figures 1 to 6, the illustrated embodiment of a control device assembly 1, 1A, 1B, 1C, 1D, 1E according to the invention, in particular for a vehicle, comprises a control device 3, 3A, 3B, respectively, and a heat sink 9 configured as a cooling device 9A, the control device 3, 3A, 3B comprising a housing 4 and at least one heat source 7 arranged inside the housing 4. The control device 3, 3A, 3B is detachably connected to the cooling device 9A. The at least one heat source 7 is thermally coupled to the housing 4 of the control device 3 via a first thermal interface 8. Furthermore, at least one heat dissipation device 10, 10A, 10B, 10C, 10D, 10E according to the present invention is disposed between the control device 3, 3A, 3B and the cooling device 9A, and the heat dissipation device 10, 10A, 10B, 10C, 10D, 10E forms a second thermal interface 12 between the housing 4 and the cooling device 9A, and dissipates the heat generated by the at least one heat source 7 to the cooling device 9A. In this case, the at least one heat dissipation device 10, 10A, 10B, 10C, 10D, 10E dissipates the heat generated by the at least one heat source 7 through the first thermal interface 8, through the housing 4 of the control device 3, and directly to the cooling device 9A through the second thermal interface 12.

[0018] In the illustrated embodiment, the cooling device 9A includes a metal plate with a number of passages, not shown, through which water or other suitable coolant is conducted to remove heat generated by at least one heat source 7.

[0019] As can be further seen from Figures 1 to 6, the illustrated embodiment of the heat dissipation device 10, 10A, 10B, 10C, 10D, 10E according to the present invention comprises an accommodating space 11, 11A, 11B, 11C having at least one open side and at least one mosaic segment 14, 14A, 14B, 14C, 14D arranged in the accommodating space 11, 11A, 11B, 11C, respectively, and the at least one mosaic segment 14, 14A, 14B, 14C, 14D comprises a thermally conductive and elastic compensation element 16 and a thermally conductive and low-adhesive contact region 18. At least one mosaic segment 14, 14A, 14B, 14C, 14D is arranged in the accommodating space 11, 11A, 11B, 11C such that the thermally conductive and elastic compensation element 16 of at least one mosaic segment 14, 14A, 14B, 14C, 14D abuts against the inner surface of the bottom 11.1 of the accommodating space 11, 11A, 11B, 11C and such that at least the thermally conductive and low-adhesion contact area 18 of at least one mosaic segment 14, 14A, 14B, 14C, 14D partially protrudes from the accommodating space 11, 11A, 11B, 11C on the open side of the accommodating space 11, 14A, 14B, 11C opposite the bottom 11.1. In this case, the outer surface of the bottom 11.1 of the accommodating space 11, 11A, 11B, 11C forms a rigid first contact surface for the heat source 7 or heat sink 9, and the thermally conductive and low-adhesion contact area 18 of at least one mosaic segment 14, 14A, 14B, 14C, 14D forms a flexible second contact surface for the heat sink 9 or heat source 7.

[0020] As can be further seen from Fig. 1 to Fig. 6, an electrical module 7A, 7B, 7C arranged on a printed circuit board 6, for example configured as a power semiconductor, a microcontroller, forms at least one heat source 7. In this case, the at least one heat source 7 is thermally coupled to the housing 4 of the control device 3 via a first thermal interface 8. The first thermal interface 8 can for example consist of a thermally conductive material 8A, also called thermal interface material (TIM). Thus, in the illustrated embodiment, a so-called gap filler, preferably made of a thermally conductive elastomer, is arranged as TIM 8A between the heat source 7 and a recess 5.2 formed in the bottom 5 of the housing 4, forming the first thermal interface 8. In this case, the accommodation space 11, 11A, 11B, 11C of the at least one heat dissipation device 10, 10A, 10B, 10C, 10D, 10E is formed in this recess 5.2, which in the illustrated embodiment is respectively provided in the bottom 5 of the housing 4 of the respective control device 3, 3A, 3B.

[0021] In an alternative embodiment of the control device assembly 1, not shown, the accommodation space 11 of the at least one heat dissipation device 10 is formed in a recess formed in the surface of the cooling device 9A facing the control device 3. In this case, the recess is positioned in the cooling device 9A such that it is located in the area of ​​the first thermal interface 8 of the housing 4 of the control device 3 in the assembled state of the control device assembly 1.

[0022] As can be further seen from Figures 1 to 4 and 6, the heat dissipation paths WAP of the heat generated by the at least one heat source 7 are distributed to a first heat dissipation path WAP1, which dissipates a part of the heat generated by the at least one heat source 7 to the cooling device 9A through the bottom 5 of the housing 4 of the control device 3, 3A, 3B and the mounting area. The second heat dissipation path WAP2 dissipates a part of the heat generated by the at least one heat source 7 to the cooling device 9A through air molecules across the air gap LS as radiation heat and thermal conduction. The heat dissipation devices 10, 10A, 10B, 10C, 10D, 10E form a third heat dissipation path WAP3, which dissipates a part of the heat generated by the at least one heat source 7 directly to the cooling device 9A. In the illustrated embodiment, the different embodiments of the heat dissipation device 10, 10A, 10B, 10C, 10D, 10E bridge the gap LS between the control device 3, 3A, 3B and the cooling device 9A to achieve better thermal conductivity. In this case, the heat dissipation device 10, 10A, 10B, 10C, 10D, 10E does not leave any residue on the cooling device 9A when removing the control device 3, 3A, 3B, which must be removed only by a laborious cleaning process. Furthermore, no thermally conductive material is required when installing a replacement control device.

[0023] In the illustrated embodiment, the individual mosaic segments 14, 14A, 14B, 14C, 14D are inseparably connected to the inner surface of the respective receiving space 11, 11A, 11B, 11C by a thermally conductive adhesive connection, which means that the thermally conductive and elastic compensation element 16 is glued to the respective receiving space 11, 11A, 11B, 11C. Of course, it is also possible to use other suitable connection techniques for inseparably connecting the individual mosaic segments 14, 14A, 14B, 14C, 14D to the inner surface of the respective receiving space 11, 11A, 11B, 11C.

[0024] As can be further seen from Figures 1 and 6, at least one mosaic segment 14A in the illustrated embodiment of the control device assembly 1A, 1E is composed of multiple parts. In this case, the heat dissipation device 10A shown in Figure 1 has only a single mosaic segment 14A, while the heat dissipation device 10E shown in Figure 6 has multiple mosaic segments 14A arranged side by side. The thermally conductive and elastic compensation elements 16 of the illustrated mosaic segment 14A are each configured as a gap filler 16A. The thermally conductive and low-adhesion contact areas 18 of the illustrated mosaic segment 14A are each configured as a metal pad 18A bonded to the gap filler 16A.

[0025] As can be further seen from Figures 2-4, at least one of the mosaic segments 14B, 14C, 14D in the illustrated embodiments of the control device assemblies 1B, 1C, 1D is comprised of a single part, in which case the heat dissipation devices 10B, 10C, 10D shown in Figures 2-4 each include only a single mosaic segment 14B, 14C, 14D.

[0026] 2, the illustrated mosaic segment 14B includes a plurality of spring elements 16B forming a thermally conductive, resilient compensation element 16. In this case, flattened spring ends 18B of two spring elements 16B form a thermally conductive, low-adhesion contact area 18.

[0027] As can further be seen from Fig. 3, the illustrated mosaic segment 14C is configured as a compressible elastic metal foam element 16C forming the thermally conductive and elastic compensation element 16. In this case, the mounting surface 18C of the metal foam element 16C facing away from the bottom 11.1 of the receiving space 11 forms the thermally conductive and low-adhesion contact area 18.

[0028] As can further be seen from Fig. 4, the illustrated mosaic segment 14D is configured as a compressible elastic metal wool piece 16D forming the thermally conductive and elastic compensation element 16. In this case, the resting surface 18C of the metal wool piece 16D facing away from the bottom 11.1 of the receiving space 11 forms the thermally conductive contact area 18.

[0029] In a non-illustrated alternative embodiment of the heat dissipation device 10, at least one mosaic segment 14 is configured as a sheet structure, which comprises a number of sheets protruding from a base plate, which form the thermally conductive and elastic compensation element 16. In this case, the base plate rests against the inner surface of the bottom 11.1 of the receiving space 11 and is preferably glued to the bottom 11.1 of the receiving space 11 via a thermally conductive adhesive connection. The edges of the sheets facing away from the base plate form the thermally conductive and low-adhesion contact areas 18. In a further non-illustrated alternative embodiment of the heat dissipation device 10, at least one mosaic segment 14 is configured as a metal-bump film, which comprises a number of protrusions protruding from the base surface, which form the thermally conductive and elastic compensation element 16. In this case, the base surface of the metal bump film rests against the inner surface of the bottom 11.1 of the receiving space 11 and is preferably glued to the bottom 11.1 of the receiving space 11 via a thermally conductive adhesive connection. The bumps facing away from the base plate form thermally conductive, low-adhesion contact areas 18.

[0030] As can be further seen from Fig. 5, in the illustrated embodiment, two heat dissipation devices 10E, 10F are arranged partially distributed on the bottom 5 of the control device 3B. In this case, the first heat dissipation device 10E includes 12 mosaic segments 14A, which are arranged in the first accommodation space 11B and are used to dissipate heat generated by the first electrical module 7B. The second heat dissipation device 10F includes 6 mosaic segments 14A, which are arranged in the second accommodation space 11C and are used to dissipate heat generated by the second electrical module 7C.

[0031] In a not shown embodiment, the heat dissipation device 10 is configured with a large area with a plurality of mosaic segments 14. In this case, the mosaic segments 14 are distributed over the entire bottom part 5 of the control device 3, so that the control device 3 is thermally coupled to the cooling device 9A over a large area for dissipating heat.

Claims

1. A heat dissipation device (10), in particular for a control device assembly (1) in a vehicle, comprising a receiving space (11) open on at least one side and at least one mosaic segment (14) arranged in said receiving space (11), The at least one mosaic segment (14) includes a thermally conductive, elastic compensation element (16) and a thermally conductive, low-adhesion contact region (18); The at least one mosaic segment (14) comprises: The thermally conductive and elastic compensation element (16) of the at least one mosaic segment (14) is arranged to abut against the inner surface of the bottom (11.1) of the receiving space (11) and at least so that the thermally conductive and low-adhesion contact area (18) of the at least one mosaic segment (14) partially projects out of the receiving space (11) at an open side of the receiving space (11) facing away from the bottom (11.1), Located in the storage space (11), the outer surface of the bottom (11.1) of the receiving space (11) forms a rigid first contact surface for a heat source (7) or a heat sink (9), the thermally conductive, low-adhesion contact area (18) of the at least one mosaic segment (14) forms a flexible second contact surface for the heat sink (9) or the heat source (7). A heat dissipation device (10).

2. the at least one mosaic segment (14) is inseparably connected to the inner surface of the receiving space (11); The heat dissipation device (10) of claim 1.

3. The at least one mosaic segment (14) is composed of a plurality of parts. A heat dissipation device (10) according to claim 1 or 2.

4. The thermally conductive and elastic compensation element (16) of the at least one mosaic segment (14) is configured as a gap filler (16A); the thermally conductive, low-adhesion contact area (18) of the at least one mosaic segment (14) is configured as a metal pad (18A) bonded to the gap fill material (16A); The heat dissipation device (10) of claim 3.

5. said at least one mosaic segment (14) being composed of a single part; A heat dissipation device (10) according to claim 1 or 2.

6. said at least one mosaic segment (14) includes at least one spring element (16B) forming said thermally conductive and elastic compensation element (16); a spring end (18B) of the at least one spring element (16B) forming the thermally conductive, low-adhesion contact area (18); The heat dissipation device (10) of claim 5.

7. the at least one mosaic segment (14) is configured as a metal foam member (16C) forming the thermally conductive and elastic compensation element (16); A mounting surface (18C) of the metal foam member (16C) facing away from the bottom (11.1) of the storage space (11) forms the thermally conductive and low-adhesive contact region (18). The heat dissipation device (10) of claim 5.

8. the at least one mosaic segment (14) is configured as a metal wool member (16D) forming the thermally conductive and elastic compensation element (16); A mounting surface (18C) of the metal wool member (16D) facing away from the bottom (11.1) of the storage space (11) forms the thermally conductive and low-adhesive contact region (18). The heat dissipation device (10) of claim 5.

9. The at least one mosaic segment (14) is configured as a thin plate structure, The thin plate structure includes a plurality of thin plates protruding from a base plate, the plurality of laminae forming the thermally conductive and elastic compensation element (16); the base plate abuts against the inner surface of the bottom (11.1) of the receiving space (11); the edge of the thin plate facing away from the base plate forms the thermally conductive, low-adhesion contact area (18); The heat dissipation device (10) of claim 5.

10. The at least one mosaic segment (14) is configured as a metal bump film; the metal protrusion film includes a plurality of protrusions protruding from a base surface; the plurality of protrusions forming the thermally conductive and elastic compensation element (16); The base surface of the metal protrusion film abuts against the inner surface of the bottom (11.1) of the receiving space (11); A protrusion facing away from the base surface forms the thermally conductive, low-adhesion contact area (18). The heat dissipation device (10) of claim 5.

11. A control device assembly (1), in particular for a vehicle, comprising: The control device assembly (1) includes a control device (3) and a heat sink (9) configured as a cooling device (9A); The control device (3) includes a housing (4) and at least one heat source (7) disposed inside the housing (4); The control device (3) is separably connected to the cooling device (9A), the at least one heat source (7) being thermally coupled to the housing (4) of the control device (3) via a first thermal interface (8); At least one heat dissipation device (10) is disposed between the control device (3) and the cooling device (9A); the heat dissipation device (10) forms a second thermal interface (12) between the housing (4) and the cooling device (9A) and dissipates heat generated by the at least one heat source (7) to the cooling device (9A); In the control device assembly (1), The at least one heat dissipation device (10) is configured as a heat dissipation device (10) according to any one of claims 1 to 10, Thereby, heat generated by the at least one heat source (7) is dissipated directly to the cooling device (9A) via the first thermal interface (8), via the housing (4) of the control device (3) and via at least one mosaic segment (14) forming the second thermal interface (12). A control device assembly (1).

12. the at least one heat dissipation device (10) has a plurality of mosaic segments (14) and is formed over a large area on the housing of the control device (3) or on the cooling device (9A); A control device assembly (1) according to claim 11.

13. the plurality of heat dissipation devices (10) are formed in the housing of the control device (3) or in a distributed manner in the cooling device (9A); A control device assembly (1) according to claim 11.

14. the accommodation space (11) of the at least one heat dissipation device (10) is formed in a recess (5.2) provided in the region of the first thermal interface (8) of the housing (4) of the control device (3), A control device assembly (1) according to any one of claims 11 to 13.

15. the accommodation space (11) of the at least one heat dissipation device (10) is formed in a recess (5.2) provided in a surface of the cooling device (9A) facing the control device (3); the recess (5.2) being arranged in the region of the first thermal interface (8) of the housing (4) of the control device (3) in the assembled state of the control device assembly (1), A control device assembly (1) according to any one of claims 11 to 13.

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