Liquid ejection head and manufacturing method thereof

Abstract

To provide a liquid ejection head that realizes a higher speed and higher image quality.SOLUTION: A liquid ejection head 20 has a substrate 1 and a plurality of ejection port forming members 11, 12 provided on the substrate 1. Each of the ejection port forming members 11, 12 has a channel 5, 6 formed between the substrate 1 and the member and communicating with an ejection port 8 for ejecting a liquid. The plurality of ejection port forming members 11, 12 are formed so as to differ from each other in thickness and so that the channels 5, 6 differ from each other in height.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a liquid ejection head and a manufacturing method thereof. [Background technology]

[0002] In a liquid ejection head that ejects liquid such as ink from an ejection port to record an image on a recording medium, a method of ejecting droplets of different sizes from each ejection port is known in order to achieve high speed and high image quality. Patent Document 1 describes a liquid ejection head that ejects droplets of different sizes from each ejection port forming member by forming multiple ejection port forming members with different thicknesses on the same substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2011-161761 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the liquid ejection head described in Patent Document 1, depending on the physical properties (e.g., viscosity) of the liquid used, refilling after liquid ejection may not be completed in time, and the liquid may not be ejected properly, which may result in a decrease in image quality. SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to provide a liquid ejection head that realizes high speed and high image quality, and a method for manufacturing the same. [Means for solving the problem]

[0005] In order to achieve the above object, the liquid ejection head of the present invention comprises: A plurality of energy generating elements for ejecting liquid are provided. A substrate; The liquid ejection head includes a first ejection port forming member that forms a first ejection port for ejecting liquid by driving an energy generating element, a first flow path communicating with the first ejection port, and a first ejection port portion connecting the first ejection port and the first flow path, and a second ejection port forming member that forms a second ejection port for ejecting liquid by driving an energy generating element, a second flow path communicating with the second ejection port, and a second ejection port portion connecting the second ejection port and the second flow path, the first ejection port forming member and the second ejection port forming member being formed on the same substrate, the thickness of the first ejection port forming member being thicker than the thickness of the second ejection port forming member, and the height of the first flow path being greater than the height of the second flow path. . Further, a method for producing a liquid ejection head according to the present invention includes the steps of: A plurality of energy generating elements for ejecting liquid are provided. A substrate; a first outlet forming member that forms a first outlet for ejecting liquid by driving an energy generating element, a first flow path communicating with the first outlet, and a first outlet portion connecting the first outlet and the first flow path; and a second outlet forming member that forms a second outlet for ejecting liquid by driving an energy generating element, a second flow path communicating with the second outlet, and a second outlet portion connecting the second outlet and the second flow path. A method for manufacturing a liquid ejection head, comprising the steps of: A step of preparing a substrate, a first mold material for forming a first flow path, and a second mold material for forming a second flow path. On-Board In shape accomplish Forming material The process and The first mold material and the second mold material Cover each of the mold materials. , a second resin layer on the substrate and forming a step of removing a part of the second resin layer provided on the first mold material and the second mold material, and forming, in the second resin layer, a first through hole which will become the first discharge port and the first discharge port portion, and a second through hole which will become the second discharge port and the second discharge port portion; Remove the mold material The second resin layer is formed as a first discharge port forming member and a second discharge port forming member. and The first ejection port forming member and the second ejection port forming member are formed on the same substrate. Mold material Height teeth, Higher than the height of the second mold material , No. 1 Discharge port forming member Thickness teeth, The thickness of the second discharge port forming member is thicker than that of the second discharge port forming member. . Effect of the Invention

[0006] According to the present invention, it is possible to provide a liquid ejection head that realizes high speed and high image quality, and a manufacturing method thereof. [Brief description of the drawings]

[0007] [Figure 1] 1A and 1B are a perspective view and a cross-sectional view of a liquid ejection head according to an embodiment; [Diagram 2] 5A to 5C are cross-sectional views illustrating a method for manufacturing a liquid ejection head according to an embodiment. [Diagram 3] 5A to 5C are cross-sectional views illustrating a method for manufacturing a liquid ejection head according to an embodiment. [Figure 4] 1 is a plan view of a semiconductor wafer for explaining a resin coating method. [Diagram 5] 1 is a plan view of a semiconductor wafer for explaining a resin coating method. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the following description, components having the same functions are denoted by the same reference numerals in the drawings, and the description thereof may be omitted.

[0009] FIG. 1(a) is a perspective view of a liquid ejection head according to an embodiment of the present invention, and FIG. 1(b) is a cross-sectional view taken along line AA in FIG. 1(a). The liquid ejection head 20 ejects liquid such as ink to record an image on a recording medium, and includes a substrate 1 and a plurality of ejection port forming members 11, 12 provided on the substrate surface 1a and ejecting ink of different colors, for example. The plurality of ejection port forming members 11, 12 include a first ejection port forming member 11 and a second ejection port forming member 12 having a different thickness from the first ejection port forming member 11 (specifically, having a smaller thickness than the first ejection port forming member 11). The number of the first ejection port forming members 11 is not limited to three as shown in the figure, and may be two or less or four or more, and the number of the second ejection port forming members 12 is not limited to two as shown in the figure, and may be one or three or more. The substrate 1 has a plurality of energy generating elements (not shown) that generate energy used to eject the liquid, and in response to this, each of the ejection port forming members 11, 12 has a plurality of ejection ports 8 for ejecting the liquid. The multiple outlets 8 are each disposed at a position facing an energy generating element, and are arranged to form multiple outlet rows (four per outlet forming member 11, 12 in the illustrated example).

[0010] A plurality of first flow paths 5 are formed between the substrate 1 and the first discharge port forming member 11, and a plurality of second flow paths 6 having a different height from the first flow paths 5 (specifically, a height smaller than the first flow paths 5) are formed between the substrate 1 and the second discharge port forming member 12. Each of the flow paths 5, 6 communicates with a plurality of discharge ports 8 constituting one discharge port row, and has an element row made of a plurality of corresponding energy generating elements inside. By utilizing the energy generated by the energy generating elements, the liquid in the flow paths 5, 6 can be discharged from the discharge ports 8. Examples of the energy generating elements include a heat generating element (heater) that heats the liquid to foam it and discharge it, and a piezoelectric element (piezo element) that deforms to generate pressure and discharge the liquid. The substrate 1 is provided with supply paths 10 for supplying liquid to the multiple ejection ports 8. Two supply paths 10 are provided per ejection port forming member, and each supply path 10 communicates with two ejection port rows. A protective layer 2 is formed on the rear surface 1b of the substrate, which functions as an etching mask when the supply paths 10 are formed in the substrate 1 by anisotropic etching in a process described later. In addition, an adhesion layer 3 is provided between the substrate 1 and the ejection port forming members 11 and 12 to improve adhesion between them.

[0011] As described above, in this embodiment, the first ejection port forming member 11 and the second ejection port forming member 12 are formed to have different thicknesses. Therefore, the size of the ejected droplets can be changed for each of the ejection port forming members 11 and 12, and high speed and high image quality can be achieved. In addition, in this embodiment, the first ejection port forming member 11 and the second ejection port forming member 12 are formed to have different heights of the flow paths 5 and 6. Therefore, the refill speed of the liquid can be changed for each of the ejection port forming members 11 and 12 without changing the physical properties (e.g., viscosity, etc.) of the liquid used. In other words, even when liquids with different physical properties are used, the refill speed required for each of the ejection port forming members 11 and 12 can be ensured. As a result, it is possible to suppress the occurrence of defective ejection of the liquid due to insufficient refilling after ejection of the liquid. In addition to the thickness and the height of the flow paths 5, 6 being different from each other, the first and second ejection port forming members 11 and 12 may also have different heights (lengths in the liquid ejection direction) of the cylindrical ejection port portions 17 that communicate the ejection ports 8 and the flow paths 5, 6. The first and second ejection port forming members 11 and 12 may have the same or different diameters of the ejection ports 8. In this way, by varying the dimensions of the first and second ejection port forming members 11 and 12 in various ways, it becomes possible to eject droplets of even more diverse sizes, and to record high-quality images with better gradation.

[0012] Next, a method for manufacturing a liquid ejection head according to the present embodiment will be described with reference to Fig. 2 and Fig. 3. Fig. 2(a) to Fig. 3(d) are cross-sectional views of the liquid ejection head in each step of the manufacturing method according to the present embodiment, and correspond to Fig. 1(b).

[0013] 2(a), a first resin layer 4 for forming a mold material is formed on a substrate 1 having an adhesion layer 3 and a protective layer 2 formed on a front surface 1a and a rear surface 1b of the substrate, respectively. Specifically, a photosensitive resin is applied in a solid manner on the front surface 1a of the substrate by a dispense method using a dispense nozzle 13 so as to cover a plurality of element rows each consisting of a plurality of energy generating elements, thereby forming the first resin layer 4 for forming a mold material. As a method of applying resin in a solid form by the dispensing method, for example, a method of repeatedly applying resin in a linear form while moving the dispense nozzle 13 relative to the substrate at a constant pitch can be mentioned. At this time, the resins applied before and after in time are adjacent to each other and overlap each other to form a solid pattern. For example, a dispense nozzle 13 having an inner diameter of 20 μm or more and 500 μm or less is used to apply the photosensitive resin. However, when micron-order accuracy is required as in this embodiment, the vapor pressure of the resin is important to smooth the surface of the resin layer 4. That is, if the resin dries quickly, the overlapping resins may not mix with each other depending on the discharge conditions of the dispenser, and the surface of the resin layer 4 may become wavy. Therefore, it is preferable to use a resin with an optimal vapor pressure, which makes it possible to overlap the resin applied later on the resin applied before the resin applied previously dries, thereby making it possible to smooth the surface of the resin layer 4.

[0014] The first resin layer 4 for forming the mold material is formed with different thicknesses in a plurality of regions on the substrate 1. Methods for varying the thickness of the first resin layer 4 from place to place by the dispensing method include changing the discharge pressure of the dispenser and changing the moving speed of the stage on which the substrate 1, which is the object to be coated, is placed. The first resin layer 4 for forming the mold material may be formed as a single layer at once, or may be formed in two or more layers to increase the overall thickness. When the first resin layer 4 is formed in two or more layers, a dispensing method is used to form the top layer, but the other layers may be formed by a method other than the dispensing method, such as a spin coating method. When the first resin layer 4 is formed in two or more layers, these layers may be made of the same type of photosensitive resin or different types of photosensitive resin as long as they are soluble in the same solvent.

[0015] Next, the first resin layer 4 is patterned to form a plurality of mold materials 4a, 4b each having a desired pattern. Specifically, as shown in Fig. 2(b), the first resin layer 4 is exposed using a mask 14, and developed to remove unnecessary portions, thereby forming a mold material 4a for forming the first flow path 5 and a mold material 4b for forming the second flow path 6, as shown in Fig. 2(c). At this time, the mold materials 4a, 4b have different thicknesses according to the difference in thickness of the first resin layer 4 described above.

[0016] 2(d), a second resin layer 7 that will become the discharge port forming members 11 and 12 is formed. Specifically, a photosensitive resin is applied in a solid manner to different thicknesses at positions covering the multiple mold members 4a and 4b on the substrate 1 by a dispensing method using a dispensing nozzle 15, thereby forming the second resin layer 7 that will become the discharge port forming members 11 and 12. A method of applying the resin in a solid manner by the dispensing method can be to apply the resin repeatedly in a straight line while moving the dispensing nozzle 15 relatively at a constant pitch, as in the case of the first resin layer 4. Also, a method of changing the thickness of the second resin layer 7 from place to place by the dispensing method can be to change the discharge pressure of the dispenser or to change the moving speed of the stage on which the substrate 1, which is the object to be applied, is placed, as in the case of the first resin layer 4.

[0017] Here, a method of applying resin for forming a second resin layer using a dispensing method will be described with reference to Fig. 4 and Fig. 5. Fig. 4(a) is a plan view showing an example of the configuration of a semiconductor wafer used in manufacturing the liquid ejection head of the present embodiment shown in Fig. 1, and Fig. 4(b) to Fig. 4(e) are plan views showing examples of the application path of the resin when applying the resin onto a substrate. Fig. 5(a) and Fig. 5(b) are plan views showing examples of the configuration of a semiconductor wafer for explaining the method of applying the resin.

[0018] For example, when a dispense method is used to form a protective film, it is important to apply the resin without missing any spots, and even if there is a large variation within the range of the film thickness tolerance, the effect on the reliability of the product is small. However, as in this embodiment, when a dispense method is used to form the resin layer 7 that will become the discharge port forming members 11 and 12, if the film thickness variation is large, it will have a large effect on the dimensional accuracy of the discharge port 8 formed in the subsequent process described below, resulting in a decrease in image quality. Therefore, the uniformity of the film thickness is important, and high-precision film thickness control is required for that purpose. One method for reducing the film thickness variation between the discharge ports is to repeatedly apply the resin in a straight line. Specifically, one method is to repeatedly apply the resin in a straight line along a direction parallel to the element row on the substrate 1 (Y-axis direction) as shown in FIG. 4(b), or along a perpendicular direction (X-axis direction) as shown in FIG. 4(c). However, in the dispense method, it takes time for the pressure to stabilize every time the dispenser discharge pressure is repeatedly turned on / off or changed (increased or decreased), which causes the film thickness to vary. As described above, when the resin is applied so as to repeatedly draw straight lines, the dispenser discharge pressure needs to be turned on / off every time a straight line is drawn. Therefore, in the examples shown in FIG. 4(b) and FIG. 4(c), the number of times the discharge pressure is turned on / off per semiconductor wafer is 520 (=8×5×13) and 195 (=3×5×13), respectively. Therefore, even when the resin is applied in a straight line, it is preferable to minimize the number of times the dispenser discharge pressure is turned on / off or the number of times the discharge pressure is changed within the semiconductor wafer.

[0019] 4(d) and 4(e), it is preferable to apply the resin in a linear manner in a single stroke in each of the regions that will become the first discharge port forming member 11 and the second discharge port forming member 12. This makes it possible to limit the number of times the discharge pressure of the dispenser is changed to two times per substrate, i.e., 26 times per semiconductor wafer, and to stabilize the amount of resin applied to form the second resin layer 7. The resin may be applied in a single stroke across multiple substrates 1 in the semiconductor wafer, which further reduces the number of times the discharge pressure of the dispenser is changed. Specifically, as shown in FIG. 5(a), the resin is applied in a single stroke as shown in FIG. 4(d) or FIG. 4(e) for each region in which the thickness of the second resin layer 7 is the same, which is surrounded by a dashed line, so that the number of times the discharge pressure is changed per semiconductor wafer can be reduced to six. In addition, by arranging some substrates 1 in the opposite direction to the above-mentioned semiconductor wafer, the regions in which the thickness of the second resin layer 7 is the same in the semiconductor wafer can be arranged as close to each other as possible as shown in FIG. 5(b). Then, by applying the resin in a single stroke to each of the regions (regions surrounded by a dashed line) in which the thickness is the same, which are arranged together, the number of times the discharge pressure is changed per semiconductor wafer can be reduced to four, and the stable region of the amount of resin applied can be expanded. As a result, it is possible to efficiently form the second resin layer 7 having different thicknesses in different locations in the semiconductor wafer while suppressing the amount of resin used.

[0020] Next, the second resin layer 7 thus formed is patterned to form a plurality of resin patterns 7a, 7b each having a desired pattern. Specifically, as shown in FIG. 3(a), the second resin layer 7 is exposed using a mask 16, and developed to remove unnecessary portions and form a plurality of through holes. As a result, as shown in FIG. 3(b), a first resin pattern 7a that will become a first discharge port forming member 11 and a second resin pattern 7b that will become a second discharge port forming member 12 are formed, and a plurality of discharge ports 8 are formed on the surfaces of the respective resin patterns 7a, 7b. At this time, the resin patterns 7a, 7b have different thicknesses according to the difference in thickness of the second resin layer 7 described above. Next, as shown in Fig. 3(c), the resin patterns 7a and 7b are covered with a protective film 9, and then, as shown in Fig. 3(d), anisotropic etching is performed using the protective layer 2 on the back surface 1b of the substrate as an etching mask to form a supply path 10 in the substrate 1. Then, after removing the protective film 9 on the front surface 1a of the substrate, the substrate 1 is immersed in a solvent capable of dissolving the resin constituting the mold materials 5a and 5b. In this manner, the mold materials 5a and 5b are removed (actually, the above-mentioned semiconductor wafer is subsequently cut into individual pieces), thereby completing the liquid ejection head 20 shown in Fig. 1.

[0021] Thus, according to the manufacturing method of this embodiment, by using the dispensing method to form the mold materials 5a, 5b and the resin patterns 7a, 7b with different thicknesses at different locations, it is possible to suppress the increase in manufacturing costs compared to the case of using the spin coating method, for example. That is, when the spin coating method is used, it is necessary to repeat patterning by photolithography technology according to the difference in thickness of the mold materials 5a, 5b and the resin patterns 7a, 7b, so the amount of resin used and the number of steps increase, leading to an increase in costs. In contrast, when the dispensing method is used, the desired mold materials 5a, 5b and the desired resin patterns 7a, 7b can be formed by one patterning, so the amount of resin used is minimized and the increase in manufacturing costs can be suppressed.

[0022] In this embodiment, two types of outlet forming members 11, 12 having different thicknesses and heights of the flow paths 5, 6 are provided, but the number of types is not limited to two, and three or more types of outlet forming members having different thicknesses and heights of the flow paths may be provided.

[0023] (Example) The present invention will now be described in more detail with reference to specific examples.

[0024] In this example, the liquid ejection head 20 shown in FIG. 1 was manufactured by the manufacturing method shown in FIGS.

[0025] First, in the step shown in FIG. 2(a), a single crystal silicon substrate was prepared as a substrate 1, an adhesion layer 3 was formed on the substrate front surface 1a, and a protective layer 2 made of a silicon oxide film was formed on the back surface 1b. Next, in the process shown in FIG. 2(a), a photosensitive resin was applied to the substrate surface 1a by a dispense method to form a first resin layer 4 for forming a mold material having a different thickness at each location. ODUR1010A (product name) manufactured by Tokyo Ohka Kogyo Co., Ltd. was used as the photosensitive resin. A dispense nozzle 13 with an inner diameter of 70 μm was used, and the photosensitive resin was repeatedly applied in a straight line while moving the dispense nozzle 13 at a feed pitch of 0.05 to 0.5 mm. The reason for applying the resin under such conditions is that the vapor pressure of the photosensitive resin used was 0.1 kPa, and the resin dried immediately after being discharged from the dispense nozzle 13 with an inner diameter of 20 μm, making it difficult to form the first resin layer 4 on the substrate 1. For example, when forming resin layers having three different thicknesses using a spin coat method, patterning is repeatedly performed according to the difference in thickness, so 3×10 cc of resin is required per semiconductor wafer. In contrast, in the case of the dispense method, the amount of resin used was only 3 cc per semiconductor wafer to obtain a similar structure.

[0026] Next, in the step shown in FIG. 2(b), a UX-3000 (product name) manufactured by Ushio Inc. was used as an exposure device, and a light beam of 23 J / cm was applied to the first resin layer 4 for forming the mold material through a mask 14. 2 The substrate was irradiated with far ultraviolet light at the above exposure dose. After that, in the process shown in FIG. 2(c), the substrate 1 was immersed in a developer for a predetermined time to form the mold materials 4a and 4b. MP5050 (product name) manufactured by Hayashi Pure Chemical Industries, Ltd. was used as the developer. Compared to the case where similar mold materials 4a and 4b are formed using a spin coating method, the amount of exposure mask material and developer used was 1 / 3, respectively, and no back-rinse liquid for cleaning the back surface 1b of the substrate was used. Next, in the step shown in FIG. 2(d), a photosensitive resin mainly composed of epoxy resin was applied to a predetermined thickness by a dispense method to form a second resin layer 7 which would become the ejection port forming members 11 and 12.

[0027] Next, in the step shown in FIG. 3A, an exposure apparatus, FPA-3000i5+ (product name) manufactured by Canon Inc., is used to apply a light beam of 2500 J / m to the second resin layer 7 through a mask 16. 2 The i-line was irradiated at the above exposure dose. After that, in the step shown in Fig. 3(b), unnecessary portions of the second resin layer 7 were removed using ODUR1010C (product name) manufactured by Tokyo Ohka Kogyo Co., Ltd. as a developer, and a plurality of through holes opening as a plurality of discharge ports 8 were formed in the surface of the second resin layer 7. Next, in the step shown in Fig. 3(c), the second resin layer 7 was coated with a material having excellent alkali resistance to form a protective film 9. After that, in the step shown in Fig. 3(d), the substrate 1 was immersed in a strongly alkaline tetramethylammonium hydroxide (TMAH) aqueous solution (temperature 83°C, concentration 22%) for 8 hours to perform anisotropic etching, thereby forming a supply path 10 in the substrate 1. Then, the protective film 9 on the substrate surface 1a side was removed with a dedicated removal liquid, and the mold materials 4a and 4b were similarly removed with a dedicated solvent to manufacture the liquid ejection head 20 shown in Fig. 1. [Explanation of symbols]

[0028] 1 Board 5,6 Flow path 11, 12 Discharge port forming member 20 Liquid ejection head

Claims

1. A substrate provided with a plurality of energy generating elements for ejecting liquid; a first ejection port forming member that forms a first ejection port for ejecting liquid by driving the energy generating element, a first flow path that communicates with the first ejection port, and a first ejection port portion that connects the first ejection port and the first flow path; a second ejection port forming member that forms a second ejection port for ejecting liquid by driving the energy generating element, a second flow path that communicates with the second ejection port, and a second ejection port portion that connects the second ejection port and the second flow path, the first ejection port forming member and the second ejection port forming member are formed on the same substrate, a thickness of the first ejection port forming member is greater than a thickness of the second ejection port forming member, A liquid ejection head, wherein the height of the first flow path is greater than the height of the second flow path.

2. A liquid ejection head as described in claim 1, wherein the length of the first ejection outlet portion is different from the length of the second ejection outlet portion in the liquid ejection direction.

3. A liquid ejection head as described in claim 1 or 2, wherein the diameter of the first ejection port is different from the diameter of the second ejection port.

4. A liquid ejection head described in any one of claims 1 to 3, wherein the substrate is a single crystal silicon substrate.

5. A substrate having a plurality of energy generating elements for ejecting liquid; a first ejection port forming member that forms a first ejection port for ejecting liquid by driving the energy generating element, a first flow path that communicates with the first ejection port, and a first ejection port portion that connects the first ejection port and the first flow path; a second ejection port forming member that forms a second ejection port for ejecting liquid by driving the energy generating element, a second flow path that communicates with the second ejection port, and a second ejection port portion that connects the second ejection port and the second flow path, providing the substrate; a mold material forming step of forming a first mold material for forming the first flow path and a second mold material for forming the second flow path on the substrate; forming a second resin layer on the substrate so as to cover the first mold material and the second mold material, respectively; a step of removing a portion of the second resin layer provided on the first mold material and the second mold material, and forming, in the second resin layer, a first through hole that will become the first discharge port and the first discharge port portion, and a second through hole that will become the second discharge port and the second discharge port portion; removing the first mold material and the second mold material, and forming the second resin layer into the first discharge port forming member and the second discharge port forming member, the first ejection port forming member and the second ejection port forming member are formed on the same substrate, The height of the first mold member is greater than the height of the second mold member, A method for manufacturing a liquid ejection head, wherein the thickness of the first ejection port forming member is greater than the thickness of the second ejection port forming member.

6. 6. The method for manufacturing a liquid ejection head as described in claim 5, wherein the mold forming process includes forming a first resin layer of different thicknesses in multiple regions on the substrate by a dispensing method, and then patterning the first resin layer to form the first mold material and the second mold material.

7. The method for manufacturing a liquid ejection head according to claim 6 , wherein the step of forming the second resin layer is performed by a dispensing method.

8. the substrate includes an element array including the plurality of energy generating elements, The method for manufacturing a liquid ejection head according to claim 7 , wherein the second resin layer is formed by repeatedly applying a resin in a linear manner along a direction parallel or perpendicular to the element array.

9. The method for manufacturing a liquid ejection head according to claim 8 , wherein the second resin layer is formed by overlapping resins applied at different times adjacent to each other.

10. The method for manufacturing a liquid ejection head according to claim 9 , wherein the second resin layer is formed by overlapping a subsequently applied resin adjacent to a previously applied resin before the previously applied resin dries.

11. 11. The method for manufacturing a liquid ejection head according to claim 8, wherein the second resin layer is formed by applying a resin across a plurality of the substrates in a semiconductor wafer before the substrates are singulated from the semiconductor wafer.

12. The method for manufacturing a liquid ejection head according to claim 11 , wherein the plurality of substrates are arranged within the semiconductor wafer such that regions in which the second resin layer has the same thickness are adjacent to each other.

13. The method for manufacturing a liquid ejection head according to claim 8 , wherein the second resin layer is formed by applying resin in a single stroke to each area having the same thickness.

14. A method for manufacturing a liquid ejection head described in any one of claims 5 to 13, wherein the substrate is a single crystal silicon substrate.

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