Boiling cooling device

Abstract

To provide an evaporative cooling device capable of suppressing deterioration of cooling efficiency.SOLUTION: An evaporative cooling device includes: a heat receiving part having a storage chamber for storing a refrigerant, and receiving heat from a heating element; a heat radiating part for radiating the heat from the heat receiving part; a first pipe for transferring a gas-phase refrigerant generated by vaporizing the refrigerant in the heat receiving part to the heat radiation part; and a second pipe for transferring a liquid-phase refrigerant generated by condensing the gas-phase refrigerant in the heat radiating part to the heat receiving part. The heat receiving part has a wall member for partitioning at least a part of the storage chamber into a first space and a second space, and the first pipe has a first opening opened toward the second space. At least a part of the wall member is positioned above a liquid level of the liquid refrigerant stored in the storage chamber, and the wall member blocks movement of the liquid refrigerant from the first space to the first opening.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a boiling cooling device. [Background technology]

[0002] 2. Description of the Related Art A boiling cooling device is known that cools a heat-generating body by utilizing heat transport due to latent heat caused by boiling of a refrigerant.

[0003] The cooling device described in Patent Document 1 has a heat receiving section, a heat dissipating section, and a steam pipe and a liquid pipe connecting them. The heat receiving section is a container for storing a refrigerant, and receives heat from an object to be cooled, vaporizing the refrigerant by the heat. The steam pipe transports the refrigerant vaporized in the heat receiving section to the heat dissipating section. The heat dissipating section condenses and liquefies the refrigerant by dissipating heat from the refrigerant. The liquid pipe transports the refrigerant condensed and liquefied in the heat dissipating section to the heat receiving section. Here, a steam outlet and a liquid inlet are provided on the side of the container of the heat receiving section. A steam pipe is connected to the steam outlet. A liquid pipe is connected to the liquid inlet. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2015 / 146110 Summary of the Invention [Problem to be solved by the invention]

[0005] The cooling device described in Patent Document 1 has a problem in that if it is installed in an inclined position, the refrigerant will block the vapor outlet, hindering the circulation of the refrigerant, resulting in a decrease in cooling performance. [Means for solving the problem]

[0006] In order to solve the above problems, a boiling cooling device according to one embodiment of the present invention has a storage chamber for storing a refrigerant, and is equipped with a heat receiving section that receives heat from a heat generating element, a heat dissipation section that dissipates heat from the heat receiving section, a first pipe section that transports a gas phase refrigerant generated by evaporation of the refrigerant in the heat receiving section to the heat dissipation section, and a second pipe section that transports a liquid phase refrigerant generated by condensation of the gas phase refrigerant in the heat dissipation section to the heat receiving section, wherein the heat receiving section has a wall member that divides at least a portion of the storage chamber into a first space and a second space, the first pipe section has a first opening that opens toward the second space, at least a portion of the wall member is located above the liquid level of the liquid refrigerant stored in the storage chamber, and the wall member prevents the liquid refrigerant from moving from the first space to the first opening. [Brief description of the drawings]

[0007] [Figure 1] 1 is a perspective view showing a schematic configuration of a boil cooling device according to a first embodiment. [Diagram 2] FIG. 2 is a cross-sectional view of the boil cooling device shown in FIG. [Diagram 3] 3 is a cross-sectional view taken along line AA in FIG. 2. [Figure 4] FIG. 3 is a cross-sectional view taken along line BB in FIG. [Diagram 5] 5A to 5C are diagrams illustrating a state of a heat receiving part in an example of use of the boil cooling device according to the first embodiment. [Figure 6] 5A to 5C are diagrams illustrating a state of a heat radiating part in an example of use of the boil cooling device according to the first embodiment. [Figure 7] FIG. 4 is a cross-sectional view of a boil cooling device according to a second embodiment. [Figure 8] 8 is a cross-sectional view taken along line CC in FIG. 7. [Figure 9] 8 is a cross-sectional view taken along line DD in FIG. 7. [Figure 10] 13 is a diagram showing a state of a heat receiving part in a usage example of the boil cooling device according to the second embodiment. FIG. [Figure 11] FIG. 1 is a perspective view showing an application example of a boiling cooling device. [Figure 12] FIG. 11 is a cross-sectional view of a boil cooling device according to a first modified example. [Figure 13] FIG. 11 is a cross-sectional view of a boil cooling device according to a second modified example. [Figure 14] FIG. 11 is a cross-sectional view of a boil cooling device according to a third modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Note that the dimensions and scale of each part in the drawings may differ from the actual dimensions and some parts are shown diagrammatically to facilitate understanding. Furthermore, the scope of the present invention is not limited to these embodiments unless otherwise specified in the following description to the effect that the present invention is limited thereto.

[0009] 1. First embodiment 1-1. Overview of boiling cooling device FIG. 1 is a perspective view showing a schematic configuration of a boil cooling device 1 according to a first embodiment. The boil cooling device 1 will be described below with reference to FIG. 1. In the following description, for convenience, the X-axis, Y-axis, and Z-axis, which are perpendicular to each other, are appropriately used. In addition, in the following description, one direction along the X-axis is the X1 direction, and the direction opposite to the X1 direction is the X2 direction. One direction along the Y-axis is the Y1 direction, and the direction opposite to the Y1 direction is the Y2 direction. One direction along the Z-axis is the Z1 direction, and the direction opposite to the Z1 direction is the Z2 direction.

[0010] Typically, the Z axis is a vertical line, the Z1 direction corresponds to the vertical upward direction, and the Z2 direction corresponds to the vertical downward direction. The direction of the Z axis in real space is determined according to the installation posture of the boiling cooling device 1. The Z axis may be inclined within a range of 45° or less with respect to the vertical line. In the following, the term "upper" simply refers to a position in a direction along the vertical line, and includes both the vertical upward direction and the vertical diagonally upward direction as a concept. Similarly, the term "lower" simply refers to a position in a direction along the vertical line, and includes both the vertical downward direction and the vertical diagonally downward direction as a concept.

[0011] The boiling cooling device 1 cools two heating elements 100 indicated by two-dot chain lines in Fig. 1. Each heating element 100 is, for example, a power semiconductor element such as a diode or an IGBT (Insulated Gate Bipolar Transistor). The power semiconductor element is mounted in a power electronics product such as an inverter or rectifier mounted in, for example, a railroad car, an automobile, or a household electric machine.

[0012] In the example shown in FIG. 1, each heating element 100 has a flat shape along the XZ plane. The two heating elements 100 are arranged side by side in the direction along the Y axis so as to sandwich the boil cooling device 1. FIG. 1 shows the outline of the heating element 100. The shape of the heating element 100 is not limited to the example shown in FIG. 1, but is arbitrary. One of the two heating elements 100 may be omitted. The heating element 100 is not limited to a power semiconductor element, and may be any other electric or electronic component that generates heat by being driven or energized, etc., as long as it requires cooling.

[0013] The boiling cooling device 1 is a loop-type thermosiphon type cooler that utilizes the density difference between a vaporized refrigerant RE and a liquefied refrigerant RE. The boiling cooling device 1 has a heat receiving section 10, a heat dissipating section 20, a first pipe section 30, and a second pipe section 40.

[0014] In the heat receiving section 10, the refrigerant RE is heated by the heat from the heating element 100, and the refrigerant RE is vaporized to generate a gas-phase refrigerant. The gas-phase refrigerant rises through the first pipe section 30 due to a decrease in density, and is transported to the heat dissipation section 20. In the heat dissipation section 20, the gas-phase refrigerant is cooled by heat dissipation, and the refrigerant RE is condensed to generate a liquid-phase refrigerant. The liquid-phase refrigerant falls through the second pipe section 40 due to an increase in density, and is transported to the heat receiving section 10. In this way, the refrigerant RE from the heat receiving section 10 is circulated in the order of the first pipe section 30, the heat dissipation section 20, the second pipe section 40, and the heat receiving section 10 due to the density difference between the vaporized refrigerant RE and the liquefied refrigerant RE, and the heating element 100 is cooled. Each part of the boiling cooling device 1 will be described in order below.

[0015] 1-2. Components of the boiling cooling device Fig. 2 is a cross-sectional view of the boil cooling device 1 shown in Fig. 1. Fig. 3 is a cross-sectional view taken along line AA in Fig. 2. Fig. 4 is a cross-sectional view taken along line BB in Fig. 2. Fig. 2 shows a cross-section of the boil cooling device 1 parallel to a plane including the X-axis and Z-axis. Fig. 3 shows a cross-section of the heat receiving part 10 parallel to a plane including the X-axis and Y-axis. Fig. 4 shows a cross-section of the heat receiving part 10 parallel to a plane including the Y-axis and Z-axis.

[0016] 1-2a. Heat receiving part The heat receiving section 10 is a structure having a storage chamber S10, and receives heat from the heat generating body 100. The storage chamber S10 is a space that stores a liquid refrigerant RE. In the heat receiving section 10, the refrigerant RE is vaporized by the heat of the heat generating body 100, thereby generating a gas-phase refrigerant.

[0017] The refrigerant RE is not particularly limited, but examples thereof include water-based refrigerants such as water, alcohol-based refrigerants such as methanol, ketone-based refrigerants such as acetone, glycol-based refrigerants such as ethylene glycol, fluorocarbon-based refrigerants such as Fluorinert, fluorocarbon-based refrigerants such as HFC134a, and hydrocarbon-based refrigerants such as butane. If necessary, a surfactant such as a fluorine-based surfactant, a silicone-based surfactant, or a hydrocarbon-based surfactant may be added to the refrigerant RE. The refrigerant RE may also be a combination of two or more of the above-mentioned refrigerants.

[0018] 2, the heat receiving portion 10 is a box-shaped container having an accommodation chamber S10 as an internal space. The heat receiving portion 10 has a bottom plate 11, a top plate 12, a side wall 13, and a wall member 14.

[0019] Each of the bottom plate 11 and the top plate 12 is a flat plate extending in a direction perpendicular to the Z axis. However, the top plate 12 is located in the Z1 direction relative to the bottom plate 11, and the top plate 12 is provided with holes for connection to the first tube section 30 and the second tube section 40. The bottom plate 11 and the top plate 12 are arranged parallel to each other, and a side wall 13 is arranged between them.

[0020] The sidewall 13 connects the entire outer periphery of the bottom plate 11 and the top plate 12. In this embodiment, the heating element 100 is in contact with the outer periphery of the sidewall 13. In addition, a wall member 14 is disposed inside the sidewall 13. child Here, the wall member 14 extends from the bottom plate 11 toward the top plate 12, and a gap d1 is formed between the top plate 12 and the wall member 14.

[0021] The wall member 14 is disposed so as to divide a part of the storage chamber S10 into two, left and right, in Fig. 2, and is a plate-like member connected to each of the bottom plate 11 and the side wall 13. Here, the wall member 14 spreads along a plane perpendicular to the X-axis, and divides a part of the storage chamber S10 into a first space S11 and a second space S12, as shown in Fig. 3. In addition, as shown in Fig. 4, the wall member 14 has an entire peripheral edge connected to the bottom plate 11 and the side wall 13, except for an edge facing the top plate 12.

[0022] 2, the first space S11 is a recess surrounded by a surface of the wall member 14 facing the X1 direction, the bottom plate 11, and the side wall 13. The second space S12 is a recess surrounded by a surface of the wall member 14 facing the X2 direction, the bottom plate 11, and the side wall 13.

[0023] In this embodiment, the first space S11 and the second space S12 each accommodate a liquid refrigerant RE. That is, in this embodiment, the refrigerant RE accommodated in the accommodation chamber S10 is divided into the refrigerant RE accommodated in the first space S11 and the refrigerant RE accommodated in the second space S12.

[0024] Here, as shown in FIG. 2, when the boiling cooling device 1 is installed without being inclined so that the Z axis is a vertical line, the end of the wall member 14 in the Z1 direction is located above the liquid level RE0 of the refrigerant RE. In other words, in this case, the liquid level RE0 of the refrigerant RE is located below the end of the wall member 14 in the Z1 direction. Therefore, when the Z axis is a vertical line, the movement of the gaseous refrigerant RE between the first space S11 and the second space S12 is permitted through the gap d1 between the wall member 14 and the top plate 12, but the movement of the liquid refrigerant RE between the first space S11 and the second space S12 is prevented by the wall member 14. This prevention is also achieved when the Z axis is inclined around the Y axis within a predetermined angle range with respect to the vertical line so as to be clockwise when viewed in the Y1 direction. The action and effect of the wall member 14 will be described in detail with reference to FIG. 4 described later.

[0025] The heat receiving part 10 is made of a material having excellent thermal conductivity. Specific examples of the material of the heat receiving part 10 include metal materials such as copper, aluminum, or an alloy of either of these. The materials constituting the bottom plate 11, top plate 12, sidewall 13, and wall member 14 of the heat receiving part 10 may be the same or different. The bottom plate 11, top plate 12, sidewall 13, and wall member 14 may each be made of a separate material, or the bottom plate 11, top plate 12, sidewall 13, and wall member 14 may be integrally formed.

[0026] However, the wall member 14 does not need to have thermal conductivity. However, if the wall member 14 has thermal conductivity, the area of ​​the heat transfer surface that transfers heat from the heating element 100 to the refrigerant RE is increased, so that nucleate boiling of the refrigerant RE can be efficiently generated. In this case, from the viewpoint of promoting nucleate boiling of the refrigerant RE, it is preferable that the surface of the wall member 14 has a plurality of recesses or a plurality of protrusions. Examples of the plurality of recesses or the plurality of protrusions include processing marks by machining such as cutting, a plurality of recesses by dimple processing, a plurality of uneven portions by blasting, a recess pattern or a protrusion pattern by etching, the surface of a porous body having continuous pores, and parallel, lattice, or wave-shaped fins formed by extrusion molding, welding, brazing, or the like.

[0027] The heat receiving portion 10 is thermally connected to the heat generating body 100. In this embodiment, the heat generating body 100 is thermally connected to the outer surface of the side wall 13. Here, "thermally connected" means that any one of the following conditions a, b, or c is satisfied. Condition a: The two members are in direct physical contact. Condition b: The two members are disposed with a gap of 50 μm or less between them. Condition c: The two members are disposed with a heat generating capacity of 10 W·m -1 ·K -1 The two components are physically connected via another member having the above thermal conductivity. Note that a heat transfer grease, adhesive, etc. may be present between the two components under each condition. In this case, it is preferable that the adhesive contains a heat conductive filler, etc., from the viewpoint of increasing the thermal conductivity.

[0028] 1-2b. Heat dissipation part The heat dissipation section 20 is a structure having a condensation chamber S20, and dissipates heat from the heat receiving section 10. The condensation chamber S20 is a space in which the refrigerant RE is condensed from a vaporized state to a liquid state. In the heat dissipation section 20, the gas-phase refrigerant generated in the heat receiving section 10 is condensed to generate a liquid-phase refrigerant. Here, the heat dissipation section 20 condenses and liquefies the gas-phase refrigerant in the condensation chamber S20 by dissipating heat through heat exchange with an external fluid. The external fluid is not particularly limited as long as it is a fluid flowing outside the condensation chamber S20, and may be either a liquid or a gas, but is typically, for example, air.

[0029] In the example shown in FIG. 2, the heat dissipation unit 20 has two containers 21 and a plurality of heat dissipation fins 22. Each of the two containers 21 has a condensation chamber S20 as an internal space. The container 21 has a bottom plate 211, a top plate 212, and a side wall 213. The space surrounded by these is the condensation chamber S20. Each of the bottom plate 211 and the top plate 212 is a flat plate extending in a direction intersecting the Z axis. However, the bottom plate 211 is located in the Z2 direction relative to the top plate 212, and the bottom plate 211 is provided with holes for connection to the first pipe section 30 and the second pipe section 40. The bottom plate 211 and the top plate 212 are arranged so as to be parallel to each other, and the side wall 213 is arranged between them. The side wall 213 connects the outer peripheries of the bottom plate 211 and the top plate 212 to each other over the entire circumference.

[0030] In this embodiment, the side wall 213 is cylindrical, and the condensation chamber S20 is columnar. The shape of the condensation chamber S20 is not limited to a columnar shape, and may be, for example, a rectangular columnar shape. The shapes of the inner and outer peripheral surfaces of the side wall 213 may be different from each other.

[0031] The container 21 is made of a material having excellent thermal conductivity. Specific examples of the material of the container 21 include metal materials such as copper, aluminum, and alloys of either of these.

[0032] Each of the heat dissipating fins 22 is thermally connected to two containers 21. Each of the heat dissipating fins 22 is a flat plate-shaped member. The multiple heat dissipating fins 22 are arranged at intervals from each other in the thickness direction. Each of the heat dissipating fins 22 is made of a material having excellent thermal conductivity. Specific examples of the material of the heat dissipating fins 22 include metal materials such as copper, aluminum, or an alloy of either of these. Each of the heat dissipating fins 22 is provided with a hole for inserting the container 21. The heat dissipating fins 22 are fixed to the container 21 by, for example, expanding the tube, pressing, using an adhesive, screwing, brazing, welding, or the like.

[0033] The shape of the heat dissipation fins 22 is not limited to the example shown in Fig. 2 and may be any shape. The heat dissipation fins 22 may be provided as necessary, and may be omitted. However, by having a plurality of heat dissipation fins 22 in the heat dissipation unit 20, the gas of the refrigerant RE can be efficiently condensed and liquefied.

[0034] 1-2c. First pipe section The first pipe section 30 has a first flow path S30 that transports the gas-phase refrigerant generated by vaporizing the refrigerant RE in the heat receiving section 10 to the heat dissipating section 20. In this embodiment, the first pipe section 30 is composed of two steam pipes 31 corresponding to the above-mentioned two containers 21. Each of the two steam pipes 31 extends linearly along the Z axis and is a pipe having the first flow path S30 as an internal space.

[0035] The steam pipe 31 is made of a metal material such as copper, aluminum, or an alloy of any of these. The steam pipe 31 is fixed to the top plate 12 and the bottom plate 211 by brazing or the like. The material of the steam pipe 31 is not limited to a metal material, and may be, for example, a ceramic material or a resin material.

[0036] The steam pipe 31 is connected to both the heat receiving section 10 and the heat radiating section 20, and has an opening 31a opening toward the heat receiving section 10 and an opening 31b opening toward the heat radiating section 20. The opening 31a is a space surrounded by an edge in the Z2 direction of the inner circumferential surface 31c of the steam pipe 31. The opening 31b is a space surrounded by an edge in the Z1 direction of the inner circumferential surface 31c of the steam pipe 31.

[0037] Here, the opening 31a is located on the same plane as the inner wall surface, which is the surface facing the Z2 direction of the top plate 12. Furthermore, of the two steam pipes 31, the opening 31a of one steam pipe 31 opens toward the above-mentioned first space S11, and the opening 31a of the other steam pipe 31 is an example of a "first opening" and opens toward the above-mentioned second space S12.

[0038] Also, a part of the steam pipe 31 protrudes in the Z1 direction from the bottom plate 211 of the heat dissipation unit 20. Therefore, the opening 31b is located in the Z1 direction from the bottom plate 211. This reduces the liquid-phase refrigerant from entering the opening 31b in the container 21 and blocking the opening 31b with the liquid-phase refrigerant. This will be described in detail with reference to FIG. 5 below. The first flow path S30 may be formed by the steam pipe 31 and the top plate 12 of the heat receiving unit 10. In this case, the opening 31a is formed by a hole provided in the top plate 12.

[0039] The first flow path S30 is a space surrounded by an inner circumferential surface 31c of the steam pipe 31. The first flow path S30 communicates with the storage chamber S10 via an opening 31a, and communicates with the condensation chamber S20 via an opening 31b.

[0040] In the example shown in Fig. 2, the width of the first flow path S30 is constant. The cross-sectional area of ​​the first flow path S30 is constant. The cross-sectional shape of the first flow path S30 is circular. The cross-sectional shape of the first flow path S30 is not limited to a circle, and may be, for example, a polygon such as a rectangle, an ellipse, or the like. The first flow path S30 may have a bent or curved portion.

[0041] 1-2d.Second pipe section The second pipe section 40 has a second flow path S40 that transports the liquid-phase refrigerant generated by condensing the gas-phase refrigerant in the heat dissipation section 20 to the heat receiving section 10. In this embodiment, the second pipe section 40 is composed of two liquid pipes 41 corresponding to the above-mentioned two containers 21. Each of the two liquid pipes 41 extends linearly along the Z axis and is a pipe having the second flow path S40 as an internal space.

[0042] The liquid pipe 41 is made of a metal material such as copper, aluminum, or an alloy of any of these. The liquid pipe 41 is fixed to the top plate 12 and the bottom plate 211 by brazing or the like. The material of the liquid pipe 41 is not limited to a metal material, and may be, for example, a ceramic material or a resin material. The material of the liquid pipe 41 may be the same as or different from the material of the steam pipe 31.

[0043] The liquid pipe 41 is connected to both the heat receiving section 10 and the heat dissipating section 20, and has an opening 41a that opens toward the heat receiving section 10 and an opening 41b that opens toward the heat dissipating section 20. The opening 41a is a space surrounded by an edge of the inner circumferential surface 41c of the liquid pipe 41 in the Z2 direction. The opening 41b is a space surrounded by an edge of the inner circumferential surface 41c of the liquid pipe 41 in the Z1 direction.

[0044] Here, a part of the liquid pipe 41 protrudes in the Z2 direction from the top plate 12 of the heat receiving portion 10. Therefore, the opening 41a is located in the Z2 direction from the top plate 12. In this embodiment, the opening 41a is located below the liquid level RE0 of the refrigerant RE. Therefore, it is possible to make it difficult for the gas phase refrigerant to be mixed into the opening 41a. Moreover, the opening 41a is located below the heating element 100 and does not overlap with the heating element 100 when viewed in the direction in which the heating element 100 and the heat receiving portion 10 overlap. Therefore, it is possible to make it difficult for bubbles generated by nucleate boiling of the refrigerant RE to enter the opening 41a. Moreover, of the two liquid pipes 41, the opening 41a of one liquid pipe 41 is located in the first space S11 described above, and the opening 41a of the other liquid pipe 41 is an example of a "second opening" and is located in the second space S12 described above.

[0045] Furthermore, the opening 41b is located on the same plane as the surface of the bottom plate 211 of the heat dissipation unit 20 facing the Z1 direction. This makes it easier to introduce the liquid-phase refrigerant into the opening 41b inside the container 21. This will be described in detail later with reference to FIG. 5. The second flow path S40 may be formed by the liquid pipe 41 and the bottom plate 211 of the heat dissipation unit 20. In this case, the opening 41b is formed by a hole provided in the bottom plate 211.

[0046] The second flow path S40 is a space surrounded by an inner circumferential surface 41c of the liquid pipe 41. The second flow path S40 communicates with the storage chamber S10 via an opening 41a, and communicates with the condensation chamber S20 via an opening 41b.

[0047] The cross-sectional area of ​​the second flow path S40 is smaller than that of the first flow path S30. That is, the cross-sectional area of ​​the first flow path S30 is larger than that of the second flow path S40. Therefore, the gas-phase refrigerant can be transported more smoothly in the first flow path S30 than in a configuration in which the cross-sectional area of ​​the first flow path S30 is equal to or smaller than that of the second flow path S40. The cross-sectional area of ​​the second flow path S40 may be equal to that of the first flow path S30.

[0048] In the example shown in Fig. 2, the width of the second flow path S40 is constant. The cross-sectional area of ​​the second flow path S40 is constant. The cross-sectional shape of the second flow path S40 is circular. The cross-sectional shape of the second flow path S40 is not limited to a circle, and may be, for example, a polygon such as a rectangle, an ellipse, or the like. The second flow path S40 may have a bent or curved portion.

[0049] 1-3. Examples of use of boiling cooling equipment FIG. 5 is a diagram showing the state of the heat receiving part 10 in a use example of the boiling cooling device 1 according to the first embodiment. FIG. 5 shows the state of the heat receiving part 10 when the boiling cooling device 1 is installed at an angle θ1 around the Y axis. Here, the angle θ1 is equal to the angle between the horizontal plane F0 and the bottom surface of the heat receiving part 10, or the angle between the center line LC of the storage chamber S10 or the center line of the liquid pipe 41 and a vertical line. Specifically, the angle θ1 is an angle of 45° or less. The center line LC is a straight line that passes through the center of the storage chamber S10 and is perpendicular to the bottom plate 11 or the top plate 12.

[0050] 5, even when the inclination angle of the boiling cooling device 1 is angle θ1, the end of the wall member 14 in the Z1 direction is located above the liquid level RE0 of the refrigerant RE. In other words, even in this case, the liquid level RE0 of the refrigerant RE is located below the end of the wall member 14 in the Z1 direction. Therefore, even in this case, the movement of the gaseous refrigerant RE between the first space S11 and the second space S12 is permitted through the gap d1 between the wall member 14 and the top plate 12, but the movement of the liquid refrigerant RE between the first space S11 and the second space S12 is prevented by the wall member 14. Note that when the inclination angle of the boiling cooling device 1 is angle θ1, the end of the wall member 14 in the Z1 direction may coincide with the liquid level RE0.

[0051] In Fig. 5, the liquid level RE0 when the inclination angle of the boiling cooling device 1 is angle θ1 is shown by a solid line. Also, in Fig. 5, the liquid level RE0 when the boiling cooling device 1 is not inclined is shown by a dashed line. Furthermore, in Fig. 5, the liquid level RE0 of the refrigerant RE when the wall member 14 is omitted is shown by a dashed double-dashed line.

[0052] 5, when the boiling cooling device 1 is tilted, the bottom surface of the first space S11 is located above the bottom surface of the second space S12. Even in this case, the movement of the liquid refrigerant RE from the first space S11 to the second space S12 is prevented by the wall member 14, so the distance between the liquid level RE0 of the refrigerant RE and the opening 31a of the vapor pipe 31 can be made larger than when the wall member 14 is omitted. Therefore, even when the boiling cooling device 1 is tilted, blocking of the opening 31a by the refrigerant RE can be reduced.

[0053] Here, the liquid level RE0 is inclined about the Y axis with respect to the X axis in each of the first space S11 and the second space S12 individually. Therefore, in each of the first space S11 and the second space S12, the distance between the center of the liquid level RE0 and the top plate 12 in the direction along the X axis hardly changes.

[0054] 5, the opening 31a is located at the center of the first space S11 and the second space S12 in the direction along the X-axis. Therefore, the distance between the liquid level RE0 of the refrigerant RE and the opening 31a of the vapor pipe 31 hardly changes compared to the case where the boiling cooling device 1 is not tilted.

[0055] The length of the wall member 14 in the direction along the Z axis, i.e., the height h of the wall member 14, is set so that the end of the wall member 14 in the Z1 direction is positioned above the liquid level RE0, even when the inclination angle of the boiling cooling device 1 is angle θ1, as described above.

[0056] Here, it is preferable that the height h is greater than the height H1. In this case, the above-mentioned effect of the wall member 14 can be suitably obtained. However, the height H1 is calculated by the following formula (1). H1=(b-(aL) / tanθ2) (1) In formula (1), a is the length [mm] of the second space S12 in the direction along the X-axis. b is the length [mm] of the storage chamber S10 in the direction along the Z-axis. L is the distance [mm] between the opening 31a corresponding to the second space S12 and the side wall 13 in the direction along the X-axis. θ2 is the angle [°] between the horizontal plane F0 and the Z-axis, and satisfies the relationship θ2=90[°]-θ1.

[0057] 5, when the inclination angle of the boil cooling device 1 is angle θ1, the steam pipe 31 is located above the liquid pipe 41. Therefore, while increasing the distance between the opening 31a and the liquid level RE0 as described above, a sufficient area for arranging the liquid pipe 41 can be secured between the steam pipe 31 and the side wall 13 or the wall member 14.

[0058] Fig. 6 is a diagram showing the state of the heat dissipation section 20 in a usage example of the boil cooling device 1 according to the first embodiment. Fig. 6 shows the state of the heat dissipation section 20 when the boil cooling device 1 is installed tilted around the Y axis as shown in Fig. 5 described above.

[0059] 6, when the inclination angle of the boil cooling device 1 is angle θ1, the opening 41b is located below the opening 31b. Therefore, it is easier to introduce the liquid-phase refrigerant from the container 21 to the opening 41b compared to a configuration in which the opening 41b is located above the opening 31b. Moreover, in this embodiment, as described above, the opening 41b opens on the inner wall surface of the bottom plate 211 of the container 21, so that the liquid-phase refrigerant can be smoothly guided to the opening 41b along the inner wall surface.

[0060] In addition, since the opening 31b is located above the opening 41b, the opening 31b is less likely to be blocked by the liquid-phase refrigerant in the container 21, compared to a configuration in which the opening 31b is located below the opening 41b. Moreover, in this embodiment, since the opening 31b is located in the Z1 direction from the bottom plate 211 as described above, the opening 31b can be positioned above the liquid level of the liquid-phase refrigerant accumulated in the container 21. This suitably reduces the liquid-phase refrigerant from entering the opening 31b in the container 21 and the opening 31b from being blocked by the liquid-phase refrigerant.

[0061] 1-4. Summary As described above, the boiling cooling device 1 has the heat receiving section 10, the heat dissipating section 20, the first pipe section 30, and the second pipe section 40. The heat receiving section 10 has an accommodation chamber S10 that accommodates the refrigerant RE, and receives heat from the heating element 100. The heat dissipating section 20 dissipates heat from the heat receiving section 10. The first pipe section 30 transports the gas phase refrigerant generated by vaporizing the refrigerant RE in the heat receiving section 10 to the heat dissipating section 20. The second pipe section 40 transports the liquid phase refrigerant generated by condensing the gas phase refrigerant in the heat dissipating section 20 to the heat receiving section 10.

[0062] In addition, the heat receiving section 10 has a wall member 14 that divides at least a part of the accommodation chamber S10 into a first space S11 and a second space S12. Here, the first pipe section 30 has an opening 31a serving as a first opening that opens toward the second space S12. Also, at least a part of the wall member 14 is located above the liquid level RE0 of the liquid refrigerant RE accommodated in the accommodation chamber S10. Then, the wall member 14 prevents the liquid refrigerant RE from moving from the first space S11 to the opening 31a serving as the first opening.

[0063] In the above boiling cooling device, at least a part of the wall member 14 is located above the liquid level RE0 of the liquid refrigerant RE contained in the storage chamber S10, so that even if the center line LC of the storage chamber S10 is inclined with respect to the vertical line VL, the wall member 14 can prevent the liquid refrigerant RE from moving from the first space S11 to the opening 31a serving as the first opening. Therefore, even if the boiling cooling device 1 is installed in an inclined position, the refrigerant RE can be prevented from blocking the opening 31a serving as the first opening. As a result, regardless of the installation position of the boiling cooling device 1, the circulation of the refrigerant RE from the heat receiving portion 10 through the first pipe portion 30, the heat dissipation portion 20, and the second pipe portion 40 in this order and returning to the heat receiving portion 10 is performed more smoothly than in the past, so that the deterioration of the cooling performance can be reduced.

[0064] Here, since the first space S11 and the second space S12 communicate with each other within the accommodation chamber S10, there is an advantage that, compared to a configuration in which the first space S11 and the second space S12 are independent spaces, it is easier to fill the accommodation chamber S10 with the refrigerant RE during manufacture of the boiling cooling device 1. Furthermore, when the center line LC is inclined with respect to the vertical line VL, the above-mentioned heat dissipation fins 22 are inclined with respect to the horizontal plane F0. Therefore, compared to a case in which the heat dissipation fins 22 are parallel to the horizontal plane F0, it is easier to generate an airflow along the heat dissipation fins 22, and the heat dissipation performance of the heat dissipation section 20 can be improved.

[0065] In this embodiment, as described above, the wall member 14 divides the liquid refrigerant RE contained in the storage chamber S10 into the refrigerant RE contained in the first space S11 and the refrigerant RE contained in the second space S12. Therefore, compared to a configuration in which the liquid refrigerant RE is contained in one space, the distance between the liquid level RE0 of the refrigerant RE and the opening 31a serving as the first opening when the boiling cooling device 1 is installed in an inclined position can be made larger.

[0066] As described above, the second pipe portion 40 has the opening 41a as the second opening that opens toward the second space S12. Therefore, both the opening 31a as the first opening and the opening 41a as the second opening open toward the second space S12.

[0067] In addition, the opening 31a serving as the first opening is located above the liquid level RE0 of the liquid refrigerant RE contained in the second space S12. Therefore, the gas-phase refrigerant generated in the second space S12 can be smoothly introduced into the opening 31a serving as the first opening.

[0068] On the other hand, the opening 41a as the second opening is located below the liquid level RE0 of the liquid refrigerant RE contained in the second space S12. This can reduce the intrusion of the gas-phase refrigerant generated in the second space S12 into the opening 41a as the second opening. Moreover, since both the opening 31a as the first opening and the opening 41a as the second opening open toward the second space S12, the first pipe section 30 and the second pipe section 40 can be disposed close to each other. As a result, when the boil cooling device 1 is installed in an inclined position, it can reduce the opening 41a as the second opening coming into contact with or separating from the refrigerant RE.

[0069] Furthermore, as described above, the first pipe section 30 has a plurality of vapor pipes 31 that transport the gas-phase refrigerant from the heat receiving section 10 to the heat dissipating section 20. The plurality of vapor pipes 31 include a vapor pipe 31 having an opening 31a as a first opening, and a vapor pipe 31 having an opening 31a that opens toward the first space S11. The second pipe section 40 has a plurality of liquid pipes 41 that transport the liquid-phase refrigerant from the heat dissipating section 20 to the heat receiving section 10. The plurality of liquid pipes 41 include a liquid pipe 41 having an opening 41a as a second opening, and a liquid pipe 41 having an opening 41a that opens toward the first space S11.

[0070] By using a plurality of vapor pipes 31 and a plurality of liquid pipes 41 in this manner, it is possible to improve the circulation efficiency of the refrigerant RE. In addition, in a configuration having a plurality of vapor pipes 31 and a plurality of liquid pipes 41 in this manner, the vapor pipes 31 and the liquid pipes 41 are disposed at positions shifted from the center line LC of the accommodation chamber S10. Therefore, in this configuration, when the boiling cooling device 1 is installed in an inclined position, it is useful to provide the wall member 14 described above in order to prevent the opening of the vapor pipe 31 from being blocked by the liquid refrigerant RE.

[0071] As described above, the wall member 14 extends upward from the bottom surface of the storage chamber S10. Therefore, the wall member 14 can be made of a plate material. As a result, the configuration or manufacturing of the boil cooling device 1 can be simplified.

[0072] Furthermore, as described above, when the height of the wall member 14 is h, the length of the second space S12 along the thickness direction of the wall member 14 is a, the length of the storage chamber S10 in the height direction of the wall member 14 is b, the distance between the opening 31a as the first opening in the thickness direction of the wall member 14 and the side surface of the storage chamber S10 is L, and the angle between the height direction of the wall member 14 and the horizontal plane F0 is θ2, it is preferable that the relationship h>(b-(aL) / tan θ2) is satisfied when θ2 is smaller than 45°.

[0073] When this relationship is satisfied, it is possible to increase the accommodation rate of the refrigerant RE in the accommodation chamber S10 and reduce blocking of the opening 31a as the first opening by the liquid refrigerant RE, compared to when this relationship is not satisfied.

[0074] As described above, the heat receiving portion 10 receives heat from the heating element 100 from the side. In this case, even if the boiling cooling device 1 is installed in an inclined position, it is possible to reduce a decrease in the overlapping area between the liquid refrigerant RE and the heating element 100 when viewed in the direction in which the heat receiving portion 10 and the heating element 100 are aligned. Therefore, even if the boiling cooling device 1 is installed in an inclined position, heat can be efficiently transferred from the heating element 100 to the liquid refrigerant RE of the heat receiving portion 10.

[0075] 2. Second embodiment A second embodiment of the present invention will be described below. In the following example, for elements having the same actions and functions as those in the previous embodiment, the reference numerals used in the description of the previous embodiment will be used and detailed descriptions of each will be omitted as appropriate.

[0076] Fig. 7 is a cross-sectional view of a boil cooling device 1A according to a second embodiment. Fig. 8 is a cross-sectional view taken along line CC in Fig. 7. Fig. 9 is a cross-sectional view taken along line DD in Fig. 7. The boil cooling device 1A is similar to the boil cooling device 1 of the first embodiment described above, except that it has a heat receiving part 10A instead of the heat receiving part 10. The heat receiving part 10A is similar to the heat receiving part 10, except that it has a wall member 15 instead of the wall member 14.

[0077] The wall member 15 extends in the X1 direction from an inner wall surface of the side wall 13 facing the X1 direction, and a gap d2 is formed between the wall member 15 and an inner wall surface of the side wall 13 facing the X2 direction.

[0078] The wall member 15 is a plate-like member disposed so as to divide a part of the storage chamber S10 into two, upper and lower, as shown in Fig. 7, and connected to the side wall 13. Here, the wall member 15 spreads along a plane perpendicular to the Z axis, and divides a part of the storage chamber S10 into a first space S13 and a second space S14, as shown in Fig. 7. In addition, as shown in Fig. 8, the wall member 15 is connected to the side wall 13 over the entire periphery, except for an edge facing an inner plane of the side wall 13 facing the X2 direction.

[0079] The wall member 15 is disposed at a position overlapping the steam pipe 31 and the liquid pipe 41 on the right side in FIG. 7 as viewed in the direction along the Z axis. In the example shown in FIG. 7, a through hole 15a is provided in the wall member 15. The through hole 15a is a hole into which one of the two liquid pipes 41 arranged in the direction along the X axis, which is located in the X2 direction, is inserted. The one liquid pipe 41 is fixed to the wall member 15 by tube expansion, press fitting, adhesive, screwing, brazing, welding, or the like as necessary. In addition, a gap between the inner wall surface of the through hole 15a and the outer circumferential surface of the liquid pipe 41 is blocked so that the refrigerant RE does not move from the first space S13 to the second space S14 through the through hole 15a. Note that the through hole 15a may be omitted. In this case, the liquid pipe 41 has a bent or curved portion so as to extend downward to bypass the wall member 15, for example.

[0080] 7, when the boiling cooling device 1 is installed without being tilted so that the Z-axis is a vertical line, the wall member 15 is located above the liquid level RE0 of the refrigerant RE. Therefore, the liquid refrigerant RE is present in the first space S13, but the liquid refrigerant is substantially not present in the second space S14.

[0081] Fig. 10 is a diagram showing the state of the heat receiving part 10A in a usage example of the boil cooling device 1A according to the second embodiment. Fig. 10 shows the state of the heat receiving part 10A when the boil cooling device 1 is installed at an angle θ1 around the Y axis.

[0082] 10, when the inclination angle of the boiling cooling device 1A is angle θ1, the wall member 15 prevents the liquid refrigerant RE from moving from the first space S13 to the second space S14. Therefore, even in this case, the liquid refrigerant RE is present in the first space S13, but the liquid refrigerant is substantially not present in the second space S14.

[0083] In Fig. 10, the liquid level RE0 when the inclination angle of the boiling cooling device 1A is angle θ1 is shown by a solid line. Also, in Fig. 10, the liquid level RE0 when the boiling cooling device 1 is not inclined is shown by a dashed line. Furthermore, in Fig. 10, the liquid level RE0 of the refrigerant RE when the wall member 14 is omitted is shown by a two-dot chain line.

[0084] 10, when the boiling cooling apparatus 1A is tilted, the movement of the liquid refrigerant RE from the first space S13 to the second space S14 is blocked by the wall member 14, and the liquid level RE0 is prevented from approaching the opening 31a as in the case where the wall member 15 is omitted. Therefore, even when the boiling cooling apparatus 1A is tilted, the blocking of the opening 31a by the refrigerant RE can be reduced.

[0085] The length of the wall member 15 in the direction along the X-axis, i.e., the height h of the wall member 14, is set so that the end of the wall member 15 in the X1 direction is positioned above the liquid level RE0 even when the inclination angle of the boiling cooling device 1A is angle θ1.

[0086] Here, it is preferable that the height h is greater than the height H2. In this case, the above-mentioned effect of the wall member 15 can be suitably obtained. However, the height H2 is calculated by the following formula (2). H2 = (L + c × tan θ2) (2) In formula (2), c is the length [mm] of the second space S14 in the direction along the Z axis. L is the distance [mm] between the opening 31a and the side wall 13 in the direction along the X axis for the opening 31a closer to the wall member 15 out of the two openings 31a. θ2 is the angle [°] between the horizontal plane F0 and the Z axis, and satisfies the relationship θ2=90[°]-θ1.

[0087] The second embodiment described above can also reduce the deterioration of cooling performance, as in the first embodiment described above. In this embodiment, as described above, the wall member 15 is located above the liquid level RE0 of the liquid refrigerant RE contained in the storage chamber S10. Therefore, even if the liquid refrigerant RE contained in the storage chamber S10 is not divided into the first space S13 and the second space S14, it is possible to reduce blocking of the opening 31a as the first opening by the liquid refrigerant RE.

[0088] As described above, the second pipe section 40 has the opening 41a as the second opening that opens toward the first space S13. Therefore, the liquid phase refrigerant from the second pipe section 40 can be discharged into the first space S13.

[0089] In addition, opening 31a serving as a first opening is located above wall member 15. Therefore, wall member 15 can prevent the movement of liquid refrigerant RE from the first space S13 to opening 31a serving as the first opening.

[0090] On the other hand, the opening 41a serving as the second opening is located below the liquid level RE0 of the liquid refrigerant RE contained in the first space S13. This can reduce the intrusion of the gas-phase refrigerant generated in the first space S13 into the opening 41a serving as the second opening.

[0091] Furthermore, as described above, the first pipe section 30 has a plurality of vapor pipes 31 that transport the gas-phase refrigerant from the heat receiving section 10 to the heat radiating section 20. The plurality of vapor pipes 31 include a vapor pipe 31 having an opening 31a as a first opening, and a vapor pipe 31 that does not overlap the wall member 15 when viewed in the thickness direction of the wall member 15. The second pipe section 40 has a plurality of liquid pipes 41 that transport the liquid-phase refrigerant from the heat receiving section 20 to the heat receiving section 10. The plurality of liquid pipes 41 include a liquid pipe 41 having an opening 41a as a second opening, and a liquid pipe 41 that does not overlap the wall member 15 when viewed in the thickness direction of the wall member 15.

[0092] By using the plurality of vapor pipes 31 and the plurality of liquid pipes 41 in this manner, it is possible to improve the circulation efficiency of the refrigerant RE. In addition, in the configuration having the plurality of vapor pipes 31 and the plurality of liquid pipes 41 in this manner, the vapor pipes 31 and the liquid pipes 41 are provided at positions shifted from the center line LC of the accommodation chamber S10. Therefore, in this configuration, when the boiling cooling device 1 is installed in an inclined position, providing the wall member 15 described above is useful in preventing the opening of the vapor pipe 31 from being blocked by the liquid refrigerant RE.

[0093] As described above, the liquid pipe 41 having the opening 41a as the second opening penetrates the wall member 15. Therefore, even if the liquid pipe 41 is disposed near the steam pipe 31, the liquid pipe 41 can be configured to extend linearly. Such a liquid pipe 41 does not require processing such as bending. Therefore, the cost of the boil cooling device 1 can be reduced.

[0094] Furthermore, as described above, the wall member 15 extends laterally from the side surface of the storage chamber S10. Therefore, the wall member 15 can be made of a plate material. As a result, the configuration or manufacturing of the boil cooling device 1 can be simplified.

[0095] Furthermore, as described above, when the height of the wall member 15 is h, the length of the second space S14 in the thickness direction of the wall member 15 is c, the distance between the opening 31a as the first opening in the height direction of the wall member 15 and the side surface of the storage chamber S10 is L, and the angle between the height direction of the wall member 15 and the horizontal plane F0 is θ2, if θ2 is smaller than 45°, it is preferable to satisfy the relationship h>(L+c×tan θ2).

[0096] When this relationship is satisfied, it is possible to increase the accommodation rate of the refrigerant RE in the accommodation chamber S10 and reduce blocking of the opening 31a as the first opening by the liquid refrigerant RE, compared to when this relationship is not satisfied.

[0097] 3. Application Examples Fig. 11 is a perspective view showing an application example of the boil cooling device 1. Fig. 11 shows an example in which a plurality of heat generating bodies 100 are cooled by a plurality of boil cooling devices 1.

[0098] 11, a plurality of boil cooling devices 1 and a plurality of heating elements 100 are arranged alternately in the direction along the Y axis. Here, the plurality of boil cooling devices 1 and the plurality of heating elements 100 are fixed by a fixing device (not shown) so that the adjacent boil cooling devices 1 and heating elements 100 are in close contact with each other. With the above configuration, the plurality of boil cooling devices 1 can cool the plurality of heating elements 100.

[0099] The heat dissipation fins 22 of two adjacent boil cooling devices 1 may be integrally formed. The number of boil cooling devices 1 is determined according to the number of heat generating bodies 100 to be cooled, and is not limited to the example shown in Fig. 11, and may be five or less or seven or more. The example shown in Fig. 11 uses a boil cooling device 1, but the above-mentioned boil cooling device 1A may be used instead of at least one of the multiple boil cooling devices 1.

[0100] 4. Variations The present invention is not limited to the above-described embodiments, and various modifications are possible. Furthermore, the embodiments and modifications may be combined as appropriate.

[0101] 4-1. Variation 1 In the first embodiment described above, a gap d1 is provided between the end of the wall member 14 in the Z1 direction and the top plate 12, but the wall member 14 may be provided over the entire area of ​​the accommodation chamber S10 in the direction along the Z axis. In this case, for example, the first space S11 and the second space S12 communicate with each other via an appropriate flow path at a position above the liquid level RE0 of the refrigerant RE.

[0102] In the second embodiment described above, the gap d2 is provided between the end of the wall member 15 in the X1 direction and the side wall 13, but the wall member 15 may be provided over the entire area of ​​the accommodation chamber S10 in the direction along the X axis. In this case, for example, the first space S11 and the second space S12 communicate with each other via an appropriate flow path at a position above the liquid level RE0 of the refrigerant RE.

[0103] 12 is a cross-sectional view of a boil cooling device 1B according to Modification 1. The boil cooling device 1B is similar to the boil cooling device 1 of the above-described first embodiment, except that it has a heat receiving part 10B instead of the heat receiving part 10. The heat receiving part 10B is similar to the heat receiving part 10, except that it has a wall member 14B instead of the wall member 14.

[0104] The wall member 14B is provided over the entire area of ​​the storage chamber S10 in the direction along the Z axis, and is similar to the wall member 14 except that it has a hole 14a that communicates the first space S11 and the second space S12. The hole 14a is located above the liquid level RE0 of the refrigerant RE. Here, the distance between the hole 14a and the bottom plate 11 in the direction along the Z axis corresponds to the height h in the first embodiment described above. The above modification 1 can also reduce the deterioration of cooling performance, as in the first embodiment described above.

[0105] 4-2. Variation 2 Although the wall member 14 of the first embodiment and the wall member 15 of the second embodiment are each flat, the shapes of the wall member 14 and the wall member 15 are not limited to this, and may have, for example, a bent or curved portion as long as at least a part of the wall member 14 or the wall member 15 is located above the liquid level RE0. In addition, the connection position of the wall member 14 or the wall member 15 to the inner wall surface of the storage chamber S10 is also not limited to the above-mentioned embodiment.

[0106] 13 is a cross-sectional view of a boil cooling device 1C according to Modification 2. The boil cooling device 1C is similar to the boil cooling device 1 of the above-described first embodiment, except that it has a heat receiving part 10C instead of the heat receiving part 10. The heat receiving part 10C is similar to the heat receiving part 10, except that it has a wall member 15C instead of the wall member 14.

[0107] Wall member 15C is similar to wall member 15 of the second embodiment described above, except that it has a portion that extends in the Z2 direction from top plate 12 and then bends to extend in the X1 direction. Here, the distance between the end of wall member 15C in the X1 direction and side wall 13 corresponds to height h in the second embodiment described above. With the above-described second modification, it is possible to reduce the deterioration of cooling performance, as with the second embodiment described above.

[0108] 4-3. Variation 3 The wall member 14 of the first embodiment and the wall member 15 of the second embodiment described above each extend from the inner wall surface of the storage chamber S10 in a direction perpendicular to the inner wall surface of the storage chamber S10, but may also extend in a direction inclined relative to the normal to the inner wall surface of the storage chamber S10.

[0109] 14 is a cross-sectional view of a boil cooling device 1D according to Modification 3. The boil cooling device 1D is similar to the boil cooling device 1 of the above-described first embodiment, except that it has a heat receiving part 10D instead of the heat receiving part 10. The heat receiving part 10D is similar to the heat receiving part 10, except that it has a wall member 15D instead of the wall member 14.

[0110] The wall member 15D is similar to the wall member 15 of the second embodiment described above, except that it extends obliquely upward from the side wall 13 in a direction inclined with respect to the X-axis. However, the wall member 15D has a portion located below the liquid level RE0. Here, the distance between the end of the wall member 15D in the X1 direction and the side wall 13 corresponds to the height h in the second embodiment described above. The above modification 3 can also reduce the deterioration of cooling performance, as in the second embodiment described above. Note that in modification 3, a small amount of liquid refrigerant RE may be accommodated in the second space S14.

[0111] 4-4. Variation 4 In the above embodiment, the opening 41a of the liquid pipe 41 is located below the liquid level RE0, but this is not limited thereto, and the opening 41a may be located above the liquid level RE0. Also, in the above embodiment, the opening 31b of the steam pipe 31 is located above the bottom surface of the container 21, but this is not limited thereto, and the opening 31b of the steam pipe 31 may be located on the same plane as the bottom surface of the container 21.

[0112] 4-5. Variation 5 In the above embodiment, two steam pipes 31 and two liquid pipes 41 are provided for one heat receiving section 10, but the number of steam pipes 31 or liquid pipes 41 provided for one heat receiving section 10 may be one or three or more. The number of containers 21 included in the heat dissipation section 20 may be one or three or more. The heat dissipation fins 22 of the heat dissipation section 20 may be divided for each container 21. [Explanation of symbols]

[0113] 1... Boiling cooling device, 1A... Boiling cooling device, 1B... Boiling cooling device, 1C... Boiling cooling device, 1D... Boiling cooling device, 10... Heat receiving part, 10A... Heat receiving part, 10B... Heat receiving part, 10C... Heat receiving part, 10D... Heat receiving part, 11... Bottom plate, 12... Top plate, 12a... Inside Wall surface, 13... Side wall, 14... Wall member, 14B... Wall member, 14a... Hole, 15... Wall member, 15C... Wall member, 15D... Wall member, 15a... Through hole, 20... Heat radiation part, 21... Container, 22... Heat radiation fin, 30... First pipe part, 31... Steam pipe, 31a... Opening, 3 1b...opening, 31c...inner surface, 40...second pipe section, 41...liquid pipe, 41a...opening, 41b...opening, 41c...inner surface, 100...heating element, 211...bottom plate, 212...top plate, 213...side wall, F0...horizontal surface, LC...center line, RE...refrigerant, RE0...liquid level, S10...storage chamber, S11...first space, S12...second space, S13...first space, S14...second space, S20...condensation chamber, S30...first flow path, S40...second flow path, VL...vertical line, d1...gap, d2...gap, h...height, θ1...angle, θ2...angle.

Claims

1. a heat receiving portion having a chamber for accommodating a refrigerant and receiving heat from a heating element; A heat dissipation section that dissipates heat from the heat receiving section; A first pipe portion that transports a gas phase refrigerant generated by vaporizing the refrigerant in the heat receiving portion to the heat dissipating portion; a second pipe portion that transports a liquid-phase refrigerant generated by condensing the gas-phase refrigerant in the heat dissipation portion to the heat receiving portion, The heat receiving portion has a wall member that divides at least a part of the accommodation chamber into a first space and a second space, The first pipe portion has a first opening that opens toward the second space, The second pipe portion has a second opening that opens toward the second space, The first opening is located above a liquid level of the liquid refrigerant contained in the second space, The second opening is located below a liquid level of the liquid refrigerant contained in the second space, The first pipe portion has a plurality of vapor pipes that transport the gas-phase refrigerant from the heat receiving portion to the heat radiating portion, the second pipe portion has a plurality of liquid pipes that transport the liquid-phase refrigerant from the heat dissipation portion to the heat receiving portion, the plurality of steam pipes include a steam pipe having the first opening and a steam pipe having an opening that opens toward the first space, the plurality of liquid pipes include a liquid pipe having the second opening and a liquid pipe having an opening that opens toward the first space, At least a portion of the wall member is located above a liquid level of the liquid refrigerant contained in the storage chamber, The wall member divides the liquid refrigerant contained in the storage chamber into a refrigerant contained in the first space and a refrigerant contained in the second space, and prevents the liquid refrigerant from moving from the first space to the first opening. Boiling cooler.

2. The wall member extends upward from a bottom surface of the storage chamber. The boiling cooling device according to claim 1.

3. When the height of the wall member is h, the length of the second space along the thickness direction of the wall member is a, the length of the storage chamber in the height direction of the wall member is b, the distance between the first opening and the side surface of the storage chamber in the thickness direction of the wall member is L, and the angle between the height direction of the wall member and a horizontal plane is θ2, When θ2 is smaller than 45°, The relationship of h>(b-(a-L) / tan θ2) is satisfied. The boiling cooling device according to claim 2.

4. A heat receiving section having a chamber for accommodating a refrigerant and receiving heat from a heating element; A heat dissipation section that dissipates heat from the heat receiving section; A first pipe portion that transports a gas phase refrigerant generated by vaporizing the refrigerant in the heat receiving portion to the heat dissipating portion; a second pipe portion that transports a liquid-phase refrigerant generated by condensing the gas-phase refrigerant in the heat dissipation portion to the heat receiving portion, The heat receiving portion has a wall member that divides at least a part of the accommodation chamber into a first space and a second space, The first pipe portion has a first opening that opens toward the second space, the second pipe portion has a second opening that opens toward the first space, The first opening is located above the wall member, The second opening is located below a liquid level of the liquid refrigerant contained in the first space, The first pipe portion has a plurality of vapor pipes that transport the gas-phase refrigerant from the heat receiving portion to the heat radiating portion, the second pipe portion has a plurality of liquid pipes that transport the liquid-phase refrigerant from the heat dissipation portion to the heat receiving portion, the plurality of steam pipes include a steam pipe having the first opening and a steam pipe that does not overlap the wall member in a thickness direction of the wall member, the plurality of liquid pipes include a liquid pipe having the second opening and a liquid pipe that does not overlap with the wall member when viewed in a thickness direction of the wall member, the wall member is located above a liquid level of the liquid refrigerant contained in the storage chamber and prevents the liquid refrigerant from moving from the first space to the first opening. Boiling cooler.

5. A liquid pipe having the second opening passes through the wall member. The boiling cooling device according to claim 4.

6. The wall member extends laterally from a side surface of the storage chamber. The boiling cooling device according to claim 4 or 5.

7. When the height of the wall member is h, the length of the second space in the thickness direction of the wall member is c, the distance between the first opening and the side surface of the storage chamber in the height direction of the wall member is L, and the angle between the height direction of the wall member and a horizontal plane is θ2, When θ2 is smaller than 45°, The relationship of h>(L+c×tan θ2) is satisfied. The boiling cooling device according to claim 6.

8. The heat receiving portion receives heat from the heating element from the side. The boil cooling device according to any one of claims 1 to 7.

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