Wafer-scale enhanced-gain electron-bombarded CMOS imager

Abstract

The present invention provides an apparatus, system, and method for fabricating stacked wafers containing an array of image intensifiers that can be pumped on a wafer scale. Wafer-scale fabrication techniques, including bonding, pumping, and compressive sealing, simultaneously form multiple EBCMOS imager anodes with design elements that enable high-voltage operation with optional enhancement of additional gain through TMSE amplification. The TMSE amplification is preferably one or more multiplication semiconductor wafers of the array of EBD dies disposed between a photocathode in a photocathode wafer and an imager anode, which is preferably an EBCMOS imager anode bonded or integrated to an interconnect die in an interconnect wafer.

Description

[Technical field]

[0001] This application claims priority to pending patent application Ser. No. 63 / 058,256, filed July 29, 2020, the disclosure of which is incorporated herein by reference in its entirety.

[0002] The present disclosure relates generally to image intensifiers used to detect low light level images, and more specifically to electron-bombarded complementary metal-oxide semiconductor (EBCMOS) imagers that can include additional electronic amplification or gain, all of which can be fabricated within the other image intensifier components at wafer scale. [Background technology]

[0003] Low-light surveillance cameras, such as night vision cameras, continue to advance the video display and processing capabilities of image intensifiers. Night vision cameras can include image intensifiers, commonly known as image intensifiers. Image intensifiers include vacuum tubes in which a photocathode is spaced apart from a sensor anode. The photocathode detects infrared light in the form of photons from an object or image, and the image intensifier amplifies or multiplies the resulting photoelectrons or electrons emitted from the photocathode. The anode can include a sensor that receives the electrons and produces an intensified image representation on a screen or display. The photocathode and anode are typically spaced apart parallel to one another and supported within a vacuum housing to provide gain and facilitate the flow of electrons between the photocathode and the anode.

[0004] Image intensifiers produce high quality images over a wide range of light levels, including the very low light levels encountered under starlight and lower illumination levels. Image intensifiers are typically small and operate at low power, making them suitable for portable handheld or head-mounted applications. There is a need to form multiple image intensifiers coincidentally or simultaneously using wafer fabrication techniques. There is also a need to simultaneously vacuum seal multiple image intensifiers for consistent, repeatable, and reliable production at low cost. The need includes forming each component of the image intensifier on individual wafers, maintaining the appropriate spacing or gaps between the specific wafers, and then heating and evacuating the space to form multiple co-planar intensifiers on the stacked wafer scale before dicing the stacked wafers into stacked and sealed individual image intensifier dies. This need was not considered, or met, when forming conventional image intensifiers using conventional manufacturing techniques. Summary of the Invention

[0005] Many image intensifier cameras, or simply image intensifiers, use a photocathode to amplify ambient light into a useful display image. The photocathode receives the image and converts photons into electrons, which are then attracted toward the anode by an electrical bias. This bias, or bias voltage source, is coupled between the photocathode and the anode, attracting the electrons from the photocathode toward the anode. The anode may contain a sensor that produces an image when electrons impinge on the pixelated surface of the sensor. Thus, the anode is commonly referred to as the imager anode. The photocathode and imager anode are separated by a spacer that surrounds a vacuum gap formed between the photocathode and the imager anode. The imager anode can provide electron gain when electrons are applied to the surface of the imager anode.

[0006] The imager anode preferably includes a complementary metal oxide semiconductor (CMOS) or charge coupled device (CCD) imager sensor. The imager sensor is comprised of a plurality of pixelated CMOS or CCD sensors arranged in an array on the imager anode die area of ​​the imager anode wafer. In addition to the CMOS or CCD sensor, the imager anode die may also include a primary electron multiplier. The primary electron multiplier is preferably an electron bombardment device (EBD) with one gain stage, commonly known as a primary electron multiplier stage. The EBD on the imager anode attributes gain to the electrons that strike the imager anode. The multiplied electrons of the primary electron multiplier remain in the substrate at the corresponding input area of ​​the CMOS or CCD array of the sensor.

[0007] If desired, another gain stage can be placed between the imager anode and the photocathode. This gain stage, the secondary electron multiplication stage, further increases the electron gain from the photocathode before it strikes the imager anode. The secondary electron multiplier is a transmission mode secondary electron (TMSE) multiplier. The TMSE is preferably spaced between the photocathode and the imager anode, all contained in a vacuum housing.

[0008] A secondary electron multiplier increases the number of electrons for each electron emitted from the photocathode. One type of secondary electron multiplier is a microchannel plate, or MCP. Another type of electron multiplier is an EBD. Like the photocathode and imager anode, the EBD is fabricated as a die in a corresponding semiconductor wafer using semiconductor fabrication techniques. The EBD-type TMSE is placed between the photocathode and the CMOS or CCD image sensor of the imager anode to increase the electron gain before it reaches the imager anode. Image intensifiers can be formed with or without a TMSE, depending on the amount of gain required. When electrons strike the surface of the EBD-type TMSE, they are multiplied while being biased towards the imager anode. Thus, an image intensifier that includes an additional TMSE gain layer can have two EBDs: one for the primary electron multiplier in the imager anode and one for the secondary electron multiplier in the TMSE.

[0009] EBDs are a special type of electron multiplier that utilizes advances in semiconductor manufacturing to create doped regions in a silicon substrate to multiply and electrically direct the electrons arriving from the photocathode. Because EBDs are created on a semiconductor wafer, as are other components of the image intensifier, EBDs are the preferred electron multiplier over MCP electron multipliers. Importantly, the EBDs of the secondary electron multipliers are similar to the EBDs of the primary electron multipliers, so the electron emission regions of each semiconductor wafer die of the EBD-type TMSE are aligned with the corresponding electron input regions of each semiconductor wafer die of the imager anode. Using proven semiconductor manufacturing techniques, EBDs can be inexpensively manufactured in a step-and-repeat pattern as individual dies across a wafer. When two (or more) primary and secondary electron multipliers are required, the EBDs on one wafer can be easily stacked and aligned in array or pixel registration at a distance from similarly formed EBDs on another wafer. More importantly, the EBD of the primary electron multiplier can be fabricated on the same semiconductor substrate as the CMOS image sensor, forming the EBCMOS imager anode die within the EBCMOS imager anode wafer. The entire image intensifier can be fabricated on the stacked die area of ​​the corresponding stacked semiconductor wafers in a reliably fabricated wafer-scale manner.

[0010] Thus, the CMOS image sensor and the primary EBD electron multiplier can be integrated together as an EBCMOS die. The EBCMOS die are co-planar with each other as an array of imager anode dies across an imager anode wafer. The EBCMOS imager anode die are bonded or integrated with dies of an interconnect wafer, each interconnect die area of ​​the interconnect wafer includes conductive traces extending from the imager anode output. The conductive traces are coupled to a bus and may be further coupled to a digital display for displaying the image sensed by the imager anode. The multiplied electrons traverse the EBD semiconductor structure between the input surface facing the photocathode and the emission surface of the imager anode facing the sensor. The EBD of the imager anode is coupled to a bias voltage source in vacuum and extracts electrons from the emission surface of the photocathode or, if a secondary electron multiplier is used, from another EBD in the TMSE.

[0011] The image intensifier is preferably formed on a wafer scale, whereby the photocathodes are spaced apart by an insulating spacer, and both the photocathodes and insulating spacer are present as a pair of wafers arranged parallel to one another. A wafer is defined in the field of semiconductor manufacturing as including the conventional circumference, diameter, and thickness, often made by slicing individual wafers from a cylinder of material such as silicon. The wafer includes an array of dies, each of which includes dopant and diffusion regions, as well as one or more layers of conductive or insulating material patterned using semiconductor manufacturing photolithography. The photocathode wafer and insulating spacer wafer include an array of openings in the spacer wafer and are aligned over the corresponding imager anodes. The imager anodes can be separated as dies from the imager anode wafer and bonded to an interconnect wafer. When the photocathode wafer and the openings in the insulating spacer wafer are aligned over the array of imager anodes bonded to the corresponding interconnect dies, pumpdown can occur across the wafer stack. Sealing then occurs to create multiple image intensifiers across the vacuum-spaced stack of multiple wafers. After pump-down evacuation, getter bake, and die separation from the stacked spaced wafers, a vacuum gap cavity is maintained between each imager anode of the multiple imager anodes disposed across the die areas of the interconnect wafer and each photocathode die of the multiple photocathodes disposed across the photocathode wafer.

[0012] Thus, according to one embodiment, an image intensifier device includes a photocathode wafer including a plurality of photocathodes arranged coplanar with one another in an array across the photocathode wafer. An interconnect wafer is also provided including a plurality of electrically separate sets of conductive traces formed in or on the interconnect wafer. Similar to the plurality of photocathodes, the plurality of electrically separate sets of conductive traces are in interconnect die regions that are coplanar with one another in an array across the interconnect wafer. A plurality of imager anodes can be bonded to corresponding sets of electrically separate conductive traces in each interconnect die region. The plurality of imager anodes are arranged coplanar with one another in an array across the imager wafer. An insulating spacer wafer having openings therein can be aligned over the imager anodes and also between the interconnect wafer and the photocathode wafer. The imager anodes are comprised of dies on the imager wafer that can be bonded to the interconnect wafer after separation from the imager wafer. Alternatively, the imager anode die may be integrally formed with the semiconductor substrate die region with the respective sets of conductive traces of the interconnect region die. A gap or cavity may be formed in each of the spaces formed between each of the imager anodes and each of the photocathodes. The gaps or cavities may be coincidentally or simultaneously evacuated to form a plurality of image intensifiers configured as an array of image intensifiers disposed across three or more stacked wafers of substantially equal size, i.e., an upper photocathode wafer, an intermediate insulating spacer wafer, and a lower interconnect, onto which the array of imager anodes is bonded or integrated into. The imager anodes may be separate from or integrated into each interconnect die region of the interconnect wafer. Thus, in the former case (separate), the imager anodes may be part of each die of the interconnect wafer. When integrated into the interconnect wafer, the conductive traces of the interconnect die region are formed along with each EBCMOS imager.

[0013] According to another embodiment, the image intensifier device may further include a secondary electron multiplier wafer disposed between a pair of insulating spacer wafers. A first wafer of the pair of insulating spacer wafers is disposed between the photocathode wafer and the EBD-type TMSE secondary electron multiplier wafer. A second wafer of the pair of insulating spacer wafers is disposed between the secondary electron multiplier wafer and the interconnect wafer. The secondary electron multiplier wafer is preferably an EBD-type TMSE semiconductor gain wafer including an array of coplanar EBD dies, whereby each EBD die functions to increase the number of free electrons delivered to the imager anode. The imager anode is preferably a CMOS imager or sensor appropriately biased to extract multiplied free electrons from the EBD dies. It is worth noting that the EBCMOS imager of the imager anode includes a surface that provides primary electron bombardment gain by itself upon receiving the free electrons. The EBD-type TMSE layer may provide additional (secondary) electron multiplier gain beyond that provided by the EBCMOS imager itself.

[0014] According to yet another embodiment, the image intensifier device includes a vacuum gap between the imager anode and the photocathode, the vacuum gap being formed simultaneously with another vacuum gap between a corresponding other coplanar imager anode bonded to the interconnect wafer and another coplanar photocathode on the overlying photocathode wafer. When an EBD-type TMSE intensifier wafer including an array of EBD dies is used, a first vacuum gap can be present between the EBD die of the TMSE intensifier wafer and the photocathode die, and a second vacuum gap can be present between the imager anode die and the EBD die of the TMSE intensifier wafer.

[0015] According to yet another embodiment, a method of forming an image intensifier is provided. The method includes bonding (or forming) a plurality of imager anodes to (or in) a set of corresponding electrically insulated conductive traces formed across an interconnect wafer. Apertures are then aligned in an insulating spacer wafer over the corresponding imager anodes. A vacuum seal can then be performed to simultaneously pump down and evacuate the photocathodes in the photocathode wafer over the corresponding imager anodes while maintaining the corresponding apertures as cavities or gaps between them. The stacked wafers can then be separated by sawing in a direction perpendicular to the parallel planes formed by the vacuum sealed and spaced apart interconnect wafer and photocathode wafer. Scribing is also performed perpendicular to the spacer wafer with spacers between the apertures to generate an image intensifier from among the simultaneously generated image intensifiers. [Brief description of the drawings]

[0016] Examples of the disclosure are best understood from the following detailed description when read in conjunction with the accompanying drawings, in which: According to common practice, the various features of the drawings are not drawn to scale or are shown only in partial perspective; Dimensions of the various embodiments are shown suitably expanded or reduced for clarity; The same reference numbers are used to represent the same elements between the drawings; The drawings include the following features and elements, reference now being made to each of the drawings: [Figure 1] FIG. 1 shows an example of an image intensifier that includes an EBD-type transmission-mode secondary electron (TMSE) gain layer. [Diagram 2] FIG. 1 shows an example of an image intensifier formed in a vacuum. [Diagram 3]FIG. 1 illustrates an example of an array of photocathodes formed on a photocathode wafer that is applied over openings formed in an insulating wafer, with the photocathode wafer and insulating wafer aligned over an array of interconnect die areas of conductive traces on an interconnect wafer. [Figure 4a] An example is shown of how openings in individual dies in an insulating wafer can be aligned to expose a corresponding imager anode die to an overlying photocathode die that is spaced from the imager anode by the insulating wafer when simultaneously forming multiple image intensifiers that are evacuated on a wafer scale prior to separating the image intensifiers into individual image intensifiers. [Figure 4b] An example is shown of how openings in individual dies in an insulating wafer can be aligned to expose a corresponding imager anode die to an overlying photocathode die that is spaced from the imager anode by the insulating wafer when simultaneously forming multiple image intensifiers that are evacuated on a wafer scale prior to separating the image intensifiers into individual image intensifiers. [Figure 4c] An example is shown of how openings in individual dies in an insulating wafer can be aligned to expose a corresponding imager anode die to an overlying photocathode die that is spaced from the imager anode by the insulating wafer when simultaneously forming multiple image intensifiers that are evacuated on a wafer scale prior to separating the image intensifiers into individual image intensifiers. [Figure 5a] FIG. 13 shows an example of an imager die bonded to or integrated within an interconnect die that, after dicing, extends laterally outside the insulating spacers of the diced insulating wafer, or, if present, may or may not extend laterally outside the insulating spacers for bonding to a carrier package. [Figure 5b]FIG. 13 shows an example of an imager die bonded to or integrated within an interconnect die that, after dicing, extends laterally outside the insulating spacers of the diced insulating wafer, or, if present, may or may not extend laterally outside the insulating spacers for bonding to a carrier package. [Figure 5c] FIG. 13 shows an example of an imager die bonded to or integrated within an interconnect die that, after dicing, extends laterally outside the insulating spacers of the diced insulating wafer, or, if present, may or may not extend laterally outside the insulating spacers for bonding to a carrier package. [Figure 5d] FIG. 13 shows an example of an imager die bonded to or integrated within an interconnect die that, after dicing, extends laterally outside the insulating spacers of the diced insulating wafer, or, if present, may or may not extend laterally outside the insulating spacers for bonding to a carrier package. [Figure 6a] Figure 1 shows an example of a secondary electron multiplier TMSE gain wafer that is added between a pair of insulating wafers after sealing and evacuation to create two vacuum gaps or cavities while simultaneously forming multiple image intensifiers of enhanced gain. [Figure 6b] Figure 1 shows an example of a secondary electron multiplier TMSE gain wafer that is added between a pair of insulating wafers after sealing and evacuation to create two vacuum gaps or cavities while simultaneously forming multiple image intensifiers of enhanced gain. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Initially, exemplary implementations of one or more embodiments are provided below, but it should be understood that the disclosed systems and / or methods may be implemented using any number of technologies, whether currently known or in existence. The present disclosure should in no way be limited to the exemplary implementations, drawings, and technologies shown below, including the exemplary designs and implementations shown and described herein, but may be modified within the scope of the appended claims, along with their full scope of equivalents.

[0018] From the description provided herein, one skilled in the art can easily combine or reverse the order in which the wafers are formed and bonded during the connection, soldering, or brazing operations, or pump-down, vacuum bake-out, or getter application methodologies. Although several embodiments are provided in this disclosure, it will be understood that the disclosed systems and methods may be embodied in many other specific forms without departing from the spirit or scope of the disclosure. The examples should be considered illustrative rather than restrictive, and the intention should not be limited to the details given herein. For example, various elements or components may be combined or integrated with another system, or certain features may be omitted or not implemented.

[0019] Additionally, the techniques, systems, subsystems, and methods described and illustrated in various embodiments as separate or distinct may be combined or integrated with other systems, modules, techniques, or methods without departing from the scope of the present disclosure. Other items shown or discussed as coupled or directly coupled or in communication with one another may be indirectly coupled or in communication through some interface, device, or intermediate component, whether electrical, mechanical, or otherwise. Other examples of modifications, substitutions, and substitutions are ascertainable by those skilled in the art and may be made without departing from the spirit and scope of the disclosure herein.

[0020] Referring now to the drawings, FIG. 1 illustrates an image intensifier 10 for enhancing a low level image 12, which is viewed as an enhanced image on a display device 14. Alternatively, the image 12 may not be configured for display to a human, but instead for consumption by a machine to automatically operate a machine based on the collected image, in accordance with an exemplary embodiment of the present invention. In general overview, the illustrated image intensifier 10 includes a photocathode 16 for converting photons 18 of the image 12 into free electrons 20. An EBD 22 is configured to increase the number of free electrons 26, and an imager anode 24 including a sensor receives the increased number of free electrons 26 and reads out an enhanced image signal. The signal may be presented to the display device 14 for human consumption, or may be presented directly to a controller for use in operating a machine controlled by the controller without human intervention.

[0021] The photocathode 16 can be made of a semiconductor material such as gallium arsenide, or any other material that exhibits a photoemissive effect. Other III-V materials such as GaP, GaInAsP, InAsp, InGaAs, etc. may also be used. The photoemissive semiconductor material absorbs photons, which increase the charge density of the semiconductor material, causing the material to generate a photocurrent of electrons 20 that pass through the photocathode 16 and are emitted from its output face. The photocathode 16 can be bonded to a light-transmitting wafer, for example, for structural support and environmental protection. The photocathode 16 can include an input face 16a and an output face 16b. When a photon strikes the input face 16a, each impinging photon 18 has a probability of generating a free electron. The free electrons 20 resulting from the impingement of the photon 18 pass through the photocathode 16 and are emitted from the output face 16b. The output surface 16b is activated in a known manner to a negative electron affinity (NEA) state to promote the flow of electrons 20 from the output surface 16b of the photocathode 16. The periphery of the photocathode 16 may be coated with a conductive surface to provide electrical contact to the photocathode 16.

[0022] The EBD 22 multiplies electrons emitted from the output surface 16b of the photocathode 16. The EBD 22 includes a semiconductor substrate of doped regions 30, and a blocking structure 32. A high voltage bombardment on the EBD surface creates electron gain, and the substrate and doped regions 30 in the substrate surface, and the blocking structure 32 on the emission surface, direct the electrons from the output (or emission) surface of the EBD 22 between the blocking structures 32. The structure and operation of the EBD in an image intensifier to provide secondary electron multiplication of the TMSE by increasing and directing the flow of electrons, and the application of a bias voltage source 34 to extract electrons from the photocathode 16 and increase or enhance the electrons from the EBD 22, are generally known. An EBD-type TMSE is described in U.S. Pat. No. 6,836,059, which is incorporated herein by reference.

[0023] The imager anode sensor 24 receives the increased number of electrons from the EBD type TMSE 22 at the input surface 24a. The imager anode 24 sensor is preferably an integrated circuit having a CMOS substrate and a number of collection wells as typically used in image intensifiers. The multiplied electrons 26 collected in the collection wells are processed using standard signal processing equipment for CMOS sensors to generate an intensified image signal that is sent to the electronic display 14 via an output bus 25. In a preferred embodiment, the sensor is a die of a semiconductor wafer that includes an array of CMOS integrated circuit pixel sensors distributed across the die of the imager anode 24. The readout of the detected multiplied electrons 26 is controlled by a timing and control circuit, and the signals can be processed by a processor of conventional design. The processor can include an analog-to-digital converter arranged in each column, and the signals are read out by a column selection unit and placed on the corresponding line of the bus 25. The array of pixels can be a photodiode type pixel structure. When reverse biased, a current flows through the photodiode and incident light generates a photocurrent. The photocurrents are routed to corresponding lines of bus 25 for rendering an intensified image 28 on display 14. The structure and operation of an electron-bombarded CMOS imager is described in U.S. Patent No. 6,657,178, which is incorporated herein by reference.

[0024] The imager anode 24 is biased to extract multiplied electrons 26 from an output or emission face of the EBD type TMSE 22. Within the imager anode 24 is a primary electron multiplier, preferably an EBD, along with an array of CMOS sensors. The primary electron multiplier EBD may be located within the input face 24a of the imager anode 24, and the CMOS sensor array may be located within the output face 24b of the imager anode. The primary electron multiplier EBD within the input face 24a is similar to the secondary electron multiplier, EBD 22 in the TMSE, in that it provides electron multiplication. However, instead of the EBD providing electron multiplication from the photocathode 16 to the imager anode 24 in the EBD type TMSE 22, the EBD within the input face 24a provides electron multiplication from the input face 24a to the output face 24b of the imager anode 24.

[0025] FIG. 2 shows the image intensifier 10 in a vacuum formed housing including a sealed top plate 40, bottom plate 42, and side plate 44. Metallic electrical contact pads 46 are aligned and pressed onto the trace conductors and subjected to heat treatment or compression bonding. The electrical contact pads 46 may be patterned on the imager anode 24 and then bonded by applying heat treatment or compression to corresponding trace conductors including bond pads on the surface of an interconnect substrate 54, which may be the same as the bottom plate according to one embodiment. Thus, the bottom plate may be a semiconductor wafer die including one or more layers of trace conductors on, and possibly below, the surface of the interconnect substrate. The solder material may melt during the soldering process and bond the bond pads of the imager anode 24 to the trace conductors on and within the interconnect substrate. It is understood that electrical coupling may be effected by other means known to those skilled in the art, including but not limited to metallic interconnection processes such as soldering, brazing, or thermocompression bonding, seal metal compression bonding, and the like.

[0026] After the imager anode 24 goes through the electrical interconnect process, it undergoes a vacuum bake-out as indicated by arrow 49 before the housing is sealed around the image intensifier 10. The space between the photocathode 16 or photocathode die 16 and the bonded imager anode 24 or imager anode die 24 can be evacuated to less than one atmosphere before the side plates 44, which surround all four sides of the imager anode 24, are sealed between the photocathode 16 and the imager anode 24. For example, a getter material can be placed on the inward facing surface of the spacer 44, and the getter material can be activated during the bake-out process. Once a vacuum is formed between the photocathode 16 and the imager anode 24, the getter remains and helps to extend the life of the image intensifier 10 by adsorbing residual gases from all components within the vacuum.

[0027] To increase the gain of the vacuum gap or cavity formed between the imager anode 24 and the photocathode 16, an EBD type TMSE 22 can be placed in the vacuum gap, with appropriate bias applied between the photocathode 16 and the TMSE 22 as well as between the TMSE 22 and the imager anode 24. The placement of the TMSE 22 is optional depending on the amount of electron multiplication and gain required. Given that the use of the EBD type TMSE 22 is optional, it is therefore shown in dashed phantom lines. However, to increase the gain to overcome the limitations of conventional electron bombarded CMOS (EBCMOS) image intensifiers, the EBD type TMSE 22 is used as a secondary electron multiplier. Conventional EBCMOS imager gain is limited by the maximum voltage in the vacuum gap so as not to generate x-rays. Placing the EBD 22 therein increases the free electrons and gain in the vacuum gap without generating x-rays. The doping in the semiconductor substrate of the EBD 22 helps to increase the number of electrons that pass from the input surface into and through the semiconductor substrate. Suppressing the recombination of electrons at the input surface ensures that more electrons flow through the semiconductor substrate to the output surface of the EBD-type TMSE 22, as described in commonly assigned U.S. Patent No. 6,836,059, which is incorporated herein by reference.

[0028] FIG. 3 shows three wafers: a photocathode wafer 60, an insulating spacer wafer 62, and an interconnect wafer 64. Regions 50 in the photocathode wafer 60 are die regions, referred to as photocathode dies 16 or simply photocathode 16. Regions 52 are cutouts or openings in the spacer die regions in the insulating wafer 62. There is one opening 52 in each spacer die 72, both of which are repeated throughout the insulating wafer. Thus, the spacer die 72 includes four sidewall regions surrounding a substantially square opening 52. Each region 54 in the interconnect wafer 64 includes a set of conductive traces formed on a surface of that region 54. According to one embodiment, the set of conductive traces are bonded to the imager anode 24. As shown in Figure 2, the backside of each imager anode 24 may include an array of bond pads 46 comprising electrical interconnect material which, when compressed and / or heated, bond to corresponding pads of a set of electrically isolated conductive traces on and within interconnect die region 54 of interconnect wafer 64. Comparing Figure 2 with Figures 4a-4c, side plates 44 are formed as insulating spacers 74, top plate 40 may be photocathode 50, and bottom plate 42 may be interconnect region 54.

[0029] Alternatively, the front surface of each imager anode 24, and portions thereof within the interconnect wafer or wire bonds bonded to the interconnect wafer, resides outside the vacuum cavity and is shielded from the high voltage fields therein. When the imager anodes are bonded to the interconnect wafer, according to one embodiment, the conductive traces within the interconnect wafer may extend to the backside of each die within the separately diced interconnect die areas 54 of the interconnect wafer 64, with the pins 47 shown in FIG. 2 being bonded thereto. Alternatively, one or more of the sets of conductive traces may extend to the peripheral edge of each corresponding interconnect die area 54 and terminate as edge connectors 45 of FIG. 2.

[0030] Each imager anode 24 obtained as a die from the imager anode wafer is bonded to a corresponding set of conductive traces in region 54 of the interconnect wafer 64. The interconnect die regions 54 are shown aligned under the openings 52 that reside between the insulating spacer die regions 72 that are repeated across the insulating spacer wafer 62. The regions 54 are coplanar with one another across the interconnect wafer 64 and aligned with the photocathode die coplanar regions of the photocathode wafer 60, but below by a parallel separation distance. The openings 52 in the insulating spacer wafer 62 are aligned between the overlying regions 50 of the photocathode wafer 60 and the underlying imager anodes 24 bonded in region 54 of the interconnect wafer 64. The formation of stacked wafers and subsequent vacuum, or vacuum in combination with bake out, provides a wafer-scale manufacturing process for simultaneously producing an array of coplanar image intensifiers from which, when the array is diced and the dies are separated from one another, a plurality of EBCMOS vacuum image intensifiers are formed.

[0031] 4a and 4b show cross-sectional views of two image intensifiers 10 formed on a wafer scale. For simplicity, only two image intensifiers 10 are shown. However, it should be understood that up to hundreds of image intensifiers 10 are formed simultaneously. The process of forming multiple image intensifiers begins with looking at FIG. 4a. A photocathode wafer 60 includes multiple photocathodes 50. For simplicity, only two photocathodes 50 corresponding to the two image intensifiers 10 are shown. Openings 52 between insulating spacers 72 in insulating spacer wafer 62 are aligned under corresponding photocathodes 50. Openings 52 are also aligned over interconnect die areas 54 in interconnect wafer 64. Each of the two illustrated imager anodes 24 can be bonded to corresponding areas of two sets of illustrated conductive traces 73, and possibly into corresponding areas 54 of interconnect wafer 64. The conductive traces 73 may be formed by applying a layer of metallic material over the entire surface of each interconnect region 54. By conventional photolithographic processes, selected portions of the metallic layer may be removed leaving sets of electrically isolated conductive traces 73 on different layers and outer surfaces of region 54.

[0032] The openings 52 in the insulating spacer 72 form a high voltage vacuum gap 70 between the overlying photocathode 50 and the underlying imager anode 24 bonded to a set of conductive traces on and within the interconnect region die 54. The spacers 72 around each opening 52 are formed when the insulating spacer wafer 62 is cut along dotted lines 74 during dicing to form a set of vacuum sealed stacked dies. When the high vacuum envelope is generated at the wafer scale, an array of multiple image intensifiers 10 is formed simultaneously by vacuum sealing the entire set of stacked wafers. Later dicing into individual intensifiers 10 forms multiple image intensifiers 10 as shown in FIG. 4b. The spacing of the high voltage vacuum gap is critical and can be maintained and better controlled throughout the array of image intensifiers using wafer processing techniques. The shape and overall planarity of the wafers and their processing are assured through maintenance in a polished state, allowing the overall spacing and gaps between wafers to be carefully controlled at low cost, resulting in separated, stacked, and sealed dies with precision that is easily accessible across the entire wafer stack.

[0033] As shown in Figures 4a and 4b, each die area 50, 52, and 54 of corresponding wafers 60, 62, and 64 are of the same size and dimensions. Furthermore, the center point of each die area 50, 52, and 54 is aligned a small percentage of a pixel size (e.g., less than 10 percent) from a central axis 75 that extends perpendicular to the plane of the stacked dies 50, 52, and 54. The outer lateral sidewalls of each die 50, 52, or 54 have identical lateral dimensions, and when stacked, the center points of each die 50, 52, and 54 are also aligned with each other's center points. By making the dies the same size and having their center points vertically identical on the central axis 75 (by fabrication of semiconductor wafers 60, 62, and 64 and subsequent aligned stacking of dies 50, 52, and 54), the arrayed or pixelated emission surface of the EBD within the arrayed or pixelated input surface of the CMOS sensor is aligned directly under and not offset from the electron emitting photocathode 16 and directly above and not offset from the corresponding set of conductive traces. Using die fabrication techniques of similarly sized dies and precise alignment on the central axis 75 ensures optimal electron gain and current distribution while achieving a more efficient and effective image intensifier 10 that is mass produced. Precise XY alignment is required when adding additional EBD-based TMSE layers 22. In addition to precise control of Z-axis alignment, a high degree of parallelism between the photocathode die 50 and the imager anode 24 (due to precise thickness control of the semiconductor wafer and the wafers fabricated for semiconductor processing) is required. Due to the precision induced by the wafer thickness and overall wafer fabrication techniques used in forming the various stacked die components of the image intensifier 10, control of the distance is tight.

[0034] FIG. 4c shows a cross-sectional view of the image intensifier 10 bonded to a carrier package 82. The image intensifier 10 is shown assembled with a vacuum gap in the space 70 formed between each imager anode 24 and each photocathode 50. Also, depending on the amount of gain required, whether the sensor in the imager anode 24 is an array of integrated circuits (e.g., a CMOS pixelated array sensor) or not, the space 70 can be approximately 10 mils. Additionally, there is a space 70 surrounding the sidewalls of the imager anode 24 and the inward facing surface of the scribed insulating spacer 72, which is split in half during the die scribing or sawing process. As shown in more detail in FIGS. 5a and 5b, the bottom or side surface of the interconnect region die 54, and specifically the set of conductive traces, can be electrically bonded to the carrier package 82. Thus, the carrier package 82 provides additional fan-out from the set of conductive traces for electrical connection to the display bus 25 of the display 14 shown in FIG. 1. Carrier package 82 can also provide additional structure and rigidity to packaged image intensifier 10, if desired. In some cases, interconnect die areas 54 are sufficient and carrier package 82 may be removed, as shown in Figure 5c. Similar to Figure 1, image intensifier 10 shown in Figure 4c includes electrical contacts from power supply 34 to photocathode die 50 and to imager anode die 24 to provide sufficient electron gain therebetween.

[0035] 5a and 5b show a cross-sectional view of region 54 of interconnect wafer 64, where each bonded imager anode 24 is larger than the insulating spacer 72 surrounding opening 52. For clarity, only one trace conductor 83 is shown in the set of conductive traces in interconnect region 54. It is understood that the set of conductive traces can exceed 100, depending on the density and size of the EBD electron multiplier and CMOS sensor array. The set of trace conductors 83 is shown extending outside of the vacuum package of image intensifier 10, which includes photocathode insulating spacer 72 bonded between photocathode 50 and interconnect region 54. As shown, trace conductor 83 can extend along an interior planar layer of interconnect region 54. Alternatively, and more preferably, the trace conductors 83 extend along the planar surface of the interconnect region 54 toward the outer surface of the interconnect region 54 outside the bond pads 46 of the imager anode 24, but are electrically coupled to the bond pads 46 shown in FIG. 5a. The trace conductors 83 extend from the bond pads 46 to the top surface of the region 54 that projects outside the lateral extent of the insulating spacer 74, and are coupled to wire bonds 80 that extend connections to trace conductors (not shown) in the carrier package 82. In this manner, the set of conductive traces 83 in the interconnect region 54 extends electrical connections from the bond pads 46 of the imager anode 24 to the wire-bonded carrier package 82. Additionally or alternatively, the set of conductive traces 83 can extend electrical connections from the bond pads 46 to the pins 47 and / or edge connectors 45 that extend from the bottom and / or sides, respectively, of the carrier package 82. By forming interconnect region 54 to accommodate a set of conductive traces beyond the lateral extent of insulating spacer 74, additional fan-out connections can be made to carrier package 82, either as wire bonds 80, pin 47 routing, or edge 45 routing.

[0036] In FIG. 5b, the bond pads 46 on the imager anode 24 are removed. Trace conductors 83 replace the bond pads of FIG. 5a and extend from the imager anode 24 to the wire bonds 80, pins 47, and / or edge connector 45. The trace conductors 83 are preferably connected between the outputs of the array of CMOS sensors in the imager anode 24 and the wire bonds 80, pins 47, and / or edge connector 45. However, the bond pads 46 can be configured on the outer surface of the interconnect region 54 and can be electrically coupled to conductors (not shown) on or within the carrier package 82 if desired to provide additional connectivity and fan-out. The connections 47 are routed. The portion of the region 54 that includes the trace conductors that extend outside the vacuum package can accommodate the wire bonds 80 and connect the imager anode 24 to the trace conductors via the bond pads and then to the carrier package 82 outside the trace conductors.

[0037] In Figure 5c, carrier package 82 can be removed entirely. If interconnect region 54 has sufficient structural rigidity and the set of conductive traces 83 within region 54 provides sufficient fan-out and density, all connections from imager anode 24 can be made easily and reliably. Set of conductive traces 83 are shown to electrically connect between bond pads 46 on imager anode 24 to pins 47 or edge connectors 45 on interconnect region die 54 in place of carrier package 82 of Figures 5a and 5b.

[0038] Alternatively, as shown in FIG. 5d, the imager anode 24 can extend outside the vacuum package, specifically outside the lateral extent of the insulating spacer 72. The vacuum housing thus includes an overlying photocathode 50 with an opposing lateral spacer 72 aligned with the photocathode 50 but inside the lateral extent of the imager anode 24. Wire bonds 80 can be bonded between bonding pads on the top surface of the imager anode 24 and bonding pads on a carrier package 82 (not shown in FIG. 5d). Alternatively, the carrier package 82 can be eliminated entirely, as in FIG. 5c. The imager anode 24 is an EBCMOS detector or sensor. A vacuum gap or cavity 70 exists between the front surface of the imager anode 24 and the photocathode 50. An array of bond pads or bumps 46 on the back surface of the imager anode 24 can be electrically interconnected to a corresponding set of conductive traces on the surface of the interconnect die area 54. As previously mentioned, the imager anode 24 is part of the interconnect die area 54 (shown in FIG. 5b) and a set of interconnect conductive traces are printed on the interconnect die area along with the CMOS sensor array. When the interconnect die area 54 includes both the imager anode 24 and the set of conductive traces 83, a portion of the back or front surface can be bonded to a circuit board using compression or heating of bond pads and / or wire bonds.

[0039] 6a and 6b show cross-sectional views of an image intensifier 10 formed simultaneously among multiple image intensifiers. More specifically, FIG. 6 shows an image intensifier 10 with additional gain via a secondary electron multiplier 22. An electrical bias supply 34 provides electronic gain and bias from the photocathode die 50, the EBD-type TMSE die 22, and the imager anode 24. The secondary electron multiplier 22 is preferably an EBD-type TMSE die 22 spaced parallel between a pair of openings 52a and 52b. The pair of openings 52a and 52b reside within a corresponding pair of insulating spacer die regions in the respective insulating wafers 62a and 62b. The insulating spacer die regions include corresponding insulating spacers 72a and 72b surrounding corresponding high voltage vacuum gaps 70a and 70b formed by the respective openings 52a and 52b. The backside of the interconnect die region 54 of the interconnect wafer 64 can be bonded to the carrier package 82. Alternatively, wire bonds (not shown) can interconnect the conductive traces in the region 54 if the region 54 extends beyond the imager anode 24 and the outer extent of the insulating spacers 72a and 72b. A ball grid array or thermocompression array 46 electrically connects the imager anode 24 (preferably including a primary electron multiplier and a CMOS sensor or detector array detector) to the interconnect region 54 of the interconnect wafer 64. Alternatively, to further increase the gain, two or more EBD-type TMSE layers 22 can be inserted between a corresponding pair of spacer layers 62, all of which are between the photocathode 50 and the imager anode 24 embedded in or bonded onto the interconnect die region 54.

[0040] The die center points of the photocathode 50, EBD-type TMSE 22, imager anode 24, and interconnect region 54 are each aligned with a central axis 74. Additionally, central axis 74 is shown as the central axis of the formed image intensifier 10. Not only are each die of the same size and dimensions, but the center points on the top and bottom planar surfaces of each die are aligned with and lie on central axis 74 to ensure proper operation of the formed image intensifier 10. For example, if there is an offset from the central axis of more than 50 percent of the pixel pitch, the primary and secondary electron multiplier arrays will not align with each other, nor will they align with the CMOS sensor array in the imager anode 24.

[0041] As used herein, "about," "approximately," and "substantially" are understood to refer to numbers within a numerical range, for example, a range of -10% to +10% of a reference value, preferably -5% to +5% of a reference value, more preferably -1% to +1% of a reference value, and most preferably -0.1% to +0.1% of a reference value.

[0042] Moreover, all numerical ranges herein should be understood to include every integer, whole or fractional number within the range. Moreover, these numerical ranges should be construed as supporting a claim directed to any number or subset of numbers within the range. As used in this specification and the appended claims, the singular forms of words include the plural forms unless the context clearly dictates otherwise. Thus, the references "a, an" and "the" generally include the plural forms of the respective terms.

[0043] Without further elaboration, it is believed that one skilled in the art can use the preceding description to utilize the claimed invention to its fullest extent. The examples and embodiments disclosed herein are merely illustrative and should not be construed as limiting the scope of the present disclosure in any way. It will be apparent to one skilled in the art that changes can be made to the details of the above examples without departing from the underlying principles discussed. In other words, various modifications and improvements of the examples specifically disclosed in the above description are within the scope of the appended claims. For example, any suitable combination of features of the various examples described is contemplated, including an orientation of the photocathode spaced above, below, or to the right or left of the imager anode. Depending on the orientation of the image intensifier relative to the image being detected, the photocathode relative to the imager anode may change if the photocathode is between the imager anode and the image.

Claims

1. 1. An image intensifier apparatus, the image intensifier apparatus comprising: a photocathode wafer including a plurality of photocathode regions; an interconnect wafer including a plurality of electrically isolated sets of conductive traces formed in or on the interconnect wafer; a plurality of imager anodes integrated or coupled between corresponding sets of electrically isolated conductive traces; an insulating spacer wafer having an opening over an imager anode and aligned between said interconnect wafer and said photocathode wafer; a gap in each of a plurality of spaces formed between each imager anode of the plurality of imager anodes and each of the respective plurality of photocathodes; the interconnect wafer comprising a coplanar array of metal material photolithographically patterned in or on a substrate into a corresponding array of coplanar interconnect regions each corresponding to a set of electrically isolated conductive traces; Image intensifier equipment.

2. 2. The image intensifier instrument of claim 1, wherein said photocathode wafer comprises gallium arsenide semiconductor material and an array of coplanar photocathode regions comprises said gallium arsenide semiconductor material and corresponds to said plurality of photocathodes.

3. The insulating spacer wafer comprises: a photolithographically patterned electrically insulating material; and an array of coplanar aperture areas corresponding to the openings extending completely through the insulating spacer wafer, each opening being surrounded on all four sides by the insulating material.

4. the plurality of imager anodes include a separate coplanar array of primary electron multipliers facing the corresponding coplanar array of photocathode regions; 3. The image intensifier apparatus of claim 2, further comprising: an array of complementary metal-oxide semiconductor (CMOS) sensors configured to receive multiplied electrons from a corresponding primary electron multiplier and generate an electrical signal from each CMOS sensor.

5. 5. The image intensifier instrument of claim 4, further comprising a digital display coupled to receive the electrical signals from each CMOS sensor.

6. 1. An image intensifier apparatus, the image intensifier apparatus comprising: a photocathode within a portion of the photocathode wafer; an interconnect including a set of conductive traces within a portion of the interconnect wafer; an imager anode coupled to the set of conductive traces; an insulating spacer including an opening formed in a portion of an insulating spacer wafer; a vacuum gap between the imager anode and the photocathode among a plurality of other vacuum gaps simultaneously formed between corresponding other coplanar imager anodes and other coplanar photocathodes on the photocathode wafer; the interconnects include a set of photolithographically printed conductive traces on at least one layer of the interconnect wafer; Image intensifier equipment.

7. 7. The image intensifier apparatus of claim 6, wherein the imager anode comprises a complementary metal-oxide semiconductor (CMOS) sensor integrated within the same semiconductor body as the interconnect wafer and arranged in an array of pixels coupled to the sets of conductive traces.

8. The imager anode comprises: a complementary metal oxide semiconductor (CMOS) sensor arranged in an array of pixels on a semiconductor body separate from the interconnect wafer; and a set of pads on a surface of said CMOS sensor configured to be electrically coupled to said set of conductive traces.

9. The imager anode comprises: an array of coplanar primary electron multipliers facing a corresponding array of coplanar photocathodes; and an array of complementary metal-oxide semiconductor (CMOS) sensors configured to receive the multiplied electrons from the corresponding primary electron multipliers and generate an electrical signal.

10. an array of coplanar secondary electron multipliers disposed in a semiconductor wafer separate from the photocathode wafer and the interconnect wafer, the array of coplanar secondary electron multipliers being further disposed between the corresponding array of coplanar photocathodes and the corresponding array of CMOS sensors; a first vacuum gap between one of the secondary electron multipliers and the photocathode; 10. The image intensifier instrument of claim 9, further comprising: a second vacuum gap between said one of said secondary electron multipliers and said imager anode.

11. 7. The image intensifier instrument of claim 6, wherein said photocathode wafer, said insulating spacer wafer, and said interconnect wafer have the same diameter.

12. 7. The image intensifier apparatus of claim 6, wherein the photocathode wafer, the insulating spacer wafer, and the interconnect wafer are aligned relative to each other such that their outer lateral extents are the same and that center points of each die of the photocathode wafer, the insulating spacer wafer, and the interconnect wafer are disposed along a central axis extending perpendicular to the stacked photocathode wafer, the insulating spacer wafer, and the interconnect wafer.

13. 1. A method of forming an image intensifier, the method comprising: coupling a plurality of imager anodes to corresponding sets of electrically isolated conductive traces formed across an interconnect wafer; aligning a plurality of openings in an insulating spacer wafer with corresponding imager anodes; vacuum sealing a plurality of photocathodes in a photocathode wafer over the corresponding plurality of imager anodes while maintaining a corresponding plurality of openings around and between each of the plurality of imager anodes and a corresponding plurality of photocathodes; and dicing orthogonal to the parallel plane formed by the vacuum sealed and spaced apart interconnect wafer and photocathode wafer and between the plurality of openings to generate said image intensifier from among a plurality of simultaneously generated image intensifiers; the interconnects include a set of photolithographically printed conductive traces on at least one layer of the interconnect wafer; method.

14. The step of combining includes: fabricating a plurality of complementary metal-oxide semiconductor (CMOS) sensors in the interconnect wafer, the CMOS sensors being coupled to the set of electrically isolated conductive traces; and fabricating a plurality of primary electron multipliers in the plurality of CMOS sensors spaced apart from the plurality of photocathodes.

15. The step of combining includes: bonding a plurality of complementary metal-oxide semiconductor (CMOS) sensors formed on an imager anode wafer onto the set of electrically isolated conductive traces of the interconnect wafer; and fabricating a primary electron multiplier within the imager anode wafer on a surface of the imager anode wafer spaced between the CMOS sensors and from the plurality of photocathodes.

16. 14. The method of claim 13, wherein the aligning step includes disposing the plurality of openings at a distance around a corresponding one of the plurality of imager anodes while abutting the insulating spacer against the interconnect wafer.

17. The method of claim 13 , wherein the step of vacuum sealing comprises the step of simultaneously evacuating the plurality of openings to less than atmospheric pressure.

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