Film wiring board for driving liquid ejection head, liquid ejection head

Abstract

To provide a film wiring board for driving a liquid discharge head, which can suppress instability of liquid discharge due to current concentration and suppress manufacturing cost.SOLUTION: A film wiring board for driving a liquid discharge head includes: a plurality of driving circuits; individual wiring of each channel; common wiring of each channel; and a wiring terminal section for thermal compression bonding. The plurality of driving circuits output driving signals to be given to each of the plurality of channels for discharging liquid. The individual wiring of each channel is connected to each of the driving circuits. The common wiring of each channel is connected to a common electrode section arranged on a board tip side. In the wiring terminal section for thermal compression bonding, the individual wiring and the common wiring are arranged like a toothed comb shape between the common electrode section and the driving circuits.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] An embodiment of the present invention relates to a film wiring board for driving a liquid ejection head, and a liquid ejection head. [Background technology]

[0002] Liquid ejection heads that supply a predetermined amount of liquid to a predetermined position are known. Liquid ejection heads are mounted on, for example, inkjet printers, 3D printers, and dispensing devices. Inkjet printers eject droplets of ink from an inkjet head to form an image or the like on the surface of a recording medium. 3D printers eject droplets of modeling material from a modeling material ejection head, harden the droplets, and form a three-dimensional object. Dispensing devices eject droplets of a sample and supply a predetermined amount to a plurality of containers, etc.

[0003] A liquid ejection head has multiple channels equipped with nozzles and actuators for ejecting liquid. The liquid ejection head selects a channel from among the multiple channels to eject liquid, and drives the actuator by sending a drive signal to the actuator using a drive IC. The actuators for the multiple channels are formed, for example, on an actuator substrate.

[0004] The driver IC that drives the actuator is mounted on a flexible printed circuit board that is connected to the actuator substrate. The driver IC sends a drive signal to one electrode of the actuator through individual wiring formed on the actuator substrate and the flexible printed circuit board. The other electrode of the actuator is connected to, for example, ground (GND) through a common wiring. In this case, the individual wiring and common wiring must be made into a three-dimensional structure on the actuator substrate, which often results in high manufacturing costs.

[0005] Furthermore, if a common electrode that connects the common wiring of each channel is formed on the actuator substrate along the array direction of the channels, current concentration occurs when multiple channels are driven simultaneously, which can cause unstable liquid ejection due to voltage drop, especially in the actuators of channels located near the center of the array direction. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP2016-43484A [Patent Document 2] Japanese Patent Application Publication No. 9-286099 Summary of the Invention [Problem to be solved by the invention]

[0007] The problem that the present invention aims to solve is to provide a film wiring board for driving a liquid ejection head, and a liquid ejection head, which can prevent unstable liquid ejection caused by current concentration and also reduce manufacturing costs. [Means for solving the problem]

[0008] The film wiring board for driving a liquid ejection head according to an embodiment of the present invention includes a plurality of drive circuits, individual wiring for each channel, a common wiring for each channel, and a wiring terminal portion for thermocompression bonding. The plurality of drive circuits output drive signals to be applied to the plurality of channels that eject liquid. The individual wiring for each channel is connected to the drive circuit. The common wiring for each channel is, On film wiring board The wiring terminal portion for thermocompression bonding has individual wiring and common wiring arranged in a comb-like shape between the common electrode portion and the drive circuit. The individual wirings and the common wirings of the wiring terminal portion are arranged alternately. [Brief description of the drawings]

[0009] [Figure 1]1 is an overall configuration diagram of an inkjet printer equipped with an inkjet head according to a first embodiment. [Diagram 2] FIG. 2 is a perspective view of the inkjet head. [Diagram 3] FIG. 2 is a cross-sectional view of an actuator of the inkjet head. [Figure 4] FIG. 2 is a plan view of an actuator substrate, a flexible printed wiring board, and a printed circuit board of the inkjet head. [Diagram 5] 4 is a side view showing a state in which an actuator substrate, a flexible printed wiring board, and a printed circuit board of the inkjet head are connected to each other. FIG. [Figure 6] FIG. 2 is a diagram showing the configuration of a drive system for the inkjet head. [Figure 7] FIG. 11 is a plan view of an actuator substrate, a flexible printed wiring board, and a printed circuit board of an inkjet head according to a second embodiment. [Figure 8] FIG. 2 is a partially enlarged view of the flexible printed wiring board. [Figure 9] 4 is a side view showing a state in which an actuator substrate, a flexible printed wiring board, and a printed circuit board of the inkjet head are connected to each other. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, a liquid ejection head according to an embodiment will be described in detail with reference to the accompanying drawings, in which the same components are denoted by the same reference numerals.

[0011] (First embodiment) As an example of an image forming apparatus equipped with a liquid ejection head according to an embodiment, an inkjet printer 10 that prints an image on a recording medium will be described. Fig. 1 shows a schematic configuration of the inkjet printer 10. Inside a housing 11, the inkjet printer 10 has a cassette 12 that stores a sheet S, which is an example of a recording medium, an upstream transport path 13 for the sheet S, a transport belt 14 that transports the sheet S taken out of the cassette 12, a plurality of inkjet heads 100-103 that eject ink droplets toward the sheet S on the transport belt 14, a downstream transport path 15 for the sheet S, an ejection tray 16, and a control board 17. An operation unit 18 that is a user interface is disposed on the upper side of the housing 11.

[0012] Image data to be printed on the sheet S is generated, for example, by a computer 200, which is an externally connected device. The image data generated by the computer 200 is sent to a control board 17 of the inkjet printer 10 via a cable 201 and connectors 202 and 203.

[0013] The pickup roller 204 supplies the sheets S one by one from the cassette 12 to the upstream conveying path 13. The upstream conveying path 13 is composed of a pair of feed rollers 131 and 132 and sheet guide plates 133 and 134. The sheet S is fed to the upper surface of the conveying belt 14 via the upstream conveying path 13. An arrow 104 in the figure indicates the conveying path of the sheet S from the cassette 12 to the conveying belt 14.

[0014] The conveyor belt 14 is a mesh-like endless belt with many through holes formed on its surface. Three rollers, a drive roller 141 and driven rollers 142 and 143, support the conveyor belt 14 so that it can rotate freely. A motor 205 rotates the conveyor belt 14 by rotating the drive roller 141. The motor 205 is an example of a drive device. In the figure, 105 indicates the rotation direction of the conveyor belt 14. A negative pressure container 206 is disposed on the back side of the conveyor belt 14. The negative pressure container 206 is connected to a fan 207 for reducing pressure. The fan 207 creates a negative pressure inside the negative pressure container 206 by forming an airflow, and adsorbs and holds the sheet S on the upper surface of the conveyor belt 14. In the figure, 106 indicates the flow of the airflow.

[0015] Inkjet heads 100-103, which are an example of liquid ejection heads, are arranged to face sheet S, which is attracted to and held on conveyor belt 14, with a small gap of, for example, 1 mm between them. Each of inkjet heads 100-103 ejects ink droplets toward sheet S. When sheet S passes below inkjet heads 100-103, the inkjet heads print images. Each of inkjet heads 100-103 has the same structure, except that they eject different colors of ink. The ink colors are, for example, cyan, magenta, yellow, and black.

[0016] The inkjet heads 100-103 are connected to ink tanks 315-318 and ink supply pressure adjusting devices 321-324 via ink flow paths 311-314, respectively. Each ink tank 315-318 is disposed above each inkjet head 100-103. During standby, each ink supply pressure adjusting device 321-324 adjusts the pressure inside each inkjet head 100-103 to a negative pressure, for example, -1.2 kPa, relative to atmospheric pressure so that ink does not leak from the nozzles 25 (see FIG. 2) of the inkjet heads 100-103. During image formation, ink from each ink tank 315-318 is supplied to each inkjet head 100-103 by the ink supply pressure adjusting devices 321-324.

[0017] After the image is formed, the sheet S is sent from the conveyor belt 14 to a downstream conveying path 15. The downstream conveying path 15 is composed of pairs of feed rollers 151, 152, 153, and 154, and sheet guide plates 155 and 156 that define the conveying path of the sheet S. The sheet S passes through the downstream conveying path 15 and is sent from a discharge port 157 to a discharge tray 16. An arrow 107 in the figure indicates the conveying path of the sheet S.

[0018] Next, a description will be given of the configuration of the inkjet heads 100 to 103. The inkjet head 100 will be described below with reference to Figures 2 to 6, but the inkjet heads 101 to 103 have the same structure as the inkjet head 100.

[0019] 2, the inkjet head 100 includes a nozzle head section 2 which is an example of a liquid ejection section, and a flexible printed wiring board 3 which is an example of a film wiring board. The nozzle head section 2 includes a nozzle plate 21, an actuator substrate 22, a sealing member 23 which seals the openings of a pressure chamber 51 and an air chamber 52 formed in the actuator substrate 22, and an ink supply port 24 formed in the sealing member 23. The ink supply port 24 is connected to an ink supply pressure adjusting device 321 shown in FIG. 1 via an ink flow path 311.

[0020] The flexible printed wiring board 3 is connected to the actuator board 22 of the nozzle head unit 2 and to a printed wiring board 4 serving as a relay board. The flexible printed wiring board 3 is equipped with a driving IC (Integrated Circuit) 31 which is a driver chip (hereinafter referred to as a driving IC). The driving IC 31 may be mounted on a board separate from the flexible printed wiring board 3 and connected to the flexible printed wiring board 3 from the separate board. The driving IC 31 temporarily stores print data sent from the control board 17 of the inkjet printer 10 via the printed wiring board 4, and provides driving signals to each channel so as to eject ink at a predetermined timing.

[0021] The nozzle plate 21 is a rectangular plate made of, for example, a resin such as polyimide or a metal such as stainless steel. A plurality of nozzles 25 for ejecting ink are formed on the surface of the nozzle plate 21. The nozzle density is set within the range of, for example, 150 to 1200 dpi.

[0022] The actuator substrate 22 is a rectangular substrate made of, for example, insulating ceramics. As shown in FIG. 3, a plurality of ink pressure chambers 51 and air chambers 52 are alternately formed in the actuator substrate 22 along a first direction, for example, the X direction. The pressure chambers 51 communicate with the nozzles 25. The pressure chambers 51 communicate with the ink supply ports 24 via a common ink chamber (not shown) formed in, for example, the actuator substrate 22 or the sealing member 23. That is, the nozzle head section 2 supplies ink to the pressure chambers 51 of each channel through the ink supply ports 24. That is, the nozzle head section 2 serves both as a liquid ejection section and a liquid supply section. On the other hand, the air chambers 52 arranged adjacent to the pressure chambers 51 are closed spaces that do not communicate with the nozzles 25 and the common ink chamber (not shown). The pressure chamber 51 and the air chamber 52 are formed by cutting out, for example, a rectangular groove shape in a second direction, for example, the Z direction, two piezoelectric members 26, 27 that are stacked in directions with opposite polarization directions (for example, facing directions) on the actuator substrate 22. That is, the pressure chamber 51 and the air chamber 52 are partitioned by the side walls of the piezoelectric members 26, 27 that are stacked in a third direction, for example, the Y direction.

[0023] The electrode 53 is integrally formed on the bottom and both side surfaces of the pressure chamber 51. The electrode 53 of the pressure chamber 51 is connected to an individual wiring 54 which is a wiring electrode. The electrode 55 is integrally formed on the bottom and both side surfaces of the air chamber 52. The electrode 55 of the air chamber 52 is connected to a common wiring 56 which is a wiring electrode. That is, the connection point of the electrode 53 of the pressure chamber 51 and the individual wiring 54 is one terminal of the actuator 5. The connection point of the electrode 55 of the air chamber 52 and the common wiring 56 is the other terminal of the actuator 5. The electrodes 53, 55, the individual wiring 54 and the common wiring 56 are formed of, for example, a nickel thin film. The individual wiring 54 is connected to a driving driver D (i.e., a driving circuit) of the driving IC 31. The driving driver D of each channel provides a driving voltage V1 as a driving signal to the actuator 5 of each channel. The common wiring 56 is connected to, for example, ground (GND). With this configuration, when a driving voltage V1 is applied to the actuator 5, an electric field is applied in a direction intersecting (preferably perpendicular to) the polarization axes of the piezoelectric members 26 and 27, and the piezoelectric members 26 and 27, which form the side walls of the pressure chamber 51 in the X direction, deform symmetrically in the X direction in shear mode.

[0024] That is, the ink pressure chamber 51 is formed by being sandwiched between a pair of columnar actuators 5 using piezoelectric members 26, 27. A potential difference is applied to both walls of the columnar actuator 5, i.e., the inner wall and the outer wall of the pressure chamber 51, and the actuator 5 is charged, thereby deforming the actuator 5. This changes the volume of the pressure chamber 51, and as a result, the ink pressure inside the pressure chamber 51 changes. Ink is ejected from the nozzle 25 by adjusting the magnitude and timing of this change.

[0025] Fig. 4 shows the wiring of the actuator substrate 22, the flexible printed wiring board 3, and the printed board 4. Fig. 4 is a plan view of the substrates 22, 3, and 4 before they are connected to each other. Fig. 5 is a side view of the substrates 22, 3, and 4 after they are connected to each other. The actuator substrate 22 and the flexible printed wiring board 3 connect their terminal portions 20, 30 to each other. The flexible printed wiring board 3 and the printed board 4 connect their terminal portions 32, 40 to each other.

[0026] As described above, the actuator substrate 22 connects the individual wiring 54 to one terminal of the actuator 5, and connects the common wiring 56 to the other terminal of the actuator 5. The individual wiring 54 and the common wiring 56 drawn from each terminal are formed up to the terminal section 20. The individual wiring 54 and the common wiring 56 of the terminal section 20 are formed, for example, alternately in parallel at equal intervals. The individual wiring 54 and the common wiring 56 are formed in a thin film shape using, for example, nickel, aluminum, gold, or an alloy thereof. To ensure insulation, an insulating layer or an insulating member is provided in an area excluding the terminal section 20. The wiring width and wiring interval of the individual wiring 54 and the common wiring 56 in the terminal section 20 are selected, for example, from within a range of 10 μm to 30 μm. The thickness of each of the wirings 54, 56 is, for example, 0.4 μm.

[0027] The flexible printed wiring board 3 is a flexible printed wiring board using a synthetic resin film such as polyimide. The driving IC 31 is, for example, a driver chip formed on a silicon semiconductor substrate. The flexible printed wiring board 3 is formed with an output wiring 33, an input wiring 34, a power supply wiring 35 for a voltage V1, a ground wiring 36, a common electrode section 37, a common wiring 38, and a common passing wiring 39. These wirings and the driving IC 31 are preferably formed on one side of the flexible printed wiring board 3. This is because forming them on both sides requires additional through holes, etc. The output wiring 33 drawn from the driving IC 31 is formed up to the terminal section 30. The output wiring 33 is an individual wiring formed on the flexible printed wiring board 3. The number of the output wirings 33 is, for example, the same as the number of the individual wirings 54 on the actuator substrate 22 side.

[0028] The common electrode section 37 is formed on the substrate tip side (i.e., the actuator substrate 22 side) along one direction of the substrate surface, for example, the width direction. The common wiring 38 drawn from the common electrode section 37 to the driving IC 31 side is formed up to the terminal section 30. At this time, in the terminal section 30, the output wiring (individual wiring) 33 and the common wiring 38 are formed, for example, alternately in parallel at equal intervals. That is, the output wiring (individual wiring) 33 and the common wiring 38 are arranged in a comb-teeth shape. This comb-teeth-shaped terminal section 30 becomes a wiring terminal section for thermocompression bonding. The common electrode section 37 is required to supply charge / discharge current to all the actuators 5, so it is made wider than the common wiring 38. The electrode width of the common electrode section 37 is, for example, 0.8 mm. In this way, when the common electrode section 37 is formed on the flexible printed wiring board 3 instead of the actuator substrate 22, the common electrode section 37 can be made thicker than when it is formed on the actuator substrate 22. The thickness of the common electrode section 37 is, for example, 8 μm. As a result, it is possible to suppress a voltage drop caused by current concentration during driving.

[0029] The common passing wiring 39 is connected to both ends of the common electrode portion 37. The common passing wiring 39 is formed up to the terminal portion 32 on the side where the printed circuit board 4 is connected. It is preferable that the common passing wiring 39 is formed on both sides in order to reduce current concentration during operation.

[0030] The input wiring 34 drawn from the driving IC 31 is formed up to the terminal section 32 on the side to which the printed circuit board 4 is connected. Since the driving IC 31 can be controlled by serial communication, the number of input wirings 34 can be made smaller than the number of output wirings 33.

[0031] The power supply wiring 35 and the ground wiring 36 are connected to the driving IC 31. The power supply wiring 35 and the ground wiring 36 are each formed up to the terminal section 32 on the side where the printed circuit board 4 is connected. The output wiring 33, the input wiring 34, the power supply wiring 35, the ground wiring 36, the common electrode section 37, the common wiring 38, and the common passing wiring 39 are formed in a thin film shape of copper, for example. The thickness is, for example, 8 μm. The wiring width and wiring interval of the output wiring 33 and the common wiring 38 of the terminal section 30 are each selected from within a range of, for example, 10 μm to 30 μm. The wiring width of the input wiring 34 is, for example, 0.15 mm. The wiring interval of the input wiring 34 is, for example, 0.15 mm. The wiring width of the power supply wiring 35, the ground wiring 36, and the common passing wiring 39 is, for example, 0.4 mm.

[0032] The printed circuit board 4 is a hard through-hole board in which glass fiber-reinforced epoxy resin layers and copper wiring layers are laminated in multiple layers. An output wiring 41, a power supply wiring 42, and a ground wiring 43 are formed on the terminal section 40. The output wiring 41 is connected to the input wiring 34 of the flexible printed wiring board 3. The power supply wiring 42 is connected to the power supply wiring 35 of the flexible printed wiring board 3. The ground wiring 43 is connected to the ground wiring 36 and the common passing wiring 39 of the flexible printed wiring board 3. A signal for selectively driving each actuator 5 from the control board 17 of the inkjet printer 10 is applied to the output wiring 41. A drive voltage V1 is applied to the power supply wiring 42. The ground wiring 43 is connected to, for example, the ground (GND) on the control board 17 of the inkjet printer 10.

[0033] As shown in FIG. 5, the terminal portion 20 of the actuator substrate 22 and the terminal portion 30 of the flexible printed wiring board 3 are connected via an anisotropic conductive film (ACF) 6. That is, the terminal portion 20 of the actuator substrate 22 and the terminal portion 30 of the flexible printed wiring board 3 are arranged to face each other, and the ACF 6 is interposed between them, and the wiring of the terminal portions 20 and 30 is connected together by thermocompression bonding using a thermocompression bonding tool. This allows the individual wiring 54 and the output wiring 33, and the common wiring 56 and the common wiring 38 to be electrically connected. The flexible printed wiring board 3 and the printed board 4 are connected in the same manner. Note that it is preferable to bend the tip portion of the flexible printed wiring board 3 into a dogleg so that the common electrode portion 37 formed on the tip side of the board does not come into contact with the actuator substrate 22 and short-circuit. The dogleg bent portion may be placed on the sealing member 23 as illustrated in FIG. 5, or may be made to maintain the dogleg bent state by itself. Furthermore, it is preferable to provide a notch on each side of flexible printed wiring board 3 so that it can be easily bent into an L shape.

[0034] In the inkjet head 100 formed as described above, the driver D of the driver IC 31 can be assigned to each actuator 5, as shown in Fig. 6. The driver D of each channel can apply a drive voltage V1 to each actuator 5 through an individual wiring 54 to cause ink to be ejected from the nozzle 25.

[0035] Second embodiment Next, an inkjet head 100 according to a second embodiment will be described. The inkjet head 100 according to the second embodiment has a similar configuration to the inkjet head 100 of the first embodiment, except for a different wiring configuration of the flexible printed wiring board 3. Therefore, the same components as those in the inkjet head 100 of the first embodiment are denoted by the same reference numerals and detailed description thereof will be omitted.

[0036] Fig. 7 shows the wiring of the actuator substrate 22, the flexible printed wiring board 3, and the printed board 4. Fig. 7 is a plan view of the substrates 22, 3, and 4 before they are connected to each other. Fig. 8 shows a partially enlarged plan view and a side view of the flexible printed wiring board 3. Fig. 9 is a side view showing the substrates 22, 3, and 4 after they are connected to each other.

[0037] 7 and 8, in the flexible printed wiring board 3 of this embodiment, the common wiring 38 is extended from the ground wiring 36 to the terminal portion 30. More specifically, the portion of the ground wiring 36 formed on the flexible printed wiring board 3 within the arrangement area of ​​the driving IC 31 is used as a common electrode portion, and the common wiring 38 of each channel is commonly connected. In other words, the ground wiring 36 also serves as the common electrode portion. For this reason, the common electrode portion 37 and the common passing wiring 39 of the first embodiment are omitted.

[0038] As shown particularly in the plan view (a) and side view (b) of Figure 8, the output wiring 33, which is an individual wiring, is connected to the driving IC 31 via a bump 61. The common wiring 38 is connected to the ground wiring 36 through between the bumps 61 of adjacent output wirings 33. The ground wiring 36 is connected to the driving IC 31 via a bump 62. The power supply wiring 35 is connected to the driving IC 31 via a bump 63. The input wiring 34 is connected to the driving IC 31 via a bump 64. The gap between the driving IC 31 and the substrate surface is protected by an underfill 65.

[0039] The terminal portion 20 of the actuator substrate 22 and the terminal portion 30 of the flexible printed wiring board 3 are connected via an ACF 6 as shown in FIG. 9. The flexible printed wiring board 3 and the printed circuit board 4 are connected in a similar manner. The flexible printed wiring board 3 of this embodiment can reduce the substrate area by omitting the common electrode portion 37 at the substrate tip and the common passing wiring 39 on both sides as in the first embodiment. Furthermore, the substrate tip does not need to be bent in an L-shape. However, the configuration is not limited to one in which the ground wiring 36 also serves as the common electrode portion, and may be separated and connected on the substrate, for example.

[0040] According to any of the above-mentioned embodiments, the common electrode section (shared with the common electrode section 37 or the ground wiring 36) is provided on the flexible printed wiring board 3 to commonly connect the common wiring 38 of each channel, and the terminal section 30 in which the output wiring (individual wiring) 33 from the driving IC 31 and the common wiring 38 from the common electrode section are arranged in a comb-teeth shape is provided on the flexible printed wiring board 3, thereby making it possible to prevent the ink ejection from becoming unstable due to current concentration. Furthermore, compared to the case where the common electrode section is formed on the actuator substrate 22, the manufacturing cost can be reduced. This is particularly effective in that it can be manufactured as a film carrier package.

[0041] The inkjet head 100 is not limited to the actuator 5 of a shear mode type in which the pressure chambers 51 and the air chambers 52 are arranged alternately. For example, the inkjet head 100 may have a configuration in which a plurality of nozzles 25 and actuators 5 are arranged on the surface of the nozzle plate 21. Other drop-on-demand piezoelectric actuators 5 may also be used.

[0042] In the above embodiment, the inkjet head 100 of the inkjet printer 10 has been described as an example of a liquid ejection device, but the liquid ejection device may also be a modeling material ejection head of a 3D printer or a sample ejection head of a dispensing device.

[0043] That is, according to the above-described embodiment, it is possible to provide the following film wiring board for driving a liquid ejection head. (1) a plurality of drive circuits that output drive signals to be applied to a plurality of channels that eject liquid; individual wiring of the channels respectively connected to the drive circuit; A common wiring of the channels connected to a common electrode portion disposed on a tip side of the substrate; Between the common electrode portion and the drive circuit, there is provided a wiring terminal portion formed by thermocompression bonding, in which the individual wirings and the common wiring are arranged in a comb-teeth shape. (2) a driver chip including a plurality of drive circuits that output drive signals to be applied to a plurality of channels that eject liquid; individual wiring of the channels respectively connected to a driving circuit in the driver chip; a common wiring of the channel connected to a common electrode portion within an arrangement region of the driver chip; The individual wirings and the common wiring are arranged in a comb-like shape, and the individual wirings and the common wirings are provided in a wiring terminal portion bonded by thermocompression. (3) In the wiring terminal portion, the individual wirings and the common wirings are arranged alternately. (4) The common electrode portion also serves as a ground wiring connected to the driver chip. (5) The film wiring board is capable of folding a portion of the common electrode portion disposed on the tip side of the board. (6) A notch is formed in the side of the film wiring board at the bending position. (7) The film wiring board has the drive circuits, the individual wiring, the common wiring, the common electrode portion, and the wiring connection portion formed on one surface of a substrate.

[0044] Furthermore, according to the above-described embodiment, the following liquid ejection head can be provided. (8) A plurality of channels each having a nozzle and an actuator for ejecting a liquid; A liquid supply unit that supplies a liquid to the channel; The film wiring board according to any one of (1) to (7) above is provided. (9) The channel includes a liquid pressure chamber communicating with the nozzle, an air chamber disposed adjacent to the pressure chamber, and the actuator separating the pressure chamber and the air chamber; The individual wiring of the film wiring board is electrically connected to an electrode provided in the pressure chamber, and the common wiring is electrically connected to an electrode provided in the air chamber.

[0045] The embodiments of the present invention are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, and are included in the scope of the invention and its equivalents described in the claims. [Explanation of symbols]

[0046] 10. Inkjet Printer 100~103 Inkjet head 2 Nozzle head 22 Actuator board 25 Nozzles 3 Flexible printed wiring board (film wiring board) 30 Terminal section 31 Driver IC (driver chip) 33 Output wiring (individual wiring) 37 Common electrode section 38 Common Wiring 4 Printed circuit board 5 Actuators 51 Pressure Chamber 52 Air chamber D Driver (drive circuit)

Claims

1. a plurality of drive circuits for outputting drive signals to be applied to a plurality of channels for ejecting liquid; individual wiring of the channels respectively connected to the drive circuit; A common wiring of the channels connected to a common electrode portion disposed on a film wiring substrate; a wiring terminal portion for thermal compression bonding in which the individual wirings and the common wirings are arranged in a comb-teeth shape between the common electrode portion and the drive circuit; a wiring terminal portion for connecting the individual wirings to the common wirings, the individual wirings being arranged alternately with the common wirings;

2. The drive circuit for each of the channels is provided in a driver chip, The individual wiring of each channel is connected to the driving circuit in the driver chip, 2. The film wiring board for driving a liquid ejection head according to claim 1, wherein the common wiring for each of the channels is connected to the common electrode portion within an area in which the driver chip is disposed.

3. 2. The film wiring board for driving a liquid ejection head according to claim 1, wherein the common electrode portion is disposed on a tip side of the film wiring board.

4. A plurality of channels each having a nozzle and an actuator for ejecting liquid; A liquid supply unit that supplies a liquid to the channel; A liquid ejection head comprising: a film wiring board for driving a liquid ejection head according to any one of claims 1 to 3.

5. the channel includes a pressure chamber for liquid communicating with the nozzle, an air chamber disposed adjacent to the pressure chamber, and the actuator separating the pressure chamber and the air chamber; 5. The liquid ejection head according to claim 4, wherein the individual wiring of the film wiring board is electrically connected to an electrode provided in the pressure chamber, and the common wiring is electrically connected to an electrode provided in the air chamber.

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