transformer

Abstract

To provide a transformer capable of reducing the complexity of the structure of a substrate having a first coil pattern and a second coil pattern.SOLUTION: A transformer 1 includes a base material 31 and a substrate 30. The substrate 30 has a first coil pattern 32a provided on a first surface 31a of the base material 31 and a second coil pattern 33a provided on a second surface 31b of the base material 31. The first wiring pattern 32b is provided on the first surface 31a. An inner circumferential side end part 32e of the first coil pattern 32a and one end part 32g of the first wiring pattern 32b are electrically connected by a first jumper pin 35. A second wiring pattern 33b is provided on the second surface 31b. The inner circumferential side end part 33e of the second coil pattern 33a and one end part 33g of the second wiring pattern 33b are electrically connected by a second jumper pin 37.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a two-layer substrate having a first coil pattern and a second coil pattern, and a core that electromagnetically couples the first coil pattern to the second coil pattern. . [Background technology]

[0002] Conventionally, a coil including a first spiral coil pattern, an insulating base material, and a second spiral coil pattern A coil that electromagnetically couples the first coil pattern and the second coil pattern to a substrate on which the coils are laminated. In such a transformer, the first coil is In order to electrically connect the inner peripheral ends of the first coil pattern and the second coil pattern, A conductive pattern for drawing out is provided between the layers of the first coil pattern and the second coil pattern. That is, the board is a multi-layer board having three or more conductive layers (usually four or more). The inner peripheral ends of the first coil pattern and the second coil pattern are The first coil pattern and the second coil pattern are connected to each other by using a conductive pattern for drawing out. The electrical connection is electrically connected to the outside of the

[0003] A four-layer board having four layers of spiral coil patterns is disclosed in, for example, Patent Document 1. As shown. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2009-016504 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, when the substrate is formed into a multilayer substrate having three or more conductive layers (usually four or more layers), However, this causes a problem that the structure of the substrate becomes complicated and the cost increases.

[0006] The present invention has been made in consideration of the above points, and provides a first coil pattern and a second coil pattern. To provide a transformer capable of suppressing the complexity of the structure of a substrate having a coil pattern. The objective of the project is to provide [Means for solving the problem]

[0007] The transformer according to the present invention comprises an insulating base material and a conductive A first spiral coil pattern and a conductive spiral coil pattern provided on the second surface of the substrate. a two-layer substrate having a first coil pattern and a second coil pattern; and a core that electromagnetically couples the pattern to the first surface of the base material. a first wiring pattern is provided, the first wiring pattern being disposed at a predetermined distance from the first wiring pattern; The inner peripheral end of the first coil pattern and one end of the first wiring pattern are connected to a first jack. The second surface of the base material is electrically connected to the second contact by a barrier member. A second wiring pattern is provided, the second wiring pattern being disposed at a predetermined distance from the first wiring pattern. The inner peripheral end of the second coil pattern and one end of the second wiring pattern are connected to a second gyro. They are electrically connected by a jumper member.

[0008] According to the transformer of the present invention, the inner peripheral end of the first coil pattern and the first wiring pattern The first end is electrically connected to the first jumper member. The inner peripheral end of the first coil pattern is electrically connected to the first jumper member. Similarly, the inner peripheral end of the second coil pattern and one end of the second wiring pattern can be The second jumper member is electrically connected to the first jumper member. The inner peripheral end of the second coil pattern can be electrically led out by a second jumper member. As a result, the board can be formed into a multi-layer board having three or more conductive layers (usually four or more). Since there is no need to form a circuit board, the circuit board structure is prevented from becoming complicated, and the cost is prevented from increasing. can be done.

[0009] In the above transformer, the first coil pattern is preferably a first overlap region that overlaps with the core when viewed from a direction; and has a second overlap region overlapping with the core when viewed in the thickness direction, and at least The first overlap region and the second overlap region are The first coil pattern and the second coil pattern are provided in the same position and with the same shape. When a current flows through the first coil pattern and the second coil pattern, heat is generated, Therefore, as described above, at least the first on The burlap region and the second overlap region have the same shape when viewed from the thickness direction. If the overlapping regions are provided at the same position, the first overlapping region and the second overlapping region can be brought closer to each other. Therefore, the heat generation amount of the first coil pattern and the second coil pattern can be reduced. The heat from the large coil pattern is divided into the first coil pattern and the second coil pattern. Therefore, the first coil pattern can dissipate heat (thermal conduction). The temperature of the coil pattern that generates the most heat among the first and second coil patterns becomes high. This can prevent excessive capacitance from being generated, which can prevent the characteristics of the transformer from deteriorating. Cut.

[0010] In the above transformer, preferably, the core and the two-layer substrate are laminated to form a flat plate. a metal housing including a base, The first surface of the two-layer substrate is a front surface of the first coil. The first coil pattern is disposed so as to face the base, and the first coil pattern is formed to have a thickness of the two-layer substrate. The base includes a non-overlapping region that does not overlap with the core when viewed from a viewing direction. A heat dissipation section for dissipating heat from the two-layer board is provided so as to protrude from the base toward the two-layer board. Between the heat dissipation portion and the non-overlapping region, An insulating heat dissipation member is provided so as to be in close contact with the non-overlapping region. With this configuration, the heat of the first coil pattern, which is the primary coil, can be efficiently dissipated through the heat dissipation member. Heat can be dissipated (thermally conducted) to the hot section. For this reason, the primary coil has more heat than the secondary coil. When the circuit is configured so that the current flows (the heat generated by the primary coil is greater than that of the secondary coil), In this case, the heat dissipation can be further improved. Metal can be used for the portion, and heat dissipation can be easily improved.

[0011] In the above transformer, preferably, the first coil pattern and the second coil pattern The inner peripheral end of the turn is disposed on one side of the core, The ends of the first coil pattern and the second coil pattern on the outer periphery are opposite to each other with respect to the core. the first wiring pattern and the second wiring pattern are disposed on the side of the first wiring pattern. The one end is disposed on one side of the core, and the first wiring pattern and The other end of the second wiring pattern is disposed on the other side of the core. With this configuration, the first coil pattern and the second coil pattern arranged on one side of the core The inner end of the second coil pattern can be easily electrically connected to the other side of the core. It can be withdrawn.

[0012] In the above transformer, preferably, the core and the two-layer substrate are laminated to form a flat plate. The two-layer substrate has a metal housing including a base, and the cores are arranged so that the two-layer substrate is The base includes a pair of cores arranged at a predetermined interval, and the two layers are a central heat dissipation portion is disposed between the pair of cores so as to protrude toward the substrate, Between the central heat dissipation portion and the two-layer substrate, a heat sink that is in close contact with the central heat dissipation portion and the two-layer substrate is provided. The first coil pattern and the second coil pattern are provided with an insulating heat dissipation member. When current flows through the wire, the heat generated tends to accumulate in the center of the board. A central heat sink is provided between the pair of cores on the base, and a heat sink is provided between the central heat sink and the two-layer board. If a heat dissipation member is provided so as to be in close contact with the central heat dissipation section and the two-layer board, Heat can be efficiently dissipated (thermally conducted) to the central heat dissipation part. Therefore, metal can be used in the central heat dissipation section, and heat dissipation can be easily improved. do. Effect of the Invention

[0013] According to the present invention, the structure of the substrate having the first coil pattern and the second coil pattern is It is possible to provide a transformer that can be made less complicated. [Brief description of the drawings]

[0014] [Figure 1] 1 is a perspective view showing a structure of a transformer according to an embodiment of the present invention; [Diagram 2] 1 is an exploded perspective view showing a structure of a transformer according to an embodiment of the present invention. [Diagram 3] 1 is a perspective view showing a structure of a housing of a transformer according to an embodiment of the present invention; [Figure 4] FIG. 2 is a cross-sectional view taken along line 100-100 in FIG. [Diagram 5] 1 is a diagram showing a substrate of a transformer according to an embodiment of the present invention, viewed from a first surface side. [Figure 6] 2 is a diagram showing a substrate of a transformer according to an embodiment of the present invention, viewed from a second surface side. FIG. [Figure 7] FIG. 2 is a cross-sectional view taken along line 150-150 in FIG. [Figure 8] 2 is an enlarged cross-sectional view showing a structure around a first jumper pin and a second jumper pin of a transformer according to one embodiment of the present invention. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Hereinafter, the structure of a transformer 1 according to an embodiment of the present invention will be described with reference to the drawings. He explains.

[0016] As shown in FIG. 1 and FIG. 2, the transformer 1 includes a metal housing 10, a heat dissipation sheet (a heat dissipation member ) 21, lower core (core) 22, heat dissipation sheet (heat dissipation member) 23, substrate (two-layer substrate) 30, Heat dissipation sheet (heat dissipation member) 24, spacers 25a, 25b, upper core (core) 26, heat dissipation sheet The heat sink 27 and the metal pressing plate 28 constitute the heat sink 27 .

[0017] The entire housing 10 is made of a metal having good thermal conductivity, such as copper or aluminum. As shown in FIGS. 2 and 3, the housing 10 includes a lower core 22, a substrate 30, and The upper core 26 and the like are stacked on a flat base 11. The housing 10 is attached to a heat sink (not shown) using the screw insertion holes 11a. As described below, the heat generated in the lower core 22, the substrate 30 and the upper core 26 is The heat is dissipated (thermally conducted) to a heat sink (not shown) through the base 11. A heat dissipation sheet or the like having good thermal conductivity is placed between the heat sink and the heat generating member (not shown).

[0018] A heat dissipation sheet 21 having a predetermined depth is disposed in a predetermined area of ​​the base 11. A pair of sheet placement recesses 11b are formed. The pair of sheet placement recesses 11b are They are arranged in the direction indicated by the arrow AA' at a predetermined interval from each other.

[0019] Between the pair of sheet placement recesses 11b of the base 11, The central heat dissipation portion 12 is formed so as to protrude (toward the substrate 30 side). The central heat sink 12 is formed so as to extend in the direction of the arrow BB'. A screw hole 12a for fixing the plate 30 is formed.

[0020] The base 11 is provided with a pair of first radially inwardly extending sheet-mounting recesses 11b in the direction of the arrow AA'. The first heat dissipation section 14a, the second heat dissipation section 14b, and the third heat dissipation section 14c are provided. The first heat dissipation portion 14a, the second heat dissipation portion 14b, and the third heat dissipation portion 14c are protruding upward from the upper surface of the base 11. The groove is formed so as to extend in the direction of the arrow BB'. The central heat dissipation section 12, the first heat dissipation section 14a, the second heat dissipation section 14b and the third heat dissipation section 14c are The surfaces are formed so that their heights are approximately the same.

[0021] The second heat dissipation section 14b is larger than the central heat dissipation section 12, the first heat dissipation section 14a, and the third heat dissipation section 14c. The second heat dissipation portion 14b is formed so that the length in the direction of the arrow BB' is shortened. , is disposed in the direction of the arrow B' with respect to the center of the base 11 in the direction of the arrow BB'. A space S is formed in the second heat dissipation portion 14b in the direction of the arrow B. As shown in the figure, the second heat dissipation portion 14b is disposed at a predetermined distance from the sheet placement recess 11b. The first heat dissipation portion 14a is disposed at a predetermined interval from the second heat dissipation portion 14b. The third heat dissipation portion 14c is disposed at a predetermined distance from the sheet placement recess 11b. If cooling air is blown into these gaps, the heat dissipation of transformer 1 can be improved. is possible.

[0022] As shown in FIG. 3, the base 11 has a pair of sheet placement recesses 11b sandwiched in the direction of the arrow BB'. Two pairs of walls 15 are provided so as to accommodate the two screws. The screw insertion hole 15a is provided with a hole 15a. The screw insertion hole 15a allows the screw installation height to be adjusted. As shown in FIG. 1, the oval shape is slightly longer in the vertical direction.

[0023] In the vicinity of the four corners of the base 11, there are provided screws for fixing the substrate 30 so as to be adjacent to the screw insertion holes 11a. The fixing portion 16 is made of a bolt for fixing the base 11 to the upper surface of the base 11. The central heat dissipation portion 12, the first heat dissipation portion 14a, and the second heat dissipation portion 14b are provided so as to protrude toward the center of the heat dissipation portion 12. The thickness of the heat dissipation sheet 23 is slightly larger than the upper surfaces of the heat dissipation section 14b and the third heat dissipation section 14c. The height of the opening is approximately the same as the height of the opening.

[0024] The heat dissipation sheet 21 is a thermally conductive sheet that fills gaps and transmits heat, and also has elasticity. For example, a heat dissipation sheet is an electrically insulating sheet made of silicone or rubber. The heat conductivity of the heat sink 21 is preferably 0.5 W / m·K or more. From the viewpoint of thermal stability, a higher value is preferable, but the upper limit is about 50 W / m K with current manufacturing technology. In addition, the heat dissipation sheet 21 preferably has an Asker C hardness of 50 or less. From the viewpoint of adhesion to uneven surfaces, it is preferable that the Asker C hardness is lower. The lower limit of the manufacturing technology is about 1. Also, the heat dissipation sheet 21 has a resistance of 0.5 kV / mm However, in the case where the transformer 1 of the present embodiment is used, Depending on the environment, it may be possible to apply a voltage of less than 0.5 kV / mm (e.g., 0.1 kV / mm). In addition, from the viewpoint of voltage resistance, it is preferable that the dielectric breakdown voltage is high. The upper limit of the technology is about 30 kV / mm. It may contain particles with good thermal conductivity, such as ceramics or fillers. The sheets 23, 24 and 27 are formed of a heat dissipation sheet of the same material as the heat dissipation sheet 21, for example. It has been made.

[0025] As shown in FIG. 2, the heat dissipation sheet 21 is formed so as to extend in the direction of the arrow BB'. Both are provided in pairs at a predetermined distance from each other in the direction of the arrow AA'. The heat dissipation sheets 21 are disposed in the pair of sheet placement recesses 11b. As described later, the sheet mounting recess 11b is disposed between the upper surface of the sheet mounting recess 11b and the lower surface of the lower core 22. As a result, the upper surface of the sheet-mounting recess 11b and the lower surface of the lower core 22 are tightly fitted together without any gaps. In this way, when the lower core 22 generates heat, the heat of the lower core 22 is transferred to the heat dissipation sheet 21. The heat is dissipated (thermally conducted) to the base 11 of the housing 10 via the .

[0026] The lower core 22 is made of ferrite, magnetic metal, or powder. It is formed by a magnetic core, etc.

[0027] The lower core 22 is U-shaped with protrusions 22b formed on both ends of the upper surface 22a in the direction of the arrow BB'. The upper surface 22a of the lower core 22 is provided with the central heat dissipation portion 12, the first heat dissipation portion 14a, the second heat dissipation portion 14b, and the It is formed so as to be substantially flush with the upper surfaces of heat dissipation portion 14b and third heat dissipation portion 14c.

[0028] A pair of lower cores 22 adjacent to each other in the direction of arrow BB' constitute an E-shaped core. The lower core 22 may be formed of an E-shaped core instead of a U-shaped core. That is, the E-shaped core is not composed of a lower core 22 consisting of a pair of U-shaped cores. The lower core may be made up of one E-shaped core. The lower cores 22) are provided in a pair at a predetermined interval in the direction of the arrow AA'. The E-shaped core is formed to have approximately the same size and shape as the heat dissipation sheet 21. The entire lower surface of the core is in close contact with the heat dissipation sheet 21 .

[0029] The heat dissipation sheet 23 is formed so as to avoid (not overlap) the protruding portion 22b of the lower core 22. In addition, the heat dissipation sheet 23 has a central portion in the direction of the arrow BB′ at the protruding portion 22 of the lower core 22. b and a slit 23a is formed at a position corresponding to the screw hole 12a of the central heat dissipation portion 12. do.

[0030] The heat dissipation sheet 23 has a first region disposed on the first heat dissipation portion 14a and the second heat dissipation portion 14b. 23b and the second core 23b arranged on the upper surface 22a of the E-shaped core (the pair of lower cores 22) in the direction of the arrow A. The second region 23c, the third region 23d disposed on the central heat dissipation portion 12, and the E-shaped region in the direction of the arrow A' A fourth region 23e disposed on the upper surface 22a of the core (the pair of lower cores 22), and a third heat dissipation section and a fifth region 23f disposed on the first region 14c of the housing 10. On the top surfaces of the first heat dissipation section 14a, the second heat dissipation section 14b, the central heat dissipation section 12 and the third heat dissipation section 14c The upper surface 22a of the pair of E-shaped cores is also in close contact with the upper surface 22a of the pair of E-shaped cores without any gaps. When the lower core 22 generates heat, the heat is transferred to the housing 10 via the heat dissipation sheet 23. The first heat dissipation portion 14a, the second heat dissipation portion 14b, the central heat dissipation portion 12, and the third heat dissipation portion 14c. (Thermal conduction)

[0031] In addition, the substrate 30 is placed on the heat dissipation sheet 23. The heat dissipation sheet 23 is This adheres closely to the first conductive layer 32 described later without any gaps. Heat from the plate 30 is transferred to the first heat dissipation portion 14a, the second heat dissipation portion 14b, The heat is dissipated (thermally conducted) to the central heat dissipation portion 12 and the third heat dissipation portion 14c. When the temperature of the lower core 22 is higher than that of the lower core 22, the heat of the substrate 30 is transferred to the lower core 22 through the heat dissipation sheet 23. When heat is dissipated (heat is conducted) to the core 22, and the temperature of the lower core 22 is higher than the temperature of the substrate 30 In addition, the heat of the lower core 22 is also dissipated (thermally conducted) to the substrate 30 via the heat dissipation sheet 23 .

[0032] As shown in FIGS. 5 and 6, the substrate 30 includes an insulating base material 31 and a first surface 3 of the base material 31. 1a (the lower surface in FIG. 2 ) of the substrate 31 and the second surface 31b (the lower surface in FIG. 2 ) of the substrate 31. The first conductive layer 32 is provided on the upper surface of the first conductive layer 32. The first conductive layer 32a includes a spiral coil pattern 32a which serves as a primary coil, and the second conductive layer 33 includes The substrate 30 includes a second coil pattern 33a having a spiral shape, which serves as a secondary coil. The detailed structure will be described later.

[0033] As shown in FIG. 2, the heat dissipation sheet 24 is formed so as to extend in the direction of the arrow AA′. A pair of heat dissipation sheets are provided at a predetermined interval from each other in the direction of the arrow BB'. The heat dissipation sheet 24 is disposed on the second conductive layer 33 of the substrate 30. 2. The upper core 26 is disposed between the second conductive layer 33 of the substrate 30 and the lower surface of the upper core 26. The second conductive layer 33 of the plate 30 is in close contact with the lower surface of the upper core 26. When the temperature of the upper core 26 is higher than that of the upper core 26, the heat of the substrate 30 is transferred upward through the heat dissipation sheet 24. When heat is dissipated (heat is conducted) to the side core 26 and the temperature of the upper core 26 is higher than the temperature of the substrate 30 In addition, the heat of the upper core 26 is also dissipated (thermally conducted) to the substrate 30 via the heat dissipation sheet 24 .

[0034] As shown in FIG. 2 and FIG. 7, the spacer 25a is formed so as to extend in the direction of the arrow AA′. A pair of the electrodes are provided at a predetermined interval from each other in the direction of the arrow BB'. The pair of spacers 25a are provided on the convex portions at both ends of the E-shaped core (the pair of lower cores 22) in the direction of the arrow BB'. The spacer 25b is disposed on the portion 22b. The spacer 25b is formed so as to extend in the direction of the arrow AA′. A pair of the electrodes are provided at a predetermined interval from each other in the direction of the arrow AA'. The pair of spacers 25b are arranged at the central convex portion of the E-shaped core (the pair of lower cores 22) in the direction of the arrow BB'. It is located on 22b.

[0035] The pair of spacers 25a are arranged to sandwich the pair of heat dissipation sheets 24 in the direction of the arrow BB'. The pair of spacers 25b are disposed between the pair of heat dissipation sheets 24. is.

[0036] The spacers 25a and 25b are arranged in a state where the upper core 26 is placed on the heat dissipation sheet 24. The heat dissipation sheets 23 and 24 are prevented from being compressed too much in the thickness direction, and the lower surface of the upper core 26 The purpose of this is to set the distance between the upper surface 22a of the lower core 22 at a predetermined value. The material of the sensors 25a and 25b is not particularly limited, but for example, an insulating resin substrate or the like may be used. There can be.

[0037] The upper core 26 is a flat I-shaped core, and is made of ferrite, like the lower core 22. The upper core 26 is formed of a magnetic material such as a ferrite core, a magnetic metal, or a powder magnetic core. The pair of the conductors are formed to extend in the direction of the arrow AA' at a predetermined interval. The upper core 26 has substantially the same size and shape as the E-shaped core when viewed in the thickness direction. is formed.

[0038] The upper core 26 and the E-shaped core (the pair of lower cores 22) form a first coil pole of the substrate 30. A core is formed that electromagnetically couples the turn 32a and the second coil pattern 33a. Therefore, for example, when a current is applied to the first coil pattern 32a of the substrate 30, the core (upper core A magnetic flux is generated in the magnetic path of the second coil pattern 33a. In this case, a current flows so as to cancel the magnetic flux generated in the core. The pair of lower cores 22) may be arranged so as to be in contact with each other, or may be arranged so as to be spaced apart from each other by a predetermined distance. They may be spaced apart.

[0039] The heat dissipation sheet 27 is formed so as to extend in the direction of the arrow BB' and is also formed so as to extend in the direction of the arrow AA. The pair of heat dissipation sheets 27 are provided at a predetermined interval in the direction of the arrow. The heat dissipation sheet 27 is disposed on the upper core 26 when viewed from the thickness direction. It is formed in approximately the same size and shape as 6.

[0040] As described later, the heat dissipation sheet 27 is attached to the upper surface of the upper core 26 and the lower surface of the pressing plate 28. By disposing the upper core 26 between the upper surface of the upper core 26 and the lower surface of the pressing plate 28, a gap is formed between the upper surface of the upper core 26 and the lower surface of the pressing plate 28. As a result, when the upper core 26 generates heat, the heat of the upper core 26 is dissipated through the heat dissipation sheet. The heat is dissipated (thermally conducted) to the pressing plate 28 via the port 27 .

[0041] The pressing plate 28 is made of a metal having good thermal conductivity, such as copper or aluminum. The pressing plate 28 is formed so as to extend in the direction of the arrow BB'. The pair of presser plates are provided at a predetermined interval in the direction of the arrow AA'. The pressing plates 28 are disposed on the pair of heat dissipation sheets 27. When viewed from the viewing direction, it is formed to have approximately the same size and shape as the heat dissipation sheet 27.

[0042] Each of the sides of the pressing plate 28 in the direction of the arrow BB' is provided with a screw insertion hole 15a of the housing 10. A pair of screw holes 28a are provided corresponding to the heat dissipation sheet 28. 27 is pressed down, the device is fixed to the wall portion 15 of the housing 10.

[0043] Next, the detailed structure of the substrate 30 will be described.

[0044] As shown in FIG. 5 and FIG. 6, the substrate 30 includes a base material 31 and a metal film 32 provided on a first surface 31a of the base material 31. a first conductive layer 32 formed on the second surface 31b of the base material 31; and a second conductive layer 33 formed on the second surface 31b of the base material 31. The substrate 30 is disposed so that the first surface 31a faces the base 11 of the housing 10 (the first surface 31b faces the base 11 of the housing 10). For ease of understanding, the first surface 31a is placed in the first position in FIG. The first conductive layer 32 is hatched, and the second conductive layer 33 is hatched in FIG.

[0045] The substrate 31 is made of an insulating material such as fluororesin or other resin, and is formed in a flat plate shape. The outer shape of the base material 31 is formed into a substantially H-shape when viewed in the thickness direction. At both ends in the AA' direction, there are formed wide portions 31c whose length in the BB' direction is longer than the other portions. The wide portion 31c is formed on the outer side of the pair of E-shaped cores in the direction of the arrow AA'. are placed.

[0046] An opening 31d is formed at a predetermined position of the base material 31 so as to penetrate the base material 31 in the thickness direction. 31d is formed to extend in the direction of the arrow AA' and is alternately The openings 31d are arranged in a pair at a predetermined interval. The substrate 30 is formed slightly larger than the central protrusion 22b on the opposite side of the heat dissipation sheet 23. When the E-shaped core is placed on the upper side, the central protrusion 22b in the direction of the arrow BB' of the E-shaped core is placed in the opening 31d. It is inserted.

[0047] At the four corners of the base material 31, screw insertion holes 31e are formed so as to correspond to the fixing parts 16 of the housing 10. The center of the base material 31 is provided with a screw hole 12a in the central heat dissipation portion 12. The base material 31 is attached to the housing using the screw insertion holes 31e and 31f. It is fixed to the fixing portion 16 of the body 10 and the central heat dissipation portion 12 .

[0048] The first conductive layer 32 is a Cu layer formed on the first surface 31a of the base material 31 and a surface of the Cu layer. The Cu layer is formed on the first surface 31a of the base material 31 and is covered with an Au plating layer. It is formed by applying Cu paste in a specified pattern on the substrate and then hardening it. The Cu layer is a copper foil that is attached to the entire first surface 31a of the base material 31 in a predetermined pattern. The recess may be formed by etching into the recess.

[0049] As shown in FIG. 5, the first conductive layer 32 is a first coil pattern having a spiral shape that becomes a primary coil. The first coil pattern 32a and the second coil pattern 32b are arranged at a predetermined distance from each other. The first wiring pattern 32b includes the first coil pattern 32a. The amount of heat generated is greater than that of the coil pattern 33a.

[0050] The first coil pattern 32a is formed in a spiral shape around the pair of openings 31d. The first coil pattern 32a has a portion 32c extending parallel to the direction of the arrow AA' and a portion 32b extending parallel to the direction of the arrow BB. and a portion 32d extending parallel to the direction of the arrows, The groove is formed counterclockwise from the inner circumference to the outer circumference over about two and a half revolutions. The portion 32c is formed to have a line width approximately twice as large as that of the portion 32d.

[0051] The end 32e on the inner periphery of the first coil pattern 32a is in the direction of the arrow A with respect to the pair of E-shaped cores. The first coil pattern 32a is disposed in a pair of outer circumferential ends 32f. The first coil pattern 32 is disposed in the direction of the arrow A' with respect to the E-shaped core. An insulating resist layer 34 having an opening 34a is formed on the inner peripheral end 32e of the a. The end 32f is connected to the base material 3 by a through hole that penetrates the substrate 30 in the thickness direction. 1 is connected to a primary electrode 33i on the second surface 31b of the first transformer 1.

[0052] One end 32g of the first wiring pattern 32b is a portion in the direction of the arrow A with respect to the pair of E-shaped cores. The other end 32h of the first wiring pattern 32b is disposed with respect to the pair of E-shaped cores. The first wiring pattern 32b is disposed in the portion in the direction of the arrow A'. A resist layer 34 having an opening 34b is formed on the end 32h. The end 32h is formed to extend in the thickness direction of the substrate 30. The primary electrode 33j on the second surface 31b of the substrate 31 is connected to the primary electrode 33j by a through hole. do.

[0053] In this embodiment, as shown in FIG. 5 and FIG. 8, the first coil pattern 32a The first jumper pin ( One end of the first jumper member 35 is soldered. The first jumper pin 35 is connected to the end 32g of the first electrode 32 via the opening 34b of the resist layer 34. That is, the other end of the first coil pattern 32a is soldered. e and one end 32g of the first wiring pattern 32b are connected to a part of the first coil pattern 32a. Electrical connection is made via a first jumper pin 35 spanning across the two.

[0054] As shown in FIG. 6, the second conductive layer 33 is a spiral second coil pattern that serves as a secondary coil. The second coil pattern 33a is disposed at a predetermined distance from the first coil pattern 33a. and a second wiring pattern 33b.

[0055] The second coil pattern 33a is formed in a spiral shape around the pair of openings 31d. The second coil pattern 33a has a portion 33c extending parallel to the direction of the arrow AA' and a portion 33b extending parallel to the direction of the arrow BB. and a portion 33d extending parallel to the direction of the arrows, is formed over approximately two and a half revolutions in a clockwise direction from the inner periphery to the outer periphery. The portion 33c is formed to have a line width that is approximately twice as large as that of the portion 33d.

[0056] The inner peripheral end 33e of the second coil pattern 33a is in the direction of the arrow A with respect to the pair of E-shaped cores. The second coil pattern 33a is disposed in a pair of outer circumferential ends 33f. The E-shaped core is disposed in the portion in the direction of the arrow A'. An insulating resist layer 36 is formed on almost the entire area of ​​the second coil pattern c. An opening 36a is formed in the resist layer 36 on the inner peripheral end 33e of the hole 33a. There are.

[0057] The end 33f is formed to extend in the direction of the arrow B. The secondary electrode 33k is formed by a through hole penetrating the substrate 30 in the thickness direction. The holes electrically connect the first surface 31a of the base material 31. The resist layer 36 is also formed on almost the entire area of ​​the wide portion 31c in the A' direction. 6, primary electrodes 33i and 33j, secondary electrode 33k, and secondary electrode 33l described later. A circular opening is formed so that the

[0058] One end 33g of the second wiring pattern 33b is a portion in the direction of the arrow A with respect to the pair of E-shaped cores. The other end 33h of the second wiring pattern 33b is disposed with respect to the pair of E-shaped cores. The second wiring pattern 33b is disposed in the portion in the direction of the arrow A'. At the other end 33h, an opening 36b is formed in the resist layer 36. The secondary electrode 33l is formed on the substrate 30. The first surface 31a of the base material 31 is electrically connected to the first surface 31a through a through hole.

[0059] In this embodiment, as shown in FIG. 6 and FIG. 8, the inner periphery of the second coil pattern 33a The second jumper pin (the first jumper pin) is connected to the end 33e of the side through the opening 36a of the resist layer 36. One end of the jumper member 37 is soldered to the second wiring pattern 33b. The one end 33g is connected to the second jumper pin 37 through the opening 36b of the resist layer 36. The other end is soldered. That is, the inner end 33e of the second coil pattern 33a One end 33g of the second wiring pattern 33b straddles a part of the second coil pattern 33a. The resist layer 36 is electrically connected to the second jumper pin 37. The openings 36a and 36b are formed by the openings 34a and 34b of the resist layer 34 when viewed in the thickness direction. It is formed in the same position and of the same size as 4b.

[0060] In this embodiment, as shown in FIG. 5 and FIG. 6, the first coil pattern 32a is The first overlay overlaps the core (upper core 26 and lower core 22) when viewed in the thickness direction of the plate 30. The second coil pattern 33a has an overlap region R32, and when viewed from the thickness direction of the substrate 30, The second overlap region R33 overlaps with the core (upper core 26 and lower core 22). At least the first overlap region R32 and the second overlap region R 33 are arranged in the same position and with the same shape when viewed in the thickness direction, that is, are symmetrical with respect to the base material 31. In this embodiment, the first coil pattern 32a is provided in substantially the entire area (the end 32f) and substantially the entire area of ​​the second coil pattern 33a (area excluding the end 33f) The first and second electrodes are provided in the same shape and at the same position (plane symmetrically) when viewed from the thickness direction. Approximately the entire area of ​​the wiring pattern 32b (area excluding the other end 32h) and the second wiring pattern 33b The substantially entire region (excluding the other end 33h) is defined as the region having the same shape and the same position when viewed from the thickness direction. The two are arranged symmetrically.

[0061] In this embodiment, the first coil pattern 32a overlaps with the core when viewed in the thickness direction. The majority of the non-overlapping area (located on the wide portion 31c) is The non-overlapped area is a non-resist area that is not covered by the heat dissipation sheet 2 The first heat dissipation portion 14a and the second heat dissipation portion 14b of the housing 10 are connected to each other via the first region 23b and the fifth region 23f of the housing 10. It is disposed so as to be in close contact with the heat portion 14b and the third heat dissipation portion 14c.

[0062] In this embodiment, as described above, the inner peripheral end 32e of the first coil pattern 32a and the The first wiring pattern 32b is electrically connected to one end 32g of the first wiring pattern 32b by a first jumper pin 35. As a result, the inner peripheral end 32e of the first spiral coil pattern 32a can be electrically connected to the first jumper pin 35. Similarly, the second coil An end 33e on the inner periphery side of the pattern 33a and one end 33g of the second wiring pattern 33b are 2 jumper pin 37. This allows the second spiral connector The inner peripheral end 33e of the coil pattern 33a is electrically connected by a second jumper pin 37. As a result, the substrate 30 can be formed by forming a conductive layer having three or more layers (usually four or more layers). Since it is not necessary to form the multi-layer substrate, the structure of the substrate 30 is prevented from becoming complicated, and the cost is reduced. It is possible to suppress the increase in

[0063] The first coil pattern 32a and the second coil pattern 33a are disposed on the first surface of the substrate 31. Since the first coil pattern 32a and the second coil pattern 32b are provided on the surface 31a and the second surface 31b, respectively, When the second coil pattern 33a is provided in an inner layer of the base material 31 (for example, when the substrate 30 is a four-layer substrate), The first coil pattern 32a and the second coil pattern 33a are provided in the two inner layers. Unlike the case where heat is generated in the first coil pattern 32a and the second coil pattern 33a, This can prevent heat from being trapped inside the substrate 30. In other words, the substrate 30 has low heat dissipation properties. It is possible to suppress the decline.

[0064] As described above, at least the first overlap region R32 and the second overlap region R33 are The top region R33 is provided at the same position and with the same shape when viewed from the thickness direction. When a current flows through the pattern 32a and the second coil pattern 33a, the first coil pattern Since the first coil pattern 32a and the second coil pattern 33a generate heat, the characteristics of the transformer 1 are adversely affected. Therefore, as described above, at least the first overlap region R32 and and the second overlap region R33 are provided in the same shape and at the same position when viewed in the thickness direction. Therefore, the first overlap region R32 and the second overlap region R33 are brought closer to each other. Therefore, the heat of the first coil pattern 32a, which generates a large amount of heat, can be dissipated to the second coil pattern 32b, which generates a small amount of heat. Therefore, the first coil pattern 33a can dissipate heat (conduct heat). This prevents the temperature of the turn 32a from becoming too high, improving the characteristics of the transformer 1. It is possible to suppress the decrease in the

[0065] As described above, the first coil pattern 32a is disposed in the thickness direction of the substrate 30. The non-overlapping region includes a non-overlapping region (located on the wide portion 31c) that does not overlap with the Between the wrap region and the first heat dissipation portion 14a, the second heat dissipation portion 14b, and the third heat dissipation portion 14c, The non-overlapping region, the first heat dissipation section 14a, the second heat dissipation section 14b, and the third heat dissipation section 14c The heat dissipation sheet 23 is provided so as to be in close contact with the first coil pattern 32. The heat of a can be efficiently dissipated (thermally conducted) to the housing 10 via the heat dissipation sheet 21. For this reason, more current is passed through the primary coil than through the secondary coil (the heat generated by the primary coil is greater than that of the secondary coil). When the circuit is configured so that the heat dissipation is greater than the amount of heat generated by the coil, the heat dissipation can be improved. In addition, since the heat dissipation sheet 21 is insulating, the first heat dissipation portion 14a, the second heat dissipation portion 14b, and In addition, a metal can be used for the third heat dissipation portion 14c, and the heat dissipation performance can be easily improved. do.

[0066] As described above, the first coil pattern 32a and the second coil pattern 33a The peripheral ends 32e and 33e are aligned in the direction of the arrow with respect to the cores (lower core 22 and upper core 26). The first coil pattern 32a and the second coil pattern 32b are arranged in the direction of the arrow A. The outer peripheral ends 32f and 33f of the core 33a are the lower core 22 and the upper core 26. The first wiring pattern 32b and the second wiring The ends 32g and 33g of the pattern 33b are connected to the cores (the lower core 22 and the upper core 26). ) in the direction of the arrow A, and the first wiring pattern 32b and the second wiring The other ends 32h and 33h of the pattern 33b are connected to the cores (the lower core 22 and the upper core 26 ) in the direction of the arrow A'. The first coil pattern 32a and the upper core 26 are arranged in the direction of the arrow A. The inner peripheral ends 32e and 33e of the second coil pattern 33a are connected to the core (the lower core 2). 2 and upper core 26) can be easily electrically led out in the direction of arrow A'. Cut.

[0067] Normally, when a current flows through the first coil pattern 32a and the second coil pattern 33a, The generated heat tends to be trapped in the center of the substrate 30. A central heat dissipation section 12 is provided between the central heat dissipation section 12 and the substrate 30. By providing the heat dissipation sheet 21 so as to be in close contact with the substrate 30, the heat in the center of the substrate 30 is The heat dissipation sheet 21 can efficiently dissipate heat (thermal conduction) to the central heat dissipation section 12. Because it is insulating, metal can be used for the central heat dissipation portion 12, and heat dissipation can be easily improved. It is possible.

[0068] In addition, elastic heat dissipation sheets 21, 23, 24 and 27 are used as heat dissipation members. By this, vibrations and shocks can be absorbed by the heat dissipation sheets 21, 23, 24 and 27. Therefore, the substrate 30 and the cores (the lower core 22 and the upper core 26) are resistant to vibration and shock. Therefore, damage to the wire can be suppressed.

[0069] It should be noted that the embodiments disclosed herein are illustrative and not restrictive in all respects. The scope of the present invention should be considered as defined by the appended claims rather than the above description of the embodiments. The scope of the claims is defined by the appended claims, and all modifications within the scope and meaning of the claims are included. Included.

[0070] For example, in the above embodiment, the housing 10 and the pressing plate 28 are made of metal. However, the present invention is not limited to this. For example, the housing 10 and the pressing plate 28 In this case, the heat sink may be made of a non-insulating ceramic material. It is also possible to use a sheet.

[0071] In the above embodiment, an example in which a heat dissipation sheet is used as a heat dissipation member is shown. The present invention is not limited to this. For example, grease containing metal or a thermally conductive material may be used as the heat dissipation material. It is also possible to use a thermoplastic resin or a thermosetting resin having such a property.

[0072] In the above embodiment, the first jumper pin 35 and the second jumper pin 36 are provided on the board 30. Although an example in which only the connector 37 is attached has been shown, the present invention is not limited to this. A capacitor, resistor, etc. may be attached.

[0073] In the above embodiment, the first jumper pin 35 is attached to the first surface 31a of the substrate 30. At the same time, the second jumper pin 37 is attached to the second surface 31b side of the substrate 30. However, the present invention is not limited to this. For example, The peripheral end 32e and one end 32g of the first wiring pattern 32b are connected to through holes. 3, the end of the first coil pattern 32a on the inner periphery side is electrically connected to the second surface 31b side by 32e and one end 32g of the first wiring pattern 32b are attached to the second surface 31b side. The second coil pattern 33 may be electrically connected to the first coil pattern 32 by a jumper pin 35. a and one end 33g of the second wiring pattern 33b. The first surface 31a is electrically connected to the second coil pattern 33a through a hole. The end 33e of the first wiring pattern 33b and one end 33g of the second wiring pattern 33b are attached to the first surface 31a. The electrical connection may also be made by a second jumper pin 37 . [Explanation of symbols]

[0074] 1: transformer, 10: housing, 11: base, 12: central heat dissipation section, 14a: first heat dissipation section (heat dissipation part), 14b: second heat dissipation part (heat dissipation part), 14c: third heat dissipation part (heat dissipation part), 21: heat dissipation sheet (heat dissipation member), 22: lower core (core), 26: upper core (core), 30: substrate (two layers substrate), 31: base material, 31a: first surface, 31b: second surface, 32a: first coil pattern 32b: first wiring pattern; 32e: inner peripheral end; 32f: outer peripheral end; 32g: : one end portion, 32h: other end portion, 33a: second coil pattern, 33b: second wiring pattern, 33e: inner peripheral end, 33f: outer peripheral end, 33g: one end, 33h: other end, 35 : first jumper pin (first jumper member), 37: second jumper pin (second jumper Part part), R32: First overlap area, R33: Second overlap area

Claims

1. a rectangular two-layer substrate having an insulating base material, a first conductive spiral coil pattern provided on a first surface of the base material, and a second conductive spiral coil pattern provided on a second surface of the base material; a core that electromagnetically couples the first coil pattern and the second coil pattern; a metal housing including a flat base on which the core and the two-layer substrate are laminated; Equipped with a first wiring pattern is provided on the first surface of the base material and is arranged at a predetermined distance from the first coil pattern; an inner peripheral end of the first coil pattern and one end of the first wiring pattern are electrically connected by a first jumper member; a second wiring pattern is provided on the second surface of the base material and is arranged at a predetermined distance from the second coil pattern; an inner peripheral end of the second coil pattern and one end of the second wiring pattern are electrically connected by a second jumper member; the first coil pattern and the second coil pattern are a primary coil and a secondary coil, respectively; the two-layer substrate is disposed such that the first surface faces the base; the first coil pattern includes a pair of non-overlapping regions that do not overlap with the core when viewed in a thickness direction of the two-layer substrate, on both sides of the core in a longitudinal direction of the two-layer substrate, the base is provided with heat dissipation parts for dissipating heat of the two-layer board at positions corresponding to each of the pair of non-overlapping regions so as to protrude from the base toward the two-layer board, an insulating heat dissipation member is provided between the heat dissipation portion and the non-overlapping region so as to be in close contact with the heat dissipation portion and the non-overlapping region; the first jumper member is provided in one of the pair of non-overlapping regions, the heat dissipation portion provided at a position corresponding to the one of the non-overlapping regions includes a first heat dissipation portion formed along a short-side direction of the two-layer board, and a second heat dissipation portion formed adjacent to the first heat dissipation portion and closer to the core than the first heat dissipation portion so as to provide a space for disposing the first jumper member; A transformer characterized in that the second heat dissipation portion is in close contact with the wiring portion on the inner periphery of the first coil pattern to which the first jumper member is connected, via the heat dissipation member.

2. A transformer as described in claim 1, characterized in that a gap is formed between the first heat dissipation portion and the second heat dissipation portion.

3. The core includes a pair of cores arranged at a predetermined interval from each other when viewed in a thickness direction of the two-layer substrate, the base is provided with a central heat dissipation portion disposed between the pair of cores so as to protrude from the base toward the two-layer substrate, 2. The transformer according to claim 1, wherein an insulating heat dissipation member is provided between the central heat dissipation portion and the two-layer substrate so as to be in close contact with the central heat dissipation portion and the two-layer substrate.

4. The two-layer substrate has an opening formed therein, and the first coil pattern and the second coil pattern are formed in a spiral shape so as to circle around the opening; a partition portion is provided on the base material at a center of the opening portion along a short-side direction of the two-layer substrate so as to divide the opening portion into two portions; screw insertion holes into which screws for fixing the substrate to the base are inserted are formed at four corners of the two-layer substrate and at a center of the partition portion in the short side direction; The base is provided with fixing portions for fixing the two-layer board, the fixing portions being formed adjacent to the screw insertion holes formed at the four corners of the two-layer board, the fixing portions protruding from a surface of the base, The central heat dissipation portion is formed with a screw hole for fixing the two-layer board so as to be adjacent to the screw insertion hole formed in the partition portion, 4. The transformer according to claim 3, wherein the two-layer board is fixed to each of the fixing portions and the central heat dissipation portion at four corners and partition portions of the two-layer board by screws inserted into the screw insertion holes.

5. The base is provided with two pairs of wall portions on both sides along the longitudinal direction, 4. The transformer according to claim 3, wherein the pair of walls are spaced apart from each other along the longitudinal direction, with the central heat dissipation portion therebetween, as viewed in the short-side direction.

6. the first coil pattern has a first overlap region that overlaps with the core when viewed in a thickness direction of the two-layer substrate, the second coil pattern has a second overlap region that overlaps with the core when viewed in the thickness direction, 2. The transformer according to claim 1, wherein at least the first overlap region and the second overlap region are provided in the same position and with the same shape when viewed in the thickness direction.

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