DEVICE AND METHOD FOR MANUFACTURING DEVICE - Patent application

Abstract

To provide a device with a novel structure that can be thinned.SOLUTION: A device 10 comprises a first encapsulation member 20, a second encapsulation member 30, a first circuit member 40, and a second circuit member 50. The first encapsulation member 20 comprises a first film composed of a film as a base. The device 10 is formed with a sealed space 18. The sealed space 18 is surrounded by the first encapsulation member 20 and the second encapsulation member 30 so as to be blocked from the outside of the device 10. The first circuit member 40 and the second circuit member 50 are sealed inside the sealed space 18. The first circuit member 40 has a first contact 48. The second circuit member 50 has a second contact 58. The first contact 48 and the second contact 58 are in contact with each other. The second encapsulation member 30 is provided with a convexoconcave part 62. The convexoconcave part 62 is in contact with the second circuit member 50 and covers a predetermined region 19 corresponding to the second contact 58.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a device having a circuit member encapsulated by a film. [Background technology]

[0002] For example, Patent Document 1 discloses a device that can be made thin.

[0003] 23, Patent Document 1 discloses a semiconductor chip built-in module (device) 90. The device 90 includes a thermosetting resin composition (sealing resin) 92, and a circuit member 94 including a semiconductor chip 96 and a wiring pattern 98. The sealing resin 92 is formed so as to embed the circuit member 94 therein. Thereafter, the surface of the sealing resin 92 is polished, thereby thinning the device 90. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2001-332654 A Summary of the Invention [Problem to be solved by the invention]

[0005] There is a demand for devices including circuit components to be made even thinner.

[0006] Therefore, an object of the present invention is to provide a new device that can be made thinner. [Means for solving the problem]

[0007] The present invention provides a first device, A device comprising a first sealing member, a second sealing member, a first circuit member, and a second circuit member, The first sealing member includes a first film as a base, The device has a sealed space formed therein; the sealed space is surrounded by the first sealing member and the second sealing member and is isolated from the outside of the device; the first circuit member and the second circuit member are sealed within the sealed space, the first circuit member includes a first contact; the second circuit member includes a second contact; the first contact and the second contact are in contact with each other; At least one of the first sealing member and the second sealing member is provided with an uneven portion, The uneven portion is in contact with at least one of the first circuit member and the second circuit member, and covers a predetermined area corresponding to at least one of the first contact point and the second contact point. Provide the device.

[0008] The present invention also provides a first device as a second device, At least one of the first sealing member and the second sealing member includes an additional film; The additional film has the uneven portion. Provide the device.

[0009] The present invention also provides a third device, which is a first or second device, The first film is provided with an air valve, The uneven portion continuously covers the area between the air valve and the predetermined area. Provide the device.

[0010] The present invention provides a fourth device, the third device, The first sealing member has a first inner portion and a first outer portion, The first inner portion is located inside the first outer portion, The second sealing member has a second inner portion and a second outer portion, The second inner portion is located inside the second outer portion, The sealed space is surrounded by the first inner portion and the second inner portion, the first outer portion has a first seal portion; the second outer portion has a second seal portion; The first seal portion and the second seal portion are connected to each other to form a seal mark, The uneven portion is sealed inside the sealed space. Provide the device.

[0011] The present invention provides a fifth device, which is a first or second device, The first sealing member has a first inner portion and a first outer portion, The first inner portion is located inside the first outer portion, The second sealing member has a second inner portion and a second outer portion, The second inner portion is located inside the second outer portion, The sealed space is surrounded by the first inner portion and the second inner portion, the first outer portion has a first seal portion; the second outer portion has a second seal portion; The first seal portion and the second seal portion are connected to each other to form a seal mark, The uneven portion continuously covers the area between the seal mark and the predetermined area. Provide the device.

[0012] The present invention provides a sixth device, which is the fourth or fifth device, The first seal portion and the second seal portion are connected to each other by heat sealing. Provide the device.

[0013] The present invention provides, as a seventh device, the sixth device, Each of the first sealing member and the second sealing member has two layers: a melting layer that melts by heat sealing and a non-melting layer that does not melt by heat sealing. Provide the device.

[0014] The present invention provides, as an eighth device, any one of the first to seventh devices, The uneven portion covers the entire area corresponding to the sealed space. Provide the device.

[0015] The present invention provides, as a ninth device, any one of the first to eighth devices, The second sealing member includes a second film as a base. Provide the device.

[0016] The present invention provides, as a tenth device, the ninth device, the first film and the second film are two sheet pieces overlapped on one another in a single film member, The film member has a predetermined portion, The first film and the second film are connected to each other at the predetermined portion. Provide the device.

[0017] The present invention provides, as an eleventh device, the tenth device, The film member is a single planar sheet, The first film and the second film are two of the sheet pieces folded over at the predetermined portion. Provide the device.

[0018] The present invention provides a twelfth device, which is a tenth device, The film member is a single bag-shaped sheet, The first film and the second film are two of the sheet pieces connected to each other at the predetermined portion. Provide the device.

[0019] The present invention provides, as a thirteenth device, any one of the first to twelfth devices, the first circuit member is a member separate from the first sealing member, The second circuit member is a separate member from the second sealing member. Provide the device.

[0020] The present invention provides, as a fourteenth device, any one of the first to twelfth devices, The first circuit member is an integral member with the first sealing member. Provide the device.

[0021] The present invention provides, as a fifteenth device, any one of the first to twelfth devices, The second circuit member is an integral member with the second sealing member. Provide the device.

[0022] The present invention provides, as a sixteenth device, any one of the first to fifteenth devices, the first circuit member has a first substrate and a first conductor pattern, the first substrate is made of an insulating film, the first conductor pattern is formed on the first substrate and has the first contact; the second circuit member has a second substrate and a second conductor pattern, the second substrate is made of an insulating film, The second conductor pattern is formed on the second substrate and has the second contact. Provide the device.

[0023] The present invention provides, as a seventeenth device, any one of the first to sixteenth devices, Each of the first sealing member and the second sealing member has high barrier properties. Provide the device.

[0024] The present invention provides, as an eighteenth device, the seventeenth device, Each of the first sealing member and the second sealing member has a high oxygen barrier property. Provide the device.

[0025] The present invention provides, as a 19th device, the 17th device, Each of the first sealing member and the second sealing member has a high water vapor Has barrier properties Provide the device.

[0026] The present invention provides a first production method, A method for manufacturing a device comprising a first sealing member, a second sealing member, a first circuit member, and a second circuit member, the method comprising the steps of: a preparation step of preparing the first sealing member, the second sealing member, the first circuit member, and the second circuit member, the first sealing member comprising a first film as a base, the first film being provided with an air valve, at least one of the first sealing member and the second sealing member being provided with an uneven portion, the first circuit member comprising a first contact, and the second circuit member comprising a second contact; an arrangement step of stacking the first sealing member, the first circuit member, the second circuit member, and the second sealing member on top of one another in this order, so that the first contacts and the second contacts face each other, the uneven portion faces at least one of the first circuit member and the second circuit member, and a predetermined region corresponding to at least one of the first contacts and the second contacts is covered by the uneven portion; a sealing step of sealing the first circuit member and the second circuit member inside an internal space formed in the device, the internal space being surrounded by the first sealing member and the second sealing member and isolated from the outside of the device except for the air valve; and a vacuum drawing step of evacuating the internal space using the air valve to bring the first contact and the second contact into contact with each other. A method of manufacture is provided. Effect of the Invention

[0027] In the device of the present invention, the first sealing member and the second sealing member are stacked on top of each other with the first circuit member and the second circuit member (hereinafter simply referred to as "circuit member") sandwiched therebetween. The first sealing member is formed based on a film. Furthermore, each of the circuit members has no structural constraints except that it has a contact point. That is, the circuit member of the present invention has a simple structure and can be formed from a variety of materials. For example, the circuit member may be an insulating film on which a conductor pattern having a contact point is formed. In this case, the thickness of the entire device can be made extremely thin. That is, according to the present invention, a new device that can be made thin can be provided. [Brief description of the drawings]

[0028] [Figure 1] 1 is a perspective view showing a device according to an embodiment of the present invention, in which the boundary of a contact region formed between a first sealing member and a second sealing member is depicted by a dashed line, and a part of the device (a portion surrounded by a dashed dotted line) is depicted in an enlarged manner. [Diagram 2] 2 is a perspective view of the device of FIG 1 with the first sealing member removed, the boundaries of the contact areas being drawn with dashed lines; [Diagram 3] A cross-sectional view showing the device of Fig. 1 taken along line III-III. This drawing is for the purpose of showing the internal structure of the device, and the size and arrangement of each member do not correspond to the actual size and arrangement. [Figure 4] A cross-sectional view showing an embodiment of the device of Fig. 3. A specific example of a first conductor pattern of a first circuit member and a second conductor pattern of a second circuit member is depicted. This figure is for the purpose of showing a schematic internal structure of the device, and the size and arrangement of each member do not match the actual size and arrangement. [Diagram 5]FIG. 5 is a diagram showing the circuit structure of the first and second conductor patterns of FIG. 4. Although the first contact of the first circuit is shown separated from the second contact of the second circuit, the first contact is actually located above the second contact. [Figure 6] 2A to 2C are diagrams illustrating an example of a method for manufacturing the device of FIG. [Figure 7] 7 is a perspective view showing a device member prepared in a preparation step of the manufacturing method of Fig. 6. A portion of the first film corresponding to an air valve is drawn with a dashed line. [Figure 8] FIG. 8 is a perspective view showing an air valve of the device member of FIG. 7. [Figure 9] 8 is a side view showing the device member of Fig. 7. A part of the device member (a part surrounded by a dashed dotted line) is drawn in an enlarged manner. [Figure 10] 7 is a perspective view showing the device in a sealing step of the manufacturing method shown in FIG. 6. [Figure 11] 1 is a cross-sectional view of the device of FIG. 10 taken along line III-III in FIG. 1. The side of a vacuum drawing tool is depicted. This drawing is for the purpose of showing the internal structure of the device, and the size and arrangement of each member do not correspond to the actual size and arrangement. [Figure 12] 8 is a perspective view of a variation of the device member of FIG. 7, with the outlines of the hidden first circuit member, second circuit member and additional film depicted in dashed lines. [Figure 13] 13 is a top view of a device fabricated from the device member of FIG. 12, with the hidden additional film outlined in dashed lines. [Figure 14] 8 is a perspective view of another variation of the device member of FIG. 7, with the hidden first circuit member, second circuit member and additional film outlined in dashed lines. [Figure 15] 15 is a top view of a device fabricated from the device member of FIG. 14, with the hidden additional film outlined in dashed lines. [Figure 16] 16 is a top view of a variation of the device of FIG. 15, with the outlines of the hidden first and second circuit members drawn in dashed lines, and the boundaries of the contact areas drawn in dashed lines. [Figure 17] 17 is a bottom view of the device of FIG. 16, with the boundary of the contact area depicted by dashed and dotted lines. [Figure 18] 18 is a bottom view of a device produced by cutting out a portion of the device of FIG. 17. The cut out portion is outlined in dashed lines, including the hidden air valve. The hidden predetermined area corresponding to the second contact is outlined in dashed lines. The boundary of the contact area is outlined in dashed lines. [Figure 19] 8 is a perspective view of an embodiment of a first circuit member and a second circuit member of the device member of FIG. 7. [Figure 20] 8 is a perspective view of an embodiment of a first film and a first circuit member of the device member of FIG. 7. [Figure 21] 8 is a perspective view of an embodiment of an additional film and second circuit member of the device member of FIG. 7. FIG. [Figure 22] 8 is a perspective view of an embodiment of a second film, an additional film, and a second circuit member of the device member of FIG. 7. [Diagram 23] FIG. 1 is a cross-sectional view showing the device of Patent Document 1. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0029] Referring to FIG. 1, a device 10 according to an embodiment of the present invention is an independent electronic device. More specifically, the device 10 can operate independently without being physically attached to another electronic device (not shown). For example, the device 10 is attached near the subject's heart to measure the subject's heart rate and transmit the measurement result to another electronic device. That is, the device 10 can be used as an electronic device that measures biological information such as the heart rate. However, the present invention is not limited to this and can be applied to devices having various functions.

[0030] Referring to FIG. 2 together with FIG. 1, the device 10 of this embodiment includes a circuit structure 12 and a sealing member 14. The circuit structure 12 is a member for causing the device 10 to function as an electronic device. For example, the circuit structure 12 has an electronic circuit (not shown) for measuring a heart rate and an electronic circuit (not shown) for transmitting the measurement result to another electronic device (not shown). The sealing member 14 houses the entire circuit structure 12 therein and protects the circuit structure 12 from the external environment. That is, the circuit structure 12 is sealed inside the sealing member 14.

[0031] The circuit structure 12 of the present embodiment includes a first circuit member 40 and a second circuit member 50. The sealing member 14 of the present embodiment includes a first sealing member 20 and a second sealing member 30. That is, the device 10 includes the first sealing member 20, the second sealing member 30, the first circuit member 40, and the second circuit member 50.

[0032] Referring to FIG. 7 in conjunction with FIGS. 1 and 2, the four members of the device 10 (the first sealing member 20, the second sealing member 30, the first circuit member 40, and the second circuit member 50) are Vertical direction (Z direction) and assembled into one device 10. The device 10 of the present embodiment includes only the four members described above. However, the present invention is not limited to this, and the device 10 may include other members in addition to the four members described above.

[0033] Each component of the device 10 of this embodiment will be described below.

[0034] Referring to FIG. 7, the first sealing member 20 of the present embodiment is formed with a first film 20F, which is an insulating film, as a base. In other words, the first sealing member 20 includes the first film 20F, which is made of a film, as a base. The first film 20F of the present embodiment is a rectangular thin sheet and has flexibility. The first film 20F extends parallel to a horizontal plane (sheet surface: XY plane). The first film 20F has a periphery 29 in the XY plane. A hole 76 is formed in the first film 20F. The hole 76 penetrates the first film 20F in the up-down direction (Z direction) perpendicular to the XY plane.

[0035] 1 and 7, the first sealing member 20 of the present embodiment includes an air valve 70 in addition to the first film 20F. Referring to FIGS. 7 and 8, the air valve 70 includes a shielding portion 72 made of a thin insulating film and a base portion 74 made of an insulator. As shown in FIG. 8, a through hole 748 is formed in the base portion 74. The through hole 748 penetrates the base portion 74 in the Z direction. The shielding portion 72 is formed with five valves 722 and five cutouts 724 corresponding to the valves 722, respectively. Each of the cutouts 724 penetrates the shielding portion 72 in the Z direction. The valves 722 and the cutouts 724 are located inside the outer periphery of the shielding portion 72 in the XY plane.

[0036] Referring to FIG. 8 together with FIG. 7, the shielding portion 72 is adhered and fixed to the upper surface (surface on the +Z side) of the base 74. In particular, the outer periphery of the shielding portion 72 in the XY plane is firmly attached to the upper surface of the base 74 over the entire circumference. On the other hand, the inside of the outer periphery of the shielding portion 72 in the XY plane can be separated from the upper surface of the base 74. That is, a passage through which air can pass can be formed between each of the cutouts 724 and the through hole 748. The lower surface (surface on the -Z side) of the base 74 is adhered and fixed to the first film 20F such that the through hole 748 is connected to the hole 76 of the first film 20F. That is, the first film 20F is provided with an air valve 70.

[0037] 1 together with FIG. 8, the air valve 70 can transition between an open state (the state shown in FIG. 8) in which each of the valves 722 is separated from the corresponding notch 724, and a closed state (the state shown in FIG. 1) in which each of the valves 722 completely covers the corresponding notch 724. When the air valve 70 is in the open state, an air passage is formed between the inside and outside of the device 10 via the air valve 70. On the other hand, when the air valve 70 is in the closed state, the inside of the device 10 is blocked off from the outside of the device 10.

[0038] As described later, the air valve 70 is used to evacuate the inside of the device 10 when the device 10 is produced. The air valve 70 of the present embodiment has a structure suitable for this purpose. However, the present invention is not limited thereto. For example, the structure of the air valve 70 is not particularly limited as long as the air inside the device 10 can be evacuated using the air valve 70. Also, the inside of the device 10 may be evacuated without providing the air valve 70. In other words, the first sealing member 20 may include the air valve 70 as necessary. That is, the first sealing member 20 may include only the first film 20F.

[0039] Referring to FIG. 7, the second sealing member 30 of the present embodiment is formed with the second film 30F, which is an insulating film, as a base. In other words, the second sealing member 30 includes the second film 30F, which is made of a film, as a base. The second film 30F is a rectangular thin sheet and has flexibility. The second film 30F extends parallel to the XY plane. The second film 30F has a periphery 39 in the XY plane. However, the present invention is not limited to this. For example, the second sealing member 30 may include a rigid (i.e., rigid and not easily bent) circuit board as a base instead of the second film 30F.

[0040] 2 and 7, the second sealing member 30 of the present embodiment includes an additional film 60 made of an insulating film in addition to the second film 30F. The additional film 60 has an uneven portion 62. As described later, the uneven portion 62 is provided to maintain a passage through which air can pass when the inside of the device 10 is evacuated. In detail, a large number of protrusions 64 are formed on the additional film 60. Each of the protrusions 64 is a deformable protrusion protruding upward (in the +Z direction). The protrusions 64 are formed uniformly and continuously over the entire additional film 60 in the XY plane. Due to the above-mentioned structure, a passage through which air can pass is formed between two adjacent protrusions 64. The shape and size of the protrusions 64 are not particularly limited as long as a passage through which air can pass is formed.

[0041] 1 together with FIG. 2, the first film 20F and the second film 30F of the present embodiment are overlapped with each other so that the position of the periphery 29 and the position of the periphery 39 in the XY plane coincide with each other. However, the present invention is not limited to this. For example, the size of the first film 20F in the XY plane and the size of the second film 30F in the XY plane may be different from each other. The shapes of the first film 20F and the second film 30F are not limited to rectangular and can be modified as necessary.

[0042] As shown in Figs. 2 and 7, the first circuit member 40 of the present embodiment has a first substrate 42 and a first conductive pattern 44. The first substrate 42 of the present embodiment is a rectangular thin sheet made of an insulating film and has flexibility. The first substrate 42 extends parallel to the XY plane. The first conductive pattern 44 is formed on the first substrate 42. More specifically, the first conductive pattern 44 is made of a conductor such as copper, and is formed on the lower surface of the first substrate 42 by a forming method such as silver ink printing or etching.

[0043] The second circuit member 50 of the present embodiment has a second substrate 52 and a second conductive pattern 54. The second substrate 52 of the present embodiment is a rectangular thin sheet made of an insulating film and has flexibility. The second substrate 52 extends parallel to the XY plane. The second conductive pattern 54 is formed on the second substrate 52. More specifically, the second conductive pattern 54 is made of a conductor such as copper, and is formed on the upper surface of the second substrate 52 by a forming method such as silver ink printing or etching.

[0044] Each of the first circuit member 40 and the second circuit member 50 of the present embodiment has the above-mentioned structure. However, the present invention is not limited thereto. For example, each of the first circuit member 40 and the second circuit member 50 may be provided with one or more electronic components. One of the first circuit member 40 and the second circuit member 50 may be a single electronic component. Each of the first base 42 and the second base 52 may be a rigid circuit board. As long as each of the first conductor pattern 44 and the second conductor pattern 54 is formed from a conductor, the method of forming each of the first conductor pattern 44 and the second conductor pattern 54 is not particularly limited.

[0045] In this embodiment, the first conductor pattern 44 has a first contact 48, and the second conductor pattern 54 has a second contact 58. That is, the first circuit member 40 has the first contact 48, and the second circuit member 50 has the second contact 58. With reference to FIGS. 2 and 3, in the assembled device 10, the first contact 48 and the second contact 58 are in contact with each other. That is, the first circuit member 40 and the second circuit member 50 are assembled such that the first contact 48 and the second contact 58 are in contact with each other. As a result, the first conductor pattern 44 and the second conductor pattern 54 are electrically connected to each other.

[0046] The first conductor pattern 44 and the second conductor pattern 54 shown in Figures 2 and 3 are abstract conductor patterns for simply explaining the present invention and have no specific function. That is, even if the illustrated first contacts 48 and second contacts 58 come into contact with each other, the device 10 does not function as an electronic device. On the other hand, the actual first conductor pattern 44 and second conductor pattern 54 have the structures shown in Figures 4 and 5, for example.

[0047] 4 and 5, a first circuit 43 is formed on the lower surface of the first substrate 42. A second circuit 53 is formed on the upper surface of the second substrate 52. The first circuit 43 has two first conductor patterns 44 on which first contacts 48 are formed, and a coin battery 46. The second circuit 53 has two second conductor patterns 54 on which second contacts 58 are formed, and an LED (Light Emitting Diode) 56. When the first contacts 48 and the second contacts 58 come into contact with each other, power is supplied from the coin battery 46 to the LED 56, and the LED 56 emits light. The structures of the first circuit 43 and the second circuit 53 can be modified to be more practical than the embodiment of FIG. 4 and FIG. 5. For example, the second circuit 53 may have a circuit for measuring a heart rate and a circuit for transmitting the measurement result instead of the LED 56.

[0048] According to the embodiment of Figures 4 and 5, the number of each of the first contacts 48 and the second contacts 58 is two. However, the number of each of the first contacts 48 and the second contacts 58 may be one as shown in Figure 2, or may be three or more. That is, referring to Figures 2 and 3, the first circuit member 40 may include one or more first contacts 48, and the second circuit member 50 may include one or more second contacts 58 corresponding to the first contacts 48, respectively. In the assembled device 10, each of the first contacts 48 may be in contact with a corresponding second contact 58.

[0049] The device 10 of this embodiment will be described in more detail below.

[0050] 1, the first sealing member 20 of the present embodiment has a first inner portion 22 and a first outer portion 24. The first inner portion 22 and the first outer portion 24 are each a part of the first film 20F. The first inner portion 22 is located inside the first outer portion 24 in the XY plane. In other words, the first outer portion 24 is a portion of the first film 20F that surrounds the first inner portion 22.

[0051] 2, the second sealing member 30 of the present embodiment has a second inner portion 32 and a second outer portion 34. The second inner portion 32 and the second outer portion 34 are each a part of the second film 30F. The second inner portion 32 is located inside the second outer portion 34 in the XY plane. In other words, the second outer portion 34 is a portion of the second film 30F that surrounds the second inner portion 32.

[0052] 1 to 3, the first inner portion 22 of the first film 20F and the second inner portion 32 of the second film 30F are portions that accommodate the circuit structure 12 in the device 10. According to this embodiment, before the device 10 is assembled, the first film 20F extends uniformly along the XY plane, and there is no visible boundary between the first inner portion 22 and the first outer portion 24 (see FIG. 7). Similarly, before the device 10 is assembled, the second film 30F extends uniformly along the XY plane, and there is no visible boundary between the second inner portion 32 and the second outer portion 34 (see FIG. 7). However, the present invention is not limited thereto. For example, a visible boundary such as a recess may be formed between the first inner portion 22 and the first outer portion 24, and a visible boundary such as a recess may be formed between the second inner portion 32 and the second outer portion 34.

[0053] Referring to FIG. 1, the first outer portion 24 of this embodiment has a first seal portion 26 and a first contact portion 28. Referring to FIG. 2, the second outer portion 34 of this embodiment has a second seal portion 36 and a second contact portion 38. Referring to FIGS. 1 to 3, the first seal portion 26 and the second seal portion 36 of this embodiment are connected to each other to form a seal mark 16. According to this embodiment, the first seal portion 26 and the second seal portion 36 are connected to each other by thermal sealing. That is, the seal mark 16 of this embodiment is a mark where the first seal portion 26 and the second seal portion 36 are welded to each other by heating. However, the present invention is not limited to this, and the first seal portion 26 and the second seal portion 36 can be connected by various methods such as high frequency, ultrasonic waves, laser, and adhesion.

[0054] 1 and 2, the seal mark 16 in this embodiment is formed around the entire circumference of the first seal portion 26 and the second seal portion 36. The seal mark 16 surrounds the entire circumference of the first contact portion 28 and the second contact portion 38 in the XY plane. However, the present invention is not limited to this, and the seal mark 16 may be formed in a necessary place depending on the manufacturing method of the device 10. For example, the seal mark 16 may be formed partially, or may not be formed at all.

[0055] Referring to FIG. 3, as described below, after the first seal portion 26 and the second seal portion 36 are connected to each other, the inside of the device 10 is evacuated. According to this embodiment, when evacuating, the first contact portion 28 and the second contact portion 38 contact each other at the contact region 17 due to the air pressure difference. As a result, a sealed space 18 is formed in the device 10. The sealed space 18 is surrounded by the first inner portion 22 and the second inner portion 32. The contact region 17 of this embodiment surrounds the first inner portion 22 and the second inner portion 32 without any breaks all around in the XY plane. However, the present invention is not limited to this, and the contact region 17 may be formed at a necessary place according to the manufacturing method of the device 10. For example, the contact region 17 may be formed partially or not at all.

[0056] The sealed space 18 formed as described above is surrounded by the first sealing member 20 and the second sealing member 30, and is isolated from the outside of the device 10. According to this embodiment, the first seal portion 26 and the second seal portion 36 are firmly connected to each other. In addition, the contact area 17 is located inside the seal mark 16 in the XY plane, and blocks the flow of air between the inside and outside of the sealed space 18. That is, the air pressure inside the sealed space 18 is maintained at a low pressure lower than the atmospheric pressure.

[0057] The first circuit member 40 and the second circuit member 50 are sealed inside the sealed space 18 maintained at the above-mentioned low pressure. The first contact 48 and the second contact 58 are in contact with each other inside the sealed space 18. More specifically, a contact force is generated between the first contact 48 and the second contact 58 due to the air pressure difference between the inside and outside of the sealed space 18. The first contact 48 and the second contact 58 are pressed against each other due to this air pressure difference, and this reliably maintains contact between the first contact 48 and the second contact 58.

[0058] To sum up the above explanation, in the device 10 of this embodiment, the first sealing member 20 and the second sealing member 30 including the additional film 60 are overlapped so as to be in contact with each other, with the first circuit member 40 and the second circuit member 50 (hereinafter simply referred to as "circuit members") sandwiched therebetween. Each of the first sealing member 20 and the second sealing member 30 of this embodiment is formed based on a film. The additional film 60 can be formed by embossing a thin insulating film.

[0059] Furthermore, each of the circuit members has no structural constraints, except that it has a contact (first contact 48 or second contact 58). That is, the circuit member of this embodiment has a simple structure and can be formed from a variety of materials. For example, the circuit member may be an insulating film on which a conductor pattern (first conductor pattern 44 or second conductor pattern 54) having a contact is formed. In this case, the overall thickness of the device 10 can be made extremely thin. That is, according to this embodiment, a new device 10 that can be made thin can be provided.

[0060] According to this embodiment, the connection between the first seal portion 26 and the second seal portion 36 and the contact between the first contact portion 28 and the second contact portion 38 can reliably maintain the airtightness of the sealed space 18. However, the present invention is not limited to this embodiment. For example, the first seal portion 26 and the second seal portion 36 may partially surround the first contact portion 28 and the second contact portion 38 in the XY plane. Also, the first seal portion 26 and the second seal portion 36 may partially surround the first inner portion 22 and the second inner portion 32 in the XY plane.

[0061] According to this embodiment, by cutting off the first seal portion 26 and the second seal portion 36, the first circuit member 40 and the second circuit member 50 can be easily removed from the sealed space 18. That is, according to this embodiment, the members can be easily separated and recovered, and can be reused.

[0062] 1, each of the first sealing member 20 and the second sealing member 30 of the present embodiment has two layers: a melting layer 146 that melts by heat sealing, and a non-melting layer 148 that does not melt by heat sealing. The melting layer 146 and the non-melting layer 148 are provided on the first film 20F and the second film 30F (or a rigid circuit board), respectively. That is, each of the first film 20F and the second film 30F has a two-layer structure consisting of the melting layer 146 and the non-melting layer 148.

[0063] For example, the melt layer 146 is made of polyethylene, and the non-melt layer 148 is made of nylon. With this structure, the melt layers 146 can be fused to each other while maintaining the non-melt layers 148 of the first sealed portion 26 and the second sealed portion 36. However, the present invention is not limited to this, and each of the first film 20F and the second film 30F may have a structure according to the manufacturing method of the device 10. For example, each of the first film 20F and the second film 30F may have only one layer, or may have three or more layers.

[0064] Each of the first film 20F and the second film 30F in the present embodiment has a melt layer 146 and a non-melt layer 148 in areas other than the first sealed portion 26 and the second sealed portion 36. However, the present invention is not limited to this. For example, the melt layer 146 may be formed only in each of the first sealed portion 26 and the second sealed portion 36.

[0065] Each of the first sealing member 20 and the second sealing member 30 preferably has high oxygen barrier properties. More specifically, each of the first film 20F and the second film 30F (or a rigid circuit board) preferably includes a layer made of a material having high oxygen barrier properties (high oxygen barrier material). This layer structure can reduce oxidation of the metal members of the circuit structure 12.

[0066] For example, the high-oxygen barrier material may be linear low density polyethylene (LLDPE). More specifically, the high-oxygen barrier material may be PET / Al / PE, which is a laminate of polyethylene terephthalate, aluminum, and polyethylene, ON / PE, which is a laminate of biaxially oriented nylon and polyethylene, PET / EVOH / PE, which is a laminate of polyethylene terephthalate, polyvinyl chloride, and polyethylene, or may be formed by laminating a transparent high-barrier film and polyethylene. The transparent high-barrier film may be SiOx-deposited PET (polyethylene terephthalate) or aluminum oxide-deposited PET (polyethylene terephthalate).

[0067] Each of the first sealing member 20 and the second sealing member 30 of the present embodiment preferably has high water vapor barrier properties in addition to high oxygen barrier properties. More specifically, each of the first film 20F and the second film 30F (or a rigid circuit board) preferably includes a layer made of a material having high water vapor barrier properties (high water vapor barrier material). This layer structure can make the circuit structure 12 waterproof. For example, the high water vapor barrier material may be a material in which a sheet such as ON / PE, OPP (biaxially oriented polypropylene), or PET is coated with PVDC (polyvinylidene chloride).

[0068] Each of the first sealing member 20 and the second sealing member 30 may have various barrier properties such as a nitrogen barrier property in addition to a high oxygen barrier property and a high water vapor barrier property. That is, each of the first sealing member 20 and the second sealing member 30 preferably has a high barrier property according to the application.

[0069] 6, device 10 (see FIG. 1) of this embodiment is manufactured through four steps: a preparation step (STEP 1), a placement step (STEP 2), a sealing step (STEP 3), and a vacuum drawing step (STEP 4). However, the present invention is not limited to this, and the manufacturing method of device 10 can be modified as necessary. The manufacturing method of device 10 of this embodiment will be described below.

[0070] Referring to FIG. 7, in the preparation step (see FIG. 6), the device member 11 is prepared. The device member 11 includes a first sealing member 20, a second sealing member 30, a first circuit member 40, and a second circuit member 50. The first sealing member 20 includes a first film 20F as a base, and includes an air valve 70 provided on the first film 20F. The second sealing member 30 includes a second film 30F as a base, and includes an additional film 60 on which an uneven portion 62 is formed. The first circuit member 40 includes a first contact 48. The second circuit member 50 includes a second contact 58.

[0071] 7 and 9, in the arrangement step (see FIG. 6), the first sealing member 20, the first circuit member 40, the second circuit member 50, and the second sealing member 30 are stacked on top of each other in this order from top to bottom along the Z direction. At this time, the first circuit member 40 and the second circuit member 50 are arranged so that the first contact 48 and the second contact 58 face each other in the Z direction. The additional film 60 is positioned at the middle part of the second film 30F in the XY plane. The first circuit member 40 and the second circuit member 50 are positioned at the middle part of the additional film 60 in the XY plane. In addition, the first film 20F and the second film 30F are arranged so that the two melt layers 146 face each other in the Z direction.

[0072] 9, the uneven portion 62 of the additional film 60 arranged as described above faces the second circuit member 50 in the Z direction. In particular, the uneven portion 62 covers the predetermined region 19 corresponding to the second contact 58 from below (-Z side). The predetermined region 19 in this embodiment is a portion of the lower surface of the second base 52 of the second circuit member 50 that is located directly below the second contact 58.

[0073] 9 and 10, in the sealing process (see FIG. 6), the first film 20F and the second film 30F are heat-sealed. In detail, the portions of the two melt layers 146 located on the outer periphery of the first film 20F and the second film 30F in the XY plane are welded to each other by heat sealing.

[0074] 11 together with FIG. 10, as a result of the heat sealing, the device 10 having the seal mark 16 is formed, and an internal space 18S is formed inside the device 10. The seal mark 16 is formed continuously and seamlessly around the outer periphery of the first film 20F and the second film 30F in the XY plane. That is, the internal space 18S is surrounded by the first sealing member 20 and the second sealing member 30, and is isolated from the outside of the device 10 except for the air valve 70. The first circuit member 40 and the second circuit member 50 are sealed inside the internal space 18S together with the additional film 60 of the second sealing member 30.

[0075] Next, in the evacuation process (see FIG. 6), the internal space 18S is evacuated. According to this embodiment, the air is removed from the internal space 18S using an instrument 80 and an air valve 70. The instrument 80 in this embodiment is a syringe-type piston pump. The instrument 80 includes a syringe 82 and a plunger 84. The lower end of the syringe 82 has a ring shape that corresponds to the outer periphery of the shielding portion 72 of the air valve 70 in the XY plane.

[0076] In the evacuation process, first, the lower end of the syringe 82 is pressed against the upper surface of the shielding portion 72. Next, the plunger 84 is pulled upward. At this time, the air valve 70 is opened, and an air passage is formed between the internal space 18S and the inside of the syringe 82. The air in the internal space 18S is drawn into the inside of the syringe 82 through the passage hole 748 and the notch 724 (see FIG. 9) of the air valve 70. As a result, the air pressure in the internal space 18S gradually decreases. When the air pressure in the internal space 18S becomes a low pressure close to a vacuum, the evacuation by the instrument 80 is stopped.

[0077] When the evacuation is stopped, the valve 722 (see FIG. 9) of the air valve 70 closes the notch 724 (see FIG. 9) due to the pressure difference between the pressure in the internal space 18S and the atmospheric pressure, and the air valve 70 is in a closed state. As a result, the pressure in the internal space 18S is maintained at a low pressure. That is, in the device 10, a sealed space 18 (see FIG. 3) is formed, which is the internal space 18S at a low pressure that is isolated from the outside. The first contact 48 and the second contact 58 are pressed against each other due to the pressure difference between the inside and outside of the sealed space 18, and come into contact with each other.

[0078] 11 together with FIG. 3, when a vacuum is drawn, the first film 20F and the second film 30F tend to come into close contact with each other and form a contact portion such as the contact region 17. If the additional film 60 is not provided, the contact portion between the first film 20F and the second film 30F tends to be formed also between the air valve 70 and the predetermined region 19. That is, the air passage between the air valve 70 and the predetermined region 19 may be blocked by the contact portion. In this case, the air pressure in the space in which the first contact 48 and the second contact 58 are located may not be sufficiently reduced, and the first contact 48 and the second contact 58 may not come into reliable contact with each other.

[0079] On the other hand, the additional film 60 of this embodiment is located between the first film 20F and the second film 30F, and therefore prevents direct contact between the first film 20F and the second film 30F. Also, since the additional film 60 has the uneven portion 62, even if the first film 20F and the second film 30F come into indirect contact with each other via the additional film 60, the air passage between the air valve 70 and the predetermined region 19 is maintained. That is, the uneven portion 62 of this embodiment prevents the formation of a contact portion that blocks the air passage between the air valve 70 and the predetermined region 19. As a result, the first contact 48 and the second contact 58 are reliably in contact with each other.

[0080] 2 together with FIG. 3, the uneven portion 62 in this embodiment is sealed inside the sealed space 18 and covers the entire area corresponding to the sealed space 18. However, the present invention is not limited to this. From the viewpoint of ensuring contact between the first contact 48 and the second contact 58 during evacuation, the uneven portion 62 may continuously cover only the area between the air valve 70 and the predetermined area 19. In particular, the uneven portion 62 may continuously cover only the area between the air passage (passage hole 748) in the air valve 70 and the predetermined area 19. Furthermore, when the distance between the air valve 70 and the predetermined area 19 is short, the uneven portion 62 may cover the predetermined area 19 corresponding to at least one of the first contact 48 and the second contact 58.

[0081] However, if the size of the uneven portion 62 in the XY plane is small, there is a possibility that an air pocket surrounded by the contact portion where the first film 20F and the second film 30F are in close contact with each other may be formed at a location away from the predetermined region 19 during evacuation. If such an air pocket is formed, air may flow from the air pocket into the predetermined region 19 when the device 10 is in use, which may increase the air pressure in the predetermined region 19. Therefore, it is preferable that the uneven portion 62 covers the entire region corresponding to the sealed space 18 as in this embodiment.

[0082] Referring to FIG. 3, the additional film 60 of this embodiment is an embossed film separate from the second film 30F, and is disposed on the second film 30F. The uneven portion 62 is formed over the entire upper and lower surfaces of the additional film 60. However, the present invention is not limited to this. For example, the additional film 60 may be adhered and fixed to the upper surface of the second film 30F. The uneven portion 62 may be formed only on the upper surface of the additional film 60. The uneven portion 62 may be formed on the second film 30F by embossing the second film 30F. In this case, the additional film 60 does not need to be provided. That is, the second sealing member 30 may include only the second film 30F having the uneven portion 62.

[0083] The additional film 60 of this embodiment forms the second sealing member 30 together with the second film 30F. However, the present invention is not limited to this. For example, the additional film 60 may form the first sealing member 20 together with the first film 20F. More specifically, the additional film 60 may be disposed below the first film 20F. In this case, the uneven portion 62 covers the predetermined region 19 corresponding to the first contact 48 from above. In this case, the predetermined region 19 is a portion of the upper surface of the first base 42 of the first circuit member 40 that is located directly above the first contact 48. Also, the uneven portion 62 may be formed on the first film 20F by embossing the first film 20F. In this case, the additional film 60 does not need to be provided.

[0084] The device 10 of the present embodiment has only one uneven portion 62. However, the present invention is not limited to this. The uneven portion 62 may be provided on each of the first sealing member 20 and the second sealing member 30. More specifically, one additional film 60 may be provided on each of the first sealing member 20 and the second sealing member 30. Furthermore, the uneven portion 62 may be formed on each of the first film 20F and the first film 20F.

[0085] Considering the above-mentioned modified examples, at least one of the first sealing member 20 and the second sealing member 30 may include the additional film 60. Moreover, the additional film 60 does not necessarily have to be provided. That is, it is sufficient that at least one of the first sealing member 20 and the second sealing member 30 has the uneven portion 62. It is sufficient that the uneven portion 62 is in contact with at least one of the first circuit member 40 and the second circuit member 50.

[0086] To summarize the manufacturing method of device 10 while taking into consideration the above-mentioned modified examples, the manufacturing method of device 10 includes a preparation step of preparing a first sealing member 20, a second sealing member 30, a first circuit member 40, and a second circuit member 50, wherein the first sealing member 20 has a first film 20F made of a film as a base, the first film 20F has an air valve 70, at least one of the first sealing member 20 and the second sealing member 30 has an uneven portion 62, the first circuit member 40 has a first contact 48, and the second circuit member 50 has a second contact 58.

[0087] The manufacturing method of the device 10 also includes an arrangement process in which the first sealing member 20, the first circuit member 40, the second circuit member 50, and the second sealing member 30 are stacked on top of each other in this order, so that the first contacts 48 and the second contacts 58 face each other, the uneven portion 62 faces at least one of the first circuit member 40 and the second circuit member 50, and the uneven portion 62 covers a predetermined area 19 corresponding to at least one of the first contacts 48 and the second contacts 58.

[0088] The manufacturing method of device 10 also includes a sealing process in which the first circuit member 40 and the second circuit member 50 are sealed inside an internal space 18S (see FIG. 11) formed in device 10, the internal space 18S being surrounded by the first sealing member 20 and the second sealing member 30 and isolated from the outside of device 10 except for the air valve 70.

[0089] The manufacturing method of the device 10 also includes a vacuum drawing step in which the internal space 18S (see FIG. 11) is evacuated using the air valve 70 to bring the first contact 48 and the second contact 58 into contact with each other.

[0090] 3, according to the manufacturing method of this embodiment, the first contact 48 and the second contact 58 are reliably in contact with each other without using a fixing member such as an adhesive. Therefore, when the device 10 is no longer needed, the device 10 can be disassembled simply by cutting off the first outer portion 24 and the second outer portion 34. In addition, the first circuit member 40 and the second circuit member 50 can be sealed inside the low-pressure sealed space 18, thereby reducing deterioration of the metal members due to oxidation, etc.

[0091] 11, according to the manufacturing method of this embodiment, a vacuum can be easily drawn using a simple tool 80. The vacuum can be drawn repeatedly using the tool 80. For example, even if the air pressure in the sealed space 18 increases when the device 10 is in use, the tool 80 can be used to draw a vacuum again. As a result, the contact force between the first contact 48 and the second contact 58 can be maintained when the device 10 is in use. However, the present invention is not limited to this, and the manufacturing method of the device 10 can be modified as necessary.

[0092] For example, the structure of the tool 80 is not particularly limited as long as it can draw a vacuum. Also, instead of using the tool 80 shown in the figure, a nozzle may be inserted into the device 10 and the device 10 may be vacuumed by the nozzle. In this case, it is not necessary to provide the air valve 70. Also, a commercially available tabletop vacuum packaging machine (not shown) may be used for sealing and vacuuming. Furthermore, referring to FIG. 7, the device member 11 may be placed in a vacuum chamber (not shown) and vacuumed while being heat sealed. However, by using a commercially available simple tool such as the tool 80 (see FIG. 11), the device 10 can be easily manufactured and the contact force between the first contact 48 and the second contact 58 can be easily maintained.

[0093] Referring to FIG. 3, a pressure detection member (not shown) that allows visual observation of the air pressure in the sealed space 18 may be sealed inside the sealed space 18. The pressure detection member may be, for example, a pressure measurement film that emits different colors depending on the air pressure. The pressure detection member may also be an elastically deformable cushioning material such as urethane sponge. When a cushioning material is used as the pressure detection member, the air pressure in the sealed space 18 can be estimated by visually checking the thickness of the cushioning material. The cushioning material may be disposed at a position that applies pressure to the first contact 48 or the second contact 58. On the other hand, when the first circuit member 40 or the second circuit member 50 has a sufficiently visible thickness, the air pressure in the sealed space 18 can be estimated without using a pressure detection member. For example, the air pressure in the sealed space 18 can be estimated by visually checking the change in shape of the first film 20F or the second film 30F located near the side of the first circuit member 40 or the second circuit member 50 (see FIG. 1 and FIG. 10).

[0094] In addition to the modifications already described, this embodiment can be modified in various ways. Four modifications will be described below.

[0095] 12 and 13, a device 10A according to a first modified example is manufactured from a device member 11A. Comparing FIG. 12 with FIG. 7, the device member 11A includes a sealing member 14A different from the sealing member 14 of the device member 11, and includes the same circuit structure 12 as the device member 11. The sealing member 14A includes one film member (flat sheet) 14L made of an insulator, an additional film 60, and an air valve 70. The circuit structure 12 includes a first circuit member 40 and a second circuit member 50. That is, the device 10A includes a first circuit member 40 and a second circuit member 50.

[0096] 12, the planar sheet 14L is folded at a middle portion (a specific portion 142A) in the front-rear direction (X direction), thereby forming a first film (sheet piece) 20L and a second film (sheet piece) 30L that overlap each other in the Z direction. That is, the first film 20L and the second film 30L are two sheet pieces that overlap each other in a single film member 14L. The film member 14L is a single planar sheet and has a specific portion 142A and an edge 144A. The edge 144A is an edge in the XY plane of the film member 14L.

[0097] 12 and 13, device 10A includes a first sealing member 20A and a second sealing member 30A, similar to device 10 (see FIG. 1). The first sealing member 20A includes a first film 20L as a base, and includes an air valve 70 provided on the first film 20L. The second sealing member 30A includes a second film 30L as a base, and includes an additional film 60.

[0098] The device 10A of this modified example can be manufactured by the same manufacturing method as the device 10 (see FIG. 1). For example, in a placement step (see FIG. 6), the circuit structure 12 is placed between the first sealing member 20A and the second sealing member 30A in the Z direction. The additional film 60 is placed between the second film 30L and the circuit structure 12 in the Z direction.

[0099] The device 10A has a similar structure to the device 10 (see FIG. 1). For example, the first seal portion 26A and the second seal portion 36A are connected to each other to form a seal mark 16A. The device 10A has a sealed space 18 (see FIG. 3) surrounded by the first sealing member 20A and the second sealing member 30A. The first circuit member 40, the second circuit member 50, and the additional film 60 are sealed inside the sealed space 18. The first contact 48 (see FIG. 3) of the first circuit member 40 and the second contact 58 (see FIG. 3) of the second circuit member 50 are in contact with each other.

[0100] On the other hand, the device 10A differs from the device 10 (see FIG. 1) in the following points. First, the first film 20L and the second film 30L are two sheet pieces folded over at the predetermined portion 142A. That is, the first film 20L and the second film 30L are connected to each other at the predetermined portion 142A. With this structure, there is no need to seal between the predetermined portion 142A and the sealed space 18 (see FIG. 3). Therefore, only the portion between the sealed space 18 and the edge 144A is sealed. That is, the seal mark 16A is formed only between the sealed space 18 and the edge 144A.

[0101] 14 and 15, a device 10B according to a second modified example is manufactured from a device member 11B. Comparing FIG. 14 with FIG. 7, the device member 11B includes a sealing member 14B different from the sealing member 14 of the device member 11, and includes the same circuit structure 12 as the device member 11. The sealing member 14B includes one film member (bag-shaped sheet) 14M made of an insulator, an additional film 60, and an air valve 70. The circuit structure 12 includes a first circuit member 40 and a second circuit member 50. That is, the device 10B includes a first circuit member 40 and a second circuit member 50.

[0102] 14, the bag-shaped sheet 14M is connected at three sides (predetermined portion 142B) in the XY plane, and is open at the front end (end on the +X side). With this structure, the bag-shaped sheet 14M is formed with a first film (sheet piece) 20M and a second film (sheet piece) 30M overlapping each other in the Z direction. That is, the first film 20M and the second film 30M are two sheet pieces overlapping each other in one film member 14M. The film member 14M is a single bag-shaped sheet, and has a predetermined portion 142B and an edge 144B. The edge 144B is the edge of the opening of the film member 14M.

[0103] 14 and 15, device 10B includes a first sealing member 20B and a second sealing member 30B, similar to device 10 (see FIG. 1). First sealing member 20B includes a first film 20M as a base, and includes an air valve 70 provided on first film 20M. Second sealing member 30B includes a second film 30M as a base, and includes an additional film 60.

[0104] The device 10B of this modified example can be manufactured by the same manufacturing method as the device 10 (see FIG. 1). For example, in a placement step (see FIG. 6), the circuit structure 12 is encapsulated inside the film member 14M and is placed between the first sealing member 20B and the second sealing member 30B in the Z direction. The additional film 60 is placed between the second film 30M and the circuit structure 12 in the Z direction.

[0105] The device 10B has a similar structure to the device 10 (see FIG. 1). For example, the first seal portion 26B and the second seal portion 36B are connected to each other to form a seal mark 16B. The first contact portion 28B and the second contact portion 38B are in contact with each other at a contact region 17B. The device 10B has a sealed space 18 (see FIG. 3) surrounded by the first sealing member 20B and the second sealing member 30B. The first circuit member 40, the second circuit member 50, and the additional film 60 are sealed inside the sealed space 18. The first contact 48 (see FIG. 3) of the first circuit member 40 and the second contact 58 (see FIG. 3) of the second circuit member 50 are in contact with each other.

[0106] On the other hand, the device 10B differs from the device 10 (see FIG. 1) in the following points. First, the first film 20M and the second film 30M are two sheet pieces connected to each other at the predetermined portion 142B. That is, the first film 20M and the second film 30M are connected to each other at the predetermined portion 142B. With this structure, there is no need to seal between the predetermined portion 142B and the sealed space 18 (see FIG. 3). Therefore, only the area between the sealed space 18 and the edge 144B is sealed. That is, the seal mark 16B is formed only between the sealed space 18 and the edge 144B.

[0107] 16 and 17 with FIG. 14 and FIG. 15, device 10C according to the third modified example includes a sealing member 14C different from sealing member 14B of device 10B, and includes the same first circuit member 40 and second circuit member 50 as device 10B. Sealing member 14C includes one film member (bag-shaped sheet) 14N made of an insulator, a fastener 16C provided at the opening of the bag-shaped sheet 14N, and an air valve 70 provided in the bag-shaped sheet 14N, and does not include an additional film 60.

[0108] Like the bag-shaped sheet 14M, the bag-shaped sheet 14N has a first film (sheet piece) 20N and a second film (sheet piece) 30N overlapping each other in the Z direction. A fastener 16C is provided on one side of the bag-shaped sheet 14N. The first film 20N and the second film 30N are connected to each other at three sides (predetermined portion 142C) where the fastener 16C is not provided.

[0109] The device 10C includes a first sealing member 20C and a second sealing member 30C. The first sealing member 20C includes a first film 20N as a base, and includes an air valve 70 and an upper portion (a portion on the +Z side) of a fastener 16C provided on the first film 20N. The second sealing member 30B includes a second film 30N as a base, and includes a lower portion (a portion on the -Z side) of a fastener 16C provided on the second film 30N.

[0110] Second sealing member 30C Unlike the second sealing member 30B, the second film 30N does not include the additional film 60. Instead, the second film 30N has an uneven portion 62C formed thereon. The uneven portion 62C is formed continuously over substantially the entire second film 30N. However, the present invention is not limited to this. 30C Similar to the second sealing member 30B, the second film 30N may be provided with the additional film 60. In this case, it is not necessary to form the uneven portion 62C in the second film 30N.

[0111] In the device 10C, the first sealing member 20C has a first inner portion 22C and a first outer portion 24C. The first inner portion 22C is located inside the first outer portion 24C. The second sealing member 30C has a second inner portion 32C and a second outer portion 34C. The second inner portion 32C is located inside the second outer portion 34C. The sealed space 18 (see FIG. 3) is surrounded by the first inner portion 22C and the second inner portion 32C. The first outer portion 24C has a first contact portion 28C. The second outer portion 34C has a second contact portion 38C. The first contact portion 28C and the second contact portion 38C are in contact with each other in the contact region 17C. The uneven portion 62C covers the entire area corresponding to the sealed space 18.

[0112] The device 10C of this modified example can be manufactured by the same manufacturing method as the device 10B. For example, in the arrangement step (see FIG. 6), the circuit structure 12 is arranged between the first sealing member 20C and the second sealing member 30C in the Z direction. Meanwhile, the additional film 60 is not arranged. Also, in the sealing step (see FIG. 6), the bag-shaped sheet 14N is not heat-sealed, and the fastener 16C is simply closed. Therefore, no seal mark is formed on the device 10C.

[0113] 18 together with FIGS. 16 and 17, device 10D according to the fourth modified example is manufactured from device 10C. In detail, after manufacturing device 10C, device 10C is subjected to heat sealing to form seal mark 16D. Next, device 10C is cut between seal mark 16D and air valve 70, and the portion where air valve 70 is formed is removed. As a result, device 10D is manufactured.

[0114] The first sealing member 20C of the device 10D does not include an air valve 70 and has a first inner portion 22C and a first outer portion 24D The first inner portion 22C has a first outer portion 24D The second sealing member 30C is located on the inside of the second inner portion 32C and the second outer portion 34D The second inner portion 32C has a second outer portion 34DThe first outer portion 24D has a first seal portion 26D in addition to a first contact portion 28C. The second outer portion 34D has a second seal portion 36D in addition to a second contact portion 38C. The sealed space 18 is surrounded by the first inner portion 22C and the second inner portion 32C. The first outer portion 24D has a first seal portion 26D in addition to a second contact portion 38C.

[0115] The first seal portion 26D and the second seal portion 36D are connected to each other to form the seal mark 16D. The uneven portion 62C continuously covers the area between the seal mark 16D and the predetermined area 19 corresponding to the second contact 58. The sealed space 18 of the device 10D is completely isolated from the outside of the device 10D. By cutting out and sealing the air valve 70 as in the device 10D, the sealed space 18 is completely isolated from the outside of the device 10D. airtightness can be improved.

[0116] In the four modified examples described above, the film member is a single flat sheet or a single bag-shaped sheet, but the film member according to the present invention is not limited to this and can be modified in various ways.

[0117] 3, the first circuit member 40 of this embodiment is a member separate from the first sealing member 20, and is not fixed to the first film 20F by adhesion or other methods. The second circuit member 50 of this embodiment is a member separate from the second sealing member 30, and is not fixed to the additional film 60 by adhesion or other methods. However, the present invention is not limited to this. As described below, the first circuit member 40 may be a member integral with the first sealing member 20, and the second circuit member 50 may be a member integral with the second sealing member 30.

[0118] For example, the first circuit member 40 may be provided on the first film 20F. More specifically, the first base 42 may be adhered and fixed to the lower surface of the first film 20F, and the first conductive pattern 44 may be formed on the lower surface of the first film 20F. That is, the first contact 48 may be provided on the lower surface of the first film 20F. In particular, when the first film 20F has an uneven portion 62, the first contact 48 may be provided on the uneven portion 62. Also, when the first sealing member 20 includes an additional film 60, the first base 42 may be adhered and fixed to the lower surface of the additional film 60, and the first conductive pattern 44 may be formed on the lower surface of the additional film 60. That is, the first contact 48 may be provided on the lower surface of the additional film 60.

[0119] For example, the second circuit member 50 may be provided on the additional film 60. More specifically, the second base 52 may be adhered and fixed to the upper surface of the additional film 60, and the second conductor pattern 54 may be formed on the upper surface of the additional film 60. That is, the second contact 58 may be provided on the upper surface of the additional film 60. Also, when the second sealing member 30 does not include the additional film 60, the second base 52 may be adhered and fixed to the upper surface of the second film 30F, and the second conductor pattern 54 may be formed on the upper surface of the second film 30F. That is, the second contact 58 may be provided on the upper surface of the second film 30F. In particular, when the second film 30F has an uneven portion 62, the second contact 58 may be provided on the uneven portion 62.

[0120] In addition to the above-mentioned modified examples, as mentioned above, one of the first circuit member 40 and the second circuit member 50 may be a single electronic component. Below, this embodiment (embodiment 1), an embodiment (embodiment 2) in which the first circuit member 40 is an integral member with the first sealing member 20, and embodiments (embodiments 3 and 4) in which the second circuit member 50 is an integral member with the second sealing member 30 will be specifically described with reference to Figs. 19 to 22.

[0121] FIG. 19 is a diagram showing a first embodiment. The first circuit member 40 of the first embodiment is a single electronic component 41. The electronic component 41 has two first contacts 48. Second circuit member 50 has two second contacts 58 that respectively correspond to the first contacts 48 of the electronic component 41. In the device 10 (see FIG. 3), the first contacts 48 are in contact with the second contacts 58, respectively.

[0122] 20 is a diagram showing Example 2. The first circuit member 40 of Example 2 is a single first conductor pattern 44 and has a first contact 48. The first conductor pattern 44 of Example 2 is adhered or formed on the lower surface of the first film 20F. That is, the first contact 48 of Example 2 is provided on the lower surface of the first film 20F.

[0123] 21 is a diagram showing Example 3. The second circuit member 50 of Example 3 is a single second conductor pattern 54 and has a second contact 58. The second conductor pattern 54 of Example 3 is adhered or formed on the upper surface of an additional film 60. That is, the second contact 58 of Example 3 is provided on the upper surface of the additional film 60.

[0124] 22 is a diagram showing Example 4. The second circuit member 50 of Example 4 is a single second conductor pattern 54 similar to Example 3, and has a second contact 58. A concave-convex portion 62 is formed on the second film 30F of Example 4. The second conductor pattern 54 of Example 4 is adhered or formed on the upper surface of the concave-convex portion 62. That is, the second contact 58 of Example 4 is provided on the upper surface of the second film 30F. [Explanation of symbols]

[0125] 10,10A,10B,10C,10D Devices 11, 11A, 11B Device components 12 Circuit structure 14,14A,14B,14C Sealing member 14L Film material (flat sheet) 14M, 14N Film material (bag-shaped sheet) 142A, 142B, 142C specified part 144A,144B Edge 146 Molten Layer 148 Non-melted layer 16, 16A, 16B, 16D Seal marks 16C zipper 17,17B,17C contact area 18 Sealed space 18S interior space 19 Predetermined area 20,20A,20B,20C 1st sealing member 20F 1st Film 20L, 20M, 20N First film (sheet piece) 22,22C 1st inner part 24,24C,24D 1st outer part 26, 26A, 26B, 26D First seal part 28,28B,28C 1st contact part 29 Periphery 30,30A,30B,30C 2nd sealing member 30F 2nd Film 30L, 30M, 30N Second film (sheet piece) 32,32C 2nd inner part 34,34C,34D 2nd outer part 36, 36A, 36B, 36D Second seal part 38,38B,38C 2nd contact part 39 Periphery 40 First circuit member 41 Electronic Components 42 First Base 43 1st circuit 44 First conductor pattern 46 Coin Cell Battery 48 First Contact 50 Second circuit member 52 Second Base 53 2nd circuit 54 Second Conductor Pattern 56 LED 58 Second Contact 60 Additional Films 62,62C Uneven part 64 Protrusion 70 Air valve 72 Shielding part 722 Valve 724 Notch 74 Base 748 Passing hole 76 Hole 80 Equipment 82 Syringe 84 Plunger

Claims

1. A device comprising a first sealing member, a second sealing member, a first circuit member, and a second circuit member, The first sealing member includes a first film as a base, The device has a sealed space formed therein; the sealed space is surrounded by the first sealing member and the second sealing member and is isolated from the outside of the device; the first circuit member and the second circuit member are sealed within the sealed space, the first circuit member includes a first contact; the second circuit member includes a second contact; the first contact and the second contact are pressed against each other and in contact with each other without using a fixing member due to a pressure difference between the inside and the outside of the sealed space, At least one of the first sealing member and the second sealing member is provided with an uneven portion, the uneven portion is in contact with at least one of the first circuit member and the second circuit member, and covers a predetermined area corresponding to at least one of the first contact and the second contact; At least one of the first sealing member and the second sealing member includes an additional film; The additional film has the uneven portion. device.

2. 2. The device of claim 1, the first circuit member is a member separate from the first sealing member, The second circuit member is a member separate from the second sealing member. device.

3. A device comprising a first sealing member, a second sealing member, a first circuit member, and a second circuit member, The first sealing member includes a first film as a base, The device has a sealed space formed therein; the sealed space is surrounded by the first sealing member and the second sealing member and is isolated from the outside of the device; the first circuit member and the second circuit member are sealed within the sealed space, the first circuit member includes a first contact; the second circuit member includes a second contact; the first contact and the second contact are in contact with each other, At least one of the first sealing member and the second sealing member is provided with an uneven portion, the uneven portion is in contact with at least one of the first circuit member and the second circuit member, and covers a predetermined area corresponding to at least one of the first contact and the second contact; The first circuit member is an integral member with the first sealing member. device.

4. A device comprising a first sealing member, a second sealing member, a first circuit member, and a second circuit member, The first sealing member includes a first film as a base, The device has a sealed space formed therein; the sealed space is surrounded by the first sealing member and the second sealing member and is isolated from the outside of the device; the first circuit member and the second circuit member are sealed within the sealed space, the first circuit member includes a first contact; the second circuit member includes a second contact; the first contact and the second contact are in contact with each other, At least one of the first sealing member and the second sealing member is provided with an uneven portion, the uneven portion is in contact with at least one of the first circuit member and the second circuit member, and covers a predetermined area corresponding to at least one of the first contact and the second contact; The second circuit member is an integral member with the second sealing member. device.

5. A device according to any one of claims 1 to 4, The first film is provided with an air valve, The uneven portion continuously covers the area between the air valve and the predetermined area. device.

6. 6. The device of claim 5, The first sealing member has a first inner portion and a first outer portion, The first inner portion is located inside the first outer portion, The second sealing member has a second inner portion and a second outer portion, The second inner portion is located inside the second outer portion, The sealed space is surrounded by the first inner portion and the second inner portion, The first outer portion has a first seal portion, The second outer portion has a second seal portion, The first seal portion and the second seal portion are connected to each other to form a seal mark, The uneven portion is sealed inside the sealed space. device.

7. A device according to any one of claims 1 to 4, The first sealing member has a first inner portion and a first outer portion, The first inner portion is located inside the first outer portion, The second sealing member has a second inner portion and a second outer portion, The second inner portion is located inside the second outer portion, The sealed space is surrounded by the first inner portion and the second inner portion, The first outer portion has a first seal portion, The second outer portion has a second seal portion, The first seal portion and the second seal portion are connected to each other to form a seal mark, The uneven portion continuously covers the area between the seal mark and the predetermined area. device.

8. A device according to claim 6 or claim 7, The first seal portion and the second seal portion are connected to each other by heat sealing. device.

9. 9. The device of claim 8, Each of the first sealing member and the second sealing member has two layers: a melting layer that melts by heat sealing and a non-melting layer that does not melt by heat sealing. device.

10. A device according to any one of claims 1 to 9, The uneven portion covers the entire area corresponding to the sealed space. device.

11. A device according to any one of claims 1 to 10, The second sealing member includes a second film as a base. device.

12. 12. The device of claim 11, the first film and the second film are two sheet pieces overlapped on one another in a single film member, The film member has a predetermined portion, The first film and the second film are connected to each other at the predetermined portion. device.

13. 13. The device of claim 12, the film member is a single planar sheet, The first film and the second film are two of the sheet pieces folded over at the predetermined portion. device.

14. 13. The device of claim 12, The film member is a single bag-shaped sheet, The first film and the second film are two sheet pieces connected to each other at the predetermined portion. device.

15. A device according to any one of claims 1 to 14, the first circuit member includes a first substrate and a first conductor pattern, the first substrate is made of an insulating film, the first conductor pattern is formed on the first substrate and has the first contact; the second circuit member has a second substrate and a second conductor pattern, the second substrate is made of an insulating film, The second conductor pattern is formed on the second substrate and has the second contact. device.

16. A device according to any one of claims 1 to 15, Each of the first sealing member and the second sealing member has high barrier properties. device.

17. 17. The device of claim 16, Each of the first sealing member and the second sealing member has a high oxygen barrier property. device.

18. 17. The device of claim 16, Each of the first sealing member and the second sealing member has a high water vapor barrier property. device.

19. 1. A method for manufacturing a device comprising a first sealing member, a second sealing member, a first circuit member, and a second circuit member, the method comprising: a preparation step of preparing the first sealing member, the second sealing member, the first circuit member, and the second circuit member, the first sealing member comprising a first film as a base, the first film being provided with an air valve, at least one of the first sealing member and the second sealing member being provided with an uneven portion, the first circuit member comprising a first contact, the second circuit member comprising a second contact, at least one of the first sealing member and the second sealing member comprising an additional film, the additional film comprising the uneven portion; an arrangement step of stacking the first sealing member, the first circuit member, the second circuit member, and the second sealing member on top of one another in this order, so that the first contacts and the second contacts face each other, the uneven portion faces at least one of the first circuit member and the second circuit member, and a predetermined region corresponding to at least one of the first contacts and the second contacts is covered by the uneven portion; a sealing step of sealing the first circuit member and the second circuit member inside an internal space formed in the device, the internal space being surrounded by the first sealing member and the second sealing member and isolated from the outside of the device except for the air valve; a vacuuming step of evacuating the internal space using the air valve, and pressing the first contact and the second contact against each other and contacting each other due to a pressure difference between the inside and outside of the internal space without using a fixing member. Manufacturing method.

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