Imaging device, imaging module, and electronic device

Abstract

Provided is a lightweight and thin image capturing apparatus. Provided is a highly convenient image capturing apparatus. This image capturing apparatus has an image capturing unit, a memory, and an arithmetic circuit. The image capturing unit includes a light receiving device, a first light emitting device, and a second light emitting device. The first light emitting device has a function of emitting light in a wavelength region different from a wavelength region of the second light emitting device. The image capturing unit has a function of causing the first light emitting device to emit light and acquiring first image data. The image capturing unit has a function of causing the second light emitting device to emit light and acquiring second image data. The memory has a function of holding first reference data and second reference data. The arithmetic circuit has a function of correcting the first image data by using the first reference data, and calculating first corrected image data. The arithmetic circuit has a function of correcting the second image data by using the second reference data, and calculating second corrected image data. The arithmetic circuit has a function of adding the first corrected image data and the second corrected image data to generate composite image data. The light receiving device has a first pixel electrode, and the first light emitting device has a second pixel electrode located on the same plane as the first pixel electrode.

Description

[Technical field]

[0001] One embodiment of the present invention relates to an imaging device, an imaging module, an electronic device, and an imaging method.

[0002] Note that one embodiment of the present invention is not limited to the above technical field. Examples of the technical field of one embodiment of the present invention include a semiconductor device, a display device, a light-emitting device, a power storage device, a memory device, an electronic device, a lighting device, an input device (e.g., a touch sensor), an input / output device (e.g., a touch panel), a driving method thereof, or a manufacturing method thereof. A semiconductor device refers to any device that can function by utilizing semiconductor characteristics. [Background technology]

[0003] A technology in which a transistor is formed using an oxide semiconductor thin film formed over a substrate has attracted attention. For example, Patent Document 1 discloses an imaging device in which a transistor that includes an oxide semiconductor and has an extremely low off-state current is used in a pixel circuit. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2011-119711 A Summary of the Invention [Problem to be solved by the invention]

[0005] An object of one embodiment of the present invention is to provide a lightweight and thin imaging device.An object of one embodiment of the present invention is to provide an imaging device capable of capturing a high-definition image.An object of one embodiment of the present invention is to provide an imaging device capable of capturing a high-quality image.An object of one embodiment of the present invention is to provide a multifunctional imaging device.An object of one embodiment of the present invention is to provide a highly convenient imaging device.An object of one embodiment of the present invention is to provide an imaging device with high color reproducibility.An object of one embodiment of the present invention is to provide a novel imaging device.An object of one embodiment of the present invention is to provide an imaging method with high color reproducibility.An object of one embodiment of the present invention is to provide a novel imaging method.

[0006] Note that the description of these problems does not preclude the existence of other problems. One embodiment of the present invention does not necessarily have to solve all of these problems. Problems other than these can be extracted from the description of the specification, drawings, and claims. [Means for solving the problem]

[0007] One embodiment of the present invention is an imaging device including an imaging unit, a memory, and an arithmetic circuit. The imaging unit includes a light receiving device, a first light emitting device, and a second light emitting device. The first light emitting device has a function of emitting light in a wavelength region different from that of the second light emitting device. The imaging unit has a function of causing the first light emitting device to emit light and acquiring first image data. The imaging unit has a function of causing the second light emitting device to emit light and acquiring second image data. The memory has a function of retaining first reference data and second reference data. The arithmetic circuit has a function of correcting the first image data using the first reference data and calculating the first corrected image data. The arithmetic circuit has a function of correcting the second image data using the second reference data and calculating the second corrected image data. The arithmetic circuit also has a function of adding the first corrected image data and the second corrected image data together to generate composite image data. The light receiving device has a first pixel electrode, and the first light emitting device has a second pixel electrode located on the same plane as the first pixel electrode.

[0008] In the imaging device described above, the light receiving device further includes an active layer and a common electrode, and the first light emitting device further includes an emission layer and a common electrode. The active layer is located on the first pixel electrode and includes a first organic compound. The emission layer is located on the second pixel electrode and includes a second organic compound. The common electrode has a portion overlapping the first pixel electrode via the active layer and a portion overlapping the second pixel electrode via the emission layer.

[0009] In the imaging device described above, it is preferable that the imaging section further includes a lens. The lens has a portion overlapping with the light receiving device and is located above the first pixel electrode. It is also preferable that light transmitted through the lens is incident on the light receiving device.

[0010] One aspect of the present invention is an imaging module including the imaging device described above, and at least one of a connector and an integrated circuit.

[0011] One embodiment of the present invention is an electronic device including the above-described imaging module and one or more of an antenna, a battery, a housing, a camera, a speaker, a microphone, and an operation button.

[0012] One embodiment of the present invention is an imaging method including the steps of: causing a first light-emitting device to emit light and acquiring first image data, correcting the first image data using first reference data and calculating first corrected image data, causing a second light-emitting device to emit light and acquiring second image data, correcting the second image data using the second reference data and calculating second corrected image data, and adding the first corrected image data and the second corrected image data together to generate composite image data. The first light-emitting device emits light in a wavelength range different from that of the second light-emitting device. Effect of the Invention

[0013] According to one embodiment of the present invention, a lightweight and thin imaging device can be provided. According to one embodiment of the present invention, an imaging device capable of capturing high-definition images can be provided. According to one embodiment of the present invention, an imaging device capable of capturing high-quality images can be provided. According to one embodiment of the present invention, a multi-function imaging device can be provided. According to one embodiment of the present invention, a highly convenient imaging device can be provided. According to one embodiment of the present invention, an imaging device with high color reproducibility can be provided. According to one embodiment of the present invention, a novel imaging device can be provided. According to one embodiment of the present invention, an imaging method with high color reproducibility can be provided. According to one embodiment of the present invention, a novel imaging method can be provided.

[0014] Note that the description of these effects does not preclude the existence of other effects. One embodiment of the present invention does not necessarily have all of these effects. Effects other than these can be extracted from the description in the specification, drawings, and claims. [Brief description of the drawings]

[0015] FIG. 1 is a block diagram showing an example of an imaging device. 2A to 2C are top views showing an example of a pixel. 3A to 3D are cross-sectional views showing an example of an imaging device. FIG. 4 is a conceptual diagram illustrating the operation of the imaging device. FIG. 5 is a flowchart showing an example of the operation of the imaging device. 6A to 6C are cross-sectional views showing an example of an imaging device. 7A to 7C are cross-sectional views showing an example of an imaging device. 8A to 8C are cross-sectional views showing an example of an imaging device. 9A to 9C are cross-sectional views showing an example of an imaging device. 10A to 10C are cross-sectional views showing an example of an imaging device. FIG. 11 is a perspective view showing an example of an imaging device. FIG. 12 is a cross-sectional view showing an example of an imaging device. 13A and 13B are cross-sectional views showing an example of an imaging device. 14A to 14C are cross-sectional views showing an example of an imaging device. FIG. 15 is a cross-sectional view showing an example of an imaging device. 16A and 16B are circuit diagrams showing an example of a pixel circuit. 17A and 17B are diagrams showing an example of an electronic device. 18A to 18D are diagrams showing an example of an electronic device. 19A to 19F are diagrams showing an example of an electronic device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] The embodiments will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it will be easily understood by those skilled in the art that the modes and details of the present invention can be modified in various ways without departing from the spirit and scope of the present invention. Therefore, the present invention should not be interpreted as being limited to the description of the embodiments shown below.

[0017] In the configuration of the invention described below, the same parts or parts having similar functions are denoted by the same reference numerals in different drawings, and the repeated explanations are omitted. In addition, when referring to similar functions, the same hatch pattern may be used and no particular reference numeral may be used.

[0018] For ease of understanding, the position, size, range, etc. of each component shown in the drawings may not represent the actual position, size, range, etc. Therefore, the disclosed invention is not necessarily limited to the position, size, range, etc. disclosed in the drawings.

[0019] In addition, the words "film" and "layer" can be interchanged depending on the case or situation. For example, the term "conductive layer" can be changed to the term "conductive film". Or, for example, the term "insulating film" can be changed to the term "insulating layer".

[0020] (Embodiment 1) One embodiment of the present invention is an imaging device including an imaging unit, a memory, and an arithmetic circuit. The imaging unit includes a light-emitting device (also referred to as a light-emitting element) and a light-receiving device (also referred to as a light-receiving element). Specifically, the imaging unit includes the light-emitting device and the light-receiving device arranged in a matrix, the light-emitting device emits light, and the light-receiving device receives the light reflected from a subject. The memory has a function of retaining reference data. The arithmetic circuit has a function of correcting image data output from the light-receiving device using the reference data and calculating corrected image data. The imaging device according to one embodiment of the present invention has a function of sequentially causing light-emitting devices of different colors to emit light, correcting image data obtained from the images captured with the light of each color, calculating corrected image data, and adding up the corrected image data to generate composite image data. The imaging device according to one embodiment of the present invention can display a composite image on the imaging unit based on the composite image data.

[0021] The light-emitting device preferably emits light in the wavelength region of visible light. As the light-emitting device, it is preferable to use an EL element such as an OLED (Organic Light Emitting Diode) or a QLED (Quantum-dot Light Emitting Diode). Examples of the light-emitting substance possessed by the EL element include a substance that emits fluorescence (fluorescent material), a substance that emits phosphorescence (phosphorescent material), an inorganic compound (quantum dot material, etc.), and a substance that exhibits thermally activated delayed fluorescence (thermally activated delayed fluorescence: TADF material). Also, an LED such as a micro LED (Light Emitting Diode) can be used as the light-emitting device.

[0022] The light receiving device is preferably sensitive to the wavelength region of visible light. In particular, it is preferable to use a light receiving device that is sensitive to the entire wavelength region of visible light. For example, a pn-type or pin-type photodiode can be used as the light receiving device. The light receiving device functions as a photoelectric conversion element that detects light incident on the light receiving device and generates electric charge. The amount of electric charge generated is determined based on the amount of light incident on the light receiving device.

[0023] In particular, it is preferable to use an organic photodiode having a layer containing an organic compound as the light receiving device. Organic photodiodes can be easily made thin, lightweight, and large in area, and have a high degree of freedom in shape and design, making them applicable to a variety of imaging devices.

[0024] In one embodiment of the present invention, it is preferable to use an organic EL element as the light-emitting device and an organic photodiode as the light-receiving device. Many layers of an organic photodiode can be configured in common with an organic EL element. Therefore, the light-emitting device and the light-receiving device can be built into the imaging device without significantly increasing the number of manufacturing steps. For example, the active layer of the light-receiving device and the light-emitting layer of the light-emitting device can be separately manufactured, and the other layers can be configured in the same manner in the light-emitting device and the light-receiving device. Therefore, a lightweight and thin imaging device can be obtained. Note that the layer shared by the light-receiving device and the light-emitting device may have different functions in the light-emitting device and the light-receiving device. In this specification, the components are named based on their functions in the light-emitting device. For example, the hole injection layer functions as a hole injection layer in the light-emitting device and functions as a hole transport layer in the light-receiving device. Similarly, the electron injection layer functions as an electron injection layer in the light-emitting device and functions as an electron transport layer in the light-receiving device.

[0025] As the light-emitting device, for example, a light-emitting device that emits light in a red wavelength region, a light-emitting device that emits light in a green wavelength region, and a light-emitting device that emits light in a blue wavelength region can be used. By sequentially emitting light from these light-emitting devices and detecting the reflected light from each of them with a light-receiving device, it is possible to capture an image of a subject in color. That is, the imaging device according to one embodiment of the present invention can be used as a color image scanner. In addition, the imaging device according to one embodiment of the present invention can generate composite image data by correcting image data obtained from images captured with light of each color, respectively, and adding up these corrected image data. That is, even if the light-receiving device does not have a spectroscopic function, it is possible to obtain an imaging device with high color reproducibility. In addition, by using a light-emitting device with high color reproducibility, it is possible to obtain an imaging device with even higher color reproducibility.

[0026] In this specification, the blue wavelength region is from 400 nm to less than 490 nm, and the blue emission has at least one emission spectrum peak in this wavelength region. The green wavelength region is from 490 nm to less than 580 nm, and the green emission has at least one emission spectrum peak in this wavelength region. The red wavelength region is from 580 nm to 680 nm, and the red emission has at least one emission spectrum peak in this wavelength region.

[0027] The imaging device according to one embodiment of the present invention uses a light-receiving device having sensitivity to the entire wavelength range of visible light, so that a red light-receiving device, a green light-receiving device, and a blue light-receiving device are not required, and therefore the imaging device can capture high-definition images. In addition, the imaging device according to one embodiment of the present invention has a function of displaying an image because it includes a light-emitting device, and can be a multifunctional and highly convenient imaging device. For example, an image captured by an imaging unit can be displayed on the imaging unit, allowing the captured image to be immediately checked.

[0028] The imaging device according to one embodiment of the present invention can be applied to a display portion of an electronic device. Examples of the electronic device include a television device, a personal computer, a monitor for a computer, a digital signage, a mobile phone, a portable game machine, and a portable information terminal. The imaging device according to one embodiment of the present invention can be applied to a display portion of an electronic device to provide an imaging function. A user can capture an image by placing a subject to be imaged on the display portion of the electronic device. The user can instantly display the captured image on the display portion and check the image, making the electronic device highly convenient. The imaging device according to one embodiment of the present invention can be applied to personal authentication by capturing an image of biometric information such as a fingerprint or palm print using a light receiving device. The imaging device according to one embodiment of the present invention can be applied to a touch sensor by detecting position information of an object touching the imaging portion.

[0029] An imaging device which is one embodiment of the present invention will be described with reference to FIGS.

[0030] <Configuration example 1 of imaging device> A block diagram illustrating an imaging device 10 according to one embodiment of the present invention is shown in FIG 1. The imaging device 10 includes an imaging portion 61, a driver circuit portion 62, a driver circuit portion 63, a driver circuit portion 64, and a circuit portion 65.

[0031] The imaging section 61 has pixels 60 arranged in a matrix. Each of the pixels 60 has a light emitting device and a light receiving device. The light receiving device may be provided in all of the pixels 60, or may be provided in some of the pixels 60. Furthermore, one pixel 60 may have multiple light receiving devices.

[0032] The driver circuit portion 62 functions as a source line driver circuit (also referred to as a source driver). The driver circuit portion 63 functions as a gate line driver circuit (also referred to as a gate driver). The driver circuit portion 64 has a function of generating a signal for driving a light receiving device included in the pixel 60 and outputting the signal to the pixel 60. The circuit portion 65 has a function of receiving a signal output from the pixel 60 and outputting the signal as data to the arithmetic circuit 71. The circuit portion 65 functions as a read circuit. The arithmetic circuit 71 has a function of receiving a signal output from the circuit portion 65 and performing an arithmetic operation. The memory 73 has a function of holding a program executed by the arithmetic circuit 71, data input to the arithmetic circuit 71, data output from the arithmetic circuit 71, and the like.

[0033] For example, a CPU (Central Processing Unit), a DSP (Digital Signal Processor), a GPU (Graphics Processing Unit), etc. may be used as the arithmetic circuit 71. In addition, these may be realized by a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array) or an FPA (Field Programmable Analog Array).

[0034] A storage device to which a nonvolatile storage element is applied can be suitably used as the memory 73. For example, a flash memory, a Magnetoresistive Random Access Memory (MRAM), a Phase change RAM (PRAM), a Resistive RAM (ReRAM), a Ferroelectric RAM (FeRAM), or the like can be used as the memory 73.

[0035] The drive circuit unit 62 is electrically connected to the pixels 60 via wiring 82. The drive circuit unit 63 is electrically connected to the pixels 60 via wiring 83. The drive circuit unit 64 is electrically connected to the pixels 60 via wiring 84. The circuit unit 65 is electrically connected to the pixels 60 via wiring 85. The arithmetic circuit 71 is electrically connected to the circuit unit 65 via wiring 86. The memory 73 is electrically connected to the arithmetic circuit 71 via wiring 87.

[0036] Each pixel 60 preferably has two or more sub-pixels. Furthermore, the pixel 60 preferably has a sub-pixel having an emitting device and a sub-pixel having a light receiving device. An example of the pixel 60 is shown in FIG. 2A. FIG. 2A shows an example in which the pixel 60 has four sub-pixels, namely, a sub-pixel 60R, a sub-pixel 60G, a sub-pixel 60B, and a sub-pixel 60PD. For example, the sub-pixel 60R has a light emitting device 91R that emits light in a red wavelength region, the sub-pixel 60G has a light emitting device 91G that emits light in a green wavelength region, the sub-pixel 60B has a light emitting device 91B that emits light in a blue wavelength region, and the sub-pixel 60PD has a light receiving device 91PD.

[0037] 2A shows an example in which four sub-pixels are arranged in a 2×2 matrix, but one embodiment of the present invention is not limited to this. As shown in FIG. 2B, the four sub-pixels may be arranged in a row. The order of the sub-pixels is not particularly limited.

[0038] 2A and 2B show an example in which the subpixels emit light in three colors, red (R), green (G), and blue (B), but the combination and number of colors are not limited thereto. The subpixels may emit four colors, red (R), green (G), blue (B), and white (W), or four colors, red (R), green (G), blue (B), and yellow (Y). FIG. 2C shows an example in which the pixel 60 has five subpixels, subpixel 60R, subpixel 60G, subpixel 60B, subpixel 60W, and subpixel 60PD, and the subpixel 60W has a light-emitting device 91W that emits white light. Note that the color elements applied to the subpixels are not limited to the above, and cyan (C) and magenta (M), for example, may be combined. In addition, although FIGS. 2A to 2C show an example in which the areas of the subpixels are equal, one embodiment of the present invention is not limited thereto. The areas of the subpixels may be different.

[0039] Schematic cross-sectional views of the imaging unit 61 are shown in FIGS. 3A to 3D.

[0040] 3A includes a substrate 51 and a substrate 59, and includes a layer 53 and a layer 57 between the substrates 51 and 59. The layer 57 includes a light-emitting device such as a light-emitting device 91R, and the layer 53 includes a light-receiving device 91PD.

[0041] 3B includes a substrate 51 and a substrate 59, and includes a layer 53, a layer 55, and a layer 57 between the substrate 51 and the substrate 59. The layer 55 includes a transistor.

[0042] The imaging section 61 may be configured such that, for example, red (R), green (G), and blue (B) light is emitted from a layer 57 having light-emitting devices such as a light-emitting device 91R, and light is incident from the outside onto a layer 53 having a light-receiving device 91PD. Note that in Figures 3A and 3B, the light emitted from the layer 57 and the light incident onto the layer 53 are indicated by arrows.

[0043] Layer 55 having transistors preferably includes a first transistor and a second transistor. The first transistor is electrically connected to a light receiving device 91PD in layer 53. The second transistor is electrically connected to a light emitting device, such as light emitting device 91R, in layer 57.

[0044] The imaging device according to one embodiment of the present invention has a function of capturing an image of a subject in contact with the imaging section 61. For example, as shown in Fig. 3C, a light-emitting device included in the layer 57 emits light, the light is reflected by the subject 52 in contact with the imaging section 61, and the reflected light is received by the light-receiving device 91PD included in the layer 53. This allows the subject 52 on the imaging section 61 to be captured.

[0045] As shown in Fig. 3D, the imaging device according to one embodiment of the present invention can also capture an image of subject 52 that is not in contact with imaging section 61. Similarly, imaging section 61 shown in Fig. 3A can also capture an image of subject 52 that is not in contact with imaging section 61. Note that in Figs. 3C and 3D, arrows indicate light that is emitted from layer 57, reflected by subject 52, and enters layer 53.

[0046] The operation of the imaging device will be described with reference to Fig. 1 and Fig. 4. Fig. 4 is a conceptual diagram for explaining the operation of the imaging device. Here, an example will be described in which imaging is performed using three light-emitting devices, namely, light-emitting device 91R emitting red light, light-emitting device 91G emitting green light, and light-emitting device 91B emitting blue light, as shown in Fig. 2A and Fig. 2B.

[0047] In the imaging unit 61, the light emitting device 91R that emits red light is turned on, and the light receiving device 91PD is used to capture a first image IM R The signal from the light receiving device 91PD of each pixel (hereinafter referred to as the first image data R X ) is output to the arithmetic circuit 71 via the circuit section 65. Similarly, in the imaging section 61, the light emitting device 91G that emits green light is turned on, and the light receiving device 91PD is used to capture a second image IM GThe signal from the light receiving device 91PD of each pixel (hereinafter, referred to as second image data G X (denoted as "blue") is output to the arithmetic circuit 71 via the circuit section 65. Similarly, the light emitting device 91B that emits blue light is turned on in the imaging section 61, and a third image IM B The signal from the light receiving device 91PD of each pixel (hereinafter, the third image data B X ) is output to the arithmetic circuit 71 via the circuit section 65.

[0048] The arithmetic circuit 71 calculates the first image data R X , second image data G X , and the third image data B X The calculation circuit 71 uses the reference data to calculate the first image data R X is corrected to obtain the first corrected image data R LSB Similarly, the calculation circuit 71 calculates the second image data G X is corrected to obtain the second corrected image data G LSB The calculation circuit 71 calculates the third image data B X is corrected to obtain the third corrected image data B LSB Calculate.

[0049] Here, the reference data will be described. As the reference data, reference data serving as a reference for black and reference data serving as a reference for white are acquired in advance.

[0050] A subject serving as a reference for black is photographed using red light, green light, and blue light, and first black reference data R serving as reference data for black is obtained. min , the second black reference data G min , and the third black reference data B min The first black reference data R min is the output value output from the light receiving device of each pixel when imaging with red light. min is the output value output from the light receiving device of each pixel when imaging with green light. minis the output value output from the light receiving device of each pixel when imaging with blue light. The first black reference data R min , the second black reference data G min , and the third black reference data B min For example, a voltage value can be used as the reference data. It is preferable that the black subject used to acquire the reference data has an extremely low reflectance.

[0051] Similarly, an object serving as a white reference is imaged using red light, green light, and blue light, respectively, to obtain first white reference data R max , the second white reference data G max , and the third white reference data B max The first white reference data R max is the output value output from the light receiving device of each pixel when imaging with red light. max is the output value output from the light receiving device of each pixel when imaging with green light. max is the output value output from the light receiving device of each pixel when imaging with blue light. The first white reference data R max , the second white reference data G max , and the third white reference data B max For example, a voltage value can be used as the reference data. It is preferable that the white subject used to acquire the reference data has an extremely high reflectance.

[0052] The reference data may be obtained at the time of shipment of the imaging device and stored in the memory 73. It is preferable to use a non-volatile memory such as a flash memory as the memory 73. The reference data may be rewritten when a user uses the imaging device. The arithmetic circuit 71 has a function of reading out the reference data stored in the memory 73. Specifically, the arithmetic circuit 71 has a function of reading out the reference data from the memory 73 and correcting the image data of each color into corrected image data using the reference data. The corrected image data of each color may be output to and stored in the memory 73.

[0053] First black reference data R min , the second black reference data G min , and the third black reference data B min , the first white reference data R max , the second white reference data G max , and the third white reference data B max It is preferable to obtain each of the first black reference data R for each pixel 60. By performing correction using the reference data obtained for each pixel 60, it is possible to reduce the influence of variations in the characteristics of the light emitting device and the light receiving device on the correction. min , the second black reference data G min , and the third black reference data B min , the first white reference data R max , the second white reference data G max , and the third white reference data B max Alternatively, the average value of the entire imaging unit 61 may be used for each of the reference data. By using the average value as the reference data, the capacity of the memory 73 can be reduced.

[0054] In this specification, the first black reference data R min , and the first white reference data R max The first reference data, the second black reference data G min , and the second white reference data G max The second reference data, the third black reference data B min , and the third white reference data B max The first black reference data R min , the second black reference data G min , and the third black reference data B min , the first white reference data R max , the second white reference data G max , and the third white reference data B max may be referred to as reference data.

[0055] First corrected image data R using the reference data LSB , the second corrected image data G LSB, and the third corrected image data B LSB The calculation of is explained below.

[0056] The first image data R output from each light receiving device X , second image data G X , and the third image data B X are calculated by the following equations (1), (2), and (3), respectively, to obtain the first corrected image data R LSB , the second corrected image data G LSB , and the third corrected image data B LSB is converted to.

[0057] R LSB =(R X -R min ) / (R max -R min )×A (1)

[0058] G LSB =(G X -G min ) / (G max -G min )×A (2)

[0059] B LSB =(B X -B min ) / (B max -B min )×A (3)

[0060] Here, the constant A indicates the maximum value of the gradation that the composite image SyIM can have. When the composite image SyIM has n bits, the gradation of the composite image SyIM is 0 to 2. n Take an integer less than or equal to -1, and the constant A is 2 n For example, when the composite image SyIM is 8 bits, the gradation of the composite image SyIM is an integer between 0 and 255, and the constant A is 255. Note that the first image data R X , second image data G X , and the third image data B X is an analog value, whereas the first corrected image data R LSB , the second corrected image data GLSB , and the third corrected image data B LSB is a digital value.

[0061] The arithmetic circuit 71 calculates the first corrected image data R LSB , the second corrected image data G LSB , and the third corrected image data B LSB These are added together to generate composite image data, thereby generating a color composite image SyIM.

[0062] As described above, by correcting the image data of each color using the white reference data and the black reference data and generating a composite image SyIM, an imaging device with high color reproducibility can be obtained.

[0063] In this embodiment, the reference data obtained by capturing images of a white reference subject and a black reference subject is used for correction, but the present invention is not limited to this. A unique value determined from the characteristics of the light receiving device may be used as the reference data. The temperature inside the imaging device or the temperature of the usage environment may be acquired, and reference data with the temperature as a variable may be used. By using the reference data with the temperature as a variable, the influence of the temperature during imaging can be reduced, and an imaging device with high color reproducibility can be obtained even when the characteristics of the light emitting device and the light receiving device change depending on the temperature. In addition, the cumulative driving time of the light emitting device and the cumulative driving time of the light receiving device may be acquired, and reference data with the cumulative driving time as a variable may be used. By using the reference data with the cumulative usage time as a variable, an imaging device with high color reproducibility can be obtained even when the characteristics of the light emitting device and the light receiving photons change depending on the respective cumulative driving times.

[0064] <Example of imaging device operation> The operation of the imaging device according to one embodiment of the present invention will be described with reference to Fig. 5. Fig. 5 is a flowchart illustrating the operation of the imaging device.

[0065] In step S11, the light emitting device 91R that emits red light is turned on. It is preferable that all of the light emitting devices 91R in the imaging section 61 are turned on.

[0066] In step S12, the first image IM R Since the image is captured while the light emitting device 91R is emitting light, red light is reflected from the subject, and the reflected light is incident on the light receiving device 91PD. That is, the first image IM R The signal from the light receiving device 91PD of each pixel (hereinafter referred to as the first image data R X The first image data R X is data corresponding to the current value flowing through the light receiving device 91PD of each pixel, and is output from the imaging unit 61 to the arithmetic circuit 71 via the circuit unit 65. X For example, a voltage value can be used as the input voltage.

[0067] In step S13, the light-emitting device 91R is turned off. It is preferable that all of the light-emitting devices 91R included in the imaging unit 61 are turned off.

[0068] In step S21, the calculation circuit 71 calculates the first image data R X is corrected to obtain the first corrected image data R LSB The first corrected image data R LSB is output to and stored in the memory 73. The reference data is stored in the memory 73 and is read out to the arithmetic circuit 71 during correction. In this example, the reference data is the first white reference data R max , and the first black reference data R min can be used.

[0069] In step S31, the light emitting device 91G that emits green light is turned on. It is preferable that all of the light emitting devices 91G in the imaging section 61 are turned on.

[0070] In step S32, the second image IM G Since the image is captured while the light-emitting device 91G is emitting light, the green light is reflected by the subject, and the reflected light is incident on the light-receiving device 91PD. In other words, the second image IM G The signal from the light receiving device 91PD of each pixel (hereinafter referred to as the second image data G X The second image data G X is data corresponding to the current value flowing through the light receiving device 91PD of each pixel, and is output from the imaging unit 61 to the arithmetic circuit 71 via the circuit unit 65. X For example, a voltage value can be used as the input voltage.

[0071] In step S33, the light-emitting device 91G is turned off. It is preferable that all of the light-emitting devices 91G included in the imaging unit 61 are turned off.

[0072] In step S41, the calculation circuit 71 calculates the second image data G X is corrected to obtain the second corrected image data G LSB The second corrected image data G LSB is output to the memory 73 and stored therein. In this case, the second white reference data G max , and the second black reference data G min can be used.

[0073] In step S51, the light emitting device 91B that emits blue light is turned on. It is preferable that all the light emitting devices 91B in the imaging section 61 are turned on.

[0074] In step S52, the third image IM B Since the image is captured while the light-emitting device 91B is emitting light, blue light is reflected from the subject, and the reflected light is incident on the light-receiving device 91PD. In other words, the third image IM BThe signal from the light receiving device 91PD of each pixel (hereinafter, the third image data B X The third image data B is output to the arithmetic circuit 71. X is data corresponding to the current value flowing through the light receiving device 91PD of each pixel, and is output from the imaging unit 61 to the arithmetic circuit 71 via the circuit unit 65. X For example, a voltage value can be used as the input voltage.

[0075] In step S53, the light-emitting device 91B is turned off. It is preferable that all of the light-emitting devices 91B included in the imaging unit 61 are turned off.

[0076] In step S61, the calculation circuit 71 calculates the third image data B X is corrected to obtain the third corrected image data B LSB The third corrected image data B LSB is output to the memory 73 and stored therein. In this example, the third white reference data B max , and the third black reference data B min can be used.

[0077] In step S71, the first corrected image data R LSB , the second corrected image data G LSB , and the third corrected image data B LSB are read out, and these are added together to generate composite image data, thereby generating a color composite image SyIM.

[0078] As described above, by correcting image data for each color using the white reference data and the black reference data, an imaging device with high color reproducibility can be obtained.

[0079] Although FIG. 5 shows an example in which images are captured in the order of red, green, and blue, the type of colors, the number of colors, and the order in which the colors are captured are not particularly limited.

[0080] <Configuration example 2 of imaging device> A detailed structure of an imaging device according to one embodiment of the present invention will be described with reference to FIGS.

[0081] [Imaging device 10A] A cross-sectional view of the imaging device 10A is shown in FIG. 6A.

[0082] The imaging device 10 A includes a light receiving device 110 and a light emitting device 190 .

[0083] The light-receiving device 110 includes a pixel electrode 111 , a common layer 112 , an active layer 113 , a common layer 114 , and a common electrode 115 .

[0084] The light emitting device 190 includes a pixel electrode 191 , a common layer 112 , a light emitting layer 193 , a common layer 114 , and a common electrode 115 .

[0085] The pixel electrode 111, the pixel electrode 191, the common layer 112, the active layer 113, the light-emitting layer 193, the common layer 114, and the common electrode 115 may each have a single-layer structure or a multilayer structure.

[0086] The pixel electrode 111 and the pixel electrode 191 are located on an insulating layer 214. The pixel electrode 111 and the pixel electrode 191 can be formed of the same material and in the same process.

[0087] The common layer 112 is located on the pixel electrodes 111 and 191. The common layer 112 is a layer that is used in common by the light receiving device 110 and the light emitting device 190.

[0088] The active layer 113 overlaps with the pixel electrode 111 through the common layer 112. The light-emitting layer 193 overlaps with the pixel electrode 191 through the common layer 112. The active layer 113 has a first organic compound, and the light-emitting layer 193 has a second organic compound different from the first organic compound.

[0089] The common layer 114 is located on the common layer 112, the active layer 113, and the light-emitting layer 193. The common layer 114 is a layer that is used in common by the light-receiving device 110 and the light-emitting device 190.

[0090] The common electrode 115 has a portion overlapping with the pixel electrode 111 via the common layer 112, the active layer 113, and the common layer 114. The common electrode 115 also has a portion overlapping with the pixel electrode 191 via the common layer 112, the light-emitting layer 193, and the common layer 114. The common electrode 115 is a layer used in common by the light-receiving device 110 and the light-emitting device 190.

[0091] In the imaging device of this embodiment, an organic compound is used for the active layer 113 of the light-receiving device 110. The layers of the light-receiving device 110 other than the active layer 113 can have a common configuration with the light-emitting device 190 (EL element). Therefore, the light-receiving device 110 can be formed in parallel with the formation of the light-emitting device 190 by simply adding a process of forming the active layer 113 to the manufacturing process of the light-emitting device 190. In addition, the light-emitting device 190 and the light-receiving device 110 can be formed on the same substrate. Therefore, the light-emitting device 190 and the light-receiving device 110 can be built into the imaging device without significantly increasing the number of manufacturing processes.

[0092] In the imaging device 10A, the light receiving device 110 and the light emitting device 190 have a common configuration, except that the active layer 113 of the light receiving device 110 and the light emitting layer 193 of the light emitting device 190 are separately fabricated. However, the configuration of the light receiving device 110 and the light emitting device 190 is not limited to this. The light receiving device 110 and the light emitting device 190 may have layers that are separately fabricated in addition to the active layer 113 and the light emitting layer 193 (see imaging devices 10K, 10L, and 10M described later). It is preferable that the light receiving device 110 and the light emitting device 190 have one or more layers that are used in common (common layers). This allows the light emitting device 190 and the light receiving device 110 to be built into the imaging device without significantly increasing the number of fabrication steps.

[0093] The imaging device 10A has a light receiving device 110, a light emitting device 190, a transistor 41, a transistor 42, and the like between a pair of substrates (substrate 151 and substrate 152).

[0094] In the light receiving device 110, the common layer 112, the active layer 113, and the common layer 114, which are located between the pixel electrode 111 and the common electrode 115, respectively, can be called organic layers (layers containing an organic compound). The pixel electrode 111 preferably has a function of reflecting visible light. The ends of the pixel electrode 111 are covered with partition walls 216. The common electrode 115 has a function of transmitting visible light.

[0095] The light receiving device 110 has a function of detecting light. Specifically, the light receiving device 110 is a photoelectric conversion element that receives light 22 incident from the outside of the imaging device 10A and converts it into an electric signal. The light 22 can also be light emitted by the light emitting device 190 and reflected by an object. The light 22 may also be incident on the light receiving device 110 through a lens to be described later. In this embodiment, the pixel electrode 111 functions as an anode and the common electrode 115 functions as a cathode, in line with the light emitting device 190. In other words, the light receiving device 110 can detect light incident on the light receiving device 110 and generate electric charges by applying a reverse bias between the pixel electrode 111 and the common electrode 115 and driving the light receiving device 110.

[0096] A light-shielding layer BM is provided on the surface of the substrate 152 facing the substrate 151. The light-shielding layer BM has openings at a position overlapping the light-receiving device 110 and a position overlapping the light-emitting device 190. By providing the light-shielding layer BM, the range in which the light-receiving device 110 detects light can be controlled.

[0097] The light-shielding layer BM may be made of a material that blocks light emitted from the light-emitting device. The light-shielding layer BM preferably absorbs visible light. For example, the light-shielding layer BM may be made of a black matrix using a metal material or a resin material containing a pigment (such as carbon black) or a dye. The light-shielding layer BM may have a laminated structure of a red color filter, a green color filter, and a blue color filter.

[0098] Here, the light receiving device 110 detects light emitted by the light emitting device 190 and reflected by the object. However, there are cases where the light emitted by the light emitting device 190 is reflected within the imaging apparatus 10A and enters the light receiving device 110 without passing through the object. The light shielding layer BM can suppress the influence of such stray light. For example, if the light shielding layer BM is not provided, the light 23a emitted by the light emitting device 190 may be reflected by the substrate 152, and the reflected light 23b may enter the light receiving device 110. By providing the light shielding layer BM, it is possible to suppress the reflected light 23b from entering the light receiving device 110. This can reduce noise and increase the sensitivity of the sensor using the light receiving device 110.

[0099] In the light-emitting device 190, the common layer 112, the light-emitting layer 193, and the common layer 114, which are located between the pixel electrode 191 and the common electrode 115, respectively, can also be called EL layers. The pixel electrode 191 preferably has a function of reflecting visible light. An end of the pixel electrode 191 is covered with a partition wall 216. The pixel electrode 111 and the pixel electrode 191 are electrically insulated from each other by the partition wall 216. The common electrode 115 has a function of transmitting visible light.

[0100] The light emitting device 190 has a function of emitting visible light. Specifically, the light emitting device 190 is an electroluminescent device that emits light toward the substrate 152 side by applying a voltage between the pixel electrode 191 and the common electrode 115 (see light emission 21).

[0101] The light emitting layer 193 is preferably formed so as not to overlap with the light receiving region of the light receiving device 110. This can suppress the light emitting layer 193 from absorbing the light 22, and can increase the amount of light irradiated to the light receiving device 110.

[0102] The pixel electrode 111 is electrically connected to the source or drain of the transistor 41 through an opening provided in the insulating layer 214. An end of the pixel electrode 111 is covered with a partition wall 216.

[0103] The pixel electrode 191 is electrically connected to a source or drain of the transistor 42 through an opening provided in the insulating layer 214. An end of the pixel electrode 191 is covered with a partition wall 216. The transistor 42 has a function of controlling driving of the light-emitting device 190.

[0104] The transistor 41 and the transistor 42 are in contact with each other on the same layer (substrate 151 in FIG. 6A).

[0105] At least a part of the circuit electrically connected to the light receiving device 110 is preferably formed of the same material and in the same process as the circuit electrically connected to the light emitting device 190. This allows the thickness of the imaging device to be thinner and the manufacturing process to be simplified compared to the case where the two circuits are formed separately.

[0106] Each of the light receiving device 110 and the light emitting device 190 is preferably covered with a protective layer 195. In Fig. 6A, the protective layer 195 is provided on and in contact with the common electrode 115. By providing the protective layer 195, it is possible to prevent impurities such as water from entering the light receiving device 110 and the light emitting device 190, and to improve the reliability of the light receiving device 110 and the light emitting device 190. In addition, the protective layer 195 and the substrate 152 are bonded together by the adhesive layer 142.

[0107] As shown in Fig. 7A, a protective layer does not necessarily have to be provided on the light receiving device 110 and the light emitting device 190. In Fig. 7A, the common electrode 115 and the substrate 152 are bonded together by the adhesive layer 142.

[0108] [Imaging device 10B] 6B shows a cross-sectional view of an imaging device 10B having a different configuration from the imaging device 10A described above. In the following description of the imaging device, the description of the same configuration as the imaging device described above may be omitted.

[0109] The imaging device 10B shown in FIG. 6B includes a lens 149 in addition to the components of the imaging device 10A.

[0110] The imaging device of this embodiment may have a lens 149. The lens 149 is provided at a position overlapping with the light receiving device 110. In the imaging device 10B, the lens 149 is provided in contact with the substrate 152. The lens 149 of the imaging device 10B has a convex surface on the substrate 151 side. Alternatively, the lens 149 may have a convex surface on the substrate 152 side.

[0111] When both the light-shielding layer BM and the lens 149 are formed on the same surface of the substrate 152, the order of formation does not matter. Fig. 6B shows an example in which the lens 149 is formed first, but the light-shielding layer BM may be formed first. In Fig. 6B, the edge of the lens 149 is covered with the light-shielding layer BM.

[0112] The imaging device 10B is configured such that the light 22 is incident on the light receiving device 110 via the lens 149. When the lens 149 is included, the imaging range of the light receiving device 110 can be narrowed compared to when the lens 149 is not included, and overlapping of the imaging range with the adjacent light receiving device 110 can be suppressed. This allows a clear image with less blurring to be captured. In addition, when the imaging range of the light receiving device 110 is the same, when the lens 149 is included, the size of the pinhole (corresponding to the size of the opening of the BM overlapping with the light receiving device 110 in FIG. 6B) can be made larger compared to when the lens 149 is not included. Therefore, by including the lens 149, the amount of light incident on the light receiving device 110 can be increased.

[0113] Each of the imaging devices shown in FIGS. 7B and 7C has a configuration in which light 22 is incident on the light receiving device 110 via a lens 149, similar to the imaging device 10B shown in FIG. 6B.

[0114] In Fig. 7B, lens 149 is provided in contact with the upper surface of protective layer 195. Lens 149 of the imaging device shown in Fig. 7B has a convex surface facing substrate 152.

[0115] 7C includes a lens array 146 on the imaging surface side of a substrate 152. Lenses in the lens array 146 are provided at positions overlapping the light receiving device 110. A light shielding layer BM is preferably provided on the surface of the substrate 152 facing the substrate 151.

[0116] The method of forming the lenses used in the imaging device of this embodiment may involve forming lenses such as microlenses directly on a substrate or a light receiving device, or may involve bonding a lens array such as a microlens array that has been separately fabricated to the substrate.

[0117] [Imaging device 10C] A cross-sectional view of imaging device 10C is shown in FIG. 6C.

[0118] 6C differs from imaging device 10A in that imaging device 10C does not have substrate 151, substrate 152, and partition wall 216, but has substrate 153, substrate 154, adhesive layer 155, insulating layer 212, and partition wall 217.

[0119] The substrate 153 and the insulating layer 212 are bonded together by an adhesive layer 155. The substrate 154 and the protective layer 195 are bonded together by an adhesive layer 142.

[0120] The imaging device 10C is fabricated by transferring the insulating layer 212, the transistor 41, the transistor 42, the light receiving device 110, the light emitting device 190, and the like, which are formed on a fabrication substrate, onto the substrate 153. The substrates 153 and 154 are preferably flexible, which can increase the flexibility of the imaging device 10C. For example, the substrates 153 and 154 are preferably made of resin.

[0121] The substrates 153 and 154 may each be made of polyester resin such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN), polyacrylonitrile resin, acrylic resin, polyimide resin, polymethyl methacrylate resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyamide resin (nylon, aramid, etc.), polysiloxane resin, cycloolefin resin, polystyrene resin, polyamideimide resin, polyurethane resin, polyvinyl chloride resin, polyvinylidene chloride resin, polypropylene resin, polytetrafluoroethylene (PTFE) resin, ABS resin, cellulose nanofiber, etc. One or both of the substrates 153 and 154 may be made of glass having a thickness sufficient to provide flexibility.

[0122] The substrate of the imaging device of this embodiment may be a film having high optical isotropy, such as a triacetyl cellulose (TAC, also called cellulose triacetate) film, a cycloolefin polymer (COP) film, a cycloolefin copolymer (COC) film, an acrylic film, or the like.

[0123] It is preferable that the partition 217 absorbs light emitted by the light emitting device. For example, a black matrix can be formed by using a resin material containing a pigment or a dye as the partition 217. In addition, by using a brown resist material, the partition 217 can be formed of a colored insulating layer.

[0124] Light 23c emitted by the light emitting device 190 may be reflected by the substrate 154 and the partition 217, and reflected light 23d may enter the light receiving device 110. Furthermore, light 23c may pass through the partition 217 and be reflected by a transistor, wiring, or the like, and the reflected light may enter the light receiving device 110. The light 23c is absorbed by the partition 217, and thus the reflected light 23d can be prevented from entering the light receiving device 110. This can reduce noise and increase the sensitivity of a sensor using the light receiving device 110.

[0125] It is preferable that the partition 217 absorbs at least the wavelength of light detected by the light receiving device 110. For example, when the light receiving device 110 detects green light emitted by the light emitting device 190, it is preferable that the partition 217 absorbs at least green light. For example, when the partition 217 has a red color filter, it can absorb the green light 23c and prevent the reflected light 23d from entering the light receiving device 110.

[0126] [Imaging device 10D] A cross-sectional view of imaging device 10D is shown in FIG. 8A.

[0127] The imaging device 10D includes a color layer 148a in addition to the components of the imaging device 10B.

[0128] The colored layer 148 a has a portion in contact with the upper surface of the pixel electrode 111 of the light receiving device 110 and a portion in contact with the side surface of the partition wall 216 .

[0129] The colored layer 148a preferably absorbs light emitted by the light emitting device. For example, a black matrix can be formed as the colored layer 148a using a resin material containing a pigment or dye. Also, by using a brown resist material, the colored layer 148a can be formed of a colored insulating layer.

[0130] It is preferable that the colored layer 148a absorbs at least the wavelength of light detected by the light receiving device 110. For example, when the light receiving device 110 detects green light emitted by the light emitting device 190, it is preferable that the colored layer 148a absorbs at least green light. For example, if the colored layer 148a has a red color filter, it can absorb green light and prevent stray light (reflected light) from entering the light receiving device 110.

[0131] The colored layer 148a absorbs stray light generated in the imaging device 10D, thereby reducing the amount of stray light incident on the light receiving device 110. This reduces noise and increases the sensitivity of a sensor using the light receiving device 110.

[0132] In the imaging device of this embodiment, the colored layer is disposed between the light receiving device 110 and the light emitting device 190. This makes it possible to suppress stray light incident on the light receiving device 110 from the light emitting device 190.

[0133] [Imaging device 10E] A cross-sectional view of imaging device 10E is shown in FIG. 8B.

[0134] The imaging device 10E includes a color layer 148b in addition to the components of the imaging device 10D. The material that can be used for the color layer 148b is the same as that for the color layer 148a.

[0135] The colored layer 148 b has a portion in contact with the upper surface of the pixel electrode 191 of the light emitting device 190 and a portion in contact with the side surface of the partition wall 216 .

[0136] The imaging device of this embodiment preferably has one or both of the colored layer 148a and the colored layer 148b.

[0137] By including both the colored layer 148a and the colored layer 148b, the amount of stray light entering the light receiving device 110 can be further reduced.

[0138] In the imaging device 10E, since the colored layer 148b contacts the upper surface of the pixel electrode 191, the amount of light emitted 21 from the light emitting device 190 that is extracted to the outside of the imaging device 10E may be less than that of the imaging device 10D (FIG. 8A). Therefore, when only one of the colored layer 148a and the colored layer 148b is provided, it is preferable to provide only the colored layer 148a on the light receiving device 110 side as in the imaging device 10D. This can increase the light extraction efficiency of the light emitting device 190 and suppress the incidence of stray light into the light receiving device 110. Therefore, an imaging device that can capture high-quality images can be obtained.

[0139] [Imaging device 10F] A cross-sectional view of imaging device 10F is shown in FIG. 8C.

[0140] The imaging device 10F includes the same components as the imaging device 10B, and further includes a colored layer 148. The material that can be used for the colored layer 148 is similar to that for the colored layer 148a.

[0141] The colored layer 148 is provided so as to cover the upper surface and side surfaces of the partition wall 216. The colored layer 148 has a portion in contact with the upper surface of the pixel electrode 111 of the light-receiving device 110, and a portion in contact with the upper surface of the pixel electrode 191 of the light-emitting device 190.

[0142] The colored layer 148a and the colored layer 148b shown in Fig. 8B do not need to be separated from each other, and may be a single film like the colored layer 148 shown in Fig. 8C. The colored layer 148 absorbs stray light generated in the imaging device 10F, thereby reducing the amount of stray light incident on the light receiving device 110. This reduces noise and increases the sensitivity of the sensor using the light receiving device 110.

[0143] [Imaging device 10G] A cross-sectional view of the imaging device 10G is shown in FIG. 9A.

[0144] The imaging device 10G includes a color layer 147 in addition to the components of the imaging device 10B.

[0145] The colored layer 147 is located on the insulating layer 214, and a partition wall 216 is provided to cover the top and side surfaces of the colored layer 147. The colored layer 147 and the light-receiving device 110 are electrically insulated by the partition wall 216. Similarly, the colored layer 147 and the light-emitting device 190 are electrically insulated by the partition wall 216.

[0146] Materials that can be used for the colored layer 147 are similar to those for the colored layer 148a. Like the colored layers 148, 148a, and 148b described above, the colored layer 147 absorbs stray light generated in the imaging device 10G, thereby reducing the amount of stray light incident on the light receiving device 110. This reduces noise and increases the sensitivity of the sensor using the light receiving device 110.

[0147] Since the colored layers 148, 148a, 148b described above are configured to absorb light, depending on the material, they may have a lower resistivity than the partition wall 216. For example, a resin containing a pigment such as carbon black has a lower resistivity than a resin that does not contain the pigment. Therefore, depending on the material, providing any of the colored layers 148, 148a, 148b may cause current to leak to an adjacent light-emitting device or light-receiving device. For example, current leaking to an adjacent light-emitting device may cause a problem in which devices other than the desired light-emitting device emit light (also known as crosstalk).

[0148] On the other hand, the colored layer 147 is provided at a distance from each of the light receiving device 110 and the light emitting device 190. The colored layer 147 is electrically insulated from each of the light receiving device 110 and the light emitting device 190 by the partition wall 216. Therefore, even if the colored layer 147 is a layer with low resistivity, it is unlikely to affect the light receiving device 110 and the light emitting device 190. This is preferable because it widens the range of materials to be used for the colored layer 147. For example, a black matrix may be formed as the colored layer 147 using a metal material or the like.

[0149] [Imaging device 10H] A cross-sectional view of imaging device 10H is shown in FIG. 9B.

[0150] The imaging device 10H includes a color layer 148c in addition to the components of the imaging device 10B.

[0151] In the imaging device 10H, the partition 216 has an opening that reaches the insulating layer 214. The colored layer 148c has a portion that contacts the insulating layer 214 through the opening, a portion that contacts a side surface of the partition 216 inside the opening, and a portion that contacts an upper surface of the partition 216. The colored layer 148c and the light-receiving device 110 are electrically insulated by the partition 216. Similarly, the colored layer 148c and the light-emitting device 190 are electrically insulated by the partition 216.

[0152] The material that can be used for the colored layer 148c is the same as that for the colored layer 147. The colored layer 148c absorbs stray light generated in the imaging device 10H, thereby reducing the amount of stray light incident on the light receiving device 110. This reduces noise and increases the sensitivity of the sensor using the light receiving device 110.

[0153] The colored layer 148c is provided spaced apart from the light-receiving device 110 and the light-emitting device 190. The colored layer 148c is electrically insulated from the light-receiving device 110 and the light-emitting device 190 by the partition wall 216. Therefore, even if the colored layer 148c is a layer with low resistivity, it is unlikely to affect the light-receiving device 110 and the light-emitting device 190. This provides a wider range of materials to be used for the colored layer 148c, which is preferable.

[0154] [Imaging device 10J] A cross-sectional view of imaging device 10J is shown in FIG. 9C.

[0155] The imaging device 10J includes a color layer 148c in addition to the configuration of the imaging device 10D.

[0156] 8A to 8C and 9A to 9C, the imaging device of one embodiment of the present invention preferably includes one or more of the colored layers 148, 148a, 148b, 148c, and 147. This makes it possible to absorb stray light generated in the imaging device and reduce the amount of stray light incident on the light-receiving device 110. As a result, noise can be reduced and the sensitivity of the sensor using the light-receiving device 110 can be improved.

[0157] [Imaging devices 10K, 10L, 10M] FIG. 10A shows a cross-sectional view of the imaging device 10K, FIG. 10B shows a cross-sectional view of the imaging device 10L, and FIG. 10C shows a cross-sectional view of the imaging device 10M.

[0158] The imaging device 10K differs from the imaging device 10A in that it does not have the common layer 114, but has a buffer layer 184 and a buffer layer 194. The buffer layer 184 and the buffer layer 194 may each have a single-layer structure or a stacked structure.

[0159] In the imaging device 10K, the light receiving device 110 has a pixel electrode 111, a common layer 112, an active layer 113, a buffer layer 184, and a common electrode 115. In the imaging device 10K, the light emitting device 190 has a pixel electrode 191, a common layer 112, a light emitting layer 193, a buffer layer 194, and a common electrode 115.

[0160] The imaging device 10L differs from the imaging device 10A in that it does not have the common layer 112, but has a buffer layer 182 and a buffer layer 192. The buffer layer 182 and the buffer layer 192 may each have a single-layer structure or a stacked structure.

[0161] In the imaging device 10L, the light-receiving device 110 has a pixel electrode 111, a buffer layer 182, an active layer 113, a common layer 114, and a common electrode 115. In the imaging device 10L, the light-emitting device 190 has a pixel electrode 191, a buffer layer 192, a light-emitting layer 193, the common layer 114, and the common electrode 115.

[0162] The imaging device 10M differs from the imaging device 10A in that it does not have the common layer 112 and the common layer 114, but has the buffer layer 182, the buffer layer 184, the buffer layer 192, and the buffer layer 194.

[0163] In the imaging device 10M, the light-receiving device 110 has a pixel electrode 111, a buffer layer 182, an active layer 113, a buffer layer 184, and a common electrode 115. In the imaging device 10M, the light-emitting device 190 has a pixel electrode 191, a buffer layer 192, a light-emitting layer 193, a buffer layer 194, and the common electrode 115.

[0164] In the manufacture of the light receiving device 110 and the light emitting device 190, not only the active layer 113 and the light emitting layer 193 can be separately manufactured, but also other layers can be separately manufactured.

[0165] In the imaging device 10K, an example is shown in which a buffer layer 184 between the common electrode 115 and the active layer 113 and a buffer layer 194 between the common electrode 115 and the light-emitting layer 193 are separately formed. As the buffer layer 184, for example, an electron transport layer can be formed. As the buffer layer 194, for example, one or both of an electron injection layer and an electron transport layer can be formed.

[0166] In the imaging device 10L, an example is shown in which a buffer layer 182 between the pixel electrode 111 and the active layer 113 and a buffer layer 192 between the pixel electrode 191 and the light-emitting layer 193 are separately formed. As the buffer layer 182, for example, a hole transport layer can be formed. As the buffer layer 192, for example, one or both of a hole injection layer and a hole transport layer can be formed.

[0167] The imaging device 10M shows an example in which the light receiving device 110 and the light emitting device 190 do not have a common layer between a pair of electrodes (the pixel electrode 111 or the pixel electrode 191 and the common electrode 115). The light receiving device 110 and the light emitting device 190 of the imaging device 10M can be manufactured by forming the pixel electrode 111 and the pixel electrode 191 on the insulating layer 214 using the same material and in the same process, forming the buffer layer 182, the active layer 113, and the buffer layer 184 on the pixel electrode 111, forming the buffer layer 192, the light emitting layer 193, and the buffer layer 194 on the pixel electrode 191, and then forming the common electrode 115 to cover the pixel electrode 111, the buffer layer 182, the active layer 113, the buffer layer 184, the pixel electrode 191, the buffer layer 192, the light emitting layer 193, and the buffer layer 194. The order of forming the stacked structure of the buffer layer 182, the active layer 113, and the buffer layer 184 and the stacked structure of the buffer layer 192, the light emitting layer 193, and the buffer layer 194 is not particularly limited. For example, the buffer layer 192, the light emitting layer 193, and the buffer layer 194 may be formed after the buffer layer 182, the active layer 113, and the buffer layer 184 are formed. Conversely, the buffer layer 192, the light emitting layer 193, and the buffer layer 194 may be formed before the buffer layer 182, the active layer 113, and the buffer layer 184 are formed. Also, the buffer layer 182, the buffer layer 192, the active layer 113, the light emitting layer 193, and the like may be formed alternately in this order.

[0168] <Configuration example 3 of imaging device> Below, a more detailed configuration of the imaging device of one embodiment of the present invention will be described with reference to FIGS.

[0169] [Imaging device 100A] FIG. 11 shows a perspective view of the imaging device 100A, and FIG. 12 shows a cross-sectional view of the imaging device 100A.

[0170] Imaging device 100A has a configuration in which substrate 152 and substrate 151 are bonded together. In Fig. 11, substrate 152 is indicated by a dashed line.

[0171] The imaging device 100A can be said to be an imaging module having an imaging device according to one embodiment of the present invention, and at least one of a connector and an integrated circuit (IC). As the connector, a flexible printed circuit (FPC), a tape carrier package (TCP), or the like can be used. The integrated circuit (IC) can be mounted on the imaging module by a chip on glass (COG) method, a chip on film (COF) method, or the like. FIG. 11 shows an example in which an IC 173 and an FPC 172 are mounted on the imaging device 100A. The imaging device 100A also has an imaging unit 162, a circuit 164, wiring 165, and the like.

[0172] The circuit 164 can be, for example, a scanning line driver circuit.

[0173] The wiring 165 has a function of supplying signals and power to the imaging unit 162 and the circuit 164. The signals and power are input to the wiring 165 from the outside via the FPC 172 or from the IC 173.

[0174] 11 shows an example in which an IC 173 is provided on a substrate 151 by a COG method, a COF method, or the like. For example, an IC having a scanning line driving circuit or a signal line driving circuit can be used as the IC 173. Note that the imaging device 100A and the imaging module may be configured without an IC. Also, the IC may be mounted on an FPC by a COF method, or the like.

[0175] FIG. 12 shows an example of a cross section of the imaging device 100A shown in FIG. 11, where a portion of the area including the FPC 172, a portion of the area including the circuit 164, a portion of the area including the imaging unit 162, and a portion of the area including the end portion are cut away.

[0176] The imaging device 100A shown in FIG. 12 includes a transistor 201, a transistor 205, a transistor 206, a light emitting device 190, a light receiving device 110, and the like between a substrate 151 and a substrate 152. The imaging device 100A shown in FIG.

[0177] The substrate 152 and the insulating layer 214 are bonded via an adhesive layer 142. A solid sealing structure, a hollow sealing structure, or the like can be applied to seal the light emitting device 190 and the light receiving device 110. In FIG. 12, a space 143 surrounded by the substrate 152, the adhesive layer 142, and the insulating layer 214 is filled with an inert gas (nitrogen, argon, or the like), and a hollow sealing structure is applied. The adhesive layer 142 may be provided overlapping the light emitting device 190. In addition, the space 143 surrounded by the substrate 152, the adhesive layer 142, and the insulating layer 214 may be filled with a resin different from the adhesive layer 142.

[0178] The light-emitting device 190 has a layered structure in which a pixel electrode 191, a common layer 112, a light-emitting layer 193, a common layer 114, and a common electrode 115 are layered in this order from the insulating layer 214 side. The pixel electrode 191 is electrically connected to a conductive layer 222b of the transistor 206 through an opening provided in the insulating layer 214. The transistor 206 has a function of controlling driving of the light-emitting device 190. An end of the pixel electrode 191 is covered with a partition wall 216. The pixel electrode 191 contains a material that reflects visible light, and the common electrode 115 contains a material that transmits visible light.

[0179] The light receiving device 110 has a layered structure in which a pixel electrode 111, a common layer 112, an active layer 113, a common layer 114, and a common electrode 115 are layered in this order from the insulating layer 214 side. The pixel electrode 111 is electrically connected to a conductive layer 222b of the transistor 205 through an opening provided in the insulating layer 214. An end of the pixel electrode 111 is covered with a partition wall 216. The pixel electrode 111 contains a material that reflects visible light, and the common electrode 115 contains a material that transmits visible light.

[0180] Light emitted from the light emitting device 190 is emitted towards the substrate 152. Light is incident on the light receiving device 110 via the substrate 152 and the space 143. The substrate 152 is preferably made of a material that is highly transparent to visible light.

[0181] The pixel electrodes 111 and 191 can be manufactured using the same material and in the same process. The common layer 112, the common layer 114, and the common electrode 115 are used for both the light receiving device 110 and the light emitting device 190. The light receiving device 110 and the light emitting device 190 can have the same configuration except for the configurations of the active layer 113 and the light emitting layer 193. This allows the light receiving device 110 and the light receiving device 110 to be built into the imaging device 100A without significantly increasing the number of manufacturing steps.

[0182] A light-shielding layer BM is provided on the surface of the substrate 152 facing the substrate 151. The light-shielding layer BM has openings at a position overlapping the light-receiving device 110 and a position overlapping the light-emitting device 190. By providing the light-shielding layer BM, the range in which the light-receiving device 110 detects light can be controlled. Furthermore, by having the light-shielding layer BM, it is possible to prevent the light emitted by the light-emitting device 190 from being directly incident on the light-receiving device 110 without passing through an object. Therefore, a sensor with low noise and high sensitivity can be realized.

[0183] A transistor 201, a transistor 205, and a transistor 206 are all formed over a substrate 151. These transistors can be manufactured using the same material and through the same process.

[0184] An insulating layer 211, an insulating layer 213, an insulating layer 215, and an insulating layer 214 are provided over the substrate 151 in this order. A part of the insulating layer 211 functions as a gate insulating layer for each transistor. A part of the insulating layer 213 functions as a gate insulating layer for each transistor. The insulating layer 215 is provided to cover the transistors. The insulating layer 214 is provided to cover the transistors and functions as a planarizing layer. Note that the number of gate insulating layers and the number of insulating layers covering the transistors are not limited, and each may be a single layer or two or more layers.

[0185] It is preferable to use a material that does not easily diffuse impurities such as water or hydrogen for at least one of the insulating layers covering the transistors. This allows the insulating layer to function as a barrier layer. With this structure, it is possible to effectively prevent impurities from diffusing into the transistors from the outside, thereby improving the reliability of the imaging device.

[0186] It is preferable to use an inorganic insulating film as each of the insulating layers 211, 213, and 215. As the inorganic insulating film, for example, a silicon nitride film, a silicon oxynitride film, a silicon oxide film, a silicon nitride oxide film, an aluminum oxide film, an aluminum nitride film, or the like can be used. In addition, a hafnium oxide film, an yttrium oxide film, a zirconium oxide film, a gallium oxide film, a tantalum oxide film, a magnesium oxide film, a lanthanum oxide film, a cerium oxide film, a neodymium oxide film, or the like may be used. In addition, two or more of the above insulating films may be stacked.

[0187] Here, an organic insulating film often has a lower barrier property than an inorganic insulating film. Therefore, it is preferable that the organic insulating film has an opening near the end of the imaging device 100A. This makes it possible to suppress impurities from entering through the organic insulating film from the end of the imaging device 100A. Alternatively, the organic insulating film may be formed so that the end of the organic insulating film is located inside the end of the imaging device 100A, so that the organic insulating film is not exposed at the end of the imaging device 100A.

[0188] An organic insulating film is suitable for the insulating layer 214 that functions as a planarizing layer. Materials that can be used for the organic insulating film include acrylic resin, polyimide resin, epoxy resin, polyamide resin, polyimideamide resin, siloxane resin, benzocyclobutene resin, phenol resin, and precursors of these resins.

[0189] 12, an opening is formed in the insulating layer 214. This makes it possible to prevent impurities from entering the imaging section 162 from the outside through the insulating layer 214, even when an organic insulating film is used for the insulating layer 214. This makes it possible to improve the reliability of the imaging device 100A.

[0190] The transistor 201, the transistor 205, and the transistor 206 each have a conductive layer 221 functioning as a gate, an insulating layer 211 functioning as a gate insulating layer, a conductive layer 222a and a conductive layer 222b functioning as a source and a drain, a semiconductor layer 231, an insulating layer 213 functioning as a gate insulating layer, and a conductive layer 223 functioning as a gate. Here, the same hatched pattern is applied to a plurality of layers obtained by processing the same conductive film. The insulating layer 211 is located between the conductive layer 221 and the semiconductor layer 231. The insulating layer 213 is located between the conductive layer 223 and the semiconductor layer 231.

[0191] The structure of the transistor included in the imaging device of this embodiment is not particularly limited. For example, a planar transistor, a staggered transistor, an inverted staggered transistor, or the like can be used. In addition, either a top-gate transistor or a bottom-gate transistor may be used. Alternatively, gates may be provided above and below a semiconductor layer in which a channel is formed.

[0192] The transistor 201, the transistor 205, and the transistor 206 have a structure in which a semiconductor layer in which a channel is formed is sandwiched between two gates. The two gates may be connected and the same signal may be supplied to the gates to drive the transistors. Alternatively, the threshold voltage of the transistors may be controlled by supplying a potential for controlling the threshold voltage to one of the two gates and a potential for driving to the other gate.

[0193] The crystallinity of a semiconductor material used in a transistor is not particularly limited, and any of an amorphous semiconductor and a crystalline semiconductor (a microcrystalline semiconductor, a polycrystalline semiconductor, a single crystal semiconductor, or a semiconductor partially having a crystalline region) may be used. The use of a crystalline semiconductor is preferable because it can suppress deterioration of transistor characteristics.

[0194] The semiconductor layer of the transistor preferably contains a metal oxide (also referred to as an oxide semiconductor). Alternatively, the semiconductor layer of the transistor may contain silicon. Examples of silicon include amorphous silicon and crystalline silicon (such as low-temperature polysilicon and single crystal silicon).

[0195] The semiconductor layer preferably contains, for example, indium, M (M is one or more selected from gallium, aluminum, silicon, boron, yttrium, tin, copper, vanadium, beryllium, titanium, iron, nickel, germanium, zirconium, molybdenum, lanthanum, cerium, neodymium, hafnium, tantalum, tungsten, and magnesium), and zinc. In particular, M is preferably one or more selected from aluminum, gallium, yttrium, and tin.

[0196] In particular, it is preferable to use an oxide containing indium (In), gallium (Ga), and zinc (Zn) (also referred to as IGZO) as the semiconductor layer.

[0197] When the semiconductor layer is an In-M-Zn oxide, the sputtering target used to deposit the In-M-Zn oxide preferably has an atomic ratio of In equal to or greater than the atomic ratio of M. Examples of atomic ratios of metal elements in such sputtering targets include In:M:Zn=1:1:1, In:M:Zn=1:1:1.2, In:M:Zn=2:1:3, In:M:Zn=3:1:2, In:M:Zn=4:2:3, In:M:Zn=4:2:4.1, In:M:Zn=5:1:6, In:M:Zn=5:1:7, In:M:Zn=5:1:8, In:M:Zn=6:1:6, In:M:Zn=5:2:5, and the like.

[0198] It is preferable to use a target containing a polycrystalline oxide as the sputtering target, since it is easy to form a semiconductor layer having crystallinity. The atomic ratio of the semiconductor layer to be formed includes a variation of ±40% of the atomic ratio of the metal elements contained in the sputtering target. For example, when the composition of the sputtering target used for the semiconductor layer is In:Ga:Zn=4:2:4.1 [atomic ratio], the composition of the semiconductor layer to be formed may be close to In:Ga:Zn=4:2:3 [atomic ratio].

[0199] When the atomic ratio is described as In:Ga:Zn=4:2:3 or thereabout, this includes the case where, when the atomic ratio of In is 4, the atomic ratio of Ga is 1 or more and 3 or less, and the atomic ratio of Zn is 2 or more and 4 or less. When the atomic ratio of In is described as In:Ga:Zn=5:1:6 or thereabout, this includes the case where, when the atomic ratio of In is 5, the atomic ratio of Ga is more than 0.1 and 2 or less, and the atomic ratio of Zn is 5 or more and 7 or less. When the atomic ratio of In is described as In:Ga:Zn=1:1:1 or thereabout, this includes the case where, when the atomic ratio of In is 1, the atomic ratio of Ga is more than 0.1 and 2 or less, and the atomic ratio of Zn is more than 0.1 and 2 or less.

[0200] The transistors included in the circuit 164 and the transistors included in the imaging section 162 may have the same structure or different structures. The transistors included in the circuit 164 may all have the same structure or may have two or more types. Similarly, the transistors included in the imaging section 162 may all have the same structure or may have two or more types.

[0201] A connection portion 204 is provided in an area of ​​the substrate 151 where the substrate 152 does not overlap. In the connection portion 204, the wiring 165 is electrically connected to the FPC 172 via a conductive layer 166 and a connection layer 242. On the upper surface of the connection portion 204, the conductive layer 166 obtained by processing the same conductive film as the pixel electrode 191 is exposed. This allows the connection portion 204 and the FPC 172 to be electrically connected via the connection layer 242.

[0202] Various optical members can be disposed on the outside of the substrate 152. Examples of optical members include a polarizing plate, a retardation plate, a light diffusion layer (such as a diffusion film), an anti-reflection layer, and a light collecting film. In addition, an antistatic film that suppresses adhesion of dust, a water-repellent film that makes it difficult for dirt to adhere, a hard coat film that suppresses the occurrence of scratches due to use, an impact absorbing layer, and the like may be disposed on the outside of the substrate 152.

[0203] The substrate 151 and the substrate 152 can each be made of glass, quartz, ceramic, sapphire, resin, etc. If the substrate 151 and the substrate 152 are made of a flexible material, the flexibility of the imaging device can be increased.

[0204] As the adhesive layer, various curing adhesives such as photocuring adhesives such as ultraviolet curing adhesives, reaction curing adhesives, heat curing adhesives, and anaerobic adhesives can be used. Examples of these adhesives include epoxy resins, acrylic resins, silicone resins, phenolic resins, polyimide resins, imide resins, PVC (polyvinyl chloride) resins, PVB (polyvinyl butyral) resins, and EVA (ethylene vinyl acetate) resins. In particular, materials with low moisture permeability such as epoxy resins are preferable. Two-liquid mixed resins may also be used. Adhesive sheets, etc. may also be used.

[0205] The connection layer 242 may be made of an anisotropic conductive film (ACF), an anisotropic conductive paste (ACP), or the like.

[0206] The light emitting device 190 may be of a top emission type, a bottom emission type, a dual emission type, etc. A conductive film that transmits visible light is used for the electrode on the side from which light is extracted. It is preferable to use a conductive film that reflects visible light for the electrode on the side from which light is not extracted.

[0207] The light-emitting device 190 has at least a light-emitting layer 193. The light-emitting device 190 may further have a layer containing a substance with high hole injection properties, a substance with high hole transport properties, a hole blocking material, a substance with high electron transport properties, a substance with high electron injection properties, or a bipolar substance (a substance with high electron transport properties and hole transport properties) as a layer other than the light-emitting layer 193. For example, the common layer 112 preferably has one or both of a hole injection layer and a hole transport layer. For example, the common layer 114 preferably has one or both of an electron transport layer and an electron injection layer.

[0208] Either a low molecular weight compound or a high molecular weight compound may be used for the common layer 112, the light emitting layer 193, and the common layer 114, and may contain an inorganic compound. The layers constituting the common layer 112, the light emitting layer 193, and the common layer 114 can be formed by a deposition method (including a vacuum deposition method), a transfer method, a printing method, an inkjet method, a coating method, or the like.

[0209] The light-emitting layer 193 may contain an inorganic compound such as quantum dots as a light-emitting material.

[0210] The active layer 113 of the light-receiving device 110 includes a semiconductor. Examples of the semiconductor include inorganic semiconductors such as silicon, and organic semiconductors including organic compounds. In this embodiment, an example in which an organic semiconductor is used as the semiconductor of the active layer is shown. By using an organic semiconductor, the light-emitting layer 193 of the light-emitting device 190 and the active layer 113 of the light-receiving device 110 can be formed by the same method (for example, vacuum deposition method), which is preferable because the manufacturing equipment can be shared.

[0211] The active layer 113 is made of an n-type semiconductor material such as fullerene (e.g., C 60 , C 70 Examples of the p-type semiconductor material of the active layer 113 include an electron-accepting organic semiconductor material such as copper(II) phthalocyanine (CuPc) or a derivative thereof. Examples of the p-type semiconductor material of the active layer 113 include an electron-donating organic semiconductor material such as copper(II) phthalocyanine (CuPc) or tetraphenyldibenzoperiflanthene (DBP).

[0212] For example, the active layer 113 is preferably formed by co-evaporation of an n-type semiconductor and a p-type semiconductor.

[0213] Materials that can be used for the gate, source, and drain of a transistor, as well as conductive layers such as various wirings and electrodes that constitute an imaging device, include metals such as aluminum, titanium, chromium, nickel, copper, yttrium, zirconium, molybdenum, silver, tantalum, and tungsten, as well as alloys containing such metals as the main component, etc. Films containing these materials can be used as a single layer or a laminated structure.

[0214] As the conductive material having light transmitting properties, conductive oxides such as indium oxide, indium tin oxide, indium zinc oxide, zinc oxide, zinc oxide containing gallium, or graphene can be used. Alternatively, metal materials such as gold, silver, platinum, magnesium, nickel, tungsten, chromium, molybdenum, iron, cobalt, copper, palladium, and titanium, or alloy materials containing the metal materials can be used. Alternatively, nitrides of the metal materials (for example, titanium nitride) may be used. Note that when using metal materials or alloy materials (or their nitrides), it is preferable to make them thin enough to have light transmitting properties. Also, a laminated film of the above materials can be used as the conductive layer. For example, it is preferable to use a laminated film of an alloy of silver and magnesium and indium tin oxide, because it can increase the conductivity. These can also be used for conductive layers such as various wirings and electrodes constituting an imaging device, and conductive layers (conductive layers functioning as pixel electrodes or common electrodes) of a light receiving device.

[0215] Examples of insulating materials that can be used for each insulating layer include resins such as acrylic resin and epoxy resin, and inorganic insulating materials such as silicon oxide, silicon oxynitride, silicon nitride oxide, silicon nitride, and aluminum oxide.

[0216] [Imaging device 100B] A cross-sectional view of the imaging device 100B is shown in FIG. 13A.

[0217] The imaging device 100B differs from the imaging device 100A mainly in that the imaging device 100B has a lens 149 and a protective layer 195.

[0218] By providing the protective layer 195 covering the light receiving device 110 and the light emitting device 190, impurities such as water can be prevented from entering the light receiving device 110 and the light emitting device 190, and the reliability of the light receiving device 110 and the light emitting device 190 can be improved.

[0219] In a region 228 near the end of the imaging device 100B, it is preferable that the insulating layer 215 and the protective layer 195 contact each other through the opening in the insulating layer 214. In particular, it is preferable that the inorganic insulating film of the insulating layer 215 and the inorganic insulating film of the protective layer 195 contact each other. This makes it possible to suppress impurities from entering the imaging section 162 from the outside through the organic insulating film. Therefore, it is possible to improve the reliability of the imaging device 100B.

[0220] Fig. 13B shows an example of a three-layer structure of the protective layer 195. In Fig. 13B, the protective layer 195 has an inorganic insulating layer 195a on the common electrode 115, an organic insulating layer 195b on the inorganic insulating layer 195a, and an inorganic insulating layer 195c on the organic insulating layer 195b.

[0221] The end of the inorganic insulating layer 195a and the end of the inorganic insulating layer 195c extend outward beyond the end of the organic insulating layer 195b and are in contact with each other. The inorganic insulating layer 195a is in contact with the insulating layer 215 (inorganic insulating layer) through an opening in the insulating layer 214 (organic insulating layer). This allows the insulating layer 215 and the protective layer 195 to surround the light receiving device 110 and the light emitting device 190, thereby improving the reliability of the light receiving device 110 and the light emitting device 190.

[0222] In this way, the protective layer 195 may have a laminated structure of an organic insulating film and an inorganic insulating film. In this case, it is preferable that the end of the inorganic insulating film extends further outward than the end of the organic insulating film.

[0223] A lens 149 is provided on the surface of the substrate 152 facing the substrate 151. The lens 149 has a convex surface facing the substrate 151. It is preferable that the light receiving region of the light receiving device 110 overlaps with the lens 149 and does not overlap with the light emitting layer 193. This can improve the sensitivity and accuracy of a sensor using the light receiving device 110.

[0224] The lens 149 preferably has a refractive index of 1.3 or more and 2.5 or less. The lens 149 can be formed using at least one of an inorganic material and an organic material. For example, a material containing a resin can be used for the lens 149. Also, a material containing at least one of an oxide and a sulfide can be used for the lens 149.

[0225] Specifically, a resin containing chlorine, bromine, or iodine, a resin containing a heavy metal atom, a resin containing an aromatic ring, a resin containing sulfur, or the like can be used for the lens 149. Alternatively, a material containing a resin and nanoparticles of a material having a higher refractive index than the resin can be used for the lens 149. Titanium oxide, zirconium oxide, or the like can be used for the nanoparticles.

[0226] Cerium oxide, hafnium oxide, lanthanum oxide, magnesium oxide, niobium oxide, tantalum oxide, titanium oxide, yttrium oxide, zinc oxide, an oxide containing indium and tin, or an oxide containing indium, gallium, and zinc can be used for the lens 149. Alternatively, zinc sulfide or the like can be used for the lens 149.

[0227] In the imaging device 100B, the protective layer 195 and the substrate 152 are bonded together by an adhesive layer 142. The adhesive layer 142 is provided so as to overlap the light receiving device 110 and the light emitting device 190, respectively, and a solid sealing structure is applied to the imaging device 100B.

[0228] [Imaging device 100C] A cross-sectional view of the imaging device 100C is shown in FIG. 14A.

[0229] The imaging device 100C differs from the imaging device 100B in the structure of the transistors.

[0230] The imaging device 100C includes a transistor 208, a transistor 209, and a transistor 210 over a substrate 151.

[0231] The transistor 208, the transistor 209, and the transistor 210 each include a conductive layer 221 functioning as a gate, an insulating layer 211 functioning as a gate insulating layer, a semiconductor layer having a channel formation region 231i and a pair of low-resistance regions 231n, a conductive layer 222a connected to one of the pair of low-resistance regions 231n, a conductive layer 222b connected to the other of the pair of low-resistance regions 231n, an insulating layer 225 functioning as a gate insulating layer, a conductive layer 223 functioning as a gate, and an insulating layer 215 covering the conductive layer 223. The insulating layer 211 is located between the conductive layer 221 and the channel formation region 231i. The insulating layer 225 is located between the conductive layer 223 and the channel formation region 231i.

[0232] The conductive layer 222a and the conductive layer 222b are connected to the low-resistance region 231n through openings provided in the insulating layer 225 and the insulating layer 215, respectively. One of the conductive layer 222a and the conductive layer 222b functions as a source, and the other functions as a drain.

[0233] The pixel electrode 191 of the light emitting device 190 is electrically connected to one of a pair of low resistance regions 231n of the transistor 208 via the conductive layer 222b.

[0234] The pixel electrode 111 of the light receiving device 110 is electrically connected to the other of the pair of low resistance regions 231n of the transistor 209 via the conductive layer 222b.

[0235] The transistors 208, 209, and 210 shown in FIG. 14A show an example in which the insulating layer 225 covers the top and side surfaces of the semiconductor layer. On the other hand, in the transistor 202 shown in FIG. 14B, the insulating layer 225 overlaps with the channel formation region 231i of the semiconductor layer 231, but does not overlap with the low-resistance region 231n. For example, the structure shown in FIG. 14B can be manufactured by processing the insulating layer 225 using the conductive layer 223 as a mask. In FIG. 14B, the insulating layer 215 is provided to cover the insulating layer 225 and the conductive layer 223, and the conductive layer 222a and the conductive layer 222b are connected to the low-resistance region 231n through the openings in the insulating layer 215. Furthermore, an insulating layer 218 may be provided to cover the transistor.

[0236] The imaging device 100C differs from the imaging device 100B in that it has a color layer 147.

[0237] The color layer 147 is located on the insulating layer 214 , and the partition wall 216 is provided so as to cover the upper surface and side surfaces of the color layer 147 .

[0238] In Fig. 14A, the color layer 147 and the light receiving device 110 are spaced apart from each other. Similarly, the color layer 147 and the light emitting device 190 are spaced apart from each other. The arrangement of the color layer 147 is not limited to that shown in Fig. 14A. As shown in Fig. 14C, the color layer 147 may cover one or both of the ends of the pixel electrode 111 and the pixel electrode 191.

[0239] 14A, the colored layer 147 is provided apart from the light-receiving device 110 and the light-emitting device 190, and therefore even if the colored layer 147 is a layer with low resistivity, it is unlikely to affect the light-receiving device 110 and the light-emitting device 190. Therefore, the range of materials to be used for the colored layer 147 is widened, which is preferable.

[0240] 14C, the colored layer 147 covers the ends of the pixel electrodes 111 and 191, so that the area in which the colored layer 147 is provided can be made larger. The larger the area in which the colored layer 147 is provided, the more stray light generated in the imaging device can be absorbed by the colored layer 147, and the less amount of stray light entering the light receiving device 110 can be reduced, which is preferable. This reduces noise and increases the sensitivity of the sensor using the light receiving device 110.

[0241] [Imaging device 100D] A cross-sectional view of the imaging device 100D is shown in FIG.

[0242] The imaging device 100D differs from the imaging device 100C in that it does not have the colored layer 147 but has a colored layer 148a.

[0243] The colored layer 148 a has a portion in contact with the upper surface of the pixel electrode 111 of the light receiving device 110 and a portion in contact with the side surface of the partition wall 216 .

[0244] The colored layer 148a absorbs stray light generated in the imaging device 100D, thereby reducing the amount of stray light incident on the light receiving device 110. This reduces noise and increases the sensitivity of a sensor using the light receiving device 110.

[0245] The imaging device 100D differs from the imaging device 100C in that it does not have the substrate 151 and the substrate 152, but has the substrate 153, the substrate 154, the adhesive layer 155, and the insulating layer 212.

[0246] The substrate 153 and the insulating layer 212 are bonded together by an adhesive layer 155. The substrate 154 and the protective layer 195 are bonded together by an adhesive layer 142.

[0247] The imaging device 100D is manufactured by transferring the insulating layer 212, the transistor 208, the transistor 209, the transistor 210, the light receiving device 110, the light emitting device 190, and the like, which are formed on a manufacturing substrate, onto the substrate 153. Each of the substrate 153 and the substrate 154 is preferably flexible. This can increase the flexibility of the imaging device 100D.

[0248] The insulating layer 212 can be formed using the inorganic insulating film that can be used for the insulating layers 211, 213, and 215.

[0249] The imaging device 100C shows an example that does not have a lens 149, while the imaging device 100D shows an example that has a lens 149. The lens 149 can be provided as appropriate depending on the application of the sensor, etc.

[0250] <Metal oxide> Metal oxides that can be used for the semiconductor layer will be described below.

[0251] In this specification and the like, metal oxides containing nitrogen may also be collectively referred to as metal oxides. Metal oxides containing nitrogen may also be referred to as metal oxynitrides. For example, metal oxides containing nitrogen, such as zinc oxynitride (ZnON), may be used for the semiconductor layer.

[0252] In this specification, etc., the term CAAC (c-axis aligned crystal) and CAC (Cloud-Aligned Composite) may be used. CAAC represents an example of a crystal structure, and CAC represents an example of a function or material configuration.

[0253] For example, the semiconductor layer can be made of a cloud-aligned composite (CAC)-oxide semiconductor (OS).

[0254] CAC-OS is a material in which some of the material has a conductive function and some of the material has an insulating function, and the material as a whole functions as a semiconductor. When CAC-OS is used in the semiconductor layer of a transistor, the conductive function is a function of allowing electrons (or holes) to flow as carriers, and the insulating function is a function of not allowing electrons to flow as carriers. By making the conductive function and the insulating function act in a complementary manner, it is possible to give the CAC-OS a switching function (on / off function). By separating the respective functions in CAC-OS, it is possible to maximize both functions.

[0255] CAC-OS has a conductive region and an insulating region. The conductive region has the above-mentioned conductive function, and the insulating region has the above-mentioned insulating function. In addition, in the material, the conductive region and the insulating region may be separated at the nanoparticle level. In addition, the conductive region and the insulating region may be unevenly distributed in the material. In addition, the conductive region may be observed to be connected in a cloud shape with a blurred periphery.

[0256] In the CAC-OS, the conductive regions and the insulating regions may each be dispersed in the material with a size of 0.5 nm or more and 10 nm or less, preferably 0.5 nm or more and 3 nm or less.

[0257] The CAC-OS is composed of components having different band gaps. For example, the CAC-OS is composed of a component having a wide gap due to an insulating region and a component having a narrow gap due to a conductive region. In this configuration, when carriers are caused to flow, the carriers mainly flow in the component having the narrow gap. In addition, the component having the narrow gap acts complementarily to the component having the wide gap, and carriers also flow in the component having the wide gap in conjunction with the component having the narrow gap. Therefore, when the above-mentioned CAC-OS is used in the channel formation region of a transistor, a high current driving force, that is, a large on-current and a high field effect mobility can be obtained in the on-state of the transistor.

[0258] That is, CAC-OS can also be called a matrix composite or a metal matrix composite.

[0259] Oxide semiconductors (metal oxides) are classified into single-crystal oxide semiconductors and other non-single-crystal oxide semiconductors, such as c-axis aligned crystalline oxide semiconductors (CAAC-OS), polycrystalline oxide semiconductors, nanocrystalline oxide semiconductors (nc-OS), amorphous-like oxide semiconductors (a-like OS), and amorphous oxide semiconductors.

[0260] CAAC-OS has a c-axis orientation and a distorted crystal structure in which multiple nanocrystals are connected in the ab-plane direction. The distortion refers to a portion where the lattice orientation changes between a region with a uniform lattice arrangement and a region with a different uniform lattice arrangement in the region where multiple nanocrystals are connected.

[0261] Nanocrystals are basically hexagonal, but may be non-regular hexagonal. In addition, the lattice arrangement may be pentagonal or heptagonal due to the distortion. In CAAC-OS, it is difficult to confirm clear grain boundaries even in the vicinity of the distortion. In other words, it is found that the formation of grain boundaries is suppressed by the distortion of the lattice arrangement. This is because CAAC-OS can tolerate distortion due to the fact that the arrangement of oxygen atoms in the ab-plane direction is not dense and the bond distance between atoms changes due to the substitution of metal elements.

[0262] CAAC-OS tends to have a layered crystal structure (also referred to as a layered structure) in which a layer containing indium and oxygen (hereinafter, In layer) and a layer containing element M, zinc, and oxygen (hereinafter, (M, Zn) layer) are stacked. Note that indium and element M can be substituted for each other, and when element M in an (M, Zn) layer is substituted for indium, it can also be represented as an (In, M, Zn) layer. When indium in an In layer is substituted for element M, it can also be represented as an (In, M) layer.

[0263] CAAC-OS is a metal oxide with high crystallinity. On the other hand, it is difficult to confirm clear crystal boundaries in CAAC-OS, so it is said that the decrease in electron mobility caused by crystal boundaries is unlikely to occur. In addition, since the crystallinity of metal oxides can be decreased by the inclusion of impurities or the generation of defects, CAAC-OS is unlikely to have impurities or defects (oxygen vacancies (V O : It is also called oxygen vacancy. ) Therefore, metal oxides with CAAC-OS have stable physical properties. Therefore, metal oxides with CAAC-OS are resistant to heat and highly reliable.

[0264] The nc-OS has periodic atomic arrangement in a microscopic region (for example, a region of 1 nm to 10 nm, particularly a region of 1 nm to 3 nm). In addition, the nc-OS does not show regularity in the crystal orientation between different nanocrystals. Therefore, no orientation is seen throughout the film. Therefore, depending on the analysis method, the nc-OS may be indistinguishable from an a-like OS or an amorphous oxide semiconductor.

[0265] Indium-gallium-zinc oxide (hereinafter referred to as IGZO), a type of metal oxide containing indium, gallium, and zinc, may have a stable structure when made into the above-mentioned nanocrystals. In particular, since IGZO tends to have difficulty in crystal growth in the atmosphere, it may be structurally more stable when made into small crystals (for example, the above-mentioned nanocrystals) rather than large crystals (here, crystals of several mm or several cm).

[0266] The a-like OS is a metal oxide having a structure between the nc-OS and an amorphous oxide semiconductor. The a-like OS has a pore or low-density region. That is, the a-like OS has lower crystallinity than the nc-OS and CAAC-OS.

[0267] Oxide semiconductors (metal oxides) have a variety of structures and each structure has different characteristics. The oxide semiconductor of one embodiment of the present invention may include two or more of an amorphous oxide semiconductor, a polycrystalline oxide semiconductor, an a-like OS, an nc-OS, and a CAAC-OS.

[0268] The metal oxide film functioning as the semiconductor layer can be formed using either one or both of an inert gas and an oxygen gas. The flow rate ratio of oxygen (oxygen partial pressure) during the formation of the metal oxide film is not particularly limited. However, in order to obtain a transistor with high field effect mobility, the flow rate ratio of oxygen (oxygen partial pressure) during the formation of the metal oxide film is preferably 0% or more and 30% or less, more preferably 5% or more and 30% or less, and even more preferably 7% or more and 15% or less.

[0269] The energy gap of the metal oxide is preferably 2 eV or more, more preferably 2.5 eV or more, and further preferably 2.7 eV or more. By using a metal oxide having such a wide energy gap, the off-current of the transistor can be reduced.

[0270] The substrate temperature during deposition of the metal oxide film is preferably 350° C. or lower, more preferably room temperature or higher and 200° C. or lower, and further preferably room temperature or higher and 130° C. or lower. When the substrate temperature during deposition of the metal oxide film is room temperature, productivity can be increased, which is preferable.

[0271] The metal oxide film can be formed by a sputtering method, or by other methods such as PLD, PECVD, thermal CVD, ALD, and vacuum deposition.

[0272] As described above, the imaging device according to the present embodiment has a light receiving device and a light emitting device in the imaging section, which allows the electronic device to be made smaller and lighter than when the light emitting device is provided outside the imaging section.

[0273] At least one layer of the light receiving device other than the active layer can be made to have a common structure with the light emitting device (EL element). Furthermore, all layers of the light receiving device other than the active layer can be made to have a common structure with the light emitting device (EL element). For example, the light emitting device and the light receiving device can be formed on the same substrate by simply adding a process of forming an active layer to the manufacturing process of the light emitting device. Furthermore, the pixel electrodes and the common electrodes of the light receiving device and the light emitting device can be formed from the same material and in the same process. Furthermore, the manufacturing process of the imaging device can be simplified by manufacturing a circuit electrically connected to the light receiving device and a circuit electrically connected to the light emitting device from the same material and in the same process. In this way, a highly convenient imaging device can be manufactured by incorporating a light emitting device and a light receiving device without a complicated process.

[0274] The imaging device of the present embodiment has a colored layer between the light receiving device and the light emitting device. The colored layer may also serve as a partition wall that electrically insulates the light receiving device and the light emitting device. The colored layer can absorb stray light in the imaging device, thereby increasing the sensitivity of a sensor that uses the light receiving device.

[0275] This embodiment mode can be combined with other embodiment modes as appropriate. In addition, in the case where a plurality of configuration examples are shown in one embodiment mode in this specification, the configuration examples can be combined as appropriate.

[0276] (Embodiment 2) In this embodiment, an imaging device of one embodiment of the present invention will be described with reference to FIGS.

[0277] An imaging device according to one embodiment of the present invention includes a first pixel circuit having a light receiving device and a second pixel circuit having a light emitting device, the first pixel circuit and the second pixel circuit being arranged in a matrix.

[0278] FIG. 16A shows an example of a first pixel circuit having a light receiving device, and FIG. 16B shows an example of a second pixel circuit having a light emitting device.

[0279] 16A includes a light receiving device PD, a transistor M1, a transistor M2, a transistor M3, a transistor M4, and a capacitance element C1. Here, an example is shown in which a photodiode is used as the light receiving device PD.

[0280] The light receiving device PD has a cathode electrically connected to the wiring V1 and an anode electrically connected to one of the source or drain of the transistor M1. The transistor M1 has a gate electrically connected to the wiring TX and the other of the source or drain electrically connected to one electrode of the capacitance element C1, one of the source or drain of the transistor M2, and the gate of the transistor M3. The transistor M2 has a gate electrically connected to the wiring RES and the other of the source or drain electrically connected to the wiring V2. The transistor M3 has a source or drain electrically connected to the wiring V3 and the other of the source or drain electrically connected to one of the source or drain of the transistor M4. The transistor M4 has a gate electrically connected to the wiring SE and the other of the source or drain electrically connected to the wiring OUT1.

[0281] A constant potential is supplied to the wiring V1, the wiring V2, and the wiring V3. When the light receiving device PD is driven with a reverse bias, a potential lower than the potential of the wiring V1 is supplied to the wiring V2. The transistor M2 is controlled by a signal supplied to the wiring RES, and has a function of resetting the potential of the node connected to the gate of the transistor M3 to the potential supplied to the wiring V2. The transistor M1 is controlled by a signal supplied to the wiring TX, and has a function of controlling the timing at which the potential of the node changes according to the current flowing through the light receiving device PD. The transistor M3 functions as an amplifying transistor that outputs according to the potential of the node. The transistor M4 is controlled by a signal supplied to the wiring SE, and functions as a selection transistor for reading out the output according to the potential of the node in an external circuit connected to the wiring OUT1. The connection relationship between the cathode and the anode of the light receiving device PD may be reversed from that shown in FIG. 16A.

[0282] The pixel circuit PIX2 shown in Fig. 16B includes a light-emitting device EL, a transistor M5, a transistor M6, a transistor M7, and a capacitance element C2. Here, an example is shown in which a light-emitting diode is used as the light-emitting device EL. In particular, it is preferable to use an organic EL element as the light-emitting device EL.

[0283] The transistor M5 has a gate electrically connected to the wiring VG, one of its source and drain electrically connected to the wiring VS, and the other of its source and drain electrically connected to one electrode of the capacitance element C2 and the gate of the transistor M6. One of the source and drain of the transistor M6 is electrically connected to the wiring V4, and the other is electrically connected to the anode of the light-emitting device EL and one of the source and drain of the transistor M7. The transistor M7 has a gate electrically connected to the wiring MS, and the other of its source and drain electrically connected to the wiring OUT2. The cathode of the light-emitting device EL is electrically connected to the wiring V5.

[0284] A constant potential is supplied to the wiring V4 and the wiring V5. The anode side of the light emitting device EL can be set to a high potential, and the cathode side can be set to a lower potential than the anode side. The transistor M5 is controlled by a signal supplied to the wiring VG, and functions as a selection transistor for controlling the selection state of the pixel circuit PIX2. The transistor M6 also functions as a drive transistor for controlling the current flowing through the light emitting device EL according to the potential supplied to the gate. When the transistor M5 is in a conductive state, the potential supplied to the wiring VS is supplied to the gate of the transistor M6, and the light emission brightness of the light emitting device EL can be controlled according to the potential. The transistor M7 is controlled by a signal supplied to the wiring MS, and has a function of outputting the potential between the transistor M6 and the light emitting device EL to the outside via the wiring OUT2.

[0285] The wiring V1 to which the cathode of the light receiving device PD is electrically connected and the wiring V5 to which the cathode of the light emitting device EL is electrically connected can be in the same layer and have the same potential.

[0286] In the imaging device of the present embodiment, an image may be captured by emitting light from the light emitting device in a pulsed manner. By shortening the driving time of the light emitting device, it is possible to reduce the power consumption of the imaging device and suppress heat generation. In particular, organic EL elements are suitable because they have excellent frequency characteristics. The frequency can be, for example, 1 kHz or more and 100 MHz or less.

[0287] Here, it is preferable that the transistors M1, M2, M3, and M4 in the pixel circuit PIX1, and the transistors M5, M6, and M7 in the pixel circuit PIX2 are transistors that use a metal oxide (oxide semiconductor) in the semiconductor layer in which a channel is formed.

[0288] A transistor using a metal oxide, which has a wider band gap and a lower carrier density than silicon, can achieve an extremely small off-state current. Therefore, the small off-state current allows the charge stored in the capacitor connected in series to the transistor to be held for a long period of time. Therefore, it is preferable to use transistors using an oxide semiconductor for the transistor M1, the transistor M2, and the transistor M5 connected in series to the capacitor C1 or the capacitor C2 in particular. In addition, by using transistors using an oxide semiconductor for the other transistors as well, the manufacturing cost can be reduced.

[0289] The transistors M1 to M7 may be transistors in which silicon is used as a semiconductor in which a channel is formed. In particular, the use of silicon with high crystallinity, such as single crystal silicon or polycrystalline silicon, is preferable because high field-effect mobility can be achieved and faster operation can be achieved.

[0290] A structure in which an oxide semiconductor is used for at least one of the transistors M1 to M7 and silicon is used for the remaining transistors may be used.

[0291] Note that although the transistors are depicted as n-channel transistors in FIGS. 16A and 16B, p-channel transistors can also be used.

[0292] The transistors of the pixel circuit PIX1 and the transistors of the pixel circuit PIX2 are preferably formed side by side on the same substrate. In particular, it is preferable that the transistors of the pixel circuit PIX1 and the transistors of the pixel circuit PIX2 are mixed and periodically arranged in one region.

[0293] It is preferable to provide one or more layers having transistors and / or capacitors at positions overlapping the light receiving device PD or the light emitting device EL, thereby reducing the effective area occupied by each pixel circuit and realizing a high-definition imaging section.

[0294] This embodiment mode can be combined with other embodiment modes as appropriate.

[0295] (Embodiment 3) In this embodiment, electronic devices of one embodiment of the present invention will be described with reference to FIGS.

[0296] The electronic device of this embodiment includes the imaging device of one embodiment of the present invention. For example, the imaging device of one embodiment of the present invention can be applied to a display portion of an electronic device. Since the imaging device of one embodiment of the present invention has a function of detecting light, it can perform biometric authentication or detect touch or near-touch in the display portion. This can improve the functionality, convenience, and the like of the electronic device.

[0297] Examples of electronic devices include electronic devices with relatively large screens such as television sets, desktop or notebook personal computers, computer monitors, digital signage, large game machines such as pachinko machines, as well as digital cameras, digital video cameras, digital photo frames, mobile phones, portable game machines, personal digital assistants, and audio playback devices.

[0298] The electronic device of this embodiment may have a sensor (including a function to measure force, displacement, position, velocity, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substances, sound, time, hardness, electric field, current, voltage, power, radiation, flow rate, humidity, gradient, vibration, odor, or infrared rays).

[0299] The electronic device of the present embodiment can have various functions, such as a function of displaying various information (still images, videos, text images, etc.) on a display unit, a touch panel function, a function of displaying a calendar, date, time, etc., a function of executing various software (programs), a wireless communication function, a function of reading out a program or data recorded on a recording medium, etc.

[0300] Electronic device 6500 shown in FIG. 17A is a portable information terminal that can be used as a smartphone.

[0301] The electronic device 6500 includes a housing 6501, a display portion 6502, a power button 6503, an operation button 6504, a speaker 6505, a microphone 6506, a camera 6507, and a light source 6508. The display portion 6502 has a touch panel function.

[0302] The imaging device of one embodiment of the present invention can be applied to the display portion 6502.

[0303] FIG. 17B is a schematic cross-sectional view including the end of the housing 6501 on the microphone 6506 side.

[0304] A light-transmitting protective member 6510 is provided on the display surface side of the housing 6501, and a display panel 6511, optical members 6512, a touch sensor panel 6513, a printed circuit board 6517, a battery 6518, etc. are arranged in the space surrounded by the housing 6501 and the protective member 6510.

[0305] A display panel 6511, an optical member 6512, and a touch sensor panel 6513 are fixed to the protective member 6510 by an adhesive layer (not shown).

[0306] In an area outside the display unit 6502, a part of the display panel 6511 is folded back, and the folded back part is connected to an FPC 6515. An IC 6516 is mounted on the FPC 6515. The FPC 6515 is connected to a terminal provided on a printed circuit board 6517.

[0307] The flexible display of one embodiment of the present invention can be applied to the display panel 6511. Therefore, an extremely lightweight electronic device can be realized. In addition, since the display panel 6511 is extremely thin, a large-capacity battery 6518 can be mounted thereon while suppressing the thickness of the electronic device. In addition, by folding back a part of the display panel 6511 and arranging a connection portion with the FPC 6515 on the back side of the pixel portion, an electronic device with a narrow frame can be realized.

[0308] 18A shows an example of a television device. In a television device 7100, a display unit 7000 is incorporated in a housing 7101. Here, the housing 7101 is supported by a stand 7103.

[0309] The imaging device of one embodiment of the present invention can be applied to the display portion 7000.

[0310] 18A can be operated using an operation switch provided on the housing 7101 or a separate remote control 7111. Alternatively, a touch sensor may be provided on the display unit 7000, and the television unit 7100 may be operated by touching the display unit 7000 with a finger or the like. The remote control 7111 may have a display unit that displays information output from the remote control 7111. Using an operation key or a touch panel provided on the remote control 7111, it is possible to operate the channel and the volume, and to operate the video displayed on the display unit 7000.

[0311] The television device 7100 includes a receiver and a modem. The receiver can receive general television broadcasts. By connecting to a wired or wireless communication network via the modem, one-way (from sender to receiver) or two-way (between sender and receiver, or between receivers) information communication can be performed.

[0312] 18B shows an example of a laptop personal computer 7200. The laptop personal computer 7200 includes a housing 7211, a keyboard 7212, a pointing device 7213, an external connection port 7214, and the like. A display unit 7000 is incorporated in the housing 7211.

[0313] The imaging device of one embodiment of the present invention can be applied to the display portion 7000.

[0314] 18C and 18D show an example of digital signage.

[0315] 18C includes a housing 7301, a display unit 7000, and a speaker 7303. The digital signage 7300 may further include an LED lamp, an operation key (including a power switch or an operation switch), a connection terminal, various sensors, a microphone, and the like.

[0316] 18D shows a digital signage 7400 attached to a cylindrical pole 7401. The digital signage 7400 has a display unit 7000 provided along the curved surface of the pole 7401.

[0317] 18C and 18D, the imaging device of one embodiment of the present invention can be applied to the display portion 7000.

[0318] The larger the display unit 7000, the more information can be provided at one time. Also, the larger the display unit 7000, the more easily it catches people's attention, which can increase the advertising effect of, for example, advertisements.

[0319] Applying a touch panel to the display unit 7000 is preferable because it not only displays images or videos on the display unit 7000 but also allows the user to intuitively operate it. Furthermore, when used for providing information such as route information or traffic information, usability can be improved by intuitive operation.

[0320] 18C and 18D, it is preferable that the digital signage 7300 or the digital signage 7400 can be linked to an information terminal 7311 or an information terminal 7411 such as a smartphone carried by a user via wireless communication. For example, advertising information displayed on the display unit 7000 can be displayed on the screen of the information terminal 7311 or the information terminal 7411. In addition, the display on the display unit 7000 can be switched by operating the information terminal 7311 or the information terminal 7411.

[0321] It is also possible to execute a game using the screen of the information terminal 7311 or the information terminal 7411 as an operation means (controller) on the digital signage 7300 or the digital signage 7400. This allows an unspecified number of users to participate in and enjoy the game at the same time.

[0322] The electronic device shown in Figures 19A to 19F has a housing 9000, a display unit 9001, a speaker 9003, operation keys 9005 (including a power switch or an operation switch), a connection terminal 9006, a sensor 9007 (including a function to measure force, displacement, position, speed, acceleration, angular velocity, rotation speed, distance, light, liquid, magnetism, temperature, chemical substance, sound, time, hardness, electric field, current, voltage, power, radiation, flow rate, humidity, gradient, vibration, odor or infrared rays), a microphone 9008, etc.

[0323] The electronic device shown in Fig. 19A to Fig. 19F has various functions. For example, it can have a function of displaying various information (still images, videos, text images, etc.) on the display unit, a touch panel function, a function of displaying a calendar, date or time, a function of controlling processing by various software (programs), a wireless communication function, a function of reading and processing a program or data recorded on a recording medium, etc. The functions of the electronic device are not limited to these, and it can have various functions. The electronic device may have multiple display units. In addition, the electronic device may have a function of providing a camera or the like to capture still images and videos and store them on a recording medium (external or built-in to the camera), a function of displaying the captured images on the display unit, etc.

[0324] The electronic device shown in FIGS. 19A to 19F will be described in detail below.

[0325] FIG. 19A is a perspective view showing a mobile information terminal 9101. The mobile information terminal 9101 can be used as, for example, a smartphone. The mobile information terminal 9101 may be provided with a speaker 9003, a connection terminal 9006, a sensor 9007, and the like. The mobile information terminal 9101 can display text and image information on a plurality of surfaces. FIG. 19A shows an example in which three icons 9050 are displayed. Information 9051 shown in a dashed rectangle can also be displayed on another surface of the display unit 9001. Examples of the information 9051 include notifications of incoming e-mail, SNS, and phone calls, titles of e-mail and SNS, sender names, date and time, time, remaining battery power, and antenna reception strength. Alternatively, icons 9050 and the like may be displayed at the position where the information 9051 is displayed.

[0326] 19B is a perspective view showing a mobile information terminal 9102. The mobile information terminal 9102 has a function of displaying information on three or more sides of the display unit 9001. Here, an example is shown in which information 9052, information 9053, and information 9054 are displayed on different sides. For example, a user can check information 9053 displayed in a position that can be observed from above the mobile information terminal 9102 while the mobile information terminal 9102 is stored in a breast pocket of clothes. The user can check the display without taking the mobile information terminal 9102 out of the pocket and decide, for example, whether or not to answer a call.

[0327] FIG. 19C is a perspective view showing a wristwatch-type mobile information terminal 9200. The mobile information terminal 9200 can be used as, for example, a smart watch. The display surface of the display unit 9001 is curved, and display can be performed along the curved display surface. The mobile information terminal 9200 can also perform hands-free conversation by communicating with, for example, a headset capable of wireless communication. The mobile information terminal 9200 can also perform data transmission and charging with another information terminal through a connection terminal 9006. Note that charging may be performed by wireless power supply.

[0328] 19D, 19E, and 19F are perspective views showing a foldable mobile information terminal 9201. FIG. 19D is a perspective view of the mobile information terminal 9201 in an unfolded state, FIG. 19F is a perspective view of the mobile information terminal 9201 in a folded state, and FIG. 19E is a perspective view of the mobile information terminal 9201 in a state in the middle of changing from one of FIG. 19D and FIG. 19F to the other. The mobile information terminal 9201 has excellent portability in a folded state, and has excellent viewability of the display due to a seamless wide display area in an unfolded state. The display unit 9001 of the mobile information terminal 9201 is supported by three housings 9000 connected by hinges 9055. For example, the display unit 9001 can be bent with a curvature radius of 0.1 mm or more and 150 mm or less.

[0329] This embodiment mode can be combined with other embodiment modes as appropriate. [Explanation of symbols]

[0330] BM: light-shielding layer, EL: light-emitting device, PD: light-receiving device, 10A: imaging device, 10B: imaging device, 10C: imaging device, 10D: imaging device, 10E: imaging device, 10F: imaging device, 10G: imaging device, 10H: imaging device, 10J: imaging device, 10K: imaging device, 10L: imaging device, 10M: imaging device, 10: imaging device, 21: light emission, 22: light, 23a: light, 23b: reflected light, 23c: light, 23d: reflected light, 41: transistor, 42: transistor, 51: substrate, 52: subject, 53: layer, 55: layer, 57: layer, 59: substrate, 60B: sub-pixel, 60G: sub-pixel element, 60PD: sub-pixel, 60R: sub-pixel, 60W: sub-pixel, 60: pixel, 61: imaging section, 62: driving circuit section, 63: driving circuit section, 64: driving circuit section, 65: circuit section, 71: arithmetic circuit, 73: memory, 82: wiring, 83: wiring, 84: wiring, 85: wiring, 86: wiring, 87: wiring, 91B: light-emitting device, 91G: light-emitting device, 91PD: light-receiving device, 91R: light-emitting device, 91W: light-emitting device, 100A: imaging device, 100B: imaging device, 100C: imaging device, 100D: imaging device, 110: light-receiving device, 111: pixel electrode, 112: common layer, 1 13: active layer, 114: common layer, 115: common electrode, 142: adhesive layer, 143: space, 146: lens array, 147: colored layer, 148a: colored layer, 148b: colored layer, 148c: colored layer, 148: colored layer, 149: lens, 151: substrate, 152: substrate, 153: substrate, 154: substrate, 155: adhesive layer, 162: imaging section, 164: circuit, 165: wiring, 166: conductive layer, 172: FPC, 173: IC, 182: buffer layer, 184: buffer layer, 190: light emitting device, 191: pixel electrode, 192: buffer layer, 193: light emitting layer, 194: buffer layer, 195a: inorganic insulating layer, 195b: organic insulating layer, 195c: inorganic insulating layer, 195: protective layer, 201: transistor, 202: transistor, 204: connection portion, 205: transistor, 206: transistor, 208: transistor, 209: transistor, 210: transistor, 211: insulating layer, 212: insulating layer, 213: insulating layer, 214: insulating layer, 215: insulating layer, 216: partition wall, 217: partition wall, 218: insulating layer, 221: conductive layer, 222a: conductive layer, 222b: conductive layer, 223: conductive layer, 225: insulating layer, 228: region, 231i: channel formation region,231n: low resistance region, 231: semiconductor layer, 242: connection layer, 6500: electronic device, 6501: housing, 6502: display unit, 6503: power button, 6504: operation button, 6505: speaker, 6506: microphone, 6507: camera, 6508: light source, 6510: protective member, 6511: display panel, 6512: optical member, 6513: touch sensor panel, 6515: FPC, 6516: IC, 6517: printed circuit board, 6518: battery, 7000: display unit, 7100: television device, 7101: housing, 7103: stand, 7111: remote control unit, 7200: notebook personal computer, 7211: housing, 72 12: keyboard, 7213: pointing device, 7214: external connection port, 7300: digital signage, 7301: housing, 7303: speaker, 7311: information terminal, 7400: digital signage, 7401: pillar, 7411: information terminal, 9000: housing, 9001: display unit, 9003: speaker, 9005: operation key, 9006: connection terminal, 9007: sensor, 9008: microphone, 9050: icon, 9051: information, 9052: information, 9053: information, 9054: information, 9055: hinge, 9101: portable information terminal, 9102: portable information terminal, 9200: portable information terminal, 9201: portable information terminal,

Claims

1. An image pickup unit having a plurality of pixels arranged in a matrix, a memory, and an arithmetic circuit, Each of the plurality of pixels includes a light receiving device, a first light emitting device, and a second light emitting device; the first light-emitting device has a function of emitting light in a wavelength region different from that of the second light-emitting device; the imaging unit has a function of causing the first light-emitting device to emit light and acquiring first image data; the imaging unit has a function of causing the second light-emitting device to emit light and acquiring second image data; the memory has a function of storing first reference data and second reference data; the arithmetic circuit has a function of correcting the first image data by using the first reference data stored in the memory, and calculating first corrected image data; the first reference data includes first white reference data and first black reference data; the arithmetic circuit has a function of correcting the second image data by using the second reference data stored in the memory, and calculating second corrected image data; the second reference data includes second white reference data and second black reference data; the first reference data and the second reference data are data acquired for each of the plurality of pixels, the arithmetic circuit has a function of adding the first corrected image data and the second corrected image data together to generate composite image data; the light receiving device has a first pixel electrode; The first light emitting device has a second pixel electrode located on the same plane as the first pixel electrode.

2. In claim 1, the light receiving device has an active layer and a common electrode; the first light emitting device has a light emitting layer and the common electrode; the active layer is located on the first pixel electrode; the active layer comprises a first organic compound; the light-emitting layer is located on the second pixel electrode; the light-emitting layer comprises a second organic compound; The common electrode has a portion overlapping with the first pixel electrode via the active layer, and a portion overlapping with the second pixel electrode via the light-emitting layer.

3. In claim 1 or 2, The imaging unit has a lens, the lens has a portion overlapping the light receiving device, the lens is located above the first pixel electrode; An imaging device in which light transmitted through the lens is incident on the light receiving device.

4. An imaging device according to any one of claims 1 to 3, An imaging module having at least one of a connector and an integrated circuit.

5. The imaging module according to claim 4 ; An electronic device having one or more of an antenna, a battery, a housing, a camera, a speaker, a microphone, and an operation button.

Images